TW200938041A - Method for fabricating flex-rigid circuit board - Google Patents

Abstract

A method for fabricating flex-rigid circuit board is provided. In the method, first, a flexible circuit board is provided. Then, two wiring substrates are formed. The wiring substrates are stuck upon two opposite surfaces of the flexible circuit board by two non-flow prepregs. Each of the non-flow prepregs has an opening exposing the flexible circuit board, and the wiring substrates cover the openings entirely. The viscosity coefficient of the non-flow prepregs is between 7000 poise and 100000 poise, and the openings are opposite to each other. Next, cut the wiring substrates to form two trenches. Next, the parts of the wiring substrates corresponding to the openings are removed to expose the opposite surfaces of the flexible circuit board.

Description

[Technical Field] The present invention relates to a method of manufacturing a circuit board, and more particularly to the manufacture of a flex-rigid circuit board. method. [Prior Art] A soft and hard composite circuit board is a circuit board which is a combination of a flexible circuit board and a rigid wiring board, which has both the flexibility of a flexible wiring board and the strength of a rigid wiring board. In the manufacturing method, the soft and hard composite circuit board is a flexible circuit board made of the completed circuit as a core layer, and a hard circuit board is formed on the flexible circuit board by a process similar to a buildup or stacking process. 1A to 1C are schematic cross-sectional views showing a flow of manufacturing a soft and hard composite wiring board. Referring to FIG. 1A and FIG. 1B, firstly, the two rigid substrates 120 are respectively pressed and pressed on the opposite surfaces ll 〇 a, 11 〇 b ' of a flexible circuit board no, and after pressing the rigid substrates 12 ', the flexible circuit board 110 will be located between the two rigid substrates 120. Each of the rigid substrates 12A is composed of a prepreg 122, a core iayer 124, and a metal layer 126, and each of the rigid substrates 12A has an opening 120a. In the same rigid substrate 12A, the opening 12A is extended from the film 122 to the core layer 124' and the metal layer 126 is located at the bottom of the opening 120a. Further, the opening 120a is usually formed in a manner of being shaped. In addition, the material of the core layer 124 usually contains glass fiber, and the material of the metal layer ι26 5 200938041 4twf.doc/n is generally copper. Referring to FIG. 1B and FIG. 2C, the metal layers 126 are then etched to open the second wiring layer 126' and remove portions of the metal layer 126 corresponding to the openings 120a. Thus, a soft and hard composite circuit board can be manufactured. However, in the process of etching the metal layers 126, an etching agent (not shown) may infiltrate from the openings 120a into the flexible wiring board 11〇, thereby destroying the flexible wiring board 1丨〇, resulting in the soft and hard composite wiring board 100. Good. The yield is falling. SUMMARY OF THE INVENTION The present invention provides a method of manufacturing a soft and hard composite circuit board to improve the yield of a soft and hard composite circuit board. The present invention provides a method of manufacturing a soft and hard composite circuit board, comprising: providing a f-type circuit board having an upper surface and a lower surface opposite to each other. Next, a -first wiring substrate is formed which is bonded to the upper surface through a first low-flowing amount of film, wherein the first wiring substrate has mutually opposite sides - a first outer surface and a - first inner surface. The first low flow film has a first opening that exposes a portion of the upper surface, and the first circuit substrate comprehensively covers the first opening. Next, a second circuit substrate is formed which is bonded to the lower surface through a second low-flow adhesive film which has the second circuit substrate having mutually opposite - a second outer surface and a second inner surface. The second low-flow glue film has a second opening of the lower surface of the exposed portion, and the second circuit substrate comprehensively covers the second opening. The viscosity coefficient of the first low-flow film and the second low-flow film is between 7〇〇〇(10) north and 1〇〇_200938041 4twf. doc/π poise, and the first The opening is opposite the second opening. Next, the first outer surface is cut to form at least one first trench, wherein the first trench corresponds to the edge of the first opening. Cutting the second outer surface to form at least one second trench, wherein the first trench corresponds to an edge of the second opening. Next, a portion of the first circuit substrate corresponding to the first opening is removed to form a first recess that partially exposes the upper surface. A portion of the second wiring substrate corresponding to the second opening is removed to form a second recess that partially exposes the lower surface. In an embodiment of the invention, the depth of the first trench relative to the first outer surface is equal to or smaller than the thickness of the first circuit substrate, and the depth of the second trench relative to the second outer surface is equal to the second line The thickness of the substrate. In one embodiment of the invention, the method of forming the first trench and the second trench includes a laser cutting process or a mechanical cutting process. In one embodiment of the invention, the mechanical cutting process comprises a v-cut or a routing. In an embodiment of the present invention, after removing a portion of the Q ^ circuit substrate corresponding to the first opening and a portion of the second circuit substrate corresponding to the first opening, the first slotting and the second slotting are further included Perform a cleaning procedure. In an embodiment of the invention, the cleaning procedure includes a button engraving process. In an embodiment of the invention, the method for forming the first circuit substrate and the first circuit substrate comprises: “pressing a substrate onto the flexible circuit board by the first low-flow adhesive film, wherein the first The substrate includes a first outer layer - an electrical layer and - an insulating layer between the first outer conductive layer and the flexible wiring board. Pressing the second substrate on the soft substrate by the second low-flow adhesive knee piece, wherein the second substrate comprises a second outer conductive layer and a second outer conductive layer A second insulating layer between the flexible circuit board. Optionally, a portion of the first outer conductive layer is removed to form a first outer wiring layer. A portion of the second outer conductive layer ' is removed to form a second outer wiring layer. In one embodiment of the invention, the method of removing a portion of the first outer conductive layer and a portion of the second outer conductive layer includes a lithography and a process.

In an embodiment of the invention, the first substrate further includes a first inner layer circuit layer opposite to the first outer layer conductive layer, and the second substrate further includes a second inner layer circuit layer opposite to the second outer layer conductive layer. . In an embodiment of the invention, the first inner layer circuit layer includes a first metal film layer corresponding to the first opening, and the second inner layer circuit layer includes a second metal film layer corresponding to the second opening.曰

In an embodiment of the invention, the method of forming the first circuit substrate and the second circuit substrate further comprises forming at least one circuit layer on the first outer circuit layer by a build-up method. By using the build-up method, at least another circuit layer is formed on the second outer wiring layer, wherein the film used in the build-up method has a viscosity coefficient between 100 poise and 20000 poise. The invention adopts the above-mentioned first wire board and the second circuit board to complete the two cover for side arrogance, and the younger-wire board and the second (four) substrate can be softened to avoid the soft circuit board being bleed by the sputum agent. The person was broken ^. In order to make the above features and advantages of the present invention more comprehensible, the preferred embodiment and the accompanying drawings are described in detail below. [First Embodiment] Figs. 2A to 2E are schematic cross-sectional views showing the flow of a method of manufacturing a soft and hard composite wiring board according to a first embodiment of the present invention. Referring to FIG. 2A, in relation to the manufacturing method of the soft and hard composite circuit board of the present embodiment, first, a flexible circuit board 210' is provided which has an upper surface 210a and a lower surface 210b which are opposite to each other. In the above, the flexible circuit board 210 can include a flexible substrate 212, two circuit layers 214a, 214b, and two cover layers 216a, 216b, wherein the flexible substrate 212 is disposed between the circuit layer 214a and the circuit layer 214b. The cover layer 216a is disposed on the upper surface 210a, and the cover layer 216b is disposed on the lower surface 210b. The cover layer 216a can cover the circuit layer 214a in a comprehensive manner, and the cover layer 216b can cover the circuit layer 214b in a comprehensive manner, as shown in FIG. 2A. In addition, the material of the flexible substrate 212, the cover layer 216a and the cover layer 216b may be polyimide, polyethylene terephthalate (PET) or other flexible polymer materials. The materials of the flexible substrate 212, the cover layer 216a, and the cover layer 216b may be the same. In other embodiments not shown, the flexible circuit board 21 can also include a plurality of conductive vias (not shown) or conductive vias (not shown). These conductive vias or these conductive vias can form an internal line that enables the circuit layers 214a and 214b to be electrically connected to each other. Referring to FIG. 2C', a first circuit substrate 220a is formed, and a second circuit substrate 22b is formed. The first circuit substrate 22A is bonded to the upper surface through a first low-flow film 230a. 210a, and 9 200938041 ttwf.doc/n The second circuit substrate 220b is bonded to the lower surface 210b through a second low-flow adhesive film 23〇b. The viscosity coefficient of the first low-flow film 23 and the second low-flow film 230b is between 7000 p〇ise and looooo p〇ise, preferably between 8000 poise and 24000 p〇ise. . The first circuit substrate 220a has a first outer surface si and a first inner surface S3 opposite to each other, and includes a first outer wiring layer 222a and a first insulating layer 224a. The second circuit substrate 220b has mutually opposite first and second inner surfaces S2 and S4, and includes a second outer circuit layer 222b and a second insulating layer 224b. The first low-flow glue film 230a has a first opening H1 exposing a portion of the upper surface 21〇& and the second low-flow film 230b has a first opening H2 exposing a portion of the lower surface 210b, wherein An opening is opposite to the second opening H2, that is, the first opening H1 corresponds to the second opening H2. The first circuit substrate 220a comprehensively covers the first opening H1, and the second circuit substrate 220b comprehensively covers the first opening H2. That is, the first circuit substrate 220a at this time is a full cover of the upper surface 210a' of the flexible wiring board 210, and the second wiring substrate 220b at this time is a full surface covering the lower surface 210b of the flexible wiring board 210. The above description is only for the configuration of the first circuit substrate 220a and the second circuit substrate 220b. Next, a method of forming the first circuit substrate 220a and the second circuit substrate 220b will be described in detail with reference to Figs. 2B and 2C. Referring to FIG. 2B, regarding the method of forming the first circuit substrate 220a and the second circuit substrate 220b, first, a first substrate 220a' is pressed onto the upper surface of the flexible circuit board 210 by the first low-flow adhesive film 230a. On the 210a, 4twf.doc/n 200938041 and a second low-flow adhesive film 230b, a second substrate 220b' is pressed onto the lower surface 210b of the flexible circuit board 210. The first substrate 220a' includes a first outer conductive layer 222a' and a first insulating layer 224a, and the second substrate 220b' includes a second outer conductive layer 222b' and a second insulating layer 224b, wherein the first insulating layer 224a and The material of the second insulating layer 224b may be a resin and a glass fiber, and the first insulating layer 224a and the second insulating layer 224b may be formed of a cured film. Ο

After the first substrate 220a' and the second substrate 220b are pressed together, the first insulating layer 224a may be located between the first outer conductive layer 222a and the flexible circuit board 210, and the second insulating layer 224b may be located at the second outer layer. Between layer 222b' and flexible circuit board 210. Since the viscosity coefficient of the first low-flow glue film 230a and the second low-flow film 230b is between 7000 poise and 10 〇〇〇〇p〇ise, preferably between 8000 poise and 24000 p〇ise between. Therefore, when the first substrate 220a' and the second substrate 220b' are pressed together, the first low-flow adhesive film 23〇& and the second low-flow adhesive film 230b are not easily on the upper surface 210a of the flexible wiring board 21〇. An overflow is generated on the lower surface 210b. This can avoid affecting the flexibility of the flexible circuit board 210. Referring first to Figures 2B and 2C', a portion of the first outer layer 222a' is removed to form a first outer wiring layer 2''. Removing the portion ^ outer conductive layer 222b, '(10) into the second outer circuit layer 222, the first outer conductive layer 222a, and the second outer conductive layer 22 may be a lithography and etching process. The etching process can be a β-etching process.疋 11 ttwf.doc/n

200938041 Since the first circuit substrate 220a covers the first opening H1 in a comprehensive manner, and the second circuit substrate 220b covers the second opening H2 in a comprehensive manner, the first circuit substrate 220a can completely cover the upper surface 210a of the flexible circuit board 21〇, and The second circuit substrate 22〇b can completely cover the lower surface 210b of the flexible wiring board 21〇. Thus, when a portion of the first outer conductive layer 222a is removed, a portion of the second outer conductive layer: when it is a secret engraving process, for example, a wet butterfly is used to correct the first-circuit substrate island and the second circuit substrate. 220bJ to protect the soft line (4). It is not damaged by the infiltration of the drug. , cutting, cutting the outer surface I to form the second outer surface S2 to the /th groove T to form at least one groove T1 corresponding to the edge of the first opening buckle, and /曰曰 corresponding to the second The edge of the opening H2.妒出笛一雀姨工法 or its second::::= If the cutting method, the appearance is added in this example, the first groove can be equal to the n-plane of the first-line substrate test = T2 With respect to the second outer surface, the thickness D4 of the second trench 220b may be equal to the second circuit substrate... after the first first outer surface (four) is already available from the other substrate of the second substrate Part of the first substrate 220a is detached, and the second opening two line wires 22 (^2 fine pass has been from the Wei part of the 12th twf.doc/n 200938041, please refer to FIG. 2E first, then remove the corresponding first opening H1 a portion of the first circuit substrate 220a to form a first trench R1 partially exposing the upper surface 21A. A portion of the second wiring substrate 220b corresponding to the second opening H2 is removed to form a partially exposed lower surface The second slot R2 of 210b. At this point, substantially, a soft and hard composite circuit board 2 has been manufactured. It is worth mentioning that a portion of the first circuit substrate 220a corresponding to the first opening H1 is removed and correspondingly After the second second substrate ❹ 220b of the second opening H2, the first slot R1 and the second opening Some metal chips (not shown) from the first outer circuit layer 222a and the second outer circuit layer 222b may remain on the sidewalls of both R2, and these metal chips may cause electrical quality of the soft and hard composite circuit board 200. Adverse effects. In order to remove these metal shavings, the first slot R1 and the second slot R2 may be cleaned. The cleaning procedure may be an etching process, and in particular may be a wet button engraving process. The metal shavings used can be removed to ensure the electrical quality of the soft and hard composite wiring board 200. [Second Embodiment] Figs. 3A to 3E are soft and hard composites according to a second embodiment of the present invention. A schematic cross-sectional view showing a flow of a method for manufacturing a circuit board. The method for manufacturing a soft and hard composite circuit board according to the second embodiment will be described in advance, and the manufacturing method and the first embodiment of the soft and hard composite circuit board according to the second embodiment will be described in advance. The example is similar, so the following FIG. 3A to FIG. 3E and the following description will focus on the difference between the present embodiment and the first embodiment. Referring to FIG. 3A, a flexible circuit board 310 is provided. Thereafter, 13 4twf.doc/n 200938041 is hunted by the first low-flow adhesive cymbal sheet 230a, and a first substrate 32〇a is pressed onto the upper surface 310a of the flexible circuit board 310. By the second low current The adhesive film 230b presses a second substrate 320b' onto the lower surface 310b of the flexible circuit board 310, wherein the upper surface 3a is opposite to the lower surface 31b. The flexible circuit board 310 can include a flexible substrate 212, The circuit layers 214a, 214b and the two cover layers 316a, 316b, wherein the cover layer 316a is disposed on the upper surface 310a, and the cover layer 316b is disposed on the lower surface 31"b. The cover layer 316a covers the wiring layer 214a and has an opening H3 partially exposing the wiring layer 214a. The cover layer 316b covers the wiring layer 214b and has an opening H4 that partially exposes the wiring layer 214b. The first substrate 320a' includes a first outer conductive layer 322a', a first inner wiring layer 326a, and a first insulating layer 324a between the first outer conductive layer 322a and the first inner wiring layer 326a. The second substrate 320b' includes a second outer conductive layer 322b', a second inner wiring layer 326b, and a second insulating layer 324b between the second outer conductive layer 322b' and the second inner wiring layer 326b. The first inner wiring layer 326a is opposite to the first outer conductive layer 322a', and the second inner wiring layer 326b is opposite to the second outer conductive layer 322b'. After the first substrate 320a' and the second substrate 320b' are pressed together, the first low-flow film 230a directly adheres to the first inner layer 326a and the flexible board 310, and the second low-flow film 230b directly The second inner wiring layer 326b and the flexible wiring board 310 are adhered. In this embodiment, the first inner layer circuit layer 326a may include a first metal film layer M1 corresponding to the first opening H1 and a plurality of traces W1, and the fourth twf.doc/n 200938041 two inner layer circuit layer 326b may include - Corresponding to the film layer M2 and the plurality of traces W2. In addition, the first metal and second inner wiring layers 326b may be __彡; 326a, see Figs. 3A and 3B', and then the portion is removed.

部份 Part of the first outer conductive layer 322a is the same as the partial outer method and the first embodiment. Please refer to FIG. 3C instead of repeating the 322b. Then, the layer can be applied and transferred. The first film is separated from the second film into a layer to respectively form a second metal layer on the first outer layer 322a and the second outer layer, which is, for example, a copper foil. Thereafter, a portion of the metal layer is removed by lithography and side processes to form a wiring layer 328a and a wiring layer 328b. As such, a first line slab 320a and a second line substrate 32015 are completed, wherein the first line two substrate 320a includes a circuit layer 328a, a first film 330a, a first outer circuit layer 322a, and a first inner circuit layer 326a. The second circuit substrate 32^ includes a wiring layer 328b, a second film 330b, a second outer wiring layer 322b, and a second inner wiring layer 326b. The first film 330a and the second film 330b may be low-flow film with a viscosity coefficient between 7000 poise and 100000 poise, or a high-flow film with a viscosity coefficient between 100 poise and 20000 poise. The cost of the above high-flow film is generally less than the cost of the low-flow film. Therefore, in order to reduce the cost of the soft and hard composite circuit board, the first 15 4twf.doc/n 200938041 film 330a and the second film 330b can use a high-flow film, that is, the film used in the above-mentioned layering method, the viscous coefficient It can range from 10〇p〇ise to 20,000 poise', preferably between 5〇〇p〇ise and looo p〇ise. It is to be noted that those skilled in the art to which the present invention pertains know that the first wiring substrate 320a and the second wiring substrate 32b having two or more wiring layers can be manufactured by the above-described build-up method. Therefore, the number of layers of the circuit layer which is provided by both the first circuit substrate 320a and the second circuit substrate 320b which are not shown in Fig. 3C is merely illustrative and not limiting. ❹

Referring to FIG. 3C and FIG. 3D, then, the first outer surface S5 of the first circuit substrate 32 〇 & is cut to form a first trench T3. The second outer surface % is cut by the second _, 32% to form - the second groove 4, which is integrated; the SI3 gate: the edge of the first opening H1 and the edge of the second groove T4 θf:. Further, the degree of the first trench Τ3 with respect to the === will be the thickness of the thickness raft 320b of the first-line substrate. The depth of the first-outer surface is less than the second line-based cutting process or the groove 4 is green, and the laser is used. The laser is divided into two, the external type is added, the mechanical_process, the carbon laser, and the ultraviolet thunder. The beam of light may be from a dioxide source when forming a top or his appropriate laser source. In the cutting process, the first-side (10) circuit layer gamma of the laser beam H1 of the second frequency 74 includes a corresponding first opening, 9 M1, and the second inner layer circuit layer 326b includes a pair of 16 4 twf.doc/n 200938041. The second metal film layer 第二2 of the second opening ,2, so during the laser cutting process, the first metal film layer M1 and the second metal film layer 能: can resist the laser beam to prevent the laser beam from further shooting Into the flexible circuit board 3 〇. In this way, it is possible to prevent the flexible wiring board 31 from being damaged by the laser beam. Referring to the ® 3E', a portion of the first wiring substrate 320a' corresponding to the first opening H1 is removed to form a first Ο groove R3 partially exposed to the upper surface 31. A portion of the second wiring substrate 320b' corresponding to the second opening H2 is removed to form a second groove which is - partially exposed to the lower surface 31%. In the present embodiment, the first slot R3 exposes the circuit layer purely, and the first slot R4 exposes the circuit layer 21. The circuit layer (10) and the circuit layer 214b can be separated from the first slot R3. The second-like connection chip--the passive component material part electronic component. So far, roughly, a soft and hard composite wiring board 300 has been manufactured. f In this embodiment, the method of removing part of the first circuit substrate and the partial board 32 may be performed by peeling, and the above manner may be sighed or stalked by layers, for example, by vacuum suction. _ part of the j-th substrate 320a and part of the second circuit substrate 32〇b. f remove some of the first-line substrate and after 32% of the 'can be used for the first slot R3 and the second sample r program' to remove the remaining in the first-groove and the first two money engraving process, and In particular, it can be a wet handle engraving process. The above-mentioned first circuit substrate and the second line 17 ttwf.doc/n 200938041 substrate comprehensively cover the first low-flow glue film and the second low-flow glue amount opening (ie, - Opening and second opening σ) ' Therefore, during the process of performing the wet etching process, the flexible circuit board is protected by the first circuit substrate and the second circuit substrate to prevent the soft circuit board from being etched. Infiltrated and destroyed. In addition, the present invention may also utilize a build-up method to form a circuit layer on the first outer circuit layer of the first substrate and another circuit layer on the second outer layer of the second substrate, wherein the build-up layer The film used in the law can be a high-flow film with a viscosity coefficient between 100 poise and 20,000. In this way, the manufacturing cost of the soft and hard composite circuit board can be reduced. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A to Fig. 1 are schematic cross-sectional views showing a flow of manufacturing a soft and hard composite wiring board. 2A to 2E are schematic cross-sectional views showing the flow of a method of manufacturing a soft and hard composite wiring board according to a first embodiment of the present invention. 3A to 3E are schematic cross-sectional views showing the flow of a method for manufacturing a soft-hard composite circuit board according to a second embodiment of the present invention. [Main component symbol description] 100, 200, 300: soft and hard composite circuit board 18 ttwf.doc/n 200938041 110, 210, 310: flexible circuit board 110a, 110b: surface 120: rigid substrate 120a, H3, H4: opening 122 Film 124: Core layer 126: Metal layer 126', 214a, 214b, 328a, 328b: Circuit layer 210a, 310a: Upper surface 210b, 310b: Lower surface θ 212: Flexible substrate 216a, 216b, 316a, 316b: Cover layer 220a, 320a: first circuit substrate 220a', 320a': first substrate 222a, 322a: first outer circuit layer 222a', 322a': first outer conductive layer 224a, 324a: first insulating layer 220b, 320b: Two circuit substrates ❹ 220b', 320b': second substrate 222b, 322b: second outer wiring layer 222b', 322b': second outer conductive layer 224b, 324b: second insulating layer 230a: first low-flow adhesive film 230b: second low-flow glue film 326a: first inner layer circuit layer 326b: second inner layer circuit layer 19 ttwf.doc/n 200938041

330a: first film D2, D4: thickness H1: first opening M1: first metal film layer R1, R3: first groove Sb S5: first outer surface S2, S6: second outer surface S3: first Inner surface Ή, T3: first trench T2, T4: second trench W1, W2: trace 330b: second film H2: second opening M2: second metal film layer R2, R4: second slot S4 : second inner surface

20

Claims (1)

200938041 ttwf.doc/n X. Application for Patent Park: Includes: an upper surface and a L. A method for manufacturing a soft and hard composite circuit board, providing a flexible circuit board having mutually opposite surfaces; ί plate. It passes through the first-low-flow adhesive film and the upper surface, and the first-line substrate has a mutual relative to each other. The second -2 surface 'the first low-flow adhesive film has - exposed 2 the surface - opening" and the first circuit substrate comprehensively covers the two-circuit substrate, and the second low-flow adhesive Film and ίιϊϊί, the second line has a second substrate opposite to each other, and the second low-flow film has a second opening of the lower surface, and The second circuit substrate comprehensively covers k, an opening, the first low-flow adhesive film and the second low-flow adhesive film have a viscosity coefficient between 7000 poise and 1 〇〇〇〇〇p〇ise And the first opening is opposite to the second opening; the first outer surface is cut to form at least one first groove, wherein the first groove corresponds to the edge of the first opening; Forming a surface to form at least one second trench, wherein the second trench corresponds to an edge of the second opening; removing a portion of the first circuit substrate corresponding to the first opening to form a portion partially exposing the upper surface First slotting; and removing the portion corresponding to the second opening Circuit board 'form a partially exposed to the lower surface of the second slot. 21 4twf.doc/n 200938041 The thickness of the substrate of the soft-hard composite circuit board of the first and second aspects of the ice-making composite circuit according to the first aspect of the ice-making composite circuit board The ice of the groove relative to the second outer surface is equal to the thickness of the second circuit substrate. The thickness of the first and second trenches of the soft and hard composite circuit board according to the first aspect of the invention is smaller than the thickness of the first outer surface of the first trench relative to the second outer trench The ice of the surface is smaller than the thickness of the second circuit substrate. The method of forming the first groove and the second groove in the soft-hard composite circuit board of the first item includes the - laser cutting process or the mechanical cutting process. Μ Μ 软 Μ 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该The second and second circuit boards of the second and second circuit boards of the first and second circuit boards are removed by the 硬 ΐ ΐ 对 专利 专利 专利 软 ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ Thereafter, a cleaning process is performed on the slot and the second slot. The _if patent relates to the f-method of six soft and hard composite circuit boards, wherein the cleaning process includes an etching process. "=,, ^ application for special (4) 1 of the soft and hard composite circuit board side = including · 'the towel forming the first - circuit substrate and the second circuit substrate by the first low-flow adhesive film, Pressing a first substrate on the flexible 22 200938041 4 twf.doc/n circuit board, wherein the first substrate comprises a first outer conductive layer and a first between the first outer conductive layer and the flexible circuit board a first insulating layer; press-bonding a second substrate to the flexible circuit board by the second low-flow adhesive film; wherein the second substrate comprises a second outer conductive layer and a second outer conductive layer With the flexible circuit board - the second insulating layer; A portion of the first outer conductive layer is removed to form a -first outer layer; and a portion of the second outer conductive layer is removed to form a second outer wiring layer. 9. The method of claim 1, wherein the method of removing a portion of the first outer conductive layer and a portion of the second outer conductive layer comprises a photolithography process. • The edge-making method of the soft and hard composite circuit board according to item 8 of the patent application scope of the patent application, the first substrate further includes a “first-salt layer” relative to the first-outer conductive f The second substrate further includes an m-line layer with respect to the first-outer conductive layer. =·If applying for the manufacture of a soft and hard composite circuit board as described in item 1G, where the first inner layer includes a first inner layer and the second inner layer A pair of second metal film layers that should have a second opening are included. The manufacturing process of the soft and hard composite circuit board according to item 8 of the patent scope, the method of forming the first circuit substrate and the second circuit substrate by the method of the invention, the method further comprises: using a build-up layer Forming at least one wiring layer on the first outer wiring layer; and forming at least another wiring layer on the second outer wiring layer by using the build-up method, wherein the film used in the build-up method is sticky The lag factor is between 1 〇〇 poise and 20,000 poise. twenty four