201239115 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種抗菌鍍膜件及其製備方法。 【先前技術】 [0002] 有害細菌的傳播和感染嚴重威脅著人類的健康，尤其近 年來SARS病毒、禽流感等的傳播和感染，使抗菌材料在 日常生活中的應用迅速發展起來。將抗菌金屬（Cu、Zn、 Ag等）塗覆於基材上形成抗菌鍍膜件在目前市場上有著廣 泛的應用。該抗祕膜件的殺g機理為：抗菌鍵膜件在 錢雜巾’抗g金屬·會緩贿放出金屬離子如銅 離子、鋅離子’當微量的具有殺菌性的金.屬離子與細菌 等微生物接觸時，該金屬離子依靠庫倫力與帶有負電荷 的微生物牢固吸附’金屬離子穿透細胞壁與細菌體内蛋 白質上的疏基、氨基發生反應，使蛋白質活性破壞，使 細胞喪失分裂增殖能力而死亡，從而達到殺菌的目的。 [〇〇〇3]然該類金屬抗菌塗層通常比較薄，抗菌金屬離子流失較 〇 陕，且表面硬度較低容易磨損，從而降低了金屬抗菌塗 層的抗菌持久性，甚至使抗菌塗層失去抗菌效果。 【發明内容】 _]冑繁於此’有必要提供—種抗菌效果較為持久的抗菌鍍 膜件。 _5]料’還有必要提供一種上述抗菌鑛膜件的製備方法。 _]-種抗菌鍵膜件，其包括基材、形成於基材表面的打底 層，該打底層為鎳鉻合金層，該抗菌鍍臈件還包括形成 100110297 表單編號A0101 第3頁/共15頁 1002017360-0 201239115 於打底層表面的複數錄鉻氮層和複數金屬鋅層，該複數 鎳鉻氮層和複數金屬鋅層交替排布，該抗菌鍍膜件中與 所述打底層直接相結合的係鎳鉻氮層，且該抗菌鍍膜件 的最外層為錄鉻氮層。 [0007] —種抗菌鍍膜件的製備方法，其包括如下步驟： [0008] 提供基材； [0009] 在該基材的表面形成打底層，該打底層為鎳鉻合金層； [〇〇1〇] 在該打底層的表面形成鎳鉻氮層； [0011] 在該鎳鉻氮層的表面形成金屬鋅層； [0012] 重複交替形成鎳鉻氮層和金屬鋅層以形成最外層為鎳鉻 氮層的抗菌鍍膜件。 [0013] 所述抗菌鍍膜件在基材表面交替濺鍍鎳鉻氮層和金屬鋅 層，鎳鉻氮層形成為疏鬆多孔的結構，可使金屬鋅層的 部分嵌入到該鎳鉻氮層中，對金屬辞層中辞離子的快即 溶出起到阻礙作用，從而可緩釋鋅離子的溶出，使金屬 辞層具有長效的抗菌效果。同時鎳鉻氮層具有良好的耐 磨性、时腐姓性能，因而在整個膜層的最外層鑛上錄鉻 氮層有助於提升抗菌鍍膜件的耐磨性，可延長抗菌鍍膜 件的使用菁命。 【實施方式】 [0014] 請參閱圖1，本發明一較佳實施方式的抗菌鍍膜件10包括 基材11、形成於基材11表面的打底層13，形成於打底層 13表面的複數鎳鉻氮（NiCrN)層15和複數金屬鋅（Zn)層 100110297 表單編號A0101 第4頁/共15頁 1002017360-0 201239115 17，該複數鎳鉻氮層15和複數金屬鋅層17交替排布，其 中與所述打底層13直接相結合的係鎳鉻氮層15，抗菌鍍 膜件10的最外層為鎳鉻氮層15。所述複數鎳鉻氮層15和 複數金屬鋅層1 7的總厚度為2〜3. 2 # m。本實施例中，所 述複數鎳鉻氮層15和複數金屬鋅層17的層數分別為15〜 2 0層。 [0015] [0016] Ο [0017] 該基材11的材質優選為不銹鋼，但不限於不銹鋼。 該打底層13可以磁控濺射的方式形成。該打底層為鎳鉻 合金層。該打底層13的厚度為150〜250nm。 ❹ [0018] 該複數鎳鉻氮層15可以磁控濺射的方式形成。所述每一 鎳鉻氮層15的厚度為40〜80nm。所述鎳鉻氮層15中鎳的 原子百分含量為30〜45%，鉻的原子百分含量為40〜55%， 氮的原子百分含量為5〜15% ;該種質量百分比例的鎳鉻氮 層15具有較高的硬度和良好的耐磨性。濺鍍該鎳鉻氮層 15時採用較低的沉積溫度和沉積偏壓，使鎳鉻氮層15具 有更好的疏鬆多孔的結構，可使所述金屬鋅層17的部分 後入到該金屬鋅層1 7中。 該複數金屬鋅層17可以磁控濺射的方式形成。所述每一 金屬鋅層17的厚度為40〜80nm。在每一金屬鋅層17與相 鄰的每一鎳鉻氮層15的界面處，有部分金屬鋅層17敌入 到鎳鉻氮層15中，從而使金屬鋅層17固持於鎳鉻氮層15 中，可缓釋金屬鋅層17中金屬鋅離子的溶出，使金屬鋅 層17具有長效的抗菌效果。 [0019] 本發明一較佳實施方式的抗菌鍍膜件10的製備方法，其 100110297 表單編號A0101 第5頁/共15頁 1002017360-0 201239115 包括如下步驟： [0020] 提供基材11，該基材11的材質優選為不銹鋼，但不限於 不錄鋼。 [0021] 對該基材11進行表面預處理。該表面預處理可包括常規 的對基材11進行抛光、無水乙醇超聲波清洗及烘乾等步 驟。 [0022] 對經上述處理後的基材11的表面進行氬氣電漿清洗，以 進一步去除基材11表面殘留的雜質，以及改善基材11表 面與後續鍍層的結合力。結合參閱圖2，提供一真空鍍膜 機20，該真空鍍膜機20包括一鍍膜室21及連接於鍍膜室 21的一真空泵30，真空泵30用以對鍍膜室21抽真空。該 鍍膜室21内設有轉架（未圖示）、二鎳鉻合金靶23和二鋅 靶24。轉架帶動基材11沿圓形的軌跡25公轉，且基材11 在沿軌跡25公轉時亦自轉。 [0023] 該電漿清洗的具體操作及工藝參數為：將基材11放入一 真空鍍膜機20的鍍膜室21内，將該鍍膜室21抽真空至3x 10_5torr，然後向鍍膜室内通入流量為500sccm(標準狀 態毫升/分鐘）的氬氣（純度為99. 999%)，並施加-200〜 -350V的偏壓於基材11，對基材11表面進行氬氣電漿清 洗，清洗時間為3〜1 0 m i η。 [0024] 採用磁控濺射法在經氬氣電漿清洗後的基材11的表面濺 鍍打底層13，該打底層13為鎳鉻合金層。濺鍍該打底層 13在所述真空鍍膜機20中進行。使用鎳鉻合金靶23，所 述鎳鉻合金靶23中鎳的質量百分含量為20〜40%，其採用 100110297 表單編號Α0101 第6頁/共15頁 1002017360-0 201239115 [0025] Ο [0026]Ο [0027] 100110297 直流磁控電源。濺鍍時，開啟鎳鉻合金靶23，設置鎳鉻 合金㈣的功率為7〜llkw ’通入工作氣體氮氣，氣氣流 里為350 500sccm，對基材11施加-i〇〇〜_i5〇V的偏壓 ’锻膜溫度為70〜9〇°C ’锻膜時間為5〜lOmin。該打底 層13的厚度為150〜250nm。 繼續採用磁控_法在所述打底層13的表面舰錄鉻氮 層15。繼續使用鎳鉻合金靶23，所述鎳鉻合金靶以採用 直流磁控€源。_時，開關料絲23，設置錄鉻 合金¥23的功率為7〜Ukw ’通入反應氣體氣氣 ’氮氣流 量為45〜12〇Sccm，」通入工作氣體氬氣，氬氣流量為4〇〇 〜500sCCm ’對基材u施加直流偏壓，直褚偏壓大小為_ 50〜-100V，鍍膜溫度為7〇〜9〇弋，镀膜時間為5〜 7min。該鎳鉻氮層15的厚度為4〇〜8(mm 9濺鍍該鎳鉻氮 層15採用較低的沉積溫度和較低的沉積‘壓，可使鎳鉻 氮層15達到較好的疏鬆多孔的結構。 繼績採用磁控濺射法在所述鎳鉻氮層15的表面濺鍍金屬 鋅層17。使甩鋅相24，所述鋅靶24採用直流磁控電源。 濺鍍時’開啟鋅靶24，設置鋅靶24的功率為8〜10kw， 通入工作氣鱧氬氣’氬氣流量為400〜500sccm，對基材 11施加直流偏壓，直流偏壓大小為_50〜-100V，鍵膜溫 度為70〜90°C ’鑛膜時間為5〜7min。該金屬鋅層17的 厚度為40〜80nm。 參照上述步驟，重複交替濺鍍鎳鉻氮層15和金屬鋅層17 ，且使抗菌鍍膜件10的最外層為鎳鉻氮層15。交替濺鍍 的次數總共為15〜20次。所述複數鎳鉻氮層15和複數金 表單編號A0101 第7頁/共15頁 1002017360-0 201239115 屬鋅層1 7的總厚度為2〜3. 2 " m。 [0028] 下面藉由實施例來對本發明進行具體說明。 [0029] 實施例1 [0030] 本實施例所使用的真空鍍膜機20為磁控濺射鍍膜機。 [0031] 本實施例所使用的基材11的材質為不銹鋼。 [0032] 電漿清洗：氬氣流量為500sccm，基材11的偏壓為-200V ，電漿清洗時間為5min ; [0033] 濺鍍打底層13 :鎳鉻合金靶23中鎳的質量百分含量為35% ，鎳鉻合金靶23的功率為7kw，氬氣流量為420sccm，基 材11的偏壓為-100V，鍍膜溫度為80°C，鍍膜時間為 6min ;該打底層13的厚度為185nm ; [0034] 濺鍍鎳鉻氮層15 :鎳鉻合金靶23的功率為8kw，氬氣流量 為400sccm，氮氣流量為60sccm，基材11的偏壓為-80V ，鍍膜溫度為80°C，鍍膜時間為7min ;該鎳鉻氮層的厚 度為75nm。 [0035] 濺鍍金屬鋅層17 :鋅靶24的功率為8kw，基材11的偏壓 為-80V，氬氣流量為400sccm，鍍膜溫度為80°C，鍍膜 時間為7min ;該金屬鋅層17的厚度為70nm。 [0036] 重複交替濺鍍鎳鉻氮層15和金屬鋅層17的步驟，濺鍍鎳 鉻氮層15的次數為17次，濺鍍金屬鋅層17的次數為16次 [0037] 實施例2 100110297 表單編號A0101 第8頁/共15頁 1002017360-0 201239115 [0038] [0039] [0040] Ο [0041] [0042] ζ) [0043] [0044] [0045] 100110297 第9頁/共15頁 1002017360-0 本實施例所使用的真空鍍膜機20和基材11均與實施例1中 的相同。 電漿清洗：氬氣流量為500sccm，基材11的偏壓為-200V ，電衆清洗時間為5 m i η ; 濺鍍打底層13 :鎳鉻合金靶23中鎳的質量百分含量為40% ，錄鉻合金祀23的功率為7kw，氬氣流量為420sccm，基 材11的偏壓為-100V，鍍膜溫度為80°C，鍍膜時間為 5min ;該打底層13的厚度為185nm ; 濺鍍鎳鉻氮層15 :鎳鉻合金靶23的功率為7kw，氬氣流量 為400sccm，氮氣流量為lOOsccm，基材11的偏壓為-80V，鍍膜溫度為80°C，鍍膜時間為5min ;該鎳鉻氮層 的厚度為60nm。 濺鍍金屬鋅層17 :鋅靶24的功率為8kw，基材11的偏壓 為-80V，氬氣流量為400sccm，.鍍膜溫度為80°C，鑛膜 時間為5min ;該金屬鋅層1.7的厚度為65nm。 重複交替濺鍍鎳鉻氮層15和金屬鋅層17的步驟，濺鍍鎳 鉻氮層15的次數為17次，濺鍍金屬鋅層17的次數為16次 〇 抗菌性能測試 將上述製得的抗菌鍍膜件10進行抗菌性能測試，抗菌測 試參照HG/T3950-2007標準進行，具體測試方法如下： 取適量菌液滴於實施例所製得的抗菌鍍膜件10和未處理 的不銹鋼樣品上，用滅菌覆蓋膜覆蓋抗菌鍍膜件10和未 表單編號A0101 201239115 處理的不銹鋼樣品，置於滅菌培養皿中，在溫度為37±1 °C，相對濕度為RH>90%的條件下培養24h。然後取出， 用20ml洗液反復沖洗樣品及覆蓋膜，搖勻後取洗液接種 於營養瓊脂培養基中，在溫度為37±1°C下培養24〜48h後 進行活菌計數。 [0046] 將6種霉菌製成孢子懸液，將抗菌鍍膜件10浸泡在所述孢 子懸液中，在溫度為28°C，相對濕度RH>90%的條件下培 養28天。 [0047] 測試結果：實施例1和2所製得的抗菌抗菌鍍膜件10對大 腸桿菌、沙門氏菌、金黃色葡萄球菌的殺菌率均達到98% ，長霉等級均為1級。 [0048] 抗菌持久性測試：經過在溫度為37±1°C的恒溫水溶液中 浸泡3個月後的抗菌抗菌鍍膜件10，再次進行抗菌性能測 試，實施例1和2所製得的抗菌抗菌鍍膜件10對大腸桿菌 、沙門氏菌、金黃色葡萄球菌的殺菌率依然達到95%，長 霉等級均為1級。 [0049] 所述抗菌鍍膜件10在基材11表面交替濺鍍鎳鉻氮層15和 金屬鋅層17，鎳鉻氮層15形成為疏鬆多孔的結構，可使 金屬鋅層17的部分嵌入到該鎳鉻氮層15中，對金屬鋅層 17中鋅離子的快即溶出起到阻礙作用，從而可緩釋鋅離 子的溶出，使金屬鋅層17具有長效的抗菌效果。同時鎳 鉻氮層15具有良好的耐磨性、耐腐蝕性能，因而在整個 膜層的最外層鍍上鎳鉻氮層15有助於提升抗菌鍍膜件10 的财磨性，可延長抗菌鍍膜件10的使用壽命。 100110297 表單編號A0101 第10頁/共15頁 1002017360-0 201239115 【圖式簡單說明】 [0050] 圖1為本發明一較佳實施例的抗菌鍍膜件的剖視圖； [0051] 圖2為本發明一較隹實施例真空鍍膜機的俯視示意圖 [0052] 【主要元件符號說明】 抗菌鍍膜件：10 [0053] 基材：11 [0054] 打底層：13 [0055] 鎳鉻氮層：15 [0056] 金屬辞層：17 [0057] 真空鍍膜機：20 [0058] 鍍膜室：21 [0059] 鎳鉻合金靶：23 [0060] 鋅靶：24 [0061] 〇 軌跡：25 [0062] 真空泵：30 100110297 表單編號A0101 第11頁/共15頁 1002017360-0201239115 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to an antibacterial coated member and a method of preparing the same. [Prior Art] [0002] The spread and infection of harmful bacteria is a serious threat to human health. In particular, the spread and infection of SARS virus, avian influenza, etc. in recent years have made the application of antibacterial materials in daily life develop rapidly. The application of antibacterial metals (Cu, Zn, Ag, etc.) on substrates to form antibacterial coated parts has a wide range of applications on the market. The anti-secret membrane member's mechanism of killing g is: antibacterial key film parts in the money shawl 'anti-g metal · will release bribes to release metal ions such as copper ions, zinc ions' when traces of bactericidal gold. genus ions and bacteria When exposed by microorganisms, the metal ions rely on Coulomb force and negatively charged microorganisms to firmly adsorb 'metal ions penetrate the cell wall and react with the sulfhydryl groups and amino groups on the proteins in the bacteria to destroy the protein activity and cause the cells to lose their proliferation. The ability to die, thus achieving the purpose of sterilization. [〇〇〇3] Although the metal antibacterial coating is usually thin, the antibacterial metal ion loss is more sturdy, and the surface hardness is lower and easy to wear, thereby reducing the antibacterial durability of the metal antibacterial coating, and even making the antibacterial coating. Lose the antibacterial effect. SUMMARY OF THE INVENTION It is necessary to provide an antibacterial coating material having a relatively long-lasting antibacterial effect. It is also necessary to provide a method for preparing the above-mentioned antibacterial ore film member. _] - an antibacterial film member comprising a substrate, a primer layer formed on a surface of the substrate, the primer layer being a nickel-chromium alloy layer, the anti-bacterial plated member further comprising a form 100110297 Form No. A0101 Page 3 of 15 Page 1002017360-0 201239115 The plurality of chromium-nitrogen layers and the plurality of metal zinc layers are alternately arranged on the bottom surface, and the plurality of nickel-chromium nitride layers and the plurality of metal zinc layers are alternately arranged, and the anti-bacterial coating member is directly combined with the primer layer. It is a nickel-chromium nitride layer, and the outermost layer of the anti-bacterial coating member is a recorded chromium nitrogen layer. [0007] A method for preparing an antibacterial coating member, comprising the steps of: [0008] providing a substrate; [0009] forming a primer layer on a surface of the substrate, the underlayer is a nickel-chromium alloy layer; [〇〇1 〇 forming a nickel-chromium nitride layer on the surface of the underlayer; forming a metal zinc layer on the surface of the nichrome layer; [0012] repeatedly forming a nickel-chromium nitride layer and a metal zinc layer to form an outermost layer of nickel Antibacterial coated parts of chromium nitrogen layer. [0013] The antibacterial coating member alternately sputters a nickel-chromium nitride layer and a metal zinc layer on the surface of the substrate, and the nickel-chromium nitride layer is formed into a loose porous structure, and a portion of the metallic zinc layer may be embedded in the nickel-chromium nitride layer. It can hinder the dissolution of the excimer in the metal layer, so that the dissolution of zinc ions can be sustained, and the metal layer has a long-lasting antibacterial effect. At the same time, the nickel-chromium nitride layer has good wear resistance and time-corrosion property. Therefore, recording the chromium-nitrogen layer on the outermost layer of the entire film layer can improve the wear resistance of the anti-bacterial coating member and prolong the use of the anti-bacterial coating member. Jingjing. [Embodiment] Referring to FIG. 1 , an antibacterial coating member 10 according to a preferred embodiment of the present invention includes a substrate 11 , a primer layer 13 formed on the surface of the substrate 11 , and a plurality of nickel chromium formed on the surface of the primer layer 13 . Nitrogen (NiCrN) layer 15 and complex metal zinc (Zn) layer 100110297 Form No. A0101 Page 4 / Total 15 pages 1002017360-0 201239115 17, the plurality of nickel-chromium nitride layer 15 and the plurality of metal zinc layers 17 are alternately arranged, wherein The underlayer 13 is directly bonded to the nickel-chromium nitride layer 15, and the outermost layer of the antibacterial coating member 10 is a nickel-chromium nitride layer 15. The total thickness of the plurality of nickel-chromium nitride layers 15 and the plurality of metal zinc layers 17 is 2 to 3. 2 # m. In this embodiment, the number of layers of the plurality of nickel-chromium nitride layers 15 and the plurality of metal zinc layers 17 is 15 to 20 layers, respectively. [0016] [0017] The material of the substrate 11 is preferably stainless steel, but is not limited to stainless steel. The underlayer 13 can be formed by magnetron sputtering. The underlayer is a nickel-chromium alloy layer. The underlayer 13 has a thickness of 150 to 250 nm.复 [0018] The plurality of nickel-chromium nitride layers 15 can be formed by magnetron sputtering. Each of the nickel-chromium nitride layers 15 has a thickness of 40 to 80 nm. The nickel-chromium nitride layer 15 has an atomic percentage of nickel of 30 to 45%, an atomic percentage of chromium of 40 to 55%, and an atomic percentage of nitrogen of 5 to 15%; The nickel-chromium nitride layer 15 has high hardness and good wear resistance. When the nickel-chromium nitride layer 15 is sputtered, a lower deposition temperature and a deposition bias are used, so that the nickel-chromium nitride layer 15 has a better porous structure, and a portion of the metal zinc layer 17 can be later introduced into the metal. The zinc layer is in 17. The plurality of metal zinc layers 17 can be formed by magnetron sputtering. Each of the metal zinc layers 17 has a thickness of 40 to 80 nm. At the interface of each of the metallic zinc layers 17 and each of the adjacent nickel-chromium nitride layers 15, a portion of the metallic zinc layer 17 is entrapped in the nickel-chromium nitride layer 15, thereby holding the metallic zinc layer 17 in the nickel-chromium nitride layer. In the case of 15, the dissolution of the metal zinc ions in the metal zinc layer 17 can be sustained, so that the metal zinc layer 17 has a long-lasting antibacterial effect. [0019] A method for preparing an antibacterial coating member 10 according to a preferred embodiment of the present invention, which is 100110297, Form No. A0101, Page 5 of 15 pages, 1002017360-0 201239115, includes the following steps: [0020] Providing a substrate 11, the substrate The material of 11 is preferably stainless steel, but is not limited to non-recording steel. [0021] The substrate 11 is subjected to surface pretreatment. The surface pretreatment may include conventional steps of polishing the substrate 11, ultrasonic cleaning with anhydrous ethanol, and drying. [0022] The surface of the substrate 11 subjected to the above treatment is subjected to argon plasma cleaning to further remove impurities remaining on the surface of the substrate 11, and to improve the bonding force between the surface of the substrate 11 and the subsequent plating layer. Referring to Fig. 2, a vacuum coater 20 is provided. The vacuum coater 20 includes a coating chamber 21 and a vacuum pump 30 connected to the coating chamber 21 for vacuuming the coating chamber 21. A rotating frame (not shown), a nichrome target 23, and a dizinc target 24 are provided in the coating chamber 21. The turret drives the substrate 11 to revolve along a circular trajectory 25, and the substrate 11 also rotates as it revolves along the trajectory 25. [0023] The specific operation and process parameters of the plasma cleaning are: placing the substrate 11 into the coating chamber 21 of a vacuum coating machine 20, evacuating the coating chamber 21 to 3×10_5 torr, and then introducing a flow into the coating chamber. Argon gas (purity: 99.999%) of 500 sccm (standard state ML/min), and a bias of -200 to -350 V was applied to the substrate 11, and the surface of the substrate 11 was subjected to argon plasma cleaning for the cleaning time. It is 3~1 0 mi η. [0024] The underlayer 13 is sputtered on the surface of the substrate 11 after argon plasma cleaning by a magnetron sputtering method, and the underlayer 13 is a nickel-chromium alloy layer. The underlayer 13 is sputtered in the vacuum coater 20. A nichrome target 23 is used, and the nickel content of the nichrome target 23 is 20 to 40%, which is 100110297. Form number Α0101 Page 6/15 pages 1002017360-0 201239115 [0025] Ο [0026 ]Ο [0027] 100110297 DC magnetron power supply. During sputtering, the nichrome target 23 is turned on, and the power of the nickel-chromium alloy (4) is set to 7 to llkw 'passing the working gas nitrogen, and the gas flow is 350 500 sccm, and applying -i〇〇~_i5〇V to the substrate 11 The biasing temperature of the forged film is 70~9〇°C. The forging time is 5~lOmin. The underlayer 13 has a thickness of 150 to 250 nm. The chromium oxide layer 15 is continuously recorded on the surface of the underlayer 13 by a magnetron method. The nichrome target 23 is continued to be used, which is a DC magnetron source. _, the switch wire 23, set the recording chromium alloy ¥ 23 power is 7~Ukw 'passing the reaction gas gas 'nitrogen flow rate is 45~12〇Sccm," into the working gas argon, argon flow rate is 4 〇〇~500sCCm 'The DC bias is applied to the substrate u. The direct bias voltage is _ 50~-100V, the coating temperature is 7〇~9〇弋, and the coating time is 5~7min. The thickness of the nickel-chromium nitride layer 15 is 4 〇 8 (mm 9 sputtering the nickel-chromium nitride layer 15 using a lower deposition temperature and a lower deposition pressure, so that the nickel-chromium-nitride layer 15 can achieve better looseness. Porous structure. The metal zinc layer 17 is sputtered on the surface of the nickel-chromium nitride layer 15 by magnetron sputtering. The zinc-zinc phase 24 is used, and the zinc target 24 is a DC magnetron power source. The zinc target 24 is turned on, the power of the zinc target 24 is set to 8 to 10 kW, and the working gas argon gas argon gas flow rate is 400 to 500 sccm, and a DC bias voltage is applied to the substrate 11, and the DC bias voltage is _50~- 100 V, the temperature of the bond film is 70 to 90 ° C. The film time is 5 to 7 min. The thickness of the metal zinc layer 17 is 40 to 80 nm. Referring to the above steps, the alternately sputtered nickel-chromium nitride layer 15 and the metal zinc layer 17 are repeated. And the outermost layer of the antibacterial coating member 10 is a nickel-chromium nitride layer 15. The number of alternate sputterings is 15 to 20 times in total. The complex nickel-chromium nitride layer 15 and the plurality of gold form numbers A0101 Page 7 of 15 1002017360-0 201239115 The total thickness of the zinc layer 17 is 2~3. 2 " m. [0028] The present invention will be specifically described below by way of examples. 029] Example 1 [0030] The vacuum coater 20 used in the present embodiment is a magnetron sputtering coater. [0031] The material of the substrate 11 used in the present embodiment is stainless steel. [0032] Plasma cleaning: The flow rate of argon gas is 500 sccm, the bias voltage of the substrate 11 is -200 V, and the plasma cleaning time is 5 min; [0033] Sputtering primer layer 13: nickel content in the nichrome target 23 is 35% by mass, nickel chromium The power of the alloy target 23 is 7 kW, the flow rate of argon gas is 420 sccm, the bias voltage of the substrate 11 is -100 V, the coating temperature is 80 ° C, and the coating time is 6 min; the thickness of the underlayer 13 is 185 nm; [0034] Nickel-chromium nitride layer 15: The power of the nickel-chromium alloy target 23 is 8 kW, the flow rate of argon gas is 400 sccm, the flow rate of nitrogen gas is 60 sccm, the bias voltage of the substrate 11 is -80 V, the coating temperature is 80 ° C, and the coating time is 7 min; The thickness of the nickel-chromium nitride layer is 75 nm. [0035] The metal zinc layer 17 is sputtered: the power of the zinc target 24 is 8 kw, the bias voltage of the substrate 11 is -80 V, the flow rate of argon gas is 400 sccm, and the coating temperature is 80 ° C. The coating time is 7 min; the thickness of the metallic zinc layer 17 is 70 nm. [0036] The step of alternately sputtering the nickel-chromium nitride layer 15 and the metallic zinc layer 17 is repeated, and nickel is sputtered. The number of times of the nitrogen layer 15 is 17 times, and the number of times the metal zinc layer 17 is sputtered is 16 times [0037] Example 2 100110297 Form No. A0101 Page 8 / Total 15 pages 1002017360-0 201239115 [0038] [0040] [0042] [0042] [0044] [0044] 100110297 Page 9 / Total 15 pages 1002017360-0 The vacuum coater 20 and the substrate 11 used in this embodiment are both the same as in the embodiment 1. the same. Plasma cleaning: argon gas flow rate is 500sccm, substrate 11 has a bias voltage of -200V, and power generation cleaning time is 5 mi η; sputtering bottom layer 13: nickel-chromium alloy target 23 has a mass percentage of nickel of 40% The chrome alloy 祀23 has a power of 7kw, the argon flow rate is 420sccm, the substrate 11 has a bias voltage of -100V, the coating temperature is 80 ° C, and the coating time is 5 min; the underlayer 13 has a thickness of 185 nm; Nickel-chromium nitride layer 15: Nichrome alloy target 23 has a power of 7 kW, an argon gas flow rate of 400 sccm, a nitrogen gas flow rate of 100 sccm, a substrate 11 bias voltage of -80 V, a coating temperature of 80 ° C, and a coating time of 5 min; The thickness of the nickel-chromium nitride layer was 60 nm. The metal zinc layer 17 is sputtered: the power of the zinc target 24 is 8 kw, the bias voltage of the substrate 11 is -80 V, the flow rate of the argon gas is 400 sccm, the coating temperature is 80 ° C, and the film time is 5 min; the metal zinc layer is 1.7. The thickness is 65 nm. Repeating the steps of alternately sputtering the nickel-chromium nitride layer 15 and the metal zinc layer 17, the number of times of sputtering the nickel-chromium nitride layer 15 is 17 times, and the number of times the metal zinc layer 17 is sputtered is 16 times. The antibacterial coating member 10 is tested for antibacterial properties, and the antibacterial test is carried out according to the HG/T3950-2007 standard. The specific test method is as follows: Take appropriate amount of bacterial droplets on the antibacterial coating member 10 and the untreated stainless steel sample prepared in the examples, The sterilized cover film covered the antibacterial coated member 10 and the stainless steel sample not processed in Form No. A0101 201239115, placed in a sterilized culture dish, and incubated at a temperature of 37 ± 1 ° C and a relative humidity of RH > 90% for 24 hours. Then, the sample and the cover film were repeatedly washed with 20 ml of the washing solution, shaken, and the washing solution was inoculated into the nutrient agar medium, and the viable bacteria were counted after being cultured at a temperature of 37 ± 1 ° C for 24 to 48 hours. Six kinds of molds were made into a spore suspension, and the antibacterial coated member 10 was immersed in the spore suspension, and cultured for 28 days under the conditions of a temperature of 28 ° C and a relative humidity of RH > 90%. [0047] Test results: The antibacterial antibacterial coating members 10 prepared in Examples 1 and 2 had a bactericidal rate of 98% for Escherichia coli, Salmonella, and Staphylococcus aureus, and all of the mildew grades were Grade 1. [0048] Antibacterial durability test: The antibacterial antibacterial coating member 10 after being immersed for 3 months in a constant temperature aqueous solution having a temperature of 37±1° C., and the antibacterial property test was again performed, and the antibacterial antibacterial agents obtained in Examples 1 and 2 were used. The bactericidal rate of the coated member 10 against Escherichia coli, Salmonella, and Staphylococcus aureus is still 95%, and the long mildew grade is 1 level. [0049] The antibacterial coating member 10 alternately sputters a nickel-chromium nitride layer 15 and a metallic zinc layer 17 on the surface of the substrate 11, and the nickel-chromium nitride layer 15 is formed into a loose porous structure, and a portion of the metallic zinc layer 17 can be embedded therein. In the nickel-chromium nitride layer 15, the dissolution of zinc ions in the metal zinc layer 17 is hindered, so that the dissolution of zinc ions can be released, and the metallic zinc layer 17 has a long-lasting antibacterial effect. At the same time, the nickel-chromium nitride layer 15 has good wear resistance and corrosion resistance, so that the outermost layer of the entire film layer is plated with a nickel-chromium-nitrogen layer 15 to help improve the robustness of the antibacterial coating member 10, and the antibacterial coating member can be extended. 10 lifetime. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing an antibacterial coating member according to a preferred embodiment of the present invention; [0051] FIG. 2 is a cross-sectional view of an antibacterial coating member according to a preferred embodiment of the present invention; A schematic view of a vacuum coating machine of a comparative example [0052] [Explanation of main component symbols] Antibacterial coating member: 10 [0053] Substrate: 11 [0054] Underlayer: 13 [0055] Nickel-chromium nitride layer: 15 [0056] Metal layer: 17 [0057] Vacuum coating machine: 20 [0058] Coating chamber: 21 [0059] Nickel-chromium alloy target: 23 [0060] Zinc target: 24 [0061] 〇 Trajectory: 25 [0062] Vacuum pump: 30 100110297 Form No. A0101 Page 11 / Total 15 Pages 1002017360-0