TWI406925B - Printed circuit board subatrate and method for manufacturing the same - Google Patents

Abstract

A printed circuit board includes a first metal layer, a first adhesive layer, a first epoxy resin composite material layer, an insulating base layer, a second epoxy resin composite material layer, a second adhesive layer, and a second metal layer. The epoxy resin composite material layer consists of an epoxy resin composite material. The epoxy resin composite material includes epoxy resin modified by a carboxyl-terminated polymer, carbon nanotubes, and an inorganic dispersing material. A weight content of the carbon nanotubes in the epoxy resin composite material is in a range from 4.6% to 16%. The present invention also provides a method for manufacturing the printed circuit board substrate.

Description

Circuit board substrate and manufacturing method thereof

The present invention relates to the field of circuit board technology, and in particular, to a circuit board substrate which is applied to a circuit board and has an electromagnetic shielding function and a manufacturing method thereof.

With the advancement of science and technology, printed circuit boards have been widely used in the field of electronics. For application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans On Components, Packaging, and Manufacturing Technology, 1992, 14(4): 418-425.

As the number of circuit board product layers increases, when the circuit board product is actually working, electromagnetic interference is often generated, which affects the signal transmission of the circuit board. Thus, an electromagnetic mask layer needs to be provided in the circuit board product. At present, the electromagnetic shielding layer is usually made of a stainless steel sheet having a small thickness, and the stainless steel sheet is disposed between two copper foil layers adjacent to the circuit board product to function as an electromagnetic mask. However, the weight of the stainless steel sheet is large, thereby increasing the weight of the board product. Moreover, the stainless steel sheet has poor flexibility, and the electromagnetic shielding layer made of stainless steel sheet affects the flexural performance of the flexible circuit board. The price of stainless steel sheets is higher, increasing the production cost of the board.

In view of the above, it is necessary to provide a circuit board substrate that can be applied to a circuit board to function as an electromagnetic mask and a method of manufacturing the same.

A circuit board substrate comprising a first metal layer, a first adhesive layer, a first epoxy composite material layer, an insulating base material layer, a second epoxy resin composite material layer, a second adhesive layer and a second layer which are sequentially stacked Metal layer. The epoxy resin composite material layer is composed of an epoxy resin composite material comprising an epoxy resin modified with a terminal carboxyl group polymer, a carbon nanotube and an inorganic dispersion material, and the carbon nanotube The weight percentage in the epoxy resin composite is 4.6% to 16%.

A method for manufacturing a circuit board substrate, comprising the steps of: preparing an epoxy resin composite material comprising an epoxy resin modified with a carboxyl group polymer, a carbon nanotube, and an inorganic dispersion material, wherein the nano carbon The weight percentage of the epoxy resin composite is 4.6% to 16%; providing an insulating substrate layer having a first surface and a second surface opposite to each other; Applying a resin composite material to the first surface of the insulating substrate layer to form a first epoxy resin composite material layer; applying the epoxy resin composite material to the second surface of the insulating substrate layer to form a second epoxy a resin composite layer; providing a first metal layer and a second metal layer; forming a first adhesive layer on the first metal layer; forming a second adhesive layer on the second metal layer; and stacking and pressing the first metal layer in sequence a first adhesive layer, a first epoxy composite layer, an insulating substrate layer, a second epoxy composite layer, a second adhesive layer, and a second metal layer; and curing the first adhesive layer, first Epoxy resin composite layer, second epoxy a resin composite layer and a second adhesive layer.

Compared with the prior art, the circuit board provided by the technical solution is provided with an epoxy resin composite layer, wherein the epoxy resin composite layer has a uniformly dispersed carbon nanotube and has an electromagnetic shielding effect. When the circuit board substrate is used to fabricate a multilayer circuit board, the epoxy resin composite layer can function as an electromagnetic mask and can prevent ion migration problems between the conductive lines. Moreover, the epoxy resin composite layer has good flexibility, and the flexural performance of the flexible circuit board can be increased compared with the stainless steel sheet, and the production cost of the circuit board can be reduced. The method for fabricating a circuit board substrate provided by the present technical solution can facilitate the fabrication of the circuit board substrate.

The circuit board substrate provided by the technical solution and the manufacturing method thereof will be further described in detail below with reference to the embodiments.

Referring to FIG. 1 , the technical solution provides a circuit board substrate 100 including a first metal layer 110 , a first adhesive layer 120 , a first epoxy composite layer 130 , an insulating substrate layer 140 , and a second layer which are sequentially stacked. The epoxy resin composite layer 150, the second adhesive layer 160, and the second metal layer 170.

The insulating base material layer 140 is used to carry the first epoxy resin composite material layer 130 and the second epoxy resin composite material layer 150 and function as electrical insulation. In this embodiment, the material of the insulating base material layer 140 is polyimide. The thickness of the insulating substrate layer 140 can be set according to actual needs, and the thickness thereof can be 10 micrometers to 50 micrometers, preferably 25 micrometers.

The first adhesive layer 120 is used for bonding the first epoxy resin composite layer 130 and the first metal layer 110, and electrically insulating the first epoxy composite material layer 130 and the first metal layer 110 from each other. In this embodiment, the material used for the first adhesive layer 120 is a thermosetting epoxy resin adhesive. The first adhesive layer 120 has a thickness of about 8 to 20 microns, preferably 17 microns. The second adhesive layer 160 is used to bond the second epoxy composite layer 150 and the second metal layer 170 and electrically insulate the second epoxy composite layer 150 from the second metal layer 170. The material used for the second adhesive layer 160 is also a thermosetting epoxy resin. The second adhesive layer 160 also has a thickness of about 8 to 20 microns, preferably 17 microns.

The first metal layer 110 and the second metal layer 170 are both used to make conductive lines during the fabrication process of the circuit board. In this embodiment, the first metal layer 110 and the second metal layer 170 are both copper foils having a thickness of about 10 micrometers to 25 micrometers, preferably 18 micrometers. The first metal layer 110 and the second metal layer 170 may also be made of other metal materials such as silver or the like.

The first epoxy resin composite layer 130 and the second epoxy resin composite layer 150 are both used to function as an electromagnetic mask. The thickness of the first epoxy resin composite material layer 130 and the second epoxy resin composite material layer 150 can be set according to the actual electromagnetic interference of the mask. The first epoxy resin composite layer 130 and the second epoxy resin composite layer 150 have a thickness of about 2 microns to 8 microns, preferably 3 microns. The thickness of the first epoxy resin composite material layer 130 and the second epoxy resin composite material layer 150 is controlled within this range, and the occurrence of problems such as warpage of the circuit board substrate 100 can be effectively prevented, and the circuit formed can be prevented from being formed. The plate exhibits ion migration during use. The epoxy resin composite material in the first epoxy resin composite material layer 130 and the second epoxy resin composite material layer 150 includes a carboxyl group-modified epoxy resin, a carbon nanotube, an inorganic dispersion material, a hardener, Catalyst, solvent and defoamer.

The epoxy resin modified by the terminal carboxyl group is a product obtained by copolymerization of an epoxy resin and a terminal carboxyl group polymer, that is, an epoxy group at the terminal of the epoxy resin reacts with a carboxyl group at the terminal end of the terminal carboxyl polymer. An ester group is formed to obtain a polymer having repeating units including alternating epoxy repeating units and terminal carboxyl groups. Wherein, the epoxy resin may be a bisphenol A type epoxy resin, and the terminal carboxyl group polymer may be a liquid polybutadiene acrylonitrile (CTBN). In the present embodiment, the epoxy resin used in the epoxy resin has an epoxy equivalent of from 180 to 195, preferably 188, and the epoxy resin modified by the carboxyl polymer has an oxygen equivalent weight of from 323 to 352, preferably 337. . The weight percent of the carboxyl terminated polymer modified epoxy resin in the epoxy resin composite is from about 55% to about 65%, preferably about 60%.

As a conductive material, the carbon nanotubes are uniformly dispersed in the epoxy resin modified with the terminal carboxyl group to function as an electromagnetic mask. The carbon nanotubes account for 4.6% to 16% by weight of the composite. The content of the carbon nanotubes in the composite material can be determined according to the actual needs of the electrical conductivity of the composite material. The more the content of the carbon nanotubes in the epoxy resin composite material, the smaller the electric resistance of the epoxy resin composite material, and the smaller the content of the carbon nanotubes in the composite material, the greater the electrical resistance of the epoxy resin composite material.

The inorganic dispersion material is used to disperse the carbon nanotubes so that the carbon nanotubes can be uniformly distributed in the epoxy resin composite. The inorganic dispersion material is nano clay or nano mica powder. The nano clay is a 2:1 page citrate, which may specifically be montmorillonite (Molecular formula M _x (Al _4-x Mg _x )Si ₈ O ₂₀ (OH) ₄ ), lithium montmorillonite Stone (Hectorite, molecular formula M _x (Mg _6-x Li _x )Si ₈ O ₂₀ (OH) ₄ ) or saponite (Molecular formula M _x Mg ₆ (Si _8-x Al _x )O ₂₀ (OH) ₄ ) Wait. Wherein, the weight ratio of the carbon nanotubes to the inorganic dispersion material is 8 to 1 to 12 to 1.

The hardener is used to harden the composite. In the present embodiment, the hardener used is dicyandiamine, and the hardener is about 5% by weight of the epoxy resin composite. The amount of the hardener should correspond to the epoxy resin modified with the terminal carboxyl group polymer, wherein the weight ratio of the terminal carboxyl polymer modified epoxy resin to the hardener is about 13 to 1 to 14 to 1.

The catalyst is 2-undecylimidazole, and the content of the catalyst corresponds to the content of the epoxy resin modified by the terminal carboxyl group. The catalyst is present in the epoxy resin composite in an amount of from about 0.5% to about 1% by weight, preferably about 0.65% by weight. The solvent is Diethylene glycol monoethyl ether acetate, and the solvent is contained in the epoxy resin composite in an amount of about 20% to 25%, preferably 24%. This solvent is used to dissolve the other components described above to form a homogeneous liquid dispersion. The antifoaming agent is used to eliminate the foam in the above epoxy resin composite material, and the defoaming agent is about 2% by weight in the epoxy resin composite material. The antifoaming agent may be a 2183H antifoaming agent produced by the commercially available Taiwan Yuzheng Company.

Preferably, in the epoxy resin composite, the weight percentage of the epoxy resin modified with the terminal carboxyl group is about 60.3%, the weight percentage of the carbon nanotube is about 7.8%, and the weight of the inorganic dispersion material. The percentage is about 0.6%, the weight percentage of the hardener is about 4.5%, the weight percentage of the catalyst is about 0.65%, the weight percentage of the solvent is about 24.3%, and the weight percentage of the antifoaming agent. It is about 1.85%.

The technical solution also provides a manufacturing method of the circuit board substrate 100. The manufacturing method of the circuit board substrate 100 includes the following steps:

The first step is to make an epoxy resin composite.

The epoxy resin composite material in this embodiment can be produced by the following method:

First, the epoxy resin is modified with a terminal carboxyl group polymer to obtain an epoxy resin modified with a terminal carboxyl group polymer.

The terminal carboxyl group polymer and the epoxy resin were placed together in a reaction vessel, and the reaction temperature was maintained at 120 ° C, and the reaction was carried out for about 3 hours under stirring to obtain a terminal carboxyl group-modified epoxy resin. In the present embodiment, the epoxy resin used is a bisphenol A type epoxy resin having an epoxy equivalent of 188. The terminal carboxyl group polymer used may be liquid polybutadiene acrylonitrile (CTBN), and the epoxy resin equivalent of the modified epoxy resin obtained after the reaction is 337. After the above reaction, one epoxy group at the end of the epoxy resin is bonded to one carboxyl group at the terminal of the terminal carboxyl group polymer, and one molecule of water is removed to obtain an ester group. Thus, the modified epoxy resin has good flexibility compared to the epoxy resin which has not been modified. Of course, the epoxy resin used is not limited to the bisphenol A type epoxy resin provided in the embodiment, and may be other types of epoxy resins. The terminal carboxyl group used is not limited to the liquid polybutadiene acrylonitrile provided in the present embodiment, and may be a polymer such as a terminal carboxyl group.

Then, the carbon nanotubes were uniformly dispersed in the inorganic dispersion material to form a uniformly dispersed carbon nanotube dispersion.

The carbon nanotubes are physically dispersed in the inorganic dispersion material. The inorganic dispersion material may be a layered nano clay or a nano mica powder. In this embodiment, the inorganic dispersion material selected is a layered nano clay. The carbon nanotubes and the layered nano-clay having a weight ratio of 8 to 12 to 1 are disposed and mixed by stirring or shaking, so that the carbon nanotubes are uniformly dispersed in the layered nano-clay. The layered nano-clay used may be a 2:1 page citrate, which may specifically be smectite, hectorite or saponite. The carbon nanotubes used may be single-walled carbon nanotubes or multi-walled carbon nanotubes.

Finally, the epoxy resin composite modified epoxy resin, carbon nanotube dispersion, solvent, hardener, catalyst and antifoaming agent are mixed and ground to obtain an epoxy resin composite material.

In this embodiment, the terminal carboxyl polymer-modified epoxy resin, the carbon nanotube dispersion, the solvent, the hardener, the catalyst, and the antifoaming agent are ground and dispersed by a three-roller type grinding and dispersing machine. The above-mentioned terminal carboxyl polymer-modified epoxy resin, carbon nanotube dispersion, solvent, hardener, catalyst, and antifoaming agent are put into a three-roll type grinding and dispersing machine according to the respective contents described above, and three-roller type grinding and dispersing is started. The machine is subjected to grinding and dispersion so that the solid components in the above respective compositions are uniformly dispersed in the liquid component, thereby forming a uniformly dispersed epoxy resin composite material. In the present embodiment, among the above components, the weight percentage of the epoxy resin modified with the terminal carboxyl group is about 60.3%, the weight percentage of the carbon nanotube is about 7.8%, and the weight of the inorganic dispersion material. The percentage is about 0.6%, the weight percentage of the hardener is about 4.5%, the weight percentage of the catalyst is about 0.65%, the weight percentage of the solvent is about 24.3%, and the weight percentage of the antifoaming agent. It is about 1.85%.

In order to obtain an epoxy resin composite material having different surface resistivities, it can be controlled by changing the amount of the carbon nanotube dispersion at the time of charging. When the carbon nanotubes account for 4.6% to 16% by weight of the composite material, the surface resistivity of the epoxy resin composite varies between about 100,000 ohms and ten ohms. Among them, the larger the content of the carbon nanotubes in the epoxy resin composite material, the smaller the surface resistivity of the epoxy resin conforming to the material.

The epoxy resin composite material produced by the method has a viscosity of up to 70,000 cps, and the appearance is black and slightly reflective. Under the microscope magnification of 100 times, there is no hole. It has good adhesion properties and soldering properties, and is resistant to acid, hydrazine and solvent corrosion. When the temperature was 25 ° C, it was immersed in a 10% by weight hydrochloric acid solution or a 10% by weight sodium hydroxide solution for 0.5 hour, and there was no peeling phenomenon. After immersing in acetone for 17 hours, the adhesion test was carried out without peeling.

Referring to FIG. 2, the second step provides an insulating substrate layer 140.

The insulating substrate layer 140 is a layer of an insulating substrate film which can be made of polyimide. The insulating substrate layer 140 has a thickness of from 10 micrometers to 50 micrometers. The insulating substrate layer 140 has a first surface 141 and a second surface 142 opposite to each other.

Referring to FIG. 3, in the third step, the epoxy resin composite material is coated on the first surface 141 of the insulating substrate layer 140 to form the first epoxy resin composite material layer 130.

In this embodiment, a liquid epoxy resin composite material is applied to the first surface 141 of the insulating base material layer 140 by a slit coater to form a first epoxy resin composite material layer 130. In the present embodiment, since the coating is performed by the slit coater, the thickness of the formed first epoxy resin composite material layer 130 can be controlled to be satisfactory and the coating layer is uniform. In this embodiment, the first epoxy resin composite material layer 130 is formed to have a thickness of 2 to 20 μm, preferably 3 to 10 μm. The first epoxy composite layer 130 has a third surface 131 that is remote from the insulating substrate layer 140.

In the fourth step, the first epoxy resin composite layer 130 is treated to semi-cure the first epoxy resin composite layer 130.

In this embodiment, the first epoxy resin composite material layer 130 is cured by a prebaking treatment. The duration of prebaking of the first epoxy resin composite layer 130 is about 15 minutes, and the temperature maintained during prebaking is about 80 degrees Celsius. By performing the prebaking treatment, a part of the solvent in the first epoxy resin composite material layer 130 is volatilized, so that the first epoxy resin composite material layer 130 is in a semi-cured state.

Referring to FIG. 4 and FIG. 5, a second epoxy resin composite layer 150 is formed on the second surface 142 of the insulating substrate layer 140.

In this embodiment, the second epoxy resin composite layer 150 is also formed by coating by a slit coater. The second epoxy resin composite layer 150 has a thickness of from 2 micrometers to 20 micrometers, preferably from 3 to 10 micrometers. The second epoxy composite layer 150 has a fourth surface 151 that is remote from the insulating substrate layer 140.

In the sixth step, the second epoxy resin composite layer 150 is treated to semi-cure the second epoxy resin composite layer 150.

In this embodiment, the second epoxy resin composite material layer 150 is cured by a prebaking treatment. The duration of prebaking of the second epoxy resin composite layer 150 is about 15 minutes, and the temperature maintained during prebaking is about 80 degrees Celsius. By performing the prebaking treatment, a part of the solvent in the second epoxy resin composite layer 150 is volatilized, so that the second epoxy resin composite material layer 150 is in a semi-cured state.

Referring to FIG. 5, the seventh step, the first metal layer 110 and the second metal layer 170 are provided.

In this embodiment, the first metal layer 110 and the second metal layer 170 are both copper foils having a thickness of about 10 micrometers to 25 micrometers. The first metal layer 110 has a fifth surface 111 and the second metal layer 170 has a sixth surface 171.

Referring to FIG. 6 and the eighth step, a first adhesive layer 120 is formed on the sixth surface 171 of the first metal layer 110, and a second adhesive layer 160 is formed on the sixth surface 171 of the second metal layer 170. .

In this embodiment, the liquid glue layer material is applied to the fifth surface 111 of the first metal layer 110 and the sixth surface 171 of the second metal layer 170 by a slit coater. The liquid adhesive layer material used is a thermosetting epoxy resin glue, and the thickness of the first adhesive layer 120 and the thickness of the second adhesive layer 160 are both controlled to be 8 to 15 micrometers.

After the first adhesive layer 120 and the second adhesive layer 160 are formed by coating, the step of baking the first adhesive layer 120 and the second adhesive layer 160 may be further included, so that the first adhesive layer 120 is formed and The second adhesive layer 160 is semi-cured to facilitate storage and application. In this embodiment, the first adhesive layer 120 and the second adhesive layer 160 are baked for 15 minutes, and the baking duration is 80 degrees Celsius.

Referring to FIG. 7, the ninth step, the first metal layer 110, the first adhesive layer 120, the first epoxy resin composite layer 130, the insulating base material layer 140, and the second epoxy resin composite are sequentially stacked and pressed. The material layer 150, the second adhesive layer 160, and the second metal layer 170 are obtained to obtain the circuit board substrate 100.

In this embodiment, the first metal layer 110, the first adhesive layer 120, the first epoxy resin composite material layer 130, the insulating base material layer 140, and the second epoxy resin composite material layer 150 are pressed by a roller. The second adhesive layer 160 and the second metal layer 170 are pressed together, and the temperature controlled at the time of pressing is 100 degrees Celsius, the pressing rate is 1 meter per minute, and the pressure at the time of pressing is 4 to 25 kilograms per square centimeter. . After pressing, the first metal layer 110, the first adhesive layer 120, the first epoxy resin composite material layer 130, the insulating base material layer 140, the second epoxy resin composite material layer 150, and the second adhesive layer are caused. 160 and the second metal layer 170 are integrated.

In the tenth step, the first adhesive layer 120, the first epoxy resin composite material layer 130, the second epoxy resin composite material layer 150, and the second adhesive layer 160 are cured.

In this embodiment, the first adhesive layer 120, the first epoxy resin composite material layer 130, the second epoxy resin composite material layer 150, and the second adhesive layer 160 are cured by a curing treatment. When the aging treatment was carried out, the temperature of the aging treatment was 180 degrees Celsius, and the aging treatment time was 60 minutes. After the aging treatment, the semi-cured first adhesive layer 120, the first epoxy resin composite material layer 130, the second epoxy resin composite material layer 150, and the second adhesive layer 160 are cured, and, due to the first adhesive layer 120 and The second adhesive layer 160 has an epoxy resin having an epoxy functional group, and the first epoxy composite layer 130 and the second epoxy composite layer 150 also have an epoxy functional group, and the first epoxy The surface of the resin composite material layer 130 and the first adhesive layer 120 contacting each other, the surface of the second epoxy resin composite material layer 150 and the second adhesive layer 160 contacting each other, and the material and the adhesive layer in each epoxy resin composite material layer A chemical reaction takes place between the materials, so that the adjacent epoxy resin composite layer and the glue layer are integrated. And the first adhesive layer 120, the first epoxy resin composite material layer 130, the second epoxy resin composite material layer 150, and the second adhesive layer 160 all have a higher viscosity, and after being cured, they are bonded and adjacent thereto. The substrate layer 140, the first metal layer 110, or the second metal layer 170 are insulated to obtain the circuit board substrate 100.

The circuit board substrate provided by the technical solution is provided with an epoxy resin composite material layer, wherein the epoxy resin composite material layer has a uniformly dispersed carbon nanotube tube and has an electromagnetic shielding function, when the circuit board substrate When used to fabricate a multilayer circuit board, the epoxy resin composite layer can function as an electromagnetic mask and can prevent ion migration problems between conductive lines. Moreover, the epoxy resin composite layer has good flexibility, which can increase the flexural performance of the flexible circuit board and reduce the production cost of the circuit board compared to the stainless steel sheet in the prior art. The method for fabricating a circuit board substrate provided by the present technical solution can facilitate the fabrication of the circuit board substrate.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Circuit board

110‧‧‧First metal layer

111‧‧‧ fifth surface

120‧‧‧First layer

130‧‧‧First epoxy resin composite layer

131‧‧‧ third surface

140‧‧‧Insulated substrate layer

141‧‧‧ first surface

142‧‧‧ second surface

150‧‧‧Second epoxy composite layer

151‧‧‧ fourth surface

160‧‧‧Second layer

170‧‧‧Second metal layer

171‧‧‧ sixth surface

1 is a cross-sectional view of a circuit board substrate provided by an embodiment of the present technical solution.

2 is a cross-sectional view of an insulating substrate provided by an embodiment of the present technical solution.

3 is a cross-sectional view showing a first epoxy resin composite layer formed on a first surface of an insulating substrate provided by an embodiment of the present technical solution.

4 is a cross-sectional view showing a second epoxy resin composite layer formed on a second surface of an insulating substrate according to an embodiment of the present technical solution.

FIG. 5 is a cross-sectional view of a first metal layer and a second metal layer provided by an embodiment of the present technical solution.

6 is a cross-sectional view showing a first adhesive layer formed on a first metal layer and a second adhesive layer formed on a second metal layer provided in an embodiment of the present technical solution.

7 is a stack of a first metal layer, a first adhesive layer, a first epoxy composite material layer, an insulating base material layer, a second epoxy resin composite material layer, a second adhesive layer, and the like according to an embodiment of the present technical solution. Schematic diagram of the second metal layer.

100‧‧‧Circuit board

110‧‧‧First metal layer

120‧‧‧First layer

130‧‧‧First epoxy resin composite layer

140‧‧‧Insulated substrate layer

150‧‧‧Second epoxy composite layer

160‧‧‧Second layer

170‧‧‧Second metal layer

Claims (11)

A circuit board substrate comprising a first metal layer, a first adhesive layer, a first epoxy composite material layer, an insulating base material layer, a second epoxy resin composite material layer, a second adhesive layer and a second layer which are sequentially stacked a metal layer, the epoxy resin composite material layer is composed of an epoxy resin composite material comprising an epoxy resin modified with a carboxyl group polymer, a carbon nanotube and an inorganic dispersion material, and the nano layer The carbon nanotubes account for 4.6% to 16% by weight of the epoxy resin composite. The circuit board substrate according to claim 1, wherein the terminal carboxyl group-modified epoxy resin is a liquid polybutadiene acrylonitrile modified bisphenol A type epoxy resin. The circuit board substrate of claim 1, wherein the terminal carboxyl polymer-modified epoxy resin is in a weight percentage of 55% to 65% in the epoxy resin composite material. The circuit board substrate according to claim 1, wherein the inorganic dispersion material is nano clay or nano mica powder. The circuit board substrate of claim 1, wherein the weight ratio of the carbon nanotube to the inorganic dispersion material is 8 to 12 to 1. The circuit board substrate of claim 1, wherein the epoxy resin composite material further comprises a hardener, a solvent, a catalyst, and an antifoaming agent, the hardener being dicyandiamide, the solvent It is diethylene glycol monoethyl ether acetate, and the catalyst is 2-undecylimidazole. The circuit board substrate of claim 1, wherein the epoxy resin composite layer has a thickness of from 2 micrometers to 8 micrometers. A method for manufacturing a circuit board substrate, comprising the steps of:
Making an epoxy resin composite material comprising an epoxy resin modified with a terminal carboxyl group polymer, a carbon nanotube, and an inorganic dispersion material, wherein the carbon nanotube is in the epoxy resin composite material The percentage by weight is 4.6% to 16%;
Providing an insulating substrate layer having opposite first and second surfaces;
Applying the epoxy resin composite material to the first surface of the insulating substrate layer to form a first epoxy resin composite material layer;
Applying the epoxy resin composite material to the second surface of the insulating substrate layer to form a second epoxy resin composite material layer;
Providing a first metal layer and a second metal layer;
Forming a first adhesive layer on the first metal layer and forming a second adhesive layer on the second metal layer;
Laiding and pressing the first metal layer, the first adhesive layer, the first epoxy resin composite material layer, the insulating base material layer, the second epoxy resin composite material layer, the second adhesive layer, and the second metal layer; The first adhesive layer, the first epoxy resin composite layer, the second epoxy composite layer, and the second adhesive layer are cured. The method for fabricating a circuit board substrate according to claim 8, wherein the manufacturing the epoxy resin composite material comprises the steps of:
The epoxy resin is modified with a terminal carboxyl group polymer to obtain an epoxy resin modified with a terminal carboxyl group polymer;
Dispersing the carbon nanotubes uniformly in the inorganic dispersion material to obtain a carbon nanotube dispersion; and mixing the epoxy resin modified with the terminal carboxyl group with the carbon nanotube dispersion and grinding and dispersing An epoxy resin composite material is obtained. The method for fabricating a circuit board according to claim 8, wherein the epoxy resin composite is applied to the first surface and the second surface of the insulating substrate layer by a slit coater. The thickness of the first epoxy resin composite layer and the second epoxy resin composite layer are both 2 micrometers to 8 micrometers. The method for fabricating a circuit board according to claim 8, wherein after the coating the first epoxy resin composite layer, the first epoxy resin composite layer is prebaked to make the first a step of semi-curing an epoxy resin composite layer, after coating to form the second epoxy resin composite layer, further comprising pre-baking the second epoxy resin composite material layer to make the second epoxy resin composite material The step of layer semi-curing.