TW201137478A - TFT array substrate and LCD panel - Google Patents
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- TW201137478A TW201137478A TW99116605A TW99116605A TW201137478A TW 201137478 A TW201137478 A TW 201137478A TW 99116605 A TW99116605 A TW 99116605A TW 99116605 A TW99116605 A TW 99116605A TW 201137478 A TW201137478 A TW 201137478A
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201137478 六、發明說明: 【發明所屬之技術領域】 本發明提供一種液晶顯示器,特別是一種 液晶顯示器之液晶面板的薄膜電晶體陣列基 5 板,其具有網狀結構之共通線,以降低電阻、電 谷所造成的訊號延遲效應。 【先前技術】 —般而言,液晶顯示器(Liquid Crystal Display,LCD)可以藉由分別地提供對應於晝面 1〇資料之資料訊號至液晶盒(Liquid Crystal Cell ),5周整液晶盒的光穿透率以 查二欠 料。液晶顯示器則包含:具有矩陣排列液晶盒2 液晶面板,以及驅動用之積體電路(Integr=ted201137478 VI. Description of the Invention: [Technical Field] The present invention provides a liquid crystal display, in particular, a thin film transistor array substrate 5 of a liquid crystal panel of a liquid crystal display, which has a common line of a mesh structure to reduce resistance, The signal delay effect caused by the electricity valley. [Prior Art] In general, a liquid crystal display (LCD) can provide a light signal corresponding to the data of the surface to the liquid crystal cell (Liquid Crystal Cell) separately, and the light of the liquid crystal cell is 5 weeks. The penetration rate is checked for two defects. The liquid crystal display includes: a liquid crystal panel with a matrix array 2 liquid crystal panel, and an integrated circuit for driving (Integr=ted
Circuit,1C)。 15 液晶面板還包括:一彩色濾光片基板、一 薄膜電晶體陣列基板,其對應於該彩色遽光片基 板、以及一夾於該彩色渡光片基板與該薄膜電晶 $陣列基板間之液晶層。薄膜電晶體陣列基板包 含:用以傳輸由資料驅動積體電路所提供之資料 2。,至液晶盒之資料線,以及用以傳輪由閘極驅 ^積體電路所提供之掃猫訊號之間極線,其中液 晶盒係由彼此交錯之資料線與閘極線所定義。閘 201137478 極驅動積體電路,依序地提供掃瞄訊號至間極 線,以一個接著一個地依序選擇液晶盒。另外, 資料驅動積體電路則將資料訊號,提供至所選閘 極線之液晶盒。 5 凊翏閱第1圖,其為習知晝素結構之佈局 不思圖,此種晝素結構又被稱為儲存電容在共通 線或共通電極上(Cs Qn CQ_n)的結構,其 配置於一基板上,並至少包含:一閘極線10、 一資料線11、以及-薄膜電晶體12。晝素區域 1〇 $由延閘極線與資料線所定義,閘極線10延一 則延一第二方向延Circuit, 1C). The liquid crystal panel further includes: a color filter substrate, a thin film transistor array substrate corresponding to the color filter substrate, and a sandwich between the color light guide substrate and the thin film transistor array substrate Liquid crystal layer. The thin film transistor array substrate comprises: for transmitting the data provided by the data driving integrated circuit 2 . , to the data line of the liquid crystal cell, and the polar line between the scanning cat signals provided by the gate driving circuit, wherein the liquid crystal cell is defined by the data lines and the gate lines which are staggered with each other. Gate 201137478 The pole drive integrated circuit sequentially supplies the scan signal to the interpole line, and sequentially selects the liquid crystal cells one by one. In addition, the data-driven integrated circuit supplies the data signal to the liquid crystal cell of the selected gate line. 5 Referring to Figure 1, which is a layout of a conventional halogen structure, which is also referred to as a storage capacitor on a common line or a common electrode (Cs Qn CQ_n), which is configured And a substrate comprising at least a gate line 10, a data line 11, and a thin film transistor 12. The halogen region 1 〇 $ is defined by the extended gate line and the data line, and the gate line 10 is extended by one and the second direction is extended.
弟一方向延伸,咨奴括T 1 — 12〇相同,皆係由一第一 蝕刻等製程所形成。上雷 >成。上電 13電性連 與晝素電極 17間之介電層。下電極 之共通線的一部分,甘_ ^ 且與閘極線10、閑極1: 金屬層經曝光、顯影、長 極17透過接觸窗口 18 201137478 接’與資料線U、源極122、沒極123相同,皆 係:一第二金屬層經曝光、顯影,刻等製程所 形成。另外,第-金屬層與第二金屬層間配 一閑極絕緣層,而第二金屬層與晝素電極13間 則配置有一鈍化保護層。 10 15 佈月請第2目,其為習知晝素結構之矩陣 !局不思圖’在習知的晝素矩陣中,共通線沿著 弟一方向配置,且彼此之間電性連結。因此,在 習知晝素矩陣中之共通線,其電阻、電容所造成 的訊號延遲效應相當明顯,使得晝面品質低茨。 综上所述,有必要提出一種液晶_之 液晶面板的薄膜電晶體陣列基板,其透過特 設計,降低習知技術中電阻—電容 :題,以提供社會大眾具有高度晝面品 貝之液晶顯示器。 【發明内容】 1在本明之第—至第五實施例中,-種薄 線、資料線、第 1及第二t板、複數個閑極 透明基板上,”二;間極線配置於 & 八中μ二㈤極線之數量為N+1 明基板上,:至 臨勒。备數。貢料線與間極線相交 田為偶數時,第N條至第條閘 20 201137478 . 極線與兩相鄰資料線之間並未定義有任何之 晝素區域。當N為奇數時,第N條至第N+1 條閘極線與兩相鄰資料線之間定義有兩晝素 區域,其為左晝素區域及右晝素區域。第一共 通線平行於閘極線。第二共通線平行於資料線, 亚電性連接於第一共通線,其中每一第二共通線 位於左晝素區域的晝素電極與右晝素區域的晝 素電極之間。 在第一至第五實施例中,該薄膜電晶體陣 列基板之該些第二共通線電性連接於該些第一 j =線,藉此該些第一共通線與第二共通線構成 。網狀結構,如此以降低共通線之電阻一電容訊 號延遲效應。 ▲為讓本發明之上述和其他目的、特徵和優 點能更明顯易懂’下文特舉較佳實施例,並配合 寸圖式,作详細說明如下,以使得在此顯示器 忖項域中,具有通常之知識者,能理解與認知 本發明之技術内容與特徵。 【實施方式】 第3圖為本發明之一實施例,其晝素結構 局示意圖’第4圖則為其剖線M’之剖面 不意示圖。 明參閱第3圖’晝素電極結構包含:一閘 201137478 極線30、一資料線3 1、一第一共通線32、一第 二共通線33與一薄膜電晶體34。閘極線30沿 著一第一方向配置,而資料線3 1則沿著一第二 方向配置,且該第二方向約略與該第一方向垂 5 直。第一共通線32平行於閘極線30,第二共通 線33則與該閘極線30相交。薄膜電晶體34包 含:一閘極340、一通道層341、一源極342以 及一汲極343。閘極340與閘極線30電性連接, 源極342與資料線31電性連接,汲極343則透 1〇 過接觸孔36與晝素電極35電性連接。 閘極線30、第一共通線32與閘極340,皆 經曝光、顯影、蚀刻一第一金屬層而形成,而資 料線31、第二共通線33、源極342與汲極343, 則經曝光、顯影、钱刻一第二金屬層而形成。間 15 極絕緣層42配置在第一金屬層與第二金屬層之 間。第一共通線32與第二共通線33,係透過一 導電元件37電性連接,該導電元件37係由氧化 铜錫(Indium Tin Oxide,ITO )、氧化姻辞(Indium Zinc Oxide, IZO )、 氧化鋅摻雜銘 2〇 ( Aluminum-Doped Zinc Oxide )以及氧化鋅摻 雜鎵(Gallium-Doped Zinc Oxide)等透明導電 材料所製成。鈍化保護層44配置在第二共通線 之上,且具有一第一通孔381與一第二通孔 201137478 如’第-通孔381對應於第一共通線%,而第 二通孔382則對應於苐二共通線33。因此,導 私元件37係透過該第一通孔與該第二通孔 382性連接第—共通線32與第二共通線33。 第4圖為第3圖剖線u之剖面示意圖。 由此可知’本發明所提供之液晶顯示ϋ之製造方 先提供—基板4〇’其可為玻璃基板或是 二反’其次形成一閘極340、-閘極線30 10 15 '、通線32於該基板3扣上,閘極340 電性連接’而第一共通線32則約略 與閘極線30«a , ^ 上. 十仃。閘極34〇、閘極線30與第一 ,、通線32皆屬於相同 入& 邳丨j之弟一金屬層,即皆由曝 先=、餘刻該第一金屬層所形成。 42,以在基板4〇上’再形成一閘極絕緣層 η Λ 間極線30與第一共通線 42上,形成—通:二Γ其:人,在間極絕緣層 通道層341,而在通道層341之表 曰、南郭W—歐姆接觸層(圖中未示),以提 升通道層341與接下來 捉 343間之電性接务成的源極如與没極 資料線31與第二乒 閘極絕緣層42之V,β、、7 ,緊接者形成在 ,^ ,,... ,且源極342與汲極343怜 好位於“層341之^。資” 20 201137478 通線33、源極342與汲極⑷㈣於相同之第 二金屬層,即皆由曝光、顯影、蝕刻該第二全屬 層所形成,源極342電性連接於資料線31 極細、通道層341、源極342與沒極343構成 一薄膜電晶體34。 在形成資料線31、第二共通線33、源極⑷ 10 15 =1343、之後:於基板40上再形成-鈍化保 二曰’以覆盍上述由第二金屬層所蝕刻的結 者,再_該鈍化保護層44與該閑極絕 ^42,以形成-對應於該第-共通線32之第 ,二3二,且韻刻該鈍化保護層44’以形成- /亥弟二共通線33之第二通孔382。其次, 在该鈍化保護層44上,艰士、 , ^ 所制之形成一由透明導電材料 =導電元件37,其可透過第一通孔 ΐ化導電元件37係'由氧化銦錫、 明導電材料所製1 辞錄鎵等透 盆矩陣〜布?弟5圖’其為本發明之-晝素結構, 通線33 :之示意圖。第一共通線32與第二共 同構成1此透過導電元件37電性連接,並共 H卢延i/罔狀結構,以降低共通線之電阻—電容 5凡唬延遲效應。 20 201137478 第6圖為本發明之另-實施例,其晝素結 構之佈局示意圖,第7圖則為其剖線κ_κ,之剖 面示意示圖。 晴參閱第6圖’晝素結構包含:〆閑極線 6〇、-資料線61、一第—共通線62、一第二共 通、,袁63與一薄膜電晶體64。閘極線的沿著一 第一方向配置,而資料線61則沿著一第二方向 配置’且該第二方向約略與該第一方向垂直。第 10 15 一共通線62平行於閘極線6〇,第二共通線63 則與該閉極線60相交。薄臈電晶體64包含:一 閘極通道層641、—源極⑷以及一汲 極643 °閉極640與閘極線60電性連接,源極 642與資料線61電性連接,純643則透過接 觸孔66與畫素電極65電性連接。 在本實施例中,閘極,線6〇係由—第一部分 =與-第二部分602所構成。第二共通線〇 只越相極線60,亦即横越第—部分6〇ι愈第 —部分6 〇 2之間’或橫越第-部分6 0!盥第二 之間。第-部分6〇1與第二部分6〇2, =過Γ導電元件67電性連接,其係由氧化 等二?:鋅、氧化鋅摻雜銘以及氧化鋅摻雜 二¥電材料所製成。閘極線60、第一共 62第一共通線63與閘極640,係由曝光 20 201137478 顯影、钱刻一第一金屬層所形成,而資料線61 極與汲極643,則由曝光、顯影、钱刻一 :二屬層所形成。鈍化保護層74配置在[ 通、.泉之上,如第7圖所示,且 681盥―筮一、s 了丨〈00 \ 韦弟—通孔 笛—:一通孔682,分別對應於閘極線60之 弟—邛分όοι與第二部分6〇2。因此, 67係藉由第一通孔681與第 电兀 10 15 、4接著在基板70上,形成一閘極絕緣層72, j覆蓋間極640、第一部分6〇1、第二部分術、 弟—共通線62與第二共通線63等一 :構。其次,在間極絕緣層72上,形= 在通道層641之表面上,再形成-歐 \妾觸層(圖中未示),以提昇通道層641與接 下來形成的源極642與沒極643間之電性接觸。 資料線61緊接著形成在閘極絕緣層72之 上,且源極642與汲極643恰好位於通道層641 之上方。資料線61、源極642與汲極64/則屬 ::目同之第二金屬層’即皆由曝光、顯影、蝕刻 °表第一金屬層所形成,源極642電性連接於資料 線。。間極_、通道層641、源極642與= 643構成一薄膜電晶體64。 在形成資料線61、源極642與汲極6们之 20 201137478 . 後,於基板7〇上再 蓋上述由第二金屬4化保護層74,以覆 列料Μ心 斤钱刻的結構。接著,再钱 =化_ 74與該閘極絕緣層72,以= 一對應於該第一部分6 曰 乂形成 對應於該第二部分6。2之==8二?- 在該鈍化保護層74上,、 一’ 所製之導電元件〜二成一由透明導電材料 第二通孔咖,電性連=柄第一通孔681與 分602。其中,卜t 分6〇1與第二部 10 15 20 化銦鋅、氧化辞接雜 ^係由乳化銦錫、氧 導電材料所製成。 魏鋅摻雜鎵等透明 ,參閱第8 «,其為本發明之另一晝素結 此八矩陣佈局之示意圖。第一共通線62與第 :構魏^彼此電性連接,並共同構成一網狀 應。構,以降低共通線之電阻〜電容訊號延遲效 +第9圖為根據本發明之第一實施例之薄膜 :晶體(thinfilmtl—,;TFT)陣列基板2之 俯視不意圖。該薄膜電晶體陣列基板2包含-诱 明基板4 〇、複數個閘極線2 〇、複數個資料線2卜 ,數個晝素電極25、複數個第一共通線22、複 文個弟一共通線23與一薄膜電晶體Μ。該透明 基板40可為-玻璃基板或塑膠基板。該些閘極 12 201137478 :二IT該透明基板40上。該些閉極㈣ 依序:二 ’第1條至第N+1條閘極線20 些資料綠^ 5亥透明基板4〇上,且N為正數。該 t 1與該些閘極線20相交跨越,並虚今 ,閉極線2〇垂直。當"偶數時,第N條;第亥 圣+1條閑極線3 0與兩相鄰#料線2!之間並未定 10 15 我f任何之晝素區域。當N為奇數時,第N條 2第N+1條閘極線2〇與兩相鄰資料線2丨之間 疋義有兩晝素區域41 ’其為左晝素區域41a及 =晝★素區域41b。舉例而言,當時,第2 條f第3條間極線2〇與兩相鄰資料線21之間並 =疋義有任何之晝素區域。當N為】時,第1 2至第2條閑極、線2〇與兩相鄰資料線^之間定 =有兩晝素區域41 ’其為左晝素區域…及右 :素區域41 b。其餘部份’可依此類推。兩閘極 、’泉20位於以上下位置排列的兩相鄰晝素區域41 之間,因此被稱為雙閘極線(dual gate line)型晝 素結構。 — 该第一共通線22平行於該閘極線2〇。該第 二=通線23平行於該資料線21,並電性連接於 該第一共通線22。沒有任何資料線位於左晝素 區域41 a及右晝素區域41 b之間,因此每一第二 通、‘ 23可位於左晝素區域41 a及右晝素區域 201137478 41 b之間。該此全 素區域4!内。—各笔極25分別配置於該些晝 該汲極藉由-接^轉電晶體24具有—汲極, 性連接。 妾觸* 口 %而與該晝素電極25電 域仏的書素乃位於左晝素區 電極25之門^ j畫素區域41b的畫素 二丘通飧2; 鄰晝素電極25之間具有該苐 10 15 佥::泉23,且具有該第二共通線23的兩相鄰 25 <間的電容(ca—―小於沒有 的電容。換:、:?的兩相鄰畫素電極25之間 :旦素電極25之間的耗合(c〇upling)效應小於沒 ”有D亥第一共通線23的兩相鄰晝素電極25之 ’的耦&效應。降低兩相鄰畫素電極25之間的 以效應可以解決亮線(bHghtline)及暗線(㈣ llnO之問題。 在第一實施例,該些閘極線20及第一共通 線22,皆經曝光、顯影、蝕刻—第一金屬層^i) 而形成,而該些資料線21及第二共通線23,則 經曝光、顯影、蝕刻一第二金屬層(Μ2)而形成。 閘極絕緣層(未頭示)配置在該第一金屬層與 第=金屬層之間。一鈍化保護層(未顯示)配置在 该第二共通線23上。複數個第一通孔2si被形 14 20 201137478 :::::極絶緣層及越化保護層内,並分別對應 开^=—共通線複數個第二通孔加被 她保護層内’並分別對應於 二 ,通線23。每—導電元件27用以將該第 線22經由兮笛、s 、 祕、^ 通孔281及第二通孔282而電 ㈣亥第二共通線23。該導電元件27及晝 =:;25係由透明導電材料所製成。換言之: 旦广:二:27及晝素電極25可由相同曝光、顯 二t 同時形成,如此不會增加製程時間 再者’該些資料線21及第二共通線23藉 目同弟二金屬層(M 2)而同時形成,因此該些 15 二編23可位在同-層。雙閘極 —…”。構的第—共通線23與資料線21之間 ^容小於習知晝素結構(亦即非雙間極線型書 構)的第二共通線與資料線之間的電容。換 次又閘極線型晝素結構的第二共通線23與 Z線21之間的|禺合效應小於習知畫素結構的 共通線與資料線之間的耦合效應。 播另夕1 ’篇新增第二共通線時,習知晝素結 即非雙間極線型晝素結構)之晝素區域開 率(apen则rati。)會減少。同理,當新增第二 L泉23 %,雙閘極線型畫素結構之晝素區域 15 20 201137478 汗口率(aperture rati〇)也會減少。但是,雙閘 極、’泉型晝素結構之畫素區域41 @ 口率的減少比 例小於習知晝素結構之晝素區域41開口率的減 少比例,其因為是第二共通線23位於左晝素區 域41a與右晝素區域41b之間,亦即第二共通線 23不會佔據晝素區域41。 ^ 10 第圖為根據本發明之第二實施例之第一 態樣之薄膜電晶體(TFT)陣列基板5之俯視示意 圖。該第二實施例之薄膜電晶體陣列基板5大體 上類似於該第一實施例之薄膜電晶體陣列基板 2,其t類似的元件標示類似的標號。該薄膜電 晶體陣列基板5包含一透明基板40、複數個閘 極線5 0 '複數個資料線5卜複數個晝素電極5 $、 15 複數個第一共通線52、複數個第二共通線幻與 —薄膜電晶體54。 忒第一共通線52平行於該閘極線5〇。該第 二共通線53平行於該資料線51,並電性連接於 忒第一共通線52。沒有任何資料線位於左晝素 區域41a及右晝素區域41b之間,且每一第二丘 通線53可位於左晝素區域4ia及右晝素區域 之間。該些晝素電極55分別配置於該些晝素區 域41内。特別地,該第二共通線53乃位於左晝 素區域41a.的畫素電極55與右晝素區域41b的 201137478 晝素電極55之間。呈右兮穿 L ^ 八有5亥弟二共通線53的兩相 鄰畫素電極55之問的缸人4 — 斤 间的耦合效應小於沒有具有該 第二共通線53的兩相鄰晝素電極55之間的輕人 5 效應。降低兩相鄰晝素電極55之間的•合效; 可以解決亮線(bright Hne)及暗線(_The extension of the younger brother, the same as T 1 - 12 , is formed by a first etching process. On the thunder > into. Power-on 13 electrical connection with the dielectric layer between the halogen electrodes 17. A part of the common line of the lower electrode, _ ^ and with the gate line 10, the idle pole 1: the metal layer is exposed, developed, and the long pole 17 is in contact with the window 18 201137478 "with the data line U, the source 122, the immersion 123 is the same, both: a second metal layer is formed by exposure, development, engraving and other processes. Further, a dummy insulating layer is disposed between the first metal layer and the second metal layer, and a passivation protective layer is disposed between the second metal layer and the halogen electrode 13. 10 15 The second month of the month, which is the matrix of the traditional structure of the prime minister. In the conventional matrix of the matrix, the common lines are arranged along the direction of the younger brother and are electrically connected to each other. Therefore, in the common line in the conventional matrix, the signal delay effect caused by the resistance and capacitance is quite obvious, which makes the quality of the surface low. In summary, it is necessary to propose a thin film transistor array substrate of a liquid crystal panel, which is designed to reduce the resistance-capacitance problem in the prior art, so as to provide a high-quality liquid crystal display of the public. . SUMMARY OF THE INVENTION [In the first to fifth embodiments of the present invention, a thin line, a data line, a first and a second t-plate, and a plurality of idler transparent substrates, "two; inter-polar lines are arranged in & The number of the eight-in-two (five) pole lines is N+1 on the substrate, to the Lin. The number of the tributary line and the inter-polar line intersect when the field is even, the Nth to the second gate 20 201137478 . There is no defined pixel region between the line and the two adjacent data lines. When N is an odd number, two elements are defined between the Nth to N+1th gate lines and the two adjacent data lines. a region, which is a left-handed region and a right-halogen region. The first common line is parallel to the gate line. The second common line is parallel to the data line, and is electrically connected to the first common line, wherein each second common line The second common line of the thin film transistor array substrate is electrically connected to the halogen electrode of the left halogen region and the halogen electrode of the right halogen region. In the first to fifth embodiments, the second common lines of the thin film transistor array substrate are electrically connected to the a first j = line, whereby the first common line and the second common line are formed. The mesh structure, so as to reduce the resistance of the common line The above-mentioned and other objects, features and advantages of the present invention will become more apparent and obvious. The following description of the preferred embodiments, together with the drawings, will be described in detail as follows. The technical content and features of the present invention can be understood and understood by those skilled in the art. [Embodiment] FIG. 3 is an embodiment of the present invention, and FIG. The section of the section line M' is not intended to be shown. Referring to Figure 3, the structure of the elemental electrode includes: a gate 201137478 pole line 30, a data line 3 1 , a first common line 32, a second common line 33 and a thin film transistor 34. The gate line 30 is disposed along a first direction, and the data line 31 is disposed along a second direction, and the second direction is approximately perpendicular to the first direction. The line 32 is parallel to the gate line 30, and the second common line 33 intersects the gate line 30. The thin film transistor 34 includes a gate 340, a channel layer 341, a source 342, and a drain 343. The pole 340 is electrically connected to the gate line 30, and the source 342 and the data line 31 are electrically connected. Connected, the drain 343 is electrically connected to the halogen electrode 35 through the contact hole 36. The gate line 30, the first common line 32 and the gate 340 are exposed, developed, and etched by a first metal layer. Formed, and the data line 31, the second common line 33, the source 342 and the drain 343 are formed by exposing, developing, and engraving a second metal layer. The interlayer 15 insulating layer 42 is disposed on the first metal layer and The first common line 32 and the second common line 33 are electrically connected through a conductive element 37, which is made of Indium Tin Oxide (ITO) and oxidized ( Indium Zinc Oxide, IZO), zinc-doped Zinc Oxide, and transparent conductive materials such as Gallium-Doped Zinc Oxide. The passivation protective layer 44 is disposed on the second common line, and has a first through hole 381 and a second through hole 201137478, such as 'the first through hole 381 corresponds to the first common line %, and the second through hole 382 Corresponding to the second common line 33. Therefore, the conductive element 37 is connected to the second common hole 33 through the first through hole 382 and the second common line 33. Fig. 4 is a schematic cross-sectional view taken along line u of Fig. 3. Therefore, it can be seen that the manufacturer of the liquid crystal display device provided by the present invention first provides a substrate 4 〇 which can be a glass substrate or a second anti-' secondly forming a gate 340, a gate line 30 10 15 ', and a through line. 32 is fastened to the substrate 3, the gate 340 is electrically connected to 'the first common line 32 is approximately the same as the gate line 30«a, ^. Ten. The gate 34〇, the gate line 30 and the first line, and the through line 32 belong to the same metal layer of the same & 邳丨j, that is, the first metal layer is formed by exposure first. 42. On the substrate 4', a gate insulating layer η inter-electrode line 30 and the first common line 42 are formed to form a pass-through: a human, in the inter-electrode insulating channel layer 341, and In the surface of the channel layer 341, the south Guo W-ohmic contact layer (not shown), the source of the channel layer 341 and the next 343 electrical connection, such as the immersive data line 31 and The two ping gates of the insulating layer 42 are V, β, and 7, and the next ones are formed at, ^, ..., and the source 342 and the bungee 343 are located at the "layer 341 ^." 20 201137478 The line 33, the source 342 and the drain (4) (4) are formed in the same second metal layer, that is, formed by exposing, developing, and etching the second full layer. The source 342 is electrically connected to the data line 31 and the channel layer 341. The source 342 and the gate 343 form a thin film transistor 34. After the data line 31, the second common line 33, and the source (4) 10 15 =1343 are formed, a passivation layer is formed on the substrate 40 to cover the layer etched by the second metal layer, and then The passivation protective layer 44 and the passivation layer 42 are formed to correspond to the first and second common lines 32, and the passivation protective layer 44' is formed to form a - /Hai two common line The second through hole 382 of 33. Next, on the passivation protective layer 44, a hard conductive material is formed by a transparent conductive material = conductive element 37, which is permeable to the first via hole, and the conductive element 37 is made of indium tin oxide and conductive. Material made by 1 quotation gallium and other permeable basin matrix ~ cloth? 5, which is a schematic diagram of the structure of the present invention, the line 33:. The first common line 32 and the second common structure 1 are electrically connected to each other through the conductive element 37, and have a common structure to reduce the resistance-capacitance of the common line. 20 201137478 Fig. 6 is a schematic view showing the layout of the unitary structure of the present invention, and Fig. 7 is a schematic cross-sectional view showing the line κ_κ. For the sake of clearing, Fig. 6's structure includes: a free line 6〇, a data line 61, a first common line 62, a second common, a Yuan 63 and a thin film transistor 64. The gate line is disposed along a first direction, and the data line 61 is disposed along a second direction and the second direction is approximately perpendicular to the first direction. The 10th common line 62 is parallel to the gate line 6〇, and the second common line 63 intersects the closed line 60. The thin germanium transistor 64 includes a gate channel layer 641, a source (4), and a drain 643 ° closed pole 640 electrically connected to the gate line 60. The source 642 is electrically connected to the data line 61, and the pure 643 is The pixel electrode 65 is electrically connected through the contact hole 66. In the present embodiment, the gate, line 6 is composed of a first portion = and a second portion 602. The second common line 〇 only crosses the phase line 60, that is, traverses the first portion 6 〇 第 — - part 6 〇 2 between or traverses the first portion 6 0! The first portion 6〇1 is electrically connected to the second portion 6〇2, = the over-conducting conductive member 67, which is oxidized by the second? : Zinc, zinc oxide doping and zinc oxide doping. The gate line 60, the first common 62 first common line 63 and the gate 640 are formed by exposure 20 201137478 development, and a first metal layer is formed, and the data line 61 pole and the drain 643 are exposed, Development, money engraving: the formation of two genera. The passivation protective layer 74 is disposed on the [pass, spring, as shown in Fig. 7, and 681盥-筮一, s 丨 <00 \ Weidi-through hole flute-: one through hole 682, respectively corresponding to the gate The brother of the polar line 60 - 邛 ό ο ι and the second part 6 〇 2. Therefore, the 67 is formed by the first via 681 and the first vias 10 15 and 4 on the substrate 70 to form a gate insulating layer 72, which covers the interpole 640, the first portion 〇1, and the second portion. The brother-common line 62 and the second common line 63 are one. Next, on the interpole insulating layer 72, the shape = on the surface of the channel layer 641, and then a -European/妾 contact layer (not shown) is formed to enhance the channel layer 641 and the source 642 formed next. Electrical contact with 643 poles. The data line 61 is formed immediately above the gate insulating layer 72, and the source 642 and the drain 643 are located just above the channel layer 641. The data line 61, the source 642 and the drain 64/ are: the same second metal layer is formed by exposing, developing, etching the first metal layer of the meter, and the source 642 is electrically connected to the data line. . . The interpole _, the channel layer 641, the source 642 and = 643 constitute a thin film transistor 64. After forming the data line 61, the source 642 and the drain 6 of 20 201137478 , the second metal protective layer 74 is further covered on the substrate 7 to cover the structure of the material. Next, the voltage _74 and the gate insulating layer 72 are formed to correspond to the first portion 6 曰乂 corresponding to the second portion 6. 2 == 8 ? - in the passivation protective layer 74 The conductive element of the first, the second is made of a transparent conductive material, the second through hole, the electrical connection = the first through hole 681 and the branch 602. Among them, the b is divided into 6〇1 and the second part 10 15 20 indium zinc, and the oxidized word is made of emulsified indium tin and oxygen conductive material. Wei zinc is doped with gallium and the like, see the eighth «, which is another schematic diagram of the eight-matrix layout of the present invention. The first common line 62 and the first structure are electrically connected to each other and together form a mesh. The structure is used to reduce the resistance of the common line to the delay of the capacitance signal. Fig. 9 is a plan view of the thin film: crystallographic (TFT) array substrate 2 according to the first embodiment of the present invention. The thin film transistor array substrate 2 includes a --induced substrate 4 〇, a plurality of gate lines 2 〇, a plurality of data lines 2, a plurality of halogen electrodes 25, a plurality of first common lines 22, and a plurality of copies of the first common line Line 23 is connected to a thin film transistor. The transparent substrate 40 can be a glass substrate or a plastic substrate. The gates 12 201137478: two IT on the transparent substrate 40. The closed-poles (4) are sequentially: two '1st to N+1th gate lines 20 some of the information green ^ 5 透明 transparent substrate 4 ,, and N is a positive number. The t 1 intersects the gate lines 20, and the virtual line is closed. When " even, the Nth; Dihai St. +1 idle line 3 0 and two adjacent # line 2! are not fixed between 10 15 I f any of the areas. When N is an odd number, the Nth 2nd N+1th gate line 2〇 and the two adjacent data lines 2丨 have two prime regions 41' which are left-handed regions 41a and =昼★ Prime region 41b. For example, at the time, between the second line of the second article f and the two adjacent data lines 21, there was no ambiguous area. When N is 】, the 1st to 2nd idle poles, the line 2〇 and the two adjacent data lines ^ are determined to have two halogen regions 41 'which are left-handed regions... and right: prime regions 41 b. The rest of the section can be deduced by analogy. The two gates, 'spring 20, are located between two adjacent halogen regions 41 arranged in the upper and lower positions, and are therefore referred to as dual gate line type quartz structures. - The first common line 22 is parallel to the gate line 2〇. The second = pass line 23 is parallel to the data line 21 and is electrically connected to the first common line 22. No data line is located between the left alum region 41a and the right alum region 41b, so each second pass, '23 can be located between the left alum region 41a and the right alum region 201137478 41b. This whole area is within 4!. - Each of the pen electrodes 25 is disposed at the respective 昼. The 汲 pole has a 汲-pole connection. The pixel with the port % and the electric field of the halogen electrode 25 is located in the pixel of the left chevron region electrode 25, and the pixel is between the adjacent elements. Having the 苐10 15 佥::spring 23, and having the capacitance between two adjacent 25 lts of the second common line 23 (ca---less than the capacitor without. The two adjacent pixel electrodes of::::? Between 25: the effect of the (c〇upling) between the denier electrodes 25 is smaller than the coupling effect of the 'two adjacent halogen electrodes 25 having the first common line 23 of D.' The effect between the pixel electrodes 25 can solve the problem of the bright line (bHghtline) and the dark line ((4) llnO. In the first embodiment, the gate lines 20 and the first common line 22 are exposed, developed, and etched. a first metal layer ^i) is formed, and the data lines 21 and the second common lines 23 are formed by exposing, developing, and etching a second metal layer (Μ2). The gate insulating layer (not shown) Between the first metal layer and the third metal layer, a passivation protective layer (not shown) is disposed on the second common line 23. The plurality of first through holes 2si are shaped 14 20 201137478 ::::: The pole insulation layer and the transition protection layer are respectively corresponding to the opening ^=-common line and the plurality of second through holes are added to the inside of her protective layer' and respectively correspond to the second, the through line 23. Each - The conductive element 27 is used to electrically (four) the second common line 23 via the whistle, the s, the secret, the through hole 281 and the second through hole 282. The conductive element 27 and the 昼 =:; Made of a transparent conductive material. In other words: Dan Guang: 2: 27 and the halogen electrode 25 can be formed simultaneously by the same exposure and display, so that the process time is not increased, and the data lines 21 and the second common line are further increased. 23 borrowed from the same two metal layers (M 2) and formed at the same time, so the 15 second series 23 can be located in the same layer. Double gate - ..." between the first common line 23 and the data line 21 The capacitance is smaller than the capacitance between the second common line and the data line of the conventional structure (ie, the non-double-pole line structure), and the second common line 23 and the Z line of the gate-lined halogen structure are replaced. The | coupling effect between 21 is smaller than the coupling effect between the common line and the data line of the conventional pixel structure. In the case of the conventional 昼 昼 即 即 即 即 即 即 区域 区域 区域 ap ap ap ap ap ap ap ap ap ap ap ap ap ap ap ap ap ap ap ap ap In the same way, when the second L-spring is added, 23%, the double-gate linear-type pixel structure of the alizarin region 15 20 201137478 sweat percentage (aperture rati〇) will also decrease. However, the ratio of the decrease in the aperture ratio of the pixel region 41 of the double-gate, 'spring-type halogen structure is smaller than the decrease ratio of the aperture ratio of the pixel region 41 of the conventional halogen structure, because the second common line 23 is located on the left Between the halogen region 41a and the right halogen region 41b, that is, the second common line 23 does not occupy the halogen region 41. Fig. 10 is a plan view showing a thin film transistor (TFT) array substrate 5 according to a first aspect of the second embodiment of the present invention. The thin film transistor array substrate 5 of the second embodiment is substantially similar to the thin film transistor array substrate 2 of the first embodiment, and elements similar to t are denoted by like reference numerals. The thin film transistor array substrate 5 comprises a transparent substrate 40, a plurality of gate lines 50', a plurality of data lines 5, a plurality of halogen electrodes 5, 15 a plurality of first common lines 52, and a plurality of second common lines. Magic and film transistor 54. The first common line 52 is parallel to the gate line 5〇. The second common line 53 is parallel to the data line 51 and is electrically connected to the first common line 52. None of the data lines are located between the left alum region 41a and the right alum region 41b, and each of the second hill lines 53 may be located between the left alum region 4ia and the right alum region. The halogen electrodes 55 are disposed in the halogen regions 41, respectively. Specifically, the second common line 53 is located between the pixel electrode 55 of the left pupil region 41a. and the 201137478 pixel electrode 55 of the right halogen region 41b. The coupling effect between the cylinders of the two adjacent pixel electrodes 55, which are right-handed through the L^8 and the 5th brother's common line 53, is smaller than that of the two adjacent elements without the second common line 53. Light human 5 effect between electrodes 55. Reduce the effect between two adjacent halogen electrodes 55; can solve the bright line (bright Hne) and dark line (_
題。 J …請再參考第10圖,在該第二實施例之第一 • 心樣中’第一及第一實施例之薄膜電晶體陣列基 ,的差異為『該些間極線50、第一共通線52: 1〇 *二共通線53皆經曝光、顯影、蝕刻一第—金 屬層(Ml)而形成,而該些資料線51則經曝光、 ,影、蝕刻一第二金屬層(M2)而形成』。—間極 絕緣層(未顯示)配置在該第一金屬層與第二金 -^層之間。該閘極線50包括-第-部分50a及 _ 15 一第二部分50b。 複數個第一通孔581被形成於該閘極絕緣 層、,並分別對應於該些第一部分5 〇 a。複數侗第 、 $ 2被形成於§亥閉極絕緣層内,並分別斜 應於ϋ亥些第二部分50b。每-導電元件57用以 〇 將3亥第一部分5〇3經由該第一通孔581及第二通 孔582而電性連接至該第二部分5〇b。位於該閘 f線5〇的第一部分5〇a及第二部分50b之間的 導電兀仵57與該第二共通線53相交跨越。該導 201137478 電元件57及晝素電極55係由透明導電材料所製 成。換言之’該導電元件57及晝素電極55可由 相同曝光、顯影、钱刻製程同i時形成,如此不會 增加製程時間及成本。 10 請參考第11圖’在該第二實施例之第二態 樣中,該些閘極線50、第一共通線52及第二共 通線53,亦皆經曝光、顯影、蝕刻一第一金屬 層(Ml)而形成,而該些資料線5丨,則亦經曝光、 '員y Ί虫刻第一金屬層(M2)而形成。一閘極絕 緣層(未顯示)亦配置在該第一金屬層與第二金 屬層之間。該第二實施例之第二及第一態樣之薄 膜電晶體陣列基板的差異為『該第二共通線53 包括一第—部分53a及一第二部分53b』。question. J ... please refer to FIG. 10 again, in the first embodiment of the second embodiment, the difference between the thin film transistor array bases of the first and first embodiments is "the interpolar lines 50, the first The common line 52: 1〇*2 common line 53 is formed by exposing, developing, etching a first metal layer (M1), and the data lines 51 are exposed, shadowed, and etched by a second metal layer (M2). ) formed. An interpole insulating layer (not shown) is disposed between the first metal layer and the second gold layer. The gate line 50 includes - a portion 50a and a -15 a second portion 50b. A plurality of first via holes 581 are formed in the gate insulating layer and respectively correspond to the first portions 5 〇 a. The plural 侗, $2 are formed in the § Hai closed-pole insulation layer and are respectively inclined to the second part 50b of the ϋ海. Each of the conductive elements 57 is used to electrically connect the first portion 5〇3 of the 3H to the second portion 5〇b via the first through hole 581 and the second through hole 582. A conductive crucible 57 located between the first portion 5〇a and the second portion 50b of the gate f line 5〇 intersects the second common line 53. The electric conductor 57 and the halogen electrode 55 are made of a transparent conductive material. In other words, the conductive element 57 and the halogen electrode 55 can be formed by the same exposure, development, and engraving process, so that the process time and cost are not increased. 10, in the second aspect of the second embodiment, the gate lines 50, the first common line 52, and the second common line 53 are also exposed, developed, and etched. The metal layer (M1) is formed, and the data lines 5丨 are also formed by exposure, and the first metal layer (M2) is inscribed. A gate insulating layer (not shown) is also disposed between the first metal layer and the second metal layer. The difference between the second and first aspects of the film transistor array substrate of the second embodiment is that the second common line 53 includes a first portion 53a and a second portion 53b.
15 20 γ u」ϋ 1傲形成於該閘極與 層,亚分別對應於該些第—部分53a。複數也 二通孔582’被形成於該閘極絕 應於該些第二部分別。每一導電元件^ :該第-部分53a經由該第一通請,及驾 而電性連接至該第二部分饥。位: ::、通線53的第一部分…及第二部分 導:的:電…7,與該閑極線5〇相交跨越 所:’及畫素電極55係由透明導電和 衣m,該導電元件57,及晝素電極15 20 γ u" ϋ 1 is formed on the gate and the layer, and the sub-portions correspond to the first portion 53a. A plurality of two via holes 582' are formed in the gates corresponding to the second portions, respectively. Each of the conductive elements ^: the first portion 53a is electrically connected to the second portion via the first pass. Bit: ::, the first part of the line 53 and the second part of the guide: the electric...7, intersecting the idle line 5〇: 'and the pixel electrode 55 is made of transparent conductive and clothing m, the Conductive element 57, and halogen electrode
18 201137478 可由相同曝光、顯影、蝕刻製程 不會增加製程時間及成本。 _絲據本發明之第三實施例之第— :、樣之賴電晶體(TFT)陣列基板7之俯視示意 上^弟一貫施例之薄膜電晶體陣列基板7大體 上大頁似於該第一實施例之薄 9 ^ /寻胰電晶體陣列基板18 201137478 The same exposure, development, and etching processes can be used without increasing process time and cost. According to the third embodiment of the present invention, the thin film transistor array substrate 7 of the conventionally applied embodiment of the TFT array substrate 7 is substantially larger than the first Thin 9 ^ / pancreatic transistor array substrate of one embodiment
同時形成,如此 5 10 丨上t類似的元件標示類似的標號。該薄膜電 曰曰^車列基板7包含-透明基板4Q、複數個閉 極、·泉70、複數個資料線71、複數個晝素電極75、 複數個第-共通線72、複數個第二共通線乃盘 一薄膜電晶體74。 一该第一共通線72平行於該閘極線70。該第 ,,通線73平行於該資料線71,並電性連接於 。亥第一共通線72。沒有任何資料線位於左畫素 15 區域41a及右晝素區域41b之間,因此每一第二 共通線73可位於左晝素區域41a及右晝素區域 41b之間。該些晝素電極75分別配置於該些晝 素區域41内。特別地,該第二共通線73乃位於 左晝素區域41a的晝素電極75與右晝素區域41b 20 的晝素電極75之間。具有該第二共通線73的兩 相鄰晝素電極75之間的耦合效應小於沒有具有 该第二共通線73的兩相鄰晝素電極75之間的耦 &效應。降低兩相鄰晝素電極7 5之間的搞合效 201137478 應可以解決亮線(bright line)及暗線(dark line)之 問題。 請再參考第12圖,在該第三實施例之第一 悲樣中,第三及第一實施例之薄膜電晶體陣列基 板的差異為『該些閘極線7 〇經曝光、顯影、飯 刻一第—金屬層(Ml)而形成,而該些資料線 71、第一共通線72及第二共通線73則皆經曝 光、顯影、蝕刻一第二金屬層(M2)而形成』。一 鈍化保護層(未顯示)配置在該第一金屬層與第 1〇 二金屬層之間。該資料線71包括一第一部分71a 及一第二部分71b。 複數個第一通孔781被形成於該鈍化保護 層’並分別對應於該些第一部分71a。複數個第 一通孔782被形成於該鈍化保護層内,並分別對 15 應於該些第二部分71b。每一導電元件77用以 將該第一部分7丨a經由該第一通孔7 8丨及第二通 孔782而電性連接至該第二部分71b。位於該資 才:線71的第—部分71a及第二部分71b之間的 導電几件77與該第一共通線72相交跨越。該導 兒元件77及晝素電極75係由透明導電材料所製 成換口之,該導電元件77及晝素電極75可由 相同曝光、顯影、蝕刻製程同時形成,如此不會 增加製程時間及成本。 20 201137478 、 請參考第13圖,在該第三實施例之第二態 樣中,該些閘極線70亦經曝光、顯影、蝕刻一 第一金屬層(Μ 1)而形成,而該些資料線71、第 一共通線72及第二共通線73,則亦皆經曝光、 5 顯影、I虫刻一第二金屬層(M2)而形成。一純化保 護層(未顯示)亦配置在該第一金屬層與第二金 屬層之間。該第三實施例之第二及第一態樣之薄 膜電晶體陣列基板的差異為『該第一共通線72 包括一第一部分72a及一第二部分72b』。 ίο 複數個第一通孔78 Γ被形成於該鈍化保護 層,並分別對應於該些第一部分72a。複數個第 二通孔782’被形成於該鈍化保護層内,並分別對 應於該些第二部分72b。每一導電元件77’用以 將該第一部分72a經由該第一通孔781’及第二 15 通孔782’而電性連接至該第二部分72b。位於該 第一共通線72的第一部分72a及第二部分72b 之間的導電元件77’與該資料線71相交跨越。該 導電元件77’及晝素電極75係由透明導電材料 所製成。換言之,該導電元件77’及晝素電極75 20 可由相同曝光、顯影、蝕刻製程同時形成,如此 不會增加製程時間及成本。 第14圖為根據本發明之第四實施例之薄膜 電晶體(TFT)陣列基板8之俯視示意圖。該第二 201137478 實施例之薄膜電晶體陣列基板8大體上類似於 該第一實施例之薄膜電晶體陣列基板2,其中類 似的兀件標不類似的標號。該薄膜電晶體陣列基 板8包含一透明基板40、複數個問極線8〇、ς 5 數個資料線81、複數個晝素電極85、複數個第 —共通線82、複數個第二共通線83與一薄膜恭 晶體84。 、兒 该第一共通線82平行於該閘極線8〇。該第 二共通線83平行於該資料線81,並電性連接於 1〇該第一共通線82。沒有任何資料線位於左晝素 區域41a及右畫素區域4ib之間,因此每一第二 共通線83可位於左晝素區域41a及右畫素區= 41 b之間。該些晝素電極85分別配置於該些晝 素區域41内。特別地,該第二共通線83乃位於 15 左晝素區域41a的晝素電極85與右晝素區域41b 的晝素電極85之間。具有該苐二共通線83的兩 相鄰晝素電極85之間的耦合效應小於沒有具有 该第二共通線8 3的兩相鄰晝素電極8 5之間的耦 合效應。降低兩相鄰畫素電極85之間的耦合效 2〇 應可以解決亮線(briSht Hne)及暗線(dark line)之 問題。 —在該第四實施例中,第四及第一實施例之 薄膜電晶體陣列基板的差異為『該些閘極線8〇 22 201137478 及第二共通線83皆經曝光、顯影、蝕刻一第一 金屬層(Ml)而形成,而該些資料線81及第一共 通線82則皆經曝光、顯影、餘刻一第二金屬層 (M2)而形成』。一閘極絕緣層(未顧示)配置在該 5 第一金屬層與第二金屬層之間。一純化保護層 (未顯示)配置在該第一共通線82上。該第一共 通線82包括一第一部分82a及一第二部分82b, 且該第二共通線83包括一第三部分83a及一第 四部分83b。 1〇 複數個第一通孔881被形成於該鈍化保護 層内,並分別對應於該些第一部分82a。複數個 第二通孔882被形成於該鈍化保護層内,並分別 對應於該些第二部分82b。每一導電元件87a用 以將該第一部分82a經由該第一通孔881及第二 15 通孔882而電性連接至該第二部分82b。位於該 第一共通線82的第一部分82a及第二部分82b 之間的導電元件87a與該資料線81相交跨越。 複數個第三通孔883被形成於該閘極絕緣層 内,並分別對應於該些第三部分83a。複數個第 20 四通孔884被形成於該閘極絕緣層内,並分別對 應於該些第四部分83b。每一導電元件87b用以 將該第三部分83a經由該第三通孔883及第四通 孔884而電性連接至該第四部分83b。位於該第 201137478 , 二共通線83的第三部分83a及第四部分83b之 間的導電元件87b與該閘極線8〇相交跨越。複 數個第五通孔885被形成於該鈍化保護層内,並 分別對應於該些第一共通線82。複數個第六通 孔886被形成於該閘極絕緣層内,並分別對應於 及些第二共通線83。每一導電元件8乃用以將 4第—共通線82經由該第五通孔885及第六通 孔886而電性連接至該第二共通線83。該導電 元件87a、87b、87c及晝素電極85係由透明^ 1〇 電材料所製成。換言之,該導電元件87a、87b、 及晝素電極δ5可由相同曝光、顯影、蝕刻 衣私同時形成,如此不會增加製程時間及成本。 第15圖為根據本發明之第五實施例之薄膜 電晶體(TFT)陣列基板9之俯視示意圖。該第五 15 實施例之薄膜電晶體陣列基板9大體上類似於 該第四實施例之薄膜電晶體陣列基板8,其中類 似的元件標示類似的標號。該薄膜電晶體陣列基 板9包含一透明基板40、複數個閘極線9〇、複 數個資料線91、複數個晝素電極95、複數個第 2〇 一共通線92、複數個第二共通線93與一薄骐電 晶體94。 、兒 該第一共通線92平行於該閘極線9〇。該第 一共通線93平行於該資料線91,並電性連接於 24 201137478 «ο • 該第—共通線92。沒有任何資料線位於左晝素 ., 區域41a及右晝素區域41b之間,因此每一第二 . #通線93可位於左晝素區域…及右晝素區域 仙之間。該些晝素電極%分別配置於該些晝 5素區域41内。特別地,該第二共通線93乃位於 左晝素區域41a的晝素電極%與右晝素區域4ib 的晝素電極95之間。具有該第二共通線93的兩 • :目:晝素電極95之間的耦合效應小於沒有具有 «亥第一共通線93的兩相鄰晝素電極95之間的耦 1〇 合效應。降低兩相鄰晝素電極95之間的耦合效 應可以解決亮線(bright line)及暗線(dark line)之 問題。 —在該第五實施例中,第五及第四實施例之 薄膜電晶體陣列基板的差異為『該第一共通線 15 92位於以上下位置排列的兩相鄰畫素區域41内 • 的兩閘極線90之間』。該第-共通線92包括一 第一部分92a及一第二部分92b,且該第二共通 、’泉%包括一第二部分93a及一第四部分93b。 複數個第一通孔981被形成於該鈍化保護 20 層内,並分別對應於該些第一部分92a。複數個 第一通孔982被形成於該純化保護層内,並分別 對應於該些第二部分92b。每一導電元件97a用 以將該第一部分92a經由該第一通孔981及第二 25 201137478 、 通孔982而電性連接至該第二部分92b。位於該 第一共通線92的第一部分92a及第二部分92b 之間的導電元件97a與該資料線91相交跨越。 複數個第三通孔983被形成於該閘極絕緣層 5 内,並分別對應於該些第三部分93a。複數個第 四通孔984被形成於該閘極絕緣層内,並分別對 應於該些第四部分93b。每一導電元件97b用以 將該第三部分93a經由該第三通孔983及第四通 孔984而電性連接至該第四部分93b。位於該第 ίο 二共通線93的第三部分93a及第四部分93b之 間的導電元件97b與該閘極線90相交跨越。複 數個第五通孔985被形成於該鈍化保護層内,並 分別對應於該些第一共通線92。該導電元件97b 亦用以將該第一共通線92經由該第三通孔 15 983、第四通孔984及第五通孔985而電性連接 至該第二共通線93。該導電元件97a、97b及晝 素電極95係由透明導電材料所製成。換言之, 該導電元件97a、97b及晝素電極95可由相同曝 光、顯影、银刻製程同時形成,如此不會增加製 20 程時間及成本。 請參考第16圖,其顯示第一實施例之薄膜 電晶體(TFT)陣列基板2之電路示意圖。該薄膜 電晶體陣列基板2包含該些閘極線20、資料線 201137478 、 • μ、晝素電極25、第一共通線22、第二共通線 - 23與薄膜電晶體24。該些第二共通線23電性連 * 接=該些第一共通線22。因此,第17圖顯示該 些第一共通線22與第二共通線23構成本發明之 5 第一實施例之一網狀結構。同理,在第二至第五 貫施例中,該薄膜電晶體(TFT)陣列基板之該些 第=共通線電性連接於該些第一共通線,藉此該 φ 些第一共通線與第二共通線構成一網狀結構,如 此以降低共通線之電阻—電容訊號延遲效應。 10 參考第1 8圖’其顯示一液晶面板200。該 第一實施例之薄膜電晶體陣列基板2可應用於 该液晶面板200。該液晶面板2〇〇包括該薄膜電 晶體陣列基板2 ' 一彩色濾光片基板2,及一液晶 層2丨’°該液晶層21,位於該彩色濾光片基板2, 15 與该薄膜電晶體陣列基板2間。該彩色濾光片基 板2包括黑色矩陣層(black matrix layer)28,、 彩色濾、光層22’及一透明電極24,,其依序形 成於另一透明基板26,上。該黑色矩陣(black matnx)28’須對應於該些閘極線20、資料線21、 20 晝素電極25及第二共通線23,以避免漏光。 I考第19圖,其顯示一液晶顯示器2〇〇〇。 该第一實施例之液晶面板2〇〇可應用於該液晶 顯不器2000。該液晶顯示器2〇〇〇包含一前框 27 201137478 202、遠液晶面板200及一背光模組2〇4。該背 光模組204是用以提供光源進入該液晶面板 200,並與該前框202彼此結合而將該液晶面板 200及月光模組204組合成該液晶顯示器2〇〇〇。 雖然本發明已以較佳實施例揭露如上,然 其並非用以限定本發明,任何本發明所屬技術領 域中具有通常知識者,在不脫離本發明之精神和 範圍内,當可作些許之更動與潤飾,因此本發明 10 15At the same time, similar elements such as t 10 are labeled with similar reference numerals. The thin film electric circuit board 7 includes a transparent substrate 4Q, a plurality of closed electrodes, a spring 70, a plurality of data lines 71, a plurality of halogen electrodes 75, a plurality of first common lines 72, and a plurality of second The common line is a thin film transistor 74. A first common line 72 is parallel to the gate line 70. The first line is parallel to the data line 71 and electrically connected to the line 73. Hai first common line 72. There is no data line between the left pixel 15 region 41a and the right pixel region 41b, so each second common line 73 can be located between the left halogen region 41a and the right halogen region 41b. The halogen electrodes 75 are disposed in the respective pixel regions 41. Specifically, the second common line 73 is located between the halogen electrode 75 of the left halogen region 41a and the halogen electrode 75 of the right halogen region 41b 20. The coupling effect between the two adjacent pixel electrodes 75 having the second common line 73 is smaller than the coupling effect between the two adjacent pixel electrodes 75 having the second common line 73. Reduce the effect between two adjacent halogen electrodes 7 5 201137478 should solve the problem of bright line and dark line. Referring to FIG. 12 again, in the first sadness of the third embodiment, the difference between the thin film transistor array substrate of the third embodiment and the first embodiment is "the gate lines 7 are exposed, developed, and cooked. The first metal layer (M1) is formed, and the data lines 71, the first common line 72, and the second common line 73 are formed by exposing, developing, and etching a second metal layer (M2). A passivation protective layer (not shown) is disposed between the first metal layer and the first metal layer. The data line 71 includes a first portion 71a and a second portion 71b. A plurality of first via holes 781 are formed in the passivation protective layer ' and correspond to the first portions 71a, respectively. A plurality of first vias 782 are formed in the passivation protective layer and are respectively applied to the second portions 71b. Each of the conductive elements 77 is electrically connected to the second portion 71b via the first through hole 718 and the second through hole 782. The conductive member 77 located between the first portion 71a and the second portion 71b of the line 71 intersects the first common line 72. The conductive element 77 and the halogen electrode 75 are made of a transparent conductive material, and the conductive element 77 and the halogen electrode 75 can be simultaneously formed by the same exposure, development, and etching processes, so that the process time and cost are not increased. . 20 201137478, please refer to FIG. 13 , in the second aspect of the third embodiment, the gate lines 70 are also formed by exposing, developing, etching a first metal layer (Μ 1), and the The data line 71, the first common line 72, and the second common line 73 are also formed by exposure, 5 development, and etching of a second metal layer (M2). A purification protective layer (not shown) is also disposed between the first metal layer and the second metal layer. The difference between the second and first aspects of the thin film transistor array substrate of the third embodiment is that the first common line 72 includes a first portion 72a and a second portion 72b. A plurality of first through holes 78 are formed in the passivation protective layer and respectively correspond to the first portions 72a. A plurality of second via holes 782' are formed in the passivation protective layer and respectively correspond to the second portions 72b. Each of the conductive elements 77' is used to electrically connect the first portion 72a to the second portion 72b via the first through hole 781' and the second through hole 782'. A conductive element 77' located between the first portion 72a and the second portion 72b of the first common line 72 intersects the data line 71. The conductive member 77' and the halogen electrode 75 are made of a transparent conductive material. In other words, the conductive element 77' and the halogen electrode 75 20 can be simultaneously formed by the same exposure, development, and etching processes, so that the process time and cost are not increased. Fig. 14 is a plan view showing a thin film transistor (TFT) array substrate 8 according to a fourth embodiment of the present invention. The thin film transistor array substrate 8 of the second embodiment of the 201137478 is substantially similar to the thin film transistor array substrate 2 of the first embodiment, wherein like elements are not labeled with similar reference numerals. The thin film transistor array substrate 8 includes a transparent substrate 40, a plurality of interrogation lines 8〇, ς5 number of data lines 81, a plurality of pixel electrodes 85, a plurality of first common lines 82, and a plurality of second common lines. 83 with a film Christine crystal 84. The first common line 82 is parallel to the gate line 8〇. The second common line 83 is parallel to the data line 81 and electrically connected to the first common line 82. No data line is located between the left-handed region 41a and the right-pixel region 4ib, so each second common line 83 can be located between the left-hand pixel region 41a and the right-pixel region = 41 b. The halogen electrodes 85 are disposed in the respective pixel regions 41. In particular, the second common line 83 is located between the pixel electrode 85 of the left-dwell region 41a and the halogen electrode 85 of the right-halogen region 41b. The coupling effect between two adjacent pixel electrodes 85 having the second common line 83 is smaller than the coupling effect between two adjacent pixel electrodes 85 having no second common line 83. Reducing the coupling effect between two adjacent pixel electrodes 85 should solve the problem of bright lines (briSht Hne) and dark lines. In the fourth embodiment, the difference between the thin film transistor array substrate of the fourth embodiment and the first embodiment is that the gate lines 8〇22 201137478 and the second common line 83 are exposed, developed, and etched. A metal layer (M1) is formed, and the data lines 81 and the first common lines 82 are formed by exposure, development, and a second metal layer (M2). A gate insulating layer (not shown) is disposed between the 5 first metal layer and the second metal layer. A purified protective layer (not shown) is disposed on the first common line 82. The first common line 82 includes a first portion 82a and a second portion 82b, and the second common line 83 includes a third portion 83a and a fourth portion 83b. 1〇 A plurality of first via holes 881 are formed in the passivation protective layer and respectively correspond to the first portions 82a. A plurality of second via holes 882 are formed in the passivation protective layer and respectively correspond to the second portions 82b. Each of the conductive elements 87a is electrically connected to the first portion 82a via the first through hole 881 and the second through hole 882 to the second portion 82b. A conductive element 87a located between the first portion 82a and the second portion 82b of the first common line 82 intersects the data line 81. A plurality of third via holes 883 are formed in the gate insulating layer and respectively correspond to the third portions 83a. A plurality of twenty-four through holes 884 are formed in the gate insulating layer and respectively correspond to the fourth portions 83b. Each of the conductive elements 87b is electrically connected to the third portion 83a via the third through hole 883 and the fourth through hole 884 to the fourth portion 83b. Located at this 201137478, the conductive element 87b between the third portion 83a and the fourth portion 83b of the common common line 83 intersects the gate line 8A. A plurality of fifth via holes 885 are formed in the passivation protective layer and respectively correspond to the first common lines 82. A plurality of sixth via holes 886 are formed in the gate insulating layer and correspond to the second common lines 83, respectively. Each of the conductive elements 8 is electrically connected to the second common line 83 via the fifth through hole 885 and the sixth through hole 886. The conductive members 87a, 87b, 87c and the halogen electrode 85 are made of a transparent material. In other words, the conductive members 87a, 87b, and the halogen electrode δ5 can be formed simultaneously by the same exposure, development, and etching, so that the process time and cost are not increased. Fig. 15 is a plan view showing a thin film transistor (TFT) array substrate 9 according to a fifth embodiment of the present invention. The thin film transistor array substrate 9 of the fifth embodiment is substantially similar to the thin film transistor array substrate 8 of the fourth embodiment, wherein like elements are designated by like reference numerals. The thin film transistor array substrate 9 includes a transparent substrate 40, a plurality of gate lines 9〇, a plurality of data lines 91, a plurality of halogen electrodes 95, a plurality of second common lines 92, and a plurality of second common lines. 93 and a thin germanium transistor 94. The first common line 92 is parallel to the gate line 9〇. The first common line 93 is parallel to the data line 91 and is electrically connected to 24 201137478 «ο • the first common line 92. There is no data line between the left sputum., the area 41a and the right sulphate area 41b, so each second . #通线93 can be located between the left 昼 区域 area and the right 昼 区域 area. The monocyte electrodes % are disposed in the respective germanium regions 41. Specifically, the second common line 93 is located between the pixel electrode % of the left-handed region 41a and the halogen electrode 95 of the right-handed region 4ib. The coupling effect between the two electrodes having the second common line 93 is smaller than the coupling effect between the two adjacent pixel electrodes 95 having no first common line 93. Reducing the coupling effect between two adjacent halogen electrodes 95 can solve the problems of bright lines and dark lines. - In the fifth embodiment, the difference between the thin film transistor array substrates of the fifth and fourth embodiments is "the first common line 15 92 is located in the two adjacent pixel regions 41 arranged in the upper and lower positions." Between the gate lines 90. The first common line 92 includes a first portion 92a and a second portion 92b, and the second common, 'spring%' includes a second portion 93a and a fourth portion 93b. A plurality of first through holes 981 are formed in the passivation protection layer 20 and correspond to the first portions 92a, respectively. A plurality of first via holes 982 are formed in the purification protective layer and respectively correspond to the second portions 92b. Each of the conductive elements 97a is electrically connected to the first portion 92a via the first through hole 981 and the second 25 201137478 and the through hole 982 to the second portion 92b. A conductive element 97a located between the first portion 92a and the second portion 92b of the first common line 92 intersects the data line 91. A plurality of third via holes 983 are formed in the gate insulating layer 5 and correspond to the third portions 93a, respectively. A plurality of fourth via holes 984 are formed in the gate insulating layer and respectively correspond to the fourth portions 93b. Each of the conductive elements 97b is electrically connected to the third portion 93a via the third through hole 983 and the fourth through hole 984 to the fourth portion 93b. The conductive member 97b located between the third portion 93a and the fourth portion 93b of the second common line 93 intersects the gate line 90. A plurality of fifth via holes 985 are formed in the passivation protective layer and respectively correspond to the first common lines 92. The conductive element 97b is also used to electrically connect the first common line 92 to the second common line 93 via the third through hole 15 983, the fourth through hole 984 and the fifth through hole 985. The conductive members 97a, 97b and the germanium electrode 95 are made of a transparent conductive material. In other words, the conductive elements 97a, 97b and the halogen electrode 95 can be formed simultaneously by the same exposure, development, and silver engraving process, so that the process time and cost are not increased. Referring to Fig. 16, there is shown a circuit diagram of a thin film transistor (TFT) array substrate 2 of the first embodiment. The thin film transistor array substrate 2 includes the gate lines 20, the data lines 201137478, the μ, the halogen electrodes 25, the first common lines 22, the second common lines - 23, and the thin film transistors 24. The second common lines 23 are electrically connected to the first common lines 22. Therefore, Fig. 17 shows that the first common line 22 and the second common line 23 constitute a mesh structure of the first embodiment of the present invention. Similarly, in the second to fifth embodiments, the first common lines of the thin film transistor (TFT) array substrate are electrically connected to the first common lines, whereby the first common lines are Forming a mesh structure with the second common line, thereby reducing the resistance-capacitance signal delay effect of the common line. 10 Referring to Fig. 18', a liquid crystal panel 200 is shown. The thin film transistor array substrate 2 of the first embodiment can be applied to the liquid crystal panel 200. The liquid crystal panel 2 includes the thin film transistor array substrate 2', a color filter substrate 2, and a liquid crystal layer 2', the liquid crystal layer 21, which is located on the color filter substrate 2, 15 and the thin film. Between the crystal array substrates 2. The color filter substrate 2 includes a black matrix layer 28, a color filter, a light layer 22', and a transparent electrode 24, which are sequentially formed on the other transparent substrate 26. The black matrics 28' must correspond to the gate lines 20, the data lines 21, 20, and the second common line 23 to avoid light leakage. I. Figure 19 shows a liquid crystal display. The liquid crystal panel 2 of the first embodiment can be applied to the liquid crystal display 2000. The liquid crystal display 2 includes a front frame 27 201137478 202, a far liquid crystal panel 200 and a backlight module 2〇4. The backlight module 204 is configured to provide a light source into the liquid crystal panel 200, and the front panel 202 is coupled to the front panel 202 to combine the liquid crystal panel 200 and the moonlight module 204 into the liquid crystal display panel. Although the present invention has been disclosed in the above preferred embodiments, the present invention is not intended to limit the invention, and it is possible to make a few changes without departing from the spirit and scope of the invention. With retouching, therefore the invention 10 15
之保護範圍當視後附之申請專利範圍所界定者 為準。 【圖式簡單說明】 第1圖為習知晝素結構之俯視示意圖; 第2圖為習知晝素結構矩陣之俯視示意圖; 第3圖為本發明之—實施例,其晝素結構之俯視 示意圖;The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view of a conventional halogen structure; Fig. 2 is a schematic plan view of a conventional halogen structure matrix; Fig. 3 is an embodiment of the present invention, and a plan view of a halogen structure schematic diagram;
f 4圖為第3圖剖線1-1,之剖面示意圖; :5圖為第3圖之矩陣俯視示意圖; ^ 6圖為本發明之另—實施例,其晝素結構之 視示意圖; 斤。 ^ Dj 之剖面示意圖 !圖為第6圖之矩陣俯視示意圖; 二^^-實施― 28 20 201137478 第ίο圖為根據本發明之第二實施例之第一態樣 之薄膜電晶體陣列基板之俯視示意圖; 第11圖為根據本發明之第二實施例之第二態樣 之薄膜電晶體陣列基板之俯視示意圖; 5 第12圖為根據本發明之第三實施例之第一態樣 之薄膜電晶體陣列基板之俯視示意圖; 第13圖為根據本發明之第參三實施例之第二態 樣之薄膜電晶體陣列基板之俯視示意圖; 第14圖為根據本發明之第四實施例之薄膜電晶 10 體陣列基板之俯視示意圖; 第15圖為根據本發明之第五實施例之薄膜電晶 體陣列基板之俯視示意圖; 第16圖為本發明之第一實施例之薄膜電晶體陣 列基板之電路不意圖.; 15 第17圖顯示該些第一共通線與第二共通線構成 本發明之第一實施例之一網狀結構; 第18圖為本發明之第一實施例之液晶面板之分 解立體示意圖; 第19圖為本發明之第一實施例之液晶顯示器之 20 分解立體示意圖。 【主要元件符號說明】 10, 20, 30, 50, 60, 70, 80, 90 閘極線 11,21,31,51, 61,71, 81, 91 資料線 29 201137478 12, 24, 34, 54, 64, 74, 84, 94 薄膜電晶體 120, 340, 640 閘極 5 121,341,641 通道層 122, 342, 642 源極 123,343,643 汲極 13, 25, 35, 55, 65, 75, 85, 95 晝素電極 14, 18, 26, 36, 66 接觸窗口 15下電極 10 16儲存電容 17上電極 200液晶面板 2000液晶顯示器 202前框 204背光模組 15 2, 5, 7, 8, 9薄膜電晶體陣列基板 2’彩色濾光片基板 21’液晶層 22’彩色濾光層 22, 32, 52, 62, 72, 82, 92 第一共通線 23, 33, 53, 63, 73, 83, 93 第二共通線 24’透明電極 26’透明基板 27, 37, 57, 57,,67, 77, 77,,87a, 87b,87c, 97a,97b 導電元件 201137478 28’黑色矩陣層 281, 381, 581,,681, 781, 781,,881, 981 第一通孔 282, 382, 582,,682, 782, 782,,882, 982 第二通孔 40, 70基板 5 41, 41a, 41b晝素區域 42, 72閘極絕緣層 44, 74鈍化保護層 50a, 53a, 601, 71a,72a, 82a,92a 第一部分 50b, 53b, 602, 71b, 72b, 82b,92b 第二部分 ίο 83a,93a第三部分 83b, 93b第四部分 883,983第三通孔 884, 984第四通孔 885,985第五通孔 15 886第六通孔Figure 4 is a cross-sectional view taken along line 1-1 of Fig. 3; Fig. 5 is a schematic plan view of the matrix of Fig. 3; ^6 is another embodiment of the present invention, and a schematic view of the structure of the element; . ^Dj is a schematic plan view of the matrix; Figure 2 is a schematic plan view of the matrix of Fig. 6; 2^^-implementation - 28 20 201137478 The first view is a plan view of the thin film transistor array substrate according to the first aspect of the second embodiment of the present invention. FIG. 11 is a top plan view of a thin film transistor array substrate according to a second aspect of the second embodiment of the present invention; FIG. 12 is a first embodiment of a thin film power according to a third embodiment of the present invention. FIG. 13 is a top plan view of a thin film transistor array substrate according to a second aspect of the third embodiment of the present invention; and FIG. 14 is a thin film power according to a fourth embodiment of the present invention. FIG. 15 is a top plan view of a thin film transistor array substrate according to a fifth embodiment of the present invention; FIG. 16 is a circuit diagram of a thin film transistor array substrate according to a first embodiment of the present invention; 15 shows that the first common line and the second common line constitute a mesh structure of the first embodiment of the present invention; FIG. 18 is a liquid of the first embodiment of the present invention. Panel in a schematic exploded perspective; 20 an exploded perspective schematic view of a first embodiment of the liquid crystal 19 of the graph display of the present embodiment of the invention. [Explanation of main component symbols] 10, 20, 30, 50, 60, 70, 80, 90 Gate lines 11, 21, 31, 51, 61, 71, 81, 91 Information line 29 201137478 12, 24, 34, 54 , 64, 74, 84, 94 Thin Film Transistor 120, 340, 640 Gate 5 121, 341, 641 Channel Layer 122, 342, 642 Source 123, 343, 643 Bungee 13, 25, 35, 55, 65, 75, 85, 95 Alizarin Electrode 14, 18, 26, 36, 66 Contact window 15 Lower electrode 10 16 Storage capacitor 17 Upper electrode 200 Liquid crystal panel 2000 Liquid crystal display 202 Front frame 204 Backlight module 15 2, 5, 7, 8, 9 Thin film transistor array substrate 2 'Color filter substrate 21' liquid crystal layer 22' color filter layer 22, 32, 52, 62, 72, 82, 92 first common line 23, 33, 53, 63, 73, 83, 93 second common line 24' transparent electrode 26' transparent substrate 27, 37, 57, 57, 67, 77, 77, 87a, 87b, 87c, 97a, 97b conductive element 201137478 28' black matrix layer 281, 381, 581, 681, 781, 781, 881, 981 first through hole 282, 382, 582, 682, 782, 782, 882, 982 second through hole 40, 70 substrate 5 41, 41a, 41b halogen region 42, 72 gate Pole insulating layers 44, 74 passivation protective layers 50a, 53a, 601, 71a 72a, 82a, 92a first part 50b, 53b, 602, 71b, 72b, 82b, 92b second part ίο 83a, 93a third part 83b, 93b fourth part 883, 983 third through hole 884, 984 fourth through hole 885, 985 Five-way hole 15 886 sixth through hole
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CN102566183A (en) * | 2012-03-08 | 2012-07-11 | 深超光电(深圳)有限公司 | Dual-gate display panel with high display quality |
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CN103399440A (en) | 2013-08-08 | 2013-11-20 | 京东方科技集团股份有限公司 | Array substrate, display device and drive method |
KR102046848B1 (en) * | 2013-12-20 | 2019-11-20 | 엘지디스플레이 주식회사 | Liquid Display Device |
CN104007590A (en) * | 2014-06-17 | 2014-08-27 | 深圳市华星光电技术有限公司 | TFT array substrate structure |
CN104216183B (en) * | 2014-08-28 | 2017-08-29 | 合肥鑫晟光电科技有限公司 | A kind of array base palte and preparation method thereof, display device |
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TWI548923B (en) | 2015-06-16 | 2016-09-11 | 友達光電股份有限公司 | Display panel and pixel array thereof |
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CN110658657B (en) * | 2018-06-29 | 2021-10-01 | 京东方科技集团股份有限公司 | Array substrate and display panel |
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