JPS6116690Y2 - - Google Patents
Info
- Publication number
- JPS6116690Y2 JPS6116690Y2 JP1980170822U JP17082280U JPS6116690Y2 JP S6116690 Y2 JPS6116690 Y2 JP S6116690Y2 JP 1980170822 U JP1980170822 U JP 1980170822U JP 17082280 U JP17082280 U JP 17082280U JP S6116690 Y2 JPS6116690 Y2 JP S6116690Y2
- Authority
- JP
- Japan
- Prior art keywords
- winding
- spool
- gold wire
- cross
- required length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004804 winding Methods 0.000 claims description 60
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
【考案の詳細な説明】
本考案は半導体素子のボンデイング用金線、す
なわち半導体素子のチツプ電極と外部リード部と
を接続するために使用される金線のスプール巻線
形態に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a gold wire for bonding semiconductor devices, that is, a spool winding form of gold wire used to connect chip electrodes and external leads of semiconductor devices.
従来、金線のスプール巻線形態には、金線を往
側巻線と復側巻線とを交叉させてスプールに巻込
むクロス巻線形態及び巻線を交叉させない整列巻
線形態の両者が採用されており、その前者の巻線
形態が巻線どうしの適度な係合状態を得てくずれ
落ちを防止でき使用性に優れるものである。 Conventionally, gold wire spool winding configurations include both a cross winding configuration in which the gold wire is wound around the spool by crossing the forward and backward windings, and an aligned winding configuration in which the gold wires are not crossed. The former type of winding allows the windings to be properly engaged with each other and prevents them from falling off, providing excellent usability.
しかしながら、上記従来のクロス巻線形態にお
いては巻線部全幅に渉り巻線が交叉状に巻込まれ
ているために、巻線始端を必要長さ分、ほぐそう
としてもそれが不可能であつた。 However, in the above-mentioned conventional cross winding configuration, since the windings are wound in a crosswise manner across the entire width of the winding section, it is impossible to loosen the starting end of the winding to the required length. Ta.
しかるに、スプール金線はその繰出し金線の断
線を検出するために、巻線始端をアースに接続す
る使用態様をとる場合があるが、上記従来のクロ
ス巻線形態では巻線始端部の巻きほぐしができな
いため、アースに接続する作業ができない不具合
があつた。 However, in some cases, the spool wire is used in such a way that the starting end of the winding is connected to ground in order to detect a break in the wire being fed out, but in the conventional cross winding configuration described above, the starting end of the winding is unwound. There was a problem in which it was not possible to connect to the ground because it was not possible to connect to the ground.
本考案は斯る従来不具合を解決せんとして、巻
線始端部を必要長適時ほぐして繰出し可能とし使
用性に優れたスプール巻線を提供するものであ
り、クロス巻線形態において、巻線始端部に所要
長さの整列巻部分を設けたことを特徴とする。 In order to solve these conventional problems, the present invention provides a spool winding which is excellent in usability by allowing the starting end of the winding to be unraveled and fed out to the required length at the appropriate time. It is characterized by having an aligned winding portion of a required length.
本考案の実施例を図面により説明すれば、第１
図はスプールＡにボンデイング用金線Ｂを巻込ん
だスプール巻線を示し、a1，a2はスプールＡのフ
ランジ、b1は整列巻部分、b2はクロス巻線部分、
１は巻線始端、２は巻線終端である。 The first embodiment of the present invention will be described with reference to the drawings.
The figure shows a spool winding in which bonding gold wire B is wound around spool A, a 1 and a 2 are flanges of spool A, b 1 is an aligned winding part, b 2 is a cross winding part,
1 is the winding start end, and 2 is the winding end.
整列巻部分b1は金線Ｂを交叉させない状態で一
層又は多層に巻込んだもので、この部分b1の巻線
の必要長さは一般的に10〜25cmであるが、余分を
見込んで100cmの長さを巻込んでおく。 The aligned winding part b 1 is made by winding the gold wire B in one layer or in multiple layers without crossing each other, and the required length of the winding wire in this part b 1 is generally 10 to 25 cm, but the extra length is taken into account. Roll up a length of 100cm.
クロス巻線部分b2は金線Ｂを所要長さだけ整列
巻きした後に連続して、往側巻線b2′と復側巻線
b2″とを交叉させるように巻込んだものである。 The cross winding part b 2 is made by winding the gold wire B to the required length and then continuously winding the outgoing winding b 2 ' and the incoming winding.
b 2 ″ are wrapped so as to intersect with each other.
クロス巻線部分b2は多層段積み形態とすること
が金線長さを増大させ得て好ましく、その段積み
形態は巻線全幅を等しくする状態あるいは上層と
なるにつれて巻線幅を小さくしていく俵積みの何
れであつてもよいが、後者の方が巻線のくずれ落
ちをよりよく防止でき、図面はそれを示す。 It is preferable that the cross winding portion b 2 has a multi-layered stacked form because it can increase the length of the gold wire, and the stacked form is such that the entire winding width is made equal or the winding width is made smaller as it approaches the upper layer. Although it may be stacked in any number of bales, the latter method better prevents the windings from collapsing and falling off, as shown in the drawings.
巻線始端１及び巻線終端２はスプールＡのフラ
ンジa1，a2に夫々テープ３，４によつて仮止めし
ておく。 The winding start end 1 and the winding end 2 are temporarily fixed to the flanges a 1 and a 2 of the spool A with tapes 3 and 4, respectively.
而して、上記金線Ｂを巻込んだスプールＡはボ
ンデイングマシンの支持台５上に載承支持され、
金線Ｂはその巻線終端２をガラス管６、ガイド部
材７，８，９，１０，１１及びワイヤクランプ１
２，１３を通してキヤビラリー１４に繰出され、
水素トーチ１５によつて加熱されながら半導体リ
ードフレームのペレツト１６とリードピン（図示
せず）とに渉り接続される（第２図）。 Thus, the spool A wound with the gold wire B is mounted and supported on the support stand 5 of the bonding machine,
The winding end 2 of the gold wire B is connected to a glass tube 6, guide members 7, 8, 9, 10, 11 and a wire clamp 1.
2, 13 to the cavity 14,
While being heated by a hydrogen torch 15, the pellet 16 of the semiconductor lead frame is connected to a lead pin (not shown) (FIG. 2).
一方、金線Ｂの巻線始端１はフランジ３より剥
がして整列巻部分b1よりその必要長さをほぐして
支持台５に設けた通電部１７にアースとして接続
する。 On the other hand, the winding start end 1 of the gold wire B is peeled off from the flange 3, loosened to a required length from the aligned winding portion b1 , and connected to the current carrying part 17 provided on the support base 5 as a ground.
又、上記ワイヤクランプ１３にも通電部１８を
設け、この通電部１８と前記通電部１７との間に
作業中常時に弱電流を印加させておくことによつ
てスプールＡより繰出された金線Ｂの断線を検出
するようにする。 The wire clamp 13 is also provided with a current-carrying part 18, and by constantly applying a weak current between the current-carrying part 18 and the current-carrying part 17 during work, the gold wire drawn out from the spool A is A break in B is detected.
本考案は叙上の如く金線のクロス巻線形態にお
いて、巻線始端部に巻線を交叉させない所要長さ
の整列巻部分を設けたので、金線をスプールに巻
込み終了とした後に巻線始端より必要長さを巻き
ほぐすことができる。 As described above, in the cross-winding configuration of gold wire, the present invention provides an aligned winding portion of a required length at the starting end of the winding so that the windings do not intersect. You can unwind the required length from the starting end of the wire.
従つて、スプール巻線をボンデイングマシンに
設置する使用状態で巻線始端を通電部にアースと
して接続し断線検出をかけることができるととも
にクロス巻線形態の利点はそのまま維持し得る。 Therefore, when the spool winding is installed in a bonding machine, the starting end of the winding can be connected to the current-carrying part as a ground, and disconnection can be detected, and the advantages of the cross-winding configuration can be maintained.
依つて所期の目的を達成できる。 Thus, the intended purpose can be achieved.
第１図は本考案巻線の一部切欠せる側面図、第
２図は使用状態を示す斜視図である。
図中、Ａはスプール、Ｂは金線、b1は整列巻部
分、b2はクロス巻線部分、b2′は往側巻線、b2″は
復側巻線、１は巻線始端、２は巻線終端である。
FIG. 1 is a partially cutaway side view of the winding of the present invention, and FIG. 2 is a perspective view showing the state of use. In the figure, A is the spool, B is the gold wire, b 1 is the aligned winding part, b 2 is the cross winding part, b 2 ′ is the forward winding, b 2 ″ is the return winding, and 1 is the winding start end. , 2 is the winding end.
Claims (1)
交叉させてスプールに巻込むクロス巻線形態にお
いて、巻線始端部に巻線を交叉させない所要長さ
の整列巻部分を設けた半導体素子のボンデイング
用金線のスプール巻線。 In a cross-winding configuration in which bonding gold wire is wound onto a spool by crossing the outgoing winding and the incoming winding, a semiconductor is provided with an aligned winding portion of a required length at the starting end of the winding so that the windings do not cross each other. Gold wire spool winding for element bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980170822U JPS6116690Y2 (en) | 1980-11-27 | 1980-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980170822U JPS6116690Y2 (en) | 1980-11-27 | 1980-11-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5793144U JPS5793144U (en) | 1982-06-08 |
| JPS6116690Y2 true JPS6116690Y2 (en) | 1986-05-22 |
Family
ID=29529230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980170822U Expired JPS6116690Y2 (en) | 1980-11-27 | 1980-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116690Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952629U (en) * | 1982-09-30 | 1984-04-06 | 住友金属鉱山株式会社 | Fine wire supply package |
-
1980
- 1980-11-27 JP JP1980170822U patent/JPS6116690Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5793144U (en) | 1982-06-08 |
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