TW201202722A - Apparatus and method for measuring operation functions of electronic components - Google Patents

Abstract

The present invention, instead of isolating a single chip component, can easily measure and inspect electrical or optical characteristics of a plurality of chip components bundled on a substrate, which greatly simplifies the apparatus constitution. The invention includes an electronic component lateral face separation step, a terminal connection step, and an electrical operation function measurement step. The electronic component lateral face separation step is to use a roller 51 of an electronic component lateral face separation mechanism 5 to bend an electronic component substrate 3 along a curved surface or corner to separate the lateral face of adjacent LED chips 21. The terminal connection step is to connect a terminal connection mechanism 6 to a specific terminal of the above LED chips 21. In the electrical operation function measurement step, an electrical operation function measurement mechanism 7 drives one or a plurality of electronic components via the terminal connection mechanism 6 to measure the electrical operation functions of one or a plurality of LED chips 21.

Description

[Technical Field] The present invention relates to an electronic component operating performance measuring device and an electronic component operating performance measuring method, which are related to a light emitting diode (hereinafter referred to as (Light Emitting Diode) device, etc.) The operational performance of the optical component or the light-receiving component, that is, illumination or light reception, or LSI (Large Scale)

Integration circuit, large integrated circuit) The performance of the wafer is checked. [Prior Art] In recent years, from the viewpoint of protecting the global environment, as an energy-saving lighting component having characteristics such as small size, long life, and no harmful substances, it is recognized that the necessity of LEDs is low for the price. The demand is also very urgent. In a related flow of the manufacturing steps of the prior LED elements, a plurality of LED chips assembled to the substrate are electrically connected to each other. In order to inspect and measure the electrical characteristics and optical characteristics of each of the plurality of LED chips, it is necessary to measure the electrical characteristics or the optical characteristics and detect them. For example, after dividing a plurality of LED chips into individual pieces, each LED is made. The wafer is illuminated and the amount of light is measured by a previous luminescence measuring device. The above technique has been shown in Patent Document 2 and Patent Document 2. The wafer component transfer apparatus of Patent Document 1 includes a feeder that arranges a plurality of wafer components and transports the plurality of wafer components, and a first flat Δ complex is provided with a plurality of transfer grooves on the outer peripheral surface, and the plurality of transfer grooves Wafer parts are arranged in-line and the wafer parts can be held one by one; 2nd flat 155083.doc 201202722, which is arranged orthogonal to the first stage and adjacent to the second stage, and can hold the wafer parts in the outer periphery side. The second platform and the second platform alternately rotate intermittently, and the wafer parts are transferred from the feeder to the third platform, and then from the first! The platform is handed over to the second platform. Inspection of each surface of the wafer component is performed. Further, even if the transport direction of the rectangular wafer component is reversed in the front and rear directions, the image recognition device can recognize that the transport direction of the wafer component is in the opposite direction. The +_ of the probe is reversed, and the LED element of the wafer component is illuminated to perform light amount inspection or the like. In the wafer component supply device of Patent Document 2, the center angle of the passage is set to be 9 之 degrees in the vicinity of the pickup point of the passage for guiding the wafer component supplied from the main body cartridge in parallel with the long side of the rectangle. And a plurality of wafer parts are arranged side by side, and the wafer part is fed to the picking point after the direction of the bent portion is changed to an angle of 9 degrees. In this case, when the wafer components such as the LED element wafers are bonded to each other, the bent portions having the center angle of the vias of 9 turns can be used, and the wafer components can be bonded to each other and released. [Provisional Technical Documents] [Patent Document] Patent Document 1: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In the above-described prior art disclosed in Patent Document 1 and Patent Document 2, 155083.doc -4- 201202722 is singulated into individual wafer components to perform electric characteristics, optical characteristics, and the like. Therefore, as a problem of the monolithic wafer component, a device for realizing singulation, manpower, and transport, and a device for arranging wafer components during detection are required. Further, due to the singulation of the wafer parts, the debris and the like are generated. Further, although there is also a method of automatically separating a coffee base plate in which a plurality of wafer parts are arranged into individual wafer parts, an expensive and complicated loading mechanism control or a recognition device using a camera is required. " As a flow problem in the substrate state, when a wiring pattern is formed in units of wafer parts, it is required to generate a wiring pattern; gas processing becomes complicated. X, in order to expand the distance between wafer parts (stretching), it is necessary to expand the device, and the positional accuracy is also poor, and it is difficult to perform probe contact due to coordinate deviation. Further, in the insulation method in which the insulator is embedded, it is necessary to enlarge the insertion of the device and the shielding plate. In spite of this, since the detection methods described above are measured on a plane, the light emission during DC (Direct Current' DC measurement has an influence on the measurement of optical characteristics, and thus it is impossible to perform detection at the same time. The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component (four) performance device and an electronic component (four) performance measuring method which can be used to mount a plurality of wafer components without dicing the wafer components. In the state, the device configuration is greatly simplified, and the electrical characteristics and optical characteristics of each wafer component are easily measured and inspected. YANG [Technical means for solving the problem] The electronic component operating performance measuring device of the present invention performs the electrical operation performance of the (four) sub-parts in the state of a plurality of electronic component substrates that are implanted. 155083.doc 201202722 Inspector's plural The electronic component substrate is mounted with a plurality of electronic components arranged in a matrix, and the plurality of electronic components are respectively cut in a state in which the back surface is adhered to the sheet. The electronic component operating performance measuring device includes: an electronic component side separating mechanism And the electronic component substrate is folded along the curved surface or the corner portion, so that the side surface between the adjacent electronic components is connected to the specific terminal of the electronic component by the H-substrate connection mechanism, and the electrical operation performance measuring mechanism is In the state in which one or a plurality of electronic components are driven and connected via the terminal connection mechanism, the electrical performance of the one or more electronic components is paralyzed, thereby achieving the above-mentioned object β and being better The electronic component side separation mechanism in the electronic component action performance measuring device of the invention has a circular or multi-section The roller of the edge and the cross section of the polygon are drawn. Further, it is preferable to arrange one or a plurality of rotation axes having a cross section of a meandering shape or a polygonal shape and a rotation axis having a polygonal cross section as the electronic component side separation mechanism in the electronic component dynamic energy absorbing device of the present invention. Further, it is preferable that the terminal connection mechanism in the electronic component operation performance measuring device of the present invention includes a probe pin electrically connected to a terminal on a back side or a side surface of the electronic component, and a driving electric house output mechanism. It can supply the driving power for driving the above electronic components to the above probes. Further, in the electronic component operating performance measuring apparatus of the present invention, it is preferable that when the terminal is present on the back surface, the terminal connecting mechanism and the front end are penetrated by the two probe pins of the needle shape. The back sheet is connected to the terminals of the electronic component. Further, in the case where the electronic component in the electronic component operating performance measuring device of the present invention is a light-emitting device wafer, the electrical performance measuring mechanism includes a reflecting plate that has a specific number of light-emitting device wafers. Covering the periphery thereof, and preventing the light emitted from the light-emitting element wafer from leaking to the outside, and reflecting the light by the inner surface to guide the light to a specific direction; and the light-receiving element photoelectrically opting the light from the reflector Converting to obtain a photographing signal; and a good or bad chip portion, which compares the amount of light emitted from the light-emitting element wafer with a threshold value based on an image pickup signal from the light-receiving element, and determines whether the light-emitting element wafer is good or bad. Further, in the case where the electronic component in the electronic component operation performance measuring device of the present invention is an LSI wafer or a light-receiving device wafer, the electrical operation performance mechanism includes a good or bad teaching portion, and the wafer quality determination unit The electronic component is judged to be good or bad by comparing the input output value of the terminal connecting means via a specific number of LSI chips or the light receiving element chip with the threshold value of the input output value. Further, in the electronic component operating performance measuring apparatus of the present invention, when the determination result of the electronic component determined by the wafer quality determining unit is: "the coordinate position of the electronic component is stored as NG information. Memory department. Further, it is preferable that the terminal=connection mechanism in the electronic component operating performance measuring apparatus of the present invention includes: the first terminal connecting mechanism m connects the probe to the electronic characteristic of the electronic component for each component. Inspection; and the second terminal connection mechanism 'the heart will be connected (4) to the plural of the plurality of electronic parts that are inspected by the above-mentioned light property inspection 155083.doc 201202722

The terminal is used to check the electrical characteristics of the electronic component. The P terminal connection mechanism includes a rear terminal in the probe connection device, and the contact unit is electrically connected to the electronic component and has a tapered surface on the lower surface, and the strip shape is fixed: the probe pin, Immediately below the lower surface of the touch unit, the second unit is configured to move freely in the horizontal direction of the joint/σ, and the upper surface of the dog-shaped protrusion is pushed by the above-mentioned movement, and the drive is output. The mechanism, the drive house of the parts, is supplied to the probe pin. The terminal connection mechanism in the electronic component action device of the invention is preferably: the probe is connected to the rear terminal; the contact unit is connected to the lower surface of the electronic component and can be determined according to The above-mentioned probe pin '^^, the gas is ejected and moved in the longitudinal direction, and the end face is opened to be configured as the above-mentioned contact unit, and the long tube in the lateral direction is freely rotated, according to the description The arrangement of the electronic components is changed by an interval, at a specific interval = a plurality of air vents for air jets; and a driving voltage output 丨 can supply a driving voltage for driving the electronic components to the probe pins β = ' The f-connecting mechanism of the electronic component operating performance measuring device of the present invention includes a probe, which is electrically connected to the terminal of the electronic component, the contact single 疋, which is configured to have the above-mentioned probe fixed on the upper surface. The corner of the surface has a curvature and can move in the longitudinal direction; rotates the 155083.doc 201202722 cylinder, which is formed on the lower surface of the contact unit, and the long circular axis in the left and right direction If the rotation is performed, and the angle is changed according to the arrangement interval of the electronic components, a specific number of protruding cylindrical portions are formed at specific intervals for each of the electronic components, and the protruding cylindrical portion pushes up the lower surface of the contact unit by rotation; And a driving voltage output mechanism that supplies a driving voltage for driving the electronic component to the probe pin. Further, it is preferable that the terminal connecting mechanism in the electronic component operating performance measuring device of the present invention has the following configuration 'gp' The reflector, the insulating sheet, and the probe pin are formed at a position directly below the insulating edge plate 61B below the reflector, and the front end of the reflector abuts against the surface of the light-emitting device wafer, and the probe is connected The foot is abutted against or separated from the side terminal of the light-emitting element wafer. Further preferably, the terminal connection mechanism in the electronic component operation performance measuring device of the present invention comprises: a probe pin electrically connected to the electron a rear terminal of the part; a rotating shaft, a contact unit, which is connected to the circular cross section of the rotating shaft On the opposite side of the crank-shaped upper and lower contact units, the probe pins are respectively fixed to the both end faces, and the f-plane terminals of the plurality of electronic components and the probe pins are simultaneously rotated by the rotation of the above-mentioned shafts a rear terminal connected to each of a plurality of electronic components disposed on opposite sides of the upper and lower sides; and a driving voltage output mechanism that supplies a driving voltage for driving the electronic component to the probe pin. The electronic material of the present invention (4) The performance method is to check the electrical operation performance of the electronic component substrate in a plurality of mounted electronic component substrates, and the plurality of electronic components 155083.doc 201202722 of the plurality of mounted electronic component substrates are arranged in a matrix. The plurality of electronic components are respectively cut off in a state in which the back surface is adhered to the sheet, the electronic component operating performance measuring method package, the electronic component side separating step, and the electronic component side separating mechanism to cause the electronic component substrate to be curved or Bent at the corners to separate the sides between the adjacent electronic components; terminal connection steps, terminals a connection of a connection mechanism; a specific terminal of the electronic component; and an electrical performance measurement step of the one or more of the plurality of electronic components that are driven to be connected via the terminal connection mechanism The electrical performance of the electronic component is measured, thereby achieving the above. Hereinafter, the action of the present invention will be described based on the above configuration. The invention comprises: an electronic component side separating mechanism, which causes the electronic component substrate to be folded along a curved surface or a corner portion to separate a side surface between the adjacent electronic components; and a terminal connecting mechanism connected to the electronic component a specific terminal; and an electrical performance measuring mechanism that measures electrical performance of the one or more electronic components in a state in which one or a plurality of electronic components are driven and connected via a terminal connecting mechanism. In this way, the wafer component is singulated and the electrical performance of the electronic component is directly measured in the state in which the plurality of wafer components are mounted. Therefore, the device configuration can be simplified, and the device configuration can be simplified. The electrical characteristics and optical characteristics of each wafer component are measured and inspected. [Effects of the Invention] According to the present invention, the wafer component is not singulated 155083.doc •10-201202722 In the substrate state of each wafer component, the electrical operation performance of the electronic component is directly measured. Therefore, the device configuration can be greatly simplified, and the electrical or optical characteristics of each crystal component can be measured and performed. an examination. [Embodiment] Embodiments 1 to 8 of the electronic component operating performance measuring device and the electronic component operating (four) measuring method of the present invention will be described in detail below with reference to the drawings. Further, the viewpoint of the production of the drawings is not limited to the configuration shown in each of the thicknesses, lengths, and the like of the constituent members in the respective drawings. (Embodiment 1) FIG. 1 is a view schematically showing an example of a side surface separation method of an electronic component in an electronic component operation performance measuring device according to Embodiment 1 of the present invention. Fig. 2 and Fig. 3 are schematic cross-sectional views showing main components of a terminal connecting mechanism and an electrical operating performance measuring device of the electronic component operating performance measuring device according to the first aspect of the invention. Figure 4 is a plan view of the reflector and electronic components of Figure 2 and Figure 3. In the electronic component operating performance measuring apparatus 1 of the present embodiment, the electronic component side surface separating mechanism 5 is configured to bend a plurality of mounted electronic component substrates 3 along a curved surface so as to be adjacent to each other. The side surface between the electronic components 2 before and after the bending direction is opened and spaced apart as the opening 4, and the plurality of electronic components 2 of the plurality of mounted electronic component substrates 3 are arranged in a matrix, and the plurality of electronic components 2 are The adhesive sheet (uv (Ultra Violet 'ultraviolet) sheet) is attached to the back side and is cut off; the terminal is connected to 155083.doc _ 11 · 201202722 mechanism 6, which is sequentially connected to the above-mentioned bend for each electronic component 2 a specific terminal on the side or the back of the electronic component 2 on which the two sides of the folding direction are separated; and an electrical performance measuring mechanism 7 in which one or a plurality of electronic components 2 are driven via the terminal connecting mechanism 6 The electrical performance (optical characteristics such as the amount of light and electrical characteristics) of one or a plurality of electronic components 2 are inspected. Here, the electronic component operating performance measuring device 1 of the present embodiment is used as the illuminating measuring device, and the optical characteristics (luminous amount or illuminance of the LED chip 21 which is an operational performance of the electronic component 2) Measurements such as directivity and the like, and electrical characteristics (DC inspection) are performed. The electronic component 2 includes an LED chip as a semiconductor light-emitting chip, an photographic wafer as a semiconductor light-receiving wafer, and an optical element such as a light-receiving wafer, in addition to the LSI wafer. However, the LED wafer 21 will be described here. A plurality of electronic component substrates 3 are mounted, and a plurality of LED chips 21 are arranged in a matrix shape in a row direction and a column direction, and the plurality of LEd wafers 2 j are attached to the back surface with an adhesive sheet in the longitudinal direction and the lateral direction. They were cut off separately. The adhesive sheet is slightly stretchable, and the plurality of LED chips 21 can be held in a state in which a plurality of LED chips 21 are arranged. There are cases where the positive terminal and the negative terminal of the LED chip 21 are on the side and on the back side, but here, the case where the positive terminal and the negative terminal of the LED chip 21 are on the back surface will be described. A lens 22 is disposed at the center of the surface of the LED chip 21, and light emitted from the LED is emitted to the outside through the lens 22. Here, the electronic component side spacer mechanism 5 is constituted by a cylinder type 155083.doc 12 201202722 roller 51 having a circular cross section. When the diameter of the roller 51 is smaller, when the adhesive sheet of the electronic component substrate 3 is wound along the curved surface of the roller 5i, the opening of the opening portion 4 becomes large, so that it can be adjacent to the bending direction ( The two sides of the LED chips 21 are further spaced apart in the row direction or the longitudinal direction, but the electrical connection between the plurality of LED chips 21 assembled to the substrate can be electrically blocked from each other and each The LED chip 21 can be illuminated. In short, the electronic component substrate 3 is bent along the curved surface of the roller 51, whereby the electrical conduction between the LED wafers 21 can be blocked, and only the LED wafer 21 to be measured can be controlled to emit light. When the electronic component substrate 3 is placed along the curved surface of the roller 51, the difference between the inner diameter and the outer diameter of the thickness of the LED wafer 21 causes a distance between the adjacent wafers. The terminal connecting mechanism 6 pushes the base of the two needle-shaped probe pins which are insulated from each other to the positive terminal and the negative terminal of the back surface of the LED chip 21, so that the two needle-shaped probe pins penetrate the adhesive. Connected to the piece. The pedestal with the two pin-shaped pins is disposed on each of the LED chips 21, and is disposed in a plurality of LED chips 21 in a specific direction (lateral direction) of the electronic component substrate 3 wound around the roller 51. Below. Thereby, when a plurality of LED chips 21 in one of the specific directions (horizontal direction) are sequentially illuminated, the pedestal with the two pin-shaped pins can be sequentially pushed up to connect the two probes. The leg is electrically connected to the positive terminal and the negative terminal of the LED chip 21, and a specific power supply voltage is supplied from the two probe pins to the LED chip 21 to sequentially emit the LED chip 21. At this time, the illuminating voltage is supplied from the illuminating voltage output source as the driving voltage output means to the two probe pins, thereby driving the LED chip 21 to emit light. 0 155083.doc 13-201202722 Electrical performance measuring mechanism 7 pack &; : counter & plate 71, 胄 covers a specific number (here, five) of the LED chip 21, and does not let the light emitted from the LED chip 21 leak to the outside and utilize the inner surface to conduct the light Reflecting, directing the light to a specific direction; a light receiving element 72 (photodiode) that photoelectrically converts light from the reflecting plate 71 to obtain a photographing signal; and a wafer quality determining unit 73 based on the light receiving element 72 The illuminating amount of the LED chip 21 is compared with the threshold value by the photographic signal, and the LED chip 21 is judged to be good or bad. The electrical performance measuring mechanism 7 is caused by the two probe pins of the terminal connecting mechanism 6 to make one or The amount of light emitted from one or a plurality of LED chips 21 is inspected in a state where a plurality of LED chips 21 are illuminated. Hereinafter, the luminescence measuring method of the electronic component operating performance measuring apparatus 1 having the above configuration will be described in detail. First, the electronic component substrate 3 is wound around the cylindrical roller 51 as the electronic component side spacer mechanism 5 by fixing the front end of the plurality of mounted electronic component substrates 3 so that the adhesive sheet is placed below. The plurality of LED chips 21 of the plurality of mounted electronic component substrates 3 are arranged in a matrix shape in the row direction and the column direction, and the plurality of LED chips 21 are vertically and horizontally adhered to the back surface with the adhesive sheet adhered thereto. The directions are cut off separately. Then, the cylindrical roller 51 is rotated, and when one of the plurality of LED chips 21 of the electronic component substrate 3 reaches the apex of the roller, the rotation of the roller 51 is stopped, and the reflector 71 and the light receiving element 72 are lowered, and the reflector is used. 71. The periphery of a specific number of LED chips 21 (here, five) is covered. In this case, 14 155083.doc 8 201202722, a plurality of subsequent reflecting plates 7 are sequentially prepared by separating 5 LED chips 21, and then in the cylindrical roller 51, for each LED chip 21, The base of the two needle-shaped probe pins and the LED chip 21 are sequentially pushed up so that the two needle-shaped probe pins are sequentially connected to the positive terminal and the negative terminal of the back surface of each LEd wafer 21 Each of the LED chips 21 is sequentially illuminated. When the LED chips 21 are sequentially illuminated, the chip quality determining unit 73 is notified by the counter that the first LED chips 21 are emitting light. At this time, based on the image pickup signal from the light receiving element 72, the wafer quality determination unit 73 compares the amount of light emitted from the LED chip 21 with the threshold value, and determines whether the LED chip 21 is good or bad. Further, when the result of the chip quality determination unit 73 is NG (bad), the coordinate position (address information) of the LED chip 21 is recalled in the memory unit (RAM (Random Access Memory). Take memory)). For the coordinate position (address information), in a matrix-shaped arrangement of a plurality of LED chips 21, the column direction is set to χ, the row direction is set to Y, and the LED wafer 2 is determined by coordinates (χ, γ). The location of the 丨. In this case, the execution row direction γ is set to "丨" and the position number of the column direction χ is 1 to 5 '11 to 15, 21 to 25, · · · When the coordinate (21, 1) is NG At this time, the coordinates (21, 1) are memorized in the memory unit (RAM). Then, the plurality of reflecting plates 71 and the light receiving element 22 are temporarily raised together, and the five LED chips 21' are moved again to lower the plurality of reflecting plates 71 and the light receiving element 22 together, and a specific number of LED chips are used by the reflecting plate 71. Cover around 21 (here 5). Then, in the cylindrical roller 51, for each LED chip 21, the pedestal with two probe pins and the LED chip 21 attached to 155083.doc -15-201202722 are sequentially pushed up to make two The probe pins are sequentially connected to the positive terminal and the negative terminal on the back surface of each LED chip 21, so that the LED chips 21 sequentially emit light. When the LED chips 21 are sequentially illuminated, the wafer quality determination unit 73 is notified by the counter that the LED chips 21 are emitting light. At this time, based on the image pickup signal from the light receiving element 72, the wafer quality determination unit 73 compares the amount of light emitted from the LED chip 21 with the threshold value, and determines whether the LED chip 21 is good or bad. Further, when the result of the wafer quality determination unit 73 is NG (bad), the coordinate position (address information) of the LED chip 21 is stored in the memory unit (Ram) as NG information. For the coordinate position (address information), in the matrix of the plurality of LED chips 21, the column direction is set to X, the row direction is set to γ, and the LED chip 21 is determined by coordinates (χ, γ). The location. In this case, the execution row direction γ is set to "1" and the position numbers of the column direction X are 6 to 1 〇, 16 〜 2 〇, 26 〜 3 〇, .., and if there is no NG, the NG is not Information is stored in the memory (ram). The measurement of the amount of luminescence of the plurality of LED chips 21 in one column is checked by the measurement. Then, the roller 51 is rotated by an amount corresponding to one LED chip 21, and when one of the plurality of LED chips 21 of the electronic component substrate 3 reaches the apex of the roller, 'the rotation of the roller 51 is stopped', the plurality of reflecting plates 71 and the light receiving element are caused. 22 is lowered at the same time, and the periphery of a specific number of LED chips 21 (here, five) is covered by the reflecting plate 71, and the measurement of the amount of light emitted from the plurality of LED chips 21 in the next row is started. The above-described operations are repeatedly performed, so that the measurement of the amount of light emitted from the plurality of LED chips 21 in a specific column can be performed in a specific row. 155083.doc. According to the above, the method for measuring the operational performance of the electronic component according to the first embodiment includes: The electronic component side spacing step, the electronic component side spacing mechanism 5 bends the electronic component substrate 3 along the curved surface or the corner portion to separate the side surfaces between the adjacent LED chips 21; the terminal connection step enables the terminal connection The mechanism 6 is connected to a specific terminal of the LED chip 21; and an electrical operation performance measuring step, in which the electrical performance measuring mechanism 7 drives one or a plurality of electronic components connected via the terminal connecting mechanism 6 The electrical performance of the plurality of LED chips 21 is measured. According to the above-described embodiment, the damage (cracks, chips, and dirt) of the LED wafer 21 during the singulation of the adhesive sheet is directly peeled off from the electronic component substrate 3 in a state in which the plurality of mounted electronic component substrates are removed. In the state of the optical measurement, a plurality of LED chips 21 of the plurality of mounted electronic component substrates are arranged in a scaly shape, and the plurality of LED wafers 2 are divided in a state in which the adhesive sheets are adhered. Therefore, it is not necessary to arrange the arrangement direction of the respective LED chips 21 in the transport direction or the position alignment mechanism when the parts are transported (there is no complicated and complicated part feeding mechanism, etc.), and the device can be compact in size and when When optical measurement is performed on each LED chip, positioning is not required, optical wafers can be easily performed on each of the coffee wafers, and optical materials can be used for the optical wafers of the LED chips. The information of the value is correctly maintained in the memory as the coordinate data. Furthermore, in the present embodiment, the following example is described in the case of the 丨 丨 办 办 办 , , , , , , , 于 于 于 于 于 于 于 于 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子The cylinder roller 51 is not limited thereto, and is 155083.doc • 17· 201202722 The electronic component operation performance measuring device ^, the electronic component side spacing mechanism 5 may also be a quadrilateral or pentagon cross section and called a strip edge and a led wafer 2i A cylindrical roller of the width that matches the width. (Second Embodiment) In the first embodiment, the electronic component side surface partitioning mechanism 5 has a circular or polygonal cylinder (four). However, in the second embodiment, the electronic component side surface separating mechanism is used. 5 A curtain method in which the electronic component substrate 3 is suspended by using a rotating shaft having a quadrangular cross section will be described. Fig. 5 is a perspective view showing a main configuration example of the electronic component side surface partitioning mechanism and the terminal connecting mechanism of the electronic component operating performance measuring apparatus according to the second embodiment of the present invention. Further, in this case, the electrical action performance measuring mechanism 7 of FIGS. 2 to 4 is used, and the terminal connecting mechanism 6 of FIGS. 2 and 3 is used, and the terminal which can be electrically connected only to the side of the LED chip 21 is used. The probe pin serves as the terminal connection mechanism 6. In the electronic component operating performance measuring apparatus 1A of the second embodiment, the electronic component side surface partitioning mechanism 5 includes a plurality of mounted electronic component substrates 3 which are bent at a corner portion of a quadrangle in FIG. 2 to FIG. The side surface between the electronic components 2 adjacent to each other in the bending direction is opened and separated as an opening 4, and the plurality of electronic components 2 of the plurality of mounted electronic component substrates 3 are arranged in a matrix. The electronic components 2 are respectively cut in a state in which the back surface is adhered to the sheet; the terminal connecting mechanism 6A is connected to a specific terminal on the side of the electronic component 2 on which the front and rear sides of the bending direction are separated; The sexual activity measuring mechanism 7 drives the one or more electronic components 2 via the 4-sub-connection mechanism 6A. 155083.doc • 18 · 201202722 The following describes the electrical performance of one or a plurality of electronic components 2 Determination. Here, the electronic component operating performance measuring device 丨A of the second embodiment is used as the illuminating measuring device, and the optical characteristics (light-emitting amount, illuminating directivity, etc.) and electrical characteristics of the LED chip 21 are ( Dc inspection) and the like are measured as the operational performance of the electronic component 2. Here, the electronic component side partitioning mechanism 5 is constituted by a rotating shaft 52 having a quadrangular cross section. The electronic component substrate 3 is bent along the corner of the rotating shaft 52 in such a manner that the mutual electrical connection of the plurality of lEd wafers 21 assembled onto the substrate can be electrically blocked from each other and the respective LEd wafers 2 i are illuminated. By folding the angle of 90 degrees, the opening is formed between the adjacent led wafers 21, and the electrical conduction is blocked, so that only the LED wafer 21 to be measured can be controlled to emit light. When the electronic component substrate 3 is placed along the corner of the rotating shaft 52, the difference between the inner diameter and the outer diameter of the thickness of the LED chip 21 is greatly separated by the distance between adjacent wafers. The terminal connecting mechanism 6A electrically connects the two pin-shaped probe pins 61 insulated from each other against the positive terminal and the negative terminal on the side surface of the LED chip 21. The two pin-shaped pins 61 are disposed so as to be pressed against the side of a specific number of LED chips 21 in a specific direction (lateral direction) of the electronic component substrate 3 wound around the rotating shaft 52 for each of the LED chips 21, respectively. Terminal. Thereby, when a plurality of LED chips 21 in one of the specific directions (horizontal direction) are sequentially illuminated, the two pin-shaped pins 61 can be sequentially pressed against the terminals on the side of the LED chip 21 to be specified. The power supply voltage is supplied from the two probe pins 61 to the LED chip 21 to sequentially emit the LED chips 21. At this time, the voltage of the light-emitting 155083.doc •19-201202722 can be supplied from the light-emitting voltage output source as the driving voltage output means to the two probe pins 61, thereby driving the LED chip 21 to emit light. Hereinafter, the luminescence measuring method of the electronic component operating performance measuring apparatus 1A having the above configuration will be described in detail. First, the electronic component board 3 is wound around the front end of the plurality of mounted electronic component boards 3 so that the electronic component board 3 is wound around the axis of the electronic component side surface partitioning mechanism 5A. 52. The plurality of LED chips 21 of the plurality of mounted electronic component substrates 3 are arranged in a matrix shape in the row direction and the column direction, and the plurality of LED chips 21 are vertically and laterally adhered to the back surface with the adhesive sheet adhered thereto. They were cut off separately. Then, the rotating shaft 52 having a quadrangular cross section is rotated, and when one of the plurality of LED chips 21 of the electronic component substrate 3 reaches the upper surface position of the rotating shaft 52, the rotation of the rotating shaft 52 is stopped, and the reflecting plate 71 and the light receiving element are caused. 72 is lowered together, and the periphery of a specific number of LED chips 21 (here, five) is covered by the reflecting plate 71. In this case, a plurality of subsequent reflecting plates 7 j are sequentially prepared by separating five led wafers 21. Then, the LED chips 21 which are wound around the corners of the rectangular rotating shaft 52 are formed, and the adjacent LED chips 21 are formed at substantially right angles along the corners, and the side faces are largely separated from each other, and the two needles are formed. The probe pin 61 is pressed against the positive terminal and the negative terminal on the side of the LED chip 21 whose upper surface is covered by the reflection plate 71 on the upper surface of the rotating shaft 52, and the specific voltage is applied from the two pin-shaped probe pins. 61 is supplied to the positive terminal and the negative terminal on the side of the LED chip 21 to cause the LED chip 21 to emit light. When the LED chips 21 are sequentially illuminated, the 155083.doc 8 201202722 uses the counter to cause the wafer quality determination unit 73 to know that the first Led wafers 21 are emitting light. At this time, based on the image pickup signal from the light receiving element 72, the wafer quality determination unit 73 compares the amount of light emitted from the LED chip 21 with the threshold value, and determines whether the LED chip 21 is good or bad. Further, when the result of the chip quality determination unit 703 is NG (bad), the coordinate position (address information) of the LED chip 21 is stored in the memory unit (RAM). For the coordinate position (address information), in the matrix of the plurality of LED chips 21, the column direction is set to X, and the row direction is set to Y'. The LED chip is determined by coordinates (X, Y). 21 position. In this case, the 'execution row direction γ is set to "丨" and the position number of the column direction X is 1 to 5, 11 to 15, 21 to 25, . . . , when the coordinate (21 ' 1) is NG When 'the coordinates (21, 1) are memorized in the memory (RAM). This is the same as the case of the first embodiment described above. Then, the plurality of reflecting plates 71 and the light receiving element 22 are temporarily raised, the five LED chips 21 are moved, and the plurality of reflecting plates 71 and the light receiving element 22 are again lowered and lowered by the reflecting plate 71 to form a specific number of led chips. Cover around 21 (here 5). Then, the two pin-shaped probe pins 61 are pressed against the positive terminal and the negative terminal 'on the side of the LED chip 21 whose upper surface is covered by the reflection plate 71 on the upper surface of the rotary shaft 52, and the specific voltage is from two. The pin-like probe pin 61 is supplied to the positive terminal and the negative terminal on the side of the LED chip 21 to cause the LED chip 21 to emit light. When the LED chips 21 are sequentially illuminated, the wafer quality determination unit 73 is notified by the counter that the LED chips 21 are emitting light. At this time, based on the image pickup signal from the light receiving element 72, the wafer quality determination 155083.doc - 21 - 201202722 portion 73 compares the amount of light emitted from the LED chip 21 with the threshold value to determine whether the wafer 21 is good or bad. Further, when the chip quality determination unit 73 determines that the result is NG (bad), the coordinate position (address information) is stored in the memory unit (RAM) as the information. For the coordinate position (address information), in the matrix queue of the plurality of LED chips 21, the column direction is set to X, the row direction is set to γ, and the led chip is determined by coordinates (χ, γ). 21 position. In this case, the execution row direction γ is set to "i" and the position numbers of the column direction X are 6 to 10, 16 to 20, 26 to 30, .., and if there is no NG, the NG information is not memorized. Memory (RAM). This is the same as the case of the first embodiment described above. Thereby, the measurement of the amount of luminescence of the plurality of LED chips 21 in one column is checked. Then, when the rotating shaft 52 having a quadrangular cross section is rotated by 90 degrees corresponding to one [ED wafer 21], when one of the plurality of LED chips 21 subsequent to the electronic component substrate 3 reaches the upper surface of the rotating shaft 52, The rotation of the rotating shaft 52 is stopped, and the plurality of reflecting plates 71 are lowered together with the light receiving element 22, and the periphery of a specific number of LED chips 21 (here, five) is covered by the reflecting plate 71, and the next column is started. The amount of light emitted from the plurality of wafers 21 is measured and inspected. By repeating the above operation, the measurement of the amount of light emitted from the plurality of LED chips 21 in a specific column can be performed in a specific row. In the second embodiment, as compared with the case of the above-described embodiment, since the openings are formed at right angles to each other between the adjacent LED chips 21, the side faces are largely separated from each other, so that it is easy to separate the two. The needle-like probe pin 61 is pressed against the LED chip 2 covered by the reflector 71 on the upper surface, and the positive terminal and the negative terminal on the side of the 55 〇 83d 〇 C -22- 八 201202722. According to the second embodiment, when the electronic component board 3 is formed as a rectangular rotating shaft 52 (rotational axis) along the cross section, the difference between the inner diameter and the outer diameter due to the thickness of the electronic component board 3 is adjacent. An opening is formed at a substantially right angle between the LED chips 21 before and after the corners, and the side faces are largely separated from each other. Therefore, it is possible to more reliably insulate the sheets in the conductive state from each other, and it is easy to press the two needle-shaped probe pins 6 丨 against the terminals of the side surface of the LED chip 21 forming the opening, so that the substrate can be In the state, it is easier and more reliable to implement the detection step. In the present embodiment, the following description has been made on the case where the electronic component side surface partitioning mechanism 5 is used to suspend the electronic component substrate using the rotating shaft 52 having a quadrangular cross section. In this way, the probe point can be set at a plurality of positions on one rotation axis, but is not limited thereto. As shown in FIG. 14, the electronic component side separation mechanism 5 A can also be configured as follows. Two rotating shafts 52 having a quadrangular cross section are disposed, and the electronic component board 3 is wound around the upper rotating shaft 52 from the lower rotating shaft 52. In this case, the terminal connecting mechanism 6A electrically connects the two pin-shaped probe pins 61 insulated from each other to the positive terminal and the negative terminal on the side of the LED chip 21, and performs the action at two places. That is, the connection operation of connecting the probe pins 61 to the LED chips 21 is performed for each of the rotation shafts 52. Further, in the same manner, two rolls 5' having a circular cross section are disposed vertically, and the electronic component substrate 3 is wound from the lower roll 51 to the upper roll 51 to constitute the electronic component side spacer mechanism 5. In this case, the terminal connecting mechanism 6 electrically connects the two pin-shaped probe pins 61 of the insulated 155083.doc • 23-201202722 to the positive terminal and the 贞 terminal of the bottom surface of the LED chip 21, and is electrically connected. This action is performed for each roller 51. The number of the above-mentioned rotating shaft 52 or roller 51 can be set to three or four. In short, the side spacing mechanism of the electronic component is provided with one or a plurality of rollers having a circular or polygonal cross section and a rotating shaft having a multi-turn cross section, and for one or a plurality of rollers having a circular or polygonal cross section. And the terminal connection mechanism can be provided by any one of the rotating shafts having a polygonal cross section. Thus, a plurality of places can be set on one rotating shaft by using the curtain mode.

In the inspection probe point, the above-mentioned curtain method is a method in which the electronic component side spacer mechanism 5 A suspends the electronic component substrate 3 by using the quadrilateral rotation shaft 52. However, by adding the rotation shaft 52, the inspection can be further performed. The probe point is increased. Furthermore, in the second embodiment, the case where the electrical connection to the plurality of LED chips 21 assembled to the substrate can be electrically blocked from each other and the respective LED chips 21 are made is described. The method of illuminating 'the electronic component substrate 3 is bent at an angle of 90 degrees along the corner of the rotating shaft 52 (the cross section is a quadrangle), whereby an opening is formed between the adjacent LED chips 21 to be electrically formed. The sexual conduction is blocked, so that only the LED wafer 21 to be measured can be controlled to emit light, but the opening angle is not limited to 90 degrees, and when the rotating shaft 52 is increased to, for example, three places, the opening angle is less than 90 degrees. Angle, but as long as the above opening angle is the angle at which the probe can be contacted, there is no problem. (Embodiment 3) 155083.doc 8 201202722 In the above-described embodiment i, a cylindrical or polygonal type of cross section of the electronic component side surface partitioning mechanism 5 has been described. However, in the third embodiment, The illuminating amount of the plurality of LED chips 21 in the column is also measured in addition to the above-described embodiment, in which the amount of light emitted from the plurality of LED chips 21 of the plurality of rows is measured in a specific row. Before and after the measurement, a plurality of LEDs 21 are subjected to electrical inspection such as DC inspection. Fig. 6 is a view showing a configuration of a main part configuration of an electronic component side surface separation mechanism and an electrical activity performance measuring mechanism of the electronic component operation performance measuring device according to the third embodiment of the present invention. Fig. 7 is a view schematically showing the configuration of a main part of a terminal connection mechanism of the electronic component operating performance measuring apparatus according to the third embodiment of the present invention. In the electronic component operating performance measuring device 1B of the present embodiment, the electronic component side surface partitioning mechanism is configured to bend a plurality of mounted electronic component substrates 3 along a curved surface so as to be adjacent to the curved portion. The side surface between the LED chips 21 in the front and rear directions is opened and separated as the opening 4, and the plurality of LED chips 21 of the plurality of mounted electronic component substrates 3 are arranged in a matrix, and the plurality of LED chips 21 are used for The back surface is bonded to the back sheet, and the terminal connection mechanism 6F is connected to the optical detection terminal (first terminal connection mechanism 6) and the electrical detection terminal (second terminal connection mechanism 62). The detection terminal connection (the first terminal connection mechanism 6) is sequentially connected to a specific terminal on the back surface of each of the LED chips 21 on which the front and rear sides of the bending direction are separated, and the electrical detection terminal is connected (second The terminal connection mechanism 62) electrically detects a plurality of LED chips 21 in a row different from the plurality of LED chips 21 of the 155083.doc -25-201202722 optical inspection. When the front and rear sides of the bending direction are separated from each other, the specific terminals of the back surface of the plurality of LED chips 21 are separated from each other; and the electrical performance measuring mechanism 7 is driven by the terminal connecting mechanism 6F for one or more In the state of the LED chips 21, the electrical operation performance (optical detection and electrical detection) of one or a plurality of electronic components 2 is inspected. 0 The terminal connection mechanism 6F connects the two needle-shaped probes which are insulated from each other. The base of the foot is pushed onto the positive terminal and the negative terminal on the back surface of the LED chip 21, so that the two needle-shaped probe pins are connected to the adhesive sheet to connect β. The base with the two needle-shaped pins is attached to the optical At the time of detection, each of the LED chips 21 is disposed directly under a plurality of LED chips 21 wound in one row (lateral direction) of the electronic component substrate 3 of the can roller 53. Therefore, when a plurality of LED chips 21 in a row (horizontal direction) are sequentially illuminated for optical detection, the pedestal with the two pin-shaped pins can be sequentially pushed up to connect the two probes. The leg is electrically connected to the positive terminal and the negative terminal of the LED chip 21, and a specific power supply voltage is supplied from the two probe pins to the LED chip 21 to sequentially emit the LED chip 21. At this time, the light-emission voltage is supplied from the light-emitting voltage output source as the drive voltage output means to the two probe pins, thereby driving the LED chip 21 to emit light. When the susceptor having the two pin-shaped pins is electrically detected by DC detection or the like for detecting the output current or the output voltage with respect to the specific input voltage, the pedestals are arranged in a plurality of LED chips 21 in a row. Immediately below, all the pedestals with two pin-shaped pins are pushed up at the same time. 155083.doc -26- 8 201202722 The two probe pins are electrically connected to the positive terminals of all the LED chips 21 The negative terminal is supplied to the LED chip 21 from the two probe pins, so that a specific input voltage can be supplied to the plurality of LED chips 21 in all of the columns, and the respective output voltages of the respective LED chips 21 can be obtained. The electrical characteristics of the LED chip 21 can be determined based on the respective threshold voltages of the respective LED chips 21 and the specific threshold values. According to the third embodiment, the determination of the optical characteristics of the LED chip 21 and the determination of the electrical characteristics are as follows: the cylindrical roller 53 having a circular cross section as the electronic component side spacer mechanism 5B is formed. When the measurement positions are different, the inspection can be performed at the same time, and the inspection time is greatly shortened. Here, the determination of the quality of the optical characteristics and the determination of the electrical characteristics are performed at positions where the angles differ by 180 degrees, but are not limited thereto, and the determination of the optical characteristics and the determination of the electrical characteristics at one position may be performed. Any one of the determinations is made, and another determination is made at a position that is different from the position by 90 degrees. Therefore, the 'terminal connection mechanism 6F includes: a first terminal connection mechanism 6 for connecting the probe pin to the terminal of the lED wafer 21 for each LED wafer 21 to inspect the optical characteristics of the LED chip 21; The 2-terminal connection mechanism 62' is configured to simultaneously connect the probe pins to the terminals of the plurality of LED chips 21 which are different from the plurality of LED chips 21 whose optical characteristics are inspected, and check the electrical characteristics of the LED chips 21. . (Embodiment 4) In the first embodiment, when optical detection is performed, the two probe pins are sequentially pushed up together with the susceptor for each LED wafer 21', so that 155083.doc •27·201202722 The two probe pins are electrically connected to the positive terminal and the negative terminal of the LED chip 21

8(a) to 8(c) are diagrams schematically showing a configuration of a wedge type of a terminal connection mechanism of the electronic component operating performance measuring apparatus according to the fourth embodiment of the present invention. As shown in FIG. 8(a) to FIG. 8(c), the terminal connection mechanism 6B of the wedge type of the second embodiment includes a contact pin 63 electrically connected to the positive terminal and the negative terminal of the back surface of the LED chip. And two pin probe pins insulated from each other; the contact unit 64 is fixed to the upper surface by two stylus 63 at a specific interval (the same interval as the interval between the positive terminal and the negative terminal), and the lower surface a tapered surface having a slope so as to be movable up and down (longitudinal direction); and a moving shaft 65 configured to be freely oriented in the left-right direction along the long axis at a position below the tapered surface of the contact unit 64 The horizontal direction is moved, and a wedge-shaped projection 65a is disposed on the upper surface at a predetermined interval in the longitudinal direction. The contact unit 64 having the two contact pins 63 attached to the upper surface is configured to freely move up and down for the back of each of the LED chips 21. That is, the stylus ο and the contact unit 64 are respectively disposed on the plurality of LED chips 21 wound in one row (horizontal direction) of the electronic component substrate 3 of the can roller 54 for each LEE) wafer 21 during optical detection. Directly below. The operation of the terminal connection mechanism 6B having the above configuration will be described below. First, as shown in Fig. 8(a) to Fig. 8(b), at the time of optical detection, the reflecting plate 71 and the light receiving element 72 are lowered, and the specific number is 28-155083.doc 8 201202722 by the reflecting plate 71. The periphery of the LED chips 21 (here, five) is covered. In this case, a plurality of subsequent reflecting plates 71 are sequentially prepared by separating five LED chips 21. In the above state, the moving shaft 65 moves to the right side, and the tapered surface of the wedge-shaped projection 65a on the upper surface of the moving shaft 65 pushes the tapered surface of the lower surface of the contact unit 64 with the two stylus 63 attached thereto. At the same time, the two needle-shaped styluses are fused through the adhesive sheet 3 1 (UV sheet) and electrically connected to the positive terminal and the negative terminal of the back surface of each of the i, jj, and 21th LED chips 21 . In this manner, the two contact pins 63 are electrically connected to the positive terminal and the negative terminal of the LED chip 21, and a specific power supply voltage is supplied from the two contact pins 63 to the LED chip 2 to cause the LED chip 21 to emit light. Optical inspection is performed on each of the first, u-th, and twenty-first light-emitting LED chips 21 (check whether the amount of light is above the threshold value). In short, after the wedge-shaped protrusions 65a are moved by an amount corresponding to one wafer, the contact unit 64 with the two stylus pins 63 is raised, and the two stylus pins 63 are penetrated through the adhesive sheet 31 (UV sheet) and connected to A positive terminal and a negative terminal on the back side of the LED chip 21. Then, as shown in Fig. 8(b) to Fig. 8(c), the moving shaft 65 is further moved to the right side, and the tapered surface of the wedge-shaped projection 65a on the upper surface of the moving shaft 65 will be attached with two styluses 63. The tapered surface of the lower surface of the contact unit 64 is pushed. Here, the two needle-shaped stylus 63 penetrates the adhesive sheet 3 1 (UV sheet) and is electrically connected to the second, seventh, and twelfth A positive terminal and a negative terminal on the back surface of each of the LED chips 21. Thus, the two contact pins 63 are electrically connected to the positive terminal and the negative terminal of the LED chip 21, and a specific power supply voltage is supplied from the two contact pins 63 to the LED chip 21 to cause the LED chip 21 to emit light. The second, twelfth, and twenty-second LED chips 21 that emit light are optically detected (check whether the amount of light is 155083.doc -29-201202722 is above the threshold). In short, after the wedge-shaped protrusion 65a is further moved by the amount corresponding to one wafer, the previous contact unit 64 is lowered to return to the original position 'subsequent contact unit 64 and two styli 63- and raised' The root contact pin 63 penetrates the adhesive sheet 31 (UV sheet) and is connected to the positive terminal and the negative terminal of the back surface of the subsequent LED chip 21. Repeat the above operation, optical detection of the five light-emitting LED chips 21 of the first to fifth, eleventh to fifteenth, and twenty-first to twenty-fifth (inspection light amount is more than a threshold value) carry out. In the same manner as in the first embodiment described above, the coordinate information of the LED chip 21 of NG is stored as NG information in the RAM. Then, the plurality of reflecting plates 71 and the light receiving element 22 are temporarily raised, and more than five LED chips 21 whose optical detection has been completed are moved to the right side, and the plurality of reflecting plates 7 1 and the light receiving element 22 are again lowered. The circumference of the subsequent specific number of led wafers 21 (here, five) is covered by the reflecting plate 71. Repeat the above-mentioned inspection operation, optical detection of the LED chips 21 of the sixth to the first, the 16th to the 20th, and the 26th to the 30th, respectively (check whether the amount of light is a threshold The value above is completed. In the same manner as in the first embodiment described above, the coordinate information of the LED chip 21 of NG is stored in the memory unit (RAM) as NO information. According to the above, a plurality of LED wafers 21 (horizontal direction) can be sequentially illuminated to perform optical detection. Thereafter, the cylindrical roller 54 is rotated by a specific distance' so that the plurality of LED chips 21 in the next row (horizontal direction) are sequentially illuminated to perform optical detection. 155083.doc 201202722 (Embodiment 5) In the above-described Embodiment 1, when optical detection is performed, two probe pins and their pedestals are sequentially pushed up for each LED chip 21, and two probes are pushed up. The pin pins are electrically connected to the positive terminal and the negative terminal of the LED chip 21 to sequentially emit the LED chips 21. However, in the fifth embodiment, a specific example of the air jet method will be described. A plurality of (here, five) blocks respectively cause the plurality of Led wafers η of the above-described columns to sequentially emit light one by one. Fig. 9 (a) to Fig. 9 (c) are diagrams showing a configuration of a second embodiment of the terminal connection mechanism of the electronic component operating performance measuring apparatus according to the fifth embodiment of the present invention. As shown in FIG. 9 (4) to FIG. 9 (4), the terminal connection mechanism 6C of the second embodiment includes a contact pin 63 electrically connected to the positive terminal of the back surface of the LED wafer n and the two materials insulated from each other. a needle probe pin; the contact unit 66' has two contact pins 63 fixed at a certain interval on the upper surface (the same interval as the interval between the positive terminal and the negative terminal), and the lower surface can be ejected according to the presence or absence of air. The upper and lower (longitudinal) movements are open; and the pressure air tube 67 is configured to be freely rotatable in the left and right direction at a position below the opening of the contact unit 66, and is spaced apart according to the arrangement of the LED chips 21. While changing the angle, w - Ba forms a specific number (here, five) of air vents 67a at special intervals. The contact unit 66 having the two contact pins 63 attached to the upper surface is configured to be freely movable up and down with respect to the back surface of the mother coffee chip 21. That is, when the stylus 63 and the contact unit 66 are optically (four), the same number is placed on one of the electronic component substrates 3 (lateral direction) wound around the cylindrical roller 54 for the same amount of each of the hunger milk 155083.doc • 31·201202722. Directly below the LED chips 21. Hereinafter, the operation of the terminal connection mechanism 6C having the above configuration will be described. First, as shown in FIG. 9(a) to FIG. 9(b), when the optical detection is performed, the reflection plate 71 and the light-receiving element 72 are lowered, and a specific number of LED chips 21 are used by the reflection plate 71 (here Cover all around 5). In this case, a plurality of subsequent reflecting plates 71 are sequentially prepared by separating five LED chips 21. In the above state, the long pressure air tube 67 is rotated by a certain angle, and the air vent hole 67a of the pressure air tube 67 reaches directly below the open surface of the lower surface of the contact unit 66 with the two stylus pins 63. The air hole 67a is ejected toward the lower surface open port, and the contact unit 66 is pushed up together with the two contact pins 63. Here, the two needle-shaped contact pins 63 penetrate the adhesive sheet 3 1 (uv sheet) and are electrically connected. The positive terminal and the negative terminal are connected to the faces of the LED chips 21 of the first, the second, and the second. In this manner, the two contact pins are electrically connected to the positive terminal and the negative terminal of the LED chip 21, and a specific power supply voltage is supplied from the two contact pins 63 to the LED chip 21 to cause the LED chip 21 to emit light. Optical inspection is performed on each of the jth, eleventh, and twenty-first light-emitting LED chips 21 (check whether the amount of light is equal to or greater than the threshold value). In short, after the pressure air tube 67 is rotated by an amount corresponding to an angle of 360 degrees/the number of wafers n (N is 5), the contact unit 66 with the two stylus pins 63 is lifted by the action of air ejection. The two stylus pins 63 penetrate the adhesive sheet 31 (UV sheet) and are connected to the positive terminal and the negative terminal of the back surface of the LED chip 21. Then, as shown in Fig. 9(b) to Fig. 9(c), the pressure air tube 67 is further rotated by a specific angle, and the subsequent air vent hole 67a reaches the contact unit with two contact pins 155083.doc 32 8 201202722 63 Directly below the surface opening opening of the lower surface 66, air is ejected from the air vent hole 67a toward the lower surface opening port, and only the contact unit 66 and the two stylus pins 63 are pushed up. Here, the two needle-shaped stylus 63 penetrates the adhesive sheet 31 (UV sheet) and is electrically connected to the positive terminal and the negative terminal of the back surface of each of the second, twelfth and twenty-second LED chips 21. In this manner, the two contact pins 63 are electrically connected to the positive terminal and the negative terminal of the LED chip 21, and a specific power supply voltage is supplied from the two contact pins 63 to the LED chip 21 to cause the LED chip 21 to emit light. The second '12th and 22nd light-emitting LED wafers 21 are optically detected (check whether the amount of light is above the threshold). In short, after the pressure air tube 67 is further rotated by an amount equivalent to the angle of one wafer (angle 36 / / wafer number 5), the previous contact unit "falls due to no air blasting and returns to the original position, followed by The contact unit 66 and the two stylus pins 63 are lifted by the action of air ejection, and the two stylus pins 63 penetrate the adhesive sheet 31 (UV sheet) and are connected to the positive terminal and the negative terminal of the back surface of the subsequent LED chip 21. Repeat the above operation, optical detection of the LED chips 21 of the first to fifth, the eleventh, the fifteenth, the twenty-first to the twenty-five, and the five sequentially illuminated LEDs (check whether the amount of light is a threshold) In the same manner as in the above-described embodiment, the coordinate information of the LED chip 21 of NG is stored in the memory unit (RAM) as NG information. Then, the plurality of reflecting plates 71 and the light receiving element 22 are temporarily placed together. Ascending, more than five optical detection completed LED chips 21 are moved to the right side, and the plurality of reflection plates 71 and the light-receiving element 22 are again lowered, and the subsequent specific number of LED chips 21 are used by the reflection plate 71 (this Around 5) 1 55083.doc •33·201202722 Overlay. Repeat the above inspection operation, optical detection of the 6th to 10th, 16th to 20th and 26th to 30th LED light-emitting LED chips 21 (Checking whether the amount of light is equal to or greater than the threshold value) is completed. In the same manner as in the first embodiment, the coordinate information of the LED chip 21 of NG is stored in the memory unit (RAM) as > 'A plurality of lEd wafers 2 j in one row (horizontal direction) can be sequentially illuminated for optical detection. Thereafter, the cylindrical roller 54 is rotated by a specific distance so that the plurality of LED chips 21 of the next column (horizontal direction) are sequentially The terminal connection mechanism 6C includes a contact pin 63 electrically connected to the probe pin of the rear terminal of the LED chip 21, and a contact unit 66 to which the above-mentioned stylus 63 is fixed on the upper surface. And the lower surface is opened in such a manner as to be movable in the longitudinal direction according to the presence or absence of air ejection; the pressure air tube is configured to be located below the open end of the contact unit 66, and the long tube along the lateral direction Freely rotating And changing the angle according to the arrangement interval of the LED chips 21, forming a plurality of air vents 67a for air jets at specific intervals; and driving a voltage output mechanism (not shown) for driving the driving voltage of the led wafer 21. The stylus 63 is supplied to the stylus 63. (Embodiment 6) In the first embodiment, when optical detection is performed, the two probe pins are sequentially pushed up together with the susceptor for each LED chip 21 to make two The root probe pin is electrically connected to the positive terminal and the negative terminal of the LED chip 21 to sequentially emit the LED chip 21. However, in the sixth embodiment, a specific example of the rotary cylinder 155083.doc 34 8 201202722 will be described. In the specific example of the rotary cylinder method, a plurality of (here, five) blocks are used to sequentially emit the plurality of wafers 21 of the above-described columns one by one. Fig. 10 (4) to Fig. H) (4) are diagrams showing a configuration of a rotary drum type of a third example of the terminal connection mechanism of the electronic component operating performance measuring apparatus according to the sixth embodiment of the present invention. As shown in FIGS. 10(a) to 10(c), the terminal connection mechanism 6D of the rotary drum type of the third example includes a contact pin 63 electrically connected to the positive terminal and the negative side of the back surface of the LED chip 21. Two pin probe pins that are insulated from each other by a terminal; the contact unit 68 is configured to have two contact pins 63 fixed at a certain interval on the upper surface (the same interval as the interval between the positive terminal and the negative terminal). The lower surface corner portion has an arc and is movable up and down (longitudinal direction); and the rotating cylinder 69 is configured to be freely rotatable along the long circular axis in the left and right direction at the lower surface position of the contact unit 68, and according to the LED chip The arrangement angle of 21 is changed by the angle 'to form a specific number (here, five) of protruding cylindrical portions 69a at specific intervals. The contact unit 68 having the two contact pins 63 attached to the upper surface is configured to freely move up and down for the back surface of each of the LED chips 21. That is, when the stylus 63 and the contact unit 68 are optically detected, the LED wafers 21 are respectively disposed in the same number of LED chips wound in one row (horizontal direction) of the electronic component substrate 3 of the cylindrical roller 54 for each LED wafer 21. Just below the 21st. The operation of the terminal connection mechanism 6D having the above configuration will be described below. First, as shown in the circle 10 (a) to FIG. 10 (b), at the time of optical detection, the reflecting plate 71 and the light receiving element 72 are lowered, and the specific number 155083.doc -35 - 201202722 is used by the reflecting plate 71. The periphery of the LED chips 21 (here, five) is covered. In this case, a plurality of subsequent reflecting plates 71 are sequentially prepared by separating the five LED chips 21. In the above state, the 'long rotating drum 69 is rotated by a certain angle, and the protruding cylindrical portion 69a of the rotating cylinder 69 is moved directly below the lower surface of the contact unit 68 with the two stylus pins 63. The contact unit 68 and the two are The stylus 63—and pushes up the 'here' two needle-shaped stylus 63 through the adhesive sheet 31 (UV sheet) and is electrically connected to the first '11th and 21st LED chips 21 Positive and negative terminals on the back. In this manner, the two contact pins 63 are electrically connected to the positive terminal and the negative terminal of the LED chip 21, and a specific power supply voltage is supplied from the two contact pins 63 to the LED chip 21 to cause the LED chip 21 to emit light. At the same time, optical detection is performed on each of the first, eleventh and twenty-first illuminating LED chips 21 (check whether the amount of light is above the threshold value p, and that the rotating cylinder 69 is rotated and the angle is 360 degrees / the number of wafers N (N) After the angle of 5) is equal, the contact unit 68 with the two contact pins 63 is raised by the protruding cylinder portion 69a, and the two contact pins 63 penetrate the adhesive sheet 31 (UV sheet) to be connected to the LED chip. The positive terminal and the negative terminal on the back side of 21. Then, as shown in Fig. 10(b) to Fig. 1(c), the rotating cylinder 69 is further rotated by a specific angle, and the subsequent protruding cylindrical portion 69a arrives with two styli pins. Directly below the lower surface of the contact sheet 7C 68 of 63, the protruding cylindrical portion 69a pushes up the lower surface of the contact unit 68 together with the two contact pins 63. Here, the two needle-shaped stylus 63 penetrates the adhesive sheet. 31 (uv chip) is electrically connected to the positive terminal and the negative terminal of the back surface of each of the second, the first and the 22nd LED chips 21. Thus, the two stylus pins 63 are electrically connected to the LED chip 21 The positive terminal and the negative terminal 155083.doc 8 -36-201202722 sub' supply a specific power supply voltage from the two stylus pins 63 to the LEd wafer 21 The LED chip 21 emits light, and optically detects the second, second, and twenty-second light-emitting ED wafers 21 (check whether the amount of light is equal to or greater than a threshold value). In summary, the rotating cylinder 69 is further rotated with a wafer. After the angle (angle 36 / / wafer number 5) is equivalent, the previous contact unit 68 descends from the first protruding cylinder portion 69a and returns to the original position, and the subsequent contact unit 68 and the two stylus 63 are. And rising from the second protruding tubular portion 69a, the two stylus 63 penetrates the adhesive sheet 3 1 (UV sheet) and is connected to the positive terminal and the negative terminal of the back surface of the subsequent LED wafer 2 1. Repeat the above operation. The optical detection (whether or not the amount of light is equal to or greater than the threshold value) of the first to fifth, the eleventh, the fifteenth, and the twenty-first to the twenty-fifth of the five LED chips 21 that are sequentially illuminated is completed. In the same manner as in the first embodiment, the coordinate information of the LED chip 21 of NG is stored in the memory unit (RAM) as NG information. Then, the plurality of reflecting plates 71 and the light receiving element 22 are temporarily raised to exceed 5 The optical detection of the completed lEd wafer 21 moves to the right side. The plurality of reflecting plates 71 and the light-receiving element 22 are lowered, and the periphery of a predetermined number of un-Ed wafers 21 (here, five) which are not inspected is covered by the reflecting plate 71. The above-described inspection operation is repeated. The optical detection (whether or not the amount of light is equal to or greater than the threshold value) of the light-emitting LED chips 21 of the six to the first, the 16th to the 20th, and the 26th to the 30th is completed. In the case of the form 1, the coordinate information of the LED chip 21 of NG is similarly stored in the memory unit (RAM) as NG information. 155083.doc -37- 201202722 In the present and the present, a plurality of LED chips in a row (horizontal direction) can be sequentially illuminated to perform optical detection. Thereafter, the cylindrical pro- 54 is rotated by a specific distance, and a plurality of LED chips 21 in the next row (horizontal direction) are sequentially illuminated to perform optical detection. Therefore, the terminal connection mechanism 6D includes a stylus 63 electrically connected to the probe pin of the rear terminal of the LED chip 21; _3 is fixed on the upper surface, and there is an arc on the lower surface ^ = Moving in the longitudinal direction; the rotating cylinder 69' is configured to rotate freely along the long circular axis in the lateral direction at the lower surface position of the contact unit 68, and is changed in angle according to the arrangement interval of the coffee wafer 21, for the LED wafer 2i a specific number of protruding cylinders _ are formed at a specific interval, the protruding cylinder portion (4) pushes up the lower surface of the contact unit 68 by rotation; and a driving voltage output mechanism (not shown) which can drive the LED wafer 21 The driving voltage is supplied to the stylus 63 ° (Embodiment 7). FIG. 11 is a view showing a reflection plate and a probe integrated in a fourth example of the terminal connection mechanism of the electronic component operating performance measuring device according to the seventh embodiment of the present invention. The composition of the mode. As shown in Fig. 11, the electronic component substrate 3 is wound around a side surface of the electronic component. The partitioning mechanism 5 has a polygonal roller 55, and is disposed directly below the insulating reflector 71 and the insulating sheet 61B. The insulating sheet 61B and the probe pin 61A are integrated, and the respective distal ends abut (the reflecting plate 71A abuts against the surface probe pin 61A and abuts the side terminal) on the surface of the LED chip 21 and the terminal on the side surface. The two pin-shaped probe pins 155083.doc 8 -38-201202722 61A are electrically connected to each other from both sides to electrically connect the probe pin 61A to the positive terminal and the negative terminal of the side of the LED chip 21. The two probe pins 61A are arranged to be pressed against a specific number of rows (lateral directions) of a specific direction of the electronic component substrate 3 wound around the cylindrical roller roller 5 of the polygonal cross section for each of the LED chips 21, respectively. The terminal on the side of the LED chip 21. Thereby, when a plurality of LED chips 21 in one of the specific directions (horizontal direction) are sequentially illuminated, the two needle-like probe pins 61A directly below the reflecting plate 71A are placed along the back surface of the reflecting plate 7ia. The terminals above the side of the LED chip 21 are sequentially pressed, so that a specific power source voltage can be supplied from the two probe pins 61A to the LED chip 21 to sequentially emit the LED chips 21. At this time, the light-emission voltage can be supplied from the light-emitting voltage output source as the driving voltage output means to the two probe pins 61 A, thereby driving the LED chips 21 to emit light. The insulating sheet 6 j b is a sheet member for electrically insulating the probe pin 61A from the reflection plate 71A. Therefore, the terminal connection mechanism of the seventh embodiment has a configuration in which the reflection plate 71A, the insulating sheet 61B, and the probe pin 61A are integrated at a position directly below the dielectric barrier piece 61B below the reflection plate 71A, and the reflection is made. The front end of the plate 71A abuts against the surface of the LED chip 21, and the probe pin "A freely abuts or is spaced apart from the side terminal of the LED chip 21. (Embodiment 8) FIG. 12 is a schematic representation FIG. 13 is a longitudinal cross-sectional view showing the terminal connection mechanism of the fifth example of the terminal connection mechanism of the electronic component operating performance measuring apparatus according to the eighth embodiment of the present invention. FIG. 12 and FIG. In the terminal connection mechanism 6E of the eighth embodiment, the electronic component board 3 is wound around a side surface of the electronic component 155083.doc • 39. 201202722 The mechanism 5 has a circular cylindrical roller 56, and the stylus 63E At the same time, it is abutted against a specific number of (here, five) LED chips 21, and the stylus 63E can also be abutted to a specific number (here, five) of LEDs on opposite sides of the angle of 180 degrees. The back side of the wafer 21. The rotation shaft 69E of the central portion is rotated, whereby the plurality of stylus 63E provided at the distal end portion of each of the contact portions 6 8E connected in the crank shape via the upper and lower sides are five needle-shaped pins insulated from each other. The stylus 63E can be simultaneously pressed and electrically connected to the positive terminal and the negative terminal of the back surface of the five LED chips 21. The opposite sides of the five sets of the two stylus pins 63E are different from each other by an angle of 180 degrees. The root stylus 63E can simultaneously press the five sets of the two stylus pins 63E to one of the electronic component substrates 3 (horizontal direction) wound around the cylindrical roller 56 having a circular cross section for each LED chip 21. a terminal of the back surface of the specific number of LED chips 21 and a terminal of the back surface of the electronic component substrate 3 on the opposite side (the horizontal direction) of a specific number of the terminals of the lED wafer 21. Thereby, one column (horizontal direction) can be simultaneously A plurality of LED chips 21 and a plurality of LED chips 2 in one row (horizontal direction) on the opposite side are turned on and inspected. In this case, a driving voltage such as a specific light-emitting voltage may be used as a driving voltage output mechanism. Illuminated voltage output source for To the two stylus pins 63E, the LED chip 21 is driven to emit light or obtain a specific output voltage. Therefore, the terminal connection mechanism 6E includes a stylus 63E electrically connected to the probe of the rear terminal of the LED BB sheet 21. a pin; a rotating shaft 69E; a contact unit 68E connected to a crank-shaped upper and lower contact unit 68E on a side opposite to each other in a circular cross section of the rotating shaft 69E, the stylus 63 being fixed to the both end faces respectively Rotation of the rotating shaft 69E, and connecting the back terminal of each of the plurality of LED crystals 155083.doc 201202722 and the contact pins 63, respectively, to the back terminals of the plurality of LED chips 21 disposed on the opposite sides of the upper and lower sides; A driving voltage output mechanism (not shown) that supplies a driving voltage for driving the LED chip 21 to the stylus 63E. Furthermore, in the above-described first to eighth embodiments, when the electronic component 2 is a light-emitting device wafer, the electrical performance measuring mechanism 7 includes a reflecting plate 71 which will be specified. The number of the LED chips 21 as the light-emitting element wafer is covered, and the light emitted from the LED chip 21 is not leaked to the outside, and the light is reflected by the inner surface to guide the light to a specific direction; the light-receiving element 72, The photoelectric conversion is performed on the light from the reflecting plate 71 to obtain a photographic signal; and the wafer quality determining unit 73 compares the illuminance of the LED chip 21 with the threshold value based on the photographic signal from the light receiving element 72 to determine the LED chip. 21 is not limited to this, and the present invention can be applied to the case where the 'electrical action performance measuring mechanism 7' is used when the electronic component 2 is an LSI wafer or a light receiving element wafer. Including the chip quality determination unit's input/output of the terminal connection mechanism 6 via a specific number of LSI wafers or light-receiving element wafers Input and output threshold value is determined by comparing the electronic component 2 is good or bad. As described above, the present invention has been exemplified using the preferred embodiments of the present invention and the eighth embodiment. However, the present invention is not limited to the above-described embodiments to the eighth embodiment. The Applicant understands that the scope of the invention should be construed only by the scope of the patent application. It is understood by those skilled in the art that the present invention can be carried out in accordance with the specific and preferred embodiments 1 to 8 of the present invention, and is based on the disclosure of the present invention and the technical knowledge of the present invention. It is to be understood that the contents of the patents, patent applications, and documents cited in the specification are hereby expressly incorporated herein by reference in their entirety herein in [Industrial Applicability] The present invention relates to an electronic device that detects an optical element such as a light-emitting diode (hereinafter referred to as an LED element) or a light-receiving element, that is, an illuminating or receiving light, or an electronic device that inspects the operational performance of an lsi wafer. In the field of the component operating performance measuring device and the electronic component operating performance measuring method, the electrical component performance of the electronic component is directly measured without dicing the wafer component in a substrate state in which a plurality of wafer components are mounted. The device configuration can be greatly simplified, and the electrical characteristics or optical characteristics of each wafer component can be measured and inspected more easily. [Brief Description of the Drawings] Fig. 1 is a perspective view showing an example of a configuration of a main part of an electronic component side separation mechanism of an electronic component operation performance measuring device according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view in the short-side direction of a main part configuration example of a terminal connecting mechanism and an electrical operating performance measuring apparatus of the electronic component operating performance measuring apparatus according to the first embodiment of the present invention. Fig. 3 is a longitudinal cross-sectional view showing a configuration of a main part of a terminal connecting mechanism and an electrical operating performance measuring device of the electronic component operating performance measuring apparatus according to the first embodiment of the present invention. Figure 4 is a plan view of the reflector of Figures 2 and 3 and the LED crystal 155083.doc • 42·201202722 as an electronic component. Fig. 5 is a perspective view schematically showing an example of a configuration of a main part of an electronic component side surface partitioning mechanism and a terminal connecting mechanism of the electronic component operating performance measuring apparatus according to the second embodiment of the present invention. Fig. 6 is a view showing a configuration of a main part configuration of an electronic component side surface separation mechanism and an electrical activity performance measuring mechanism of the electronic component operation performance measuring device according to the third embodiment of the present invention. Fig. 7 is a view schematically showing the configuration of a main part of a terminal connecting mechanism of the electronic component operating performance measuring apparatus according to the third embodiment of the present invention. Fig. 8(a) to Fig. 8(c) are schematically shown. A configuration diagram of a wedge method of a first example of a terminal connection mechanism of an electronic component operation performance measuring device according to a fourth embodiment of the present invention. Fig. 9 (a) to Fig. 9 (c) are diagrams showing a configuration of a second embodiment of the terminal connection mechanism of the electronic component operating performance measuring apparatus according to the fifth embodiment of the present invention. Fig. 10 (a) to Fig. 5 (c) are diagrams showing a configuration of a rotary cylinder type of a third example of the terminal connection mechanism of the electronic component operating performance measuring apparatus according to the sixth embodiment of the present invention. Fig. 11 is a view showing a configuration of a reflection plate and a probe integration method of a fourth example of the terminal connection mechanism of the electronic component operation performance measuring device according to the seventh embodiment of the present invention. The figure is a schematic diagram showing the structure of the fifth embodiment of the terminal connection mechanism of the electronic component operating performance measuring apparatus according to the eighth embodiment of the present invention. 155〇83.d〇c -43 - 201202722. Longitudinal section of the material connection mechanism of (4) and ®13_®12. The circle 14 schematically shows the vertical βα circle of the electronic component side spacer mechanism and the terminal connection mechanism of the electronic component operating performance measuring device of Fig. 5 . [Description of main component symbols] 1. ΙΑ, 1Β Electronic component operation performance measurement device 2 Electronic component 3 Electronic component substrate 4 Openings 5, 5Α, 5Β Electronic component side separation mechanism 6, 6Α~6F h sub-connection mechanism 7 Electrical Action performance measuring mechanism 21 LED wafer 22 Lens 31 Adhesive sheet (UV sheet) 51 ' 53-56 Cartridge roller 52 Rotating shaft 61, 61 探针 Probe pin 62 Second terminal connecting mechanism 61 绝缘 Insulation sheets 63 , 63 Ε Stylus (probe pin) 64, 66, 68, 68Ε Contact unit 155083.doc •44· 201202722 65 65a 67 67a 69 69a 69E 71, 72 73 Moving shaft wedge-shaped protrusion pressure air tube air vent rotating barrel protruding Tube rotation axis 71A Reflector plate light receiving element chip quality judgment unit 155083.doc -45-

Claims (1)

201202722 VII. Patent application scope: 1. An electronic component operation performance device, which is in the form of a plurality of mounted electronic component substrates. "Time for the electronic component (4): Inspector, the above-mentioned plurality of mounted electronic devices There are (four) electronic components arranged in a matrix on the component substrate, and the plurality of electronic components are respectively cut off in a state in which the back surface is adhered to the sheet, and the electric device includes: X-electronic parts operating performance measuring electronic parts side separated a mechanism for bending the electronic component substrate along a curved surface or a corner, so that the front and rear adjacent electric circuits are separated from each other by a side, a terminal connection mechanism, which is connected to a specific terminal of the electronic component, and an electric The sexual performance performance mechanism is configured to perform electrical operation performance of the solid or a plurality of electronic components in a state in which one or a plurality of electronic components are driven and connected via the terminal connection mechanism. 2. The apparatus for measuring the performance of an electronic component according to the item 1, wherein: one or a plurality of sections having a circular or polygonal cross section and a rotating shaft having a polygonal cross section are opened. The above-mentioned electronic component side isolation device 3. The electronic component operation performance measuring device according to claim 1, wherein the terminal connection mechanism comprises: a probe pin 'which can be electrically connected to two terminals: a terminal on a back side or a side surface of the component; And drive voltage output probe pins. The boat dynamic voltage of the component is supplied to the electronic component operating performance measuring device according to claim 3, wherein when the terminal is present on the back surface of the electronic component, the terminal 155083.doc 201202722 is connected to the front end of the inspection mechanism. The two probe pins of the needle shape are passed through the back sheet to be connected to the terminals of the electronic component. 5. The electronic component operation performance measuring device according to claim 1, wherein when the electronic component is a light-emitting device wafer, the electrical performance measuring mechanism comprises: a reflecting plate that surrounds a specific number of the light-emitting device wafers Covering and not leaking light emitted from the light-emitting element wafer to the outside, and reflecting the light by the inner surface to guide the light to a specific direction; and the light-receiving element photoelectrically converting the light from the reflector A photographing signal is obtained, and a wafer quality determination unit compares the light emission of the light-emitting element wafer with a threshold value based on an image pickup signal from the light-receiving element, and determines whether the light-emitting element wafer is good or bad. 6. As requested in item 1, the j praised a_ The threshold value of the value is compared to determine whether the electronic component is good or bad. The electronic component motion performance device of claim 5 or 6, wherein The electronic component operation performance device of claim 3, wherein the terminal connection mechanism comprises: a month-end measuring device, wherein the first terminal connecting mechanism is used for I55083.doc 201202722 to pin the probe for each of the above electronic components Connected to the electronic component t-terminal 'to check the optical characteristics of the electronic component; and a second: connection mechanism for simultaneously connecting the probe pin to all of the plurality of electronic components inspected with the optical characteristics described above Terminal, pair = no shape - the number of 仏 Taizhi's choker checks the electrical characteristics of the electronic part. 9. The electronic component operating performance measuring device of the request, wherein: the terminal connecting mechanism comprises: a probe pin electrically connected to a rear terminal 丨 contact unit of the electric component, the upper probe pin, and the lower The surface becomes a tapered surface as described below directly below the lower surface of the contact unit === which constitutes a free movement of the Bu Wan/0 transverse direction, and the = surface is provided with a wedge-shaped protrusion, which is formed by the above-mentioned Ray T And a drive-output mechanism for supplying the drive (4) for pulsing the electronic component to the above-mentioned 10. The electronic component action performance measuring device according to claim 1, wherein the pot-connecting mechanism comprises: a probe pin, and the electrical property thereof Connected to the electric probe pin; the contact unit has the probe pin on the upper surface, and the lower surface is opened in such a manner as to be movable according to whether or not the air is ejected, and the above-mentioned constricted - μ工' is configured to rotate freely under the opening of the upper end of the singular end face, and is changed according to the above-mentioned arrangement of the °, 卞苓, 卞苓 • , , , , , , , There are multiple sprays With the driving voltage output means' which can be a drive voltage is supplied to the electronic components of the probe pin. The electronic component operating performance measuring device of claim 1 wherein the terminal connecting mechanism comprises: a probe pin electrically connected to a rear terminal of the electronic component; and a contact unit configured to The upper surface is fixed with the above-mentioned probe pin, and has a curvature at a corner of the lower surface and is movable in a longitudinal direction. The rotating cylinder is configured to be located at a lower surface of the contact unit, and has a long circular axis in the left-right direction. Rotating, and changing the angle according to the arrangement interval of the above-mentioned electronic components, for each of the above-mentioned electronic components, a certain number of protruding cylindrical portions are formed at specific intervals to push up the lower surface of the contact unit by rotation; and driving A voltage output mechanism that supplies a driving voltage for driving the electronic component to the probe pin. 12. The electronic component operating performance measuring device according to claim 5, wherein the terminal connecting mechanism is configured such that the reflecting plate, the insulating sheet, and the probe are located directly below the dielectric insulating sheet below the reflecting plate. The pin is integrated, the front end of the reflector abuts against the surface of the light-emitting element wafer, and the probe pin abuts on or is separated from the side terminal of the light-emitting element wafer. 1 3: The apparatus for measuring the performance of an electronic component according to the item 1, wherein the above-mentioned electronic connection mechanism includes a probe pin electrically connected to a rear terminal of the electronic component; a rotating shaft; a contact unit, which is connected a crank-shaped upper and lower contact unit on a side opposite to each other in a circular cross section of the rotating shaft, wherein the probe pins are respectively fixed to the both end faces, and the back of each of the plurality of electronic components is simultaneously rotated by the rotating shaft Each of the terminal and the probe pin is connected to a rear terminal of each of the plurality of electronic components disposed on the opposite side of the upper and lower sides of the 155083.doc 201202722; and a driving dust structure capable of driving the driving voltage of the electronic component To the above-mentioned probe pin. 14. An electronic material performance carrying method, wherein the electrical component performance of the electronic component is checked by a plurality of mounted electronic component substrates, and the plurality of electronic component substrates are mounted The plurality of electronic components are arranged in a matrix, and the plurality of electronic components are respectively adhered to the state of the sheet on the back side The method for measuring the operating performance of the electronic component includes: a step of separating the side surface of the electronic component, and a side separating mechanism of the electronic component, so that the electronic component substrate is fed along a curved surface or a corner, so that the side between the adjacent electronic components is separated. a terminal connection step of connecting a terminal connection mechanism to a specific terminal of the electronic component; and an electrical operation performance measuring step of electrically-operating performance 敎 mechanism driving one or more of the plurality of terminals connected via the terminal connection mechanism The electrical performance of the one or more electronic components is measured under the state of the electronic component. 155083.doc