201202891 六、發明說明： 【發明所屬之技術領域】 [0001]本發明係關於一種電腦殼體，尤指一種具有良好散熱性 能之電腦殼體。 【先前技術】201202891 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a computer case, and more particularly to a computer case having good heat dissipation performance. [Prior Art]
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[0002] 由於電子產業之快迷升級，已發展出許多高精密度之電 子元件，該等電子元件隨著電腦技術之發展，其運作之 速度日益增加’其所產生之熱量亦隨之增加。CPU (中央 處理器）等電子元件處理能力不斷升級’為其散熱用之 散熱裝置亦隨之多樣化’一般使用之散熱裝置係由散熱 器與風扇組合而成’散熱器其中一表面與愈子元件接觸 ，另一表面形成複數具有一定間距之散熱片’散熱片之 間形成氣流流道，而風扇設於與該散熱器氣流流道相通 之一側，從而加快其熱對流速度，然往$由於電腦機箱 中零组件幕多，即使有風扇為中央處理器之散熱器散熱 ，没過散熱片之氣流之流量較小，無法有效地將散熱器 ... +:δ 18 |*夕執量帶走° 上之熱更 【發明内容】 MS:，有必要提供一種可有效散熱之電腦殼體 [0003] 鑒於以上Μ今 [0004] 一種電腦殼體，包括一底板與一設定於該底板之一邊緣 處之後板，一炙機板固定於該底板上’該主機板上設有 _發熱元件，〆散熱器與該發熱元件相接觸，該後板於 與該散熱器相對之位置處設有複數通風孔，一風扇固定 於該散熱器與该後板之間，該風扇之進風面朝向該散熱 099121780 第3頁/共10頁 0992038339-0 201202891 器，該風扇之出風面朝向該通風孔。 [0005] 相較於習知技術，本發明之電腦殼體可有效地將該散熱 器上之熱量排走，為該發熱元件散熱。 【實施方式】 [0006] 請參閱圖1，本發明電腦殼體之一實施例包括一機殼20、 一電腦主機板30、一散熱器40與一風扇50。 [0007] 該機殼20包括一底板21與垂直地設置於該底板21 —邊緣 之一後板22，該主機板30固定於該底板21上，該主機板 30上裝設了一發熱元件（圖未示），於本實施例中該發 熱元件為一中央處理器，於其他實施例中，該發熱元件 亦可為其他元件；該後板22在與該發熱元件相對之位置 處設有複數通風孔223。 [0008] 散熱器40包括一底座41，底座41上固定了複數平行排列 之散熱片43，該等散熱片43均垂直於該後板22，兩兩散 熱片43之間設有間隙以讓氣流流過，複數熱管45固定於 該等散熱器40上，每一熱管45之一端穿入該等散熱片43 ，另一端固定於底座41與散熱片43之間。 [0009] 該風扇50包括一進風面51與一出風面53。 [0010] 請參閱圖1至圖3，首先將該散熱器40固定於該主機板30 上，使散熱器40之底座41之底面與發熱元件接觸，則可 將發熱元件之熱量藉由該散熱器4 0之底座41與熱管4 5傳 導到散熱片43上，此時該散熱器40之散熱片43與後板22 之間之距離與該風扇50之寬度相當，恰可容置該風扇50 放置其中。 099121780 表單編號A010] 第4頁/共10頁 0992038339-0 201202891 [0011]然後將該風扇50放置於後板22與散熱器40之散熱片43之 間，將風扇50之進風面51朝向散熱片43，將風扇50之出 風面53朝向後板22之通風孔223，從而在散熱時，風扇 50轉動，從散熱片43之間的間隙中抽出氣流，該等氣流 將放熱片43上之熱量帶走，且該等氣流直接被該風扇5〇 從後板22之通風孔223中排出，從而有效地為該發熱元件 散熱。 [0012] 於上述電腦殼體中，由於散熱器4〇、風扇50與通風孔223 之間沒有其他零件阻擋，氣流流動之很通暢，從而有效 將該散熱器40上之熱量帶走★ [0013] 纟上所述，本發明係合乎發明專利申請條件，爰依法提 出專利申請。惟，以上所述僅為本發明之較佳實施例， 舉凡熟悉本案技藝之人士其所爰依本案之創作精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 【圖式簡單說明】 [0014] 圖1係本發明電腦殼體之一實施例之立體分解圖。 [0015] 圖2係圖1之電腦殼體之部分組裝圖。 [0016] 圖3係圖1之電腦殼體之立體組裝圖。 【主要元件符號說明】 [〇〇17]機殼：20 [0018] 底板：21 [0019] 後板：22 099121780 表單編號A0101 第5頁/共1〇頁 0992( 201202891 [0020] 通風孔 [0021] 主機板 [0022] 散熱器 [0023] 底座： [0024] 散熱片 [0025] 熱管： [0026] 風扇： [0027] 進風面 [0028] 出風面 ：223 ：30 ：40 41 ：43 45 50 ：51 ：53 099121780 表單編號A0101 第6頁/共10頁 0992038339-0[0002] Due to the rapid upgrade of the electronics industry, many high-precision electronic components have been developed. With the development of computer technology, the speed of operation of these electronic components is increasing, and the amount of heat generated by them has also increased. The processing power of electronic components such as CPU (Central Processing Unit) is constantly being upgraded. 'The heat sink for heat dissipation is also diversified.' The heat sink used in general is a combination of a heat sink and a fan. The other side of the surface is formed with a plurality of fins having a certain interval. The air flow path is formed between the fins, and the fan is disposed on one side of the airflow passage of the radiator to accelerate the heat convection speed. Since there are many components in the computer chassis, even if there is a fan that dissipates heat from the central processor's heat sink, the flow of the airflow that has not passed through the heat sink is small, and the heat sink cannot be effectively... +: δ 18 | Take away the heat on the ° [invention] MS: It is necessary to provide a computer housing that can effectively dissipate heat [0003] In view of the above [0004] a computer housing, including a bottom plate and a set on the bottom plate a rear plate at the edge, a stack of the plate is fixed on the bottom plate. The main plate is provided with a heat generating component, and the heat sink is in contact with the heat generating component, and the rear plate is at a position opposite to the heat sink. There is a plurality of ventilation holes, and a fan is fixed between the heat sink and the rear plate, and the air inlet surface of the fan faces the heat dissipation 099121780, and the wind direction of the fan faces the Vents. Compared with the prior art, the computer case of the present invention can effectively remove heat from the heat sink to dissipate heat from the heat generating component. [0006] Referring to FIG. 1, an embodiment of a computer case of the present invention includes a casing 20, a computer motherboard 30, a heat sink 40 and a fan 50. [0007] The casing 20 includes a bottom plate 21 and a rear plate 22 vertically disposed on the edge of the bottom plate 21. The main plate 30 is fixed on the bottom plate 21, and a heat generating component is mounted on the main plate 30 ( In the embodiment, the heating element is a central processing unit. In other embodiments, the heating element may be other elements. The rear plate 22 is provided at a position opposite to the heating element. Ventilation hole 223. The heat sink 40 includes a base 41 on which a plurality of fins 43 arranged in parallel are fixed. The heat sinks 43 are perpendicular to the rear plate 22, and a gap is provided between the two fins 43 to allow airflow. The plurality of heat pipes 45 are fixed to the heat sinks 40. One end of each heat pipe 45 penetrates the heat sinks 43 and the other end is fixed between the base 41 and the heat sink 43. The fan 50 includes an air inlet surface 51 and an air outlet surface 53. [0010] Referring to FIG. 1 to FIG. 3, firstly, the heat sink 40 is fixed on the motherboard 30, and the bottom surface of the base 41 of the heat sink 40 is in contact with the heat generating component, so that the heat of the heat generating component can be dissipated by the heat dissipation. The base 41 and the heat pipe 45 of the device 40 are conducted to the heat sink 43. At this time, the distance between the heat sink 43 and the rear plate 22 of the heat sink 40 is equivalent to the width of the fan 50, and the fan 50 can be accommodated. Place it there. 099121780 Form No. A010] Page 4 / Total 10 Page 0992038339-0 201202891 [0011] The fan 50 is then placed between the rear plate 22 and the heat sink 43 of the heat sink 40, and the air inlet surface 51 of the fan 50 is directed toward the heat sink. The sheet 43 faces the air outlet surface 53 of the fan 50 toward the venting opening 223 of the rear panel 22, so that when the heat is dissipated, the fan 50 rotates to extract airflow from the gap between the fins 43 which will be on the heat radiating sheet 43. The heat is carried away, and the airflow is directly discharged from the vent hole 223 of the rear plate 22 by the fan 5, thereby effectively dissipating heat from the heat generating component. [0012] In the above computer case, since there is no other component blocking between the heat sink 4, the fan 50 and the ventilation hole 223, the airflow is smooth, so that the heat on the heat sink 40 is effectively taken away [0013] As described above, the present invention is in accordance with the conditions of the invention patent application, and the patent application is filed according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the following patent claims. BRIEF DESCRIPTION OF THE DRAWINGS [0014] FIG. 1 is an exploded perspective view of an embodiment of a computer housing of the present invention. 2 is a partial assembled view of the computer case of FIG. 1. 3 is an assembled, isometric view of the computer housing of FIG. 1. [Main component symbol description] [〇〇17] Enclosure: 20 [0018] Base plate: 21 [0019] Rear plate: 22 099121780 Form number A0101 Page 5/Total 1 page 0992 (201202891 [0020] Ventilation hole [0021] Motherboard [0022] Heatsink [0023] Base: [0024] Heatsink [0025] Heat pipe: [0026] Fan: [0027] Air inlet surface [0028] Wind surface: 223:30:40 41:43 45 50 : 51 : 53 099121780 Form No. A0101 Page 6 / Total 10 Page 0992038339-0