201204210 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電路板的製造方法，且特別是有 關於一種軟硬複合電路板的製造方法。 【先前技術】 隨著電子產品市場的持續成長及多樣化，使得電路板 的應用也隨之多樣化。在多數的電子商品中，電路板是不 ® 可或缺的組件。電路板係用以承載電子元件以及電子元件 之間的電路。電路板可分為硬性電路板、軟性電路板以及 軟硬複合電路板’其中軟硬複合電路板具有較高的設計彈 性，故可廣泛地應用在各式的電子產品中。 f的軟硬複合電路板是分別先形成硬性電路板的電 路以及軟性電路板的電路，然後再將以適當的方式將硬性 電路板與軟性電路板接合。例如，先在硬性電路板侧邊的 夹層中形成凹槽，然後將軟硬電路板的一端插入凹槽中， 鲁並黏著固定’再於硬性電路板與軟硬電路板接合處的上方 形成連接孔’以電性連接硬性電路板與軟性電路板。 另一種習知的連接方式為與硬板尺寸類似大小的軟板 介於一個硬板的中間層，軟板的兩端被二個硬板夾合。然後 .在硬性電路板上形成電性連接孔，以將硬性電路板與軟硬 電路板電性連接。 上述的製造方法，均難實現可靠的自動化生產流程。 且、在上述第一種方法中，軟硬板連接處的可靠性與機械 強度不佳’容易脫落或電性接觸不良。而在上述的第二種 201204210 方法中，在形成電性連接孔時，此軟硬電路板半成品的一 端是硬性電路板，而另一端是軟性電路板，在進行後續製 程或運送的過程非常不便。所以，目前仍需要一種可改善 上述問題的製造方法。 【發明内容】 本發明之一目的係提供一種軟硬複合電路板與其製造 方法，俾能實現自動化製造、提升產品良率及可靠度。 上述製造軟硬複合電路板的方法，包括以下步驟。提 供一第一硬性基板，此第一硬性基板之相對兩側分別具有 一第一表面以及一第二表面。在此第一硬性基板之一第一 預定移除區域邊緣具有一第一切割線以及一第二切割線， 其中該第一及第二切割線貫穿第一硬性基板。黏附一第一 黏膠層於第一硬性基板的第二表面上，此第一黏膠層具有 一第一開口對應第一預定移除區域而露出部分的第一硬性 基板之第二表面。配置一軟性電路板於部分第一黏膠層上 以及第一硬性基板之第一預定移除區域上方。黏附第二黏 膠層於部分軟性電路板上以及未被軟性電路板覆蓋之第一 黏膠層上方，其中此第二黏膠層具有一第二開口，且第二 開口的位置對應於第一開口上方。黏附第二硬性基板與第 二黏膠層，此第二硬性基板之相對兩側分別具有一第一表 面以及一第二表面，其中第二硬性基板之第二表面接觸第 二黏膠層，且第二硬性基板之一第二預定移除區域邊緣具 有貫穿第二硬性基板之一第三切割線以及一第四切割線， 且第三切割線位置對應於第一切割線位置上方、第四切割 201204210 線位置對應於第二_通位置上方。 上述軟硬複合電路板，包括：一旦 ί-第-切割移除區之第-硬性基板 • : Γΐ:切割移除區之第二硬性基板?以及- 置;的軟性電路板，其中第二切割移除區的位 ί-L!:相對兩側分別具有-第-表面以及- ^黏附於軟性電路板上，第-黏膠層具有二一二:ί 出部分的軟性電路板，而第一㈣二、* 路 露出部分第一黏膠層；一第：板：第-切割移除區 A板：ΪΓ 表面，第-表面黏附於第二硬性 二第ί二表面黏附於軟性電路板上，此第二黏膠層 =4-開口以露出部分軟性電路板，而第二硬性基板 之，-切割移除區露出部分第二黏二 表：r二黏膠層之第二表面部分係丄:膝： 性連ί第硬=越第一黏膠層與第一硬性基板，以電 ϊΐί硬性基板之第—導電線路與軟性電路板之第- 【實施方式】 造過=圖=2為本發明—實施方式之製造方法的製 =。第=α圖及第_，首先提供第-硬性 土板〇〇。第1Α圖為第_硬性基板刚 1Β圖為第1Α^ 1Β至 祝不思圖’第 Β的J面不思圖。如第⑴圖所 201204210 示，第一硬性基板100的相對兩側分別具有第一表面101 以及第二表面102,且第一表面101上具有第一銅層103(第 一金屬廣）。當然，第二表面102上也可具有另一金屬層（例 _ 如銅層）所形成的對位標記(alignment mark)(未圖示）。在一 - 實施例中，第一硬性基板1 〇〇為熱固型材料，例如玻璃纖 維布基板(例如Flame Retardant 4 ’ FR4基板）’其已廣泛地 應用在印刷電路板中。 如第1A圖所示，在第一硬性基板100的第一預定移 鲁 除區域105的邊緣形成第一切割線110以及第二切割線 120，第一及第二切割線no、120由上至下貫穿第一硬性 基板100。形成第一及第二切割線110、120的方法並無特 殊限制，舉例而言，可利用刀模切割（或稱鋼模切割）或雷 射切割技術。第一及第二切割線110、120的位置及長度是 根據產品需求而設計，並無特別限制。 請參見第2A及2B圖，在第一硬性基板100的第二表 面1〇2上形成第一黏膠層200，且第一黏膠層200上具有 φ 第—開口 210，而露出部分第一硬性基板1〇〇的第二表面 W2。第一黏膠層2〇〇的第一開口 21〇形成方法並無特殊限 制’舉例而言，可利用沖型機或雷射切割機。第一黏膠層 2〇〇覆蓋第一及第二切割線110、120，且第一及第二切割 線110、120大致平行第一開口 210之一邊。在一實施例中， 形成第一黏膠層200於第一硬性基板100上的方法是使用 快壓機將一具有黏著性的膠層壓合在第一硬性基板100的 第二表面上102上。在另一實施例中，可藉由同時提供外 在壓力及高溫’將第一黏膠層200附著在第一硬性基板100 201204210 上。第一黏膠層200可為熱塑性高分子材料，其在受熱後 軟化熔融而具有黏著性。 接著，請參見第3A及3B圖，在第一黏膠層200上配 • 置軟性電路板300,且軟性電路板300跨越第一黏膠層200 • 的第一開口 210。在一實施例中，軟性電路板300包括第 一部310、第二部320以及中間部330。中間部330大致對 應於第一開口 210上方，第一部310由中間部330之一端 延伸跨越第一切割線110，第二部320由中間部330的另 φ 一端延伸跨越該第二切割線120，如第3A及3B圖所示。 第一黏膠層200的相對兩側分別具有第一表面201以及第 二表面202，第一表面201黏附於第一硬性基板100上， 且軟性電路板黏附於第二表面202上。在一實施例中，使 用貼附機將軟性電路板300預貼合在第一黏膠層200上， 例如利用貼附機提供約120°C的溫度，將軟性電路板300 的第一部310及第二部320預貼合在第一黏膠層200上。 在一特定實施例中，軟性電路板300包括第一保護層 書 301、第一導電層302、絕緣層303、第二導電層304以及 第二保護層305,上述各層別可由下而上依序配置，如第 3C圖所示，但本發明不限於此。第一及第二導電層302、 304可例如為圖案化之銅層（銅線路），用以傳輸電能或訊 號。第一及第二保護層301、305用以保護第一及第二導電 層302、304，避免第一及第二導電層302、304刮傷或損 毀。絕緣層303、第一及第二保護層301、305可例如為聚 亞醯胺之高分子材料。在一實施例中，第一保護層301配 置於軟性電路板300鄰接第一黏膠層200之外側表面，且 201204210 第二保護層305配置於軟性電路板300相對於第一黏膠層 200的另一外側表面。絕緣層303配置於第一保護層301 與第二保護層305之間；第一導電層302配置於絕緣層303 與第一保護層301之間；且第二導電層304配置在該絕緣 層303與該第二保護層305之間。 接著，請參見第4A及4B圖’形成第二黏膠層400於 部份軟性電路板300上以及未被軟性電路板300覆蓋的第 一黏膠層200上。第二黏膠層400具有第二開口 420，且 該第二開口 420之尺寸大致與第一黏膠層200之第一開口 210相同，並位於該第一開口 210上方。形成第二黏膠層 400方法可與第一黏膠層200相同，於此不再重述。 然後，如第5A及5B圖所示，在第二黏膠層400上配 置第二硬性基板500。如第5B圖所示，第二硬性基板500 的相對兩侧分別具有第一表面501以及第二表面502，第 一表面501上具有第二銅層503(第二金屬層），且第二硬性 基板500的第二表面502接觸第二黏膠層400。換言之， 第二黏膠層400的相對兩側分別具有第一表面401以及第 二表面402，第一表面401黏附於第二硬性基板上，且第 二表面402黏附於軟性電路板300上。第二硬性基板500 上的第二預定移除區域505的邊緣具有第三切割線530以 及第四切割線540，第三切割線530及第四切割線540分 別貫穿第二硬性基板500，且第二硬性基板500的第三切 割線530大致位於第一切割線11〇上方，而第四切割線540 大致位於第二切割線丨2〇上方。在一實施例中，係利用壓 合機提供外在壓力及適當溫度，將第二硬性基板500與第 201204210 一硬性基板100之間的各層緊密壓合在一起，其為本領域 技術人士所熟悉。在一特定實施例中，第三及第四切割線 530、540的長度分別與第一及第二切割線11〇、120相同， 但本發明不限於此。第二硬性基板500上形成第三及第四 切割線530、540的方法可與在第一硬性基板100上形成第 一及第二切割線110、120的方法相同或不同。在一實施例 中’先在第二硬性基板500上形成第三及第四切割線530、 540後，然後再進行壓合步驟。在另一實施例中，先進行 壓合步驟後’在利用諸如雷射切割技術，於第二硬性基板 500上形成第三及第四切割線530、540。 或者’請參見第5C圖，在形成第二黏膠層400之前， 可先配置一填充層410於第一黏膠層200上，然後再形成 第二黏膠層400於填充層410上。在此一實施方式中，在 第一黏膠層200與第二黏膠層400之間配置填充層410， 可降低第一黏膠層200與第二黏膠層400所需的使用量。 填充層410的材料可為硬性或軟性材料，化學性質性安定 的材料均可。例如，填充層410可為諸如銅之金屬材料或 諸如環氧樹脂基板之非金屬材料。 在一實施方式中，在完成上述步驟後，或在第一黏膠 層配置於第一硬性基板後，在第一硬性基板1〇〇上形成第 一連接孔001以及第二連接孔602，以及在第二黏膠層配 置於第二硬性基板後，在第二硬性基板500上形成第三連 接孔603以及第四連接孔604 ’如第6A及6B圖所示。第 及第二連接孔601、602貫穿第一硬性基板1〇〇、第一黏 膠層200以及軟性電路板3〇〇的第一保護層3〇1，使軟性 201204210 電路板300之第一部310中的第一導電層302可經第一連 接孔601露出，以及使軟性電路板300之第二部320中的 第一導電層302可經第二連接孔602露出。同理，第三及 第四連接孔604由上至下貫穿第二硬性基板500、第二黏 膠層400以及軟性電路板300之第二保護層305，使軟性 電路板300之第一部310中的第二導電層304可經第三連 接孔603露出，以及軟性電路板300之第二部320中的第 二導電層304可經第四連接孔604露出。 形成第一、第二、第三及第四連接孔601、602、603、 604後’在該第一及第二連接孔6〇2中形成第一電連接層 610,以及在第三及第四連接孔6〇4中形成第二電連接層 620。第一電連接層61〇及第二電連接層620可以在同一步 驟中完成，例如’以化學鍍（或稱無電電鍍，electr〇less plating)同時形成第一及第二電連接層61〇、620。因此，軟 性電路板300中的第一導電層3〇2經第一電連接層61〇電 性連接第一硬性基板100的第一銅層103，且軟性電路板 300中的第二導電層3〇4電性連接第二硬性基板5〇〇的第 二銅層503。 上述的製造方法中，可更包括圖案化第一銅層1〇3以 及第二銅層5〇3。圖案化第一及第二銅層1〇3、503可在形 成第一及第二電連接層61〇、620之後進行。在一實施例 中’是以習知的顯影、蝕刻製程將第一及第二銅層1〇3、 503圖案化’而形成產品的電路如第一硬性基板100上的 第一導電線路丨〇7與第二硬性基板50〇上的第二導電線路 507，如第6A及6B圖所示。 10 201204210 請參見第7圖，在一實施方式中，於完成上述步驟後， 形成第五切割線650,其可由上往下貫穿第一硬性基板1〇〇 至第二硬性基板500之間的所有層。亦即第五切割線650 • 由第一硬性基板100的第一表面101貫穿至第二硬性基板 ' 5〇〇的第一表面501。且第五切割線650、第三切割線530 以及第四切割線540至少大致圍成該軟性電路板300的中 間部330。在一實施例中，如第7圖所示，第五切割線650 包括第7圖左側標示的651、652及653，以及第7圖右側 • 襟示的654、655及656。第五切割線標示為652以及標示 為655的部分大致分別沿著軟性電路板300的中間部330 之兩側，且第五切割線標示為652及655的部分與第三切 割線530及第四切割線540大致圍成第二硬性基板500的 第二預定移除區域505。第五切割線標示為652及655的 部分與第一切割線110及第二切割線120大致圍成電路板 3〇〇的第一預定移除區域105。因為第五切割線650由第二 硬性基板500貫穿至第一硬性基板100，所以第五切割線 % 榡示651、652、653的部分以及邊界630所圍成的區域亦 ▼完整地被移除，同時第五切割線標示654、655、656的 部分以及邊界640所圍成的區域也可完整地被移除。第8 圖繪示移除上述兩部分後的上視圖。 然後，移除位於軟性電路板300之中間部330上方的 第二硬性基板500，以及移除位於軟性電路板300之中間 、 部33〇下方的第一硬性基板100。如第9A及9B圖所示， 在一實施例中，位於中間部330上方部分的第二硬性基板 5〇〇只有在第三及第四切割線530、540附近具有小面積的 201204210 第二黏膠層400,因此可輕易移除第三切割線53〇至第四 切割線540之間位於中間部330上方部分的第二硬性基板 500。同理，也可以移除第一切割線11〇至第二切割線12〇 之間位於中間部330下方部分的第—硬性基板ι〇〇，而露 出軟性電路板300的中間部330。因此，在第9A圖中，軟 性電路板300之第一部310連接一片多層硬性電路板51〇， 而軟性電路板300之第二部320連接另一片多層硬性電路 板520。兩個多層硬性電路板之間以軟性電路板3〇〇連接， 而完成一軟硬複合電路板。 在上述的製造方法中’當然存在其他的實施態樣。例 如’第五切割線與其他的切割線圍成一封閉的區域，並將 此區域中的所有層移除。例如第五切割線65〇僅包括第7 圖左側標示的652 ’以及第7圖右侧標示的655。故僅軟性 電路板300的中間部330上下方的第二硬性基板5〇〇與第 一硬性基板100將被移除。 在其他實施例中’上述之第二黏膠層400可形成在第 二硬性基板500的第二表面502上，然後再進行壓合及後 續步驟，以下將詳述。 在完成如第3B圖所示的結構之前或之後或同時，準備 第二硬性基板500，如上所述’第二硬性基板5〇〇的相對 兩側分別具有第一表面以501及第二表面502，且第二硬 性基板500的第一表面上具有第二銅層503。並根據第一 硬性基板100上的第一及第二切割線110、120的配置，在 第二硬性基板500上形成第二切割線5 3 0以及第四切割線 540’且第三及第四切割線530、540貫穿第二硬性基板5〇〇。 [S] 12 201204210 接著，第二硬性基板500的第二表面502上形成第二 黏膠層400。第二黏膠層400中具有第二開口 420以露出 部分的第二表面502，且第二黏膠層400覆蓋第三及第四 切割線530、540。在一實施例中，第三及第四切割線540 是大致平行第二開口 420的周邊。 然後，將形成有第二黏膠層400的第二硬性基板500 與配置有軟性電路板300的第一硬性基板100進行壓合’ 使軟性電路板3〇〇夾置於第一黏膠層200與第二黏膠層400 之間。第三切割線530、第四切割線540以及第二開口 420 分別位於該第一切割線110、第二切割線120以及第一開 口 210上方，而完成如第5B圖所示的結構。然後可進行後 續製程，例如形成連接孔、電連接層、或圖案化第一銅層 以及第二銅層的製程。 在上述的製造方法中’當然還有其他的實施態樣。例 如，在完成如第6B圖所示的結構後，可接著進行電路板的 增層製程。請參見第6C圖，在一實施例中，在第二硬性基 板500的第一表面501上依序形成第一增層板71〇、第二 增層板720以及第三增層板730 ’且在第一硬性基板i〇〇 的第一表面101上依序形成第四增板層740、第五增層板 750以及第六增層板760。第一增層板710、第二增層板72〇 以及第三增層板730上分別具有第一電路712、第二電路 722以及第三電路732。第四增層板740、第五增層板750 以及第六增層板76〇上分別具有第四電路742、第五電路 752以及第六電路762。上述增層板可用以增加導電線路， 例如，可在不同的增層板上形成不同的電路圖案，而形成201204210 VI. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a circuit board, and more particularly to a method of manufacturing a soft and hard composite circuit board. [Prior Art] As the market for electronic products continues to grow and diversify, the application of circuit boards has also diversified. In most electronic products, the board is an indispensable component. The circuit board is used to carry electronic components and circuits between the electronic components. The circuit board can be divided into a rigid circuit board, a flexible circuit board, and a soft and hard composite circuit board. Among them, the soft and hard composite circuit board has high design flexibility, so it can be widely applied to various electronic products. The soft and hard composite circuit board of f is a circuit that first forms a rigid circuit board and a circuit of a flexible circuit board, and then the hard circuit board and the flexible circuit board are joined in an appropriate manner. For example, first, a groove is formed in the interlayer on the side of the rigid circuit board, and then one end of the soft and hard circuit board is inserted into the groove, and is fixed and fixed, and then formed over the joint between the rigid circuit board and the hard and soft circuit board. The connection hole ' electrically connects the rigid circuit board and the flexible circuit board. Another conventional connection method is a soft board having a size similar to that of a hard board. The soft board is placed in the middle layer of a hard board, and the two ends of the board are sandwiched by two hard boards. Then, an electrical connection hole is formed on the rigid circuit board to electrically connect the rigid circuit board to the hard and soft circuit board. The above manufacturing methods are difficult to achieve a reliable automated production process. Further, in the first method described above, the reliability and mechanical strength of the joint of the soft and hard plates are poor, and the electrical and electronic contacts are liable to fall off or the electrical contact is poor. In the above-mentioned second method of 201204210, when the electrical connection hole is formed, one end of the semi-finished product of the soft and hard circuit board is a rigid circuit board, and the other end is a flexible circuit board, which is very inconvenient in performing subsequent processes or transportation. . Therefore, there is still a need for a manufacturing method that can improve the above problems. SUMMARY OF THE INVENTION One object of the present invention is to provide a soft and hard composite circuit board and a manufacturing method thereof, which can realize automated manufacturing, improve product yield and reliability. The above method of manufacturing a soft and hard composite circuit board includes the following steps. A first rigid substrate is provided, and the opposite sides of the first rigid substrate respectively have a first surface and a second surface. The first predetermined removal region edge of the first rigid substrate has a first cutting line and a second cutting line, wherein the first and second cutting lines extend through the first rigid substrate. Attaching a first adhesive layer to the second surface of the first rigid substrate, the first adhesive layer having a first opening corresponding to the first predetermined removal region to expose a portion of the second surface of the first rigid substrate. A flexible circuit board is disposed on the portion of the first adhesive layer and over the first predetermined removal region of the first rigid substrate. Adhering the second adhesive layer to a portion of the flexible circuit board and the first adhesive layer not covered by the flexible circuit board, wherein the second adhesive layer has a second opening, and the position of the second opening corresponds to the first Above the opening. Attaching a second rigid substrate and a second adhesive layer, the opposite sides of the second rigid substrate respectively have a first surface and a second surface, wherein the second surface of the second rigid substrate contacts the second adhesive layer, and One of the second rigid substrate has a second predetermined removal region edge having a third cutting line and a fourth cutting line penetrating through the second rigid substrate, and the third cutting line position corresponds to the first cutting line position, and the fourth cutting The 201204210 line position corresponds to the top of the second_pass position. The above soft and hard composite circuit board includes: a first hard substrate of the ί-first-cut removal area: Γΐ: a second rigid substrate of the dicing removal area, and a flexible circuit board, wherein the second cutting The bit ί-L! of the removed area: the opposite side has a ---surface and - ^ adheres to the flexible circuit board, the first-adhesive layer has two: two: a part of the flexible circuit board, and the first (4) Second, the * road exposes part of the first adhesive layer; one: board: the first-cut removal area A board: ΪΓ surface, the first surface adheres to the second hard surface and adheres to the flexible circuit board, The second adhesive layer=4-opening to expose a portion of the flexible circuit board, and the second rigid substrate, the cut removal region exposes a portion of the second adhesive surface: the second surface portion of the r-adhesive layer is: Knee: Sexual connection ί hard = the first adhesive layer and the first rigid substrate, the first of the hard substrate - the conductive circuit and the flexible circuit board - [Embodiment] Made = Figure = 2 is the invention - The manufacturing method of the embodiment =. The first = alpha map and the first _, first provide the first hard slab. The first picture is the first _ hard substrate, the first picture is the first Α ^ 1 Β to the 不 图 ’ 第 第 第 第 第 第 。 。 。 。 。 。 。. As shown in Fig. 1 (2012), the opposite sides of the first rigid substrate 100 have a first surface 101 and a second surface 102, respectively, and the first surface 101 has a first copper layer 103 (first metal wide). Of course, the second surface 102 may also have an alignment mark (not shown) formed by another metal layer (e.g., a copper layer). In one embodiment, the first rigid substrate 1 is a thermoset material, such as a glass fiber substrate (e.g., Flame Retardant 4' FR4 substrate), which has been widely used in printed circuit boards. As shown in FIG. 1A, the first cutting line 110 and the second cutting line 120 are formed at the edge of the first predetermined shift eradication region 105 of the first rigid substrate 100, and the first and second cutting lines no, 120 are up to The first rigid substrate 100 is penetrated below. The method of forming the first and second cutting lines 110, 120 is not particularly limited, and for example, a die cutting (or steel die cutting) or a laser cutting technique can be utilized. The positions and lengths of the first and second cutting lines 110, 120 are designed according to product requirements, and are not particularly limited. Referring to FIGS. 2A and 2B, a first adhesive layer 200 is formed on the second surface 1〇2 of the first rigid substrate 100, and the first adhesive layer 200 has a first opening 210 and an exposed first portion. The second surface W2 of the rigid substrate 1〇〇. The first opening 21 of the first adhesive layer 2 is formed without any particular limitation. For example, a punch or a laser cutter can be used. The first adhesive layer 2 covers the first and second cutting lines 110, 120, and the first and second cutting lines 110, 120 are substantially parallel to one side of the first opening 210. In one embodiment, the method of forming the first adhesive layer 200 on the first rigid substrate 100 is to laminate an adhesive adhesive on the second surface 102 of the first rigid substrate 100 using a quick press. . In another embodiment, the first adhesive layer 200 can be attached to the first rigid substrate 100 201204210 by simultaneously providing external pressure and high temperature. The first adhesive layer 200 may be a thermoplastic polymer material which is softened and melted after being heated to have adhesiveness. Next, referring to Figures 3A and 3B, a flexible circuit board 300 is disposed on the first adhesive layer 200, and the flexible circuit board 300 spans the first opening 210 of the first adhesive layer 200. In an embodiment, the flexible circuit board 300 includes a first portion 310, a second portion 320, and an intermediate portion 330. The intermediate portion 330 substantially corresponds to the upper portion 210. The first portion 310 extends from one end of the intermediate portion 330 across the first cutting line 110, and the second portion 320 extends from the other φ end of the intermediate portion 330 across the second cutting line 120. As shown in Figures 3A and 3B. The opposite sides of the first adhesive layer 200 respectively have a first surface 201 and a second surface 202. The first surface 201 is adhered to the first rigid substrate 100, and the flexible circuit board is adhered to the second surface 202. In one embodiment, the flexible circuit board 300 is pre-bonded to the first adhesive layer 200 using an applicator, such as by providing a temperature of about 120 ° C using an applicator, the first portion 310 of the flexible circuit board 300. The second portion 320 is pre-attached to the first adhesive layer 200. In a specific embodiment, the flexible circuit board 300 includes a first protective layer book 301, a first conductive layer 302, an insulating layer 303, a second conductive layer 304, and a second protective layer 305, and the above layers may be sequentially arranged from bottom to top. The configuration is as shown in Fig. 3C, but the invention is not limited thereto. The first and second conductive layers 302, 304 can be, for example, patterned copper layers (copper lines) for transmitting electrical energy or signals. The first and second protective layers 301, 305 are used to protect the first and second conductive layers 302, 304 from scratching or damage of the first and second conductive layers 302, 304. The insulating layer 303, the first and second protective layers 301, 305 may be, for example, a polymer material of polyamidamine. In an embodiment, the first protective layer 301 is disposed on the outer surface of the flexible circuit board 300 adjacent to the first adhesive layer 200, and the second protective layer 305 is disposed on the flexible circuit board 300 relative to the first adhesive layer 200. The other outer surface. The insulating layer 303 is disposed between the first protective layer 301 and the second protective layer 305; the first conductive layer 302 is disposed between the insulating layer 303 and the first protective layer 301; and the second conductive layer 304 is disposed on the insulating layer 303 Between the second protective layer 305 and the second protective layer 305. Next, please refer to FIGS. 4A and 4B' to form the second adhesive layer 400 on the partial flexible circuit board 300 and on the first adhesive layer 200 not covered by the flexible circuit board 300. The second adhesive layer 400 has a second opening 420, and the second opening 420 has substantially the same size as the first opening 210 of the first adhesive layer 200 and is located above the first opening 210. The method of forming the second adhesive layer 400 may be the same as the first adhesive layer 200, and will not be repeated here. Then, as shown in Figs. 5A and 5B, the second rigid substrate 500 is disposed on the second adhesive layer 400. As shown in FIG. 5B, the opposite sides of the second rigid substrate 500 respectively have a first surface 501 and a second surface 502. The first surface 501 has a second copper layer 503 (second metal layer) thereon, and the second rigid layer The second surface 502 of the substrate 500 contacts the second adhesive layer 400. In other words, the opposite sides of the second adhesive layer 400 respectively have a first surface 401 and a second surface 402. The first surface 401 is adhered to the second rigid substrate, and the second surface 402 is adhered to the flexible circuit board 300. The edge of the second predetermined removal region 505 on the second rigid substrate 500 has a third cutting line 530 and a fourth cutting line 540, and the third cutting line 530 and the fourth cutting line 540 respectively penetrate the second rigid substrate 500, and The third cutting line 530 of the two rigid substrate 500 is located substantially above the first cutting line 11〇, and the fourth cutting line 540 is located substantially above the second cutting line 丨2〇. In one embodiment, the pressure between the second rigid substrate 500 and the 201204210 rigid substrate 100 is tightly pressed together by a press machine to provide external pressure and appropriate temperature, which is familiar to those skilled in the art. . In a particular embodiment, the lengths of the third and fourth cutting lines 530, 540 are the same as the first and second cutting lines 11, 〇, 120, respectively, but the invention is not limited thereto. The method of forming the third and fourth dicing lines 530, 540 on the second rigid substrate 500 may be the same as or different from the method of forming the first and second dicing lines 110, 120 on the first rigid substrate 100. In an embodiment, the third and fourth cutting lines 530, 540 are formed on the second rigid substrate 500, and then the pressing step is performed. In another embodiment, the third and fourth cutting lines 530, 540 are formed on the second rigid substrate 500 using a process such as laser cutting. Or, please refer to FIG. 5C. Before forming the second adhesive layer 400, a filling layer 410 may be disposed on the first adhesive layer 200, and then a second adhesive layer 400 may be formed on the filling layer 410. In this embodiment, the filling layer 410 is disposed between the first adhesive layer 200 and the second adhesive layer 400, so that the required amount of the first adhesive layer 200 and the second adhesive layer 400 can be reduced. The material of the filling layer 410 may be a hard or soft material, and a chemically stable material may be used. For example, the filling layer 410 may be a metallic material such as copper or a non-metallic material such as an epoxy resin substrate. In one embodiment, after the step is completed, or after the first adhesive layer is disposed on the first rigid substrate, the first connection hole 001 and the second connection hole 602 are formed on the first rigid substrate 1 , and After the second adhesive layer is disposed on the second rigid substrate, the third connection hole 603 and the fourth connection hole 604' are formed on the second rigid substrate 500 as shown in FIGS. 6A and 6B. The first and second connecting holes 601 and 602 penetrate through the first rigid substrate 1 , the first adhesive layer 200 , and the first protective layer 3〇1 of the flexible circuit board 3〇〇, so that the first part of the soft 201204210 circuit board 300 The first conductive layer 302 in the 310 may be exposed through the first connection hole 601, and the first conductive layer 302 in the second portion 320 of the flexible circuit board 300 may be exposed through the second connection hole 602. Similarly, the third and fourth connecting holes 604 extend through the second rigid substrate 500, the second adhesive layer 400, and the second protective layer 305 of the flexible circuit board 300 from top to bottom, so that the first portion 310 of the flexible circuit board 300 The second conductive layer 304 in the second conductive layer 304 may be exposed through the third connection hole 603, and the second conductive layer 304 in the second portion 320 of the flexible circuit board 300 may be exposed through the fourth connection hole 604. Forming the first, second, third, and fourth connection holes 601, 602, 603, and 604, forming a first electrical connection layer 610 in the first and second connection holes 〇2, and in the third and the third A second electrical connection layer 620 is formed in the four connection holes 6〇4. The first electrical connection layer 61 and the second electrical connection layer 620 may be completed in the same step, for example, 'the first and second electrical connection layers 61 are formed simultaneously by electroless plating (or electroless plating). 620. Therefore, the first conductive layer 3〇2 in the flexible circuit board 300 is electrically connected to the first copper layer 103 of the first rigid substrate 100 via the first electrical connection layer 61, and the second conductive layer 3 in the flexible circuit board 300. The 〇4 is electrically connected to the second copper layer 503 of the second rigid substrate 5〇〇. In the above manufacturing method, the first copper layer 1〇3 and the second copper layer 5〇3 may be further patterned. Patterning the first and second copper layers 1 〇 3, 503 may be performed after forming the first and second electrical connection layers 61, 620. In an embodiment, a circuit for forming a product, such as a patterning of the first and second copper layers 1〇3, 503 by a conventional development and etching process, such as a first conductive line on the first rigid substrate 100. 7 and the second conductive line 507 on the second rigid substrate 50, as shown in FIGS. 6A and 6B. 10 201204210 Please refer to FIG. 7 . In an embodiment, after the above steps are completed, a fifth cutting line 650 is formed, which can penetrate from the top to the bottom of the first rigid substrate 1 〇〇 to the second rigid substrate 500 . Floor. That is, the fifth cutting line 650 is penetrated from the first surface 101 of the first rigid substrate 100 to the first surface 501 of the second rigid substrate '5'. And the fifth cutting line 650, the third cutting line 530, and the fourth cutting line 540 at least substantially enclose the intermediate portion 330 of the flexible circuit board 300. In one embodiment, as shown in Fig. 7, the fifth cutting line 650 includes 651, 652, and 653, which are indicated on the left side of Fig. 7, and 654, 655, and 656, which are shown on the right side of Fig. 7. The fifth cutting line is labeled 652 and the portion labeled 655 is substantially along the sides of the intermediate portion 330 of the flexible circuit board 300, and the fifth cutting line is labeled 652 and 655 and the third cutting line 530 and fourth. The cutting line 540 generally encloses a second predetermined removal region 505 of the second rigid substrate 500. The portion of the fifth cutting line designated 652 and 655 and the first cutting line 110 and the second cutting line 120 substantially enclose a first predetermined removal area 105 of the circuit board 3''. Since the fifth cutting line 650 is penetrated from the second rigid substrate 500 to the first rigid substrate 100, the portion of the fifth cutting line % 651, 652, 653 and the area enclosed by the boundary 630 are also completely removed. At the same time, the portion of the fifth cutting line indicating 654, 655, 656 and the area enclosed by the boundary 640 may also be completely removed. Figure 8 shows a top view of the two parts removed. Then, the second rigid substrate 500 located above the intermediate portion 330 of the flexible circuit board 300 is removed, and the first rigid substrate 100 located under the portion 33 of the flexible circuit board 300 is removed. As shown in FIGS. 9A and 9B, in an embodiment, the second rigid substrate 5 located at the upper portion of the intermediate portion 330 has only a small area of 201204210 second sticky near the third and fourth cutting lines 530, 540. The glue layer 400 can thus easily remove the second rigid substrate 500 between the third cutting line 53A and the fourth cutting line 540 at a portion above the intermediate portion 330. Similarly, the first rigid substrate ι of the portion between the first cutting line 11 〇 and the second cutting line 12 位于 located below the intermediate portion 330 may be removed, and the intermediate portion 330 of the flexible circuit board 300 may be exposed. Therefore, in Fig. 9A, the first portion 310 of the flexible circuit board 300 is connected to one multilayer rigid circuit board 51A, and the second portion 320 of the flexible circuit board 300 is connected to the other multilayer flexible circuit board 520. A two-layer rigid circuit board is connected by a flexible circuit board, and a soft and hard composite circuit board is completed. Of course, there are other embodiments in the above manufacturing method. For example, the 'fifth cut line and other cut lines enclose a closed area and remove all layers in this area. For example, the fifth cutting line 65〇 includes only 652 ′ indicated on the left side of the seventh drawing and 655 indicated on the right side of the seventh drawing. Therefore, only the second rigid substrate 5A and the first rigid substrate 100 above and below the intermediate portion 330 of the flexible circuit board 300 will be removed. In other embodiments, the second adhesive layer 400 described above may be formed on the second surface 502 of the second rigid substrate 500, and then subjected to press-fitting and subsequent steps, as will be described in detail below. Before or after or at the same time as the structure shown in FIG. 3B is completed, the second rigid substrate 500 is prepared. As described above, the opposite sides of the second rigid substrate 5 have a first surface 501 and a second surface 502, respectively. And the second hard substrate 500 has a second copper layer 503 on the first surface thereof. And forming a second cutting line 530 and a fourth cutting line 540 ′ and third and fourth on the second rigid substrate 500 according to the arrangement of the first and second cutting lines 110 , 120 on the first rigid substrate 100 . The cutting lines 530, 540 penetrate the second rigid substrate 5A. [S] 12 201204210 Next, a second adhesive layer 400 is formed on the second surface 502 of the second rigid substrate 500. The second adhesive layer 400 has a second opening 420 therein to expose a portion of the second surface 502, and the second adhesive layer 400 covers the third and fourth cutting lines 530, 540. In an embodiment, the third and fourth cutting lines 540 are substantially parallel to the perimeter of the second opening 420. Then, the second rigid substrate 500 on which the second adhesive layer 400 is formed is pressed together with the first rigid substrate 100 on which the flexible circuit board 300 is disposed'. The flexible circuit board 3 is sandwiched between the first adhesive layer 200. Between the second adhesive layer 400 and the second adhesive layer 400. The third cutting line 530, the fourth cutting line 540, and the second opening 420 are respectively located above the first cutting line 110, the second cutting line 120, and the first opening 210, and the structure as shown in Fig. 5B is completed. A subsequent process, such as forming a via, an electrical connection layer, or a process of patterning the first copper layer and the second copper layer, can then be performed. Of course, there are other embodiments in the above manufacturing method. For example, after completing the structure as shown in Fig. 6B, the layer build-up process of the board can be performed. Referring to FIG. 6C, in an embodiment, the first build-up board 71, the second build-up board 720, and the third build-up board 730' are sequentially formed on the first surface 501 of the second rigid substrate 500. A fourth build-up layer 740, a fifth build-up layer 750, and a sixth build-up layer 760 are sequentially formed on the first surface 101 of the first rigid substrate i. The first build-up board 710, the second build-up board 72A, and the third build-up board 730 have a first circuit 712, a second circuit 722, and a third circuit 732, respectively. The fourth build-up board 740, the fifth build-up board 750, and the sixth build-up board 76 have a fourth circuit 742, a fifth circuit 752, and a sixth circuit 762, respectively. The above-mentioned build-up board can be used to increase the conductive line, for example, different circuit patterns can be formed on different build-up boards to form
[SI 13 201204210 三度空間的電路結構，增層板可例如為FR4基板。在電路 板上的製作增層電路結構，為本領域技術人所習知。但必 須注意，在本發明一實施例中，於形成第一增層710、第 二增層720以及第三增層730時，必須在第一增層710、 第二增層720以及第三增層730中形成對應於第三及第四 切割線 530、540 的切割線(714, 716, 724, 726, 734, 736)， 以及在第四增層740、第五增層750以及第六增層760中 形成對應於第一及第二切割線110、120的切割線(744, 746, 754, 756, 764, 766)，如第 6C 圖所示。 完成上述步驟後，形成第五切割線650貫穿全部增層 結構(710, 720, 730, 740, 750, 760)以及第一硬性基板100至 第二硬性基板500之間的所有層。第五切割線650的形成 方式如前文敘述以及如第7圖所示。接著，移除第五切割 線與邊界所圍成的區域，如前文敘述及第8圖所示。然後， 移除位於軟性電路板300之中間部330上方的第二硬性基 板500及第一、第二及第三增層（710, 720, 730)，以及移除 位於軟性電路板300之中間部330下方的第一硬性基板100 及第四、第五及第六增層（740, 750, 760)，而露出軟性電路 板300的中間部330，如前文敘述及第9A、9C圖所示，完 成軟硬複合電路板。 由上述本發明實施方式可知，應用本發明可具有下列 優點。（1)軟性電路板是以平面方式夾置在兩個硬性基板 中，可使用自動貼合機完成貼合軟性電路板，而達成自動 化之目的，並可減少人工步驟，提升量率。（2)硬性基板與 軟性電路板間的連接穩固，且可靠性高。（3)在製作過程 201204210 中，硬性基板500的預定移除區域的保留，使得在形成連 接孔、電連接層、圖案化金屬層、或其他增層製程中，保 護了軟性電路板不致使其受到損害，提升軟硬複合電路板 • 的良率。 . 雖然本發明已以實施方式揭露如上，然其並非用以限 定本發明，任何熟習此技藝者，在不脫離本發明之精神和 範圍内，當可作各種之更動與潤飾，因此本發明之保護範 圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖至第9圖為本發明一實施方式之製造方法的製 造過程圖。 【主要元件符號說明】 100第一硬性基板 101第一表面 • 102第二表面 103第一銅層 105第一預定移除區域 107第一導電線路 - 110第一切割線 . 120第二切割線 200第一黏膠層 201第一黏膠層之第一表面[SI 13 201204210 The circuit structure of the three-dimensional space, the build-up board can be, for example, an FR4 substrate. The fabrication of the build-up circuit structure on the circuit board is well known to those skilled in the art. It should be noted, however, that in an embodiment of the present invention, when the first build-up layer 710, the second build-up layer 720, and the third build-up layer 730 are formed, the first build-up layer 710, the second build-up layer 720, and the third increase must be added. Cutting lines (714, 716, 724, 726, 734, 736) corresponding to the third and fourth cutting lines 530, 540 are formed in the layer 730, and in the fourth build-up layer 740, the fifth build-up layer 750, and the sixth increase Cut lines (744, 746, 754, 756, 764, 766) corresponding to the first and second cut lines 110, 120 are formed in layer 760 as shown in Fig. 6C. After the above steps are completed, the fifth cut line 650 is formed through all of the build-up structures (710, 720, 730, 740, 750, 760) and all layers between the first rigid substrate 100 to the second rigid substrate 500. The fifth cutting line 650 is formed as described above and as shown in Fig. 7. Next, the area enclosed by the fifth cutting line and the boundary is removed, as described above and shown in FIG. Then, the second rigid substrate 500 and the first, second and third build-up layers (710, 720, 730) located above the intermediate portion 330 of the flexible circuit board 300 are removed, and the intermediate portion of the flexible circuit board 300 is removed. The first rigid substrate 100 under the 330 and the fourth, fifth and sixth build-up layers (740, 750, 760) expose the intermediate portion 330 of the flexible circuit board 300, as described above and shown in Figures 9A and 9C. Complete the soft and hard composite circuit board. It will be apparent from the above-described embodiments of the present invention that the application of the present invention can have the following advantages. (1) The flexible circuit board is sandwiched between two rigid substrates in a planar manner. The flexible bonding board can be used to complete the bonding of the flexible circuit board, and the purpose of automation can be achieved, and manual steps can be reduced to increase the rate. (2) The connection between the rigid substrate and the flexible circuit board is stable and highly reliable. (3) In the fabrication process 201204210, the retention of the predetermined removal region of the rigid substrate 500 protects the flexible circuit board from forming the connection hole, the electrical connection layer, the patterned metal layer, or other build-up process. Damaged, improving the yield of soft and hard composite boards. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and it is obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 9 are views showing a manufacturing process of a manufacturing method according to an embodiment of the present invention. [Main Element Symbol Description] 100 First Hard Substrate 101 First Surface • 102 Second Surface 103 First Copper Layer 105 First Predetermined Removal Area 107 First Conductive Line - 110 First Cutting Line. 120 Second Cutting Line 200 First surface of the first adhesive layer of the first adhesive layer 201
i SI 15 201204210 202第一黏膠層之第二表面 210第一開口 300軟性電路板 ’ 301第一保護層 ' 302第一導電層 303絕緣層 304第二導電層 305第二保護層 • 310第一部 320第二部 330中間部 400第二黏膠層 401第二黏膠層之第一表面 402第二黏膠層之第二表面 410填充層 φ 420第二開口 500第二硬性基板 501第一表面 502第二表面 503第二銅層 505第二預定移除區域 507第二導電線路 510, 520多層硬性電路板i SI 15 201204210 202 second surface 210 of the first adhesive layer first opening 300 flexible circuit board '301 first protective layer' 302 first conductive layer 303 insulating layer 304 second conductive layer 305 second protective layer • 310 a 320 second portion 330 intermediate portion 400 second adhesive layer 401 second adhesive layer first surface 402 second adhesive layer second surface 410 filling layer φ 420 second opening 500 second rigid substrate 501 a surface 502 second surface 503 second copper layer 505 second predetermined removal area 507 second conductive line 510, 520 multilayer rigid circuit board
[SI 16 201204210 530第三切割線 540第四切割線 601第一連接孔 • 602第二連接孔 ’ 603第三連接孔 604第四連接孔 610第一電連接層 620第二電連接層 • 630, 640 邊界 650,651，652,653,654,655,656 第五切割線 710第一增層板 712第一電路 720第二增層板 722第二電路 730第三增層板 $ 732第三電路 740第四增層板 742第四電路 750第五增層板 752第五電路 760第六增層板 762第六電路[SI 16 201204210 530 third cutting line 540 fourth cutting line 601 first connection hole 602 second connection hole 603 third connection hole 604 fourth connection hole 610 first electrical connection layer 620 second electrical connection layer • 630 640 boundary 650, 651, 652, 653, 654, 655, 656 fifth cutting line 710 first build-up board 712 first circuit 720 second build-up board 722 second circuit 730 third build-up board $ 732 third circuit 740 fourth build-up board 742 fourth Circuit 750 fifth build-up board 752 fifth circuit 760 sixth build-up board 762 sixth circuit
l SI 17l SI 17