TW201318235A - Thermally enhanced optical package - Google Patents

Abstract

A thermally enhanced optical package includes a heat conducting module configured to dissipate the heat generated from an optical device, a plurality of insulating pads disposed on a heat conducting substrate, and at least one electrical conducting pad disposed on the insulating pads. The heat conducting module includes a heat conducting substrate and a plurality of heat conducting pillars, and the optical device is a light emitting diode chip or a light emitting diode die in the present embodiments. The thermally enhanced optical package is further characterized in a simple manufacturing procedure, including substantially an electrical or electroless plating process, a metal foil laminating process, a thick film printing process, and a patterning and etching process.

Description

Enhanced heat dissipation optics package

The invention discloses a heat-dissipating optical component package, in particular to a light-emitting component (LED) multi-chip package with a reinforced heat dissipation structure and a simple process.

At present, LED development focuses on brightness and performance improvement, but since only 30% of the energy of the input LED components is used for illumination, the remaining 70% will be diverged in the form of heat, so it will inevitably be produced while increasing the brightness of the LED. A lot of heat, and the rise of temperature will cause the LED's luminous efficiency to decrease and the color temperature to change, so the heat dissipation of the LED is an urgent problem to be solved. The heat dissipation method can be solved by three levels, namely wafer level, package level, and substrate level. Among the three levels, the most effective and most important is the substrate level.

At present, the types of heat dissipation substrates can be classified into four types, a plastic substrate, a reinforced glass fiber substrate (for example, FR4), a metal substrate, and a ceramic substrate. The advantages and disadvantages are as follows: The biggest advantage of the plastic substrate is that the structure is changed and it is easy to mass-produce, but its heat dissipation efficiency is the worst. At present, the low-power (~0.3W) LED completely uses plastic as its substrate. The advantage of the glass fiber substrate is that the process is easy to mass-produce, but the disadvantage is that the heat dissipation efficiency is poor, and it is not suitable for the development of the current high-power LED. Metal core printed circuit boards, or Metal-Core PCBs (MCPCBs), are based on metals with high thermal conductivity and ease of metal processing. They are currently one of the mainstream of high-power LED heat-dissipating substrates. The difficulty in the application of MCPCB is the need to replace the insulating layer material in the structure. Although the insulating layer material enters the conventional epoxy resin by adding a filler having a high thermal conductivity, the heat transfer coefficient thereof is increased from 0.5 W/mk to 5 W/mk, but the reliability of the insulating layer material is lower and the current is lower. The heat transfer coefficient is still a problem to be solved. The ceramic substrate is also one of the mainstream of the current high-power LED heat-dissipating substrate, but the problem lies in the Al ₂ O ₃ used in the substrate, and its thermal conductivity is between 20 and 30 W/mk, although a direct copper plating substrate (Direct Plating Copper, The DPC) process or the replacement of the substrate with AlN can significantly improve its thermal conductivity, but the cost price will increase dramatically.

For the package level, it can be divided into a first level package and a second level package. The first level package directly carries an LED die to become a separate wafer, while the second level package performs its circuit layout and packaging for the LED chip array. Figure 1 shows a low power LED (<0.3 W) 10 cross-sectional view of a conventional metal lead and a first level package structure. A low power LED die 16 is placed on a plastic Leaded Chip Carrie (PLCC) 11 and electrically connected to the metal lead 12 through a hole 15 through a gold wire 13. The above structure is one clock. The package 14 and the fluorescent glue (not shown) are sealed. 2 shows a high power LED (>0.5W) 20 cross-sectional view of a conventional first level package structure. A high power LED die 26 is placed on an Al ₂ O ₃ or an AlN substrate 21, and is electrically connected to the metal electrode 22 through a hole 25 through a gold wire 23, and the above structure is packaged in a bell shape 24 and Glue (not shown) is sealed. The finished product of the first level package is a separate wafer, and the independent chip enters the second level package.

3 shows a cross-sectional view of a high power LED 300 having a conventional second level package structure having an aluminum metal core printed circuit board (MCPCB) 310 and an aluminum heat sink 311. The purpose of the second level of packaging is to place a plurality of individual chips together on a printed circuit board, and with circuit components such as resistors, varistors, transformers, etc. to complete a basic LED lighting structure. As shown in FIG. 3, a high power LED die 313 is placed on an Al ₂ O ₃ or an AlN substrate 301, and is electrically connected to the metal electrode 302 through a hole 305 by a gold wire 303. The above structure is The bell package 304 and the fluorescent glue (not shown) are sealed. A patterned conductive pad 307 is bonded to the metal electrode 302 and surrounded by a solder resist ink 308 over a dielectric layer 309. The dielectric layer 309 must be placed between the conductive pad 307 and the MCPCB 310 to isolate the conductive vias from passing through the underlying MCPCB 310. A thermal conductive tape 312 is placed between the MCPCB 310 and a heat dissipation plate 311 to adhere to both. The pores 306 intermediate the ceramic substrate 301 and the solder resist ink 308 are filled with a thermal conductive paste having a filler. The fillers comprise a polymer, a ceramic oxide or a metal to enhance heat dissipation and adhesion of the individual LED chips and the MCPCB 310.

In summary, the effective thermal management of the LED package structure is limited by the following two points: 1) the thermal conductive adhesive has a low thermal conductivity, and 2) the entire structure has a plurality of conductor-insulator interfaces. An LED package structure with a thermal paste and a plurality of conductor-insulator interfaces has a heat transfer coefficient of only 2 W/mK. Therefore, there is an urgent need for an improved LED package structure for the first level package or the second level package for more efficient thermal management.

The invention discloses a heat-dissipating optical component package, comprising: a heat dissipation module; a plurality of insulating pads; and at least one conductive pad. The heat dissipation module includes a fin-shaped heat dissipation substrate and a plurality of heat dissipation columns disposed on the fin-shaped heat dissipation substrate; the plurality of insulation pads are disposed on the fin-shaped heat dissipation substrate; the at least one conductive pad is disposed And on the plurality of insulating pads and electrically connected to an optical component.

The invention discloses a method for manufacturing a heat-dissipating optical component package, the method comprising the steps of: forming a heat dissipation module comprising a fin-shaped heat dissipation substrate and a plurality of heat dissipation substrates disposed on the fin-shaped heat dissipation substrate a heat dissipating post; forming a plurality of insulating pads and at least one conductive pad on the plurality of insulating pads; combining the heat dissipating module and the plurality of insulating pads; and forming a reinforcing adhesive layer on the plurality of heat dissipating columns And the at least one electrically conductive pad.

The invention discloses a method for manufacturing a heat-dissipating optical component package, the method comprising the steps of: forming a plurality of insulating pads and at least one conductive pad on the plurality of insulating pads; forming a first reinforcing bonding layer thereon At least one conductive pad; combining the plurality of insulating pads and a fin-shaped heat dissipating substrate; forming a plurality of heat dissipating posts on the fin-shaped heat dissipating substrate; and forming a second reinforcing bonding layer on the plurality of heat dissipating columns on.

The technical features and advantages of the present disclosure have been broadly described above, and the detailed description of the present disclosure will be better understood. Other technical features and advantages of the subject matter of the claims of the present disclosure will be described below. It will be appreciated by those skilled in the art that the present invention may be practiced with the same or equivalents. It is also to be understood by those of ordinary skill in the art that this invention is not limited to the spirit and scope of the disclosure as defined by the appended claims.

The invention discloses a thermoelectrically separated package structure. From the viewpoint of the second level packaging, the embodiment of the present invention first replaces the thermal conductive adhesive in the conventional LED package with tin or other metal, so that the wafer completing the first level packaging can utilize the entire bottom region as a heat dissipation channel; One embodiment discloses a combination of a second level package and an LED die that is not packaged in a first level to form an on-board chip package (COB) structure. The new COB structure reduces the number of conductor-insulator interfaces in the heat dissipation path to improve heat dissipation efficiency. In addition, the fin-shaped heat dissipation substrate used in the following embodiments is integrally formed of aluminum metal, which can reduce the heat dissipation path interface shown in the heat dissipation structure of FIG. 3 , that is, the interface between the aluminum metal core printed circuit board 310 and the heat dissipation tape 312 , and The interface between the heat dissipation tape 312 and the fin-shaped aluminum heat dissipation plate 311. Another advantage of using the finned aluminum metal heat sink substrate is that the adhesion process of the aluminum metal core printed circuit board 310 and the aluminum heat sink 311 is omitted, and the use of the heat dissipating tape 312 is eliminated, and the process steps and time are also reduced. Another object of the present invention is to disclose a simple process for packaging the optical component, for example, using a metal material having a high thermal conductivity coefficient for thermal paste printing, metal foil lamination, and electroplating/electroless plating.

4 is a cross-sectional view of a high power LED package 40 that enhances heat dissipation in accordance with an embodiment of the present invention. The high power LED package 40 includes a heat dissipation module 41, a plurality of insulation pads 45, and at least one conductive pad 46. The heat dissipation module 41 includes a fin-shaped heat dissipation substrate 42 and a plurality of heat dissipation columns 43 disposed on the fin-shaped heat dissipation substrate 42. The plurality of insulation pads 45 are disposed on the fin-shaped heat dissipation substrate 42. The at least one conductive pad 46 is disposed on the plurality of insulating pads 45. According to an embodiment of the invention, a plurality of optical components 20, for example, a high-power LED chip having a first level package, are disposed on the plurality of heat dissipation posts 43 and electrically coupled to the at least one via the electrode 22 and the reinforcing adhesive layer 47. The pads 46 are electrically connected. The reinforcing adhesive layer 47 contains a metal film of tin or nickel/palladium/gold.

5 through 10 are flow charts of a manufacturing method in accordance with the embodiment of FIG. Referring to FIG. 5, a fin-shaped heat dissipation substrate 42 is composed of a material having a heat conductivity higher than 100 W/mK, for example, A1 3303, A1 3305, or other aluminum substrate or copper substrate. Then, a patterned thick film composed of a thermal conductive paste is placed on the fin-shaped heat dissipation substrate 42 by thick film printing, and the patterned thick film composed of the thermal conductive adhesive forms a solid conductor through a baking and sintering step. The solid conductor is a heat dissipation post 43 placed on the fin-shaped heat dissipation substrate 42. The heat dissipation post 43 and the fin-shaped heat dissipation substrate 42 form a heat dissipation module 41. The material of the thermal conductive paste contains aluminum, silver, copper, silver palladium alloy, palladium, platinum metal powder, or a combination of the above metals and alloy powders. The printed pattern can be a plurality of squares or polygons.

In FIG. 6 to FIG. 10, the plurality of insulating spacers 45 and the at least one conductive spacer 46 are combined according to the following steps: a copper foil 46 is placed on an insulating spacer 45 to form an unpatterned combination. The insulating spacer 45 is a double-sided adhesive layer. The thickness of the copper foil 46 can range from 1/2 oz. to 3 oz. (17 μm to 105 μm) depending on the needs. The double-sided adhesive layer has a thickness of between 5 μm and 150 μm, and the material comprises a double-sided adhesive, a resin, or other adhesive having adhesive properties. The upper and lower surfaces of the double-sided adhesive layer may further comprise an insulating layer such as polyimide (PI) to form a sandwich structure.

Referring to FIG. 7, the bonding unit is formed into a complementary pattern with the plurality of heat dissipation columns 43 in FIG. 5 through a punching process. Referring to Figure 8, a patterned colloid 46' is placed over the copper foil 46 of the bonding unit. The patterned colloid 46' is designed to form a particular circuit line structure, the material of which comprises a photoresist or resin, and in one embodiment is hardened by a drying step.

Referring to Figure 9, a simple etching step is used to remove the uncovered copper foil 46. The next step utilizes a chemical etch, such as a chemical wash, or a physical etch, such as sandblasting, to remove the remaining colloid 46'.

Referring to FIG. 10, the heat dissipation module 41 and the patterned bonding unit are aligned in a complementary manner, and the two units are bonded by the non-adhesive surface of the double-sided adhesive layer. An electroplated or electroless plating process bonds a reinforcing adhesive layer 47 to the copper foil 46 and the heat dissipating post 43. The reinforcing adhesive layer 47 contains a metal film of tin or nickel/palladium/gold. In an embodiment of the invention, the top surface of the heat dissipating post 43 is at least equal to or higher than the top surface of other components of the package structure. Referring back to FIG. 4, the optical component 20 is placed on top of the heat dissipating post 43 and electrically connected to the at least one electrically conductive pad 46 by electrodes 22 and a reinforcing adhesive layer 47. The reinforcing adhesive layer 47 containing a metal film of tin or nickel/palladium/gold is plated on the copper foil 46 and the heat dissipating post 43 and then the optical component 20 is placed thereon for better adhesion and Reduce the contact resistance between different materials.

11 is a cross-sectional view of a high power LED package 110 that enhances heat dissipation in accordance with another embodiment of the present invention. The high power LED package 110 includes a heat dissipation module 51, a plurality of insulation pads 55, and at least one conductive pad 56. The heat dissipation module 51 includes a fin-shaped heat dissipation substrate 52 and a plurality of heat dissipation columns 53 disposed on the fin-shaped heat dissipation substrate 52. The plurality of insulation pads 55 are disposed on the fin-shaped heat dissipation substrate 52. The at least one conductive pad 56 is disposed on the plurality of insulating pads 55. According to an embodiment of the present invention, a plurality of optical elements 20, such as a high-power LED chip having a first level package, are disposed on the plurality of heat-dissipating posts 53 and have electrodes 22 and corresponding first reinforcing bonding layers. 57 is electrically connected to the at least one electrically conductive pad 56. The first reinforcing adhesive layer 57 comprises a metal film of tin or nickel/palladium/gold.

12 through 18 are flow charts of a manufacturing method in accordance with the embodiment of Fig. 11. A copper foil 56 is placed on an insulating spacer 55 to form an unpatterned bonding unit, which is a double-sided adhesive layer. The thickness of the copper foil 56 can range from 1/2 oz. to 3 oz. (17 μm to 105 μm) depending on the needs. The double-sided adhesive layer has a thickness of between 5 μm and 150 μm, and the material comprises a double-sided adhesive, a resin, or other adhesive having adhesive properties. The upper and lower surfaces of the double-sided adhesive layer may further comprise an insulating layer such as polyimide (PI) to form a sandwich structure. The bonding unit forms a specific pattern as shown in FIG. 13 via a punching process.

Referring to Figure 14, a patterned colloid 56' is placed over the copper foil 56 of the bonding unit. The patterned colloid 56' is designed to form a particular circuit line structure, the material of which comprises a photoresist or resin, and in one embodiment is hardened by a drying step. Next, as shown in FIG. 15, a simple etching step is used to remove the uncovered copper foil 56. The next step utilizes a chemical etch, such as a chemical wash, or a physical etch, such as sand blasting, to remove the remaining colloid 56'.

As shown in FIG. 16, an electroplating or electroless plating process deposits a first reinforcing adhesive layer 57 on the conductive pad 56. The first reinforcing adhesive layer 57 comprises a tin or a metal film of nickel/palladium/gold. The steps of bonding the insulating spacer 55, the at least one conductive pad 56, the first reinforcing bonding layer 57, and the heat dissipation module 5 are as follows: Referring to FIG. 17, a fin-shaped heat dissipation substrate 52 is required to have a heat transfer coefficient. A material composed of a material higher than 100 W/mK, for example, A1 3303, A1 3305, or other aluminum substrate, copper substrate, and alloy thereof. The structure shown in Fig. 16 and the fin-shaped heat dissipation substrate 52 shown in Fig. 17 will be bonded by the non-adhesive surface of the double-sided adhesive layer.

Referring to FIG. 18, an electroplating or electroless plating process forms a plurality of heat dissipating columns 53 on the finned heat dissipating substrate 52 in a complementary manner to the structure shown in FIG. Referring back to Fig. 18, the heat dissipating post 53 is a thermal conductor having a thermal conductivity higher than 100 W/mK, and the material thereof comprises silver, copper, silver palladium alloy, palladium, platinum, or a combination of the above alloys. According to an embodiment of the invention, the top surface of the heat dissipating post 53 is at least equal to or higher than the top surface of other components of the package structure. A second reinforcing adhesive layer 58 comprising a metal film of tin or nickel/palladium/gold is formed on the top of the heat dissipating post 53 by an electroplating or a printing process to achieve better adhesion and reduce contact resistance between different materials. . As shown in the embodiment of FIG. 11, an optical component 20 is placed on top of the heat dissipating post 53 and electrically connected to the at least one electrically conductive pad 56 by electrodes 22 and corresponding first reinforcing bonding layers 57.

19 is a cross-sectional view of a high power LED package 190 that enhances heat dissipation in accordance with another embodiment of the present invention. The high power LED package 190 includes a heat dissipation module 193, a plurality of insulating pads 192, and at least one conductive pad 194. The heat dissipation module 193 includes a fin-shaped heat dissipation substrate 191 and a plurality of insulation pads 192 disposed on the fin-shaped heat dissipation substrate 191. The plurality of insulation pads 192 are disposed on the fin-shaped heat dissipation substrate 191. The at least one conductive pad 194 is disposed on the plurality of insulating pads 192. According to an embodiment of the invention in FIG. 19, a plurality of optical elements 197, such as a modified first level packaged high power LED wafer, are disposed on a plurality of heat dissipation posts 198 and are reinforced by electrodes 22 and a corresponding first The adhesive layer 195 is electrically connected to the at least one conductive pad 194. The first reinforcing adhesive layer 195 comprises a metal film of tin or nickel/palladium/gold.

20 through 22 are flow charts of a manufacturing method in accordance with the embodiment of Fig. 19. Referring to FIG. 20, a plurality of insulating spacers 201 are disposed on a fin-shaped heat dissipation substrate 200. The plurality of insulating spacers 201 are printed on the fin-shaped heat dissipation substrate via a printing patterning process. 200; the glass colloid is densified and cured through a drying and sintering process. The cured glass colloid has a high insulation resistance and a low dielectric constant. Preferably, the resistance is higher than 10 ⁸ ohms and the dielectric constant is lower than 20 at 1 kHz. The cured glass colloid can also have a good connection with the finned heat sink substrate. Referring to FIG. 21, a conductor paste is printed on a specific circuit pattern and a plurality of heat dissipation posts 212 on the finned heat dissipation substrate 200 using another printing patterning process. The circuit pattern corresponds to at least one conductive pad 213 in FIG. The composition of the conductor paste may be silver, copper, silver palladium alloy, palladium, platinum, or a combination of the above alloys. The patterned printed conductor paste is further subjected to a baking and sintering process to complete the at least one conductive pad 213 and the plurality of heat dissipation posts 212. Referring to FIG. 22, a reinforced adhesive layer 214 is plated on the at least one conductive pad 213 and the plurality of heat dissipation posts 212 via an electroplating or electroless plating process. The reinforced adhesive layer 214 comprises a metal film of tin or nickel/palladium/gold. As shown in FIG. 19, an optical component 197 is placed on top of the heat dissipation post 198 and electrically connected to the at least one conductive pad 194 by two electrodes 22 and a corresponding reinforcing adhesive layer 195. The optical element 197 of FIG. 19 differs from the optical element 20 of FIG. 2 in that a thermally conductive pad 196 is present between the two electrodes 22, since the heat dissipating post 197 has an equal height to the conductive pad 194, The purpose of the thermal pad 196 is to completely contact the bottom of the optical element 197 with the top of the heat sink 212 to enhance the effect of the heat dissipation.

The method for forming the heat dissipation column is as follows: 1) forming a plurality of heat dissipation columns on a fin-shaped heat dissipation substrate by an electroplating or electroless plating process, The heat dissipating column material comprises silver, copper, silver palladium alloy, palladium, platinum, or a combination of the above alloys; or 2) a patterned thick film formed on a fin-shaped heat dissipating substrate by thick film printing, the thickness The film material comprises silver, copper, silver palladium alloy, palladium, platinum metal powder, or a combination of the above metals and alloy powders. The method for forming the conductive pad is: 1) stacking a copper foil on an insulating layer, and then performing a patterning process, or 2) patterning a conductive paste formed on an insulating layer by thick film printing. A thick film comprising silver, copper, silver palladium alloy, palladium, platinum metal powder, or a combination of the above metals and alloy powders. The material constituting the insulating spacer may be a double-sided tape, a resin, an insulating polymer, an insulating glass system, or a combination of the above-mentioned insulating materials. In some embodiments of the present invention, the heat dissipating post and the conductive pad are both composed of a thermal conductive adhesive. The material of the thermal conductive paste comprises silver, copper, silver palladium alloy, palladium, platinum metal powder, or a combination of the above metals and alloy powders. In other embodiments of the present invention, the heat dissipating post is formed by electroplating, and the material thereof comprises silver, copper, silver palladium alloy, palladium, platinum, or a combination of the above alloys; and the conductive pad is formed by thermal film coating by thick film printing. The material of the thermal conductive paste comprises silver, copper, silver palladium alloy, palladium, platinum metal powder, or a combination of the above metals and alloy powders.

23 shows a cross-sectional view of an LED chip package 230 having a metal layer 234 on a passive surface 238 of a semiconductor substrate 231. The semiconductor substrate 231 includes a semiconductor region 233 and an insulating region 232. An epitaxially grown light emitting structure 235 is placed on an active surface 237 of the semiconductor substrate 231, and a metal layer 234, such as gold, is placed on a passive surface 238 of the semiconductor substrate 231. The two metal pads 236 are respectively disposed on the P-type layer and the N-type layer of the light-emitting structure 235, and are connected to an external bias (not shown) by the gold wire 239. The combination of the insulating region 232 and the metal layer 234 is the key to facilitating an on-board LED chip package (COB), and the COB can further increase the number of crystal grains per unit area. The following embodiments illustrate the integrated structure of the COB with a thermally enhanced optical package. 24 is a cross-sectional view of a high power LED on-chip package (COB) 240 that enhances heat dissipation in accordance with another embodiment of the present invention. The LED COB 240 includes a heat dissipation module 241, a plurality of insulating pads 245, and at least one conductive pad 246. The heat dissipation module 241 includes a fin-shaped heat dissipation substrate 242 and a plurality of heat dissipation columns 243 disposed on the fin-shaped heat dissipation substrate 242. The plurality of insulation pads 245 are disposed on the fin-shaped heat dissipation substrate 242. The at least one conductive pad 246 is disposed on the plurality of insulating pads 245 to form a bonding unit. In the present embodiment, an LED chip 230 is disposed on a heat dissipation post 243 and electrically connected to at least one conductive pad 246 of the bonding unit by a gold wire 249 and a corresponding reinforcing adhesive layer 247. The reinforced adhesive layer 247 comprises a tin or nickel/palladium/gold metal film and is disposed on the at least one conductive pad 246 for better adhesion and lowering between the gold wire 249 and the conductive pad 206. Contact resistance. The heat dissipating post 243 is composed of a conductor paste comprising silver, copper, silver palladium alloy, palladium, platinum metal powder, or a combination of the above metals and alloy powders. The conductive gasket 246 of the present invention comprises a metal foil, preferably a copper foil, for example, stacked on the insulating liner 245. The array of light-emitting elements formed by a plurality of LED chips 230 is then packaged by a phosphor paste 244 to form a thermally enhanced LED COB structure 240. The above is only one of many embodiments of the present invention, which discloses that the heat-dissipating optical package can be integrated with the COB structure. In other words, the fin-shaped heat sink base portion of other embodiments of the present invention can be combined with the LED COB structure. In combination, an array of light-emitting elements having an optical package that enhances heat dissipation is produced.

In summary, the present invention discloses an optical component package that enhances heat dissipation and a process thereof. The embodiments of the present invention utilize a combination of different materials to construct a package structure and integrate with LED chips of different package levels. The heat-dissipating optical component package conducts heat generated by the LED wafer to the fin-shaped heat dissipation substrate via the heat dissipation post. The heat dissipating post has a simple process comprising an electroplating or an electrodeless plating step, a metal foil lamination step, a thick film printing step, and a patterning and etching step.

The technical content and the technical features of the present disclosure have been disclosed as above, but those skilled in the art should understand that the teachings and disclosures of the present disclosure are disclosed without departing from the spirit and scope of the disclosure as defined by the appended claims. Can be used for various substitutions and modifications. For example, many of the processes disclosed above may be implemented in different ways or in other processes, or a combination of the two.

Moreover, the scope of the present invention is not limited to the particular process, machine, manufacture, composition, means, method or method of the particular embodiments disclosed. It should be understood by those of ordinary skill in the art that, based on the teachings of the present disclosure, the process, the machine, the manufacture, the composition of the material, the device, the method, or the steps, whether present or future developers, The revealer performs substantially the same function in substantially the same manner, and achieves substantially the same result, and can also be used in the present disclosure. Accordingly, the scope of the following claims is intended to cover such <RTIgt; </ RTI> processes, machines, manufactures, compositions, devices, methods or steps.

10. . . Low power LED with first level package

11. . . Plastic J lead chip package

12. . . Metal lead

13, 23, 303, 199, 209, 239, 249. . . Gold Line

14, 24, 304. . . Bell package

15, 25, 305. . . Hole movement

16. . . Low power LED die

20. . . High power LED with first level package

twenty one. . . Alumina or aluminum nitride substrate

twenty two. . . electrode

26. . . High power LED die

300. . . High power LED with second level package

301. . . Alumina or aluminum nitride substrate

302. . . Metal electrode

306. . . gap

308. . . Solder mask ink

309. . . Dielectric layer

310. . . Aluminum metal core printed circuit board

311. . . Finned aluminum heat sink

312. . . Thermal tape

313. . . High power LED die

40, 110, 190, 240. . . High power LED package

41, 51, 193, 241. . . Thermal module

42, 52, 191, 200, 242. . . Fin-shaped heat sink substrate

43, 53, 197, 198, 212, 243. . . Heat sink

45, 55, 192, 201, 245. . . Insulating gasket

196. . . Thermal pad

46, 56, 194, 213, 246. . . Conductive gasket

46', 56'. . . colloid

47, 195, 214, 247. . . Reinforced adhesive layer

57. . . First reinforcing adhesive layer

58. . . Second reinforcing adhesive layer

230. . . LED chip

231. . . Semiconductor substrate

233. . . Insulated area

232. . . Semiconductor region

234. . . Metal layer

235. . . Luminescent epitaxial structure

236. . . Metal liner

237. . . Active surface

238. . . Passive surface

230. . . On-board LED chip package (COB)

244. . . Fluorescent glue

Figure 1 shows a low power LED cross-sectional view of a conventional metal lead package structure;

2 shows a cross-sectional view of a high power LED having a conventional circuit line package structure;

3 shows a high power LED cross-sectional view of a conventional aluminum metal core printed circuit board (MCPCB) and an aluminum heat sink package structure;

4 is a cross-sectional view of a high power LED package with enhanced heat dissipation according to an embodiment of the invention;

5 to 10 are flowcharts of a manufacturing method according to the embodiment of FIG. 4;

11 is a cross-sectional view of a high power LED package with enhanced heat dissipation according to another embodiment of the present invention;

12 to 18 are flowcharts of a manufacturing method according to the embodiment of Fig. 11;

19 is a cross-sectional view of a high power LED package with enhanced heat dissipation according to an embodiment of the invention;

20 to 22 are flowcharts of a manufacturing method according to the embodiment of Fig. 19;

Figure 23 shows a cross-sectional view of an LED die having a metal layer in the passive mask;

24 is a cross-sectional view of a high power LED on-chip package (COB) for enhancing heat dissipation in accordance with another embodiment of the present invention.

20. . . High power LED with first level package

twenty one. . . Alumina or aluminum nitride substrate

twenty two. . . electrode

twenty three. . . Gold Line

40. . . High power LED package

41. . . Thermal module

42. . . Fin-shaped heat sink substrate

43. . . Heat sink

45. . . Insulating gasket

46. . . Conductive gasket

47. . . Reinforced adhesive layer

Claims (25)

An optical component package for enhancing heat dissipation, comprising: a heat dissipation module configured to conduct heat generated by an optical component, wherein the optical component and the heat dissipation module are in contact with each other, the heat dissipation module comprises: a fin-shaped heat dissipation substrate And a plurality of heat dissipating columns disposed on the fin-shaped heat dissipating substrate; a plurality of insulating pads disposed on the fin-shaped heat dissipating substrate; at least one conductive pad disposed on the plurality of insulating pads, and Electrically connected to the optical component. The heat-dissipating optical component package of claim 1, wherein the optical component is a light-emitting component wafer that is completed in a first-level package, and is disposed on the plurality of heat-dissipating posts and electrically connected to the conductive pad. The heat-dissipating optical component package according to claim 1, wherein the optical component is a light-emitting component die that is not completed in the first-level package, is disposed on the plurality of heat dissipation posts, and is electrically connected to the conductive pad. The heat-dissipating optical component package of claim 3, wherein the light-emitting component die comprises: a semiconductor substrate having an insulating region and a semiconductor region disposed on the insulating region; a conductive layer disposed on the semiconductor a passive surface of the substrate is in contact with the insulating region of the semiconductor substrate; and a light emitting structure is epitaxially grown on an active surface of the semiconductor substrate to be in contact with the semiconductor region of the semiconductor substrate. The heat-dissipating optical component package according to claim 1, wherein the fin-shaped heat dissipation substrate comprises aluminum, copper, or an alloy thereof The thermally dissipating optical component package of claim 1, wherein the heat dissipating post is a thermal conductor having a thermal conductivity higher than 100 W/mK. The heat-dissipating optical component package of claim 1, wherein a top surface of the heat dissipation post is equal to or higher than a top surface of other members of the optical component package. The heat-dissipating optical component package according to claim 1, wherein the insulating spacer comprises a double-sided tape, a resin, an insulating polymer, an insulating glass system, or a combination of the above-mentioned insulating materials. The heat-dissipating optical component package of claim 1, wherein the conductive gasket comprises copper, palladium, a silver-palladium alloy, or an alloy thereof. A method for manufacturing a heat-dissipating optical component package includes the steps of: forming a heat dissipation module, the heat dissipation module comprising a fin-shaped heat dissipation substrate; and a plurality of heat dissipation columns disposed on the fin-shaped heat dissipation substrate; a plurality of insulating pads and at least one conductive pad on one of the plurality of insulating pads; combining the heat dissipation module and the plurality of insulating pads; and forming a reinforcing bonding layer on the plurality of heat dissipation columns and the at least On a conductive pad. The manufacturing method according to claim 10, further comprising the step of: bonding an optical component to the heat dissipation post by the reinforcing adhesive layer; and electrically connecting the optical component and the conductive gasket. The manufacturing method according to claim 10, wherein the step of forming the plurality of heat dissipating columns comprises a thick film printing process, and the material of the plurality of heat dissipating columns comprises a conductive paste. The manufacturing method according to claim 10, wherein the step of forming a plurality of insulating spacers comprises: bonding a metal foil on one side of a double-sided adhesive layer, wherein the double-sided adhesive layer is an insulator; and the double-sided adhesive layer And forming a specific pattern on the metal foil; printing a patterned colloid on the metal foil; etching a metal foil not covered by the colloid; The patterned colloid is removed. The manufacturing method according to claim 10, wherein the step of forming the reinforcing adhesive layer comprises a surface printing process or an electroplating process. A method for manufacturing an optical component package for enhancing heat dissipation, comprising the steps of: forming a plurality of insulating pads and at least one conductive pad on one of the plurality of insulating pads; forming a first reinforcing bonding layer on the at least one conductive layer a plurality of insulating pads and a fin-shaped heat dissipating substrate; forming a plurality of heat dissipating posts on the fin-shaped heat dissipating substrate; and forming a second reinforcing bonding layer on the plurality of heat dissipating columns. The manufacturing method of claim 15, further comprising the step of: bonding an optical component to the heat dissipating post by the second reinforcing adhesive layer; and electrically connecting the optical component and the conductive pad. The manufacturing method according to claim 15, wherein the step of forming a plurality of insulating spacers comprises: bonding a metal foil on one side of a double-sided adhesive layer, wherein the double-sided adhesive layer is an insulator; and the double-sided adhesive layer And forming a specific pattern on the metal foil; printing a patterned colloid on the metal foil; etching the metal foil not covered by the colloid; and removing the patterned colloid. The manufacturing method according to claim 15, wherein the step of forming the plurality of heat dissipation columns comprises an electroplating or an electroless plating process. The manufacturing method according to claim 15, wherein the step of forming the first reinforcing adhesive layer comprises a surface printing process or an electroplating process. The manufacturing method according to claim 15, wherein the step of forming the second reinforcing adhesive layer comprises a surface printing process or an electroplating process. A method for manufacturing a heat-dissipating optical component package includes the steps of: forming a heat dissipation module, the heat dissipation module comprising a fin-shaped heat dissipation substrate; and a plurality of insulation pads disposed on the fin-shaped heat dissipation substrate; Forming a plurality of heat dissipating posts and at least one electrically conductive pad on one of the plurality of insulating pads; and forming a reinforcing bonding layer on the plurality of heat dissipating posts and the at least one electrically conductive pad. The manufacturing method of claim 21, further comprising the step of: bonding an optical component to the heat dissipation post by the reinforcing adhesive layer; and electrically connecting the optical component and the conductive gasket. The manufacturing method according to claim 21, wherein the step of forming the plurality of insulating spacers comprises printing a patterned insulating layer on the fin-shaped heat dissipating substrate. The manufacturing method of claim 21, wherein the step of forming the plurality of heat dissipation columns and the at least one conductive pad comprises a thick film printing process, and the plurality of heat dissipation columns and the material of the at least one conductive pad comprise conductive gum. The manufacturing method according to claim 21, wherein the step of forming the reinforcing adhesive layer comprises a surface printing process or an electroplating process.