TW201139641A - Heat dissipation structure - Google Patents

Heat dissipation structure Download PDF

Info

Publication number
TW201139641A
TW201139641A TW100103570A TW100103570A TW201139641A TW 201139641 A TW201139641 A TW 201139641A TW 100103570 A TW100103570 A TW 100103570A TW 100103570 A TW100103570 A TW 100103570A TW 201139641 A TW201139641 A TW 201139641A
Authority
TW
Taiwan
Prior art keywords
conductive layer
heat
sheet
substrate
adhesive
Prior art date
Application number
TW100103570A
Other languages
English (en)
Chinese (zh)
Inventor
Seiji Izutani
Kazutaka Hara
Takahiro Fukuoka
Hisae Uchiyama
Hitotsugu Hirano
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201139641A publication Critical patent/TW201139641A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW100103570A 2010-01-29 2011-01-28 Heat dissipation structure TW201139641A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010018256 2010-01-29
JP2010090908 2010-04-09
JP2010161845 2010-07-16
JP2010161850 2010-07-16
JP2010172325 2010-07-30

Publications (1)

Publication Number Publication Date
TW201139641A true TW201139641A (en) 2011-11-16

Family

ID=44490952

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100103570A TW201139641A (en) 2010-01-29 2011-01-28 Heat dissipation structure

Country Status (5)

Country Link
US (1) US20110259565A1 (ko)
JP (1) JP2012049496A (ko)
KR (1) KR20110089103A (ko)
CN (2) CN104658994A (ko)
TW (1) TW201139641A (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012049495A (ja) 2010-01-29 2012-03-08 Nitto Denko Corp 発光ダイオード装置
TW201203477A (en) 2010-01-29 2012-01-16 Nitto Denko Corp Power module
DE102011109594A1 (de) * 2011-08-05 2013-02-07 Connaught Electronics Ltd. Vorrichtung mit einem Gehäuse, zumindest zwei Leiterplatten und zumindest einem Wärmeableitelement
JP2013179277A (ja) * 2012-02-08 2013-09-09 Nitto Denko Corp 熱伝導性シート
CN104302474B (zh) * 2012-05-16 2016-09-21 荒川化学工业株式会社 伸缩性散热片和贴附有该伸缩性散热片的物品
WO2014065068A1 (ja) 2012-10-24 2014-05-01 シャープ株式会社 発光装置
JP5766335B2 (ja) * 2013-07-01 2015-08-19 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び放熱部材
JP5752299B2 (ja) * 2013-07-01 2015-07-22 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び放熱部材
JP2015030238A (ja) * 2013-08-06 2015-02-16 Dic株式会社 積層基材、粘着シート及び電子機器
WO2015109453A1 (zh) * 2014-01-22 2015-07-30 浙江三元电子科技有限公司 热熔胶组合物及其制备方法、热熔胶导热片及其制备方法
US10111363B2 (en) * 2014-12-04 2018-10-23 Microsoft Technology Licensing, Llc System for effectively transfering heat from electronic devices and method for forming the same
CN107093591B (zh) * 2016-02-17 2022-07-29 株式会社有泽制作所 散热板
US10731067B2 (en) * 2016-02-25 2020-08-04 Zeon Corporation Heat conductive sheet and method of producing same, and heat dissipation device
EP3575368A4 (en) * 2017-01-30 2020-07-22 Sekisui Chemical Co., Ltd. RESIN AND LAMINATE MATERIAL
CN106907696A (zh) * 2017-02-27 2017-06-30 苏州科斯曼照明工程有限公司 一种用于地埋灯的散热片
WO2018207819A1 (ja) 2017-05-10 2018-11-15 積水化学工業株式会社 絶縁性シート及び積層体
KR102541460B1 (ko) * 2018-03-27 2023-06-09 엘지이노텍 주식회사 전파 투과형 방열 시트 및 이를 포함하는 통신 모듈
JP6994122B2 (ja) * 2019-02-07 2022-01-14 信越ポリマー株式会社 放熱構造体およびそれを備えるバッテリー
CN113631504B (zh) * 2019-03-27 2024-02-09 富士胶片株式会社 散热片的制造方法
CN113416389B (zh) * 2021-07-28 2022-05-13 四川大学 一种环氧基二维片状金属纳米填料的超高各向同性导热材料及其制备方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162849A (en) * 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
KR20030029118A (ko) * 2000-08-03 2003-04-11 해밀턴 선드스트랜드 코포레이션 히트 싱크로의 인쇄 회로 기판의 접착 접합
JP5015366B2 (ja) * 2000-09-12 2012-08-29 ポリマテック株式会社 熱伝導性成形体及びその製造方法
JP4714371B2 (ja) * 2001-06-06 2011-06-29 ポリマテック株式会社 熱伝導性成形体及びその製造方法
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
CN1307858C (zh) * 2003-05-21 2007-03-28 广达电脑股份有限公司 功能模块及其制造方法
JP2005057088A (ja) * 2003-08-05 2005-03-03 Agilent Technol Inc 多層構造の熱伝導部材、および、それを用いた電子機器
JP4089636B2 (ja) * 2004-02-19 2008-05-28 三菱電機株式会社 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
JP4225945B2 (ja) * 2004-05-17 2009-02-18 富士高分子工業株式会社 熱伝導性シート
JP4046120B2 (ja) * 2005-01-27 2008-02-13 三菱電機株式会社 絶縁シートの製造方法およびパワーモジュールの製造方法
US20070259211A1 (en) * 2006-05-06 2007-11-08 Ning Wang Heat spread sheet with anisotropic thermal conductivity
JP4916764B2 (ja) * 2006-05-10 2012-04-18 電気化学工業株式会社 異方熱伝導積層型放熱部材
JP2007324016A (ja) * 2006-06-02 2007-12-13 Matsushita Electric Ind Co Ltd 誘導加熱装置
JP5407120B2 (ja) * 2007-04-11 2014-02-05 日立化成株式会社 熱伝導シート、その製造方法およびこれを用いた放熱装置
US20080271832A1 (en) * 2007-05-04 2008-11-06 Tyco Electronics Corporation Thermo-conductive, heat-shrinkable, dual-wall tubing
JP5525682B2 (ja) * 2007-05-15 2014-06-18 出光ライオンコンポジット株式会社 ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品
JP2008305937A (ja) * 2007-06-07 2008-12-18 Panasonic Corp 電子部品内蔵モジュールおよびその製造方法
JP5391530B2 (ja) * 2007-06-14 2014-01-15 三菱電機株式会社 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
WO2009116357A1 (ja) * 2008-03-18 2009-09-24 株式会社カネカ 高熱伝導性樹脂成形体
US7906373B1 (en) * 2008-03-26 2011-03-15 Pawel Czubarow Thermally enhanced electrically insulative adhesive paste
CN101588707A (zh) * 2008-05-19 2009-11-25 华为技术有限公司 一种散热装置及应用其的电子设备
JP2009280650A (ja) * 2008-05-20 2009-12-03 Shin Kobe Electric Mach Co Ltd 熱可塑性樹脂組成物及び熱可塑性樹脂成形品
JP5330910B2 (ja) * 2009-07-03 2013-10-30 電気化学工業株式会社 樹脂組成物及びその用途
JP5513840B2 (ja) * 2009-10-22 2014-06-04 電気化学工業株式会社 絶縁シート、回路基板及び絶縁シートの製造方法

Also Published As

Publication number Publication date
JP2012049496A (ja) 2012-03-08
CN104658994A (zh) 2015-05-27
KR20110089103A (ko) 2011-08-04
CN102169856B (zh) 2015-06-24
US20110259565A1 (en) 2011-10-27
CN102169856A (zh) 2011-08-31

Similar Documents

Publication Publication Date Title
TW201139641A (en) Heat dissipation structure
US8749978B2 (en) Power module
TW201131716A (en) Thermal conductive sheet, light-emitting diode mounting substrate, and thermal conductive adhesive sheet
TW201132691A (en) Thermal conductive sheet
JP5698932B2 (ja) 熱伝導性シート
TWI507464B (zh) 熱傳導性片材
TW201219211A (en) Multilayered resin sheet and method for producing the same, resin sheet laminate and method for producing the same, harded resin sheet, multilayered resin sheet with metal foil, and semiconductor device
US20110259566A1 (en) Thermal conductive sheet
TW201139642A (en) Thermal conductive sheet
JP2013062379A (ja) 熱伝導性シートおよびその製造方法
TW201214809A (en) Light-emitting diode device
JP2009024126A (ja) ポリマー組成物、熱伝導性シート、金属箔付高熱伝導接着シート、金属板付高熱伝導接着シート、金属ベース回路基板ならびにパワーモジュール
JP2012049493A (ja) 撮像部品
JP2017149910A (ja) 熱伝導性接着剤組成物、熱伝導性接着剤シートおよび積層体の製造方法
TW201137010A (en) Thermal conductive sheet
JP5587220B2 (ja) 熱伝導性接着シート
JP2012039064A (ja) 熱伝導性シート
JP2012039066A (ja) 熱伝導性シート
JP2017149909A (ja) 熱伝導性接着剤組成物、熱伝導性接着剤シートおよび積層体の製造方法
JP2012036365A (ja) 熱伝導性シート
JP2012039063A (ja) 熱伝導性シート
JP2011178008A (ja) 熱伝導シート、その製造方法及びこれを用いた放熱装置