JPS5952629U - Fine wire supply package - Google Patents

Fine wire supply package

Info

Publication number
JPS5952629U
JPS5952629U JP14701982U JP14701982U JPS5952629U JP S5952629 U JPS5952629 U JP S5952629U JP 14701982 U JP14701982 U JP 14701982U JP 14701982 U JP14701982 U JP 14701982U JP S5952629 U JPS5952629 U JP S5952629U
Authority
JP
Japan
Prior art keywords
fine wire
wire supply
supply package
aligned
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14701982U
Other languages
Japanese (ja)
Other versions
JPH0124932Y2 (en
Inventor
茂 安田
岸　清貴
Original Assignee
住友金属鉱山株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友金属鉱山株式会社 filed Critical 住友金属鉱山株式会社
Priority to JP14701982U priority Critical patent/JPS5952629U/en
Publication of JPS5952629U publication Critical patent/JPS5952629U/en
Application granted granted Critical
Publication of JPH0124932Y2 publication Critical patent/JPH0124932Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のファインワイヤー供給パツケ、　　−
ジの説明図でクロス巻層の１部分が剥ぎとられて整列巻
層の状態が示されている。 １・・・スプール胴部、２・・・整列巻層、３・・・ク
ロス巻層。Figure 1 shows the fine wire supply package of the present invention.
In this illustration, a portion of the cross-wound layer has been removed to show the aligned-wound layer. 1... Spool body, 2... Aligned winding layer, 3... Cross winding layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 長尺のファインワイヤーを円筒状の胴部を有するスプー
ルに多層に巻き付けたパッケージであって、該胴部に接
する第１層目が整列巻とされ、該整列巻層の上に巻始め
の整列巻部が露出するようにかつ整列巻層の部分よりは
み出ることな（クロス巻されて成るファインワイヤー供
給用パッケージ。　　　−A package in which a long fine wire is wound in multiple layers around a spool having a cylindrical body, the first layer in contact with the body is an aligned winding, and the winding start is aligned on the aligned winding layer. A fine wire supply package in which the winding portion is exposed and does not protrude beyond the aligned winding layer (cross-wound. -
JP14701982U 1982-09-30 1982-09-30 Fine wire supply package Granted JPS5952629U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14701982U JPS5952629U (en) 1982-09-30 1982-09-30 Fine wire supply package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14701982U JPS5952629U (en) 1982-09-30 1982-09-30 Fine wire supply package

Publications (2)

Publication Number Publication Date
JPS5952629U true JPS5952629U (en) 1984-04-06
JPH0124932Y2 JPH0124932Y2 (en) 1989-07-27

Family

ID=30327064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14701982U Granted JPS5952629U (en) 1982-09-30 1982-09-30 Fine wire supply package

Country Status (1)

Country Link
JP (1) JPS5952629U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027941A (en) * 2008-07-23 2010-02-04 Tdk Corp Coil component, and method of manufacturing coil component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793144U (en) * 1980-11-27 1982-06-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793144U (en) * 1980-11-27 1982-06-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027941A (en) * 2008-07-23 2010-02-04 Tdk Corp Coil component, and method of manufacturing coil component

Also Published As

Publication number Publication date
JPH0124932Y2 (en) 1989-07-27

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