TW201144830A - Apparatus for inspecting electronic components - Google Patents

Apparatus for inspecting electronic components

Info

Publication number
TW201144830A
TW201144830A TW99143918A TW99143918A TW201144830A TW 201144830 A TW201144830 A TW 201144830A TW 99143918 A TW99143918 A TW 99143918A TW 99143918 A TW99143918 A TW 99143918A TW 201144830 A TW201144830 A TW 201144830A
Authority
TW
Taiwan
Prior art keywords
electronic components
interior space
outer profile
profile member
light emitting
Prior art date
Application number
TW99143918A
Other languages
English (en)
Other versions
TWI428616B (zh
Inventor
Atsushi Hiruma
Original Assignee
Nihon Garter Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Garter Co Ltd filed Critical Nihon Garter Co Ltd
Publication of TW201144830A publication Critical patent/TW201144830A/zh
Application granted granted Critical
Publication of TWI428616B publication Critical patent/TWI428616B/zh

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
TW99143918A 2010-06-04 2010-12-15 電子元件之檢查裝置 TWI428616B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010003815U JP3161943U (ja) 2010-06-04 2010-06-04 電子部品の検査装置

Publications (2)

Publication Number Publication Date
TW201144830A true TW201144830A (en) 2011-12-16
TWI428616B TWI428616B (zh) 2014-03-01

Family

ID=45052153

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99143918A TWI428616B (zh) 2010-06-04 2010-12-15 電子元件之檢查裝置

Country Status (3)

Country Link
JP (1) JP3161943U (zh)
CN (1) CN102269794A (zh)
TW (1) TWI428616B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583965B (zh) * 2013-07-15 2017-05-21 Humo Laboratory Ltd Inspection and sorting device for wafer electronic parts
CN107866389A (zh) * 2017-10-16 2018-04-03 合肥福森传感科技有限公司 一种ntc芯片阻值的分选机
CN108899739B (zh) * 2018-07-31 2024-04-23 格力电器（芜湖）有限公司 电器接地测试装置及电器电气测试系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6946864B2 (en) * 2001-02-19 2005-09-20 Osram Gmbh Method for measuring product parameters of components formed on a wafer and device for performing the method
CN200959025Y (zh) * 2006-10-09 2007-10-10 深圳市量子光电子有限公司 Led测试工作台
CN201122419Y (zh) * 2007-12-05 2008-09-24 东莞彩显有机发光科技有限公司 一种用于oled测试设备的旋转台
CN101339092B (zh) * 2008-08-13 2010-11-10 重庆大学 Led芯片/晶圆/外延片的非接触式检测方法及检测装置
CN201335765Y (zh) * 2008-12-31 2009-10-28 郑晓明 分光测量器

Also Published As

Publication number Publication date
CN102269794A (zh) 2011-12-07
JP3161943U (ja) 2010-08-12
TWI428616B (zh) 2014-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees