TW201129273A - Method for manufacturing connection structure - Google Patents

Abstract

To provide a method for manufacturing a connection structure which enhances conduction reliability when electrodes of connecting object members are electrically connected. The manufacturing method for the connection structure 1 includes a process in which an anisotropic conductive material containing conductive particles is coated on the upper face 2a of a first connecting object member 2 to form an anisotropic conductive material layer 3A, a process in which light is irradiated on the anisotropic conductive material layer 3A to promote curing of the anisotropic conductive material layer 3A and the anisotropic conductive material layer 3A is changed into an anisotropic conductive material layer 3A of a B-stage, and a process in which a second connecting object member 4 is further laminated on the upper face 3a of the anisotropic conductive material layer 3B of the B-stage, and by applying heat to the anisotropic conductive material layer 3B of the B-stage, the anisotropic conductive material layer 3B of the B-stage is cured.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a bonded structure using an anisotropic conductive material comprising a plurality of conductive particles, and more particularly, for example, A method of manufacturing a connection structure in which electrodes of various connection target members such as a flexible printed circuit board, a glass substrate, and a semiconductor wafer are electrically connected via conductive particles. [Prior Art] Anisotropic conductive paste, anisotropic conductive ink, and anisotropic conductive adhesive Anisotropic conductive materials have been widely known. The anisotropic conductive material is a plurality of conductive particles dispersed in a slurry, an ink or a resin. The anisotropic conductive material is used, for example, for the connection between a flexible printed circuit board and a glass substrate (F〇G (FiImonGIass)), and the connection between the semiconductor substrate and the flexible printed circuit board (C0F (Chip 〇n) Heart, film = crystal)), or connection of a semiconductor wafer to a glass substrate (c〇G (chip (10) Glass, glass flip-chip, etc. = is the above-mentioned anisotropic conductive material - for example, the following patent (1): anisotropy The conductive material discloses an anisotropic conductive material containing an epoxy resin, a rubbery polymer particle, a latent epoxy hardener, a high softening point polymer particle, and a ferrite. When the electrode of the material body wafer is electrically connected to the electrode of the glass substrate, the glass substrate is coated with an anisotropic conductive material containing conductive particles, and the conductor wafer is heated and twisted. The conductive material is hardened, and the tunnel is electrically connected to the corpse and the two electric particles to obtain a connection structure. [Previous Technical Literature] [Patent Literature] [Patent Document 1 ]曰本专利开开2000-345010号SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] When the electrodes are electrically connected, the anisotropic conductive material applied to the glass substrate and the conductive particles contained in the anisotropic conductive material are In the case where the cured layer and the conductive particles formed of the anisotropic conductive material are not disposed in a specific region, there is a possibility that the conductive layer cannot be disposed between the lower electrodes. The particles or the adjacent electrodes that should not be connected are electrically connected via a plurality of conductive particles. Therefore, the connection structure obtained has a low reliability of conduction. The coated anisotropic conductive material diffuses beyond the coating width due to the dripping phenomenon, causing the anisotropic conductive material to inadvertently bleed out beyond a specific region. The object of the present invention is to provide a connection object In the case where the electrodes of the members are connected to each other, the method of manufacturing the connection structure capable of improving the conduction reliability can be improved.

[Technical means for solving the problem J Manufacture = a broader aspect of the present invention, providing a connection structure: You have the following steps: on the surface of the first connection member: the cloth contains lightning conductivity The anisotropy of the uncle #Electrical material, forming anisotropic conductivity 150398.doc 201129273 Material layer 'ϋThe light is irradiated to the above-mentioned layer of anisotropic conductive material, and the above-mentioned anisotropic conductive material layer is hardened to make the above-mentioned anisotropy Conductive material maiko

The second connection member is laminated on the upper surface of the anisotropic conductive material layer on the surface of the above-mentioned anisotropic conductive material layer by f B , and the above-mentioned intermediate conductive material layer is formed by crystallization The heat is imparted to harden the layer of the anisotropically oriented f (four) layer. In a specific aspect of the method for fabricating the connection structure of the present invention, in the step of forming the anisotropic conductive material layer and the step of grading the anisotropic conductive material layer B, The anisotropic conductive material is rubbed to irradiate light onto the anisotropic conductive material layer. In another specific aspect of the method for fabricating the connection structure of the present invention, the step of forming the anisotropic conductive material layer and the step of continuing the layer of the anisotropic conductive material are applied to the anisotropy The above-mentioned anisotropic conductive material layer is irradiated with light at the same time as the conductive material or immediately after coating. In still another specific aspect of the method for fabricating a connection structure of the present invention, the step of forming the anisotropic conductive material layer and the step of forming the anisotropic conductive material layer BP are self-coated The time from the directional conductive material to the irradiation of light is in the range of 0 to 3 seconds. In another specific aspect of the method for producing a bonded structure of the present invention, an anisotropic conductive material containing a curable compound, a thermosetting agent, a photocuring initiator, and conductive particles is used as the anisotropic conductive material. 7 in the method for producing a connection structure according to the present invention, in another specific bear sample, in the step of forming the anisotropic conductive material layer and the step of grading the hetero-conductive conductive material layer B, the use-containing dispensing And a composite device connected to the light illumination device of the 150398.doc 201129273 dispenser. [Effects of the Invention] In the method for producing a connection structure according to the present invention, the anisotropic conductive material layer is cured by irradiating light to the anisotropic conductive material layer, and the anisotropic conductive material layer is 8 steps. After the addition, heat is applied to the third-order anisotropic conductive material layer, so that the flow of the anisotropic conductive material layer and the conductive particles contained in the anisotropic conductive material layer can be suppressed. Therefore, the cured layer and the conductive particles formed of the anisotropic conductive material can be disposed in a specific region. Therefore, in the case where the electrodes of the second and second connection members are electrically connected to each other, the conduction can be improved, and the upper and lower electrodes to be connected can be easily connected by the conductive particles, and can be suppressed. Adjacent electrodes that should not be connected are connected via a plurality of conductive particles. Further, since the anisotropic conductive material coated by the dispenser is hardened before dropping, it is less likely to diffuse beyond the coating width, and the anisotropic conductive material can be prevented from inadvertently oozing out of the specific region. [Embodiment] The present invention is exemplified by the present invention. The present invention will be described with reference to the drawings. In Fig. 1, an example of a manufacturing structure of a connecting structure according to one embodiment of the front cutaway sectional view is shown. The connection structure 1 shown in FIG. 1 has a structure in which the second connection member 4 is connected to the upper surface 2a of the first connection member 2 via the cured layer 3: The cured layer 3 is made to include a plurality of conductive layers. Sexual particle $ of the opposite ^ ^ 150398.doc 201129273 The material hardens to form a plurality of electrodes 2b. Several electrodes 4b. The particles 5 are electrically connected. The upper surface 23 of the first connection object member 2 is provided on the lower surface 4a of the second connection object member 4, and the repolarization 2b and the electrode 4b are provided by j or a plurality of conductive connection structures 1 The substrate substrate 连接i is connected to the object member 2, and a semiconductor wafer is used as the second connection target member 4. The object to be connected is not particularly limited. Specific examples of the second connection target member include an electronic component such as a wafer, a capacitor, and a diode, and a circuit structure such as a printed circuit board, a flexible printed circuit board, and a glass substrate. The body 1 can be obtained, for example, in the following manner. As shown in Fig. 2 (4), the i-th connection member 2 having the electrode 2b on the upper surface h is prepared. Secondly, the anisotropic conduction of the plurality of electroconductive particles 5 is applied to the upper surface 2a of the first connection member 2. The material 'on the second surface 2a of the connection object member 2 forms the anisotropic conductive material layer 3A. In this case, it is preferred to dispose one or a plurality of conductive particles 5 on the electrode 2b. The person-human, as shown in Fig. 2(b), hardens the anisotropic conductive material layer 3 A by irradiating the anisotropic conductive material layer 3 with light. The anisotropic conductive material layer 3A is hardened, and the anisotropic conductive material layer is B-staged. A B-staged anisotropic conductive material layer 3B is formed on the upper surface 2a of the first connection object member 2. It is preferable that the anisotropic conductive material layer 3A is irradiated with light while applying an anisotropic conductive material to the upper surface 2 of the first connection member 2. Further, it is also preferable to apply an anisotropic property to the surface 2a of the first connection member 2a or to irradiate the anisotropic conductive material layer 8 immediately after coating. When the coating is applied in the above manner and the light is irradiated, the flow of the anisotropic conductive material layer can be suppressed by V. Therefore, it is possible to further improve the conduction of the connected structure 丨. The time from the application of the anisotropic conductive material to the upper surface 2a of the first connection member 2 to the irradiation of light is preferably in the range of G to 3 seconds, more preferably in the range of 〇 2 seconds. It is preferable that the time from when the upper surface 23 of the first connection member 2 contacts the anisotropic conductive material to the illumination light satisfies the above range. In order to moderately harden the anisotropic conductive material layer 3A, when the light is irradiated, the intensity is preferably in the range of o-ww. The light source when the light is irradiated is not particularly limited. Examples of the light source include a light source having a sufficient light emission distribution with a wavelength (10) or less. Further, as a specific example of the light source, for example, a low pressure mercury lamp, a medium mercury lamp, a mercury lamp, or an ultrahigh pressure mercury lamp can be cited. 1 lamp, metal halide lamp, etc. Lamp black, first lamp, microwave excited mercury = as shown in Fig. 2 (4) 'on the B-staged anisotropic conductive 3B upper surface 33 laminated 2nd connection object member 2 above the first pole 2b, and the second connection In the case where the electrode 2 is opposite to the electrode of the structure h, the second connection member 4 is further laminated, and when the second connection member 4 is laminated, the layer 3B is given 埶, M 卜 s, 丨王, and the like. , hunting this layer of anisotropic conductive material 3B into a hardened layer 3. However, it is also possible to build a second connection: the heat of the anisotropic conductive material layer. Further, after the connection member 4 is bonded to the anisotropic conductive material layer _ = laminated layer 2 150398.doc 201129273 The lower limit of the heating temperature when the anisotropic conductive material layer 3B is hardened by imparting heat is 16 〇〇 c 'The upper limit is better than 25〇°c, and the upper limit is 2〇〇. (: It is preferable to pressurize when the anisotropic conductive material layer 3B is hardened. By compressing the conductive particles 5 by the electrode 2b and the electrode 4b by pressurization, the electrodes 2b, 4b and the conductive particles can be enlarged. The contact area of 5. Therefore, the conduction reliability can be improved. By curing the anisotropic conductive material layer 3B, the i-th connection object member 2 and the second connection object member 4 are connected via the cured layer 3. Further, the electrodes are The electrode 4b is electrically connected via the conductive particles 5. Thereby, the connection structure 1 shown in Fig. j can be obtained. In the present embodiment, since photohardening and thermal curing are used in combination, anisotropy can be obtained in a short time. In the present embodiment, when the anisotropic conductive material layer 3A is formed and the anisotropic conductive material layer 3A is B-staged, the composite device shown in Fig. 3(a) can be suitably used. The composite device shown in 3(a) includes a dispenser 12, and a light irradiation device 13 connected to the dispenser 12. The dispenser 12 includes a syringe 12a for filling an anisotropic conductive material therein, And a grip portion 12b that grips the outer peripheral surface of the syringe 12a. 13 includes a light irradiation device body ua and a light irradiation portion 13b. In the composite device, the grip portion 12b is connected to the light irradiation device body 13a. Therefore, the distance between the dispenser 12 and the light irradiation device 13 can be reduced, that is, The distance between the discharge portion of the dispenser 12 and the light irradiation portion is reduced. Further, the dispenser 12 and the light irradiation device 13 can be easily moved at the same speed. Further, the syringe 12a and the light irradiation device body Ua are also Directly I50398.doc 201129273 is connected. As shown in Fig. 3 (4), when the coating and the light are irradiated, the composite device U is moved in the direction of the arrow A, and the surface of the object member 2 is connected from the center of the syringe to the first object. 2a is coated with enamel, and the tunnel +: 呉 呉 conductive material forms an anisotropic conductive material layer 3A. In addition, one side is divided into pillows. The edge of the cloth is connected to the light of the dispenser 12 and the radiation device 13 The light irradiation _ 兀 * <, 耵. 卩 13b illuminates the anisotropic conductive material layer 3 A as shown in the former B. Further suppresses the inversion of the surface of the first connection member 2 a layer of a conductive material and a layer of the anisotropic conductive material From the viewpoint of the flow of the f-particles 5, it is preferable that the application and the light are irradiated while the dispenser 12 and the light irradiation device 13 are moved. Further, the illumination is controlled with high precision. From the viewpoint of the time until the time, it is preferable to move the dispenser 12 and the light irradiation device 13 at the same speed. However, the platform 31 may be moved in the direction of the arrow a without moving the composite device U. As shown in Fig. 4 (4), a dispenser 12 and a light irradiation device 21 that is not connected to the dispenser 12 may be used. The light irradiation device 21 is the same as the light irradiation device (4) / the light irradiation device body 21 a and the light irradiation portion 2丨b. The light irradiation device u is configured to emit light to a wider area of the light irradiation device 13. When the dispenser 12 and the light-emitting device 21 that is not connected to the dispenser 12 are used, for example, as shown in Fig. 4(a), the device 21 is irradiated above the second connection member 2. Next, the dispenser 2 is moved in the direction of the arrow A between the first connection pair member 2 and the light irradiation device 2 1 , and the emitter 12a is coated on the upper surface 2a of the first connection member 2 Anisotropic Conductivity I50398.doc 201129273 The electrical material 'forms an anisotropic conductive material layer 3A. Then, as shown in FIG. 4(b), after the application of the anisotropic conductive material is completed, the light-irradiating portion 21b of the light-irradiating device 21 disposed above the first connection-target member 2 is opposed to the anisotropic conductive material layer. 3A illuminates the light. Irradiation of light is carried out, for example, at the same time as the application of the anisotropic conductive material or immediately after coating. The light irradiation device 21 is preferably disposed above the second connection member 2 at the time of coating. In this case, light can be quickly irradiated after coating. Preferably, the coated anisotropic conductive material layer illuminates light together from the entire area after coating. In this case, the anisotropic conductive material layer 3 can be more uniformly B-staged. By using the apparatus shown in FIG. 3(a) or FIG. 4(a), it is possible to easily apply the anisotropic conductive material to the upper surface 23 of the second connection object member 2, or immediately after coating. The anisotropic conductive material layer 3 is irradiated with light. The anisotropic conductive material used in the method for producing a bonded structure of the present invention is not particularly limited. The above anisotropic conductive material is further suppressed from the viewpoint of further suppressing the flow of the anisotropic conductive material coated on the upper surface 2a of the second connection object member 2 or the conductive particles contained in the anisotropic conductive material. Preferably, it contains a curable compound, a thermosetting agent, a photohardening initiator, and conductive particles. The viscosity of the above anisotropic conductive material before coating at 25t and 25 rpm is preferably in the range of 20-200 Pa.s. In this case, for example, after the anisotropic conductive material is applied to the upper surface 2a of the first connection member 2, the flow of the anisotropic conductive material before curing can be further suppressed, and further, the electrode and the conductivity can be easily removed. The resin composition between the particles increases the contact area of the electrode with the conductive particles of 150398.doc 201129273. Further, when the first connection target surface is uneven, the surface of the uneven surface can be sufficiently filled: ^ ^ 丨, and the conductive particles are difficult to precipitate in the anisotropic conductive material, and the conductive particles can be improved. The method of producing the above-mentioned anisotropic conductive material is not particularly limited. Examples of the method for producing the anisotropic conductive material include the above-mentioned curable compound, the above-mentioned thermosetting agent, the photocuring initiator, the above-mentioned particles, and other optional star-type agitator which are added as needed. A fully mixed manufacturing method. The manufacturing method of the connection structure of the present invention is, for example, a connection between a flexible printed circuit board and a glass substrate (FQG (Film Gn Glass)), and a connection between a semiconductor wafer and a flexible printed circuit board (c〇F (Chip 〇n Film) )), or a connection between a half-body wafer and a glass substrate (COG (Chip 〇n Glass)). The method for producing the joined structure of the present invention is suitable for use in c〇g. The method of manufacturing the connection structure of the present invention can be suitably used for the connection of a semiconductor wafer to a glass substrate. However, the use of the method of producing the joined structure of the present invention is not limited to the above use. In the COG application, in many cases, it is difficult to reliably connect the semiconductor wafer and the electrode of the glass substrate by using the conductive particles of the anisotropic conductive material. For example, in the case of COG use, the interval between the adjacent electrode of the semiconductor wafer and the adjacent electrode of the glass substrate may be about 1 〇 2 〇 ^ (7), and in many cases, fine wiring is formed. Even if a fine wiring is formed, the semiconductor wafer and the electrode of the glass substrate can be connected with high precision by the manufacturing method of the connection structure of the present invention, and the conduction reliability can be improved. Hereinafter, the detailed inner valley of each component contained in the above anisotropic conductive material will be described. (Curable compound) As the curable compound, a conventionally known curable compound can be used, and it is not particularly limited. The curable compound may be used alone or in combination of two or more. Examples of the curable compound include light, a thermosetting compound, a photocurable compound, and a thermosetting compound. The above-mentioned light and thermosetting compound have photocurability and thermosetting property. The photocurable compound has, for example, photocurability and does not have thermosetting properties. The above thermosetting compound does not have photocurability, for example, and has thermosetting properties. The curable compound contains a light and a thermosetting compound, or a photocurable compound and a thermosetting compound. In the case where the curable compound contains the light and the thermosetting compound, the curable compound may not contain at least one of the photocurable compound and the thermosetting compound, and may be in addition to the light and thermosetting compound. Further, at least one of a photocurable compound and a thermosetting compound is contained. In the case where the curable compound does not contain the light and thermosetting compound, the hardening compound contains a photocurable compound and a thermosetting compound. The curable compound preferably contains at least one of the light and thermosetting compound, the photocurable compound, and the thermosetting compound, or contains photohardening, from the viewpoint of easily controlling the curing of the anisotropic conductive material. Compounds and thermosetting compounds. The curable compound is more preferably 150398.doc 13 201129273 is a photocurable compound and a thermosetting compound β. The curable compound is not particularly limited. Examples of the curable compound include an epoxy compound, an episulfide compound, an (yinyl)acrylic acid compound, a phenol compound, an amine compound, an unsaturated polyester compound, a polyurethane compound, and a polyfluorene compound. Oxygen compounds and polyimine compounds. The above (meth)acrylic acid means acrylic acid or methacrylic acid. When the photocurable compound and the thermosetting compound are used in combination, the amount of the photocurable compound and the thermosetting compound to be used is appropriately adjusted depending on the type of the photocurable compound and the thermosetting compound. The anisotropic conductive material is preferably a weight ratio of i: 99 to 9 Å: 1 〇 contains a photocurable compound and a thermosetting compound, more preferably 5: 95 to 6 〇: 4 〇 'It is better to contain 20: 80~40: 60. [Thermosetting compound] The curable compound preferably contains an epoxy compound and an episulfide compound from the viewpoint of easily controlling the hardening of the anisotropic conductive material or further improving the conduction reliability of the bonded structure. At least one of the compounds containing a cyclic thioethyl group is more preferably an episulfide compound. In order to improve the hardenability of the anisotropic conductive material, the point of the above-mentioned hardening compound 100 is severely damaged, and the preferred lower limit of the above-mentioned episulfide compound is 夕 hk; <3; The lower limit is preferably 20 parts by weight, preferably a part by weight. The upper limit of the scorpion is 5 Å by weight. The upper limit is the above epoxy compound and the upper scent. The aromatic ring, the tetracene ring, the ring ring, and the episulfide compound preferably each have an aromatic group: a stupid ring, a naphthalene ring, an anthracene ring, a phenanthrene biphenyl ring, a tetrafen ring, an anthracene ring. And five 150398.doc -14- 201129273 benzene ring, ring and ring and so on. Wherein the above aromatic ring is preferably a benzene ring, a naphthalene ring or an anthracene ring, more preferably a benzene ring or a naphthalene ring. The episulfide compound has an episulfide group instead of an epoxy group, and thus can be rapidly hardened at a low temperature. Namely, the episulfide compound having a cyclohexadiene ethyl group can be hardened at a lower temperature due to the episulfide group than the epoxy compound having an epoxy group. The above-mentioned episulfide compound preferably has a structure represented by the following formula (1), (2), (5), (7) or (8) from the viewpoint of hardening at a lower temperature, and more preferably Preferably, it has a structure represented by the following formula (1) or (2). [Chemical 1]

In the above formula (1), R1 and R2 each represent an alkylene group having 1 to 5 carbon atoms, and 2 to 4 of the 4 groups of R3, R4, R5 and R6 represent hydrogen 'R3, R4, 5 and 5 The group which is not hydrogen is a group represented by the following formula (3). The four groups of R3, R4, R5 and R6 in the above formula (1) may all be hydrogen. 4 bases of R3, R4, R5 and R6! The two or two of the groups represented by the following formula (3), and the group of the four groups of R3, R4, R5 and R6 which are not represented by the following formula (3) may be hydrogen. [Chemical 2]

Formula (3) 150398.doc -15- 201129273 In the above formula (3), R7 represents an alkylene group having 1 to 5 carbon atoms. [Chemical 3]

In the above formula (2), R51 and R52 each represent an alkylene group having 1 to 5 carbon atoms, and 4 to 6 of 6 groups of R5 3, R54, R5 5, R5 6 , R 5 7 and R 5 8 represent hydrogen. The group other than hydrogen in R5 3, R54, R5 5, R5 6 , R5 7 and R58 represents a group represented by the following formula (4). The six groups of R5 3, R5 4, R5 5, R5 6 , R5 7 and R5 8 in the above formula (2) may all be hydrogen. One or two of the six groups of R53, R54, R55, R56, R57 and R58 are a group represented by the following formula (4), and R53, R54, R55, R5 6, R5 7 and R58 are not lower. The base of the group represented by the formula (4) may be applied. [4] *

In the above formula (4), R59 represents an alkylene group having 1 to 5 carbon atoms. •16·150398.doc 201129273 [Chemical 5] R101 R103 \〇 R110

s Formula (5) In the above formula (5), 'R101&R102 respectively represent a stretching group having a carbon number of 1-5. R103, Rl〇4, R1〇5, R1〇6, R1〇7, R1〇8, R1〇9 and rii. 6 to 8 of the 8 bases represent hydrogen. The group other than hydrogen in R10〇3, R10〇4, R105, Rl〇6, Ri〇7, R108, R1〇9 and R110 in the above formula (5) represents a group represented by the following formula (6). The eight groups of R103, Rl〇4, R105, R106, Rl〇7, R108, R109 and R11〇 may all be hydrogen. One or two of the eight groups of R103, R104, R105, R106, R107, Rl〇8, Rl〇9 and R110 are groups represented by the following formula (6), and R1〇3, R104, R105, Among the R1〇6, R107, R108, R109 and R11〇, the group which is not a group represented by the following formula (6) may be hydrogen. [Chemical 6]

In the above formula (6), R111 represents an alkylene group having 1 to 5 carbon atoms. I50398.doc •17· 201129273 [Chem. 7]

Formula (7) R1 and R2 each represent an alkylene group of a carbon number. In the above formula (7) [Chemical 8]

In the above formula W, 'R3 and R4 represent an alkylene group of carbon number. The episulfide compound having the structure represented by the above formula (1) or (2) has at least 2 cyclic thioethyl groups (cyclothio groups). Further, a group having an episulfide group is bonded to a benzene ring or a naphthalene ring. By having such a structure, the anisotropic conductive material can be rapidly hardened at a low temperature by heating the anisotropic conductive material. In the present specification, the term "low temperature" means 2 〇 (temperature below rc. The episulfide compound having the structure represented by the above formula (1), (2), (5), (7) or (8) and the above formula (1) The compound phase tb in which the epoxide thioethyl group in (2), (5), (7) or (8) is an epoxy group has high reactivity. The reason is that the epoxide group is more susceptible to ring opening than the epoxy group and the reactivity is It is higher. Because of the higher content of the episulfide compound of the structure shown in (7), (5), (7) or (8), the anisotropic conductive material can be hardened rapidly at a low temperature. Especially = 150398.doc -18- 201129273 The reactivity of the episulfide compound of the structure represented by the above formula (1) or (2) is relatively south, so that the anisotropic conductive material can be rapidly hardened at a low temperature. R1 and R2 in the above formula (I) (2) R51 and R52, R7 in the above formula (3), r59 in the above formula (4), R101 and R102 in the above formula, Rill in the above formula (6), and the above formula (7) R2 and R4 in the above formula (8) are extensible groups having a carbon number of 1 to 5. If the number of slaves of the extended base exceeds 5, the hardening of the above-mentioned episulfide compound exists. The tendency of the degree is slow. R1 and R2 in the above formula (1), R51 and R52 in the above formula (2), R7 in the above formula (3), and R59 in the above formula (4), and the above formula ( 5) R101 and R102, Rni in the above formula (6), ri and R2 in the above formula (?), and R3 and R4 in the above formula (8) are preferably carbon numbers 丨~3. The alkyl group is more preferably an anthracenylene group. The above alkyl group may be a stretching group having a linear structure or an alkyl group having a branched structure. The structure shown in the above (1) is preferably lower. The structure represented by the formula (1A) is excellent in the hardenability of the episulfide compound having the structure represented by the following formula (1A).

Formula (1A) In the above formula (1A), R1 & R2 each represents an alkylene group of a carbon number. The structure represented by the above formula (1) is more preferably a structure represented by the following formula (1B). The episulfide compound having a structure represented by the following formula (1B) is more excellent in hardenability. 150398.doc •19- 201129273 [化 ίο]

Formula (IB) The structure represented by the above (2) is preferably a structure represented by the following formula (2A). The episulfide compound having the structure represented by the following formula (2A) is excellent in hardenability. R51. Ό S' s (2A) In the above formula (2A), R51 and R52 each represent an alkylene group having 1 to 5 carbon atoms. The structure represented by the above formula (2) is more preferably a structure represented by the following formula (2B). The episulfide compound having a structure represented by the following formula (2B) is more excellent in hardenability. [化 12]

Ο

(2B) 150398.doc • 20-201129273 The above epoxy compound is not particularly limited to the conventionally known epoxy compound. The above-mentioned materials and the % oxygen compound may be used in combination of two or more kinds. The L-oxyl compound may be used alone as the above epoxy compound, and examples thereof include: "fat, biguanide F type epoxy resin, bis(tetra) type epoxy tree/t base phenoxy resin, biphenyl age Epoxy wax, Cai type ^ this powder (four) varnish oxyresin, benzene aryl burning epoxy resin, Hua: Fang:: type of ring grease, dicyclopentadiene epoxy resin type nucleus oxygen The epoxy resin of the tree skeleton, the tricyclic enamel bone = tree sap, and the epoxy resin having the two well core in the radiant burning.汆 Specific as the above epoxy compound 盥 bisphenol hydrazine ϋ #+ D 11 List: by epichlorohydrin

/, phenol Ai ί clothing oxygen tree know, bisphenol F fat #H ^ 乳乳树月曰 or double D-type epoxy tree knows what to create bisphenol type epoxy resin, Cong, the main inch of ten hemp and the epoxy _ lacquer tree moon 衍生 derived from the surface of the milk and benzene: paint or f (four) 曰. It is also possible to use glycidol 16 and shrinkage: various epoxidized compounds having two or more epoxy groups in the u group, and the curable compound may also have a formula represented by the above formula (1), (7), (7), (7) or (8). An epoxy compound in which the thioethyl group in the structure is substituted with an epoxy group. In this case, the structures of the above formulas (7), (4) and (6) are also preferably a structure in which an epoxy group is substituted with an epoxy group. The above curable compound may also contain an epoxidized product represented by the following formula (1)) or (12). The curable compound is preferably an epoxy compound containing an episulfide compound of the above formula (1) or (7) and a compound of the following formula (1)) or (12). 150398.doc 201129273 R13 Ο [Chem. 13]

R11

R16 0, R12

In the above formula (11), R11 and R12 each represent a stretching group having a carbon number of 1 to 5, and 2 to 4 of the four groups of R13, R14, R15 and R16 represent hydrogen, Ru, The group other than hydrogen in R14, R15 and R16 represents a group represented by the following formula (13). The four groups of R13, R14, R15 and R16 in the above formula (11) may all be hydrogen. One or two of the four groups of R13, R14, R15 and R16 are a group ' represented by the following formula (13) and R13, R14, R15 and the four groups of 6 are not the following formula (13) The group of the group shown may be hydrogen. In the above formula (13), R 7 represents a carbon-based stretching group. [化15]

Formula (12) 150398.doc 201129273 In the above formula (12), R61 and R62 each represent an alkylene group having 1 to 5 carbon atoms, and 6 of 6 groups of R63 'R64, R65, R66, R67 and R68 ～6 groups represent hydrogen, and a group other than hydrogen among R63, R64, R65, R66, R67 and R68 represents a group represented by the following formula (14). The six groups of R63, R64, R65, R66, R67 and R68 in the above formula (12) may all be hydrogen. One or two of the six groups of R63, R64, R65, R66, R67 and R68 are a group represented by the following formula (14), and six groups of R63, R64, R65, R66, R67 and R68 are The group which is not a group represented by the following formula (14) may be iron 1. [Chemical Formula 16] / 〇, mail 9^ . " Formula (14) In the above formula (14), 'R69 represents an alkylene group having 1 to 5 carbon atoms. R11 and R12 in the above formula (11), R61 and R62 in the above formula (12), R17 in the above formula (13), and R69 in the above formula (14) are alkylene groups having a carbon number of 1 to 5 . When the carbon number of the alkylene group exceeds 5, the curing rate of the epoxy compound represented by the above formula (1^ or oxime) tends to be slow. R11 and R12 in the above formula (11), R_61 and R62 in the above formula (12), R17 in the above formula (13), and R69 in the above formula (14) are each preferably a carbon number of 1 to 3 The extension & base is good for Aachen. The above-mentioned stretching group may be an alkylene group having a linear structure or an alkylene group having a branched structure. The structure shown in the above (11) is preferably a structure represented by the following formula (11A). An epoxy compound having a structure represented by the following formula (11A) is commercially available and can be easily obtained. 150398.doc •23· 201129273 [Chem. 17]

In the above formula (11A), R11 and R12 each represent an alkylene group having 1 to 5 carbon atoms, and the structure represented by the above formula (11) is more preferably represented by the following formula (11B). The structure. The epoxy compound having a structure represented by the following formula (11B) is resorcinol diglycidyl ether. Resorcinol diglycidyl ether is commercially available and is readily available. [Chem. 18]

Formula (11B) The structure represented by the above formula U2) is preferably a structure represented by the following formula (i2A). Furnace e having the structure shown by the following formula (12A) was obtained. And long-oxygen compounds can be easily [Chem. 19]

. . . Formula (12A) 150398.doc • 24 - 201129273 In the above formula (12A), R61 and R62 respectively represent the extension of the carbon number. The structure represented by the above formula (10) is more preferably a structure represented by the following formula (i2B). An epoxy compound having a structure of the following formula (12B) can be easily obtained

(12B) A mixture of an episulfide compound having a structure represented by the above formula (1) or (2) and an epoxy compound not represented by the above formula (11) or (12) (hereinafter, sometimes omitted It is preferable that the content of the episulfide compound having the structure represented by the above formula or (2) is 1 〇 to 5 〇 by weight, and the above formula (11) or The content of the epoxy compound shown in (12) is 8% by weight, more preferably the epoxide compound having the structure represented by the above formula (1) or (2) is 20 to 30% by weight, Further, the content of the epoxy compound represented by the above formula (η) or (12) is from 80 to 70% by weight. If the content of the episulfide compound having the structure represented by the above formula (1) or (2) is too small, the curing rate of the above mixture A tends to be slow. If the content of the episulfide compound having the structure represented by the above formula (1) or (2) is too large, the viscosity of the above mixture A becomes too high' or the above-mentioned mixture A becomes a solid. The method for producing the above mixture A is not particularly limited. For example, the method of the above-mentioned formula (11) or the preparation of the above-mentioned formula (11), and the oxidation of a part of the epoxy group of the side epoxy compound can be exemplified. The production method of the above mixture A is preferably carried out by continuously or intermittently adding the epoxy compound represented by the above formula (1)) or (12) to or containing the vulcanizing agent. After the solution of the compound, the method of adding the second solution containing the vulcanizing agent is continuously or intermittently added. # By this method, a part of the epoxy group of the above epoxy compound can be converted into an episulfide group. As a result, the above mixture A can be obtained. Examples of the vulcanizing agent include sulphuric acid salts, thioureas, phosphine sulfide, diinylthio phthalamide, and benzothiothione. Examples of the thiocyanate include sodium thionate, potassium thioate, and sodium thiocyanate. The curable compound of the melon may further contain a monomer having an epoxy compound having a structure represented by the following formula (21), a polymer obtained by bonding at least two of the epoxy compounds, or the monomer and the monomer. a mixture of polymers. [Chem. 21]

In the above formula (21), R1 represents an alkylene group having 1 to 5 carbon atoms, 2 represents an alkylene group having 1 to 5 carbon atoms, and R3 represents an alkyl group having a hydrogen atom of 'carbon number 5' or the following formula (22) In the structure shown, R4 represents a hydrogen atom, a carbon number of ～5, or a structure represented by the following formula (23) of I50398.doc -26 - 201129273. [化22]

In the above formula (22), R5 represents an alkylene group having 1 to 5 carbon atoms. [Chem. 23]

In the above formula (23), R6 represents an alkylene group having 1 to 5 carbon atoms. The epoxy compound having the structure represented by the above formula (2) is characterized by having an unsaturated double bond and at least two epoxy groups. By using an epoxy compound having a structure represented by the above formula, it can be used at a low temperature. The anisotropic guide is rapidly hardened. The above-mentioned curable compound may further contain a monomer having a compound of the following formula (9), and a polymer obtained by bonding the compound or a monomer. Mixture with the polymer. ' 150398.doc -27- 201129273 [Chem. 24]

3 - X1 • X2 (31) In the above formula (31), R1 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms or a structure represented by the following formula (32), and R2 represents a carbon number of 1 to 2 5 is an alkylene group, R3 represents an alkylene group having 1 to 5 carbon atoms, XI represents an oxygen atom or a sulfur atom, and X2 represents an oxygen atom or a sulfur atom. -X3 R4 In the above formula (32), R4 represents an alkylene group having 1 to 5 carbon atoms, and Χ3 represents an oxygen atom or a sulfur atom. The epoxidized group I50398.doc -28-201129273 which is equivalent to the compound having the structure represented by the above formula (31) can be synthesized, for example, in the following manner. The raw material compound is mixed with a burial compound, epigas alcohol, oxyhydrogen, and a Si, and is cooled to react H dropwise with a sodium oxynitride solution. After the dropwise addition, the reaction was further carried out to obtain a reaction liquid. Next, water and a stupid were added to the reaction liquid, and the toluene layer was taken out. After washing the toluene layer with water, it is dried to remove water and solvent. #此, It is easy to obtain an epoxy compound of a compound having a structure of the above formula (3). Further, as a raw material compound, a compound having a warp group is, for example, a city such as JFE Chemical Co., Ltd. Further, a compound containing a ring:ethyl group corresponding to a compound having a structure represented by the above formula (31) can be obtained by an epoxy resin equivalent to an epoxy compound having a J = compound represented by the above formula (8). The base is converted into a cyclothioethyl group, and a solution containing the epoxy compound is added as a raw material in a solution containing the above-mentioned vulcanizing agent, and then a solution of a vulcanizing agent is further added, whereby the epoxy group can be easily added. The compound which is converted into a ring m compound may also contain a compound. The above epoxy compound having a hetero ring containing a nitrogen atom is produced by the following formula (41), and is preferably a compound which is not a compound. Or the lower compound. By using the hardening rate of the hardenable epoxy conductive material, and the stepwise acceleration of the heat resistance of the anisotropic hardened material, and further improving the I50398 of the anisotropic conductive material .doc •29· 201129273 [ 26]

...(41) ο

In the above formula (41), R1 to R3 each represent a stretching group having a carbon number of 1 to 5, and B represents a cyclodecyl group or a hydroxy group. R21 to R23 may be the same or different. [化27] Λ R4 0 — R1. 0

D

0 Ν- 0- • R3

A R6 R2' Ν

Ο 0- R5 q In the above formula (42), 'R1 to R3 respectively represent a carbon number 伸 extension group, and p and qh each represent an integer 'R4 of 1 to 5', respectively, and represent a carbon number of the alkyl group. R1 to R3 may be the same or not. p, q and r may be the same or different. R4 to R6 may be the same or different. The above oxygen compound having a gas-containing heteroselective + clothing is preferably a triple-shrinkage I50398.doc • 30-201129273 glyceryl isocyanuric acid SI, or tris-ethylethyl isocyanuric acid triglycidyl scale. By using these hardening compounds, the hardening speed of the anisotropic conductive material can be further accelerated. It is preferred that the above-mentioned curable compound contains an epoxy compound having an aromatic ring, and by using an epoxy compound having an aromatic ring, the rate of hardening of the material can be accelerated and the coating is easily applied. Conductive material. From the viewpoint of the coatability of the anisotropic conductive material, the above aromatic ring is preferably a benzene ring, a naphthalene ring or an anthracene ring. The above-mentioned aromatic ring = epoxy compound' may, for example, be resorcinol diglycidyl ether or hydrazine naphthalene diglycidyl ether. Among them, the female, like L Α ^ is particularly preferably a structure having the structure represented by the above formula (11Β), which is a hydroquinone diglycidyl ether. By using resorcinol diglycidyl hydrazine ′, the rate of hardening of the anisotropic conductive material can be accelerated, and the anisotropic conductive material can be easily applied. [Photocurable compound] The curable compound of the present invention may further contain a photocurable compound to be cured by irradiation with light. The curable compound can be semi-hardened by irradiation of light to lower the fluidity of the curable compound. The photocurable compound is not particularly limited, and examples thereof include a (meth)acrylic resin and a cyclic ether group-containing resin. As the (meth)acrylic resin, for example, a compound obtained by reacting (meth)acrylic acid with a compound having a recording compound, and reacting (b-methyl)acrylic acid with an epoxy compound can be suitably used. Epoxy (meth)acrylic acid, and (meth)acrylic acid urethane obtained by reacting isocyanate S with a trans (meth)propionic acid derivative. 150398.doc 201129273 In the case of containing a photocurable compound other than the photocurable compound, the photocurable compound may be a crosslinkable compound or a non-crosslinkable compound" as the crosslinkable compound. Specific examples include, for example, 1,4-butanediol bis(indenyl) acrylate, 1,6-hexanediol di(meth) acrylate, and 1,9-nonanediol bis (曱). Acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol bis(indenyl)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(decyl)acrylic acid Ester, glycerol methacrylate acrylate, pentaerythritol tris(decyl) acrylate, trishydroxypropyl propane tridecyl acrylate, allyl (meth) acrylate, ethylene (meth) acrylate, diethyl A thin benzene, a polyester (meth) acrylate, and a (meth) acryl amide phthalate. Specific examples of the non-crosslinkable compound include ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl methacrylate, and n-butyl (meth) acrylate. Isobutyl methacrylate, tert-butyl (meth) acrylate, amyl (meth) acrylate, hexyl (meth) acrylate, (heptyl) heptyl acrylate, (meth) acrylate_2 Ethylhexyl ester, n-octyl (meth)acrylate, isooctyl (meth)acrylate, decyl acrylate (decyl) decyl acrylate, undecyl (meth) acrylate, Dodecyl (meth)acrylate, tridecyl (meth)acrylate, and tetradecyl (meth)acrylate. [Light and thermosetting compound] When the curable compound contains, for example, a thermosetting compound and a photopolymerizable compound, it is easy to control the hardening of the anisotropic conductive material, I50398.doc •32·201129273 or further improve the connection. From the viewpoint of the conduction reliability of the structure, the curable compound preferably contains light having at least one of an epoxy group and an episulfide group and a (meth)acryl fluorenyl group, and a thermosetting compound. The curable compound preferably contains light having an epoxy group and a (meth)acryl fluorenyl group and a thermosetting compound (hereinafter also referred to as a partially (meth) acrylate epoxidized epoxy resin). The above (meth)acrylic acid vinegar means acrylic or decyl acrylate. The above-mentioned partial (meth) acrylated epoxy resin is obtained, for example, by reacting an epoxy resin with (meth)acrylic acid in the presence of a basic catalyst according to a usual method. It is preferred to convert (4) or more of the epoxy group to a (meth) propylene (conversion) and partially (meth) acrylate. More preferably, 50% of the epoxy group is converted to a (meth) acrylonitrile group. From the viewpoint of improving the hardenability of the anisotropic conductive material, a preferred lower limit of the content of the above-mentioned partial (meth)propionic acid acetated epoxy resin in the weight % of the curable compound is ο"% by weight, A lower limit is preferably 〇·5% by weight, a higher limit is preferably 2% by weight, and a higher limit is 丨5% by weight. Examples of the epoxy (meth)acrylic acid vinegar include a double-type epoxy (meth)acrylic acid vinegar, a f-four (four) varnish-type epoxy (meth)acrylic acid vinegar, and a tauric anhydride-modified epoxy resin ( Methyl acrylate vinegar, and phenol phenolic acrylate). Milk (A thermosetting agent) The above-mentioned thermosetting agent is not particularly limited. As the above-mentioned thermosetting agent, a conventionally known thermosetting agent can be used. Examples of the above-mentioned thermosetting agent include (4) a curing agent, an amine curing agent, and a weighting agent. A 丨, 4 thiol hardener, acid field, etc. l5039S.doc •33· 201129273 The above-mentioned heat curing agent may be used alone or in combination of two or more. The above heat curing agent is preferably an imidazole hardener or a poly A thiol hardener or an amine hardener, which is because the anisotropic conductive material can be hardened more rapidly at a low temperature. Further, a latent hardener is preferred because the anisotropic conductive material can be improved. Storage stability. The latent hardener is preferably a latent imidazole hardener, a latent polythiol hardener or a latent amine hardener. The above heat hardener may also be a polyamine phthalate resin or polyester. The imidazole curing agent is not particularly limited, and examples thereof include 2—nonyl imidazole, 2-ethyl-4·nonyl imidazole, and cyanoethyl 2-phenylimidazole. Cyanoethyl-2-phenylimidazolium Acid salt, 2,4-diamino]6_[2|-methylimidazolyl·(1,)]-ethyl-all-three and 2,4-diamino- 6 [2, methyl- oxazole The base (I1)]-ethyl-allo-three-pigmented isocyanurate addition product, etc. The polythiol hardener is not particularly limited, and examples thereof include trimethylolpropane tri-3, propyl propionic acid. Vinegar, pentaerythritol tetra-3, propyl propyl acrylate, dipentaerythritol hexamethylene propionate, etc. The amine hardener is not particularly limited, and examples thereof include hexamethylene diamine, octamethylene diamine, and ten ya. Methyldiamine, 3,9_bis(3_Aminopropionate 2,4,8,10-tetraspiro[5.5] eleven, bis(4,ylcyclohexyl)methylxyl, m-phenylenediamine And diaminodiphenyl sulfone, etc. The content of the above-mentioned thermosetting agent is 盔 . . . . 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 合 合 合 合 合 合 合 合 合 合 合 合 合 合 合Λ 里里切, the preferred lower limit of the content of the above-mentioned heat hardener is 5 parts by weight, more preferably I: 艮 or Λ壬 _ θ is 10 parts by weight, preferably upper limit is 3 〇 by weight , the upper limit is 20 parts by weight. Times: u β on £ f The content of the above hot hardener meets 150398 .doc -34· 201129273 When the lower limit and the upper limit are better, the anisotropic conductive material can be sufficiently thermally cured (photocuring initiator). The photohardening initiator is not particularly limited. The photohardening initiator may be used alone or in combination of two or more kinds. The photocuring initiator is not particularly limited, and examples thereof include anthraquinone light. Hardening initiator, bismuth photohardening initiator, 9_oxysulfide, condensed photohardening initiator, halogenated _, fluorenylphosphine oxide and oleic acid vinegar, etc. as the above acetophenone light Specific examples of the curing initiator include 4_(2·hydroxyethoxy)phenyl(2-superpropyl)ketone and 2—transalkyl-2-indolyl]-phenylpropan-1-one. Methoxyacetophenone, 2,2. dimethoxy-phenylethyl _= hydrazine, and 2-carbyl-2_cyclohexyl phenylethyl _ and the like. Specific examples of the above-mentioned shrinkage curing initiator include benzoin dimethyl ketal and the like. The content of the above photohardening initiator is not particularly limited. The lower limit of the content of the photohardening initiator is 0.1 part by weight, more preferably 〇2 parts by weight, and the upper limit is 2 parts by weight, and the upper limit is better than 100 parts by weight of the total of the curable compound. 1 part by weight. If the content of the photohardening initiator is such as to satisfy the above preferred lower limit and upper limit, the anisotropic conductive material may be used.

Moderately light hardening. The flow of the anisotropic conductive material can be suppressed by illuminating the anisotropic conductive material to make it B-stage by shaking the light. (Electrically conductive particles) The conductive particles contained in the anisotropic conductive material are, for example, conventionally known conductive particles which can electrically connect the electrodes. The above-mentioned J50398.doc -35- 201129273 conductive particles are preferably particles having a conductive layer on the outer surface. The electric particles may also be coated with insulating particles on the surface of the conductive layer, and the surface is covered by the insulating material. In this case, the insulating particles or the insulating layer are removed by pressing the electrode 2 = under pressure. For example, the conductive particles include, for example, organic particles, inorganic particulate organic-inorganic hybrid particles, or conductive particles coated with a conductive layer on the surface of metal particles, and metal particles substantially composed only of metal. Wait. The above conductive layer is not particularly limited. As the above conductive layer, a gold layer, a silver layer, a copper layer, a recording layer, a layer or a conductive layer containing tin, or the like can be listed. The amount of the above-mentioned conductive particles in the weight % of the anisotropic conductive material is preferably in the range of 1 to 25% by weight. The lower limit of the content of the above conductive particles is 5% by weight, more preferably 19% by weight, still more preferably 15% by weight, and most preferably 1% by weight. When the conductive particles 3 are in the above range, the conductive particles can be easily disposed between the lower electrodes to be connected. Further, it is difficult to electrically connect adjacent electrodes that should not be connected via a plurality of conductive particles. That is, it is possible to prevent a short circuit between adjacent electrodes. (Other components) The above-mentioned anisotropic material may also contain a solvent. For example, in the case where the above-mentioned hardening is a solid, the dispersibility of the curable compound can be improved by adding a solvent to the solid curable compound and dissolving it. Examples of the solvent include ethyl acetate, thiol cellosolve, toluene, acetone decylethyl hydrazine, cyclohexane, n-hexane, tetrahydrofuran, and diethyl ether. 150398.doc -36· 201129273 The above-mentioned anisotropic guide sister _ ^ because it can improve the difference (4) invite x & is the inclusion of the adhesion modifier, the hardening step of the original 杈- anisotropic conductive material improves the force From the point of view, it is the power. Just enter-burn coupler. It is better to use the above-mentioned anisotropic enamel electric material, which can be used in the standard 〜 钊. The material of the hardened material filled with the '° conductive material is not particularly limited. Bulging. The above fillers for filling the above-mentioned fillers include dioxin and oxidized materials. The above 埴 oxidation, weathering. The "bubble" may be used alone or in combination of two kinds of substances. The lower limit of the content of the above filler is 5 parts by weight, and the lower limit is preferably 15 parts by weight, more preferably 7 parts by weight, more preferably 50 parts by weight, relative to the above-mentioned hardening compounding ratio of 10 parts by weight. ; When the content of the filler on the right side satisfies the above preferred lower limit and upper limit, the latent heat expansion of the cured product of the anisotropic conductive material can be sufficiently suppressed, and the filler can be sufficiently dispersed in the anisotropic conductive material. Hereinafter, the present invention will be specifically described with reference to the examples and the comparative examples. The present invention is not limited to the following embodiments. (Example 1) (1) Preparation of a mixture containing an episulfide compound In a vessel equipped with a stirrer, a cooler, and a thermometer, 250 mL of ethanol, 250 mL of pure water, and 20 g of potassium thiocyanate were added to make sulfur The potassium cyanate was dissolved to prepare a first solution. Thereafter, the temperature in the vessel was maintained at 2 Torr to 25 cm. Within the scope of 匸. Next, while stirring the first solution held in a container of 20 to 25 ° C, a solution was added to the first solution at a rate of 5 mL / min. 150398.doc • 37· 201129273 Glycerol mystery 1 6 0 g. After the dropwise addition, the mixture was dropped for 30 minutes to obtain a mixed solution containing an epoxy compound. Next, the second solution in which potassium thiocyanate 2 〇 g was dissolved in a solution containing 100 liters of pure water and 100 mL of ethanol was prepared. After the obtained second solution was added to the obtained epoxy group-containing mixed solution at a rate of 5 mL/min, the mixture was stirred for 3 Torr. After stirring, the second solution in which 2 〇g of potassium thiocyanate was dissolved in a solution containing pure water and xenopus was prepared, and the second solution was further added to the container at a rate of 5 minutes. Stir for 3 minutes. Thereafter, the temperature in the vessel was cooled to 1 Torr <t, and stirred for 2 hours to carry out a reaction. Next, add 1 mL of saturated brine to the vessel, stir for 1 minute, stir, add 3 mL of toluene to the vessel, stir for 1 minute, then move the solution in the vessel to the liquid separation. In the funnel, let stand for 2 hours, ^ solution is separated. The solution below the inside of the separatory funnel was discharged, and the supernatant was taken out. Toluene·mL was added to the supernatant, and the mixture was stirred and allowed to stand. Further, 1 mL of toluene was added in a stepwise manner, and the mixture was stirred. Eight people added 50 g of magnesium sulfate to the supernatant containing the stupid, and gave it for 5 minutes. After stirring, the solution was removed by removing S magnesium from S. Make the moon work dry and inorganic, at 80τ

So go... The separated solution is dried under reduced pressure, I. b, k paid 3 mixtures of epicyclic sulfur compounds 4 Determination of 1H-NMR using chloroform as a solvent. The resulting mixture containing the episulfide compound results in a decrease in the signal of the region of 6.5 to 7.5 150398.doc •38 to 201129273 PPm indicating the presence of the epoxy group, and 2 〇~3 〇PPm indicating the presence of the epoxide group. A signal appears in the area. From this, it was confirmed that a part of the epoxy group of the meta-benzoic dimethyl glycerol was converted into an epoxide group. Further, it was confirmed that the mixture containing the episulfide compound contained 70% by weight of resorcinol diglycidyl ether and 30 parts by weight of the episulfide compound having the structure represented by the above formula (1B) based on the integral value of the measurement result of 1 h_nmr. /〇. (2) Preparation of an anisotropic conductive paste In an amount of 3 parts by weight of the obtained mixture containing an episulfide compound, an amine adduct as a heat hardener ("PN-23J" manufactured by Ajinomoto Fine Techno Co., Ltd.) 5 was prepared. 5 parts by weight of an epoxy acrylate vinegar ("EBECRYL 3702" manufactured by Daicel-Cytec Co., Ltd.) as a photocurable compound, and a fluorenyl phosphine oxide compound as a photopolymerization initiator ("Darocur TPO" manufactured by Ciba Corporation ")" by weight", 1 part by weight of 2-ethyl-4-methylimidazole as a hardening accelerator, and 20 parts by weight and an average particle diameter of cerium oxide having an average particle diameter of 〇·25 μηι as a filler 20 parts by weight of the alumina of 〇5, and further, conductive particles having an average particle diameter of 3 μηη were added so that the content of the compound in the weight % of the compound became a weight %, and then stirred at 2000 rpm using a planetary mixer. In minutes, the formulation is obtained. Further, the above-mentioned conductive particles used are a conductive layer in which a nickel plating layer is formed on the surface of the divinylbenzene resin particles, and a metal layer is formed on the surface of the nickel plating layer. The obtained preparation was filtered through a nylon filter paper (having a pore size of 1 μ μηι), whereby an anisotropic conductive paste having a conductive particle content of 1% by weight was obtained. (3) Fabrication of the connection structure 150398.doc 39· 201129273 A transparent glass substrate having an ITO (Indium Tin Oxide Indium Tin Oxide) electrode pattern having an L/S of 30 μm/30 μm was formed on the upper surface. Further, a semiconductor wafer having a copper electrode pattern having an L/S of 30 μm / 30 μm is formed on the lower surface. Further, when the composite device including the ultraviolet irradiation lamp as the light irradiation device shown in Fig. 3(a) is prepared, the composite device is moved while the syringe from the dispenser is placed on the upper surface of the moon-transparent glass substrate to have a thickness of 30 The resulting anisotropic conductive paste was applied in the form of μηη to form an anisotropic conductive paste layer. Further, while the composite device is moved to "apply anisotropic conduction (four), ultraviolet rays are used, and the ultraviolet light of the anisotropic conductive_(10) is irradiated with a light irradiation intensity of 50 mw/cm2 by light. Polymerization to coat the anisotropic conductive (four) layer, that is, the time T from the time when the coated anisotropic conductive polymer is bonded to the transparent glass substrate to the irradiation of the anisotropic conductive paste layer is 0.5 second . Next, on the upper surface of the anisotropic conductive stripping layer which has been condensed, the semiconductor wafer is laminated with the electrodes facing each other. Thereafter, the temperature of the anisotropic conductive paste layer was adjusted to 185 Ω, and the degree of the surface was MPa^r, ^ on the semiconductor wafer. . The pressure heating head was placed on the surface, and the anisotropic conductive paste which was subjected to a crucible at 3 C was hardened to obtain a joined structure. s heart king (Example 2) When preparing an anisotropic conductive paste, the acid-faced * 妇 妇 妇 变更 变更 变更 D D D D D D D D D D D D D D D D D D D D D D D D D D

"EBECRYL 150398.doc 201129273 8804"), except for the use of the known anisotropic conductive polymer in the same manner as in the Example, except that the anisotropic conductive material was used. The connection structure is obtained. (Example 3) Instead of the composite device shown in Fig. 3 (4), the dispenser shown in Fig. 4 (a) and the ultraviolet irradiation lamp as the light irradiation device not connected to the dispenser were used for the anisotropic conductive paste. The connection structure was obtained in the same manner as in Example 1 except that the light was irradiated immediately after the application of the material. The time T from the application to the irradiation of light was 2 seconds. (Example 4) The connection structure was obtained in the same manner as in Example 3 except that the time τ from the application to the irradiation of light was changed to 3 seconds. (Example 5) In the preparation of the anisotropic conductive paste, the epoxy acrylate was changed to acrylamide (Dairp) Ρ *

10(10) "EBECRYL 8 804" manufactured by 1ceKytec Co., Ltd.) In addition, the anisotropic conductive paste obtained by using the anisotropic conductive paste was obtained in the same manner as in Example 3, and the anisotropic φ Π I" A connection structure was obtained in the same manner as in Example 3 except for the above. (Reference Example 1) The same procedure as in Example 1 was carried out except that the phosphatide-based phosphine-based compound which is a photopolymerization initiator was not used in the production of the anisotropy-guided sputum-derived plasmon. Anisotropic conductive paste. : A transparent glass substrate having an electrode pattern of L/S of 30 μm/30 μηι is formed on the upper surface. Further, a semiconductor wafer having a copper electrode pattern having an L/S of 30 150398.doc -41 - 201129273 μm / 30 μιη was formed on the lower surface. The syringe from the dispenser was applied to the upper surface of the transparent glass substrate to apply the obtained anisotropic conductive paste to a thickness of 30 μm to form a biaxial conductive paste layer. No light is applied at the time of coating and after coating. The person stacks the semiconductor wafer on the upper surface of the anisotropic conductive polymer layer with the electrodes facing each other. Thereafter, the temperature of the head is adjusted so that the temperature of the anisotropic conductive feed layer becomes 185 ° C, and the heating head is placed on the upper surface of the semiconductor wafer, and a slight shift force is applied to the lower surface. The anisotropic conductive paste layer is completely hardened, and the connection structure is obtained (evaluation). (1) The point of the anisotropic conductive paste before coating, the t-type viscometer (manufactured by Toki Sangyo Co., Ltd.), under conditions of hunger and 2.5 ah The measurement was carried out. (2) Leakage evaluation θ = The resulting connected structure was used to measure whether or not leakage occurred in 20 adjacent electrodes by a tester. (3) The presence or absence of voids: In the bonded structure, from the lower surface side of the transparent glass substrate, the voids were generated in the cured layer formed by the conductive paste layer. The results are shown in Table 1 below. 150398.doc .42- 201129273 [Table i]

In the embodiment 5, the anisotropic conductive material smear coated by the dispenser is hardened before, so that it does not spread more than the coating width, and the metamaterial is not inadvertently exceeded beyond the specific region. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a partially cut front cross-sectional view of a joined structure obtained by the manufacturing method of the present invention, which is used in the embodiment of the present invention. The partial cut-away front cross-sectional view of each step of the connection configuration (9) k method; FIG. 3 (a) and (b) are used for the manufacturing method of the manufacturer of the present invention "" The connection structure ', using a combination of a dispenser and a light irradiation device, forms a B-staged heterogeneous refilling mode front view U, and the method of material layer is described (4) and (9) A mode front view for explaining a modification of the method of forming the (fourth) step. Electrical material shaking layer [Main component symbol description] 1 Connection structure 2 First connection object member 150398.doc •43· 201129273 2a Upper surface 2b Electrode 3 Hardened layer 3 a Upper surface 3A Anisotropic conductive material layer 3B Orthogonal conductive material layer 4 second connection target member 4a lower surface 4b electrode 5 conductive particle 11 composite device 12 dispenser 12a syringe 12b grip portion 13 light irradiation device 13a light irradiation device body 13b light irradiation portion 21 Light irradiation device 21a Light irradiation device body 21b Light irradiation portion 31 Platform 150398.doc -44-

Claims (1)

201129273 VII. Patent Application Range: 1. A method for manufacturing a connection structure, comprising the steps of: coating a surface containing a conductive particle on a surface of a first connection member; a layer of a conductive material; by irradiating the layer of the anisotropic conductive material, and performing the hardening of the layer of the above-mentioned anisotropic conductive material to make the anisotropic conductive material (4) B-staged and B-staged And a surface of the second connecting object is formed on the surface of the anisotropic conductive material layer, and the anisotropic conductive material layer is formed by imparting heat to the b-st oriented anisotropy: material layer. The manufacturing method of the connection structure of claim 1, wherein the step of forming the anisotropic conductive material layer and the step of arranging the anisotropic electrical material layer are self-coated The directional conductive material is in the range of 0 to 3 seconds from the time of the irradiation of the light. The manufacturing method of the connection structure of claim 1, wherein the step of forming the anisotropic conductive material layer and the step of grading the anisotropic conductive material layer are performed by applying the anisotropy A layer of electrically conductive material illuminates the light. (4) The above-mentioned anisotropic guide 4, wherein the method of manufacturing the connection structure of claim 3, wherein the step of forming the anisotropic conductive material layer and the step of grading the anisotropic conductive material layer, 150398 .doc 201129273 The time from the application of the above anisotropic conductive material to the irradiation of light is in the range of 0 to 3 seconds. 5. The method of manufacturing the connection structure of claim 1, wherein the step of forming the anisotropic conductive material layer and the step of grading the anisotropic conductive material layer B are performed by applying the anisotropic conductive The anisotropic conductive material layer is irradiated with light at the same time as the material or immediately after coating. 6. The method of manufacturing a connection structure according to claim 5, wherein in the step of forming the anisotropic conductive material layer and the step of grading the anisotropic conductive material layer, self-coating the anisotropic conductive The material is in the range of 0 to 3 seconds from the time of irradiation to light. The method for producing a bonded structure according to any one of claims 1 to 6, wherein the anisotropic conductive material contains a curable compound, a heat hardener, a photohardening initiator, and a conductive particle. The opposite material. The method for manufacturing a connection structure according to any one of claims 1 to 6, wherein in the step of forming the anisotropic conductive material layer and the step of grading the opposite conductive material layer, A light combining device including a dispenser and connected to the dispenser is used. And the method of manufacturing the connection structure of claim 7, wherein the step of guiding the anisotropic conductive material layer and the step of arranging the anisotropic, bismuth conductive material layer are 150398.doc 201129273 The use of the device includes a dispenser and a light irradiation device connected to the dispenser 150398.doc