201133677 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種測試裝置，特別是指一種晶片測 試裒置。 【先前技術】 以目前半導體製造業的通常狀況來說，封裝製程雖是 -必要製程，但是’半導體封裝同樣具有其所帶來的風險 ，例如在封裝時受環境微粒的污染，或封襄製程精密度不 佳而造成測試品損壞等原因，皆會導致成品良率的降低。 但是’由於半導體製造技術日趨進步，目前已有許多業者 正積極投入研發不需封裝的晶片，意即在晶圓製造完成後 ’切割下來的每—裸晶即是成品，並不需要再經過一封裝 製程，雖然以目前來說此種技術尚未成熟，但此種，，不封裝” 的製作方式極有可能成為日後半導體製造業中的趨勢，因 展出#可對未封裝之裸晶進行測試之測試裝置， 對於晶片測試的相關業者來說乃是一個相當重要的課題。 =所示，台灣公開第2_2562〇『晶片測試裝置』 勺二為申凊人之前申請的發明專利案，該晶片測試裝置 ^一具有複數探針1G的測試座u、—設於該測試座u 且用於搭載一裸晶12的手測蓋13。 ，藉由將搭載有該裸晶12的該手測蓋13進—步地下愿 ，晶12與該等探針〗°電連接以供測試之用， 試裝置在作掌T缺乏此類測試治具的問題，但該晶片測 «置在作業令只能夠測試單一顆裸晶12，而且必須以人 201133677 工 的方式將該手測蓋π進一步下厭 曰 /下壓，—次僅能夠測試單顆 曰日片的方式，較難增進其測試效 ^ w a , 馬了此夠長:升此類測 试b具的便利性，以及測試效率， 干甲s月人仍持續對該晶片 測試裝置進行改良。 【發明内容】 因此，本發明之目的，即在 ^ 丨在徒供一種半自動化且能夠 提升晶片測試效率的晶片測試裝置。 於是，本發明晶片測試裝置， 1 迥用於對自一晶圓切割 下之裸晶進行測試，該晶片測呀梦番4八 曰曰乃州忒裝置包含—升降單元，及 一測試單元。 固定座上的驅 該升降單元具有一固定座、一設置在該 動器，及至少-受該_器控制移動的移動座 該測試單元具有至少一固設在該升降單元之固定座上 的測試座、一組合在該測試座上的探測本體，及至少一可 刀離地叹置在該升降單凡之移動座上且用以載放多片裸晶 的載放體，其中，該探測本體與該載放體相面對，而且該 探測本體具有多數用於測試該等裸晶的探測端。 該升降單元之移動座能夠在遠離該探測本體之一待測 位置與接近該探測本體之一測試位置間移動，當該移動座 在測試位置時，該探測本體之探測端會與該等裸晶接觸而 形成電連接》 本發明之功效在於，藉由該驅動器能夠控制該移動座 的升降位置，使載放有多片裸晶的載放體隨著該移動座位 移，而能夠使該等裸晶靠觸該探測本體之探測端而形成電 201133677 連接’而達到晶片職的效果，料自動化的測試流程， 可免除以人工的方式手動測試’進而有效提升晶片測試的 效率。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 乂下配。參考圖式之較佳實施例的詳細說明中，將可清楚 的呈現。201133677 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a test apparatus, and more particularly to a wafer test apparatus. [Prior Art] In the current situation of the semiconductor manufacturing industry, the packaging process is a necessary process, but 'the semiconductor package also has its risks, such as contamination by environmental particles during packaging, or packaging process. If the precision is poor and the test article is damaged, the yield of the finished product will be reduced. However, due to the advancement of semiconductor manufacturing technology, many companies are actively investing in the development of chips that do not need to be packaged, meaning that each die that is cut after wafer fabrication is finished, and does not need to go through one. The packaging process, although the technology is not yet mature at present, but this, no packaging" production method is very likely to become a trend in the semiconductor manufacturing industry in the future, because the exhibition # can test the unencapsulated bare crystal The test device is a very important issue for the relevant manufacturers of wafer testing. = The Taiwan Patent No. 2_2562〇 "Wafer Test Device" is the invention patent file previously filed by Shen Yi. The device has a test socket u having a plurality of probes 1G, a hand test cover 13 disposed on the test socket u and configured to mount a die 12, and the hand test cover 13 on which the bare crystal 12 is mounted Into the underground, the crystal 12 and the probes are electrically connected for testing purposes, the test device is in the palm of the hand T lack of such test fixtures, but the wafer test « placed in the operation order can only test single The bare crystal 12, and the hand test cover π must be further disgusted/depressed in the way of 201133677. The method of testing only one single day is difficult to improve the test effect. This is long enough: to improve the convenience of such test b, and the test efficiency, the dry tester continues to improve the wafer test device. [Invention] Therefore, the object of the present invention is to The wafer testing device is semi-automated and capable of improving the efficiency of wafer testing. Thus, the wafer testing device of the present invention is used for testing bare crystals cut from a wafer, and the wafer is tested by Meng Fan. The 曰曰 忒 忒 包含 包含 包含 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 升降 上 上 上 上 上 上 上 上The unit has at least one test seat fixed on the fixing base of the lifting unit, a detecting body combined on the testing seat, and at least one knife-slung slanting on the moving base of the lifting and lowering Loading a chip-mounted carrier, wherein the detecting body faces the carrier, and the detecting body has a plurality of detecting ends for testing the bare crystals. The moving base of the lifting unit can be away from the detecting One of the to-be-measured positions of the body moves between a test position and a test position of the detecting body. When the moving seat is in the test position, the detecting end of the detecting body contacts the bare crystals to form an electrical connection. The drive device can control the lifting position of the moving seat, so that the carrier body carrying the plurality of bare crystals can be displaced by the movable seat, so that the bare crystals can be formed by contacting the detecting end of the detecting body. Electric 201133677 connection 'to achieve the effect of the wafer job, the automated test process, can be exempted from manual testing manually 'and thus effectively improve the efficiency of wafer testing. [Embodiment] The foregoing and other technical contents, features and effects of the present invention are formulated in accordance with the present invention. The detailed description of the preferred embodiments of the drawings will be apparent.
示，本發明晶片測試裝置之較佳實施例適 :於對自一晶圓切割下之多數片裸晶2進行測試，每一裸 日日2具有多數個用於與外界設備電連接的接觸端（圖未示）， 該晶片測試裝置包含—升降單元3，及—測試單元4。 該升降早兀3具有-固定座31、一設置在該固定座31 下方的驅動益32、二受該驅動器32控制移動的移動座33 ’及二供相對應的移動座33樞設且連設在該驅動器Μ上 的累方疋杯體34 ’在本實施例中，該驅動器32為馬達，用以 控制该等螺旋桿體34旋轉，進而能夠傳動相對應的移動座 3上下移動’當然，該移動座33上、下位移亦可利用氣 壓紅或者是油壓㈣方式來進行移動，並不偈限在本實施 例所揭露之螺旋桿體34與驅動器32(馬達）相配合的態樣。 △每-移動座33具有—調整平台331、一帶動該調整平 口 331在平面上橫移的第一調整件332、一帶動該調整平台 33i在平面上縱移的第二調整件333，及—帶動該調整平台 331在平面上旋轉一角度的第三調整件334。 在此要說明的是，該第—調整件332與第二調整件如 201133677 2作動方式相似’僅在料動的方向略有不同，其中，該 第一調整件332能夠帶動該調整平台331在如圖3所示沿 軸X左右移動’該第二調整件333能夠帶動該調整平台331 圖3所示/D抽Y别後移動，而該第三調整件334能夠 旋轉而帶動該調整平台331旋轉如圖3所示之角度Θ。 …續如圖2、3所示，該測試單元4具有二固設在該升降 3 m 31上的測試座43、二組合在相對應之測試 座43上的探測本體4卜及二對應設置在該升降單元3之移 動座33上的載放體42’其中’每一载放體42能夠放置在 相對應的調整平台331 _L，且形成有四個用以置放所述裸 晶2的置放槽40，而該等探測本體41是面對相對應的載放 體42，且每一探測本體41具有多數個用於測試該等裸晶2 的探測端411，在本實施例中，該等探測本體41是可拆離 地組合在該測試座43上，能夠配合不同規格之裸晶2進行 電連接，在此要說明的是，相異規格之裸晶2，其中接觸端 (圖未示）的配置位置與數量並不相同，所以，不同規格之 裸晶2的接觸端必須與不同的探測端411相配合，才能確實 達到電連接的測試狀態’而更換相對應的探測本體4丨能夠 替換相配合裸晶2之探測端411，進而達到對應接觸而形成 電連接的測試狀態。 依據上述之設計，每一載放體42之置放槽40皆放置 有多片裸晶2，將該等載放體42放置在相對應的移動座33 之調整平台331上，令該驅動器32驅動該等螺旋桿體34 旋轉’使該等移動座33能夠在如圖2所示之遠離該等探測 201133677 的待測位置，以及如圖4所示在接近該探測本體 41之一測試位置間移動。 當該等移動座33在待測位置時，藉由調整該第一、二 調整件332、333、334，進而對該等裸晶2之接觸端（ 圖未示）與該等探測本體41之探測端411之間的相對位置進 订校準。進而使該等載放體42中的裸晶2能夠與相對應的 探測本體41之探測端411對位，當該等移動座33被傳動而 自待測位置向上位移至測試位置時，該探測本體Μ之探測 •端4U會與該等裸晶2接觸而形成電連接的測試狀態進而 ㈣進行該等裸晶2的相關測試，待測試完畢後，該驅動 器32會控制該等移動座33穿多動恢復至待測狀態，此時， 使用者可再換置存放有待測裸晶2的載放體^，以便進行 下一批裸晶2的測試作業。 紅上所述，藉由該升降單元3之驅動器32能夠控制該 移動座33的升降位置，使載放有多片裸晶2的載放體U 隨著該移動座33位移’能夠靠觸該探測本體41之探測端 411而形成電連接，而達到晶片測試的效果，其半自動化的 測試流程，可免除以人工的方式手動測試，進而有效提升 晶片測試的效率，故確實能達成本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 7 201133677 圖1疋立體圖’說明台灣公開第200925620『晶片測 試裝置』發明專利案； 圖2是一側視圖，爷 況明本發明晶片測試裝置的較佳實 施例； 圖3疋一部分立體圖’說明該較佳實施例之移動座的 態樣；及 圖4是一側視圖，說明該較佳實施例之移動座在測試 位置的態樣。 201133677The preferred embodiment of the wafer testing apparatus of the present invention is suitable for testing a plurality of die 2 cut from a wafer, and each of the bare day 2 has a plurality of contact ends for electrically connecting to external devices. (not shown), the wafer testing apparatus includes a lifting unit 3 and a testing unit 4. The lifting platform 3 has a fixing base 31, a driving benefit 32 disposed under the fixing base 31, a moving seat 33' controlled by the driving of the driver 32, and two corresponding moving seats 33 pivoted and connected. In the present embodiment, the driver 32 is a motor for controlling the rotation of the auger body 34, thereby enabling the corresponding movable seat 3 to be moved up and down. Of course, The upper and lower displacements of the movable seat 33 can also be moved by the air pressure red or the hydraulic pressure (four), and the configuration of the screw body 34 and the driver 32 (motor) disclosed in the embodiment is not limited. The Δ per-moving seat 33 has an adjusting platform 331, a first adjusting member 332 that drives the adjusting flat opening 331 to traverse in a plane, a second adjusting member 333 that drives the adjusting platform 33i to be longitudinally displaced in a plane, and The third adjustment member 334 that rotates the adjustment platform 331 at an angle on the plane is driven. It should be noted that the first adjusting member 332 and the second adjusting member are similar to the second adjusting member, such as 201133677 2 'only slightly different in the direction of the feeding, wherein the first adjusting member 332 can drive the adjusting platform 331 at As shown in FIG. 3, the second adjustment member 333 can drive the adjustment platform 331 to move around the axis D, and the third adjustment member 334 can rotate to drive the adjustment platform 331. Rotate the angle Θ as shown in Figure 3. As shown in FIG. 2 and FIG. 3, the test unit 4 has two test seats 43 fixed on the lift 3 m 31, and two detection bodies 4 and two correspondingly arranged on the corresponding test seats 43. The mounting body 42' on the moving base 33 of the lifting unit 3, wherein each of the loading bodies 42 can be placed on the corresponding adjusting platform 331_L, and four places for placing the bare crystals 2 are formed. The detecting body 41 has a plurality of detecting bodies 411 for testing the bare crystals 2, and in this embodiment, the detecting body 41 has a plurality of detecting ends 411 for testing the bare crystals 2, in the embodiment, The detecting body 41 is detachably assembled on the test seat 43 and can be electrically connected with the bare crystals 2 of different specifications. Here, the bare die 2 of different specifications, wherein the contact end (Fig. The arrangement position and the number of the indications are not the same. Therefore, the contact ends of the bare crystals 2 of different specifications must be matched with the different detection ends 411 to be able to surely reach the test state of the electrical connection' and replace the corresponding detection body 4丨The detection end 411 of the matching die 2 can be replaced to achieve the corresponding contact Formed are electrically connected to the test. According to the above design, the placement slots 40 of each of the loading bodies 42 are placed with a plurality of bare crystals 2, and the loading bodies 42 are placed on the adjustment platform 331 of the corresponding moving base 33, so that the driver 32 is provided. Driving the auger shafts 34 to rotate 'to enable the moving seats 33 to be in a position to be tested away from the probes 201133677 as shown in FIG. 2, and to approach a test position of the probe body 41 as shown in FIG. mobile. When the moving seats 33 are in the position to be tested, the first and second adjusting members 332, 333, 334 are adjusted, and then the contact ends (not shown) of the bare crystals 2 and the detecting bodies 41 are The relative position between the probe ends 411 is stapled for calibration. The bare crystals 2 in the loading bodies 42 can be aligned with the detecting ends 411 of the corresponding detecting bodies 41, and when the moving seats 33 are driven and displaced upward from the position to be tested to the test position, the detecting The detection of the body • • the end 4U will contact the bare crystal 2 to form a test state of electrical connection, and (4) perform the relevant test of the bare crystal 2, after the test is completed, the driver 32 controls the moving seat 33 to wear The multi-action is restored to the state to be tested. At this time, the user can replace the carrier body 2 in which the die 2 to be tested is stored, so as to perform the test operation of the next batch of die 2. As described above, the driver 32 of the lifting unit 3 can control the lifting position of the moving seat 33, so that the carrier U carrying the plurality of bare crystals 2 can be displaced by the displacement of the moving seat 33. Detecting the detecting end 411 of the body 41 to form an electrical connection, and achieving the effect of the wafer test, the semi-automatic testing process can eliminate the manual testing by manual method, thereby effectively improving the efficiency of the wafer testing, so the invention can be achieved. purpose. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a preferred embodiment of the wafer testing apparatus of the present invention; FIG. 3 is a side view of a wafer testing apparatus of the present invention; A portion of the perspective view ' illustrates the embodiment of the movable seat of the preferred embodiment; and FIG. 4 is a side view showing the embodiment of the movable seat of the preferred embodiment at the test position. 201133677
【主要元件符號說明】 2 ....... 裸曰曰 4…… •…測試單元 Ο ....... Λ Λ..... ....^ 4^ 开降早7L 4U..... 罝放糟 31…… …·固定座 41 ••… •…探測本體 32…… •…驅動器 411 ··· …·探測端 33…… •…移動座 42···.. 載放體 331… •…調整平台 43 ·..·· •…測試座 332 ···. …·第一調整件 X…… 333… …·第二調整件 Y…… —轴 334… …·第三調整件 Θ ·.... ···.角度 34…… •…螺旋桿體[Main component symbol description] 2 ....... Naked 曰曰 4...... •...Test unit Ο ....... Λ Λ..... ....^ 4^ Open and drop 7L early 4U..... 糟 糟 31... ...· fixing seat 41 ••... •...detecting body 32... •...driver 411 ·····detecting end 33... •...moving seat 42···. Loading body 331... •...Adjustment platform 43 ·..··•...Testing seat 332 ······The first adjustment part X... 333... The second adjustment part Y...-axis 334... ·The third adjustment piece Θ ·.... ···. Angle 34... •... Helical body