JP4889131B2 - Winding form of bonding wire for semiconductor - Google Patents

Winding form of bonding wire for semiconductor Download PDF

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JP4889131B2
JP4889131B2 JP2009161621A JP2009161621A JP4889131B2 JP 4889131 B2 JP4889131 B2 JP 4889131B2 JP 2009161621 A JP2009161621 A JP 2009161621A JP 2009161621 A JP2009161621 A JP 2009161621A JP 4889131 B2 JP4889131 B2 JP 4889131B2
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winding
wire
wound
main
spool
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JP2011018732A (en
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幸弘 彌永
里奈 本田
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Tanaka Denshi Kogyo KK
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

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Description

本発明は、半導体装置の組立て等に用いるスプールに巻かれたボンディングワイヤの巻線形態に関する。   The present invention relates to a winding form of a bonding wire wound around a spool used for assembling a semiconductor device or the like.

半導体装置の組立て等に用いるボンディングワイヤは、スプールの円筒状胴部に数千メートルの長さが数十ミリメートル程度にまで厚く本巻部分として巻き付けられている。この本巻部分の荷崩れを防ぐために、例えば図３に示されるように、往側巻線と復側巻線とを交叉させてスプールに巻込むクロス巻線形態（クロス巻線形態部分１４）とし、巻線始端部に巻線を交叉させない所要長さの整列巻部分（１３）を設け、その巻線始端（１１）（ワイヤ繰出し時には終端部になる）と巻線終端（１２）（ワイヤ繰出し時には始端部になる）とを（仮止めの）テープ（１５）により胴部外側又はフランジ（１６）に止着して巻き崩れを防止するようになっている（特許文献１参照）。   A bonding wire used for assembling a semiconductor device or the like is wound around a cylindrical body portion of a spool as a main winding portion having a length of several thousand meters up to about several tens of millimeters. In order to prevent this main part from collapsing, for example, as shown in FIG. 3, the cross winding form (cross winding form part 14) in which the forward winding and the return winding are crossed and wound on the spool. An aligned winding portion (13) having a required length that does not cross the winding is provided at the winding start end portion, and the winding start end (11) (which becomes a termination portion when the wire is fed) and winding termination end (12) (wire A tape (15) is temporarily attached to the outer side of the body or the flange (16) to prevent collapse (see Patent Document 1).

この卷回体は、使用時には、スプールをボンディング装置に装着した後、テープをはがして、巻線始端をアース部として引き出し、巻線終端は引き出してワイヤ繰りだし経路に導く。ワイヤの終端をスプールのフランジ等に止着した端末テープをはがさずに、端末テープ近傍のワイヤを直接切断し、切断したワイヤの先端側を再びフランジのアースに接続するというワイヤカット方式が行われることもある。
At the time of use, this winding body, after the spool is mounted on the bonding apparatus, peels off the tape, pulls out the winding start end as a grounding portion, and pulls out the winding end to guide the wire winding path. There is a wire-cut method in which the wire near the terminal tape is directly cut without peeling off the terminal tape with the end of the wire fixed to the flange of the spool, and the tip end of the cut wire is connected to the ground of the flange again. Sometimes done.

上記テープをはがす作業はピンセットを使った非常に細かい作業であるため、巻始め端部や巻線の終端部で上記テープをはがす際にピンセットから張力のかかったボンディングワイヤが外れてしまうことがある。一方、端末テープをはがさずにワイヤを切断してアース部を引き出そうとした場合でも、切断時に張力のかかったボンディングワイヤの端部が跳ねてピンセットからボンディングワイヤが外れてしまうことがある。巻き始め端部の場合、本巻部分のボンディングワイヤに影響が及ぶことはないが、巻線の終端部でボンディングワイヤが外れてしまうと、ボンディングワイヤがスプールの胴部に巻き付けたワイヤの中に潜り込んでしまったり、切断した勢いで胴部に巻き付けたワイヤが緩んだり絡んだりする、いわゆるスプリングバック現象がしばしば発生する。   Since the work of peeling the tape is a very fine work using tweezers, when the tape is peeled off at the winding start end or winding end, the tensioned bonding wire may come off from the tweezers. . On the other hand, even when the wire is cut without peeling off the terminal tape and an attempt is made to pull out the ground portion, the end of the bonding wire that is tensioned at the time of cutting may jump and the bonding wire may come off from the tweezers. In the case of the winding start end, there is no effect on the bonding wire of the main winding part, but if the bonding wire comes off at the end of the winding, the bonding wire is inserted into the wire wound around the body of the spool. There is often a so-called springback phenomenon in which the wire wraps around, or the wire wound around the body portion is loosened or entangled with the force of cutting.

巻終り端部をテープにより胴部外側又はフランジに止着することに替えて、例えば図４に示されるような、巻終り端部（１７）にワイヤ引出し用の長尺物（１８）を繋げた半導体用ボンディングワイヤの巻線形態も試みられている（特許文献２参照）。１９はフランジである。長尺物は、テープ同士では接離可能に固着するが、テープ以外には固着しない性質の非接着性テープであることが好ましいとされている。
しかし、この先行例では、まず粘着テープという別部品を使用するためにその購入、管理のための費用がかかる。また、ボンディング作業に不要な非接着性のテープがあると、誤ってワイヤと一緒に非接着性テープをボンディングしたりするおそれがあり、また気温の上下によってその非接着性テープの取り外しにかえって時間がかかることがあり、作業効率を悪くすることもあった。 Instead of fixing the end of the winding to the outside of the body or the flange with tape, for example, as shown in FIG. 4, a long object (18) for drawing the wire is connected to the end of winding (17). In addition, a winding form of a bonding wire for semiconductor has been tried (see Patent Document 2). Reference numeral 19 denotes a flange. It is considered that the long object is preferably a non-adhesive tape having such a property that it adheres to and separates from each other but does not adhere to other than the tape.
However, in this prior example, first, since a separate part called an adhesive tape is used, the cost for purchasing and managing it is high. Also, if there is a non-adhesive tape that is not necessary for the bonding operation, there is a risk that the non-adhesive tape will be accidentally bonded together with the wire. In some cases, work efficiency may be deteriorated.

本巻部分の両側に整列巻き部分を設けるタイプの卷回形態も試みられている（特許文献３参照）。図５に示すのがその例で、スプール２０の中央部分にクロス多層巻きされた俵積み状積層形態からなる本巻き部分２１、その両側にリード巻き部分２２とテール巻部分２３が整列巻きで巻き付けられ、それぞれの先端は端末テープ２４でフランジ２５に止着される。
整列巻き部分は、図６（イ）に示されるように、従来の広ピッチのリード巻きとすると、ワイヤカット方式によるときに、切断したボンディングワイヤのリード巻き部分２２が一気に緩んで崩れ、たるみ、絡み等が生じてしまう所謂スプリングバック現象がしばしば発生する（図６（イ）、（ロ））。しかし、ボンディングワイヤ同士を緊密に接触させると、切断されたボンディングワイヤ２６に加わった衝撃エネルギーを、隣接するボンディングワイヤに吸収・発散させることができるとされている（図６（ハ））。しかし、これとても、万全であるとは必ずしも言えない憾みがある。 A type of winding form in which aligned winding portions are provided on both sides of the main winding portion has also been attempted (see Patent Document 3). An example is shown in FIG. 5, a main winding portion 21 having a stacked stack form in which a multi-layered cross is wound around the center portion of the spool 20, and a lead winding portion 22 and a tail winding portion 23 are wound in an aligned manner on both sides thereof. Each end is fixed to the flange 25 with a terminal tape 24.
As shown in FIG. 6 (a), the aligned winding portion is a conventional wide pitch lead winding, and when the wire cutting method is used, the lead winding portion 22 of the cut bonding wire is loosened and collapsed at once. A so-called springback phenomenon in which entanglement or the like occurs often occurs (FIGS. 6A and 6B). However, when the bonding wires are brought into close contact with each other, the impact energy applied to the cut bonding wire 26 can be absorbed and diffused by the adjacent bonding wires (FIG. 6C). However, there is a grudge that is not necessarily perfect.

実開昭５７−０９３１４４号公報Japanese Utility Model Publication No. 57-093144 特開２０００−２７７５６０号公報JP 2000-277560 A 特開２００４−１１１４４９号公報JP 2004-111449 A

本発明は、上述したような従来事情に鑑みてなされたもので、その目的とするところは、巻線の終端部で誤ってボンディングワイヤがピンセットから外れても、スプリングバックが生じないボンディングワイヤの巻線形態を提供することにある。また本発明の他の目的は、ボンディングワイヤをねじったり、折り曲げたりしないでも、巻き付けたワイヤ自身によってワイヤが緩むことなく巻き終わり端部（リード部分）を固定することができるようにすることにある。   The present invention has been made in view of the above-described conventional circumstances. The object of the present invention is to provide a bonding wire that does not cause spring back even if the bonding wire is accidentally disconnected from the tweezers at the end of the winding. It is to provide a winding form. Another object of the present invention is to enable the winding end end (lead portion) to be fixed without the wire being loosened by the wound wire itself without twisting or bending the bonding wire. .

上述の目的を達成するために本発明の半導体用ボンディングワイヤの巻線形態の一つは、
（ａ）スプールの円筒状胴部の中央部分に半導体用ボンディングワイヤとして使用するワイヤを巻き付けた本巻部分と、その本巻部分のワイヤの巻き終わり端部を前記スプールの円筒状胴部の端部分に巻き付けたアース部分と、そのアース部分から繰出されたワイヤの終端をスプールのフランジで固定された半導体用ボンディングワイヤの巻線形態において、
上記アース部分のワイヤの巻線構造は全体として第１巻回列のワイヤと第２巻回列のワイヤとからなる第１層の巻回構造をなし、当該第２巻回列のワイヤは離散した複数のワイヤであって、その各々のワイヤは両側がスプール胴部上に互いに密着整列して巻かれた第１巻回列の複数のワイヤと高密着整列して巻かれている構造である。 In order to achieve the above object, one of the winding forms of the bonding wire for semiconductors of the present invention is as follows:
(A) A main winding portion in which a wire used as a semiconductor bonding wire is wound around a central portion of the cylindrical body portion of the spool, and a winding end portion of the wire of the main winding portion is an end of the cylindrical body portion of the spool. In a winding form of a bonding wire for a semiconductor in which a ground portion wound around a portion and a terminal end of a wire drawn out from the ground portion are fixed by a flange of a spool,
The winding structure of the wire of the ground portion as a whole has a first layer winding structure composed of a first winding wire and a second winding wire, and the second winding wire is discrete. A plurality of wires, each of which has a structure in which both sides are wound in close contact with the plurality of wires in the first winding row wound in close contact with each other on the spool body. .

また、本発明の巻線形態の他の一つは、
（ｂ）スプールの円筒状胴部の中央部分に半導体用ボンディングワイヤとして使用するワイヤを巻き付けた本巻部分と、その本巻部分のワイヤの巻き終わり端部を前記スプールの円筒状胴部の端部分に巻き付けたアース部分と、そのアース部分から繰出されたワイヤの終端をスプールのフランジで固定された半導体用ボンディングワイヤの巻線形態において、
上記アース部分のワイヤの巻線構造は全体として第１巻回列のワイヤと第２巻回列のワイヤとからなる第１層の巻回構造をなし、当該第１巻回列のワイヤはスプール胴部４上に互いに密着整列して外側に向かって巻かれた主アース部分および内側に向かって巻かれた副アース部分とからなり、当該第２巻回列のワイヤは単数または離散した複数のワイヤであって、その各々のワイヤは両側が前記主アース部分の複数のワイヤと高密着整列して巻かれている構造である。 Another one of the winding forms of the present invention is:
(B) A main winding portion in which a wire used as a semiconductor bonding wire is wound around a central portion of the cylindrical body portion of the spool, and a winding end portion of the wire of the main winding portion is an end of the cylindrical body portion of the spool. In a winding form of a bonding wire for a semiconductor in which a ground portion wound around a portion and a terminal end of a wire drawn out from the ground portion are fixed by a flange of a spool,
The winding structure of the wire of the ground portion as a whole has a first layer winding structure composed of a first winding row wire and a second winding row wire, and the first winding row wire is a spool. It comprises a main ground portion wound close to each other on the body 4 and wound outward, and a sub-ground portion wound inward, and the wire of the second winding row is a single or a plurality of discrete wires. Each of the wires has a structure in which both sides are wound in close contact with the plurality of wires of the main ground portion.

また、本発明の半導体用ボンディングワイヤの好ましい巻線形態は、以下のとおりである。
（ｃ）ボンディングワイヤが熱処理された金属細線である。
（ｄ）主アース部分に巻かれた第１巻回列のワイヤが本巻部分から遠ざかるように巻かれている。
（ｅ）主アース部分に巻かれた第２巻回列のワイヤがスプール胴部４上に互いに密着整列して巻かれた第１巻回列の複数のワイヤ上から押し込まれ、高密着整列して巻かれている。
（ｆ）副アース部分に巻かれた第１巻回列のワイヤが主アース部分に巻かれた第１巻回列のワイヤと逆方向に巻かれている。 Moreover, the preferable coil | winding form of the bonding wire for semiconductors of this invention is as follows.
(C) The bonding wire is a heat-treated fine metal wire.
(D) The wire of the 1st winding row wound around the main ground part is wound so that it may keep away from a main volume part.
(E) The second winding wire wound around the main ground portion is pushed in from the plurality of wires of the first winding wire wound in close contact with each other on the spool body 4 and aligned in high contact. It is rolled up.
(F) A wire in the first winding row wound around the sub-ground portion is wound in the opposite direction to the wire in the first winding row wound around the main ground portion.

本発明によれば、スプールの円筒状胴部に巻き付けた本巻部分のボンディングワイヤは、その巻き終わり端部（ワイヤ繰出し時には始端部になる）にアース部分として第１巻回列のワイヤと第２巻回列のワイヤとからなる第１層の巻回構造をなし、当該第２巻回列のワイヤは離散した複数のワイヤであって、その各々のワイヤは両側がスプール胴部４上に互いに密着整列して巻かれた第１巻回列の複数のワイヤと高密着整列して巻かれていることから、スプリングバックひいては巻き崩れが確実に防止される。さらに、アース部分を主アース部分に続いて副アース部分が設ける２部分構成とすれば、スプリングバックひいては巻き崩れがより確実に防止される。   According to the present invention, the bonding wire of the main winding portion wound around the cylindrical body portion of the spool is connected to the first winding row wire and the first winding wire as the ground portion at the winding end end portion (which becomes the start end portion when the wire is fed). A first layer winding structure comprising two winding wires is formed, and the second winding wire is a plurality of discrete wires, each of which is on both sides of the spool body 4 Since the plurality of wires in the first winding row wound in close contact with each other are wound in close contact with each other, the springback and thus the collapse are reliably prevented. Furthermore, if the ground portion is a two-part configuration in which a sub-ground portion is provided after the main ground portion, the springback and therefore the collapse of the spring are more reliably prevented.

その他の効果としては、
イ．スプリングバックした状態（ワイヤがスプール上で緩んだ状態）で、そのままボンディングするとワイヤ絡まりが発生して、ワイヤ断線を引き起こす。しかし、高密着整列して巻かれていると、線接触している摩擦抵抗が大きいので、主アース部分のワイヤ緩みが無くなり、このような現象は起きない。
ロ．本巻きの巻長さや本巻巻条件に関係なく、本発明の巻回構造体が適用可能である。
ハ．従来の巻回構造体よりもアース部のテンションが強いので、輸送時のアース部の緩みが大幅に減少する。
ニ．通常緩みが発生した場合には、緩んだワイヤを一本一本手でほどいてから使用するが、高密着整列して巻かれている構造により、この作業が無くなる。 Other effects include
I. If bonding is performed as it is in the spring-backed state (the wire is loose on the spool), wire entanglement occurs, causing wire breakage. However, when wound in close contact with each other, since the frictional resistance in line contact is large, loosening of the wire in the main ground portion is eliminated, and this phenomenon does not occur.
B. The winding structure of the present invention is applicable regardless of the winding length of the main winding and the conditions of the main winding.
C. Since the tension of the ground part is stronger than that of the conventional winding structure, loosening of the ground part during transportation is greatly reduced.
D. Normally, when loosening occurs, the loosened wires are unwound one by one before use, but this work is eliminated due to the structure that is wound with high close alignment.

本発明の第一の巻線形態の要部を示す部分説明図である。It is a partial explanatory view showing the principal part of the first winding form of the present invention. 本発明の第二の巻線形態の要部を示す部分説明図である。It is a partial explanatory view showing the principal part of the second winding form of the present invention. ボンディングワイヤの本巻部分をクロス巻線形態とした従来技術を示す説明図である。It is explanatory drawing which shows the prior art which made the main volume part of the bonding wire the cross winding form. 巻終り端部（１７）にワイヤ引出し用の長尺物を繋げた半導体用ボンディングワイヤの巻線形態とした従来技術を示す説明図である。It is explanatory drawing which shows the prior art made into the winding form of the bonding wire for semiconductors which connected the elongate thing for wire drawing to the winding end part (17). 本巻部分の両側に整列巻き部分を設けるタイプの卷回形態とした従来技術を示す説明図である。It is explanatory drawing which shows the prior art made into the winding form of the type which provides an alignment winding part in the both sides of a main volume part. ボンディングワイヤのリード巻き部分におけるスプリングバック現象についての説明図であって、（イ）は密着態様ではない通常のリード巻き部分を示す説明図、（ロ）は（イ）においてワイヤカット方式に際して生ずるスプリングバックを示す説明図、（ハ）は密着整列されたリード巻き部分を示す説明図である。It is explanatory drawing about the springback phenomenon in the lead winding part of a bonding wire, Comprising: (a) is explanatory drawing which shows the normal lead winding part which is not an adhesion | attachment aspect, (b) is a spring which arises at the time of a wire cut system in (a) FIG. 4C is an explanatory view showing a back, and FIG. 3C is an explanatory view showing a lead winding portion that is closely aligned.

本発明の実施の形態を図面を参照して詳細に説明する。
本発明の第一の巻線形態においては、スプール胴部上に互いに密着整列して巻かれた第１巻回列の複数のワイヤの間に、離散した複数のワイヤである第２巻回列のワイヤが高密着整列して巻かれている構造である。本巻部分から本巻ワイヤが引っ張られる影響は、複数回密着整列して巻かれた第１巻回列のワイヤによって無視できるようになる。また、第２巻回列のワイヤは、スプール胴部上に互いに密着整列して巻かれた第１巻回列の複数のワイヤに両側から挟まれているので、高密着整列して巻かれている構造となり、スプールのフランジに固定されたボンディングワイヤがピンセットから外れたとしてもほどけてしまうことはないが、安全のため第２巻回列のワイヤは複数本巻回させることがより好ましい。 Embodiments of the present invention will be described in detail with reference to the drawings.
In the first winding configuration of the present invention, the second winding row which is a plurality of discrete wires between the plurality of wires of the first winding row wound in close contact with each other on the spool body. This is a structure in which the wires are wound in close contact with each other. The influence of pulling the main winding wire from the main winding portion can be ignored by the wire of the first winding row wound in close contact with and aligned multiple times. In addition, since the second winding row wire is sandwiched from both sides by the plurality of wires of the first winding row wound in close contact with each other on the spool body portion, the second winding row is wound with high close contact alignment. Even if the bonding wire fixed to the flange of the spool is detached from the tweezers, it will not be unwound, but it is more preferable to wind a plurality of wires in the second winding row for safety.

図１において、スプールのフランジ１側の、本巻部分（図示略）との間のスプールの胴部２に、第１卷回列３を互いに密着整列して外側に向かって適当回数（４回以上が必要であり、好ましくは１０〜１５回がよい）卷回し、その終端から第１卷回列の巻始め側に戻って、第１卷回列の中間卷回とその一つ前の卷回との間に押し入れながら第２卷回列４を開始し、単数若しくは離散した複数の卷回を行い、末端をフランジ１（スプールの胴部２でも可能である）にテープ５で固着する。テープによる固着に替えて、従来技術で用いられているワイヤ引出し用長尺物（非接着性テープ）を利用するものとすることができる。
第１卷回列は、隣り合うワイヤが相互に隣接するように密着整列とし、第２卷回列は、第１卷回列を卷回するときの張力と同等またはそれよりも大きな張力を掛けて卷回すると、第１卷回列の隣接する卷回間に押し入れられ、高密着整列状態となる。この状態では、スプリングバックによってボンディングワイヤがほどける等のトラブルは確実に防止されるようになる。第２卷回列の卷回するときの張力は、限定的ではないが、第１卷回列を卷回するときの張力に比して、概ね同等以上を目処とすることが好ましい。
なお、便宜上、第１卷回列を太線（後述する図１及び図２の符号３）で、第２卷回列のワイヤを白抜き線（後述する図１及び図２の符号４）で表した。
In FIG. 1, the first winding row 3 is closely aligned with the spool body 2 on the flange 1 side of the spool between the main winding portion (not shown in the drawing) and the outer side is arranged a suitable number of times (four times) toward the outside. The above is necessary, preferably 10 to 15 times are preferable.) Winding and returning from the end to the winding start side of the first winding row, the intermediate winding of the first winding row and the previous winding The second winding row 4 is started while being pushed in between, and a single or a plurality of discrete windings are performed, and the end is fixed to the flange 1 (which can also be the spool body 2) with the tape 5. Instead of fixing with a tape, a long wire drawing (non-adhesive tape) used in the prior art can be used.
The first winding row is closely aligned so that adjacent wires are adjacent to each other, and the second winding row applies a tension equal to or greater than the tension when winding the first winding row. When it is wound, it is pushed in between the adjacent windings of the first winding row, and is in a highly closely aligned state. In this state, troubles such as unwinding of the bonding wire due to the springback are surely prevented. The tension when winding the second winding row is not limited, but it is preferable that the tension is approximately equal to or greater than the tension when winding the first winding row.
For the sake of convenience, the first winding row is represented by a bold line (reference numeral 3 in FIGS. 1 and 2 described later) , and the second winding string is represented by a white line (reference numeral 4 in FIGS. 1 and 2 described later). did.

また、第二の巻線形態においては、アース部分を主アース部分に続いて副アース部分が設ける２部分構成とする。主アース部分に続いて副アース部分が区画して設けられているので、本巻部分から本巻ワイヤが引張られる影響は、副アース部分にまで及ばない。そして、副アース部分から副アースワイヤが引張られる影響は、主アースワイヤと副アースワイヤとの接触面積の増大による摩擦抵抗によって端末テープにまでは及ばない。よって、端末テープをはがしてワイヤをピンセットで挟まなくても、副アースワイヤ自身がほどかれる力よりも本巻ワイヤと副アースワイヤとの摩擦抵抗を大きくすることができる。この摩擦抵抗は、主アース部分の巻回回数が多くなればなるほど、大きくすることができる。
In the second winding configuration, the ground portion is a two-part configuration in which a sub-ground portion is provided after the main ground portion. Since the sub-ground portion Following main ground portion is provided with compartments, effects of the winding wire is pulled from the winding portion does not extend up to the sub-ground portions. The influence of the sub-ground wire being pulled from the sub-ground portion does not reach the terminal tape due to the frictional resistance due to the increase in the contact area between the main ground wire and the sub-ground wire. Therefore, even if the terminal tape is not peeled off and the wire is not pinched by the tweezers, the frictional resistance between the main winding wire and the sub-ground wire can be made larger than the force that the sub-ground wire itself unwinds. This frictional resistance can be increased as the number of windings of the main ground portion increases.

図２において、スプールのフランジ１側のスプールの胴部２に、第１卷回列として、互いに密着整列して外側に向かって巻かれた主アース部分６および内側に向かって巻かれた副アース部分７とを卷回する。そして、副アース部７の終端を主アース部６に戻して、主アース部６のワイヤが適宜に卷回された間（中間卷回とその一つ前の卷回との間）に押し入れながら第２卷回列４を開始し、単数若しくは離散した複数の卷回を行い、末端をフランジ１（スプールの胴部２でも可）にテープ５で固着する。第２卷回列４を卷回するときの張力が第１卷回列を卷回するときの張力と同等またはそれよりも大きくすることは、第一の卷回形態と同様である。
これによって、スプリングバックによってボンディングワイヤがほどける等のトラブルはより確実に防止されるようになる。
なお、両卷回形態において、リード部分（アース部）を本巻部分の両側に設けることができることは、いうまでもない。
In FIG. 2, a main ground portion 6 wound toward the outside in close contact with each other and a secondary ground wound toward the inside as a first winding row on the spool body 2 on the flange 1 side of the spool. Roll with part 7. Then, the terminal of the sub-grounding portion 7 is returned to the main grounding portion 6 and pushed while the wire of the main grounding portion 6 is appropriately wound (between the intermediate winding and the previous winding). The second winding row 4 is started, and a single or a plurality of discrete windings are performed, and the end is fixed to the flange 1 (or the trunk portion 2 of the spool) with the tape 5. The tension when winding the second winding row 4 is equal to or larger than the tension when winding the first winding row is the same as in the first winding form.
As a result, troubles such as unwinding of the bonding wire due to the springback can be prevented more reliably.
Needless to say, in both winding forms, lead portions (ground portions) can be provided on both sides of the main winding portion.

ボンディングワイヤの材質は、Ａｕ，Ａｇ，Ａｌ，Ｃｕあるいはこれらの合金等からなるので、これらの材質に応じて、適宜、巻回回数やワイヤピッチは調整することができる。なお、第２巻回列のワイヤに上記の摩擦抵抗があっても、第２巻回列のワイヤの全周にわたって水平方向に圧縮力として働くので、ワイヤの外観に傷や凹みによる光沢異常が発生することがない。   Since the material of the bonding wire is made of Au, Ag, Al, Cu, or an alloy thereof, the number of windings and the wire pitch can be appropriately adjusted according to these materials. Even if the second winding wire has the above frictional resistance, it acts as a compressive force in the horizontal direction over the entire circumference of the second winding wire. It does not occur.

まず、線径が２５μｍ、純度９９．９９質量％以上のＡｕの半導体素子用ボンディングワイヤ（伸び率が４％になるように熱処理されたもの）をそれぞれ１０，０００ｍ、クロス多層巻きによって、直径５０ｍｍ、長さ４５．５ｍｍの円筒状の胴部を有するスプールの胴部に４,０００層巻き取って、本巻部分を形成した。
その際、上層となるにつれて巻き線幅を小さくしていく俵積み状の積層形態とした。巻き取り条件は、初期巻き幅４０ｍｍ、ピッチ幅５ｍｍとした。
上記のようにして本巻部分を形成した後、スプールを、巻き終り側における主・副アース線の取り出し位置へ移動させながら、主・副アース部分を形成した。このときの主アース部分の巻き取り条件は、テンションが本巻部分の２倍、ピッチ幅は線径が２５μｍの場合に、２５μｍで、本巻部分から遠ざかる方向へ１１巻き巻回した。副アース部分の巻き取り条件は、テンションが本巻部分の２倍で、主アース部分と本巻部分との間で本巻部分の方向へ隣接ワイヤが平均的に緊密に接触する状態、で整列に６巻き巻回した。ついで、本巻部分の２倍のテンションで副アースワイヤが巻回された主アースワイヤの間に２巻き巻回した後、接着テープを用いた従来の止着手段によりフランジの端に止着した。 First, an Au semiconductor element bonding wire (having been heat-treated so as to have an elongation of 4%) with a wire diameter of 25 μm and a purity of 99.99% by mass or more is each 10,000 m, and a cross multilayer winding is 50 mm in diameter. Then, 4,000 layers were wound around the body of a spool having a cylindrical body having a length of 45.5 mm to form a main part.
In that case, it was set as the piled-up laminated form which makes a winding width | variety small as it becomes an upper layer. The winding conditions were an initial winding width of 40 mm and a pitch width of 5 mm.
After the main winding portion was formed as described above, the main / sub-ground portion was formed while moving the spool to the main / sub-ground wire take-out position on the winding end side. At this time, the winding condition of the main ground part was 25 μm when the tension was twice that of the main part and the pitch width was 25 μm, and the winding was 11 turns away from the main part. The winding condition of the sub-ground part is aligned so that the tension is twice that of the main part and the adjacent wires are in close contact with each other in the direction of the main part between the main ground part and the main part. 6 turns. Then, after winding twice between the main ground wires wound with the secondary ground wire with a tension twice that of the main winding portion, it was fixed to the end of the flange by conventional fixing means using an adhesive tape. .

比較例Comparative example

副アース部分を設けなかった以外は、実施例と同様にして、主アースワイヤを本巻部分から遠ざかる方向へ２０巻き巻回し、接着テープでフランジの端に止着した。
この止着した実施例および比較例のスプールを、各線径のボンディングワイヤにつきそれぞれ１０個ずつを接着テープの近傍からピンセットを用いて切断し、ワイヤが巻き戻された回数の平均値を求めたところ、表１に示すような結果を得た。 The main ground wire was wound 20 turns in the direction away from the main winding portion, and was fastened to the end of the flange with adhesive tape, except that the sub-ground portion was not provided.
The fixed spools of Example and Comparative Example were cut with 10 tweezers for each wire diameter bonding wire from the vicinity of the adhesive tape using tweezers, and the average number of times the wire was rewound was determined. The results shown in Table 1 were obtained.

Figure 0004889131
Figure 0004889131

上記の結果から明らかなとおり、本発明の半導体用ボンディングワイヤの巻線形態によれば、スプリングバックが従来のものと比べて著しく少なくなっていることがわかる。なお、実施例および比較例のスプールからのいずれのワイヤも、傷や乱反射等の外観不良は見られず、ボンディング装置への装着においてワイヤのつまりはなかった。また、ボンディングワイヤの線径が２０μｍと３０μｍのものも巻き戻された回数は１回以下であった。   As is apparent from the above results, according to the winding form of the bonding wire for semiconductor of the present invention, it can be seen that the springback is remarkably reduced as compared with the conventional one. In addition, none of the wires from the spools of the example and the comparative example showed appearance defects such as scratches and irregular reflection, and there was no clogging of the wire when mounted on the bonding apparatus. Moreover, the number of times that the wire diameters of the bonding wires were 20 μm and 30 μm were rewound was 1 or less.

１：フランジ
２：スプールの胴部
３：第１卷回列
４：第２卷回列
５：テープ
６：主アース部分
７：副アース部分

１１：（ワイヤの）巻線始端
１２：（ワイヤの）巻線終端
１３：整列巻部分
１４：クロス巻線形態部分
１５：テープ
１６：（スプールの）フランジ

１７：巻終り端部
１８：（ワイヤ引出し用の）長尺物
１９：フランジ

２０：スプール
２１：本巻き部分
２２：リード巻き部分
２３：テール巻部分
２４：端末テープ
２５：フランジ
２６：ボンディングワイヤ
1: Flange 2: Spool body 3: First winding row 4: Second winding row 5: Tape 6: Main ground portion 7: Sub ground portion

11: Winding start end (of wire) 12: End of winding (of wire) 13: Aligned winding part 14: Cross winding form part 15: Tape 16: Flange (of spool)

17: End of winding 18: Long object (for wire drawing) 19: Flange

20: Spool 21: Main winding part 22: Lead winding part 23: Tail winding part 24: Terminal tape 25: Flange 26: Bonding wire

Claims (6)

スプールの円筒状胴部の中央部分に半導体用ボンディングワイヤとして使用するワイヤを巻き付けた本巻部分と、その本巻部分のワイヤの巻き終わり端部を前記スプールの円筒状胴部の端部分に巻き付けたアース部分と、そのアース部分から繰出されたワイヤの終端をスプールのフランジで固定された半導体用ボンディングワイヤの巻線形態において、
上記アース部分のワイヤの巻線構造は全体として第１巻回列のワイヤと第２巻回列のワイヤとからなる第１層の巻回構造をなし、当該第２巻回列のワイヤは離散した複数のワイヤであって、その各々のワイヤは両側がスプール胴部上に互いに密着整列して巻かれた第１巻回列の複数のワイヤと高密着整列して巻かれていることを特徴とする半導体用ボンディングワイヤの巻線形態。 A main winding portion in which a wire used as a bonding wire for a semiconductor is wound around the central portion of the cylindrical body portion of the spool, and a winding end portion of the wire of the main winding portion is wound around the end portion of the cylindrical body portion of the spool. In the winding form of the bonding wire for a semiconductor in which the end portion of the grounded portion and the wire drawn out from the grounded portion are fixed by the flange of the spool,
The winding structure of the wire of the ground portion as a whole has a first layer winding structure composed of a first winding wire and a second winding wire, and the second winding wire is discrete. A plurality of wires, each of which is wound in close contact with the plurality of wires of the first winding row wound on both sides of the spool body in close contact with each other. The winding form of the bonding wire for semiconductors. スプールの円筒状胴部の中央部分に半導体用ボンディングワイヤとして使用するワイヤを巻き付けた本巻部分と、その本巻部分のワイヤの巻き終わり端部を前記スプールの円筒状胴部の端部分に巻き付けたアース部分と、そのアース部分から繰出されたワイヤの終端をスプールのフランジで固定された半導体用ボンディングワイヤの巻線形態において、
上記アース部分のワイヤの巻線構造は全体として第１巻回列のワイヤと第２巻回列のワイヤとからなる第１層の巻回構造をなし、当該第１巻回列のワイヤはスプール胴部上に互いに密着整列して外側に向かって巻かれた主アース部分および内側に向かって巻かれた副アース部分とからなり、当該第２巻回列のワイヤは単数または離散した複数のワイヤであって、その各々のワイヤは両側が前記主アース部分の複数のワイヤと高密着整列して巻かれていることを特徴とする半導体用ボンディングワイヤの巻線形態。 A main winding portion in which a wire used as a bonding wire for a semiconductor is wound around the central portion of the cylindrical body portion of the spool, and a winding end portion of the wire of the main winding portion is wound around the end portion of the cylindrical body portion of the spool. In the winding form of the bonding wire for a semiconductor in which the end portion of the grounded portion and the wire drawn out from the grounded portion are fixed by the flange of the spool,
The winding structure of the wire of the ground portion as a whole has a first layer winding structure composed of a first winding row wire and a second winding row wire, and the first winding row wire is a spool. A main ground portion wound outwardly in close contact with each other on the body portion, and a sub-ground portion wound inwardly; the wire of the second winding row is a single or a plurality of discrete wires A winding form of a bonding wire for a semiconductor, characterized in that each of the wires is wound on both sides with a plurality of wires in the main ground portion in close contact with each other. ボンディングワイヤが熱処理された金属細線であることを特徴とする請求項１または請求項２に記載の半導体用ボンディングワイヤの巻線形態。   The winding form of the bonding wire for a semiconductor according to claim 1 or 2, wherein the bonding wire is a heat-treated fine metal wire. 主アース部分に巻かれた第１巻回列のワイヤが本巻部分から遠ざかるように巻かれていることを特徴とする請求項１または請求項２に記載の半導体用ボンディングワイヤの巻線形態。   The winding form of the bonding wire for a semiconductor according to claim 1 or 2, wherein the wire of the first winding row wound around the main ground portion is wound away from the main winding portion. 主アース部分に巻かれた第２巻回列のワイヤがスプール胴部上に互いに密着整列して巻かれた第１巻回列の複数のワイヤ上から押し込まれて巻かれていることを特徴とする請求項１または請求項２に記載の半導体用ボンディングワイヤの巻線形態。   The second winding wire wound around the main ground portion is wound by being pushed in from the plurality of wires of the first winding wire wound in close contact with each other on the spool body. The winding form of the bonding wire for semiconductor according to claim 1 or 2. 副アース部分に巻かれた第1巻回列のワイヤが主アース部分に巻かれた第1巻回列のワイヤと逆方向に巻かれていることを特徴とする請求項２に記載の半導体用ボンディングワイヤの巻線形態。
3. The semiconductor device according to claim 2, wherein the first winding wire wound around the sub-ground portion is wound in a direction opposite to the first winding wire wound around the main ground portion. 4. Bonding wire winding form.
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JP6066438B1 (en) * 2015-11-10 2017-01-25 田中電子工業株式会社 Winding structure of bonding wires for semiconductor devices

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* Cited by examiner, † Cited by third party
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JPS5952629A (en) * 1982-09-20 1984-03-27 Tachibana Yoki Kk Injection molding method of plastic container
JPH11228025A (en) * 1997-12-12 1999-08-24 Tanaka Electronics Ind Co Ltd Spool winding form of extra fine wire and spool case
JP2000036513A (en) * 1998-07-21 2000-02-02 Tatsuta Electric Wire & Cable Co Ltd Spool wound with bonding wire for semiconductor and method for supplying spool and bonding wire for semiconductor
JP2004111449A (en) * 2002-09-13 2004-04-08 Tanaka Electronics Ind Co Ltd Wound structure of ultrafine gold bonding wire and method for winding the same

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