TW201142961A - Fixing fixture and wire bonding machine - Google Patents

Fixing fixture and wire bonding machine Download PDF

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Publication number
TW201142961A
TW201142961A TW099116090A TW99116090A TW201142961A TW 201142961 A TW201142961 A TW 201142961A TW 099116090 A TW099116090 A TW 099116090A TW 99116090 A TW99116090 A TW 99116090A TW 201142961 A TW201142961 A TW 201142961A
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Taiwan
Prior art keywords
substrate
window
wire
circuit substrate
grounding
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TW099116090A
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Chinese (zh)
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TWI405278B (en
Inventor
Hyun-Kyu Lee
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Advanced Semiconductor Eng
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Publication of TWI405278B publication Critical patent/TWI405278B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H01L2224/78704—Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

A fixing fixture suitable for wire bonding process is disposed on a carrier so as to fix a circuit substrate. The circuit substrate has a bonding surface, a ground pad on the bonding surface and substrate units. Each of the substrate units is suitable for carrying a chip. The ground pad is located at the periphery of the substrate units. The fixing fixture includes a window clamp on the circuit substrate and a ground element. The window clamp has an opening exposing the substrate units and the material thereof is an electric-conductive material. The ground element has a magnetic attraction portion on the window clamp and a contacting end extending from the edge of the magnetic attraction portion. The magnetic attraction portion magnetically attracts the window clamp and the contacting end contacts the ground pad. The ground element electrically connects the window clamp and the ground pad.

Description

201142961 ASEK2328-NEW-FINAL-TW-20100520 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種固定治具及配置有該固定治具 的打線機台，且特別是有關於一種可應用在打線接合製程 中且有助於打線監控的固定治具及配置有該固定治具的打 線機台。 【先前技術】 在高度情報化社會的今日，各種電子裝置的市場不斷 地急速擴張。晶片封裝技術亦需配合電子裝置的數位化、 網路化、區域連接化以及使用人性化的趙勢而發展。在各 種晶片封裝製程中，打線接合製程與覆晶接合製程(flip chip bonding process)為目前最常見之技術。覆晶接合製程 疋藉由凸塊(bump)連接晶片與承載器(earrjer)，故可大幅縮 紐配線長度，並有助於提昇晶片與承載器間訊號傳遞的速 度。然而，覆晶接合製程所需耗費之時間與成本遠高於打 線接合製程。因此，在許多低腳數或低成本之電子裝置中， 打線接合製㈣為晶片封«者所最㈣用之封裳技術。 ^此外，習知技術在打線接合的同時亦會以打線監控系 統（wire bonding monitoring system)監測每一個晶片與導 線之間的連接是否良好，以避免對與導線連接不良的晶片 ，行封膠製程’進而可降低製作成本，並提升晶片封裝成 良率。並且，在進行打線監控時，打線監控系統與晶 白而接地，以使打線監控系統可正確地判讀所偵測到的 201142961 ASEK2328-NEW-FINAL-TW-20100520 訊號。 [發明内容】 本發明提供一種用於打線接合製程的固定治具，具有 可任思移動的接地兀件，故以該固定治具進行打線接合製 程與打線監控時’該固定治具所固定之線路基板的接地墊201142961 ASEK2328-NEW-FINAL-TW-20100520 VI. Description of the Invention: [Technical Field] The present invention relates to a fixed jig and a wire arranging machine equipped with the fixed jig, and particularly relates to a A fixed jig that is used in the wire bonding process and contributes to wire monitoring and a wire bonding machine equipped with the fixed jig. [Prior Art] In today's highly information society, the market for various electronic devices continues to expand rapidly. The chip packaging technology also needs to be developed in conjunction with the digitalization, networking, regional connectivity of electronic devices and the use of humanized Zhao potential. In various wafer packaging processes, the wire bonding process and the flip chip bonding process are currently the most common techniques. The flip chip bonding process 连接 bumps the wafer and the carrier (earrjer), so the wiring length can be greatly reduced and the speed of signal transmission between the wafer and the carrier can be improved. However, the time and cost of the flip chip bonding process is much higher than the wire bonding process. Therefore, in many low-foot count or low-cost electronic devices, the wire bonding system (4) is the chipping technology used by the wafer sealer. In addition, the conventional technology also monitors whether the connection between each wafer and the wire is good by wire bonding monitoring system at the same time as wire bonding, so as to avoid the wafer with poor connection with the wire, and the sealing process. 'In turn, the manufacturing cost can be reduced and the wafer package can be improved in yield. Moreover, during the wire monitoring, the wire monitoring system is grounded and crystallized so that the wire monitoring system can correctly interpret the detected 201142961 ASEK2328-NEW-FINAL-TW-20100520 signal. SUMMARY OF THE INVENTION The present invention provides a fixed jig for a wire bonding process, which has a grounding element that can be moved at any time. Therefore, when the fixing jig is used for the wire bonding process and the wire monitoring, the fixed jig is fixed. Ground pad of circuit substrate

可任意配置，進而有助於增加線路基板的接地墊的佈局設 計彈性。 本發明提供一種打線機台，其設置有前述固定治具， 且在該打線機台進行打線接合製程與打線監控時，固定治 具的接地元件可使線路基板上的晶片接地，以提升打線監 控系統的债測準讀度。 本發明提出一種用於打線接合製程的固定治具，設置 於一載台上，用以固定一線路基板。線路基板具有一接合 面’。至少一接地墊位於接合面上以及多個基板單元，各基 板單70適於承載至少一晶片，接地墊位於基板單元的周 邊。肢治具包括-窗顏板以及—接地元件。窗型壓板 配置於線路基板上，以將線路基板壓合於載台上，窗型壓 板，有開口’開口暴露出基板單元，窗型壓板的材質為 -以材料。接地元件具有—磁吸部與自磁吸部之邊緣延 伸而出的—接觸端，磁吸部位於窗型壓板上並磁性吸附窗 與接地塾。 塾接輪件％性連職型壓板 在本發Θ之g〜例巾’部分窗型壓板位於接地塾與 201142961 ASEK2328-NEW-FINAL-TW-20100520 接地元件配置於窗型壓板的 接地元件配置於窗型壓板之 基板單元之間。 在本發明之一實施例中 邊緣上。 在本發明之一實施例中 鄰近開口的部分上。 在本發明之-實施例巾，接地元件為—：形結構。 本發明提出-種打線機台，適於打線連接一線路 與配置於線路基板上❹個晶片。祕基板具^一 = 面’至少-接地墊位於接合面上以及多個基板單元，晶 分別配置於基板單元上，接地独於基板單元關邊。打 線機台包括-載台、—gj定治具、—銲針以及—打線監控 糸統。線路基板配置於載台上。固定治轉置於載台上^ =固J線路基板。固定治具包括一窗型壓板以及一接地元 △。®型壓板配置於線路基板上，以將,線路基板壓合 ^沾窗麵板具有—開口，開口暴露出基板單元，窗型 吸導電材料。接地元件具有一磁吸部與自磁 及狀邊緣延伸而出的—接觸端，磁吸部位於窗型壓板上 吸附窗型壓板，接觸端接觸接地墊，接地树電性 連接固型壓板與接地塾^銲針位於線路基板上方，用 性連接各晶片及線路基板的導線。打線監㈣ 導線所回授的電流或電絲監測銲針所形 成的導線是否良好連接至晶片其中之—。 所沿 f發明之—實施例中’至少一 B曰曰片依序經由 板、接地元件與窗型壓板而接地。 201142961 ASEK2328-NEW-FINAL-TW-20100520 在本發明之一實施例中，部分窗型壓板位於接地墊與 基板單元之間。 在本發明之一實施例中，接地元件配置於窗型壓板的 邊緣上。 在本發明之一實施例中’接地元件配置於窗型壓板之 鄰近開口的部分上。 在本發明之一實施例中’接地元件為一L形結構。 基於上述’由於本發明之接地元件是以磁性吸附的方 式固定在窗型麗板上，故接地元件可在窗型壓板上任意移 動。因此，本發明之固定治具適於固定（接地墊位置）不 同的線路基板，並可透過接地元件連接線路基板的接地 塾，故有助於增加線路基板的接地墊的佈局設計彈性。本 發明之打線機台設置有前述固定治具，且在該打線機台進 行打線接合製程與打線監控時，固定治具的接地元件可使 線路基板上的晶;i接地’以提升打線監控㈣的彳貞測準確 為讓本發明之上述特徵和優點能更賴易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】It can be arbitrarily configured to help increase the layout design flexibility of the ground pad of the circuit substrate. The invention provides a wire splicing machine, which is provided with the above-mentioned fixing jig, and when the wire splicing machine performs the wire bonding process and the wire monitoring, the grounding component of the fixing jig can ground the wafer on the circuit substrate to improve the wire monitoring. The system's debt test read degree. The invention provides a fixing jig for a wire bonding process, which is arranged on a stage for fixing a circuit substrate. The circuit substrate has a joint surface'. At least one ground pad is located on the bonding surface and the plurality of substrate units, and each of the substrate sheets 70 is adapted to carry at least one wafer, and the ground pad is located around the substrate unit. The limb fixture includes a window panel and a grounding element. The window type pressure plate is disposed on the circuit substrate to press the circuit substrate onto the stage, the window type pressure plate has an opening, the opening exposes the substrate unit, and the window type pressure plate is made of - material. The grounding member has a contact portion extending from the magnetic attraction portion and the edge of the self-magnetic portion, and the magnetic attraction portion is located on the window type pressure plate and the magnetic adsorption window and the grounding port.塾 轮 % % % % 〜 〜 〜 〜 例 例 例 例 ' ' ' ' ' 部分 部分 部分 部分 部分 部分 部分 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 Between the substrate units of the window type pressure plate. In an embodiment of the invention, on the edge. In an embodiment of the invention adjacent to the portion of the opening. In the embodiment of the invention, the grounding element is a -: shaped structure. The present invention proposes a wire bonding machine suitable for wire bonding a wire and a wafer disposed on a circuit substrate. The substrate has a surface = at least - the ground pad is located on the bonding surface and the plurality of substrate units, and the crystals are respectively disposed on the substrate unit, and the grounding is independent of the substrate unit. The wire machine includes - the stage, - gj fixed fixture, - welding pin and - wire monitoring system. The circuit substrate is disposed on the stage. The fixed treatment is placed on the stage ^ = solid J circuit substrate. The fixture has a window type pressure plate and a grounding element △. The ® type press plate is disposed on the circuit substrate to press the circuit substrate, and the window panel has an opening, the opening exposes the substrate unit, and the window type attracts the conductive material. The grounding element has a magnetic contact portion and a contact end extending from the magnetic and edge. The magnetic suction portion is located on the window type pressure plate and the window is pressed, the contact end contacts the grounding pad, and the grounding tree is electrically connected to the solid pressure plate and the ground. The soldering pin is located above the circuit substrate and is used to connect the wires of the respective wafers and the circuit substrate. Line monitoring (4) The current or wire fed back by the wire monitors whether the wire formed by the welding pin is well connected to the chip. In the embodiment of the invention, at least one B-plate is sequentially grounded via a plate, a grounding member and a window platen. 201142961 ASEK2328-NEW-FINAL-TW-20100520 In one embodiment of the invention, a partial window platen is located between the ground pad and the substrate unit. In an embodiment of the invention, the grounding element is disposed on the edge of the window platen. In one embodiment of the invention, the grounding member is disposed on a portion of the window-type pressure plate adjacent the opening. In one embodiment of the invention, the grounding element is an L-shaped structure. Based on the above, since the grounding member of the present invention is fixed to the window panel by magnetic attraction, the grounding member can be arbitrarily moved on the window type pressing plate. Therefore, the fixing jig of the present invention is suitable for fixing the circuit substrate of different (grounding pad position) and connecting the grounding pad of the circuit substrate through the grounding member, thereby contributing to increase the layout design flexibility of the ground pad of the circuit substrate. The wire bonding machine of the present invention is provided with the above-mentioned fixing jig, and when the wire bonding machine performs the wire bonding process and the wire bonding monitoring, the grounding component of the fixing jig can make the crystal on the circuit substrate; i grounding to improve the wire monitoring (4) The above-described features and advantages of the present invention are more readily understood, and the following detailed description is given in conjunction with the accompanying drawings. [Embodiment]

圖 1A · ‘ 1B繪示圖 化說明，圖 控系統，以Figure 1A · ‘ 1B illustrates the graphical description, the graphical control system,

ί S.I 7 201142961 ASEK2328-NEW-FINAL-TW-20100520 請同時參照目U與圖m，本實施例之打線機台⑽ k於打線連接-線路基板21()與配置於線路基板⑽ 多個晶片跡詳細而言，線路基板210具有-接合面212, 接地墊214位於接合面212上以及多個基板單元。 各晶片222分別配置於對應的基板單元216上，接地墊214 位於基板單元216的周邊。在其他實施例中，線路基板21〇 可具有多個接地墊214。 、圖1<：繪不圖1A之打線機台的示意圖，且圖lc中的 載台、固定治具、線路基板與晶片是繪示沿圖1Α2Ι4段 的剖面圖。請同時參照圖1Β與圖lc，本實施例之打線^ 台100包括一載台11〇、一固定治具12〇、一銲針13〇以及 一打線監控系統140。線路基板210配置於載台11〇上。 固定治具120設置於載台110上，以固定線路基板 210。詳細而言，固定治具12〇包括一窗型壓板122以及一 接地元件124。窗型壓板122配置於線路基板21〇上，以 將線路基板210壓合於載台11〇上。窗型壓板122具有一 開口 122a，開口 122a暴露出基板單元216。在本實施例中， 部分窗型壓板122位於接地墊214與基板單元216之間。 窗型壓板122的材質為一導電材料。 接地元件124具有一磁吸部124a與自磁吸部124a之 邊緣延伸而出的一接觸端124b。磁吸部124a位於窗型壓 板122上並磁性吸附窗型壓板122 ’接觸端i24b接觸接地 墊214 ’如此一來，接地元件124可電性連接窗型壓板122 與接地墊214。在本實施例中，窗型壓板122接地，且線 201142961 ASEK2328-NEW-FINAL-TW-20100520 路基板210的接地塾214可經由接地元件124與窗型磨板 122而接地。在本實施例中，祕元件124位 i22的邊緣上。接地元件124例如為一乙形結構。“反 圖m繪示圖1A之接地元件的立體圖。請參照圖1〇, 在本實施例中，接地元件124可包括一第一導電片c卜一 第二導電片C2舆一磁性材料層M，其中第一導電片Q 具有一平板部P與一彎折部B，磁性材料層M位 • P與第二導電片C2之間。磁性材料層Μ、平板部p與第 二導電片C2構成磁吸部124a，彎折部凡構成接觸端⑽。 第一導電片C1與第二導電片（：2的材質例如為不錄鋼。 值得注意的是，由於本實施例之接地元件124是以磁 性吸附的方式固定在窗型壓板122上，因此，可依照實際 使用的需求而任意移動接地元件124的位置。舉例來說二 當打線機台100需對（接地塾214位置）不同的線路基板 210進行打線接合時，僅需移動接地元件124的位置即可 使接地元件I24接觸接地墊214。也就是說，不論線路基 板210的接地墊214的佈局方式為何，接地元件124皆可 有效地連接接地墊214與窗型壓板122。因此，可任意移 動的接地元件124可有助於增加線路基板21〇的接二墊 214的佈局設計彈性。 ' 在本實施例中，線路基板210與載台11〇之間係使用 真空吸附固定。本實施例之接地元件124是配置在窗型壓 板122上並以接觸端i24b接觸線路基板210的接地墊 214，此時，接觸端124b可對線路基板21〇施加一朝向載 201142961 ASEK2328-NEW-FINAL-TW-20100520 台110的壓力，如此一來，可將線路基板21〇壓合於載台 m上，以避免在後續的製程中因線路基板210趣曲而ς 壞線路基板210與載台110之間的真空狀熊。 圖2與圖3繪不圖ία之接地元件在窗型壓板上的多 種配置方式。在其他實施例中，接地元件124可依照圖2 或圖3所繪示的方式配置。在圖3中，接地元件124'可選 擇性地配置於窗型塵板122之鄰近開口 122a的部分上。值 得注意的是，本實施例並不限定接地元件124的配置位 置，因此，接地元件124可依照圖1、圖2或圖3所繪示 的方式配置，也可以是以其他的方式配置。 請參照圖1C，銲針130位於線路基板21〇上方，用 以形成至少一電性連接各晶片220及線路基板21〇的導線 150。詳細而言，一導線供應裝置16〇可提供銲針13〇 一導 線 150 〇 打線監控系統140適於藉由檢查導線150所回授的電 流或電壓來監測銲針130所形成的導線150是否良好連接 至晶片220。詳細而言，在本實施例中，打線監控系統ι4〇 具有一線夾142 ’線夾142係配置於導線供應裝置160與 銲針130之間’並位於導線15〇的周邊。打線監控系統14〇 利用線夾142對導線150施加一電流並檢查回授至線夾 142之電流或電壓來監控打線接合製程。 在本實施例中，打線監控系統140接地，且晶片220 依序經由線路基板210、接地元件124與窗型壓板122而 接地’以降低打線接合時打線監控系統140所接收到的電 流雜訊，進而提高打線監控系統140的偵測準確度。 201142961 ASEK2328-NEW-FINAL-TW-20100520 綜上所述，由於本發明之接地元件是以磁性吸附的方 式固定在窗型壓板上’故可依照實際使用的需求而任意移 動接地元件的位置’進而有助於增加線路基板的接地墊的 佈局設計彈性。此外，在本發明之打線機台中，由於打線 監控系統接地且接地元件使晶片接地，故可降低打線接合 時打線監控系統所接收到的電流雜訊，進而提高打線監控 系統的偵測準確度。SI SI 7 201142961 ASEK2328-NEW-FINAL-TW-20100520 Please also refer to the U and FIG. m, the wire bonding machine (10) k of the present embodiment is connected to the wiring substrate 21 () and the plurality of wafer tracks arranged on the circuit substrate (10). In detail, the circuit substrate 210 has a bonding surface 212 on which the ground pad 214 is located and a plurality of substrate units. Each of the wafers 222 is disposed on the corresponding substrate unit 216, and the ground pad 214 is located around the substrate unit 216. In other embodiments, the circuit substrate 21A may have a plurality of ground pads 214. Fig. 1 <: A schematic view of the wire splicing machine of Fig. 1A, and the stage, the fixed jig, the circuit substrate and the wafer in Fig. 1c are sectional views taken along line 图2Ι4 of Fig. 1 . Referring to FIG. 1A and FIG. 1c together, the wire bonding station 100 of the present embodiment includes a loading platform 11A, a fixing fixture 12A, a soldering pin 13A, and a wire monitoring system 140. The circuit substrate 210 is disposed on the stage 11A. The fixing jig 120 is disposed on the stage 110 to fix the circuit substrate 210. In detail, the fixed fixture 12A includes a window type pressure plate 122 and a grounding member 124. The window platen 122 is disposed on the circuit substrate 21A to press the circuit substrate 210 against the stage 11A. The window platen 122 has an opening 122a that exposes the substrate unit 216. In the present embodiment, the partial window type pressure plate 122 is located between the ground pad 214 and the substrate unit 216. The window platen 122 is made of a conductive material. The grounding member 124 has a magnetic attraction portion 124a and a contact end 124b extending from the edge of the magnetic attraction portion 124a. The magnetic attraction portion 124a is located on the window-type pressure plate 122 and the magnetic adsorption window-type pressure plate 122' contact end i24b contacts the grounding pad 214'. Thus, the grounding member 124 can electrically connect the window-type pressure plate 122 and the grounding pad 214. In the present embodiment, the window platen 122 is grounded, and the ground 塾 214 of the line 201142961 ASEK2328-NEW-FINAL-TW-20100520 circuit substrate 210 can be grounded via the grounding element 124 and the window plate 122. In this embodiment, the secret element 124 is on the edge of i22. The grounding element 124 is, for example, a B-shaped structure. The reverse view shows a perspective view of the grounding member of FIG. 1A. Referring to FIG. 1A, in the embodiment, the grounding member 124 can include a first conductive sheet c, a second conductive sheet C2, and a magnetic material layer M. The first conductive sheet Q has a flat portion P and a bent portion B, and between the magnetic material layer M and P and the second conductive sheet C2. The magnetic material layer Μ, the flat portion p and the second conductive sheet C2 constitute The magnetic attraction portion 124a and the bent portion constitute the contact end (10). The material of the first conductive sheet C1 and the second conductive sheet (: 2 is, for example, no steel is recorded. It is worth noting that since the grounding member 124 of the embodiment is The magnetic adsorption mode is fixed on the window type pressing plate 122. Therefore, the position of the grounding element 124 can be arbitrarily moved according to the actual use requirements. For example, when the wire bonding machine 100 needs to be used (grounding 塾 214 position) different circuit substrates When the wire bonding is performed, only the position of the grounding element 124 needs to be moved to make the grounding element I24 contact the grounding pad 214. That is, the grounding element 124 can be effectively connected regardless of the layout of the grounding pad 214 of the circuit substrate 210. Ground pad 214 and The type of platen 122. Therefore, the arbitrarily movable grounding member 124 can contribute to increase the layout design flexibility of the second pad 214 of the circuit substrate 21A. In the present embodiment, the circuit substrate 210 and the stage 11〇 are connected. The grounding member 124 of the present embodiment is a grounding pad 214 disposed on the window-type pressing plate 122 and contacting the circuit substrate 210 at the contact end i24b. At this time, the contact end 124b can apply an orientation load to the circuit substrate 21A. 201142961 ASEK2328-NEW-FINAL-TW-20100520 The pressure of the stage 110, so that the circuit substrate 21 can be pressed onto the stage m to avoid damaging the line due to the circuit board 210 in the subsequent process. A vacuum bear between the substrate 210 and the stage 110. Figures 2 and 3 illustrate various arrangements of the ground element on the window platen. In other embodiments, the ground element 124 can be in accordance with Figure 2 or Figure The configuration shown in Fig. 3. In Fig. 3, the grounding member 124' is selectively disposed on a portion of the window shaped dust plate 122 adjacent to the opening 122a. It is noted that the present embodiment does not limit the grounding member 124. Configuration location, due to The grounding element 124 can be configured in the manner shown in FIG. 1, FIG. 2 or FIG. 3, or can be configured in other manners. Referring to FIG. 1C, the soldering pin 130 is located above the circuit substrate 21A to form at least one The wires 150 and the wires 150 of the circuit substrate 21 are electrically connected. In detail, a wire supply device 16 can provide a solder pin 13 and a wire 150. The wire monitoring system 140 is adapted to be fed back by the inspection wire 150. Current or voltage is used to monitor whether the wire 150 formed by the solder pin 130 is well connected to the wafer 220. In detail, in the present embodiment, the wire monitoring system ι4 〇 has a wire clamp 142 'clip 142 disposed between the wire supply device 160 and the welding pin 130' and located at the periphery of the wire 15 turns. The wire bonding system 14 〇 applies a current to the wire 150 using the wire clamp 142 and checks the current or voltage fed back to the wire clamp 142 to monitor the wire bonding process. In this embodiment, the wire monitoring system 140 is grounded, and the wafer 220 is grounded sequentially via the circuit substrate 210, the grounding element 124, and the window platen 122 to reduce the current noise received by the wire monitoring system 140 when the wire bonding is performed. The detection accuracy of the wire monitoring system 140 is further improved. 201142961 ASEK2328-NEW-FINAL-TW-20100520 In summary, since the grounding element of the present invention is magnetically adsorbed to the window type pressure plate, the position of the grounding element can be arbitrarily moved according to the actual use requirements. It helps to increase the layout design flexibility of the ground pad of the circuit substrate. In addition, in the wire bonding machine of the present invention, since the wire monitoring system is grounded and the grounding member grounds the wafer, the current noise received by the wire monitoring system during the wire bonding can be reduced, thereby improving the detection accuracy of the wire monitoring system.

山再者，本發明之接地元件是配置在窗型壓板上並以接 觸端接觸線路基板的接地塾’糾，接綱可對線路基板 施力:朝向载台的壓力，如此一來，可將線路基板壓合於 乂避免在後續的製程中因線路基板翹》曲而破壞線 路基板與载台之間的真空狀態。 、 太恭Ϊ然本發明已以實施例揭露如上，然其並非用以限定 本發明之領^中具有通常知識者，在不脫離 發明之保®内，當可作些許之更動與、卿，故本 蒦把圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖lA輪"—丄 m m 2T發明一實施例之打線機台的俯視圖。 =Β、會示圖1Α之打線機台的立體圖。 圖1C矣会 * 載台、固定1Α之打線機台的示意圖，且圖lc中的 的剖面圖广、、線路基板與晶片是繪示沿圖1A之I-Ι段 U之接地元件的立體圖。 Θ與圖3緣示圖认之接地元件在窗型壓板上的多 201142961 ASEK2328-NEW-FINAL-TW-20100520 種配置方式。 【主要元件符號說明】 100 :打線機台 110 ·•載台 120 :固定治具 122 :窗型壓板 122a :開 口 124 :接地元件 124a :磁吸部 124b :接觸端 130 :銲針 140 :打線監控系統 142 :線夾 150 :導線 160 :導線供應裝置 210 :線路基板 212 :接合面 214 :接地墊 216 :基板單元 220 :晶片 B :彎折部 C1 :第一導電片 C2 :第二導電片 Μ:磁性材料層 Ρ :平板部Furthermore, the grounding element of the present invention is disposed on the window-type pressure plate and contacts the grounding substrate of the circuit substrate with the contact end, and the connection can apply force to the circuit substrate: the pressure toward the stage, so that The circuit substrate is pressed against the crucible to prevent the vacuum state between the circuit substrate and the stage from being damaged due to the warpage of the circuit substrate in the subsequent process. It is to be understood that the present invention has been disclosed in the above embodiments, and is not intended to limit the scope of the present invention, and that it may be modified and modified without departing from the invention. Therefore, this is subject to the definition of the patent application scope attached to it. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a plan view of a wire splicing machine according to an embodiment of the invention. =Β, will show a perspective view of the wire machine of Figure 1. Fig. 1C is a schematic view of a stage, a fixed one, and a cross-sectional view in Fig. 1c, a circuit board and a wafer showing a grounding element along the I-Ι section U of Fig. 1A. Θ Θ Θ 图 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 [Main component symbol description] 100: Wire bonding machine 110 ·• Stage 120: Fixed jig 122: Window type platen 122a: Opening 124: Grounding element 124a: Magnetic part 124b: Contact end 130: Solder pin 140: Wire monitoring System 142: clip 150: wire 160: wire supply device 210: circuit substrate 212: joint surface 214: ground pad 216: substrate unit 220: wafer B: bent portion C1: first conductive sheet C2: second conductive sheet : Magnetic material layer 平板 : flat part

Claims (1)

201142961 ASEK2328-NEW-FINAL-TW-2〇l〇〇52〇 七、申謗專利範菌·· 1· 一種用於打線接合製程的固定治具，設置於一載 台上，用以固定一線路基板，該線路基板具有一接合面， 至f一接地墊位於該接合面上以及多個基板單元，各該基 板單元適於承载至少一晶片，該接地墊位於該些基板單元 的周邊，該固定治具包括： ， 自型壓板，配置於該線路基板上，以將該線路基板 壓合於該，台上’該窗型屢板具有-開口，該開口暴露出 該上基板單元，該窗型壓板的材質為一導電材料；以及 一接地元件，具有一磁吸部與自該磁吸部之邊緣延伸 2的-接觸端’該磁吸部位於該窗㈣板上並磁性吸附 =型壓板，該接觸端接賴接地墊，該接地元件電性連 接該窗型壓板與該接地墊。 八2.如申請專利範圍…項所述之固定治具，其中部 勺該窗型壓板位於該接地墊與該些基板單元之間。八 3.㈣請專利範圍第2項所述之固定治盆中該 镬地凡件配置於該窗型壓板的邊緣上。 ’、 4· Μ請專利第i項所述之固定奸， 接地70件配置於該窗型壓板之鄰近該開口的部八上八° 接/如申請專利範圍第1項所述之固定治id中兮 接地元件為一L·形結構。 、/、中該 6· 一種打線機台，適於打線連接—綠％甘t 於該線路紐上的多個晶片，該魏基板^基板與配置 晶 至少-接地塾位於該接合面上以及多個基板單:接=’ 13 201142961 Abtl^：J28-NEW-FINAL-TW-201〇〇52〇 片分別配置於該絲板單元上’該接轉位於該些基板單 元的周邊，該打線機台包括： 一载台，該線路基板配置於該載台上； 一固疋治具，設置於該載台上，用以固定該線路基板， 該固定治具包括： 一窗型壓板，配置於該線路基板上，以將該線路 基板，合於該載台上，該窗型壓板具有一開口，該開 口暴露出該些基板單元，該窗型壓板的材質為一導電 材料； 一接地元件’具有一磁吸部與自該磁吸部之邊緣 延伸而出的一接觸端，該磁吸部位於該窗型壓板上並 磁性吸附該窗型壓板，該接觸端接觸該接地墊，該接 地元件電性連接該窗型壓板與該接地墊； 一銲針，位於該線路基板上方，用以形成至少一電性 連接各該晶片及該線路基板的導線；以及 一打線監控系統，適於藉由檢查該導線所回授的電流 或電壓來監_銲針卿成的料線是否良好連接至該些 晶片其中之一。 .— 7.如申請專利範圍第6項所述之打線機台，其中該 些晶片至少其中之一依序經由該線路基板、該接地元件與 該窗型壓板而接地。 8‘如申凊專利範圍第ό項所述之打線機台，其中部 分該窗型壓板位於該接地墊與該些基板單元之間。 9.如申晴專利範圍第8項所述之打線機台，其中該 201142961 AbhiK2328-NEW-FINAL-TW-20100520 接地元件配置於該窗型壓板的邊緣上。 10. 如申請專利範圍第6項所述之打線機台，其中該 接地元件配置於該窗型壓板之鄰近該開口的部分上。 11. 如申請專利範圍第6項所述之打線機台，其中該 接地元件為一 L形結構。201142961 ASEK2328-NEW-FINAL-TW-2〇l〇〇52〇七,申谤专利范菌·· 1· A fixed fixture for the wire bonding process, installed on a stage for fixing a line a substrate having a bonding surface, wherein a ground pad is located on the bonding surface and a plurality of substrate units, each of the substrate units being adapted to carry at least one chip, the ground pad being located at a periphery of the substrate units, the fixing The fixture comprises: a self-type pressing plate disposed on the circuit substrate to press the circuit substrate thereon, and the window type has an opening, the opening exposing the upper substrate unit, the window type The material of the pressure plate is a conductive material; and a grounding member has a magnetic attraction portion and a contact end extending from the edge of the magnetic attraction portion. The magnetic attraction portion is located on the window (four) plate and magnetically adsorbed = type pressure plate. The contact end is connected to the ground pad, and the ground element is electrically connected to the window platen and the ground pad. 8. The fixed jig as claimed in claim 4, wherein the window-shaped pressure plate is located between the ground pad and the substrate units. VIII 3. (4) In the fixed treatment basin described in item 2 of the patent scope, the mortise piece is disposed on the edge of the window type pressure plate. ', 4· Μ 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利The middle grounding element is an L-shaped structure. / /, the 6 a wire bonding machine, suitable for wire bonding - green % Gan t a plurality of wafers on the line, the Wei substrate ^ substrate and the configuration crystal at least - the grounding 塾 is located on the joint surface and Substrate single: connection = ' 13 201142961 Abtl ^: J28-NEW-FINAL-TW-201 〇〇 52 〇 〇 配置 配置 配置 〇 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The method includes: a loading platform, the circuit substrate is disposed on the loading platform; a fixing fixture is disposed on the loading platform for fixing the circuit substrate, the fixing fixture includes: a window type pressing plate disposed on the a circuit board is mounted on the circuit board, the window type pressing plate has an opening, the opening exposing the substrate unit, the window type pressing plate is made of a conductive material; and the grounding element has a magnetic attraction portion and a contact end extending from an edge of the magnetic attraction portion, the magnetic attraction portion is located on the window type pressure plate and magnetically adsorbs the window type pressure plate, the contact end contacts the ground pad, and the grounding element is electrically Connecting the window type pressure plate and the ground a soldering pin disposed on the circuit substrate for forming at least one wire electrically connecting each of the chip and the circuit substrate; and a wire monitoring system adapted to check a current or voltage fed back by the wire Supervisor _ solder needles into the material line is well connected to one of the wafers. 7. The wire bonding machine of claim 6, wherein at least one of the wafers is grounded via the circuit substrate, the grounding element and the window platen in sequence. [8] The wire splicing machine of the ninth aspect of the invention, wherein the window type pressure plate is located between the grounding pad and the substrate units. 9. The wire bonding machine according to item 8 of the Shenqing patent scope, wherein the 201142961 AbhiK2328-NEW-FINAL-TW-20100520 grounding element is disposed on an edge of the window type pressure plate. 10. The wire bonding machine of claim 6, wherein the grounding element is disposed on a portion of the window platen adjacent to the opening. 11. The wire bonding machine of claim 6, wherein the grounding element is an L-shaped structure.
TW099116090A 2010-05-20 2010-05-20 Fixing fixture and wire bonding machine TWI405278B (en)

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JP2003007759A (en) * 2001-06-27 2003-01-10 Sanyo Electric Co Ltd Method of manufacturing recognition equipment, bonding equipment, and circuit device
US7481351B2 (en) * 2003-12-23 2009-01-27 Samsung Electronics Co., Ltd. Wire bonding apparatus and method for clamping a wire
TWI306279B (en) * 2006-08-25 2009-02-11 Advanced Semiconductor Eng Wire bonding machine
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