TW201144341A - Cross-linked polymer particle and method for producing same - Google Patents

Cross-linked polymer particle and method for producing same Download PDF

Info

Publication number
TW201144341A
TW201144341A TW100108712A TW100108712A TW201144341A TW 201144341 A TW201144341 A TW 201144341A TW 100108712 A TW100108712 A TW 100108712A TW 100108712 A TW100108712 A TW 100108712A TW 201144341 A TW201144341 A TW 201144341A
Authority
TW
Taiwan
Prior art keywords
crosslinked polymer
particles
particle
amine
group
Prior art date
Application number
TW100108712A
Other languages
Chinese (zh)
Inventor
Masaru Watanabe
Kenji Takai
Yuuko Nagahara
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201144341A publication Critical patent/TW201144341A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02Polyamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating
    • C08J3/14Powdering or granulating by precipitation from solutions
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/24Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/243Two or more independent types of crosslinking for one or more polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2353/00Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C08J2353/02Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/02Ingredients treated with inorganic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Chemically Coating (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is a cross-linked polymer particle that can be obtained by a production method provided with a step (a) in which a mother particle formed from a cross-linked polymer having functional groups is brought into contact with an amino compound having two or more amino groups, and the cross-linked polymer is further cross-linked by a reaction of the functional groups and amino groups. This amino compound includes low molecular weight amino compounds with molecular weights less than 500.

Description

201144341 六、發明說明: 【發明所屬之技術領域】 本發明係關於交聯聚合物粒子及其製造方法。 【先前技術】 交聯度高且具有優異耐熱性及耐藥品性之交聯聚合物 粒子已應用於以各種間隔物、導電性微粒子等之電性、電 子材料領域爲首之樹脂薄膜之滑動特性改質劑、層析用擔 體、生物醫藥用元件等之各種領域並已實用化。一般,該 等交聯聚合物粒子係利用懸浮聚合法、乳化聚合法、種子 聚合法及分散聚合法等方法製造。 於懸浮聚合,可藉由機械力,將交聯性單體於水性介 質中作爲油滴之懸浮狀態聚合,而製造交聯聚合物粒子。 乳化聚合時,通常交聯性單體之比例上限爲2.0質量% 左右。且,所得之交聯聚合物粒子之粒徑範圍爲 0.1~1.0μιη,可謂爲無法獲得具有超過Ιμιη粒徑者。於專利 文獻1,揭示有藉由使用特殊種子,即使使用交聯性單體 20·0質量%以上亦可安定地乳化聚合之方法。然而,由該 方法所得之粒徑範圍與通常之乳化聚合法同樣爲 0.1〜Ι.Ομηι。因此,由乳化聚合難以獲得具有超過Ιμηι粒徑 之交聯聚合物粒子。 於專利文獻2中,揭示有保持粒子形狀直接使單體聚 合之膨潤聚合法,其經過將具有對水溶解度小的有機化合 物作爲膨潤助劑而吸收於種子聚合物之第1階段,隨後, -5- 201144341 將於水中某程度可溶之單體吸收於種子聚合物中而形成單 體膨潤粒子之第2階段。依據該方法,成爲可使用較多交 聯性單體’結果,可製造具有以1 μιη以上大小均一粒子分 佈之交聯聚合物粒子。然而’該方法所用之膨潤助劑對水 之溶解度顯著較低,故有將膨潤助劑吸收於種子聚合物之 第1階段需要長時間之缺點。而且,未吸收於種子聚合物 而殘留之油滴於聚合後,有形成粗大粒子之情況。 於專利文獻3中’揭示使用20質量%以上之交聯性乙烯 基單體由分散聚合法製造交聯粒子之方法。依據該方法, 有可能製造數微米左右之單分散粒子。但,粒徑若超過 2.5μτη,則粒子彼此之凝集熔著增大,非常難以獲得單分 散粒子。而且,使親水性或水溶性聚合性單體共聚合時, 容易產生凝集熔著,因而更難以獲得單分散粒子。 於專利文獻4中,報導有進行與分散聚合法類似之沉 澱聚合法時,藉由使具有親水性官能基或活性氫基之不飽 和單體與交聯性單體共聚合而製造交聯聚合物粒子之方法 。依據該方法,可效率良好地獲得數μπι之單分散粒子。 於專利文獻5中,報導有使具有官能基之未交聯之母 粒子與環氧化合物、噁唑啉化合物或胺基化合物反應而使 母粒子交聯之方法。依據該方法,雖然可使未交聯粒子交 聯,但由於經反應之化合物之反應性高,因此主要於粒子 表面進行交聯反應,而有形成蕊殼構造之傾向》 〔先前技術文獻〕 〔專利文獻〕201144341 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to crosslinked polymer particles and a method for producing the same. [Prior Art] The crosslinked polymer particles having a high degree of cross-linking and excellent heat resistance and chemical resistance have been applied to the sliding properties of resin films including various spacers, conductive fine particles, and the like. Various fields such as modifiers, chromatography supports, and biomedical devices have been put into practical use. Generally, the crosslinked polymer particles are produced by a suspension polymerization method, an emulsion polymerization method, a seed polymerization method, or a dispersion polymerization method. In suspension polymerization, a cross-linkable monomer can be polymerized in a suspended state in an aqueous medium as an oil droplet by mechanical force to produce a crosslinked polymer particle. In the emulsion polymerization, the upper limit of the ratio of the crosslinkable monomer is usually about 2.0% by mass. Further, the obtained crosslinked polymer particles have a particle diameter ranging from 0.1 to 1.0 μm, which means that a particle size exceeding Ιμηη cannot be obtained. Patent Document 1 discloses a method in which emulsion polymerization can be stably carried out by using a special seed even if a crosslinkable monomer is used in an amount of 20.0% by mass or more. However, the particle size range obtained by this method is 0.1 to Ι.Ομηι as in the usual emulsion polymerization method. Therefore, it is difficult to obtain crosslinked polymer particles having a particle diameter exceeding Ιμηι by emulsion polymerization. Patent Document 2 discloses a swelling polymerization method in which a particle shape directly polymerizes a monomer, which is subjected to a first stage of absorption of a seed polymer by using an organic compound having a small water solubility as a swelling aid, and then - 5- 201144341 The second stage of forming monomeric swelling particles by absorbing a certain amount of soluble monomers in the water into the seed polymer. According to this method, as a result of using a large amount of crosslinkable monomer, it is possible to produce a crosslinked polymer particle having a uniform particle size of 1 μm or more. However, the swelling aid used in the method has a significantly lower solubility in water, so that it takes a long time to absorb the swelling aid in the first stage of the seed polymer. Further, the oil droplets remaining after being absorbed by the seed polymer may be formed into coarse particles after polymerization. In Patent Document 3, a method of producing crosslinked particles by a dispersion polymerization method using 20% by mass or more of a crosslinkable vinyl monomer is disclosed. According to this method, it is possible to produce monodisperse particles of several micrometers or so. However, if the particle diameter exceeds 2.5 μτη, the aggregation and aggregation of the particles increase, and it is very difficult to obtain single-dispersed particles. Further, when the hydrophilic or water-soluble polymerizable monomer is copolymerized, aggregation and aggregation are likely to occur, so that it is more difficult to obtain monodisperse particles. In Patent Document 4, when a precipitation polymerization method similar to the dispersion polymerization method is reported, cross-linking polymerization is produced by copolymerizing an unsaturated monomer having a hydrophilic functional group or an active hydrogen group with a crosslinkable monomer. The method of particle. According to this method, monodisperse particles of several μm can be obtained efficiently. Patent Document 5 discloses a method of crosslinking mother particles by reacting an uncrosslinked mother particle having a functional group with an epoxy compound, an oxazoline compound or an amine compound. According to this method, although the uncrosslinked particles can be crosslinked, since the reacted compound has high reactivity, the crosslinking reaction is mainly carried out on the surface of the particles, and there is a tendency to form a core structure [Prior Art Document] [ Patent literature]

S -6- 201144341 專利文獻1 :特開平1-3 1 5454號公報 專利文獻2:特開昭54- 1 26288號公報 專利文獻3:特開平6-1227 03號公報 專利文獻4:特開2006-282772號公報 專利文獻5 :日本專利第42 1 5 5 2 1號公報 〔非專利文獻〕 非專利文獻 1 : Journal of Polymer Science· Part A: Polymer Chemistry, ( USA) , 3 1, 3 257 ( 1 993 ) 【發明內容】 〔發明欲解決之課題〕 依據以往方法,例如母粒子於粒子表面及內部含有源 自親水性單體之官能基時,難以獲得如壓縮變形回復率及 壓縮破壞強度之壓縮特性方面可達成充分程度之聚合物粒 子。例如聚合物粒子以金屬層覆蓋形成導電性粒子,將其 使用於異向導電性接著劑時,聚合物粒子具有良好壓縮特 性係其極重要。再者,與壓縮特性同時,藉由在聚合物粒 子表面進行鍍敷處理而形成金屬鍍敷層之際,要求.形成具 有高均一性且良好密著性之鎪敷層。然而,源自親水性單 體之官能基並非於粒子表面時,在具有優異壓縮特性之同 時,獲得鍍敷形成性方面亦充分優異之聚合物粒子於以往 有其困難。 因此’本發明之主要目的在於提供具有良好壓縮特性 同時可在其表面以良好狀態形成鍍敷層之聚合物粒子。 201144341 〔用以解決問題之手段〕 本發明係有關交聯聚合物粒子,其可由具備有使具有 官能基之交聯聚合物所形成之母粒子,與具有2個以上之 胺基的胺化合物接觸,使前述官能基與前述胺基反應,而 使前述交聯聚合物再進行交聯之步驟(a)之製造方法所 得者。上述胺基化合物包含分子量未達5 〇〇之低分子量胺 基化合物。 上述本發明之交聯聚合物粒子具有良好壓縮特性同時 可於其表面以良好狀態形成鍍敷層。藉由使用分子量未達 500之低分子量胺基化合物,可有效率地交聯至母粒子內 部,可提高壓縮特性。如舉以沉澱聚合所合成之粒子爲例 ,使親水性單體共聚合所得之母粒子,一般由於交聯性單 體量較少故有壓縮特性低之傾向。藉由使用具有2個以上 胺基之化合物使具有源自親水性單體之羧基等之官能基之 母粒子後交聯,可獲得壓縮特性進而鍍敷形成性良好之交 聯聚合物粒子》 上述銨機化合物較好更包含分子量500〜10000之高分 子量胺基化合物。藉由倂用分子量500-10000之高分子量 胺基化合物,可於母粒子表面導入較多胺基,可更改善鍍 敷形成性。 交聯聚合物之平均粒徑較好爲0.1〜1 0 μπι。交聯聚合物 粒子之粒徑之Cv値較好爲1 0%以下。交聯聚合物粒子之粒 徑Cv値若低,則由交聯聚合物粒子所得之導電性粒子可更Japanese Patent Application Laid-Open No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. -282772 Patent Document 5: Japanese Patent No. 42 1 5 5 2 1 [Non-Patent Document] Non-Patent Document 1: Journal of Polymer Science·Part A: Polymer Chemistry, (USA) , 3 1, 3 257 ( 1 993 ) [Problem to be Solved by the Invention] According to the conventional method, for example, when the mother particles contain a functional group derived from a hydrophilic monomer on the surface and inside of the particles, it is difficult to obtain a compression deformation recovery rate and a compression fracture strength. A sufficient degree of polymer particles can be achieved in terms of compression characteristics. For example, when polymer particles are covered with a metal layer to form conductive particles, and they are used for an anisotropic conductive adhesive, it is extremely important that the polymer particles have good compression characteristics. Further, at the same time as the compression characteristics, when a metal plating layer is formed by plating treatment on the surface of the polymer particles, it is required to form a tantalum layer having high uniformity and good adhesion. However, when the functional group derived from the hydrophilic monomer is not on the surface of the particle, it is difficult to obtain a polymer particle which is excellent in plating formability while having excellent compression characteristics. Therefore, the main object of the present invention is to provide a polymer particle which has good compression characteristics while forming a plating layer in a good state on its surface. 201144341 [Means for Solving the Problem] The present invention relates to a crosslinked polymer particle which can be contacted with an amine compound having a crosslinked polymer having a functional group and an amine compound having two or more amine groups The method for producing the step (a) in which the aforementioned functional group is reacted with the aforementioned amine group to crosslink the crosslinked polymer. The above amine-based compound contains a low molecular weight amine compound having a molecular weight of less than 5 Å. The above crosslinked polymer particles of the present invention have good compression characteristics and can form a plating layer in a good state on the surface thereof. By using a low molecular weight amine compound having a molecular weight of less than 500, it can be efficiently crosslinked to the inside of the mother particle, and the compression property can be improved. As an example of the particles synthesized by precipitation polymerization, the mother particles obtained by copolymerizing a hydrophilic monomer generally have a low compressive property because the amount of the crosslinkable monomer is small. By using a compound having two or more amine groups to crosslink the mother particles having a functional group derived from a carboxyl group of a hydrophilic monomer, and thereby obtaining a crosslinked polymer particle having a compression property and a good plating formability. The ammonium compound preferably further comprises a high molecular weight amine compound having a molecular weight of from 500 to 10,000. By using a high molecular weight amine compound having a molecular weight of 500 to 10,000, a large amount of an amine group can be introduced on the surface of the mother particle, and the plating formability can be further improved. The average particle diameter of the crosslinked polymer is preferably from 0.1 to 10 μm. The Cv 粒径 of the particle diameter of the crosslinked polymer particles is preferably at most 10%. If the particle diameter Cv of the crosslinked polymer particles is low, the conductive particles obtained by crosslinking the polymer particles may be more

S -8- 201144341 提高使用於異向性導電性接著劑時之連接信賴性》 形成上述母粒子之交聯聚合物較好具有自羧基、環氧 基及環氧丙基所成群選出之至少一種官能基。該等官能基 與胺基化合物之胺基有效地反應,而於母粒子中形成交聯 構造。 上述母粒子較好爲可利用懸浮聚合、乳化聚合、分散 聚合、沉澱聚合或種子聚合所得之聚合物。 形成上述母粒子之交聯聚合物較好爲使含有1 〇質量% 以上之具有2個以上不飽和雙鍵之單體的單體混合物經共 聚合所形成之共聚物。藉此,可特別提高交聯聚合物粒子 之壓縮特性。具有2個以上不飽和雙鍵之單體較好爲自二 乙烯基苯及二(甲基)丙烯酸酯選出之至少一種。 步驟(a)之後之母粒子在180 °C較好具有40%以上之 壓縮變形回復率及lOmN以上之壓縮破壞強度。 本發明又有關可藉由具備對上述本發明之交聯聚合物 粒子施以鍍敷之步驟(c)之製造方法獲得之導電性粒子 。本發明之導電性粒子可使用作爲例如異向導電性接著劑 用之導電性粒子。 步驟(c )中,較好使用Pd離子錯合物作爲鍍敷觸媒 對交聯聚合物粒子施以鍍敷。 於另一方面,本發明係關於交聯聚合物粒子之製造方 法。本發明之製造方法具備使自具有官能基之交聯聚合物 所形成之母粒子與具有2個以上胺基之胺基化合物接觸’ 使前述官能基與胺基反應,藉此使交聯聚合物再進行交聯 -9 - 201144341 之步驟(a)。胺基化合物包含分子量未達5 00之低分子量 胺基化合物。 依據本發明之方法,可獲得具有良好壓縮特性同時可 於其表面以良好狀態形成鍍敷層之交聯聚合物粒子》 於步驟(a)中,胺基化合物之胺基比例,相對於母 粒子中官能基1當量較好爲0.1〜5當量。藉由使用該等比例 之胺基化合物處理母粒子,可獲得具有特別優異壓縮特性 及鍍敷形成性之交聯聚合物粒子。 本發明又有關異向導電性接著劑,其具備膠黏樹脂以 及分散於該膠黏樹脂中之上述導電性粒子。 〔發明效果〕 依據本發明,提供具有良好壓縮特性同時可於其表面 以良好狀態形成鍍敷層之聚合物粒子。 【實施方式】 以下’基於本發明之較佳實施形態加以詳細說明。但 ,本發明不限定於以下實施形態者。 本實施形態之交聯聚合物粒子係利用具備有準備自具 有官能基之交聯聚合物所形成之母粒子之步驟,及使該母 粒子與具有2個以上胺基之胺基化合物接觸,使前述官能 基與胺基反應’藉此使交聯聚合物再進行交聯之步驟(a )之製造方法獲得。 圖1爲顯示交聯聚合物粒子之一實施形態之模式圖。S -8- 201144341 Improving connection reliability when used for an anisotropic conductive adhesive 》 The crosslinked polymer forming the above-mentioned mother particles preferably has at least one selected from the group consisting of a carboxyl group, an epoxy group and an epoxy propyl group. A functional group. The functional groups react efficiently with the amine groups of the amine compound to form a crosslinked structure in the parent particles. The above mother particles are preferably polymers obtainable by suspension polymerization, emulsion polymerization, dispersion polymerization, precipitation polymerization or seed polymerization. The crosslinked polymer forming the above-mentioned mother particles is preferably a copolymer obtained by copolymerizing a monomer mixture containing 1% by mass or more of a monomer having two or more unsaturated double bonds. Thereby, the compression characteristics of the crosslinked polymer particles can be particularly improved. The monomer having two or more unsaturated double bonds is preferably at least one selected from the group consisting of divinylbenzene and di(meth)acrylate. The mother particles after the step (a) preferably have a compression set recovery ratio of 40% or more and a compressive fracture strength of 10 m or more at 180 °C. Further, the present invention relates to an electroconductive particle obtainable by the production method comprising the step (c) of plating the crosslinked polymer particles of the present invention. The conductive particles of the present invention can be used as, for example, conductive particles for an anisotropic conductive adhesive. In the step (c), the Pd ion complex is preferably used as a plating catalyst to apply the plating to the crosslinked polymer particles. In another aspect, the invention relates to a method of making crosslinked polymer particles. The production method of the present invention comprises contacting a mother particle formed of a crosslinked polymer having a functional group with an amine compound having two or more amine groups, and reacting the functional group with an amine group, thereby causing a crosslinked polymer Then proceed to step (a) of cross-linking -9 - 201144341. The amine compound contains a low molecular weight amine compound having a molecular weight of less than 500. According to the method of the present invention, crosslinked polymer particles having good compression characteristics while forming a plating layer in a good state on the surface thereof can be obtained. In the step (a), the proportion of the amine group of the amine compound is relative to the mother particle. The intermediate functional group 1 equivalent is preferably from 0.1 to 5 equivalents. By treating the mother particles with the amine-based compounds in the same ratio, crosslinked polymer particles having particularly excellent compression characteristics and plating formability can be obtained. Further, the present invention relates to an anisotropic conductive adhesive comprising an adhesive resin and the above-mentioned conductive particles dispersed in the adhesive resin. [Effect of the Invention] According to the present invention, a polymer particle having a good compression property and capable of forming a plating layer on a surface thereof in a good state is provided. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described in detail. However, the present invention is not limited to the following embodiments. The crosslinked polymer particles of the present embodiment are obtained by using a step of preparing a mother particle formed of a crosslinked polymer having a functional group, and contacting the mother particle with an amine compound having two or more amine groups. The above-mentioned functional group is reacted with an amine group to thereby obtain a production method of the step (a) in which the crosslinked polymer is further crosslinked. Fig. 1 is a schematic view showing an embodiment of crosslinked polymer particles.

-10- 201144341 圖1中所不之父聯聚合物粒子1係具備母粒子10、爲粒子狀 父聯聚合物的母粒子10、源自使交聯聚合物交聯之胺基化 合物之父聯部X以及具有源自胺基化合物之胺基的修飾部R 。交聯部X分佈遍及母粒子10表面及內部全體。修飾部尺主 要配至於母粒子10表面。 構成母粒子1 0之交聯聚合物微例如苯乙烯系樹脂、丙 烯酸系樹脂、甲基丙烯酸系樹脂、聚乙烯系樹脂、聚丙烯 系樹脂、矽氧系樹脂、聚酯系樹脂、聚胺基甲酸酯系樹脂 、聚醯胺系樹脂、環氧系樹脂、聚乙烯縮丁醛系樹脂、松 香系樹脂、萜系樹脂、酚系樹脂、三聚氰胺系樹脂、胍系 樹脂、噁唑啉系樹脂、碳二醯亞胺系樹脂以及使該等進行 交聯反應所得之硬化樹脂。該等可以一種單獨使用,或可 組合2種以上使用。該等聚合物中,導入有與胺基化合物 反應之官能基(羧基、環氧基及環氧丙基)0 母粒子10較好爲藉由由具有不飽和雙鍵之複數種單體 所構成之單體混合物之共聚合所形成之交聯聚合物之粒子 。單體混合物包含例如具有2個以上不飽和雙鍵之多官能 性單體與具有由羧基、環氧基及環氧丙基所成群選出之至 少一種親水性官能基之單體。 單體混合物之具有2個以上不飽和雙鍵之多官能性單 體較好相對於單體混合物全體含有10質量%以上。藉此, 特別容易形成壓縮變形回復率高之交聯聚合物粒子。交聯 聚合物粒子之壓縮變形回復率若高,則聚合物交聯粒子作 爲構成異向導電性接著劑之導電性粒子之聚合物粒子而使 -11 - 201144341 用時,隨著時間經過而連接電阻增大可受到抑制,可達成 更高之連接信賴性。由該觀點觀之,單體混合物中具有2 個以上不飽和雙鍵之多官能性單體更好含有1〇〜80質量%, 再更好爲1 〇〜60質量%,又更好爲10~50質量%。 母粒子10較好藉由在可溶解單體混合物,而實質上不 溶解所生成之交聯聚合物之溶劑中進行溶液聚合之方法所 獲得。在如塊狀聚合之無溶劑下亦可形成交聯聚合物》 至於溶液聚合,舉例有(1 )在水溶液中進行之乳化 或懸浮聚合,(2 )於非水系有機溶劑中或水與非水系溶 劑之混合溶劑中,在分散劑存在下進行之分散聚合,(3 )組合上述(1)或(2)與種子聚合法之方法等。 基於容易控制粒徑、於洗淨等之後步驟中之處理變容 易、不使用種子粒子不僅亦可獲得目的之微米尺寸粒子且 可容易地製造具有親水性官能基之共聚物之可容易地獲得 高壓縮移位時之變形回復率優異之粒子等之理由,較好採 用沉澱聚合。 具有2個以上不飽和雙鍵之單體並未特別限定,例如 係自通常使用之多官能基乙烯基單體及多官能(甲基)丙 烯酸酯適當選擇。 至於多官能單體之具體例,舉例有二乙烯基苯;二乙 烯基聯苯;二乙烯基萘、(聚)乙二醇二(甲基)丙烯酸 酯、(聚)丙二醇二(甲基)丙烯酸酯、(聚)丁二醇二 (甲基)丙烯酸酯等之(聚)烷二醇二(甲基)丙烯酸酯 ;1,6·己二醇二(甲基)丙烯酸酯、1,8-辛二醇二(甲基-10- 201144341 The parent polymer particle 1 in Fig. 1 includes the mother particle 10, the parent particle 10 which is a particulate parent polymer, and the parent cell derived from the amine compound which crosslinks the crosslinked polymer. a moiety X and a modifying moiety R having an amine group derived from an amine compound. The crosslinked portion X is distributed over the entire surface of the mother particle 10 and the entire interior. The modifier is mainly applied to the surface of the mother particle 10. The crosslinked polymer constituting the mother particle 10 is, for example, a styrene resin, an acrylic resin, a methacrylic resin, a polyethylene resin, a polypropylene resin, a fluorene resin, a polyester resin, or a polyamine group. Formate resin, polyamine resin, epoxy resin, polyvinyl butyral resin, rosin resin, oxime resin, phenol resin, melamine resin, oxime resin, oxazoline resin A carbodiimide-based resin and a cured resin obtained by subjecting these to a crosslinking reaction. These may be used alone or in combination of two or more. Among the polymers, a functional group (carboxyl group, epoxy group, and epoxypropyl group) 0, which is introduced with a reaction with an amine compound, is preferably composed of a plurality of monomers having an unsaturated double bond. The particles of the crosslinked polymer formed by copolymerization of the monomer mixture. The monomer mixture contains, for example, a polyfunctional monomer having two or more unsaturated double bonds and a monomer having at least one hydrophilic functional group selected from the group consisting of a carboxyl group, an epoxy group, and a glycidyl group. The polyfunctional monomer having two or more unsaturated double bonds in the monomer mixture is preferably contained in an amount of 10% by mass or more based on the entire monomer mixture. Thereby, it is particularly easy to form crosslinked polymer particles having a high compression deformation recovery rate. When the compression-deformation recovery rate of the cross-linked polymer particles is high, the polymer cross-linking particles are used as polymer particles constituting the electroconductive particles of the anisotropic conductive adhesive, and when used in -11 - 201144341, they are connected with time. The increase in resistance can be suppressed, achieving higher connection reliability. From this point of view, the polyfunctional monomer having two or more unsaturated double bonds in the monomer mixture preferably contains from 1 to 80% by mass, more preferably from 1 to 60% by mass, even more preferably from 10 to 10% by mass. ~50% by mass. The mother particles 10 are preferably obtained by a solution polymerization method in a solvent which dissolves the monomer mixture and substantially does not dissolve the formed crosslinked polymer. A crosslinked polymer may also be formed in the absence of a solvent such as a bulk polymerization. As for solution polymerization, there are, for example, (1) emulsification or suspension polymerization in an aqueous solution, (2) in a non-aqueous organic solvent or water and a non-aqueous system. In the solvent mixture, the dispersion polymerization is carried out in the presence of a dispersant, and (3) the method of the above (1) or (2) and the seed polymerization method are combined. The treatment in the step after the particle size is easy to control, the washing, and the like becomes easy, and the use of the seed particles can not only obtain the micron-sized particles of interest but also can easily produce a copolymer having a hydrophilic functional group, which can be easily obtained. Precipitation polymerization is preferably used for the reason of particles having excellent deformation recovery rate at the time of compression displacement. The monomer having two or more unsaturated double bonds is not particularly limited, and is suitably selected, for example, from a polyfunctional vinyl monomer and a polyfunctional (meth) acrylate which are usually used. Specific examples of the polyfunctional monomer include divinylbenzene; divinylbiphenyl; divinylnaphthalene, (poly)ethylene glycol di(meth)acrylate, and (poly)propylene glycol di(methyl). (poly)alkylene glycol di(meth)acrylate such as acrylate, (poly)butylene glycol di(meth)acrylate; 1,6·hexanediol di(meth)acrylate, 1,8 -octanediol di(methyl

-12- 201144341 )丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、ι,1〇_癸二 醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙燃 酸酯、3-甲基-1,5-戊二醇二(甲基)丙烯酸酯、2,4_二乙 基-1,5-戊二醇二(甲基)丙烯酸酯、丁基乙基丙二醇二( 甲基)丙烯酸酯、3-甲基-1,7-辛二醇二(甲基)丙烯酸酯 、2-甲基- l,8-辛二醇二(甲基)丙烯酸酯等之烷二醇系二 (甲基)丙烯酸酯;新戊二醇二(甲基)丙烯酸酯、三羥 甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基) 丙烯酸酯、四羥甲基丙烷四(甲基)丙烯酸酯、季戊四醇 三(甲基)丙烯酸酯、乙氧化環己烷二甲醇二(甲基)丙 烯酸酯、乙氧化雙酚A二(甲基)丙烯酸酯、三環癸烷二 甲醇二(甲基)丙烯酸酯、丙氧化乙氧化雙酚A二(甲基 )丙烯酸酯、1,1,1-參(羥基甲基)乙烷二(甲基)丙烯 酸酯、1,1,1-參(羥基甲基)乙烷三(甲基)丙烯酸酯、 參(羥基甲基)丙烷三丙烯酸酯、苯二甲酸二烯丙 酯及其異構物、異氰尿酸三烯丙酯及其衍生物。至於商業 可獲得之多官能基單體,舉例有新中村化學工業(股)至 之 NK ESTER ( A-TMPT-6P0、A-TMPT-3 E0、A-TMM-3LMN ' A-GLY系列、A-9300、AD-TMP、AD-TMP-4CL、 ATM-4E、A-DPH )等。該等單體可單獨使用亦可倂用兩 種類以上。 該等中,多官能性單體較好含有自二乙烯基苯及多官 能基(甲基)丙烯酸酯選出之至少1種。藉由使用該等單 體,所得之交聯聚合物粒子之壓縮變形回復率更容易提高 -13- 201144341 。基於同樣觀點,多官能基之單體較好包含二(甲 烯酸酯,更好爲烷二醇二(甲基)丙烯酸酯。烷二 數較好爲碳數6~18,更好爲碳數8〜12。 至於具有羧基之自由基聚合性單體舉例有例如 酸、甲基丙烯酸、巴豆酸、衣康酸、馬來酸、富碼 康酸單丁酯及馬來酸單丁酯之不飽和單或二羧酸或 二元酸。該等可單獨使用亦可倂用兩種以上。 具有環氧基之自由基聚合性單體係自(甲基) 環氧丙酯、(甲基)丙烯酸(/3-甲基)環氧丙酯 基)丙烯酸3,4-環氧基環己基酯、烯丙基環氧丙 3,4-環氧基乙烯基環己烷、馬來酸二(沒-甲基)環 及富碼酸二(/3-甲基)環氧丙酯選出。 亦可使用其他具有環氧基之化合物而於交聯聚 導入環氧基。具有環氧基之化合物舉例有如乙二醇-12- 201144341 )Acrylate, 1,9-nonanediol di(meth)acrylate, ι,1〇-nonanediol di(meth)acrylate, 1,12-dodecanediol di Methyl)propionate, 3-methyl-1,5-pentanediol di(meth)acrylate, 2,4-diethyl-1,5-pentanediol di(meth)acrylate , butyl ethyl propylene glycol di(meth) acrylate, 3-methyl-1,7-octanediol di(meth) acrylate, 2-methyl- l, 8-octanediol di(methyl) Alkanediol-based di(meth)acrylate such as acrylate; neopentyl glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolethane methane (a) Acrylate, tetramethylolpropane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, ethoxycyclohexanedimethanol di(meth)acrylate, ethoxylated bisphenol A di(A) Acrylate, tricyclodecane dimethanol di(meth) acrylate, ethoxylated bisphenol A di(meth) acrylate, 1,1,1- cis (hydroxymethyl) ethane di ( Methacrylate Ester, 1,1,1-paraxyl(hydroxymethyl)ethane tri(meth)acrylate, cis (hydroxymethyl)propane triacrylate, diallyl phthalate and isomers thereof, isocyanide Triallyl urate and its derivatives. As for commercially available polyfunctional monomers, examples include Nakamura Chemical Industry Co., Ltd. to NK ESTER (A-TMPT-6P0, A-TMPT-3 E0, A-TMM-3LMN 'A-GLY Series, A -9300, AD-TMP, AD-TMP-4CL, ATM-4E, A-DPH). These monomers may be used singly or in combination of two or more kinds. Among these, the polyfunctional monomer preferably contains at least one selected from the group consisting of divinylbenzene and polyfunctional (meth) acrylate. By using these monomers, the compression set recovery rate of the resulting crosslinked polymer particles is more easily improved -13-201144341. Based on the same viewpoint, the monomer having a polyfunctional group preferably contains a bis(methenoic acid ester, more preferably an alkylene glycol di(meth) acrylate. The number of the alkyl groups is preferably from 6 to 18 carbon atoms, more preferably carbon. Numbers 8 to 12. Examples of the radical polymerizable monomer having a carboxyl group are, for example, an acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, monobutyl methacrylate, and monobutyl maleate. An unsaturated mono- or dicarboxylic acid or a dibasic acid. These may be used alone or in combination of two or more. The radically polymerizable single system having an epoxy group is derived from (meth) propyl acrylate, (methyl) Acrylic (/3-methyl)glycidyl acrylate) 3,4-epoxycyclohexyl acrylate, allyl epoxypropyl 3,4-epoxy vinylcyclohexane, maleic acid The (no-methyl) ring and the rich acid di(/3-methyl) glycidyl ester were selected. Other compounds having an epoxy group may also be used to crosslink and introduce an epoxy group. Examples of compounds having an epoxy group are, for example, ethylene glycol.

醇二環氧丙醚、甘油三環氧丙醚、三羥甲基丙烷三 醚及季戊四醇四環氧丙醚之脂肪族多元醇之環氧丙 聚乙二醇二環氧丙醚、聚丙二醇二環氧丙醚及四丁 環氧丙醚之聚烷二醇之環氧丙醚,聚酯樹脂系之聚 化物,聚醯胺樹脂系之聚環氧丙基化物,雙酚Α系 樹脂、酚酚醛清漆系之環氧樹脂,以及環氧基胺基 樹脂。該等可單獨使用亦可倂用兩種以上。 單體混合物亦可包含具有1個不飽和雙鍵之單 單體。該單官能基單體之比例,較好爲單體混合物 基)丙 醇之碳 如丙烯 酸、衣 不飽和 丙烯酸 、(甲 基醚、 氧丙酯 合物中 二環氧 己烷二 環氧丙 醚,如 二醇二 環氧基 之環氧 甲酸酯 官能基 全體之Ethylene diglycidyl ether, glycerol triglycidyl ether, trimethylolpropane triether and pentaerythritol tetraglycidyl ether of aliphatic polyols, propylene glycol diglycidyl ether, polypropylene glycol Glycidyl ether of polyalkylene glycol of glycidyl ether and tetrabutylglycidyl ether, polymer of polyester resin, polyepoxypropyl compound of polyamine resin, bisphenol oxime resin, phenol A novolak-based epoxy resin, and an epoxy-based amine-based resin. These may be used alone or in combination of two or more. The monomer mixture may also comprise a single monomer having one unsaturated double bond. The proportion of the monofunctional monomer is preferably a monomer mixture based on a carbon of a propanol such as acrylic acid, unsaturated acrylic acid, (methyl ether, oxypropyl acrylate, diethylene oxide diglycidyl ether) , such as the diol di-epoxy group of the epoxy ester functional group

S -14- 201144341 0~70質量%。單官能基單體之比例更好爲5〜7〇質量%,又 更好爲10〜70質量%,再更好爲15〜70質量。/〇。 至於單官能基單體舉例有例如(i)苯乙烯、鄰-甲基 苯乙烯、間-甲基苯乙烯、對-甲基苯乙烯、α -甲基苯乙烯 、鄰-乙基苯乙烯、間-乙基苯乙烯、對-乙基苯乙烯、24_ 二甲基苯乙烯、對-正丁基苯乙烯、對-第三丁基苯乙烯、 對-正己基苯乙烯、對-正辛基苯乙烯、對-正壬基苯乙烯、 對-正癸基苯乙烯、對-正十二烷基苯乙烯、對-甲氧基苯乙 烯、對-苯基苯乙烯、對-氯苯乙烯、3,4_二氯苯乙烯等之 苯乙烯或其衍生物’ (ii)丙烯酸甲酯、丙烯酸乙酯、丙 烯酸丙酯、丙烯酸正丁酯、丙烯酸異丁酯、丙烯酸己酯、 丙稀酸2-乙基己酯、丙烯酸正辛酯、丙烯酸十二烷酯、丙 烯酸月桂酯、丙烯酸硬脂酯、丙烯酸2-氯乙酯、丙烯酸苯 酯' α-氯丙烯酸甲酯、甲基丙烯酸甲酯、甲基丙烯酸乙 酯、甲基丙烯酸丙酯、甲基丙烯酸正丁酯、甲基丙烯酸異 丁酯、甲基丙烯酸己酯、甲基丙烯酸2-乙基己酯、甲基丙 烯酸正辛酯、甲基丙烯酸十二烷酯、甲基丙烯酸月桂酯、 甲基丙烯酸硬脂酯等之(甲基)丙烯酸酯,(iii)乙酸乙 烯酯、丙酸乙烯酯、苯甲酸乙烯酯、丁酸乙烯酯等之乙烯 酯’ (iv) 乙烯基吡咯、N-乙烯基咔唑、N-乙烯基吲哚 、N -乙烯基吡咯烷酮等之N -乙烯基化合物,(v)氟化乙 烯、偏氟化乙烯、四氟乙烯、餾氟丙烯、丙烯酸三氟乙酯 、丙烯酸四氟丙酯等之含有氟烷基之(甲基)丙烯酸酯, (vi) 丁二烯、異戊間二烯等之共軛二烯。該等可單獨使 -15- 201144341 用一種亦可組合兩種以上使用。 該等中,較好爲苯乙烯或其衍生物、(甲基)丙烯酸 酯及乙烯酯。藉由使用該等,可有效率地獲得具有上述物 性之母粒子。 用於製造母粒子之自由基聚合時使用之聚合起始劑可 使用公知之自由基聚合起始劑。自由基聚合起始劑之具體 例,舉例有過氧苯甲醯、枯基過氧化氫、第三丁基過氧化 氫、過硫酸鈉、過硫酸銨等之過氧化物、偶氮異丁腈、偶 氮雙甲基丁腈、偶氮雙異戊腈等之偶氮系化合物等。該等 可單獨使用亦可倂用兩種以上。 至於由溶液聚合製造母粒子之劑所用之聚合溶劑之具 體例,舉例有水、甲醇、乙醇、1-丙醇、2-丙醇、1-丁醇 、2-丁醇、異丁醇、第三丁醇、1-戊醇、2-戊醇、3-戊醇 、2-甲基-1-丁醇、異戊醇、第三戊醇、1-己醇、2-甲基-1-戊醇、4-甲基-2-戊醇、2-乙基丁醇、卜庚醇、2-庚醇、3-庚醇、2-辛醇、2-乙基-1-己醇、苯甲醇、環己醇等之醇類 :甲基溶纖劑、乙基溶纖劑、異丙基溶纖劑、丁基溶纖劑 、二乙二醇單丁醚等之醚醇類;丙醇、甲基乙基酮、甲基 異丁醇、環己酮等酮類:乙酸乙酯、乙酸丁酯、丙酸乙酯 、(烷基)溶纖劑乙酸酯、乙基卡必醇乙酸酯、丁基卡必 醇乙酸酯等酯類;戊烷、2-甲基丁烷、正己烷、環己烷、 2-甲基戊烷、2,2-二甲基丁烷、2,3-二甲基丁烷、庚烷、 正辛烷、異辛烷、2,2,3-三甲基戊烷、癸烷、壬烷、環戊 烷、甲基環戊烷、甲基環己烷、乙基環己烷、對-盖烷、S -14- 201144341 0~70% by mass. The proportion of the monofunctional monomer is more preferably from 5 to 7 % by mass, still more preferably from 10 to 70% by mass, still more preferably from 15 to 70% by mass. /〇. As the monofunctional monomer, for example, (i) styrene, o-methyl styrene, m-methyl styrene, p-methyl styrene, α-methyl styrene, o-ethyl styrene, M-ethylstyrene, p-ethylstyrene, 24_dimethylstyrene, p-n-butylstyrene, p-tert-butylstyrene, p-n-hexylstyrene, p-n-octyl Styrene, p-n-decylstyrene, p-n-decylstyrene, p-n-dodecylstyrene, p-methoxystyrene, p-phenylstyrene, p-chlorostyrene, Styrene or its derivative of 3,4-dichlorostyrene, etc. (ii) methyl acrylate, ethyl acrylate, propyl acrylate, n-butyl acrylate, isobutyl acrylate, hexyl acrylate, acrylic acid 2 -ethylhexyl ester, n-octyl acrylate, lauryl acrylate, lauryl acrylate, stearyl acrylate, 2-chloroethyl acrylate, phenyl acrylate 'methyl α-chloro acrylate, methyl methacrylate, Ethyl methacrylate, propyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, hexyl methacrylate, A 2-ethylhexyl acrylate, n-octyl methacrylate, dodecyl methacrylate, lauryl methacrylate, stearyl methacrylate, etc., (iii) vinyl acetate Vinyl esters of esters, vinyl propionate, vinyl benzoate, vinyl butyrate, etc. (iv) vinylpyrrole, N-vinylcarbazole, N-vinylfluorene, N-vinylpyrrolidone, etc. a vinyl compound, (v) a fluoroalkyl group-containing (meth) acrylate such as fluorinated ethylene, vinylidene fluoride, tetrafluoroethylene, distilled fluoropropene, trifluoroethyl acrylate or tetrafluoropropyl acrylate. (vi) a conjugated diene such as butadiene or isoprene. These can be used alone or in combination of two or more. Among these, styrene or a derivative thereof, (meth) acrylate and vinyl ester are preferred. By using these, the mother particles having the above physical properties can be efficiently obtained. A known radical polymerization initiator can be used as the polymerization initiator used in the radical polymerization for producing the mother particles. Specific examples of the radical polymerization initiator include peroxides such as benzoyl peroxide, cumyl hydroperoxide, t-butyl hydroperoxide, sodium persulfate, ammonium persulfate, and azoisobutyronitrile. An azo compound such as azobismethylbutyronitrile or azobisisovaleronitrile. These may be used alone or in combination of two or more. Specific examples of the polymerization solvent used for the agent for producing the mother particles by solution polymerization include water, methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, isobutanol, and the like. Tributanol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isoamyl alcohol, third pentanol, 1-hexanol, 2-methyl-1- Pentanol, 4-methyl-2-pentanol, 2-ethylbutanol, b-heptanol, 2-heptanol, 3-heptanol, 2-octanol, 2-ethyl-1-hexanol, benzene Alcohols such as methanol and cyclohexanol: methyl cellosolve, ethyl cellosolve, isopropyl cellosolve, butyl cellosolve, ether glycol of diethylene glycol monobutyl ether, etc.; propanol, A Ketones such as ethyl ethyl ketone, methyl isobutanol and cyclohexanone: ethyl acetate, butyl acetate, ethyl propionate, (alkyl) cellosolve acetate, ethyl carbitol acetate Ester such as butyl carbitol acetate; pentane, 2-methylbutane, n-hexane, cyclohexane, 2-methylpentane, 2,2-dimethylbutane, 2,3 - dimethylbutane, heptane, n-octane, isooctane, 2,2,3-trimethylpentane, decane, decane, cyclopentane, methylcyclopentane, methylcyclohexane Alkane, B Cyclohexane, p-capane,

S -16- 201144341 二環己基、苯、甲苯 族烴類;四氯化碳、 烴類;乙醚、二甲醚 甲縮醛、二乙基乙縮 肪酸類;硝基丙烯、 二甲基甲醯胺、二甲 等之含有硫、氮之有 ,或可組合兩種以上 點而言,較好爲乙腈 製造母粒子時, 乳化劑及界面活性劑 至於分散劑及安 烯磺酸、乙烯基苯酚 (甲基)丙烯酸酯共 丙烯酸酯共聚物等之 、聚(甲基)丙烯醯 酯、聚(甲基)丙烯 ;聚甲基乙烯醚、聚 基乙烯醚等之聚乙烯 、乙酸纖維素、硝酸 素、羥丙基纖維素、 乙烯醇、聚乙烯縮丁 聚乙酸乙烯酯衍生物 、聚伸乙亞胺、聚-2 、二甲苯、乙基苯等之脂肪族或芳香 三氯乙烯、氯苯、四溴乙烷等之鹵化 、三氧雜環己烷、四氫呋喃等醚類; 醛等縮醛類;甲酸、乙酸、丙酸等脂 硝基苯 '二甲胺、單乙醇胺、吡啶、 基亞颯、乙腈、N -甲基-2 -吡咯烷酮 機化合物類等。該等可單獨使用一種 使用。該等中,從防止粒子凝集之觀 〇 亦可適當選擇使用分散劑、安定劑、 0 定劑,舉例有聚羥基苯乙烯、聚苯乙 -(甲基)丙烯酸酯共聚物、苯乙烯-聚物、苯乙烯-乙烯基苯酚-(甲基) 聚苯乙烯衍生物;聚(甲基)丙烯酸 胺、聚丙烯腈、聚(甲基)丙烯酸乙 酸丁酯等之聚(甲基)丙烯酸衍生物 乙基乙烯醚、聚丁基乙烯醚、聚異丁 烷基醚衍生物;纖維素、甲基纖維素 纖維素、羥甲基纖維素、羥乙基纖維 羧甲基纖維素等之纖維素衍生物:聚 醛、聚乙烯甲醛、聚乙酸乙烯酯等之 ;聚乙烯基吡啶、聚乙烯基吡咯烷酮 -甲基-2-噁唑啉等之含氮聚合物衍生 -17- 201144341 物;聚氯乙烯、聚偏氯乙烯等之聚鹵化已烯衍生物;聚二 甲基矽氧烷等之聚矽氧烷衍生物等之各種疏水性或親水性 分散劑、安定劑等。該等可單獨使用亦可倂用兩種以上。 至於乳化劑(界面活性劑),舉例有月桂酸鈉等之烷 基硫酸酯鹽,十二烷基苯磺酸鈉等之烷基苯磺酸鹽,烷基 萘磺酸鹽、脂肪酸鹽、烷基磷酸鹽、烷基磺基琥珀酸鹽等 之陰離子系乳化劑;烷基胺鹽、四級銨鹽、烷基甜菜鹼、 氧化胺等之陽離子系乳化劑;聚氧乙烯烷基醚、聚氧乙烯 烷基醚、聚氧乙烯烷基烯丙基醚、聚氧乙烯烷基苯基醚、 山梨糖醇酐脂肪酸酯、甘油脂肪酸酯、聚氧乙烯脂肪酸酯 等之非離子系乳化劑等》該等可單獨使用亦可倂用兩種以 上。 步驟(a )係例如使母粒子與含有胺基化合物及可溶 解該胺基化合物之溶劑的溶液接觸,使母粒子中之官能基 與胺基反應藉此使交聯聚合物再進行交聯。胺基化合物之 溶液係僅含浸至母粒子之表層部或含浸至內部區域。 至於上述胺基化合物,係使用具有2個以上胺基之1種 或2種以上之化合物。由鍍敷形成性改善之觀點,較好爲 例如聚伸乙亞胺及五伸乙基六胺中之具有較多1級或2級胺 之化合物。 自改善壓縮特性之觀點觀之,胺基化合物較好包含分 子量未達500之低分子量胺基化合物。且,未改善鍍敷形 成性,胺基化合物較好包含分子量500〜1 0000之高分子量 胺基化合物。最好倂用低分子量胺基化合物及高分子量胺S -16- 201144341 Dicyclohexyl, benzene, toluene hydrocarbons; carbon tetrachloride, hydrocarbons; diethyl ether, dimethyl ether methylal, diethyl acetyl fatty acid; nitropropene, dimethylformamidine Amine, dimethyl or the like containing sulfur or nitrogen, or combining two or more kinds, preferably when acetonitrile is used as a mother particle, an emulsifier and a surfactant are used as a dispersant and an aene sulfonic acid or a vinyl phenol. Poly(meth) propylene oxime ester, poly(meth) propylene, polymethyl vinyl ether, polyvinyl chloride, polyethylene, cellulose acetate, nitric acid, etc., such as a (meth) acrylate copolymer copolymer Aliphatic or aromatic trichloroethylene, chlorobenzene, etc., hydroxypropylcellulose, vinyl alcohol, polyvinyl butylpolyvinyl acetate derivatives, polyethylenimine, poly-2, xylene, ethylbenzene, etc. , halogen such as tetrabromoethane, ethers such as trioxane or tetrahydrofuran; acetals such as aldehydes; aliphatic nitrobenzene 'dimethylamine such as formic acid, acetic acid, and propionic acid, monoethanolamine, pyridine, and kea Anthracene, acetonitrile, N-methyl-2-pyrrolidone compound, and the like. These can be used alone. In these, from the viewpoint of preventing particle agglomeration, a dispersing agent, a stabilizer, and a 0-setting agent can be appropriately selected, and examples thereof include polyhydroxystyrene, polystyrene-(meth)acrylate copolymer, and styrene-poly. , styrene-vinylphenol-(meth)polystyrene derivative; poly(meth)acrylic acid derivative of poly(meth)acrylic acid amine, polyacrylonitrile, poly(meth)acrylic acid butyl acetate, etc. Ethyl vinyl ether, polybutyl vinyl ether, polyisobutylene ether derivatives; cellulose derived from cellulose, methyl cellulose cellulose, hydroxymethyl cellulose, hydroxyethyl cellulose carboxymethyl cellulose, etc. : Polyaldehyde, polyethylene formaldehyde, polyvinyl acetate, etc.; nitrogen-containing polymer derived from polyvinylpyridine, polyvinylpyrrolidone-methyl-2-oxazoline, etc.-17- 201144341; polyvinyl chloride And a polyhalogenated hexene derivative such as polyvinylidene chloride; a polyhydric or hydrophilic dispersant such as a polyoxyalkylene derivative such as polydimethyl siloxane or a stabilizer; These may be used alone or in combination of two or more. As the emulsifier (surfactant), for example, an alkylsulfate salt of sodium laurate or the like, an alkylbenzenesulfonate such as sodium dodecylbenzenesulfonate, an alkylnaphthalenesulfonate, a fatty acid salt or an alkane Anionic emulsifier such as a phosphate or an alkyl sulfosuccinate; a cationic emulsifier such as an alkylamine salt, a quaternary ammonium salt, an alkylbetaine or an amine oxide; a polyoxyethylene alkyl ether; Nonionic emulsification of oxyethylene alkyl ether, polyoxyethylene alkyl allyl ether, polyoxyethylene alkyl phenyl ether, sorbitan fatty acid ester, glycerin fatty acid ester, polyoxyethylene fatty acid ester, etc. These may be used alone or in combination of two or more. In the step (a), for example, the mother particles are brought into contact with a solution containing an amine group compound and a solvent capable of dissolving the amine group compound, and the functional group in the mother particles is reacted with the amine group to thereby crosslink the crosslinked polymer. The solution of the amine compound is only impregnated into the surface portion of the mother particle or impregnated into the inner region. As the above amine-based compound, one or two or more compounds having two or more amine groups are used. From the viewpoint of improvement in plating formability, a compound having a plurality of primary or secondary amines such as polyethylenimine and pentaethylhexylamine is preferred. From the standpoint of improving the compression characteristics, the amine compound preferably contains a low molecular weight amine compound having a molecular weight of less than 500. Further, the plating composition is not improved, and the amine compound preferably contains a high molecular weight amine compound having a molecular weight of 500 to 1 0000. It is best to use low molecular weight amine compounds and high molecular weight amines.

S -18- 201144341 基化合物。低分子量胺基化合物之分子量較好爲 未達500 ’更好爲50〜400,又更好爲5〇~3 00。高 基化合物之分子量較好爲500〜1 0000,更好爲5〇〇„ 胺基化合物較好爲具有直鏈或烷基側鏈之脂 。脂肪族二胺之具體例舉例有乙二胺、丙二胺、 二胺、1,6-己烷二胺、1,8_辛烷二胺、丨,9_壬烷二 基-1,8-辛烷二胺、ΐ,ι〇·癸烷二胺、ι,12-十二烷 甲基- I,5-戊烷二胺、2,2,4-三甲基-1,6-己烷二肢 三甲基-1,6 -己烷二胺及5 -甲基-1,9 -壬烷二胺。 胺基化合物亦可包含脂環式二胺及/或芳香 至於脂環式二胺舉例有環己烷二胺、甲基環己烷 佛爾酮二胺。至於芳香族二胺舉例有對-苯二胺, 胺' 二甲苯二胺、4,4’-二胺基二苯基甲烷、4,4’-苯基颯及4,4’-二胺基二苯基醚。 上述胺基化合物中,分子量未達5 00者可作 量胺基化合物使用。 胺基化合物除了上述二胺以外,亦可包含三 等之多胺。高分子量之聚伸乙亞胺爲適宜之高分 合物。 該等胺基化合物可使用一種或組合兩種以上 粒子與2種類以上之胺基化合物之反應’可一次 可階段性地添加各胺基化合物而進行。 胺基化合物亦可溶解於有機溶劑中。至於該 之代表例舉例有丙酮 '甲基乙基酮、甲基異丁基 5 0以上、 分子量胺 -5000 ° 肪族二胺 1,4-丁烷 胺、2-甲 二胺、3 -? 、 2,4,4- 族二胺。 二胺及異 •間-苯二 二胺基二 爲低分子 胺、四胺 子量胺化 使用。母 進行,亦 有機溶劑 酮、環己 -19- 201144341 酮等酮類:乙酸乙酯、乙酸丁酯、丙酸乙酯、溶纖劑乙酸 酯等酯類;戊烷、2-甲基丁烷、正己烷、環己烷、2-甲基 戊烷、2,2-二甲基丁烷、2,3-二甲基丁烷、庚烷、正辛烷 、異辛烷、2,2,3-三甲基戊烷、癸烷、壬烷、環戊烷、甲 基環戊烷、甲基環己烷、乙基環己烷、對-蓋烷、苯、甲 苯、二甲苯、乙基苯等之脂肪族或芳香族烴類;四氯化碳 、三氯乙烯、氯苯、四溴乙烷等之鹵化烴類;乙醚、二甲 醚、三氧雜環己烷、四氫呋喃等醚類:甲縮醛、二乙基乙 縮醛等之縮醛類;硝基丙烯、硝基苯、吡啶、二甲基甲醯 胺 '二甲基亞砸、乙腈等之含硫、氮之有機化合物類等》 該等可單獨使用亦可倂用2種類以上。 胺基化合物若爲水溶性或親水性有機化合物,則除上 述有機溶劑以外,亦可使用水、甲醇、乙醇、1-丙醇、2-丙醇、1-丁醇、2-丁醇、異丁醇、第三丁醇、1-戊醇、2-戊醇、3-戊醇、2-甲基-1-丁醇、異戊醇、第三戊醇、1-己 醇、2-甲基-1-戊醇、4·甲基-2-戊醇、2-乙基丁醇、1-庚醇 、2-庚醇、3-庚醇、2-辛醇、2-乙基-1-己醇' 苯甲醇、環 己醇等醇類;甲基溶纖劑、乙基溶纖劑、異丙基溶纖劑、 丁基溶纖劑、二乙二醇單丁醚等醚醇類。該等可單獨使用 亦可倂用2種類以上。 進行母粒子中之官能基與胺基之反應的反應溶劑較好 爲實質上不溶解母粒子而可溶解胺基化合物之溶劑。胺基 化合物爲液狀時,母粒子中之官能基與胺基化合物之反應 亦可在無溶劑下進行。S -18- 201144341 Base compound. The molecular weight of the low molecular weight amine compound is preferably less than 500 Å, more preferably 50 to 400, and still more preferably 5 Å to 30,000. The molecular weight of the high-base compound is preferably from 500 to 1 0000, more preferably 5 〇〇. The amine compound is preferably a lipid having a linear or alkyl side chain. Specific examples of the aliphatic diamine include ethylenediamine, Propylenediamine, diamine, 1,6-hexanediamine, 1,8-octanediamine, hydrazine, 9-decanediyl-1,8-octanediamine, hydrazine, oxime decane Diamine, iota, 12-dodecylmethyl-I, 5-pentanediamine, 2,2,4-trimethyl-1,6-hexane, limb trimethyl-1,6-hexane Diamine and 5-methyl-1,9-decanediamine. Amine compounds may also contain alicyclic diamines and/or aromatics to alicyclic diamines such as cyclohexanediamine, methylcyclohexane Alkyl sulphonyl diamine. Examples of aromatic diamines are p-phenylenediamine, amine 'xylylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-phenyl fluorene and 4 , 4'-diaminodiphenyl ether. Among the above amine compounds, the molecular weight may be less than 500. The amine compound may be used as an amine compound. The amine compound may contain a tertiary amine in addition to the above diamine. High molecular weight polyethylenimine is a suitable high-molecular compound. One or a combination of two or more kinds of particles and two or more kinds of amine-based compounds can be carried out in a stepwise manner by adding each of the amine-based compounds. The amine-based compound can also be dissolved in an organic solvent. Acetone 'methyl ethyl ketone, methyl isobutyl 50 or more, molecular weight amine - 5000 ° aliphatic diamine 1,4-butane amine, 2-methyldiamine, 3 -?, 2,4,4- Diamines and di- and m-phenylenediamines are used for the amination of low molecular weight amines and tetraamines. Mothers are also organic solvent ketones, cyclohexyl-19- 201144341 Ketones and other ketones: acetic acid Esters such as ethyl ester, butyl acetate, ethyl propionate, and cellosolve acetate; pentane, 2-methylbutane, n-hexane, cyclohexane, 2-methylpentane, 2,2- Dimethylbutane, 2,3-dimethylbutane, heptane, n-octane, isooctane, 2,2,3-trimethylpentane, decane, decane, cyclopentane, A Aliphatic or aromatic hydrocarbons such as cyclopentane, methylcyclohexane, ethylcyclohexane, p-captan, benzene, toluene, xylene, ethylbenzene; carbon tetrachloride, trichloroethylene Chlorobenzene, tetrabromide a halogenated hydrocarbon such as an alkane; an ether such as diethyl ether, dimethyl ether, trioxane or tetrahydrofuran: an acetal such as methylal or diethyl acetal; nitropropene, nitrobenzene or pyridine , dimethyl carbamide, dimethyl hydrazine, acetonitrile, and the like, and organic compounds such as sulfur and nitrogen. These may be used alone or in combination of two or more kinds. If the amine compound is water-soluble or hydrophilic As the organic compound, in addition to the above organic solvent, water, methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, isobutanol, butanol, 1- Pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isoamyl alcohol, third pentanol, 1-hexanol, 2-methyl-1-pentanol, 4·A Base-2-pentanol, 2-ethylbutanol, 1-heptanol, 2-heptanol, 3-heptanol, 2-octanol, 2-ethyl-1-hexanol' benzyl alcohol, cyclohexanol And other alcohols; methyl cellosolve, ethyl cellosolve, isopropyl cellosolve, butyl cellosolve, ether glycol such as diethylene glycol monobutyl ether. These can be used alone or in combination of two or more types. The reaction solvent for carrying out the reaction of the functional group in the mother particle with the amine group is preferably a solvent which can dissolve the amine compound without substantially dissolving the mother particles. When the amine compound is in a liquid form, the reaction of the functional group in the mother particle with the amine compound can also be carried out without a solvent.

S -20- 201144341 至於上述反應溶劑,r-丁內酯、甘油、乙二醇、 丙二醇、1,3-丙二醇、1,2-丁 二醇、1,3-丁二醇、正丁 醇類,甲苯、二甲苯、正辛烷、正十二烷等烴類,亞 等之脂肪酸類,聚乙二醇、二甲基矽氧、水、甲醇、 、1-丙醇、2-丙醇、1-丁醇、2-丁醇、異丁醇、第三 、1-戊醇、2-戊醇、3-戊醇、2-甲基-1-丁醇、異戊醇 三戊醇、1-己醇、2-甲基-1·庚醇、4-甲基-2-庚醇、2-丁醇、1-庚醇、2-庚醇、3-庚醇、2-辛醇、2-乙基-1-、苯甲醇、環己醇等醇類;甲基溶纖劑、乙基溶纖劑 丙基溶纖劑、丁基溶纖劑、二乙二醇單丁醚等醚醇類 酮、甲基乙基酮、甲基異丁基酮、環己酮等酮類;乙 酯、乙酸丁酯、丙酸乙酯、溶纖劑乙酸酯等酯類;戊 2-甲基丁烷、正己烷、環己烷、2-甲基戊烷、2,2-二 丁烷' 2,3-二甲基丁烷、戊烷、正辛烷、異辛烷、2,2 甲基戊烷、癸烷、壬烷、環戊烷、甲基環戊烷、甲基 烷、乙基環己烷、對-蓋烷、二環己基、苯、甲苯、 苯、乙基苯等之脂肪族或芳香族烴類;四氯化碳、三 烯、氯苯、四溴乙烷等之鹵化烴類;乙醚、二甲醚、 雜環己烷、四氫呋喃等醚類;甲縮醛、二乙基乙縮醛 縮醛類;甲酸、乙酸、丙酸等脂肪酸類;硝基丙烯、 苯、二甲胺、單乙醇胺、吡啶、二甲基甲醯胺、二甲 颯等之含硫、氮之有機化合物類等。較好爲如水、甲 乙醇等之低級醇,甲基溶纖劑、乙基溶纖劑等之醚醇 與低級醇之混合物、水與醚醇之混合物之水溶性及親 1,2- 醇等 油酸 乙醇 丁醇 、第 乙基 己醇 、異 :丙 酸乙 烷、 甲基 ,3-三 環己 二甲 氯乙 三氧 等之 硝基 基亞 醇或 、水 水性 -21 - 201144341 溶劑,甲苯、二甲基甲醯胺(DMF)、四氫呋喃(THF) 、甲基乙基酮(MEK)、甲基異丁基酮(MIBK)、丙酮 、N-甲基-2-吡咯烷酮(NMP )、二氯甲烷、四氯乙烯等, 更好爲如水、甲醇或乙醇等之低級醇、水與甲醇或乙醇等 之低級醇之混合物、水與甲醇或乙醇等之低級醇之混合物 、水與醚醇之混合物之水溶性及親水性介質。該等可單獨 使用亦可併用2種類以上。 步驟(a)中使胺基化合物反應之溫度雖由溶劑之種 類而決定,但較好爲l〇°C〜250 °C,更好爲100〜250°C,又 更好爲180°C〜250°C。反應時間只要爲使交聯反應大致完 全所需之時間即可,雖受所使用之胺基化合物及添加量、 母粒子中之官能基種類、溶液黏度及濃度等之大幅左右, 但可爲例如於180 °C係5〜24小時,較好爲6〜10小時左右。 反應時間即使加長,雖亦可獲得交聯聚合物粒子,但實用 上,需要長時間並非合宜對策。且若反應時間極短,則有 交聯未充分進行之情況。 步驟(a )中之胺基化合物量,以相對於母粒子之官 能基之胺基當量比計,較好爲0.1〜5,更好爲0.5〜3。該當 量比過小時,或變過大時,有壓縮特性提高或鍍敷形成性 提高之效果變小之傾向》 交聯聚合物粒子之平均粒徑較好爲0.1〜50μπι,更好爲 0.2〜30μηι,又更好爲0.3 ~ 2 0 μηι,最好爲0.5〜5 μιη。平均粒 徑若較小,則有交聯聚合物粒子容易凝集之可能性。 交聯聚合物粒徑(直徑)之Cv値(變動係數)較好爲 -22- 201144341 1 5 %以下。c v値超過1 5 °/。時,有交聯聚合物粒子之各種 途中之性能降低之傾向。例如交聯聚合物粒子使用於構 異向導電性接著劑之導電性粒子時有連接信賴性降低, 聯聚合物粒子使用於生體檢查元件時有定量性降低之傾 。基於同樣觀點,粒徑之Cv値較好爲10%以下,更好爲 以下’又更好爲4%以下。 交聯聚合物粒子之平均粒徑與粒徑之Cv値係利用下 測定法求得。1)使用超音波分散設備將粒子分散於水 ,調製含1質量%之粒子得分散液。 2 )使用粒度分佈計(SYSMEXFLOW,SYSMEX製 以顯微鏡觀察分散液約2萬個粒子,算出平均粒徑與粒 之變動係數C v。 於步驟(a )後之母粒子於1 80°C測定之壓縮變形回 率通常爲30%以上,較好爲40%以上,更好爲50%以上, 更好爲50〜65%。該壓縮變形回復率若低,則彈性力不足 在要求高彈性之異向導電性接著劑等用途中有容易導致 觸不良之傾向。 壓縮變形回復率係藉由將粒子自中心以0.33 mN/秒 速度壓縮至5mN後,反過來以0.33mN /秒之速度減少荷 之過程中測定荷重値與壓縮位移之關係而獲得。自荷重 轉之點到最終除荷重値之位移(L1 )與自反轉點至初期 重値之位移(L2 )之比(L1/L2 )以%表示之値作爲壓 變形回復率" 於步驟(a)後之母粒子於180°C測定之壓縮破壞強 用 成 交 向 5% 述 中 ) 徑 復 再 接 之 重 反 荷 縮 度 -23- 201144341 較好爲10mN以上》 本實施形態之交聯聚合物微粒子,如上述,由於具有 高的壓縮變形回復率,故彈力性優異之可能性高。因此, 使用該交聯聚合物微粒子作爲導電材料時,刮傷電極間連 接用之基板、使其貫通之可能性低。導電材料經高壓縮變 形,發揮高精度之間隔保持性或安定之連接信賴性之可能 性亦高。本實施形態之交聯聚合物粒子由於具有如上述特 徵,故不僅於電材料領域有用,於塗料、塗佈劑、光擴散 劑、化妝料、醫藥或生體檢査元件、農藥、建築材料等廣 泛爲領域中亦有用。 圖2爲顯示異向導電性接著劑之一實施形態之剖面圖 。圖2所示之薄膜狀異向導電性接著劑20係由膠黏樹脂3及 分散於膠黏樹脂3中之導電性粒子5所構成。導電性粒子5 具有本發明之交聯聚合物粒子及披覆該交聯聚合物粒子之 金屬層(金屬鍍敷層)。 膠黏樹脂3雖無特別限定,但較好爲絕緣性接著劑組 成物。該絕緣性接著劑組成物(膠黏樹脂3 )包含例如自 熱可塑性樹脂、熱硬化性樹脂及彈性體選出之至少一種成 分。熱可塑性樹脂係選自例如如乙酸乙烯酯系樹脂、氯乙 烯系樹脂、丙烯酸樹脂及苯乙烯系樹脂等之乙烯系樹脂; 聚烯烴;乙烯-乙酸乙烯酯共聚物;聚醯胺樹脂;苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-異戊間二烯-苯乙烯嵌 段共聚物及該等之氫化加成物之熱可塑性嵌段共聚物。熱 硬化性樹脂係選自例如如環氧系樹脂、胺基甲酸酯系樹脂 -24- 201144341 、聚醯亞胺系樹脂及不飽和聚酯系樹脂。熱硬化性樹脂通 常與其硬化劑一起含於膠黏樹脂3中。熱硬化性樹脂亦可 爲常溫硬化型、熱硬化型、光硬化型及濕氣硬化型之任一 種硬化型。彈性體係選自例如苯乙烯-丁二烯共聚物橡膠 、氯丁二烯橡膠及丙烯腈-苯乙烯嵌段共聚物橡膠。該等 樹脂可單獨使用亦可2種以上倂用。 作爲膠黏樹脂3之絕緣性接著劑組成物,依據需要, 亦可包含例如增量劑、軟化劑(可塑劑)、黏接著性增進 劑、抗氧化劑(抗老化劑)、熱安定劑、光安定劑、紫外 線吸收劑、著色劑、難燃劑、有機溶劑等之各種添加劑。 本實施形態之異向導電性接著劑可利用例如於膠黏樹 脂中添加導電性粒子,均勻混合而使導電性粒子分散之方 法而獲得。藉由將包含膠黏樹脂及導電性粒子之異向導電 性接著劑直接溶解或以溶解或分散於溶劑中之狀態塗佈於 脫膜紙及脫模薄膜等脫模材之脫模處理面上,依據需要進 行乾燥或冷卻等之方法,可獲得薄膜狀異向導電性接著劑 〇 異向導電性接著劑中之導電性粒子之分散狀態並無特 別限制。可將導電性粒子均勻分散於膠黏樹脂中,亦可局 部分佈於薄膜表層附近。異向導電性接著劑之形態不限定 於薄膜,例如亦可爲糊膏或油墨。 實施例 以下列舉實施例針對本發明更具體加以說明。但本發 -25- 201144341 明不限定於該等實施例。 1.母粒子之合成 合成例1 於100mL之三頸燒瓶中一次饋入下述各化合物,一面 以8(TC之水浴加熱,一面以攪拌機攪拌約6小時,形成自 交聯聚合物形成之母粒子。 • DVB-960 (新日鐵化學,含有二乙烯基苯(DVB) 96質量%,乙基乙烯苯(EVB ) 3質量% ) : 4_9g •甲基丙烯酸(和光純藥):2.1g •偶氮雙異丁腈(AIBN,和光純藥):〇.6g •乙腈(和光純藥):7〇g 接著,使用抽吸過濾設備將母粒子過濾’利用異丙醇 (IPA,和光純藥)洗淨並過濾重覆3~5次左右後’真空乾 燥獲得粉末狀母粒子。所得母粒子之粒徑以s E M觀察並測 定後,爲平均粒徑係4 · 1 μηι之球狀單分散粒子。粒徑之C ν 値爲2.3 %。 合成例2 於100mL之三頸燒瓶中一次饋入下述各化合物,一面 以8 0。(:之水浴加熱,一面以攪拌機攪拌約6小時,形成自 交聯聚合物形成之母粒子。 • DVB-960 : 2.8g •甲基丙烯酸:4.2gS -20- 201144341 As for the above reaction solvent, r-butyrolactone, glycerin, ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, n-butanol , hydrocarbons such as toluene, xylene, n-octane, n-dodecane, fatty acids of the sub-class, polyethylene glycol, dimethyl anthracene, water, methanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, isobutanol, third, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isoamyl alcohol tripentol, 1 -hexanol, 2-methyl-1.heptanol, 4-methyl-2-heptanol, 2-butanol, 1-heptanol, 2-heptanol, 3-heptanol, 2-octanol, 2 - alcohols such as ethyl-1-, benzyl alcohol, cyclohexanol; methyl cellosolve, ethyl cellosolve propyl cellosolve, butyl cellosolve, ether glycol ketone such as diethylene glycol monobutyl ether , ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone; esters such as ethyl ester, butyl acetate, ethyl propionate, and cellosolve acetate; penta 2-methylbutane , n-hexane, cyclohexane, 2-methylpentane, 2,2-dibutane ' 2,3-dimethylbutane, pentane, n-octane, isooctane, 2,2 methyl pentane Alkane, decane, decane An aliphatic or aromatic hydrocarbon such as cyclopentane, methylcyclopentane, methylalkane, ethylcyclohexane, p-captan, dicyclohexyl, benzene, toluene, benzene, ethylbenzene; tetrachloro a halogenated hydrocarbon such as carbon, triene, chlorobenzene or tetrabromoethane; an ether such as diethyl ether, dimethyl ether, heterocyclohexane or tetrahydrofuran; methylal, diethyl acetal acetal; formic acid And fatty acids such as acetic acid and propionic acid; organic compounds containing sulfur and nitrogen such as nitropropene, benzene, dimethylamine, monoethanolamine, pyridine, dimethylformamide, and dimethylhydrazine. It is preferably a lower alcohol such as water or methyl alcohol, a mixture of an ether alcohol and a lower alcohol such as methyl cellosolve or ethyl cellosolve, a water-soluble mixture of water and an ether alcohol, and a 1,2-alcohol, etc. Oleic acid, butanol, diethylhexanol, iso-propionic acid ethane, methyl, 3-tricyclohexachlorodichloroethane, or the like, or water-based solvent - 201144341 solvent, Toluene, dimethylformamide (DMF), tetrahydrofuran (THF), methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), acetone, N-methyl-2-pyrrolidone (NMP), Methylene chloride, tetrachloroethylene, etc., more preferably a lower alcohol such as water, methanol or ethanol, a mixture of water and a lower alcohol such as methanol or ethanol, a mixture of water and a lower alcohol such as methanol or ethanol, water and ether alcohol. A water soluble and hydrophilic medium for the mixture. These may be used alone or in combination of two or more types. The temperature at which the amine compound is reacted in the step (a) is determined by the kind of the solvent, but is preferably from 10 ° C to 250 ° C, more preferably from 100 to 250 ° C, still more preferably from 180 ° C. 250 ° C. The reaction time may be a time required for the crosslinking reaction to be substantially complete, and may be, for example, substantially different depending on the amine compound to be used, the amount of the compound to be used, the type of the functional group in the mother particle, the viscosity and concentration of the solution, and the like. It is 5 to 24 hours at 180 ° C, preferably about 6 to 10 hours. Even if the reaction time is lengthened, crosslinked polymer particles can be obtained, but practically, it takes a long time to be a suitable countermeasure. Further, if the reaction time is extremely short, crosslinking may not be sufficiently performed. The amount of the amino group compound in the step (a) is preferably from 0.1 to 5, more preferably from 0.5 to 3, based on the amine equivalent ratio of the functional group of the mother particle. When the equivalent ratio is too small or too large, the effect of improving the compression characteristics or the improvement of the plating formability becomes small. The average particle diameter of the crosslinked polymer particles is preferably from 0.1 to 50 μm, more preferably from 0.2 to 30 μm. It is preferably 0.3 to 2 0 μηι, preferably 0.5 to 5 μιη. If the average particle diameter is small, there is a possibility that the crosslinked polymer particles are easily aggregated. The Cv 値 (coefficient of variation) of the crosslinked polymer particle diameter (diameter) is preferably -22-201144341 1 5 % or less. c v値 exceeds 15 ° /. At the time, there is a tendency that the properties of the crosslinked polymer particles are lowered in various ways. For example, when the crosslinked polymer particles are used for the conductive particles of the conductive conductive adhesive, the connection reliability is lowered, and when the polymer particles are used for the bio-inspection element, there is a quantitative decrease. From the same viewpoint, the Cv 粒径 of the particle diameter is preferably 10% or less, more preferably hereinafter less preferably 4% or less. The Cv値 system of the average particle diameter and particle diameter of the crosslinked polymer particles was determined by the following measurement method. 1) The particles were dispersed in water using an ultrasonic dispersing device, and a dispersion containing 1% by mass of the particles was prepared. 2) Using a particle size distribution meter (SYSMEXFLOW, SYSMEX, approximately 20,000 particles of the dispersion were observed under a microscope, and the average particle diameter and the coefficient of variation C v of the particles were calculated. The mother particles after the step (a) were measured at 180 ° C. The compression deformation recovery rate is usually 30% or more, preferably 40% or more, more preferably 50% or more, and more preferably 50 to 65%. If the compression deformation recovery rate is low, the elastic force is insufficient to require high elasticity. There is a tendency to cause poor contact in applications such as conductive adhesives. The compression deformation recovery rate is reduced by 0.33 mN / sec by compressing the particles from the center at a speed of 0.33 mN/sec to 5 mN. In the process, the relationship between the load enthalpy and the compression displacement is obtained. The ratio of the displacement from the load to the final load (L1) and the displacement from the reversal point to the initial weight (L2) (L1/L2) is % indicates 値 as the compressive deformation recovery rate " The compressive damage measured by the mother particles after the step (a) at 180 °C is 5%.) The heavy back-retraction -23- 201144341 is preferably 10mN or more. The cross-linked polycondensation of this embodiment As described above, the fine particles of the composite have a high recovery rate of compression deformation, so that the possibility of excellent elasticity is high. Therefore, when the crosslinked polymer fine particles are used as the conductive material, there is a low possibility that the substrate for connection between the electrodes is scratched and penetrated. The conductive material is highly compressed and deformed, and the possibility of high-accuracy interval retention or stable connection reliability is also high. Since the crosslinked polymer particles of the present embodiment have the above characteristics, they are useful not only in the field of electrical materials, but also in coatings, coating agents, light diffusing agents, cosmetics, medical or biological inspection elements, agricultural chemicals, building materials, and the like. Also useful for the field. Fig. 2 is a cross-sectional view showing an embodiment of an anisotropic conductive adhesive. The film-shaped anisotropic conductive adhesive 20 shown in Fig. 2 is composed of an adhesive resin 3 and conductive particles 5 dispersed in the adhesive resin 3. The conductive particles 5 have the crosslinked polymer particles of the present invention and a metal layer (metal plating layer) coated with the crosslinked polymer particles. The adhesive resin 3 is not particularly limited, but is preferably an insulating adhesive composition. The insulating adhesive composition (adhesive resin 3) contains, for example, at least one component selected from the group consisting of a thermoplastic resin, a thermosetting resin, and an elastomer. The thermoplastic resin is selected from, for example, a vinyl resin such as a vinyl acetate resin, a vinyl chloride resin, an acrylic resin, or a styrene resin; a polyolefin; an ethylene-vinyl acetate copolymer; a polyamide resin; a butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer and a thermoplastic block copolymer of such hydrogenated adducts. The thermosetting resin is selected from, for example, an epoxy resin, a urethane resin -24 to 201144341, a polyimide resin, and an unsaturated polyester resin. The thermosetting resin is usually contained in the adhesive resin 3 together with its hardener. The thermosetting resin may be any of a room temperature curing type, a heat curing type, a photo hardening type, and a moisture curing type. The elastomeric system is selected, for example, from styrene-butadiene copolymer rubber, chloroprene rubber, and acrylonitrile-styrene block copolymer rubber. These resins may be used singly or in combination of two or more. As an insulating adhesive composition of the adhesive resin 3, if necessary, it may contain, for example, an extender, a softener (plasticizer), an adhesion improver, an antioxidant (anti-aging agent), a heat stabilizer, and light. Various additives such as stabilizers, ultraviolet absorbers, colorants, flame retardants, and organic solvents. The anisotropic conductive adhesive of the present embodiment can be obtained, for example, by adding conductive particles to an adhesive resin, uniformly mixing the conductive particles, and dispersing the conductive particles. It is applied to a release-treated surface of a release material such as a release paper or a release film by directly dissolving or dissolving or dispersing the isotropic conductive adhesive containing the adhesive resin and the conductive particles in a solvent. The film-form anisotropic conductive adhesive can be obtained by drying or cooling, and the conductive state of the conductive particles in the anisotropic conductive adhesive is not particularly limited. The conductive particles may be uniformly dispersed in the adhesive resin, or may be partially disposed near the surface layer of the film. The form of the anisotropic conductive adhesive is not limited to the film, and may be, for example, a paste or an ink. EXAMPLES The following examples are set forth to more specifically illustrate the present invention. However, the present invention is not limited to the embodiments. 1. Synthesis of Mother Particles Synthesis Example 1 Each of the following compounds was fed in a 100 mL three-necked flask, and heated in a water bath of 8 (TC) while stirring in a stirrer for about 6 hours to form a mother of self-crosslinking polymer. Particles • DVB-960 (Nippon Steel Chemical, containing 96% by mass of divinylbenzene (DVB), ethyl styrene (EVB) 3% by mass): 4_9g • Methacrylic acid (Wako Pure Chemical): 2.1g • Azobisisobutyronitrile (AIBN, Wako Pure Chemical Industries): 〇.6g • Acetonitrile (Wako Pure Chemical Industries): 7〇g Next, use a suction filtration device to filter the mother particles 'Using isopropanol (IPA, Wako Pure Chemicals) After washing and filtering for about 3 to 5 times, 'vacuum drying to obtain powdery mother particles. The particle size of the obtained mother particles is s EM observed and measured, and is spherical monodisperse of the average particle size of 4 · 1 μηι Particles: C ν 値 of the particle size was 2.3%. Synthesis Example 2 Each of the following compounds was fed into a 100 mL three-necked flask at a time, and was heated at 80° (in a water bath) while stirring in a mixer for about 6 hours. Mother particles formed from self-crosslinking polymers • DVB-960 : 2.8 g • methacryl : 4.2g

S -26- 201144341 • AIBN : 0.6g •乙腈:70g 接著,使用抽吸過濾設備將母粒子過濾,利用異丙醇 (IPA,和光純藥)洗淨並過濾重覆3〜5次左右後,真空乾 燥獲得粉末狀母粒子。所得母粒子之粒徑以SEM觀察並測 定後,爲平均粒徑係之球狀單分散粒子。粒徑之以 値爲3.0 % » 合成例3 於10 0mL之三頸燒瓶中一次饋入下述各化合物,一面 以80°C之水浴加熱,一面以攪拌機攪拌約6小時,形成自 交聯聚合物形成之母粒子。 • DVB-960 : 0.9g • 1,10-癸二醇二丙烯酸酯(A-DOD,新中村化學工業 ):2.7g •甲基丙烯酸:2g • 11-十一碳烯酸:1.4g • AIBN ·· 0.07g •乙腈:7〇g 接著,使用抽吸過濾設備將母粒子過濾,利用異丙醇 (IPA,和光純藥)洗淨並過濾重覆3〜5次左右後,真空乾 燥獲得粉末狀母粒子。所得母粒子之粒徑以SEM觀察並測 定後,爲平均粒徑係2.8μιη之球狀單分散粒子。粒徑之Cv 値爲2.7 %。 -27- 201144341 測定合成例1〜3所得之各母粒子之壓縮變形回復率及 壓縮破壞強度。測定結果匯整於表1。 〔表1〕 母粒子 粒徑(μηι) Cv(°/〇) 壓縮回復率(%) 壓縮破壞強度㈣ 合成例1 4.1 2.3 32 8 合成例2 3.1 3.0 25 4 合成例3 2.8 2.7 25 6 2.交聯聚合物粒子及導電性粒子之製作及其評價 實施例1 (步驟a ) 於100mL之三頸燒瓶中一次饋入下列所述比例之混合 物,在室溫使用攪拌機攪拌1小時獲得分散液。使該分散 液在氮氣流下,以180°C之油浴加熱約6小時。 •合成例1之母粒子:5重量份 •己烷二胺(分子量1 16.2 ) : 1重量份(胺基相對於 母粒子中之羧基之比例爲1當量) •聚伸乙亞胺(分子量300) : 0.8重量份(胺基相對 於母粒子中之羧基之比例爲1當量) • r-丁內酯:93.2重量份 接著,使用抽吸過濾設備將粒子過濾,利用IPA洗淨 並過濾重覆3〜5次左右後,真空乾燥,獲得由己烷二胺及 聚伸乙亞胺交聯所成之粉末狀母粒子(粒子1 a )。所得母 粒子於180°C之壓縮變形回復率爲56%,壓縮破壞強度爲S -26- 201144341 • AIBN : 0.6g • Acetonitrile: 70g Next, the mother particles are filtered using a suction filtration device, washed with isopropyl alcohol (IPA, Wako Pure Chemical Industries, Ltd.) and filtered for 3 to 5 times. Vacuum drying gave powdery mother particles. The particle diameter of the obtained mother particles was observed by SEM and measured to be spherical monodisperse particles having an average particle diameter. The particle size was 3.0% by enthalpy. » Synthesis Example 3 The following compounds were fed in a 100 mL three-necked flask, and heated in a water bath of 80 ° C while stirring in a mixer for about 6 hours to form a self-crosslinking polymerization. The parent particle formed by the object. • DVB-960: 0.9g • 1,10-decanediol diacrylate (A-DOD, Xinzhongcun Chemical Industry): 2.7g • Methacrylic acid: 2g • 11-undecenoic acid: 1.4g • AIBN · · 0.07g • Acetonitrile: 7〇g Next, the mother particles are filtered using a suction filtration device, washed with isopropyl alcohol (IPA, Wako Pure Chemical Industries, Ltd.) and filtered for 3 to 5 times, and then vacuum dried to obtain a powder. Parent particle. The particle diameter of the obtained mother particles was observed by SEM and measured to obtain spherical monodisperse particles having an average particle diameter of 2.8 μηη. The particle size of Cv 値 was 2.7%. -27-201144341 The compression deformation recovery ratio and the compression fracture strength of each of the mother particles obtained in Synthesis Examples 1 to 3 were measured. The results of the measurements are summarized in Table 1. [Table 1] Particle size (μηι) Cv (°/〇) Compression recovery ratio (%) Compressive fracture strength (IV) Synthesis Example 1 4.1 2.3 32 8 Synthesis Example 2 3.1 3.0 25 4 Synthesis Example 3 2.8 2.7 25 6 2. Preparation of Crosslinked Polymer Particles and Conductive Particles and Evaluation Example 1 (Step a) A mixture of the following ratios was fed in a 100 mL three-necked flask at a time, and stirred at room temperature for 1 hour using a stirrer to obtain a dispersion. The dispersion was heated in an oil bath at 180 ° C for about 6 hours under a nitrogen stream. • Master particle of Synthesis Example 1: 5 parts by weight • Hexanediamine (molecular weight: 16.2): 1 part by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent) • Polyethylenimine (molecular weight 300) : 0.8 parts by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent) • r-butyrolactone: 93.2 parts by weight Next, the particles are filtered using a suction filtration device, washed with IPA and filtered repeatedly. After about 3 to 5 times, it was vacuum-dried to obtain powdery mother particles (particles 1 a ) which were crosslinked by hexane diamine and polyethylenimine. The obtained mother particles have a compression set recovery ratio of 56% at 180 ° C, and the compression failure strength is

S -28- 201144341 1 6mN 〇 (步驟C ) 藉由以下操作,對粒子1 a施以Ni鍍敷,製作由交聯聚 合物粒子及披覆其之Ni鍍敷層所構成之導電性粒子。 (觸媒賦予) 將日本ATOTECH公司製造之活性劑Neoganth 83 4 (商 品名,鈀離子-胺系錯合劑之水溶液)之原液以水稀釋至 40mL/L ’調整至pH 10.5,準備單液型鹼觸媒液。於該鹼觸 媒液中,將粒子la於35 °C浸漬10分鐘,於粒子la表面吸附 鈀錯合物,利用抽吸過濾回收粒子1 a,經水洗。隨後,再 將粒子la懸浮於水中。於其中,以成爲0.1 g/L饋入二甲基 胺硼烷,使粒子la表面之鈀錯合物還原,獲得於表面擔持 鈀之粒子la之懸浮液。 (無電解鍍敷) 將上述懸浮液加溫至80°C,於其中,通過定量泵緩慢 滴加無電解Ni-P鍍敷液(日立化成工業股份有限公司製, 商品名:NIPS-100 ),對粒子la施以鍍敷處理。鍍敷時間 爲60分鐘。藉此,於粒子la表面形成鍍敷層。隨後,依序 進行抽吸過濾、水洗、抽吸過濾及乾燥,獲得具有由無電 解Ni-P鍍敷所致之鍍敷層之導電性粒子。所得導電性粒子 以良好均勻性形成鍍敷層,於鍍敷層表面未見到凹凸。 -29 - 201144341 (解碎處理及粒子評價) 所得之導電性粒子以噴射硏磨機於解碎壓力0·1 MPa之 條件進行解碎處理。以電子顯微鏡觀察該解碎處理後之導 電性粒子,並拍照攝影。調整倍率使得每一張照片拍入 1 000個粒子,邊對每一張改變攝影場所拍攝10張。針對該 等照片10張(全粒子數=10000個),調查未以鍍敷層完全 披覆之粒子數及鍍覆片數。若解碎處理俞之凝集較多,則 無法以鍍敷層完全披覆,樹脂部分露出之狀態的粒子較多 。且樹脂粒子與鍍敷層之密著性非良好時。因解碎處理使 鍍敷剝落,解碎處理後發生大量鍍敷片。因此,於解碎處 理後之導電性粒子中,若未以鍍敷完全披覆之粒子數較少 (完全以鍍敷披覆脂粒子數較多),鍍敷片較好,則判斷 爲鍍敷處理液中之粒子分散性良好,且樹脂粒子與鍍敷層 之密著性優異。於解碎後之觀察中,幾乎未確認到鍍敷片 之存在。 實施例2 於100mL之三頸燒瓶中一次饋入下列所述比例之混合 物,在室溫使用攪拌機攪拌1小時獲得分散液。使該分散 液在氮氣流下,以18(TC之油浴加熱約6小時。 •合成例1之母粒子:5重量份 •己烷二胺(分子量116.2) :1重量份(胺基相對於 母粒子中之羧基之比例爲1當量)S -28- 201144341 1 6mN 〇 (Step C) The particles 1 a were subjected to Ni plating by the following operation to prepare conductive particles composed of the crosslinked polymer particles and the Ni plating layer coated thereon. (catalyst supply) A stock solution of the active agent Neoganth 83 4 (trade name, aqueous solution of palladium ion-amine-based complexing agent) manufactured by ATOTECH Co., Ltd. was diluted with water to 40 mL/L to adjust to pH 10.5 to prepare a single-liquid base. Catalyst fluid. In the base vehicle, the particles la were immersed at 35 ° C for 10 minutes to adsorb a palladium complex on the surface of the particles la, and the particles 1 a were recovered by suction filtration and washed with water. Subsequently, the particles la are suspended in water. Among them, a palladium complex of the surface of the particle la was reduced by feeding dimethylamine borane to 0.1 g/L to obtain a suspension of the palladium-loaded particles la on the surface. (electroless plating) The above suspension was heated to 80 ° C, and an electroless Ni-P plating solution (manufactured by Hitachi Chemical Co., Ltd., trade name: NIPS-100) was slowly added dropwise by a metering pump. The particles la are plated. The plating time is 60 minutes. Thereby, a plating layer is formed on the surface of the particle la. Subsequently, suction filtration, water washing, suction filtration, and drying were sequentially performed to obtain conductive particles having a plating layer caused by electroless Ni-P plating. The obtained conductive particles were formed into a plating layer with good uniformity, and no irregularities were observed on the surface of the plating layer. -29 - 201144341 (Disintegration treatment and particle evaluation) The obtained conductive particles were subjected to a pulverization treatment at a crushing pressure of 0·1 MPa by a jet honing machine. The conductive particles after the disintegration treatment were observed by an electron microscope and photographed. Adjust the magnification so that each photo is taken with 1 000 particles, and 10 shots are taken for each change of the shooting place. For the 10 photos (the total number of particles = 10,000), the number of particles not completely coated with the plating layer and the number of plated sheets were investigated. If there is a large amount of agglutination treatment, it is impossible to completely coat the plating layer, and there are many particles in a state in which the resin is partially exposed. Further, when the adhesion between the resin particles and the plating layer is not good. The plating was peeled off by the pulverization treatment, and a large amount of plating sheets occurred after the pulverization treatment. Therefore, in the conductive particles after the pulverization treatment, if the number of particles which are not completely coated by plating is small (the number of the coating-coated lipid particles is large), and the plating sheet is preferable, it is judged to be plated. The particles in the treatment liquid have good dispersibility and excellent adhesion between the resin particles and the plating layer. In the observation after the disintegration, the presence of the plating sheet was hardly confirmed. Example 2 A mixture of the following ratios was fed in a 100 mL three-necked flask at a time, and stirred at room temperature for 1 hour using a stirrer to obtain a dispersion. The dispersion was heated under a nitrogen stream at 18 (TC oil bath for about 6 hours. • Master particle of Synthesis Example 1: 5 parts by weight • Hexanediamine (molecular weight 116.2): 1 part by weight (amine group relative to mother The ratio of carboxyl groups in the particles is 1 equivalent)

S -30- 201144341 •聚伸乙亞胺(分子量600 ) : 0.9重量份(胺基相對 於母粒子中之羧基之比例爲1當量) • r-丁內酯:93.1重量份 接著,使用抽吸過濾設備將粒子過濾,利用IPA洗淨 並過濾重覆3〜5次左右後,真空乾燥,獲得由己烷二胺及 聚伸乙亞胺交聯所成之粉末狀母粒子(粒子2a )。所得母 粒子於1 80 °C之壓縮變形回復率爲54%,壓縮破壞強度爲 1 5rnN 〇 (步驟C) 藉由與實施例1同樣操作,對粒子2a施以Ni鍍敷,製 作由交聯聚合物粒子及披覆其之Ni鍍敷層所構成之導電性 粒子。於所得導電性粒子中,以良好均勻性形成鍍敷層, 於鍍敷層表面未見到凹凸。且解碎後之觀察中,幾乎未確 認到鍍敷片之存在。 實施例3 於100mL之三頸燒瓶中一次饋入下列所述比例之混合 物,在室溫使用攪拌機攪拌1小時獲得分散液。使該分散 液在氮氣流下,以180°C之油浴加熱約6小時。 •合成例1之母粒子:5重量份 •己烷二胺(分子量116.2) :1重量份(胺基相對於 母粒子中之羧基之比例爲1當量) •聚伸乙亞胺(分子量1200) :〇.9重量份(胺基相 201144341 對於母粒子中之羧基之比例爲1當量) ♦ r -丁內酯:93.1重量份 接著,使用抽吸過濾設備將粒子過濾,利用IP A洗淨 並過濾重覆3〜5次左右後,真空乾燥,獲得由己烷二胺及 聚伸乙亞胺交聯所成之粉末狀母粒子(粒子3 a )。所得母 粒子於180 °C之壓縮變形回復率爲53%,壓縮破壞強度爲 1 6mN。 (步驟C) 藉由與實施例1同樣操作,對粒子3a施以Ni鍍敷,製 作由交聯聚合物粒子及披覆其之Ni鍍敷層所構成之導電性 粒子。於所得導電性粒子中,以良好均勻性形成鍍敷層, 於鍍敷層表面未見到凹凸。且解碎後之觀察中,幾乎未確 認到鍍敷片之存在。 實施例4 於100mL之三頸燒瓶中一次饋入下列所述比例之混合 物,在室溫使用攪拌機攪拌1小時獲得分散液。使該分散 液在氮氣流下,以1 80°C之油浴加熱約6小時。 •合成例1之母粒子:5重量份 •己烷二胺(分子量116·2) : 1重量份(胺基相對於 母粒子中之羧基之比例爲1當量) •聚伸乙亞胺(分子量1 800 ) : 0.9重量份(胺基相 對於母粒子中之羧基之比例爲1當量)S -30- 201144341 • Polyethylenimine (molecular weight 600): 0.9 parts by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent) • r-butyrolactone: 93.1 parts by weight Next, using suction The filter device filters the particles, washes them with IPA, and filters them for about 3 to 5 times, and then vacuum-driates them to obtain powdery mother particles (particles 2a) obtained by crosslinking hexanediamine and polyethylenimine. The obtained mother particles had a compression set recovery ratio of 54% at 180 ° C and a compressive fracture strength of 15 rnN 〇 (Step C). By performing the same operation as in Example 1, the particles 2a were subjected to Ni plating to prepare a cross-linking. Conductive particles composed of polymer particles and a Ni plating layer coated thereon. In the obtained conductive particles, the plating layer was formed with good uniformity, and no unevenness was observed on the surface of the plating layer. In the observation after the disintegration, the presence of the plating sheet was hardly confirmed. Example 3 A mixture of the following ratios was fed in a 100 mL three-necked flask at a time, and stirred at room temperature for 1 hour using a stirrer to obtain a dispersion. The dispersion was heated in an oil bath at 180 ° C for about 6 hours under a nitrogen stream. • Master particle of Synthesis Example 1: 5 parts by weight • Hexanediamine (molecular weight 116.2): 1 part by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent) • The polyethylenimine (molecular weight: 1200) : 9 parts by weight (amine phase 201144341 for the carboxyl group in the mother particles is 1 equivalent) ♦ r - butyrolactone: 93.1 parts by weight Next, the particles are filtered using a suction filtration device, washed with IP A and After filtering for about 3 to 5 times, it was vacuum-dried to obtain powdery mother particles (particles 3 a ) which were crosslinked by hexane diamine and polyethylenimine. The obtained mother particles had a compression set recovery at 53 ° C of 53% and a compressive fracture strength of 16 mN. (Step C) By subjecting the particles 3a to Ni plating in the same manner as in Example 1, conductive particles composed of crosslinked polymer particles and a Ni plating layer coated thereon were produced. In the obtained conductive particles, the plating layer was formed with good uniformity, and no unevenness was observed on the surface of the plating layer. In the observation after the disintegration, the presence of the plating sheet was hardly confirmed. Example 4 A mixture of the following ratios was fed in a 100 mL three-necked flask at a time, and stirred at room temperature for 1 hour using a stirrer to obtain a dispersion. The dispersion was heated in an oil bath at 180 ° C for about 6 hours under a nitrogen stream. • Master particle of Synthesis Example 1: 5 parts by weight • Hexanediamine (molecular weight: 116·2): 1 part by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent) • Polyethylenimine (molecular weight 1 800 ) : 0.9 parts by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent)

S -32- 201144341 • r -丁內酯:93.1重量份 接著,使用抽吸過濾設備將粒子過濾,利用IPA洗淨 並過濾重覆3 ~5次左右後,真空乾燥,獲得由己烷二胺及 聚伸乙亞胺交聯所成之粉末狀母粒子(粒子4a )。所得母 粒子於180 °C之壓縮變形回復率爲55%,壓縮破壞強度爲 1 6mN 〇 (步驟C ) 藉由與實施例1同樣操作,對粒子4a施以Ni鍍敷,製 作由交聯聚合物粒子及披覆其之Ni鑛敷層所構成之導電性 粒子。於所得導電性粒子中,以良好均勻性形成鍍敷層, 於鍍敷層表面未見到凹凸。且解碎後之觀察中,幾乎未確 認到鍍敷片之存在。 實施例5 於lOOmL之三頸燒瓶中一次饋入下列所述比例之混合 物,在室溫使用攪拌機攪拌1小時獲得分散液。使該分散 液在氮氣流下,以1 80°C之油浴加熱約6小時。 •合成例1之母粒子:5重量份 •己烷二胺(分子量1 16.2 ) : 1重量份(胺基相對於 母粒子中之羧基之比例爲1當量) •聚伸乙亞胺(分子量1 0000 ) : 0.9重量份(胺基相 對於母粒子中之羧基之比例爲1當量) • 7 -丁內酯:93.1重量份 -33- 201144341 接著,使用抽吸過濾設備將粒子過濾,利用IPA洗淨 並過濾重覆3-5次左右後,真空乾燥,獲得由己烷二胺及 聚伸乙亞胺交聯所成之粉末狀母粒子(粒子5a )。所得母 粒子於180 °C之壓縮變形回復率爲5 7%,壓縮破壞強度爲 1 6mN。 (步驟c) 藉由與實施例1同樣操作,對粒子5a施以Ni鍍敷,製 作由交聯聚合物粒子及披覆其之Ni鍍敷層所構成之導電性 粒子。於所得導電性粒子中,以良好均勻性形成鍍敷層, 於鍍敷層表面未見到凹凸。且解碎後之觀察中,幾乎未確 認到鑛敷片之存在》 實施例6 (步驟a ) 於100mL之三頸燒瓶中一次饋入下列所述比例之混合 物,在室溫使用攪拌機攪拌1小時獲得分散液。使該分散 液在氮氣流下,以1 8 0 °C之油浴加熱約6小時。 •合成例2之母粒子:5重量份 •乙二胺(分子量60.2 ) : 1重量份(胺基相對於母 粒子中之羧基之比例爲1當量) •聚伸乙亞胺(分子量1 200 ) : 1.8重量份(胺基相 對於母粒子中之羧基之比例爲1當量) • r -丁內酯(和光純藥):91.7重量份S -32- 201144341 • r -butyrolactone: 93.1 parts by weight Next, the particles were filtered using a suction filtration device, washed with IPA and filtered for about 3 to 5 times, and then dried in vacuo to obtain hexanediamine and Powdered mother particles (particles 4a) formed by cross-linking of ethyleneimine. The obtained mother particles had a compression set recovery ratio of 55% at 180 ° C and a compressive fracture strength of 16 mN 〇 (Step C). By the same operation as in Example 1, the particles 4a were subjected to Ni plating to prepare a crosslinked polymerization. Conductive particles composed of particles and a Ni deposit coated with the particles. In the obtained conductive particles, the plating layer was formed with good uniformity, and no unevenness was observed on the surface of the plating layer. In the observation after the disintegration, the presence of the plating sheet was hardly confirmed. Example 5 A mixture of the following ratios was fed into a three-necked flask of 100 mL at a time, and stirred at room temperature for 1 hour using a stirrer to obtain a dispersion. The dispersion was heated in an oil bath at 180 ° C for about 6 hours under a nitrogen stream. • Master particle of Synthesis Example 1: 5 parts by weight • Hexanediamine (molecular weight: 16.2): 1 part by weight (1 equivalent of the amine group to the carboxyl group in the mother particle) • Polyethylenimine (molecular weight 1 0000 ) : 0.9 parts by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent) • 7 -butyrolactone: 93.1 parts by weight - 33 - 201144341 Next, the particles are filtered using a suction filtration device, and washed with IPA. After filtering and filtering for about 3-5 times, it was vacuum-dried to obtain powdery mother particles (particles 5a) obtained by crosslinking hexanediamine and polyethylenimine. The obtained mother particles had a compression set recovery rate of 5 7% at 180 ° C and a compressive fracture strength of 16 mN. (Step c) By subjecting the particles 5a to Ni plating in the same manner as in Example 1, conductive particles composed of the crosslinked polymer particles and the Ni plating layer coated therewith were produced. In the obtained conductive particles, the plating layer was formed with good uniformity, and no unevenness was observed on the surface of the plating layer. In the observation after the disintegration, the presence of the ore sheet was hardly confirmed. Example 6 (Step a) A mixture of the following ratios was fed in a 100 mL three-necked flask at a time, and stirred at room temperature for 1 hour using a stirrer. Dispersions. The dispersion was heated in an oil bath at 180 ° C for about 6 hours under a nitrogen stream. • Master particle of Synthesis Example 2: 5 parts by weight • Ethylenediamine (molecular weight 60.2): 1 part by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent) • The polyethylenimine (molecular weight 1 200 ) : 1.8 parts by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent) • r - butyrolactone (Wako Pure Chemical Industries, Ltd.): 91.7 parts by weight

S -34- 201144341 接著,使用抽吸過濾設備將粒子過濾,利用IP A洗淨 並過濾重覆3〜5次左右後,真空乾燥,獲得由乙二胺及聚 伸乙亞胺交聯所成之粉末狀母粒子(粒子6a )。所得母粒 子於180t之壓縮變形回復率爲51 %,壓縮破壞強度爲 1 1 mN。 (步驟c ) 藉由與實施例1同樣操作,對粒子6a施以Ni鍍敷,製 作由交聯聚合物粒子及披覆其之Ni鍍敷層所構成之導電性 粒子。於所得導電性粒子中,以良好均勻性形成鍍敷層, 於鍍敷層表面未見到凹凸。且解碎後之觀察中,幾乎未確 認到鍍敷片之存在。 實施例7 (步驟a ) 於100mL之三頸燒瓶中一次饋入下列所述比例之混合 物,在室溫使用攪拌機攪拌1小時獲得分散液。使該分散 液在氮氣流下,以1 8(TC之油浴加熱約1 2小時。 •合成例3之母粒子:5重量份 •五伸乙基六胺(分子量232.4) :0.27重量份(胺基 相對於母粒子中之羧基之比例爲1當量) •聚伸乙亞胺(分子量3 00 ) : 1重量份(胺基相對於 母粒子中之羧基之比例爲1當量) • 7 -丁內酯(和光純藥):93.7重量份 -35- 201144341 接著,使用抽吸過濾設備將粒子過濾,利用IP A洗淨 並過濾重覆3〜5次左右後’真空乾燥’獲得由五伸乙基六 胺及聚伸乙亞胺交聯所成之粉末狀母粒子(粒子7a )。所 得母粒子於18〇°C之壓縮變形回復率爲45%,壓縮破壞強度 爲 1 2mN 〇 (步驟c) 藉由與實施例1同樣操作,對粒子7a施以Ni鍍敷,製 作由交聯聚合物粒子及披覆其之Ni鍍敷層所構成之導電性 粒子。於所得導電性粒子中,以良好均勻性形成鍍敷層, 於鍍敷層表面未見到凹凸。且解碎後之觀察中,幾乎未確 認到鍍敷片之存在。 比較例1 直接使用合成例2所合成之母粒子,評價壓縮特性及 鍍敷層之形成狀態。 比較例2 除於步驟a中使用下述比例之混合物作爲原料以外, 藉由與實施例1同樣操作,進行合成例1之母粒子之處理及 導電性粒子之製作以及其評價。 •合成例1之母粒子:5重量份 •己胺(分子量100) : 1.7重量份(胺基相對於母粒 子中之羧基之比例爲1當量)S -34- 201144341 Next, the particles were filtered using a suction filtration device, washed with IP A and filtered for 3 to 5 times, and then vacuum dried to obtain cross-linking from ethylenediamine and polyethylenimine. Powdered mother particles (particles 6a). The resulting masterbatch had a compression set recovery of 51% at 180 t and a compressive failure strength of 1 1 mN. (Step c) By the same operation as in Example 1, the particles 6a were subjected to Ni plating to prepare conductive particles composed of the crosslinked polymer particles and the Ni plating layer coated thereon. In the obtained conductive particles, the plating layer was formed with good uniformity, and no unevenness was observed on the surface of the plating layer. In the observation after the disintegration, the presence of the plating sheet was hardly confirmed. Example 7 (Step a) A mixture of the following ratios was fed in a 100 mL three-necked flask at a time, and stirred at room temperature for 1 hour using a stirrer to obtain a dispersion. The dispersion was heated under a nitrogen stream at 18 °C in an oil bath for about 12 hours. • Masterbatch of Synthesis Example 3: 5 parts by weight • Pentaethylhexamine (molecular weight: 232.4): 0.27 parts by weight (amine) The ratio of the base to the carboxyl group in the mother particle is 1 equivalent) • Polyethylenimine (molecular weight 300): 1 part by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent) • 7 - Ester (Wako Pure Chemicals): 93.7 parts by weight -35- 201144341 Next, the particles were filtered using a suction filtration device, washed with IP A and filtered for 3 to 5 times, and then vacuum dried to obtain an ethylidene group. Powdered mother particles (particles 7a) obtained by cross-linking hexamine and polyethylenimine. The resulting mother particles have a compression set recovery of 45% at 18 ° C and a compressive failure strength of 12 mN 〇 (step c) By subjecting the particles 7a to Ni plating in the same manner as in Example 1, conductive particles composed of the crosslinked polymer particles and the Ni plating layer coated thereon were prepared, and the obtained conductive particles were excellent. Uniformity forms a plating layer, no unevenness is observed on the surface of the plating layer, and observation after disintegration The presence of the plating sheet was hardly observed. Comparative Example 1 The mother particles synthesized in Synthesis Example 2 were used as they were, and the compression characteristics and the formation state of the plating layer were evaluated. Comparative Example 2 In the step a, a mixture of the following ratios was used. In the same manner as in Example 1, the treatment of the mother particles of Synthesis Example 1 and the production and evaluation of the conductive particles were carried out in the same manner as in Example 1. The mother particles of Synthesis Example 1: 5 parts by weight • Hexylamine (molecular weight: 100): 1.7 parts by weight (the ratio of the amine group to the carboxyl group in the mother particle is 1 equivalent)

S -36- 201144341 • r-丁內酯:92.3重量份 比較例3 除於步驟a中使用下述比例之混 藉由與實施例1同樣操作,進行合成. 導電性粒子之製作以及其評價。 •合成例1之母粒子:5重量份 •聚伸乙亞胺(分子量600 ): 於母粒子中之羧基之比例爲1當量) • 丁內酯:91.4重量份 比較例4 除於步驟a中使用下述比例之混 藉由與實施例1同樣操作,進行合成 導電性粒子之製作以及其評價。 •合成例1之母粒子:5重量份 •聚伸乙亞胺(分子量1200 ) 對於母粒子中之羧基之比例爲1當量) • r -丁內酯:91.4重量份 合物作爲原料以外, 例1之母粒子之處理及 〇 · 9重量份(胺基相對 合物作爲原料以外, 列1之母粒子之處理及 ·· 〇 . 9重量份(胺基相 -37- 201144341 (表2〕 壓縮回復率 (%) 壓縮破壞強 度(mN) 鍍敷層之 均勻性 鍍敷層之 凹凸 解碎後之鍍 敷片 實施例1 56 16 良好 {fuc 無 實施例2 54 15 良好 無 無 實施例3 53 16 良好 無 fte 實施例4 55 14 良好 inL •frrr m 實施例5 57 18 良好 ^m*. m 無 實施例6 51 11 良好 /frTf- M Μ /»、、 實施例7 45 12 良好 Arrr Μ 比較例1 33 7 不良 有 有 比較例2 32 8 不良 有 有 比較例3 30 8 良好 有 有 比較例4 33 9 良好 fnr. m Arrr 無 評價結果示於表2。各實施例所得之交聯聚合物粒子 具有良好壓縮特性。且,各實施例之交聯聚合物粒子表面 可以良好均一性形成鍍敷層。再者,導電性粒子解碎後幾 乎無鑛敷片’故亦確認樹脂粒子與鍍敷層之密著性優異。 相對於此,比較粒之各粒子之壓縮特性及鍍敷性均不充分 。由以上實驗結果’確認依據本發明,提供具有良好壓縮 特性同時可於其表面以良好狀態形成鍍敷層之交聯聚合物 粒子。 〔產業上之可能利用性〕 可了解本發明之交聯聚合物粒子滿足作爲異向導電性 薄膜、導電糊膏爲代表之導電性材料中使用之粒子之有用 特性。再者,由本發明之製法獲得之交聯聚合物粒子由於S-36-201144341 • r-butyrolactone: 92.3 parts by weight. Comparative Example 3 The synthesis was carried out in the same manner as in Example 1 except that the mixing of the following ratios was carried out in the step a. Production of conductive particles and evaluation thereof. • Master particle of Synthesis Example 1: 5 parts by weight • Polyethylenimine (molecular weight 600): The ratio of carboxyl groups in the mother particles was 1 equivalent) • Butyrolactone: 91.4 parts by weight Comparative Example 4 Except in step a The production of the synthesized conductive particles and the evaluation thereof were carried out in the same manner as in Example 1 using the following ratios. • Master particle of Synthesis Example 1: 5 parts by weight • Polyethylenimine (molecular weight 1200) The ratio of carboxyl groups in the mother particles is 1 equivalent) • r - butyrolactone: 91.4 parts by weight as a raw material, Treatment of 1 mother particle and 〇·9 parts by weight (treatment of the parent particle of column 1 in addition to the amine-based compound and ·. 9 parts by weight (amine-phase-37-201144341 (Table 2) compression Recovery rate (%) Compressive failure strength (mN) Uniformity of plating layer Plating sheet after unevenness of the plating layer Example 1 56 16 Good {fuc No Example 2 54 15 Good No Example 3 53 16 good without fte Example 4 55 14 good inL • frrr m Example 5 57 18 good ^m*. m no example 6 51 11 good / frTf - M Μ /»,, example 7 45 12 good Arrr Μ comparison Example 1 33 7 Defective Comparative Example 2 32 8 Defective Comparative Example 3 30 8 Good Comparative Example 4 33 9 Good fnr. m Arrr No evaluation results are shown in Table 2. Crosslinked polymers obtained in each example The particles have good compression properties, and the crosslinked polymer particles of the examples The sub-surface can be formed into a plating layer with good uniformity. Further, since the electroconductive particles are almost free of ore-deposited pieces after disintegration, it is confirmed that the resin particles and the plating layer are excellent in adhesion. In contrast, the particles of the particles are compared. The compression characteristics and the plating properties are not sufficient. From the above experimental results, it was confirmed that according to the present invention, crosslinked polymer particles having good compression characteristics and forming a plating layer on a good surface thereof can be provided. It is understood that the crosslinked polymer particles of the present invention satisfy the useful properties of particles used as an electrically conductive material represented by an anisotropic conductive film or a conductive paste. Further, the crosslinked polymerization obtained by the process of the present invention Particle due to

S -38- 201144341 耐熱性、耐藥品性、反應性、溶液分散性亦優異,故可較 好地使用於下述領域:液晶用間隔材、使用導電性微粒子 及使用其之導電材料、靜電荷顯像劑、銀鹽薄膜用表面改 質劑、磁帶用薄膜改質劑、熱感應紙行進安定劑、碳粉等 之電性、電子工業領域、油墨、接著劑、黏著劑、光擴散 劑、塗料、紙塗佈、資料記錄紙等之紙用塗佈劑等之化學 領域、芳香劑、低收縮化劑、紙、牙科材料、樹脂改質劑 等之一般工業領域、液狀或粉狀化妝品中添加之滑劑或體 質顏料等之化妝品領域、生體及抗原抗體反應檢査用粒子 等之生物、醫療、醫藥及農業領域、建築領域、汽車領域 等之廣範圍領域。 【圖式簡單說明】 圖1爲顯示交聯聚合物粒子之一實施形態之模式圖。 圖2爲顯示異向導電性接著劑之一實施形態之模式圖 【主要元件符號說明】 1 :交聯聚合物粒子 3 :膠黏樹脂 5 :導電性粒子 10 :母粒子 20 :異向導電性接著劑 -39-S-38-201144341 Excellent in heat resistance, chemical resistance, reactivity, and solution dispersibility, so it can be preferably used in the following fields: spacers for liquid crystals, conductive fine particles, conductive materials using them, and electrostatic charges. Developers, surface modifiers for silver salt films, film modifiers for magnetic tapes, thermal stability paper travel stabilizers, carbon and other electrical properties, electronics industry, inks, adhesives, adhesives, light diffusers, General industrial fields such as chemical fields such as paints, paper coatings, and data recording papers, such as chemical agents, aromatic agents, low shrinkage agents, paper, dental materials, and resin modifiers, liquid or powder cosmetics. A wide range of fields such as cosmetics, bio-antigens, and antigen-antibody reaction-inspection particles, such as a slip agent or an extender pigment, and the like, such as biology, medical treatment, medicine, agriculture, construction, and automotive. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an embodiment of crosslinked polymer particles. 2 is a schematic view showing an embodiment of an anisotropic conductive adhesive [Description of main components] 1 : Crosslinked polymer particles 3 : Adhesive resin 5 : Conductive particles 10 : Parent particles 20 : Anisotropic conductivity Follow-39-

Claims (1)

201144341 七、申請專利範圍: 1. 一種交聯聚合物粒子,其特徵爲,由具備有使具 有官能基之交聯聚合物所形成之母粒子,與具有2個以上 之胺基的胺化合物接觸,使前述官能基與前述胺基反應, 而使前述交聯聚合物再進行交聯之步驟(a)之製造方法 所得者, 又,前述胺化合物爲包含分子量未達5 00之低分子量 胺化合物。 2. 如申請專利範圍第1項之交聯聚合物粒子,其中, 前述胺化合物尙含有分子量50 0~ 10000之高分子量胺化合 物。 3. 如申請專利範圍第1或2項之交聯聚合物粒子,其 中’平均粒徑爲0.1〜10/zm,粒徑之Cv値爲10%以下。 4-如申請專利範圍第1〜3項中任一項之交聯聚合物 粒子,其中,前述官能基爲由羧基、環氧基及環氧丙基( Glycidyl)所成群中所選出之至少1種。 5 ·如申請專利範圍第1〜4項中任一項之交聯聚合物 粒子,其中,前述母粒子爲可由懸浮聚合、乳化聚合、分 散聚合、沈澱聚合或種子聚合所得之粒子。 6. 如申請專利範圍第1〜5項中任一項之交聯聚合物 粒子’其中,前述交聯聚合物爲由含有1〇質量%以上之具 有2個以上不飽和雙鍵之單體的單體混合物經共聚合所形 成之共聚物。 7. 如申請專利範圍第6項之交聯聚合物粒子,其中, S -40- 201144341 前述具有2個以上不飽和雙鍵之單體爲包含由二乙烯基苯 及二(甲基)丙烯酸酯所選出之至少1種》 8. 如申請專利範圍第1〜7項中任一項之交聯聚合物 粒子,其中,前述步驟(a)之後之前述母粒子,於180t 下,具有40%以上之壓縮變形回復率,及l〇mN以上之壓縮 破壞強度。 9. 一種導電性粒子,其特徵爲,可由具備有將申請 專利範圍第1〜8項中任一項之交聯聚合物粒子施以鍍敷之 步驟(c )之製造方法所製得。 10. 如申請專利範圍第9項之導電性粒子,其中,於 前述步驟(c)中,爲使用Pd離子錯合物作爲鍍敷觸媒, 對前述交聯聚合物進行鍍敷。 11. 一種交聯聚合物粒子之製造方法,其特徵爲,包 含使具有官能基之交聯聚合物所形成之母粒子,與具有2 個以上之胺基的胺化合物接觸,使前述官能基與前述胺基 反應,而使前述交聯聚合物再進行交聯之步驟(a), 又,前述胺化合物爲包含分子量未達5 00之低分子量 胺化合物。 12. 如申請專利範圍第11項之交聯聚合物粒子之製造 方法,其中,於前述步驟(a)中,前述胺化合物之胺基 之比例,相對於前述母粒子中之前述官能基1當量爲0.1〜 5當量。 13·—種異向導電性黏著劑,其爲具備有膠黏樹脂, 與分散於該膠黏樹脂中之如申請專利範圍第9或10項之導 -41 - 201144341 電性粒子。 S -42-201144341 VII. Patent Application Range: 1. A crosslinked polymer particle characterized in that it is contacted with an amine compound having a crosslinked polymer having a functional group and an amine compound having two or more amine groups. And the method for producing the step (a) wherein the functional group is reacted with the amine group to further crosslink the crosslinked polymer, and the amine compound is a low molecular weight amine compound having a molecular weight of less than 5,000. . 2. The crosslinked polymer particles of claim 1, wherein the amine compound 尙 contains a high molecular weight amine compound having a molecular weight of from 50 to 10,000. 3. The crosslinked polymer particles according to claim 1 or 2, wherein the average particle diameter is 0.1 to 10/zm, and the Cv値 of the particle diameter is 10% or less. The crosslinked polymer particles according to any one of claims 1 to 3, wherein the functional group is at least selected from the group consisting of a carboxyl group, an epoxy group, and a glycidyl group (Glycidyl). 1 species. The crosslinked polymer particles according to any one of claims 1 to 4, wherein the mother particles are particles obtainable by suspension polymerization, emulsion polymerization, dispersion polymerization, precipitation polymerization or seed polymerization. 6. The crosslinked polymer particles according to any one of the above claims, wherein the crosslinked polymer is a monomer having 2 or more mass% of a double bond having 2 or more unsaturated double bonds. A copolymer formed by copolymerization of a monomer mixture. 7. The crosslinked polymer particle of claim 6, wherein S-40-201144341 wherein the monomer having two or more unsaturated double bonds comprises divinylbenzene and di(meth)acrylate The crosslinked polymer particles according to any one of the preceding claims, wherein the parent particles after the step (a) have a content of 40% or more at 180 t. The compression deformation recovery rate and the compression failure strength above l〇mN. A conductive particle obtained by the production method comprising the step (c) of plating the crosslinked polymer particles according to any one of claims 1 to 8. 10. The conductive particles according to claim 9, wherein in the step (c), the crosslinked polymer is plated by using a Pd ion complex as a plating catalyst. A method for producing a crosslinked polymer particle, comprising: contacting a mother particle formed of a crosslinked polymer having a functional group with an amine compound having two or more amine groups, and allowing the functional group to The amine group is reacted to further crosslink the crosslinked polymer (a), and the amine compound is a low molecular weight amine compound having a molecular weight of less than 500. 12. The method for producing a crosslinked polymer particle according to claim 11, wherein in the step (a), the ratio of the amine group of the amine compound is 1 equivalent to the functional group in the parent particle. It is 0.1 to 5 equivalents. 13. An anisotropic conductive adhesive which is provided with an adhesive resin and is dispersed in the adhesive resin as disclosed in claim 9 or 2011. S -42-
TW100108712A 2010-03-15 2011-03-15 Cross-linked polymer particle and method for producing same TW201144341A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010057882 2010-03-15

Publications (1)

Publication Number Publication Date
TW201144341A true TW201144341A (en) 2011-12-16

Family

ID=44649088

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100108712A TW201144341A (en) 2010-03-15 2011-03-15 Cross-linked polymer particle and method for producing same

Country Status (3)

Country Link
JP (2) JP4957871B2 (en)
TW (1) TW201144341A (en)
WO (1) WO2011114993A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6097184B2 (en) * 2013-09-10 2017-03-15 積水化学工業株式会社 adhesive
JP2016060776A (en) * 2014-09-16 2016-04-25 綜研化学株式会社 Organic-inorganic composite resin particle and method for producing the same
CN114133732B (en) * 2021-12-06 2023-07-25 中广核俊尔(浙江)新材料有限公司 Polyamide master batch for irradiation crosslinking and preparation method and application thereof
JP7454108B2 (en) * 2022-01-18 2024-03-21 松本油脂製薬株式会社 Particles and their uses

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189103A (en) * 1983-04-11 1984-10-26 Nippon Shokubai Kagaku Kogyo Co Ltd Water-absorbing agent
JPH0689069B2 (en) * 1985-05-31 1994-11-09 積水ファインケミカル株式会社 Conductive microsphere
JPS62101605A (en) * 1985-10-29 1987-05-12 Nagasaki Pref Gov Synthesis of adsorbent resin
JPH03197512A (en) * 1989-12-26 1991-08-28 Tosoh Corp Production of water-absorptive resin
JP2884653B2 (en) * 1990-01-22 1999-04-19 日本油脂株式会社 Crosslinked polymer fine particles and coating composition containing the same
JP2951744B2 (en) * 1990-06-14 1999-09-20 花王株式会社 Crosslinked polymer fine particles
JPH0586205A (en) * 1991-04-26 1993-04-06 Hitachi Chem Co Ltd Production of crosslinked polymer particle
JPH0674331B2 (en) * 1992-01-28 1994-09-21 三洋化成工業株式会社 Process for producing modified super absorbent resin and resin
JPH06228225A (en) * 1993-02-04 1994-08-16 Hitachi Chem Co Ltd Production of crosslinked polymer particle
JPH07118340A (en) * 1993-10-26 1995-05-09 Nippon Zeon Co Ltd Hydrophilic gel particle modified with ethyleneamine
JP3587398B2 (en) * 1995-05-25 2004-11-10 綜研化学株式会社 Conductive particles and anisotropic conductive adhesive
JP2001206954A (en) * 2000-01-26 2001-07-31 Sekisui Chem Co Ltd Method for producing fine particle having crosslinkage and fine particle having crosslinkage
JP4215521B2 (en) * 2003-01-14 2009-01-28 日清紡績株式会社 Curable particle and method for producing the same

Also Published As

Publication number Publication date
WO2011114993A1 (en) 2011-09-22
JP4957871B2 (en) 2012-06-20
JPWO2011114993A1 (en) 2013-06-27
JP2011231336A (en) 2011-11-17

Similar Documents

Publication Publication Date Title
TWI356425B (en) Coated fine particle and their manufacturing metho
JP5140209B2 (en) Conductive fine particles, resin particles and anisotropic conductive material using the same
TW201144341A (en) Cross-linked polymer particle and method for producing same
WO2005113649A1 (en) Particle with rough surface and process for producing the same
CN101550213B (en) A metal/ polymer composite particle and method of preparing the same
WO2005113650A1 (en) Particle with rough surface for plating or vapor deposition
Gupta et al. Synthesis and characterization of stimuli‐sensitive micro‐and nanohydrogels based on photocrosslinkable poly (dimethylaminoethyl methacrylate)
JP5375961B2 (en) Crosslinked polymer particles, production method thereof, and conductive particles
JP5927862B2 (en) SUBMICRON POLYMER PARTICLE AND METHOD FOR PRODUCING INSULATION-CONTAINING CONDUCTIVE PARTICLE HAVING THE SAME
TWI284652B (en) Flat particle and process for producing the same
TWI363070B (en)
TW201833196A (en) Emulsion of nitrogen atom-containing polymer or salt thereof, production method therefor, and production method for particles
TWI565734B (en) High durability cross-linked polymer particles
WO2004092731A1 (en) Element having bioactive substance fixed thereto
JP6014438B2 (en) Conductive fine particles and anisotropic conductive material using the same
Zhang et al. Fabrication and morphological evolution of inverse core/shell structural latex particles of poly (vinyl acetate)/polystyrene by maleic anhydride grafting
Handique et al. Microencapsulated self-healing polymers via controlled, surface initiated atom transfer radical polymerization from the surface of graphene oxide
JP4215521B2 (en) Curable particle and method for producing the same
TWI618718B (en) Cross-linked polymer microparticle with temperature-regulatable mechanical properties and method of fabricating the same
JP2013105537A (en) Water repellent conductive particles, anisotropic conductive material and conductive connection structure
JP2010116539A (en) Polymer microparticle, and method for manufacturing the same
JP2005017773A (en) Particle having rugged surface and its manufacturing method
JP2021154209A (en) Particle and classification method
TW200946544A (en) Preparations of polymeric microspheres with multiple functional groups and with metallic nanoparticles deposited thereon
JP2013095781A (en) Polymer-covered particle