201146128 六、發明說明： 【發明所屬之技術領域】 本發明之實施形態係關於電子機器用殼體及其製造方 法。 【先前技術】 先前’係使用包含於含鎂合金之金屬構件上利用射出成 形而將成形用樹脂一體成形之複合成形體之電子機器用殼 體。如此一體成形金屬構件與成形用樹脂之情形中，由於 成形用樹脂之成形收縮而易於複合成形體上產生翹曲。尤 其結晶性塑膠與非結晶性塑膠相比成形收縮之異方性較 大，一體成形之情形中翹曲易變大。再者，於複合成形體 上進行焙燒塗裝之情形中，在金屬構件與成形用樹脂之接 .合部易產生浮動與剝落。為解決金屬構件與成形用樹脂之 體成形之問通’至今嘗試有各種研討（例如參照專利文 獻1~4)。 [先前技術文獻] [專利文獻] [專利文獻1]曰本特開平7-124995號公報 [專利文獻2]日本特開2001-3 15 162號公報 [專利文獻3]日本特開2002-232220號公報 [專利文獻4]曰本特開2009-273104號公報 【發明内容】 本發明之電子機器用殼體，係具有由射出成形而將鎂合 金模鑄成形而成之金屬構件，與含非結晶性熱可塑性樹脂 152908.doc 201146128 之成形用樹脂一體成形而成之複合成形體，且於其表面進 行培燒塗裝者》金屬構件與成形用樹脂經由接著劑層而接 合。接著劑層係包含接著劑組合物，其含有（A)環氧樹 脂、（B)環氧樹脂用硬化劑及（C)彈性體作為必須成份，且 相對於（A)環氧樹脂100質量份，含有5〜4〇質量份之（c)彈 性體。又，焙燒塗裝係使用2液混合型焙燒塗料進行。 【實施方式】 以下’針對實施形態之電子機器用殼體及其製造方法進 行詳細說明》 實施形態之電子機器用殼體係具有由射出成形而將使鎂 合金模鑄成形而成之金屬構件，與含非結晶性熱可塑性樹 月曰之成形用樹脂一體成形而成之複合成形體，且於其表面 進行培燒塗裝者。金屬構件與成形用樹脂經由接著劑層而 接合。接著劑層係藉由含有環氧樹脂、環氧樹脂用 硬化劑及（C)彈性體作為必須成份，且相對於（A)環氧樹脂 100質量份，含有5〜40質量份之（C)彈性體之接著劑組合物 而構成。又’焙燒塗裝係使用2液混合型焙燒塗料進行。 根據如此之實施形態之電子機器用殼體，可縮小該翹曲， 且可抑制在金屬構件與成形用樹脂之接合部之塗料部份產 生浮動或剝落。 金屬構件若係將鎂合金模鑄成形而成者則無特別限制， 例如可舉出大致矩形之鎂製蓋板等。於金屬構件上可設置 例如用以使成形用樹脂卡合之卡合部，例如亦可穿孔用以 錨栓效果之卡合孔作為卡合部。金屬構件可利用溶解鎂合 152908.doc 201146128 金、例如AZ9戰，將該熔㈣出成形於模具上之鎮 法而製造。 另，亦可於金屬構件之表面形成作為防銹膜之化學處理 膜。如此之化學處理膜可利用眾所周知之處理方法形成。 即，-般係利用含有磷酸鹽之表面處理劑進行處理後，以 防錄前處理劑進行處理，接著利用含有芳香族幾酸或選自 其鹽類之至少i種及界面活性劑之清洗劑進行處理，進而 可藉由以鎂用防銹劑進行處理而形成。 接者劑組合物如上述，係含有（A)環氧樹脂、環氧樹 脂用硬化劑及（C)彈性體作為必須成份者。作為㈧成份之 環氧樹脂，可舉幻分子中具有2個以上環氧基之環氧樹 脂:例如雙紛A型環氧樹脂、雙紛F型環氧樹脂、盼链清漆 型環氧樹脂、縮水甘油㈣環氧樹脂、脂環族環氧樹脂、 雜環型環氧樹脂、縮水甘油越系之改性環氧樹脂' 及其漠 化物等’該等可單獨或混合2種以上使用。 八、 作為（B)成份之環氧樹脂用硬化劑，若係作為一般環氧 樹脂之硬化劑使用之化合物則可無特別限制地使用。例如 作為胺系硬化劑，可舉出雙氰胺、芳香族二胺等，作為苯 酚系硬化劑，可舉出酚醛清漆樹脂、曱酚酚醛清漆樹脂、 雙酚A酚醛清漆樹脂、三嗪改性酚醛清漆樹脂、醯亞胺改 性酚醛清漆樹脂、進而含聯苯結構之酚醛清漆樹脂或萘酚 系多官能型硬化劑等，該等可單獨或混合2種以上使用。 (B)成份環氧樹脂用硬化劑之調配量較佳為以相對於（八） 成份裱氧樹脂之環氧基數，可與該（A)成份環氧樹脂之環 I52908.doc 201146128 氧基反應之（B)成份之環氧樹脂用硬化劑之反應性基數比 (⑻成份it氧樹脂用硬化劑 < 反應性基數/(A)成份環氧樹 脂之環氧基數）成G.7H.3之方式進行調整。使（B)成份之環 氧樹脂用硬化劑之調配量滿足如此之基數比，從而可❹ (A)成伤之％氧樹脂及（B)成份之環氧樹脂用硬化劑之各個 未反應部份。 作為（C)成份之彈性體，可舉出例如丙稀酸橡膠、丙稀 腈丁二烯橡膠、苯乙烯丁二烯橡膠、丁二烯丙烯酸曱酿丙 稀腈橡膠、丁二稀橡膠、各士#诗 冲像修、含有羧基之丙烯腈丁二烯橡膠、 含有乙稀基之丙烯腈丁-，法維棚 π月j 一埽橡膠、矽酮橡膠、胺基甲酸酯 橡膠、聚乙烯縮丁醛等，嗲黧 寺通寺了早獨或組合2種以上使 (C)成伤彈性體之調配量相對於（Α)成份環氧樹脂1〇〇質 量伤為5 4G質1份。若（c)成份彈性體之調配量不滿$質量 伤則接。面、即金屬構件與成形用樹脂間之緩衝效果不 充分，有於接合部產生浮動或剝落之虞。另一方面，若 ⑹成份彈性體之調配量超過4〇質量份，則接著性下降， 例如進行培燒塗裝之情形中有於接合面產生㈣之虞。 接者劑組合物除上述⑷〜(C)成份外，可於必要時且在 不違反本發明目的之限度上含有其他成份，例如無機填充 材、二嘻硫醇衍生物、咏嫂土 /丨 物防橡膠老化劑、著色劑、阻燃劑 如此之接著劑組合物可採用眾所周知之方法調製。例如 調配上述必須成份、其他依需要所加人之成份後，可使用 J52908.doc 201146128 罐磨機、球磨機、珠磨機、輥磨機、均化機、超粉碎機或 粉碎擂潰機等眾所周知之混練機，於室溫或加熱下混練而 調製。又，可添加溶劑調整為適於加工方法之粘度使用。 作為溶劑，可舉出甲醇、乙醇、異丙醇等醇系溶媒、丙 酮、曱基乙基酮等酮系溶媒、苯、甲苯、二甲芏 媒、1，4-二噁烷、l，3-二噁烷、丙二醇單甲基醚等醚系溶 媒、或N-甲基吡咯烷酮、二甲基甲醯胺等，該等可單獨或 組合2種以上使用。 如此之接著劑組合物使用於使金屬構件與成形用樹脂接 著之接著劑層之形成中。接著劑組合物例如塗布於金屬構 件之與成形用樹脂之接合面上，藉由加熱處理成半硬化狀 態而可成為接著劑層。 接著劑層之厚度例如為1 〇〜50 μηι較佳。成如此厚度從而 可將金屬構件與成形用樹脂良好地結合，又金屬構件與成 形用樹脂間之緩衝效果亦可充分，易抑制接合部之浮動或 剝落。又，用以成半硬化狀態之加熱處理例如使加熱溫度 為120〜15 0°C，使加熱時間為3〜20分鐘進行較佳。進行如 此之加熱處理，從而可利用接著劑層將金屬構件與成形用 樹脂良好地接著，可減少接合部之浮動或剝落。 如此之加熱處理尤其較好進行至接合劑層之流值成 50〜1000 μηι。使流值為50 μιη以上，從而易抑制金屬構件 與成形用樹脂之接合部之浮動或剝落。又，使流值為1 〇〇〇 μηι以下，從而經由接著劑層一體成形金屬構件與成形用 樹脂時，易抑制接著劑層（接著劑組合物）溢出。由更有效 152908.doc 201146128 抑制接著劑層之溢出或接合部之浮動或剝落之觀點而言， 流值為100〜700 μιη更佳，1 〇〇〜4〇〇 μπι進而佳。 此處，流值係如下測定者。即，將接著劑組合物以特定 厚度塗布於 >專膜基材上後，以不鏽鋼板失持，以特定溫度 與時間進行加熱處理’藉此獲得接著片。對如此而得之接 著片實施直徑3 mm之孔加工’以12(TC、1〇分鐘、2 5 Mpa 進行加熱加壓成形後’測定樹脂從實施孔加工之端部之流 出長度》 另，接著劑層除如上述於金屬構件之表面直接塗布接著 劑組合物而形成外，亦可例如於聚酯薄膜等薄膜片上塗布 接著劑組合物，進行加熱處理成半硬化狀態之接著片後， 將該接著片熱按壓於金屬構件之表面藉而形成。此時，例 如以60〜1 50 C之溫度’施加2〜200 N/cm2之壓力而進行熱 按壓，從而可良好地將接著片接著於金屬構件上。又，該 接著劑層亦為10〜50 μπι之厚度較佳。 作為成形用樹脂，較佳使用非結晶性熱可塑性樹脂，具 體可舉出ABS(丙烯腈· 丁二烯-苯乙烯樹脂）、ρμμα(聚曱 基丙烯酸曱酯）、PC(聚碳酸酯）、mPPE(改性聚苯醚）、或 PES(聚喊碼·）等。該等非結晶性塑膠一般與結晶性塑膠相 比成形收縮率較小，一體成形、例如注塑成形後之電子機 器用殼體之翹曲或彎曲變小，因而較佳。 必要時可對成形用樹脂添加纖維狀、粉粒狀、板狀填充 材°尤其為獲得翹曲較小之複合成形體而較佳使用纖維狀 或板狀填充材。 152908.doc 201146128 作為纖維狀填充材， 了舉出玻璃纖維、碳纖維、二氧化 —化矽氧化鋁纖維、氧化锆纖維、鈦酸鉀纖 、，. 侧纖維、進而不鏽鋼、紐、欽、銅、黃銅等金屬 之纖維狀物等無機質纖維狀物。尤其作為代表性纖維狀填 純，可舉出玻璃纖維、碳纖維。另，亦可使用聚酿胺、 氟樹月曰丙稀酸樹脂等高溶點有機質纖維狀物。 作為粉粒狀填充材，可舉出碳黑、二氧化石夕、石英粉 末、玻璃珠、玻璃粉、玻璃短纖維、矽酸鈣'矽酸鋁、高 嶺土⑺石、黏土、矽藻土、如矽灰石之矽酸鹽、氧化 鐵、氧化鈦、氧化辞、如氧化铭之金屬氧化物、碳酸詞、 如碳酸鎂<金屬之碳酸鹽、硫酸弼、如硫酸鋇之金屬之硫 酸鹽、其他碳化矽、氮化矽、各種金屬粉末。 又，作為板狀填充材，可舉出雲母、玻璃鱗片、各種金 屬箔等。作為非纖維狀無機填充材，較佳為滑石、玻璃 珠、玻璃短纖維、雲母、玻璃鱗片❶該等填充材可為一種 或並用二種以上。 調配填充材之情形時，其調配量為每樹脂成份丨〇〇質量 份為10〜200質量份較佳，50〜150質量份更佳。填充材之調 配量為10質量份以上之情形中，自金屬構件之上浮較少， 可有效抑制複合成形體之翹曲。另一方面，填充材之調配 量為200質量份以下之情形中，成形性變良好，又成形用 樹脂不易碎。 於含金屬構件、接著劑層及成形用樹脂之複合成形體表 面，使用2液混合型塗料進行焙燒塗裝。作為2液硬化型塗 152908.doc 201146128 料，無特別限制，但例如主劑係聚合物末端如羥基般含活 性氫之基者較佳，硬化劑係聚異氰酸酯較佳。 利用如此塗料，可使焙燒溫度為80〜110°C，相比需要— 般150°C以上之焙燒溫度之環氧系塗料，可降低焙燒溫 度。因此’易抑制金屬構件與成形用樹脂之接合面之膨脹 或剝落之產生。 接著’針對實施形態之電子機器用殼體之製造方法進行 說明。 實施形態之電子機器用殼體之製造方法係關於在利用射 出成形’將使鎂合金模禱成形而成之金屬構件，與含非結 晶性熱可塑性樹脂之成形用樹脂一體成形而成之複合成形 體之表面’進行焙燒塗裝而成之製造方法。 根據貫施形態之製造方法，首先在金屬構件之與成形用 樹脂之接合面形成接著劑層。接著劑層係包含含有（A)環 氧樹脂、（B)環氧樹脂用硬化劑及彈性體作為必須成 份，且相對於（A)環氧樹脂1〇〇質量份，含有5〜4〇質量份之 (c)彈性體之接著劑組合物者。又，接著劑層以i2(rc之流 值成50〜1〇〇〇 μιη之方式進行調整。 其後’進行對形成有接著劑層之金屬構件利用射出成形 而將成形用樹脂一體成形’獲得複合成形體之步驟。再 者’進行於複合成形體之表面使用2液混合型焙燒塗料， 以不滿120°C之培燒溫度進行培燒塗裳之步驟。 以下’具體說明實施形態之製造方法。根據實施形態之 製造方法’如圖1所示，首先進行在將鎂合金模鑄成形而 I52908.doc -10- 201146128 成之金屬構件中之至少與成形用樹脂之接合面之表面，設 置含上述接著劑組合物，120°C之流值為50-1000 μιη之接 著劑層之步驟（以下稱接著劑層形成步驟）。 接著劑層之形成如已說明，可藉由以12〇°C之流值成 50〜1000 μιη之方式’例如叾使加熱溫度為12〇〜15〇。〇，加 熱時間為3〜20分鐘之加熱處理而使接著劑組合物成半硬化 狀態而進行。又’接著劑層之厚度例如為1〇〜5〇 μιη較佳。 其後’進行對形成有接著劑層之金屬構件利用射出成形 而將成形用樹脂一體成形’獲得複合成形體之步驟（以下 稱成形步驟）。再者，進行於複合成形體之表面使用2液混 合型焙燒塗料，以不滿12〇。(：之焙燒溫度進行焙燒塗裝之 步驟（以下稱塗裝步驟）。 圖2係顯示實施形態之製造方法所使用之成形模具及製 造步驟之一例之剖面圖。如圖2(Α)所示，成形模具21由例 如具有凹部之孔型22，及具有凸部之芯型23構成。另，圖 2(A)所不之成形模具顯示模具打開之狀態。金屬構件1 i配 置於如此之成形模具21内部，具體係孔型22之凹部内（圖 2(B)) 〇 然後，於該金屬構件丨丨之接合成形用樹脂之接合面形成 接著劑層12(接著劑層形成步驟p接著劑層12例如可藉由 對配置於成形模具21上之金屬構件i!塗布接著劑組合物， 由加熱處理成半硬化狀態而形成。此時，調整接著劑組合 物之塗布量，從而可調整接著劑層12之厚度…調整加 熱處理之條件，從而可調整接著劑層12之流值。 152908.doc 201146128 另，接著劑層12之形成未必一定以配置於成形模具2丨之 狀態進行，例如亦可在配置於成形模具2丨前預先於外部進 行。又，接著劑層12之形成未必—定限於在金屬構件丨i上 直接塗布接著劑組合物之方法’如已說明’亦可首先製作 含接著劑組合物之接著片後，將該接著片熱按壓。 接著，在使孔型22與芯型23當設而合模之狀態下，以特 定壓力將經加熱之成形用樹脂13射出，暫時保持後進行開 模，取出經由接著劑層12將金屬構件u與成形用樹脂13一 體成形，例如注塑成形之複合成形體14(圖2(c)、（D卜成 形步驟）。 於如此之複合成形體14之表面，使用2液混合型塗料以 不滿120°C之焙燒溫度進行焙燒塗裝（塗裝步驟）。使用2液 混合型塗料’ &而易以不滿12代進行培燒。培燒溫度成 120°C以上之情形中，有在金屬構件^與成形用樹脂η之 接合面產生膨脹或剝落之虞，因而不佳。 作為2液混合型塗料，例如主劑係聚合物末端如羥基般 含活性氫之基者較佳，硬化劑係聚異氰酸酯系較佳。利用 如此塗料，可使焙燒溫度為不滿12〇t ，具體為 8〇〜1HTC ’相比需要-般15n：以上之培燒溫度之環氧系 塗料，可降低焙燒溫度。 ' 列如0J使用空氣喷 塗裝方法無特別 、Λ ，JBtt , 塗法、鐘形塗裝法等眾所周知之塗裝方法，無特別限 塗膜之厚度無限制但1〇〜100 μΓη較佳。塗膜之厚度不 μΓΠ時基底之隱蔽性差，超過1〇〇 易產生外觀不< 152908.doc -12· 201146128 而不佳。 接著，針對電子機器之其他實施形態，參照圖3、4進行 說明。圖3中，將跟前側（即使用者側）定義成前方向f，將 從使用者所見内側定義成後方向R，將從使用者所見左側 疋義成左方向，將從使用者所見右側定義成右方向，將從 使用者所見上方定義成上方向，將從使用者所見下方定義 成下方向。 如圖3所示，電子機器之一例之手提電腦lu具備主體單 元112與顯示單元113。主體單元112具有鉸鏈部114，鉸鏈 部114可旋轉地支撐顯示單元丨丨3。 主體單元112例如具備由鎂合金等金屬而形成箱狀之本 體機殼115、安裝於本體機殼115之上面之鍵盤116、設於 本體機设115之上面之觸摸板117、收納於本體機殼us内 部之印刷電路板118。印刷電路板丨丨8具有CPU或RAM、 R0M等電路零件，總括控制手提電腦111全體。本體機殼 Π5具有構成其上側半部份且固定有鍵盤116之上殼體 115 A ’及構成下側半部份之下殼體11 5B。 顯示單元113具有顯示器121、包圍顯示器121周圍之含 金屬及合成樹脂等之顯示器機殼122、安裝於顯示器機殼 122之遮罩123上之複數之緩衝構件124。顯示器121於本實 施形態中’例如以液晶顯示器面板構成，但亦可為其他種 類之顯示器面板。緩衝構件124以具有彈性之例如橡膠等 構成。緩衝構件124在顯示單元113覆蓋主體單元112之位 置，即顯示器機殼122之第2殼體之遮罩123旋轉至與主體 152908.doc -13· 201146128 單元112對向之位置時，與主體單元112碰撞。另，本實施 形態中’殼體（電子機器用殼體）126以主體機殼115與顯示 器機殼122構成。 如圖4所示，顯示器機殼122具有覆蓋顯示器m之背面 之第1殼體之蓋131 ’及覆蓋顯示器ι21之前面之第2殼體之 遮罩123。遮罩123與蓋131分離設置，例如由合成樹脂村 料形成平坦框狀。 蓋13 1係於金屬製基底之一部份一體成形合成樹脂者， 作為全體形成平板狀。即，蓋131具有設有開口部132八之 金屬部（金屬構件132)、以覆蓋該開口部132A之方式而設 置之樹脂部（成形用樹脂）133、從金屬部132向樹脂部延 伸之犬出邓134、设於突出部丨3 4上，將金屬部丨3 2與樹脂 部133接著之固定構件（接著劑層）135。金屬部132例如以鎂 合金等形成，但亦可為其他金屬材料。 根據本實施形態，作為固定構件135，採用包含含有特 定量彈性體之環氧樹脂組合物之接著劑。使用固定構件 135’從而-體成形有含非結晶性熱可塑性樹脂之成形用 樹脂之、即金屬製基底之一部份 — 〇丨伤上一體成形有合成樹脂之 本貫施形態之電子機器用殼體φ , I 叹命和叔版肀，翹曲較少，又外觀異常 亦較少。 另 111， 機器 範圍 ，電子機器不限於上述實施形態所示Μ提電腦 例如當然亦可對如手機之其他電子機器實施。電子 不限於上述實施形態’實施階段中在不脫離其主旨之 内可將構成要素變形並具體化…藉由上述實施形 152908.doc 201146128 態所揭示之複數之構成要素之適當組合而可形成各種發 明。例如，亦可從實施形態所示之所有構成要素中刪除一 些構成要素。再者，亦可適當組合不同實施形態之構成要 素。 [實施例] 以下，參照實施例更詳細地說明。 (接著劑組合物之製作） 將作為（A)成份環氧樹脂之jER ΥΧ4000Η(日本環氧樹脂 公司製，商品名，環氧當量195) ; jER 807(曰本環氧樹脂 公司製，商品名，環氧當量1 68);作為（B)成份環氧樹脂用 硬化劑之雙氰胺；作為（C)成份彈性體之含有羧基之丙烯 腈丁二烯橡膠（曰本zeon公司製，商品名：Nipoll072);及 作為硬化促進劑之2E4MZ-CN(四國化成公司製，商品名： 1-氰乙基-2-乙基-4-曱基咪唑），以成表1所示比率之方式進 行調配，使之溶解、分散於曱基乙基酮中，製成接著劑組 合物a~e 〇 [表1] 接著劑組合物 a b c d e 成份 [質量份] (A) 環氧樹脂 jERYX-4000 50 50 50 50 50 jER-807 30 30 30 30 30 (B) 硬化劑 DICY-7 6.5 6.5 6.5 6.5 6.5 (C) 彈性體 Nipol1072 0 5 10 30 50 其他 硬化促進劑 2E4MZ-CN 3.5 3.5 3.5 3.5 3.5 相對於(A)成份100質量份之(C)成份之調配量 [質量份] 0 6.25 12.5 37.5 62.5 152908.doc -15- 201146128 (金屬構件之製作） 將溶融之鎂合金AZ91D送至電子機器用殼體之模鑄模 具’模鑄成形10 mmx280 mm之大致矩形之金屬構件。 (實施例1) 在金屬構件之與成形用樹脂之接合部份塗布接著劑組合 物b ’由加熱處理成半硬化狀態而形成接著劑層（接著劑層 形成步驟）。此處’使接著劑層之厚度為25 μηι。又，加熱 處理係以15〇°C進行3分鐘，以接著劑層之1 2(TC之流值成 200 μιη之方式進行調整。 將形成有接著劑層之金屬構件設置於保持在60°C之注塑 模具上後’將非結晶性塑膠之聚碳酸酯樹脂（樹脂流動方 向之成形收縮率為〇·〇5〜0.25%，流動直角方向之成形收縮 率為0.2°/。〜0.45%)射出成形，獲得金屬構件與成形用樹脂 經由接著劑層一體成形之複合成形體（成形步驟）。 接著’於複合成形體之表面塗布2液硬化型胺基甲酸酯 系樹脂塗料後，以l〇〇°C進行30分鐘焙燒，形成30~40 μιη 厚度之塗膜。再者，塗布塗層用胺基曱酸酯系透明塗料 後’以100°C進行30分鐘焙燒，形成30〜40 μιη厚度之塗 膜，獲得作為個人電腦用LCD蓋之電子機器用殼體（塗裝 步驟）。 (實施例2) 除將接著劑組合物b之塗布後之加熱處理以150°C進行1 〇 分鐘，以接著劑層之120°C之流值成〇 μιη之方式進行調整 外，與實施例1相同地獲得電子機器用殼體。 152908.doc •16- 201146128 (實施例3) 除將接著劑組合物b之塗布後之加熱處理以80°C進行3分 鐘’以接著劑層之120°C之流值成1 500 μιη之方式進行綱整 外，與實施例1相同地獲得電子機器用殼體。 (實施例4) 除使用接著劑組合物c外，與實施例1相同地獲得電子機 器用殼體。 (實施例5) 除使用接著劑組合物d外，與實施例1相同地獲得電子機 器用殼體。 (比較例1) 除使用接著劑組合物a外，與實施例1相同地獲得電子機 器用殼體。 (比較例2) 除將作為成形用樹脂之結晶性塑膠之聚苯硫醚樹脂（樹 脂流動方向之成形收縮率為0.2%，流動直角方向之成形收 縮率為1.0%)射出成形而使用外，與實施例1相同地獲得電 子機器用殼體。 (比較例3) 除將作為成形用樹脂之結晶性塑膠之聚對苯二甲酸丁二 酯樹脂（樹脂流動方向之成形收縮率為〇 4%，流動直角方 向之成形收縮率為1 ·〇%)射出成形使用外，與實施例i相同 地獲得電子機器用殼體。 (比較例4) 152908.doc 201146128 除使用接著劑組合物e外，與實施例1相同地獲得電子機 器用殼體。 (比較例5 ) 除取代2液硬化型胺基甲酸酯系樹脂塗料而塗布1液型環 氧系樹脂塗料，以150°C進行30分鐘焙燒外，與實施例1相 同地獲得電子機器用殼體。 (評估） 針對實施例及比較例之電子機器用殼體，由以下所示方 法評估翹曲及外觀《將結果顯示於表2。 [勉曲] 利用間隙規尺測定該 隙，將最大值作為翹 將電子機器用殼體靜置於平板上， 電子機器用殼體之4角與平板之間 曲。 [外觀] 目視觀察電子機器用殼體夕洛# i[Technical Field] The present invention relates to an electronic device casing and a method of manufacturing the same. [Prior Art] A housing for an electronic device using a composite molded body in which a molding resin is integrally molded by injection molding on a metal member containing a magnesium alloy. In the case where the metal member and the molding resin are integrally molded in this manner, warpage of the composite molded body is liable to occur due to molding shrinkage of the molding resin. In particular, the crystalline plastic has a larger anisotropy in forming shrinkage than the amorphous plastic, and the warpage tends to become large in the case of integral molding. Further, in the case where the composite molded body is subjected to baking coating, the joint portion of the metal member and the molding resin is liable to cause floating and peeling. In order to solve the problem of forming a metal member and a molding resin, various attempts have been made so far (for example, refer to Patent Documents 1 to 4). [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2002-232220 (Patent Document 2) JP-A-2001-315 162 [Patent Document 3] JP-A-2002-232220 [Invention] The electronic device casing of the present invention has a metal member molded by injection molding and a magnesium alloy, and contains a non-crystalline material. The thermoplastic resin 152908.doc 201146128 is a composite molded body in which a molding resin is integrally molded, and a metal member and a molding resin are bonded to each other via a pressure-sensitive adhesive layer. The adhesive layer further comprises an adhesive composition containing (A) an epoxy resin, (B) a hardener for an epoxy resin, and (C) an elastomer as an essential component, and 100 parts by mass relative to the (A) epoxy resin. Containing 5 to 4 parts by mass of (c) elastomer. Further, the baking coating was carried out using a two-liquid mixed baking paint. [Embodiment] The following describes an electronic device casing and a method for manufacturing the same according to the embodiment. The electronic device casing of the embodiment has a metal member obtained by injection molding a magnesium alloy, and A composite molded body in which a molding resin containing a non-crystalline thermoplastic tree is formed integrally, and is baked on the surface thereof. The metal member and the molding resin are joined via an adhesive layer. The adhesive layer contains an epoxy resin, a hardener for an epoxy resin, and (C) an elastomer as an essential component, and contains 5 to 40 parts by mass based on 100 parts by mass of the (A) epoxy resin (C). It is composed of an adhesive composition of an elastomer. Further, the baking coating was carried out using a two-liquid mixed baking paint. According to the electronic device casing of the embodiment, the warpage can be reduced, and the coating portion of the joint portion between the metal member and the molding resin can be prevented from floating or peeling off. The metal member is not particularly limited as long as it is formed by molding a magnesium alloy, and examples thereof include a substantially rectangular magnesium cover plate. For example, an engaging portion for engaging the molding resin may be provided on the metal member. For example, an engaging hole for anchoring the effect may be pierced as the engaging portion. The metal member can be produced by dissolving magnesium 152908.doc 201146128 gold, for example, AZ9, and casting the melt into a mold. Further, a chemical treatment film as a rust preventive film may be formed on the surface of the metal member. Such a chemically treated film can be formed by a well-known treatment method. That is, after the treatment with a surface treatment agent containing a phosphate, it is treated with a pre-treatment agent, and then a cleaning agent containing at least one of an aromatic acid or a salt thereof and a surfactant is used. The treatment is carried out, and further, it can be formed by treating with a rust inhibitor for magnesium. As described above, the binder composition contains (A) an epoxy resin, a hardener for an epoxy resin, and (C) an elastomer as an essential component. As the epoxy resin of (8), it can be used as an epoxy resin having two or more epoxy groups in the molecule: for example, a double-type A-type epoxy resin, a double-type F-type epoxy resin, a chain-chain varnish type epoxy resin, The glycidyl (tetra) epoxy resin, the alicyclic epoxy resin, the heterocyclic epoxy resin, the glycidol-modified modified epoxy resin, and the like, and the like, may be used alone or in combination of two or more. VIII. The curing agent for an epoxy resin as the component (B) is not particularly limited as long as it is a compound used as a curing agent for a general epoxy resin. Examples of the amine-based curing agent include dicyandiamide and aromatic diamine. Examples of the phenol-based curing agent include novolak resin, nonylphenol novolak resin, bisphenol A novolac resin, and triazine modification. A novolac resin, a quinone imine-modified novolak resin, a novolac-containing novolac resin, or a naphthol-based polyfunctional hardener, etc., may be used alone or in combination of two or more. (B) The amount of the curing agent for the epoxy resin is preferably a reaction with the epoxy group of the (A) component epoxy resin, which can react with the epoxy group I52908.doc 201146128 of the (A) component epoxy resin. The reactivity base ratio of the hardener for the epoxy resin of the component (B) ((8) the hardener for the component oxy-resin < the reactive group/the number of epoxy groups of the epoxy resin of the (A) component is G.7H.3 The way to adjust. The amount of the epoxy resin hardener to be used in the component (B) satisfies such a base ratio, and the unreacted portion of the hardener for the epoxy resin (A) and the epoxy resin for the component (B) Share. Examples of the elastomer of the component (C) include acrylic acid rubber, acrylonitrile butadiene rubber, styrene butadiene rubber, butadiene acrylic acid acrylonitrile rubber, butadiene rubber, and each.士#诗冲像修, acrylonitrile butadiene rubber containing carboxyl group, acrylonitrile butadiene containing ethylene group, weiwei shed π month j 埽 rubber, fluorenone rubber, urethane rubber, polyethylene Butyral aldehyde, etc., 嗲黧 通 tong tong Temple has been used alone or in combination of two or more types to make the amount of the (C) wounded elastomer to be one part of the mass of the Α1 component of the epoxy resin. If the blending amount of the (c) component elastomer is less than $massage, the damage is followed. The surface, that is, the buffering effect between the metal member and the molding resin is insufficient, and there is a possibility that the joint portion floats or peels off. On the other hand, if the blending amount of the component elastomer (6) exceeds 4 parts by mass, the adhesion is lowered. For example, in the case of baking, the joint surface (4) is generated. The binder composition may contain, in addition to the above components (4) to (C), other components such as inorganic fillers, diterpene thiol derivatives, alumina/丨, if necessary and without departing from the object of the present invention. Anti-rubber ageing agents, colorants, flame retardants, such adhesive compositions can be prepared by well known methods. For example, after mixing the above-mentioned essential ingredients and other ingredients as needed, you can use the J52908.doc 201146128 tank mill, ball mill, bead mill, roll mill, homogenizer, super-grinder or crusher. The kneading machine is prepared by mixing at room temperature or under heating. Further, the solvent may be added to adjust the viscosity to suit the processing method. Examples of the solvent include alcohol-based solvents such as methanol, ethanol, and isopropyl alcohol, ketone-based solvents such as acetone and mercaptoethyl ketone, benzene, toluene, dimethyl hydrazine, 1,4-dioxane, and 1,3. An ether-based solvent such as dioxane or propylene glycol monomethyl ether, or N-methylpyrrolidone or dimethylformamide. These may be used alone or in combination of two or more. Such an adhesive composition is used in the formation of an adhesive layer in which a metal member and a molding resin are bonded. The subsequent composition is applied, for example, to the joint surface of the metal member and the molding resin, and can be an adhesive layer by heat treatment in a semi-hardened state. The thickness of the subsequent layer is preferably, for example, 1 〇 50 50 μm. With such a thickness, the metal member can be well bonded to the molding resin, and the cushioning effect between the metal member and the molding resin can be sufficient, and the floating or peeling of the joint portion can be easily suppressed. Further, the heat treatment for the semi-hardened state is preferably carried out, for example, at a heating temperature of 120 to 150 ° C and a heating time of 3 to 20 minutes. By performing the heat treatment as described above, the metal member and the molding resin can be satisfactorily adhered by the adhesive layer, and the floating or peeling of the joint portion can be reduced. Such heat treatment is particularly preferably carried out until the flow value of the adhesive layer is 50 to 1000 μη. When the flow value is 50 μm or more, it is easy to suppress floating or peeling of the joint portion between the metal member and the molding resin. Further, when the flow value is 1 〇〇〇 μηι or less and the metal member and the molding resin are integrally molded via the adhesive layer, it is easy to suppress the overflow of the adhesive layer (adhesive composition). From the viewpoint of suppressing the overflow of the adhesive layer or the floating or peeling of the joint portion by the more effective 152908.doc 201146128, the flow value is preferably 100 to 700 μm, and further preferably 1 〇〇 to 4 〇〇 μπι. Here, the flow value is determined as follows. Namely, after the adhesive composition was applied to the > film substrate at a specific thickness, it was lost in a stainless steel plate and heat-treated at a specific temperature and time to thereby obtain a film. For the thus obtained sheet, a hole having a diameter of 3 mm was subjected to '12 (TC, 1 minute, 2 5 Mpa, after heat and pressure forming, 'measuring the outflow length of the resin from the end of the hole processing') The agent layer may be formed by directly applying an adhesive composition to the surface of the metal member as described above, and may, for example, apply an adhesive composition to a film sheet such as a polyester film, and heat-treat the film into a semi-cured film. Then, the sheet is formed by hot pressing on the surface of the metal member. At this time, for example, a pressure of 2 to 200 N/cm 2 is applied at a temperature of 60 to 150 C to perform hot pressing, so that the sheet can be satisfactorily attached to the metal. Further, the adhesive layer is preferably a thickness of 10 to 50 μm. As the molding resin, a non-crystalline thermoplastic resin is preferably used, and specific examples thereof include ABS (acrylonitrile butadiene-styrene). Resin), ρμμα (poly(decyl methacrylate), PC (polycarbonate), mPPE (modified polyphenylene ether), or PES (poly code), etc. These amorphous plastics are generally combined with crystalline plastics. Compared to the formation shrinkage ratio It is preferable to integrally form, for example, warpage or bending of the casing for an electronic device after injection molding, and it is preferable to add a fibrous, powdery or plate-shaped filler to the molding resin as necessary. For the composite molded body having a small curvature, a fibrous or plate-shaped filler is preferably used. 152908.doc 201146128 As a fibrous filler, glass fiber, carbon fiber, cerium oxide-yttria alumina fiber, zirconia fiber, Inorganic fibrous material such as potassium titanate fiber, side fiber, and further fibrous material such as stainless steel, New Zealand, Chin, copper, brass, etc., particularly as a representative fibrous filler, glass fiber or carbon fiber. Further, a high-melting point organic fiber such as polystyrene or a fluorinated lauric acid resin may be used. Examples of the powdery filler include carbon black, silica dioxide, quartz powder, and glass beads. Glass powder, glass short fiber, calcium citrate 'aluminum citrate, kaolin (7) stone, clay, diatomaceous earth, such as strontium silicate, iron oxide, titanium oxide, oxidized words, metal oxides such as oxidized ,carbon Words such as magnesium carbonate <metal carbonate, barium sulfate, sulfate of metal such as barium sulfate, other barium carbide, tantalum nitride, various metal powders. Further, as the plate-shaped filler, mica and glass are mentioned. The non-fibrous inorganic filler is preferably a talc, a glass bead, a glass short fiber, a mica or a glass flake, and the filler may be used alone or in combination of two or more. In the case of the resin component, the amount of the resin is preferably 10 to 200 parts by mass, more preferably 50 to 150 parts by mass, and the amount of the filler is 10 parts by mass or more. In the case where the amount of the filler is 200 parts by mass or less, the moldability is improved, and the molding resin is not easily broken. The surface of the composite molded body of the metal-containing member, the adhesive layer, and the molding resin was subjected to baking coating using a two-liquid mixed paint. The two-liquid hardening type coating 152908.doc 201146128 is not particularly limited, but for example, the polymer of the main component is preferably a hydroxyl group-containing active hydrogen group, and the curing agent is preferably a polyisocyanate. With such a coating, the baking temperature can be made 80 to 110 ° C, and the baking temperature can be lowered as compared with the epoxy coating which requires a baking temperature of 150 ° C or more. Therefore, it is easy to suppress the occurrence of expansion or peeling of the joint surface between the metal member and the molding resin. Next, a method of manufacturing an electronic device casing according to the embodiment will be described. The manufacturing method of the casing for an electronic device according to the embodiment is a composite molding in which a metal member obtained by molding a magnesium alloy by injection molding is integrally molded with a molding resin containing a non-crystalline thermoplastic resin. A method of manufacturing a surface of a body by baking and coating. According to the manufacturing method of the cross-sectional form, first, an adhesive layer is formed on the joint surface of the metal member and the molding resin. The adhesive layer contains the (A) epoxy resin, (B) a hardener for an epoxy resin, and an elastomer as essential components, and contains 5 to 4 Å by mass based on 1 part by mass of the (A) epoxy resin. (c) an adhesive composition of an elastomer. Further, the adhesive layer is adjusted so that the flow value of rc is 50 to 1 〇〇〇μη. Thereafter, the metal member having the adhesive layer formed thereon is integrally molded by injection molding to obtain the molding resin. The step of compounding the molded body. Further, the step of using the two-liquid mixed type calcined paint on the surface of the composite formed body to carry out the calcination at a temperature of less than 120 ° C. The following describes the manufacturing method of the embodiment. According to the manufacturing method of the embodiment, as shown in FIG. 1, first, the surface of the joint surface of at least the metal member formed by molding the magnesium alloy and I52908.doc -10- 201146128 is formed, and the surface is provided. The above adhesive composition, a step of flowing a layer of an adhesive layer of 50 to 1000 μm at 120 ° C (hereinafter referred to as an adhesive layer forming step). The formation of the subsequent layer is as described, and can be carried out by 12 ° C The flow rate is in the range of 50 to 1000 μm, for example, the heating temperature is 12 Torr to 15 Torr, and the heating time is 3 to 20 minutes for heat treatment to make the adhesive composition semi-hardened. The thickness of the coating layer is preferably, for example, 1 〇 to 5 〇 μηη. Then, the step of forming a composite molded body by integrally molding the metal member having the adhesive layer formed by injection molding to obtain a composite molded body (hereinafter referred to as forming) In addition, a two-liquid mixed type baking paint is used on the surface of the composite molded body, and the step of baking is carried out at a baking temperature of less than 12 Å (hereinafter referred to as a coating step). A cross-sectional view of an example of a molding die and a manufacturing process used in the manufacturing method of the embodiment. As shown in Fig. 2 (Α), the molding die 21 is composed of, for example, a hole 22 having a concave portion and a core 23 having a convex portion. The forming mold shown in Fig. 2(A) shows the state in which the mold is opened. The metal member 1 i is disposed inside the forming mold 21, specifically in the recess of the hole type 22 (Fig. 2(B)), and then The adhesive layer of the metal member 丨丨 joint molding resin is formed into the adhesive layer 12 (the adhesive layer forming step p. The adhesive layer 12 can be applied to the metal member i! disposed on the molding die 21, for example, by applying an adhesive composition, by The heat treatment is carried out in a semi-hardened state. At this time, the coating amount of the adhesive composition is adjusted to adjust the thickness of the adhesive layer 12, and the conditions of the heat treatment can be adjusted to adjust the flow value of the adhesive layer 12. 152908.doc 201146128 Further, the formation of the adhesive layer 12 is not necessarily performed in a state of being disposed in the molding die 2, and may be performed in advance, for example, before being disposed in the molding die 2. Further, the formation of the adhesive layer 12 is not necessarily limited to The method of directly applying the adhesive composition to the metal member 丨i can be described as follows. After the adhesive sheet composition is first formed, the adhesive sheet can be thermally pressed. Next, the aperture type 22 and the core type are formed. In the state where the mold is clamped, the heated molding resin 13 is ejected at a specific pressure, temporarily held, and then opened, and the metal member u and the molding resin 13 are integrally molded by the adhesive layer 12, for example, injection molding. The formed composite molded body 14 (Fig. 2 (c), (D forming step). On the surface of such a composite formed body 14, a two-liquid mixed type coating material was used for baking coating at a baking temperature of less than 120 ° C (coating step). It is easy to burn with less than 12 generations using a 2-liquid mixed type paint & In the case where the firing temperature is 120 ° C or more, the joint between the metal member and the molding resin η is swollen or peeled off, which is not preferable. As the two-liquid mixed type paint, for example, the base of the main polymer is preferably a hydroxyl group-containing active hydrogen-based base, and the hardener is preferably a polyisocyanate. With such a coating, the firing temperature can be lowered by less than 12 Torr, specifically 8 Torr to 1 HTC', compared to an epoxy-based coating which requires a baking temperature of 15 n: or more. ' Columns such as 0J use air spray coating method without special, Λ, JBtt, coating method, bell-shaped coating method and other well-known coating methods, there is no special limit to the thickness of the coating film is not limited, but 1 ~ 100 μΓη is better. When the thickness of the coating film is not μΓΠ, the concealing property of the substrate is poor, and if it is more than 1 〇〇, the appearance is not easy to be < 152908.doc -12· 201146128 is not good. Next, other embodiments of the electronic device will be described with reference to Figs. In Fig. 3, the front side (i.e., the user side) is defined as the front direction f, and the inner side of the user is defined as the rear direction R, which is defined as the left direction from the left side of the user, and is defined from the right side of the user. In the right direction, the upper side defined by the user is defined as the upper direction, and the lower side is defined from the lower side seen by the user. As shown in Fig. 3, a portable computer lu as an example of an electronic apparatus is provided with a main unit 112 and a display unit 113. The main body unit 112 has a hinge portion 114 that rotatably supports the display unit 丨丨3. The main unit 112 includes, for example, a main body casing 115 formed of a metal such as a magnesium alloy, a keyboard 116 attached to the upper surface of the main body casing 115, a touch panel 117 provided on the upper surface of the main unit 115, and the main body casing. Us internal printed circuit board 118. The printed circuit board 8 has circuit components such as a CPU, a RAM, and a ROM, and collectively controls the entire portable computer 111. The main body casing Π 5 has a casing 115 A ′ which is formed on the upper half thereof and is fixed with a keyboard 116 and a lower casing 17 5B which constitutes the lower half. The display unit 113 has a display 121, a display casing 122 surrounding the display 121 and a display casing 122 containing metal and synthetic resin, and a plurality of cushioning members 124 attached to the cover 123 of the display casing 122. The display 121 is constructed by, for example, a liquid crystal display panel in this embodiment, but may be other types of display panels. The cushioning member 124 is made of, for example, rubber or the like having elasticity. The buffer member 124 is at a position where the display unit 113 covers the main body unit 112, that is, the mask 123 of the second housing of the display casing 122 is rotated to a position opposite to the main body 152908.doc -13·201146128 unit 112, and the main unit 112 collisions. Further, in the present embodiment, the casing (electronic casing) 126 is constituted by the main casing 115 and the display casing 122. As shown in Fig. 4, the display casing 122 has a cover 131' that covers the first casing on the back side of the display m, and a cover 123 that covers the second casing on the front side of the display ι21. The mask 123 is provided separately from the cover 131, and is formed in a flat frame shape, for example, from a synthetic resin village. The lid 13 1 is formed by integrally molding a synthetic resin on one part of a metal base, and is formed into a flat plate as a whole. In other words, the lid 131 has a metal portion (metal member 132) in which the opening portion 132 is provided, a resin portion (molding resin) 133 provided to cover the opening portion 132A, and a dog extending from the metal portion 132 toward the resin portion. The Deng 134 is provided on the protruding portion 丨34, and the metal portion 丨3 2 and the resin portion 133 are followed by a fixing member (adhesive layer) 135. The metal portion 132 is formed of, for example, a magnesium alloy or the like, but may be another metal material. According to the present embodiment, as the fixing member 135, an adhesive containing an epoxy resin composition containing a specific amount of elastomer is used. The fixing member 135' is used to form a molding resin containing a non-crystalline thermoplastic resin, that is, a part of a metal substrate, and an electronic device in which a synthetic resin is integrally formed on a scratch. The shells φ, I sigh and the uncle version have less warpage and less abnormal appearance. Further, the range of the machine and the electronic device are not limited to those described in the above embodiments. For example, it is of course possible to implement other electronic devices such as mobile phones. The electrons are not limited to the above-described embodiments. In the implementation stage, the constituent elements can be modified and embodied without departing from the gist thereof. Various combinations of the constituent elements disclosed in the above-described embodiment 152908.doc 201146128 can form various types. invention. For example, some of the constituent elements may be deleted from all the constituent elements shown in the embodiment. Furthermore, the constituent elements of the different embodiments may be combined as appropriate. [Examples] Hereinafter, the examples will be described in more detail with reference to examples. (Preparation of an adhesive composition) jER ΥΧ4000Η (manufactured by Nippon Epoxy Co., Ltd., trade name, epoxy equivalent 195) as epoxy resin (A); jER 807 (manufactured by Sakamoto Epoxy Co., Ltd., trade name) , epoxy equivalent 1 68); dicyandiamide as a hardener for (B) component epoxy resin; acrylonitrile butadiene rubber containing carboxyl group as (C) component elastomer (manufactured by Sakamoto Zeon Co., Ltd., trade name :Nipoll072); and 2E4MZ-CN (manufactured by Shikoku Chemical Co., Ltd., trade name: 1-cyanoethyl-2-ethyl-4-mercaptoimidazole) as a hardening accelerator, in the manner shown in Table 1. The preparation was dissolved and dispersed in mercaptoethyl ketone to prepare an adhesive composition a~e 〇 [Table 1] Substituent composition abcde Component [parts by mass] (A) Epoxy resin jERYX-4000 50 50 50 50 50 jER-807 30 30 30 30 30 (B) Hardener DICY-7 6.5 6.5 6.5 6.5 6.5 (C) Elastomer Nipol1072 0 5 10 30 50 Other hardening accelerator 2E4MZ-CN 3.5 3.5 3.5 3.5 3.5 Relative to (A) Amount of (C) component of 100 parts by mass of the component [parts by mass] 0 6.25 12.5 37.5 62.5 152908.doc -15- 201146128 (Production of metal member) The molten magnesium alloy AZ91D was sent to a mold for molding an electronic device to mold a substantially rectangular metal member of 10 mm x 280 mm. (Example 1) The adhesive composition b' was applied to the joint portion of the metal member and the molding resin by heat treatment to form a semi-hardened state to form an adhesive layer (adhesive layer forming step). Here, the thickness of the adhesive layer is 25 μm. Further, the heat treatment was performed at 15 ° C for 3 minutes, and the electrode layer was adjusted to have a flow rate of 200 μm. The metal member in which the adhesive layer was formed was set at 60 ° C. After the injection mold is applied, the polycarbonate resin of the amorphous plastic (the molding shrinkage ratio of the flow direction of the resin is 〜·〇5 to 0.25%, and the molding shrinkage ratio in the direction perpendicular to the flow is 0.2°/.% to 0.45%). After molding, a composite molded body in which a metal member and a molding resin are integrally molded through an adhesive layer is obtained (forming step). Next, after applying a two-liquid hardening type urethane-based resin coating material to the surface of the composite molded body, The coating was baked at a temperature of 30 ° C for 30 minutes to form a coating film having a thickness of 30 to 40 μm. Further, the coating was coated with an amino phthalate-based clear coating and then calcined at 100 ° C for 30 minutes to form a thickness of 30 to 40 μm. The coating film was used as a casing for an electronic device (apparatus step) as an LCD cover for a personal computer. (Example 2) The heat treatment after application of the adhesive composition b was performed at 150 ° C for 1 〇 minutes. The flow rate of the adhesive layer at 120 ° C The casing for an electronic device was obtained in the same manner as in Example 1 except that the method was adjusted to 〇μιη. 152908.doc •16- 201146128 (Example 3) The heat treatment after application of the adhesive composition b was carried out at 80 ° C. The casing for an electronic device was obtained in the same manner as in Example 1 except that the flow rate of the adhesive layer at 120 ° C was changed to 1 500 μm for 3 minutes. (Example 4) Except for the use of the adhesive composition In the same manner as in Example 1, a casing for an electronic device was obtained. (Example 5) A casing for an electronic device was obtained in the same manner as in Example 1 except that the adhesive composition d was used. (Comparative Example 1) In the same manner as in Example 1, a casing for an electronic device was obtained in the same manner as in Example 1. (Comparative Example 2) A polyphenylene sulfide resin containing a crystalline plastic as a molding resin (formation shrinkage ratio in the flow direction of the resin) A case for an electronic device was obtained in the same manner as in Example 1 except that the molding shrinkage ratio in the direction of the flow direction was 1.0% by injection molding. (Comparative Example 3) In addition to the polymerization of the crystalline plastic as a molding resin Butylene terephthalate resin (tree A housing for an electronic device was obtained in the same manner as in Example i except that the molding shrinkage ratio in the flow direction was 〇4%, and the molding shrinkage ratio in the direction perpendicular to the flow direction was 1·〇%). (Comparative Example 4) 152908.doc 201146128 A housing for an electronic device was obtained in the same manner as in Example 1 except that the adhesive composition e was used. (Comparative Example 5) A one-component epoxy resin was applied in place of the two-liquid-curing urethane-based resin coating material. A resin coating material was fired at 150 ° C for 30 minutes, and a casing for an electronic device was obtained in the same manner as in Example 1. (Evaluation) For the electronic device casings of the examples and the comparative examples, the warpage and the appearance were evaluated by the following methods. The results are shown in Table 2. [Twist] The gap is measured by a gap gauge, and the maximum value is used as a warp. The housing for the electronic device is placed on the flat plate, and the corners of the electronic device casing are bent between the four corners of the casing. [Appearance] Visual observation of the housing for electronic equipment 夕洛# i
， ._ ¥ - 面之金屬構件與塑 1平估為「0」，觀察 、膨脹、剝離等異 膠構件. 到邊界 常之情： 152908.doc 201146128 [表2], ._ ¥ - The metal parts of the surface and the plastic 1 are estimated to be "0", and the plastic components such as observation, expansion, and peeling are removed. To the boundary. Normally: 152908.doc 201146128 [Table 2]
實施例 比較例 1 2 3 4 5 1 2 3 4 5 成形用樹脂 PC PC PC PC PC PC PPS PBT PC PC 接著劑組合物 b b b C d a b b e b 流值[μπι] 200 0 1500 200 200 200 200 200 200 200 塗裝 2液 2液 2液 2液 2液 2液 2液 2液 2液 1液 評估 結果 勉曲[mm] 0.5 0.6 0.4 0.5 0.4 0.6 2.3 2.5 0.4 0.6 外觀 〇 Δ Δ Ο Ο X 〇 〇 X X 由表2明瞭’關於經由包含含有特定量彈性體之環氧樹 月曰組合物之接者劑層’將含非結晶性熱可塑性樹脂之成形 用树如一體成形，且使用2液混合型培燒塗料進行培燒塗 裝之實施例之電子機器用殼體’確認翹曲少，又外觀異常 亦少。尤其將成形步驟前之接著劑層之流值調整至 5 0〜1000 μηι者’尤其確認可有效抑制外觀異常。 【圖式簡單說明】 圖 圖1係顯示實施形態之製造方法 圖2(A)-(D)係顯示實施形態之 之—例之流程圖。 製&方法之一例之剖面 圖3係顯示實施形態之電子機考+ 之—例之手提電腦之立 體圖。 之手提電腦之蓋及遮 圖4係實施形態之電子機器之—$ 罩之沿著厚度方向之剖面圖。 【主要元件符號說明】 1 電子機器用殼體 I52908.doc -19· 201146128 11 金屬構件 12 接著劑層 13 成形用樹脂 14 複合成形體 126 殼體（電子機器用殼體） 132 金屬部（金屬構件） 133 樹脂部（成形用樹脂） 135 固定構件（接著劑層） 152908.doc -20-EXAMPLES Comparative Example 1 2 3 4 5 1 2 3 4 5 Resin for molding PC PC PC PC PC PC PPS PBT PC PC Adhesive composition bbb C dabbeb Flow value [μπι] 200 0 1500 200 200 200 200 200 200 200 Coating 2 liquid 2 liquid 2 liquid 2 liquid 2 liquid 2 liquid 2 liquid 2 liquid 2 liquid 1 liquid evaluation result distortion [mm] 0.5 0.6 0.4 0.5 0.4 0.6 2.3 2.5 0.4 0.6 Appearance 〇Δ Δ Ο Ο X 〇〇XX 2. It is understood that the forming tree containing the amorphous thermoplastic resin is integrally molded by using a carrier layer containing an epoxy resin composition containing a specific amount of elastomer, and a two-liquid mixed type baking paint is used. In the case of the electronic device case of the embodiment in which the polishing was applied, it was confirmed that the warpage was small and the appearance was abnormally small. In particular, it was confirmed that the flow value of the adhesive layer before the forming step was adjusted to 50 to 1000 μm. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a manufacturing method of an embodiment. Figs. 2(A) to (D) are flowcharts showing an embodiment of an embodiment. Sectional Example of a System & Method FIG. 3 is a perspective view of a portable computer showing an electronic computer test of the embodiment. The cover and cover of the laptop are the cross-sectional views of the cover in the thickness direction of the electronic device of the embodiment. [Description of main component symbols] 1 Housing for electronic equipment I52908.doc -19· 201146128 11 Metal member 12 Adhesive layer 13 Resin for molding 14 Composite molded body 126 Housing (casing for electronic equipment) 132 Metal part (metal part) ) 133 Resin part (forming resin) 135 Fixing member (adhesive layer) 152908.doc -20-