CN102378479A - Circuit board substrate and manufacturing method thereof - Google Patents
Circuit board substrate and manufacturing method thereof Download PDFInfo
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- CN102378479A CN102378479A CN2010102622133A CN201010262213A CN102378479A CN 102378479 A CN102378479 A CN 102378479A CN 2010102622133 A CN2010102622133 A CN 2010102622133A CN 201010262213 A CN201010262213 A CN 201010262213A CN 102378479 A CN102378479 A CN 102378479A
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Abstract
The invention relates to a circuit board substrate, which comprises a first copper foil layer, a first insulating layer, an epoxy resin composite material layer, a second insulating layer and a second copper foil layer which are sequentially stacked, wherein the epoxy resin composite material layer consists of an epoxy resin composite material, the epoxy resin composite material comprises carboxyl end group polymer modified epoxy resin, a carbon nano tube and an inorganic dispersed material, and the mass percentage of the carbon nano tube in the epoxy resin composite material is 4.6-16%. The invention also provides a manufacturing method of the circuit board substrate.
Description
Technical field
The present invention relates to the circuit board technology field, relate in particular to and a kind ofly be applied to board production and have circuit board substrate of electromagnetic shielding action and preparation method thereof.
Background technology
Along with progress of science and technology, the application widely that printed circuit board (PCB) obtains at electronic applications.Application about circuit board sees also document Takahashi, A.Ooki, N.Nagai, A.Akahoshi; H.Mukoh, A.Wajima, M.Res.Lab; High densitymultilayer printed circuit board for HITAC M-880, IEEE Trans.onComponents, Packaging; And Manufacturing Technology, 1992,15 (4): 418-425.
Along with the circuit board product number of plies increases, circuit board product tends to produce the electromagnetic interference phenomenon when real work, influences circuit board signal and transmits.Like this, in circuit board product, electro-magnetic screen layer need be set.At present, the electro-magnetic screen layer of employing adopts the less stainless steel substrates of thickness to make usually, stainless steel substrates is arranged between the two adjacent copper foil layers of circuit board product, thereby plays the effect of electromagnetic shielding.Yet the weight of stainless steel substrates is bigger, thereby has increased the weight of circuit board product.And the flexility of stainless steel substrates is relatively poor, and the electro-magnetic screen layer that adopts stainless steel substrates to make influences the flexible PCB performance of destroying or force to yield.Because the price of stainless steel substrates is higher, increased the production cost of circuit board.
Summary of the invention
Therefore, be necessary to provide a kind of circuit board substrate and preparation method thereof, said circuit board substrate can be applied to circuit board to play electromagnetic shielding action.
Below will a kind of circuit board substrate and preparation method thereof be described with embodiment.
A kind of circuit board substrate, it comprises first copper foil layer, first insulating barrier, epoxy resin composite material layer, second insulating barrier and second copper foil layer that stacks gradually.Said epoxy resin composite material layer is made up of epoxy resin composite material.Said epoxy resin composite material comprises epoxy resin, CNT and the inorganic dispersion of end carboxyl polymer modification, and said CNT shared mass percent in said epoxy resin composite material is 4.6% to 16%.
A kind of manufacture method of circuit board substrate; Comprise step: make epoxy resin composite material; Said epoxy resin composite material comprises epoxy resin, CNT and the inorganic dispersion of end carboxyl polymer modification, and said CNT is 4.6% to 16% in the shared mass percent of said epoxy resin composite material; Adopt said epoxy resin composite material to form the epoxy resin composite material layer, and the said epoxy resin composite material layer of semi-solid preparation; First copper-clad plate that comprises first copper foil layer and first insulating barrier is provided; The epoxy resin composite material layer is arranged at first surface of insulating layer of said first copper-clad plate; Said epoxy resin composite material layer is softened processing; Second copper-clad plate that comprises second copper foil layer and second insulating barrier is provided;
Second copper-clad plate is arranged at the epoxy resin composite material laminar surface, and makes second insulating barrier contact with the epoxy resin composite material layer; And adopt the mode of roller pressing that pressing is carried out in first copper-clad plate, epoxy resin composite material layer and second copper-clad plate, make the epoxy resin composite material layer solidify and bonding first copper-clad plate and second copper-clad plate, thereby obtain circuit board substrate.Than prior art; The circuit board substrate that the present technique scheme provides; Owing between adjacent copper foil layer, be provided with the epoxy resin composite material layer; Have finely dispersed CNT in the said epoxy resin composite material layer and have electromagnetic shielding action, when two copper foil layers of said circuit board substrate were made the formation conducting wire, said epoxy resin composite material layer can play electromagnetic shielding action.And the epoxy resin composite material layer has good pliability, than stainless steel substrates of the prior art, can increase the performance of destroying or force to yield of flexible PCB, and can reduce the production cost of circuit board.The manufacture method of the circuit board substrate that the present technique scheme provides; Only need can realize the curing of epoxy resin composite material layer through the mode of roller pressing; Thereby can carry out maturation process to the epoxy resin composite material layer; Practice thrift the cost of circuit board substrate, improved the production efficiency of circuit board substrate.
Description of drawings
Fig. 1 is the cutaway view of the circuit board substrate that provides of present technique scheme implementation mode.
Fig. 2 is the cutaway view of the release substrate layer that provides of present technique scheme implementation example.
Fig. 3 is the cutaway view after release substrate layer surface forms the epoxy resin composite material layer that present technique scheme implementation example provides.
Fig. 4 is the cutaway view of first copper-clad plate that provides of present technique scheme implementation example.
Fig. 5 is the cutaway view after on first insulating barrier epoxy resin composite material layer being set that present technique scheme implementation example provides.
Fig. 6 is the cutaway view of second copper-clad plate that provides of present technique scheme implementation example.
Fig. 7 be present technique scheme implementation example provide roll extrusion is carried out in first copper-clad plate, epoxy resin composite material layer and second copper-clad plate time sketch map.
The main element symbol description
First copper-clad plate 101
Second copper-clad plate 102
First copper foil layer 110
First insulating barrier 120
Epoxy resin composite material layer 130
Second insulating barrier 140
Second copper foil layer 150
Embodiment
Film with electromagnetic shielding action that the present technique scheme is provided below in conjunction with embodiment and preparation method thereof further specifies.
See also Fig. 1, the present technique scheme provides a kind of circuit board substrate 100, and it comprises first copper foil layer 110 that stacks gradually, first insulating barrier 120, epoxy resin composite material layer 130, second insulating barrier 140 and second copper foil layer 150.
In the present embodiment, first copper foil layer 110 and second copper foil layer 150 are Copper Foil, and the material of first insulating barrier 120 and second insulating barrier 140 is polyimides.Circuit board substrate 100 is by first copper-clad plate 101, the epoxy resin composite material layer 130 that comprise first copper foil layer 110 and first insulating barrier 120 and comprise second copper foil layer 150 and second copper-clad plate 102 of second insulating barrier 140 is formed.It is understandable that the material of first copper foil layer 110 and second copper foil layer 150 can use other metal materials that can make the conducting wire to replace, like silver or aluminium etc.The material of first insulating barrier 120 and second insulating barrier 140 also can be for other be used for the material of circuit board as insulating barrier, like polyester etc.
Epoxy resin composite material layer 130 is used to play electromagnetic shielding action and bonds first insulating barrier 120 and second insulating barrier 140.The power of the electromagnetic interference that the thickness of epoxy resin composite material layer 130 can shield is according to actual needs set.Epoxy resin composite material layer 130 thickness are about 8 microns to 12 microns.Epoxy resin composite material layer 130 adopts epoxy resin composite material to process, and said epoxy resin composite material comprises epoxy resin, CNT, inorganic dispersion, curing agent, catalyst, solvent and the antifoaming agent of end carboxyl polymer modification.
The epoxy resin of said end carboxyl polymer modification is the product behind epoxy resin and the end carboxyl polymer generation copolymerization; To be the terminal epoxy radicals of epoxy resin react with the carboxyl of the end of end carboxyl polymer and generate an ester group, thereby obtain comprising the polymer of the epoxy resin repetitive alternately and the repetitive of end carboxyl polymer.Wherein, epoxy resin can be bisphenol A type epoxy resin, and the end carboxyl polymer can be liquid polybutadiene acrylonitrile (CTBN).In the present embodiment, the epoxide equivalent of the epoxy resin of employing before unmodified is about 500, and the oxygen equivalent of going back of the epoxy resin after the carboxyl polymer modification is about 950 to 1100, preferably is about 1029.The mass percent of epoxy resin in epoxy resin composite material of end carboxyl polymer modification is about 50% to 60%, preferably is about 55% to 57%.
CNT is as electric conducting material, and it is dispersed in the epoxy resin of end carboxyl polymer modification, to play electromagnetic shielding action.CNT shared mass percent in composite material is 4.6% to 16%.How many electric conductivities that can obtain composite material according to actual needs of the content of CNT are confirmed in the composite material.The content of CNT is many more in the epoxy resin composite material, and the resistance of epoxy resin composite material is more little, and the content of CNT is few more in the composite material, and the resistance of epoxy resin composite material is big more.
Inorganic dispersion is used for dispersing Nano carbon tubes, so that CNT can be uniformly distributed in the epoxy resin composite material.Said inorganic dispersion is nanoclay or nano mica powder.Said nanoclay is 2: 1 a phyllosilicate, and it specifically can (Montmorillonite, molecular formula be M for montmorillonite
x(Al
4-xMg
x) Si
8O
20(OH)
4), (Hectorite, molecular formula is M to hectorite
x(Mg
6-xLi
x) Si
8O
20(OH)
4) or saponite (Saponite, molecular formula is M
xMg
6(Si
8-xAl
x) O
20(OH)
4) etc.Wherein, CNT is 3 to 4 to 1 with the mass ratio of inorganic dispersion.Said inorganic dispersion is preferably nanoclay.
Said curing agent is used for that composite material is cured process and plays induration.In the present embodiment, the curing agent of employing is the polyetheramine curing agent, and what adopt in the present embodiment is polyetheramine D-230 type curing agent.Said curing agent is about 3% to 4% in the shared mass percent of epoxy resin composite material.The consumption of curing agent should be corresponding with the epoxy resin of end carboxyl polymer modification, and the epoxy resin of its middle-end carboxyl polymer modification is about 18 to 20 to 1 with the mass ratio of curing agent.
Said catalyst is glyoxal ethyline (2-Methylimidazole), and the content of catalyst is corresponding each other with the content of the epoxy resin of end carboxyl polymer modification.Catalyst shared quality percentage composition in epoxy resin composite material is about 1% to 2%, preferably is about 1.5% to 1.6%.Said solvent is diethylene glycol monoethyl ether (Diethylene glycol monoethylether), and the content of said solvent in epoxy resin composite material is about 25% to 80%, preferably is about 28%.Said solvent is used to dissolve above-mentioned other components, to form uniform liquid dispersed system.Said antifoaming agent is used for eliminating the foam of above-mentioned epoxy resin composite material, and the mass percent of said antifoaming agent in epoxy resin composite material is about 0.5% to 1%.Said antifoaming agent can be the 2183H antifoaming agent of the pure political affairs in commercially available Taiwan company production.
Preferably; In the epoxy resin composite material, the quality percentage composition of the epoxy resin of end carboxyl polymer modification is about 56.0%, and the quality percentage composition of CNT is about 8.5%; The quality percentage composition of inorganic dispersion is about 2.2%; The quality percentage composition of curing agent is about 3.1%, the quality percentage composition of catalyst is about 1.6%, and the quality percentage composition of solvent is about 28.0%, and the quality percentage composition of antifoaming agent is about 0.6%.Inorganic dispersion is selected nanoclay for use.The viscosity of the epoxy resin composite material in the present embodiment can reach 60000 to 75000 centipoises, its can be easily with circuit board in coverlay or other epoxy resin composite material layer bonding each other.Preferably, the viscosity of epoxy resin composite material is about 70000 centipoises.
The present technique scheme also provides a kind of said manufacture method with circuit board substrate 100 of electromagnetic shielding action, and said manufacture method comprises the steps:
The first step is made said epoxy resin composite material.
Stating epoxy resin composite material in the present embodiment can adopt following method to make:
At first, adopt end carboxyl polymer modified epoxy to obtain holding the epoxy resin of carboxyl polymer modification.
To hold carboxyl polymer and epoxy resin to be positioned over jointly and be positioned in the reaction vessel, and to keep reaction temperature be 120 degrees centigrade that reaction is about 3 hours under stirring condition, thereby obtain holding epoxy resin after the carboxyl polymer modification.In the present embodiment, the epoxide equivalent of the epoxy resin of employing is about 500.The end carboxyl polymer that adopts can be liquid polybutadiene acrylonitrile (CTBN), and the epoxide equivalent of the epoxide resin after the modification that obtains after the reaction is about 1029.Through above-mentioned reaction, a terminal epoxy radicals of epoxy resin mutually combines with a terminal carboxyl of end carboxyl polymer, and removes the water of a molecule, thereby obtains an ester group.Thereby than the epoxy resin that does not carry out modification, the epoxy resin after the modification has good flexibility.Certainly, the epoxy resin of employing is not limited to the bisphenol A type epoxy resin that present embodiment provides, and it also can be the epoxy resin of other types.The end carboxyl polymer that adopts also is not limited to the liquid polybutadiene acrylonitrile that provides in the present embodiment, and it also can be polymer such as terminal carboxyl polyester.
Then, even carbon nanotube is scattered in the inorganic dispersion to form finely dispersed CNT dispersion.
Adopt physics mode that CNT is scattered in the inorganic dispersion.Said inorganic dispersion can be laminar nano clay or mica powder.In the present embodiment, the inorganic dispersion of selecting for use is the laminar nano clay.Configuration quality is than 3 to 4 to 1 CNT and laminar nano clay, and through stirring or the mode of concussion is mixed, makes even carbon nanotube be scattered in the layered nanoclay.The laminar nano clay that adopts can be 2: 1 phyllosilicate, and it specifically can be montmorillonite, hectorite or saponite etc.The CNT that adopts can be SWCN, also can be multi-walled carbon nano-tubes.
At last, epoxy resin, CNT dispersion, solvent, curing agent, catalyst and the antifoaming agent of end carboxyl polymer modification mixed and grind dispersion, thereby obtain epoxy resin composite material.
In the present embodiment, adopt three drum-types to grind dispersion machine described end carboxyl polymer modified epoxy, CNT dispersion, solvent, curing agent, catalyst and antifoaming agent are ground dispersion.Above-mentioned end carboxyl polymer modified epoxy, CNT dispersion, solvent, curing agent, catalyst and antifoaming agent are devoted three drum-types according to above-mentioned content separately to be ground in the dispersion machine; Start three drum-types and grind dispersion machine to grind dispersion; Thereby make above-mentioned each form in the solid uniform ingredients be scattered in the liquid component, thereby form finely dispersed epoxy resin composite material.In the present embodiment; In above-mentioned each composition, the quality percentage composition of the epoxy resin of end carboxyl polymer modification is about 56.0%, and the quality percentage composition of CNT is about 8.5%; The quality percentage composition of inorganic dispersion is about 2.2%; The quality percentage composition of curing agent is about 3.1%, the quality percentage composition of catalyst is about 1.6%, and the quality percentage composition of solvent is about 28.0%, and the quality percentage composition of antifoaming agent is about 0.6%.
In order to obtain the epoxy resin composite material of different surfaces resistivity, the consumption of CNT dispersion is controlled in the time of can feeding intake through change.The mass percent that accounts for composite material when CNT is between 4.6% to 16%, and epoxy resin composite material surface resistivity constant interval is about between 100,000 ohm to ten ohm.Wherein, the content of CNT is big more in the epoxy resin composite material, and the surface resistivity of epoxy resin composite material is more little.
Please consult Fig. 2 and Fig. 3 in the lump, in second step, adopt described epoxy resin composite material to make the epoxy resin composite material layer 130 of semi-solid preparation.
In the present embodiment, adopt following method that said epoxy resin composite material is made epoxy resin composite material layer 130.
At first, release substrate layer 20 is provided.
In the present embodiment, release substrate layer 20 is the PET mould release membrance, and it has first release surface 210.
Then, said epoxy resin composite material is coated first release surface 210 to form epoxy resin composite material layer 130.
In the present embodiment, adopt slit type coater that the epoxy resin composite material of liquid state is coated first release surface 210 of release substrate layer 20, to form epoxy resin composite material layer 130.In the present embodiment owing to adopt slit type coater to be coated with, the thickness that can control the epoxy resin composite material layer 130 of formation meet the demands and coating even.In the present embodiment, the thickness of the epoxy resin composite material layer 130 of formation is about 8 microns to 12 microns, is preferably 10 microns.
At last, the epoxy resin composite material layer 130 that coating on first release surface 210 of release substrate layer 20 is formed carries out the semi-solid preparation processing, so that epoxy resin composite material layer 130 semi-solid preparation.That is, formed the epoxy resin composite material layer 130 of semi-solid preparation.
In the present embodiment, the method that epoxy resin composite material layer 130 semi-solid preparation adopt is that prebake conditions is handled.The time that continues epoxy resin composite material layer 130 being carried out prebake conditions is about 15 minutes, and the temperature that keeps during prebake conditions is about 80 degrees centigrade to 90 degrees centigrade.Handle through carrying out prebake conditions, make that the partial solvent in the epoxy resin composite material layer 130 volatilizees, make epoxy resin composite material layer 130 be in semi-cured state.
It is understandable that; Carrying out the temperature of prebake conditions duration and baking can confirm according to the thickness of the epoxy resin composite material layer 130 of reality; When epoxy resin composite material layer 130 thickness are big; Can the time proper extension of baking or the temperature of baking suitably be heightened; And when epoxy resin composite material layer 130 thickness hour, can the time of baking suitably be shortened or the temperature of baking suitably reduces, can form the semi-solid preparation membrane structure to guarantee epoxy resin composite material layer 130.
See also Fig. 4, in the 3rd step, first copper-clad plate 101 that comprises first copper foil layer 110 and first insulating barrier 120 is provided.
See also Fig. 5, the 4th step, 130 contraposition of epoxy resin composite material layer are stacked on first insulating barrier 120, epoxy resin composite material layer 130 contacts with first insulating barrier 120.
Before carrying out subsequent step, need release substrate layer 20 be removed from epoxy resin composite material layer 130.Particularly.Can, 130 contraposition of epoxy resin composite material layer earlier release substrate layer 20 be removed from epoxy resin composite material layer 130 before being stacked on first insulating barrier 120.Also can, 130 contraposition of epoxy resin composite material layer more release substrate layer 20 be removed from epoxy resin composite material layer 130 after being stacked on first insulating barrier 120.
In the 5th step, epoxy resin composite material layer 130 is softened processing.
In the present embodiment, it is 50 degrees centigrade that epoxy resin composite material layer 130 is softened treatment temperature, and the time that continues is about 1 minute.Certainly; Softening temperature and duration can be adjusted according to the thickness of epoxy resin composite material layer 130; When the thickness of epoxy resin composite material layer 130 is big; Can suitably increase softening temperature or prolong the softening time, when the thickness of epoxy resin composite material layer 130 hour, reduction softening temperature that can be suitable or shorten the softening time.Through above-mentioned softening processing; Make in the epoxy resin composite material layer 130; Follow-up to epoxy resin composite material layer 130 be cured reaction the functional group of reacting can with curing agent and catalyst etc. further each other near, thereby convenient follow-up curing reaction carries out.
See also Fig. 6, in the 6th step, second copper-clad plate 102 that comprises second copper foil layer 150 and second insulating barrier 140 is provided.
See also Fig. 7, in the 7th step, second copper-clad plate 102 is stacked on the epoxy resin composite material layer 130, and makes second insulating barrier 140 contact with epoxy resin composite material layer 130.
See also Fig. 7, in the 8th step, the mode that adopts the roller pressing is carried out pressing to first copper-clad plate 101, epoxy resin composite material layer 130 and second copper-clad plate 102, obtains circuit board substrate 100 thereby make epoxy resin composite material layer 130 solidify.
In the present embodiment, adopt first roller 31 and 32 pairs first copper-clad plates 101 of second roller, epoxy resin composite material layer 130 and second copper-clad plate 102 that are arranged in parallel to carry out pressing.First roller 31 and second roller 32 can adopt stainless steel to process.First roller 31 and first copper foil layer 110 are in contact with one another; Second roller 32 and second copper foil layer 150 are in contact with one another, and the distance between first roller 31 and second roller 32 is slightly less than the thickness sum of first copper-clad plate 101, epoxy resin composite material layer 130 and second copper-clad plate 102.Drive first roller 31 through drive unit (figure do not show) and produce rightabout rotation, thereby feasiblely be positioned over first copper-clad plate 101, epoxy resin composite material layer 130 and second copper-clad plate 102 of piling up placement between first roller 31 and second roller 32 by pressing with second roller 32.When carrying out pressing, the pressing-in temp of control is about 200 degrees centigrade, and pressing speed is 0.5 meter per minute, and the pressure during pressing is every square centimeter of 4 to 5 kilogram.
And because the epoxide equivalent of the epoxy resin that adopts in the present technique scheme is bigger, the functional group that wherein contains is less, and in step before, has carried out softening processing.Under this pressing condition; Functional group in the epoxy resin composite material layer 130 and catalyst and curing agent fully react; Thereby make epoxy resin composite material layer 130 solidify; And bonding first insulating barrier 120 and second insulating barrier 140, thereby obtain doing as a whole circuit board substrate 100.The present technique scheme is made the circuit board substrate obtain, can satisfy among the IPC-TM-650 testing standard about mechanical property, chemical characteristic, physical characteristic and electrical characteristic.
The circuit board substrate that the present technique scheme provides; Owing between adjacent copper foil layer, be provided with the epoxy resin composite material layer; Have finely dispersed CNT in the said epoxy resin composite material layer and have electromagnetic shielding action; When two copper foil layers of said circuit board substrate were made the formation conducting wire, said epoxy resin composite material layer can play electromagnetic shielding action.And the epoxy resin composite material layer has good pliability, than stainless steel substrates of the prior art, can increase the performance of destroying or force to yield of flexible PCB, and can reduce the production cost of circuit board.The manufacture method of the circuit board substrate that the present technique scheme provides; Only need can realize the curing of epoxy resin composite material layer through the mode of roller pressing; Thereby can carry out maturation process to the epoxy resin composite material layer; Practice thrift the cost of circuit board substrate, improved the production efficiency of circuit board substrate.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. circuit board substrate; It comprises first copper foil layer, first insulating barrier, epoxy resin composite material layer, second insulating barrier and second copper foil layer that stacks gradually; Said epoxy resin composite material layer is made up of epoxy resin composite material; Said epoxy resin composite material comprises epoxy resin, CNT and the inorganic dispersion of end carboxyl polymer modification, and said CNT shared mass percent in said epoxy resin composite material is 4.6% to 16%.
2. circuit board substrate as claimed in claim 1; It is characterized in that; The epoxy resin of said end carboxyl polymer modification is the bisphenol A type epoxy resin of liquid polybutadiene acrylonitrile modification, and the mass percent of epoxy resin in epoxy resin composite material of said end carboxyl polymer modification is 55% to 65%.
3. circuit board substrate as claimed in claim 1 is characterized in that, the oxygen equivalent of going back of the epoxy resin of said end carboxyl polymer modification is 950 to 1100.
4. circuit board substrate as claimed in claim 1 is characterized in that, said inorganic dispersion is nanoclay or nano mica powder.
5. circuit board substrate as claimed in claim 1 is characterized in that, the thickness of said epoxy resin composite material layer is 8 microns to 12 microns.
6. circuit board substrate as claimed in claim 1; It is characterized in that; Said epoxy resin composite material also comprises curing agent and catalyst, and said curing agent is a polyetheramine, and said curing agent is 3% to 4% in the shared mass percent of epoxy resin composite material; Said catalyst is a glyoxal ethyline, and said catalyst shared quality percentage composition in epoxy resin composite material is 1% to 2%.
7. the manufacture method of a circuit board substrate comprises step:
Make epoxy resin composite material; Said epoxy resin composite material comprises epoxy resin, CNT and the inorganic dispersion of end carboxyl polymer modification, and said CNT is 4.6% to 16% in the shared mass percent of said epoxy resin composite material;
Adopt said epoxy resin composite material to form the epoxy resin composite material layer, and the said epoxy resin composite material layer of semi-solid preparation;
First copper-clad plate that comprises first copper foil layer and first insulating barrier is provided;
The epoxy resin composite material layer is arranged at first surface of insulating layer of said first copper-clad plate;
Said epoxy resin composite material layer is softened processing;
Second copper-clad plate that comprises second copper foil layer and second insulating barrier is provided;
Second copper-clad plate is arranged at the epoxy resin composite material laminar surface, and makes second insulating barrier contact with the epoxy resin composite material layer; And
Adopt the mode of roller pressing that pressing is carried out in first copper-clad plate, epoxy resin composite material layer and second copper-clad plate, make the epoxy resin composite material layer solidify and bonding first copper-clad plate and second copper-clad plate, thereby obtain circuit board substrate.
8. the manufacture method of circuit board substrate as claimed in claim 7 is characterized in that, said making epoxy resin composite material comprises step:
Adopt the end carboxyl polymer that epoxy resin is carried out modification to obtain holding the epoxy resin of carboxyl polymer modification;
Even carbon nanotube is scattered in the inorganic dispersion, to obtain the CNT dispersion; And
The epoxy resin of said end carboxyl polymer modification is mixed with the CNT dispersion and grinds dispersion, to obtain epoxy resin composite material.
9. the manufacture method of circuit board substrate as claimed in claim 8 is characterized in that, adopt said epoxy resin composite material to form the epoxy resin composite material layer, and the said epoxy resin composite material layer of semi-solid preparation comprises step:
Release substrate layer is provided, and said release substrate layer has first release surface;
First release surface of said epoxy resin composite material being coated insulated base material layer forms the epoxy resin composite material layer; And
Toast said epoxy resin composite material layer, extremely said epoxy resin composite material layer is in semi-cured state.
10. the manufacture method of circuit board substrate as claimed in claim 9 is characterized in that, before said epoxy resin composite material layer being softened processing, also said epoxy resin composite material layer is separated from first release surface of release substrate layer.
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| CN104284571A (en) * | 2013-07-03 | 2015-01-14 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printed wiring board, electronic device and method for forming same |
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| CN106827716A (en) * | 2017-03-20 | 2017-06-13 | 成都三益新材料有限公司 | A kind of thin-type flexible copper-clad plate and preparation method thereof |
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Application publication date: 20120314 |