200925620 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種測試裝置，特別是指一種晶片測 試裝置。 【先前技術】 如圖1所示，習知之晶圓測試裝置1 ’是可對一晶圓進 行相關之測試’該晶圓上具有複數塊裸晶（die)，而每一裸 晶皆具有複數用於與外界電連接之接觸部，該晶圓測試裝 置1包含一測試電腦11、一測試頭i 2、一具有複數探針的 探針卡13(pr〇be card)、一測試體14，及一連接介面15。該 測試電腦11是與該測試頭12電連接，並用於處理欲測試之 事項如開路/短路測試（open/short test)等，該測試體i4是用 於承載該待測試的晶圓，並藉由一連接介面15與該測試電 腦11電連接，該探針卡13是與該測試頭12電連接，並藉 由自該探針卡13上突伸出的該等探針與該晶圓上之每一裸 晶的相對應接觸部電連接，進而對每一裸晶進行測試。 當該探針卡13的探針正確接觸該晶圓内的一顆裸晶的 相對應接觸部後，即會送出—開始測試訊號並透過該連接 介面15告知該測試電腦丨丨開始進行測試。 雖然現今之晶圓測試設備已相當成&，但是，目前在 業界對單裸晶測试的設備，僅是適用於對，，封裝後，，之裸晶 進行測試’而用於從晶圓切割後尚未封裝的單一裸晶進： 測試的設備仍相當少見。由於現有的所有對晶圓的測試設 備皆為業者長年下來累積的經驗所設計及規劃出的專用設 5 200925620 要對其進行改裝以配合進行對單—裸晶㈣試 半導體封裝產業中無疑是一大問題觀纟逐漸薄利化的 以目前半導體製造業的通常狀況來說，封裝製程 一必要製程，但是，半導體封裝 u樣具有其所帶來的風險 =在封裝時受環境微粒的污染，或封裝製程精密度不 :造成測試品損壞等原因，皆會導致成品良率的降低。 Ο Ο 但是’由於半導體製造技術曰趨進步，目前已有許多業者 正積極投入研發不需封裝的晶片，意即在晶圓製造完成後 :刀割下來的每一裸晶即是成品，並不需要再經過一封裝 I程’雖然以目前來說此種技術尚未成熟，但此種，，不封裝” 的製作方式極有可能成為日後半導體製造業中的趨勢，因 7發展I套可對未封裝之單__裸晶進行測試之測試裝 =，對於晶片载的相關業者來說乃是—個相#重要的課 喊。 【發明内容】 因此，本發明之目的，即在提供-種小規模、成本低 肚並可安全地對尚未封裝的單—裸晶進行測試 裝置。 於是，本發明之晶片測試裝置，適用於對自一晶圓切 。下之單-裸晶進行測試，該晶片測試裝置包含：一測試 座、一手測蓋，及一壓動單元。 該測試座設有複數探針，詩與料㈣ 測試該裸晶。 6 200925620 該手測蓋是設置於該測 連接的連接部，以及―心連^上’並具有—與該測試座 活?並將該裸晶吸附於該測試部上的真 -收人位置門二：部疋可相對於該連接部在-開放位置與 真空吸附件即會鄰近：；等探:是位於該收合位置時，該 放位置時，料线附件即會遠離該等探針。 .〇 Ο 該麼動單元是設於該手測蓋之測試座上，並且有一活 ，手測蓋之測試部上並可進行軸向運動的把手 及-制動件，該制動件具有—固定端及一具有一滾輪的 動件的固定端是固設於該把手上，並藉由該 之滾輪與該測試部之真空吸附件相頂抵，當該把手 I-並進订轴向運動時’即會帶動該制動件在一測試位 由位置間移動，當該制動件是位於該自由位置且 是位於該收合位置時，被吸附於該真空吸附件上 裸晶即會與位於該測試座上的該等探針的相對上方，作 2未與該等探針電連接，當該制動件是位㈣測試位置: =试部是位於該收合位置時，該真空吸附件即會被該制 動件之滾輪下壓’並令被吸附於該真空吸附件上的裸晶與 位於該測試座上的該等探針電連接。 本發明之功效在於利用該手測蓋之測試部的真空吸附 待測試之裸晶吸附，並藉由該測試部之作動將該 裸曰曰帶至鄰近該測試座之探針’之後再利用該壓動單元之 制動件將吸附有該裸晶的該真空吸附件下壓，使該裸晶能 7 200925620 正確且安全地與該等探針電連接’進而達到安全測試的目 的0 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 清楚的呈現。 Ο 在本發明被詳細描述之前，要注意的是，在以下的說 明中’類似的元件是以相同的編號來表示。 如圖2、3所示，本發明晶片測試裝置之第一較佳實施 例，適用於對自一晶圓切割下之單一裸晶2〇〇(如圖中虚線 所示）進行測試，該裸晶200具有複數用於與外界設備電連 接之複數接觸部201，該晶片測試裝置包含一測試座2、一 手測蓋3，及一壓動單元4。 該測試座2設有複數探針21(配合該裸晶2〇〇之接觸部 201數量而定，本實施例中是以5支探針21來舉例說明）、 -微調滑台22’及二^位件23,該等探針21是用於與該 裸晶200之相對應接觸冑加電連接，進而對該裸晶· 進行產品測試，該微調滑台22具有一第一調整件221與一 第二調整件222 ’該第—調整件221是可帶動該測試座2在 平面上橫移’該第二調整件222是可帶動該測試座2在平 面上縱移，並藉此使該等探針21能更精確地與該裸晶· 之接觸部進行校準，而該等定位件23是㈣特# Η 相間隔地設置於該職W面上，並具有定位及限位 等力％冑該手測蓋3與該測試座2之間的相對作動更為 8 200925620 精確。在本實施例中是揭露出二個定位件23之態樣，但其 述數量及配置方式皆可再進一步調整，所以不應以本實施 利之說明為限。 該測試座2之探針21是如習知般與外界之一負責進行 測試的測試電腦（圖未示）電連接，由於該測試電腦所進行之 各種測試與所用之測試軟體，及其與該測試座2之間的通 Ο200925620 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a test apparatus, and more particularly to a wafer test apparatus. [Prior Art] As shown in FIG. 1, a conventional wafer testing apparatus 1' is capable of performing a related test on a wafer having a plurality of die on the wafer, and each die has a plurality of dies. a contact portion for electrically connecting to the outside, the wafer testing device 1 includes a test computer 11, a test head i 2, a probe card 13 having a plurality of probes, and a test body 14, And a connection interface 15. The test computer 11 is electrically connected to the test head 12 and is used for processing items to be tested, such as an open/short test, etc., the test body i4 is for carrying the wafer to be tested, and borrowing Electrically connected to the test computer 11 by a connection interface 15, the probe card 13 is electrically connected to the test head 12, and the probes are protruded from the probe card 13 and the wafer The corresponding contacts of each of the bare crystals are electrically connected, and each die is tested. When the probe of the probe card 13 correctly contacts a corresponding contact portion of a bare crystal in the wafer, a test signal is sent to the test computer and the test computer 15 is notified through the connection interface 15 to start the test. Although today's wafer test equipment has become quite a &, currently, the industry's single-die test equipment is only suitable for, after, after packaging, the bare crystal is tested' and used for the wafer. Single bare crystal that has not been packaged after cutting: The equipment tested is still quite rare. Since all existing wafer testing equipments are designed and planned for the long-term experience accumulated by the industry, 5 200925620 is to be modified to match the single-die (four) test semiconductor packaging industry. The problem of big problems is gradually thinning. In the current situation of semiconductor manufacturing, the packaging process is a necessary process, but the semiconductor package has the risk of being contaminated by environmental particles during packaging, or packaging. Process precision is not caused by damage to the test article, etc., which will result in a decrease in the yield of the finished product. Ο Ο But 'Because of the advancement of semiconductor manufacturing technology, many companies are actively investing in the development of wafers that do not require packaging, meaning that after wafer fabrication is completed: each die cut by the knife is the finished product, not Need to go through a package I process 'Although this technology is not mature at present, but this, no packaging" production method is very likely to become a trend in the semiconductor manufacturing industry in the future, because the development of 7 sets can be The package of the package __ bare crystal test test =, for the wafer carrier related to the industry is a phase # important class shouting. [Summary] Therefore, the object of the present invention is to provide - small The scale and cost are low and the test device can be safely tested on the un-packaged single-die. Thus, the wafer test device of the present invention is suitable for testing a single-die under a wafer. The test device comprises: a test seat, a hand measuring cover, and a pressing unit. The test seat is provided with a plurality of probes, and the test piece (4) tests the bare crystal. 6 200925620 The hand measuring cover is a connection disposed on the measuring connection. And the "heart connection" and having - the test seat is lived and the bare crystal is adsorbed on the test portion of the true-receiving position door 2: the portion can be in the open position relative to the connection portion Adjacent to the vacuum adsorption member:; etc.: When the position is at the folding position, the attachment of the material line is away from the probes. 〇Ο The moving unit is disposed on the hand cover And a handle and a brake member on the test portion of the living cover and capable of axial movement, the brake member having a fixed end and a fixed end of the movable member having a roller is fixed And the roller is pressed against the vacuum absorbing member of the test portion by the roller, and when the handle I-and the binding axial movement, the brake member is moved between positions by a test position. When the brake member is located at the free position and is located at the retracted position, the bare crystal adsorbed on the vacuum adsorption member is opposite to the probes located on the test socket. When the probe is electrically connected, when the brake is in position (four) test position: = the test part is located in the When the position is folded, the vacuum adsorption member is pressed down by the roller of the brake member and the bare crystal adsorbed on the vacuum adsorption member is electrically connected to the probes located on the test socket. The utility model is characterized in that the vacuum adsorption of the test portion of the hand cover is used to adsorb the bare crystal adsorption to be tested, and the bare jaw is brought to the probe adjacent to the test seat by the test portion, and then the pressure unit is used. The brake member presses the vacuum adsorbing member to which the bare crystal is adsorbed, so that the bare crystal energy 7 200925620 is correctly and safely electrically connected to the probes to achieve the purpose of safety testing. [Embodiment] Related to the present invention The foregoing and other technical contents, features, and advantages will be apparent from the following detailed description of the preferred embodiments of the accompanying drawings. Ο Before the present invention is described in detail, it is noted that In the following description, 'similar elements are denoted by the same reference numerals. As shown in FIG. 2 and FIG. 3, the first preferred embodiment of the wafer testing device of the present invention is suitable for testing a single die 2 切割 (shown by a broken line in the figure) cut from a wafer. The die 200 has a plurality of contacts 201 for electrically connecting to external devices. The wafer test device includes a test stand 2, a hand cover 3, and a pressing unit 4. The test stand 2 is provided with a plurality of probes 21 (depending on the number of contact portions 201 of the bare crystals 2, which are exemplified by 5 probes 21 in this embodiment), - fine-tuning the slide table 22' and two a bit member 23, the probes 21 are used for electrical connection with the corresponding contacts of the die 200, and then the product is tested for the die, the fine adjustment slide 22 has a first adjustment member 221 and a second adjusting member 222 'the first adjusting member 221 is configured to drive the test seat 2 to traverse in a plane'. The second adjusting member 222 is configured to drive the test seat 2 to be longitudinally displaced in a plane, thereby The probe 21 can be more accurately calibrated with the contact portion of the bare crystal, and the positioning member 23 is disposed on the W surface at intervals of (4), and has a force such as positioning and limiting.相对 The relative actuation between the hand cover 3 and the test seat 2 is more accurate. In the embodiment, the two positioning members 23 are exposed, but the number and arrangement thereof can be further adjusted, and therefore should not be limited to the description of the implementation. The probe 21 of the test stand 2 is electrically connected to a test computer (not shown) which is responsible for testing by one of the outside worlds, and various test tests and test software used by the test computer, and Wanted between test stands 2
訊協定及控制電路在業界中皆屬相當習知的技術，因此在 此並不加以資述。 該手測蓋3是設置於該測試座2上，並具有一與該測 試座2連接的連接部31，以及一與該連接部31相連接之一 測試部32,該測試部32上設有—可產生真空的—真空吸附 件33及一第三調整件34，該真空吸附件33可藉由自身所 產生的真空環境將該裸晶2〇〇吸附於該測試部32的底面， 該第三調整件34之作用與該第一調整件221之作動方式相 似’並可帶動該測試部32在—平面上橫移，進而與該第一 调正件221與第二調整件222相配合地對該裸晶細之接 觸。Ρ 201與該等探# 21 <間的相對位置進行校準。 、在本實施例中，該連接部31具有一貫穿之置入孔3ιι 以及四固接於該微調滑台22上並支樓該手測蓋3的支撐 柱312 S手測蓋3與該測試座2相連接時，該測試座2即 :伸入錢接部31之置人孔311中。該測試部^是藉由轴 弋一該連接部31相連接，進而使該測試部32 相對於該連接部31進行軸向運動。 該壓動單元4是設於該手測蓋3之測試座2上，並具 9 200925620 有一活動地設置於該手測蓋3之測試部32上，並可進行軸 向運動的把手4丨，及一制動件42,該制動件42具有一固 定端421及一具有一滾輪423的接觸端422，該制動件β 之固定端421是固設於該把手41上，並藉由該接觸端422 之滾輪423與該測試部32之真空吸附件幻相頂抵。 如圖 β 田於孩予測蓋3之測試部32之一側The protocol and control circuits are well-known technologies in the industry and are therefore not accounted for here. The test cover 3 is disposed on the test stand 2 and has a connecting portion 31 connected to the test seat 2, and a test portion 32 connected to the connecting portion 31. The test portion 32 is provided on the test portion 32. a vacuum adsorbing member 33 and a third adjusting member 34, wherein the vacuum adsorbing member 33 can adsorb the bare crystal 2〇〇 to the bottom surface of the test portion 32 by a vacuum environment generated by itself. The function of the third adjusting member 34 is similar to that of the first adjusting member 221, and the test portion 32 can be traversed on the plane, thereby cooperating with the first adjusting member 221 and the second adjusting member 222. Fine contact with the bare crystal. Ρ 201 is calibrated with the relative position between the probes 21 < In this embodiment, the connecting portion 31 has a through hole 3 ιι and a support post 312 S which is fixed to the fine adjustment slide 22 and supports the hand cover 3 and the test. When the seat 2 is connected, the test seat 2 is inserted into the manhole 311 of the money joint 31. The test portion is connected to the connecting portion 31 by the shaft, and the test portion 32 is axially moved relative to the connecting portion 31. The pressing unit 4 is disposed on the test seat 2 of the hand measuring cover 3, and has a handle 4丨 that is movably disposed on the testing portion 32 of the hand measuring cover 3 and can perform axial movement. And a brake member 42 having a fixed end 421 and a contact end 422 having a roller 423. The fixed end 421 of the brake member β is fixed on the handle 41, and the contact end 422 is supported by the contact end 422. The roller 423 is faintly offset from the vacuum absorbing member of the test portion 32. As shown in Fig. β, one side of the test section 32 of the child's test cover 3
是以軸接的方式與該連接部31的—側相連接，因此，該測 試部32是可相對於該連接部31在―開放位置與—收合位 置間移動，當該測試部32是位於該收合位置時，該測試部 32之真空吸附件即會鄰近於該等探針21，而當該測試部μ 是位於該開放位置時’該真空吸附件％即會遠離該等探針 2卜另外，當該測試部32是位於該收合位置時，該真空吸 附件33自身更可藉由該壓動單元4的帶動，進一步地相對 於該測試部32在-測試位置及_自由位置間移動。 如圖5、6所示’當該壓動單元4之把手41，皮扳動並 進行軸向運動時，即會帶動該制動件42在―測試位置及一 自由位置間移動，當該制動件 4切1干42疋位於該自由位置且該測 試部32是位於該收合位晋 位置時，被吸附於該真空吸附件33 上的裸曰曰200即會位於該測試座2上的該等探針η的相對 二，但尚未與該等探針21電連接，當該制動件Μ是位 於該測試位置且該測試部 a 1 W疋位於該收合位置時，該 吸附件33即會被該制動件42之滾輪- 附於該真空吸附件33 7极及 該等探針2丨電連接，進^⑽與位於制試座2上的 進而使對於該裸晶200的相關測試得 10 200925620 以開始進行。 值得注意的是，無論是在該自由或是測試位置時，該 真空吸附件33皆可藉由彈簧(因視角關係圖未示)的與該： 動件42之滾輪423相互頂抵，也就是說，該真空吸附件^ 在任何時刻皆是與該滾輪423相接觸。 !0 _ 再次參_ 3、4’由於該手測蓋3之測試部32是採用 如書本翻頁般之軸向運動的作動方式，運動之路徑是呈一 弧形狀’因此，如果設計方式是令該測試部32在抿^亥收 合位置時直接讓該裸晶2〇〇之接觸部2〇1與測試座2 ^探 針21相接觸並電連接，勢必會造在該裸晶2㈧之接觸部 2〇1上形成較大的接觸痕跡’也就是說，該等接觸部2〇i i 的探針痕(probe mark)即會很大，而在業界中，探針痕的大 小也是-晶片產品在品管上的—項重要指標（探針痕越小越 佳），因此，本發明之設計是令該測試部32在㈣至收合位 置時，該裸晶200之接觸部2()1與該等探針2 ，而是位於該等探針21的相對上方（如冑5中所示^= ，此時使用者及可藉由該第―、第二，及第三調整件221、 222、34來對該裸晶·以及該等探針21的相對位置進行 微調曰’使該裸晶200之各接觸冑2〇1可與其相對應之探針 付乂更精確地校準對齊，之後再藉由板該動壓動單元4 ^把手41 ’並藉此帶動該制動件42對該真空吸附件33進 订壓動進而帶動該裸晶200垂直下降至該測試位置（如圖 並使該等接觸部2〇1與該等探針21電連接以進行 11 200925620 由於該壓動單元4是令該裸晶200進行垂直的升降動 作，當與該等探針21接觸時，由於是垂直接觸的關係，所 造成的探針痕會比在弧形運動地接觸下所造成的探針痕要 小許多’有利於成品在探針痕大小方面的品質管控。 另外’為配合測試某些接觸部2 01之配置型態較特殊 的裸晶200時（如該等接觸部201僅是設於一裸晶2〇〇 _側 的同一邊）’該荨探針21也會相配合地具有一不對稱之配置 型態，在此情況下，如該裸晶200與該等探針21在接觸時 的力道未能恰當控制，很容易因受力不平均而造成該裸晶 200的損壞，而本發明可藉由其壓動單元4與該第一、第二 及第二調整件221、222、34相配合，有效地對下壓力道及 準確度進行控制，使得本發明也能安全地對接觸部2〇1分 佈不平均之裸晶2 0 0進行測試。 更重要的疋，本發明提供一種小規模的測試治具使 生線上的工程師能很輕易且安全地對一切割下的裸晶2㈧ 進行測試。此外，本實施提供了一對，’封裝前之單一裸晶 200”進行測試之治具，除了提供現今生產線上的測試工程師 一個解決無法對單一裸晶200進行測試的方案，也符合晶 片製造業積極朝向”無需封裝，，之晶片製造方式的潮流。口 如圖7所示，本發明晶片測試裝置之第二較佳實施例 ，大致上是與該第一較佳實施例相同，相同之處不再贅言 ’其中不相同之處在於：該測試座2之該等探針21是藉由 探針卡24的方式並可更換地設置於該測試座2上，本實施 例的優點在於，藉由更換不同的探針卡24，即可對多種不 12 200925620 同的裸晶200進行測試，進而增加本發明實際應用上的彈 性。 歸納上述，本發明之晶片測試裝置，利用該手測蓋3 之測試部32上的真空吸附件33搭載欲測試之該裸晶2〇〇, 使該裸晶2GG能被帶離或鄰近地位於該等探針2ι的相對上 方，而當該裸晶200是鄰近該等探針21的相對上方（即該 試部32位於收合位置）但尚未與料探針21接觸時，即可 Φ ❹ 藉由遠第- ’第二及第三調整件221、222、34相配合地調 整該裸晶與該等探針21間的相對位置，使兩者能更精 準的相互對齊校準，之後再利用扳動該壓動單纟4之板手 ’進而帶動該制動# 42並進一步地將該真空吸附件33下 麼，使吸附於該真空吸附件33上的該裸晶能與該等探 針21電連接以進行測試，因此，本發明提供了—可安全地 未封裝的單-裸晶2〇〇進行測試的小型治具，且在測 、。式時不會產生過大的探針痕，有利於品質管制，故確實能 達到本發明之目的。 ▲、准以上所述者’僅為本發明之較佳實施例而已，當不 能以此限定本發明眘始+ m 妒 貫施之範圍，即大凡依本發明申請專利 ，發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 設備； 圖疋側視不意圖，說明習知之_用於測試晶 圓的 圖疋iL體分解圖，說明本發明晶片測試裝置之第 13 200925620 一較佳實施例的分解後狀態； 圖3是一立體圖，說明該第— 乐較佳實施例之一測試部 是位於一收合位置； 圖4是一立體圖，說明該測試邱β 疋位於一開放位置； 圖5是一侧視圖’說明該第—軔 曰 ^ 較佳實施例之一制動件 是位於一自由位置； 圖6是一側視圖，說明該制動件是位於一測試位 及 ， 圖7是一立體分解圖，說明本發明晶片測試裴置之第 二較佳實施例之分解後狀態。 鲁 14 200925620 【主要元件符號說明】 2…… 測5式座 32···.· •…測試部 21 ··..· …·探針 33····. …·真空吸附件 22••… •…微調滑台 34·..·· …·第三調整件 221… …·第一調整件 4…… …·壓動單元 222… …·第二調整件 41 ····. …·把手 23·.··. •…定位件 42·.··· •…制動件 24••… •…探針卡 421 ··· •…固定端 3…… •…手測蓋 422… •…接觸端 31 ·.··. •…連接部 423… •…滚輪 311 ··· •…置入孔 200… ••裸日曰 312… •…支撐柱 201… •…接觸部 15The shaft portion is connected to the side of the connecting portion 31. Therefore, the testing portion 32 is movable relative to the connecting portion 31 between the "open position" and the folded position. When the test portion 32 is located In the folded position, the vacuum adsorbing member of the testing portion 32 is adjacent to the probes 21, and when the testing portion μ is in the open position, the vacuum adsorbing member % is away from the probes 2 In addition, when the test portion 32 is in the folded position, the vacuum adsorption member 33 itself can be further driven by the pressing unit 4, and further in the -test position and the free position relative to the test portion 32. Move between. As shown in Figures 5 and 6, when the handle 41 of the pressing unit 4 is pulled and moved in the axial direction, the brake member 42 is moved between the test position and a free position. When the test piece 32 is located at the free position and the test portion 32 is located at the retracted position, the bare cymbal 200 adsorbed on the vacuum absorbing member 33 is located on the test pedestal 2 The opposite of the probe η, but not yet electrically connected to the probes 21, when the brake member Μ is located at the test position and the test portion a 1 W 疋 is located at the collapsed position, the absorbing member 33 is The roller of the brake member 42 is attached to the 7 poles of the vacuum adsorption member 33 and the probes 2丨 are electrically connected, and the test is carried out on the test socket 2 to further test the relevant test for the bare crystal 200 10 200925620 To start. It should be noted that, in the free or test position, the vacuum absorbing member 33 can be offset from the roller 423 of the movable member 42 by a spring (not shown by the viewing angle diagram), that is, It is said that the vacuum adsorbing member ^ is in contact with the roller 423 at any time. !0 _ again _ 3, 4' Since the test portion 32 of the hand cover 3 is an action of axial movement like a book flip, the path of the motion is in the shape of an arc 'so, if design The method is such that the test portion 32 directly contacts and electrically connects the contact portion 2〇1 of the bare crystal 2〇〇 to the test post 2^probe 21 at the collapse position of the die portion 32, which is bound to be formed in the bare crystal. 2 (8) The contact portion 2〇1 forms a large contact mark. That is to say, the probe mark of the contact portion 2〇ii is large, and in the industry, the size of the probe mark is also - the important index of the wafer product on the quality control (the smaller the probe mark is, the better), therefore, the design of the present invention is such that the test portion 32 is in the (four) to the collapsed position, the contact portion 2 of the bare metal 200 () 1 and the probes 2, but located above the probes 21 (as shown in 胄 5 ^ = , at this time the user can be adjusted by the first, second, and third The pieces 221, 222, and 34 are used to finely adjust the relative positions of the bare crystals and the probes 21 so that the contacts 胄2〇1 of the bare crystals 200 can correspond to the probes乂 Aligning the alignment more precisely, and then pressing the unit 4 to actuate the unit 4 ^ 4 and thereby driving the brake member 42 to press the vacuum absorbing member 33 to drive the die 200 to vertically descend to the Test position (as shown in the figure and the contact portions 2〇1 are electrically connected to the probes 21 to perform 11 200925620. Since the pressing unit 4 is for vertically lifting the bare metal 200, when the probes are 21 contact, due to the vertical contact relationship, the resulting probe marks will be much smaller than the probe marks caused by the contact in the arc of the moving contact 'favorable quality control of the finished product in the size of the probe mark. 'In order to cooperate with the test of some contact portions 201, the configuration of the bare die 200 is more special (if the contact portions 201 are only on the same side of a bare die 2 〇〇 side) 'the 荨 probe 21 It also has an asymmetrical configuration, and in this case, if the force of the bare crystal 200 in contact with the probes 21 is not properly controlled, it is easy to cause the force to be uneven. Damage to the die 200, and the present invention can be performed by the press unit 4 and the first First, the second and second adjusting members 221, 222, and 34 are matched to effectively control the lower pressure channel and the accuracy, so that the present invention can also safely distribute the bare crystal 2 0 which is unevenly distributed to the contact portion 2〇1. More importantly, the present invention provides a small-scale test fixture that enables engineers on the line to easily and safely test a cut die 2 (eight). In addition, the present embodiment provides a pair. The fixtures for 'single die 200 before packaging' test, in addition to providing a test engineer on the current production line, can solve the problem of not being able to test a single die 200, and also conform to the positive direction of the wafer manufacturing industry. The trend of manufacturing methods. As shown in FIG. 7, the second preferred embodiment of the wafer testing apparatus of the present invention is substantially the same as the first preferred embodiment, and the same is no longer in common. 'The difference is that the test seat is: The probes 21 of the two are disposed on the test stand 2 by means of the probe card 24, and the advantage of this embodiment is that by replacing different probe cards 24, a plurality of 12 200925620 The same bare crystal 200 is tested to increase the flexibility of the practical application of the present invention. In summary, the wafer testing apparatus of the present invention uses the vacuum adsorbing member 33 on the test portion 32 of the hand measuring cover 3 to mount the bare crystal 2 欲 to be tested, so that the bare crystal 2GG can be taken away or adjacently. The probes 21 are relatively above, and when the bare crystals 200 are adjacent to the opposite sides of the probes 21 (ie, the test portion 32 is in the collapsed position) but have not been in contact with the probe 21, Φ ❹ By adjusting the relative position between the bare crystal and the probes 21 by the second and third adjustment members 221, 222, and 34, the two can be aligned and calibrated more accurately, and then used. Pulling the wrench of the pressing unit 4 to drive the brake #42 and further lowering the vacuum adsorption member 33, so that the bare crystal energy adsorbed on the vacuum adsorption member 33 and the probe 21 are Electrically connected for testing, therefore, the present invention provides a small fixture that can be safely unpackaged single-die 2 〇〇 for testing, and is under test. When the formula is not excessively large, it is advantageous for quality control, so that the object of the present invention can be achieved. ▲, the above-mentioned ones are only the preferred embodiments of the present invention, and the scope of the invention is not limited by the scope of the present invention. Equivalent variations and modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is an exploded view of a wafer for testing a wafer, illustrating the decomposition of a preferred embodiment of the wafer testing apparatus of the present invention. Figure 3 is a perspective view showing the test portion of the preferred embodiment of the first embodiment in a folded position; Figure 4 is a perspective view showing the test in the open position; Figure 5 is a side view The view 'describes the first step'. The brake member of the preferred embodiment is in a free position; FIG. 6 is a side view showing the brake member in a test position and FIG. 7 is an exploded perspective view illustrating The post-decomposed state of the second preferred embodiment of the wafer test apparatus of the present invention. Lu 14 200925620 [Explanation of main component symbols] 2... Test 5 type seat 32·····•...Test part 21 ·······Probe 33······· Vacuum suction part 22•• ... •... fine-tuning the slide table 34·..····the third adjustment member 221...the first adjustment member 4...the pressure unit 222...the second adjustment member 41····. Handle 23····. •... positioning member 42·.··· •...brake 24••... •...probe card 421 ··· •...fixed end 3... •...hand cover 422... •... Contact end 31 ····. •...connecting part 423... •...roller 311 ··· •...insertion hole 200... ••bare day 312... •...support column 201... •...contact part 15