TW201135172A - Flat type heat pipe and method of manufacturing the same - Google Patents

Flat type heat pipe and method of manufacturing the same Download PDF

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Publication number
TW201135172A
TW201135172A TW99110232A TW99110232A TW201135172A TW 201135172 A TW201135172 A TW 201135172A TW 99110232 A TW99110232 A TW 99110232A TW 99110232 A TW99110232 A TW 99110232A TW 201135172 A TW201135172 A TW 201135172A
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Taiwan
Prior art keywords
capillary structure
heat pipe
capillary
flat thin
thin heat
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TW99110232A
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Chinese (zh)
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TWI482938B (en
Inventor
Yue Liu
sheng-liang Dai
Jin-Peng Liu
Sheng-Guo Zhou
Sheng-Lin Wu
Yu-Liang Lo
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Foxconn Tech Co Ltd
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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A flat type heat pipe includes a hollow housing, a first wick structure and a second wick structure disposed in the housing. The housing includes an evaporator section and a condenser section. The housing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is woven by a plurality of wires. The first wick structure extends from the evaporator section to the condenser section. The second wick structure is sintered and solid wick structure. The second wick structure is disposed in the evaporator section and connects between the top plate and the bottom plate. The first wick structure connects to the second wick structure in the evaporator section.

Description

201135172 [0001] [0002] Ο [0003] Ο [0004] 發明說明: 【發明所屬之技術領域】 本發明涉及一種熱導管,特別涉及一種扁平薄型熱導管 及其製造方法。 【先前技術"】 現階段,熱導管因其具有較高傳熱量的優點,已被廣泛 應用於具較大發熱量的電子元件中。該熱導管工作時, 利用管體内部填充的低沸點工作介質在其蒸發部吸收發 熱電子元件產生的熱量後蒸發汽化,蒸氣帶著熱量運動 至冷凝部,並在冷凝部液化凝結將熱量釋放出去,對電 子元件進行散熱。該液化後的工作介質在熱導管壁部毛 細結構的作用下回流至蒸發部,繼續蒸發汽化及液化凝 結,使工作介質在熱導管内部循環運動,將電子元件產 生的熱量源源不斷的散發出去。 當今電子產品不斷傾向於輕薄短小方向發展,電子產品 在不斷縮小的空間内散熱問題越發變的重要,這就需要 散熱產品在走向輕薄短小的同時,更需要有較高的傳熱 、散熱性能。 習知熱導管僅採用單一毛細結構,毛細結構一般可分為 溝槽型、燒結型、纖維型及絲網型等,所述毛細結構設 於熱導管的管壁上或與管壁緊密貼合,在圓形熱導管内 可使冷凝部的工作介質及時回流至熱導管的蒸發部。但 是,當熱導管打扁後,尤其是打扁至厚度很薄的時候, 所述毛細結構容易出現變形、崩解等狀況,使其液體輸 送能力大幅下降,並且整個熱導管的液體輸送能力不能 099110232 表單編號Α0101 第3頁/共24頁 0992018026-0 201135172 得到其他方式補充,從而導致熱導管最大傳熱量的大幅 下降及熱阻的增加。同時因為熱導管的厚度很薄,使用 習知的毛細結構會使熱導管内部的蒸氣通道很窄,無法 及時將蒸氣從蒸發段運送至冷凝段,這也在很大程度上 導致熱導管的最大傳熱量的大幅下降。 【發明内容】 [0005] 有饔於此,有必要提供一種具較高傳熱性能的扁平薄型 熱導管及其製造方法。 [0006] 一種扁平薄型熱導管,包括中空扁平的管體及設置在管 體内的第一毛細結構與第二毛細結構,該管體包括蒸發 段及冷凝段,該管體包括頂板及與該頂板相對的底板, 第一毛細結構由絲線形成,第一毛細結構從管體的蒸發 段延伸至冷凝段,所述第二毛細結構為由粉末燒結形成 ,所述第二毛細結構為實心結構並設置於管體的蒸發段 ,所述第二毛細結構連接於管體的頂板與底板之間,所 述第一毛細結構在蒸發段與該第二毛細結構連接。 [0007] 一種扁平薄型熱導管的製造方法,包括以下步驟:提供 一桿體,桿體呈圓柱狀,桿體的外圓週面上沿軸向開設 至少一收容槽,該桿體的一端的部分外圓週面上形成一 缺口,該缺口與該至少一收容槽連通;提供至少一由絲 線形成的第一毛細結構,將該至少一第一毛細結構置入 該桿體的該至少一收容槽中;提供一中空的金屬圓管, 圓管的内徑與桿體的外徑相當,將該桿體插入圓管中; 將金屬粉末填入位於圓管内的該桿體的缺口中,將該金 屬粉末燒結形成一第二毛細結構,第二毛細結構貼附於 099110232 表單編號A0101 第4頁/共24頁 0992018026-0 201135172 圓管的部分内壁上且與該至少一第一毛細結構連接;取 出桿體;及將圓管打扁成扁平薄型熱導管,使該第二毛 細結構位於該扁平薄型熱導管的管體的蒸發段並連接於 管體的頂板與底板之間,該至少一第一毛細結構在蒸發 段與該第二毛細結構連接,該至少一第一毛細結構從管 體的蒸發段延伸至冷凝段。 [0008] ❹ Ο [0009] [⑻ 10] 與習知技術相比,本發明的扁平薄型熱導管的厚度變薄 ,第二毛細結構起到支撐作用,確保蒸氣通道不會發生 堵塞,使得管體内蒸氣流動順暢。另,燒結粉末型的第 二毛細結構設置於管體的蒸發段,有效增加蒸發段的毛 細力,使冷凝段冷凝後的液體可以及時運送回蒸發段, 防止發生幹燒現象;同時由於在冷凝段中未設置第二毛 細結構,.而第一毛細結構在冷凝段所佔據的空間相對較 少,這可相對增加冷凝段的内部蒸氣通道以供蒸氣順暢 流動,同時保證在冷凝段凝結的工作介質通過第一毛細 結構回流到蒸發段,從而能保證扁平薄型熱導管具有良 好的散熱性能,適用於内部空間狹小的電子設備。 【實施方式】 請參閱圖1至圖3,該扁平薄型熱導管10包括一中空扁平 管體11、兩個第一毛細結構12、13、第二毛細結構14及 注入該管體11内的適量工作介質(圖未示)。 該管體11由銅等具良好導熱性的材料製成,可將其外部 的熱量傳遞至其内部。該管體11呈縱長扁平狀且密封, 沿其縱向包括一蒸發段111及一冷凝段113,蒸發段111 及冷凝段113分別位於管體11的縱向兩端。該管體11為一 099110232 表單編號Α0101 第5頁/共24頁 0992018026-0 201135172 [0011] [0012] [0013] 099110232 中空密封腔體’其由一中空圓管壓扁而成,包括—頂板 114、一底板Π 5及兩侧板11 6、11 7。該頂板Π 4與底板 115相互平行且上下相對,該兩侧板116、117呈弧形, 分別位於管體Π的兩侧並與頂板114和底板u5相連,從 而使該管體11在與縱向垂直的橫向的截面上形成類似跑 道型的輪廓。該管體11内具有光滑的内壁118。 第二毛細結構14為由銅等金屬粉末燒結形成的毛細結構 。第二毛細結構14設置於管體11的蒸發段ill的中央,且 第二毛細結構14為實心結構並連接於管體11的頂板114與 底板115之間,第二毛細結構14的兩侧分別與管體丨1的兩 個側板116、117之間間隔形成第一蒸氣通道141與第二 蒸氣通道142 * 每一第一毛細結構1 2、13呈一縱長的中空管狀體結構, 其由複數銅或不銹鋼等材料製成的絲線編織後形成一單 層絲網,在該管狀體内部形成一縱長的通道14(),並在該 管狀體的壁部121形成複數細小的孔隙,孔隙由絲線編織 後形成。在其他實施方式中,每一第一毛細結構12、13 也可以編織形成沿其徑向相互層疊的多層絲網。 該兩個第-毛細結構12、13位於第二毛細結構14的橫向 左、右兩側,且在蒸發段U1分別與第二毛細結構14的兩 侧連接固疋成一整體結構! 7。每—第—毛細結構12、13 沿縱向從該管體11的蒸發段ln延伸至冷凝段113。每一 第-毛細結構12、13的中空管狀體在管體u内被麼扁成 扁平狀,並分別與管體!!的頂板114、底板115連接。在 管體11的蒸發段⑴,位於左側的第一毛細結構12與管體 第6頁/共24頁 表單編號A0101 0992018026-0 201135172 ii左側的側板116_形成所述第_蒸氣通道i4i,位於 右侧=第-毛細結構13與管體u右側的側板m間隔形成 所述第二蒸氣通道142,所述第一蒸氣通道141及第二蒸 氣通道142可供蒸氣通過,即該整體結構^與管體^的蒸 發段111的内壁118之間形成可供蒸氣通過的所述第一蒸 氣通道14i及第二蒸氣通道142。在管體⑽冷凝段u3、 ,兩個第-毛細結構12、13之間間隔於冷凝段ιΐ3的中央 形成第三蒸氣通道143,第一毛細結構12與管體U的左側 板116之間間隔形成第四蒸氣通道144,第-毛細結構13 鮮體11的右側板117之間觸形成第m通道145, 所述第二蒸氣通道143、第四蒸氣通道144及第五蒸氣通 道145可供蒸氣通過,第四蒸氣通道144與第—蒸氣通道 141沿縱向連通,第五蒸氣通道145與第二蒸氣通道142 沿縱向連通。 [0014]該工作介質為水、酒精、甲醇等具較低沸點的物質。當 管體11的蒸發段1H與熱源接觸時,該工#介質從蒸發段 〇 ni處吸熱蒸發成汽體,蒸氣溢散至位於蒸發段11丨的通 道140、第一蒸氣通道141及第二蒸氣通道142中,蒸氣 帶著熱量從通道140、第一蒸氣通道141與第二蒸氣通道 142往冷凝段113運送,並經由通道】4〇、第三蒸氣通道 143、第四蒸氣通道144及第五蒸氣通道丨45運動至冷凝 •kl 13,在冷凝段Π3放熱後凝結成液體,將熱量釋放出 去,完成對發熱元件(圖未示)的散熱。第一毛細結構 12、13及第二毛細結構14提供毛細力使在管體丨丨的冷凝 #又113凝結形成的工作介質回流至蒸發段111,實現工作 099110232 表單編號A0101 第7頁/共24頁 0992018026-0 201135172 介質在管體U内的循環運動,以完成對發熱元件的持續 散熱。 ' [0015] [0016] [0017] 099110232 在扁平薄型熱導官10的打4成形過程中,第二毛細結構 14在洛發段⑴起到支料用,確保蒸氣通道不會發生堵 塞,使得管體11内蒸氣流動順暢。另,燒‘粉末型的第 二毛細結構14設置於管體11的蒸發段ill,與第一毛細結 構12、13-起有效增加蒸發段lu的毛細力使冷凝段 U3冷凝後的液體可以及時運送回蒸發段⑴防止發生 幹燒現象;同時由於在冷凝段m巾未設置第二毛細結構 14 ’而第-毛細結構12、13在冷凝段⑴所佔據的空間 ,對較少,這可相對增加冷,113的㈣蒸氣通道以供 洛氣順暢流動’同時保證在冷凝段113凝結的工作介質通 過第-毛細結構12、13回流到蒸發段ln。 第毛'U冓12、13與第二毛細結構14在蒸發段⑴具 車乂大的接觸面積’且第二毛細結構Η可以在其燒結 成型過程中與第—毛細結構12、观綱接在—起,從 第毛、、田L構12、13與第二毛㈣結構14之間結合緊密 ,故,工作介質通過第—毛細結龍、13回流至蒸發段 U1後’可以迅速滲透到第二毛細結構14中。本實施方式 =平薄型熱導管10可達到2龍以下,甚至當扁平薄型熱 旱度為1. 5mro時,該扁平薄型熱導管1〇仍能保證 的佳月匕仙於内部空間狹小的電子設備如筆記型 工只❿"八,興上一貫施方式习 編號在於’第—毛細結構22的數量為-個,第一毛細 表單編號Λ0101 货0 第8頁/共24頁 n( 201135172 222在扁平薄型熱㈣的蒸發段川穿設於第二毛細結 的中。卩’弟—毛細結構24與管體21左側的側板216 :形成第-蒸氣通道24卜第二毛細結㈣與管體21右 側的侧板2Π間隔形成第二蒸氣通咖。 [0018]BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe, and more particularly to a flat thin heat pipe and a method of manufacturing the same. [Prior Art "] At this stage, the heat pipe has been widely used in electronic components with large heat generation because of its high heat transfer capacity. When the heat pipe is in operation, the low-boiling working medium filled inside the pipe body absorbs the heat generated by the heat-generating electronic component in the evaporation portion, and then evaporates and vaporizes, the vapor moves to the condensation portion with heat, and condenses and condenses in the condensation portion to release the heat. , heat dissipation of electronic components. The liquefied working medium is returned to the evaporation portion under the action of the capillary structure of the heat pipe wall, and continues to evaporate vaporization and liquefaction condensation, so that the working medium circulates inside the heat pipe, and the heat generated by the electronic component is continuously emitted. Today's electronic products are continually inclined to develop in a light, short, and short direction. The problem of heat dissipation in electronic products is becoming more and more important in ever-shrinking spaces. This requires heat-dissipating products to be lighter, shorter, and lighter, and requires higher heat and heat dissipation. Conventional heat pipes use only a single capillary structure, and the capillary structure can be generally divided into a groove type, a sintered type, a fiber type, a wire mesh type, etc., and the capillary structure is disposed on the pipe wall of the heat pipe or closely adheres to the pipe wall. In the circular heat pipe, the working medium of the condensation portion can be timely returned to the evaporation portion of the heat pipe. However, when the heat pipe is flattened, especially when it is flattened to a very thin thickness, the capillary structure is liable to be deformed, disintegrated, etc., so that the liquid transporting ability is greatly reduced, and the liquid transporting ability of the entire heat pipe cannot be 099110232 Form No. 1010101 Page 3 of 24 0992018026-0 201135172 Added by other means, resulting in a large drop in the maximum heat transfer of the heat pipe and an increase in thermal resistance. At the same time, because the thickness of the heat pipe is very thin, the use of the conventional capillary structure makes the vapor passage inside the heat pipe narrow, and it is impossible to transport the vapor from the evaporation section to the condensation section in time, which also largely leads to the maximum heat pipe. The amount of heat transfer has dropped dramatically. SUMMARY OF THE INVENTION [0005] In view of this, it is necessary to provide a flat thin heat pipe having a high heat transfer performance and a method of manufacturing the same. [0006] A flat thin heat pipe includes a hollow flat tube body and a first capillary structure and a second capillary structure disposed in the tube body, the tube body including an evaporation section and a condensation section, the tube body including a top plate and the same a first base structure opposite to the top plate, the first capillary structure is formed by a wire, the first capillary structure extends from the evaporation section of the pipe body to the condensation section, the second capillary structure is formed by sintering of the powder, and the second capillary structure is a solid structure and The second capillary structure is connected between the top plate and the bottom plate of the pipe body, and the first capillary structure is connected to the second capillary structure in the evaporation section. [0007] A method for manufacturing a flat thin heat pipe, comprising the steps of: providing a rod body having a cylindrical shape, wherein at least one receiving groove is formed in an axial direction on an outer circumferential surface of the rod body, and a portion of one end of the rod body Forming a notch on the outer circumferential surface, the notch communicating with the at least one receiving groove; providing at least one first capillary structure formed by the wire, the at least one first capillary structure being disposed in the at least one receiving groove of the rod body Providing a hollow metal round tube having an inner diameter equal to the outer diameter of the rod body, inserting the rod body into the round tube; filling the metal powder into the notch of the rod body in the round tube, the metal The powder is sintered to form a second capillary structure, and the second capillary structure is attached to 099110232 Form No. A0101 Page 4 / Total 24 Page 0992018026-0 201135172 A part of the inner wall of the round tube is connected to the at least one first capillary structure; And flattening the round tube into a flat thin heat pipe such that the second capillary structure is located between the evaporation section of the tube of the flat thin heat pipe and is connected between the top plate and the bottom plate of the pipe body, the at least one The capillary structure is connected to the second wick in the evaporator section, the capillary structure extends at least a first section from the evaporator section to the condenser tube. 0008 Ο [0009] [(8) 10] Compared with the prior art, the thickness of the flat thin heat pipe of the present invention is thinned, and the second capillary structure serves as a support to ensure that the vapor passage does not become clogged, so that the tube The vapor flow in the body is smooth. In addition, the second capillary structure of the sintered powder type is disposed in the evaporation section of the pipe body, effectively increasing the capillary force of the evaporation section, so that the liquid condensed in the condensation section can be transported back to the evaporation section in time to prevent dry burning; and at the same time due to condensation The second capillary structure is not disposed in the segment, and the first capillary structure occupies relatively less space in the condensation section, which can relatively increase the internal vapor passage of the condensation section for smooth flow of steam while ensuring condensation in the condensation section. The medium is returned to the evaporation section through the first capillary structure, thereby ensuring good heat dissipation performance of the flat thin heat pipe, and is suitable for electronic equipment having a small internal space. 1 to 3, the flat thin heat pipe 10 includes a hollow flat tube body 11, two first capillary structures 12, 13, a second capillary structure 14, and an appropriate amount injected into the tube body 11. Working medium (not shown). The tube body 11 is made of a material having good thermal conductivity such as copper, and heat from the outside thereof can be transmitted to the inside thereof. The tube body 11 is vertically long and sealed, and includes an evaporation section 111 and a condensation section 113 along the longitudinal direction thereof. The evaporation section 111 and the condensation section 113 are respectively located at longitudinal ends of the tube body 11. The tube body 11 is a 099110232 Form No. Α0101 Page 5 / Total 24 Page 0992018026-0 201135172 [0012] [0013] 099110232 Hollow sealed cavity 'which is flattened by a hollow circular tube, including - top plate 114, a bottom plate Π 5 and two side plates 11 6 , 11 7 . The top plate Π 4 and the bottom plate 115 are parallel to each other and are vertically opposed to each other. The two side plates 116 and 117 are arc-shaped, respectively located on both sides of the pipe body and connected to the top plate 114 and the bottom plate u5, so that the pipe body 11 is in the longitudinal direction. A vertical runway profile is formed on a vertical transverse section. The tube body 11 has a smooth inner wall 118 therein. The second capillary structure 14 is a capillary structure formed by sintering a metal powder such as copper. The second capillary structure 14 is disposed at the center of the evaporation section ill of the pipe body 11, and the second capillary structure 14 is a solid structure and is connected between the top plate 114 of the pipe body 11 and the bottom plate 115, and the two sides of the second capillary structure 14 are respectively Forming a first vapor passage 141 and a second vapor passage 142 with the two side plates 116, 117 of the tubular body 1 * Each of the first capillary structures 1 2, 13 has an elongated hollow tubular structure, which is A plurality of wires made of a material such as copper or stainless steel are woven to form a single-layer wire mesh, and an elongated passage 14 () is formed inside the tubular body, and a plurality of fine pores and pores are formed in the wall portion 121 of the tubular body. Formed by weaving the thread. In other embodiments, each of the first capillary structures 12, 13 may also be woven to form a multi-layered screen laminated to each other in the radial direction thereof. The two first-capillary structures 12, 13 are located on the lateral left and right sides of the second capillary structure 14, and are integrally connected to the two sides of the second capillary structure 14 in the evaporation section U1 to form a unitary structure! 7. Each of the first capillary structures 12, 13 extends longitudinally from the evaporation section ln of the tubular body 11 to the condensation section 113. The hollow tubular bodies of each of the first capillary structures 12, 13 are flattened in the tubular body u and are respectively associated with the tubular body! ! The top plate 114 and the bottom plate 115 are connected. In the evaporation section (1) of the pipe body 11, the first capillary structure 12 on the left side and the side plate 116_ on the left side of the pipe body page 6 of the form number A0101 0992018026-0 201135172 ii form the first steam passage i4i, located at The right side = first capillary structure 13 is spaced apart from the side plate m on the right side of the tubular body u to form the second vapor passage 142, and the first vapor passage 141 and the second vapor passage 142 are adapted to pass steam, that is, the integral structure The first vapor passage 14i and the second vapor passage 142 through which the vapor passes are formed between the inner walls 118 of the evaporation section 111 of the tubular body. A third vapor passage 143 is formed in the center of the condensation section ι 3 between the condensation section u3 of the pipe body (10), and between the two first capillary structures 12, 13, and the first capillary structure 12 is spaced from the left side plate 116 of the pipe U. Forming a fourth vapor passage 144, the right side plate 117 of the first capillary structure 13 is formed to form an mth passage 145, and the second vapor passage 143, the fourth vapor passage 144, and the fifth vapor passage 145 are available for vapor. By passing, the fourth vapor passage 144 communicates with the first vapor passage 141 in the longitudinal direction, and the fifth vapor passage 145 communicates with the second vapor passage 142 in the longitudinal direction. [0014] The working medium is a substance having a lower boiling point such as water, alcohol or methanol. When the evaporation section 1H of the pipe body 11 is in contact with the heat source, the medium # absorbs heat from the evaporation section 〇ni to vaporize, and the vapor overflows to the passage 140 located in the evaporation section 11丨, the first vapor passage 141 and the second. In the vapor passage 142, the vapor carries heat from the passage 140, the first vapor passage 141 and the second vapor passage 142 to the condensation section 113, and passes through the passage 4, the third vapor passage 143, the fourth vapor passage 144, and the The five vapor passages 运动45 move to the condensation. kl 13. After the condensation section 放3 releases heat, it condenses into a liquid, releasing the heat, and completing the heat dissipation of the heating element (not shown). The first capillary structures 12, 13 and the second capillary structure 14 provide a capillary force to cause the working medium formed by condensation of the tube body condensing #113 to flow back to the evaporation section 111 to realize the work 099110232 Form No. A0101 Page 7 of 24 Page 0992018026-0 201135172 The cyclic motion of the medium within the tube U to complete the continuous heat dissipation of the heating element. [0017] [0017] 099110232 During the forming process of the flat thin heat guide 10, the second capillary structure 14 acts as a support in the Luofa section (1), ensuring that the vapor passage does not become clogged, The vapor flow in the tube 11 is smooth. In addition, the second capillary structure 14 of the powder type is disposed in the evaporation section ill of the tube body 11, and the first capillary structure 12, 13 effectively increases the capillary force of the evaporation section lu so that the liquid condensed by the condensation section U3 can be timely Carrying back to the evaporation section (1) to prevent dry burning; at the same time, since the second capillary structure 14' is not disposed in the condensation section, the space occupied by the first capillary structure 12, 13 in the condensation section (1) is less, which is relatively The cold, 113 (four) vapor passage is provided for smooth flow of the Luo gas' while ensuring that the working medium condensed in the condensation section 113 is returned to the evaporation section ln through the first capillary structure 12, 13. The first hair 'U冓12, 13 and the second capillary structure 14 have a large contact area in the evaporation section (1) and the second capillary structure can be connected to the first capillary structure 12 in the sintering process. Starting from the first hair, the field L structure 12, 13 and the second hair (four) structure 14 tightly combined, so the working medium through the first capillary capillary, 13 back to the evaporation section U1 'can quickly penetrate into the first In the second capillary structure 14. The present embodiment is as follows: the flat-thin heat pipe 10 can reach below 2 dragons, and even when the flat thin heat-drying degree is 1.5 mro, the flat thin heat pipe 1 〇 can still guarantee the good space of the electronic device with narrow internal space. For example, the note-type worker only ❿"eight, the consistent application method number is that the number of the 'first-capillary structure 22 is -, the first capillary form number Λ 0101 goods 0 page 8 / total 24 pages n (201135172 222 in flat The evaporation section of the thin heat (4) is passed through the second capillary knot. The —'--the capillary structure 24 and the side plate 216 on the left side of the tubular body 21: forming the first vapor passage 24, the second capillary knot (four) and the right side of the tubular body 21 The side panels 2 are spaced apart to form a second vapor pass. [0018]

[0019] [0020] 圖5示出本發明的第三較佳實施方式,與第-實施方式不 同之處在於,扁平薄型熱管3G内設置三個第_毛細結構^ 33、35 ’其中個第—毛細結構35在蒸發段311穿沒在第二毛細結構34的中部,另外兩個第—毛細結構犯 、33在蒸發段311分別位於第二毛細結構_兩側。 明參閱圖6至圖8,以下以扁平薄型熱導管1〇為例,介紹 所述扁平薄賴導㈣可^町步驟制得: 提供一桿體15,如圖7所示,桿體15呈圓柱狀,桿體㈣ 外圓週面151上沿軸向開設兩個對稱的收容槽⑸ 〇 [0021] [0022] ’该桿體15的縱向-端155的部分外圓週面上形成一缺口 154,該缺口 154分別與該南猶收容槽152、153連通; 提供兩個第-毛細結構12、13,分別將該兩個第一毛細 結構12、13置入桿體15的兩個收容槽152、ι53中; 提供-中空金屬圓管18,圓管18的内徑與桿體15的外徑 相‘ ’將該桿體15插入圓管18中; [0023]將金屬粉末填入位於圓管18内的桿體15的缺口 154中,將 金屬粉末高溫燒結形成第二毛細結構14 ’第二毛細結構 14貼附於圓管18的部分内壁181上且與第一毛細結構12 、13連接固定; 099110232 表單編號A0I01 第9頁/共24頁 0992018026-0 201135172 [0024] 取出捍體15 ’如削所示,第—毛細結構】2、似第二毛 細結構14留置於圓管18中; 抽真空並封閉圓管18的縱向 [0025] 向圓管18内填充工作介質 兩端以形成圓形熱導管16 闕將圓形熱導管16打扁成扇平薄型熱導管ι〇。 闕在金輕末燒結成第二毛細結構14賴巾,第二毛細結 構14不僅貼合於圓形熱導管16的内壁161上並且與第— 毛細結構12、13-併燒結連接,該扁平薄型熱導管_ 制程簡單,便於量產。進一步而言,在打扁前,第二毛 細結構14僅貼合於圓形熱導管16的蒸發段的部分内壁i6i 上’這使得第二毛細結構14在打扁過程中不容易發生崩 解。 闺綜上所述,本發明符合發明專利要件,f依法提出專利 申°月淮以上所述者僅為本發明之較佳實施例,舉凡 熟悉本案技藝之人士,在爰依本發明精神所作之等效修 飾或變化,皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0029]圖1為本發明第-實施方式的扁平薄型熱導管側視圖。 闕圖2為圖1所示扁平薄型熱導管的沿η_π橫向剖面示意圖 [0031 ]圖3為圖1所示扁平薄型熱導管的沿π I -111橫向剖面示 意圖。 _ ® 4為本發明第二實施方式的扁平薄型熱導管在蒸發段的 099110232 表單編號Α0Ι01 第10頁/共24頁 0992018026-0 201135172 橫向剖面示意圖。 [0033] 圖5為本發明第三實施方式的爲平薄型孰導技少# …&隹瘵發段的 橫向剖面示意圖。 [0034] 圖6為圖1所示扁平薄型熱導管的一製造方法的流程圖。 [0035] 圖7為圖6所示製造方法中桿體及圓管的立體示意圖。 [0036] 圖8為圖6所示製造方法中圓形熱導管的橫向剖面示意圖[0020] FIG. 5 shows a third preferred embodiment of the present invention, which differs from the first embodiment in that three flat-thickness structures 33, 35' are disposed in the flat thin heat pipe 3G. - The capillary structure 35 is worn in the middle of the second capillary structure 34 in the evaporation section 311, and the other two first capillary structures are in the evaporation section 311 on both sides of the second capillary structure. Referring to FIG. 6 to FIG. 8 , the following is an example of a flat thin heat pipe 1 ,, which is described in the following steps: A rod body 15 is provided. As shown in FIG. 7 , the rod body 15 is as shown in FIG. 7 . Cylindrical, rod body (4) Two symmetrical receiving grooves (5) are formed in the axial direction on the outer circumferential surface 151. [0021] [0022] A notch 154 is formed on a portion of the outer circumferential surface of the longitudinal end 155 of the rod body 15, The notches 154 are respectively connected to the south jujube receiving slots 152, 153; two first capillary structures 12, 13 are provided, and the two first capillary structures 12, 13 are respectively placed in the two receiving slots 152 of the rod body 15, Provided - a hollow metal round tube 18, the inner diameter of the round tube 18 is aligned with the outer diameter of the rod body 15' to insert the rod body 15 into the round tube 18; [0023] filling the metal powder into the round tube 18 In the notch 154 of the inner rod body 15, the metal powder is sintered at a high temperature to form the second capillary structure 14'. The second capillary structure 14 is attached to the inner wall 181 of the circular tube 18 and is fixedly connected to the first capillary structure 12, 13; 099110232 Form No. A0I01 Page 9 / Total 24 Page 0992018026-0 201135172 [0024] Take out the carcass 15 ' as shown, the first - Capillary structure 2, like the second capillary structure 14 is left in the circular tube 18; vacuuming and closing the longitudinal direction of the circular tube 18 [0025] Filling the round tube 18 with the working medium ends to form a circular heat pipe 16 The shaped heat pipe 16 is flattened into a flat thin heat pipe ι〇. The crucible is sintered into a second capillary structure 14 in the gold light, and the second capillary structure 14 is not only attached to the inner wall 161 of the circular heat pipe 16, and is sintered and connected to the first capillary structure 12, 13-, the flat thin heat pipe _ The process is simple and easy to mass produce. Further, before the flattening, the second capillary structure 14 is only attached to a portion of the inner wall i6i of the evaporation section of the circular heat pipe 16' which makes the second capillary structure 14 less prone to disintegration during the flattening process. In summary, the present invention complies with the requirements of the invention patent, and the patent is filed according to law. The above description is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are in accordance with the spirit of the present invention. Equivalent modifications or variations are intended to be included in the scope of the claims below. BRIEF DESCRIPTION OF THE DRAWINGS [0029] FIG. 1 is a side view of a flat thin heat pipe according to a first embodiment of the present invention. 2 is a schematic cross-sectional view along the η_π side of the flat thin heat pipe shown in FIG. 1. [0031] FIG. 3 is a schematic cross-sectional view along the π I-111 of the flat thin heat pipe shown in FIG. 1. _® 4 is a flat thin heat pipe according to a second embodiment of the present invention in the evaporation section of 099110232 Form No. Ι0Ι01 Page 10 of 24 0992018026-0 201135172 Transverse section schematic. 5 is a schematic transverse cross-sectional view of a flat-type 孰 guide technology less than a third embodiment of the present invention. 6 is a flow chart of a method of manufacturing the flat thin heat pipe shown in FIG. 1. 7 is a perspective view of a rod body and a round tube in the manufacturing method shown in FIG. 6. 8 is a transverse cross-sectional view of a circular heat pipe in the manufacturing method shown in FIG. 6.

【主要元件符號說明】 [0037] 扁平薄型熱導管:10、20、30 [0038] 管體:11、21 [0039] 蒸發段:111、211 、311 [0040] 冷凝段:113 [0041] 頂板:114 [0042] 底板:115 [0043] 側板:116、117、 216 、 217 [0044] 内壁:118、181 [0045] 第一毛細結構:12 、13、22、32、33、35 [0046] 壁部:121 [0047] 第二毛細結構:14 ' 24 ' 34 [0048] 通道:140 第11頁/共24頁 099110232 表單編號.A0101 0992018026-0 201135172 [0049] 第一蒸氣通道: 141 、 241 [0050] 第二蒸氣通道: 142 > 242 [0051] 第三蒸氣通道: 143 [0052] 第四蒸氣通道: 144 [0053] 第五蒸氣通道: 145 [0054] 桿體:15 [0055] 外圓週面:151 [0056] 收容槽:152、 153 [0057] 缺口 : 1 54 [0058] 縱向一端:15 5 [0059] 圓形熱導管:1 6 [0060] 内壁:161 [0061] 整體結構:17 [0062] 圓管:18 099110232 表單編號A0101 第12頁/共24頁 0992018026-0[Main component symbol description] [0037] Flat thin heat pipe: 10, 20, 30 [0038] Pipe body: 11, 21 [0039] Evaporation section: 111, 211, 311 [0040] Condensation section: 113 [0041] Top plate : 114 [0042] Base plate: 115 [0043] Side plates: 116, 117, 216, 217 [0044] Inner wall: 118, 181 [0045] First capillary structure: 12, 13, 22, 32, 33, 35 [0046] Wall: 121 [0047] Second capillary structure: 14 ' 24 ' 34 [0048] Channel: 140 Page 11 / Total 24 pages 099110232 Form number. A0101 0992018026-0 201135172 [0049] First vapor channel: 141, 241 [0050] Second vapor channel: 142 > 242 [0051] Third vapor channel: 143 [0052] Fourth vapor channel: 144 [0053] Fifth vapor channel: 145 [0054] Rod body: 15 [0055] Circumferential surface: 151 [0056] Storage groove: 152, 153 [0057] Notch: 1 54 [0058] Longitudinal end: 15 5 [0059] Circular heat pipe: 1 6 [0060] Inner wall: 161 [0061] Overall structure: 17 [0062] Round tube: 18 099110232 Form number A0101 Page 12 / Total 24 page 0992018026-0

Claims (1)

201135172 七、申請專利範圍: Ο 3201135172 VII. Patent application scope: Ο 3 =平_熱導管,包括中空扁㈣管體及設 ^第-毛細結構與第二毛細結構,該管體包括蒸發段及 ^凝段,該管私括頂板及與_板彳目對的純,其改良 第—毛細結構由絲線形成,第-毛細結構從管體的 ==至冷凝段’所述第二毛細結構為由粉末燒結形 ,-毛細結構為實心結構並設置於管體的蒸發段 笛:述第二毛細結構連接於管體的頂板與底板之間,所述 第-毛細結構錢錢倾第二毛細結構連接。 如申請專利範圍第1項所述的扁平薄型熱導管,其中所述 第-毛細結構設置於管體的蒸發段的中央。 如申請專職圍第1項所料騎薄型料#,其中所述 第-毛細結構為由轉線編織形成的中空的管狀體。 4.如申請專利範圍第1項所述的扁平薄型熱導管,其中所述 第二毛細結構在燒結成型過程中與所述第一毛細結構於蒸 發段燒結連接成整體結構^ i 5 .如申請專利範圍第_所述的扁平薄型熱導管其中所述 整體結構與管體的蒸發段的内壁間隔形成可供蒸氣通 蒸氣通道。 .如申請專利範圍第1項所述的扁平薄型熱導管,其中所述 第-毛細結構的數量為兩個,該兩個第一毛細結構在蒸發 段分別位於第二毛細結構的兩側。 .如申請專利範圍第6項所述的扁平薄型熱導管,其中該管 體還包括兩個側板,該兩個側板分別位於管體的兩側並與 頂板和底板相連,該兩個第一毛細結構與該管體的兩個側 099110232 表單編號A0I01 第13頁/共24頁 0992018026-0 201135172 蒸氣通道及第二蒸氣 板間隔分卿成可供蒸氣通過的第一 通道。 =申f利範圍第1項所述的扁平薄型熱導管,其中所述 毛細結構在蒸發段穿設在第二毛細結構的中部。 如申請專雜圍第8項所述抑平薄«導管,其中該管 體還包括兩個側板’該兩個側板分別位於管體的兩側並與 、底板相4 „亥第—毛細結構的兩侧與該管體的兩個 Γ板間隔分卿成可供聽通㈣第-蒸氣通道及第二蒸 氣通道。 10 如申請專職圍幻韻述的騎彻熱導管其中所述 ㈣賴量為』’其中—個錢發段穿設在第 毛細、、α構的中和另外兩個在蒸發段分別也於第二毛細 結構的兩侧。 .如申料㈣圍第1〇項料的扁平薄^熱導管,其中所述 管體還包括兩個侧板’所述兩個難分触於管體的兩侧 並與頂板和底板相連,所述__第一毛細結構與該管 體的兩個側板間隔分別形成可供蒸氣通過的第一蒸氣通道 及第二蒸氣通道》 12 ·如申請專利範圍第i項所述的扁平薄型熱導管其中所述 第-毛細結構為單層絲網或者沿徑向相互層疊的多層絲網 13 .如申凊專利範圍第ι12中任意一項所述的扁平薄型熱導 管’其中該熱導管的厚度在2 mm以下。 4.種扁平薄型熱導管的製造方法,包括以下步驟: 知:供一#體,;f干體呈圓柱狀,桿體的外圓週面上沿軸向開 §史至少一收容槽,該桿體的一端的部分外圓週面上形成— 表單編號A0101 第14頁/乒24苜 ' 0992018026-0 201135172 Ο 15 ❹ 16 17 18 099110232 缺口,該缺口與該至少一收容槽連通; 提供至少-由絲線形成的第 .Λ 口構’將該至少一筮— 毛細結構置人該桿體的該至少—收容槽第 提供—中空的金屬圓管,圓管的内徑鱼 將該桿體插入圓管中; Ά體的外徑相當, 將金屬粉末填入位於圓管内的 於古、陆认 瞪的缺口中,將該金屬 叔末k結形成一第二毛細結構 的却八^ 七、-田結構貼附於圓管 的#内壁上且與該至少一第一毛細結構連接. 取出桿體;及 ^圓管打扁成扁平薄型熱導管,使該第二毛細結構位㈣ 熱導Γ—的管體的蒸發段並連接於管體的頂板與底X a H—毛細結構在蒸發段與該第二毛細結 =接’該至少一第一毛細結構從管體的蒸發段延伸至冷 如申請專利範圍第14項所述的扁平薄型熱導管的製造方法 ’其中該第二毛細結構設置於管體的爲發段的中央。 如申請專利範圍第u項所述的扁平薄型熱導管的製造方法 ’其中每-第-毛鈿結構為由絲線編織形成的中空的管狀 體。 * 如申請專利範圍第14項所述的扁平薄型熱導管的製造方法 ’其中該第二毛細結構在燒結成型過程中與該至少—第— 毛細結構於蒸發段燒結連接成一整體結構。 如申請專利範圍第17項所述的扁平薄型熱導管的製造方法 ,其中該整體結構與管體的蒸發段的内壁間隔形成可供蒸 乳通過的秦氣通道。 如申請專利範圍第14項所述的扁平薄型熱導管的製造方法 表單編號A0101 第15頁/共24頁 ' 0992018026-0 19 201135172 20 21 . 22 . 、〇至^帛毛細結構的數量為兩個,該兩個第— 、、田結構在蒸發段㈣位於第二毛細結制兩側。— 如申請專利範圍第14項所述的扁”型熱導管㈣ 其m > -第—毛細結構在蒸發段穿設在第 構的中部。 七、、、田結 如申凊專利範圍第14項所述的爲平薄型熱導管的製造方 ,其中該至少—第—毛細結構的數量為三個复 蒸發段穿設在第二毛細結構財部,料兩個在蒸發段分 別位於第一毛細結構的兩側。 如申請專利範_14至21中任意—項職的扁平薄型熱 導管的製造方法,其中該熱導管的厚度在2咖以下。、 099110232 表單編號A0101 第16頁/共24頁 0992018026-0= flat _ heat pipe, comprising a hollow flat (four) pipe body and a first-capillary structure and a second capillary structure, the pipe body comprising an evaporation section and a condensing section, the tube of the private roof and the pure The modified first-capillary structure is formed by a wire, the first capillary structure is from the == to the condensation section of the pipe body, the second capillary structure is sintered by powder, the capillary structure is a solid structure and is disposed in the evaporation of the pipe body. Duandi: The second capillary structure is connected between the top plate and the bottom plate of the pipe body, and the first capillary structure is connected to the second capillary structure. The flat thin heat pipe of claim 1, wherein the first capillary structure is disposed at a center of an evaporation section of the pipe body. For example, the application of the full-time enclosure 1 item is to ride the thin material #, wherein the first-capillary structure is a hollow tubular body formed by braiding. 4. The flat thin heat pipe according to claim 1, wherein the second capillary structure is sintered in the sintering process with the first capillary structure in an evaporation section to form an integral structure. The flat thin heat pipe of the invention is characterized in that the integral structure is spaced apart from the inner wall of the evaporation section of the pipe body to form a vapor-permeable vapor passage. The flat thin heat pipe according to claim 1, wherein the number of the first capillary structures is two, and the two first capillary structures are respectively located on both sides of the second capillary structure in the evaporation section. The flat thin heat pipe according to claim 6, wherein the pipe body further comprises two side plates respectively located at two sides of the pipe body and connected to the top plate and the bottom plate, the two first capillaries Structure and the two sides of the tube 099110232 Form No. A0I01 Page 13 / Total 24 Page 0992018026-0 201135172 The vapor channel and the second vapor plate are separated into a first passage through which the vapor can pass. The flat thin heat pipe of claim 1, wherein the capillary structure is disposed in the middle of the second capillary structure in the evaporation section. For example, the application of the special section 4, the flattening thin «conduit, wherein the tube body also includes two side plates', the two side plates are respectively located on both sides of the pipe body and the bottom plate phase 4 „海第— capillary structure The two sides of the tube are separated from the two jaws of the tube body to be audible (four) first-vapor channel and second vapor channel. 10 If applying for a full-time phantom rhyme, the said (4) 』 'Which - a section of money is worn in the first capillary, the middle of the alpha structure and the other two in the evaporation section are also on both sides of the second capillary structure. For example, the flat of the first item of the material (4) a thin heat pipe, wherein the pipe body further comprises two side plates 'the two are hard to contact the two sides of the pipe body and are connected to the top plate and the bottom plate, the __first capillary structure and the pipe body The two side plate spaces respectively form a first vapor channel and a second vapor channel through which the vapor can pass. 12 A flat thin heat pipe according to the above item i, wherein the first capillary structure is a single layer mesh or a multi-layered screen 13 laminated to each other in the radial direction. A flat thin heat pipe of the type in which the thickness of the heat pipe is less than 2 mm. 4. A method for manufacturing a flat thin heat pipe comprises the following steps: knowing: for a body, the body of the f is cylindrical The outer circumferential surface of the rod body is axially opened to at least one receiving groove, and a part of the outer circumferential surface of the rod body is formed - Form No. A0101 Page 14 / Table 24 苜 ' 0992018026-0 201135172 Ο 15 ❹ 16 17 18 099110232 a notch, the notch being in communication with the at least one receiving slot; providing at least one of the at least one accommodating groove formed by the wire forming the at least one 筮-capillary structure of the shank - a hollow metal round tube, the inner diameter of the round tube is inserted into the round tube; the outer diameter of the body is equivalent, and the metal powder is filled into the notch of the ancient and the land in the round tube, and the The tertiary metal k-junction forms a second capillary structure, but the octagonal structure is attached to the inner wall of the circular tube and is connected to the at least one first capillary structure. The rod body is taken out; and the round tube is flattened. a flat thin heat pipe to make the second capillary knot Positioning (4) heat-conducting the evaporation section of the tube body and connecting to the top plate and bottom of the tube body X a H-capillary structure in the evaporation section and the second capillary junction = connection 'the at least one first capillary structure from the tube body The evaporating section extends to a method of manufacturing a flat thin heat pipe as described in claim 14 wherein the second capillary structure is disposed in the center of the tubular body as the hair segment. The method for manufacturing a flat thin heat pipe wherein the per-thro-bristle structure is a hollow tubular body formed by weaving a wire. * The method for manufacturing a flat thin heat pipe according to claim 14 The two-capillary structure is sintered and joined to the at least the first-capillary structure in the sintering section to form a unitary structure during the sintering process. The method for producing a flat thin heat pipe according to claim 17, wherein the integral structure is spaced apart from the inner wall of the evaporation section of the pipe body to form a Qin gas passage through which the steam can pass. Manufacturing method of flat thin heat pipe according to claim 14 of the patent application form No. A0101 Page 15 of 24 '9202018026-0 19 201135172 20 21 . 22 . The number of capillary structures is two The two first, and the field structures are located on both sides of the second capillary junction in the evaporation section (four). - The flat type heat pipe (4) as described in claim 14 of the patent application, the m > - the first capillary structure is placed in the middle of the first structure in the evaporation section. VII, ,,,,,,,,,,,,,,,,, The method for manufacturing a flat-type heat pipe, wherein the at least one-capillary structure has three re-evaporation segments disposed in the second capillary structure, and the two are located in the first capillary structure in the evaporation section. The manufacturing method of the flat thin heat pipe of any one of the patents _14 to 21, wherein the thickness of the heat pipe is less than 2 coffee. 099110232 Form No. A0101 Page 16 / Total 24 Page 0992018026- 0
TW099110232A 2010-04-01 2010-04-01 Flat type heat pipe and method of manufacturing the same TWI482938B (en)

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JPH08303971A (en) * 1995-04-28 1996-11-22 Fujikura Ltd Flat heat pipe for use in cooling portable personal computer and its manufacturing method
JPH08303972A (en) * 1995-05-02 1996-11-22 Fujikura Ltd Flat heat pipe for use in cooling portable personal computer and its manufacturing method
TWI289654B (en) * 2006-06-02 2007-11-11 Foxconn Tech Co Ltd Composite heat pipe and method of producing the same
TW200907277A (en) * 2007-08-03 2009-02-16 Foxconn Tech Co Ltd Heat pipe
TW200923306A (en) * 2007-11-21 2009-06-01 Forcecon Technology Co Ltd Flat heat pipe having sintered multiple channel wick structure
JP4653187B2 (en) * 2008-01-31 2011-03-16 古河電気工業株式会社 Thin heat pipe and manufacturing method thereof
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