TWM410894U - Integration-type backlight module with excellent heat uniformization and dissipation effect - Google Patents
Integration-type backlight module with excellent heat uniformization and dissipation effect Download PDFInfo
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- TWM410894U TWM410894U TW100202407U TW100202407U TWM410894U TW M410894 U TWM410894 U TW M410894U TW 100202407 U TW100202407 U TW 100202407U TW 100202407 U TW100202407 U TW 100202407U TW M410894 U TWM410894 U TW M410894U
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M410894 五、新型說明： 【新型所屬之技術領域】 - 本創作係關於一種背光模組，尤指具有一熱傳導介質 : 與一導熱帶的一種具有良好的均熱與散熱效果之整合式背 • 光模組。 【先前技術】 液晶顯示器為目前被廣為使用之顯示器產品，液晶顯 示器係藉由液晶面板之液晶層以控制各圖元也置之光線透 射率’使得液晶顯示器能夠正確地顯示影像。目前，液晶 顯示器已被大量地應用於電視、手機（ph〇ne )、智 慧型手機（smart phone )、筆記型電腦、與個人數位助理 (personal digital assistant, PDA)之中 〇 然而’由於液晶面板係屬於非自發光之顯示材質，因 此’液晶顯示器需要配置一個背光模組以提供其光源。請 • 參閱第一圖，係一種習用的LED背光模組與液晶顯示器之 一主框架之組合示意圖。如第一圖所示，通常，液晶顯示 器内至少裝設有二背光模組12,，該二背光模組12,係相對 地設置於液晶顯示器之一主框架11，之上下邊框或左右邊 框（如第一圖所示’該二背光模組12’係相對地設置於主框 架1 Γ之上下邊框）。其中’每一個背光模組12，係至少包 括：一罩體121’、一電路板122,與複數個LED元件123,。 眾所周知，當該複數個LED元件123,發光時，該背光 3 M410894 模組12’會產生一熱堆積現象，該熱堆積現象將促使安裝於 主框架11’内的導光板或光學膜片產生形變；嚴重者，熱堆 積現象將導致導光板或光學膜片之損壞，而使得液晶顯示 器無法正常地顯示影像。 請繼續參閱第二圖，係習用的LED背光模組與液晶顯 不器之主框架之第二組合示意圖。有鑒於熱堆積現象導致 導光板或光學膜片之損壞，如第二圖所示，部分液晶顯示 器廠商，係僅於該主框架丨丨’之一邊框裝設該背光模組 12’’以減緩LED元件123,發光時於背光模組12，内所造成 的熱堆積現象。然而，這樣的作法卻反而在導光板或光學 膜片的兩側端之間，造成一個極大的溫差現象；這樣的溫 差現象係導致導光板或光學膜片的兩側端的形變程度不同 ，而影響了液晶顯示器外觀之平衡性與美觀。 有鑒於該存在於液晶顯示器内的熱堆積現象無法有效 地被改善，因此，許多的研究文獻與專利說明書係提出了 改善背光模組的熱堆積現象之方法；但是，該些研究文獻 與專利說明書所提出的熱堆積解決方法，皆係藉由改變該 罩體12Γ或該電路板122’外形或材質之方式以達到散熱之 效果。然而，該些熱堆積解決方法係僅止於背光模組 獨立使用時有效，一旦背光模組12，被安裝於該主框架 之内時，該複數 LED元件123,所i生的熱，將被排除於 背光模組12,之外而存在於背光模組12，與主框架u，之 4 M410894 間’係為第二層的熱堆積現象。由於罩體121，與主框架u， 之一底表面之間，並非完整地貼合；因此，可想而知革 121與主框帛11，之底表面間，係仍具有空隙，而空隙 之中的空軋將成為罩體121’與主框架u’之間的熱傳導熱 阻’使得存在於主框架u，與背光模組12，之間的第二層熱 堆積現象無法有效地透過主框架u，而被散去。 。因此，綜合上述對於習用之LED背光模組與液晶顯示 器之主框架之組合的說明，可以得知習用之LED背光模組 與液晶顯示器之主框架之組合具有係仍具有許多缺點與不 足’有鑑於此，本案之創作人係極力加以研究創作，而終 於研發完成本創作之__種具有良好均熱與散熱效果之整合 式背光模組，用以同時解決習用之LED背光模組與液晶顯 不器之主框架之組合’其具有之熱堆積現象與無法均溫之 問題。 【新型内容】 本創作之主要目的，在於提供一種具有良好的均熱與 散熱效果之整合式背光模組，係將一熱傳導介質與至少— 光源組整合於一主框架内，以藉由該熱傳導介質將該光源 組所產生的熱傳導至該主框架，並經由主框架以熱對流 方式將熱散去，以達到高效能之散熱效果。 因此，為了達成本創作之第一目的，本案之創作人提 出一種具有良好的均熱與散熱效果之整合式背光模組，係 5 M410894 包括： 一主框架，係具有至少一邊框，並具有良好的散熱特 . 性； 至少一光源組’係設置於該主框架之該至少一邊框的 -一内表面上，以提供一背光源至主框架内的一導光板，該 光源組係包括：一反射片，係彎折成一罩體，且該罩體之 一罩體底部具有複數個孔洞；一銅箔電路層，係貼附於該 •罩體底部外侧；以及複數個LED it件，係設置於該銅箱電 路層之上，且該複數個LED元件之一光發射面係分別穿過 該複數個孔洞而進入反射片所形成的罩體内部； 一熱傳導介質，係以其一第二表面而完全地貼附於該 邊框之該内表面，其中，該銅箔電路層係藉由一絕緣導熱 膠而貼附於該熱傳導介質之一第一表面，如此，當該複數 個LED凡件發光時，其所產生的熱可經由銅落電路層與該 ^ 絕緣導熱膠而被傳導至該熱傳導介質，再透過熱傳導介質 傳導至主框架；以及 -焊料’係以焊接之方式而形成於該熱傳導介質之該 第二表面與邊框的内表面之間，用以將熱傳導介質穩固地 結合於邊框之内表面上。 本創作之第一目的，在於提供一種具有良好的均熱與 散熱效果之整合式背光模組，係藉由將複數個導熱帶鋪設 於主框架之；£板上，以於一光源組將熱傳導至該主框 6 M410894 以達到高效 架時’將熱均勾地分佈於主框架之該底板上 能之均熱效果。 並且，為了達成本創作之第二目的，本案之創作人提 出一種具有良好的均熱與散熱效果之整合式背光模組，係 包括： 一主框架，係具有至少-邊框，並具有良好的散熱特 性； 至 > —光源組，係設置於該主框架之該至少一邊框的 内表面上，以提供一背光源至主框架内的一導光板，該 光原、’且係包括·一反射片，係彎折成一罩體，且該罩體之 罩體底部具有複數個孔洞；一銅箔電路層係貼附於該 罩體底部外侧；以及複數個LED元件，係設置於該銅箔電 路層之上，且該複數個LED元件之一光發射面係分別穿過 該複數個孔洞而進入反射片所形成的罩體内部； 一熱傳導介質，係以其一第二表面而完全地貼附於該 邊框之該内表面’其中，該銅箔電路層係藉由一絕緣導熱 朦而貼附於該熱傳導介質之一第一表面，如此，當該複數 個LED元件發光時，其所產生的熱可經由銅箔電路層與該 絕緣導熱膠而被傳導至該熱傳導介質，再透過熱傳導介質 傳導至主框架；以及 複數條導熱帶，係相對於該複數個LED元件而設置於 主框架之一底板表面，並且，設置於由該反射片所臀折而 7 M410894 成的該罩體，其該罩體底部係貼附於該複數條導熱帶之上。 本創作之第三目的，在於提供一種具有良好的均熱與 …、效果之整。式#光模組，係將—熱傳導介質與至少一 光源組整合於一主框架内，並且， 方式，於該光源組形成一反射層， 射片沖壓成型之步驟。 利用塗佈或噴塗之製程 以減少習用技術中，反 本案之創作人提出一種M410894 V. New Description: [New Technology Area] - This creation is about a backlight module, especially a heat transfer medium: an integrated back light with a good heat and heat dissipation effect. Module. [Prior Art] A liquid crystal display is a display product which is widely used at present, and a liquid crystal display uses a liquid crystal layer of a liquid crystal panel to control the light transmittance of each element to enable the liquid crystal display to correctly display an image. At present, liquid crystal displays have been widely used in televisions, mobile phones, smart phones, notebook computers, and personal digital assistants (PDAs). It is a non-self-illuminating display material, so 'the LCD monitor needs to be equipped with a backlight module to provide its light source. Please refer to the first figure, which is a combination of a conventional LED backlight module and a main frame of the liquid crystal display. As shown in the first figure, generally, at least two backlight modules 12 are disposed in the liquid crystal display, and the two backlight modules 12 are oppositely disposed on one of the main frames 11 of the liquid crystal display, and the upper and lower frames or the left and right frames ( As shown in the first figure, the two backlight modules 12 are disposed opposite to the lower frame of the main frame 1 ). Each of the backlight modules 12 includes at least a cover 121', a circuit board 122, and a plurality of LED elements 123. It is known that when the plurality of LED elements 123 emit light, the backlight 3 M410894 module 12' generates a thermal build-up phenomenon, which causes the light guide plate or the optical film mounted in the main frame 11' to be deformed. In severe cases, thermal build-up will cause damage to the light guide or optical film, making the LCD display unable to display images properly. Please continue to refer to the second figure, which is a second combination diagram of the conventional LED backlight module and the main frame of the liquid crystal display. In view of the thermal accumulation phenomenon, the light guide plate or the optical film is damaged. As shown in the second figure, some liquid crystal display manufacturers install the backlight module 12'' only in one frame of the main frame to slow down. The LED element 123 emits heat in the backlight module 12 during light emission. However, such a method causes a great temperature difference between the two ends of the light guide plate or the optical film; such temperature difference causes the degree of deformation of the light guide plate or the optical film to be different at both sides, and the influence The balance and beauty of the appearance of the liquid crystal display. In view of the fact that the thermal accumulation phenomenon existing in the liquid crystal display cannot be effectively improved, many research documents and patent specifications propose methods for improving the thermal accumulation phenomenon of the backlight module; however, the research literature and patent specifications The proposed thermal stacking method achieves the effect of dissipating heat by changing the shape or material of the cover 12 or the circuit board 122'. However, the thermal stacking solutions are effective only when the backlight module is used independently. Once the backlight module 12 is installed in the main frame, the heat generated by the plurality of LED elements 123 will be Except for the backlight module 12, it exists in the backlight module 12, and the main frame u, 4 M410894' is a thermal accumulation phenomenon of the second layer. Since the cover 121 is not completely attached to the bottom surface of the main frame u, it is conceivable that there is still a gap between the bottom surface of the leather 121 and the main frame 帛11, and the gap is The air rolling in the middle will become the heat conduction heat resistance between the cover 121' and the main frame u', so that the second layer of thermal accumulation between the main frame u and the backlight module 12 cannot be effectively transmitted through the main frame. u, and was dispersed. . Therefore, combining the above description of the combination of the conventional LED backlight module and the main frame of the liquid crystal display, it can be known that the combination of the conventional LED backlight module and the main frame of the liquid crystal display still has many disadvantages and disadvantages. Therefore, the creators of this case tried their best to research and create, and finally developed the __ an integrated backlight module with good soaking and heat dissipation effects to simultaneously solve the conventional LED backlight module and LCD display. The combination of the main frame of the device has the problem of heat accumulation and the inability to equalize temperature. [New content] The main purpose of this creation is to provide an integrated backlight module with good soaking and heat dissipation effects, which integrates a heat conducting medium and at least a light source group into a main frame for heat conduction. The medium conducts the heat generated by the light source group to the main frame, and dissipates heat through the main frame in a heat convection manner to achieve a high-efficiency heat dissipation effect. Therefore, in order to achieve the first purpose of this creation, the creator of the case proposed an integrated backlight module with good soaking and heat dissipation effects, and the system 5 M410894 includes: a main frame having at least one frame and having good The at least one light source group is disposed on an inner surface of the at least one frame of the main frame to provide a backlight to a light guide plate in the main frame, the light source set includes: The reflective sheet is bent into a cover body, and a cover body has a plurality of holes at the bottom of the cover body; a copper foil circuit layer is attached to the outer side of the bottom of the cover body; and a plurality of LED it pieces are provided Above the copper box circuit layer, and a light emitting surface of the plurality of LED elements respectively passes through the plurality of holes to enter the inside of the cover formed by the reflective sheet; a heat conducting medium is a second surface thereof And completely attached to the inner surface of the frame, wherein the copper foil circuit layer is attached to the first surface of the heat conductive medium by an insulating thermal conductive adhesive, so that when the plurality of LEDs are illuminated Time The generated heat may be conducted to the heat transfer medium via the copper drop circuit layer and the insulating thermal conductive adhesive, and then transmitted to the main frame through the heat transfer medium; and the solder is formed on the heat transfer medium by soldering. The second surface is disposed between the inner surface of the frame and the inner surface of the frame to firmly bond the heat conductive medium to the inner surface of the frame. The first purpose of the present invention is to provide an integrated backlight module with good soaking and heat dissipation effects, which is to provide heat conduction through a light source group by laying a plurality of guides on the main frame; Up to the main frame 6 M410894 to achieve the soaking effect of the heat distribution on the bottom plate of the main frame. Moreover, in order to achieve the second purpose of the creation, the creator of the present invention proposes an integrated backlight module with good soaking and heat dissipation effects, comprising: a main frame having at least a frame and having good heat dissipation a light source group disposed on an inner surface of the at least one frame of the main frame to provide a backlight to a light guide plate in the main frame, the light source, and the reflection The sheet is bent into a cover, and the cover body has a plurality of holes at the bottom of the cover; a copper foil circuit layer is attached to the outside of the bottom of the cover; and a plurality of LED elements are disposed on the copper circuit Above the layer, and a light emitting surface of the plurality of LED elements respectively passes through the plurality of holes to enter the inside of the cover formed by the reflective sheet; a heat conducting medium is completely attached by a second surface thereof In the inner surface of the frame, wherein the copper foil circuit layer is attached to the first surface of the heat conducting medium by an insulating heat conducting crucible, such that when the plurality of LED elements emit light, Conducted to the heat transfer medium via the copper foil circuit layer and the insulating heat conductive adhesive, and then transmitted to the main frame through the heat conductive medium; and a plurality of conductive layers disposed on one of the bottom plates of the main frame with respect to the plurality of LED elements The surface is disposed on the cover body which is folded by the reflection sheet and is reinforced by 7 M410894, and the bottom of the cover body is attached to the plurality of guide walls. The third purpose of this creation is to provide a good soaking and ... effect. The optical module is a step of integrating a heat conducting medium and at least one light source group into a main frame, and, in the manner, forming a reflecting layer in the light source group, and forming a film by stamping. Using a coating or painting process to reduce the use of conventional techniques, the author of the case proposes a
為了達成本創作之第三目的 具有良好的均熱與散熱效果之整合式背光模組，係包括： 主框架，係具有至少一邊框，並具有良好的散熱特 性； 至少一光源組，係設置於該主框架之該至少一邊框的 —内表面上，以提供一背光源至主框架内的一導光板，該 光源組係包括：—罩體’其一罩體底部係具有複數個孔洞； 反射層係塗佈於該罩體之内表面；一鋼箔電路層，係 貼附於該罩體底部之外側；以及複數個led元件，係設置 於該銅落電路層之上，且該複數個led元件之一光發射面 係分別穿過該複數個孔洞而進入罩體内部； ,、’、傳導介質，係以其一第二表面而完全地貼附於該 邊框之該内表面，其中’銅箔電路層係藉由一絕緣導熱膠 而貼附於該熱傳導介質之一第一表面，如此，當該複數個 LED元件發光時，其所產生的熱可經由銅箔電路層與該絕 緣導熱谬而被傳導至熱傳導介質，再透過熱傳導介質傳導 M410894 至主框架；以及 一焊料，係以焊接 冲按&方式而形成於熱傳導介質之該第 二表面與邊框的内表面之 衣面之間，用以將熱傳導介質穩固地結 合於邊框之内表面上。 本創作之第四目的’在於提供一種具有良好的均熱與 散’、’、效果之整。式背光模組’係將複數個熱傳導介質與至 少一光源組整合於一主柩恕如 王也架内，並且，透過於該主框架上 製作複數個孔洞，使得兮选把y Α 4 # 付μ複數個熱傳導介質可延伸至主框 架外側，以透過與外部空氣 .^ L ^ 工乳之熱對流’有效地將該光源組 所產生的熱散去。 因此為了達成本創作之第四目地，本案之創作人提 出-種具有良好的均熱與散熱效果之整合式背光模組，係 包括： -主框架’係具有至少-邊框與-底板，Λ中，該底 板具有複數個第一孔洞； 至少一光源組，係以貼附該邊框之方式被設置於該底 板之上’該光源組係用以提供一背光源至主框架内的一導 光板，該光源組係包括： 一罩體，係具有一罩體底部，該罩體底部具有複數個 第二孔 >同，一反射層，係形成於該罩體内部；一銅箔電路 層，係藉由一絕緣膠而設置於該罩體底部，並具有相對於 該複數個第一孔洞與該複數個第二孔洞的複數個第三孔 9 M410894 洞；以及 複數個LED元件，係設置於該銅箔電路層之上；以及 複數個熱傳導介質，係以穿過該複數個第一孔洞、該複數 個第二孔洞與該複數個第三孔洞之方式，由底板外部進入 罩體内部，並藉由一散熱介質而接觸該複數個lEd元件； 其中，當該複數個LED元件發光時，該熱傳導介質會 藉由高效率熱傳導之方式，將LED元件所產生的熱傳導至 邊框，以藉由主框架散熱；並且，藉由熱傳導介質與外部 空氣之熱對流，亦可同步地將LED元件所產生的熱散去。 【實施方式】 為了I夠更清楚地描述本創作所提出之一種具有良好 的均熱與散熱效果之整合式背光模組，以下將配合圖示， 詳盡說明本創作之較佳實施例。 本創作係具有多組實施例’請同時參閱第三圖與第四 圖’係本創作之一種具有良好的均熱與散熱效果之整合式 背光模組之第一實施例的立體圖與側視圖，如第三圖與第 四圖所示’該具有良好的均熱與散熱效果之整合式背光模 組1係包括：一主框架丨丨、一光源組12、一熱傳導介質 14、以及一焊料13’其中’該主框架n可使用具有良好 的散熱特性之材質’例如：鐵、鋁與陶瓷；同時，如第三 圖所示’主框架11之一邊框丨12係用以組裝該光源組12， 且主框架11之一底板上係具有複數個螺孔ml，該複 M410894 數個螺孔1111係於將主框架u組裝入一液晶顯示裝置時 使用。 - 繼續地參閱第三圖與第四圖，該焊料13可為一低溫錫 * •膏或一高溫錫膏，係以焊接之方式形成於該邊框112之 •上；該熱傳導介質14係以其一第二表面142而完全地貼附 於焊料13，且，該光源組12係藉由一絕緣導熱踢123而 貼附於該熱傳導介質14之一第一表面141，用以提供一背 # 光源至主框架11内的一導光板，其中，該絕緣導熱膠123 可全面貼附或局部貼附於該第一表面141。光源組12係包 括·一反射片124，係彎折成一罩體，且該罩體之一罩體 底部1241具有複數個孔洞；一銅箔電路層121，係貼附於 該罩體底部124外側，並且該銅箔電路層121更貼附有該 絕緣導熱膠123 ·，以及複數個LED元件122，係設置於該 銅箔電路層121之上，且該複數個LED元件122之一光發 % 射面1221係分別穿過該複數個孔洞而進入反射片124所形 成的罩體内部。 必須補充說明的是，於上述該具有良好的均熱與散熱 效果之整合式背光模組的第一實施例之中，由該反射片丄24 所折成的該罩體，係可為一门形罩體或一罩體；並且， 該熱傳導介質14可由下列任一種金屬製成：其一表面鍍鎳 的鋁、其一表面鍍銅的鋁以及鋁鎳合金。其中，若熱傳導 介質14為鋁鎳合金，則其表面不須經過任何處理；反之， 11 M410894 ♦ 毳 若熱傳導介質14係由鋁製成，則該熱傳導介質i4之該第 二表面142係必須經過鍍鎳或鍍銅之表面處理，以使得鋁 材質之熱傳導介質14能夠被焊接於該邊框112之上。 如此’經由上述’該具有良好的均熱與散熱效果In order to achieve the third objective of the present invention, an integrated backlight module having good soaking and heat dissipation effects includes: a main frame having at least one frame and having good heat dissipation characteristics; at least one light source group is disposed on An inner surface of the at least one frame of the main frame to provide a backlight to a light guide plate in the main frame, the light source assembly comprising: a cover body having a plurality of holes in a bottom portion of the cover body; a layer is applied to the inner surface of the cover; a steel foil circuit layer is attached to the outer side of the bottom of the cover; and a plurality of LED elements are disposed on the copper circuit layer, and the plurality of One of the light-emitting surfaces of the led element passes through the plurality of holes and enters the inside of the cover; and the conductive medium is completely attached to the inner surface of the frame by a second surface thereof, wherein The copper foil circuit layer is attached to the first surface of the heat conducting medium by an insulating thermal conductive adhesive, so that when the plurality of LED elements emit light, the heat generated by the copper foil circuit layer and the insulating heat conduction through the copper foil circuit layer And Conducted to the heat transfer medium and then conducted through the heat transfer medium M410894 to the main frame; and a solder is formed between the second surface of the heat transfer medium and the inner surface of the frame by soldering & To firmly bond the heat transfer medium to the inner surface of the bezel. The fourth object of the present invention is to provide a good soaking and scattering, and the effect. The backlight module integrates a plurality of heat transfer media and at least one light source group into a main body, such as Wang Ye, and creates a plurality of holes through the main frame, so that the selection is y Α 4 #付The plurality of heat transfer media may extend to the outside of the main frame to effectively dissipate heat generated by the light source group through heat convection with external air. Therefore, in order to achieve the fourth purpose of this creation, the creators of the present case proposed an integrated backlight module with good soaking and heat dissipation effects, including: - the main frame ' has at least - a frame and a bottom plate, The bottom plate has a plurality of first holes; at least one light source group is disposed on the bottom plate in a manner of attaching the frame. The light source group is configured to provide a backlight to a light guide plate in the main frame. The light source assembly includes: a cover having a cover bottom having a plurality of second holes at the bottom; and a reflective layer formed inside the cover; a copper foil circuit layer Provided on the bottom of the cover by an insulating glue, and having a plurality of third holes 9 M410894 holes with respect to the plurality of first holes and the plurality of second holes; and a plurality of LED elements disposed thereon Above the copper foil circuit layer; and a plurality of heat conducting media, passing through the plurality of first holes, the plurality of second holes and the plurality of third holes, entering the inside of the cover from the outside of the bottom plate, and borrowing By a scattered The heat medium contacts the plurality of lEd elements; wherein, when the plurality of LED elements emit light, the heat conducting medium conducts heat generated by the LED elements to the frame by high-efficiency heat conduction to dissipate heat by the main frame; Further, by the heat convection of the heat transfer medium and the outside air, the heat generated by the LED elements can be simultaneously dissipated. [Embodiment] In order to more clearly describe an integrated backlight module with good heat absorption and heat dissipation effects proposed by the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the drawings. The present invention has a plurality of sets of embodiments 'please refer to the third figure and the fourth figure at the same time' as a perspective view and a side view of a first embodiment of the integrated backlight module having good heat absorption and heat dissipation effects. As shown in the third and fourth figures, the integrated backlight module 1 having good heat absorption and heat dissipation effects includes: a main frame, a light source group 12, a heat conduction medium 14, and a solder 13 'Where the main frame n can use a material having good heat dissipation characteristics' such as iron, aluminum and ceramic; and, as shown in the third figure, a frame 丨 12 of the main frame 11 is used to assemble the light source group 12 And one of the main frames 11 has a plurality of screw holes ml, and the plurality of screw holes 1111 are used when the main frame u is assembled into a liquid crystal display device. - Continuing to refer to the third and fourth figures, the solder 13 may be a low temperature tin paste or a high temperature solder paste formed on the bezel 112 by soldering; the heat transfer medium 14 is A second surface 142 is completely attached to the solder 13 , and the light source group 12 is attached to the first surface 141 of the heat conducting medium 14 by an insulating and thermally conductive kick 123 for providing a back light source A light guide plate is disposed in the main frame 11, wherein the insulating thermal conductive adhesive 123 is fully attached or partially attached to the first surface 141. The light source group 12 includes a reflection sheet 124 which is bent into a cover body, and a cover body bottom portion 1241 of the cover body has a plurality of holes; a copper foil circuit layer 121 is attached to the outer side of the cover body bottom portion 124. And the copper foil circuit layer 121 is further attached with the insulating thermal conductive adhesive 123 ·, and a plurality of LED elements 122 are disposed on the copper foil circuit layer 121, and one of the plurality of LED components 122 emits light % The emitting surface 1221 passes through the plurality of holes and enters the inside of the cover formed by the reflective sheet 124. It should be added that, in the first embodiment of the integrated backlight module having good heat absorption and heat dissipation effects, the cover folded by the reflection sheet 24 can be a door. A heat shield medium or a cover; and the heat transfer medium 14 may be made of any one of the following: nickel plated aluminum on one surface, copper plated aluminum on one surface, and aluminum nickel alloy. Wherein, if the heat conducting medium 14 is an aluminum-nickel alloy, the surface thereof does not need to be subjected to any treatment; otherwise, 11 M410894 ♦ If the heat conducting medium 14 is made of aluminum, the second surface 142 of the heat conducting medium i4 must pass through A nickel or copper plated surface treatment is provided to enable the aluminum heat transfer medium 14 to be soldered over the bezel 112. So, through the above, it has good soaking and heat dissipation effects.
«式背光模組1之第一實施例之架構即完整地被揭露。就 該第一實施例之架構而言，當設置於該罩體内之該複數個 LED TG件122發光時，其所產生的熱可藉由熱傳導之方 式，透過該銅羯電路層121與該絕緣導熱膠123被傳導至 該熱傳導介質14;並且，由於熱傳導介f 14係經由焊接 之方式而完全地貼合於該邊框112之内表面，因此，該熱 傳導介質14與邊框112之間不具有空隙；基於這項因素， 當熱傳導介質14進-步地將熱傳導至該主框架u之時， 該熱傳導之過程係不會受到空氣熱阻之阻礙，I該熱傳 導介質14可有效率地將熱傳導至主框架u，並透過主框 架11所具有的良好散熱特性而將熱散去。 並且’為了加速該主框架n之散熱效率，本創作係更 提供該具有良好的均熱與散熱效果之整合式背光模組之一 第二實施例。請參閱第五圖 + 胃係具有良好的均熱與散熱效 果之整合式背光模組之第-眚 第一實施例的側視圖。如第二圖所 示，藉由增加-具有熱輕射特性之材料16於該第_實施例 之中，即完成該具有良好的均熱與散熱效果之整 模組1的第二實施例之架構。該具有㈣㈣性之材料16 12 M410894 可被全面塗佈或局部塗佈於該主框架11之外表面，其中， 具有熱輻射特性之材料16可為白漆與液態鑽石。如此，於 第二實施例之中，當該主框架n開始散熱時，該具有熱輻 射特性之材料16可透過熱幅射與熱對流之方式協助主框 架11將熱散去·。 另外’於該具有良好的均熱與散熱效果的整合式背光 模組的第一實施例之中，當該光源組12透過該熱傳導介質 14將熱傳導至該邊框112之時，雖然傳導至邊框ιΐ2的熱 可、，’呈由熱對流之方式被散去，但是，堆積於邊框丨i 2的熱 依然會於邊框112與該底板lu之間造成一溫度差。基於 這個原因，本創作更提供具有良好的均熱與散熱效果的整 合式身光模組的一第三實施例。請參閱同時參閱第六圖與 第七圖，係本創作之一種具有良好的均熱與散熱效果之整 合式背光模組之第三實施例的立體圖與側視圖。如第六圖 與第七圖所示’藉由增設複數條導熱帶15於該第一實施例 之中’即完成該具有良好的均熱與散熱效果之整合式背光 模組1的第三實施例之架構。其中，該複數條導熱帶i 5之 製造材料可為銅、鋁以及石墨，係設置於主框架u之邊框 H2，同時’該複數條導熱帶Μ亦藉由一導熱膠125而鋪 設於主框架11之底板m，其中，導熱帶15係用以將堆積 於邊框112的熱’均勻地分佈於該底板n丨；此外，必須特 別說明的是，鋪設於該底板U1表面的該複數條導熱帶 13 M410894 15’並不限定全面鋪設’其亦可被局部鋪設於底板I"表 面。 如第六圖與第七圖所示’藉由該複數個導熱帶15，由 該熱傳導介質14傳導至該主框架u的熱’係可同時地被 均勻地分佈於底板111之上，如此，係使得底板U1上的 任意兩個位置間不會具有明顯的溫度差異；如此，係使得 本創作之該整合式背光模組丨同時具有散熱與均熱之特 生’疋以’當該整合式背光模組1應用於液晶顯示器時， 係可解決存在於習用的背光模組與液晶顯示器主框架之間 的熱堆積之問題。 清繼續參閱第八圖’係本創作之一種具有良好的均熱 與散熱效果之整合式背光模組之第三實施例的第二側視 圖其中’為了使得上述該具有良好的均熱與散熱效果之 S。式背光模組之第三實施例能夠具備更佳良好的散熱效 果，相同於第二實施例’於此，亦可增設該具有熱輻射特 性之材料16於第三實施例之中，以藉由該具有熱輻射特性 材料16與外部空氣之間的熱幅射與熱對流，協助該主框 架11散熱。 上述該具有良好的均熱與散熱效果之整合式背光模組 之第一實施例、第二實施例與第三實施例皆係利用熱傳導 介質14來進行熱傳導，然而，實際上，仍具有其它實施方 式可將該光源組12所產生的熱傳導至該邊框112;因此， M410894 本創作更提供具有良好的均熱與散熱效果之整合式背光模 組之一第四實施例，藉由不同的實施方式將光源組12所產 .生的熱傳導至邊框112。請參閱第九圖，係本創作之一種 :具有良好的均熱與散熱效果之整合式背光模組之第四實施 例的側視圖，如第九圖所示，該具有良好的均熱與散熱效 果之整合式背光模組丨的第四實施例係包括：該主框架 11、一導熱結合物質17、該複數條導熱帶15、以及該光源 t 組 12。 其中，該主框架11、該導熱帶15與該光源組12之結 構與組成與第二實施例之所述相同。如第九圖所示，於該 具有良好的均熱與散熱效果之整合式背光模組的第四實施 例之中，該導熱結合物質17係設置於主框架丨丨之該邊框 112上Π時導熱結合物質17亦設置於主框架η之該底 板111上；並且，該複數條導熱帶15係藉由導熱結合物質 ► 17而設置於邊框112之上，同時，該複數條導熱帶15亦 藉由導熱結合物質17而設置於底板lu之表面。另外，藉 由貼附於銅箔電路層121的該絕緣導熱膠123，該光源組 12可貼合於導熱帶15，進以透過導熱結合物質17而被設 置於該邊框112。 於該第四實施例之中，主要係透過該導熱結合物質17 而使得該導熱帶15與該光源組12可被穩固地設置於主框 架11的邊框112上；並且’利用這樣的結合關係，當該複 15 M410894 數個LED元件122發光時，該複數條導熱帶15會藉由高 效率的熱傳導方式，將LED元件122所產生的熱傳導至邊 框Π2 ’如此’即可利用主框架丨丨所具有的散熱特性，將 傳導至邊框112的熱散去。此外，透過導熱結合物質丨了與 導熱帶15，更可進一步地將熱均勻分布於底板m，以避 免主框架111上的任兩處位置之間產生明顯的溫度差。The architecture of the first embodiment of the type backlight module 1 is completely disclosed. In the structure of the first embodiment, when the plurality of LED TG members 122 disposed in the cover emit light, the heat generated by the plurality of LED TG members 122 can be transmitted through the copper circuit layer 121 by heat conduction. The insulating thermally conductive adhesive 123 is conducted to the heat transfer medium 14; and since the thermal conduction layer 14 is completely adhered to the inner surface of the bezel 112 by soldering, there is no between the thermally conductive medium 14 and the bezel 112. Based on this factor, when the heat transfer medium 14 conducts heat to the main frame u in advance, the heat conduction process is not hindered by the air heat resistance, and the heat transfer medium 14 can efficiently conduct heat. The heat is dissipated to the main frame u and through the good heat dissipation characteristics of the main frame 11. And in order to accelerate the heat dissipation efficiency of the main frame n, the present invention further provides the second embodiment of the integrated backlight module having good heat absorption and heat dissipation effects. Please refer to the fifth figure + the first embodiment of the integrated backlight module with good soaking and heat dissipation effect of the stomach system. As shown in the second figure, by adding a material 16 having thermal light-emitting characteristics to the first embodiment, the second embodiment of the whole module 1 having good heat absorption and heat dissipation effects is completed. Architecture. The material having the (four) (four) nature 16 12 M410894 may be fully coated or partially coated on the outer surface of the main frame 11, wherein the material 16 having heat radiation characteristics may be white paint and liquid diamond. Thus, in the second embodiment, when the main frame n starts to dissipate heat, the material 16 having heat radiation characteristics can assist the main frame 11 to dissipate heat by means of heat radiation and heat convection. In addition, in the first embodiment of the integrated backlight module having good heat absorption and heat dissipation effects, when the light source group 12 transmits heat to the frame 112 through the heat conduction medium 14, although it is transmitted to the frame ι2 The heat can be dissipated by heat convection, but the heat accumulated on the frame 丨i 2 will still cause a temperature difference between the frame 112 and the bottom plate lu. For this reason, the present invention further provides a third embodiment of an integrated body light module having good soaking and heat dissipation effects. Please refer to the sixth and seventh figures at the same time, which is a perspective view and a side view of a third embodiment of the integrated backlight module with good heat absorption and heat dissipation effects. As shown in the sixth and seventh figures, the third embodiment of the integrated backlight module 1 having good heat absorption and heat dissipation effects is completed by adding a plurality of plurality of heat guides 15 in the first embodiment. The structure of the example. The manufacturing material of the plurality of conductive guides i 5 may be copper, aluminum and graphite, and is disposed on the frame H2 of the main frame u, and the plurality of conductive turns are also laid on the main frame by a thermal conductive adhesive 125. The bottom plate m of the eleventh, wherein the heat guide 15 is used to uniformly distribute the heat accumulated on the frame 112 to the bottom plate n; in addition, the plurality of guide lines laid on the surface of the bottom plate U1 must be specifically described. 13 M410894 15' is not limited to full-laying' it can also be partially laid on the floor I" surface. As shown in the sixth and seventh figures, 'the heat conduction from the heat transfer medium 14 to the main frame u by the plurality of heat guides 15 can be uniformly distributed on the bottom plate 111 at the same time, thus, Therefore, there is no obvious temperature difference between any two positions on the bottom plate U1; thus, the integrated backlight module of the present invention has both heat dissipation and soaking heat. When the backlight module 1 is applied to a liquid crystal display, the problem of heat accumulation existing between the conventional backlight module and the main frame of the liquid crystal display can be solved. Continuing to refer to the eighth figure, a second side view of a third embodiment of an integrated backlight module having good soaking and heat dissipation effects, wherein 'in order to make the above-mentioned good heat and heat dissipation effect S. The third embodiment of the backlight module can have better heat dissipation effect. Similarly to the second embodiment, the material 16 having heat radiation characteristics can be added to the third embodiment. The heat radiation and heat convection between the heat radiation characteristic material 16 and the outside air assists the main frame 11 to dissipate heat. The first embodiment, the second embodiment and the third embodiment of the integrated backlight module having good uniform heat and heat dissipation effects utilize heat transfer medium 14 for heat conduction. However, in practice, there are still other implementations. The method can transmit the heat generated by the light source group 12 to the frame 112; therefore, the M410894 further provides a fourth embodiment of the integrated backlight module with good soaking and heat dissipation effects, by different embodiments. The heat generated by the light source group 12 is conducted to the bezel 112. Please refer to the ninth figure, which is a side view of a fourth embodiment of the integrated backlight module with good soaking and heat dissipation effects, as shown in the ninth figure, which has good soaking and heat dissipation. The fourth embodiment of the integrated backlight module 包括 includes the main frame 11, a thermally conductive bonding substance 17, the plurality of conductive belts 15, and the light source t group 12. The structure and composition of the main frame 11, the heat guide 15 and the light source group 12 are the same as those described in the second embodiment. As shown in the ninth embodiment, in the fourth embodiment of the integrated backlight module having good heat absorption and heat dissipation effects, the thermally conductive bonding substance 17 is disposed on the frame 112 of the main frame Π The thermal conductive bonding material 17 is also disposed on the bottom plate 111 of the main frame η; and the plurality of conductive tropics 15 are disposed on the frame 112 by the thermally conductive bonding substance ►17, and the plurality of guiding tropics 15 are also borrowed It is provided on the surface of the bottom plate lu by the thermally conductive bonding substance 17. In addition, the light source group 12 can be attached to the heat guide 15 by being attached to the copper foil circuit layer 121, and is disposed on the frame 112 through the heat conductive bonding material 17. In the fourth embodiment, the heat conducting bonding material 17 is mainly disposed such that the heat guiding layer 15 and the light source group 12 can be stably disposed on the frame 112 of the main frame 11; and 'using such a bonding relationship, When the plurality of LED elements 122 are illuminated, the plurality of conductive elements 15 will conduct heat generated by the LED elements 122 to the frame '2 by high-efficiency heat conduction mode, so that the main frame can be utilized. The heat dissipation characteristics have the heat transmitted to the bezel 112 being dissipated. Further, the heat-conducting bonding material is entangled with the heat guiding layer 15, and the heat can be further uniformly distributed to the bottom plate m to avoid a significant temperature difference between any two positions on the main frame 111.
於此，必須另外說明的是，於該具有良好的均熱與散 熱效果之整合式背光模組的第四實施例之中，該導熱結合 物質17可為導熱膠或焊料，並且，設置於該底板"I上的 導熱結合物質17並不限定必須全面鋪設覆蓋底板iu表 面，其亦可以局部覆蓋之方式鋪設於底板lu表面；並且， 由此可知，設置於導熱結合物質17之上的該複數條導熱帶 15,其亦可全面鋪設或局部舖設於底板lu表面。 同樣的，請繼續參閱第十圖，係本創作之一種具有良 好的均#與散熱效果之整合<背光模組之第四實施例的第 二側視圖。其中’ & 了使得上述讓具有良好的均熱與散熱 效果之整合式背光模組之第四實施例能夠具備更佳良好的 散熱效果，於此，亦可增設—具有熱輻射特性之材料㈣ 第四實施例之中’以藉由該具有熱輻射特性之材料Μ與外 部空氣之間的熱幅射與熱對流，協助該主框架1】散熱；其 中，該具有熱輻射特性之材料16可被全面塗佈或局部㈣ 於該主框架11之外表面。 16 M410894 此外，本創作之具有良好的均熱與散熱效果之整合式 背光模組更包括其它實施例；請參閱第十一圖，係本創作 . 之一種具有良好的均熱與散熱效果之整合式背光模組之一 : 第五實施例的側視圖。如第—圖所示，該具有良好的均 '· 熱與散熱效果之整合式背光模組1的第五實施例係包括： 該主框架11、該焊料13、該熱傳導介質14、該複數條導 熱帶15、以及該光源組12，其中，該焊料13係焊接於主 ^ 框架11之該邊框112以及該邊框112之上；該熱傳導介質 1 4則貼附於焊料13之上；該複數條導熱帶15係進一步地 貼附於熱傳導介質14之上；最後’藉由將該絕緣導熱帶 123貼附該銅箔電路121與該導熱帶15,該光源組12則可 被設置於主框架11之邊框112之上。並且，於上述的第五 實施例之中，同樣地，設置於該底板U1的焊料13、熱傳 導介質14與導熱帶15 ’皆可以全面鋪設或局部鋪設之方 φ 式被焊接於底板111上。 效果之整合式背光模組之第五實施例的第二側視圖。如第 十二圖所示，A了使得上述該具有良好的均熱與散熱效果 整合式背光模組之第五實施例㈣具備更佳良好的散熱 之 效果’於此，亦可增設一具有熱輻射特性之材料16於第五 實施例之中’以藉由該具有純射特性之材料16與外部空 氣之間的熱幅射與熱對流，協助該主框架u散熱。 17 M410894 上述已經揭露了本創作之具有良好的均熱與散熱效果 之整合式背光模組的多組實施例，然而，就第三圖至第十Therefore, in the fourth embodiment of the integrated backlight module having good uniform heat and heat dissipation effects, the thermally conductive bonding material 17 may be a thermal conductive adhesive or solder, and is disposed on the The thermally conductive bonding substance 17 on the bottom plate "I is not limited to be completely laid over the surface of the bottom plate iu, and may be partially covered on the surface of the bottom plate lu; and, as can be seen, the thermal insulating bonding substance 17 is disposed on the substrate. A plurality of guide rollers 15 may be fully laid or partially laid on the surface of the bottom plate. Similarly, please continue to refer to the tenth figure, which is a second side view of the fourth embodiment of the backlight module which has a good integration of the uniformity and the heat dissipation effect. The fourth embodiment of the integrated backlight module having the above-mentioned uniform heat and heat dissipation effect can have better heat dissipation effect, and a material having heat radiation characteristics can also be added (4) In the fourth embodiment, the heat dissipation and heat convection between the material having the heat radiation property and the outside air assists the heat dissipation of the main frame 1; wherein the material 16 having heat radiation characteristics can be It is completely coated or partially (four) on the outer surface of the main frame 11. 16 M410894 In addition, the integrated backlight module with good soaking and heat dissipation effect of this creation includes other embodiments; please refer to the eleventh figure, which is a kind of integration with good soaking and heat dissipation effects. One of the backlight modules: a side view of the fifth embodiment. As shown in the first figure, the fifth embodiment of the integrated backlight module 1 having good thermal and heat dissipation effects includes: the main frame 11, the solder 13, the heat transfer medium 14, and the plurality of strips. a conductive layer 15 and the light source group 12, wherein the solder 13 is soldered to the frame 112 of the main frame 11 and the frame 112; the heat conductive medium 14 is attached to the solder 13; The heat guide 15 is further attached to the heat transfer medium 14; finally, by attaching the insulation guide 123 to the copper foil circuit 121 and the heat guide 15, the light source group 12 can be disposed on the main frame 11. Above the border 112. Further, in the fifth embodiment described above, similarly, the solder 13, the heat transfer medium 14, and the heat guide 15' provided on the bottom plate U1 may be entirely or partially laid on the bottom plate 111. A second side view of a fifth embodiment of the integrated backlight module of effect. As shown in FIG. 12, A has achieved the effect of better heat dissipation in the fifth embodiment (4) of the integrated backlight module having good uniform heat and heat dissipation effect. The material 16 of the radiation characteristic assists the heat dissipation of the main frame u by the heat radiation and heat convection between the material 16 having the pure emission characteristics and the outside air in the fifth embodiment. 17 M410894 The above has disclosed various embodiments of the integrated backlight module with good soaking and heat dissipation effects of the present invention, however, from the third to the tenth
二圖所顯示的’使用於該整合式背光模組之中的光源組係 皆屬於直光式光源組（direct-type backlight module )。針對 此部分’必須加以說明的是，本創作之具有良好的均熱與 散熱效果之整合式背光模組並不限定必須使用直光式光源 組以提供背光源；實際上’側光式光源組（edge-type backlight module )亦可被使用於該具有良好的均熱與散熱 效果之整合式背光模組之中，以提供背光源至導光板。 另外，傳統上’係使用一金屬罩體，例如：鋁罩體， 容置該複數個LED元件，因此，為了使得本創作亦可符合 傳統之製法使用金屬罩體之具有良好的均熱與散熱效果 之整合式背光模組，係將於下列說明中被揭露。請參閱第 十三圖’係、本創#之一種具有良好的均熱與散熱效果之整 合式背光模組之一第六實施例的側視圖。如第十三圖所 示’該第六實施例係提供一種具有金屬罩體之整合式背光 模組，其中’具有良好的均熱與散熱效果之整合式背光模 組1之第六實施例係包括：一主框架Ua、一焊料Ih、一 熱傳導介質14a、以及一光源組12a。 如第十三圖所示，該主框架Ua之材質可為鐵、紹或 陶竟，且主框架Ua具有至少一邊框U2a，並同時具有良 好的散熱特性。該焊料13a可為低溫錫f或高溫錫膏，且 18 M410894 焊料13a係藉由焊接之方式而被設置於該邊框u2a之上。 該熱傳導介質14a則以其一第二表面1423而完全地貼附於 焊料13a。 該光源組12a可為一直光式光源組或一側光式光源組 ，光源組12a係藉由一絕緣導熱膠123a而貼附於該熱傳導 介質14a之一第一表面141a，用以提供一背光源至該主框 架11a内的一導光板；其中，該絕緣導熱膠123a可局部貼 附或全面貼附於該第一表面141a ^光源組Ua係包括：一 罩體120a、一反射層124a、一箔電路層121a、以及複數個 L^D元件lKa。罩體i2〇a為具有一罩體底部的一 金屬罩體’其中’該罩體底部1241a具有複數個孔洞。不 同於習知技術之反射片，於第六實施例之中，該反射層124a 係利用塗佈（coating)、塗抹（painting)或喷塗（Spray) 之方式而形成於罩體120a内部’因此，反射層i24a形成 於罩體120a内部時’係不需要事先反射片沖壓成型之製程 步驟。該銅箔電路層121 a係貼附於該罩體底部124a外側， 同時’銅箔電路層121 a係經由該絕緣導熱膠123a而貼附 於熱傳導介質14a之該第一表面141a。該複數個LED元件 122a係設置於銅箔電路層121a之上，且該複數個LED元 件122a之一光發射面1221 a係分別穿過該複數個孔洞而進 入罩體120a内部。 如此，經由上述，該具有良好的均熱與散熱效果之整 19 1料丄U894 合式背光模組之第六實施例的架構係已被揭露。如第六圖 所不’相同於其第一實施例（即’以反射片為罩體之實施 •例於第六實施例之中，當該複數個LED元件122a發光 -時’該熱傳導介質14a會藉由高效率熱傳導之方式，將lED _牛122a所產生的熱傳導至邊框U2a，以藉由主框架"a 之散熱特性將熱散去。 φ 同樣地，對於上述該具有良好的均熱與散熱效果的整 0式背光模組的第六實施例而言，當該光源組12a透過該 熱傳導介質14a將熱傳導至該邊框U2a之時，雖然傳導至 邊框112a的熱可經由熱對流之方式被散去，但是，堆積於 邊框112a的熱依然會於邊框U2a與該底板111&之間造成 一溫度差。基於這個原因，本創作更提供具有良好的均熱 與散熱效果的整合式背光模組的-第七實施例。請參閱同 • 肖參閱第十四圖與第十五圖，係本創作之__種具有良好的 均熱與散熱效果之整合式背光模組之第七實施例的立體圖 與侧視圖。如第十四圖與第十五圖所示，藉由增設複數條 導熱帶15a於該第六實施例之中，即完成該具有良好的均 熱與散熱效果之整合式背光模組i的第七實施例之架構。 其中，該複數條導熱帶15a之製造材料可為銅、鋁以及石 墨，係設置於主框架lla之邊框112a，同時，該複數條導 熱帶15a亦藉由一導熱膠125&而鋪設於主框架iu之底板 111a其中，導熱帶15a係用以將堆積於邊框U2a的熱， 20 M4l〇894 均勻地分佈於該絲11U;此外，必須特別說明的是，舖 設於該底板111a表面的該複數條導熱帶15a，並不限定全 面舖設，其亦可被局部鋪設於底板Uu表面。 請繼續地參閱第十六圖’係具有良好的均熱與散熱效 果之整合式背光模組的第七實施例之第二側視圖，其中， 相同於前述第五圖’料該具有良好的均熱與散熱效果之 整合式背光模組1的第七實施例而言，亦可於其主框架丄“ 之外表面增設一具有熱輻射特性之材料16a，以藉由該具 有熱輻射特性之材肖16a與外部空氣之間的熱幅射與熱對 流，協助該主框架lla散熱；其中，該具有熱輻射特性之 材料16a可被全面塗佈或局部塗佈於該主框架na之外表 面。 本創作更包括一第八實施例，請參閱第十七圖，係本 創作之具有良好的均熱與散熱效果之整合式背光模组的第 八實施例之側視圖。如第十七圖’該具有良好的均熱與散 熱效果之整合式背光模組的第八實施例的第八實施例係包 括：一主框架lib、一光源組12b與複數個熱傳導介質14b， 其中，該主框架lib之材質可為鐵、鋁或陶瓷，係具有至 夕邊框112b與一底板lllb，該底板111b具有複數個第 一孔洞。 該光源組12b係以貼附該邊框丨12b之方式被設置於該 底板111 b之上，光源組丨2b係用以提供一背光源至主框架 21 M410894 11b内的-導光板’並包括：―罩體12Gb，可由銅叙、 電鍍鋅鋼板、或熱浸鋅鋼板製成一门形或一[形，並具有 ^罩體底冑1201b，且該罩體底部1201b具有複數個第二 孔洞，一反射層124b，係形成於該罩體12〇b内部；—銅 猪電路層121b’係藉由一絕緣膠123b而設置於該罩體底The light source groups used in the integrated backlight module shown in the second figure are all direct-type backlight modules. For this part, it must be stated that the integrated backlight module with good soaking and heat dissipation effect of the present invention does not necessarily require the use of a direct light source group to provide a backlight; in fact, the 'side light source group The edge-type backlight module can also be used in the integrated backlight module with good soaking and heat dissipation effects to provide a backlight to the light guide plate. In addition, conventionally, a metal cover, such as an aluminum cover, is used to accommodate the plurality of LED components. Therefore, in order to make the creation conform to the conventional method, the metal cover has good heat absorption and heat dissipation. The integrated backlight module of the effect will be revealed in the following description. Please refer to a side view of a sixth embodiment of an integrated backlight module having a good soaking and heat dissipating effect of the thirteenth drawing. As shown in the thirteenth embodiment, the sixth embodiment provides an integrated backlight module having a metal cover, wherein the sixth embodiment of the integrated backlight module 1 having good heat absorption and heat dissipation effects is The invention comprises a main frame Ua, a solder Ih, a heat conducting medium 14a, and a light source group 12a. As shown in the thirteenth figure, the material of the main frame Ua may be iron, sho or ceramic, and the main frame Ua has at least one frame U2a, and at the same time has good heat dissipation characteristics. The solder 13a may be a low temperature tin f or a high temperature solder paste, and the 18 M410894 solder 13a is placed on the frame u2a by soldering. The heat transfer medium 14a is completely attached to the solder 13a with a second surface 1423 thereof. The light source group 12a can be a light source group or a side light source group. The light source group 12a is attached to a first surface 141a of the heat conduction medium 14a by an insulating heat conductive adhesive 123a for providing a backlight. A light guide plate is disposed in the main frame 11a; wherein the insulating and thermally conductive adhesive 123a is partially attached or fully attached to the first surface 141a. The light source group Ua includes a cover 120a, a reflective layer 124a, A foil circuit layer 121a, and a plurality of L^D elements lKa. The cover i2〇a is a metal cover having a bottom portion of the cover, wherein the cover bottom portion 1241a has a plurality of holes. In the sixth embodiment, the reflective layer 124a is formed inside the cover 120a by coating, painting or spraying. When the reflective layer i24a is formed inside the cover 120a, it is a process step that does not require prior reflection sheet stamping. The copper foil circuit layer 121a is attached to the outside of the cover bottom portion 124a, and the 'copper foil circuit layer 121a is attached to the first surface 141a of the heat transfer medium 14a via the insulating heat conductive adhesive 123a. The plurality of LED elements 122a are disposed on the copper foil circuit layer 121a, and one of the plurality of LED elements 122a passes through the plurality of holes and enters the inside of the cover 120a. Thus, through the above, the architecture of the sixth embodiment of the U 合 U894 combined backlight module having good soaking and heat dissipating effects has been disclosed. 6 is the same as the first embodiment (ie, the embodiment in which the reflective sheet is used as a cover, and in the sixth embodiment, when the plurality of LED elements 122a emit light - the heat conductive medium 14a) The heat generated by lED_牛122a is conducted to the frame U2a by means of high-efficiency heat conduction to dissipate heat by the heat dissipation characteristics of the main frame "a. φ Similarly, it has good soaking for the above In the sixth embodiment of the integral type backlight module with heat dissipation effect, when the light source group 12a conducts heat to the frame U2a through the heat conduction medium 14a, although the heat conducted to the frame 112a can be thermally convective It is dissipated, but the heat accumulated on the frame 112a still causes a temperature difference between the frame U2a and the bottom plate 111& For this reason, the creation further provides an integrated backlight mode with good soaking and heat dissipation effects. The seventh embodiment of the integrated backlight module having good uniformity and heat dissipation effect is the same as that of the fourth embodiment and the fifteenth figure. Stereogram As shown in FIG. 14 and FIG. 15 , by adding a plurality of conductive strips 15a in the sixth embodiment, the integrated backlight module having good uniform heat and heat dissipation effects is completed. The structure of the seventh embodiment is wherein the plurality of conductive strips 15a are made of copper, aluminum and graphite, and are disposed on the frame 112a of the main frame 11a. Meanwhile, the plurality of conductive strips 15a are also thermally conductive. The glue 125& is laid on the bottom plate 111a of the main frame iu, and the guide belt 15a is used for uniformly distributing the heat accumulated on the frame U2a, 20 M4 〇 894 to the wire 11U; in addition, it must be specifically explained that The plurality of guides 15a on the surface of the bottom plate 111a are not limited to a full-scale laying, and may be partially laid on the surface of the bottom plate Uu. Please refer to the sixteenth figure for an integrated system with good soaking and heat dissipation effects. A second side view of the seventh embodiment of the backlight module, wherein the seventh embodiment of the integrated backlight module 1 having the same uniform heat and heat dissipation effect is the same as the fifth embodiment In its main frame丄a material 16a having heat radiation characteristics is added to the outer surface to assist the heat dissipation of the main frame 11a by heat radiation and heat convection between the material 16a having heat radiation characteristics and the outside air; wherein the heat is provided The material 16a of the radiation characteristic can be fully coated or partially coated on the outer surface of the main frame na. The present invention further includes an eighth embodiment, please refer to the seventeenth figure, which has a good soaking heat. A side view of an eighth embodiment of an integrated backlight module having a heat dissipation effect. As shown in the seventeenth embodiment, the eighth embodiment of the integrated backlight module having good heat absorption and heat dissipation effects includes the eighth embodiment. a main frame lib, a light source group 12b and a plurality of heat transfer media 14b, wherein the main frame lib can be made of iron, aluminum or ceramic, and has an outer frame 112b and a bottom plate 111b. The bottom plate 111b has a plurality of The first hole. The light source group 12b is disposed on the bottom plate 111b in a manner of attaching the frame 丨12b. The light source group 丨2b is used to provide a backlight to the light guide plate 'in the main frame 21 M410894 11b and includes: The cover body 12Gb may be made of a copper or galvanized steel sheet or a hot dip galvanized steel sheet, and may have a shape or a shape, and have a second bottom hole 1201b, and the bottom portion 1201b of the cover has a plurality of second holes. A reflective layer 124b is formed inside the cover 12b; the copper pig circuit layer 121b' is disposed on the bottom of the cover by an insulating rubber 123b.
部1201b，並具有相對於該複數個第一孔洞與該複數個第 二孔洞的複數個第三孔洞；以及複數個LED元件i ，係 分別具有二焊接端點1221b與一散熱片1222b，該複數個 LED兀件122b係藉由該二焊接端點122比而設置於該銅箔 電路層121b之上。 該複數個熱傳導介質14b係以穿過該複數個第一孔 >同、該複數個第二孔洞與該複數個第三孔洞之方式，由底 板mb外部進入罩體120b内部，並藉由一散熱介質nb 而接觸該複數個LED元件122b之該散熱片1222b，其中， • 該散熱介質13b可為導熱膏或錫膏；且，與前述其它實施 例相同，熱傳導介質14b之可為銅、其一表面鍍鎳的鋁、 其一表面鍍鋼的鋁、或鎳鋁合金；並且，於第八實施例之 中，熱傳導介質14b可進一步地被製成一鉚釘形態或一柱 狀形態’以利於穿過該第一孔洞、該第二孔洞與該第三孔 洞。如此’於第八實施例之中，當該複數個LEd元件122b 發光時’該熱傳導介質14b會藉由高效率熱傳導之方式， 將LED元件122b所產生的熱傳導至邊框mb，以藉由主 22 M410894 框架lib散熱；並且，藉由熱傳導介質14b與外部空氣之 熱對流，亦可同步地將LED元件所產生的熱散去。 上述具有良好的均熱與散熱效果之整合式背光模組的 第八實施例’係必須分別於該底板Ulb、該罩體底部l2〇lb 與該銅箔電路層121b製作彼此相對的複數個孔洞，製程上 或許有其難度。基於這個理由，本創作更提供了一第九實 施例’請參閱第十八圖’係本創作之具有良好的均熱與散 熱效果之整合式背光模組的第九實施例之侧視圖，如第十 八圖所示’第九實施例之架構係相似於第八實施例，不同 的是，於第九實施例之中，並沒有於底板mb與罩體底部 1201b上製作孔洞。 於第九實施例之中，係於罩體底部12〇ib上製作複數 個凸起1202b ’該複數個凸起12〇2b係以穿過該銅箔電路 層121b之該複數個第三孔洞之方式，透過該散熱介質13b 而與該複數個LED元件122b的該散熱片1222b接觸。該 複數個凸起1202b係作為熱傳導介質之用，因此，當該複 數個LED元件122b發光時，該複數個凸起12〇2b會藉由 高效率熱傳導之方式，將LED元件122b所產生的熱傳導 至罩體120b，接著，罩體i2〇b會將熱傳導致邊框U2b， 以藉由主框架lib散熱。 另外’考慮到於該罩體底部1201b上製作該複數個凸 起1202b之複雜，本創作又提供了一第十實施例，請參閱 23 M410894 第十九圖’係本創作之具有良好的均熱與散熱效果之整合 式背光模組的第十實施例之側視圖。如第十九圖所示，第 十實施例之架構係相似於第九實施例，不同的是，於第十 實施例之中’並沒有於罩體底部1201b上製作該複數個凸 起1202b’而是直接將該複數個熱傳導介質14b直接地設 置於罩體底部1201b，而同樣地’熱傳導介質14b係藉由 該散熱介質13b，並以穿過該銅箔電路層12ib之該複數個 第三孔洞之方式接觸該LED元件122b的散熱片1222b。如 此，當該複數個LED元件122b發光時，該熱傳導介質14b 會藉由高效率熱傳導之方式，將LED元件122b所產生的 熱傳導至罩體12〇b，接著，罩體120b會將熱傳導致邊框 112b，以藉由主框架lib散熱。 另外’為了增加製程速度以及進一步地減少製造成本， 本創作更提供一第十一實施例，請參閱第二十A圖與第二 十B圖’係本創作之具有良好的均熱與散熱效果之整合式 背光模、组的第十一實施例之側視圖。如第二十A圖所示， 該具有良好的均熱與散熱效果之整合式背光模組1的第十 一實施例係包括：一主框架lie、一導熱帶15c與一光源組 12c ’其中’相同於前述實施例，該主框架u c係具有一邊 框112c與一底板1Uc。該導熱帶i5c係具有散熱之特性， 其可由銅、鋁或石墨製成；於第十一實施例之中，導熱帶 15c係彎折成一 l形罩體而設置於該邊框112c之上。 24 M410894 繼續地參閱第一十A圖，該光源組12c係設置於該導 熱帶15c所形成的罩體内’並用以提供一背光源至主框架 11c内的一導光板，其中，該光源組l2c係包括：一銅绪電 路層121c’係藉由一絕緣導熱膠123c而設置於該罩體之一 罩體底部151c ;以及複數個LED元件122c，係設置於該 銅箔電路層121c之上，其中，該LED元件122c可為直光 型LED元件或側光型LED元件，然而，於第十一實施例之 中，係採用直光型LED元件作為該LED元件122c。 如此，對於該具有良好的均熱與散熱效果之整合式背 光模組1的第十一實施例而言，當該複數個LED元件122c 發光時，該導熱帶15c會藉由高效率熱傳導之方式，將LED 元件122c所產生的熱傳導至罩體12〇c，接著，罩體12〇c 會將熱傳導致邊框112c，以藉由主框架Uc散熱。另外， 必須特別說明的是’該絕緣導熱膠123c可以局部貼佈與全 面貼佈之方式而貼附於該罩體底部並且，該反射層 可利用下列任一種方式而形成於該罩體内部：塗佈、塗抹 與噴塗。 此外’如第二十B圖所示，於該具有良好的均熱與散 熱效果之整合式背光模組1的第十一實施例之中，該導熱 帶15c亦可彎折成一门形罩體而設置於該邊框112c之上； 此時，為了使得該光源組12e具有更佳的收光效果，亦可 額外設置一反射層14c，係設置於該導熱帶15c所形成的罩 25 M410894 體内於導熱帶15c所形成的罩體内部，如此，將使得該具 有良好的均熱與散熱效果之整合式背光模組i同時具有良 好的收光效果》 如此，藉由上述所有實施例，本創作之具有良好均熱 與散熱效果之整合式背光模組係已完整且清楚地揭露，並 且，由上所述，可以得知本創作具有下列之優點： 1.本創作係藉由一熱傳導介質將至少一光源組整合於液晶 顯不器之主框架内，使得該光源組與主框架之間不具有 空隙，如此，當光源組内的LED元件發光時，其所產生 的熱則可透過熱傳導之方式，經由該熱傳導介質傳導至 主框架，以透過主框架將熱散去，達到良好的散熱效果。 2·本創作更將一導熱帶鋪設於主框架之底板，以透過該導 熱帶之熱傳導，使得熱可均勻分佈於主框架，而達到均 熱之效果。 3. 承上述第1點，本創作所達成之良好的散熱效果，係可 避免熱堆積損壞液晶顯示器内的導光板與其它光學膜 片。 4. 承上述第2點，本創作所達成之良好的均熱效果，係可 避免熱堆積現象於導光板或光學膜片的兩側端之間所造 成的溫差現象。 5. 本創作包括多組實施例，可分別應用於使用直光式光源 組或使用侧光式光源組之液晶顯示器之内。 26 ’承上述第5 .點’此外’本創作之第七實施例係不使用傳 統反射片’而係以塗佈或喷塗之方式，於該罩體内形成 反射層’藉以反射LED元件所發出的光。 上述之詳細㉟明係針對本創作可行實施例之具體說 月准該實施例並非用以限制本創作之專利範圍，凡未脫 離本創作技藝精神所為之等效實施或變更，均應包含於本 案之專利範圍中。 【圖式簡單說明】 係一種習用的led背光模組與液晶顯示器 之一主框架之組合示意圖； 係習用的LED背光模組與液晶顯示器之主 框架之第二組合示意圖； 係本釗作之一種具有良好的均熱與散熱效 果之整合式背光模組之一第一實施例的立 體圖； 係具有良好的均熱與散熱效果之整合式背 光模組之第一實施例的側視圖； 係具有良好的均熱與散熱效果之整合式背 光模組之一第二實施例的側視圖； 係本創作之一種具有良好的均熱與散熱效 果之整合式背光模組之一第三實施例的立 體圖； 27 M410894 第七圖 第八圖 第九圖a portion 1201b having a plurality of third holes with respect to the plurality of first holes and the plurality of second holes; and a plurality of LED elements i having two soldering end points 1221b and a heat sink 1222b, respectively The LED elements 122b are disposed on the copper foil circuit layer 121b by the two solder terminals 122. The plurality of heat transfer media 14b enter the inside of the cover 120b from the outside of the bottom plate mb through the plurality of first holes>, the plurality of second holes and the plurality of third holes, and The heat dissipating medium nb is in contact with the heat sink 1222b of the plurality of LED elements 122b, wherein: the heat dissipating medium 13b may be a thermal paste or solder paste; and, like the other embodiments described above, the heat conducting medium 14b may be copper, a surface nickel-plated aluminum, a surface thereof plated with aluminum, or a nickel aluminum alloy; and, in the eighth embodiment, the heat transfer medium 14b may be further formed into a rivet shape or a columnar shape to facilitate Passing through the first hole, the second hole and the third hole. Thus, in the eighth embodiment, when the plurality of LEd elements 122b emit light, the heat conducting medium 14b conducts heat generated by the LED elements 122b to the frame mb by means of high-efficiency heat conduction, by the main 22 The M410894 frame lib dissipates heat; and, by the heat convection of the heat transfer medium 14b and the outside air, the heat generated by the LED elements can be simultaneously dissipated. The eighth embodiment of the integrated backlight module having good uniform heat and heat dissipation effects must have a plurality of holes opposite to each other on the bottom plate U1b, the cover bottom portion l2〇1b and the copper foil circuit layer 121b. , the process may have its difficulty. For this reason, the present invention further provides a ninth embodiment 'please refer to the eighteenth figure' as a side view of the ninth embodiment of the integrated backlight module having good heat absorption and heat dissipation effects, such as The structure of the ninth embodiment shown in Fig. 18 is similar to that of the eighth embodiment, except that in the ninth embodiment, holes are not formed in the bottom plate mb and the bottom portion 1201b of the cover. In the ninth embodiment, a plurality of protrusions 1202b are formed on the bottom portion 12〇ib of the cover body. The plurality of protrusions 12〇2b are passed through the plurality of third holes of the copper foil circuit layer 121b. The method is in contact with the heat sink 1222b of the plurality of LED elements 122b through the heat dissipation medium 13b. The plurality of protrusions 1202b are used as a heat conduction medium. Therefore, when the plurality of LED elements 122b emit light, the plurality of protrusions 12〇2b conduct heat conduction by the LED elements 122b by high-efficiency heat conduction. To the cover 120b, then, the cover i2〇b will transfer heat to the frame U2b to dissipate heat by the main frame lib. In addition, considering the complexity of fabricating the plurality of protrusions 1202b on the bottom portion 1201b of the cover body, the present invention provides a tenth embodiment. Please refer to FIG. 23 M410894, the nineteenth figure, which has a good soaking heat. A side view of a tenth embodiment of an integrated backlight module with a heat dissipation effect. As shown in the nineteenth embodiment, the architecture of the tenth embodiment is similar to that of the ninth embodiment, except that in the tenth embodiment, the plurality of protrusions 1202b are not formed on the bottom portion 1201b of the cover. Rather, the plurality of heat transfer media 14b are directly disposed on the bottom portion 1201b of the cover body, and similarly, the heat transfer medium 14b is formed by the heat dissipation medium 13b and the plurality of third portions passing through the copper foil circuit layer 12ib. The holes are in contact with the fins 1222b of the LED element 122b. Thus, when the plurality of LED elements 122b emit light, the heat conducting medium 14b conducts heat generated by the LED elements 122b to the cover 12b by high-efficiency heat conduction, and then the cover 120b transmits heat to the frame. 112b, to dissipate heat through the main frame lib. In addition, in order to increase the processing speed and further reduce the manufacturing cost, the present invention further provides an eleventh embodiment, please refer to the twentieth A picture and the twentieth B picture, which has good heat absorption and heat dissipation effects. Side view of an eleventh embodiment of an integrated backlight mold, set. As shown in FIG. 20A, the eleventh embodiment of the integrated backlight module 1 having good soaking and heat dissipation effects includes: a main frame lie, a guiding layer 15c and a light source group 12c' 'As in the previous embodiment, the main frame uc has a frame 112c and a bottom plate 1Uc. The heat guide i5c has heat dissipation characteristics and can be made of copper, aluminum or graphite. In the eleventh embodiment, the heat guide 15c is bent into an l-shaped cover and disposed on the frame 112c. 24 M410894 Continuing to refer to FIG. 10A, the light source group 12c is disposed in the cover body formed by the heat guide 15c and is used to provide a backlight to a light guide plate in the main frame 11c, wherein the light source group The l2c system includes: a copper circuit layer 121c' disposed on a bottom portion 151c of the cover body by an insulating thermal conductive adhesive 123c; and a plurality of LED elements 122c disposed on the copper foil circuit layer 121c The LED element 122c may be a direct light type LED element or a side light type LED element. However, in the eleventh embodiment, a direct light type LED element is used as the LED element 122c. Thus, for the eleventh embodiment of the integrated backlight module 1 having good soaking and dissipating effects, when the plurality of LED elements 122c emit light, the heat conducting layer 15c is thermally conductive. The heat generated by the LED element 122c is conducted to the cover 12〇c, and then the cover 12〇c transmits heat to the frame 112c to dissipate heat by the main frame Uc. In addition, it must be specifically stated that the insulating thermal conductive adhesive 123c can be attached to the bottom of the cover in a partial patch and a full patch, and the reflective layer can be formed inside the cover by any of the following methods: Coating, painting and spraying. In addition, as shown in FIG. 20B, in the eleventh embodiment of the integrated backlight module 1 having good soaking and heat dissipation effects, the guide belt 15c can also be bent into a gate-shaped cover. And disposed on the frame 112c; in this case, in order to make the light source group 12e have a better light-receiving effect, a reflective layer 14c may be additionally disposed in the cover 25 M410894 formed by the heat guide 15c. In the inside of the cover body formed by the guide belt 15c, the integrated backlight module i having good heat absorption and heat dissipation effects can have a good light-receiving effect at the same time. Thus, by all the above embodiments, the creation The integrated backlight module with good soaking and heat dissipation effect has been completely and clearly disclosed, and, as described above, it can be known that the creation has the following advantages: 1. The creation is performed by a heat conduction medium At least one light source group is integrated into the main frame of the liquid crystal display device, so that there is no gap between the light source group and the main frame, so that when the LED elements in the light source group emit light, the heat generated by the light source can be transmitted through heat conduction. The method is conducted to the main frame via the heat conducting medium to dissipate heat through the main frame to achieve a good heat dissipation effect. 2. This creation also lays a tropical guide on the bottom plate of the main frame to transmit heat through the guide, so that the heat can be evenly distributed in the main frame to achieve the soaking effect. 3. In accordance with point 1 above, the good heat dissipation effect achieved by this creation can prevent thermal buildup from damaging the light guide plate and other optical films in the liquid crystal display. 4. In accordance with point 2 above, the good soaking effect achieved by this creation avoids the temperature difference caused by the thermal accumulation phenomenon between the two ends of the light guide plate or the optical film. 5. This creation includes a plurality of sets of embodiments that can be applied to liquid crystal displays using a direct light source group or a side light source group, respectively. 26 'in accordance with the above fifth point. In addition, the seventh embodiment of the present invention uses a conventional reflective sheet to form a reflective layer in the cover body by coating or spraying, thereby reflecting the LED element. The light emitted. The above detailed description of the present invention is not intended to limit the scope of the patents of the present invention, and equivalent implementations or modifications that are not departing from the spirit of the present invention should be included in the present case. In the scope of patents. [Simple diagram of the diagram] is a schematic diagram of a combination of a conventional LED backlight module and a main frame of a liquid crystal display; a schematic diagram of a second combination of a conventional LED backlight module and a main frame of a liquid crystal display; A perspective view of a first embodiment of an integrated backlight module having good soaking and heat dissipation effects; a side view of a first embodiment of an integrated backlight module having good soaking and heat dissipation effects; A side view of a second embodiment of an integrated backlight module with uniform heat and heat dissipation effect; a perspective view of a third embodiment of an integrated backlight module having good heat absorption and heat dissipation effects; 27 M410894 Seventh Figure Eighth Figure IX
第十圖 第十一圖 第十Tenth map eleventh figure tenth
第十四圖 第十五圖 係具有良好的均熱與散熱效果之整合式背 光模組之第三實施例的側視圖； 具有良好的均熱與散熱效果之整合式背光 模組之第三實施例的第二側視圖； 係本創作之-種具有良好的均熱與散熱效 果之整合式背光模組之一第四實施例的側 視圖； 係具有良好的均熱與散熱效果之整合式背 光模組之第四實施例的第二側視圖； 係本創作之一種具有良好的均熱與散熱效 果之整合式背光模組之一第五實施例的侧 視圖； 係具有良好的均熱與散熱效果之整合式背 光模組之第五實施例的第二側視圖； 係本創作之一種具有良好的均熱與散熱效 果之整合式背光模組之一第六實施例的側 視圖； 係本創作之一種具有良好的均熱與散熱效 果之整合式背光模組之第七實施例的立體 圆， 係具有良好的均熱與散熱效果之整合式背 光模組之第七實施例的側視圖； 28 M410894 第十六圖 第十七圖 第十八圖 第十九圖Figure 14 is a side view of a third embodiment of an integrated backlight module having good soaking and heat dissipation effects; a third implementation of an integrated backlight module having good soaking and heat dissipation effects The second side view of the example; a side view of a fourth embodiment of the integrated backlight module with good soaking and heat dissipation effects; an integrated backlight with good soaking and heat dissipation effects A second side view of a fourth embodiment of the module; a side view of a fifth embodiment of an integrated backlight module having good soaking and heat dissipation effects; having good soaking and heat dissipation A second side view of a fifth embodiment of the integrated backlight module of the present invention; a side view of a sixth embodiment of an integrated backlight module having good heat absorption and heat dissipation effects; The three-dimensional circle of the seventh embodiment of the integrated backlight module with good uniform heat and heat dissipation effect is a side view of the seventh embodiment of the integrated backlight module with good heat absorption and heat dissipation effects. ; 28 M410894 FIG sixteenth FIG eighteenth seventeenth FIG nineteenth FIG
係具有良好的均熱與散熱效果之整合式背 光模組之第七實施例的第二側視圖； 係本創作之具有良好的均熱與散熱效果之 整合式背光模組的第八實施例之側視圖； 係本創作之具有良好的均熱與散熱效果之 整合式背光模組的第九實施例之側視圖； 係本創作之具有良好的均熱與散熱效果之 整合式背光模組的第十實施例之侧視圖； 以及 第二十A圖與第二十B圖 係本創作之表士 ώ 具'有良好的均熱與散熱效果之 整合式背# Ζ 月元模故的第十一實施例之側視 圖。The second side view of the seventh embodiment of the integrated backlight module having good heat absorption and heat dissipation effects; the eighth embodiment of the integrated backlight module having good heat absorption and heat dissipation effects Side view; a side view of the ninth embodiment of the integrated backlight module with good uniform heat and heat dissipation effect; the integrated backlight module with good uniform heat and heat dissipation effect A side view of the tenth embodiment; and the twentieth A picture and the twentieth B picture are the ones of the creation of the watcher's integrated back with a good soaking and heat dissipation effect. Side view of the embodiment.
【主要元件符號說明】 1 11、 11a、lib、11c、11， 111、 111a ' 111b、111c 1111 112、 112a、112b、112c 12、 12a、12b、12c 12’ 具有良好的均熱與散熱效 果之整合式背光模組 主框架 底板 螺孔 邊框 光源組 背光模組 29 M410894 120a、120b、12Γ 罩體 1201b、1241、1241a、151c 罩體底部 1202b凸起 121、 121a、121b、121c 銅羯電路層 122、 122a、122b、122c、123，LED 元件 1225 1221 、 1221a[Main component symbol description] 1 11, 11a, lib, 11c, 11, 111, 111a '111b, 111c 1111 112, 112a, 112b, 112c 12, 12a, 12b, 12c 12' have good soaking and heat dissipation effects Integrated backlight module main frame bottom plate screw hole frame light source group backlight module 29 M410894 120a, 120b, 12Γ cover 1201b, 1241, 1241a, 151c cover bottom 1202b protrusion 121, 121a, 121b, 121c copper circuit layer 122 , 122a, 122b, 122c, 123, LED components 1225 1221, 1221a
1221b 1222b 123、123a、123c 123b 124 124a、124b、14c 125 、 125a1221b 1222b 123, 123a, 123c 123b 124 124a, 124b, 14c 125, 125a
13 、 13a 13b 14、14a、14b 141 、 141a 142 、 142a 15 、 15a 、 15c 16 、 16a 17 電路板 光發射面 焊接端點 散熱片 絕緣導熱膠 絕緣膠 反射片 反射層 導熱膠 焊料 散熱介質 熱傳導介質 第一表面 第二表面 導熱帶 具有熱輻射特性之材料 導熱結合物質 3013 , 13a 13b 14, 14a, 14b 141 , 141a 142 , 142a 15 , 15a , 15c 16 , 16a 17 Circuit board light emitting surface soldering end plate heat sink insulation thermal conductive adhesive insulating film reflective sheet reflective layer thermal conductive solder cooling medium thermal conduction medium First surface second surface conduction zone material having heat radiation characteristics thermally conductive bonding substance 30
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100202407U TWM410894U (en) | 2011-02-01 | 2011-02-01 | Integration-type backlight module with excellent heat uniformization and dissipation effect |
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| Application Number | Priority Date | Filing Date | Title |
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| TW100202407U TWM410894U (en) | 2011-02-01 | 2011-02-01 | Integration-type backlight module with excellent heat uniformization and dissipation effect |
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| TWM410894U true TWM410894U (en) | 2011-09-01 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI456310B (en) * | 2011-08-31 | 2014-10-11 | Acer Inc | Backlight module and lcd device |
| TWI472847B (en) * | 2011-10-27 | 2015-02-11 | Innolux Corp | Display device and backlight module thereof |
| TWI587049B (en) * | 2012-01-06 | 2017-06-11 | 揚昇照明股份有限公司 | Light source module and backlight module |
-
2011
- 2011-02-01 TW TW100202407U patent/TWM410894U/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI456310B (en) * | 2011-08-31 | 2014-10-11 | Acer Inc | Backlight module and lcd device |
| TWI472847B (en) * | 2011-10-27 | 2015-02-11 | Innolux Corp | Display device and backlight module thereof |
| TWI587049B (en) * | 2012-01-06 | 2017-06-11 | 揚昇照明股份有限公司 | Light source module and backlight module |
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