TWM368893U - Plastic lead frame structure with reflective and conductor metal layer - Google Patents

Description

M368893 V. New description: [New technical field] This creation is about a lead frame preparation technology for a light-emitting diode. Specifically, δ refers to a plastic lead frame structure with a reflective and conductive metal layer, thereby simplifying the process, Moreover, the cost can be reduced, and the reflection efficiency and the wire area can be further improved to form a lead frame structure with high heat conduction effect. [Prior Art] According to the existing light-emitting diode lead frame, it is generally used for conductive materials (such as copper, copper alloy or aluminum), and the lead frame is formed by stamping, followed by electricity. Treatment, on the surface of the lead frame billet material, the electrode layer has a highly conductive metal layer (such as tin, silver, gold, etc.) and then uses the insert molding technique (Insert M〇lding) to form a cup-shaped light-emitting The polar body lead frame, but the reflective area of the cup-shaped lead frame cannot effectively provide the reflection effect of the metal layer. In addition, there is also a Laser Structuring 'LDS process applied to the lead frame of the light-emitting diode. The disadvantage of this process is that the laser is used to directly activate the process-specific material. After the material is ejected, its electrode and reflective area Surface activation using lasers, which will roughen the surface due to laser 'and the area of the laser is too large'. The slope is limited by the angle of the laser and the processing time, and the roughness after laser activation will cause the original The reflection angle of the design is different from the reflection brightness. In addition, the 3D stereo laser processing equipment is expensive. The processing time is too long and the cost is too high. M368893 In addition, 'the existing ones also have Low-Temperature Co-fired Ceramics' (LTCC). Because of the similar materials of Tauman and Tantalum, they can be connected to the wafer, and their thermal conductivity and heat resistance are very good. However, the low-temperature co-fired multi-layer ceramics need to be sintered at a temperature of about 900 degrees, which has different shrinkage phenomena, tends to increase electrical fluctuation factors, and the ceramic process is expensive, and the mass production cost is not easily lowered. In addition, although some operators consider the two-shot technology to make the lead frame, in the existing two-shot technology, there are two methods: PCK method and SKW method. The PCK method is the first injection molding method. Plastics that can be electroplated and modified via catalysis are used, which are made of non-platable plastic during the second injection molding, and the surface of the component is then etch activated and metallized. As for the SKW method, the electroplated plastic is used in the first injection molding, and then the first injection molded plastic surface is etched, and the surface is activated with palladium (pd), the component is placed in the mold, and the execution is performed. After the second injection molding, the surface of the component is metallized. These two methods are limited in the processing of extremely fine lines and are limited by the two-shot process, and cannot effectively form extremely fine lines. In other words, the existing light-emitting diode lead frame may not be able to reduce the manufacturing cost due to the complicated process, or the surface may be rough due to the activation of the laser, thereby failing to achieve the original design reflection angle and reflection brightness, thereby affecting the Reflectivity is not suitable for micronized insulated circuit patterns, so how to provide a wire that combines ease of fabrication, low cost, and high reflectivity

Claims (1)

M368893 VI. Patent application scope: Λ. A plastic lead frame structure with a reflective and conductive metal layer, comprising: a base, the base is inclined downwardly to form a reflecting surface on the top surface, and then on the outer periphery of the reflecting surface The edge is formed with a staggered carrier recess, and a carrier is formed by the injection technique in the carrier recess, and a surface layer is further deposited on the surface of the base. The interface layer is formed on the surface of the base by electroless plating, and is reused. The laser technique strips a portion of the interface layer to form an insulated line, and finally performs a Φ plating or chemical deposition of a metal layer on the pedestal to form a plastic leadframe structure having a reflective metal layer. 2. Please ask for the scope of patents! The plastic lead frame structure of the reflective and conductive metal layer is wherein the pedestal and the carrier are formed by two-shot injection of different plastic materials. For example, the plastic lead frame L with reflection and conductor metal layer described in the item (4) of the π patent (4), the base and the carrier can be formed by the injection of the same plastic material, and the base is doped with metal. Catalyst plastic or plastic containing organic matter. 4. 5. Such as the whistle patent | & A plastic lead frame structure having a reflective and conductive metal layer, wherein the pedestal is formed by doping a plastic (tetra) material containing a metal catalyst, and is formed with a metal-free catalytic plastic or an organic-free plastic. A carrier attached to the base, and the base is inclined downwardly from the top surface to form a reflecting surface to constitute a lead frame blank. In the plastic 13 M368893 with a reflective and conductive metal layer as described in claim 1, the susceptor is formed by a single plastic shot, and the formed pedestal is etched out, and the plastic is in its surface material lead frame structure, After the injection molding base is uniformly immersed or coated with the catalyst, the base having the whole catalyst soaked or coated is then subjected to the second injection molding process using the same plastic, and the injection molding is carried out for the first injection molding. The body, wherein the base is inclined downward from the top surface to form a reflecting surface to form a lead frame blank. 6_ A plastic lead frame structure having a reflective and conductive metal layer as described in claim 3 or 4, wherein the metal catalyst or an organic substance thereof is mainly palladium, copper, silver or the like. The plastic lead frame structure having a reflective and conductive metal layer as described in claim 1, 4 or 5, wherein the top surface and the reflecting surface define an angle between 15 degrees and 85 degrees to enhance the illumination. Diode luminous efficiency. 8. A plastic lead frame structure having a reflective and conductive metal layer as described in claim 4, wherein a lead frame blank is produced, followed by a surface-activated key bath pretreatment, and is applied to the surface of the base. A mineral layer is deposited by a chemical ore method. 9_A plastic lead frame structure having a reflective and conductive metal layer as described in claim 5, wherein a lead frame blank is produced, followed by a partial surface activation plating bath pretreatment, and on the surface of the base A mineral layer is deposited by a chemical ore method. 1 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A plastic lead frame structure having a reflective and conductive metal layer as described in claim 9 wherein after the plating of the interface layer is deposited, partial peeling of the interface layer is performed by laser to form an insulated line. 12_ A plastic lead frame structure having a reflective and conductive metal layer as described in claim 10, wherein the insulating layer is reused on the interface layer The metal layer is electroplated or chemically deposited to complete the fabrication of the plastic leadframe structure. 13_ The plastic lead frame structure having a reflective and conductive metal layer according to claim 11 wherein the dielectric layer of the insulated circuit is electrically or chemically deposited on the interface layer of the insulated circuit to complete the plastic lead frame structure Production. 14. A plastic leadframe structure having a reflective and conductor metal layer as described in claim 1, 8 or 9, wherein the electroless plating process grows chemical nickel or chemical copper on the surface of the pedestal to form an interfacial layer. 15. A plastic leadframe structure having a reflective and conductor metal layer as described in claim 1, 12 or 13 wherein the plated or chemically deposited metal layer is selected from the group consisting of copper, nickel, silver, gold, chromium, It is formed by any of a group consisting of chemically substituted gold, copper/nickel/silver, and copper/nickel/gold. 16_ A plastic lead frame structure having a reflective and conductive metal layer as described in claim 4 or 5 wherein the plastic forming the pedestal and the carrier is optional. demand. M368893 » A plastic lead frame structure with a reflective and conductive metal layer as described in claim 1 or 10, which is capable of withstanding a plastic having a high temperature resistance of more than 260 degrees, in accordance with the reflow process. Selecting from a carbon dioxide laser, a Nd:YAG laser, a Nd:YV04 crystal laser, a pseudo-laser, etc., the laser wavelength of the laser insulation step is selected from Used in 248 nm, 308 nm, 355 nm, 532 nm, 1064 nm or 10600 nm. 16