201138010 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種封裝用基板固定裝置及半導體 曰曰片封裝體的製造方法，特別有關於一種用於晶片型覆 晶封裝基板固定裝置及晶片型覆晶封裝體的製造方法。 【先前技術】 傳統晶片型覆晶封裝技術（Flip chip csp，簡稱 fcCSP) ’將晶片翻轉後，以面朝下的方式透過金屬導體 與積層基板（laminated substrate)進行接合，廣泛地運用在 需要咼性能、高速與高密度，以及小尺寸封裝的元件上。 隨著半導體裝置的尺寸微縮，電性連接凸塊的間距 也隨之逐漸縮小。若使用傳統的晶片型覆晶封裝技術， 將晶片倒置貼附於積層基板時，因積層基板受外力發生 翹曲，使得相鄰凸塊之間易發生橋接，或者形成非常脆 性的冷焊點（cold joint)。特別是，在將晶片取置於積層基 板上的步驟時，並未以固定治具固定，在經過迴焊 後，接著在進行後續去除助焊劑的清洗製程時，才使用 治具固定積層基板邊緣。然而，在取置晶片於積層基板 上的步驟時，已容易造成積層基板翹曲，導致凸塊間橋 接或冷焊點缺陷。就其本身而論，業界所亟需一種封譽 用基板固定裝置及半導體晶片封裝體的製造方法，能有 效地避免凸塊間橋接或冷焊點缺陷，並且避免在去除助 焊劑的清洗製程後，造成助焊劑及容易殘留。 〇503-A34739TWF/jamngwo 4 201138010 【發明内容】 根據本發明之一實施例，一種封裝用基板固定裝 置’包括>底板；-積層基板，具有多個晶片置晶區 =至少—晶片接合；以及—上固^蓋板，藉由磁力或 機械力將該積層基板平整地固定在該底板和該上蓋固定 板之間；其中該上蓋固定板具有多則口區域^該些 晶片置晶區域。[Technical Field] The present invention relates to a substrate fixing device for packaging and a method for manufacturing a semiconductor chip package, and more particularly to a wafer type flip chip package substrate fixing device and A method of manufacturing a wafer type flip chip package. [Prior Art] A conventional wafer-type flip chip package (Flip chip csp, abbreviated as fcCSP) 'When the wafer is turned over, the metal conductor is bonded to the laminated substrate in a face-down manner, and is widely used in the need. Performance, high speed and high density, as well as components in small package sizes. As the size of the semiconductor device is reduced, the pitch of the electrical connection bumps is also gradually reduced. When the conventional wafer type flip chip packaging technology is used, when the wafer is inverted and attached to the laminated substrate, the laminated substrate is warped by an external force, so that bridging between adjacent bumps is liable to occur, or a very brittle cold solder joint is formed ( Cold joint). In particular, when the wafer is placed on the laminated substrate, it is not fixed by the fixing jig, and after the reflowing, and then the cleaning process for the subsequent removal of the flux is performed, the jig is used to fix the edge of the laminated substrate. . However, when the step of taking up the wafer on the laminated substrate, the laminated substrate is easily warped, resulting in bridging between the bumps or cold solder joint defects. As far as it is concerned, there is a need in the industry for a method for manufacturing a substrate fixing device and a semiconductor chip package, which can effectively avoid bridging or cold solder joint defects and avoid the cleaning process after removing the flux. , causing flux and easy residue. 〇503-A34739TWF/jamngwo 4 201138010 SUMMARY OF THE INVENTION According to one embodiment of the present invention, a substrate fixing device for packaging 'includes> a substrate; a laminated substrate having a plurality of wafer crystallographic regions = at least - wafer bonding; The upper cover plate is fixedly fixed between the bottom plate and the upper cover fixing plate by magnetic force or mechanical force; wherein the upper cover fixing plate has a plurality of mouth regions.
”根據本發明另—實施例，—種半導體晶片封裝體的 製造方法，包括：提供一封裝用基板固定裝置，其包括 一底板、一積層基板具有多個晶片置晶區域供至少;一晶 ^合、以及-上較蓋板藉由磁力或機械力將該積層 土，平整地固定在該底板和該上蓋固定板之間，其中該 上蓋固定板具有多個開口區域對應該些晶片置晶區域； 將-晶片反轉覆置於該積層基板的該晶片置晶區域上· 將含晶片的該封裝用基板固定裝置進行一迴焊製程；以 含去離子水及溶劑的―溶液清洗該含晶片㈣封裝用基 板固定裝置，以去除殘留助焊劑。 為使本發明能更明顯易懂，下文特舉實施例，並配 合所附圖式，作詳細說明如下： 【實施方式】 以下以各實施例詳細說明並伴隨著 例:做為本發狀參考㈣。在圖式或㈣#描=& 相似或相同之部分皆使用相同之圖號。且在圖式中，實 施例之形狀或是厚度可擴大’並以簡化或是方便標示。 Γ· t 〇503-A34739TWF/jamngwo 5 201138010 再$ ®式中各元件之部分將以分別描述說明之，值 =意的是’圖中未綠示或描述之元件’為所屬技術領域 中具有通常知識者所知的形式，另外，特定之實施例僅 為揭不本發明使用之特定方式，其並非用以限定本發明。 第1A圖顯示根據本發明之一實施例的封裝用 固疋裝置的立體示意圖，第1B圖顯示第1A圖的封裝用 基板固定裝置的剖面示意圖。於第1A、1B圖中，一封裝 用基板岐《置1()〇包括—底板15G、—積層基板H 具有多個晶片置晶區域！ 35供至少一晶片〗6〇接合，及 一上盍固定板110具有多個開口區域125對應該些晶片 置晶區域135。應瞭解的是，在去除助焊劑的過程中，為 了使得去離子水和溶劑所構成的溶液容易排除，在設計 上，上蓋固定板11〇的厚度τ應小於或等於晶片16〇的 厚度。多個固定孔洞（pinh〇le)ll5設置於上蓋固定板u〇 的周邊區域126。該些固定孔洞115與底板的釘樁（guide pin)用以與底板的釘樁（guide pin)結合而固定上蓋固定板 11〇、積層基板130和底板150。上蓋固定板11()的開口 區域内包括格子狀的細帶122，分隔陣列中的各晶片。 第2A圖顯示根據本發明另一實施例的封裝用基板 固定裝置的立體示意圖，第2B圖顯示第2A圖的封裝用 基板固定裝置的剖面示意圖。於第2A、2B圖中，一封裝 用基板固定裝置200包括一底板250、一積層基板230， 具有多個晶片置晶區域235供至少一晶片260接合，及 一上蓋固定板210具有多個開口區域225對應該些晶片 置晶區域235。於此實施例中，各個晶片置晶區域235可 0503-A34739TWF/jamngwo 6 201138010 供一陣列式晶片260黏附。多個固定孔洞2丨5設置於上 盍固疋板210的周邊區域。該些固定孔洞215用以與底 板的釘樁（guide pin)結合而固定上蓋固定板21〇、積層基 板230和底板250。應瞭解的是，相鄰兩開口區域2乃之 間具有一寬帶228，其中寬帶228的寬度D大於積層基 板的一切割槽2 3 2白勺S度d，但小於兩組相鄰陣列式晶片 之間的間距D’。再者’在去除助焊劑的過程中，為了使 得去離子水和溶劑所構成的溶液容㈣除，在設計上該 上蓋固定板UG的厚度了應小於或等於該W 160的厚 第3A圖顯示根據本發明另一實施例的封裝用基板 固疋裝置的立體示意圖，帛3B圖顯示第3A目的封裝用 基板固定裝置的分解示意圖。於第3A'3B圖中，一上蓋 固疋板310包括第一固定構件31〇a和第二固定構件 310b該第g]定構件31()a為一頂蓋環，壓附該第二固 定構件31Gb的邊緣，其中該頂蓋環的外圍具有多個扣環 318 ’以固定底板、積層基板、上固定蓋板、和頂蓋環。 第二固定構件31Gb相似於第1圖的上蓋固定板 110 ’、具有多個開口區域325對應晶片置晶區域。多個固 =孔洞315叹置於上蓋固定板31G的周邊區域。該些固 疋孔洞315用以固疋上盍固定板、積層基板和底板。同 樣地’第二固定構件·的開口區域内包括格子狀的细 帶322，分隔陣列中的各晶片。According to another embodiment of the present invention, a method of manufacturing a semiconductor chip package includes: providing a substrate fixing device for packaging, comprising: a bottom plate; and a laminated substrate having a plurality of wafer dicing regions for at least; And the upper cover plate is fixedly fixed between the bottom plate and the upper cover fixing plate by magnetic force or mechanical force, wherein the upper cover fixing plate has a plurality of opening regions corresponding to the wafer crystallization regions And reversing the wafer on the wafer dicing region of the laminated substrate, performing a reflow process on the wafer-containing substrate fixing device, and cleaning the wafer with a solution containing deionized water and a solvent. (4) Substrate fixing device for encapsulation to remove residual flux. In order to make the present invention more comprehensible, the following specific embodiments will be described in detail below with reference to the accompanying drawings: [Embodiment] The detailed description is accompanied by an example: as a reference for the hair style (4). The same figure number is used in the similar or identical parts of the drawing or (4)# description, and in the drawings, the embodiment Shape or thickness can be expanded' and simplified or conveniently marked. Γ·t 〇503-A34739TWF/jamngwo 5 201138010 The parts of each component in the $® formula will be described separately, the value = meaning is in the figure The elements that are not shown or described in the art are known to those of ordinary skill in the art, and the specific embodiments are not intended to limit the invention, and are not intended to limit the invention. FIG. 1B is a schematic cross-sectional view showing a package fixing device according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view showing the package substrate fixing device of FIG. 1A. In FIGS. 1A and 1B, a package substrate is placed. 1()〇 includes a bottom plate 15G, a laminated substrate H having a plurality of wafer dicing regions! 35 for at least one wafer splicing, and an upper yoke fixing plate 110 having a plurality of opening regions 125 for aligning the wafers Area 135. It should be understood that in the process of removing the flux, in order to facilitate the elimination of the solution composed of deionized water and solvent, the thickness τ of the upper cover fixing plate 11〇 should be less than or equal to the wafer 16 in design. The thickness of the crucible. A plurality of fixing holes 151 are disposed in the peripheral region 126 of the upper cover fixing plate u. The fixing holes 115 and the guide pin of the bottom plate are used for the pegs of the bottom plate (guide pin) The upper cover fixing plate 11 〇, the laminated substrate 130 and the bottom plate 150 are fixedly combined. The open area of the upper cover fixing plate 11 () includes a lattice-shaped thin strip 122 that separates the wafers in the array. FIG. 2A shows another according to the present invention. FIG. 2B is a schematic cross-sectional view showing the substrate fixing device for packaging according to FIG. 2A. In FIGS. 2A and 2B, a substrate fixing device 200 for packaging includes a bottom plate 250, A laminate substrate 230 having a plurality of wafer dicing regions 235 for bonding at least one wafer 260, and an upper lid fixing plate 210 having a plurality of opening regions 225 corresponding to the wafer dicing regions 235. In this embodiment, each wafer etched region 235 can be bonded to an array of wafers 260 by 0503-A34739TWF/jamngwo 6 201138010. A plurality of fixing holes 2丨5 are provided in a peripheral region of the upper tamping plate 210. The fixing holes 215 are used to couple the upper cover fixing plate 21, the laminated substrate 230 and the bottom plate 250 in combination with a guide pin of the bottom plate. It should be understood that the adjacent two open regions 2 have a wide band 228 therebetween, wherein the width D of the broadband 228 is greater than the S degree d of a cutting groove 2 3 2 of the laminated substrate, but less than two sets of adjacent array wafers. The spacing between D'. Furthermore, in the process of removing the flux, in order to remove the solution volume of the deionized water and the solvent, the thickness of the upper cover fixing plate UG should be less than or equal to the thickness of the W 160. 3 is a perspective view showing a substrate fixing device for packaging according to another embodiment of the present invention, and FIG. 3B is an exploded perspective view showing a substrate fixing device for packaging according to a third aspect. In the 3A′3B diagram, an upper cover fixing plate 310 includes a first fixing member 31〇a and a second fixing member 310b. The first fixing member 31()a is a top cover ring, and the second fixing is pressed. The edge of the member 31Gb, wherein the periphery of the top cover ring has a plurality of buckles 318' to fix the bottom plate, the laminated substrate, the upper fixed cover, and the top cover ring. The second fixing member 31Gb is similar to the upper cover fixing plate 110' of Fig. 1, and has a plurality of opening regions 325 corresponding to the wafer dicing regions. A plurality of solid holes 315 are slid to the peripheral region of the upper cover fixing plate 31G. The fixing holes 315 are used to fix the upper fixing plate, the laminated substrate and the bottom plate. Similarly, the opening region of the second fixing member includes a lattice-shaped strip 322 which partitions each wafer in the array.
第A圖·，、員不根據本發明另一實施例的封裝用基板 固定裝置的立體示意圖，第犯圖顯示第4A^_U 〇503-A34739TWF/jamngwo 7 201138010 基板固定裝置的週邊區域4B的局部放大示意圖。於第 4A、4B圖中，一封裝用基板固定裝置400包括一底板 450、一積層基板430，具有多個晶片置晶區域供至少一 晶片接合，及一上蓋固定板410具有多個開口區域425 對應該些晶片置晶區域。於一實施例中，底板450鑲有 多個磁石458以將積層基板430平整地固定在底板450 和上蓋固定板410之間。上蓋固定板410具有固定孔洞 415，用以與底板的釘樁（guide pin) 416結合而固定上蓋 固定板410、積層基板430和底板450。於另一實施例中， 底板450具有多個真空吸孔455以吸附積層基板430。 再者，多個固定孔洞415設置於上蓋固定板410的 周邊區域426。上蓋固定蓋板410的週邊區域426具有多 條暗溝428，連接些開口區域425與外界。第4C圖顯示 第4A圖的封裝用基板固定裝置400的組合後的上視圖， 第4D圖顯示第4C圖的封裝用基板固定裝置400的剖面 示意圖。於第4D圖中，藉由上蓋固定蓋板410可將積層 基板430平整地壓附並固定在底板450上，以避免積層 基板430發生翹曲。應瞭解的是，在去除助焊劑的過程 中，為了使得去離子水和溶劑所構成的溶液容易透過暗 溝428排除至外界，在設計上，上蓋固定板410的厚度T 應大於晶片的厚度，並且大於暗溝428的高度T1。 第5A圖顯示根據本發明另一實施例的封裝用基板 固定裝置500的組合後的上視圖，第5B圖顯示第5A圖 的封裝用基板固定裝置500的剖面示意圖，第5C圖顯示 第5A圖的封裝用基板固定裝置的週邊區域5C的局部放 0503-A34739TWF/jamngwo 8 201138010 大示意圖。於第5A、5B圖中，一封裝用基板固定裝置 500包括一底板550、一積層基板530，具有多個晶片置 晶區域535供至少一晶片560接合，及一上蓋固定板510 具有多個開口區域525對應晶片的置晶區域535。上蓋固 定板510包括格子狀的細帶522,分隔陣列中的各晶片位 置。於此實施例中，上蓋固定蓋板510的週邊區域具有 多條溝道528。應瞭解的是，在去除助焊劑的過程中，為 了使得去離子水和溶劑所構成的溶液容易透過溝道528 φ 排除至外界，連接開口區域525與外界。上蓋固定板510 的週邊區域為一階梯形緊靠積層基板530，具有一凸出部 526，其中溝道528的底部與積層基板530大約等高度。 第6A圖顯示根據本發明另一實施例的封裝用基板 固定裝置600的組合後的上視圖，第6B圖顯示第6A圖 的封裝用基板固定裝置600的剖面示意圖，第6C圖顯示 第6A圖的封裝用基板固定裝置的週邊區域6C的局部放 大示意圖。於第6A-6C圖中，一封裝用基板固定裝置600 • 實質上相似於第5A-5C圖實施例所描述述的封裝用基板 固定裝置500，為求簡明之故，在此省略相同的敘述。不 同之處在於，上蓋固定板610的週邊區域為一階梯形， 緊壓在積層基板630的邊緣，具有一凸出部626,其中溝 道628的底部實質上高於與積層基板630的表面，以利 助焊劑清洗溶液透過溝道628排除至外界。 根據本發明實施例，可利用上述封裝用基板固定裝 置100-600進行晶片型覆晶封裝的製造。例如，提供上述 封裝用基板固定裝置，並將一晶片反轉覆置於積層基板§ 0503-A34739TWF/jamngwo 9 201138010 的晶片的置晶區域上，接著， 定裝置進行-迴焊製程，以含去‘:曰片的封裝用基板固 清洗含晶片的料絲㈣定；7水γ㈣一溶液 劑，其中將晶片反轉覆置步驟㈣，以去除殘留助烊 留助焊劑步驟是在一連續式製程及清洗去除殘 基板受到上蓋固定板平中進行。由於積層 . A十正的屋覆，因此在覆晶步驟時， 二：3曲：造成的凸塊間橋接或冷焊'_ 、a ’藉由在上蓋固定板的週邊區域設置溝 =溝，在去除助焊劑的過程中，能夠完全將去助二 丄谷液排除至外界，避免助焊劑及溶液殘留。再者，由 =本發明^施例的封裝用基板固以置可將底板、積層 二板及上盍固定板整體固定，可適用於連續性的晶片型 覆晶封震的製造過程中，降低因中斷製程，受外力所造 成的超低介電常數介電層脫層（ELK de-lamination)。 —本發明雖以各種實施例揭露如上，然其並非用以限 疋本發明的範圍，任何所屬技術領域中具有通常知識 者，在不脫離本發明之精神和範圍内，當可做些許的更 動與潤飾。本發明之保護範圍當視後附之申請專利範圍 所界定者為準。 〇503-A34739TWF/jamngwo 10 201138010 【圖式簡單說明】 固定ΐ詈^圖顯不根據本發明之一實施例的封裝用基板 固疋裝置的立體示意圖。 示音ΐ 圖顯不第1Α圖的封裝用基板固定裝置的剖面 固定ί詈圖Γ不根據本發明另—實施例的封裝用基板 固疋裝置的立體示意圖。 示意^⑶圖顯示第2Α圖的封㈣基板固定《置的剖面 ^3^圖顯示根據本發明另—實施例的 固疋裝置的立體示意圖。 示意圖顯示第3Α圖的封裝用基板固定裝置的分解 ，二圖顯讀據本發明另_實施例的封裝用基板 固疋裝置的立體示意圖。 第4Β圖顯示第4Α圖的封装用基 區域4Β的局部放大示意圖。 疋裝置的週遺 第4C圖顯示第4Α圖的封奘用 組合後的上視圖。㈣裝用基板固定裝置棚的 第^圖顯示第4C圖的封敦用基板固定裝置4 剖面不意圖。 第5A圖顯示根據本發明另—實_㈣ 固定裝置500的組合後的上視圖。 又土 第5B圖顯示第5A圖的封裝用基板 剖面示意圖。 的 〇503-A34739TWF/jamngW< 11 201138010 第5C圖顯示第5A圖的封裝用基板固定裝置的週邊 區域5C的局部放大示意圖。 第6A圖顯示根據本發明另一實施例的封裝用基板 固定裝置600的組合後的上視圖。 第6B圖顯示第6A圖的封裝用基板固定裝置600的 剖面示意圖。 第6C圖顯示第6A圖的封裝用基板固定裝置的週邊 區域6C的局部放大示意圖。 【主要元件符號說明】 100、200、300、400、500、600〜封裝用基板固定裝 置； 110、210、310、410、510、610〜上蓋固定板； 115、215、315、415〜固定孔洞； 416〜底板釘樁； 122、322、422、522、622〜格子狀的細帶； 125、 225、325、425、525、625〜開口 區域； 126、 226、426〜上蓋固定板的周邊區域； 130、230、430、530、630〜積層基板； 135、235、535、635〜晶片置晶區域； 150、250、450、550、650〜底板； 160、260、560、660〜晶片； 228〜寬帶； 232〜切割槽； 310a〜第一固定構件； 0503-A34739TWF/jamngwo 12 201138010 310b〜第二固定構件； 318〜扣環； 455〜真空吸孔； 45 8〜磁石， 428〜暗溝； 526、626〜凸出部； 528、628〜溝道； T〜上蓋固定板的厚度； T1〜暗溝的高度； D〜寬帶的寬度； D’〜兩組陣列式晶片之間的間距； d〜切割槽的寬度。FIG. A is a perspective view showing a substrate fixing device for a package according to another embodiment of the present invention, and the first diagram shows a portion of the peripheral region 4B of the substrate fixing device of the 4A^_U 〇503-A34739TWF/jamngwo 7 201138010. Zoom in on the schematic. In FIG. 4A and FIG. 4B, a package substrate fixing device 400 includes a bottom plate 450, a laminated substrate 430 having a plurality of wafer dicing regions for bonding at least one wafer, and an upper cover fixing plate 410 having a plurality of opening regions 425. The wafer area is corresponding to some wafers. In one embodiment, the bottom plate 450 is embedded with a plurality of magnets 458 to planarly secure the laminated substrate 430 between the bottom plate 450 and the upper cover fixing plate 410. The upper cover fixing plate 410 has a fixing hole 415 for fixing the upper cover fixing plate 410, the laminated substrate 430, and the bottom plate 450 in combination with a guide pin 416 of the bottom plate. In another embodiment, the bottom plate 450 has a plurality of vacuum suction holes 455 for adsorbing the laminated substrate 430. Furthermore, a plurality of fixing holes 415 are provided in the peripheral region 426 of the upper cover fixing plate 410. The peripheral region 426 of the upper cover fixing cover 410 has a plurality of dark grooves 428 connecting the open areas 425 to the outside. Fig. 4C is a top view showing the combination of the package substrate fixing device 400 of Fig. 4A, and Fig. 4D is a schematic cross-sectional view showing the package substrate fixing device 400 of Fig. 4C. In Fig. 4D, the laminated substrate 430 can be flatly pressed and fixed on the bottom plate 450 by the upper cover fixing cover 410 to prevent warpage of the laminated substrate 430. It should be understood that in the process of removing the flux, in order to allow the solution composed of deionized water and solvent to be easily removed to the outside through the dark trench 428, the thickness T of the upper cover fixing plate 410 should be designed to be larger than the thickness of the wafer, and Greater than the height T1 of the dark trench 428. 5A is a top view showing a combination of a substrate fixing device 500 for packaging according to another embodiment of the present invention, and FIG. 5B is a cross-sectional view showing a substrate fixing device 500 for packaging according to FIG. 5A, and FIG. 5C is a view showing a fifth embodiment. The partial area of the peripheral region 5C of the substrate fixing device for packaging is 0503-A34739TWF/jamngwo 8 201138010. In the 5A and 5B drawings, a package substrate fixing device 500 includes a bottom plate 550, a laminated substrate 530, a plurality of wafer morphing regions 535 for bonding at least one wafer 560, and an upper cover fixing plate 510 having a plurality of openings. Region 525 corresponds to the crystallized region 535 of the wafer. The upper cover fixing plate 510 includes a lattice-like thin strip 522 that separates the positions of the respective wafers in the array. In this embodiment, the peripheral region of the upper cover fixing cover 510 has a plurality of channels 528. It should be understood that in the process of removing the flux, in order to allow the solution of deionized water and solvent to be easily removed to the outside through the channel 528 φ, the open region 525 is connected to the outside. The peripheral region of the upper cover fixing plate 510 is a stepped shape against the laminated substrate 530, and has a protruding portion 526, wherein the bottom of the channel 528 is approximately equal in height to the laminated substrate 530. 6A is a top view showing a combination of a substrate fixing device 600 for packaging according to another embodiment of the present invention, and FIG. 6B is a cross-sectional view showing a substrate fixing device 600 for packaging according to FIG. 6A, and FIG. 6C is a view showing a sixth embodiment. A partially enlarged schematic view of a peripheral region 6C of the substrate fixing device for packaging. In FIG. 6A-6C, a package substrate fixing device 600 is substantially similar to the package substrate fixing device 500 described in the fifth embodiment of FIG. 5A-5C. For the sake of brevity, the same description will be omitted herein. . The difference is that the peripheral portion of the upper cover fixing plate 610 has a stepped shape and is pressed against the edge of the laminated substrate 630, and has a protruding portion 626, wherein the bottom of the channel 628 is substantially higher than the surface of the laminated substrate 630. The flux cleaning solution is removed to the outside through the channel 628. According to the embodiment of the present invention, the wafer-type flip chip package can be manufactured by the above-described package substrate fixing device 100-600. For example, the above-mentioned substrate fixing device for packaging is provided, and a wafer is reversely overlaid on a crystallized region of a wafer of a laminated substrate § 0503-A34739TWF/jamngwo 9 201138010, and then the device is subjected to a reflow process to include ': The substrate for encapsulation of the crucible is solid-cleaned with the wafer-containing filament (4); 7 water γ (tetra)-solution, wherein the wafer is reversed and coated (IV) to remove the residual desorption flux step in a continuous process And cleaning and removing the residual substrate is carried out by the upper cover fixing plate. Because of the stacking. A ten-square roof, so in the flip-chip step, two: 3: the resulting bridging or cold welding of the bumps '_, a' by providing grooves = grooves in the peripheral area of the upper cover fixing plate, In the process of removing the flux, the decoction solution can be completely removed to the outside to avoid flux and solution residue. Furthermore, the substrate for packaging according to the embodiment of the present invention can be fixed by integrally fixing the bottom plate, the laminated second plate and the upper plate fixing plate, and is suitable for use in a continuous wafer-type flip chip sealing process. Due to the interrupt process, the ultra-low dielectric constant dielectric layer delamination (ELK de-lamination) is caused by external force. The present invention has been disclosed in the above various embodiments, and is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can make a few changes without departing from the spirit and scope of the invention. With retouching. The scope of the invention is defined by the scope of the appended claims. 〇503-A34739TWF/jamngwo 10 201138010 [Simplified Schematic] A schematic diagram of a substrate fixing device according to an embodiment of the present invention is not shown. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 3(3) is a perspective view showing the structure of a fixing device according to another embodiment of the present invention. The schematic view shows an exploded view of the package substrate fixing device of the third drawing, and the second drawing shows a perspective view of the package substrate fixing device according to another embodiment of the present invention. Fig. 4 is a partially enlarged schematic view showing the package base region 4A of Fig. 4; The circumstance of the 疋 device Fig. 4C is a top view showing the combination of the sealing of the fourth drawing. (4) Mounting of the substrate fixing device shed Fig. 4 shows the cross-sectional view of the sealing substrate fixing device 4 of Fig. 4C. Fig. 5A shows a top view of the combination of the other-solid (four) fixing device 500 according to the present invention. Fig. 5B is a cross-sectional view showing the package substrate of Fig. 5A. 〇503-A34739TWF/jamngW<11 201138010 Fig. 5C is a partially enlarged schematic view showing a peripheral region 5C of the package substrate fixing device of Fig. 5A. Fig. 6A is a top plan view showing the combination of the substrate fixing device 600 for packaging according to another embodiment of the present invention. Fig. 6B is a cross-sectional view showing the package substrate fixing device 600 of Fig. 6A. Fig. 6C is a partially enlarged schematic view showing a peripheral region 6C of the package substrate fixing device of Fig. 6A. [Description of main component symbols] 100, 200, 300, 400, 500, 600~ package substrate fixing device; 110, 210, 310, 410, 510, 610~ upper cover fixing plate; 115, 215, 315, 415~ fixing hole ; 416 ~ bottom plate nail pile; 122, 322, 422, 522, 622 ~ grid-like thin strip; 125, 225, 325, 425, 525, 625~ open area; 126, 226, 426~ peripheral area of the upper cover fixing plate 130, 230, 430, 530, 630~ laminate substrate; 135, 235, 535, 635~ wafer etched area; 150, 250, 450, 550, 650~ bottom plate; 160, 260, 560, 660~ wafer; ~ Broadband; 232~ cutting slot; 310a~ first fixing member; 0503-A34739TWF/jamngwo 12 201138010 310b~ second fixing member; 318~ buckle ring; 455~vacuum suction hole; 45 8~ magnet, 428~ditch; , 626~ bulging portion; 528, 628~ channel; T~ thickness of upper cover fixing plate; height of T1~ditch; D~width of broadband; D'~ spacing between two arrays of wafers; d~cutting The width of the slot.
0503-A34739TWF/jamngwo0503-A34739TWF/jamngwo