TW201202805A - Light emitted diode back light unit - Google Patents

Light emitted diode back light unit Download PDF

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Publication number
TW201202805A
TW201202805A TW100123444A TW100123444A TW201202805A TW 201202805 A TW201202805 A TW 201202805A TW 100123444 A TW100123444 A TW 100123444A TW 100123444 A TW100123444 A TW 100123444A TW 201202805 A TW201202805 A TW 201202805A
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TW
Taiwan
Prior art keywords
light
emitting diode
heat
backlight module
rod
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TW100123444A
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Chinese (zh)
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TWI459090B (en
Inventor
Jae-Chul Jung
Han-Jun Kang
Sung-Ho Lee
Jin-Ho Kim
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Youl Chon Chemical Co Ltd
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Publication of TW201202805A publication Critical patent/TW201202805A/en
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Publication of TWI459090B publication Critical patent/TWI459090B/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085Means for removing heat created by the light source from the package
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073Light emitting diode [LED]
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133615Edge-illuminating devices, i.e. illuminating from the side
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133628Illuminating devices with cooling means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides an LED back light unit (BLU), which is disposed between an LED bar and an extrusion bar, and has a heat dissipation layer containing a heat dissipation coating. The invention also provides a display device including the LED BLU structure. This invention has the following advantage of: reducing the temperature difference between an edge portion of the LED and a center portion of a light guide plate, thereby improving the adverse effect of the panel. Therefore, the problems of poor light leakage and LED BLU components bending or distortion can be solved.

Description

201202805 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種LED背光模組。 【先前技術】201202805 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an LED backlight module. [Prior Art]

液晶顯示器(Liquid Crystal Display,以下簡稱為LCD)由 背光模組(BacklightUnit,以下簡稱為BLU)和液晶面板構成, LCD本身不具備發光的特性,因此需要光源。提供上述光源的結 構稱為BLU。以往BLU部件之一的燈管中發射的光線下產生的發 熱量並不多’而採用發光二極體(Light Emitted Diode : LED)光 源的LCD面板,其發熱嚴重,使得附著有LED的邊緣(edge)部 分的溫度與導光板(Light Guide Plate,以下簡稱為LGP )中央部 分的溫度差很大。由此發生的薄板(Sheet)不良現象,導致出現 漏光不良、BLU部件的彎曲或扭曲等問題。 【發明内容】 本發明是為了解決上述問題而提出的,其目的在於,提供一 種能夠,少附著有LED的邊緣部分溫度與導綠巾央部分溫度差 的具有薄板不良改善效果的LED背光模組。 y為了達到上述目的’本發明提供一種在LED棒與擠壓棒之間 形成包含散熱塗料的散熱層的LEDBLU。 並且’本發明提供一種包含上述LED BLU結構的顯示裝置。 —種在LED棒與務抱冑之㈤形成&含散埶塗料 ^則,由此具杨下優點:齡_有=^ 的溫度與導光板中央部分的溫度差,_呈現薄板不良 或:曲i問S此’能夠解決漏光不良、LED背光模組部件的彎曲 【實施方式】 100123444 1003315910-0 201202805 以下’將對本發明進行詳細說明。 根據本發明的一個實施例,提供一種在LED棒與擠壓棒之間 具備包含散熱塗料的散熱層的LED ( Light Emitted Diode )背光模 組(Back Light Unit :以下簡稱為 BLU )。 其中,散熱層是指以熱的傳導、對流、輻射的原理,幫助釋 放發熱源產生的熱的結構。 根據本發明的一個實施例,優選的是,上述散熱層應以 0.5kgf/25mm以上的粘合力固定LED棒與擠壓棒。當粘合力不足 0.5kgf/25mm時,粘合力較弱,將無法固定LED棒與擠壓棒。 在本發明的一個實施例中,能夠由多個緊固裝置對上述LED 棒與擠壓棒進行固定。 <在本發明的一個實施例中,上述LED棒與擠壓棒之間存在由 於採用緊固裝置而產生的縫隙,散熱層形成於上述縫隙之間,上 述,熱層設在未採用緊固裝置的部位。對於以往的BLU中存在的 Ϊ於不具備散熱層並且由於LED棒與擠壓棒之間採用 緊固裝置而產生的縫隙導致的彎曲、扭曲問題,通過在 成散熱層,能夠減少背光模組的彎曲、扭曲問題: 地發&ίϊΪ㈣励棒生成的熱,傳導至擠壓棒,進而有效 ί«本5,明.的—個實施财,提供在上述機棒㈣-側面具 ίΐΐΐί ίϊί散熱·LED BLU °這鋪況下,led棒與擠 if散熱塗料的散熱層,並且在擠壓棒的另 触料的散觸,由此賴效果進—步得到改盖。 獅、,ΐ敎與播轉之間存在由於採时固裝置而產生的 成於上述縫隙之間,上述散熱層設在未採用緊Ϊ 層,韻衫散熱麵的散熱 祕4=_理是將發_生成_,沿著水準方向發散, 〜由LED棒產生的熱,通過散熱層,並以程度及 4 100123444 1003315910-0 201202805 垂直方向傳導至擠壓棒,再次通過散熱層,以程度及垂直方向傳 導並釋放於空氣中,能夠有效降低發熱部位的溫度。當散熱層是 包含散熱塗料與粘合層的單面或雙面膠帶的情況下,產生的熱將 通過散熱塗料層與粘合層,向程度及垂直方向傳導。A liquid crystal display (hereinafter referred to as LCD) is composed of a backlight module (Backlight Unit, hereinafter abbreviated as BLU) and a liquid crystal panel. The LCD itself does not have the characteristics of light emission, and therefore requires a light source. The structure providing the above light source is called BLU. In the past, the light emitted by the light emitted from the lamp of one of the BLU components is not much, and the LCD panel using a light-emitting diode (LED) light source is severely heated, so that the edge of the LED is attached ( The temperature of the part of the edge is very different from the temperature of the central part of the Light Guide Plate (LGP). The resulting thin sheet (Sheet) causes problems such as poor light leakage and bending or distortion of the BLU member. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the invention is to provide an LED backlight module having a thin plate defect improving effect capable of less adhering to a temperature difference between an edge portion temperature of an LED and a green leaf portion. . In order to achieve the above object, the present invention provides an LED BLU in which a heat dissipation layer containing a heat-dissipating paint is formed between an LED rod and an extruded rod. And the present invention provides a display device comprising the above LED BLU structure. - Kind of in the LED rod and the entanglement of the five (5) formation & containing the sputum coating ^, which has the advantages of Yang: age _ have = ^ temperature and the temperature difference between the central part of the light guide plate, _ presents a thin sheet or: The present invention can solve the problem of poor light leakage and bending of LED backlight module components. [Embodiment] 100123444 1003315910-0 201202805 The present invention will be described in detail below. According to an embodiment of the present invention, an LED (Light Emitted Diode) backlight module (hereinafter referred to as BLU) having a heat dissipation layer containing a heat dissipating paint between the LED rod and the extruded rod is provided. Among them, the heat dissipation layer refers to a structure that helps to release heat generated by a heat source by the principle of heat conduction, convection, and radiation. According to an embodiment of the present invention, it is preferable that the heat dissipating layer should fix the LED rod and the extruded rod with an adhesive force of 0.5 kgf / 25 mm or more. When the adhesion is less than 0.5kgf/25mm, the adhesion is weak and the LED rod and the extruded rod cannot be fixed. In one embodiment of the invention, the LED rod and the extruded rod can be secured by a plurality of fastening devices. < In an embodiment of the present invention, a gap is formed between the LED rod and the extruded rod due to the use of a fastening device, and a heat dissipation layer is formed between the slits. The part of the device. By the problem of bending and twisting which is caused by the gap which is not provided with the heat dissipation layer and the fastening means between the LED rod and the extrusion rod is present in the conventional BLU, the backlight module can be reduced by forming the heat dissipation layer. Bending and twisting problems: Ground heat & ϊΪ 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本In the case of LED BLU °, the LED rod and the heat-dissipating layer of the extruded heat-dissipating paint, and the contact of the other contact material of the extruded rod, the effect is further improved. Between the lion, the cymbal and the sowing, there is a gap between the gaps formed by the time-harvesting device. The heat-dissipating layer is disposed on the heat-dissipating layer of the heat-dissipating surface. _ _ _, diverge along the horizontal direction, ~ the heat generated by the LED rod, through the heat dissipation layer, and to the extent and 4 100123444 1003315910-0 201202805 vertical direction to the extrusion rod, again through the heat dissipation layer, to the extent and vertical The direction is transmitted and released into the air, which can effectively reduce the temperature of the hot part. In the case where the heat dissipating layer is a one-sided or double-sided tape containing a heat-dissipating paint and an adhesive layer, the generated heat is transmitted to the extent and the vertical direction through the heat-dissipating paint layer and the adhesive layer.

在本發明的一個實施例中,對於上述散熱塗料的選擇不進行 限制’例如,能夠使用類似有機矽的橡膠(Rubber)系列、類似 泡棉膠帶(Foam tape)的丙烯酸系列或石墨(Graphite),優選地 使用熱傳導性能優秀的石墨。石墨存在易碎易破損的問題,因此 包含石墨的同時應具備塗料的液性。在物理性質方面,由於具有 塗,的液性,可以採用塗層的方法形成散熱層或製作散熱帶,具 有能夠調整厚度的優點。本發明中將(DYBRID CAB-02,Dajin Kemis)用作散熱塗料》 在本發明的一個實施例中,上述散熱層是通過粘貼包含有粘 合層的散熱帶而形成,上述散熱帶的粘合層直接與上述LED棒成 擠壓棒接觸。 ,、上述散熱帶可以是單面膠帶或雙面膠帶。僅在散熱層的一面 形成粘合層的單面膠帶的情況下,應以多個緊固裝置固定LED 與擠壓棒。 M發明的一個實施例中,上述散熱帶其散熱層與粘合層之 =還匕3金屬基材,上述金屬基材不受限制’但有可能是網 構。 上述金屬基材不受限制,優選地應採用選自由鎳、鐵、鋁、 ^j、嫣、金、銅以及銀組成的种的一種純金屬或兩種以上 散埶實酬巾,上触合層姑含齡性樹脂及 劑形成。上絲合性樹脂不受限制,優 =====、咖祕__系 叶、顧本ίί的Γ個實施例是包含上述LED BLU的顯示裝置。上 述顯不裝置,由於邊緣(edge)部分與中央(讀〇部=溫$ 100123444 1003315910-0 201202805 差有所減少,呈現LED BLU的薄板不良改善效果。 以下,將參照本發明的實施例對本發明 本U的Α開内谷,本發_範圍並不局限於以下所述的實施例。 試驗例1 :散熱效果的測定 ,用=栓固定LED雜擠壓棒之間,未進行散熱處理的情況 (,較例1),LED棒與賴棒之間不進行絲輕,僅在麵棒 外^粘合雖賴帶(SPREADEFSHIELD,制E Graf^司J 的,(比較例2) ’經過1小時後,測定背光模組邊緣部分 與顯不裝置中央部分的溫度,進行散熱程度測試。 附著有LED的鋁底盤LED棒與鋁底盤擠壓棒上形成散熱 層,經過一小時後,測定背光模組邊緣部分與顯示裝置中央部分 的溫度’進行散熱程度測試(實施例丨〜8)。 、 LED棒與擠壓棒之間,以10cm間隔,固定螺栓螺栓之間 粘合以往的散熱帶(SPREADEFSHIELD,美國E Graft公司產品) (實施例1)。LED棒與擠壓棒之間,以i〇cm間隔,固定螺检, 母個螺枝之間對LED棒與擠壓棒塗層散熱塗料(dy^pjd CAB-02 ’ Dajm Kemis),形成散熱層(實施例2 )。LED棒與擠壓 棒之間’以10cm間隔,固定螺栓,每個螺栓之間對LED棒與擠 壓棒粘合單面散熱帶,形成散熱層。上述單面散熱帶,在鎳網器 材的雙面,將散熱塗料以25 μιη的厚度,利用凹印塗層機進行凹印 塗層’在一面的散熱塗料層以20 μιη的厚度進行逗號刀塗層形成粘 合層。上述粘合層使用將丙烯酸樹脂5〇重量%與散熱塗料5〇重量 %混合製造而成的熱傳導性粘合劑進行塗層(實施例3)。LED棒 與擠壓棒之間不使用螺栓,在實施例3的散熱帶中,以粘合層進 行雙面塗層而製造的雙面散熱帶形成散熱層,僅以粘合力固定 LED棒與擠壓棒(實施例4 )。 上述實施例1中,將散熱帶(SPREADEFSHIELD,美國E-Grafl 公司產品)粘合於擠壓棒的另一側面(實施例5)。上述實施例2 100123444 1003315910-0 6 201202805 中,將散熱塗料塗層於擠壓棒的另一側面(實施例6)。上述實施 例3中,將單面散熱塗料塗層於擠壓棒的另一側面(實施例7)。 上述實施例4中,將單面散熱帶粘合於擠壓棒的另一側面(實施 例8)。 下表1為上述BLU邊緣部分與顯示裝置中央部分的溫度測定 結果。In one embodiment of the present invention, the selection of the above heat-dissipating paint is not limited. For example, a rubber-like series similar to an organic ruthenium, an acrylic series like Foam tape, or graphite (Graphite) can be used. Graphite excellent in thermal conductivity is preferably used. Graphite has the problem of being fragile and easily broken, so it should contain the liquidity of the coating while containing graphite. In terms of physical properties, due to the liquidity of the coating, a heat dissipation layer or a heat dissipation tape can be formed by a coating method, and the thickness can be adjusted. In the present invention, (DYBRID CAB-02, Dajin Kemis) is used as a heat-dissipating paint. In one embodiment of the present invention, the heat-dissipating layer is formed by sticking a heat-dissipating tape including an adhesive layer, and the heat-dissipating tape is bonded. The layer is in direct contact with the above-mentioned LED rods in an extruded rod. The heat dissipation belt may be a single-sided tape or a double-sided tape. In the case of a single-sided tape in which an adhesive layer is formed on one side of the heat dissipation layer, the LED and the extruded rod should be fixed by a plurality of fastening means. In one embodiment of the invention of the invention, the heat dissipating strip has a heat dissipating layer and an adhesive layer = a metal substrate, and the metal substrate is not limited 'but may be a mesh. The above metal substrate is not limited, and preferably a pure metal or two or more kinds of loosely-charged towels selected from the group consisting of nickel, iron, aluminum, ^j, yttrium, gold, copper, and silver should be used. Layered age-old resin and agent are formed. The above-mentioned filament-forming resin is not limited, and an embodiment of the above-mentioned LED BLU is an embodiment of the above-mentioned LED BLU. In the above-mentioned display device, since the difference between the edge portion and the center portion (reading portion = temperature $100123444 1003315910-0 201202805 is reduced, the thin plate defect improving effect of the LED BLU is exhibited. Hereinafter, the present invention will be described with reference to the embodiments of the present invention. The present invention is not limited to the embodiments described below. Test Example 1: Measurement of heat dissipation effect, fixing of LED hybrid extruded rods with = bolts, without heat treatment (Comparative to Example 1), the LED rod and the rod are not lightly colored, and only the outer surface of the rod is bonded (SPREADEFSHIELD, manufactured by E Graf^J, (Comparative Example 2)' after 1 hour After that, the temperature of the edge portion of the backlight module and the central portion of the display device are measured to perform the heat dissipation test. The aluminum chassis with the LED attached to the LED rod and the aluminum chassis extrusion rod form a heat dissipation layer, and after one hour, the backlight module is measured. The temperature of the edge portion and the central portion of the display device is tested for heat dissipation (Example 丨8). Between the LED rod and the extruded rod, the conventional heat sink (SPREADEFSHIELD, is bonded between the bolts and bolts at intervals of 10 cm. United States E Graft product) (Example 1). Between the LED rod and the extruded rod, at a distance of i〇cm, the screw is fixed, and the LED rod and the extruded rod are coated with heat-dissipating paint between the mothers (dy^) Pjd CAB-02 'Dajm Kemis), forming a heat dissipation layer (Example 2). The LED rod and the extruded rod are fixed at 10 cm intervals, and the bolts are bonded to each other between the bolts and the extruded rod. The heat dissipating belt forms a heat dissipating layer. The above-mentioned single-sided heat dissipating belt, on both sides of the nickel mesh equipment, heats the coating at a thickness of 25 μm, and uses a gravure coating machine to perform gravure coating on the one side of the heat dissipating paint layer to 20 The thickness of μιη is coated with a comma knife to form an adhesive layer. The above adhesive layer is coated with a thermally conductive adhesive prepared by mixing 5 wt% of acrylic resin and 5 wt% of heat-dissipating paint (Example 3). In the heat dissipation tape of Embodiment 3, the double-sided heat dissipation tape manufactured by double-sided coating with an adhesive layer forms a heat dissipation layer, and the LED rod is fixed only by adhesion. And the extruded rod (Example 4). In the above embodiment 1, the heat dissipation belt (SPREADEFSHIELD, US E-Grafl product) bonded to the other side of the extruded rod (Example 5). In the above embodiment 2 100123444 1003315910-0 6 201202805, the heat-dissipating coating is applied to the other side of the extruded rod (implementation Example 6) In the above Example 3, a one-side heat-dissipating paint was applied to the other side of the extruded rod (Example 7). In the above Example 4, the single-sided heat-dissipating tape was bonded to the extruded rod. One side (Example 8). Table 1 below shows the results of temperature measurement of the edge portion of the above BLU and the central portion of the display device.

表1 溫度 BLU邊緣 部分(上側) 溫度 BLU邊緣 部分(下 側)溫度 BLU邊 緣部分 (左側)溫 度 BLU邊緣 部分(右 側)溫度 LGP中央 部分溫度 比較例1 43.3 41.4 45.0 43.1 29.3 比較例2 40.1 39.9 41.5 40.7 27.9 實施例1 42.1 40.2 43.3 41.9 29.0 實施例2 40.5 39.9 40.3 39.9 27.7 實施例3 39.9 38.8 39.7 39.3 27.5 實施例4 40.2 39.7 40.6 39.8 27.5 實施例5 38.6 37.7 39.0 39.6 27.4 實施例6 36.1 35.5 36.7 35.2 25.0 實施例7 35.4 34.0 35.1 34.5 24.9 實施例8 38.0 35.9 38.9 37.0 26.0 試驗例2 :薄板不良改善程度 表2為比較例1〜2及實施例的薄板改善效果。 100123444 1003315910-0 201202805 表2 薄板不良改善程度 比較例1 X 比較例2 Δ 實施例1 △ 實施例2 〇 實施例3 〇 實施例4 Δ 實施例5 〇 實施例6 ◎ 實施例7 ◎ 實施例8 〇 X :薄板不良發生50%以上 △:薄板不良發生30%以上 〇:薄板不良發生15%以上 ◎:薄板不良發生15%以下 以上對本發明的特定部分進行了詳細說明,但應當指出,對 於本發明所屬技術領域的普通技術人員來說,上述說明僅為本發 明的優選實施例,本發明的範圍不局限於所述實施例。因此,本 發明要示保護的範圍由權利要求書及其等同替換來決定。 【圖式簡單說明】 圖1為表示在LED棒與擠壓棒之間具備散熱層的LED BLU 側面的一部分的概略圖。 圖2及圖3為表不LED棒與擠壓棒之間具備緊固裝置及散熱 100123444 1003315910-0 8 201202805 層的LEDBLU側面的一部分的概略圖。 圖4及圖5為在LED棒與擠壓棒之間具備散熱層,並在擠壓 棒的另一侧面具備散熱層的LED BLU側面的一部分的概略圖。 【主要元件符號說明】Table 1 Temperature BLU edge portion (upper side) Temperature BLU edge portion (lower side) Temperature BLU edge portion (left side) Temperature BLU edge portion (right side) Temperature LGP central portion temperature comparison Example 1 43.3 41.4 45.0 43.1 29.3 Comparative Example 2 40.1 39.9 41.5 40.7 27.9 Example 1 42.1 40.2 43.3 41.9 29.0 Example 2 40.5 39.9 40.3 39.9 27.7 Example 3 39.9 38.8 39.7 39.3 27.5 Example 4 40.2 39.7 40.6 39.8 27.5 Example 5 38.6 37.7 39.0 39.6 27.4 Example 6 36.1 35.5 36.7 35.2 25.0 Example 7 35.4 34.0 35.1 34.5 24.9 Example 8 38.0 35.9 38.9 37.0 26.0 Test Example 2: Improvement degree of sheet defects Table 2 shows the improvement effects of the sheets of Comparative Examples 1 to 2 and Examples. 100123444 1003315910-0 201202805 Table 2 Thin plate defect improvement degree Comparative Example 1 X Comparative Example 2 Δ Example 1 △ Example 2 〇 Example 3 〇 Example 4 Δ Example 5 〇 Example 6 ◎ Example 7 ◎ Example 8 〇X: 50% or more of sheet failure occurs △: 30% or more of sheet defects occur: 15% or more of sheet defects occur ◎: 15% or less of sheet defects occur in detail. Specific portions of the present invention have been described in detail, but it should be noted that The above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the embodiments. Therefore, the scope of the invention is to be determined by the claims and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a part of a side surface of an LED BLU having a heat dissipation layer between an LED rod and a squeeze bar. Fig. 2 and Fig. 3 are schematic diagrams showing a part of the side of the LEDBLU with the fastening device and the heat dissipation 100123444 1003315910-0 8 201202805 layer between the LED rod and the extruded rod. Fig. 4 and Fig. 5 are schematic views showing a part of the side surface of the LED BLU having a heat dissipation layer between the LED rod and the extrusion bar and having a heat dissipation layer on the other side surface of the extrusion bar. [Main component symbol description]

10 LED 20 LED棒 30 40 50 Ο 60 擠壓棒 散熱層 緊固裝置 散熱層 〇 100123444 9 100123444 1003315910-010 LED 20 LED rod 30 40 50 Ο 60 extruded rod heat sink fastening device heat sink 〇 100123444 9 100123444 1003315910-0

Claims (1)

201202805 七、申請專利範圍: 1· 一種發光二極體背光模組,其特徵在於, 壓棒之間具備包含散熱塗料的散熱層。n極體棒與掷 2. 如申請專利細第1項所述的發光二姆背光顯, 於’所述散熱層以0_5 kgf/25mm以上的枯合力對發光二極^ 及擠壓棒進行固定。 從H棒 3. 如申請專利範圍第1項所述的發光二極體背光模組, 於’由多個緊固裝置對所述發光二極體棒及讎棒進行固定在 4.如申請專利範圍第3項所蘭發光二極體背絲組,其特 於,所述發光二極體棒與擠壓棒之間存在由於採用緊固骏 產生的缝隙,散熱層形成於所述縫隙之間,所述散埶層 採用緊固裝置的部位。 ° 禾 5. 如申請專利範圍第1項所述的發光二極體背光模組,其特徵在 於,所述擠壓棒的另一側面具備包含散熱塗料的散熱層。" 6. 如申請專利範圍第1至5中任一項所述的發光二極體背光楔 組,其特徵在於,所述散熱塗料包含石墨。 、 7. 如申請專利範圍第1至5中任一項所述的發光二極體背光模 組,其特徵在於,所述散熱層是通過粘貼包含有粘合層的散熱 帶而形成的,所述散熱帶的粘合層直接與所述發光二極體棒^ 擠壓棒接觸。 "" 8. 如申請專利範圍第7項所述的發光二極體背光模組,其特徵在 於’所述散熱帶在散熱層與粘合層之間還包含金屬基材。 9. 如申請專利範圍第8項所述的發光二極體背光模組,其特徵在 於,所述金屬基材呈網狀結構。 10. 如申請專利範圍第8項所述的發光二極體背光模組,其特徵在 於’所述金屬基材是選自由鎳、鐵、鋁、錫、鋅、鎢、金、鋼 100123444 l〇〇33lS9l〇 10 201202805 以及銀組成的群中的一種純金屬或兩種以上的合金。 11.如申請專利範圍第7項所述的發光二極體背光模組,其特徵在 於’所述枯合層由包含粘合性樹脂及散熱塗料的熱傳導性粘合 劑形成。 12.如申請專利範圍第u項所述的發光二極體背光模組,其特徵 在於,所述粘合性樹脂是選自由丙烯酸系粘合劑、聚氨酯系粘 合劑及有機矽系粘合劑組成的群中的一種以上。201202805 VII. Patent application scope: 1. A light-emitting diode backlight module, characterized in that a heat dissipation layer containing a heat-dissipating paint is arranged between the pressure bars. N-pole bar and throw 2. As shown in the patent application item 1, the illuminating ohm backlight is used to fix the light-emitting diode and the extruded rod with the dry force of 0_5 kgf/25 mm or more. . The light-emitting diode backlight module according to claim 1, wherein the light-emitting diode rod and the rod are fixed by a plurality of fastening devices. The third embodiment of the blue light-emitting diode back wire group is characterized in that: between the light-emitting diode rod and the extruded rod, there is a gap formed by fastening, and a heat dissipation layer is formed between the gaps. The divergent layer is a portion of the fastening device. The light-emitting diode backlight module according to claim 1, wherein the other side of the extruded rod is provided with a heat dissipation layer containing a heat-dissipating paint. 6. The light-emitting diode backlight wedge according to any one of claims 1 to 5, wherein the heat-dissipating paint comprises graphite. 7. The light-emitting diode backlight module according to any one of claims 1 to 5, wherein the heat dissipation layer is formed by pasting a heat dissipation tape including an adhesive layer. The adhesive layer of the heat dissipation tape is directly in contact with the light emitting diode rod. 8. The illuminating diode backlight module of claim 7, wherein the heat dissipating tape further comprises a metal substrate between the heat dissipating layer and the adhesive layer. 9. The light-emitting diode backlight module of claim 8, wherein the metal substrate has a mesh structure. 10. The light-emitting diode backlight module of claim 8, wherein the metal substrate is selected from the group consisting of nickel, iron, aluminum, tin, zinc, tungsten, gold, and steel 100123444. 〇33lS9l〇10 201202805 and a pure metal or a mixture of two or more of the group consisting of silver. 11. The light-emitting diode backlight module of claim 7, wherein the dry layer is formed of a thermally conductive adhesive comprising an adhesive resin and a heat-dissipating paint. 12. The light-emitting diode backlight module according to claim 5, wherein the adhesive resin is selected from the group consisting of an acrylic adhesive, a polyurethane adhesive, and an organic silicone adhesive. One or more of the group consisting of agents. 13 一置’其特徵在於’包含申請專利範圍第1至5中任 一項的發光二極體背光模組結構。 項所述的顯示裝置,其特徵在於,由於 100123444 11 1003315910-0A device is characterized in that it comprises a light-emitting diode backlight module structure according to any one of claims 1 to 5. The display device according to the item, characterized in that, since 100123444 11 1003315910-0
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JP2008060204A (en) * 2006-08-30 2008-03-13 Nec Lcd Technologies Ltd Led back light unit and liquid display device using the same
US20100014315A1 (en) * 2007-02-26 2010-01-21 Rohm Co., Ltd Linear light source apparatus and image reading apparatus provided with the same
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