201209126 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及電路板技術領域，尤其涉及一種應用於電路 板生產並具有電磁遮罩作用之電路板基板及其製作方法 [先前技術] [0002] 隨著科學技術之進步，印刷電路板於電子領域得糾之廣 泛之應用。關於電路板之應用請參見文獻Takahashi， A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima， M. Res. Lab, High density multilayer printed circuit board for IIITAC M-880 > IEEE Trans, on Components, Packaging, and Manufacturing Technology, 1992， 14(4): 418-425。 [0003] 隨著電路板產品層數增加，電路板產品於實際工作時， 往往會產生電磁幹擾現象，影響電路板信號傳送。這樣 ，於電路板產品中需要設爲電磁遮夫層。目前，採用之 電磁遮罩層通常採用厚度較小之不銹鋼片製作，將不銹 鋼片設置於電路板產品相鄰之兩銅箔層之間，從而起到 電磁遮罩之作用。然而，不銹鋼片之重量較大，從而增 加了電路板產品之重量。並且不銹鋼片之撓折性較差， 採用不銹鋼片製作之電磁遮罩層影響柔性電路板撓折性 能。由於不錄鋼片之價格較南’增加電路板之生產成本 〇 【發明内容】 [0004] 有鑑於此，提供一種能夠應用於電路板以起到電磁遮罩 099129184 表單編號A0101 第3頁/共21頁 0992051207-0 201209126 [0005] [0006] [0007] 099129184 作用之電路板基板及其數造方、、 一種電路板基板，其包紅& , 依二人堆疊之纽 樹脂複合材料層、膠層及金屬展 緣基材層、環氧 料層由環氧樹脂複合材料級成9所迷環氧樹脂複合材 包括端幾基聚合物改性之環氣樹迷環氡樹脂複合材料 散材料，所述奈米碳管於所述環^ j奈米碳管及無機分 之重量百分比為4. 6%至16%。衣氧樹脂複合材料中所佔 一種電路板基板之製作方法， 複合材料，所述環氧樹脂複合衬料=驟：製作環氣樹脂 性之環氧樹脂、奈米碳管及無機八=括端鲮基聚合物改 管於所述環氧樹脂複合材料中所佔材料’所述奈米碳 至16% ;提供絕緣基材層.敗纪 重里百分比為4. 6% 於絕緣基材層之表面形成環氧樹腊複A脂複3村料塗佈 述環氧樹賴合㈣層；提供金屬層料層；固化所 成膠層;壓合表面形成有環氧樹合=層表面形 材層及表面形成有勝層之金屬層，並使得膠層 環氧樹脂複合材料層；以及固所迷膠層。觸點m 相較於先前技術，本技術方案提供〜电路扳基板，其中 間設置有環氧樹脂複合材料層，所社.堪& ' 尽所攻環氧樹脂複合材料 層中具有分散均勻之奈米碳管而具有㊉”有電磁遮罩作用，當 所述電路板基板祕製❹層電叫時，所述環氧樹脂 複合材料層能夠起到電磁鮮作用，並能_止導電= 路之間之離子遷㈣題。並且，錢樹脂複合材料層具 有良好之柔㈣，相比於現有技術中之獨鋼片，能夠 增加柔性電路板之撓折性能，並且可降低電路板之生產 表單編號A0101 第4頁/共21頁 實屬 0992051207-0 201209126 成本。本技術方案提供之電路板基板之製作方法，能夠 方便地製作所述電路板基板。 【實施方式】 [0008] 下面結合實施例對本技術方案提供之電路板基板及其製 作方法進一步之詳細說明。 [0009] 請參閱圖1 ’本技術方案提供一種電路板基板1〇〇，其包 括依次堆疊之絕緣基材層110、環氧樹脂複合材料層12〇 、膠層130及金屬層140。 〇 [_]絕緣絲層11()用於承舰氧樹脂複合材料層i2Q，並起 到電絕緣之作用。本實施例中，琴緣基材層11〇之材質為 聚醯亞胺。絕緣基材層110之厚度可根據實際需要進行設 定，其厚度可為10微米至50微米，優選為„25微米。 _]縣130用於黏接環氧樹脂複合材料層12(j及金屬層14〇 ，並使得環氧樹脂複合材料層12G及金屬層14{)之間相互 電絕緣。本實施例中，膠層13〇採用之材料為熱固性環氧 樹月曰踢。膠層130之厚度約為8至b微米，優選為12微米 [0012] =屬層U〇用於於電路板之製作過程中製作導電線路。本 ΓΓ’金屬層14G為㈣，其厚度約為_至25微 [0013] 099129184 環氧樹脂複合材料層12。用於起到 料層12G之厚度可根據實際= 複合材料層120之厚度約為2 第5頁/共21頁 之強弱進行設定。環氧樹难 表單編號A0101 0992051207-0 201209126 微米至8微米，優選為3微米。環氧樹脂複合材料層120控 制於此範圍内，可有效地避免電路板基板100發生翹曲等 問題之產生。環氧樹脂複合材料層120内之環氧樹脂複合 材料包括端羧基聚合物改性之環氧樹脂、奈米碳管、無 機分散材料、硬化劑、催化劑、〉谷劑及消泡劑。 [0014] [0015] [0016] 099129184 所述端缓基聚合物改性之環氧樹脂為環氧樹脂與端羧基 聚合物發生共聚合反應後之產物，即環氧樹脂末端之環 氧基與端羧基聚合物之末端之羧基發生反應而生成一個 酯基，從而得到有包括交替之環氧樹脂重複單元及端羧 基聚合物之重複單元之聚合物。其中，環氧樹脂可為雙 酚A型環氧樹脂’端羧基聚合·物可為液態聚丁二烯丙烯腈 (CTBN)。本實施例中’採用之環氧樹埯於未改性前之環 氧當量為180至195，優選為188，羧基聚合物改性後之 環氧樹脂之還氧當量為323至352，優選為33卜端叛基 聚合物改性之環氧樹脂於環氧樹脂複合材料中之重量百 分比約為55%至65% ’優選約為6〇%。 奈米碳管作為導_，_分散⑼㈣聚合物改 性之觀樹財，以磁鮮㈣。管於複 ==量百分比為4.6%，:複合材料中奈 ==要得到複合―導電 多，環氧樹脂複合材料之電中奈米碳管之含量越 管之含量越少，環氧樹腾複合材料之奈米碳 無機分散材料心錢 勻分佈於環氧樹:e m使得奈米碳管可均 表單編號_1 所述無機分散材料為奈 0992051207-0 201209126 米黏土或者奈米雲母粉。所述奈米黏土為2 : 1之頁矽酸 鹽’其具體可為蒙脫石（Montmorillonite，分子式為201209126 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to the field of circuit board technology, and more particularly to a circuit board substrate applied to a circuit board and having an electromagnetic shielding effect and a manufacturing method thereof [Prior Art] [0002] With the advancement of science and technology, printed circuit boards have been widely used in the field of electronics. For application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for IIITAC M-880 > IEEE Trans, on Components, Packaging, and Manufacturing Technology, 1992, 14(4): 418-425. [0003] With the increase in the number of circuit board product layers, when the circuit board product is actually working, electromagnetic interference is often generated, which affects the signal transmission of the circuit board. Thus, it is necessary to set it as an electromagnetic mask layer in the circuit board product. At present, the electromagnetic shielding layer is usually made of a stainless steel sheet having a small thickness, and the stainless steel sheet is placed between two copper foil layers adjacent to the circuit board product, thereby functioning as an electromagnetic mask. However, the weight of the stainless steel sheet is large, which increases the weight of the board product. Moreover, the stainless steel sheet has poor flexibility, and the electromagnetic shielding layer made of stainless steel sheet affects the flexural performance of the flexible circuit board. Since the price of the unprinted steel sheet is higher than that of the south, the production cost of the circuit board is increased. [Invention] [0004] In view of the above, there is provided a method that can be applied to a circuit board to function as an electromagnetic mask 099129184 Form No. A0101 Page 3 / Total 21 page 0992051207-0 201209126 [0005] [0006] [0007] 099129184 The circuit board substrate and its manufacturing method, a circuit board substrate, the red package & The rubber layer and the metal spread edge substrate layer and the epoxy layer are composed of an epoxy resin composite material. The epoxy resin composite material includes a terminal group polymer modified ring gas tree ring resin composite material bulk material. 6%至16百分比。 The carbon nanotubes in the ring and the carbon nanotubes and inorganic parts by weight of 4.6% to 16%. A method for manufacturing a circuit board substrate in a oxy-resin composite material, a composite material, the epoxy resin composite lining = step: preparing a cycloolefin resin epoxy resin, a carbon nanotube, and an inorganic VIII The 鲮-based polymer is modified in the epoxy resin composite material to occupy the material of the nanocarbon to 16%; the insulating substrate layer is provided. The percentage of the slab is 4.6% on the surface of the insulating substrate layer. Forming an epoxy tree wax complex A fat complex 3 village material coating said epoxy tree ray (4) layer; providing a metal layer layer; curing the gel layer; forming an epoxy tree layer = layer surface layer layer And the surface is formed with a metal layer of the winning layer, and the adhesive layer epoxy resin composite layer; and the solidified rubber layer. Compared with the prior art, the present invention provides a circuit board substrate with an epoxy resin composite layer disposed therebetween, which is uniformly dispersed in the epoxy resin composite layer. The carbon nanotube has a ten-dimensional electromagnetic shielding function, and when the circuit board substrate is made of a layer of electricity, the epoxy resin composite layer can play an electromagnetic fresh effect, and can stop conduction = road The interaction between the ions (4) and the money resin composite layer has good flexibility (4), compared with the prior art single steel sheet, can increase the flexibility of the flexible circuit board, and can reduce the production form of the board No. A0101 Page 4 of 21 Actually 0992051207-0 201209126 Cost. The method for manufacturing a circuit board substrate provided by the present technical solution can facilitate the fabrication of the circuit board substrate. [Embodiment] [0008] The circuit board substrate provided by the technical solution and the manufacturing method thereof are further described in detail. [0009] Please refer to FIG. 1 'The present technical solution provides a circuit board substrate 1 〇〇 including sequential stacks The laminated insulating substrate layer 110, the epoxy resin composite material layer 12, the adhesive layer 130 and the metal layer 140. The 〇[_] insulating silk layer 11 () is used for the ship oxyresin composite material layer i2Q, and plays the electricity In this embodiment, the material of the base material layer 11 is polyimide, and the thickness of the insulating base layer 110 can be set according to actual needs, and the thickness thereof can be 10 micrometers to 50 micrometers, preferably „25 microns. The county 130 is used to bond the epoxy resin composite layer 12 (j and the metal layer 14 〇 and electrically insulate the epoxy resin composite layer 12G and the metal layer 14{) from each other. In this embodiment, the material used for the adhesive layer 13 is a thermosetting epoxy tree. The thickness of the glue layer 130 is about 8 to b microns, preferably 12 microns. [0012] The layer U is used to make conductive lines during the fabrication of the board. The metal layer 14G is (4) and has a thickness of about _ to 25 micro [0013] 099129184 epoxy resin composite layer 12. The thickness of the layer 12G for use can be set according to the actual thickness of the composite material layer 120 of about 2, 5 pages, or 21 pages. Epoxy tree is difficult Form No. A0101 0992051207-0 201209126 Micron to 8 microns, preferably 3 microns. The epoxy resin composite material layer 120 is controlled within this range, and the occurrence of warpage of the circuit board substrate 100 can be effectively prevented. The epoxy resin composite material in the epoxy resin composite layer 120 comprises a carboxyl group-modified epoxy resin, a carbon nanotube, an inorganic dispersion material, a hardener, a catalyst, a granule, and an antifoaming agent. [0016] [0016] 099129184 The end-retardant polymer-modified epoxy resin is a product obtained by copolymerization of an epoxy resin and a terminal carboxyl group polymer, that is, an epoxy group at the end of the epoxy resin. The carboxyl group at the end of the terminal carboxyl polymer reacts to form an ester group, thereby obtaining a polymer having repeating units including alternating epoxy resin repeating units and terminal carboxyl groups. Among them, the epoxy resin may be a bisphenol A type epoxy resin. The terminal carboxyl group polymerization material may be liquid polybutadiene acrylonitrile (CTBN). In the present embodiment, the epoxy equivalent of the epoxy tree used before the unmodification is 180 to 195, preferably 188, and the epoxy resin modified by the carboxyl polymer has an oxygen equivalent weight of 323 to 352, preferably The weight percentage of the epoxy resin modified epoxy resin in the epoxy resin composite is about 55% to 65% 'preferably about 6〇%. The carbon nanotubes act as a guide _, _ disperse (9) (four) polymer modification of the view of the tree, to magnetic fresh (four). The percentage of the tube in the complex == 4.6%, the composite material in the negative == to get the composite - more conductive, the content of the electrical carbon nanotubes in the epoxy resin composite material is less than the content of the tube, the epoxy tree The nano-carbon inorganic dispersion material of the composite material is uniformly distributed in the epoxy tree: em makes the carbon nanotubes can be in the form number _1. The inorganic dispersion material is Nai 0992051207-0 201209126 m clay or nano mica powder. The nano-clay is a 2:1 page of citrate, which may specifically be montmorillonite (Montmorillonite, the molecular formula is
Mx(A14-xMgx)Si8020(〇H)4)、鋰蒙脫石（Hector-ite，分子式為Mx (Mg6-xLix) Si8O20(〇H)4)或者皂 石（Saponite，分子式為MxMg6 (Si 8-χΑ1χ) 〇20(OH)4)等。其中’奈米碳管與無機分散材料之重量 比為8至12比1。 [0017] Ο 所述硬化劑用於對複合材料起到硬化作用《本實施例中 ’採用之硬化劑為雙氰胺（Dicyandiamine)，所述硬 化劑於環氧樹脂複合材料所佔之重量百分比約為5%。硬 化劑之用量應與端羧基聚合物改性之環氧樹脂相對應， 其中端羧基聚合物改性之環氧樹脂與硬化劑之重量比約 為1 3至14比1。 [0018] Ο 所述催化劑為2-Η 烧基味峻（2-Undecyl imidazole) ，催化劑之含量與端羧基聚合物改性之環氧樹脂之含量 相互對應。催化劑於環氧樹瘤.複合材料^中所佔之重量百 分含量約為〇，5%至1%，優選為0. 65%。所述溶劑為二乙 一知單乙鱗醋酸酯（Diethylene glycol monoethyl ether acetate)，所述溶劑於環氧樹脂複合材料中之含 量約為20%至25%，優選為24%。該溶劑用於溶解上述其 他組分，以形成均句之液態分散體系。所述消泡劑用於 消除上述環氧樹脂複合材料中之泡沫，所述消泡劑於環 軋樹脂複合材料中之重量百分比約為2%。所述消泡劑可 為市售之臺灣淳政公司生產之2183H消泡劑。 099129184 優選地，於環氧樹脂複合材料中，端羧基聚合物改性之 表單編號A0101 第7頁/共21頁 0992051207-0 [0019] 201209126 壤氧樹脂之重量百分含量約為60.3%，奈米碳管之重量百 分含量約為7.8%，無機分散材料之重量百分含量約為 0. 6/0 ’硬化劑之重量百分含量约為4. 5%、催化劑之重量 百分含量約為〇.65% ’溶劑之重量百分含量約為24.3%， 消泡劑之重量百分含量約為1. 85%。 [0020] 本技術方案還提供一種所述電路板基板1〇〇之製作方法， 所述電路板基板1〇〇之製作方法包括如下步驟： [0021] 第一步，製作環氧樹脂複合材料。 [0022] 本實施例中所述環氧掛脂複合材料牙採用如下方法製作 參 « ....Mx(A14-xMgx)Si8020(〇H)4), Hector-ite (Mector (Mg6-xLix) Si8O20(〇H)4) or Saponite (Molecular formula MxMg6 (Si 8) -χΑ1χ) 〇20(OH)4), etc. Wherein the weight ratio of the carbon nanotube to the inorganic dispersion material is from 8 to 12 to 1. [0017] Ο the hardener is used to harden the composite material. The hardener used in the present embodiment is dicyandiamine, and the weight percentage of the hardener to the epoxy resin composite material About 5%. The amount of the hardener should correspond to the epoxy resin modified with the terminal carboxyl group polymer, wherein the weight ratio of the epoxy group to the hardener modified by the terminal carboxyl group is about 13 to 14 to 1. [0018] Ο The catalyst is 2-Undecyl imidazole, and the content of the catalyst corresponds to the content of the epoxy resin modified by the terminal carboxyl group. 65%。 The catalyst is about 5%, preferably 5% to 1%, preferably 0. 65%. The solvent is Diethylene glycol monoethyl ether acetate, and the solvent is contained in the epoxy resin composite in an amount of about 20% to 25%, preferably 24%. This solvent is used to dissolve the other components described above to form a liquid dispersion system of the same sentence. The antifoaming agent is used to eliminate the foam in the above epoxy resin composite material, and the weight percentage of the antifoaming agent in the entangled resin composite material is about 2%. The antifoaming agent may be a commercially available 2183H antifoaming agent manufactured by Hiroyuki Corporation of Taiwan. 099129184 Preferably, in the epoxy resin composite, the terminal carboxyl group modified form No. A0101, page 7 / 21 pages 0992051207-0 [0019] 201209126 The weight percentage of the earth oxide resin is about 60.3%, The 5% by weight of the catalyst is about 5% by weight of the catalyst. The weight percentage of the hardener is about 6.5 %. 85%。 The weight percentage of the defoamer is about 1. 85%. [0020] The technical solution further provides a manufacturing method of the circuit board substrate 1 , wherein the manufacturing method of the circuit board substrate includes the following steps: [0021] In the first step, an epoxy resin composite material is prepared. [0022] The epoxy grease-hanging composite tooth in the embodiment is produced by the following method.
[0023] 首先，採用端羧基聚合物改性環氧樹脂以得到端羧基聚 合物改性之環氧樹脂。 [0024] 將端羧基聚合物及環氧樹脂放置於共同放置於反應容器 中，並維持反應溫度為120,琛·’於攪拌之條件下反應 約3小時，從而得到端羧基聚合物改性攀環氧樹脂。本實 施例中，採用之環氧樹脂爲參酴▲型環氧樹脂，其環氧當 量為188。採用之端羧基聚合物可為液態聚丁二烯丙婦猜 (CTBN)，反應後得到之改性後之還氧樹脂之環氧當量為 337。經過上述反應，環氧樹脂末端之一個環氧基與端幾 基聚合物末端之一個羧基相互結合，並脫除一個分子之 水，從而得到一個酯基。從而相比於未進行改性之環氧 樹脂，改性後之環氧樹脂具有良好之柔軟性。當然，採 用之環氧樹脂不限於本實施例提供之雙酚A型環氧樹腸， 其亦亦可為其他類型之環氧樹脂。採用之端羧基聚合物 099129184 表單編號A0101 第8頁/共21頁 °"2〇512〇7.〇 201209126 [0025] [0026] Ο [0027] [0028] 〇 亦亦不限於本實施例中提供之液態聚丁二烯丙烯腈其 亦亦可為端羧基聚酯等聚合物。 然後，將奈米碳管均勻分散於無機分散材料中以形成分 散均勻之奈米碳管分散體。 採用物理方式將奈米碳管分散於無機分散材料中。所述 無機/7散材料可為層狀奈米黏土或者奈米雲母粉。本實 施例中，選用之無機分散材料為層狀奈米黏土。配置重 量比8至12比1之奈米碳管與層狀奈米黏土，並藉由攪拌 或者震盪之方式混合，使得奈米碳管均勻分散於所述層 狀奈米黏土中。採用之層狀奈米黏本可為2 :丨之頁矽酸 鹽，其具體可為蒙脫石、短鎂脫石或，考，皂石等。採用之 奈米碳管可為單壁奈米碳管，亦亦可為多遭奈米碳管。 最後，將端羧基聚合物改性之環氧樹脂、奈米碳管分散 體、溶劑、硬化劑、催化消泡_行混合並研磨分 散’從而得到環氧樹脂複合材料‘》 .f & 本實施例中’採用三滚筒式研磨分散機對所述之端叛基 聚合物改性環氧樹脂、奈米碳管分散體、溶劑、硬化劑 、催化劑及消泡劑進行研磨分散。將上述《基聚合物 改性環氧顧、奈米碳管分韻、溶劑、硬化劑、催化 劑及消泡難照上述各自之含量投人於三滾筒式研磨分 散機中，啟動三㈣式研磨分散機以進行研磨分散，從 而使得上述各組成中固體成份均勻分散於液體成分中， 從而形成分散均句之環氧樹脂複外料。本實施例中， 於上述各成分中’職基聚合物改性之環氧樹脂之重量 099129184 表單編號A0101 第9頁/共21頁 0992051207-0 201209126 百分含量約為60. 3%，奈米碳管之重量百分含量約為 7. 8 %，無機分散材料之重量百分含量約為0. 6 %，硬化劑 之重量百分含量約為4. 5%、催化劑之重量百分含量約為 0. 65%，溶劑之重量百分含量約為24. 3%，消泡劑之重量 百分含量約為1. 85%。 [0029] 為了得到不同表面電阻率之環氧樹脂複合材料，可藉由 改變投料時奈米碳管分散體之用量進行控制。當奈米碳 管佔複合材料之重量百分比為4. 6%至16%之間，環氧樹脂 複合材料表面電阻率變化區間約為十萬歐姆至十歐姆之 間。其中，環氧樹脂複合材料中奈米碳管之含量越大， 環氧樹脂符合材料之表面電阻率越小。 [0030] 藉由所述方法製作之環氧樹脂複合材料，其黏度可達到 700 00厘泊，外觀呈現黑色，微弱反光。於顯微鏡放大 100倍觀測下，無孔洞。並具有良好之附著特性及焊錫特 性，並且能夠耐酸、域及溶劑之腐蝕。溫度為25攝氏度 時，於重量百分含量為10%之鹽酸或重量百分含量為10% 之氫氧化鈉溶液中浸泡0. 5小時，均無剝落現象。於丙酮 中浸泡1 7小時後進行百格附著測試，亦亦無剝落現象。 [0031] 請參閱圖2，第二步，提供絕緣基材層110。 [0032] 絕緣基材層110為一層絕緣基材膜，其可由聚醯亞胺（PI) 製成。絕緣基材層110之厚度為10微米至50微米。絕緣基 材層110具有相對之第一表面111及第二表面112。 [0033] 請參閱圖3，第三步，將所述環氧樹脂複合材料塗佈於絕 緣基材層110之第一表面111，以形成環氧樹脂複合材料 099129184 表單編號A0101 第10頁/共21頁 0992051207-0 201209126 層 120 〇 [0034] Ο [0035] [0036] [0037][0023] First, an epoxy resin is modified with a terminal carboxyl group polymer to obtain a terminal carboxyl group-modified epoxy resin. [0024] The terminal carboxyl polymer and the epoxy resin are placed together in a reaction vessel, and the reaction temperature is maintained at 120, and the reaction is carried out under stirring for about 3 hours, thereby obtaining a terminal carboxyl polymer modified climbing. Epoxy resin. In this embodiment, the epoxy resin used is a 酴-type epoxy resin having an epoxy equivalent of 188. The terminal carboxyl group polymer used may be liquid polybutadiene (CTBN), and the epoxy resin equivalent of the modified epoxy resin obtained after the reaction is 337. After the above reaction, an epoxy group at the terminal of the epoxy resin is bonded to a carboxyl group at the terminal of the terminal polymer group, and one molecule of water is removed to obtain an ester group. Thus, the modified epoxy resin has good flexibility compared to the epoxy resin which is not modified. Of course, the epoxy resin used is not limited to the bisphenol A type epoxy resin sausage provided in the present embodiment, and it may also be other types of epoxy resin. The terminal carboxyl group used 099129184 Form No. A0101 Page 8 of 21 °"2〇512〇7.〇201209126 [0025] [0026] [0028] [0028] 〇 is also not limited to this embodiment The liquid polybutadiene acrylonitrile provided may also be a polymer such as a terminal carboxyl polyester. Then, the carbon nanotubes were uniformly dispersed in the inorganic dispersion material to form a dispersion-dispersed carbon nanotube dispersion. The carbon nanotubes are physically dispersed in the inorganic dispersion material. The inorganic/7-dispersed material may be a layered nano-clay or a nano-mica powder. In this embodiment, the inorganic dispersion material selected is a layered nano-clay. The carbon nanotubes and the layered nano-clay having a weight ratio of 8 to 12 to 1 are disposed and mixed by stirring or shaking, so that the carbon nanotubes are uniformly dispersed in the layered nano-clay. The layered nano-adhesive used may be 2: strontium sulphate, which may specifically be smectite, short magnesium or stone, saponite, and the like. The carbon nanotubes used may be single-walled carbon nanotubes or multi-nano carbon nanotubes. Finally, the epoxy resin, the carbon nanotube dispersion, the solvent, the hardener, the catalytic defoaming, and the dispersion of the carboxyl group-modified polymer are mixed and ground to obtain an epoxy resin composite material. 'f & In the embodiment, the end-retinating polymer-modified epoxy resin, the carbon nanotube dispersion, the solvent, the hardener, the catalyst, and the antifoaming agent are ground and dispersed by a three-roll type grinding and dispersing machine. The above-mentioned "based polymer modified epoxy, nano carbon tube rhyme, solvent, hardener, catalyst and defoaming difficult to take the above content into the three-roller type grinding disperser, start three (four) type grinding The disperser is subjected to grinding and dispersing so that the solid components in the above respective compositions are uniformly dispersed in the liquid component, thereby forming an epoxy resin composite material which is dispersed in a uniform sentence. In this embodiment, the weight of the epoxy resin modified by the above-mentioned components is 099129184. Form No. A0101 Page 9 / 21 pages 0992051207-0 201209126 The percentage is about 60.3%, nanometer. The 5% by weight of the catalyst is about 5% by weight of the catalyst. The weight percentage of the hardener is about 6.5 %. 85%。 The weight percentage of the defoamer is about 1. 85%. [0029] In order to obtain an epoxy resin composite having different surface resistivities, it can be controlled by changing the amount of the carbon nanotube dispersion at the time of charging. When the weight ratio of the carbon nanotubes to the composite material is between 4.6% and 16%, the surface resistivity of the epoxy resin composite varies between about 100,000 ohms and ten ohms. Among them, the larger the content of the carbon nanotubes in the epoxy resin composite material, the smaller the surface resistivity of the epoxy resin conforming to the material. [0030] The epoxy resin composite material produced by the method has a viscosity of 70000 cps, and the appearance is black and slightly reflective. Under the microscope magnification of 100 times, there is no hole. It has good adhesion properties and solder properties, and is resistant to acid, domain and solvent corrosion. 5小时,不脱落。 When the temperature was 25 ° C, soaked in a 10% by weight of hydrochloric acid or 10% by weight of sodium hydroxide solution soaked for 0.5 hours, no peeling phenomenon. After immersing in acetone for 17 hours, the adhesion test was carried out without peeling. [0031] Referring to FIG. 2, the second step, an insulating substrate layer 110 is provided. [0032] The insulating substrate layer 110 is a layer of an insulating substrate film which can be made of polyimide (PI). The insulating substrate layer 110 has a thickness of from 10 micrometers to 50 micrometers. The insulating substrate layer 110 has opposing first and second surfaces 111, 112. Referring to FIG. 3, the third step, the epoxy resin composite material is coated on the first surface 111 of the insulating substrate layer 110 to form an epoxy resin composite material 099129184 Form No. A0101 Page 10 / Total Page 21 0992051207-0 201209126 Layer 120 〇 [0034] Ο [0036] [0037]
[0038] 本實施例中，採用狹缝式塗佈機將液態之環氧樹脂複合 材料塗佈於絕緣基材層110之第一表面111，以形成環氧 樹脂複合材料層120。本實施例中由於採用狹縫式塗佈機 進行塗佈，可控制形成之環氧樹脂複合材料層120之厚度 滿足要求並且塗層均勻。本實施例中，形成之環氧樹脂 複合材料層120之厚度為2微米至20微米，優選為3至10 微米。環氧樹脂複合材料層120具有遠離絕緣基材層110 之第三表面121。 第四步，對絕緣基材層110塗佈形成之環氧樹脂複合材料 層120進行處理，以使得環氧樹脂複合材料層120固化。 本實施例中，環氧樹脂複合材料層120固化採用之方法為 預烘烤及熟化處理。 於對環氧樹脂複合材料層120進行預烘烤之持續之時間約 為15分鐘，預烘烤時保持之溫度約為80攝氏度。藉由進 行預烘烤處理，使得環氧樹脂複合材料層120中之溶劑揮 發。 於對環氧樹脂複合材料層120進行熟化處理時，熟化處理 時保持之溫度約為150攝氏度，持續之時間約為30分鐘。 藉由熟化處理後，使得環氧樹脂複合材料層120中之端羧 基聚合物改性之環氧樹脂、無機分散材料、硬化劑、催 化劑及消泡劑等之間發生反應，使得環氧樹脂複合材料 層120形成固態之膜狀結構。可理解之是，進行預烘烤及 熟化之持續時間及溫度可根據實際之環氧樹脂複合材料 099129184 表單編號Α0101 第11頁/共21頁 0992051207-0 201209126 層120之厚度進行確定，當環氧樹脂複合材料層120厚度 較大時，可將處理之時間適當延長或溫度適當調高，而 當環氧樹脂複合材料層120厚度較小時，可將處理之時間 適當縮短或溫度適當降低，以保證環氧樹脂複合材料層 120能夠形成固態膜狀結構。 [0039] 請參閱圖4，第五步，提供金屬層140。 [0040] 本實施例中，金屬層140為銅箔，其厚度約為10微米至25 微米。金屬層140具第三表面141。 [0041] 請參閱圖5，第六步，於金屬層140之第三表面141塗佈上 形成膠層130。 [0042] 本實施例中，採用狹縫式塗佈機將液態之膠層材料塗佈 於金屬層140之第三表面141。採用之液態膠層材料為熱 固性環氧樹脂膠，控制形成之膠層130之厚度為8至15微 米。 [0043] 於塗佈形成膠層130之後，還可進一步包括對形成之膠層 130進行烘烤之步驟，使得形成之膠層130半固化狀態， 以方便存儲及應用。本實施例中，對形成之膠層130進行 烘烤之時間為15分鐘，烘烤持續之時間為80攝氏度。 [0044] 請參閱圖1，第七步，壓合表面形成有環氧樹脂複合材料 層120之絕緣基材層110及表面形成有膠層130之金屬層 140，並使得膠層130接觸黏結環氧樹脂複合材料層120 〇 [0045] 本實施例中，壓合時控制之溫度為100攝氏度，壓合之速 099129184 表單編號A0101 第12頁/共21頁 0992051207-0 201209126 [0046] [0047] Ο [0048] Ο 率為2米每分鐘’屋合時之壓力為4至25千克力每平方复 米。藉由壓合之後，使得絕緣基材層UG、環氧樹人 材料層12〇、膠層13〇及金屬層⑽成為一個整體。曰。 第八步’對膠層13()進行熟化處理，使得勝層咖固化。 本實施例中’進行熟化處理之溫度為180攝氏度，熟化處 理之時間為6G分鐘。經過熟化處理，使得半固化之膝層 130固化’並且’由於膠層13〇之材料中具有環氧樹脂， 具有環氧基官能圏，環氧樹脂複合材料層12G亦亦具有環 氧基官能團，於環氧樹雕複合材料層幽及膠層13〇相互 接觸之表面’環氧樹脂複合材料層巧之材料及勝層13〇 材料之間發i化學反應，從錢得環⑽脂複合材料層 120及膠層13〇之間之結合力增強。， 本技術方案提供之電路板基板，其中間設置有環氧樹脂 複合材料層，所述環氧樹脂複合材料層中具有分散均句 之奈米碳管而具有電磁遮罩作用，當所述;電路板基板用 於製作多層電路板時，所述環氧樹脂複合材料層能夠起 到電磁遮罩作用，並能夠防止》導電妹路之間之離子遷移 問題。並且，環氧樹脂複合材料層具有良好之柔韌性， 相較於不銹鋼片，能夠增加柔性電路板之撓折性能，並 且可降低電路板之生產成本。本技術方案提供之電路板 基板之製作方法，能夠方便地製作所述電路板基板。 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 099129184 表單編號A0101 第13頁/共21頁 0992051207-0 [0049] 201209126 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0050] 圖1係本技術方案實施方式提供之電路板基板之剖視圖。 [0051] 圖2係本技術方案實施例提供之絕緣基材之剖視圖。 [0052] 圖3係本技術方案實施例提供之於絕緣基材表面形成環氧 樹脂複合材料層後之剖視圖。 [0053] 圖4係本技術方案實施例提供之金屬層之剖視圖。 [0054] 圖5係本技術方案實施例提供之金屬層上膠層後之剖視圖 〇 【主要元件符號說明】 [0055] 電路板基板：100 [0056] 絕緣基材層：110 [0057] 第一表面：111 [0058] 第二表面：112 [0059] 環氧樹脂複合材料層：120 [0060] 膠層：130 [0061] 金屬層：140 [0062] 第三表面：141 099129184 表單編號A0101 第14頁/共21頁 0992051207-0In the present embodiment, a liquid epoxy resin composite material is applied to the first surface 111 of the insulating base material layer 110 by a slit coater to form an epoxy resin composite material layer 120. In the present embodiment, since the coating by the slit coater is applied, the thickness of the formed epoxy resin composite material layer 120 can be controlled to be satisfactory and the coating layer is uniform. In the present embodiment, the epoxy resin composite layer 120 is formed to have a thickness of from 2 μm to 20 μm, preferably from 3 to 10 μm. The epoxy composite layer 120 has a third surface 121 that is remote from the insulating substrate layer 110. In the fourth step, the epoxy resin composite material layer 120 formed by coating the insulating base material layer 110 is treated to cure the epoxy resin composite material layer 120. In this embodiment, the epoxy resin composite material layer 120 is cured by pre-baking and curing. The duration of prebaking of the epoxy resin composite layer 120 is about 15 minutes, and the temperature maintained during prebaking is about 80 degrees Celsius. The solvent in the epoxy resin composite layer 120 is volatilized by the prebaking treatment. When the epoxy resin composite layer 120 is aged, the temperature maintained during the curing treatment is about 150 degrees Celsius for a period of about 30 minutes. After the aging treatment, the epoxy resin, the inorganic dispersion material, the hardener, the catalyst, the antifoaming agent and the like which are modified by the terminal carboxyl group in the epoxy resin composite layer 120 are reacted to form an epoxy resin composite. The material layer 120 forms a solid film structure. It can be understood that the duration and temperature of the prebaking and aging can be determined according to the thickness of the actual epoxy resin composite material 099129184 Form No. 1010101 Page 11 / 21 page 0992051207-0 201209126 layer 120 When the thickness of the resin composite material layer 120 is large, the processing time may be appropriately extended or the temperature may be appropriately increased. When the thickness of the epoxy resin composite material layer 120 is small, the processing time may be appropriately shortened or the temperature may be appropriately lowered. It is ensured that the epoxy resin composite layer 120 can form a solid film structure. [0039] Referring to FIG. 4, the fifth step, a metal layer 140 is provided. [0040] In this embodiment, the metal layer 140 is a copper foil having a thickness of about 10 micrometers to 25 micrometers. The metal layer 140 has a third surface 141. Referring to FIG. 5, the sixth step, a third layer 141 of the metal layer 140 is coated to form a glue layer 130. [0042] In this embodiment, a liquid glue layer material is applied to the third surface 141 of the metal layer 140 by a slit coater. The liquid adhesive layer material used is a thermosetting epoxy resin, and the thickness of the adhesive layer 130 formed is 8 to 15 micrometers. [0043] After the coating layer 130 is formed, the step of baking the formed glue layer 130 may be further included, so that the formed glue layer 130 is semi-cured to facilitate storage and application. In this embodiment, the formed adhesive layer 130 is baked for 15 minutes, and the baking is continued for 80 degrees Celsius. Referring to FIG. 1, the seventh step, the insulating substrate layer 110 on which the epoxy resin composite material layer 120 is formed on the pressing surface and the metal layer 140 on the surface of which the adhesive layer 130 is formed, and the adhesive layer 130 is in contact with the bonding ring. Oxygen Resin Composite Layer 120 00 [0045] In this embodiment, the temperature controlled during pressing is 100 degrees Celsius, and the speed of pressing is 099129184. Form No. A0101 Page 12 / Total 21 Page 0992051207-0 201209126 [0047] Ο [0048] The Ο rate is 2 meters per minute. The pressure at the time of the house is 4 to 25 kilograms per square meter. After the pressing, the insulating substrate layer UG, the epoxy resin material layer 12, the adhesive layer 13 and the metal layer (10) are integrated. Hey. In the eighth step, the adhesive layer 13 () is aged to cure the layer. In the present embodiment, the temperature at which the aging treatment was carried out was 180 ° C, and the aging treatment time was 6 G minutes. After the aging treatment, the semi-cured knee layer 130 is cured 'and' because the epoxy layer 13 〇 has an epoxy resin and has an epoxy functional enthalpy, and the epoxy resin composite layer 12G also has an epoxy functional group. On the surface of the epoxy tree-carved composite layer and the surface of the adhesive layer 13〇, the epoxy resin composite material layer material and the triumphant layer 13〇 material are chemically reacted from the Qiande ring (10) lipid composite layer. The bonding force between 120 and the rubber layer 13〇 is enhanced. The circuit board substrate provided by the technical solution is provided with an epoxy resin composite material layer, wherein the epoxy resin composite material layer has a carbon nanotube dispersed in a uniform sentence and has an electromagnetic shielding effect; When the circuit board substrate is used to fabricate a multilayer circuit board, the epoxy resin composite material layer can function as an electromagnetic mask and can prevent the ion migration problem between the conductive paths. Moreover, the epoxy resin composite layer has good flexibility, and the flexural performance of the flexible circuit board can be increased compared with the stainless steel sheet, and the production cost of the circuit board can be reduced. The method for fabricating a circuit board substrate provided by the present technical solution can facilitate the fabrication of the circuit board substrate. In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. The equivalent modifications or variations made by those skilled in the art in the spirit of the present invention are intended to be included in the scope of the following claims. FIG. BRIEF DESCRIPTION OF THE DRAWINGS [0050] FIG. 1 is a cross-sectional view of a circuit board substrate provided by an embodiment of the present technical solution. 2 is a cross-sectional view of an insulating substrate provided by an embodiment of the present technical solution. 3 is a cross-sectional view showing the formation of an epoxy resin composite material layer on the surface of an insulating substrate provided by an embodiment of the present technical solution. 4 is a cross-sectional view of a metal layer provided by an embodiment of the present technical solution. 5 is a cross-sectional view of a metal layer sizing layer provided by an embodiment of the present invention. [Main component symbol description] [0055] Circuit board substrate: 100 [0056] Insulating substrate layer: 110 [0057] Surface: 111 [0058] Second surface: 112 [0059] Epoxy composite layer: 120 [0060] Sublayer: 130 [0061] Metal layer: 140 [0062] Third surface: 141 099129184 Form No. A0101 No. 14 Page / Total 21 pages 0992051207-0