201146120 六、發明說明： 【發明所屬之技術領域】 本創作是關於印刷電路板的導通孔構造，以及用於成 形導通孔的加工裝置設計。 【先前技術】 目前印刷電路板隨著終端產品功能的複雜化，以及體 積縮小化的發展需求，因此，印刷電路板上的線路佈局密 度不斷提高，以符合信號傳遞高度複雜性的需求。由於單 _ 層電路板因其線路層受限於佈局空間而不足時，即須增加 線路層收為雙面線路或三層以上的多層式線路層，如圖4 所不，使線路佈局密度增加，而線路層7與線路層7間的 訊號連接，則必須依賴成形於垂直導通孔7〇中的導電體 作為訊號與電性的傳導媒介。 關於目前雙面線路或多層式印刷電路板構造中，電性 連接上下層線路的導通孔設計，一般是採取垂直式孔洞設 計，其一般的作法是利用機械鑽孔手段或雷射鑽孔手段在 籲印刷電路板上的預定位置鑽出垂直狀的孔洞，接續進行除 膠渣化銅/黑孔/黑影等步驟，再進電鐘鋼的步驟，於孔 洞中形成一銅導電體連接上下層線路。 惟前述垂直狀的導通孔因須有最小的孔距限制，Μ 印刷電路板線路佈局的密度，且無法降低線路層的層數 不利於印刷電路板應用終端產品的功能複雜化與 化的發展趨勢。 【發明内容】 201146120 本發明之主要目的在於提供一種具有斜管式導通孔的 印刷電路板及其加工裝置，希藉此設計，解決現有印刷電 路板垂直式導通孔設計’不利於印刷電路板線路佈局的密 度提高以及降低線路層的層數之發展趨勢等缺點。 為達成前述目的，本發明所提出的具有斜管式導通孔 的印刷電路板是包含多層線路層形成上下層間隔排列，以 及設於上下相鄰之線路層間的絕緣層，上下線路層間設有 多個通過絕緣層的斜管式導通孔，所述斜管式導通孔之孔 ^ 壁形成導電體電性連接上下線路層。 本發明所提出的用於成形斜管式導通孔的加工敕置是 包含： 一平台； 一載板，係用以提供待鑽孔的印刷電路板設置其上， 載板具有一樞接側以及一調整側位於樞接側相對之另一側 ’載板以其樞接側樞設於平台上； 一斜撑桿，係可伸縮調整長度的連接於平台與載板調 # 整側之間’用以斜向支撐載板’使載板相對於平台呈傾斜 狀； 一 S测組件’係設於鄰近載板調整側一側，用以取得 載板調整側升高後的高度數據；以及 鑽孔组件，是可位移的裴設於載板上方，用以垂直 於平台方向進行鑽孔加工’而於印刷電路板成形斜管式導 通孔。 本發明以前述具有斜管式導通孔的印刷電路板及其加 工裝置设計’其特點在於令印刷電路板上形成斜管式導通 4 201146120 « 孔作多層線路層間的連接設計，使有限面積的印刷電路板 可以騰出更線路佈局的空間’作為更高密度線路導體佈局 ’或可藉此滿足現有線路佈局關係’從而減少線路層層數 等功效。 【實施方式】 如圖1或2所示，是揭示本發明具有斜管式導通孔的 印刷電路板之數較佳實施例，該印刷電路板主要是包含多 層線路層10形成上下層間隔排列，並於上下相鄰之線路 φ 層1 〇間設有絕緣層1 1，上下線路層10間設有一個或多 個通過絕緣層11的斜管式導通孔12，所述斜管式導通孔 12之孔壁形成導電體1 3電性連接多層線路層彳〇，所述斜 管式導通孔12可為貫通孔或盲孔。 為實現於印刷電路板上成形斜管式導通孔，本發明尚 提出一種用於成形斜管式導通孔的加工裝置設計，如圖3 所示’該用於成形斜管式導通孔的加工裝置是包含一平台2 '一載板3、一斜撐桿4、一量測組件5以及一鑽孔組件6 _ ，其中： 該載板3係用以提供待鑽孔的印刷電路板1設置其上 ，載板3具有一樞接側31以及一調整側32位於樞接侧31 相對之另一側’載板3以其樞接側31藉由樞接元件樞設於 平台2上。 該斜撐桿4是可伸縮調整長度的連接於平台2與載板 3調整側3 2之間’用以升高載板3的調整側3 2高度，斜向 支撐載板3，使載板3相對於平台2呈傾斜狀。 該量測組件.5係設於鄰近載板3調整侧32 —側，用[s ] 5 .201146120 以取得載& 3調整側32升高後的高度數據，於本較佳實 紹列是揭示量測組# 5係使用光學尺，當然該量測組件^ 可使用其具有量測長度的測量器具。 ’、 該：：組…為機械式錯孔機具或可為雷射鑽孔機 Ί ’所述鑽孔組件6是可位移的裝設於載板3上方 以垂直於平台2方向進行鑽孔加工。201146120 VI. Description of the Invention: [Technical Field of the Invention] This creation relates to a via structure of a printed circuit board, and a processing device design for forming a via. [Prior Art] At present, with the complexity of the functions of the terminal products and the development of the volume reduction of the printed circuit board, the layout density on the printed circuit board is continuously increased to meet the high complexity of signal transmission. Since the single-layer circuit board is insufficient due to the limitation of the circuit layer to the layout space, it is necessary to increase the circuit layer to be a double-sided circuit or a multi-layer circuit layer of three or more layers, as shown in FIG. 4, to increase the line layout density. The signal connection between the circuit layer 7 and the circuit layer 7 must rely on the electrical conductor formed in the vertical via hole 7 as a signal and electrical conduction medium. Regarding the current double-sided circuit or multi-layer printed circuit board structure, the design of the via hole for electrically connecting the upper and lower layers is generally adopted as a vertical hole design, and the general method is to use mechanical drilling means or laser drilling means. Calling a predetermined position on the printed circuit board to drill a vertical hole, followed by the steps of removing the slag-removed copper/black hole/black shadow, and then entering the electric bell steel to form a copper conductor in the hole to connect the upper and lower layers. line. However, the above-mentioned vertical via holes must have a minimum pitch limit, the density of the printed circuit board layout, and the inability to reduce the number of layers of the circuit layer is not conducive to the development of the function and complexity of the printed circuit board application terminal products. . SUMMARY OF THE INVENTION 201146120 The main object of the present invention is to provide a printed circuit board having a tapered tube through-hole and a processing device thereof, which are designed to solve the problem that the vertical conductive via design of the existing printed circuit board is not conducive to the printed circuit board circuit. The disadvantages of increased density of the layout and a tendency to reduce the number of layers of the circuit layer. In order to achieve the above object, the printed circuit board having the inclined tube type through hole according to the present invention comprises a plurality of circuit layers forming an upper and lower layer spaced arrangement, and an insulating layer disposed between the upper and lower adjacent circuit layers, and the upper and lower circuit layers are provided with a plurality of layers. A through-tube via hole passing through the insulating layer, the hole wall of the inclined tube type via hole is electrically connected to the upper and lower circuit layers. The processing device for forming a inclined tube type through hole according to the present invention comprises: a platform; a carrier plate for providing a printed circuit board to be drilled thereon, the carrier board having a pivoting side and An adjustment side is located on the opposite side of the pivoting side. The carrier board is pivotally disposed on the platform with its pivoting side. A diagonal strut is connected between the platform and the carrier board. The utility model is used for supporting the carrier plate obliquely to make the carrier plate inclined with respect to the platform; an S measuring component is disposed on the side adjacent to the adjustment side of the carrier plate for obtaining the height data after the adjustment side of the carrier plate is raised; The hole assembly is a displaceable crucible disposed above the carrier plate for drilling perpendicular to the platform direction to form a tapered tube via hole in the printed circuit board. The invention adopts the foregoing design of the printed circuit board with the inclined tube type through hole and the processing device thereof, which is characterized in that the inclined tube type conduction is formed on the printed circuit board 4 201146120 « The connection design of the holes for the multi-layer circuit layer makes the limited area The printed circuit board can free up the space of the line layout 'as a higher-density line conductor layout' or to satisfy the existing line layout relationship', thereby reducing the number of layers of the circuit layer. [Embodiment] As shown in FIG. 1 or 2, a preferred embodiment of the printed circuit board having the inclined tube type through hole according to the present invention is disclosed. The printed circuit board mainly includes a plurality of circuit layers 10 formed in an upper and lower layer interval. An insulating layer 1 is disposed between the upper and lower adjacent lines φ, and the first and second circuit layers 10 are provided with one or more inclined tube through holes 12 passing through the insulating layer 11, and the inclined tube through holes 12 are provided. The hole wall forming electrical conductors 13 are electrically connected to the multilayer circuit layer 彳〇, and the inclined tube type through holes 12 may be through holes or blind holes. In order to realize the forming of the inclined tube type through hole on the printed circuit board, the present invention also proposes a processing device for forming the inclined tube type through hole, as shown in FIG. 3, the processing device for forming the inclined tube type through hole Is a platform 2' a carrier 3, a diagonal strut 4, a measuring assembly 5 and a drilling assembly 6 _, wherein: the carrier 3 is used to provide a printed circuit board 1 to be drilled The carrier board 3 has a pivoting side 31 and an adjusting side 32 on the opposite side of the pivoting side 31. The carrier board 3 is pivotally mounted on the platform 2 by its pivoting side 31. The diagonal strut 4 is connected between the platform 2 and the adjustment side 3 2 of the carrier 3 with a telescopic adjustable length to increase the height of the adjustment side 32 of the carrier 3, and to support the carrier 3 obliquely, so that the carrier plate 3 is inclined with respect to the platform 2. The measuring component .5 is disposed adjacent to the adjusting side 32 side of the carrier 3, and [s] 5 .201146120 is used to obtain the height data of the loading & 3 adjusting side 32, which is shown in the preferred embodiment. It is disclosed that the measuring group #5 uses an optical scale, of course, the measuring unit can use a measuring instrument having a measuring length. ', the:: group... is a mechanical misaligned machine or may be a laser drilling machine Ί 'The drilling assembly 6 is displaceably mounted above the carrier 3 for drilling perpendicular to the platform 2 .
前述用於成形斜管式導通孔12的加工裝置於使用，係 令待鑽孔的㈣電路板！固定於載板3上表面，並利用斜 樓桿4搭配量測組# 5調整載板3及其上的印刷電路板工 至預定的傾斜度，纟中可利用畢氏定三角關係運算式以及 相似三角形的邊長比例原理，依據已知待鑽孔的印刷電路 板總厚度、預定.斜管式導通孔頂部與底部的水平距離，以 及印刷電路板總長度等數據，計算出載板3調整側32應提 升的高度’待載板3調整側32升高至預定高度後，以鑽孔 組件6垂直向下對載板3上的印刷電路板丨傾斜鑽設預定 的斜管式導通孔12»待印刷電路板丨之斜管式導通孔12鑽 孔完成後，取下印刷電路板丨，即可進行孔洞去除膠渣、化 銅/黑化/黑影等孔壁表面粗化之步驟，再進行電鍍銅，使 斜管式導通孔中形成導電體，之後，再對印刷電路板表面 的銅層進行圖案化成形（顯影、蝕刻…等影像移轉手段） 步驟，而完成印刷電路板之製作。 【圖式簡單說明】 圖1是本發明具有斜管式導通孔的印刷電路板之一較 佳貫施例的平面示意圖。 圖2是本發明具有斜管式導通孔的印刷電路板之另一 6 201146120 較佳實施例的平面示意圖。 圖3為本發明用於成形斜管式導通孔的加工裝置之一 較佳實施例的平面示意圖。 圖4為目前印刷電路板中以完全垂直導通孔中的導電 體作為上下線路層間訊號與電性的傳導媒介的平面示意圖 【主要元件符號說明】 1印刷電路板The aforementioned processing apparatus for forming the inclined tube type through hole 12 is used to (4) the circuit board to be drilled! It is fixed on the upper surface of the carrier board 3, and the tilting bar 4 is matched with the measuring group #5 to adjust the carrier board 3 and the printed circuit board on the workpiece to a predetermined inclination, and the Pythagorean triangle relational expression can be used in the 以及The principle of the side length ratio of similar triangles is calculated based on the total thickness of the printed circuit board to be drilled, the horizontal distance between the top and bottom of the inclined tube type through hole, and the total length of the printed circuit board. The height of the side 32 should be raised. After the adjustment side 32 of the carrier board 3 is raised to a predetermined height, the predetermined inclined tube type through hole 12 is drilled obliquely downward to the printed circuit board on the carrier board 3 by the drilling assembly 6 vertically downward. »After the drilling of the inclined tube type through hole 12 of the printed circuit board, the printed circuit board is removed, and the steps of removing the surface of the hole, such as slag, copper/blackening/black shadow, etc., can be performed. Electroplating copper is further performed to form a conductor in the via-type via hole, and then the copper layer on the surface of the printed circuit board is patterned (developing, etching, etc., image transfer means) to complete the printed circuit board. Production. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a preferred embodiment of a printed circuit board having a tapered via hole according to the present invention. 2 is a plan view of another preferred embodiment of a printed circuit board having a tapered tube via of the present invention. Fig. 3 is a plan view showing a preferred embodiment of a processing apparatus for forming a tapered tube type through hole according to the present invention. 4 is a schematic plan view showing a conductor in a completely vertical via hole as a conductive medium between the upper and lower circuit layers in the current printed circuit board. [Main component symbol description] 1 printed circuit board
線路層 11絕緣層 12斜管式導通孔 13導電體 2平台 3載板 31樞接側 32調整側 4斜撐桿 5量測組件 6鑽孔組件 7線路層 7 0垂直導通孔 [S1 7Circuit layer 11 Insulation layer 12 Inclined tube type through hole 13 Conductor 2 Platform 3 Carrier plate 31 Pivot side 32 Adjustment side 4 Diagonal brace 5 Measuring component 6 Drilling component 7 Circuit layer 7 0 Vertical via hole [S1 7