201129275 六、發明說明： 〔發明所屬技術領域〕 本發明係有關一種多層印刷配線板的製造方法及蕋板 保持具、以及遮蔽板，特別是有關於僅在導通孔（via hole)開 口面施作電鍍處理之單面電鍍的多層撓性印刷配線板的製造 方法、及製造其多層印刷配線板所用的莲板保持具，以及遮 蔽板者。 〔先前技術〕 近年來，搭載於行動電話等之小型電子機器上的安裝蕋 板，對於微細化及髙密度化的要求更加高漲。針對這樣的安 裝基板之微細化及髙密度化技術的一個環節，揭示了有關將 安裝各種電子零件的安裝菡板部和撓性電纜部一體化、所謂 的具有可撓性電纜部的多層撓性印刷配線板之技術，基於該 技術的多層撓性印刷配線板係以行動m話等的小型電子機器 之用途爲中心地廣泛普及著（例如|參照專利文獻1、專利文 獻2)。 根據該技術的多層撓性印刷配線板之主流爲，利用NC 鑽孔或金屬模等方式在配線铒上挖孔後，施以通孔（through hole)電鍍，之後再於基板雙面形成電路，所謂的蕋板雙面之 通孔連接。然而，伴隨電子機器的小型化及高機能化，爲更 高密度地對基板進行零件安裝，逐漸形成由對零件安裝用的 通孔插入電子零件的端子作安裝的形態，轉爲進行將電子零 件直接安裝於基板上的表面安裝。因此，常表面零件安裝用 201129275 的通孔存在於零件安裝楚上時，會宵焊料朝相反側的基板面 流動而無法正常地進行奪件安裝的情況。 於是，透過藉雷射、電漿或樹脂蝕刻等手法形成微細的 有底導通孔在其上施以電鍍處理，以進行即便該導通孔存在 於零件安裝墊上亦能安裝電子零件之盲孔（blind via hole)連 接的手法，係使用在針對以行動m話的液晶附近爲中心朝小 型化進展之行動機器用的越板等。 然而，以此手法而言，由於要對基板的雙而施以電鍍處 理，所以即使在導通孔的非開口而側亦會造成導體的厚度增 加，因而變得難以將其後之根據感光蝕刻（photofabrication) 乎法（基於曝光處理的蝕刻手法）的蝕刻加工所形成之電路圖 案予以微細化。 於是，爲解決這樣的缺點，已揭示一種對使用前述的通 孔或盲孔連接的多層撓性印刷配線板上施作電鍍處理的情 況，使用框架型基板保持具進行電鍍處理的技術（例如，參照 專利文獻3、專利文獻4)。亦即，依據該技術往框架型基板 保持具，用以使基板的面內之爾鍍厚度均一化的遮蔽板係在 框體的雙面中設匱於上下左右的周邊部。 又，亦揭示一種爲避免因框架型菡板保持具之個體差所 致電鍍厚度不均的影響，改爲採用吊掛型蕋板保持具的技術 以取代框架型基板保持具（例如，參照與利文獻5)。依據該技 術爲避免電鍍厚度不均的影響，不使用框架型越板保持具， i 而採用於橫移自如地支持於陰極棒的吊掛型越板保持具上， 把要被電鍍處理之電路甚材的上部挾持成懸匪狀態並譲複數 個電路基,材鄰接。然後，讓複數個爾路蕋材鄰接的狀態下， 4 201129275 從陰極棒經由吊掛Μ基板保持具而對製品上部一邊供電，一 邊順著陰極棒在電鍍處理槽內的爾鍍液中横向且水平地行進 一邊實施電解電鍍處理，採用所謂的無框架式的電鍍裝置。 但是爲了使用此等電鍍裝置僅對蕋板單面施行電鍍處 理，對非電鍍面有必要使用爾鍍遮罩。因此，成爲更需要進 行遮掩用的電鍍遮罩之形成步驟、及用以剝離遮罩的剝離步 驟，因而成爲電鍍處理生產成本增加及製品成品率降低的原 因。 又，作爲僅在雙面撓性印刷配線板的導迎孔開口面實施 電鍍處理的手法的一個例子，揭示有一種製造雙面撓性印刷 配線板的方法，係將2片雙面貼銅積層板利用雙面微黏著薄 膜等以導通孔開口面朝外的方式貼合並形成導通界孔，且就 這樣地進行導通孔電鍍，之後透過剝離微黏著薄膜而僅在導 通孔開口面側形成電鍍被膜。（例如，參照專利文獻6) 依據該技術雖有能匯集地進行2片的雙面撓性印刷配 線板之導通孔電鍍的優點，但會因爲微黏著薄膜的貼合及其 剝離步驟等而變煩雜。特別是多屑撓性印刷配線板要如同雙 面撓性印刷配線板那樣採用捲軸式（Roll to Roll)進行電鍍處 理是有困難的。亦即，若是捲軸式的爾鍍處理則亦可連續地 進行微黏著薄膜的貼合及其剝離步驟等，但按各短薄片進行 貼合及剝離時，有加工成本變高之虜。 又，在使用熱發泡薄膜的情況中亦有必要進行將其熱發 泡薄膜剝離後的薄膜殘渣物處理。因此會有此等補助材料的 成本變高之虞。又，亦擔心起因於此等微黏著薄膜或熱發泡 201129275 薄膜的電鍍浴之污染或殘膠所引發蝕刻不良或端子電鍍不良 等品質降低的情形* 於是，爲解決此等缺點而揭示一種在使2片的電路基材 的背面平行地對向的狀態下進行爾解爾鍍處理的手法（例 如，參照專利文獻7)。依據該技術’各m路蕋材的背面側雖 因電場受遮蔽板所遮蔽而未被施作電鍍處理，但可在各電路 基材的表面側施行所期望之厚度的電鍍處理。然而，在陽極 間的中央部未設基板保持具而產生因電鍍裝置的個體差等使 陽極和m路蕋材之間有距離差那樣的情況中，爾解m鍍之厚 度依電鍍液電阻的差異而產生偏差，變得難以將其後之根據 感光蝕刻手法的蝕刻加工所形成之m路圖案予以微細化。 〔先前技術文獻〕 〔專利文獻〕 〔專利文獻1〕日本特許第3776304號公報 〔專利文獻2〕日本特許第4236837號公報 〔專利文獻3〕日本特開2〇〇6_291337號公報 C專利文獻4〕日本特開2〇〇8·ι38257號公報 〔專利文獻5〕日本特開2〇〇6·316322號公報 〔專利文獻6〕日本特開2006-086358號公報 〔專利文獻7〕日本特開平1卜229196號公報 〔發明内容〕 〔發明欲解決之課題〕 201129275 依據以上所述那樣的情事，期望實現一種更簡便且無電 鍍浴之污染，可僅在多層印刷配線板的導通孔之開口面施行 均一的電鍍處理之多層印刷配線板的製造方法》 於是，爲了提供一簡便的手法、無使用輔助材料且無電 鍍浴之污染下可廉價地穗定製造能僅在單面的導迎孔的開口 面形成電鍍被膜之多層印刷配線板的多層印刷配線板的製造 方法、及製造其多層印刷配線板所用的蕋板保持具、以及遮 蔽板，遂衍生出應解決的技術課題，本發明之目的在於解決 此課題》 〔解決課題之手段〕 本發明係爲達成上述目的而提案者，申請専利範圍第1 項所記載之發明提供一種多層印刷配線板的製造方法，其特 徵爲包含：第1步驟，作成具有3層以上的導電層和介於前述 各導電層間的絶緣層之電路基材；第2步驟•在由前述電路菡 材的一方的最外層的導電層到達另一方的最外層的導電層之 路徑中，形成僅前述一方具開口部的非貫通之導通用孔;.第3 步驟，對前述導通用孔的內壁進行導電化處理；第4步驟，準 備配備有遮蔽板的基板保持具，該遮蔽板具有覆蓋前述電路 基材的單面之面積，且具有自該電路基材朝下方延長的長度; 第5步驟，以具有前述開口部的前述一方的相反面側朝前述 遮蔽板地，將前述電路基材安裝於前述蕋板保持具；及第6步 驟，譲安裝在前述基板保持具的前述電路基材浸泡於電鍍 液、進行電解電鍍處理而形成僅單側具有·開口部的導通孔。 201129275 依據該方法，可簡便且免使用副基材、亦無電鍍浴之污 染下，廉價地穩定製造僅在單側的導通孔開口面形成電鍍被 膜的多層印刷配線板。再者，藉由將電路菡材和遮蔽板的間 隔設成較理想的15mm以下，可適當地抑制朝導通用孔開口 的相反面側繞入之電流所致電鍍析出。又，藉由將電路基材 和遮蔽板的間隙設成5mm以上，特別是在對多層撓性印刷配 線板等之薄狀物的爾路基材作m鍍處理的愦況，可抑制因電 路基材撓曲和遮蔽板接觸，使得爾鍍液的帶出變多，變難以 水洗等的情形。 申請專利範圍第2項所記載之發明提供一種多層印刷 配線板的製造方法，其特徵爲包含：第丨步驟，作成具有3層 以上的導電層和介於前述各導電層間的絶緣層之電路基材； 第2步驟，在由前述m路基材的一方的最外層的導電層到達 另一方的最外層的導電層之路徑中，形成僅前述一方具開口 部的非貫通之導通用孔；第3步驟，對前述導通用孔的內壁進 行導電化處理；第4步驟，準備一設置有遮蔽板的框架型基板 保持具，該遮蔽板具有將配備有朝該框架型基板保持具前述 電路基材供電的供電用端子之一對縱框以上側橫框及下側横 框保持間隔並固定的框體，且具有在前述一對縱框間支承前 述爾路基材上端的上端基材支承件及支承下端的下端蕋材支 承件，且與左右的前述一對縱框接觸並具有自前述上端蕋材 支承件朝前述下端基材支承件更下方延長的長度；第5步 驟，使具有前述開口部之前述一方的相皮而側朝前述遮蔽板 地，將前述電路基材的兩横端部安裝成和前述蕋板保持具的 前述供電用端子接觸；及第6步驟，使安裝在前述框架型蕋板 8 201129275 保持具上的前述電路基材浸泡於電鍍液，進行電解電鍍處理 形成僅單側具有開口的導通孔。 依據該方法•再者，將電路菡材安裝於框架型保持具進 行電鍍處理的情況，以和電路貍材的間隔是理想的15mm以 下且兩橫端部與框架型基板保持具接的方式，於非貫通的導 通用孔的開口部的相反面側設置遮蔽板|藉此可抑制兩橫端 部之電鍍析出。又，藉由將電路蕋材和遮蔽板的間隙設成5mm 以上，特別是在對多層撓性印刷配線板等之薄狀物的電路基 材作電鍍處理的情況，可抑制因爾路載材撓曲和遮蔽板接 觸，使電鍍液的帶出變多、變得難以水洗等的情形。 申請輿利範圍第3項所記敝之發明係提供一種多暦印 刷配線板的製造方法，其特徵爲包含：第1步驟，作成具有3 層以上的導電層和介於前述各導爾層間的絶緣層之m路基材; 第2步驟，僅前述電路基材的一方具有開口部，在由前述一 方的最外層的導電層到達另一方的最外層的導電層之路徑 中，形成僅前述一方具開口部的非貫通之導通用孔；第3步 驟，對前述導通用孔內壁進行導電化處理；第4步驟，將前述 電路基材以垂下並卡止的方式安裝於電鍍鉗上，該電鍍鉗對 懸掛著遮蔽板的吊掛型基板保持具進行供電，該遮蔽板係橫 移自如地支持陰極棒，且具有和前述電路菡材同等寛度及自 前述電路基材的上端延長到比下端更下方的長度；及第.5步 驟，使前述電路基材浸泡電鍍液，在和其他的吊掛型蕋板保 持具鄰接的狀態下進行電解電鍍處理，形成僅單側具有開口 的導通孔。 201129275 依據該方法，再者，將電路蕋材安裝在既組裝於遮蔽板 的吊掛型基板保持具上以進行電鍍處理的情況，在非貫通的 導通用孔的開口的相反面側，設電路蕋材和遮蔽板的間隔是 理想的15mm以下，且於電解電鍍時使兩相鄰者無間隔般地 讓各基板保持具的遮蔽板彼此鄰接，藉此可抑制兩横端部之 電鍍析出。又，藉由將電路基材和遮蔽板的間隙設成5mm以 上，特別是在對多層撓性印刷配線板等之簿狀物的爾路基材 作電鍍處理的情況，可抑制因電路蕋材撓曲和遮蔽板接觸， 使得電鍍液的帶出變多、變得難以水洗等的情形。 申請專利範圍第4項所記戦之發明係提供一種框架型 基板保持具，係製造多層印刷配線板所用的框架型蕋板保持 具，其特徵爲：設置有遮蔽板，該遮蔽板具有將配備有朝向電 路基材的供電用端子之一對縱框以上側及下側的横框保持間 隙並固定的框體，且具有在前述一對縱框間將前述電路基材 上端支承的上端基材支承件及支承下端的下端基材支承件， 且與左右的前述一對縱框接觸並具有自前述上端基材支承件 朝前述下端基材支承件更下方延長的長度。 依據該構成，在使用框架型蕋板保持具的情況，將遮蔽 板加工成能與其上端基材支承件接觸，且自其下端部朝下方 延長30mm以上，較佳爲延長60mm以上•較佳爲亦在下端 基材支承件設置輔助遮蔽板者。又|透過在馄解電鍍時使用 設置在非貫通的導通用孔開口的相反面側之框架型菡板保持 具，可抑制下端部之電鍍析出。但是，就箅把遮蔽板的下端 部作成太長，遮蔽效果亦不太會有提升，因而在考ffi到會有 10 201129275 與下側橫框之干涉及電鍍液的帶出量增加之缺點時，遮蔽板 的延長設爲120mm以下者較妥當。 申請專利範圃第5項所記載之發明係提供一種遮蔽 板，係橫移自如地懸掛於陰極棒，且安裝於將爾路S材垂下 並卡止並進行供電的吊掛型越板保持具上，其特徵爲具備有: 安裝於前述吊掛型基板保持具的肩部之把持部、及用以保持 前述電路基材的上端且進行遮蔽的突出部，1具有和前述電 路基材同等寛度及自前述電路基材的上端朝比下端更下方延 _ - 長的長度。 依據該構成，在使用無框架型電鍍裝置的情況，於懸掛 在陰極棒上的吊掛型基板保持具，將設有上端部菡材支承件 的遮蔽板固定。電路基材係以與上端部基材支承件接觸的方 式安裝於基板保持具。而且，將遮蔽板自爾路基材的下端部 朝下方延長30mm以上，較佳爲延長60mm以上，藉由在電 解電鍍時使用遮蔽板的下端部亦設置有輔助遮蔽板者，可抑 制下端部之電鍍析出。但是，就算把遮蔽板的下端部作成太 長，遮蔽效果亦不太會有提升，因而在考贵到會有重量增加 及電鍍液的帶出量增加$缺點時，遮蔽板的延長係設爲 120mm以下者較妥當。 〔發明效果〕 依據申請專利範圍第丨項所記載之發明，可簡便且不用 辅助材料在無電鍍浴之污染下，廉價且穩定地製造僅單側的 導通孔開口面形成有電鍍被膜的多層印刷配線板。且可在不 201129275 進行煩雜的抗蝕層形成等之步驟下，進行生產性良好的單面 爾鍍。 依據申請專利範圍第2項所記載之發明，將電路基材安 裝於框架型基板保持具進行電鍍處理的情況，適當設定和電 路基材的間隔，且以兩橫端部與越·板保持具接觸般地在非貫 通的導通用孔開口的相反面側設置遮蔽板，藉此可抑制兩横 端部之電鍍析出。又，亦無需進行剝離後的薄膜殘渣物之處 理，亦無需此等輔助材料的成本。而且亦完全無需顧慮因此 等微黏著薄膜或熱發泡薄膜所引起的電鍍浴之污染。 申請專利範圍第3項所記載之發明，將爾路基材安裝在 既組裝於遮蔽板上的吊掛型蕋板保持具進行爾鍍處理的情 況，由於在非貫通的導通用孔開口的相反面側*電路基材和 遮蔽板的間隔被適當地保持，所以_藉由在爾解電鍍時以兩相 鄰者無間隔的方式讓各基板保持具的遮蔽板彼此鄰接，可抑 制兩横端部之電鍍析出》再者，就算陽極與電路基材間因電 鍍裝置的個體差而存在有距離差的情況，電解電鍍厚度不會 產生差異，可容易將其後之根據感光蝕刻手法的蝕刻加工之 電路圖案予以微細化。由此等可知，係能廉ί53且穩定地製造 利用1單側具有導通孔的開口之窗孔接觸的多層印刷配線 板。 依據申請專利範圍第4項所記戦之發明，在使用框架型 基板保持具的情況，透過在爾解爾鍍時使用設置在非貫通的 導通用孔的開口的相反面側之越板保持具，可抑制下端部之 m鍍析出。因此，可提供適合於多屑印刷配線板的製造之框 架型基板保持具。 12 201129275 依據申請專利範圍第5項所記載之發明，在使用無框架 型電鍍裝置的情況，在懸掛於陰極棒的吊掛型越板保持具上 可將設有上端部g材支承件之適當大小的遮蔽板固定。藉 此，可提供適合於多層印刷配線板之製造的框架型基板保持 具以及組裝於吊掛型基板保持具的遮蔽板。 〔實施方式〕 本發明爲達成實現所謂以簡便的手法、且在未使用軸助 材料及無電鍍浴之污染之下，可廉價且穩定地製造能僅在單 面的導通孔開口面形成電鍍被膜之多層印刷配線板的製造方 法，遂透過提供具以下特徵之多層印刷配線板的製造方法來 實現，該製造方法包含：第1步驟，作成具有3層以上的導電 層和介於前述各導電層間的絶緣層之電路蕋材；第2步驟，在 由前述電路基材的一方的最外層的導電層到達另一方的最外 層的導電層之路徑中，形成僅前述一方具開口部的非貫通之 導通用孔；第3步驟，對前述導通用孔的內壁進行導電化處理； 第4步驟，準備配備有遮蔽板的越板保持具，該遮蔽板具有 覆蓋前述電路基材的單面之面積，且具有自該電路基材朝下 方延長的長度；第5步驟，以具有前述開口部的前述一方的相 反面側朝前述遮蔽板地，將前述電路蕋材安裝於前述基板保 持具；及第6步驟，讓安裝在前述蕋板保持具的前述電路基材 浸泡於電鍍液、進行電解電鍍處理而形成僅單側具有開口部 的導通孔。 201129275 以下，依據圖1至圖9詳細地說明本發明幾個較佳實施 例。此外，在各實施例中，針對共通的內容係在先述及的贲 施例中作說明，而在以後的實施例中將省略重複的說明。 〔實施例1〕 圖1爲本發明所涉及之共通的苡施例，其顯示3層構成 的多層撓性印刷配線板之製造步驟的菡板端而圖。首先，如 同圖1(a)所示那樣對聚醯亞胺等的可撓性絶緣基材1(在此爲 厚度25// m的聚醯亞胺）的雙而上形成苻原度12mm的銅箔2 及銅箔3的雙面貼銅積層板4，進行用以藉感光蝕刻手法形 成雙面的電路圖案等之抗蝕層的形成、曝光、顯影、蝕刻、 抗蝕層剝離等一連串的步驟》然後，在該雙面貼銅積層板4 的銅箔2及銅箔3 |形成雷射加工之際的正形（conformal)遮罩 2a、3a並對銅箔3形成內層電路圖案3b。 此時的雙面對位係對扁平的褪板材料進行，因而該越板 材料的伸縮等未受影響，可容易地確保雙面的位置精度。此 外，亦可因應需要而使用能髙精度雙而對位的曝光機》再者， 亦可因應需要進行將表面粗化的粗化處理以提升和接著劑5 的密接性β 其次，準備聚醯亞胺等的可撓性絶緣蕋材6(在此爲厚 度25mm的聚醯亞胺）的單面（在此爲背面）形成有厚度12mm 的銅箔7的單面貼銅積層板8，接著對此單面貼銅積層板8 沖切出設置可撓性電纜部用的開口部位，然後將該被沖切後 的單面貼銅稂層板8與用以將形成苟上述內層爾路的雙面貼 銅積層板4稂層的接著劑5進行對位。此外亦可因應需要， 14 201129275 將沖切有對位用的導引件等之單面貼銅積層板8與用以將形 成有上述內層電路的雙面貼銅稂層板4積暦的接著劑5進行 對位。 其次，如同圖1(b)所示，隔著接著劑5利用真空壓縮等 方式將雙面貼銅積層板4和單面貼銅積層板8積層。在以上 的步驟中形成3層構造的電路趟材9。此外，作爲接著劑5 宜使用難流動型（low flow type)的黏結片等會流出較少之類 的接著劑。又，在後面步驟無需作爲可撓性電纜部的接著劑 發揮機能的情況1由於可撓性不成爲必須要件，因而亦可使 用含玻璃布的預浸材作爲接著劑5但在考慮雷射加工性等 時，無玻璃布者較佳。又，接蕃劑5的厚度可選擇10~15 v m 左右者。 其次，如同圖1(c)所示，使用正形遮罩2a及3a進行雷 射加工，形成連接電路基材9之3層的銅箔2、銅箔3、銅箔 7用的非貫通的導通用孔10。此外，苟關用以形成導通用孔 10的雷射加工用雷射的種類，可選擇UV-YAG雷射、二氧化 碳雷射或準分子雷射等。 其次，如同圖1(d)所示，對具有導通用孔10的3層的 電路基材9進行導電化處理，施予10〜20 /z m左右的電解電 鍍處理而取得3層的銅箔2，銅箔3及銅箔7的層間導通。 此時，進行在没有開口的面側（亦即，同圖（d)的銅箔7之下 面側）不賦予電鍍之所謂的單面電鍍處理。 在此，針對單面電鍍處理的方法作說明。_ 2係顯示在 本發明實施例所涉及之基板保持具上安裝3靥的電路基材之 狀態的端面構成圖。亦即，在單而電鍍處理的方法方面，如 201129275 圖2所示係把具有導通用孔ίο的m路痤材9固定於基板保持 具（未圖式），和電路基材9的間隔燈15mm以下且湏蓋該電路 基材9的單面的方式設置遮蔽板13。此遮蔽板13係在電路 基材9固定於電解電鍍時的越板保持具（未圖式）之際，用以 覆蓋上端是藉基材支承件所固定的爾路越材9的開口部（亦 即，導通用孔10)的相反面（亦即，爾路菡材9的背面側）。又， 後面將詳述遮蔽板13被設成自12路骓材9的下端部朝下方延 長60mm以上。 如此一來，藉由把下端是藉蕋材支承件固定的電路基材 9設定在基板保持具，使之浸泡於電鍍液以進行電解電鍍處 理，如圖1(d)所示，能僅從導通用孔10的開口面側析出電鍍 被膜11。 此外，在圖2中電路菡材9和遮蔽板13的間隔比5mm 還窄時，由於電路基材9具可撓性，會有電路基材9和遮蔽 板13接觸，導通用孔10的開口面的相反面之液體更新變困 難而無法進行充分的水洗處理之處。另一方面電路基材9和 遮蔽板13的間隔比15mm還寛的惜況，上端雄材支承件部分 的遮蔽效果變弱而在導通用孔10的開口面之相反面，特別是 在電路基材9的上端部會有因爾解電鍍處理時的電流繞入而 析出不必要的電鍍之虞。 再回到圖1，利用圖2所示那樣的單面電鍍處理之手 法，如圖1(d)所示僅在3層的電路蕋材9的第1層施予電鍍 處理，且透過電鍍處理而在導通用孔10形成階梯狀導通孔 201129275 其次’如圖1(e)所示將已被施予電鍍處理的第1層之表 面（亦即’銅箔2的表面）與未被施予電鍍處理之第3層的背 面（亦即，銅箔7的表面），同時透過採用感光蝕刻手法的蝕 刻處理而形成電路圖案2b及爾路圖案7b。此時，爲確保蓋 孔（tenting)性（亦即，防止因蝕刻所致抗蝕層周邊的破損），屬 階梯狀導通孔12的開口面之第1層面宜適用具有20μ m以 上厚度的乾膜抗蝕層。 又，在無需考慮蓋孔性下，銅箔7的第3層而可適用10 从m以下之微細圖面形成用的乾膜抗蝕層。此外，在使用液 狀抗蝕劑的情況等時，因爲無需考慮階梯狀導通孔12的蓋孔 性，所以形成在第1層面和第3層而上的抗蝕層亦可相同厚 度。 其次，在第1層面和第3層面上形成阻焊層或覆蓋層， 亦因應需要形成設有既定開口的糊/薄膜等之屏蔽層。在此步 驟的前後，因應需要而在基板表面施予焊接、鍍鎳、鍍金等 的表面處理，透過進行外形加工，可獲得利用僅單側具有開 口的有底階梯狀導通孔連接之3層的多暦撓性印刷配線菡 板。此外，在利用前述的手法作成3層的多層撓性印刷配線 基板後，第3層面上形成了配線間距是60 μ m的高密度電路。 其次，針對本發明之多層印刷配線板的製造方法所適用 的實施例1之框架型基板保持具的構成作說明。圖3係顯示 本發明所涉及之實施例1的框架型越板保持具之楢成圖，圖 3(a)是前視圖、圖3(b)是仰視圖 '圖3(c)楚端面丨圈。以下，一 邊參照圆3的全圖一邊就實施例1的框架型菡板保持具之構 成作說明。 201129275 圖3中框架型基板保持辱20爲配備有對上部進行通電 用之鉤22的左右一對縱框21，係藉上側的上側横框23及下 側的下側橫框24保持間隔而構成固定的框體。在其框體的上 下橫框（亦即，上側橫框23及下側横框24)的內側，上端基材 支承件25和下端基材支承件26分別以跨左右的縱框21之間 的方式設置。又，在左右一對框體21的單面（亦即，前視圖 的背面側），遮蔽板27被安裝往上端骓材支承件25，該遮蔽 板27與左右的縱框21接觸，同時梢成有自下端蕋材支承件 26往下方延長的長度。再者，於下端褪材支承件26,補助遮 蔽板28被安裝在與遮蔽板27平行的方向。 茲針對圖3再作詳細說明，前視圖所示的一對縱框21 分別如仰視圖所示，由支柱21a及越板按壓板21b所構成。 又，基板按壓板21b透過支柱21a和鉸鏈21c而安裝成開閉 自如。而且•電路基材29以被其支柱21a及基板按壓板21b 所挾入的形1作安裝》 又，雖未特別圖示，但在挾持支柱21a及菡板按壓板 21b的爾路蕋材29的部分，設阶有朝該汜路菡材29供mfU 的供電用端子。其供電用端子的迎接端子係經由導線等與框 架型S板保持具20的上部之鉤22馆性迎接。亦即，透過該 鉤22與電鍍裝匱（未圖式）的上部之陰極棒接觸導通，而對框 架型基板保持具20的供電用端子供電。此外，爲了進行電路 基材29面內之電鍍厚度調整，亦可往前述蕋板按壓板21b 再安裝根據同一申請人的專利文獻3所記載那樣的板狀遮蔽 201129275 又，上側的上端基材支承件25用的上側橫框23及下側 的下端基材支承件26用的下側横樞24係分別安裝在左右的 縱框21，將該左右的縱框21保持成既定的間隔，同時擔任將 電路基材29的上下支撐之菡材支承件的角色。 又，在框架型基板保持具20，遮蔽板27被設置於覆蓋 電路基材29的單面之位置。本實施形態中的電路基材29的 單面是指被安裝之電路基材29的衷側（亦即，圖3之前視圖 的背面側”此外，此遮蔽板27設朦在和電路基材29的表面 相距5~ 15mm的位置。 此外，該遮蔽板27如仰視圖所示，左右與支柱2U無 間隙地相接觸。又，遮蔽板27的上部和上端菡材支承件25 稍微設有間隙，但如A-A’端面圖所示那樣，若在遮蔽板27 的上部和上端基材支承件25無間隙地相接的情況，有必要把 用以將抽空氣用的通路設在上端菡材支承件25。 又，如A-A’端面圖所示，遮蔽板27的下端是從下端 基材支承件26再延長至下方。其延長的長度設爲約90mm » 此外，遮蔽板27自電路基材29朝下方延長係短於30mm的 情況，遮蔽效果變弱而在導通用孔開口而之相反面，特別是 在零路基材29的下端部會有因電解爾鍍時之電流繞入而析 出不必要的電鍍之虞。另一方面，在遮蔽板27是自電路基材 29朝下方延長120mm以上的情況，會有和下側橫框24干涉、 及因附著在遮蔽板27上的液體而讓爾鍍液的帶出量增加等 之缺點。 因此，爲了提升對下側之繞入電流的遮蔽效果，遮蔽板 27的下部係設有朝向跟前側之傾斜。但有必要把自電鍍液槽 19 201129275 或水洗槽上昇時排液可被快速進行的程度之間隙，事先設置 在遮蔽板27和下端基材支承件26之間》 又，下端基材支承件26上安裝有輔助遮蔽板28。此_ 助遮蔽板28的髙度設爲20mm。此外，雖未圖示，但在下端 蕋材支承件26有必要事先設有排液用的通路，使得滯留在爾. 路基材29和輔助遮蔽板28之間的爾鍍液或水洗水被適切排 出。 〔實施例2〕 圖4係本發明所涉及之實施例2的框架型S板保持具之 構成圖，圖4(a)是前視圖、圖4(b)迸仰視丨01、圖4(c)是端而 圖。以下，一邊參照圖4的全圖一邊就實施例2昨框架型基 板保持具之構成作說明•和前述的圖3相同地，框架型基板 保持具30爲，具備供電用端子的左右一對縱框31、31’係 藉上側横框3 3及下側横框3 4被保持間隔而構成固定的框體。 圖4和圖3的不同點在於，具備有滑励的機構，可讓上 側横框33及下側横框34變Η問隔。闪此，遮蔽板37、37’ 被分割成左右，各自被安裝於左在的縱框31、3 Γ 。又，遮 蔽板37、37’係與左右的縱框31、31’接觸，同時構成有自 下端基材支承件36朝下方延長的長度。 亦即，此等遮蔽板37、37’係能相亙11#地滑動的構 成，且和上端基材支承件35之間產生微小的間隙。因此，爲 提升遮蔽效果遮蔽板37、37’的上側亦迚構成具葙超過上端 菡材支承件35而延伸的長度，使朝上側延.艮的部分朝跟前側 20 201129275 傾斜。再者，於下端基材支承件36同樣地安裝有輔助遮蔽板 38、38，。 〔實施例3〕 圖5係本發明所涉及之實施例3的框架型基板保持具之 構成圖，圖5(a)是前視圖、圖5(b)是仰視_、圖5(c)是端面 圖、圖5(d)是部分放大圖。以下，一邊參照圖5的全圖一邊 就實施例3的框架型基板保持具之構成作說明。和前述的圖 3相同地，框架型基板保持具40爲，配備宵供電用端子的左 右一對縱框41係藉由上側橫框43及下側橫框44保持間隔而 構成固定的框體。在其框體的取而遮蔽板47被安裝在上端菡 材支承件45，該遮蔽板47係與左右的縱框41接觸，同時構 成有自下端基材支承件46朝下方延長的長度。再者，於下端 基材支承件46上設有輔助遮蔽板48。 圖5和圖3的差異點在於，遮蔽板47未設匱成朝跟前 側傾斜，而是筆直地延伸、以及輔助遮蔽板48係開閉自如設 在下端S材支承件46的下端。此外，此輔助遮蔽板48係由 比重較電鍍液還輕的素材所作成。因此，如部分放大圖所示， 輔助遮蔽板48浸泡在電鍍液中時|成爲因浮力而堵塞下端菡 材支承件46和遮蔽板47的間隙之形態，防止朝向電路基材 49的遮蔽板側之電鍍蔓延。又，基板保持具40自液面昇起 時，輔助遮蔽板48係因重力而自然解放，可讓浸入電路蕋材 49和遮蔽板47之間的電鍍液順暢地排液。藉此，透過軸助 遮蔽板48使得下端基材支承件46之上没宵爾鍍液停滯’由 201129275 於遮蔽板47上無需設置提升遮蔽效果用的傾斜，故能更減少 電鍍液的帶出S。 其次，參照圖6至圖9，針對吊掛型雄板保持具中之遮蔽 板的幾個實施例之構成作說明。 〔實施例4〕 圖6係本發明所涉及之f施例4的吊掛型基板保持具之 構成圖，圖6(a)是前視圖、圖6(b)是仰視圖、圖6(c)是A-A’ 端面圖、圖6(d)是B-B’端面圖。以下，一邊參照圖6的全 圖一邊就實施例4的吊掛型越板保持具之梆成作說明。亦 即，圖6係顯示組裝在本發明所涉及之吊掛型菡板保持具上 的遮蔽板之實施例的構造圖。圖6中橫移自如地懸掛於陰極 棒（未圖式）的吊掛型基板保持具50,萣由將爾路越材59垂下 並卡止且用以進行供電的電鍍鉗51、用以將吊掛型基板保持 具50懸掛於陰極棒（未圖式）的鉤52、以及迚結IS鍍鉗51和 鉤52之肩部53所構成。 遮蔽板57被組裝於吊掛型蕋板保持具50,具有覆蓋電 路基材59的單面之面稹。該遮蔽板57具有和爾路基材59同 等的寛度，且構成有自電路菡材59的下端朝下方延長的長 度。本實施例中，遮蔽板57的把持部57a成爲嵌入肩部53 的溝狀，透過將把持部57a掛於肩部53而使遮蔽板57不會 前後搖動。而且*遮蔽板57具備有用以保持爾路趣材59的 上端且遮蔽自上側繞入之11流的突出部57b。又，爲了增加 遮蔽效果，遮蔽板57從電路菡材59的下端往下方之朝向爲， 朝向電路菡材59側設腫傾斜部。 22 201129275 該遮蔽板57被安裝在和電路基材59的表面相距 5〜15mm的位置。遮蔽板57的下端係自爾路越材59的下端延 長至下方。其延長的長度設爲90mm。此外，遮蔽板57自電 路基材59朝下方延伸的長度是短於30mm的情況遮蔽效果會 變弱，而在導通用孔10(參照圖1(c))的開口面之相反面，特 別是在電路基材59的下端部會有因電解爾鍍時之電流的繞 入而析出不必要的電鍍之虞。另一方面，遮蔽板57自爾路基 材59朝下方延長超過120mm以上的情況，會有遮蔽板57的 重量增加使整體傾斜而負荷施加於把持部57a，因附著的液 體所致電鍍液的帶出量增加等之缺點。 又，電路基材59的下端部安裝有下端®材支承件56， 下端基材支承件56具有輔助遮蔽板58。該補助遮蔽板58由 電路基材59的下端朝上方立設，擔任遮蔽自下側繞入的電流 之角色。此外，雖未圖示但在下端蕋材支承件56事先設有排 液用的通路，使得滯留在電路菡材59和輔助遮蔽板58之間 的電鍍液或水洗水被適切排出。 〔實施例5〕 圖7係本發明所涉及之實施例5的吊掛型蕋板保持具之 構成圖，圖7(a)是前視圖、圖7(b)是仰視圖、圖7(c)是Α·Α’ 端面圖、圖7(d)是Β-Β’端面圖。以下，一邊參照圖7的全 圖一邊就實施例5的吊掛型越板保持具之構成作說明。圖7 係與圖6同樣地，遮蔽板67具備：嵌入吊掛型S板保持具60 的肩部63之把持部67a，及用以保持HI路蕋材69的上端且 遮蔽自上側繞入的電流之突出部67b。 23 201129275 圖7和圖6的差異點在於，遮蔽板67雖從電路基材69 的下端朝下方延仲，但没有傾斜部、及設阶於下端基材支承 件66的輔助遮斷板68從下端基材支承件66朝遮蔽板方向突 出並朝下方膂曲。 此輔助遮蔽板68，係防止電鍍液從下方朝和遮蔽板67 側對向的電路基材69的表面繞入，同時擔任用以將遮蔽板 67的距離保持成既定間隔的角色，就算是在爾鍍液中電路驻 材69承受液流所產生的壓力，還是會有防止爾路基材69和 遮蔽板67接觸的作用。又•吊掛型越板保持具60自液面昇 起時，輔助遮蔽板68係朝下方彎曲，所以該輔助遮蔽板68 和遮蔽板67的間隔伴随著爾鍍液的流!fi/j而變窕，可順暢地排 液。而且，透過被彎曲的輔助遮蔽板68使得下端基材支承件 66之上亦變得没有電鍍液停滯。軿此，由於遮蔽板67上無 需設置遮蔽效果提升用的傾斜，故能更減少電鍍液的帶出量。 〔實施例6〕 圖8係本發明所涉及之货施例6的吊掛型越板保持具之 構成圖，圖8(a)是前視圖、圖8(b)是仰視圖、圖8(c)是A-A’ 端面圖、圖8(d)是B-B·端面圖、圖8(e)是局部放大圖。以 下，一邊參照圖8的全圖一邊就苡施例6的吊掛型基板保持 具之構成作說明。 圖8係與圖7同樣地，遮蔽板77係具有嵌入吊掛型基 板保持具70的肩部73之把持部77a、及用以保持電路基材 79的上端且遮蔽自上側繞入的爾流之突出部77b，該遮蔽板 77之自II路基材79下端朝下方延仲的部分並未傾斜。 24 201129275 圖8和圖7的差異點在於，設置在下端甚材支承件76 的輔助遮蔽板78被設置成開閉自如。亦即，和前述的圖5 同樣地，輔助遮蔽板78係由比重較電鍍液還輕的素材所形 成。因此，如圖8(e)所示當浸泡在爾鍍液中時，成爲_助遮 蔽板78因浮力而堵塞下端基材支承件66和遮蔽板67的間隙 之形態，可防止電鍍朝電路骓材79的遮蔽板77側的表面茲 延。 又，吊掛型基板保持具70自液面昇起時，下端基材支 承件66和遮蔽板67的間隙係因輔助遮蔽板78的重力而被自 然地解放，故可順暢地對浸入爾路蕋材79和遮蔽板77之間 的爾鍍液進行排液。此外，遮蔽板77和輔助遮蔽板78的間 隙係開啓成比圖7的情況還大，所以電鍍液的排液更順暢地 進行，因而能更減少電鍍液的帶出Jft。 〔實施例7〕 圖9係本發明所涉及之實施例7的吊掛型蕋板保持具之 構成圖：圖9(a)是前視圖、圖9(b)是仰視_、圖9(c)是A-A· 端面圖、圖9(d)是B-B’端面圖。以下，一邊參照圖9的全 圖一邊就實施例7的吊掛型基板保持具之構成作說明。圖9 係和圖6相同地，遮蔽板87係具有嵌入吊掛型基板保持具 80的肩部83之把持部87a、及用以保持電路基材89的上端 並遮蔽自上側繞入的電流之突出部87b，遮蔽板87的比電路 基材89下端還下方的部分，係朝向電路蕋材89側不傾斜地 垂直延伸。 25 201129275 圖9和圖6的差異點在於，在未安裝有下端基材支承件 之下，輔助遮蔽板88被安裝在遮蔽板87和ϋ路越材89的下 端位匱之間，且朝電路基材89的方向突出地朝下方彎曲設 置。該輔助遮蔽板88係防止電鍍自下方朝爾路菡材89的遮 蔽板87側的表面蔓延，同時擔任保持®路基材89和遮蔽板 87的間隔之角色。 又，吊掛型菡板保持具80自液而昇起時，因電鍍液之 流動使電路基材87撓曲而與該電路蕋材87及_助遮蔽板88 的間隔變寬，可順暢地排液。如此透過將輔助遮蔽板88安裝 於遮蔽板87,變得無需耗費將下端基材支承件安裝在電路基 材87的工夫，可更有效率地製造多暦印刷配線板。 如以上所說明•依據本發明之多層印刷配線板的製造方 法，可在不進行煩雜的抗蝕層形成等步驟之下進行生齑性良 好的單面電鍍。又，亦無需進行剝離後的薄膜殘渣物之處理， 亦無需此等輔助材料的成本。再加上，亦完金無需顧慮此等 微黏著薄膜或熱發泡薄膜所致電鍍浴之污染。而且，就算是 因電鍍裝匱的個體差而使陽極和m路材丨κ]產生距離差的情 況，亦不會產生電解電鍍之厚度差，容易將其後之根據感光 蝕刻手法的蝕刻加工所形成之電路圖案予以微細化。由此等 可知，可提供能廉價且穩定地製造利用僅职側具有導通孔的 開口之肓孔連接的多層印刷配線板的方法、及適合於製造上 述多層印刷配線板之框架型基板保持具、以及組合在吊掛型 基板保持具的遮蔽板。 26 201129275 如以上所述*雖說明了幾個本發明的實施例，但本發明 未受限於上述的實施例，可在未逸脫本發明的精神下進行各 種，且本發明當然可及該改變者。 〔產業上可利用價值〕 依據本發明所涉及之多層印刷配線板的製造方法及基 板保持具以及遮蔽板，由於能在生產性良好的狀態下在蕋板 上進行單面電鍍處理，所以亦可葙效地利用在半導體安裝基 板的製造裝匱等。 〔圖式簡單說明〕 【圖1(3)~圖1(e)】係顯示本發明所涉及之共通的實施例中， 3層構成的多層撓性印刷配線板之製造步驟的拣板端面圖。 【圖2】本發明所涉及之實施例蕋板保持具上安裝著3層的 電路基材之狀態的端面構成圖。 【圖3(a)〜圖3(c)】本發明所涉及之實施例1的框架型基板保 持具之構成圖，（a)是前視圖、（b)是仰視圖、（c)是A-A’端面 圖》 【圖4(&)~圖4(c)】本發明所涉及之實施例2的框架型基板保 持具之構成圖，（a)是前視圖、（b)是仰視圖，（c)是A-A’端面 圖。 【圖5(3)~圖5(d)】本發明所涉及之實施例3的框架型蕋板保 持具之構成圖，（a)是前視圖、（b)是仰視圖、（c)是A-A’端面 圖、（d)是部分放大圖。 27 201129275 【圖6(a)〜圖6(d)】本發明所涉及之贲施例4的吊掛型基板保 持具之構成圖* (a)是前視圖、（b)是仰視圖、（c)是A-A’端面 圖、（d)是Β·Β·端面圖。 【圖7(3)~圖7(d)】本發明所涉及之货施例5的吊掛型基板保 持具之構成圖，（a)是前視圖、（b)是仰視岡、（c)是Α-Α’端面 圖、（d)是Β·Β’端面圖。 【圖8(3)~圖8(e)】本發明所涉及之资施例6的吊掛型基板保 持具之構成圖，（a)是前視圖、（b)是仰視圇、（c)是Α..Α’端面 圖、⑷是Β·Β’端面圖、（e)是部分放大丨制》 【圖9(a)〜圖9(d)】本發明所涉及之贸施例7的吊掛型基板保 持具之構成圖，（a)是前視圖、（b)逛仰視圖、（c)最A-A’端面 圖、（d)是B-B’端面_。 〔主要元件符號說明〕 1 可撓性絶緣基材 2 銅箔 2a 正形遮罩 2b 爾路圖案 3 銅箔 3a 正形遮罩 3b 爾路圖案 4 雙面貼銅積層板 5 接著劑 6 可撓性絶緣基材 7 銅箔 7b 電路圖案 8 單面貼銅積層板 9 爾路蕋材 10 導通用孔 11 m鍍暦（爾 12 階梯狀導通孔 13 遮蔽板 20、30、40 框架型基板保持具 28 201129275 21、 21a 21b 21c 22、 23、 24、 25、 26、 27、 28、 29、 50、 51、 52、 53、 56、 57、 57a 57b 58、 59 ' 31、 31， > 4 U 縱框 ' 31a 、31a. ' 41a支柱 、31b 31b， 、41b 蕋板按壓板 、31c 、41c 鉸鏈 32、 42 鉤 33 ' 43 上 側橫框 34、 44 下 側橫框 35 ' 45 上: 喘基材支承件 36、 46 下 端基材支承件 37 ' 37' 47 遮蔽板 38 ' 38 ， 48 輔助遮蔽板 39 ' 49 電 路基材 60 ' 70 、80 吊掛型蕋板保持具 61、 71 、81 電鍍鉗 62 ' 72 、82 鉤 63、 73 '83 肩部 66 ' 76 下 端基材支承件 67 > 77 、87 遮蔽板 、67a 、1 77a、 87a把持部 、67t 1 ' 77b ' 87b 突出部 68 ' 78 、88 輔助遮蔽板 69 ' 79 、89 電路基材 29BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a multilayer printed wiring board, a slab holder, and a shielding plate, and more particularly to the opening surface of a via hole only. A method of manufacturing a multilayer flexible printed wiring board for single-sided plating by electroplating, a lotus plate holder for manufacturing a multilayer printed wiring board, and a shielding plate. [Prior Art] In recent years, mounting plates mounted on small electronic devices such as mobile phones have become more demanding for miniaturization and density reduction. In one aspect of the miniaturization and enthalpy density technology of such a mounting substrate, it is disclosed that the mounting slab portion and the flexible cable portion for mounting various electronic components are integrated, and the so-called multilayer flexible portion having a flexible cable portion is disclosed. In the technique of the printed wiring board, the multilayer flexible printed wiring board based on this technology is widely used for the use of small electronic devices such as mobile phones (for example, see Patent Document 1 and Patent Document 2). According to the mainstream of the multilayer flexible printed wiring board according to the present technology, through holes are drilled in the wiring raft by means of NC drilling or a metal mold, a through hole plating is applied, and then a circuit is formed on both sides of the substrate. The so-called double-sided through-hole connection of the seesaw. However, with the miniaturization and high performance of the electronic device, the substrate is mounted at a higher density, and the terminal for inserting the electronic component into the through hole for mounting the component is gradually formed, and the electronic component is converted. Surface mounted directly on the substrate. Therefore, when the through hole of the normal surface component mounting 201129275 is present on the component mounting surface, the solder flows toward the opposite substrate surface, and the mounting of the component cannot be performed normally. Therefore, a fine bottomed via hole is formed by a laser, a plasma or a resin etching method, and a plating process is performed thereon to perform blind hole mounting of the electronic component even if the via hole exists on the component mounting pad (blind In the method of connecting to the mobile device, which is used for the miniaturization of the vicinity of the liquid crystal in the action m, it is used. However, in this method, since the plating treatment is applied to the double of the substrate, even if the non-opening side of the via hole causes the thickness of the conductor to increase, it becomes difficult to follow the photosensitive etching ( Photofabrication) The circuit pattern formed by the etching process (the etching method based on exposure processing) is miniaturized. Accordingly, in order to solve such a drawback, a technique of performing a plating treatment on a multilayer flexible printed wiring board using the above-described through hole or blind via connection has been disclosed, and a technique of performing plating treatment using a frame type substrate holder (for example, Refer to Patent Document 3 and Patent Document 4). In other words, according to this technique, the frame type substrate holder is provided with a shielding plate for uniformizing the in-plane plating thickness of the substrate, and is provided on the upper and lower left and right peripheral portions of the frame. Moreover, it is also disclosed that in order to avoid the influence of the uneven thickness of the plating due to the individual difference of the frame type sill retaining device, the technique of using the hanging type sill retainer is replaced by the frame type substrate holder (for example, reference and Li literature 5). According to the technique, in order to avoid the influence of the uneven thickness of the plating, the frame type overhanging holder is not used, and the circuit to be plated is supported by the hanging type overhanging holder which is traversely supported on the cathode rod. The upper part of the material is held in a suspended state and has a plurality of circuit bases, and the materials are adjacent. Then, in a state in which a plurality of slabs of the slabs are adjacent to each other, 4 201129275 is supplied from the cathode rod to the upper portion of the product by hanging the Μ substrate holder, and is horizontally and horizontally in the plating solution in the plating bath along the cathode rod. Electrolytic plating treatment is carried out while traveling horizontally, and a so-called frameless plating apparatus is employed. However, in order to use such a plating apparatus, only one side of the raft is subjected to plating treatment, and it is necessary to use an illuminating mask for the non-electroplated surface. Therefore, the formation step of the plating mask which is more necessary for masking, and the peeling step for peeling off the mask are caused by an increase in the production cost of the plating treatment and a decrease in the yield of the product. Moreover, as an example of a method of performing a plating process only on the opening surface of the guide hole of the double-sided flexible printed wiring board, a method of manufacturing a double-sided flexible printed wiring board is disclosed, and two double-sided copper-clad laminates are disclosed. The plate is bonded and formed to form a conduction via hole by using a double-sided micro-adhesive film or the like so that the opening of the via hole faces outward, and the via hole is plated in this manner, and then the plating film is formed only on the opening surface side of the via hole by peeling off the micro-adhesive film. . (For example, refer to Patent Document 6) According to this technique, there is an advantage that the through-hole plating of two double-sided flexible printed wiring boards can be collectively performed, but it may be changed by the bonding of the micro-adhesive film and the peeling step thereof. Worry. In particular, a swarf-flexible printed wiring board is difficult to perform a plating process using a Roll to Roll like a double-sided flexible printed wiring board. In other words, in the case of the roll-type plating treatment, the micro-adhesive film can be continuously bonded and peeled off. However, when the short sheets are bonded and peeled off, the processing cost is increased. Further, in the case of using a heat-foamed film, it is also necessary to carry out the treatment of the film residue after peeling off the thermal foaming film. Therefore, the cost of such subsidy materials will become higher. In addition, there are also concerns about the deterioration of the plating bath caused by the micro-adhesive film or the thermal foaming 201129275 film or the deterioration of the soldering failure caused by the residual glue, etc. * Therefore, in order to solve these disadvantages, a A method in which the back surfaces of the two circuit substrates are aligned in parallel with each other (for example, see Patent Document 7). According to this technique, the back side of each m-channel coffin is not subjected to plating treatment because the electric field is shielded by the shield plate, but plating treatment of a desired thickness can be performed on the surface side of each circuit substrate. However, in the case where the substrate holder is not provided in the central portion between the anodes and there is a difference in distance between the anode and the m-channel coffin due to the individual difference of the plating apparatus, etc., the thickness of the m plating is determined by the plating liquid resistance. The difference is caused by the difference, and it becomes difficult to refine the m-way pattern formed by the etching process by the photosensitive etching method. [Patent Document 1] [Patent Document 1] Japanese Patent No. 3, 776, 430 (Patent Document 2) Japanese Patent No. 4236837 (Patent Document 3) Japanese Patent Application Laid-Open No. Hei. No. Hei. Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. 229196 (Summary of the Invention) [Problems to be Solved by the Invention] 201129275 In view of the above, it is desirable to realize a simpler and non-electroplating bath contamination, and it is possible to perform uniformity only on the opening surface of the via hole of the multilayer printed wiring board. Therefore, in order to provide a simple method, without the use of an auxiliary material and without the contamination of the electroplating bath, it is possible to inexpensively manufacture an opening surface which can be guided only on one side. Method for producing a multilayer printed wiring board for forming a multilayer printed wiring board of a plating film, and a enamel holder for manufacturing the multilayer printed wiring board In addition, the present invention aims to solve the problem. A method of manufacturing a multilayer printed wiring board, comprising: a first step of forming a circuit substrate having three or more conductive layers and an insulating layer interposed between the conductive layers; and a second step: The conductive layer of the outermost layer of one of the materials reaches the path of the outermost conductive layer of the other material, and forms a non-through conductive common hole of only one of the openings; In the third step, the inner wall of the conductive hole is electrically conductive; in the fourth step, a substrate holder equipped with a shielding plate having an area covering one side of the circuit substrate, and having the same a length in which the circuit substrate is extended downward; and in a fifth step, the circuit substrate is attached to the seesaw holder with the opposite surface side of the opening having the opening; and the sixth step, The circuit board attached to the substrate holder is immersed in a plating solution and subjected to electrolytic plating to form a via hole having only one opening and one opening. According to this method, it is possible to stably and inexpensively manufacture a multilayer printed wiring board in which a plating film is formed only on the opening surface of the via hole on one side without using the sub-substrate and the electroless plating bath. Further, by setting the interval between the circuit coffin and the shielding plate to be preferably 15 mm or less, plating deposition due to the current wound on the opposite side of the opening of the common hole can be appropriately suppressed. In addition, by setting the gap between the circuit substrate and the shielding plate to 5 mm or more, it is possible to suppress the circuit due to the m-plating treatment of the thin substrate of the thin flexible printed wiring board or the like. When the substrate is deflected and the shielding plate is in contact, the elution of the plating solution is increased, and it becomes difficult to wash or the like. The invention described in claim 2 provides a method of manufacturing a multilayer printed wiring board, comprising: a second step of forming a circuit base having three or more conductive layers and an insulating layer interposed between the conductive layers; In the second step, in the path from the conductive layer of the outermost layer of the one of the m-path substrates to the conductive layer of the outermost layer of the other one, a non-through-conducting common hole having only one of the openings is formed; 3, the inner wall of the conductive hole is electrically conductive; and the fourth step, preparing a frame type substrate holder provided with a shielding plate, the shielding plate having a circuit base to be provided to the frame type substrate holder One of the terminals for power supply and one of the terminals for supporting the upper frame and the lower frame of the vertical frame, and having an upper frame supporting the upper end of the base substrate between the pair of vertical frames And a lower end coffin support supporting the lower end, and contacting the pair of left and right vertical frames and having a length extending from the upper end coffin support to the lower end substrate support In a fifth step, the one end surface of the circuit board having the opening is placed toward the shielding plate, and the two lateral end portions of the circuit substrate are attached to the power supply terminal of the seesaw holder; In the sixth step, the circuit substrate mounted on the holder of the frame type sill plate 8 201129275 is immersed in the plating solution, and electrolytic plating treatment is performed to form a via hole having an opening on only one side. According to the method, in addition, when the circuit board is attached to the frame type holder and subjected to plating treatment, the distance from the circuit board material is preferably 15 mm or less, and the two horizontal end portions are held by the frame type substrate. A shielding plate is provided on the opposite side of the opening of the non-through conductive hole. Thereby, plating deposition of the both lateral ends can be suppressed. In addition, when the gap between the circuit material and the shielding plate is set to 5 mm or more, in particular, when a circuit substrate of a thin material such as a multilayer flexible printed wiring board is subjected to plating treatment, the in-way carrier material can be suppressed. When the deflection is in contact with the shield plate, the plating solution is taken out more and becomes difficult to be washed. The invention described in claim 3 provides a method for producing a multi-layer printed wiring board, comprising: a first step of forming a conductive layer having three or more layers and interposed between the respective layers In the second step, only one of the circuit substrates has an opening, and only one of the paths is formed in a path from the conductive layer of the outermost layer to the outermost layer of the other outer layer. a non-through conductive common hole having an opening; a third step of conducting a conductive treatment on the inner wall of the common hole; and a fourth step of mounting the circuit substrate on the plating pliers by hanging down and locking The plating pliers supply power to the hanging type substrate holder on which the shielding plate is suspended, and the shielding plate supports the cathode rod traversely and has the same degree of twist as the circuit board and the upper end of the circuit substrate is extended to a ratio The lower end of the length; and the first. In the fifth step, the circuit substrate is immersed in the plating solution, and subjected to electrolytic plating treatment in a state of being adjacent to the other hanging type slab retaining members to form a via hole having an opening on only one side. According to the method, in addition, when the circuit material is mounted on the hanging type substrate holder that is assembled on the shielding plate to perform plating treatment, the circuit is provided on the opposite side of the opening of the non-through conductive hole. The distance between the coffin and the shielding plate is preferably 15 mm or less, and the plating plates of the substrate holders are adjacent to each other without gaps during electrolytic plating, whereby plating deposition of the both lateral ends can be suppressed. In addition, when the gap between the circuit board and the shielding plate is set to 5 mm or more, in particular, when the substrate of the substrate of the multilayer flexible printed wiring board or the like is plated, the circuit coffin can be suppressed. When the deflection is in contact with the shield plate, the plating solution is taken out more and becomes difficult to be washed. The invention recited in claim 4 provides a frame type substrate holder which is a frame type sill holder for manufacturing a multilayer printed wiring board, characterized in that a shielding plate is provided, and the shielding plate is provided with a casing having a gap between the one of the power supply terminals facing the circuit substrate and the horizontal frame on the upper side and the lower side of the vertical frame, and having an upper end substrate supporting the upper end of the circuit substrate between the pair of vertical frames The support member and the lower end substrate support member supporting the lower end are in contact with the pair of left and right vertical frames and have a length extending from the upper end substrate support member to the lower end substrate support member. According to this configuration, in the case of using the frame type sill holder, the shielding plate is processed so as to be in contact with the upper substrate support, and is extended downward by 30 mm or more from the lower end portion thereof, preferably 60 mm or more. An auxiliary shielding plate is also provided at the lower substrate support. Further, by using a frame type stencil holder provided on the opposite side of the non-through guide hole opening during the splicing, the plating deposition at the lower end portion can be suppressed. However, if the lower end of the shielding plate is made too long, the shielding effect will not be improved. Therefore, when the ffi is reached, there will be 10 201129275 and the lower horizontal frame is involved in the disadvantage of the increase in the amount of plating liquid. It is more appropriate to set the length of the shielding plate to be less than 120 mm. The invention described in claim 5 provides a shielding plate which is suspended from a cathode rod and which is attached to a wall of the ball and suspended and locked to supply power. Further, the present invention is characterized in that: a grip portion attached to a shoulder portion of the hanging substrate holder and a protruding portion for holding the upper end of the circuit substrate and shielding are provided, and the one is equivalent to the circuit substrate. The length and the length from the upper end of the circuit substrate are extended to a length _ longer than the lower end. According to this configuration, in the case of using the frameless plating apparatus, the hanging type substrate holder suspended from the cathode rod is fixed to the shielding plate provided with the upper end coffin support. The circuit substrate is attached to the substrate holder in a manner of being in contact with the upper end substrate support. Further, the lower end portion of the shield substrate is extended downward by 30 mm or more, preferably 60 mm or more, and the lower end portion of the shield plate is also provided with an auxiliary shielding plate during electrolytic plating to suppress the lower end portion. Electroplating is deposited. However, even if the lower end portion of the shielding plate is made too long, the shielding effect is not so much improved, so that when the weight is increased and the amount of plating liquid is increased by $, the extension of the shielding plate is set to Those below 120mm are more appropriate. [Effect of the Invention] According to the invention described in the scope of the application of the patent application, it is possible to inexpensively and stably manufacture a multi-layer printing in which an electroplated film is formed on only one side of the opening surface of the via hole, without the contamination of the electroless plating bath. Wiring board. Further, it is possible to perform a single-sided plating with good productivity without performing a complicated etching layer formation step or the like in 201129275. According to the invention described in the second aspect of the invention, when the circuit board is attached to the frame type substrate holder for plating treatment, the distance between the circuit board and the circuit board is appropriately set, and the two end portions and the board holder are provided. A shielding plate is provided on the opposite side of the non-through-hole opening of the common hole in contact with each other, whereby plating deposition at both lateral ends can be suppressed. Moreover, there is no need to carry out the film residue after peeling, and the cost of such auxiliary materials is not required. Moreover, there is no need to worry about the contamination of the plating bath caused by the micro-adhesive film or the heat-expandable film. According to the invention described in the third aspect of the invention, the ergo substrate is attached to the hanging type yoke holder which is assembled on the shielding plate, and the plating is performed on the opposite side of the opening. The interval between the front side* circuit substrate and the shielding plate is appropriately maintained, so that the shielding plates of the substrate holders are adjacent to each other by the two adjacent persons without gaps during the plating, and the two lateral ends can be suppressed. In addition, even if there is a distance difference between the anode and the circuit substrate due to the individual difference of the plating apparatus, there is no difference in the thickness of the electrolytic plating, and the etching process according to the photosensitive etching method can be easily performed. The circuit pattern is miniaturized. According to this, it is understood that the multilayer printed wiring board which is in contact with the aperture of the opening having the one side of the via hole can be manufactured stably and stably. According to the invention described in the fourth aspect of the patent application, in the case of using the frame type substrate holder, the overhanging holder provided on the opposite side of the opening of the non-through guide hole is used for the plating of the frame type. It can suppress the deposition of m at the lower end. Therefore, it is possible to provide a frame type substrate holder suitable for the manufacture of a swarf printed wiring board. 12 201129275 According to the invention described in claim 5, in the case of using a frameless type plating apparatus, it is possible to provide an upper end portion of the material support member on the suspension type overhanging holder suspended from the cathode rod. The size of the shielding plate is fixed. Thereby, a frame type substrate holder suitable for the manufacture of a multilayer printed wiring board and a shielding plate assembled to the hanging type substrate holder can be provided. [Embodiment] In order to achieve a simple method, the present invention can be inexpensively and stably manufactured without using a shaft assisting material and an electroless plating bath. The plating film can be formed only on the opening surface of the via hole on one side. The method for producing a multilayer printed wiring board is realized by providing a method of manufacturing a multilayer printed wiring board having the following features: the first step of forming a conductive layer having three or more layers and interposed between the conductive layers In the second step, in the path from the conductive layer of one of the outermost layers of the circuit substrate to the conductive layer of the other outermost layer, a non-through portion of only one of the openings is formed. a general-purpose hole; a third step of conducting a conductive treatment on the inner wall of the conductive hole; and a fourth step of preparing a cross-plate holder equipped with a shielding plate having a single-sided area covering the circuit substrate And having a length extending downward from the circuit substrate; and in the fifth step, the opposite side of the one having the opening is directed toward the shielding plate, and The circuit board is mounted on the substrate holder; and in the sixth step, the circuit substrate mounted on the reticle holder is immersed in a plating solution and subjected to electrolytic plating to form a via hole having only one opening on one side. 201129275 Hereinafter, several preferred embodiments of the present invention will be described in detail with reference to Figs. Further, in the respective embodiments, the common contents are described in the above-described embodiments, and overlapping description will be omitted in the following embodiments. [Embodiment 1] Fig. 1 is a view showing a common example of the present invention, which shows a slab end of a manufacturing process of a multilayer flexible printed wiring board having a three-layer structure. First, as shown in Fig. 1(a), a size of 12 mm is formed on a double of a flexible insulating substrate 1 (here, a polyimide having a thickness of 25 / / m) of polytheneimine or the like. The double-sided copper-clad laminate 4 of the copper foil 2 and the copper foil 3 is formed by a series of resist layers such as a resist layer formed by a photosensitive etching method to form a double-sided circuit pattern, exposure, development, etching, and resist stripping. Then, the copper foil 2 and the copper foil 3 of the double-sided copper-clad laminate 4 are formed into conformal masks 2a and 3a at the time of laser processing, and the inner layer circuit pattern 3b is formed on the copper foil 3. . At this time, the double-sided alignment is performed on the flat fading material, so that the expansion and contraction of the cross-over material is not affected, and the positional accuracy of both sides can be easily ensured. In addition, it is also possible to use an exposure machine capable of double-aligning the precision according to the need. Further, the roughening treatment for roughening the surface may be performed as needed to improve the adhesion to the adhesive 5. Next, prepare for the gathering. A single-sided copper-clad laminate 8 of a copper foil 7 having a thickness of 12 mm is formed on one side (here, the back surface) of a flexible insulating material 6 such as an imide (here, a polyimide having a thickness of 25 mm), and then The single-sided copper-clad laminate 8 is punched out to form an opening portion for the flexible cable portion, and then the punched single-sided copper-clad laminate 8 is used to form the inner layer of the inner layer. The double-sided copper-clad laminate 4 layer of the adhesive 5 is aligned. In addition, as needed, 14 201129275, a single-sided copper-clad laminate 8 having a guide member for alignment, and a double-sided copper-clad laminate 4 for forming the inner layer circuit may be formed. Subsequent agent 5 is aligned. Next, as shown in Fig. 1(b), the double-sided copper-clad laminate 4 and the single-sided copper-clad laminate 8 are laminated by vacuum compression or the like via the adhesive 5. In the above steps, a circuit coffin 9 having a three-layer structure is formed. Further, as the adhesive 5, it is preferable to use a low flow type adhesive sheet or the like which causes a small amount of an adhesive to flow out. Further, in the latter step, it is not necessary to function as an adhesive for the flexible cable portion. Since flexibility does not become an essential component, a prepreg containing a glass cloth can be used as the adhesive 5, but laser processing is considered. When the sex is equal, it is preferred that there is no glass cloth. Moreover, the thickness of the agent 5 can be selected from about 10 to 15 v m. Next, as shown in FIG. 1(c), laser processing is performed using the positive masks 2a and 3a, and the copper foil 2, the copper foil 3, and the copper foil 7 which are connected to the circuit substrate 9 are formed to be non-through. Guide the general hole 10. Further, depending on the type of laser for laser processing for forming the general-purpose hole 10, a UV-YAG laser, a carbon dioxide laser or a pseudo-molecular laser may be selected. Next, as shown in FIG. 1(d), the three-layer circuit substrate 9 having the conductive via 10 is subjected to a conductive treatment, and an electrolytic plating treatment of about 10 to 20 /zm is applied to obtain a three-layer copper foil 2 The layers of the copper foil 3 and the copper foil 7 are electrically connected. At this time, the so-called one-side plating treatment for plating is not performed on the surface side having no opening (that is, on the lower side of the copper foil 7 of the same drawing (d)). Here, a method of single-sided plating treatment will be described. _ 2 shows an end surface configuration diagram in a state in which a circuit board of 3 turns is mounted on the substrate holder according to the embodiment of the present invention. That is, in the method of single plating treatment, as shown in FIG. 2 of 201129275, the m-channel coffin 9 having the common hole ίο is fixed to the substrate holder (not shown), and the spacer lamp of the circuit substrate 9 is shown. The shielding plate 13 is provided in a manner of 15 mm or less and covering one side of the circuit substrate 9. The shielding plate 13 is used to cover the opening of the circuit board 9 which is fixed by the substrate support member when the circuit substrate 9 is fixed to the over-plate holder (not shown) during electrolytic plating ( That is, the opposite side of the common hole 10) (that is, the back side of the girders 9). Further, as will be described in detail later, the shielding plate 13 is provided to extend downward from the lower end portion of the 12-way coffin 9 by 60 mm or more. In this way, the circuit substrate 9 fixed at the lower end by the coffin support member is set on the substrate holder so as to be immersed in the plating solution for electrolytic plating treatment, as shown in FIG. 1(d), The plating film 11 is deposited on the opening surface side of the common hole 10. In addition, when the interval between the circuit coffin 9 and the shielding plate 13 is narrower than 5 mm in FIG. 2, since the circuit substrate 9 is flexible, the circuit substrate 9 and the shielding plate 13 are in contact with each other, and the opening of the common hole 10 is opened. The liquid on the opposite side of the surface becomes difficult to update and cannot be sufficiently washed. On the other hand, the spacing between the circuit substrate 9 and the shielding plate 13 is less than 15 mm, and the shielding effect of the upper male support portion is weakened on the opposite side of the opening surface of the common hole 10, particularly in the circuit substrate. The upper end portion of 9 has an electric current that is entangled in the electroplating treatment to precipitate unnecessary plating. Referring back to FIG. 1, the single-layer plating treatment as shown in FIG. 2 is applied to the first layer of the three-layer circuit coffin 9 as shown in FIG. 1(d), and the plating treatment is performed. The stepped via hole 201129275 is formed in the common hole 10. Next, the surface of the first layer which has been subjected to the plating treatment (that is, the surface of the 'copper foil 2) is not applied as shown in FIG. 1(e). The back surface of the third layer of the plating treatment (that is, the surface of the copper foil 7) is formed by etching treatment using a photosensitive etching method to form the circuit pattern 2b and the road pattern 7b. In this case, in order to ensure the tenting property (that is, to prevent damage of the periphery of the resist layer due to etching), the first layer of the opening surface of the stepped via hole 12 is preferably applied to have a thickness of 20 μm or more. Membrane resist. Further, the dry film resist layer for forming a fine pattern of 10 m or less can be applied without considering the capping property of the third layer of the copper foil 7. Further, in the case of using a liquid resist or the like, since it is not necessary to consider the cover hole property of the stepped via hole 12, the resist layers formed on the first layer and the third layer may have the same thickness. Next, a solder resist layer or a cap layer is formed on the first layer and the third layer, and a shield layer such as a paste/film having a predetermined opening is formed as needed. Before and after this step, surface treatment such as soldering, nickel plating, gold plating, or the like is applied to the surface of the substrate as needed, and by performing the outer shape processing, three layers connected by the bottomed stepped via holes having only one opening on one side can be obtained. Multi-turn flexible printed wiring board. Further, after the multilayer flexible printed wiring board having three layers was formed by the above-described method, a high-density circuit having a wiring pitch of 60 μm was formed on the third layer. Next, the configuration of the frame type substrate holder of the first embodiment to which the method for producing a multilayer printed wiring board of the present invention is applied will be described. Fig. 3 is a perspective view showing the frame type overhanging holder of the first embodiment of the present invention, Fig. 3(a) is a front view, and Fig. 3(b) is a bottom view 'Fig. 3(c) ring. Hereinafter, the constitution of the frame type sill holder of the first embodiment will be described with reference to the full view of the circle 3. In the case of the frame type substrate in FIG. 3, the left and right vertical frames 21 provided with the hooks 22 for energizing the upper portion are formed by the upper side horizontal frame 23 and the lower lower horizontal frame 24 of the upper side. Fixed frame. On the inner side of the upper and lower horizontal frames of the frame (that is, the upper side frame 23 and the lower side frame 24), the upper end substrate support member 25 and the lower end substrate support member 26 are respectively spanned between the left and right vertical frames 21 Mode setting. Further, on one side of the pair of right and left frames 21 (that is, on the back side of the front view), the shielding plate 27 is attached to the upper end coffin support 25, and the shielding plate 27 is in contact with the left and right vertical frames 21, and the tip The length is extended from the lower coffin support member 26 downward. Further, at the lower end material supporting member 26, the auxiliary shielding plate 28 is mounted in a direction parallel to the shielding plate 27. 3, the pair of vertical frames 21 shown in the front view are respectively constituted by the support 21a and the over-plate pressing plate 21b as shown in the bottom view. Further, the substrate pressing plate 21b is attached to the support 21a and the hinge 21c so as to be openable and closable. Further, the circuit substrate 29 is mounted in a shape 1 which is inserted by the support 21a and the substrate pressing plate 21b. Further, although not shown, the stalk 29 of the support 21a and the seesaw pressing plate 21b is held. In the part, there is a power supply terminal for the mfU to the coffin 29 of the road. The welcome terminal of the power supply terminal is welcoming to the hook 22 of the upper portion of the frame type S-plate holder 20 via a wire or the like. In other words, the hook 22 is in contact with the cathode rod of the upper portion of the plating package (not shown) to supply power to the power supply terminal of the frame type substrate holder 20. In addition, in order to adjust the thickness of the plating in the surface of the circuit board 29, the plate-shaped shielding 201129275 as described in Patent Document 3 of the same applicant may be attached to the above-described slab pressing plate 21b, and the upper substrate supporting the upper side is supported. The upper lateral frame 23 for the member 25 and the lower lateral hinge 24 for the lower lower substrate support 26 are attached to the left and right vertical frames 21, respectively, and the left and right vertical frames 21 are held at predetermined intervals. The role of the coffin support that supports the upper and lower sides of the circuit substrate 29. Further, in the frame type substrate holder 20, the shielding plate 27 is provided at a position covering one surface of the circuit substrate 29. The single side of the circuit substrate 29 in the present embodiment means the side of the circuit substrate 29 to be mounted (that is, the back side of the front view of FIG. 3). Further, the shielding plate 27 is provided on the circuit substrate 29 Further, the shielding plate 27 is in contact with the pillar 2U without gaps as shown in the bottom view. Further, the upper portion of the shielding plate 27 and the upper end coffin support member 25 are slightly provided with a gap. However, as shown in the end view of the A-A', if the upper portion of the shield plate 27 and the upper substrate support member 25 are joined without a gap, it is necessary to provide a passage for pumping air at the upper end coffin. The support member 25. Further, as shown in the end view of the A-A', the lower end of the shield plate 27 is extended from the lower end substrate support member 26 to the lower side. The length of the extension plate is set to be about 90 mm » In addition, the shield plate 27 is self-circuited. When the base material 29 is extended downward by 30 mm, the shielding effect is weakened, and the current is turned on at the opposite end of the common hole opening, particularly at the lower end portion of the zero-base substrate 29. And the unnecessary plating is deposited. On the other hand, the shielding plate 27 is self-powered. When the road base material 29 is extended downward by 120 mm or more, there is a disadvantage that the lower side horizontal frame 24 interferes with the liquid adhering to the shield plate 27, and the amount of the plating solution is increased. For the shielding effect of the winding current on the lower side, the lower portion of the shielding plate 27 is provided with an inclination toward the front side. However, it is necessary to have a gap in which the liquid discharge can be quickly performed when the plating solution tank 19 201129275 or the washing tank is raised. Between the shielding plate 27 and the lower substrate support member 26, the auxiliary shielding plate 28 is attached to the lower substrate support member 26. The width of the auxiliary shielding plate 28 is set to 20 mm. As shown in the figure, it is necessary to provide a passage for draining in the lower end of the coffin support member 26 so that it stays in the air. The plating solution or the washing water between the road substrate 29 and the auxiliary shielding plate 28 is appropriately discharged. [Embodiment 2] Fig. 4 is a configuration diagram of a frame type S-plate holder according to a second embodiment of the present invention, and Fig. 4(a) is a front view, Fig. 4(b) is a top view, and Fig. 4 (c) ) is the end and the picture. Hereinafter, the configuration of the frame type substrate holder of the second embodiment will be described with reference to the full view of FIG. 4. In the same manner as the above-described FIG. 3, the frame type substrate holder 30 is provided with a pair of left and right verticals of the power supply terminal. The frames 31 and 31' are formed by a fixed frame by the upper lateral frame 3 3 and the lower lateral frame 34 being spaced apart. The difference between Fig. 4 and Fig. 3 is that the sliding mechanism is provided to allow the upper lateral frame 33 and the lower lateral frame 34 to be separated. In this case, the shielding plates 37, 37' are divided into right and left sides, and are respectively attached to the left vertical frames 31, 3'. Further, the shielding plates 37 and 37' are in contact with the left and right vertical frames 31 and 31', and are formed to have a length extending downward from the lower substrate supporting member 36. That is, the shielding plates 37, 37' are configured to be slidable relative to each other and have a slight gap with the upper substrate support member 35. Therefore, the upper side of the shielding effect shielding plates 37, 37' is also configured to extend beyond the upper end coffin support member 35 so as to extend upward. The squat portion is tilted toward the front side 20 201129275. Further, auxiliary shielding plates 38, 38 are similarly attached to the lower substrate support member 36. [Embodiment 3] Fig. 5 is a configuration diagram of a frame type substrate holder according to a third embodiment of the present invention, wherein Fig. 5(a) is a front view, Fig. 5(b) is a bottom view _, and Fig. 5(c) is a view The end view and Fig. 5 (d) are partial enlarged views. Hereinafter, the configuration of the frame type substrate holder of the third embodiment will be described with reference to the full view of Fig. 5 . Similarly to the above-described Fig. 3, the frame type substrate holder 40 is such that the pair of right and left vertical frames 41 provided with the power supply terminals are arranged to be spaced apart by the upper lateral frame 43 and the lower lateral frame 44 to form a fixed frame. The shield plate 47 of the frame is attached to the upper end material support member 45, and the shield plate 47 is in contact with the right and left vertical frames 41, and is formed to have a length extending downward from the lower end substrate support member 46. Further, an auxiliary shielding plate 48 is provided on the lower substrate support member 46. The difference between Fig. 5 and Fig. 3 is that the shielding plate 47 is not provided to be inclined toward the front side, but extends straight, and the auxiliary shielding plate 48 is opened and closed freely at the lower end of the lower end S material support member 46. Further, the auxiliary shielding plate 48 is made of a material having a lighter specific gravity than the plating solution. Therefore, as shown in a partially enlarged view, when the auxiliary shielding plate 48 is immersed in the plating solution, the gap between the lower coffin support member 46 and the shielding plate 47 is blocked by buoyancy, and the shielding plate side toward the circuit substrate 49 is prevented. The plating spread. Further, when the substrate holder 40 is raised from the liquid surface, the auxiliary shielding plate 48 is naturally released by gravity, and the plating solution immersed between the circuit coffin 49 and the shielding plate 47 can be smoothly drained. Thereby, the shaft shielding liquid is prevented from passing through the shaft assisting shielding plate 48, and the tilting of the coating liquid is not required to be provided on the shielding plate 47 by the 201129275, so that the plating liquid can be further removed. S. Next, the configuration of several embodiments of the shielding plate in the hanging type male plate holder will be described with reference to Figs. 6 to 9 . [Embodiment 4] Fig. 6 is a view showing a configuration of a hanging type substrate holder according to a fourth embodiment of the present invention, wherein Fig. 6(a) is a front view, Fig. 6(b) is a bottom view, and Fig. 6(c) ) is an A-A' end view, and Figure 6(d) is a B-B' end view. Hereinafter, the description of the hanging type overhanging holder of the fourth embodiment will be described with reference to the full view of Fig. 6 . That is, Fig. 6 is a structural view showing an embodiment of a shielding plate assembled to the hanging type sill holder according to the present invention. In FIG. 6 , a hanging type substrate holder 50 that is slidably suspended from a cathode rod (not shown), and a plating pliers 51 that is suspended from the ball and that is locked and used for power supply is used for The hanging type substrate holder 50 is constituted by a hook 52 that is suspended from a cathode rod (not shown), and a knee joint pliers 51 and a shoulder portion 53 of the hook 52. The shielding plate 57 is assembled to the hanging type yoke holder 50, and has a surface that covers one side of the circuit substrate 59. The shielding plate 57 has the same degree of twist as the ballast substrate 59, and is formed to have a length extending downward from the lower end of the circuit coffin 59. In the present embodiment, the grip portion 57a of the shield plate 57 is formed in a groove shape in which the shoulder portion 53 is fitted, and the shutter portion 57 is not swayed back and forth by the grip portion 57a being hung on the shoulder portion 53. Further, the *shielding plate 57 is provided with a projecting portion 57b for holding the upper end of the road material 59 and shielding the flow of 11 from the upper side. Further, in order to increase the shielding effect, the shielding plate 57 is oriented downward from the lower end of the circuit coffin 59, and a swollen inclined portion is formed toward the circuit coffin 59 side. 22 201129275 The shielding plate 57 is mounted at a position 5 to 15 mm from the surface of the circuit substrate 59. The lower end of the shield plate 57 is extended to the lower end of the self-passing material 59. Its extended length is set to 90mm. Further, when the length of the shielding plate 57 extending downward from the circuit substrate 59 is shorter than 30 mm, the shielding effect is weakened, and on the opposite side of the opening surface of the general-purpose hole 10 (refer to FIG. 1(c)), in particular At the lower end portion of the circuit substrate 59, there is a possibility that an unnecessary plating is deposited due to the winding of the current during the electroplating. On the other hand, when the shielding plate 57 is extended downward by more than 120 mm from the substrate 55, the weight of the shielding plate 57 is increased, and the whole is inclined, and the load is applied to the holding portion 57a, and the plating solution is caused by the adhered liquid. The disadvantage of increasing the amount of take-out. Further, the lower end portion of the circuit substrate 59 is attached with a lower end material support member 56, and the lower end substrate support member 56 has an auxiliary shielding plate 58. The auxiliary shielding plate 58 is erected upward from the lower end of the circuit substrate 59, and serves to shield the current from the lower side. Further, although not shown, the lower end coffin support member 56 is provided with a passage for discharging liquid in advance, so that the plating liquid or the washing water remaining between the circuit coffin 59 and the auxiliary shielding plate 58 is appropriately discharged. [Embodiment 5] Fig. 7 is a configuration diagram of a hanging type sill holder according to a fifth embodiment of the present invention, and Fig. 7(a) is a front view, Fig. 7(b) is a bottom view, and Fig. 7(c) ) is a Α·Α' end view, and Fig. 7(d) is a Β-Β' end view. Hereinafter, the configuration of the hanging type overhanging holder of the fifth embodiment will be described with reference to the full view of Fig. 7 . Fig. 7 is a view similar to Fig. 6. The shielding plate 67 is provided with a holding portion 67a that is fitted into the shoulder portion 63 of the hanging S-plate holder 60, and a holding portion for holding the upper end of the HI road coffin 69 and shielding from the upper side. The protruding portion 67b of the current. 23 201129275 The difference between FIG. 7 and FIG. 6 is that the shielding plate 67 extends downward from the lower end of the circuit substrate 69, but has no inclined portion and the auxiliary shielding plate 68 disposed at the lower end substrate supporting member 66. The lower end substrate support member 66 protrudes toward the shielding plate and is bent downward. The auxiliary shielding plate 68 prevents the plating solution from being wound from the bottom toward the surface of the circuit substrate 69 opposed to the shielding plate 67 side, and serves as a role for maintaining the distance of the shielding plate 67 at a predetermined interval, even in the case of In the plating solution, the circuit stub 69 is subjected to the pressure generated by the liquid flow, and the contact between the substrate 69 and the shielding plate 67 is prevented. Further, when the hanging type holder 60 is raised from the liquid surface, the auxiliary shielding plate 68 is bent downward, so the interval between the auxiliary shielding plate 68 and the shielding plate 67 is accompanied by the flow of the plating solution! fi/j Change the sputum and drain smoothly. Moreover, through the curved auxiliary shielding plate 68, the plating material is also stagnated on the lower substrate support 66. Accordingly, since it is not necessary to provide the inclination for lifting the shielding effect on the shielding plate 67, the amount of the plating solution can be further reduced. [Embodiment 6] Fig. 8 is a configuration diagram of a hanging type overhanging holder according to Embodiment 6 of the present invention, wherein Fig. 8(a) is a front view, Fig. 8(b) is a bottom view, and Fig. 8 (Fig. 8) c) is an A-A' end view, FIG. 8(d) is a BB. end view, and FIG. 8(e) is a partial enlarged view. Hereinafter, the configuration of the hanging type substrate holder of the sixth embodiment will be described with reference to the full view of Fig. 8. In the same manner as in Fig. 7, the shielding plate 77 has a holding portion 77a in which the shoulder portion 73 of the hanging type substrate holder 70 is fitted, and an upper end for holding the circuit substrate 79 and shielding the flow from the upper side. In the protruding portion 77b, the portion of the shielding plate 77 that extends downward from the lower end of the II-path substrate 79 is not inclined. 24 201129275 The difference between FIG. 8 and FIG. 7 is that the auxiliary shielding plate 78 provided at the lower end of the material support member 76 is provided to be openable and closable. That is, similarly to Fig. 5 described above, the auxiliary shielding plate 78 is formed of a material having a lighter specific gravity than the plating solution. Therefore, when immersed in the plating solution as shown in FIG. 8(e), the gap of the lower shielding substrate 66 and the shielding plate 67 is blocked by the buoyancy of the auxiliary shielding plate 78, and the plating can be prevented from coming to the circuit. The surface of the material 79 on the side of the shielding plate 77 is delayed. Further, when the hanging substrate holder 70 is raised from the liquid surface, the gap between the lower substrate support 66 and the shielding plate 67 is naturally liberated by the gravity of the auxiliary shielding plate 78, so that the immersion can be smoothly performed. The plating solution between the coffin 79 and the shielding plate 77 is drained. Further, the gap between the shield plate 77 and the auxiliary shield plate 78 is opened larger than in the case of Fig. 7, so that the discharge of the plating solution is performed more smoothly, so that the Jft of the plating solution can be further reduced. [Embodiment 7] Fig. 9 is a view showing a configuration of a hanging type sill holder according to a seventh embodiment of the present invention: Fig. 9(a) is a front view, and Fig. 9(b) is a bottom view _, Fig. 9 (c) ) is an AA · end view, and Figure 9 (d) is a B-B 'end view. Hereinafter, the configuration of the hanging type substrate holder of the seventh embodiment will be described with reference to the full view of Fig. 9 . 9 is the same as FIG. 6, the shielding plate 87 has a holding portion 87a that is fitted into the shoulder portion 83 of the hanging type substrate holder 80, and a current for holding the upper end of the circuit substrate 89 and shielding the current from the upper side. The protruding portion 87b, a portion of the shielding plate 87 that is lower than the lower end of the circuit substrate 89, extends vertically without tilting toward the circuit coffin 89 side. 25 201129275 The difference between FIG. 9 and FIG. 6 is that, under the absence of the lower end substrate support member, the auxiliary shielding plate 88 is installed between the shielding plate 87 and the lower end of the bypass path 89, and faces the circuit. The direction of the substrate 89 is convexly curved downward. The auxiliary shielding plate 88 prevents the plating from spreading from the surface of the shielding plate 87 on the side of the lower path coffin 89, and serves as a space for maintaining the gap between the substrate substrate 89 and the shielding plate 87. Further, when the hanging type yoke holder 80 is lifted from the liquid, the circuit substrate 87 is deflected by the flow of the plating liquid, and the distance between the circuit board 87 and the auxiliary shielding plate 88 is widened, and the smoothness can be smoothly performed. Drain. By attaching the auxiliary shielding plate 88 to the shielding plate 87 in this way, it is possible to manufacture the multi-turn printed wiring board more efficiently without consuming the need to mount the lower substrate supporting member on the circuit substrate 87. As described above, according to the method for producing a multilayer printed wiring board of the present invention, it is possible to perform single-sided plating with good greenness without performing complicated steps such as formation of a resist layer. Moreover, it is not necessary to carry out the treatment of the film residue after the peeling, and the cost of such auxiliary materials is not required. In addition, there is no need to worry about the contamination of the plating bath caused by these micro-adhesive films or thermal foaming films. Moreover, even if the distance between the anode and the m-material 丨 κ is caused by the individual difference of the plating device, the difference in thickness of the electrolytic plating does not occur, and it is easy to carry out the etching process according to the photosensitive etching method. The formed circuit pattern is miniaturized. According to the above, it is possible to provide a method of manufacturing a multilayer printed wiring board having a pupil connection having an opening having a via hole on the front side only, and a frame type substrate holder suitable for manufacturing the multilayer printed wiring board. And a shielding plate combined with the hanging substrate holder. 26 201129275 As described above, although several embodiments of the present invention have been described, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention, and the present invention can of course be Changer. [Industrial Applicability] The method for producing a multilayer printed wiring board according to the present invention, the substrate holder and the shielding plate can be subjected to single-sided plating treatment on the enamel plate in a state of good productivity. It is effective in the manufacture of semiconductor mounting substrates and the like. [Brief Description of the Drawings] [Fig. 1 (3) to Fig. 1 (e)] Fig. 1 (3) to Fig. 1 (e) show the end face of the drawing board of the manufacturing process of the multilayer flexible printed wiring board which consists of three layers in the common embodiment of this invention. . Fig. 2 is a view showing the configuration of an end face in a state in which a three-layer circuit substrate is mounted on a slab holder according to an embodiment of the present invention. 3(a) to 3(c) are diagrams showing a configuration of a frame type substrate holder according to a first embodiment of the present invention, wherein (a) is a front view, (b) is a bottom view, and (c) is A. [A] (End view) [Fig. 4 (&) to Fig. 4 (c)] FIG. 4(c) is a structural view of a frame type substrate holder according to a second embodiment of the present invention, (a) is a front view, and (b) is a bottom view. Fig. (c) is an A-A' end view. 5(3) to 5(d) is a structural view of a frame type sill holder according to a third embodiment of the present invention, wherein (a) is a front view, (b) is a bottom view, and (c) is The A-A' end view and (d) are partial enlarged views. 27 201129275 [FIG. 6(a) to FIG. 6(d)] FIG. 6(a) is a view showing a configuration of a hanging type substrate holder according to a fourth embodiment of the present invention; (a) is a front view; (b) is a bottom view; c) is the A-A' end view, and (d) is the Β·Β·end view. 7(3) to 7(d) are diagrams showing a configuration of a hanging type substrate holder according to a fifth embodiment of the present invention, wherein (a) is a front view, (b) is a bottom view, and (c) It is a Α-Α' end view, and (d) is a Β·Β' end view. 8(3) to 8(e) are diagrams showing a configuration of a hanging type substrate holder according to a sixth embodiment of the present invention, wherein (a) is a front view, (b) is a bottom view, and (c) Yes. . Α' end view, (4) is a 端面·Β' end view, and (e) is a partial enlargement 【 [Fig. 9 (a) to Fig. 9 (d)] The hanging type substrate of the trade example 7 of the present invention The configuration of the holder, (a) is the front view, (b) the bottom view, (c) the most A-A' end view, and (d) the B-B' end face. [Major component symbol description] 1 Flexible insulating substrate 2 Copper foil 2a Positive mask 2b Road pattern 3 Copper foil 3a Positive mask 3b Road pattern 4 Double-sided copper laminate 5 Adhesive 6 Flexible Insulating Substrate 7 Copper foil 7b Circuit pattern 8 Single-sided copper-clad laminate 9 Erlu coffin 10 Guide universal hole 11 m rhodium plated (12 stepped via 13 Trim plate 20, 30, 40 Frame-type substrate holder 28 201129275 21, 21a 21b 21c 22, 23, 24, 25, 26, 27, 28, 29, 50, 51, 52, 53, 56, 57, 57a 57b 58, 59 ' 31, 31, > 4 U Box '31a, 31a. '41a pillar, 31b 31b, 41b 蕋 plate pressing plate, 31c, 41c hinge 32, 42 hook 33' 43 upper lateral frame 34, 44 lower lateral frame 35' 45 upper: asthma substrate support 36, 46 lower end base Material support 37 ' 37' 47 shielding plate 38 ' 38 , 48 auxiliary shielding plate 39 ' 49 circuit substrate 60 ' 70 , 80 hanging type jaw holder 61, 71 , 81 plating pliers 62 ' 72 , 82 hook 63 , 73 '83 shoulder 66 ' 76 lower end substrate support 67 > 77 , 87 shielding plate , 67a , 1 77a , 87a gripping portion, 67t 1 ' 77b ' 87b protruding portion 68 ' 78 , 88 auxiliary shielding plate 69 ' 79, 89 circuit substrate 29