201205752 • 六、發明說明： 【發明所屬之技術領域】 本發明是關於一種導線架的結構及其製造方法，特別是指一 種形成有串聯(或並聯)電路的導線架。 【先前技術】 導線架的作用為傳輸積體電路内之電子元件功能至 Φ 外部之系統板。導線架是封裝的三大物件（導線架、金線、 螢光粉封裝膠）中’最重要的一種物件。積體電路中除了 極少數的簡單功能晶片直接封裝（Molding)外，每一個積 . 體電路的每一片晶片都必須有一導線架配合，以組合成— • 個完整可使用的積體電路。導線架依功能可分為單體導線 架及積體電路導線架，單體導線架中又含支援電晶體、二 極體和發光二極體等產品。 φ 以發光二極體而言’ LED(發光二極體)被廣泛應用來做為各領 域產品的光源’例如螢幕的背光、車燈光源、一般室内照明用燈 等，以螢幕的背光而言，例如電腦螢幕、手機螢幕、PDA螢幕… 等等。LED形成背光方式通常是在螢幕背後單側或兩侧佈設多數 個LED模組，每一 LED模組内設置一顆LED晶片（體），且每一 LED模組之間以串聯或並聯方式電性連結，形成預定效果的光 源。但使用時常發生’因其中幾個LED模組内的LED晶片損壞 而無法發亮或形成光衰退，導致從外部觀看螢幕呈現有暗處的現 201205752 - 象，影響視覺效果。 而LED模組經常損壞的原因，主要是封裝不良所引起，更具 體而言可由LED的導線架來探討。請參閱第一圖為習知發光二極 體(LED)導線架半成品示意圖。傳統的導線架做法是先在一金屬板 件A上沖壓加卫出眾多格具有預設形狀的導線區域b，再以塑膠 射出成型方式於該導線區域3上形成一絕緣殼體c，後再進行金 屬導線區域的接腳D打彎。傳統的LED難方式因led的結構 •型態而有不同’對於陽極、陰極烊墊分別在咖晶片頂面及底面 的型態者而5 ’疋先把led晶片固定在該絕緣殼體的範圍内(固 .晶），使底面的陰極焊翻設於導顧域的㈣腳，再於LED陽極 焊塾與導線區域的内引腳之間，以金屬細線連接(打線鍵合），後再 把完成固晶及打線鍵合的導線架，填充t光粉環氧樹祕護晶片 (模造）；對於陽極、陰極焊塾皆在LED晶片同一側的型態者而言， 可採用上述打線鍵合的方式，或者可制覆晶方式，即將LED晶 ♦ 4齡轉’將陽極、陰極料焊設於導_域的㈣腳，然後 進行膠體封裝。但不論何種電性連結方式，都會因金屬導線區域 與塑膠絕緣殼體之間常結合不良而形成有間隙，LED晶片長時間 暴露在大氣中，受到水氣或其他環境中的化學物質影響，會造成 LED晶片短路、金屬細線與焊墊氧化產生更高阻抗、光衰退…等 現象。 為解決LED模組在被應用過程中臨時媳滅或具有光衰退現 象々攸結構上對led模組進行改良，―方面避免水氣渗入模組、 201205752 -提高LED的良率’另―方面須織咖模組也相其他因素而 造成熄滅的情形’所以須對LED突然熄滅設想―因應之道。 此外’從翁介紹LED轉㈣製作方式可知，傳統的導線 架製程大致上為金屬板件賴成型、絕緣殼體射出成型、接聊打 f、固晶、打線等多道卫序’不僅#時，還需負擔料片以及工作 機具的成本。因此須對製程加以改良並簡化，以節省各方面成本 的支出。 _ 駐所述，傳統LED導、_在製紅、結構上以及應用上， 分別存在有製造時耗費成本、結構結合不良以及無法克服應用 . 時’因LED突然熄滅而影響外觀視覺效果的問題。 【發明内容】 有鑒於此，本發明的其中一目的在於，提供一種具有串(並） 聯電路覆蓋表面之LED導線架，藉由該電路，可直接在導線架上 »串(並)聯至少兩顆LED晶片，以解決傳統咖模組中因僅具有單 貝D b曰片，若s亥LED晶片損壞或光衰退會造成暗處，影響視 覺效果的問題。 』本《明的另一目的在於，提供一種一體成型之led導線架的 製造方法，省去傳統製造LED導線架所需的多道工序，藉以節省 製造時間、節省物料以及工作機具的成本。 本發明的再—目的在於，提供—種—體成型的led導線架結 構藉以解決傳統導線架金屬導線區域與塑夥絕緣殼體間結合不 201205752 '良，易使水氣渗入，造成LED晶片損壞的問題。 此外，本發明的又一目的在於，提供一種具有串㈤聯電路 之LED ^線架’此導線架能提供不論是傳統的打線鍵合或覆晶封 裝皆適用。 為解決傳統LED導線架常因結構不良，而造成内部㈣晶 片又才貝的問題，本發明提供了一種創新的導線架結構。包括一導 線架本體，其具有-設置槽，其巾，該導絲本_表面具有導 φ電’線路°亥°又置槽供设置複數電子元件，且該等電子元件與該導 電線路電性連結’使鮮電子元件可發生制。其巾，導電線路 •可為串聯或並聯，使導線架内可同時串聯或並聯多數個電子元 件；其中，該電子元件可為LED晶片。 由於導線穌體上直接成财導電線路，因此*會有傳統導 線架金屬導線區域與娜絕緣殼制結合林的問題，後續施以 的封勝gp可禁止水氣渗入晶片，避免造成晶片損壞。又， 籲由於複數顆LED晶在導線架上形成串聯或並聯，除可提高發光 面積外，若有其中一顆晶片損壞，還有其他備用的晶片，可延長 整個LED额的使用壽命。此外，選擇本發明之具有複數咖 晶片的LED模組做為背光源或照明裝置時，與傳統僅具單顆晶片 的LED模組相較，無須串、並聯過多的LED模組便能達成較高 的發光效能，因此可節省模組之間的串、並聯工序及成本。 如上所述導線架的製造方法’包括下列步驟： (1)提供一材料； 201205752 ⑺以该材料形成—導線架本體，該導線架本體具有—設置槽； ⑶對斜雜本體進倾影製程； (4)對料線架本體進行侧’形成—就的電路路線圖案； )、寸5/導線架本體進行網版印刷，使該電路路線圖案上形成導 電線路結構； (6)對δ亥導電線路結構進行燒結。 在本發明中’導電㈣金屬材料與構成導雜本體的材料之 門為體成型’顛覆了傳統先成型出金屬部分再於金屬部分上結 合塑膠殼體的做法’且本發明U接在導絲本體上形成導電的 金屬層(即導電線路)，後續施做固晶的人員可以覆晶方式將晶片與 金屬層電性連結，可省去傳統的打線工法，以及省去打線所需材 料的成本’對於晶體封裳而言，能縮小整體的體積。 【實施方式】 乂下配σ ®式及％件符號對本發明的實施方式做更詳細的說 明’俾使《該項技#者在研讀本制紐能據以實施。 請參閱第二圖，本發明之導線架結構主要包括一導線架本體 、中央祕Α置槽η ’該導線架本體丨表面形成有導電線路 此導電線路2可為串聯線路或並聯線路。該設置槽^供設置 设數電子7G件3 ’且該等電子辑3電性連結於導電線路2，使該 等電子元件3之間形成㈣或並聯。其中，電子元件3與導電線 路2之間電性連結的方式可依電子元们_態而選擇用打線鍵 201205752 合方式或覆晶方式。本發明導線架的特徵在於，因導線架上成型 有可將兩個以上相同電子元件3串聯或並聯的導電線路2, 一方面 對於電子元件3所能釋出的功效有加乘作用，另一方面當其中 -電子元件3受損在功能上有瑕症，另—電子元件3可作為備 用。 導線架具體的結構可參考第三圖至第六圖，本發明是以咖 的導線架做為較佳實施例。導、_具有—導線架本體i，該導線架 # 本體1呈矩形體’中央形成-垂直向下切伸的LED晶片設置槽、 1卜導線架本體1的表面佈設有導電線路2，該導電線路2為銅層， 導電線路2可為φ聯或並聯。該LED晶片設置槽n内可供電性 連結至少兩顆LED晶片，以使兩顆LED晶片能相互串聯或並聯；201205752 • VI. Description of the Invention: [Technical Field] The present invention relates to a structure of a lead frame and a method of manufacturing the same, and more particularly to a lead frame formed with a series (or parallel) circuit. [Prior Art] The role of the lead frame is to transfer the function of the electronic components in the integrated circuit to the external system board of Φ. The lead frame is the most important item in the package of three major objects (lead frame, gold wire, phosphor powder encapsulant). In addition to a very small number of simple functional wafers in the integrated circuit, each wafer of each integrated circuit must have a lead frame fit to be combined into a complete usable integrated circuit. According to the function, the lead frame can be divided into a single lead frame and an integrated circuit lead frame. The single lead frame also supports products such as a transistor, a diode and a light-emitting diode. φ In terms of light-emitting diodes, 'LEDs (light-emitting diodes) are widely used as light sources for products in various fields, such as backlights for screens, light sources for lamps, lamps for general indoor lighting, etc., in terms of backlighting of screens Such as computer screens, mobile screens, PDA screens, etc. LEDs are usually formed by backlighting a plurality of LED modules on one side or both sides of the screen. Each LED module is provided with one LED chip (body), and each LED module is connected in series or in parallel. Sexually connected to form a light source of a predetermined effect. However, it often occurs when the LED chip in several of the LED modules is damaged and cannot be brightened or light is degraded, resulting in the appearance of a dark shadow on the screen from the outside, which affects the visual effect. The reason why the LED module is often damaged is mainly caused by poor packaging, and more specifically can be discussed by the lead frame of the LED. Please refer to the first figure for a schematic diagram of a semi-finished product of a conventional LED (LED) lead frame. The conventional lead frame method is to first press a plurality of wire regions b having a predetermined shape on a metal plate member A, and then form an insulating casing c on the wire region 3 by plastic injection molding, and then Perform the pin D of the metal wire area to bend. The difficulty of the traditional LED is different due to the structure and shape of the LED. For the anode and cathode pads, the top and bottom of the coffee chip are respectively 5', and the LED wafer is fixed in the insulating housing. Inner (solid crystal), the bottom electrode is turned over on the (four) leg of the guide field, and then connected between the LED anode pad and the inner lead of the wire area by a thin metal wire (wire bonding), and then The lead frame for completing the solid crystal bonding and wire bonding is filled with the t-light epoxy resin secret-protecting wafer (molding); for the type of the anode and the cathode soldering on the same side of the LED chip, the above-mentioned wire bonding key can be used. The combination method, or the flip chip method, is to turn the LED crystal 4 to turn 'the anode and the cathode material are soldered to the (four) foot of the conduction field, and then the gel is packaged. However, no matter what kind of electrical connection method, there is a gap due to the poor bonding between the metal wire area and the plastic insulating case. The LED chip is exposed to the atmosphere for a long time and is affected by water vapor or other environmental chemicals. It will cause short circuit of LED chip, oxidation of metal thin wire and pad to produce higher impedance, light decay, etc. In order to solve the problem that the LED module is temporarily annihilated or has light decay during the application process, the LED module is improved on the structure, so as to avoid moisture infiltration into the module, 201205752 - improving the yield of the LED 'others' The weaving coffee module is also caused by other factors, so it is necessary to extinguish the LED. In addition, from the introduction of the introduction of LED to (four) production methods, the traditional lead frame process is generally the metal plate parts Lai molding, insulation shell injection molding, contact chat f, solid crystal, wire and other multi-channel order 'not only # It is also necessary to bear the cost of the piece and the work tool. Therefore, the process must be improved and simplified to save costs in all aspects. _ In the above, traditional LED guides, _ in red, structural and application, respectively, there are manufacturing costs, poor structural integration and the inability to overcome the application. The problem of the visual effect of the appearance due to the sudden extinction of the LED. SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide an LED lead frame having a series (parallel) circuit covering surface, by which the circuit can be directly connected to the lead frame. Two LED chips are used to solve the problem that the traditional coffee module has only a single-shell D b-chip. If the LED chip is damaged or the light is degraded, it will cause dark spots and affect the visual effect. Another object of the present invention is to provide a method for manufacturing a one-piece LED lead frame, eliminating the need for multiple processes required for conventionally manufacturing LED lead frames, thereby saving manufacturing time, material savings, and cost of work tools. A further object of the present invention is to provide a led-frame structure for forming a seed body to solve the problem that the combination of the metal wire area of the conventional lead frame and the plastic insulating case of the plastic body is not good, and the water vapor is infiltrated, causing damage to the LED chip. The problem. Further, it is still another object of the present invention to provide an LED cable holder having a series (five) coupling circuit which can be used regardless of the conventional wire bonding or flip chip sealing. In order to solve the problem that the conventional LED lead frame is often poorly structured, resulting in an internal (four) wafer, the present invention provides an innovative lead frame structure. The utility model comprises a lead frame body, which has a groove for providing a guide wire, the surface of the guide wire has a conductive wire, and a groove is provided for providing a plurality of electronic components, and the electronic components and the conductive circuit are electrically connected. Link 'to make fresh electronic components work. The towel, the conductive circuit can be connected in series or in parallel, so that a plurality of electronic components can be connected in series or in parallel in the lead frame; wherein the electronic component can be an LED chip. Since the wire is directly formed into a conductive circuit, there is a problem that the metal wire area of the conventional wire frame and the inner insulating layer of the wire are combined, and the subsequent application of the sealing gp prohibits moisture from penetrating into the wafer to avoid wafer damage. Moreover, because a plurality of LED crystals are connected in series or in parallel on the lead frame, in addition to improving the light-emitting area, if one of the wafers is damaged, there are other spare wafers, which can extend the service life of the entire LED. In addition, when the LED module with the plurality of coffee chips of the present invention is selected as the backlight or the illumination device, compared with the conventional LED module with only a single wafer, the LED module without stringing and paralleling can be achieved. High luminous efficiency, thus saving string and parallel processes and costs between modules. The manufacturing method of the lead frame as described above includes the following steps: (1) providing a material; 201205752 (7) forming a lead frame body with the material, the lead frame body having a setting groove; (3) a tilting process for the oblique body; (4) Performing a side 'formation—the circuit route pattern on the side of the wire frame body;), screen printing the inch 5/lead frame body, and forming a conductive circuit structure on the circuit route pattern; (6) Conducting a conductive line structure The line structure is sintered. In the present invention, the door of the 'electric (four) metal material and the material constituting the body of the impurity is formed by the body 'overturning the conventional method of forming the metal portion and then bonding the plastic case to the metal portion' and the U is connected to the guide wire A conductive metal layer (ie, a conductive line) is formed on the body, and a person who subsequently applies the solid crystal can electrically connect the wafer to the metal layer in a flip chip manner, thereby eliminating the traditional wire-laying method and eliminating the cost of materials required for wire bonding. 'For the crystal seal, it can reduce the overall volume. [Embodiment] The embodiment of the present invention will be described in more detail with the σ 配 式 formula and the % symbol 俾 俾 《 《 该项 该项 该项 该项 该项 该项 该项 该项 该项 该项 该项 该项 该项 该项 该项 该项 该项 。 。 。 。 。 。 。 。 。 Referring to the second figure, the lead frame structure of the present invention mainly comprises a lead frame body, a central secret slot η', and a conductive line is formed on the surface of the lead frame body. The conductive line 2 can be a series line or a parallel line. The arrangement slot is provided with a set of electronic 7G devices 3' and the electronic components 3 are electrically connected to the conductive lines 2 such that the electronic components 3 are formed (four) or in parallel. The manner in which the electronic component 3 and the conductive line 2 are electrically connected to each other may be selected according to the state of the electronic component, using the wire bonding key 201205752 or the flip chip method. The lead frame of the present invention is characterized in that, by forming a conductive line 2 in which two or more identical electronic components 3 are connected in series or in parallel on the lead frame, on the one hand, the effect of the electronic component 3 can be multiplied, and the other is In the aspect, when the electronic component 3 is damaged, it is functionally flawed, and the electronic component 3 can be used as a backup. The specific structure of the lead frame can be referred to the third to sixth figures. The present invention is a lead frame of a coffee machine as a preferred embodiment. The lead frame body i has a lead frame body i, and the body body 1 has a rectangular body formed at the center - a vertically downwardly extending LED chip setting groove, and a surface of the lead frame body 1 is provided with a conductive line 2, the conductive line 2 is a copper layer, and the conductive lines 2 may be φ or parallel. The LED chip is disposed in the slot n to electrically connect at least two LED chips, so that the two LED chips can be connected to each other in series or in parallel;
'如第三圖、第四圖所示即為兩種不同的並聯線路分布實施例，第 五圖、第六圖所示為兩種不同的串聯線路分布實施例，但並聯或 串聯的形式不以此為限。由於導線架本體！上具有導電線路2，對 •於陽極、陰極焊墊皆位於同側的LED晶片31(如第三圖及第五圖） 而言’電性連結於導線㈣方式可叫祕經過打線鍵合，而可 選擇利用覆晶方式，將陽極、陰極焊塾直接焊固在導電線路2上； 對於陽極、陰極焊塾分別在上、下兩側的LED晶片32(如第四圖 及第六圖所示)而言，可先將LED晶片32的陰極焊墊焊固於導電 線路2，陽極焊势才用打線21的方式與導電線路2電性連結，這 樣的做法可較傳統省去至少一道打線的工序，因此本發明所提供 的導線架應用方式相當廣泛。導線架可一次串、並聯多顆LED 201205752 片好處在於’可提高LED發光面積、提升亮度，另一方面，當其 中LED晶片因受損產生光衰退甚至媳滅的情形，另-UED晶 7可作為翻’藉啸升整個LED模_使用壽命。在應用方面， 選擇本發明之具有·LED W的LED模組做為背光源或直接 :、月時與傳統僅具單顆晶片白勺咖模組相較，無須串、並聯過 夕的LED模組便能達成較高的發級能，因此可節省模組之間的 串、並聯工序及成本。 乂上所述導線架的製造方法’可參考第七圖所示的製造步 驟以及第八A至第八£)圖所示，各步驟的實施狀態示意圖。其 中製造步驟包括： 提供一材料7〇1 ; 、亥材料械—導線架本體，該導線架本體具有一設 對該導線架本體進行微影製程703 ; ::線架本體進行侧，形成一預定的電路路線圖案爾； 路、轉^本體進行網版印刷’使該電路路線圖案上形成導電線 對5亥導電線路結構進行燒結706。 係先提供一材料，並以該材料形成 本體1且有一置㈣, 導線架本體卜該導線架 、有。又置槽n，其中，該材料可為金 =者可柄細喝梅㈣斷顿翻的材料 例如材料為鋁，可應用沖壓成型來製成導線架本靜 材科為陶賴可應賴造法來姻導'«切w球料以及製t 201205752 導線架本體的方式不以此為限。為了便利量產，本實施例較佳的 做法是在-金屬板(或陶究板)上，事先一體成型出多數個導線架本 體1(如第八A圖）’之後的每一道工序也是以整個板體為單位去施 作完成，若要錢導線糾’相機賴切下板體上的導線架。 但為方便介紹，以下皆以單個導線細成型步驟做為實施例。請 參閱第八BS1為導線架本體的剖面示意圖，導線架本體丨中央一 體成型地設有-設置槽n。由於本發明的目的，是要在導線架本 •體1上形成串連(或並聯)的導電線路結構。因此先對導線架本體i 的表面進行微影製程；微影製程包括在導線架本體的表面塗佈光 .阻4(如第八c圖）’再透過㈣光線5及具有預設電路路線圖案61 的光罩6 ’料線架本體1進行曝光，使光罩6上的電路路線圖荦 61轉換到光阻4下面的導線架本體^表面(如第八D圖），再利用 顯影技術將電她_61顯現㈣。接下來，對料線架本體 1進行银刻，形成-預定的電路路線圖案61 ;本實施例中是對有 •曝光的導線架本體1表面進行触刻，因此在導線架本體i表面形 成凹陷的電路路線圖案61 ;侧後再去除綱如第八E圖）。再 對該導線架本體1進行網版印刷7(如第八F圖），在該電路路線圖 案=上形成導電線路結構8(如第八〇圖）；該導電線路結構8為 銅泊’導電線路的設計可為串聯(或並聯）。此外，由於陶竟較硬， 為避免網印贈 1時發生印製深度不足的問題，因此可於網印後， 對該導電線路結構8進行壓延，使銅魏完全陷人喊。最後， 對》亥導電線路結構8進行燒結，使導電線路結構8固化。所述設 201205752 置槽11可供設置電子元件3 ’例如上段所述，在本發明實施例中， 係設置複數LED “，且料LED晶η與㈣(或細)電路電性 連結，因此該等LED晶片之間形成串聯或並聯。 本發明導線架在製程方面的優勢為，提供了—種—體成型之 導線架的製造方法，省去傳統製造導線架所f的多道工序，藉以 節省製造日相、節省物料以紅作機具的成本。制對咖導線 架而言’由於導電的金屬部分與導線架本體的結構係成型在一 起’不會發生如傳統導線架金屬導魏域與_絕緣殼體之間結 合不良的問題’只要後續的轉無誤，即可禁止水氣渗入晶片， 避免造成LED晶片損壞。 以上所述者僅為用以解釋本發明之較佳實施例，並非企圖且 以對本發明做任何形式上之_，是以，凡有在 下所作有關本㈣之任何修飾或 月精神 保護 更6仍縣括林發明意圖'As shown in the third and fourth figures, there are two different parallel line distribution embodiments. The fifth and sixth figures show two different series line distribution embodiments, but the parallel or series form is not This is limited to this. Thanks to the lead frame body! The conductive circuit 2 has a conductive chip 2, and the LED chip 31 (such as the third figure and the fifth figure) on the same side of the anode and the cathode pad is electrically connected to the wire (four). Alternatively, the anode and cathode pads can be directly soldered to the conductive line 2 by means of flip chip bonding; for the anode and cathode pads, the LED chips 32 on the upper and lower sides respectively (as shown in the fourth and sixth figures) For example, the cathode pad of the LED chip 32 can be first soldered to the conductive line 2, and the anode soldering force is electrically connected to the conductive line 2 by means of the wire 21, which can save at least one line more than the conventional one. Therefore, the lead frame provided by the present invention is widely used. The lead frame can be connected in series and in parallel with multiple LEDs. 201205752 The advantage of the film is that it can improve the LED illumination area and enhance the brightness. On the other hand, when the LED chip is damaged or even annihilated due to damage, the other - UED crystal 7 can As a turn to 'borrow the entire LED die _ service life. In terms of application, the LED module with LED W of the present invention is selected as a backlight or directly: compared with a conventional single-chip coffee chip module, the LED module does not need to be connected in series or in parallel. The group can achieve a higher level of performance, thus saving the string, parallel process and cost between modules. The manufacturing method of the lead frame can be referred to the manufacturing steps shown in the seventh drawing and the eighth to eighth drawings, and the implementation states of the respective steps are shown. The manufacturing step includes: providing a material 7〇1; a hai material device-lead frame body, the lead frame body having a lithography process 703 for the lead frame body; :: the wire frame body side to form a predetermined The circuit route pattern; the road, the turn body is screen-printed' to form a conductive line on the circuit route pattern to sinter 706 the 5H conductive line structure. A material is first provided, and the body 1 is formed with the material and has a set (4). The lead frame body has the lead frame. The groove n is further set, wherein the material can be gold=the handle is fine and the plum is used. (4) The material is broken, for example, the material is aluminum, and the stamping can be used to make the lead frame. The static material is made by Tao Lai. The method of the French marriage guide '«cut w ball and the t 201205752 lead frame body is not limited to this. In order to facilitate mass production, the preferred embodiment of the present embodiment is that each of the steps after forming a plurality of lead frame bodies 1 (such as FIG. 8A) in advance on a metal plate (or a ceramic plate) is also The entire plate is finished for the unit, and if the wire is to be corrected, the camera will lie on the lead frame on the lower plate. However, for convenience of introduction, the following is a single wire thin molding step as an embodiment. Please refer to the eighth BS1 as a schematic cross-sectional view of the lead frame body, and the lead frame body is integrally formed with a groove n in the center. For the purposes of the present invention, a series (or parallel) conductive line structure is formed on the lead frame body 1. Therefore, the surface of the lead frame body i is first subjected to a lithography process; the lithography process includes coating light on the surface of the lead frame body. The resistance 4 (such as the eighth c picture) 're-transmission (four) light 5 and having a preset circuit route pattern 61 reticle 6 'The wire frame body 1 is exposed, so that the circuit circuit diagram 荦61 on the reticle 6 is converted to the surface of the lead frame body under the photoresist 4 (as shown in FIG. 8D), and then development technology is used. Electric her _61 appeared (four). Next, the wire carrier body 1 is silver-engraved to form a predetermined circuit route pattern 61. In this embodiment, the surface of the lead frame body 1 with exposure is exposed, thereby forming a depression on the surface of the lead frame body i. The circuit route pattern 61; the side is then removed as shown in Figure 8E). Then, the lead frame body 1 is screen-printed 7 (as shown in FIG. 8F), and a conductive line structure 8 (such as an eighth figure) is formed on the circuit route pattern=; the conductive line structure 8 is copper-both conductive The lines can be designed in series (or in parallel). In addition, since the ceramics are harder, in order to avoid the problem of insufficient printing depth when the screen printing is given, the conductive circuit structure 8 can be calendered after the screen printing, so that the copper Wei is completely shouted. Finally, the "Hay conductive line structure 8" is sintered to cure the conductive line structure 8. In the embodiment of the present invention, the plurality of LEDs are disposed, and the LED η is electrically connected to the (four) (or thin) circuit, so The LED wafers are formed in series or in parallel. The advantage of the lead frame of the present invention is that it provides a method for manufacturing a lead frame for forming a body-shaped body, thereby eliminating the need for multiple processes for manufacturing the lead frame, thereby saving Manufacturing the solar phase, saving the cost of materials to red machine tools. For the coffee lead frame, 'because the conductive metal part and the structure of the lead frame body are formed together' will not occur as the traditional lead frame metal guide and _ The problem of poor bonding between the insulative housings 'as long as the subsequent rotation is correct, the water vapor can be inhibited from penetrating into the wafer to avoid damage to the LED wafer. The above is only a preferred embodiment for explaining the present invention, and is not intended to be In any form of the invention, it is intended that any modification or monthly spiritual protection relating to this (4) is made.
【圖式簡單說明】 第-圖為習知發光二極體導_半成品示意圖。 第二®為本翻導線架示意圖。 =三=顯示在本發明導線架上具有並聯的導電線路。 第四圖顯示在本發明導線紅 $力並聯的導電線路 201205752 第五圖顯示在本發科線紅具有串聯的導電線路。 第六圖顯示在本發明導線架上具有另-串聯的導電線路 第七圖為本發明導線架之製造流程說明。 第八A圖至第八η圖為本發明導線架成型過程示意圖。 【主要元件符號說明】 1. 導線架本體 I Π.設置槽 2. 導電線路 21.打線 • 3.電子元件 31 .LED晶片 32丄ED晶片 4.光阻 φ 5. UV光線 6. 光罩 61.電路路線圖案 7. 網版印刷 8. 導電線路結構 701.提供一材料 設置槽 702·以該材料形成一導線架本體，該導線架本體具有一 703.對該導線架本體進行微影製程； 12 201205752 " 704.對該導線架本體進行蝕刻，形成一預定的電路路線圖案 705. 對該導線架本體進行網版印刷，使該電路路線圖案上形成導電 線路結構 706. 對該導電線路結構進行燒結。 A. 金屬板件 B. 導線區域 C. 絕緣殼體 φ D.接腳[Simple description of the diagram] The first figure is a schematic diagram of a conventional light-emitting diode guide _ semi-finished product. The second® is a schematic diagram of the lead frame. = three = shows that there are parallel conductive lines on the lead frame of the present invention. The fourth figure shows the conductive line in parallel with the wire red force in the present invention. 201205752 The fifth figure shows that the red line in the present line has a series of conductive lines. Figure 6 shows a conductive line with another series connection on the lead frame of the present invention. The seventh figure is a description of the manufacturing process of the lead frame of the present invention. The eighth to eighth figures are schematic views of the forming process of the lead frame of the present invention. [Main component symbol description] 1. Lead frame body I Π. Set slot 2. Conductive line 21. Wire • 3. Electronic component 31. LED chip 32 丄 ED wafer 4. Photoresist φ 5. UV ray 6. Photomask 61 Circuit route pattern 7. Screen printing 8. Conductive circuit structure 701. A material setting groove 702 is provided. The lead frame body is formed by the material, and the lead frame body has a 703. The lithography process is performed on the lead frame body; 12 201205752 " 704. The lead frame body is etched to form a predetermined circuit route pattern 705. The lead frame body is screen printed so that the circuit trace pattern forms a conductive trace structure 706. The conductive trace structure Sintering is carried out. A. Metal plate B. Wire area C. Insulation case φ D. Pin