TW201213947A - Method for fabricating a display and the display produced therefrom - Google Patents

Abstract

The present invention provides a method for fabricating a display, comprising the following steps: providing a lower substrate with a first conductive layer; forming a plurality of banks on the lower substrate; filling a display medium material between the banks; forming an upper cover layer on the display medium material; and conducting a process to bind a second conductive layer to the lower substrate, wherein the banks are formed by: forming a dry film on the lower substrate; placing a photomask above the dry film; and applying a lithography and etching process once to pattern the dry film and form a plurality of banks, wherein the dry film has at least two photoresist layers. The present invention further provides a display made from the above described process. The invention provides a simpler and environmentally friendly process which can make the surface of the display medium material flatter during the fabrication process.

Description

201213947 VI. Description of the Invention: The present invention relates to a method of manufacturing a display and a display thereof, and more particularly to a method of manufacturing a flexible display capable of improving the flatness of a display medium in a process and a A display made. [Prior Art] In recent years, 'thin displays' such as liquid crystal displays, electronic papers, or electronic books are booming. In the liquid crystal display of a single-layer liquid crystal structure, as shown in FIG. 1, the lower substrate 2, the upper substrate 4, the plurality of liquid crystal materials 6, a plurality of retaining walls 8 for separating the liquid crystal material, the upper cover, The first conductive film 12 and the second conductive film 14. However, as shown in FIG. 2, at the time of fabricating, for example, the aforementioned liquid crystal display, since the display medium material (liquid crystal) 9 and the materials of the substrate 3 or the retaining wall 7 have differences in chemical affinity and the like, the display medium material 9 The tendency to adhere to the retaining wall 7 causes the display medium material 9 sprayed on the surface of the substrate 3 to have a disadvantage of surface flatness and poor spray shape. Therefore, subsequent literature studies such as Microelectronic Engineering 82 (2005), pp, attempted to improve this problem by using two-layer photosensitive materials, but it could not completely solve the problem of flatness, and the conventional technology was applied to the field of two-layer photosensitive materials. Most of them have the same shortcomings, as listed below: (1) The more complicated process, the current method of making a double-layered structural bank is to perform two coating or bonding processes, and then perform two exposure and development etching operations. The substrate with the double-layer structure retaining wall can be obtained; (2) or the surface plasma treatment is used to make the load-bearing surface with only one layer structure have different characteristics, resulting in a double-layer structure block 150536.doc 201213947 effect 'but use The method of surface treatment of electric power has many disadvantages. For example, it is necessary to have a expensive machine such as a vacuum device and a plasma generating system, and a toxic gas generated in the process does not comply with environmental regulations, and the surface characteristics generated by surface treatment are only temporary. Sex, as well as electropolymerization process can only be a single piece (batChpr〇cess), slow output and other shortcomings; and (7) the current double layer Problems dielectric material f PLUG flat display configuration and can not effectively solve the manufacturing process. A content of the invention

In view of the above, the present invention provides a method of manufacturing a display and a display manufactured thereby, which utilizes a relatively simple and environmentally friendly process to improve the flatness of the display medium material after filling in the process. In order to achieve the above and other objects, the present invention provides a method for manufacturing a display, comprising the steps of: providing a substrate having a first conductive layer; forming a plurality of retaining walls on the lower substrate; filling the display The material f is formed on the display medium material; and a bonding process of the second conductive layer and the lower substrate is performed, wherein the retaining walls are formed by: forming a dry film under the On the substrate; a photomask is disposed over the dry film; and the dry film is patterned by a single photolithography process to form a plurality of barrier walls, wherein the dry film has at least two photoresist layers. The invention also proposes a display which is formed by the aforementioned method. [Embodiment] Referring to Figures 3A to 3E, there is shown a schematic view of a preferred embodiment of a display device of the present invention. As shown in Fig. 3A, a substrate 16 is first provided, which has a first conductive layer 18 thereon. The lower substrate 16 can be a glass substrate or a 150536.doc 201213947 plastic substrate and can include active or passive drive circuitry. The type of resin that can be used for the plastic substrate can be, for example but not limited to, a polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (polyethylene). Naphthalate, PEN); polyacrylate resin, such as polymethyl methacrylate (PMMA); polyolefin resin, such as polyethylene (PE) or polypropylene ( PP); polycyclic hydrocarbon resin (p〇lyCyCl〇〇lefin resin); polyimide resin; polycarbonate resin, polyacrylic acid (p〇iyUrethane resin) ; triacetyl cellulose (TAC); polylactic acid, or a combination thereof. Preferably, the polyester resin, the polycarbonate resin or a combination thereof, the first conductive layer 18' may be composed of a material well known to those skilled in the art, such as indium tin oxide (ITO). The composition 'is formed on the lower substrate 丨6 by sputtering. In addition, if the display medium material used is a liquid crystal material, the first conductive layer 18 may be coated with an alignment layer (not shown, the alignment layer may comprise polyvinyl alcohol, polyamidoamine, polyamine, nylon 'two Cerium oxide and lecithin. As shown in FIG. 3B, a dry film 2 is applied to the substrate 16 under the first conductive layer. In the preferred embodiment, the dry film 2 has a two-layer structure. The upper photoresist layer 20a and the lower photoresist layer 2〇b are respectively illustrated. However, the preferred embodiment is for illustrative purposes only, and is not intended to limit the number of layers included in the dry film 2(). In the preferred embodiment of the number of layers, 'can be changed to three or more layers according to the actual application. In the case of a dry film of two layers, the two layers are formed by a laminating roller 150536.doc 201213947 (lamination roller) process. In another preferred embodiment, the dry film 2 having a two-layer structure is formed on the lower substrate 16 by a vacuum lamination process. If a dry film of two layers is used as an example The dry film (upper photoresist layer + lower photoresist layer) may have a thickness of about 5 micrometers to 50 micrometers, preferably 1 Up to 35 microns, and in order to obtain a better planarization effect, the thickness of the lower photoresist layer should be controlled to be about the same as the thickness of the display dielectric material filled between the retaining wall structures. The dry film is a photosensitive material. It comprises a photosensitive resin and a surface modifying agent. The dry film of the two-layer structure is composed of two different photosensitive materials. In other words, the photosensitive resins of the upper and lower photoresist layers may be the same or different, but The above-mentioned photosensitive resin is known to those skilled in the art to which a different surface modifying agent is used, and may be an acrylic type resin or an epoxy resin. The surface modifier can be a wax "silane", for example: vinyl silane, polyether-functional trimethoxysilane, Novalac phenol resin (cresol novalac hybrid) Resin), perfluorobutane sulfonate, for example: di-functional perfluorobutane sulfona Te) or silicone, for example: di-functional acrylic type silicone, multi-functional acrylic type silicone, poly-stone Polyether silicone, per-polypropylpolyether silicone, di-functional isocyanate type silicone, difunctional amine-based lithium 150536.doc 201213947 Di-functional amino type silicone). However, in the two-layer structure, the upper photoresist layer and the lower photoresist layer respectively have different chemical affinities, and the thicknesses of the upper photoresist layer and the lower photoresist layer are adjusted according to the thickness of the display medium material filling. To meet the needs of displays with a variety of different display modes. The affinity between the upper and lower photosensitive materials and various display medium materials is related to the surface tension, and can be judged by the contact angle between the photosensitive material and the display medium material. Generally, the contact angle is large, indicating that it is more repulsive (- Phobic) shows the dielectric material, while the contact angle is small, indicating that it is better than (•phUic) to display the dielectric material. Because &, depending on the display medium used, it can be arbitrarily matched with a photosensitive material suitable for the upper photoresist layer and the lower photoresist layer. Generally speaking, the photosensitive material of the upper photoresist layer is preferably composed of a material which is relatively more repellent to the display medium material, and the photosensitive material of the lower photoresist layer is composed of a material of a relatively comparative display medium material. Preferably, if the affinity between the photosensitive material of the lower photoresist layer and the display medium material is too large, the display = the material will be adsorbed on both sides of the barrier wall and the surface is concave, so that the preferred embodiment of the present invention, The display medium material has a better planarization effect on the display medium material when the contact angle of the lower layer of the cholesterol liquid to the display medium material is from about 30 degrees to about 45 degrees. The experimental data is based on cholesterol liquid crystal (coffee is not a medium material, respectively: mesh, 丨, 匕 卞 显 显 ( (RG, the photosensitive material on the contact angle of water and cholesterol liquid crystal (RGB two colors), nature. Φ - A is not the surface tension of this photosensitive material. The source of the sterol liquid crystal is Yongzhen Chemical Co., Ltd. Because the surface tension of various display media materials is not: and the connection to water is proposed (4), (4) force material-like, so this Invention J is a reference point for reference. The 14 photosensitive materials listed in the table 150536.doc 201213947 can be constructed with a multilayer structure of dry film by any thickness and combination. These 14 kinds of photosensitive materials The main component comprises a photosensitive resin and a surface modifying agent, and the photosensitive resin may be a general organic photosensitive resin or an organic photosensitive resin having a special structure, such as an acrylic resin or an epoxy resin. For example, including stone soil, linaloline, Novalac phenolic resin, fluorine sulfonate and silicone rubber, the photosensitive material can be adjusted by using different photosensitive resin and appropriate surface modifier. The contact angle of the dielectric material. Table 1 Contact angle of the main component of the dry film and the display medium (R) Contact angle of the display medium (G) Contact angle of the display medium (Β) Contact angle with water Manufacturing example 1 Acrylic Resin/Bifunctional Acrylic Silicone 77 66 71 72 Production Example 2 Epoxy Resin/Polyether Silicone 60 61 66 65 Production Example 3 Acrylic Tree Moon/Perfluoropolyether Silicone 58 55 55 68 Manufacture Example 4 Acrylic resin/bifunctional isocyanate silicone 52 56 49 67 Production Example 5 Acrylic resin/bifunctional amine silicone 49 51 51 64 Production Example 6 Acrylic resin/vinyl decane 45 50 49 75 Production Example 7 Acrylic resin/polyfunctional acrylic silicone 41 43 34 72 Production Example 8 Acrylic silicone resin 38 41 45 63 Production Example 9 Acrylic resin/bifunctional group 36 39 41 68

-9-150536.doc 201213947 Preparation of fluorosulfonate salt 10 Acrylic resin/polyfunctional perfluorosulfonate 31 42 42 58 Production Example 11 Epoxy resin/polyether trimethoxydecane 28 35 31 60 Production example 12 Epoxy Resin / Novalac Hope Resin 25 38 25 79 Production Example 13 Epoxy Resin / Paraffin 22 33 20 93 Production Example 14 Acrylic Resin/Polyether Trimethoxydecane 19 29 24 80 In addition, the dry film upper and lower layers The thickness can also be adjusted to make the display medium material flat. For example, when the thickness of the photoresist layer under the dry film is equivalent to the thickness of the filled display medium material, the display medium material is easily leveled inside the groove, and the dielectric material of the photoresist layer on the thicker dry film is reused. The surface characteristics are such that the display medium material adsorbed to the two side retaining walls is repelled, so that a display substrate which can make the surface of the display medium material relatively flat can be obtained. In a preferred embodiment, when the thickness of the groove of the display medium filled between the retaining walls is about 2 micrometers, the thickness of the photoresist layer on the dry film is about 3 micrometers to 33 micrometers, and the dry film The thickness of the photoresist layer is about 2 micrometers. In another preferred embodiment, when the thickness of the recess of the display dielectric material between the barrier walls is about 5 micrometers, the thickness of the photoresist layer on the dry film is It is about 5 microns to 45 microns, and the thickness of the photoresist layer below the dry film is about 5 microns. As shown in Figures 3B through 3C, the dry film 20 is then patterned. First, a mask 22 is disposed above the dry film 20, and then a photolithography process is performed by using the mask 22 to form a plurality of 150536.doc -10·201213947 retaining walls 24 in a dry film 20 by a microlithography process. (The gap between the retaining walls is separated by the pgcheng groove 26)' and the retaining wall has upper and lower layers, wherein the thickness of the retaining wall is about 5 micrometers to 5 micrometers, and the width of the retaining wall is 1 to 35 micrometers. From about 15 microns to about 60 microns, the above specifications can be changed according to actual needs. Each of the retaining walls constitutes a display panel region, and the distance between the barrier walls is preferably about 50 micrometers to 250 micrometers, and the tantalum is 70 micrometers to 100 micrometers. However, the above specifications can be changed according to actual needs. Following the above process, after defining a plurality of walls 24 and a plurality of grooves 26, the retaining wall 24 is cured. The manner of curing is well known to those of ordinary skill in the art to which the invention pertains, and may be used, for example, to include UV curing. After curing, the substrate having the retaining wall 24 can be subjected to a subsequent baking process, using a temperature of about 10 (rc to mvc, preferably about 1 〇〇 < t to about 120 ° C for about 30 to 9 〇). In minutes, preferably about 4 to 6 minutes of baking 'to increase the chemical resistance and mechanical strength of the retaining wall 24. As shown in Fig. 3D, the display medium material is filled between the retaining walls of the lower substrate 16 (i.e., concave In the groove 26, the display medium material may be subjected to an ink-jet printing process by the ink-jet head 28, or may be filled between the retaining walls (in the groove 26) by vacuum input. The display medium material may be, for example, a cholesteric liquid crystal, or other display medium material well known in the art of the present invention. The dry film of Production Example 1 to Production Example 14 provided in Table 1 is cured to form a single layer or a double layer. A retaining wall fills the display medium (the three-color cholesteric liquid crystal of Yongri Chemical Co., Ltd.) between the retaining walls (in the groove), and shows the flattening of the dielectric material between the retaining walls (in the groove) by optical microscopy. 150536.doc 11·201213947, the observations are as Table 1 Table 2 Example double wall structure shown in FIG. 2 embodiment observations dry film 7 for producing (upper layer) / 9 for producing (lower layer)

Example 2 Double layer Manufacturing 1 (upper layer) / manufacturing 9 (lower layer)

Comparative example 1 single layer manufacturing 1

Li Comparative Example 2 Single layer Manufacturing 2

Comparative Example 3 Single layer Manufacturing 5

150536.doc -12- 201213947 Comparative Example 4 Single layer Manufacturing 9 Comparative Example 5 Single layer Manufacturing 10

Comparative Example 6 Single layer Production 11 Comparative Example 7 Single layer Manufacturing 12 Comparative Example 8 Single layer Manufacturing 13

Comparative Example 9 Single layer Manufacturing 14

150536.doc -13 - 201213947

Comparative Example 10 Double-layer production 5 (upper layer) / production 14 (lower layer) 比较 Comparative Example 1 shown in Table 2 is a single-layer structure of a photosensitive material (manufacturing example 1) using the most cholesteric liquid crystal, and a cholesteric liquid crystal The two sides of the retaining wall are repelled to the middle. 'Comparative Example 9 is the wall of the single-layer structure of the most cholesteric liquid crystal (Manufacturing Example 14). Therefore, the cholesteric liquid crystal to be printed is adsorbed on both sides of the retaining wall and the surface is concave. Therefore, in the optical microscope image, a whiter area in the middle of the liquid crystal is the shallower portion of the liquid crystal. The dry film of Comparative Example 4 (Manufacturing Example 9) was preferable to the flattening effect of the cholesteric liquid crystal as compared with the other single-layer retaining walls, but the flattening effect required for the display was not obtained. The first embodiment, the second embodiment and the comparative example 1 shown in Table 2 are double-walled retaining wall structures, and the lower layer of the retaining wall of the first embodiment and the second embodiment has a manufacturing example 9 in which the flattening effect on the cholesteric liquid crystal is better. In the case of using the photosensitive material for repelling cholesteric liquid crystal, the production method of Example 7 and Production Example 1 respectively, the planarization effect of the cholesteric liquid crystal was good, and the comparative example 10 was a photosensitive material using the most cholesteric liquid crystal under the enamel wall (Production Example 14). With the use of the repellent cholesteric liquid crystal = photosensitive material (Production Example 5) in the upper layer, the flattening effect on the cholesteric liquid crystal was inferior to those of Example 1 and Example 2. As shown in Figure 3E, a plurality of upper covers 32 are formed over the display medium material. The upper cover may be a polymer protective layer. In addition, a bonding process of the substrate 36 and the lower substrate 16 on the second layer 150536.doc -14-201213947 is performed, such as a hot roller pressing process. The upper substrate is a glass substrate or a plastic substrate, and the second conductive layer 34 is made of an inorganic conductive material or an organic conductive material, and may include an active or passive driving circuit.

Since the photosensitive dry film of the present invention has two or more layers and the upper and lower layers have different surface properties, and the different surface properties are derived from the results after photopolymerization, the surface properties are permanent, unlike electricity. The surface properties of the pulp treatment will quickly fade away over time. Since the present invention first applies a photosensitive dry film having an upper layer and a lower layer on the surface of the substrate, and then performs a patterning process to define a plurality of retaining walls in the photosensitive dry film, and then refilling the display material to the retaining wall Between the grooves (the wall made of the double-layer photosensitive dry film with different characteristics described above) can effectively improve the material flattening caused by the single-layer structure retaining wall in the conventional production display section, and constructed in two processes. The problem of complicated process of double-layer structure retaining wall, the use of toxic gas generated by plasma surface treatment and the problem of only temporary surface modification characteristics. [Simple description of the figure] Figure ^ is a single-layer liquid crystal in the prior art FIG. 2 shows a schematic view of a cross-sectional structure of a display substrate of the structure. FIG. 2 shows a case where the flatness of the dielectric material is just after filling the substrate. A preferred embodiment of the manufacturing method of the display FIGS. 3A to 3E show an example 0 of the present invention. 】150536.doc -15- lower substrate substrate liquid crystal material retaining wall retaining wall display medium material cover first conductive film second conductive film lower substrate Conductive layer Photosensitive dry film Photosensitive dry film upper layer Photosensitive dry film underlayer Photomask Retaining wall Retaining wall layer Retaining wall lower layer Groove Inkjet head No dielectric material Upper cover Second conductive layer Upper substrate -16-

Claims (1)

201213947 VII. Patent application scope: 1. A method for manufacturing a display, comprising the steps of: providing a lower substrate having a first conductive layer; forming a plurality of retaining walls on the lower substrate; filling display medium materials on the retaining walls Forming an upper cover on the display medium material; and performing a bonding process of the second conductive layer and the lower substrate, wherein the retaining walls are formed by: forming a dry film on the lower substrate; Over the dry film; and patterning the dry film using a photolithography process to form a plurality of barrier walls, wherein the dry film has at least two photoresist layers. 2. If the request is in the manner described in the figure, the dry film has an upper photoresist layer and a lower photoresist layer. 3. The method of claim 2, wherein a contact angle of the upper photoresist layer with the display medium material is greater than a contact angle of the lower photoresist layer with the display medium material. The method of claim 2, wherein the thickness of the lower photoresist layer is equivalent to a thickness of the display medium material filled between the barrier walls. A method as claimed in the above, wherein the dry film comprises a photosensitive resin and a surface modifying agent. The method of claim 5, wherein the surface modifying agent is selected from the group consisting of paraffin, decane, N0valac phenolic resin, gas sulfonate, and silicone. 7. As described in claim 1, the straight line &lt; 沄 沄 after patterning the dry film, further includes 150536.doc 201213947 containing curing the dry film. 8. The method of claim 7 wherein the curing comprises an ultraviolet light. 9. The method of claim 7 is a baking process. 1 0. The method of claim 9, l ° ° C to about 150 ° C. 11. The method of claim 9 to 30 to about 90 minutes. 12. The method of claim 1 to 50 microns. 13. The method of claim 1 is up to 60 microns. 14. The method of claim 1 micron to about 250 microns. 15. The method of claim 1, wherein the alcohol liquid crystal. After the curing of the dry film, the temperature of the baking process is further included, wherein the baking process is about time, wherein the thickness of the retaining wall is between 5 micrometers, wherein the width of the retaining wall is The method of claim 1, wherein the method of forming the dry film on the lower substrate is a laminating roller or Vacuum lamination. η. The method of claim </ RTI> wherein the method of filling the display medium material between the retaining walls is ink jet printing or vacuum injection. 18. A display device formed by the method of manufacture of the display as claimed in claim 1. 150536.doc