CN102313206B - LED backlight module - Google Patents
LED backlight module Download PDFInfo
- Publication number
- CN102313206B CN102313206B CN201110188324.9A CN201110188324A CN102313206B CN 102313206 B CN102313206 B CN 102313206B CN 201110188324 A CN201110188324 A CN 201110188324A CN 102313206 B CN102313206 B CN 102313206B
- Authority
- CN
- China
- Prior art keywords
- emitted light
- light diode
- utilizing emitted
- dissipating layer
- backlight module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
Abstract
The invention provides an LED BLU which has a heat-dissipating layer containing heat-dissipating paints between an LED bar and an extrusion bar. In addition, the invention provides a display device comprising the LED BLU structure. The invention has the following advantages that the difference between the temperature of the edge portion attached with the LED and the central portion of a light guide plate is reduced, and furthermore the defects of a sheet are improved. In this way, the problems can be solved of poor light leakage, bending or distorting of LED BLU components, etc.
Description
Technical field
The present invention relates to a kind of LED-backlit module.
Background technology
Liquid crystal display (Liquid Crystal Display, be designated hereinafter simply as LCD) by backlight module (Back Light Unit, be designated hereinafter simply as BLU) and liquid crystal panel formation, LCD itself does not possess luminous characteristic, therefore needs light source.Provide the structure of above-mentioned light source to be called BLU.The thermal value producing under the light of in the past launching in the fluorescent tube of one of BLU parts is also few, and the LCD panel of employing utilizing emitted light diode (Light Emitted Diode:LED) light source, its heating is serious, the temperature of edge (edge) part and the temperature difference of light guide plate (LightGuide Plate, is designated hereinafter simply as LGP) middle body that make to be attached with LED are very large.Thin plate (Sheet) bad phenomenon occurring thus, causes occurring that light leak is bad, the problem such as bending or distortion of BLU parts.
Summary of the invention
The present invention proposes in order to address the above problem, and its object is, provide a kind of can reduce be attached with the marginal portion temperature of LED and light guide plate middle body temperature difference there is the bad LED-backlit module of improving effect of thin plate.
In order to achieve the above object, the invention provides a kind of LED BLU that forms the heat dissipating layer that comprises heat radiation coating between LED rod and extruded rod.
And, the invention provides a kind of display device that comprises above-mentioned LED BLU structure.
The invention provides a kind of LED BLU that forms the heat dissipating layer that comprises heat radiation coating between LED rod and extruded rod, tool has the following advantages thus: reduce and be attached with the temperature of marginal portion and the temperature difference of light guide plate middle body of LED, and then present the bad phenomenon of improving of thin plate.Therefore, can solve that light leak is bad, the problem such as bending or distortion of LED-backlit modular unit.
Brief description of the drawings
Fig. 1 is the skeleton diagram that is illustrated in a part for the LED BLU side that possesses heat dissipating layer between LED rod and extruded rod.
Fig. 2 and Fig. 3 are the skeleton diagram that represents to possess between LED rod and extruded rod a part for the LED BLU side of fastener and heat dissipating layer.
Fig. 4 and Fig. 5 be for to possess heat dissipating layer between LED rod and extruded rod, and possess the skeleton diagram of a part for the LED BLU side of heat dissipating layer in the another side of extruded rod.
Reference numeral
10:LED 20:LED rod
30: extruded rod 40: heat dissipating layer
50: fastener 60: heat dissipating layer
Embodiment
Below, the present invention is described in detail.
According to one embodiment of present invention, provide a kind of LED (Light Emitted Diode) backlight module (BackLight Unit: be designated hereinafter simply as BLU) that possesses the heat dissipating layer that comprises heat radiation coating between LED rod and extruded rod.
Wherein, heat dissipating layer refers to the principle with hot conduction, convection current, radiation, helps to discharge the hot structure that pyrotoxin produces.
According to one embodiment of present invention, preferably, above-mentioned heat dissipating layer should be with bounding force fixed L ED rod and extruded rod more than 0.5kgf/25mm.In the time of the not enough 0.5kgf/25mm of bounding force, bounding force a little less than, cannot fixed L ED rod and extruded rod.
In one embodiment of the invention, can be fixed with extruded rod above-mentioned LED rod by multiple fasteners.
In one embodiment of the invention, between above-mentioned LED rod and extruded rod, exist due to the gap that adopts fastener to produce, heat dissipating layer is formed between above-mentioned gap, and above-mentioned heat dissipating layer is located at the position that does not adopt fastener.For the problem existing in BLU in the past,, owing to not possessing heat dissipating layer and due to the bending, the distortion problem that adopt gap that fastener produces to cause between LED rod and extruded rod, by forming heat dissipating layer at the position that does not adopt fastener, can reduce bending, the distortion problem of backlight module.And heat dissipating layer can, by the heat being generated by LED rod, conduct to extruded rod, and then effectively bring into play heat sinking function.
In one embodiment of the invention, provide the LED BLU that possesses the heat dissipating layer that comprises heat radiation coating in the another side of above-mentioned extruded rod.In this case, possess the heat dissipating layer that comprises heat radiation coating between LED rod and extruded rod, and also possess in the another side of extruded rod the heat dissipating layer that comprises heat radiation coating, radiating effect further improves thus.
And, between LED rod and extruded rod, exist due to the gap that adopts fastener to produce, heat dissipating layer is formed between above-mentioned gap, above-mentioned heat dissipating layer is located at the position that does not adopt fastener, the another side of above-mentioned extruded rod possesses the heat dissipating layer that comprises heat radiation coating, and radiating effect is further improved.
Radiating principle is in the past the heat that pyrotoxin is generated, and disperses along horizontal direction, makes the periphery to pyrotoxin by thermal diffusion, and then reduces the temperature of heating position.But according to content of the present invention, the heat being produced by LED rod, by heat dissipating layer, and conducts to extruded rod with degree and vertical direction, again, by heat dissipating layer, conducts and is released in air with degree and vertical direction, can effectively reduce the temperature of heating position.When heat dissipating layer is in the situation of the single or double adhesive tape that comprises heat radiation coating and bonding coat, the heat of generation will be by the heat-radiation coating bed of material and bonding coat, to degree and vertical direction conduction.
In one embodiment of the invention, selection for above-mentioned heat radiation coating does not limit, for example, oleic series or the graphite (Graphite) that can use similar organosilyl rubber (Rubber) series, similar foam tape (Foamtape), preferably use the outstanding graphite of heat-conductive characteristic.There is the problem of frangible cracky in graphite, should possess the fluidity of coating when therefore comprising graphite.Aspect physical property, owing to thering is the fluidity of coating, can adopt the method for coating form heat dissipating layer or make heat-radiation belt, have advantages of and can adjust thickness.In the present invention, (DYBRID CAB-02, Dajin Kemis) is used as to heat radiation coating.
In one embodiment of the invention, above-mentioned heat dissipating layer is that the heat-radiation belt that includes bonding coat by stickup forms, and the bonding coat of above-mentioned heat-radiation belt directly contacts with above-mentioned LED rod or extruded rod.
Above-mentioned heat-radiation belt can be one side adhesive tape or double sticky tape.Only form the one side adhesive tape of bonding coat in the one side of heat dissipating layer, should be with multiple fastener fixed L ED rods and extruded rod.
In one embodiment of the invention, between its heat dissipating layer of above-mentioned heat-radiation belt and bonding coat, also comprise metal base, above-mentioned metal base is unrestricted, but is likely reticulate texture.
Above-mentioned metal base is unrestricted, preferably should adopt a kind of simple metal in the group who selects free nickel, iron, aluminium, tin, zinc, tungsten, gold, copper and silver composition or two or more alloys.
In one embodiment of the invention, above-mentioned bonding coat is formed by the thermally conductive adhesive that comprises resin of binding property and heat radiation coating.Above-mentioned resin of binding property is unrestricted, preferably should adopt one or more in the group who selects free acrylic adhesive, polyurethane series bonding agent and silicon-type bonding agent composition.
One embodiment of the present of invention are the display device that comprise above-mentioned LED BLU.Above-mentioned display device, because edge (edge) part and the temperature difference of central (center) part reduce to some extent, presents the bad effect of improving of thin plate of LED BLU.
Below, with reference to embodiments of the invention, the present invention is described in detail.General technical staff of the technical field of the invention should understand, and the present embodiment is only for improving disclosure of the present invention, and scope of the present invention is not limited to the embodiment of the following stated.
Test example 1: the mensuration of radiating effect
Use between bolt fixed L ED rod and extruded rod, do not carry out the situation (comparative example 1) of radiating treatment, between LED rod and extruded rod, do not carry out radiating treatment, only at the outside bonding (SPREADEFSHIELD of heat-radiation belt in the past of extruded rod, E-Graft company of U.S. product) situation (comparative example 2), after 1 hour, measure the temperature of backlight module marginal portion and display device middle body, carry out degree of heat radiation test.
In the aluminum chassis LED rod that is attached with LED and aluminum chassis extruded rod, form heat dissipating layer, after after an hour, measure the temperature of backlight module marginal portion and display device middle body, carry out degree of heat radiation test (embodiment 1～8).
Between LED rod and extruded rod, with 10cm interval, set bolt, bonding heat-radiation belt (SPREADEFSHIELD, E-Graft company of U.S. product) (embodiment 1) in the past between bolt.Between LED rod and extruded rod, with 10cm interval, set bolt, to LED rod and extruded rod coating heat radiation coating (DYBRID CAB-02, Dajin Kemis), forms heat dissipating layer (embodiment 2) between each bolt.Between LED rod and extruded rod, with 10cm interval, set bolt, to LED rod and the bonding one side heat-radiation belt of extruded rod, forms heat dissipating layer between each bolt.Above-mentioned one side heat-radiation belt, two-sided at nickel screen equipment, the thickness by heat radiation coating with 25 μ m, utilizes gravure coating machine to carry out gravure coating, carries out comma cutter coating formation bonding coat at the heat-radiation coating bed of material of one side with the thickness of 20 μ m.Above-mentioned bonding coat uses and acryl resin 50 % by weight is mixed to the thermally conductive adhesive that manufacture forms with heat radiation coating 50 % by weight and carry out coating (embodiment 3).Between LED rod and extruded rod, do not use bolt, in the heat-radiation belt of embodiment 3, carry out coated on both sides and the two-side radiation band manufactured forms heat dissipating layer with bonding coat, only with bounding force fixed L ED rod and extruded rod (embodiment 4).
In above-described embodiment 1, heat-radiation belt (SPREADEFSHIELD, E-Graft company of U.S. product) is bonded in to the another side (embodiment 5) of extruded rod.In above-described embodiment 2, by heat radiation coating coating in the another side of extruded rod (embodiment 6).In above-described embodiment 3, by one side heat radiation coating coating in the another side of extruded rod (embodiment 7).In above-described embodiment 4, one side heat-radiation belt is bonded in to the another side (embodiment 8) of extruded rod.
Following table 1 is the temperature measuring result of above-mentioned BLU marginal portion and display device middle body.
Table 1
Test example 2: the bad improvement degree of thin plate
Table 2 is that the thin plate of comparative example 1～2 and embodiment 1～8 improves effect.
Table 2
X: the bad generation of thin plate is more than 50%
△: the bad generation of thin plate is more than 30%
Zero: the bad generation of thin plate is more than 15%
◎: the bad generation of thin plate is below 15%
Above specific part of the present invention is had been described in detail, but it should be pointed out that for general technical staff of the technical field of the invention, above-mentioned explanation is only the preferred embodiments of the present invention, and scope of the present invention is not limited to described embodiment.Therefore the scope that, the present invention will show protection is by claims and be equal to replace and decide.
Claims (9)
1. a utilizing emitted light diode backlight module, is characterized in that, possesses the heat dissipating layer that comprises heat radiation coating between utilizing emitted light diode bar and extruded rod;
By multiple fasteners, described utilizing emitted light diode bar and extruded rod are fixed;
Between described utilizing emitted light diode bar and extruded rod, exist due to the gap that adopts fastener to produce;
Heat dissipating layer is formed between described gap, and described heat dissipating layer is located at the position that does not adopt fastener;
Described heat dissipating layer is that the heat-radiation belt that includes bonding coat by stickup forms;
The bonding coat of described heat-radiation belt directly contacts with described utilizing emitted light diode rod or extruded rod;
Described heat-radiation belt also comprises cancellated metal base between heat dissipating layer and bonding coat.
2. utilizing emitted light diode backlight module according to claim 1, is characterized in that, described heat dissipating layer is fixed utilizing emitted light diode bar and extruded rod with bounding force more than 0.5kgf/25mm.
3. utilizing emitted light diode backlight module according to claim 1, is characterized in that, the another side of described extruded rod possesses the heat dissipating layer that comprises heat radiation coating.
4. according to the utilizing emitted light diode backlight module described in any one in claims 1 to 3, it is characterized in that, described heat radiation coating comprises graphite.
5. utilizing emitted light diode backlight module according to claim 1, is characterized in that, described metal base is to select a kind of simple metal in the group of free nickel, iron, aluminium, tin, zinc, tungsten, gold, copper and silver composition or two or more alloys.
6. utilizing emitted light diode backlight module according to claim 1, is characterized in that, described bonding coat is formed by the thermally conductive adhesive that comprises resin of binding property and heat radiation coating.
7. utilizing emitted light diode backlight module according to claim 6, is characterized in that, described resin of binding property is to select more than one in the group of free acrylic adhesive, polyurethane series bonding agent and silicon-type bonding agent composition.
8. a display device, is characterized in that, the utilizing emitted light diode backlight module structure that comprises any one in claims 1 to 3.
9. display device according to claim 8, is characterized in that, because the temperature difference of marginal portion and middle body reduces to some extent, thereby presents the bad effect of improving of thin plate of utilizing emitted light diode backlight module.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100066321A KR101136316B1 (en) | 2010-07-09 | 2010-07-09 | Light emitted diode back light unit |
| KR10-2010-0066321 | 2010-07-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102313206A CN102313206A (en) | 2012-01-11 |
| CN102313206B true CN102313206B (en) | 2014-08-06 |
Family
ID=45426616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110188324.9A Active CN102313206B (en) | 2010-07-09 | 2011-07-04 | LED backlight module |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101136316B1 (en) |
| CN (1) | CN102313206B (en) |
| TW (1) | TWI459090B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140141283A (en) | 2013-05-31 | 2014-12-10 | 삼성디스플레이 주식회사 | Display device |
| KR101447177B1 (en) | 2014-07-29 | 2014-10-06 | 주식회사 영남엘이디라이팅 | Hybrid LED face lighting apparatus based on complex plastic with PLA coated high efficiency thermally conductive composition and high efficiency thermal-conductive micro-line for improving heat radiation performance |
| CN104763933A (en) * | 2015-04-15 | 2015-07-08 | 东莞市闻誉实业有限公司 | Fresco lamp |
| CN104763936A (en) * | 2015-04-15 | 2015-07-08 | 东莞市闻誉实业有限公司 | Decorative lamp |
| KR20170002412U (en) | 2015-12-24 | 2017-07-04 | 정좌용 | One touch-type jighead fishing tackle |
| KR20160002940U (en) | 2016-08-03 | 2016-08-23 | 정좌용 | One touch-type lure fishing tackle |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI224384B (en) * | 2002-01-22 | 2004-11-21 | Shinetsu Chemical Co | Heat-dissipating member, manufacturing method and installation method |
| JP2004233810A (en) * | 2003-01-31 | 2004-08-19 | Seiko Epson Corp | Surface light source unit, electrooptical device, and electronic device |
| JP2006011242A (en) * | 2004-06-29 | 2006-01-12 | Kyocera Corp | Liquid crystal display device |
| JP4683969B2 (en) * | 2005-03-18 | 2011-05-18 | 京セラ株式会社 | Liquid crystal display |
| KR100752009B1 (en) * | 2006-03-06 | 2007-08-28 | 삼성전기주식회사 | Backlight unit provided with light emitting diodes thereon |
| KR20070117335A (en) * | 2006-06-08 | 2007-12-12 | 삼성에스디아이 주식회사 | Light emission device and liquid crystal display device using the same as back light unit |
| JP2008060204A (en) * | 2006-08-30 | 2008-03-13 | Nec Lcd Technologies Ltd | Led back light unit and liquid display device using the same |
| WO2008108210A1 (en) * | 2007-02-26 | 2008-09-12 | Rohm Co., Ltd. | Linear light source apparatus and image reading apparatus provided with the same |
| JP2008219333A (en) * | 2007-03-02 | 2008-09-18 | Rohm Co Ltd | Linear light source device |
-
2010
- 2010-07-09 KR KR1020100066321A patent/KR101136316B1/en active IP Right Grant
-
2011
- 2011-07-04 CN CN201110188324.9A patent/CN102313206B/en active Active
- 2011-07-04 TW TW100123444A patent/TWI459090B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120005716A (en) | 2012-01-17 |
| CN102313206A (en) | 2012-01-11 |
| KR101136316B1 (en) | 2012-04-19 |
| TW201202805A (en) | 2012-01-16 |
| TWI459090B (en) | 2014-11-01 |
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