TW201204209A - Wiring board and method for fabricating the same - Google Patents

Abstract

A wiring board including an outer wiring layer, a wiring layer, a body layer, a high density interconnection (HDI) board and at least a first conductive column. The body layer is disposed between the outer wiring layer and the wiring layer, and the HDI board is embedded in the body layer. The first conductive column is disposed in the body layer, and connected between the HDI board and the outer wiring layer. In addition, a method for fabricating the wiring board is also provided.

Description

201204209 钃六、发明说明: Technical Field of the Invention The present invention relates to a wiring board and a method of manufacturing the same, and more particularly to a high density interconnecting board (High Density Interconnection Board) , HDI Board) circuit board and its manufacturing method. [Prior Art] • The circuit board is currently the electronic device for mobile phones, computers and digital cameras, and the parts required for home appliances such as TVs, washing machines and refrigerators. In detail, 'the circuit board can carry and be equipped with various electronic components such as chips, passive components, active components, and microelectromechanical systems 'MEMS'. . In this way, current can be transmitted to these electronic components via the circuit board, thereby enabling these electronic devices and home appliances to operate. SUMMARY OF THE INVENTION The present invention provides a wiring board capable of mounting at least one electronic component. The present invention provides a method of manufacturing a wiring board for manufacturing the above wiring board. The present invention provides a wiring board comprising an outer wiring layer, a wiring layer, a body layer, a high density interconnecting board (HDI board), and at least one first conductive germanium. The body layer 201204209 is disposed between the outer circuit layer and the circuit layer, and the high-density interconnection plate is buried in the main layer. The first conductive pillar is disposed in the body layer and is connected between the high density interconnecting board and the outer wiring layer. In an embodiment of the invention, the body layer includes an adhesive layer and an insulation layer. The adhesive layer is bonded between the high density inner wiring board and the outer wiring layer, and the first conductive pillar passes through the adhesive layer. The insulating layer covers the high-density interconnecting board, and the wiring layer is disposed on the insulating layer and contacts the insulating layer. In an embodiment of the invention, the adhesive layer covers the outer layer of the outer layer in a comprehensive manner. In an embodiment of the invention, the adhesive layer partially covers the outer wiring layer. In an embodiment of the invention, the body layer further includes a substrate between the outer wiring layer and the insulating layer, and the substrate surrounds the high density interconnecting board. In an embodiment of the invention, the circuit board further includes at least one second conductive pillar passing through the insulating layer. The second conductive pillar is connected between the high-density interconnecting board and the wiring layer, and the substrate is a semipreg; or, in another embodiment of the invention, the substrate is a wiring substrate. And the second conductive pillar is connected between the circuit substrate and the circuit layer. In an embodiment of the invention, when the substrate is a wiring substrate, the distance between the high-density interconnecting board and the outer wiring layer is smaller than the distance between the high-density interconnecting board and the wiring layer. 201204209 In an embodiment of the invention, the number of layers of the high-density interconnecting board is greater than or equal to the number of layers of the circuit substrate, and the average layout density of the high-density interconnecting board is greater than or equal to the circuit substrate. Average wiring density. In an embodiment of the invention, the circuit board further includes a high density interconnect board (HDI Sub-board). The high density interconnected daughter boards are embedded in high density interconnect boards. In an embodiment of the invention, the number of layers of the high-density interconnecting sub-board is greater than or equal to the number of layers of the high-density interconnecting board, and the average wiring density of the high-density interconnecting sub-board is greater than or equal to the high density. The average wiring density of the interconnect boards. In an embodiment of the invention, the first conductive post extends from the outer circuit layer to the interior of the high density interconnect. The invention further provides a method of manufacturing a circuit board. First, at least a uniform hole is formed on a base φ plate. After the through holes are formed, a high density inner wiring board is fixed on the substrate, wherein the high density inner wiring board covers the through holes. A body layer is formed on the substrate, wherein the body layer covers the high density interconnector. A metal layer is formed on the body layer. At least one first conductive pillar connected between the high density interconnector plate and the substrate is formed after the formation of the body layer. After forming the first conductive pillars, the substrate and the metal layer are patterned to form an outer wiring layer and a wiring layer, respectively. In an embodiment of the present invention, a method of fixing a high-density interconnecting board to a substrate 201204209 and a method of forming a main body layer are as follows. Applying or sticking on the substrate - the adhesive layer. Next, the high density inner wiring board is bonded to the adhesive layer. Thereafter, an insulating layer is formed on the substrate and on the high-density wiring board, wherein the insulating layer covers the high-density interconnecting board. In an embodiment of the invention, the method of forming the first conductive pillar by the above-mentioned adhesive layer filling the through hole is as follows. Remove some of the adhesive layer in the through hole. After the partial adhesion layer is removed and before the substrate is patterned, a through hole (PTH) is applied to the through hole. In an embodiment of the invention, when the via hole is subjected to via plating, the via hole is subjected to full_Filled Plating. In an embodiment of the invention, the method for forming the main body layer further comprises: after the bonding board is bonded to the adhesive layer, the substrate is disposed between the insulating layer and the substrate, wherein the substrate has an opening. The high-density interconnect wiring board is located in the opening. In an embodiment of the present invention, after forming the main body layer, the second conductive material is connected to the second conductive layer between the high-density interconnecting board and the metal layer, wherein the substrate is a semi-solid rotating sheet; Alternatively, in another embodiment of the present invention, the substrate is a circuit substrate, and after forming the body layer, further includes 'at least—connecting the second conductive pillar between the circuit substrate and the metal layer. In the present invention, when the substrate is a secret substrate, the method of forming the host further includes disposing a semi-cured film between the substrate and the substrate.

FSI 6 201204209. In an embodiment of the invention, the high-density interconnecting board is formed by cutting a first wiring panel to form a 'the circuit substrate is a knife', a first line mother board, wherein The first line mother board includes a plurality of inner wiring boards, and the second line mother board includes a plurality of circuit boards. In an embodiment of the invention, the high density interconnecting strip has at least one pad, and the pad covers the through hole. In an embodiment of the invention, the high density interconnector board has an inner layer of wiring layers and the first conductive pillars are connected to the inner layer of wiring layers. The circuit board of the present invention can electrically connect at least the electronic components by including the outer circuit layer. Therefore, the circuit board of the present invention can be provided with at least one electronic component, that is, the current can be (4) to the electronic component. The above described features and advantages of the present invention will be more apparent from the following description of the appended claims. [Embodiment] FIG. 1A to FIG. 1 are a schematic cross-sectional view showing a method of manufacturing a wiring board according to an embodiment of the present invention, and FIG. 1G is a cross-sectional view showing the wiring board of the present embodiment. Referring first to the drawings, the structural features of the circuit board 100 of the present embodiment will be described first. The circuit board 1 of the present embodiment includes an outer wiring layer 110, a wiring layer 12, a main body layer 13, a high-density interconnecting board 140, and a plurality of first conductive pillars 15A. The main body layer 130 is disposed between the outer circuit layer 110 and the circuit layer 120, that is, the outer circuit layer 11A and the circuit layer 120 are respectively located on opposite surfaces of the main body layer 130201204209. The high-density interconnecting board 140 is buried in the main body layer 130 « , that is, the main body layer 〇 3 〇 covers the high-density interconnecting board 140. These first conductive pillars 150 are disposed in the body layer 130 and are connected between the high density inner wiring board 14 and the outer wiring layer 110. The outer wiring layer 11A may include a plurality of pads 112 and at least one trace 114' and the high density interconnecting board 140 has a plurality of pads 142a, 142b 'where the first conductive pillars 150 may Connected between the φ pads 112 and the pads 142a. At least one electronic component 300 can be mounted on the circuit board and electrically connected to the pads 112. The electronic component 300 is, for example, a wafer, a passive component, an active component, or a microelectromechanical system component, and the electronic component 300 may be mounted on the wiring board 1 by means of flip chip or wire bonding. Taking FIG. 1G as an example, the electronic component 300 is mounted on the circuit board 100 in a flip chip manner, so that a plurality of solder bumps S1 are connected between the electronic component 300 φ and the pads 112 so that the electronic component 300 can The pads 112 are electrically connected through the solder bumps S1, wherein the solder bumps S1 are, for example, solder balls. In this manner, the electronic component 300 can be electrically connected to the high-density interconnecting board 140 via the pads 112 and the first conductive pillars 150, thereby allowing current to be transmitted to the electronic component 3 via the wiring board 1 . Although FIG. 1G illustrates a plurality of first conductive pillars 150, in other embodiments, the 'circuit board 100 may include only one first conductive pillar 15 〇, that is, the first conductive pillar 150 included in the wiring board 100. The number can be only one

'f SI 201204209 r c - each. Thus, the number of first conductive pillars 150 shown in Fig. 1G is for illustrative purposes only and is not intended to limit the invention. In this embodiment, the main body layer 130 may include an adhesive layer 132, a substrate 134, and an insulating layer 136. The adhesive layer 132, the substrate 134, and the insulating layer 136 may be made of a resin material. 134 can be a semi-cured film. The adhesive layer 132 is bonded between the high-density interconnecting board 140 and the outer wiring layer 110, and partially covers the outer wiring layer 110' and the first conductive pillars 150 pass through the bonding layer 132 to connect the high-density interconnecting lines. The board 140 is connected to the outer wiring layer 11 . The insulating layer 136 covers the high-density interconnecting board 14A, and the wiring layer 120 is disposed on the insulating layer 136 and contacts the insulating layer 136. The substrate 134 is positioned between the outer wiring layer 110 and the insulating layer 136 and surrounds the high density interconnecting board 140' so that the insulating layer 136 is positioned between the wiring layer 12 and the substrate 134. Since the adhesive layer 132 is bonded to the high-density interconnecting board 14 〇, the substrate 134 surrounds the high-density interconnecting board, and the insulating layer 136 covers the high-density interconnecting board 140, so the high-density interconnecting board 14 The crucible can be buried in the main body layer 13〇. It should be noted that although the body layer 13() shown in FIG. 1G includes the substrate 134, in other embodiments, particularly when the high density interconnecting plate 14A has a very thin thickness T1, the insulating layer 136 It may be a semi-cured film, and the body layer 130 may not require the substrate 134, i.e., the substrate 134 is only a selective element of the present invention 'not a necessary element. Therefore, the high-density interconnecting board 140 may be surrounded only by the adhesive layer 132 and the insulating layer 136, and the substrate 134 of 201204209 shown in FIG. 1G is merely illustrative and not limiting. The circuit board 100 may further include at least one second conductive pillar 160. For example, the circuit board 1 shown in FIG. 1G includes a plurality of second conductive pillars 16A, but in other embodiments, the circuit board 1〇〇 may only A second conductive post 160 is included. These second conductive pillars 160 pass through the insulating layer 136 and are connected between the high density interconnecting board 140 and the wiring layer 120. The second conductive pillars ι6 〇 can be connected to the pads 142b, respectively, such that the high-density interconnecting board 140 can be electrically connected to the wiring layer 120 via the second conductive pillars 160. Further, the circuit board 1 〇〇 may further include at least one conductive connection structure. The conductive connection structure is disposed in the main body layer 130 and is connected between the outer circuit layer 110 and the circuit layer ι2 ', wherein the conductive connection structure may be a conductive blind via structure or a conductive via hole (c〇n) Structure (conductiVe thr0Ugh hole structure). With the conductive connection structure, the outer circuit layer 11 () can electrically connect the circuit layer 12 〇. It is worth mentioning that the circuit board 100 can not only be a finished circuit board finished product' And it can also be a part of a multiiayer wiring board, that is, the circuit board 1 can be used as a line structure in the multilayer circuit board. In detail, in other embodiments, it can be utilized In the build-up or stacking process, one or more wiring layers are additionally formed on the insulating layer 136, so that the wiring layer 120 becomes an inner wiring layer of the multilayer wiring board. In the embodiment shown in FIG. 1G, no circuit layer is shown above the circuit layer 120 and the insulating layer 136, so that the circuit board 100 shown in FIG. 1G is seen. It is a finished circuit board finished product, but in other embodiments, the circuit board 100 can also be used as a circuit structure in a multilayer circuit board. Therefore, the circuit board shown in FIG. 1G is merely illustrative and does not limit the present invention. Referring to FIG. 1H, the high-density interconnecting board 140 of FIG. 1G is illustrated in an enlarged manner. The circuit board 1 may further include a high-density interconnecting sub-board 180, which is a high-density interconnecting board. The density interconnecting sub-board 180 is buried in the high-density interconnecting board 140' and may be buried in the high-density interconnecting board 140 via build-up or stacking. In addition, high density The average wiring density and the number of layers of the interconnecting sub-board 180 may be greater than or equal to the average wiring density and the number of layers of the high-density interconnecting board 140, wherein the number of layers referred to in the present invention refers to the number of wiring layers. Taking FIG. 1H as an example, in addition to the pads 142a, 142b, the high-density interconnecting board 140 further has two wiring layers 144a, 144b, wherein the circuit layers 144a, 144b are the inner wiring of the high-density interconnecting board 140. Layer, so high-density interconnector board 140 The four-layer circuit layer, that is, the number of layers of the high-density interconnecting board 140 is four. However, it must be emphasized that 'the number of layers of the high-density interconnecting board 140 in FIG. 1H is merely an example' and does not limit the present invention. In addition, the high-density interconnecting board 140 may further have at least one conductive 201204209 • pillar 146, at least one conductive pillar 148a, and at least one conductive pillar 148b, wherein the conductive pillar 146 is connected between the circuit layers 144a and 144b. The conductive post 148a is connected between the high-density interconnecting sub-board 18A and the pad 142a, and the conductive post 148b is connected between the high-density interconnecting sub-board 180 and the pad 142b. With these conductive pillars 148a and 148b, the high-density interconnect wiring sub-board 180 is electrically connected to the high-density interconnecting board 14〇 so that current can be connected between the high-density interconnecting sub-board 180 and the high-density interconnecting board. Transfer between 4〇. In particular, although the first conductive pillars 150 may be connected between the pads 112 and the pads 142a, in other embodiments, the first conductive pillars 5〇 may not pass through any one of the connections. The 塾i42a is directly connected between the pad 112 and the wiring layer 144a or 144b, or directly connected to the density interconnecting sub-board 180. In other words, the first conductive pillar 15A can extend from the outer wiring layer 110 to the inside of the high-density interconnecting board 14A. The above mainly introduces the structural features of the circuit board. Next, a method of manufacturing the wiring board 100 will be described in detail with reference to Figs. 1A to II. Referring to FIG. 1A, with respect to a method of manufacturing a circuit board, first, at least one through hole H1 is formed on a substrate ίο. For example, in the embodiment of FIG. 1A, a plurality of through holes H1 are formed on the substrate 1? However, in other embodiments, only one through hole H1 may be formed. There are many ways to form the through hole H1, such as laser drilling, mechanical drilling, or lithography etching. Further, the substrate 10 may be a metal foil such as a copper foil or an aluminum foil; or the substrate 1 may be a composite sheet such as a copper foil substrate (Copper Clad Laminate, CCL). Referring to FIG. 1B and FIG. 1C, after the through holes HI are formed, the high-density interconnecting wires 140 are fixed on the substrate, wherein the high-density interconnecting plates 140 cover the through holes H1 and are in a high density. The pads 142a of the wiring board 140 cover the through holes H1', that is, the pads 142a correspond to the through holes H1, respectively. There are various ways of fixing the high-density interconnecting board 14 on the substrate 10. In the embodiment shown in FIG. 1B and FIG. 1C, the high-density interconnecting board φ 140 can be fixed on the substrate 10 by bonding. . In detail, referring to FIG. 1B, an adhesive layer 132 is first coated or bonded on the substrate 10. The adhesive layer 132 may partially cover a flat surface 12' of the substrate 10 and cover the through holes H1. The adhesive layer 132 may be formed of a resin material such as epoxy, and the method of applying the adhesive layer 132 may be a method such as spraying, brushing or screen printing. • Referring to FIG. 1C, the high density interconnecting board 140 is then bonded to the adhesive layer 132. Thus, the high-density interconnecting board 140 is fixed to the substrate 10. Further, the adhesive layer 132 may be a liquid material or a paste material having fluidity, so that the adhesive layer 132 can fill the through holes H1. In addition, the high-density interconnecting board 140 can be aligned until the high-density interconnecting board 140 is bonded to the adhesive layer 132 so that the high-density interconnecting board 140 can be seated in the correct position. Please refer to FIG. 1D and FIG. 1E, and then, a high cladding is formed on the substrate 10.

[SI 13 201204209 The main body layer 130 of the density inner wiring board 140. There are many methods for forming the main body layer 130. In the present embodiment, since the main body layer 130 includes the adhesive layer 132, when the adhesive layer 132 is coated or bonded on the substrate 10, the high-density interconnecting board is bonded. At 140 o'clock, the body layer 130 has begun to form.

After the high-density interconnecting board 140 is bonded to the adhesive layer 132, an insulating layer 136 is formed on the substrate 10 and on the high-density interconnecting board 140, and the substrate 134 is disposed between the insulating layer 136 and the substrate 10. The substrate I% has an opening H2, and the opening H2 may be formed by external singulation or laser ablation. When the substrate 134 is disposed, the progress inner wiring board 140 is positioned in the opening H2, so that the substrate 134 can be wound around the density inner wiring board 140. The insulating layer 136 and the substrate 134 may be formed by press bonding. The method of forming the insulating layer 130 and the substrate 134 in detail may be performed by laminating both the resin layer and the rhodium film on the substrate 1 , wherein the semi-cured film is disposed between the layer and the substrate 1 . In the process of pressing, e and semi-cured film may be heated, that is, the resin layer and the prepreg film are thermocompression-bonded to form the main body layer 130. A method of forming another 'circuit board 100' is further included on the body layer 130: forming a metal layer 122. The metal layer 122 may be formed on the insulating layer 136, and may be a foil such as a copper foil or an aluminum foil. The metal layer 122 may be on the side of the insulating layer Ik. At the same time, for example, the metal layer 122 and the insulating layer 136 are formed, and a composite sheet can be pressed onto the substrate 134, and the composite sheet can have a metal foil and a resin layer, such as a copper foil substrate. It should be noted that since the substrate 134 is not an essential component of the present invention, in other embodiments, the base #134 is not necessarily formed, and only the substrate 134 may be formed without pressing the substrate. The ruthenium and a piece of semi-cured film are on the substrate 1 to form a metal layer 122 and a body layer 130', wherein the metal foil may be a surface coated with a glue, such as a Resin Coated Copper (RCC) ). Therefore, the substrate 134 shown in Fig. 1D and Fig. φ 1E is merely illustrative and not intended to limit the invention. Referring to FIG. 1E and FIG. 1F, then, at least one first conductive pillar 150 and at least one second conductive pillar 160 are formed. The first conductive pillar 150 is connected between the high-density interconnecting board 140 and the substrate 10, and the second conductive pillar 160 is connected between the high-density interconnecting board 140 and the metal layer 122. The first conductive pillar 150 and the second conductive crucible 160 may be formed by via plating, and the method of forming the first conductive pillar 150 and the second conductive pillar 160 may include electroless plating and electricity. Electroplating ° The method of forming the first conductive pillar 15A may include the following process. First, when the adhesive layer 132 fills the through holes H1 (as shown in FIG. 1D), the partial adhesive layer 132' in the through holes H1 is removed, and the method of removing the partial adhesive layer 132 may include laser ablation ( The laser ablation)', that is, the adhesive layer 132' exposed by the laser beam at the through holes H1 enables the through hole H1 to partially expose the high density interconnecting plate 140.

i SI 15 201204209 In addition, after performing the above-described laser ablation, the through holes HI may be desmear to clean the through holes HI. Thereafter, the through holes H1 are subjected to through-hole plating, that is, the through holes H1 are sequentially subjected to electroless plating and electroplating. Thus, the first conductive pillars 150 are formed in the through holes H1, and the substrate 10 and the high-density interconnecting wiring board 140 are connected. When the through holes H1 are subjected to through hole plating, the through holes H1 may be filled with holes to make the first conductive posts 150 become solid conductive pillars. When the first conductive pillar 150 is formed, a flow of forming the second conductive pillar 160 may be performed so that the first conductive pillar 150 and the second conductive pillar 160 can be simultaneously formed, and the second conductive pillar 160 is formed as follows. First, one or more openings H3 are formed on the metal layer 122, wherein the openings H3 are formed through the metal layer 122 and the insulating layer 136, and the method of forming the opening H3 may be laser drilling or lithography. . Further, after performing the above-described φ laser drilling, the openings H3 may be subjected to desmearing. After the opening H3 is formed, the opening H3 is subjected to through-hole plating, that is, the holes H3 are sequentially subjected to electroless plating and electroplating, and the through holes H1 and the openings H3 are simultaneously subjected to through-hole plating. In this way, the second conductive pillars 160 can be respectively formed in the openings H3 and connect the high-density interconnecting board 140 and the metal layer 122, and the first conductive pillars 150 and the second conductive pillars 160 can be in the same pass. The hole plating process is formed. Further, when the openings H3 are subjected to through-hole plating, it is also possible to fill the holes of the 201204209 openings H3 to make the second conductive pillars i6 实 a solid conductive pillar structure. Referring to FIG. 1F and FIG. 1G, the substrate 1 and the metal layer 122 are patterned to form an outer layer wiring layer 11 and a wiring layer 12, respectively. The method of patterning the substrate 10 and the metal layer 122 may be micro-picture rhyme. engraved. So far, the circuit board 100 has been substantially completed. In addition, after the circuit board 1 is completed, one or more wiring layers may be additionally formed on the insulating layer 136 or the outer wiring layer 110 by the build-up method or the stacking method, so that the outer wiring layer 110 or the wiring layer 120 Become the inner layer of the multilayer circuit board. Referring to FIG. II, it is worth mentioning that 'because the first conductive pillar 15〇 can extend to the inside of the south density inner wiring board 140, the first conductive pillar 15 is also formed in the process of forming the first conductive pillar 150. An inner wiring layer 144 may be attached to the high density interconnecting board 140, as shown in FIG. π, wherein the inner wiring layer 144 is, for example, the wiring layer 144a or 144b (please refer to FIG. 1H). Φ Fig. 2A to Fig. 2F are schematic cross-sectional views showing the flow of a method of manufacturing a wiring board according to another embodiment of the present invention. Referring to FIG. 2D, the circuit board 200 of the present embodiment is similar in structure to the circuit board 1 of the foregoing embodiment, and the difference in structural characteristics between the circuit boards 100 and 200 will be mainly described below. The circuit board 200 can be provided for at least one electronic component 300 (see FIG. 1G), and the circuit board 200 includes components similar to those of the circuit board 100. For example, the circuit board 200 also includes an outer circuit layer 11 The circuit layer 120, a high-density interconnecting board 14〇, and a plurality of first conductive pillars 201204209 150. However, the body layer 230 included in the wiring board 200 is different from the body layer 130 of the aforementioned circuit board 100. In detail, the body layer 230 includes an adhesive layer 232, a substrate 234, an insulating layer 236, and a half cured film 238. The pre-cured film 238 is disposed between the substrate 234 and the outer wiring layer 110, and the adhesive layer 232 is bonded between the high-density interconnecting board 140 and the outer wiring layer 110, and comprehensively covers the outer wiring layer 110, wherein the adhesive layer The 232 and insulating layer 236 may include a resin material. Since the adhesive layer 232 comprehensively covers the outer wiring layer 110, the insulating layer 236, the substrate 234 and the prepreg 238 are substantially not in contact with the outer wiring layer 110. Further, in the present embodiment, the substrate 234 has an opening H4, and the high-density interconnecting board 140 is positioned in the opening H4, so that the substrate 234 surrounds the high-density inner wiring board 140. The substrate 234 is a wiring substrate, so the substrate 234 can be substantially regarded as a wiring board. Taking Fig. 2D as an example, the substrate 234 example can be regarded as a multilayer wiring board having four wiring layers. In addition, the average wiring density of the high-density interconnecting board 140 may be greater than or equal to the average wiring density of the circuit substrate (ie, the substrate 234), and the number of layers of the high-density interconnecting board 140 may also be greater than or equal to the substrate 234. The number of layers. For example, the number of layers of the high-density interconnecting board 140 shown in FIG. 1H may be four layers, and the substrate 234 shown in FIG. 2D may have four layers of wiring layers, so from FIG. 1H and FIG. 2D, The number of layers of the high density interconnector plate 140 can be equal to the number of layers of the substrate 234. Of course, in other embodiments, the number of layers of the high density 201204209 interconnecting board 140 may also be greater than the number of layers of the substrate 234, so the number of layers of the high density interconnecting board 140 shown in FIG. 1H, and FIG. 2D The number of layers of substrate 234 is shown as an example and is not intended to limit the invention. When the substrate 234 is a circuit substrate, the thickness T2 of the substrate 234 may be greater than or equal to the thickness T1 of the high-density interconnecting board 140, such that the distance D1 between the high-density interconnecting board 140 and the outer wiring layer 110 is less than The distance D2 between the high-density interconnecting board 140 and the wiring layer 120 is such that the high-density interconnecting φ strip 140 is closer to the outer wiring layer 110 and farther from the wiring layer 120. Therefore, the electronic component 300 can be mounted close to the high-density interconnecting board 140, and electrically connected to the high-density interconnecting board 140 via the outer wiring layer 110 and the first conductive post 150. In addition, since the average wiring density of the high-density interconnecting board 140 is greater than the average wiring density of the substrate 234, and the average wiring density of both the high-density interconnecting board 140 and the substrate 234, the average wiring density of the electronic component 300 The average wiring density of the high-density interconnecting board φ 140 is relatively close, thereby facilitating mounting of the electronic component 300 near the high-density interconnecting board 140, as shown in Fig. 2D. In addition, although the circuit board 200 may further include at least one second conductive pillar 260, and the shape and material of the second conductive pillar 260 are substantially the same as those of the second conductive pillar 160, different from the foregoing embodiment, the embodiment The second conductive pillar 260 passes through the insulating layer 236 and is connected between the wiring substrate (ie, the substrate 234) and the wiring layer 120. As such, the substrate 234 can be electrically connected to the wiring layer 120 via the second conductive pillars 160. However, in his embodiment of 201204209, at least one second conductive pillar 160 may also be connected between the high density interconnecting board 140 and the wiring layer 120 through the insulating layer 236. The above mainly describes the structural features of the circuit board 200. Next, a method of manufacturing the wiring board 200 will be described in detail with reference to Figs. 2A to 2F. Since the manufacturing method of the circuit board 200 and the manufacturing method of the circuit board 100 described above all include the same flow, the following mainly describes the difference in manufacturing methods of the circuit boards 1 and 200. 'φ Referring to Fig. 2A, the high-density interconnecting board 140 is fixed on the substrate 10 after the through holes H1 are formed. The high-density interconnecting board 140 can be fixed to the substrate 10 by means of bonding. For example, an adhesive layer 232 is applied or laminated on the substrate, and the method of applying the adhesive layer 232 therein may be the same as the method of applying the adhesive layer 132. The adhesive layer 232 covers the plane 12 of the substrate 10 in a comprehensive manner, so that the through holes H1 are covered by the adhesive layer 232. Next, the high-density interconnecting board 140 is bonded to the adhesive layer 232 so as to fix the high-density interconnecting board 14 on the substrate 10. Referring to FIG. 2B and FIG. 2C, an insulating layer 236 covering the high-density interconnecting board 140 is formed on the substrate 10 and on the high-density interconnecting board 140, and a base is disposed between the insulating layer 236 and the substrate 10. The material 234, wherein the opening H4 is formed in the same manner as the opening H2. Further, a prepreg 238 is disposed between the substrate 234 and the substrate 1 , wherein the prepreg 238 is disposed between the adhesive layer 232 and the substrate 234. The method of forming the insulating layer 236 can be the same as the formation of the insulating layer 136.

[SI 20 201204209 Method] For example, the method of forming the insulating layer 236 may be to bond the resin to the substrate 234. When the prepreg film (10) is disposed, the prepreg film can be laminated between the substrate H) and the substrate 234. Further, in the above-described press-bonding process, a linole layer and a prepreg film 238 may be applied so that the glue material of both the resin layer and the prepreg film 238 can flow, thereby filling the opening H4. As such, the body layer 230 is formed.

It is worth mentioning that since the adhesive layer 232 covers the plane 12 of the substrate 1 holly, the adhesive layer 232 can be adhered between the substrate 234 and the substrate 1 即使 even without the semi-cured film 238. It can be seen that the pre-cured film g is only a selective element of the present invention and is not an essential element, so the prepreg film 238 shown in Figures 2b to 2D is merely illustrative and not limiting. Referring to FIG. 2C, after the body layer 230 is formed, at least one second conductive pillar 260 connected between the substrate 234 and the metal layer 122 may be formed, and at least one first conductive pillar 15A may be formed. The second conductive pillar 26 is formed in the same manner as the second conductive pillar 160 in the foregoing embodiment. Therefore, the method of forming the second conductive pillar 260 will not be repeatedly described below. Referring to Figures 2C and 2D, the substrate 10 and the metal layer 122' are patterned to form the outer wiring layer 11 () and the wiring layer 120, respectively. At this point, the circuit board 200 has basically been manufactured. Further, the above-described patterning method is the same as the foregoing embodiment, that is, the method of patterning the substrate 1 and the metal layer 122 may be lithography etching. In addition, after the circuit board 200 is manufactured, one or more wiring layers may be additionally formed on the insulating layer 236 or the outer wiring layer 110 21 201204209 by the build-up method or the stacking method, so that the outer wiring layer 110 or the wiring layer 120 Become the inner layer of the multilayer circuit board. 2E is a top plan view of a first line mother board including a plurality of high density interconnect boards of FIG. 2d, and FIG. 2F is a top plan view of a second line mother board including a plurality of circuit boards of FIG. 2D. Referring to FIG. 2E and FIG. 2F, in the embodiment, the high-density interconnecting board 140 may be formed by cutting a first line mother board 40, and the circuit substrate (ie, the substrate 234) may be: • cutting a second The line mother board 34 is formed. The first line mother board 40 includes a plurality of high density interconnect boards 140, and the second line mother board 34 includes a plurality of substrates 234. After the first circuit mother board 40 and the second line mother board 34 are manufactured, the first line mother board 40 and the second line mother board 34 are cut to obtain a plurality of high-density interconnect boards 140 and a plurality of bases. Material 234. Therefore, the use of the first wire mother board 40 and the second line mother board 34' facilitates mass production of the high density interconnecting board 14 and the substrate 234. • The high-density interconnecting board 140 has an average wiring density greater than the average wiring density of the substrate 234, and the number of layers of the high-density interconnecting board 14〇 is larger than the number of layers of the substrate 234, thereby fabricating a high-density interconnecting board The time required for 140 may be more than the time required to manufacture the substrate 234, so the high density interconnector board 140 takes a lot of time to manufacture. However, both the high-density interconnector board 140 and the substrate 234 can be cut from different line mother boards (ie, the first line mother board 40 and the second line mother board 34), and the first line mother board 40 and Second line mother board 34

i SI 22 201204209 can be manufactured at the same time. Thus, the time required to manufacture the wiring board 200 can be reduced, so that the wiring board 200 can be manufactured quickly. In summary, the outer circuit layer included in the circuit board of the present invention can electrically connect a plurality of electronic components, such as a wafer, a passive component, an active component, or a microelectromechanical system component, so that the circuit board of the present invention can provide at least one circuit board. The electronic components are mounted so that current can be transmitted to the electronic components, thereby allowing electronic devices (such as cell phones, computers or digital cameras) and home appliances φ (such as televisions, washing machines or refrigerators) to operate. Next, in the circuit board of the present invention, the high-density interconnecting board is buried in the main body layer, and the average wiring density and the number of layers of the high-density interconnecting board are larger than the wiring substrate (ie, the substrate 234) in the main body layer. The average wiring density and the number of layers 'is thus able to form a densely distributed straight layer in a certain area of the wiring board; in another area of the wiring board, a wiring having a relatively thin distribution and a small number of layers is formed. In this way, the overall number of layers of the board can be reduced, as well as the overall thickness, and the layout of the board can be simplified. While the present invention has been described above in the foregoing embodiments, it is not intended to limit the invention, and the equivalents of the modifications and retouchings are still in the present invention without departing from the spirit and scope of the invention. Within the scope of patent protection.

23 201204209 [Brief Description of the Drawings] Figs. 1A to 1 are schematic cross-sectional views showing a process of manufacturing a wiring board according to an embodiment of the present invention. 2A to 2F are schematic cross-sectional views showing a process of manufacturing a wiring board according to another embodiment of the present invention. [Main component symbol description]

10 substrate 12 plane 34 second line mother board 40 first line mother board 100, 200 circuit board 110 outer circuit layer 112, 142a, 142b pads 114 traces 120, 144, 144a, 144b circuit layer 122 metal layers 130, 230 Body layer 132' 232 adhesive layer 134, 234 substrate 136, 236 insulation layer 140 high density interconnect plate 146, 148a, 148b conductive column 150 first conductive column 24 201204209 160, 260 second conductive column 180 high density interconnect Line board 238 Pre-cured film 300 Electronic components D1 > D2 Distance HI Through-hole H2, H4 Opening H3 Opening SI Solder block T, T2 thickness [si 25

Claims (1)

201204209 VII- 1. Patent application scope: A circuit board comprising: • 2. an outer circuit layer; a circuit layer; a main body layer disposed between the outer circuit layer and the circuit layer; a wire board embedded in the body layer; and at least one first conductive pillar disposed in the body layer and connected between the high density interconnecting plate and the outer circuit layer. The circuit board of claim 1, wherein the main body layer comprises an adhesive layer and an insulating layer, the adhesive layer is adhered between the high-density interconnecting board and the outer circuit layer, and the first A conductive pillar passes through the adhesive layer, the insulating layer covers the high density interconnecting board, and the wiring layer is disposed on the insulating layer and contacts the insulating layer. 3. The circuit board of claim 2, wherein the adhesive layer #4 comprehensively covers the outer circuit layer. The circuit board of claim 2, wherein the adhesive layer partially covers the outer circuit layer. 5. The circuit board of claim 2, wherein the body layer further comprises a substrate between the outer circuit layer and the insulating layer, the substrate surrounding the density interconnecting board. 6. The circuit board of claim 3, wherein the body layer further comprises a base f si 26 201204209 material between the outer circuit layer and the insulating layer, the substrate surrounding the high Density inner wiring board. 7. The circuit board of claim 5, further comprising a second conductive crucible having at least one tooth passing through the insulating layer, the second conductive post being connected between the high density interconnecting board and the wiring layer And the substrate is a half cured film. 8. The circuit board of claim 5, further comprising at least one second conductive doped through the insulating layer, the substrate is a circuit substrate, and the second conductive post is connected to the circuit substrate Between the circuit layers. 9. The circuit board of claim 8, wherein the body layer further comprises a semi-cured film disposed between the substrate and the outer circuit layer. The circuit board of claim 8, wherein the high-density interconnecting board and the outer layer of the circuit layer! The distance between the two is less than the distance between the high density interconnector and the circuit layer. 11. The circuit board of claim 8, wherein the number of layers of the high density # interconnect board is greater than or equal to the number of layers of the circuit substrate, and the average wiring density of the high density interconnect board is greater than Or equal to the average wiring density of the circuit substrate. 12. The circuit board of claim 1, wherein the high density interconnected daughter board is embedded in the high density interconnecting board. The circuit board of claim 12, wherein the number of layers of the high-density interconnecting sub-board is greater than or equal to the number of layers rsi 27 201204209 of the high-density interconnecting board, and the high-density interconnect The average wiring density of the line boards is greater than or equal to the average wiring density of the high density interconnect boards. 14. The circuit board of claim 1, wherein the first conductive post extends from the outer wiring layer to an inner portion of the high density interconnecting board. 15. A method of manufacturing a circuit board, comprising: forming at least a uniform hole on a substrate; and after forming the through hole, fixing a high density interconnecting board on the substrate, wherein the high density interconnecting board Covering the through hole; forming a body layer on the substrate, wherein the body layer covers the high density interconnecting plate; forming a metal layer on the body layer; forming at least one connection after forming the body layer a first conductive pillar between the high-density interconnecting board and the substrate; and after forming the first conductive pillar, patterning the substrate and the metal layer to form an outer wiring layer and a wiring layer, respectively. 16. The method of manufacturing a wiring board according to claim 15, wherein the method of fixing the high-density interconnecting board to the substrate and the method of forming the main body layer include: coating or coating the substrate Bonding an adhesive layer; bonding the high-density interconnecting board to the adhesive layer; and forming a permanent layer of 201204209 on the substrate and on the high-density interconnecting board, wherein the insulating layer covers the High density interconnect panels. The method of manufacturing a circuit board according to claim 16, wherein the adhesive layer fills the through hole, and the method of forming the first conductive column comprises: removing a portion of the through hole The adhesive layer; and through-hole plating after removing a portion of the adhesive layer and before patterning the substrate. 18. The method of manufacturing a circuit board according to claim 17, wherein when the through hole is plated through the hole, the through hole is filled with a hole. 19. The method of manufacturing a circuit board according to claim 16, wherein the method of forming the main body layer further comprises: after the high density inner wiring board is bonded to the adhesive layer, the insulating layer and the A substrate is disposed between the substrates, wherein the substrate has an opening, and the high density interconnecting plate is located within the opening. 20. The method of manufacturing a circuit board according to claim 18, after forming the body layer, further comprising forming at least one second conductive connection between the high density interconnecting board and the metal layer. a column wherein the substrate is a half cured film. The method of manufacturing a circuit board according to claim 18, wherein the substrate is a circuit substrate, and after forming the body layer, further comprising forming at least one connection between the circuit substrate and the metal layer The second conductive column. 22. The method of manufacturing a circuit board according to claim 20, wherein the method of forming the body layer in 29 201204209 ' further includes between the substrate and the substrate. 23. The method of manufacturing a circuit board according to claim 19, wherein the high-density interconnecting board is formed by cutting a first line mother board, and the circuit board is formed by cutting a second line mother board. The first line mother board includes a plurality of the high density interconnect boards, and the second line mother board includes a plurality of the circuit boards. 24. The method of manufacturing a circuit board according to claim 15, wherein the high density interconnecting board has at least one pad covering the through hole. The method of manufacturing a circuit board according to claim 15, wherein the high-density interconnector board has an inner wiring layer, and the first conductive pillar is connected to the inner wiring layer. EI 30