201201670 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於一種電腦殼體，尤指一種具有良好散熱性 能之電腦殼體。 [0002] [先前技術3 由於電子產業之快速升級，已發展出許多高精密度之電 子元件，該等電子元件隨著電腦技術之發展，其運作之 速度曰ϋ增加，其所產生之熱量亦隨之增加。CPU (中央 D ❹ 處理器）等電子元件處理能力不斷升級，為其散熱用之 散熱裝置亦隨之多槔化，_般使用之漱熱襄置係由散熱 器與風扇組合而成，散熱器其中一表面與電子元件接觸 ’另一表面形成複數具有一定間距之散熱片；散熱片之 間形成氣流流道，而風扇設於與該散熱器氣流流道相通 之一侧，從而加快其熱對流速度，然，往往由於電腦機 箱中零組件眾多，即使有風扇為中央處理器之散熱器散 熱’流過散熱片之氣流之流量較小，：無法有效地將散熱 器上之熱量帶走。 ..尹' a·.「 ;:.:Λ . . 1 f -警、1 [0003] 【發明内容】 鑒於以上内容，有必要提供一種可有效散熱之電腦殼體 〇 [0004] 一種電腦殼體，包括一底板與一設定於該底板之一邊緣 處之後板，一主機板固定於該底板上，該主機板上設有 一發熱元件’一散熱器與該發熱元件相接觸，該後板在 與該散熱器相對之位置處設有複數通風孔，一風扇固定 於該散熱器與該後板之間’該風扇之進風面朝向該散熱 099119864 表單编號 A0101 帛 3 頁/共 10 I 0992035120-0 201201670 器，該風扇之出風面朝向該通風孔。 [0005] 相較於習知技術，本發明之電腦殼體可有效地將該散熱 器上之熱量排走，為該發熱元件散熱。 【實施方式】 [0006] 請參閱圖1，本發明電腦殼體之一實施例包括一機殼20、 一電腦主機板30、一散熱器40與一風扇50。 [0007] 該機殼20包括一底板21與垂直地設定於該底板21 —邊緣 之一後板22，該主機板30固定於該底板21上，該主機板 30上裝設了一發熱元件（圖未示），於本實施例中該發 熱元件為一中央處理器，於其他實施例中，該發熱元件 亦可為其他元件；該後板22在與該發熱元件相對之位置 處設有複數通風孔223。 [0008] 散熱器40包括一底座41，底座41上固定了複數平行排列 之散熱片43，該等散熱片43均垂直於該後板22，兩兩散 熱片43之間設有間隙以讓氣流流過，複數熱管45固定在 該散熱器40上，每一熱管45之一端穿入該等散熱片43， 另一端固定於底座41與散熱片43之間。 [0009] 該風扇50包括一進風面51與一出風面53。 [0010] 請參閱圖1至圖3，首先將該散熱器40固定於該主機板30 上，使散熱器40之底座41之底面與發熱元件接觸，則發 熱元件之熱量藉由該散熱器40之底座41與熱管45傳導到 散熱片43上，此時該散熱器40之散熱片43與後板22之間 之距離與該風扇50之寬度相當，恰可容置該風扇50放置 其中。 099119864 表單編號A0101 第4頁/共10頁 0992035120-0 201201670 [0011] [0012] Ο [0013] [0014] Ο [0015] [0016] [0017] [0018] [0019] [0020] 然後將該風扇50放置於後板22與散熱器40之散熱片43之 間’將風扇50之進風面51朝向散熱片43，將風扇50之出 風面53朝向後板22之通風孔223，從而在散熱時，風扇 5 〇轉動’從散熱片4 3之間之間隙中抽出氣流，氣流將散 熱片43上之熱量帶走，且氣流直接被該風扇5〇從後板22 之通風孔223中排出’從而有效地為該發熱元件散熱。 於上述電腦殼體中，由於散熱器4〇、風扇50與通風孔223 之間沒有其他零組件阻擋，氣流流動通暢，從而有效地 將該散熱器40上之熱量帶走。 综上所述，本發明係合乎發明專利申請條件，爰依法提 出專利申請。惟，以上所述僅為本發明之較佳實施例， 舉凡熟悉本案技藝之人士其所爰依本案之〖創作精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 【圖式簡單說明】 圖1係本發明電腦殼趙々一實施例之立體分解圖。 圖2係圖1之電腦鉸體之部分組裝圖。 圖3係圖1之電腦殼體之立體組裝圖。 【主要元件符號說明】 機殼：20 底板：21 後板：22 通風孔：223 099119864 表單編號Α0101 第5頁/共1〇頁 0992035120-0 201201670 [0021] 主機板：30 [0022] 散熱器：40 [0023] 底座：41 [0024] 散熱片：43 [0025] 熱管：4 5 [0026] 風扇·· 50 [0027] 進風面：51 [0028] 出風面：53 0992035120-0 099119864 表單編號A0101 第6頁/共10頁201201670 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a computer case, and more particularly to a computer case having good heat dissipation performance. [0002] [Prior Art 3 Due to the rapid upgrade of the electronics industry, many high-precision electronic components have been developed. With the development of computer technology, the speed of its operation has increased, and the heat generated by it has also increased. It will increase. The processing power of electronic components such as the CPU (central D ❹ processor) is constantly being upgraded, and the heat sink for heat dissipation is also becoming more and more entangled. The 襄-used heat sink is composed of a heat sink and a fan. One of the surfaces is in contact with the electronic component. The other surface forms a plurality of heat sinks having a certain interval; an air flow path is formed between the heat sinks, and the fan is disposed on one side of the airflow passage of the heat sink to accelerate the heat convection. Speed, of course, often due to the numerous components in the computer chassis, even if the fan is the heat sink of the central processor, the flow of air flowing through the heat sink is small: the heat on the heat sink cannot be effectively removed. ..Yin ' a·. " ;:.:Λ . . 1 f - police, 1 [0003] [Invention] In view of the above, it is necessary to provide a computer housing that can effectively dissipate heat [0004] The body includes a bottom plate and a rear plate disposed at an edge of the bottom plate, and a main plate is fixed on the bottom plate. The main plate is provided with a heating element, a heat sink is in contact with the heating element, and the rear plate is in contact with A plurality of ventilation holes are disposed at a position opposite to the heat sink, and a fan is fixed between the heat sink and the rear plate. The air inlet surface of the fan faces the heat dissipation. 099119864 Form No. A0101 帛3 Page/Total 10 I 0992035120 -0 201201670, the air outlet surface of the fan faces the vent hole. [0005] Compared with the prior art, the computer case of the present invention can effectively remove heat from the heat sink to dissipate heat for the heat generating component. [0006] Referring to FIG. 1, an embodiment of a computer case of the present invention includes a casing 20, a computer motherboard 30, a heat sink 40 and a fan 50. [0007] The casing 20 Include a bottom plate 21 and vertically disposed on the edge of the bottom plate 21 a rear panel 22, the motherboard 30 is fixed on the bottom plate 21, and a heating element (not shown) is mounted on the motherboard 30. In the embodiment, the heating component is a central processing unit. In the embodiment, the heating element may also be other components; the rear plate 22 is provided with a plurality of ventilation holes 223 at a position opposite to the heating element. [0008] The heat sink 40 includes a base 41 on which a plurality of bases 41 are fixed. The fins 43 are arranged in parallel, and the fins 43 are perpendicular to the rear plate 22, and a gap is provided between the two fins 43 to allow airflow to flow through, and a plurality of heat pipes 45 are fixed on the heat sink 40, and each heat pipe One end of the 45 is inserted into the heat sink 43 and the other end is fixed between the base 41 and the heat sink 43. [0009] The fan 50 includes an air inlet surface 51 and an air outlet surface 53. [0010] Please refer to FIG. As shown in FIG. 3, first, the heat sink 40 is fixed on the motherboard 30, and the bottom surface of the base 41 of the heat sink 40 is in contact with the heat generating component, and the heat of the heat generating component is conducted by the base 41 and the heat pipe 45 of the heat sink 40. On the heat sink 43, at this time, the heat sink 43 and the rear plate 22 of the heat sink 40 The distance is the same as the width of the fan 50, and the fan 50 can be accommodated therein. 099119864 Form No. A0101 Page 4 / Total 10 Page 0992035120-0 201201670 [0012] [0012] [0014] [0014] [0020] [0020] [0020] Then, the fan 50 is placed between the rear plate 22 and the heat sink 43 of the heat sink 40. The wind inlet surface 51 of the fan 50 is directed toward the heat sink 43. The air outlet surface 53 of the fan 50 faces the ventilation hole 223 of the rear plate 22, so that when the heat is dissipated, the fan 5 turns "to extract airflow from the gap between the fins 4, and the airflow brings the heat on the heat sink 43. The airflow is directly discharged by the fan 5〇 from the vent hole 223 of the rear plate 22 to effectively dissipate heat from the heat generating component. In the above computer casing, since there is no other component blocking between the radiator 4, the fan 50 and the vent hole 223, the airflow flows smoothly, thereby effectively carrying away the heat on the radiator 40. In summary, the present invention is in accordance with the conditions of the invention patent application, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or changes made by those who are familiar with the art of the present invention in accordance with the creative spirit of the present invention should be included in the following patent application. Brief Description of the Drawings Fig. 1 is an exploded perspective view of an embodiment of the computer case of the present invention. Figure 2 is a partial assembly view of the computer hinge of Figure 1. 3 is an assembled, isometric view of the computer housing of FIG. 1. [Main component symbol description] Case: 20 Base plate: 21 Rear plate: 22 Ventilation holes: 223 099119864 Form number Α 0101 Page 5 / Total 1 page 0992035120-0 201201670 [0021] Motherboard: 30 [0022] Radiator: 40 [0023] Base: 41 [0024] Heat sink: 43 [0025] Heat pipe: 4 5 [0026] Fan · · 50 [0027] Air inlet: 51 [0028] Wind surface: 53 0992035120-0 099119864 Form number A0101 Page 6 of 10