201138013 六、發明說明： 【發明所屬之技術領域] 本發明關於-種將二個互相貼合的片狀元件制離的方 法以及一種相關的剥離震置。 【先前技術】 在將片狀元件（例如晶圓）從一堆4 (Stapel)- _分開 (糟⑽zeln)時，原來的制離程序可μ完全達^如此會 有一個多少有些重疊的片狀元件互相貼合。因此，為了不 干擾進一步作的製造程序（例如在製造光電池設備時），項作 -道「後分離作業」⑽如如叫。迄今，須將這此互 相貼合的片狀元件從程序排離（aussehleusen)出來再分別地 一一分離’然後再作進送，但這種進行方式對流程 L赞明内容】 離作業；ίί發月的目的在提供一種儘量簡單而有效的後分 举：W將互相貼合的片狀元件剝離，此後分離作 ::整合到既有的程序中，…係利用本發： 本發明的裝置達成。 在及 發明的方法中，首先將該互相貼合的片 二其：為了作運送。在此，使用一吸取裝置產 j =用^1…狀元件（其上附著另一片一元件）的—表 及取裝置保持住。在此運送過程將互相貼合的片 4 201138013 狀元件檢出。在檢出有互相貼 保持力施到至少一第—M #的片狀凡件後，將一第二 弟一片狀7〇件上，此 在該第-片狀元件上。如& -片狀元件附著 片狀元件，第二保持力作用到第二:保持力作用到第- 二片狀元件產生作相對運動使它們：件▲第-及第 係沿運送方向產生。 目剝離。此相對運動 為此，依本發明的—種用於將 離的剝離裝置包含：一第_ 。的片狀凡件剥 於產生一第一保持力的/裝置，該運送裝置與—用 件保持在-表面上.此置配合，因此-個片狀元 互相貼合的片狀元件，，二=置:檢出 空裝置配合以產生-第二保持力。此外設有―、產生^真 附著力的真空裝置與-保持裝置配人 吝 "第— 第-元件及/或一產生[伴一第一力量的 一驅動手段沿運送方向互相有-相對速^ 用至） 離作在運送過程時可同時進行-道後分 乍業，、中將互相貼合的元件互相剝離。該堆疊或至少 一個互相貼合的元#彡音尤"，& H '從整個程序排出，然後再進送。 另外也須檢出有雙片相貼 u ,, . ,. σ的日日片或雙片相貼合的其他的 ::，以將這種堆疊的元件作排出(Aussch :早:運:中，它們可用於本發明以將片狀元件互相撕 二向撕離的作業。如果利用該將二個片狀元件 元：1Γ 對運動達成，則有一優點，即不須將該 、D升起。在此例中，互相貼合為剛好二 201138013 個片狀兀件。但可看出即使是多數個片狀元件，例如三個 或四個，也可用本發明的進行方式及本發明的裝置。但在 此情形，在第一步驟並不將所有片狀元件完全分離。 申请專利範圍附屬$係關於本發明方法及本發 的有利實施例。 x 第一及第二保持力宜利用二個先後相隨的運送裝置達 成。在此’該二個產生第—及第二保持力的元件特別設置 成使它們有-共同運送平面。那一些主要使用本發明的裝 置及方法的晶圓係為很薄的片狀元件，此處二個晶圓只部 分地重疊’因此須將未重疊的部分利用二個先後相隨的構 件保持住。雖然利用第—運送手⑨，例如-輸送帶的帶將 二個互相貼合的晶圓的第—個晶圓保持住，但沿運送方向 在後方的晶圓同時被—隨後的構件（例如-隨後之輸送帶的 另-帶)保持住，如此，藉著產生該二帶互相的相對速度， 可將二晶圓互相剝離。 如不用此方式，舉例而言，也可利用一第一運送裝置 產=此第一附著力，以及利用一吸取運送裝置產生此第二 附者力（該第二吸取获番分/V Λ、Λ：» Λ* 裒置3又成與第一運送裝置成相對靜 止）。然後，利用進-步運轉的輸送帶，當第二晶圓附著在 °取裝置上時將一晶圓剝離，然後利用吸取裝置將第二 晶圓再放在第-運送裝置上。在吸取裝置的位置上可設另 -運送裝置’它和第一運送裝置對立，在該吸取裝置及第 二運送裝置（它和第—運送裝置對立）的情形，該互相貼合的 晶圓保持在互相背向的表面上。 201138013 在此，特別是該另一運送裝置（它和第一運送裝 之後端（沿運详士 a认义 置對立） 迗方向的後端）上距第一運送裝置的距離 變。此端宜利用__ 2S I A # 肖-彈簧施負何’如此-方面可確保該距離 ::距…變:、：另！Γ又可作後調整—eb_ 如此，a曰圓文損的機率大大減小，如此同 可確保忒距报小’ 0此當只有二個晶圓互相貼合可 確實產生第二保持力。 也了 當未完全--分離時，宜沿運送方向再運送—定路徑 距離’其後作另一道分離過程。這點特別是和利用先後 隨的運送裝置所作的分離的作業可有利地組合。因此可確 保有足夠的面積以利用第一及第二運送裝置產生第一及第 二保持力。但由於會發生不同程度的重疊，因此要將不同 的元件保持在第一或第二運送裝置上並設有理想的時間 占如此利用此分段的進一步運送可確實作分離。 依另-較佳實施例’當在吸取裝置產生第二保持力的 情形中’設有-驅動手段，$用它可調整吸取裝置距第一 運送裝置的運送面的距離，用此方式可確保，即使有不同 數目之互相貼合的晶圓(例如二片或三片)也可使晶圓之背 向第一運送裝置的那個表面與吸取裝置接觸並倚靠的晶圓 固定保持在該處。 較佳之實施例示於圖式中並在以下的說明中敘述。 【實施方式】 所 圓1顯示一個二階段後分離裝置，在下文配合圖i 201138013 說明之用於檢出互相貼合的晶圓及控制驅動手段的構件在 圖2及圖3的裝置也存在。但為了簡明起見，故不完全重 新敘述。 用於將互相貼合的片狀元件分離的裝置包含一第一運 送裝置⑴’第-運送裝置⑴宜設計成輸送帶形式、輸送帶 有帶（2) ’ 3又5十成無端方式且利用一第一驅動滾子（3)及一 第二驅動滾子（4)運轉。》了驅動該輸送帶，故設有一驅動 手段（5)，它仙到第-驅動滾子（3)或第二驅動滾子⑷的至 少-個上，驅動手段（5)可針對帶⑺的運送速度作調整。 帶（2)之朝外的-側有一運送平面（6)，帶⑺之背向運送 平面⑹的那-側在第-(3)及第二驅動滾子⑷之間沿一吸 取裝置導進。吸取裝置包含一通道系統⑺，它和一泵⑻連 接’利用通道系統（7)，在帶（2)背向運送平面（6)的那一側產 生-真空。帶（2)宜設有槽孔或其他開σ，因此被糾）運走 的介質造成一股介質流通過帶（2)過去。 在圖示之實施例已可看出：由任-先前的程序所進送 的片狀元件[為了簡明’它們在下文只稱為「晶圓」]互相貼 合。舉例而言，：個這種的晶圓（9)⑽可利用—種分 置，在這方面還要說明：圖示的後分離作業可整合到㈣ '離設備的流程中。因此’舉例而言，第-運送裝置⑴就 可為那個直接用於將片狀元件從設在-液體槽中的堆遇ί =送裝置。但同樣地也可從另-個程序(它和來自：： 的片狀元件的分離無關）將元件進送。 且 該二片狀元件（9)與（10)[它們部分地重疊]此時利用帶 8 201138013 ⑺的運動”财向運送mu⑽[它與—電子 控制裝置（1 5)配合組成—彳 互相貼合。為此，舉例而;用]可檢知：晶圓(9)和(1°) !而D ，可用一超音波感測器、一 電谷^量厚度的感測器、一光學厚度感測手段、 用uv先感測器（紫外光感測器）可藉測量 吸收里而知道厚度與預設值的偏差，檢出互相貼合的片狀 7C件的此-方式係已習知者且用於先前技術中，在 側設感測II⑽只是舉例，也可設置在下側。準確之設 別取決於所用之檢出方法。 J此處的情形，在檢知有二個片狀元件互相附著後(也 可有多於二個的元件相附著)利用一真空裝置產生一第二保 持力。第二附著力係利用一吸取器⑴）[它與另一果⑴）連接] 產生’、雖然第-晶圓⑼用其背向第二晶圓(1 〇)的表面倚在帶 (2)的運送面⑹上並利用該處產生的真空施以第—保持力， 但一第二保持力利用一保持裝置[它由吸取器⑴）形成]產生 ，到第二晶圓⑽上。在此’第二保持力在第二晶圓⑽之 背向運送平面（6)的那個表面上產生。 、士簡化圖中所不’當作保持裝置的吸取器（1 3)，其距運 达平面(6)的距離可改變。為此，設有一相關的驅動手段， 它利用電子控制單元（15)控制，如此可依互相貼合的晶圓 (9)(10)的數目而定，調整距運送平面⑹的理想距離。 ^在圖示之實施例中，吸取器（Π)相對於運送方向設置成 靜 換。之，在此方向不能運動。在此情形，將該利用 第一保持力保持在帶（2)上的第一晶圓（9)進一步運送，造成 201138013201138013 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of separating two sheet members bonded to each other and an associated peeling vibration. [Prior Art] When a chip component (such as a wafer) is separated from a stack of 4 (Stapel)-_ (small (10) zeln), the original separation process can be completely up to ^ so that there will be a somewhat overlapping sheet The components are attached to each other. Therefore, in order not to interfere with the further manufacturing process (for example, when manufacturing a photovoltaic device), the item "post-separation operation" (10) is called. So far, the sheet-like elements that are attached to each other have to be separated from the program and then separated separately and then sent again, but this way of doing things to the process L is praised. The purpose of the moon is to provide a post-splitting that is as simple and effective as possible: W peels off the sheet-like elements that are attached to each other, and then separates:: integrates into the existing program, ... uses the present invention: the device of the present invention Achieved. In the method of the invention, the mutually bonded sheets are first: for transport. Here, a suction device is used to produce j = a watch and a pick-up device that hold a member of the device (on which another component is attached). In this transport process, the pieces of the film 4 201138013 are attached to each other. After detecting a sheet-like member having a mutual holding force applied to at least one of the first -M #, a second piece of a piece of the second piece is placed on the first sheet-like member. For example, & - the sheet member is attached to the sheet member, and the second holding force acts on the second: the holding force acts on the second sheet member to cause relative movement so that the member ▲ first and second portions are generated in the conveying direction. Detachment. This relative movement is for this purpose, according to the invention, the stripping device for separation is comprised of: a _. The sheet-like piece is peeled off to produce a first holding force/device, and the conveying device and the member are held on the surface. This is matched, so that the sheet-like elements that are attached to each other are two-piece elements, Set: Check out the empty device fit to generate a second holding force. In addition, there is a vacuum device that generates a true adhesion force and a holding device that is associated with the first component and/or a generating device that has a driving force along the conveying direction. ^ Use to) Separation can be carried out at the same time during the transportation process - the components that are attached to each other are peeled off from each other. The stack or at least one of the mutually conforming elements #彡音尤", & H ' is discharged from the entire program and then fed. In addition, it is necessary to detect the other ones that are attached to the two pieces of the Japanese, or the two pieces that fit together::, to discharge the stacked components (Aussch: Early: Transportation: Medium They can be used in the present invention to tear the sheet members apart from each other. If the two sheet member elements are used to achieve the movement, there is an advantage that the D is not required to be raised. In this case, they are bonded to each other to exactly two 201138013 sheet-like elements. However, it can be seen that even a plurality of sheet-like members, for example three or four, can be used in the manner of the present invention and the apparatus of the present invention. In this case, however, all of the sheet-like elements are not completely separated in the first step. Patent Application Affiliated $ relates to the method of the present invention and an advantageous embodiment of the present invention. x The first and second holding forces are preferably used in two successive steps. The accompanying transport device is achieved. Here, the two elements that produce the first and second holding forces are specifically arranged such that they have a common transport plane. Those wafer systems that primarily use the apparatus and method of the present invention are very Thin chip component, where the two wafers are only partially The stack 'must therefore hold the non-overlapping parts with two successive components. Although the first carrier wafers of the two wafers are bonded by the first transporter 9, for example, the belt of the conveyor belt Live, but the wafers in the rear along the transport direction are simultaneously held by the subsequent components (eg, the subsequent belts of the conveyor belt), so that by generating the relative speed of the two belts, the two wafers can be If it is not used in this way, for example, a first transport device can be used to produce the first adhesion force, and a second suction force can be generated by using a suction transport device (the second suction score is obtained / V Λ, Λ: » Λ * 裒 3 is again relatively stationary with the first transport device. Then, using a conveyor belt that runs in a step-by-step manner, a wafer is attached when the second wafer is attached to the pick-up device Stripping, and then placing the second wafer on the first transport device by means of a suction device. At the position of the suction device, a further transport device can be provided which is opposite to the first transport device, and the suction device and the second transport device (It is opposite to the first transport device) In this case, the mutually conforming wafers are held on the surfaces facing away from each other. 201138013 Here, in particular, the other transport device (which is opposite to the rear end of the first transport device (opposite to the traveler a). The distance from the first transport device on the rear end of the direction is changed. This end should use __ 2S IA # 肖-弹簧", which is the same as - to ensure the distance:: change from::: another! Can be adjusted later - eb_ So, the probability of a 曰 文 大大 大大 大大 大大 大大 大大 大大 大大 大大 大大 大大 大大 大大 大大 大大 大大 大大 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Incompletely - in the case of separation, it is preferred to re-deliver in the direction of transport - the path distance - followed by another separation process. This can be advantageously combined, in particular with the separation work carried out by successive transport means. Therefore, it is possible to ensure that there is sufficient area to generate the first and second holding forces by the first and second conveying means. However, since different degrees of overlap occur, it is desirable to maintain the different components on the first or second transport device and to provide the desired time so that further transport using this segment can be reliably separated. According to a further preferred embodiment, 'in the case of a second holding force in the suction device, a setting-driving means is provided, with which the distance of the suction device from the conveying surface of the first conveying device can be adjusted, in this way Even if there are different numbers of wafers that are bonded to each other (for example, two or three), the wafer facing away from the surface of the first transport device and the wafer that is in contact with the suction device and held there can be fixedly held there. Preferred embodiments are shown in the drawings and described in the following description. [Embodiment] The circle 1 shows a two-stage post-separation device, and the components for detecting the mutually adhered wafers and the control driving means described below in connection with Fig. i 201138013 are also present in the devices of Figs. 2 and 3. However, for the sake of brevity, it is not completely rewritten. The device for separating the mutually overlapping sheet-like elements comprises a first conveying device (1). The first conveying device (1) is preferably designed in the form of a conveyor belt, conveyed with a belt (2) '3 and 50% in an endless manner and utilized A first drive roller (3) and a second drive roller (4) operate. The driving belt is driven, so that a driving means (5) is provided, which is applied to at least one of the first driving roller (3) or the second driving roller (4), and the driving means (5) can be directed to the belt (7) The delivery speed is adjusted. The outward side of the belt (2) has a transport plane (6), and the side of the belt (7) facing away from the transport plane (6) is guided along a suction device between the first (3) and second drive rollers (4). . The suction device comprises a channel system (7) which is connected to a pump (8) using a channel system (7) to create a vacuum on the side of the belt (2) facing away from the transport plane (6). The belt (2) should be provided with a slot or other opening σ, so that the medium that has been removed and transported causes a stream of material to pass through the belt (2). It can be seen in the illustrated embodiment that the chip elements fed by any of the previous procedures [for simplicity" they are hereinafter simply referred to as "wafers" are attached to each other. For example, one such wafer (9) (10) can utilize a type of separation, and in this respect it is also stated that the illustrated post-separation operation can be integrated into (iv) the process of the 'off-device. Thus, for example, the first transport device (1) can be used to directly feed the chip component from the stacking device provided in the liquid tank. However, it is equally possible to feed the component from another program (which is independent of the separation of the chip components from::). And the two-piece elements (9) and (10) [they partially overlap] at this time use the movement of the belt 8 201138013 (7) "transportation mu (10) [it is combined with - electronic control device (1 5) - 彳 affixed each other For this purpose, for example; use] can detect: wafer (9) and (1 °) and D, can use an ultrasonic sensor, a sensor of thickness, an optical thickness The sensing method and the uv first sensor (ultraviolet light sensor) can be used to measure the deviation of the thickness from the preset value by measuring the absorption, and it is known to detect the sheet-like 7C pieces that are attached to each other. And used in the prior art, the sensing II (10) is only exemplified on the side, and can also be set on the lower side. The exact setting depends on the detection method used. J. Here, it is detected that there are two chip components. After being attached to each other (and there may be more than two components attached), a second holding force is generated by a vacuum device. The second adhesion is obtained by using a suction device (1)) [it is connected to another fruit (1)]. The first wafer (9) is placed on the transport surface (6) of the belt (2) with its surface facing away from the second wafer (1) and is utilized therewith. The vacuum applies a first holding force, but a second holding force is generated by a holding device [which is formed by the suction (1)) onto the second wafer (10). Here, the second holding force is on the second wafer (10). The back is produced on the surface of the transport plane (6). The suction device (1 3) which is not used as a holding device in the simplified diagram, the distance from the transport plane (6) can be changed. An associated drive means is provided which is controlled by the electronic control unit (15) so that the desired distance from the transport plane (6) can be adjusted depending on the number of wafers (9) (10) to be bonded to each other. In the embodiment, the suction device is arranged to be statically changed with respect to the conveying direction. In this case, the movement cannot be performed in this direction. In this case, the first wafer holding the first holding force on the belt (2) is used. (9) Further shipping, resulting in 201138013
第一（9)和篦-B 〇 —曰曰圓（10)間相對運動’實際上在帶（2)和吸取 器（1 1)間有相對運動。 如虛線箭碩所示，也可利用吸取器（11)的相關的多維式 驅動手段造成相對運動。在此情形’另外也可將帶⑺的速 度變為零。如不用此方式也可將吸取器和帶⑺作運動。 果利用相對運動使第-晶圓(9)從第二晶圓(10)分 開，因此二晶圓互相剝離，則隨後將第二保持力撤掉，因 此第-晶圓（1〇)再保持在運送裝置⑴的帶⑺上。沿箭頭方 向造成進一步的遥# . ^ 運送。為了檢知是否成功地--分開了， 故有另一操控裝詈。μ 裝置此另一刼控裝置包含另一感測器，它 可一如第一感測器作建構。 如不用上述感測器技術，也可利用感測器⑴）⑽檢出 位置。在檢出位置時，在運送之時將該假想之個別晶圓的 一前緣及—後緣檢出，由在運送時，在前緣及後緣掃掠 ( chen)的時間，可計算晶圓的虛擬長度。當晶圓成 功地一一分開或二晶圓屬函蓋相同面積時，此虛擬長度 就和預設晶圓長度一致。 如果利用第二感⑽器⑽配合電子控制單元（15)並未檢 知成功地-一分開，則進一步運送並移交到另一運送裝 置°此另—運送裝置（1’)與第—運送裝置構造相同，因此， 此處配合保持裝置作進—步分離過程。用此方式，還可作 多於一個的先後相隨的分離階段。 為了簡明起見，以下只說明—分離階段。 利用電子控制單元（15)不但可控制第二保持力的產生 10 201138013 置⑴L而且也可控制各種進送’亦即可控制第-運送裝 置（）的㈣手段⑺或第二運送裝置（1，）的驅動手段（5，）。 -運逆梦_不這種分離階段的一第二實施例，此處除了第 運送裝置⑴外同樣設有—第 置（1，）在第_杳说^ %圪牧直u )。第一運送裝 裝置〇二=:時為保持裝置，第-⑴與第二運送 第 b可在晶圓（9)或（10)上產生-第一或 的伴持六。此產生保持力的構件為帶(2)(2，)。在帶(2)上 利用—真空裝置產生，如第-實施例所述。在圖 保持二出，第一晶圓(9)仍單獨地用第-運送裝置⑴ 用真it，/二晶圓(1°)已和第二帶⑺重疊，因在該處利 工 保持力。然後利用不同的帶速度將第一 (9) 晶圓⑽互相剝離。如圖i實施例所述，此處也設有 =-，它們檢出是否成功分離或在輸入端是否還有重疊 器（4〇)作圖示。^見’不對電子控料元（15)和感測 夕巧立^生第&第—保持力的元件[此處為帶（2)及（2，)] & '相對速度分量的作業可藉著提 的速度或減少第-運送裝置（2)料度達成。 最好第運送裝置⑴的速度減少到零，而第二運送裝 ，⑴則進—步作運送。如果在此情形利用—感測器系統[它 ^一段分離距離後定位在第二輸送帶⑴上。此分離距離由 =⑺的長度定義出]不能檢出到第二帶⑽成功地將晶圓 運走，則第-運送裝置⑴繼續作脈動，換言之，第一晶圓 ⑼[第二晶圓(10)仍明顯地附著在其上]要朝向第二運送裝 201138013 置O’)的方向繼續運動。如此，第二晶圓⑽的較大部分的 表面與第二帶（2’）接觸。這種過程當分離未不功時會一直繼 續’直到第二晶圓（1G)在任何情形都被第二運送裝置（1，）運 走為止。在不測的情形中，分離並不成功，且當第二晶圓（丨〇) 在運送時’仍有第__晶圓（9)附著在其上卜齊被運離。 在圖1的第-實施例及在圖2的實施例中，先後相隨 的運送裝置（1)(1,)的運送平面⑹(6，）都設成形成—個共同 在圖2的實施例中特別要注意：杲⑻及（8，）的介質可不 Ί例而言’雖然第-運送裝置⑴可設在一液體盆中並 在該處直接將晶圓從一堆疊一 一分開，但第二運送裝置可 以已設在此液體盆外。 不能將晶圓互相分離，則 (Phchen)或堆疊從程序排 如果在數個先後相隨的晶圓 最後還可將不要分離的成對晶圓 出。 、，你_ γ相對於第一 運送裝置⑴的運送面（6)設有另—運送裝置（16)，第—運送 裝置在以下用與圖"目同的圖號表示，該二運送裳置⑴⑽ 設成使所要分離的晶圓（9)⑽在各帶⑺及（17)的互相朝向 的那-側之間運送，隨著另一運送裝置(16)的運送平面 (2〇)，在分離的情形，該晶圓⑽之背向第—運送裝 的運送平面⑹的那-側施以一第二保持力量。為了 使有不同數目之互相貼合的片狀元件，也能確實地作 後分離，故該另-運送裝置（16)[它由―卜驅動滾子⑽ 12 201138013 形成]的前側係牢$ μ 動，該後端由另一二二送方向的後端可繞著此端轉 有-彈餐㈣另―的第"驅動滾子（19)形成。 另-運送二==之揭帶構件連接，該彈簧將 裝置。因此利用签 送方向的後端施-力到第—運送 送運送裝置⑴運送的片狀元件通過二運 :)(16)之間形成的變細窄的縫 片相貼的晶圓之背向運送平― 確保'雙 帶（17)接觸。在此，另—方㈤⑹的那—側在任何情形可與 兀件不能成功一一分 一片狀 f ^ 月形，也不會有損壞，該另一運 适展罝（16)也有—真空奘罟 (17)]配合。 裝置⑵)⑺），它與保持裝置[以及帶 =的簡化圖顯示一一分離的方法流程，如圖㈠所 这 首先利用一第一谨·?兵驶5? # 送4置將一晶圓或多數晶圓運送（步 驟30)。在運送時，在步 在步驟31可看到兩片或更多的晶圓互 相貼合，然後產生一第― 弟一保持力到該互相貼合的晶圓的至 少另一片晶圓上（步驟32)，装由 其中，在步驟33造成互相貼合 的明圓相對運動，使它們互相撕離。在步驟33造成相對運 動後，操控此成功的分離（步驟34)。如果分離不成功 重複分離過程。 ' 本發明不限於所示實施例，特別是可將所示實施例的 個別構件組合。因&，各種不同之先後相隨的分離階段也 可設計成不同。此外’ 1不需各使用個別的栗以產生真介 或介質流。也可利用m及—相關的通道或管路系 統產生真空，特別是當保持力藉此吸取這類介質而產生時 13 201138013 尤然。 ι圆式簡單說 圖1係 第一例，利用二個沿運 吸取裝置作二階段的後分離作業；、。又置成靜止的 圖2係顯示一種二階段式的後分離作 後相隨之有一共同運送平面的運送裝置；〃 一固先 圖3係顯示一種同樣為二階段式的後分離作業， 一 4固聋σ令僉w m 冰I . * 圖4 係該方法流程的— 【主 要元件符號說明】 ⑴ 第一運送裝置 (1，） 第二運送裝置 (2) 帶 (2，） 帶 (3) 第一驅動滾子 (4) 第—驅動滚子 (5) 驅動手段 (5，) 驅動手段 (6) 運送平面 (6，) 運送平面 ⑺ 通道系統 (8) 泵 14 201138013 (8，） 泵 (9) 晶圓（片狀元件） (10) 晶圓（片狀元件） (11) 吸取器 (12) 泵 (13) 感測器 (14) 感測器 (15) 控制裝置（電子控制單元） (16) 運送裝置 (17) 帶 (18) 第一驅動滾子 (19) 第二驅動滚子 (20) 運送平面 (21) 真空裝置 (22) 真空裝置 (30)〜（34) 步驟 15The relative motion between the first (9) and 篦-B 〇 - 曰曰 (10) actually has a relative motion between the belt (2) and the suction (1 1). As shown by the dashed arrow, the relative multi-dimensional driving means of the suction (11) can also be used to cause relative motion. In this case, the speed of the belt (7) can also be changed to zero. The suction and belt (7) can also be moved without this. If the relative movement is used to separate the first wafer (9) from the second wafer (10), the two wafers are detached from each other, and then the second holding force is removed, so the first wafer (1 〇) is retained. On the belt (7) of the transport device (1). In the direction of the arrow, cause further teleports. . ^ Shipping. In order to detect whether it was successfully--separated, there is another control device. μ Device This other monitoring device contains another sensor that can be constructed as a first sensor. If the above sensor technology is not used, the position can also be detected by the sensor (1)) (10). When the position is detected, a leading edge and a trailing edge of the imaginary individual wafer are detected at the time of transportation, and the time can be calculated at the time of sweeping at the leading edge and the trailing edge during transportation. The virtual length of the circle. When the wafer is successfully separated one by one or two wafers cover the same area, the virtual length is the same as the preset wafer length. If the second sensing device (10) is used in conjunction with the electronic control unit (15) and is not detected to be successfully separated, it is further transported and handed over to another transport device. The other transport device (1') and the first transport device The construction is the same, so that the holding device is used here for the step-by-step separation process. In this way, more than one successive separation phase can be used. For the sake of brevity, the following only illustrates the separation phase. The use of the electronic control unit (15) not only controls the generation of the second holding force 10 201138013 (1) L but also controls the various feedings, ie the (four) means (7) or the second conveying means (1, which can control the first conveying means). ) The driving means (5,). - Operational Dreams - A second embodiment of this separation phase, here in addition to the first transport device (1) - is also provided - the first (1,) in the first _ 杳 ^ 圪 圪 。 。 。 。 。 。. The first transport device 〇2 =: is the holding device, and the -(1) and the second transport b may generate a first or a companion six on the wafer (9) or (10). The member that generates the holding force is the belt (2) (2,). It is produced on the belt (2) by means of a vacuum device as described in the first embodiment. In the figure, the first wafer (9) is still separately used by the first transport device (1) with the true it, / the second wafer (1 °) has overlapped with the second strip (7), because the work is maintained here. . The first (9) wafers (10) are then peeled off each other using different tape speeds. As shown in the embodiment of Fig. i, there is also a =-, which detects whether the separation is successful or whether there is an overlap (4〇) at the input. ^See 'No Electronic Control Element (15) and Sensing 巧 立 ^ 第 & & 第 第 第 第 第 第 第 保持 保持 保持 [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ This can be achieved by the speed of the lifting or by reducing the mass of the first transport device (2). Preferably, the speed of the first transport device (1) is reduced to zero, and the second transport device, (1), is transported. If in this case the sensor system is used [it ^ is positioned on the second conveyor belt (1) after a separation distance. The separation distance is defined by the length of = (7)] cannot be detected until the second belt (10) successfully transports the wafer, and the first transport device (1) continues to pulsate, in other words, the first wafer (9) [the second wafer ( 10) Still apparently attached thereto] to continue moving in the direction of the second transport assembly 201138013 O'). As such, the surface of the larger portion of the second wafer (10) is in contact with the second strip (2'). This process continues until the separation is not completed until the second wafer (1G) is transported by the second transport device (1) in any case. In the event of an accident, the separation was not successful, and when the second wafer (丨〇) was shipped, the first wafer (9) was attached to it and was transported away. In the first embodiment of Fig. 1 and the embodiment of Fig. 2, the transport planes (6) (6,) of the successive transport devices (1) (1,) are all formed to form a common implementation in Fig. 2. In particular, it should be noted that the media of 杲(8) and (8,) can be used as an example. 'Although the first transport device (1) can be placed in a liquid basin and directly separate the wafers from one stack to one at a time, but The second transport device may already be located outside of the liquid basin. If the wafers cannot be separated from each other, then (Phchen) or stacking from the program row. If there are several successive wafers, the paired wafers that are not separated can be finally discharged. , _ γ is provided with another transport device (16) with respect to the transport surface (6) of the first transport device (1), and the first transport device is represented by the same figure as the figure below. The set (1) (10) is arranged such that the wafers (9) (10) to be separated are transported between the mutually facing sides of the strips (7) and (17), with the transport plane (2〇) of the other transport device (16), In the case of separation, a side of the wafer (10) facing away from the side of the transport plane (6) of the first transport is subjected to a second holding force. In order to allow a different number of mutually conforming chip components to be reliably separated, the front side of the further transport device (16) [which is formed by the "buck drive roller (10) 12 201138013] is fastened to $ μ. The rear end of the rear end can be formed by the other end of the second and second directions of the direction of the "mechanical meal" (four) and the other "drive roller" (19). In addition - the delivery of the two == strip member connection, the spring will be the device. Therefore, the sheet-like member conveyed by the trailing end of the carrying direction to the first transport conveying device (1) passes through the opposite side of the wafer which is formed by the thinning slit formed between the two: (16) Shipping flat - Make sure the 'double belt (17) is in contact. Here, the side of the other side (5) (6) can be in any case and can not be successfully formed in a piece of shape, and there will be no damage. The other transport is also a vacuum.奘罟(17)] cooperate. Device (2)) (7)), which is separate from the holding device [and the simplified diagram of the band = display method, as shown in Figure (1). First, use a first squadron to send 5? Or a majority of wafer shipments (step 30). When transporting, in step 31, two or more wafers can be seen to be bonded to each other, and then a first-child force is applied to at least one other wafer of the mutually bonded wafers. 32), wherein, in step 33, the opposite sides of the open circle which are caused to adhere to each other are caused to move away from each other. After the relative motion is caused in step 33, this successful separation is manipulated (step 34). If the separation is not successful, repeat the separation process. The invention is not limited to the illustrated embodiment, and in particular the individual components of the illustrated embodiment may be combined. Because of &, the different stages of separation can also be designed to be different. In addition, it is not necessary to use individual pumps to generate a real media or medium stream. It is also possible to use m and associated channels or piping systems to create a vacuum, especially when holding forces to draw such media. 13 201138013 Especially. The ι round type is simple. Figure 1 is the first example, using two suction suction devices for the second stage of the post-separation operation; Figure 2, which is again set to stand still, shows a two-stage post-separation as a post-phase with a common transport plane transport device; 〃一固先图3 shows a post-separation operation that is also a two-stage type, a 4固聋 佥 佥 wm ice I. * Figure 4 is the flow of the method - [Main component symbol description] (1) First transport device (1,) Second transport device (2) Belt (2,) Belt (3) A drive roller (4) No. - Drive roller (5) Drive means (5,) Drive means (6) Transport plane (6,) Transport plane (7) Channel system (8) Pump 14 201138013 (8,) Pump (9 ) Wafer (chip component) (10) Wafer (chip component) (11) Suction device (12) Pump (13) Sensor (14) Sensor (15) Control device (electronic control unit) ( 16) Conveying device (17) Belt (18) First drive roller (19) Second drive roller (20) Transport plane (21) Vacuum device (22) Vacuum device (30) ~ (34) Step 15