JP3169761U - Matched backlight module with good soaking and heat dissipation - Google Patents

Abstract

An alignment backlight module having good soaking and heat dissipation effects is provided. A main frame (11), at least one light source group (12), one heat transfer medium (14), and solder (13) are provided. The main frame has at least one side frame 112 having good heat dissipation characteristics for installing at least one light source group. The light source group includes a reflective sheet 124, a copper foil electronic circuit layer 121, and a plurality of LED elements 122, and a backlight module in which an insulating heat conductive adhesive 123 is bonded through a heat transfer medium. One inner surface of the side frame can be bonded, and the solder has a function of stably coupling the heat transfer medium to the inner surface of the side frame. As a result, the heat generated when the plurality of LED elements emit light is conducted to the heat transfer medium 14 via the copper foil electronic circuit layer and the insulating heat conductive adhesive, and then is mainly transmitted via the heat transfer medium. Conducted to the frame 11 can release a large amount of heat at high speed. [Selection] Figure 4

Description

      A liquid crystal display device is a widely used display device. The liquid crystal display device can display an accurate image by controlling the light transmittance of each pixel position through the liquid crystal layer of the liquid crystal panel. Today, liquid crystal display devices are used in large quantities in televisions, mobile phones, smart phones, notebook computers, and personal digital assistants (PDAs).

      However, since the liquid crystal panel is a display member that cannot emit light, a backlight module needs to be additionally disposed in order to provide a light source from the liquid crystal display device. A description will be given with reference to a combination view of main frames of the LED backlight module of the prior art shown in FIG. As shown in FIG. 1, normally, at least two light source groups 12 'are provided inside the liquid crystal display device, and the two light source groups 12' face each other on the main frame 11 'of the liquid crystal display device. It is provided on the upper and lower side frames or on the left and right side frames (as shown in FIG. 1, the two light source groups 12 ′ are provided on the upper and lower side frames of the main frame 11 ′ opposite to each other). Among them, each light source group 12 ′ includes at least a hood 121 ′, an electronic circuit board 122 ′, and a plurality of LED elements 123 ′.

      As is well known, when a plurality of LED elements 123 ′ emit light, the light source group 12 ′ causes a heat accumulation phenomenon. This heat storage phenomenon causes deformation of the light guide plate or chemical film installed in the main frame 11 '. When serious, the light storage plate or chemical film is damaged by the heat storage phenomenon, and the liquid crystal display device normalizes the image. Cannot be displayed.

      Next, a description will be given with reference to a combination mode diagram (part 2) of the main frame of the LED backlight module of the prior art shown in FIG. As shown in FIG. 2, some liquid crystal display device manufacturers reduce the heat storage phenomenon inside the light source group 12 ′ when the LED element 123 ′ emits light with respect to breakage of the light guide plate or chemical film due to the heat storage phenomenon. Therefore, the light source group 12 ′ is installed only on one side frame of the main frame 11 ′. However, this method, instead, forms an extremely large temperature difference phenomenon between the two side edges of the light guide plate and the chemical film, and this temperature difference phenomenon causes the two side edges of the light guide plate and the chemical film. The amount of deformation differs from one another, which affects the balance and appearance of the liquid crystal display device.

      Since the heat storage phenomenon inside the liquid crystal display device cannot be effectively improved, many research literatures and patent specifications have proposed methods for improving the heat storage phenomenon of the backlight module. However, most of the solutions related to heat storage presented in these research documents and patent specifications achieve a heat radiation effect by modifying the appearance or members of the hood 121 ′ or the electronic circuit board 122 ′. However, these solutions for heat storage are effective only when the light source group 12 'is used alone. If the light source group 12' is installed in the main frame 11 ', a plurality of solutions are provided. The generated heat of the LED element 123 ′ is released to the outside of the light source group 12 ′ and deposited between the light source group 12 ′ and the main frame 11 ′ to form a second layer heat storage phenomenon. The hood 121 ′ and the bottom surface of the main frame 11 ′ are not completely bonded together. For this reason, obviously, a space still remains between the hood 121 ′ and the bottom surface of the main frame 11 ′, and the air accumulated in the space has a thermal resistance between the hood 121 ′ and the main frame 11 ′. A heat storage phenomenon of the second layer between 11 ′ and the light source group 12 ′ is formed and cannot be effectively emitted through the main frame 11 ′.

      Therefore, from the above description of the combination of the LED backlight module of the prior art and the main frame of the liquid crystal display device, there are still many drawbacks and deficiencies in the combination of the LED backlight module of the prior art and the main frame of the liquid crystal display device. is doing. As a result of intensive research by the inventor on this point, the present inventors have devised a matching backlight module with good soaking and heat dissipation effects of the present invention, and the main frame of the conventional LED backlight module and liquid crystal display device. It is intended to solve the heat storage phenomenon by the combination and the problem that cannot be soaked.

      The main object of the present invention is to place a heat transfer medium and at least one light source group in alignment with the main frame, and the heat generated by the light source group is conducted to the main frame through the heat medium and then the main frame is heated. Provided is a matched backlight module having good heat equalization and heat dissipation effect, which releases heat by a convection method and achieves a highly efficient heat dissipation effect.

      In order to achieve the first object of the present invention, a matching backlight module having a main frame, at least one light source group, one heat transfer medium, and solder and having a good heat equalization and heat dissipation effect. Present.

      The main frame includes at least one side frame and has good heat dissipation characteristics.

      At least one light source group is installed on the inner surface of at least one side frame of the main frame, and provides a back light source to a light guide plate installed in the main frame. The light source group is refracted to form a hood, a reflective sheet having a plurality of holes at the bottom of the hood, a copper foil electronic circuit layer to be bonded to the outside of the hood bottom, and the copper foil electronic circuit layer A plurality of LED elements installed on the upper surface of the substrate. The light emitting surfaces of the plurality of LED elements pass through the plurality of holes, respectively, and enter the inside of the hood made of the reflective sheet.

      The heat transfer medium is completely bonded to the inner surface of the side frame by the second surface. Among them, the copper foil electronic circuit layer is bonded to the first surface of the heat transfer medium with an insulating heat conductive adhesive. Thus, the heat generated when the plurality of LED elements emit light is conducted to the heat transfer medium through the copper foil electronic circuit layer and the insulating heat conductive adhesive, and then to the main frame from the heat transfer medium. Can do.

      The solder has a function of stably coupling the heat transfer medium to the inner surface of the side frame by being formed between the second surface of the heat transfer medium and the inner surface of the side frame by a soldering method.

      The second object of the present invention is to lay a plurality of heat transfer strips on the bottom plate of the main frame, and when heat is conducted to the main frame by the light source group, the heat is evenly distributed to the bottom plate of the main frame, and high efficiency Provided is a matched backlight module that achieves a good soaking effect and has a good soaking and heat dissipation effect.

      In order to achieve the first object of the present invention, a matching type having a good heat equalization and heat dissipation effect, comprising a main frame, at least one light source group, one heat transfer medium, and a plurality of heat transfer strips. Provide a backlight module.

      The main frame includes at least one side frame and has good heat dissipation characteristics.

      At least one light source group is installed on the inner surface of at least one side frame of the main frame, and provides a back light source to a light guide plate installed in the main frame. The light source group is refracted to form a hood, a reflective sheet having a plurality of holes at the bottom of the hood, a copper foil electronic circuit layer to be bonded to the outside of the hood bottom, and the copper foil electronic circuit layer A plurality of LED elements installed on the upper surface of the substrate. The light emitting surfaces of the plurality of LED elements pass through the plurality of holes, respectively, and enter the inside of the hood made of the reflective sheet.

      The heat transfer medium is completely bonded to the inner surface of the side frame by the second surface. Among them, the copper foil electronic circuit layer is bonded to the first surface of the heat transfer medium with an insulating heat conductive adhesive. Thus, the heat generated when the plurality of LED elements emit light is conducted to the heat transfer medium through the copper foil electronic circuit layer and the insulating heat conductive adhesive, and then to the main frame from the heat transfer medium. Can do.

      The plurality of heat transfer strips are installed on the surface of the bottom plate of the main frame so as to face the plurality of LED elements and on a hood formed by refracting the reflection sheet. The hood bottom is bonded to a plurality of heat transfer strips.

      A third object of the present invention is to form a reflective layer in the light source group by aligning the heat transfer medium and at least one light source group with the main frame and using a coating or spraying process. Provided is a matching backlight module that can omit steps such as press forming of a reflective sheet employed in the prior art, and has good heat equalization and heat dissipation effects.

      In order to achieve the third object of the present invention, a matching backlight having a good heat equalization and heat dissipation effect, comprising a main frame, at least one light source group, one heat transfer medium, and solder from the inventor. Provide modules.

      The main frame includes at least one side frame and has good heat dissipation characteristics.

      At least one light source group is installed on the inner surface of at least one side frame of the main frame, and provides a back light source to a light guide plate installed in the main frame. The light source group includes a hood having a plurality of holes in the bottom of the hood, a reflective layer coated on the inner surface of the hood, a copper foil electronic circuit layer to be bonded to the outside of the hood bottom, and the copper foil electronics And a plurality of LED elements installed above the circuit layer. The light emitting surfaces of the plurality of LED elements are installed so as to pass through the plurality of holes and penetrate the inside of the hood.

      The heat transfer medium is completely bonded to the inner surface of the side frame by its surface. Among them, the copper foil electronic circuit layer is bonded to the first surface of the heat transfer medium with an insulating heat conductive adhesive. Thus, the heat generated when the plurality of LED elements emit light is conducted to the heat transfer medium through the copper foil electronic circuit layer and the insulating heat conductive adhesive, and then to the main frame from the heat transfer medium. Can do.

      The solder is formed between the second surface of the heat transfer medium and the inner surface of the side frame by a soldering method, thereby stably coupling the heat transfer medium to the inner surface of the side frame.

      A fourth object of the present invention is to align a plurality of heat transfer media and at least one light source group inside the main frame, and to form a plurality of holes on the main frame, thereby arranging the plurality of heat transfer media into the main frame. Provided is a matched backlight module having a good heat equalization and heat dissipation effect that can be extended to the outside of the light source and effectively releases the heat generated by the light source group by thermal convection with the outside air.

      In order to achieve the fourth object of the present invention, the main frame, at least one light source group, a hood, a plurality of LED elements, and a plurality of heat transfer media, a matching type having a good heat equalization and heat dissipation effect. Provide a backlight module.

      The main frame has at least one side frame and one bottom plate, and the bottom plate has a plurality of first holes.

      At least one light source group is installed on the bottom plate so as to be bonded to the side frame, and the light source group provides a rear light source to the light guide plate of the main frame.

      The light source group has a hood bottom, and the hood bottom is installed on the hood bottom by a hood having a plurality of second holes, a reflective layer formed inside the hood, and an insulating adhesive. And a copper foil electronic circuit layer in which a third hole portion is disposed to face the plurality of second hole portions.

      The plurality of LED elements are installed above the copper foil electronic circuit layer. The plurality of heat transfer media passes through the plurality of first holes, the plurality of second holes, and the plurality of third holes, penetrates the inside of the hood from the outside of the bottom plate, and a plurality of heat transfer media The LED element is contacted.

      Among them, when a plurality of LED elements emit light, the heat transfer medium conducts heat generated by the LED elements to the side frame and dissipates the heat through the main frame by a highly efficient heat transfer method. Furthermore, the heat generated by the LED element can be released simultaneously with heat convection between the heat transfer medium and the outside air.

      As a result, according to all the embodiments described below, the matched backlight module having good heat equalization and heat dissipation effect of the present invention is clearly disclosed, and further, from the above description, the present invention has the following advantages. It can be seen that

    (A) The present invention has no space between the light source group and the main frame by aligning at least one light source group with the main frame of the liquid crystal display device by the heat transfer medium. As a result, heat generated when the LED elements installed in the light source group emit light is transferred from the heat transfer medium to the main frame using a heat transfer method, and then the heat is released to the outside by the main frame. Has a good heat dissipation effect.

    (B) In the present invention, the heat transfer strip is laid on the bottom plate of the main frame, and the heat is transferred through the heat transfer strip, so that the heat is uniformly distributed to the main frame and the heat equalization effect can be achieved.

    (C) Following (a) above, the good heat radiation effect that the present invention can achieve can prevent the light guide plate and the chemical film inside the liquid crystal display device from being damaged by the heat storage phenomenon.

    (D) Following (b) above, the good soaking effect that the present invention can achieve can prevent the temperature difference phenomenon due to the heat storage phenomenon between the both ends of the light guide plate or the chemical film.

    (E) The present invention provides a plurality of embodiments, each of which can be applied to a liquid crystal display device of a direct type backlight module or a side light type backlight module.

    (F) Following the above (e), in Example 7 of the present invention, a reflective layer is formed inside the hood by coating or painting instead of the conventional reflective sheet, and the emitted light of the LED element is emitted. reflect.

It is the combination aspect figure (the 1) of the main frame of the LED backlight module of a prior art. It is the combination aspect figure (the 2) of the main frame of the LED backlight module of a prior art. It is a three-dimensional view of Example 1 of the alignment type backlight module having good soaking and heat dissipation effects of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a first embodiment of a matching backlight module having good soaking and heat dissipation effects according to the present invention. It is a side view of Example 2 of the alignment type backlight module provided with the favorable heat equalization and heat dissipation effect of this invention. It is a three-dimensional figure of Example 3 of the alignment type backlight module provided with the favorable heat equalization and heat dissipation effect of this invention. It is the side view (the 1) of Example 3 of the alignment type backlight module provided with the favorable soaking | uniform-heating and heat dissipation effect of this invention. It is the side view (the 2) of Example 3 of the alignment type backlight module provided with the favorable soaking | uniform-heating and heat dissipation effect of this invention. It is the side view (the 1) of Example 4 of the alignment type backlight module provided with the favorable heat equalization and heat dissipation effect of this invention. It is the side view (the 2) of Example 4 of the alignment type backlight module provided with the favorable heat equalization and heat dissipation effect of this invention. It is the side view (the 1) of Example 5 of the alignment type backlight module provided with the favorable soaking | uniform-heating and heat dissipation effect of this invention. It is the side view (the 2) of Example 5 of the alignment type backlight module provided with the favorable heat equalization and heat dissipation effect of this invention. It is a side view of Example 6 of the alignment type backlight module provided with the favorable heat equalization and heat dissipation effect of this invention. It is a three-dimensional view of Example 7 of the alignment type backlight module having good soaking and heat dissipation effects of the present invention. It is the side view (the 1) of Example 7 of the alignment type backlight module provided with the favorable soaking | uniform-heating and heat dissipation effect of this invention. It is the side view (the 2) of Example 7 of the alignment type backlight module provided with the favorable heat equalization and heat dissipation effect of this invention. It is a side view of Example 8 of the alignment type backlight module provided with the favorable soaking | uniform-heating and heat dissipation effect of this invention. It is a side view of Example 9 of the alignment type backlight module provided with the favorable soaking | uniform-heating and heat dissipation effect of this invention. It is a side view of Example 10 of the alignment type backlight module provided with the favorable soaking | uniform-heating and heat dissipation effect of this invention. It is a side view of Example 11 of the alignment type backlight module provided with the favorable soaking | uniform-heating and heat dissipation effect of this invention. It is a side view of Example 11 of the alignment type backlight module provided with the favorable soaking | uniform-heating and heat dissipation effect of this invention.

      A preferred embodiment of the present invention will now be described in detail with reference to the following drawings.

[Example]
The present invention has a plurality of embodiments.
First, a description will be given with reference to a three-dimensional view and a side view of the first embodiment of the alignment type backlight module having good soaking and heat dissipation effects of the present invention shown in FIGS.
As shown in FIGS. 3 and 4, the matching backlight module 1 having good heat equalization and heat dissipation effects includes a main frame 11, a light source group 12, a heat transfer medium 14, and solder 13.
Among them, the main frame 11 may use a member having good heat dissipation characteristics, such as iron, aluminum and ceramics. Further, as shown in FIG. 3, the side frame 112 of the main frame 11 is used for the combination of the light source groups 12, and a plurality of screw holes 1111 are formed on the side frame 111 of the main frame 11. The screw hole 1111 is used when the main frame 11 is incorporated in a liquid crystal display device.

      Continuing to refer to FIG. 3 and FIG. The solder 13 is a low-temperature solder paste or a high-temperature solder paste, and is formed on the side frame 112 by soldering. The heat transfer medium 14 is completely bonded to the solder 13 by the second surface 142. In addition, the light source group 12 is attached to the first surface 141 of the heat transfer medium 14 with an insulating heat conductive adhesive 123, and the rear light source is provided to the light guide plate inside the main frame 11. Among them, the insulating heat conductive adhesive 123 can be bonded to the first surface 141 entirely or locally. The light source group 12 is refracted to form a hood, and the hood bottom portion 1241 of the hood is bonded to the reflection sheet 124 having a plurality of holes and the outside of the hood bottom portion 124, and an insulating heat conductive adhesive 123. The copper foil electronic circuit layer 121 and the copper foil electronic circuit layer 121 are placed above the copper foil electronic circuit layer 121, and the light exit surface 1221 passes through a plurality of holes, and the inside 1241 of the hood made of the reflective sheet 124. A plurality of LED elements 12.

      What should be supplementarily described here is that the hood formed by bending the reflection sheet 124 in the embodiment of the matched backlight module 1 having the above-described good soaking and heat dissipation effect is an inverted U-shaped hood or An L-shaped hood may be used, and the heat transfer medium 14 may use any of the following metals. One surface is nickel-plated aluminum and the other surface is copper-plated aluminum and aluminum-nickel alloy. If the heat transfer medium 14 is an aluminum nickel alloy, there is no need for any treatment on its surface. On the other hand, when the heat transfer medium 14 is made of aluminum, the second surface 142 of the heat transfer medium 14 is made of nickel plating or copper plating in order to solder the heat transfer medium 14 of the aluminum member to the side frame 112. It is necessary to apply surface treatment.

      According to the above description, the first embodiment of the matching backlight module 1 having good soaking and heat dissipation effects is completely disclosed. About the structure of Example 1, when the plurality of LED elements 122 installed in the hood emit light, the generated heat is transferred through the copper foil electronic circuit layer 121 and the insulating heat conductive adhesive 123 by a heat transfer method. Conducted to the heat transfer medium 14. Moreover, the heat transfer medium 14 can be completely bonded to the inner surface of the side frame 112 by a soldering method. Thereby, there is no gap between the heat transfer medium 14 and the side frame 112. For this reason, the heat transfer process when the heat is continuously conducted to the main frame 11 by the heat transfer medium 14 is not hindered by the thermal resistance of the atmosphere. Therefore, after the heat transfer medium 14 effectively conducts heat to the main frame 11, the heat transfer medium 14 can release the heat to the outside due to good heat dissipation characteristics provided in the main frame 11.

And in order to accelerate the thermal radiation efficiency of the main frame 11, this invention provides further Example 2 of the alignment type backlight module provided with the favorable heat equalization and the thermal radiation effect.
A description will be given with reference to the side view of the second embodiment of the matching backlight module having good soaking and heat dissipation effects of the present invention shown in FIG.
As shown in FIG. 5, a member 16 having heat radiation characteristics is added to the first embodiment to complete the structure of the second embodiment of the matching backlight module 1 having good heat equalization and heat dissipation effects. The member 16 having thermal radiation characteristics can be coated on the entire outer surface of the main frame 11 or locally, and the member 16 having thermal radiation characteristics may be white paint and liquid diamond. Thereby, in the second embodiment, when the main frame 11 starts to dissipate heat, the member 16 having the heat radiation characteristic can help the main frame 11 to release heat to the outside by heat radiation and heat convection.

In addition, in the first embodiment of the matching backlight module having good soaking and heat dissipation effects, the light source group 12 conducts heat to the side frame 112 when conducting heat to the side frame 112 through the heat transfer medium 14. The generated heat can be released by a heat convection method, but the heat accumulated in the side frame 112 still forms a temperature difference between the side frame 112 and the bottom plate 111. For this reason, the present invention provides a third embodiment of a matching backlight module having good soaking and heat dissipation effects.
The alignment backlight module having good heat equalization and heat dissipation effects according to the present invention shown in FIGS. 6 and 7 will be described with reference to a three-dimensional view and a side view (No. 1).
As shown in FIGS. 6 and 7, a plurality of heat transfer strips 15 are added to the first embodiment to complete the structure of the third embodiment of the matched backlight module 1 having good heat equalization and heat dissipation effects. To do. Among them, members that manufacture the plurality of heat transfer strips 15 are, for example, copper, aluminum, and graphite are installed in the side frame 112 of the main frame 11. The plurality of heat transfer strips 15 are laid on the bottom plate 111 of the main frame 11 by a heat conductive adhesive 125. Among them, the heat transfer strip 15 can uniformly distribute the heat accumulated in the side frame 112 to the bottom plate 111. In addition to this, it should be particularly explained that the plurality of heat transfer strips 15 laid on the surface of the bottom plate 111 are not limited to being laid on the entire surface, but can be laid on the surface of the bottom plate 111 locally. .

      As shown in FIGS. 6 and 7, in the plurality of heat transfer strips 15, the heat conducted to the main frame 11 by the heat transfer medium 14 can be uniformly distributed on the bottom plate 111. Thereby, a remarkable temperature difference does not occur at any two positions on the bottom plate 111. Therefore, the matching backlight module 1 of the present invention has both heat dissipation and soaking characteristics. Therefore, if the matching backlight module 1 is applied to a liquid crystal display device, the thermal deposition problem between the backlight module of the prior art and the frame of the liquid crystal display device can be solved.

Next, description will be made with reference to a side view (No. 2) of the embodiment 3 of the matching backlight module having good heat equalization and heat dissipation effect according to the present invention shown in FIG.
Since the third embodiment of the matching backlight module having good heat equalization and heat dissipation described above achieves a better heat dissipation effect, the member 16 having the heat radiation characteristic is used in the third embodiment as in the second embodiment. In addition, the main frame 11 can be radiated by heat radiation and heat convection with the outside air through the member 16 having heat radiation characteristics.

The heat conduction of the first, second, and third embodiments of the matching backlight module having the good soaking and heat dissipation effects described above uses the heat transfer medium 14.
However, in practice, there are other implementation methods for conducting the heat generated by the light source group 12 to the side frame 112. For this reason, the present invention further provides a matched backlight module embodiment 4 having good soaking and heat dissipation effects, and conducts heat generated by the light source group 12 to the side frame 112.
A description will be given with reference to a side view (No. 1) of the embodiment 4 of the alignment type backlight module having good soaking and heat dissipation effects of the present invention shown in FIG.
As shown in FIG. 9, the embodiment 4 of the matching backlight module 1 having good soaking and heat dissipation effects includes a main frame 11, a heat transfer bonding material 17, a plurality of heat transfer strips 15, A light source group 12.

Among them, the structures and compositions of the main frame 11, the heat transfer strip 15, and the light source group 12 are the same as those described in the second embodiment.
As shown in FIG. 9, in Example 4 of the aligned backlight module 1 having good soaking and heat dissipation effects, the heat transfer coupling substance 17 is installed on the side frame 112 of the main frame 11 and at the same time the heat transfer coupling is performed. The substance 17 is placed on the bottom plate 111 of the main frame 11. The plurality of heat transfer strips 15 are installed on the side frame 112 by the heat transfer coupling material 17, and at the same time, the plurality of heat transfer strips 15 are installed on the surface of the bottom plate 111 by the heat transfer coupling material 17. In addition, the light source group 12 is bonded to the heat transfer strip 15 with an insulating heat conductive adhesive 123 bonded to the copper foil electronic circuit layer 121, and is installed on the side frame 112 via the heat transfer coupling material 17. be able to.

      In the fourth embodiment, the heat transfer strip 15 and the light source group 12 can be stably installed on the bottom plate 112 of the main frame 11 mainly by the heat transfer bonding material 17. Further, when the plurality of LED elements 122 emit light using such a coupling relationship, the plurality of heat transfer strips 15 conduct the heat generated by the LED elements 122 to the side frame 112 by a highly efficient heat transfer method. be able to. Thus, the heat conducted to the side frame 112 can be released to the outside using the heat dissipation characteristics of the main frame 11. In addition to this, heat can be further uniformly distributed to the bottom plate 111 via the heat transfer bonding material 17 and the heat transfer strip 15, and a significant temperature difference between any two positions on the main frame 111 can be avoided.

      Here, in particular, in the fourth embodiment of the matching backlight module 1 having good soaking and heat dissipation effects according to the present invention, the heat transfer bonding material 17 is, for example, a heat transfer plastic or a heat transfer solder. Alternatively, the heat transfer coupling substance 17 installed on the bottom plate 111 may be a method of locally covering the surface of the bottom plate 111 instead of laying the entire surface on the bottom plate 111. From this, it can be seen that the plurality of heat transfer strips 15 installed on the heat transfer coupling substance 17 may be installed on the entire surface or locally on the surface of the bottom plate 111.

Next, description will be made with reference to a side view (No. 2) of the embodiment 4 of the alignment type backlight module having good heat equalization and heat dissipation effect of the present invention shown in FIG.
In order to achieve a better heat dissipation effect in Example 4 of the matching backlight module 1 having the above-described good soaking and heat dissipation effects, a member 16 having heat radiation characteristics is additionally installed in Example 4, Heat dissipation of the main frame 11 can be aided by heat radiation and heat convection with the outside air via the member 16 having heat radiation characteristics. Among them, the member 16 having thermal radiation characteristics can be coated on the outer surface of the main frame 11 on the entire surface or locally.

In addition, the matching backlight module 1 having good soaking and heat dissipation effects of the present invention further includes another embodiment.
A description will be given with reference to a side view (No. 1) of Example 5 of the alignment backlight module having good heat equalization and heat dissipation effect according to the present invention shown in FIG.
As shown in FIG. 11, the fifth embodiment of the matching backlight module 1 with good soaking and heat dissipation effects of the present invention includes a main frame 11, solder 13, a heat transfer medium 14, and a plurality of pieces. A heat transfer strip 15 and a light source group 12 are provided. Among them, the solder 13 is soldered onto the side frame 112 and the side frame 112 of the main frame 11, and the heat transfer medium 14 is bonded onto the solder 13. The plurality of heat transfer strips 15 are further bonded to the surface of the heat transfer medium 14. Finally, the heat transfer strip 123 is further bonded to the copper foil electronic circuit layer 121 and the heat transfer strip 15. The light source group 12 may be installed on the side frame 112 of the main frame 11. In the fifth embodiment, the solder 13, the heat transfer medium 14 and the heat transfer strip 15 that are also installed on the bottom plate 111 can be soldered on the bottom plate 111 so as to be laid on the entire surface or locally.

Next, description will be made with reference to a side view (No. 2) of the fifth embodiment of the alignment type backlight module having good heat equalization and heat dissipation effect of the present invention shown in FIG.
As shown in FIG. 12, in order to achieve a better heat dissipation effect in the embodiment 5 of the matching backlight module 1 having the good soaking and heat dissipation effects described above, the member 16 having the heat radiation characteristic is implemented here. In addition to Example 5, heat radiation of the main frame 11 can be assisted by heat radiation and convection with the outside air through the member 16 having heat radiation characteristics.

As described above, a plurality of embodiments of the matching backlight module 1 having good soaking and heat dissipation effects have been disclosed. However, as shown in FIGS. The light source group 12 being used is a direct-type backlight module (direct-type backlight module).
This part should be explained in particular. The back light source of the matching backlight module 1 having good heat equalization and heat dissipation effect according to the present invention is not limited to the direct backlight module, and is practically a side light type. The backlight module (edge-type backlight module) can also be applied to the aligned backlight module 1 having good heat equalization and heat dissipation effects, and the back light source can be provided to the light guide plate.

In addition, conventionally, for example, a plurality of LED elements are accommodated using a hood such as an aluminum hood. Therefore, the matching backlight module 1 having a good heat equalization and heat dissipation effect using a metal hood is disclosed in the following description so that the present invention can be applied to a conventional manufacturing method.
A description will be given with reference to a side view of a sixth embodiment of the alignment backlight module having good soaking and heat dissipation effects according to the present invention shown in FIG.
As shown in FIG. 13, in the sixth embodiment of the present invention, an aligned backlight module having a metal hood is provided. Among them, the sixth embodiment of the alignment backlight module 1 having good heat equalization and heat dissipation effects includes a main frame 11a, solder 13a, a heat transfer medium 14a, and a light source group 12a.

      As shown in FIG. 13, the member of the main frame 11a may be iron, aluminum, or ceramics, and the main frame 11a has at least one side frame 112a and has good heat dissipation characteristics. The solder 13a is a low-temperature solder paste or a high-temperature solder paste, and the solder 13a is installed on the side frame 112a by a soldering method. The heat transfer medium 14a is completely bonded to the solder 13a by the second surface 142a.

      The light source group 12a is a direct-type back light module or a side light type backlight module. The light source group 12a is installed on the first surface 141a of the heat transfer medium 14a by an insulating heat conductive adhesive 123a, and the rear light source is provided to the light guide plate provided in the main frame 11a. Among them, the insulating heat conductive adhesive 123a can be bonded to the first surface 141a locally or entirely. The light source group 12a includes a hood 120a, a reflective layer 124a, a copper foil electronic circuit layer 121a, and a plurality of LED elements 122a. The hood 120a is a metal hood provided with a hood bottom 1241a. Among them, the hood bottom part 1241a has a plurality of holes. Unlike the reflective sheet of the prior art, in the sixth embodiment of the present invention, the reflective layer 124a is formed inside the hood 120a by coating, painting, or spraying. Thereby, when forming the reflective layer 124a in the inside of the hood 120a, the production step of the press molding of the reflective sheet is unnecessary. The copper foil electronic circuit layer 121a is bonded to the outside of the hood bottom portion 124a. The copper foil electronic circuit layer 121a is installed on the first surface 141a of the heat transfer medium 14a by an insulating heat conductive adhesive 123a. A plurality of LEDs and elements 122a are installed on the copper foil electronic circuit layer 121a. Each of the light emitting surfaces 1221a of the plurality of LED elements 122a passes through the plurality of holes and penetrates the inside of the hood 120a.

      According to the above description, the embodiment 6 of the matching backlight module 1 having good soaking and heat dissipation effects is completely disclosed. As shown in FIG. 6, similarly to Example 1 (that is, an example using a reflective sheet as a hood), in Example 6, when the plurality of LED elements 122 a emit light, the heat transfer medium 14 a is a highly efficient heat. The heat generated by the LED element 122a is transferred to the side frame 112a by the conduction method, and the heat is released to the outside by the heat dissipation characteristic of the main frame 11a.

Similarly, in the sixth embodiment of the aligned backlight module 1 having the above-described good soaking and heat dissipation effects, when the light source group 12a conducts heat to the side frame 112a through the heat transfer medium 14a, the side frame 112a The heat conducted to the side frame 112a can be released by a thermal convection method, but the heat accumulated in the side frame 112a still forms a temperature difference between the side frame 112a and the bottom plate 111a.
For this reason, the present invention provides a seventh embodiment of a matching backlight module having good soaking and heat dissipation effects.
14 and FIG. 15, a description will be given with reference to a three-dimensional view and a side view (No. 1) of a seventh embodiment of the matching backlight module having good heat equalization and heat dissipation effects of the present invention.
As shown in FIGS. 14 and 15, a plurality of heat transfer strips 15a are added to the sixth embodiment to complete the structure of the seventh embodiment of the aligned backlight module 1 having good heat equalization and heat dissipation effects. To do. Among the members, for example, copper, aluminum and graphite are installed on the side frame 112a of the main frame 11a as members for manufacturing the plurality of heat transfer strips 15a. The plurality of heat transfer strips 15a are laid on the bottom plate 111a of the main frame 11a by a heat conductive adhesive 125a. Among them, the heat transfer strip 15a can uniformly distribute the heat accumulated in the side frame 112a to the bottom plate 111a. In addition, it should be particularly explained that the plurality of heat transfer strips 15a laid on the surface of the bottom plate 111a are not limited to laying over the entire surface, but can be laid on the surface of the bottom plate 111a locally. .

Next, a description will be given with reference to a side view (No. 2) of the embodiment 7 of the alignment backlight module having good heat equalization and heat dissipation effect according to the present invention shown in FIG.
Similar to FIG. 5 described above, in the seventh embodiment of the aligned backlight module 1 having good soaking and heat dissipation effects, a member 16a having heat radiation characteristics is added to the outer surface of the main frame 11a, and heat radiation is performed. The heat radiation of the main frame 11a can be aided by the thermal radiation and thermal convection between the member 16a having characteristics and the outside air. Among them, the member 16a having thermal radiation characteristics can be coated on the entire outer surface or locally on the outer surface of the main frame 11a.

The present invention further provides Example 8.
A description will be given with reference to a side view of an embodiment 8 of the alignment type backlight module having good soaking and heat dissipation effects of the present invention shown in FIG.
As shown in FIG. 17, Example 8 of the alignment type backlight module having good soaking and heat dissipation effects includes a main frame 11b, a light source group 12b, and a plurality of heat transfer media 14b. Among them, the member of the main frame 11b may be, for example, iron, aluminum, or ceramics. It has at least one side frame 112b and a bottom plate 111b, and the bottom plate 111b has a plurality of first holes.

      The light source group 12b is installed on the bottom plate 111b so as to be bonded to the side frame 112b. The light source group 12b provides a light guide plate in which a rear light source is provided in the main frame 11b. A copper, aluminum, galvanized steel sheet or hot dip galvanized steel sheet formed in an inverted U-shape or L-shape, having a hood bottom 1201b, the hood bottom 1201b having a plurality of second holes; A plurality of third holes having a plurality of first holes and a plurality of second holes installed in the hood bottom 1201b by a reflective layer 124b formed inside the hood 120b and an insulating adhesive 123b. And a plurality of LED elements 122b each having two soldering locations 1221b and one heat sink 1222b. The plurality of LED elements 122b are installed on the copper foil electronic circuit layer 121b by two soldering locations 1221b.

      The plurality of heat transfer media 14b penetrates the inside of the hood 120b from the outside of the bottom plate 111b so as to pass through the plurality of first holes, the plurality of second holes, and the plurality of third holes, and the heat dissipation medium 13b. Thereby contacting the heat sinks 1222b of the plurality of LED elements 122b. Among them, the heat dissipation medium 13b may be, for example, a heat transfer paste or a solder paste. As in the other embodiments described above, the heat transfer medium 14b may be, for example, copper, aluminum plated with nickel on one surface, aluminum plated with copper on one surface, or nickel aluminum alloy. Furthermore, in Example 8, the heat transfer medium 14b forms a rivet shape or a rod shape, and passes through the first hole portion, the second hole portion, and the third hole portion. Thus, when the plurality of LED elements 122b emit light, the heat transfer medium 14b conducts heat generated by the LED elements 122b to the side frame 112b and dissipates the heat through the main frame 11b by a highly efficient heat conduction method. Furthermore, heat generated by the LED element can be released simultaneously with heat convection between the heat transfer medium 14b and the outside air.

Example 8 of the matching backlight module having good heat equalization and heat dissipation effect described above is to open a plurality of holes corresponding to each other in the bottom plate 111b, the hood bottom 1201b, and the copper foil electronic circuit layer 121b. The production process is somewhat difficult. For this reason, the present invention further provides a ninth embodiment.
A description will be given with reference to a side view of a ninth embodiment of the alignment backlight module having good heat equalization and heat dissipation effects according to the present invention shown in FIG.
As shown in FIG. 18, the structure of the ninth embodiment is similar to that of the eighth embodiment. The difference is that Example 9 does not open a hole in the bottom plate 111b and the hood bottom 1201b.

      In Example 9, a plurality of protrusions 1202b are formed on the hood bottom 1201b, and the plurality of protrusions 1202b pass through a plurality of third holes provided in the copper foil electronic circuit layer 121b. Through the heat sink 1222b of the plurality of LED elements 122b. The plurality of protrusions 1202b are for a heat transfer medium. When the plurality of LED elements 122b emit light, the plurality of protrusions 1202b transfer the heat generated by the LED elements 122b to the hood 120b by a high-efficiency heat conduction method, and then transfer heat from the hood 120b to the side frame 112b. Heat is released to the outside by the main frame 11b.

In addition, considering the complexity of forming a plurality of protrusions 1202b on the hood bottom 1201b, the present invention further provides Example 10.
A description will be given with reference to the side view of the embodiment 10 of the matching backlight module having good soaking and heat dissipation effects of the present invention shown in FIG.
As shown in FIG. 19, the structure of the tenth embodiment is similar to that of the ninth embodiment, except that in the tenth embodiment, a plurality of protrusions 1202 b are formed on the hood bottom 1201 b instead of a plurality of protrusions 1202 b. The heat transfer medium 14b is formed directly on the hood bottom 1201b. Similarly, the heat transfer medium 14b contacts the heat sink 1222b of the LED element 122b through the heat dissipation medium 13b and so as to pass through a plurality of third holes provided in the copper foil electronic circuit layer 121b. As a result, when the plurality of LED elements 122b emit light, the plurality of heat transfer media 14b transfer the heat generated by the LED elements 122b to the hood 120b by a highly efficient heat conduction method, and then continue from the hood 120b to the side frame 112b. After heat transfer, heat is released to the outside by the main frame 11b.

In addition, in order to accelerate the production process and reduce the production cost, the present invention further provides Example 11.
20A and 20B, description will be made with reference to a side view of the eleventh embodiment of the alignment backlight module having good soaking and heat dissipation effects of the present invention.
As shown in FIG. 20A, Example 11 of the alignment backlight module 1 having good soaking and heat dissipation effects includes a main frame 11c, a heat transfer strip 15c, and a light source group 12c. Of these, the main frame 11c includes a side frame 112c and a bottom plate 111c, as in the above-described embodiment. The heat transfer strip 15c has heat dissipation characteristics, and may be, for example, copper, aluminum, or graphite. In Example 11, the heat transfer strip 15c is refracted to form an L-shaped hood and is installed on the side frame 112c.

      Still referring to FIG. The light source group 12c is provided in a hood formed of a heat transfer strip 15c, and provides a light guide plate in which a rear light source is provided in the main frame 11c. Among them, the light source group 12c includes a copper foil electronic circuit layer 121c installed on the hood bottom 151c of the hood by an insulating heat conductive adhesive 123c, and a plurality of LED elements 122c installed on the copper foil electronic circuit layer 121c. And. Among them, the LED element 122c is either a direct type back light module LED element or a side light type backlight module LED element. In Example 11, the direct type back light module LED element 122c is used.

      Thereby, in Example 11 of the matching backlight module 1 having good soaking and heat dissipation effects, when the plurality of LED elements 122c emit light, the heat transfer strip 15c is formed by the high-efficiency heat conduction method. After the heat generated by the element 122c is transferred to the hood 120c, the heat is transferred from the hood 120c to the side frame 112c, and the main frame 11c releases the heat to the outside. In addition, it should be particularly explained that when the insulating heat conductive adhesive 123c is laid on the hood bottom 151c, it may be local or full. Further, when the reflective layer is formed inside the hood, any of a coating process, a painting process or a spraying process can be used.

      In addition, as shown in FIG. 20B, in Example 11 of the matched backlight module 1 having good soaking and heat dissipation effects, the heat transfer strip 15c is refracted to form an inverted U-shaped hood. Can be installed on the side frame 112c. At this time, in order for the light source group 12c to achieve a better light convergence effect, the reflective layer 14c may be additionally installed inside the hood formed of the heat transfer strip 15c. Thereby, the matching backlight module 1 having a good soaking and heat dissipation effect has a good light convergence effect at the same time.

      The foregoing detailed description describes preferred embodiments of the present invention. However, this embodiment does not add any limitation to the present invention. All applications or changes of the effect based on the technical idea of the present invention are included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Alignment type backlight module with good soaking and heat dissipation effect 11, 11a, 11b, 11c, 11 ′ Main frame 111, 111a, 111b, 111c Bottom plate 1111 Screw hole 112, 112a, 112b, 112c Side frame 12, 12a, 12b, 12c Light source group 12 'Backlight module 120a, 120b, 121' Hood 1201, 1, 241a, 1241b, 151c Hood bottom 1202b Protrusion 121, 121a, 121b, 121c Copper foil electronic circuit layer 122, 122a, 122b 122c, 123 'LED element 122' Electronic circuit board 1221, 1, 221a Light exit surface 1221b Soldering location 1222b Heat sink 123, 123a, 123c Insulating thermal conductive adhesive 123b Insulating adhesive 124 Reflective sheet 12 a, 124b, 14c Reflective layer 125, 125a Thermal conductive adhesive 13, 13a Solder 13b Heat dissipation medium 14, 14a, 14b Heat transfer medium 141, 141a First surface 142, 142a Second surface 15, 15a, 15c Heat transfer strip 16, 16a Members having heat radiation characteristics 17 Heat transfer bonding substance

Claims (57)

A matched backlight module with good soaking and heat dissipation,
A main frame having at least one side frame and having good heat dissipation characteristics;
Solder formed on the side frame by a soldering method; and
A heat transfer medium completely bonded to the solder by the second surface;
At least one light source group, which is bonded to the first surface of the heat transfer medium by an insulating heat conductive adhesive and provides a rear light source to a light guide plate provided in the main frame,
The light source group is refracted to form a hood, and the hood bottom of the hood has a reflective sheet having a plurality of holes, and
A copper foil electronic circuit layer, bonded to the bottom of the hood, and further bonded to the insulating heat conductive adhesive;
A plurality of LED elements that are installed on the copper foil electronic circuit layer, and each light exit surface passes through the plurality of hole portions and penetrates the inside of the hood made of the reflective sheet. Prepared,
When the plurality of LED elements emit light, the heat transfer medium transfers heat generated by the LED elements to the side frame by a highly efficient heat transfer method, and releases heat by the main frame. Characteristic matching backlight module with good heat equalization and heat dissipation.       A plurality of heat transfer strips installed on the side frame of the main frame, the plurality of heat transfer strips installed on the surface of the bottom plate of the main frame by the heat conductive adhesive; The heat transfer strip is installed on a surface of the bottom plate of the main frame by the heat conductive adhesive, and heat conducted to the side frame is uniformly distributed on the bottom plate. Matched backlight module with good thermal uniformity and heat dissipation as described.       3. The good heat equalization and heat radiation according to claim 2, wherein when the plurality of heat transfer strips are laid on the surface of the bottom plate, either a local laying method or a full laying method can be used. Aligned backlight module with effects.       2. The matched backlight module with good heat equalization and heat dissipation effect according to claim 1, wherein the main frame member can be selected from iron, aluminum and ceramics.       2. The good leveling of claim 1, wherein the heat transfer strip is selected from copper, aluminum plated with nickel on one surface, aluminum plated with copper on one surface, and nickel aluminum alloy. Aligned backlight module with heat and heat dissipation effect.       2. The matching with good heat equalization and heat dissipation effect according to claim 1, wherein the hood formed by refracting the reflection sheet can be selected from an inverted U-shaped hood or an L-shaped hood. Shaped backlight module.       The matched backlight module having good heat equalization and heat dissipation effect according to claim 1, wherein the solder member can be selected from either a low-temperature solder paste or a high-temperature solder paste.       3. The matched backlight module with good heat equalization and heat dissipation effect according to claim 2, wherein the heat transfer strip member can be selected from copper, aluminum and graphite.       2. The matched backlight module having good heat equalization and heat dissipation effects according to claim 1, wherein the light source group can be either a direct-type backlight module or a sidelight backlight module.       2. The matching backlight module according to claim 1, wherein the outer surface of the main frame is further coated with a member having heat radiation characteristics.       11. The matched backlight module having good heat equalization and heat dissipation effect according to claim 10, wherein the member having the heat radiation characteristic can be selected from white paint or liquid diamond. A matched backlight module with good soaking and heat dissipation,
A main frame having at least one side frame and having good heat dissipation characteristics;
Installed on the side frame of the main frame and installed on the bottom plate of the main frame,
A plurality of heat transfer strips, which are installed on the side frame by the heat transfer coupling material, and are installed on the bottom plate by the heat transfer coupling material, and
At least one light source group installed on the side frame of the main frame and providing a rear light source to the light guide plate of the main frame;
The light source group is refracted to form a hood, and the hood bottom of the hood has a reflective sheet having a plurality of holes, and
A copper foil electronic circuit layer that is attached to the outside of the bottom of the hood and installed on the heat transfer strip by an insulating heat conductive adhesive,
A plurality of LED elements that are installed on the copper foil electronic circuit layer, and each light exit surface passes through a plurality of holes and penetrates into the inside of the hood made of the reflective sheet. ,
With the heat transfer bonding material, the heat transfer strip and the light source group can be stably installed on the side frame of the main frame, and when the plurality of LED elements emit light, the plurality of heat transfer strips have high efficiency. The heat transfer method transfers heat generated by the LED element to the side frame, and heat can be uniformly distributed to the bottom plate through the heat transfer bonding material and the heat transfer strip. Aligned backlight module with good soaking and heat dissipation.       13. The good heat equalization and heat dissipation according to claim 12, wherein when the plurality of heat transfer strips are laid on the surface of the bottom plate, either a local laying method or a full laying method can be used. Aligned backlight module with effects.       The aligned backlight module having good heat equalization and heat dissipation effect according to claim 12, wherein the main frame member can be selected from iron, aluminum, and ceramics.       The hood formed by refracting the reflection sheet can be selected from an inverted U-shaped hood or an L-shaped hood. Shaped backlight module.       The matched backlight module having good heat equalization and heat dissipation effect according to claim 12, wherein the heat transfer bonding material can be selected from heat conductive adhesive and solder.       13. The matched backlight module with good heat equalization and heat dissipation effect according to claim 12, wherein the heat transfer strip member can be selected from copper, aluminum and graphite.       The matched backlight module with good heat equalization and heat dissipation effect according to claim 12, wherein the light source group can be selected from either a direct backlight module or a sidelight backlight module.       13. The matching backlight module according to claim 12, wherein the outer surface of the main frame is further coated with a member having heat radiation characteristics.       20. The matched backlight module with good heat equalization and heat dissipation effect according to claim 19, wherein the member having the heat radiation characteristic can be selected from white paint or liquid diamond. A matched backlight module with good soaking and heat dissipation,
A main frame having at least one side frame and one bottom plate and having good heat dissipation characteristics;
At the same time, solder to solder on the side frame and the bottom plate,
A heat transfer medium that is completely bonded to the solder by the second surface;
A plurality of heat transfer strips that are fully bonded to the first surface of the heat transfer medium;
At least one light source group installed on the side frame and providing a rear light source to the light guide plate of the main frame;
The light source group is refracted to form a hood, and the hood bottom of the hood has a reflective sheet having a plurality of holes, and
A copper foil electronic circuit layer that is attached to the outside of the bottom of the hood and installed on the heat transfer strip by an insulating heat conductive adhesive,
A plurality of LED elements that are installed on the copper foil electronic circuit layer, and each light exit surface passes through a plurality of holes and penetrates into the inside of the hood made of the reflective sheet. ,
When the plurality of LED elements emit light, the heat transfer strip and the heat transfer medium installed in the side frame transfer heat generated by the LED elements to the side frame by a highly efficient heat transfer method. With the heat transfer strip and the heat transfer medium installed on the bottom plate, heat can be transferred to the side frame and distributed uniformly on the bottom plate. Aligned backlight module.       [22] The method according to claim 21, wherein when the solder is laid on the surface of the bottom plate, the solder can be laid locally or entirely. Aligned backlight module.       The good heat equalization and heat dissipation according to claim 21, wherein when the plurality of heat transfer strips are laid on the surface of the solder, the heat radiating strip can be either locally or entirely laid. Aligned backlight module with effects.       The aligned backlight module with good heat equalization and heat dissipation effect according to claim 21, wherein the main frame member can be selected from iron, aluminum and ceramics.       The good heat-dissipating strip according to claim 21, wherein the heat transfer strip can be selected from the group consisting of copper, aluminum plated with nickel on one surface, aluminum plated with copper on one surface, and nickel aluminum alloy. Aligned backlight module with heat and heat dissipation effect.       [22] The matching with good heat equalization and heat radiation effect according to claim 21, wherein the hood formed by refracting the reflection sheet can be selected from an inverted U-shaped hood or an L-shaped hood. Shaped backlight module.       The matched backlight module with good heat equalization and heat dissipation effect according to claim 21, wherein the heat transfer strip member can be selected from copper, aluminum and graphite.       [22] The matched backlight module having good heat equalization and heat dissipation effects according to claim 21, wherein the light source group can be either a direct backlight module or a sidelight backlight module.       The matched backlight module with good heat equalization and heat dissipation effect according to claim 21, wherein the outer surface of the main frame is further coated with a member having thermal radiation characteristics.       30. The matched backlight module with good heat equalization and heat dissipation effect according to claim 29, wherein the member having the heat radiation characteristic can be selected from white paint or liquid diamond. A matched backlight module with good soaking and heat dissipation,
A main frame having at least one side frame and having good heat dissipation characteristics;
Solder formed on the side frame by a soldering method;
A heat transfer medium completely bonded to the solder by the second surface;
At least one light source group, which is bonded to the first surface of the heat transfer medium by an insulating heat conductive adhesive and provides a rear light source to a light guide plate provided in the main frame,
The light source group has a hood bottom, and the hood bottom has a hood with a plurality of holes, and
A reflective layer formed inside the hood;
A copper foil electronic circuit layer, which is attached to the outside of the bottom of the hood and installed on the first surface of the heat transfer medium by an insulating heat conductive adhesive;
A plurality of LED elements that are installed on the copper foil electronic circuit layer, and each light exit surface passes through a plurality of holes and penetrates into the inside of the hood made of the reflective sheet. ,
When the plurality of LED elements emit light, the heat transfer medium transfers heat generated by the LED elements to the side frame by a highly efficient heat transfer method, and releases heat by the main frame. Characteristic matching backlight module with good heat equalization and heat dissipation.       The heat conductive adhesive further includes a plurality of heat transfer strips installed on the inner surface of at least one side frame of the main frame, and the plurality of heat transfer strips are installed on the surface of the bottom plate of the main frame. 32. The matched backlight module with good heat equalization and heat dissipation effect according to claim 31, wherein the heat conducted to the side frame is uniformly distributed on the bottom plate.       33. Good heat equalization and heat dissipation according to claim 32, wherein when the plurality of heat transfer strips are laid on the surface of the bottom plate, either a local laying method or a full laying method can be used. Aligned backlight module with effects.       32. The matched backlight module with good heat equalization and heat dissipation effect according to claim 31, wherein the main frame member can be selected from iron, aluminum, and ceramics.       The heat transfer medium according to claim 31, wherein the heat transfer medium can be selected from one of nickel plated aluminum, one copper plated aluminum, and nickel aluminum alloy. Aligned backlight module with heat dissipation effect.       32. The matched backlight module with good heat equalization and heat dissipation effect according to claim 31, wherein the heat transfer strip member can be selected from copper, aluminum or graphite.       32. The matched backlight module with good heat equalization and heat dissipation effect according to claim 31, wherein the light source group can be selected from either a direct backlight module or a sidelight backlight module.       32. The matching with good heat equalization and heat dissipation effect according to claim 31, wherein when the reflective layer is formed in the hood, any one of coating, painting and spraying can be selected. Shaped backlight module.       32. Good heat equalization and heat dissipation according to claim 31, wherein when the insulating heat conductive adhesive is bonded to the first surface of the heat transfer medium, either local or full surface is selected. Aligned backlight module with effects.       32. The matched backlight module with good heat equalization and heat dissipation effect according to claim 31, wherein the outer surface of the main frame is further coated with a member having heat radiation characteristics. A matched backlight module with good soaking and heat dissipation,
A main frame having at least one side frame and one bottom plate, the bottom plate having a plurality of first holes;
At least one light source group provided on the bottom plate so as to be bonded to the side frame, and providing a back light source to the light guide plate of the main frame,
The light source group has a hood bottom, and the hood bottom has a hood with a plurality of holes, and
A reflective layer formed inside the hood;
A copper foil electronic circuit layer having a plurality of third holes disposed on the bottom of the hood and facing the plurality of first holes and the plurality of second holes by an insulating adhesive;
A plurality of LED elements having a soldering place and a heat sink, and installed on the copper foil electronic circuit layer by the soldering place;
A plurality of first hole portions, a plurality of second hole portions, and a plurality of third hole portions are passed through the inside of the hood from the bottom plate, and the heat sink of the plurality of LED elements is formed by a heat dissipation medium. A plurality of heat transfer media in contact;
When a plurality of the LED elements emits light, the heat transfer medium transfers heat generated by the LED elements to the side frame by a highly efficient heat transfer method, and releases heat by the main frame,
And, by performing heat convection with the outside air through the heat transfer medium, the heat generated by the LED element can be released to the outside at the same time. Backlight module.       42. The matched backlight module with good heat equalization and heat dissipation effect according to claim 41, wherein the hood can be selected from an L-shaped hood or an inverted U-shaped hood.       43. The matched backlight module with good heat equalization and heat dissipation effect according to claim 42, wherein the hood member can be selected from copper, aluminum, and electroplated galvanized steel sheet.       42. The good material according to claim 41, wherein the member of the heat transfer medium can be selected from copper, aluminum plated with nickel on one surface, aluminum plated with copper on one surface, and nickel aluminum alloy. Aligned backlight module with uniform soaking and heat dissipation.       42. The matching backlight module according to claim 41, wherein the member of the heat dissipation medium can be selected from heat transfer paste or solder paste. A matched backlight module with good soaking and heat dissipation,
A main frame having at least one side frame and one bottom plate;
At least one light source group provided on the bottom plate so as to be bonded to the side frame, and providing a back light source to the light guide plate of the main frame,
The light source group has a hood bottom, and the hood bottom is formed with a plurality of heat transfer media;
A reflective layer formed inside the hood;
A copper foil electronic circuit layer installed on the bottom of the hood and facing the plurality of third holes by an insulating adhesive;
A plurality of LED elements installed on the copper foil electronic circuit layer.
The plurality of heat transfer media are in contact with the plurality of LED elements by a heat dissipation medium, and when the plurality of LED elements emit light, the heat transfer medium generates the LED elements by a highly efficient heat conduction method. Heat is transferred to the hood, and then the heat is transferred from the hood to the side frame and then released to the outside by the main frame. Equipped with an integrated backlight module.       47. The matched backlight module with good heat equalization and heat dissipation effect according to claim 46, wherein the hood can be selected from an L-shaped hood and an inverted U-shaped hood.       48. The matched backlight module with good heat equalization and heat dissipation effect according to claim 47, wherein the hood member can be selected from copper, electroplated galvanized steel sheet, hot dip galvanized steel sheet or aluminum. .       The matched backlight module with good heat equalization and heat dissipation effect according to claim 46, wherein the heat dissipation medium member can be selected from heat transfer paste or solder paste.       The good material according to claim 46, wherein the member of the heat transfer medium can be selected from the group consisting of copper, aluminum plated with nickel on one surface, aluminum plated with copper on one surface, and nickel aluminum alloy. Aligned backlight module with uniform soaking and heat dissipation.       47. The matching with good heat equalization and heat dissipation effect according to claim 46, wherein when the reflective layer is formed in the hood, any one of coating, painting and spraying can be selected. Shaped backlight module. A matched backlight module with good soaking and heat dissipation,
A main frame having at least one side frame and one bottom plate;
A heat transfer strip having heat dissipation characteristics, refracted to form a hood, and installed on the side frame;
At least one light source group provided on the hood composed of the heat transfer strip and providing a rear light source to the light guide plate of the main frame;
The light source group is a copper foil electronic circuit layer installed on the hood bottom of the hood by an insulating heat conductive adhesive;
A plurality of LED elements installed on the copper foil electronic circuit layer, and
When the plurality of LED elements emit light, the heat transfer strip transfers heat generated by the LED elements to the hood by a highly efficient heat transfer method, and then transfers heat to the side frame by the hood. An aligned backlight module having good soaking and heat dissipation effects, wherein heat is released by the main frame.       53. The matched backlight module with good heat equalization and heat dissipation effect according to claim 52, wherein the member of the heat transfer strip can be selected from copper, aluminum or graphite.       53. The matched backlight module with good heat equalization and heat dissipation effect according to claim 52, further comprising a reflective layer provided in the hood made of the heat transfer strip.       53. The matching type with good heat equalization and heat dissipation effect according to claim 52, wherein when the insulating heat conductive adhesive is bonded to the bottom of the hood, either local or full surface is selected. Backlight module.       54. The matching with good heat equalization and heat dissipation effect according to claim 53, wherein when the reflective layer is formed in the hood, any one of covering, painting and spraying can be selected. Shaped backlight module.       The hood formed by refracting the heat transfer strip can be selected from an L-shaped hood and an inverted U-shaped hood. Aligned backlight module.

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