TW201212133A - Form for wire winding of bonding wire for semiconductor - Google Patents

Form for wire winding of bonding wire for semiconductor Download PDF

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Publication number
TW201212133A
TW201212133A TW100100477A TW100100477A TW201212133A TW 201212133 A TW201212133 A TW 201212133A TW 100100477 A TW100100477 A TW 100100477A TW 100100477 A TW100100477 A TW 100100477A TW 201212133 A TW201212133 A TW 201212133A
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Taiwan
Prior art keywords
winding
wire
wound
row
bonding wire
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TW100100477A
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Chinese (zh)
Inventor
Yukihiko Iyonaga
Rina Honda
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Tanaka Electronics Ind
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Publication of TW201212133A publication Critical patent/TW201212133A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H55/00—Wound packages of filamentary material
    • B65H55/04—Wound packages of filamentary material characterised by method of winding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H65/00—Securing material to cores or formers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/18—Constructional details
    • B65H75/26—Arrangements for preventing slipping of winding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/18—Constructional details
    • B65H75/28—Arrangements for positively securing ends of material
    • B65H75/285—Holding devices to prevent the wound material from unwinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78601—Storing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)

Abstract

To provide a form for wire winding of bonding wire for semiconductors such that even if the bonding wire is cut, springback does not occur easily, and the wire does not loosen greatly on the spool. A wire winding structure for the end part of the winding (grounding part when the wire is unwound) of the main winding part for a bonding wire wound onto the wire winding part of a spool core is provided such that the winding structure for a first layer forms a structure in which grounding wires closely adhere to each other on the spool core, and lines are formed so as to be wound in alignment, with the plurality of wires in those lines separated from each other and inserted to form a winding with a strongly adhering alignment.

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201212133 六、發明說明： 【發明所屬之技術領域】 本發明，是關於半導體裝置的組裝等所使用之捲繞在 線軸上的接合線捲線形態。 【先前技術】 半導體裝置之組裝等所使用的接合線是以數千公尺的 長度捲附在線軸的圓筒狀胴部上成數十毫米程度厚的實捲 部份。爲了防止該實捲部份的鬆垮變形，例如第3圖所示 ，是構成爲往側捲線和復側捲線交叉捲繞在線軸上的交叉 捲線形態（交叉捲線形態部份1 4 )，透過在捲線始端部設 有可使捲線不交叉之指定長度的序列捲繞部份（1 3 )，利 用（暫時固定的）膠帶（1 5 )將線的捲線始端（1 1 )(在 線拉出時爲末端部）和捲線末端（1 2 )(在接合線拉出時 爲始端部）固定在胴部外側或凸緣（1 6 )藉此防止捲繞鬆 弛（參照專利文獻1 )。 該接合線捲繞體，於使用時，將線軸安裝在接合裝置 之後，撕掉膠帶，拉出捲線始端做爲接地部，捲線末端是 拉出引導至送線路徑。除此之外，也有進行所謂的線剪斷 方式，該方式是不撕掉線末端固定在線軸凸緣等使用的末 端膠帶，直接剪斷末端膠帶附近的線，然後將切斷的線連 接在接地。 上述膠帶的撕掉作業是使用小鑷子進行非常細腻的作 業，因此有時在捲繞開始端部或捲線的末端部撕掉上述膠 -5- 201212133 帶時是會導致已施有張力的接合線從小鑷子脫落。另一方 面，即使是在不撕掉末端膠帶直接剪斷線拉出做爲接地部 時的狀況，也會有在剪斷時已施有張力的接合線其端部彈 跳導致接合線從小鑷子脫落。在捲繞開始端部發生接合線 從小鑷子脫落的狀況時，是不會影響到實捲部份的接合線 ，但在捲線的終端部發生接合線從小鑷子脫落的狀況時， 接合線會縮進捲繞在線軸胴部的線當中，或因剪斷造成捲 繞在胴部的線鬆弛或糾纏，屢屢產生所謂的回彈現象。 取代利用膠帶將捲繞結束端部固定在胴部外側或凸緣 的固定方式，也有嘗試提案例如第4圖所示在捲繞結束端 部（17)繫上接合線拉出用長尺寸物（18)的半導體用接 合線的捲線形態（參照專利文獻2 )。第4圖中1 9爲凸緣。 長尺寸物，最好是膠帶彼此固定成可接離，但膠帶以外爲 非固定性質的非黏著性帶。 但是’於該先行例，首先爲了使用所謂的黏著膠帶是 需花費該黏著膠帶購入、管理用的費用。此外，若具有接 合作業上不需要的非黏著性帶時，恐怕會誤將非黏著性帶 和接合線一起進行接合作業，另外，氣溫的高低變化是會 造成該非黏著性帶的拆除反而較費時，也會造成作業效率 變差。 此外’又嘗試提案有在實捲部份設有序列捲繞部份之 型式的捲繞形態（參照專利文獻3 )。該例子爲第5圖所示 的形態’由交叉多層捲繞在線軸20中央部份的台形積層形 態形成的實捲部份2 1，是在其兩側以序列捲繞方式捲繞有 -6- 201212133 前頭捲繞部份2 2和尾端捲繞部份2 3，該前頭捲繞部份2 2和 尾端捲繞部份23的前端是以末端膠帶24固定在凸緣25。 序列捲繞部份，如第6 ( a )圖所示，若是爲先前較寬 間隔之前頭捲繞時，在線剪斷方式時，剪斷後之接合線的 前頭捲繞部份22會一口氣鬆垮，屢屢產生鬆弛、糾纏等所 謂回彈現象[第6 ( a ) 、（ b )圖]。但是，若是將接合線彼 此接觸成緊密時，施加在剪斷後之接合線26的衝擊能量就 可由鄰接的接合線吸收、散發[第6(c)圖]。不過，遺憾 的是該形態並非萬無一失。 〔先行技術文獻〕 〔專利文獻〕 專利文獻1:日本實開昭57-093 1 44號公報 專利文獻2:日本特開2000-277560號公報 專利文獻3:日本特開2004-1 1 1449號公報 【發明內容】 〔發明欲解決之課題〕 本發明，是有鑑於以上所述之先前實況而爲的發明， 其目的是提供一種即使在捲線的末端部因失誤造成接合線 從小鑷子脫落也不會產生回彈現象的接合線之捲線形態。 此外，本發明的另一目的，是不需扭轉或彎折接合線，利 用捲繞的線本身就能夠在線不必鬆驰的狀態下固定捲繞結 束端部（前頭部份）。 201212133 〔用以解決課題之手段〕 爲了達成上述目的，本發明的半導體用接合線的捲線 形態之一， (a )將線軸的圓筒狀胴部的中央部份捲繞有做爲半 導體用接合線使用之線的η捲部份，和該實捲部份之線的 捲繞結束端部捲繞在上述線軸之圓筒狀胴部端部份的接地 部份，及從該接地部份拉出之線的終端固定在線軸之凸緣 的半導體用接合線之捲線形態，其特徵爲， 上述接地部份之線的捲線構造是全體爲由第1捲繞列 的線和第2捲繞列的線所構成的第1層捲繞構造，該第2捲 繞列的線爲離散之複數的線，其各個的線是兩側和在線軸 胴部上彼此貼緊序列捲繞之第1捲繞列之複數的線成高貼 緊序列捲繞的構造。 此外，本發明的另一捲線形態， (b )將線軸的圓筒狀胴部的中央部份捲繞有做爲半 導體用接合線使用之線的實捲部份，和該實捲部份之線的 捲繞結束端部捲繞在上述線軸之圓筒狀胴部端部份的接地 部份，及從該接地部份拉出之線的終端固定在線軸之凸緣 的半導體用接合線的捲線形態，其特徵爲， 上述接地部份之線的捲線構造是全體爲由第1捲繞列 的線和第2捲繞列的線所構成的第1層捲繞構造，該第1捲 繞列的線是由在線軸胴部4上彼此貼緊序列朝外側捲繞的 主接地部份及朝內側捲繞的副接地部份所構成，該第2捲 繞列的線爲單數或離散之複數的線，其各個的線是兩側和 -8- 201212133 上述主接地部份之複數的線成高貼緊序列捲繞的構造。 另外’本發明的半導體用接合線的捲線形態是以下述 爲較佳形態。 (C )接合線爲熱處理過的金屬細線。 (d)捲繞在主接地部份之第1捲繞列的線是捲繞成遠 離實捲部份。 (e )捲繞在主接地部份之第2捲繞列的線是從在線軸 胴部4上彼此貼緊序列捲繞之第1捲繞列之複數的線上壓入 ，以高貼緊序列的狀態捲繞著。 (f )捲繞在副接地部份之第1捲繞列的線是朝與捲繞 在主接地部份之第1捲繞列的線相反的方向捲繞著。 〔發明效果〕 根據本發明時’由於捲繞在線軸圓筒狀胴部之實捲部 份的接合線’是於其捲繞結束端部（於線拉出時之爲始端 部）構成要做爲接地部份由第1捲繞列的線漢第2捲繞列的 線所形成的第1層捲繞構造體，該第2捲繞列的線爲離散之 複數的線，其各個的線是兩側和在線軸胴部4上彼此貼緊 序列捲繞之第1捲繞列之複數的線成高貼緊序列捲繞著， 因此就能夠確實防止回彈進而能夠防止捲繞鬆垮。再加上 ’若是將接地部份由緊接著主接地部份設有副接地部份之 一部份構成時’就能夠更加確實防止回彈進而能夠防止捲 繞鬆垮。 其他的效果： -9 - 201212133 a. 若是在回彈的狀態（線在線軸上成鬆弛的狀態） 下，直接進行接合作業時線會產生糾纏，導致線斷掉。但 是，若線是高貼緊序列捲繞著，則線接觸時的摩擦阻力會 較大，因此主接地部份的線不會鬆弛，不會產生回彈、糾 纏現象。 b. 可不拘實捲的捲繞長度或實捲捲繞條件應用本發 明的捲繞構造體。 c. 由於接地部的張力狀態比先前的捲繞構造體還強 ，因此送線時接地部的鬆弛就會大幅減少。 d. 通常線產生鬆弛時，是用手將鬆弛的線一條一條 解開後使用，但若採用高貼緊序列捲繞的構造，就不需上 述作業》 【實施方式】 〔發明之最佳實施形態〕 以下，是參照圖面對本發明的實施形態進行詳細說明 〇 本發明的第一捲線形態，是在線軸胴部上彼此貼緊序 列捲繞之第1捲繞列之複數的線之間，高貼緊序列捲繞有 離散之複數的線即第2捲繞列的線之構造。從實捲部份拉 出實捲線的影鬯，因爲複數次貼緊序列捲繞之第1捲繞列 的線可得以忽視。此外，第2捲繞列的線，是由線軸胴部 上彼此貼緊序列捲繞之第1捲繞列的複數線從兩側夾持著 ，因此就成爲高貼緊序列捲繞的構造，即使固定在線軸凸 -10- 201212133 緣的接合線從小鑷子脫落也無會造成鬆開，但安全起見最 好是第2捲繞列的線爲複數條捲繞著。 第1圖中，在線軸的凸緣1側其與實捲部份（省略圖示 )之間的線軸胴部2，將第1捲繞列3彼此貼緊序列朝外側 捲繞適當次數（需要4次以上，最好是1 0〜1 5次），從其 終端返回至第1捲繞列的捲繞開始側，邊壓入在第1捲繞列 的中間捲繞和其前一個捲繞之間邊開始第2捲繞列4，進行 單數或離散之複數的捲繞，然後用膠帶5將末端固定在凸 緣1(也可固定在線軸胴部2)。該膠帶固定，也可取代成 是利用先前技術所採用的接合線拉出用長尺寸物（非黏著 性帶）。 當第1捲繞列，是貼緊序列成使相鄰的線彼此鄰接， 第2捲繞列，是以第1捲繞列捲繞時相同的張力或較大的張 力捲繞時，第2捲繞列就會壓入在第1捲繞列之鄰接的捲繞 間，形成爲高貼緊序列狀態（但是、第2捲繞列的張力狀 態是實捲繞張力狀態的2倍）。該狀態，是能夠確實防止 回彈造成的接合線鬆弛等問題。第2捲繞列捲繞時的張力 ，並非限定性，但其和第1捲繞列捲繞時的張力相比，最 好是大致同等以上的捲繞張力（但是、第2捲繞列的張力 狀態是實捲繞張力狀態的2倍）。 另，爲了方便圖示，第1圖中，第1捲繞列是以粗線表 示，第2捲繞列的接合線是以空白線表示。 此外，第二捲線形態，是將接地部份爲緊接著主接地 部份設有副接地部份的二部份構成。由於將接地部份爲緊 -11 - 201212133 接著主接地部份設有副接地部份，因此實捲線從實捲部份 被拉出來的影桴，是不會波及到副接地部份。接著，副接 地線從副接地部份被拉出來的影響，也會因主接地線和副 接地線的接觸面積增大形成的摩擦阻力而不會涉及末端膠 帶。因此，撕掉末端膠帶即使不用小鑷子夾著線，也可使 實捲線和副接地線的摩擦阻力比要讓副接地線本身鬆開的 力還大。該摩擦阻力，是主接地部份捲繞次數愈多，其就 能夠愈大。 第2圖中，是在線軸之凸緣1側的線軸胴部2，以做爲 第1捲繞列捲繞有彼此貼緊序列朝外側捲繞的主接地部份6 及朝內側捲繞的副接地部份7。接著，是將副接地部份7的 終端返回主接地部6，邊壓入在主接地部份6的線其適宜的 捲繞間（中間捲繞和其前一個捲繞之間）邊開始第2捲繞 列，進行單數或離散之複數的捲繞，然後用膠帶5將末端 固定在凸緣1 (也可固定在線軸胴部2 )。第2捲繞列捲繞 時的張力是和第一捲繞形態相同形成爲與第1捲繞列捲繞 時的張力同等或較大（但是、第2捲繞列的張力狀態是實 捲繞張力狀態的2倍）。 如此一來，就能夠更加確實防止回彈造成接合線鬆驰 等問題。 另，兩捲繞形態中，前頭部份（接地部）理所當然是 可設置在實捲部份的兩側。 接合線的材質，是由金（Au )、銀（Ag )、鋁（A1 )、銅（Cu)或該等的合金等形成，因此是可根據該等材 -12- 201212133 質適當調整捲繞次數或線間隔。另，第2捲繞列的線即將 具有上述的摩擦阻力，但也會遍及第2捲繞列的線全周運 作水平方向的壓縮力，因此線的外觀不會產生損傷或凹陷 造成的光澤異常。 〔實施例1〕 首先，是將線徑爲250111、純度99.99質量％以上之金（ Au )的半導體用接合線（經熱處理成延展率4% )各 1 0,000m，利用交叉多層捲繞，捲繞有4,000層在具有直徑 50mm、長45.5 mm之圓筒狀胴部的線軸胴部，形成實捲部 份。 此時，是構成爲隨著成爲上層捲繞線寬度逐漸變小的 台形積層形態。捲繞條件，是初期捲繞寬度40mm，間隔 寬度5mm。 如上述形成有實捲部份之後，是將線軸邊往捲繞結束 側之主、副接地線的取出位置移動，邊形成主、副接地部 份。此時的主接地部份的捲繞條件，是張力狀態爲實捲部 份的2倍，間隔寬度是線徑25μιη時爲25μηι，往遠離實捲部 份的方向捲繞11圏。副接地部份的捲繞條件，是張力狀況 爲實捲部份的2倍，在主接地部份和副接地部份之間往實 捲部份的方向鄰接的線以平均性緊密接觸的狀態序列捲繞 6圏。緊接著，捲繞2圈在以實捲部份的2倍的張力狀態捲 繞有副接地線的主接地線之間後，就用黏著膠帶利用先前 的固定手段固定在凸緣端。 -13- 201212133 〔比較例〕 除了未設有副接地部份以外，其他是和實施例相同， 形成爲主接地線往遠離實捲部份的方向捲繞20圈，以黏著 膠帶固定在凸緣的端部。 將該已經固定之實施例和比較例的線軸針對各線徑的 接合線分別以各1 〇從黏著膠帶附近使用小鑷子切斷，線回 捲之次數的平均値經算出後，獲得如表1所示結果。 【表1】 〔表1〕回捲次數的比較 接合線的線徑 實施例 比較例 25μηι 0.9次 9.8次 從上述結果明確得知，根據本發明的半導體用接合線 之捲線形態時，回彈明顯比先前捲線形態少。另，實施例 及比較例之線軸當中任一的線，都沒有損傷或散射等外觀 不良，對接合裝置的安裝也沒有產生線的阻塞。此外，接 合線的線徑爲20μηι和30μηι時的回捲次數是1次以下。 【圖式簡單說明】 第1圖爲表示本發明第一捲線形態要部的局部說明圖 〇 第2圖爲表示本發明第二捲線形態要部的局部說明圖 -14- 201212133 第3圖爲表示接合線的實捲部份爲交叉捲線形態之先 前技術說明圖。 第4圖爲表示捲繞結束端部（17)繫有線拉出用長尺 寸物之半導..體用接合線的捲線形態之先前技.術說明圖。 第5圖爲表示實捲部份的兩側設有序列捲繞部份之型 式的捲繞形態之先前技術說明圖。 第6圖爲接合線之前頭捲繞部份的回彈現象說明圖， (a )爲表示非貼緊狀態之通常的前頭捲繞部份說明圖， (b)爲表示於（a)圖狀態下採線剪斷方式時產生的回彈 現象說明圖’ （c )爲表示形成爲貼緊序列的前頭捲繞部 份說明圖。 【主要元件符號說明】 1 :凸緣 2 :線軸 3 :第1捲繞列 4 :第2捲繞列 5 :膠帶 6 :主接地部份 7 副接地部份 11:(接合線的）捲線始端 1 2 :(接合線的〉捲線末端 1 3 :序列捲繞部份 1 4 :交叉捲線形態部份 -15- 201212133 15:(暫時固定的）膠帶 1 6 :(線軸的）凸緣 1 7 :捲繞結束端部 18:(接合線拉出用的）長尺寸物 19 :凸緣 20 :線軸 2 1 :實捲部份 22 :前頭捲繞部份 23 :尾端捲繞 24 :末端膠帶 2 5 :凸緣 26 :接合線 -16-201212133 SUMMARY OF THE INVENTION [Technical Field] The present invention relates to a form of a bonding wire wound wire wound around a bobbin used for assembly of a semiconductor device or the like. [Prior Art] A bonding wire used for assembly of a semiconductor device or the like is wound into a cylindrical portion of a bobbin having a thickness of several thousands of meters and is a solid portion having a thickness of several tens of millimeters. In order to prevent the loose deformation of the real-volume portion, for example, as shown in Fig. 3, the cross-winding form (cross-winding form portion 14) of the cross-winding and the double-side winding are cross-wound on the bobbin. A sequence winding portion (1 3 ) of a predetermined length at which the winding wires are not crossed is provided at the beginning of the winding wire, and the starting end (1 1 ) of the wire is wound by the (temporarily fixed) tape (1 5 ) (when the wire is pulled out The end portion) and the winding end (1 2 ) (the starting end portion when the bonding wire is pulled out) are fixed to the outside of the crotch portion or the flange (16) to prevent the winding from being slack (see Patent Document 1). In the use of the wire wound body, after the bobbin is attached to the joining device, the tape is torn off, and the beginning of the winding wire is pulled out as a grounding portion, and the end of the winding wire is pulled out to guide the wire feeding path. In addition to this, there is also a so-called wire cutting method in which the end tape used for fixing the bobbin flange or the like is not peeled off, the wire near the end tape is directly cut, and then the cut wire is connected. Ground. The tearing operation of the above-mentioned tape is a very delicate operation using a small tweezers. Therefore, sometimes the above-mentioned glue-5-201212133 tape is torn off at the end portion of the winding start or the end portion of the winding wire, which causes the tensioned joint to be applied. The line fell off from the little scorpion. On the other hand, even if the end tape is not cut off and the wire is pulled out as a grounding portion, there is a bonding wire that has been subjected to tension at the time of cutting, and the end portion bounces to cause the bonding wire to fall off from the small tweezers. . When the bonding wire is detached from the small tweezers at the winding start end, the bonding wire does not affect the actual winding portion. However, when the bonding wire is detached from the small tweezers at the end portion of the winding wire, the bonding wire is indented. The so-called rebound phenomenon is often caused by the slack or entanglement of the wire wound around the crotch portion of the wire shaft or the wire wound around the crotch. Instead of fixing the winding end portion to the outer side of the crotch portion or the flange by means of a tape, there is an attempt to propose a long product for the wire drawing at the winding end portion (17) as shown in Fig. 4 ( 18) The winding form of the bonding wire for a semiconductor (refer to Patent Document 2). In Fig. 4, 1 9 is a flange. For long-sized articles, it is preferable that the tapes are fixed to each other to be detachable, but non-adhesive tapes other than the tape are non-stationary. However, in the first example, in order to use the so-called adhesive tape, it is necessary to spend the cost of purchasing and managing the adhesive tape. In addition, if there is a non-adhesive tape that is not required for the joining operation, the non-adhesive tape and the bonding wire may be accidentally joined together, and the change in the temperature may cause the removal of the non-adhesive tape to be time consuming. It will also cause the work efficiency to deteriorate. Further, there has been proposed a winding form in which a sequence winding portion is provided in a solid portion (see Patent Document 3). This example is the form shown in Fig. 5, and the real-volume portion 21 formed by the mesa-shaped laminated form in which the central portion of the bobbin 20 is wound in the cross-multilayer is wound on the both sides in a sequential winding manner. - 201212133 The front winding portion 2 2 and the trailing end winding portion 2 3 are fixed to the flange 25 by the end tape 24 at the front end of the front winding portion 2 2 and the trailing end winding portion 23. The sequence winding portion, as shown in Fig. 6(a), is the first winding portion 22 of the bonding wire after the cutting, if it is wound before the previous wide interval, in the online cutting mode. Hey, there are repeated so-called rebound phenomena such as slack and entanglement [Fig. 6 (a), (b)]. However, if the bonding wires are brought into close contact with each other, the impact energy applied to the bonding wires 26 after the shearing can be absorbed and emitted by the adjacent bonding wires [Fig. 6(c)]. However, it is a pity that this form is not foolproof. [PRIOR ART DOCUMENT] [Patent Document] Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. 2000-277560. [Problem to be Solved by the Invention] The present invention has been made in view of the above-described prior art, and an object of the invention is to provide a structure in which a bonding wire is not detached from a small tweezers even if a tip end portion of a winding wire is mistaken. The winding form of the bonding wire that produces a rebound phenomenon. Further, another object of the present invention is to fix the winding end portion (head portion) in a state where it is not required to be relaxed on the wire, without twisting or bending the bonding wire, by using the wound wire itself. 201212133 [Means for Solving the Problem] In order to achieve the above object, one of the winding forms of the bonding wire for a semiconductor of the present invention, (a) winding the central portion of the cylindrical portion of the bobbin as a semiconductor joint The η coil portion of the wire used by the wire, and the winding end portion of the wire of the actual wound portion are wound around the ground portion of the cylindrical end portion of the bobbin, and are pulled from the ground portion A winding form of a bonding wire for a semiconductor in which a terminal of a wire is fixed to a flange of a bobbin, wherein the winding structure of the wire of the ground portion is a wire of the first winding row and a second winding row. The first layer winding structure formed by the line, the line of the second winding row is a discrete plurality of lines, and the respective lines are the first volume wound on the both sides and the bobbin on the bobbin. The plurality of lines of the wrap are wound into a highly wound sequence. Further, in another winding form of the present invention, (b) the central portion of the cylindrical flange portion of the bobbin is wound around a real winding portion of a wire used as a bonding wire for a semiconductor, and the solid portion is The winding end portion of the wire is wound around the ground portion of the cylindrical end portion of the bobbin, and the terminal of the wire drawn from the ground portion fixes the semiconductor bonding wire of the flange of the bobbin The winding form is characterized in that the winding structure of the line of the ground portion is a first layer winding structure including a line of the first winding row and a wire of the second winding row, and the first winding The line of the column is composed of a main ground portion wound toward the outer side of the wire shaft portion 4 and a sub-ground portion wound toward the inner side, and the line of the second winding row is singular or discrete. The plurality of lines, each of which is a structure in which the plurality of lines of the above-mentioned main grounding portions of the above-mentioned main grounding portions are wound in a high-tight sequence. Further, the winding form of the bonding wire for a semiconductor of the present invention is preferably as follows. (C) The bonding wire is a heat-treated metal thin wire. (d) The wire wound in the first winding row of the main ground portion is wound away from the solid portion. (e) The line wound in the second winding row of the main ground portion is pressed from the plurality of lines of the first winding row wound in close contact with each other on the wire shaft portion 4, and is in a high-contact sequence. The state is wound up. (f) The wire wound in the first winding row of the sub-ground portion is wound in a direction opposite to the wire wound in the first winding row of the main ground portion. [Effect of the Invention] According to the present invention, the 'bonding line' of the wound portion of the cylindrical portion of the bobbin is formed at the end portion of the winding end (the beginning portion when the wire is pulled out) a first layer wound structure in which a ground portion is formed by a line of a second winding row of a first winding row, wherein the line of the second winding row is a discrete plurality of lines, and each of the lines It is possible that the plurality of wires of the first winding row wound in the sequence on the both sides and the wire shaft portion 4 are wound in a high-fitting sequence. Therefore, it is possible to surely prevent the rebound and prevent the winding from being loosened. In addition, if the ground portion is formed by a portion of the main ground portion provided with the sub-ground portion, it is possible to more reliably prevent the rebound and prevent the winding from becoming loose. Other effects: -9 - 201212133 a. If it is in the rebound state (the state where the wire is slack on the bobbin), the wire will be entangled when the bonding work is directly performed, causing the wire to break. However, if the wire is wound in a high-tight sequence, the frictional resistance at the time of wire contact will be large, so that the wire of the main ground portion will not be slack, and no rebound or entanglement will occur. b. The wound structure of the present invention can be applied without the winding length or the actual winding condition of the roll. c. Since the tension state of the grounding portion is stronger than that of the previous wound structure, the slack of the grounding portion at the time of wire feeding is greatly reduced. d. When the line is slack, the slack line is unwrapped by hand, but if the structure is wound with a high close sequence, the above operation is not required. [Embodiment] [Best implementation of the invention [Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings, and a first winding form of the present invention is a line between a plurality of lines of a first winding row in which a linear winding portion is closely wound with each other. A structure in which a line of a plurality of discrete lines, that is, a line of the second winding train, is wound in a high close sequence. The effect of the actual winding is pulled out from the real winding portion, because the line of the first winding row wound in a plurality of times can be ignored. Further, since the lines of the second winding row are sandwiched by the plurality of lines of the first winding row wound in close contact with each other on the bobbin crotch portion, the wire is wound in a high-contact sequence. Even if the bonding wire of the fixed bobbin -10- 201212133 edge is detached from the small tweezers, it does not cause loosening, but it is preferable that the wire of the second winding row is wound in a plurality of wires for safety. In the first drawing, the bobbin crotch portion 2 between the flange 1 side of the bobbin and the real winding portion (not shown) is wound around the first winding row 3 to the outside in an appropriate number of times (required) 4 times or more, preferably 10 to 15 times), returning from the terminal to the winding start side of the first winding row, and press-fitting the intermediate winding of the first winding row and the previous winding thereof The second winding row 4 is started between the singular or discrete plural windings, and then the end is fixed to the flange 1 by the tape 5 (the wire shaft portion 2 can also be fixed). The tape is fixed or replaced by a long-sized material (non-adhesive tape) for use in the drawing of the bonding wire used in the prior art. When the first winding row is in a close sequence such that adjacent wires are adjacent to each other, and the second winding row is wound by the same tension or a large tension at the time of winding the first winding row, the second winding is performed. The winding row is pressed into the adjacent winding between the first winding rows, and is formed in a high-contact state (however, the tension state of the second winding row is twice the actual winding tension state). This state is a problem that can reliably prevent the looseness of the bonding wire caused by the rebound. The tension at the time of winding the second winding row is not limited, but it is preferably equal to or higher than the tension at the time of winding the first winding row (but in the second winding row) The tension state is twice the state of the actual winding tension). Further, for convenience of illustration, in the first drawing, the first winding row is indicated by a thick line, and the bonding wire of the second winding row is indicated by a blank line. In addition, the second winding form is composed of two parts in which the ground portion is provided with the sub-ground portion immediately after the main ground portion. Since the grounding portion is tightly -11 - 201212133 and then the main grounding portion is provided with a sub-ground portion, the effect of the real winding wire being pulled out from the real coil portion does not affect the sub-ground portion. Then, the influence of the sub grounding wire being pulled out from the sub-ground portion is also caused by the frictional resistance formed by the contact area of the main grounding wire and the sub-grounding wire, and does not involve the end tape. Therefore, tearing off the end tape can make the frictional resistance of the solid winding wire and the secondary grounding wire larger than the force for releasing the secondary grounding wire itself, even if the wire is not sandwiched by the small tweezers. The frictional resistance is that the more the main grounding portion is wound, the larger it can be. In the second drawing, the bobbin crotch portion 2 on the flange 1 side of the bobbin is wound as a first winding row with a main ground portion 6 wound toward the outside in a close contact sequence and wound toward the inside. Sub grounding section 7. Next, the terminal of the sub-ground portion 7 is returned to the main ground portion 6, and is pressed into the appropriate winding between the line of the main ground portion 6 (between the intermediate winding and the preceding winding). 2 Winding the row, performing a singular or discrete plural winding, and then fixing the end to the flange 1 with a tape 5 (the wire shaft portion 2 can also be fixed). The tension at the time of winding the second winding row is equal to or larger than the tension at the time of winding the first winding row, similarly to the first winding form (however, the tension state of the second winding row is a real winding 2 times the tension state). In this way, it is possible to more reliably prevent problems such as rebound and loosening of the bonding wires. In addition, in the two winding forms, the front portion (the ground portion) can of course be disposed on both sides of the solid portion. The material of the bonding wire is formed of gold (Au), silver (Ag), aluminum (A1), copper (Cu), or the like, and therefore the winding can be appropriately adjusted according to the quality of the material -12-201212133. Number of times or line spacing. Further, the line of the second winding row immediately has the above-described frictional resistance, but the horizontal compressive force is also applied throughout the entire circumference of the second winding row, so that the appearance of the wire does not cause damage or uneven glossiness due to the depression. . [Example 1] First, a bonding wire for a semiconductor having a wire diameter of 250,111 and a purity of 99.99% by mass or more (a heat-treated to have an elongation of 4%) of 10,000 m each was wound by a cross-multilayer. A 4,000-layer bobbin portion having a cylindrical crotch portion having a diameter of 50 mm and a length of 45.5 mm was wound to form a real roll portion. In this case, the shape of the mesa layer is gradually reduced as the width of the upper layer winding line is gradually reduced. The winding conditions were an initial winding width of 40 mm and a spacing width of 5 mm. After the solid portion is formed as described above, the main shaft and the sub-ground portion are formed by moving the bobbin edge to the removal position of the main and sub-grounding wires on the winding end side. The winding condition of the main ground portion at this time is twice the tension state of the solid portion, and the interval width is 25 μm when the wire diameter is 25 μm, and is wound 11 远离 away from the solid portion. The winding condition of the sub-ground portion is twice as large as the tension portion, and the line adjacent to the direction of the real coil portion between the main ground portion and the sub-ground portion is in close contact with each other in an average close state. The sequence was wound 6 inches. Immediately after that, two windings were wound between the main grounding wires having the sub-grounding wires in a state of tension twice the real winding portion, and then fixed to the flange ends by the fixing means by the adhesive tape. -13- 201212133 [Comparative Example] Except that the sub-ground portion is not provided, it is the same as the embodiment, and is formed as a main grounding wire wound 20 times in the direction away from the real-rolled portion, and fixed to the flange with adhesive tape. The end. The wire rods of the fixed examples and the comparative examples were cut with a small tweezers from the vicinity of the adhesive tape for each of the bonding wires of the respective wire diameters, and the average number of times of the wire rewinding was calculated, and then obtained as shown in Table 1. Show results. [Table 1] [Table 1] Comparison of the number of rewinding wires The wire diameter of the bonding wire Example Comparative Example 25 μηι 0.9 times 9.8 times From the above results, it is clear that the reeling is conspicuous in the winding form of the bonding wire for a semiconductor according to the present invention. Less than the previous winding form. Further, in any of the bobbins of the examples and the comparative examples, there was no appearance defect such as damage or scattering, and no line clogging occurred in the attachment of the joining device. Further, the number of rewinding when the wire diameter of the bonding wire is 20 μm and 30 μm is one or less. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial explanatory view showing a main part of a first winding form of the present invention. Fig. 2 is a partial explanatory view showing a main part of a second winding form of the present invention. Fig. 14 - 201212133 Fig. 3 is a view The solid portion of the bond wire is a prior art diagram of the cross-wound configuration. Fig. 4 is a view showing the prior art of the winding form of the body-use bonding wire, which is a half-guide of the long-length member for wire-drawing end of the winding end portion (17). Fig. 5 is a prior art explanatory view showing a winding form of a type in which a wound portion is provided on both sides of a real wound portion. Fig. 6 is an explanatory view showing the rebound phenomenon of the head winding portion before the bonding wire, (a) is an explanatory view of a normal front winding portion showing a non-contact state, and (b) is a state shown in (a) diagram. The illustration of the rebound phenomenon generated in the lower cutting line cutting mode is shown in Fig. 2(c) as an explanatory view showing the front winding portion formed as a close sequence. [Description of main components] 1 : Flange 2 : Spool 3 : 1st winding row 4 : 2nd winding row 5 : Tape 6 : Main grounding part 7 Sub-grounding part 11 : Starting line of the winding wire 1 2 : (bonding line > winding end 1 3 : sequential winding part 1 4 : cross winding form part -15- 201212133 15: (temporarily fixed) tape 1 6 : (spool) flange 1 7 : Winding end portion 18: (for joint wire drawing) Long object 19: Flange 20: Bobbin 2 1 : Real roll portion 22: Front winding portion 23: Tail end winding 24: End tape 2 5: Flange 26: Bonding wire-16-

Claims (1)

201212133 七、申請專利範圍： 1 . 一種半導體用接合線之捲線形態，係將線軸的圓 筒狀胴部的中央部份捲繞有做爲半導體用接合線使用之線 的實捲部份，和該實捲部份之線的捲繞結束端部捲繞在上 述線軸之圓筒狀胴部端部份的接地部份，及從該接地部份 拉出之線的終端固定在線軸之凸緣的半導體用接合線之捲 線形態，其特徵爲， 上述接地部份之線的捲線構造是全體爲由第1捲繞列 的線和第2捲繞列的線所構成的第1層捲繞構造，該第2捲 繞列的線爲離散之複數的線，其各個的線是兩側和在線軸 胴部4上彼此貼緊序列捲繞之第1捲繞列之複數的線成高貼 緊序列捲繞的構造。 2. —種半導體用接合線之捲線形態，係將線軸的圓 筒狀胴部的中央部份捲繞有做爲半導體用接合線使用之線 的實捲部份，和該實捲部份之線的捲繞結束端部捲繞在上 述線軸之圓筒狀胴部端部份的接地部份，及從該接地部份 拉出之線的終端固定在線軸之凸緣的半導體用接合線的捲 線形態，其特徵爲， 上述接地部份之線的捲線構造是全體爲由第1捲繞列 的線和第2捲繞列的線所構成的第1層捲繞構造，該第1捲 繞列的線是由在線軸胴部4上彼此貼緊序列朝外側捲繞的 主接地部份及朝內側捲繞的副接地部份所構成，該第2捲 繞列的線爲單數或離散之複數的線，其各個的線是兩側和 上述主接地部份之複數的線成高貼緊序列捲繞的構造。 -17- 201212133 3. 如申請專利範圍第1項或第2項所記載的半導體用 接合線之捲線形態，其中，接合線爲熱處理過的金屬細線 〇 4. 如申請專利範圍第1項或第2項所記載的半導體用 接合線之捲線形態，其中，捲繞在主接地部份之第J捲繞 列的線是捲繞成遠離實捲部份。 5. 如申請專利範圍第1項或第2項所記載的半導體用 接合線之捲線形態，其中，捲繞在主接地部份之第2捲繞 列的線是從在線軸胴部4上彼此貼緊序列捲繞之第1捲繞列 之複數的線上壓入捲繞著。 6. 如申請專利範圍第2項所記載的半導體用接合線之 捲線形態，其中，捲繞在副接地部份之第1捲繞列的線是 朝與捲繞在主接地部份之第1捲繞列的線相反的方向捲繞 著。 -18-201212133 VII. Patent application scope: 1. A winding form of a bonding wire for a semiconductor, in which a central portion of a cylindrical flange portion of a bobbin is wound with a real winding portion of a wire used as a bonding wire for a semiconductor, and The winding end portion of the wire of the actual wound portion is wound around the ground portion of the cylindrical end portion of the bobbin, and the end of the wire drawn from the ground portion is fixed to the flange of the bobbin In the form of a winding wire of a bonding wire for a semiconductor, the winding structure of the wire of the ground portion is a first layer winding structure including a wire of the first winding row and a wire of the second winding row. The line of the second winding row is a discrete plurality of lines, and each of the lines is a high line of the plurality of lines of the first winding row wound on the both sides of the bobbin portion 4 in close contact with each other. The structure of the sequence winding. 2. A winding form of a bonding wire for a semiconductor in which a central portion of a cylindrical flange portion of a bobbin is wound with a real winding portion of a wire used as a bonding wire for a semiconductor, and the real winding portion The winding end portion of the wire is wound around the ground portion of the cylindrical end portion of the bobbin, and the terminal of the wire drawn from the ground portion fixes the semiconductor bonding wire of the flange of the bobbin The winding form is characterized in that the winding structure of the line of the ground portion is a first layer winding structure including a line of the first winding row and a wire of the second winding row, and the first winding The line of the column is composed of a main ground portion wound toward the outer side of the wire shaft portion 4 and a sub-ground portion wound toward the inner side, and the line of the second winding row is singular or discrete. The plurality of lines, each of which is a structure in which a plurality of lines on both sides and the above-mentioned main ground portion are wound in a high-knit sequence. -17- 201212133 3. The winding form of the bonding wire for a semiconductor according to the first or the second aspect of the patent application, wherein the bonding wire is a heat-treated metal fine wire 〇 4. as claimed in claim 1 or In the winding form of the bonding wire for a semiconductor according to the item 2, the wire wound in the J winding row of the main ground portion is wound away from the real winding portion. 5. The winding form of the bonding wire for a semiconductor according to the first or second aspect of the invention, wherein the wire wound in the second winding row of the main ground portion is from the wire shaft portion 4 to each other. The plurality of lines of the first winding row wound in close contact with each other are pressed and wound. 6. The winding form of the bonding wire for a semiconductor according to the second aspect of the invention, wherein the wire wound in the first winding row of the sub-ground portion is wound toward the first portion of the main grounding portion. The line of the winding row is wound in the opposite direction. -18-
TW100100477A 2010-09-10 2011-01-06 Form for wire winding of bonding wire for semiconductor TW201212133A (en)

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