CN102656676A - Form for wire winding of bonding wire for semiconductor - Google Patents
Form for wire winding of bonding wire for semiconductor Download PDFInfo
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- CN102656676A CN102656676A CN2010800034099A CN201080003409A CN102656676A CN 102656676 A CN102656676 A CN 102656676A CN 2010800034099 A CN2010800034099 A CN 2010800034099A CN 201080003409 A CN201080003409 A CN 201080003409A CN 102656676 A CN102656676 A CN 102656676A
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- wire rod
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H55/00—Wound packages of filamentary material
- B65H55/04—Wound packages of filamentary material characterised by method of winding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H65/00—Securing material to cores or formers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/18—Constructional details
- B65H75/26—Arrangements for preventing slipping of winding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/18—Constructional details
- B65H75/28—Arrangements for positively securing ends of material
- B65H75/285—Holding devices to prevent the wound material from unwinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78601—Storing means
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78611—Feeding means
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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Abstract
To provide a form for wire winding of bonding wire for semiconductors such that even if the bonding wire is cut, springback does not occur easily, and the wire does not loosen greatly on the spool. A wire winding structure for the end part of the winding (grounding part when the wire is unwound) of the main winding part for a bonding wire wound onto the wire winding part of a spool core is provided such that the winding structure for a first layer forms a structure in which grounding wires closely adhere to each other on the spool core, and lines are formed so as to be wound in alignment, with the plurality of wires in those lines separated from each other and inserted to form a winding with a strongly adhering alignment.
Description
Technical field
The present invention relates to a kind of winding arrangement that is wrapped on the spool and is used for the bonding wire rod of assembled semiconductor device etc.
Background technology
Be used for being twined,, make the wire rod of thousands of meters length be stacked to tens of millimeters thickness as the main part of twining such as the bonding wire rod of the application of assembled semiconductor device cylindrical tube around spool.In order to prevent main twine piling up of part and slide and subside; For example; Adopt the intersection winding arrangement (intersection winding arrangement part 14) shown in Fig. 3, wire rod circle that wherein advances left and the wire rod circle that advances to the right are intersected with each other when they are wrapped on the spool; According to this structure; The winding that the is arranged in parallel part (13) of predetermined axial length begins the end by the coiling of the Uncrossed spool of wire rod and forms; And the coiling end end (12) (cephalic par when untiing coil) that the coiling of wire rod begins end (11) (tail end when untiing coil) and wire rod is fastened on the end face of tube or flange (16) through (temporarily fastening) adhesive tape (15), in case the principal vertical line circle slides and subside (referenced patent discloses 1).
It is free that this of wire rod twines body (after spool is installed in the adhering device) its cephalic par when in use, after removing adhesive tape, and be drawn out and as the ground connection end, and its tail end is drawn out and is set in the wire rod delivery catheter.Also adopt another method that is called the wire rod cutting method; The adhesive tape that wherein tail end of wire rod is fastened on the grade in the flange of spool is not removed, and wire rod makes it freedom and cutting tip is drawn out so that be connected to ground but near adhesive tape, cut off.
The above-mentioned removal of adhesive tape need be used the very elaboration of pair of forceps, and sometimes at the cephalic par or the tail end of the wire rod that twines, the fastening bonding wire rod in the ground that is tensioned when the release adhesive band from the tweezers landing.On the other hand, be not removed but wire rod is cut and pulls out as under the situation of ground connection end at adhesive tape, the cutting tip of the bonding wire rod of tensioning can fly off tweezers and bonding wire rod possibly fluff diffusing.Under the situation of cephalic par (it is a leading section when wire rod is reeled); Its lax bonding wire rod that does not influence in the main winding part; But under the situation of tail end (it is a rearward end when wire rod is reeled); Tend to cause that the bonding wire rod at tail end place lax that end retreats in the piling up of the wire rod that twines around the tube of spool; Perhaps can cause the phenomenon that what is called is rebounded, the wire rod that the tube around spool that the cutting of the bonding wire rod that this phenomenon of rebounding is tensioning triggers twines lax or tangle or lax and tangle.
Replacement is fastened on the tail end of wire rod on the end face of tube or flange; Attempted the bonding wire rod winding arrangement that for example is used for semiconductor application as shown in Figure 4, the coiling that the material (18) that wherein is used for drawing the length of wire rod is connected to wire rod finishes end (17) (referenced patent discloses 2).Reference numeral 19 these flanges of expression.According to suggestion, long material is half adhesive tape preferably, and this half adhesive tape releasably adheres to self but do not adhere to other material.
Yet, in this prior art, need to use other article and this increase manufacturing cost and management cost with the form of half adhesive tape.And, worry that unwanted half adhesive tape possibly spurred by error and bond together with wire rod in bonding operation; In addition, because the variation of environment temperature exists and removes the situation that the required time of half adhesive tape becomes long unreasonably, cause the reduction of operating efficiency.
Also attempted one type wire rod winding arrangement, a winding part (referenced patent discloses 3) that is arranged in parallel wherein has been set near each end of main winding part.Fig. 5 illustrates the embodiment of this structure; The wherein similar main part of being made up of piling up of wire rod 21 (back is called " ladder piles up ") of twining with trapezoidal profile of piling up the japanese traditional manner of straw is laid on the middle body of spool 20 through the intersection multi-lay winding; And part 22 is twined in the guiding end and tail end winding part 23 is wrapped on the spool 20 at the position that main winding part 21 is between this part 22 and 23 with being arranged in parallel, and each end of wire rod is fastened on the flange 25 through the fastening adhesive tape 24 of end.
If being wound in the guiding end sections that is arranged in parallel processes and has conventional wide winding pitch; Shown in Fig. 6 (a); And adopt this wire rod cutting method; Then guiding end sections 22 will often receive relaxing, sliding of moment and tangle the promptly so-called phenomenon of rebounding (with reference to figure 6 (a) and 6 (b)) when the bonding wire rod of cutting.Yet; It is said to make the closely contact each other of adjacent wire segment that the impact energy that allows when the bonding wire rod of cutting, to be applied to bonding wire rod 26 is absorbed by adjacent wire segment and propagates into adjacent wire segment (Fig. 6 (c)) through the bonding wire rod of tight arrangement.But this plan is not considered to the perfect solution of this problem.
Patent is open
Patent discloses 1: the clear 57-093144 of disclosed utility model application
Patent discloses 2: disclosed patent application 2000-277560
Patent discloses 3: disclosed patent application 2004-111449
Summary of the invention
The problem that the present invention manages to solve
Consider that above-mentioned regular situation makes the present invention, and target of the present invention provides a kind of winding arrangement of bonding wire rod, when the guiding end sections accident of bonding wire rod during from the tweezers landing this winding arrangement phenomenon that do not allow to rebound take place.And another target of the present invention is to propose a kind of winding arrangement, in this winding arrangement can by the winding of wire rod self closely the coiling of fastening bonding wire rod finish end sections (leader), and needn't twist or bent wire.
The means of dealing with problems
In order to address the above problem, be according to of the embodiment of the winding arrangement of the bonding wire rod that is used for semiconductor application of the present invention:
(a) be used for the winding arrangement of the bonding wire rod of semiconductor application; This winding arrangement comprises: by the middle body main part of twining that twine, that will form as the wire rod of bonding wire rod of the cylindrical tube that centers on spool; The grounded part that forms and twine around the end sections of the cylindrical tube of spool by the wire rod that finishes the end continuity from the main coiling that twines the wire rod of part, and the wire ends part that forms and be fastened to the flange of spool by the wire rod that continues from grounded part; Wherein
The winding arrangement of the wire rod of grounded part generally by first twine accurate layer one deck winding arrangement of forming of wire rod and second wire rod that twines accurate layer; The accurate layer of first winding is a plurality of intensive wire rod circle that is arranged in parallel that is wrapped on the spool tube; And second twine accurate layer wire rod be a plurality of wire rod circles separated from one another substantially, but second twines some wire rod circles in the wire rod circle of accurate layer and all highly closely is laid on first and twines between two adjacent parallel wire rod circles of accurate layer.
And another embodiment among the embodiment of the winding arrangement of bonding wire rod is:
(b) be used for the winding arrangement of the bonding wire rod of semiconductor application; This winding arrangement comprises: by the middle body main part of twining that twine, that will form as the wire rod of bonding wire rod of the cylindrical tube that centers on spool; The grounded part that forms and twine around the end sections of the cylindrical tube of spool by the wire rod that finishes the end continuity from the main coiling that twines the wire rod of part, and the wire ends part that forms and be fastened to the flange of spool by the wire rod that continues from grounded part; Wherein
The winding arrangement of the wire rod of grounded part generally by first twine accurate layer one deck winding arrangement of forming of wire rod and second wire rod that twines accurate layer; The wire rod of the accurate layer of first winding forms main grounded part and secondary grounded part; This main grounded part is to be wrapped in a plurality of intensive wire rod circle that is arranged in parallel on the spool tube 4 outwards (to leave the master and to twine part) mode of advancing; This pair grounded part is wrapped on the spool tube with the mode of inwardly advancing; Second twine accurate layer wire rod be one or more wire rod circle separated from one another substantially, but second at least one wire rod circle of twining in the wire rod circle of accurate layer highly closely is laid between two adjacent parallel wire rod circles of main grounded part.
And, following according to some of the preferred embodiment of the winding arrangement of the bonding wire rod that is used for semiconductor application of the present invention:
(c) bonding wire rod is processed by the heat treated metal silk.
(d) is twined to form the wire rod that first of main grounded part twines accurate layer and twined to leave the main mode of partly advancing of twining.
(e) be wrapped in one or more circle that twines the wire rod of accurate layer in second of main grounded part top on the spool tube 4 and all be laid between two adjacent circles that are arranged in parallel of the wire rod that is wrapped in the accurate layer of first on the spool tube 4, make second to twine accurate deck wire and be trapped between the wire rod circle of the first accurate layer by pressure.
(f) be wrapped in wire rod that first in the secondary grounded part twine accurate layer along be wrapped in first in the main grounded part and twine the direction in the opposite direction that the wire rod of accurate layer twined and twined.
Effect of the present invention
According to the present invention; The main coiling that twines the bonding wire rod of part that twines around the cylindrical tube of spool finishes end (or untiing the beginning end) and is connected to grounded part; This grounded part twines accurate deck wire and second by first and twines one deck structure that accurate deck wire is formed; Wherein the wire rod of the accurate layer of second winding is a plurality of wire rod circles separated from one another substantially; Some wire rod circles in these a plurality of wire rod circles all are laid on first highly closely and twine between two adjacent parallel wire rod circles of accurate layer, and this parallel wire rod circle closely is arranged in parallel within on the spool tube 4, make and can avoid causing the phenomenon of rebounding of subsiding that wire rod piles up definitely.In addition, have the two-part structure of in series being made up of with this order main grounded part and secondary grounded part through making grounded part, the phenomenon that can prevent with higher certainty to rebound is subsided with piling up.
Other effect of the present invention comprises:
(i) if (be wire rod on spool lax) carried out bonding operation under the situation that wire rod rebounds, then wire rod is tangled and wire rod possibly fracture.Yet, rely on this wire rod to be arranged to the fact of twining with highly compact arranged mode, thus because the frictional resistance of wire rod contact is quite high, the wire rod of main grounded part is not lax and can not cause unfavorable phenomenon.
(ii) can irrespectively use wire rod winding arrangement of the present invention with main coiling length and winding of twining part.
(iii) because the tension force of comparing the grounding parts office with conventional wire rod winding arrangement is higher, therefore during transportation the lax frequency of grounded part minimizes greatly.
(iv) common, when the lax generation of wire rod, before reusing spool, enclose and untie lax wire rod, but closely arrange because of the height of winding arrangement with staff one, can remove this operation from now.
Description of drawings
Fig. 1 is the illustrative partial view that the pith of first winding arrangement of the present invention is shown.
Fig. 2 is the illustrative partial view that the pith of second winding arrangement of the present invention is shown.
Fig. 3 is the explanatory that conventional art is shown, and wherein the main part of twining of bonding wire rod is for intersecting winding arrangement.
Fig. 4 is the explanatory that conventional art is shown, and the coiling that the bonding wire rod winding arrangement that wherein is used for semiconductor application makes the material of the length be used for drawing wire rod be connected to wire rod finishes end (17).
Fig. 5 is the explanatory that conventional art is shown, and wherein winding arrangement makes the winding that is arranged in parallel partly be arranged in main the winding on each side partly.
Fig. 6 illustrates the guiding end that occurs in bonding wire rod to twine a group profile property view of the phenomenon of rebounding of part; Wherein view (a) illustrates and has normal guidance end wide winding pitch, that twine with the mode that is arranged in parallel and twine part; And wherein view (b) is illustrated in the phenomenon of rebounding that takes place when implementing the wire rod cutting method under the situation of (a), and wherein view (c) illustrates the compact arranged guiding of wire rod end and twines part.
Embodiment
Now, will specify the example of embodiment of the present invention with reference to accompanying drawing.
First example according to winding arrangement of the present invention presents following structure: the many astragals material that constitutes the first accurate layer is arranged parallel to each other on the tube of spool; And the wire rod that constitutes some circles of the second accurate layer all is closely arranged between the parallel circle of the first accurate deck wire, and other of the second accurate deck wire circle is neither parallel also is not closely aligned together.Because a plurality of wire rod circles of the first accurate layer that is arranged parallel to each other, the main influence of being drawn back from main winding part of twining the wire rod of part can be left in the basket now.And some wire rod circles of the second accurate layer all are closely aligned between the parallel wire rod circle that is wrapped in the accurate layer of first on the spool tube in parallel with each other, make them form highly compact arranged accurate band structure; Because this structure falls from tweezers even be fixed to the bonding wire rod of the flange of spool, the main bonding wire rod that twines part does not unclamp yet.Yet,, preferably, coat around bonding wire rod with many circle second accurate deck wires for purpose of safety.
Shown in Fig. 1; (at least 4 circles are necessary to the suitable number of turns of the first accurate layer 3; And 10-15 circle preferably) wire rod twining that part of extending between the part (not shown) at the flange 1 of spool and main and twine around spool tube 2 with the mode that outwards (in Fig. 1 left) advances; Make them closely arrange in parallel with each other; And the coiling of the first accurate layer finishes the winding start position that the end is brought back to the first accurate layer 3, and to begin the winding of the second accurate layer 4, wherein the circle of the wire rod of the second accurate layer 4 closely is pressed in the central ring of the first accurate deck wire and just between the circle before this central ring; And twine the second accurate layer of a circle or a plurality of circles of not arranging subsequently, and reel and finish the end and be fixed to flange 1 (also can this end be fixed to spool tube 2) by an adhesive tape 5.By the fixing position of adhesive tape, can utilize long material (half adhesive tape), the material of this length is generally used for pulling out wire ends.
The winding of the first accurate layer is so that adjacent wire rod circle is parallel and the mode of arrangement is contiguously carried out; And the winding of the second accurate layer so that winding tension equals or even the mode that is higher than the winding tension under the situation of twining the first accurate layer carry out; Each circle that causes the second accurate layer is thus invaded between the adjacent circle of the first accurate layer, consequently produces the layer of dense arrangement.(incidentally, the tension force of the second accurate layer is main twice of twining the tension force of part).According to present circumstances, prevented to discharge this thorny phenomenon of bonding wire rod really owing to rebounding.The winding tension that is used for the second accurate layer is not designated, but preferably it can equate perhaps greater than the winding tension that is used for the first accurate layer with the winding tension that is used for the first accurate layer.(winding tension that incidentally, is used for the second accurate layer is to be used for main twice of twining the winding tension of part).
Purpose for ease, the wire rod circle of the first standard layer is represented by the gray line that has profile by the thick black line representative and the wire rod circle of the second accurate layer.
In second example of winding arrangement, grounded part is made up of two parts: one is that main grounded part and another are the secondary grounded parts after main grounded part.Be arranged to from the main grounded part fact in succession by secondary grounded part, draw main power of twining the wire rod of part not felt by secondary grounded part from the main part of twining.And the frictional resistance of the increase that causes by the contact area by the increase of main ground connection wire rod and secondary ground connection wire rod draws the power of the wire rod of secondary grounded part not felt by the end band from secondary grounded part.Therefore, the power of frictional resistance that can keep main wire rod that twines part and secondary ground connection wire rod is greater than after the stripped terminal end band, there not being tweezers to help keep the unlocked power of secondary ground connection wire rod self under the wire ends situation.This frictional resistance is along with the quantity increase and the change of the wire rod circle of main grounded part are big.
As shown in Figure 2, around the circle that inwardly advances of the wire rod of near the circle (as first accurate layer) wire rod, that compact arranged outwards (left) advances of the main grounded part 6 of that part of winding that the flange 1 of spool, extends of spool tube 2 and secondary grounded part 7.Then; The coiling of secondary grounded part finishes the end and is brought back to main grounded part 6; And the winding of the second accurate layer begins along with forcing this wire rod to be between the adjacent circle of main grounded part 7 (at the circle at center with just between the circle in its front); And a circle or a plurality of circle of not arranging of the second accurate layer 4 are twined subsequently, and its coiling finishes the end and is fixed to (alternatively to the tube 2 of spool) on the flange 1 by adhesive tape.With with the similar mode of first example of winding arrangement, the winding tension that is used for the second accurate layer 4 equals or even greater than the winding tension of the winding that is used for the first accurate layer.(winding tension that incidentally, is used for the second accurate layer is to be used for main twice of twining the winding tension of part).
By this winding arrangement, prevented to discharge this thorny phenomenon of bonding wire rod really owing to rebounding.
Much less, in any of these examples of winding arrangement, can on main both sides of twining part, guiding end sections (grounded part) be provided.
Be selected from Au, Ag, Al, Cu or their two kinds or more kinds of alloys owing to be used for the material of bonding wire rod, therefore can depend on the quantity and the wire rod pitch of the selection control wire rod circle of material wire.Incidentally, the first accurate deck wire can have above-mentioned frictional resistance, but this frictional resistance along continuous straight runs works, and as the compression stress along the whole length of the second accurate layer, makes wire rod avoid cut and occurs unusually in its smooth outward appearance with indenture causes.
Example
At first; To intersect the technological mode of multi-lay winding; Form the main part of twining through on the cylindrical tube of the spool of the length of diameter with 50mm and 45.5mm, twining the bonding wire rod of Au that is used for semiconductor application; Up to laying 4000 layers, the bonding wire rod of Au that each spool length comprises ten thousand metres, have diameter and the 99.99 quality % of 25 μ m or higher purity (it by heat treatment so that have 4% elongation).
In this operating winding, adopt the stepped technology of piling up, wherein the width of wire-coated is along with the height increase of piling up reduces consistently.It is that 40mm and pitch width are 5mm that reeling condition makes the width of the wire-coated of winning.
After forming main winding part as stated, reel and carry out, and therefore form main grounded part and secondary grounded part towards the position that will draw main ground connection wire rod and secondary ground connection wire rod.In this case; The mode of twining main ground connection wire rod makes that the tension force that is used for main ground connection wire rod is to be used for main twice of twining the tension force of part; And be that pitch width is 25 μ m under the situation of 25 μ m at gauge or diameter of wire; And the 11 astragal materials of reeling, each new circle increase the distance of leaving main winding part.The mode of twining secondary ground connection wire rod makes that the tension force that is used for it is to be used for main twice of twining the tension force of part; And six parallel wire rod circles of each wire rod circle wire rod circle that all closely adjacency is adjacent substantially are wound onto between main grounded part and the main winding part, and each new circle is shifted towards main grounded part from main winding part.Next; Two astragal materials are wound onto between the main ground connection wire rod circle; This main ground connection wire rod circle is the same with secondary ground connection wire rod to be twined to be used for the main tension force that twines the twice of tension force partly, and wire ends uses adhesive tape to be fixed to the peripheral part of flange through conventional fixing means subsequently.
Comparison example
Except not being set, secondary grounded part and main ground connection wire rod twined the transposition of partial away from main by each new circle of 20 circles of reeling, this 20 circle; All other steps with this example in identical mode followed, be fixed to the peripheral part of flange by adhesive tape up to the wire rod end.
Ten spools that prepare this example and comparison example respectively; Wire rod (25 μ m diameter) is secured on it as stated; And each spool stands following experiment, wherein, uses tweezers; Wire rod is cut off near adhesive tape, and from spool the tube unlocked wire rod circle quantity be counted and calculate par.Table 1 illustrates the result.
Table 1
As clearly visible from The above results, compare with traditional winding arrangement, significantly be limited according to the phenomenon of rebounding under the situation of the winding arrangement of the bonding wire rod that is used for semiconductor application of the present invention.Incidentally, the wire rod of untiing from the spool of this example and comparison example does not all have such as the outward appearance of wound and irregular reflection unusual, and when wire rod is set in the bonding apparatus, does not stop up.In addition, under the situation of the gauge or diameter of wire of 20 μ m and 30 μ m, experimentize, and the quantity of the circle of untiing is less than winding arrangement of the present invention.
Description of reference numerals
1: flange
2: the tube of spool
3: the first accurate layers
4: the second accurate layers
5: band
6: main grounded part
7: secondary grounded part
11: (wire rod) coiling begins the end
12: (wire rod) coiling finishes the end
13: the winding part that is arranged in parallel
14: the structure division that intersection is twined
15: (temporarily fastening) adhesive tape
16: (spool) flange
17: reel and finish the end
18: the material that is used for drawing the length of wire rod
19: flange
20: spool
21: the main part of twining
22: part is twined in the guiding end
23: tail end twines part
24: terminal fastening adhesive tape
25: flange
26: bonding wire rod
Claims (6)
1. winding arrangement that is used for the bonding wire rod of semiconductor application; Said winding arrangement comprises: by the middle body main part of twining that twine, that will form as the wire rod of bonding wire rod of the cylindrical tube that centers on spool; By finishing the grounded part of end sections winding that wire rod that the end continue with being integral formed and centered on the cylindrical tube of said spool from the said main coiling that twines the wire rod of part, and form and be fastened to the wire ends part of the flange of said spool by the wire rod that continues from said grounded part with being integral; Wherein
The winding arrangement of the wire rod of said grounded part generally by first twine accurate layer one deck winding arrangement of forming of wire rod and second wire rod that twines accurate layer; The accurate layer of said first winding is, a plurality of intensive wire rod circles that are arranged in parallel that twine around said spool tube; And the wire rod that said second winding is accurate layer constitutes a plurality of wire rod circles separated from one another substantially, and some the wire rod circles in a plurality of wire rod circles of the said second winding standard layer highly closely are laid on respectively between two adjacent parallel wire rod circles of accurate layer of said first winding.
2. winding arrangement that is used for the bonding wire rod of semiconductor application; Said winding arrangement comprises: by the middle body main part of twining that twine, that will form as the wire rod of bonding wire rod of the cylindrical tube that centers on spool; By finishing the grounded part of end sections winding that wire rod that the end continue with being integral formed and centered on the cylindrical tube of said spool from the said main coiling that twines the wire rod of part, and form and be fastened to the wire ends part of the flange of said spool by the wire rod that continues from said grounded part with being integral; Wherein
The winding arrangement of the wire rod of said grounded part generally by first twine accurate layer one deck winding arrangement of forming of wire rod and second wire rod that twines accurate layer; The wire rod of the accurate layer of said first winding forms main grounded part and secondary grounded part; Said main grounded part is a plurality of intensive wire rod circle that is arranged in parallel that twines around said spool tube with the mode of outwards advancing; Said secondary grounded part twines around said spool tube with the mode of inwardly advancing; Said second twines wire rod formation one or more wire rod circle separated from one another substantially of accurate layer, and at least one the wire rod circle in a plurality of wire rod circles of the accurate layer of said second winding highly closely is laid between two adjacent parallel wire rod circles of said main grounded part.
3. according to claim 1 or claim 2 the winding arrangement of the bonding wire rod that is used for semiconductor application is characterized in that said bonding wire rod is processed by the heat treated metal silk.
4. according to claim 1 or claim 2 the winding arrangement of the bonding wire rod that is used for semiconductor application is characterized in that, is twined to form the wire rod that said first of said main grounded part twines accurate layer to be twined to leave the said main mode of partly advancing of twining.
5. according to claim 1 or claim 2 the winding arrangement of the bonding wire rod that is used for semiconductor application; It is characterized in that; Be wrapped in one or more circle that said second in the said main grounded part that twines around said spool tube twine the wire rod of accurate layer and be laid on respectively between two adjacent circles that are arranged in parallel of wire rod of the said first accurate layer that twines around said spool tube, make said second to twine accurate deck wire and be trapped between the wire rod circle of the said first accurate layer by pressure.
6. the winding arrangement that is used for the bonding wire rod of semiconductor application as claimed in claim 2; It is characterized in that, be wrapped in wire rod that said first in the said secondary grounded part twine accurate layer along be wrapped in the direction in the opposite direction that wire rod that said first in the said main grounded part twine accurate layer twined and twined.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2010/065579 WO2012032645A1 (en) | 2010-09-10 | 2010-09-10 | Form for wire winding of bonding wire for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102656676A true CN102656676A (en) | 2012-09-05 |
Family
ID=45810266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800034099A Pending CN102656676A (en) | 2010-09-10 | 2010-09-10 | Form for wire winding of bonding wire for semiconductor |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN102656676A (en) |
| SG (1) | SG179072A1 (en) |
| TW (1) | TW201212133A (en) |
| WO (1) | WO2012032645A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473934A (en) * | 2019-02-22 | 2021-10-01 | W.L.戈尔及同仁股份有限公司 | Actuation wire storage system and method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014180587A1 (en) * | 2013-05-07 | 2014-11-13 | Nv Bekaert Sa | Arrangement of elongated element on empty spool |
| CN110683411A (en) * | 2018-07-06 | 2020-01-14 | 广东众恒科技有限公司 | Uniform winding manipulator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0896363A2 (en) * | 1997-08-08 | 1999-02-10 | Tanaka Denshi Kogyo Kabushiki Kaisha | Spool case of bonding wire |
| JP2000036513A (en) * | 1998-07-21 | 2000-02-02 | Tatsuta Electric Wire & Cable Co Ltd | Spool wound with bonding wire for semiconductor and method for supplying spool and bonding wire for semiconductor |
| JP2004111449A (en) * | 2002-09-13 | 2004-04-08 | Tanaka Electronics Ind Co Ltd | Wound structure of ultrafine gold bonding wire and method for winding the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11228025A (en) * | 1997-12-12 | 1999-08-24 | Tanaka Electronics Ind Co Ltd | Spool winding form of extra fine wire and spool case |
-
2010
- 2010-09-10 SG SG2012016796A patent/SG179072A1/en unknown
- 2010-09-10 WO PCT/JP2010/065579 patent/WO2012032645A1/en active Application Filing
- 2010-09-10 CN CN2010800034099A patent/CN102656676A/en active Pending
-
2011
- 2011-01-06 TW TW100100477A patent/TW201212133A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0896363A2 (en) * | 1997-08-08 | 1999-02-10 | Tanaka Denshi Kogyo Kabushiki Kaisha | Spool case of bonding wire |
| JP2000036513A (en) * | 1998-07-21 | 2000-02-02 | Tatsuta Electric Wire & Cable Co Ltd | Spool wound with bonding wire for semiconductor and method for supplying spool and bonding wire for semiconductor |
| JP2004111449A (en) * | 2002-09-13 | 2004-04-08 | Tanaka Electronics Ind Co Ltd | Wound structure of ultrafine gold bonding wire and method for winding the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473934A (en) * | 2019-02-22 | 2021-10-01 | W.L.戈尔及同仁股份有限公司 | Actuation wire storage system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| SG179072A1 (en) | 2012-04-27 |
| WO2012032645A1 (en) | 2012-03-15 |
| TW201212133A (en) | 2012-03-16 |
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Application publication date: 20120905 |