TW201129267A - Apparatus for feeding electronic component - Google Patents

Abstract

Disclosed is an apparatus for feeding electronic component, which facilitates to additionally provide electronic components by a simplified process through a simplified process by omitting steps of containing electronic components in a carrier tape, and adhering a cover tape onto the carrier tape with the electronic components contained therein. The apparatus comprises a supplying unit including a storing groove for storing the electronic component therein; a first transferring unit for transferring the electronic component to a picking position, wherein the picking position indicates a position where a mounting unit provided in a surface mounting apparatus is capable of picking up the electronic component; and a second transferring unit for transferring the electronic component, supplied from the supplying unit, to the first transferring unit, wherein the second transferring unit is installed between the supplying unit and the first transferring unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a surface mount apparatus, and more particularly to an apparatus for feeding electronic components that facilitates supply of electronic components to surface mounts. device. [Prior Art] An integrated circuit, a resistor, a switch, etc. (hereinafter, referred to as "electronic component") is mounted on a substrate' and then electrically connected to the substrate. The electronic component is automatically mounted on the substrate by using surface mount technology (SMT) of the surface mount device, which is called a mounter. Fig. 1 is a plan view schematically showing a surface mount apparatus of the prior art. Referring to FIG. 1, a surface mount apparatus 10 of the prior art includes a mounting unit 11 and a transfer unit 12, wherein the mounting unit η mounts electronic components on the substrate S, and the transfer unit 12 transfers the substrates. S. When the electronic component is mounted on the substrate S through the mounting unit η, the substrate S is placed at the mounting position a. A plurality of tape feeders 20 fed into the electronic components are mounted in the surface mount device 1A. The mounting unit 11 picks up the electronic components from the tape feeder 20; moves the electronic components to the mounting position A; the electronic components of the Newcomer pickup are mixed with the substrate S of the mounting position A. The tape feeder 200 supplies electronic components to the mounting unit u to pick up the pickup position of the electronic components by using the tape. The electronic component is placed between the transfer f and the cover tape (C〇Vertape) is attached to the upper surface of the electronic component 201129267 contained in the conveyor belt. In order to supply the electronic component to the surface mount device 1 by using the tape feeder 20, it is necessary to perform the steps of accommodating the electronic component on the conveyor belt and attaching the cover f to the upper surface of the electronic component. If the electronic components housed in the conveyor belt are all replaced, the belt feeders || 2 〇 or Wei belts are replaced with new belt feeders 20 or conveyor belts. In this case, it is necessary to stop the process of loading through the surface mount device 10, which avoids the loss of jade time. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an apparatus for feeding electronic readings to eliminate one or more problems caused by the lack of knowledge. The present invention provides a device for _ human electronic components, which provides electronic components by simplification of the money, and the simplification process omits the steps of accommodating the electronic components in the conveyor belt and The step of covering the tape side to the conveyor belt containing the electronic components. Other advantages, objects, and features of the present invention will be set forth in part in the following description. <RTIgt;</RTI> Other advantages, objects, and features of the invention will be apparent to those of ordinary skill in the art. It can be understood from the local _ real shot. The present invention and other gamma can be realized and obtained through the book making and the _ _ _ _ _ _ _ _ _ _ _ _ _ _ In order to obtain other advantages of the present invention, the present invention is embodied and described in detail. The device of the present invention includes: 201129267 supply unit, which is provided for storing electronic components in The storage tank 'first-transport unit' &amp; first-transfer unit is used for transferring electronic components to a pick-up position, wherein the pick-up position refers to a position where the mounting unit disposed in the surface mount device can pick up the electronic component And a second transfer unit for transferring the electronic component supplied from the supply unit to the first transfer unit, wherein the second transfer unit is installed between the supply unit and the first transfer unit. In another aspect of the present invention, an apparatus for feeding an electronic component includes: a supply unit including a storage slot in which the electronic component is stored; a first transfer unit, the first transfer unit The first conveying device has a plurality of first conveying grooves, and the first conveying groove is adjacent to the feeding position of the feeding electronic secret and the picking position for picking up the electronic components, and the first conveying unit is used for inserting the first Transferring the electronic component to the pick-and-place device; and the second transfer unit is configured to transfer the electronic tree from the supply unit to the first transfer, the transfer device, and the present invention (10) The detailed descriptions of the above are all representative and reversible, and are intended to further disclose the scope of the patent in the present invention. [Embodiment] The phase in the ^^合_份详_ The present invention is read by Jiashiguan. The graph phase gate field table is different or similar. &quot;Monthly, the device for describing the human element of the present invention will be described hereinafter. Feeding Electron Element of the Embodiment • Fig. 2 is a plan view showing the apparatus of the first 201129267 of the present invention. Referring to "Fig. 2", the apparatus for feeding electronic components of the present invention includes a supply unit 2, a first transfer unit 3, and a second transfer unit 4. First, the electronic component is housed in the supply unit 2. The electronic component can be transferred from the supply unit 2 to the first transfer unit 3 through the second transfer unit 4. In addition, the mounting unit 安装 (not shown in FIG. 1) mounted on the surface mount device 10 (as shown in FIG. 1) can pick up the electronic components from the first transfer unit 3 and then The electronic component is mounted on the substrate S (as shown in the "Figure"). Here, the electronic component may be a light-emitting element such as a light-emitting diode (LED), an integrated circuit, a resistor or a coffee. For example, a surface mount device 1G (as shown in the "figure") can mount a light emitting diode (LED) on a substrate S (shown as "丨圊") to serve as a backlight unit. According to the device i for feeding an electronic component of the present invention, a light emitting diode (LED) can be supplied to the surface mount device 1 (as shown in "first circle"). The backlight unit is used as a light source of a liquid crystal display device (LCD). The supply unit 2 can include a storage device 21 and a delivery device 22.

The storage device 21 &amp; contains a storage slot, which is called to store a plurality of electronic components therein. At this time, since there is the storage tank 211, one side of the storage device 21 can be opened. A plurality of electronic components can be stored in the storage device 21 through the storage slot 211. Therefore, according to the device of the present electronic component, the effect can be achieved. The first necessary step in the prior art is to omit the steps of accommodating a plurality of electronic components in a conveyor belt and to thin the cover tape to the electronic components. The steps on the conveyor belt. 7 201129267 Further, the apparatus 1 for feeding electronic components of the present invention stores electronic components into the storage device 21 by using the storage tank 211 to additionally supply electronic components. Further, the apparatus 1 for feeding electronic components of the present invention can continuously operate the first transfer unit 3 and the second transfer unit 4 even in the above process of additionally supplying electronic components. Therefore, the device for feeding electronic components of the present invention can supply electronic components to the surface mount device 10 (as shown in Fig. 1) without interruption. Therefore, the surface mount device 10 (shown in FIG. 1) can continuously mount the electronic component on the substrate S (as shown in FIG. 1) without interruption, thereby preventing additional Loss of working time due to the cessation of supply of electronic components during the supply of electronic components. The storage device 21 can sequentially supply the electronic components stored in the storage tank 211 to the transport device 22 through vibration. The storage device 21 can include a spiral slot (not shown) that directs the electronic components to the transport device 22. Further, the storage device 21 may be formed in a hemispherical shape that is completely open on one side. The storage tank 211 can be formed as a hemispherical groove. At this time, a bowl feeder can be used as the storage device 21. The delivery device 22 includes a delivery trough 221. The electronic component transmitted from the storage tank 211 can be inserted into the transfer tank work. The electronic component can be shocked from the storage to be supplied to the side of the conveying groove 221, and then conveyed to the other side of the conveying groove 221 along the conveying groove 221. The transport device 22 can transmit the electronic components inserted into the 221 through the vibration. At this time, the linear feeder can be used as the conveying device 22. Although the cardiac delivery device 22 can include: a conveyor belt for renewing electronic components; a drive wheel and a driven wheel coupled to both ends of the conveyor belt; and a money for rotating the wire wheel. When the drive wheel is rotated, the electronic components placed on the conveyor are transported through the conveyor belt 201129267. The conveyor belt is mounted in such a manner that the conveyor belt is inserted into the transport slot 221. In other words, the device 1 for feeding electronic components of the present invention can be implemented in different embodiments according to the first transfer unit 3 and the second transfer unit 4. Hereinafter, an apparatus for feeding an electronic component according to various embodiments of the present invention will be described with reference to the accompanying drawings. First Embodiment Fig. 2 is a view schematically showing a device for feeding an electronic component according to a first embodiment of the present invention. The "figure 3" is a plane which schematically shows the operational relationship in the apparatus for feeding electronic components of the first embodiment of the present day and the month. "Picture 4" is a plan view of the equipment that is used to feed electronic components. Fig. 5 and Fig. 6 are plan views showing the tactile system in the device for feeding electronic components according to the first modified embodiment of the present invention. &quot;Monthly referring to Fig. 2 and Fig. 3, the apparatus 1 for feeding an electronic component according to the first embodiment of the present invention includes the following first transfer unit 3 and second transfer unit 4. The first transfer unit 3 can transfer the electronic component from the supply position sp to the pickup position PP. The electronic component can be transferred from the supply unit 2 to the supply through the second transfer unit 4, and the SP can be set. Mounted on the surface mount device 1 (as shown in the "Figure"), as shown in Figure 1, (as shown in Figure 1), pick up the electronic components at the pick-up position pp, and then mount the electronic components. On the substrate S (as shown in the "Figure"). The first transfer unit 3 may include a first transfer member 3. Further, the first transfer member 31 may include a first transfer groove 3U having a flank connection supply position sp and a pickup position pp. The first conveying member 31 is mounted in such a manner that the supply position (sp) faces the 201129267 supply unit it2, and the pickup position PP surface surface device 1() (as shown in Fig. 1). A plurality of first transfer grooves 311 may be formed in the first transfer member 3i. Therefore, the first transfer unit 3 can feed a plurality of electronic components so that they are placed at the pickup position PP. Mounting sheet it U (as shown in "丨0")—Pick up a plurality of electronic components and transfer the electronic components to the substrate s (as shown in Figure i). Therefore, the apparatus 1 for feeding an electronic component according to the first embodiment of the present invention can shorten the time for the process of mounting the electronic component on the substrate s (as shown in Fig. 1). In the second figure, the number of the first transfer grooves included in the first transfer member 31 is eight. However, the total number of the first transfer grooves included in the first transport member 31 may be not more than 7, or may be not less than 9. The number of the first transfer grooves 311 included in the first transfer member 31 is approximately equal to the number of electronic components allowed by the mounting unit 11 (as shown in FIG. 1), wherein, the packing sheet tl 11 (such as "the first The number of allowed electronic components refers to the predetermined number of electronic components that can be picked up at one time by the mounting unit 11 (shown in FIG. Fruit placement sheet it π (as shown in "i") picks up a plurality of electronic components of the "mXn" matrix (claw, n is an integer greater than 1), then m first-transmission slots can be formed in the first - The transport unit 3 in the transport member 31 can transport the electronic components so that the electronic components are placed at the pickup position ρρ of the "mxn" matrix arrangement. At this time, the number of the first transfer grooves of the first transfer member 31 may be greater than the number of electronic components allowed by the mounting unit 11, such as shown in "Fig. 1". The number of the first transfer grooves 311 to be included in the first supply member 31 can be set to be a multiple of the number of electronic components allowed by the mounting unit u (not shown in Fig. 1). The 201129267 first transfer groove 311 can extend in the moving direction of the electronic component, thereby inserting a plurality of electronic components therein. Therefore, it is possible to reduce the time required to place the newly supplied electronic component at the pickup position PP after the mounting unit u (as shown in "jth diagram") picks up the electronic component of the pickup position PP. Therefore, the device 1 for feeding an electronic component according to the first embodiment of the present invention can shorten the time required for feeding the electronic component, and can also shorten the mounting of the electronic component on the substrate S (as shown in "i") The time required. The first conveying member 31 may be formed as a rectangular plate whose long side is disposed in the moving direction of the electronic component or may be formed as a rectangular groove in which the long side is disposed in the moving direction of the electronic component. The first transfer groove 311 has a width that can guide the movement of the electronic component, that is, the width of the first transfer groove 311 is approximately equal to the width of the electronic component. The width of the electronic component and the width of the first transfer groove 311 may correspond to the length in a predetermined direction perpendicular to the moving direction of the electronic component. The first-transport unit 3 can transmit a 3 ιι ^ electronic read into the first transfer tank through vibration. Although not shown, the first transfer unit 3 may include a conveyor belt for transporting the electric cow; a drive wheel and a follower connected to both ends of the conveyor belt; and - a motor for rotating the drive wheel. # When the motor turns the drive wheel, it is ploughed through the electronics on the m. Wei Village is installed in the first and middle, and is inserted into the first transfer slot 311 at the same time. Although not shown, the first jet may comprise a charge for the transfer of electronic components + h first - transfer tank 311 in the first - St which may be air. The spray unit can be mounted 'on top. When the mouthpiece unit is inserted into the 201129267 electronic component_stream_ in the first transfer groove 311, the electronic component smoothly moves. The jetting unit is mounted on the first conveying member 31 to eject the fluid to the electronic component through the injection hole (not shown) formed in communication with the first conveying groove 311, thereby moving the electronic component. A spray hole (not shown) may be formed in the first conveying member 3''' and may be located on the side of the first conveying groove 311. Referring to Fig. 2 and Fig. 3, the second transfer unit 4 transfers the electronic component supplied from the supply list 2 to the first transfer order unit 3. The second transfer unit 4 can be installed between the supply unit 2 and the first transfer unit 3. The second transfer unit 4 may include a second transfer member 41 and a rotary member 42. A second transfer groove is formed in a first transfer member 41, and the electronic component is inserted into the first transfer groove 411. The electronic component can be moved from the transport slot 221 to the first transfer slot 311 by the second transfer slot 411; or, the electronic component can be moved from the supply position to the pickup position along the first transfer slot 3U. In the same manner as the first transfer unit 3 described above, the second transfer member 41 can transfer the electronic components inserted into the second transfer grooves 411 by using vibration, using a conveyor belt or ejecting a fluid. The rotating member 42 rotates the second conveying member 41 about the pivot. When the two transport members are rotated, the _ two transfer grooves 411 can be connected to any one of the first transfer grooves 3ι. That is, the rotating member 42 rotates the second conveying member 41, whereby the electronic components supplied from the supplying unit 2 can be respectively distributed into the plurality of first conveying grooves 3o. As shown in Fig. 2, the rotating member 42 can rotate the second conveying member 41 so that the second conveying groove 4U is connected to the conveying groove 221. Therefore, the electronic component can be transferred from the transport slot 22! to the second transfer slot 4U. As shown in Fig. 3, the rotating member rotates the second conveying member 4 so that the second conveying groove 411 is connected to any one of the first transfer grooves 411 to the transfer groove 311. Therefore, the electronic component can be from the first plurality of first transfer grooves 311. The rotating member 42 can include a motor (not shown). The motor can be directly coupled to the heat 41a of the second transfer member to rotate the second transfer member 41. If the motor is spaced apart from the rotating shaft 41a of the first conveying member 41 by a predetermined distance, the rotating member 42 may include a connecting means 'to connect the rotating shafts of the motor and the second conveying member 41 to each other. The connecting device can be a driving wheel, a driven wheel or a conveyor belt.

Please refer to "Fig. 2" and "Fig. 3". Each of the plurality of first transfer grooves 3ιι can include a first connection groove and a second connection groove. The groove 3111 can supply the supply point f SP with The waiting position is carefully connected, and the second connecting groove 3ii2 can connect the waiting position WP with the pickup bit f PP . In the waiting position, the first connecting groove 3111 and the second connecting groove 3112 are connected to each other. As the self-waiting position is closer to the supply position SP, the interval between the respective first-joining grooves 3111 is gradually decreased. That is, the interval between the respective first connection grooves 3111 gradually decreases as approaching the supply position sp. Therefore, the device 1 for feeding an electronic component according to the first embodiment of the present invention can achieve the following effects. In the device 1 for feeding an electronic component according to the first embodiment of the present invention, the interval between the respective first connection grooves 3111 is The distance gradually decreases as it approaches the supply position SP, so that the distance by which the second conveying member 41 is rotated such that the second conveying groove 411 is connected to any one of the first conveying grooves 311 can be reduced. Therefore, the device 1 for feeding an electronic component according to the first embodiment of the present invention can shorten the time required for transferring the electronic component from the supply unit 2 to the first transfer unit 3, so that a larger number of electrons can be specified in a short time. In the apparatus 1 for feeding electronic components according to the first embodiment of the present invention, the interval between the respective first connecting grooves 3111 is gradually decreased as approaching the supply position SP, so that it can be reduced for use. The electronic component is distributed to the size of the second transfer member 41 of the plurality of first transfer grooves 3丨丨. Therefore, the apparatus 1 for feeding an electronic component of the first embodiment of the present invention can reduce the production cost. The device 1 for feeding an electronic component according to the first embodiment of the present invention can reduce the space occupied by the surface mount device 10 (shown as "Fig. 1") as compared with the prior art. Although not shown, the first transfer unit 3 can transfer the electronic component from the supply position sp to the waiting position WP by using vibration, using a conveyor belt or ejecting fluid. The first transfer unit 3 can transfer the electronic component from the waiting position WP to the pickup position PP by using vibration, using a conveyor belt or ejecting a fluid. The electronic component waits at the waiting position WP until the electronic component located at the pickup position pp is picked up. The first transfer unit 3 may include a load block (not shown) for blocking the electronic components from the waiting position wp. Referring to "Fig. 4" to "Fig. 6", the apparatus 1 for feeding an electronic component according to the first embodiment of the present invention may include a test unit 5 for testing electronic components. The test unit 5 can test the electrical properties of the electronic components. If the electronic component is measured in the test unit 5, the test unit 5 can obtain a test report on the orientation of the electronic component. For example, if the electronic component is a light emitting diode (LED) having two terminals, the test unit 5 sequentially supplies forward and reverse voltages through the two terminals and obtains a resultant voltage value, so the test unit 5 can be As a result, the voltage value is obtained as information on the orientation of the light-emitting diode (LED). The test unit 5 may include an interface to be connected with the 201129267 Z component (Fig. 5 (or). or the sub-cat catalog.. may be provided to the second transfer unit 4.) 70 test information may be known as the test unit 5 Installed on the supply order. =::: contains -_51,::4: ===::=_5, _ _ connected. Electronic components can be ejected by _5^_=^^411 g ΐ The method transmits 41 in the insertion slot 51, and the moving member 42 paste_unit 5 provides the information. The second conveying member 2 the rotating member 42 can rotate the second conveying member 41, thereby making the first conveying slot 411 a 1 ^ or the other side 411b is connected to any one of the first transfer grooves 3ΐ.

The t-rotation member 42 can rotate the scalloped yarn 41, and all of the electronic components of the can pick-up position pp face in the same direction. For example, if the electronic component faces the first direction at the pickup position pp, the operation of the device t for feeding the electronic component according to the modified first embodiment of the present invention is as follows. First, as shown in Fig. 5, if the electronic component broadcasted into the second transfer slot 411 faces the first direction, the rotary member 42 rotates the second transfer member 41 so that the other side 411b of the first transfer groove 411 is Any one of the first transfer slots 3ΐ is connected. In this case, the electronic component is supplied to the side of the second transporting member 41, and then taken out by the other side of the second transporting groove 411. Therefore, the electronic component can be transferred from the second transfer unit 4 to the first transfer unit 3 while the electronic component is directed to the first direction without changing the direction. As shown in FIG. 6, if the electronic components inserted into the second transfer slot 411 face the second direction opposite to the first direction, the rotating members rotate the second transfer member 4 such that the two transfer grooves 411 One side 4m is connected to any one of the first transfer channels. In this case, the electronic component is supplied to the side of the second transfer groove 4ΐ: it is then taken out by one side of the second transfer groove 411. Therefore, the electronic component can be transferred from the second transfer unit 4 to the first transfer unit 3 while changing the direction of the electronic component by 180. Thereby facing the first direction. Therefore, the apparatus i for feeding the electronic component according to the first embodiment of the present invention can be configured such that the electronic component is disposed in the phase direction of the pickup position PP, so that the mounting unit 11 is not required (as shown in the "figure i"). The additional process does not take into account the orientation of the electronic components located at the pick-up location PP. Therefore, the apparatus 1 for feeding an electronic component according to the first embodiment of the present invention can be shortened and the surface mount apparatus 1G (as shown in the "figure i") mounts electronic components on the substrate s (such as "Dijon" _ on the graph). [Second Embodiment] Fig. 7 is a plan view schematically showing a feeding device of a second embodiment of the present invention. The eighth embodiment is a plan view schematically showing the apparatus for feeding the electronic component of the second embodiment of the present invention. Fig. 9 is a plan view schematically showing an apparatus for feeding electronic components of the second embodiment of the present invention. "1" to "12" is a partially enlarged plan view of the "A" portion of "Fig. 9" which shows the feeding electronic component of the second embodiment of the present invention. The job relationship in the device. 201129267 ° month refer to FIG. 7" 'The device 1 for feeding electronic components according to the second embodiment of the present invention may have a first transfer unit 3 and a second transfer unit first transfer unit 3 at , , , and The above may be the same as the above-described first transfer unit 3 in the first embodiment of the present invention, and thus a detailed description of the first transfer unit 3 will be omitted. The first transfer transmission 4 includes a second transfer member Μ and a second rotary device which are second values, (10) a plurality of second transfer grooves 4U, electronic component insertion, and white 411. The electronic component can be moved from the transport slot 221 by the first transfer to the first transfer slot 311, and the first pass 3U can be placed pp. The second axis is used to vibrate, use the conveyor belt or smash the electronic components in the k-slot. / Method of jetting the body to the second transfer The second rotating means 43 is movable to move the second transfer member 41. The direction of the second axis - the direction of the γ axis is the second axis direction and the movement of the electronic component =, the second rotating device 43 may contain - (financial) vertical. : Money, _ force linearly move two St: even:: the attachment device (rackgear) and the pinion transmission belt type, including the rack-and-wheel type; or the spider with the object The tooth first conveying member 41 is moved in the second direction (the wheel direction) 17 201129267, so that the plurality (four) one conveying groove 311_ can be connected to the plurality of second conveying grooves 411. Therefore, since the device 1 for feeding an electronic component of the second embodiment of the present invention can transfer a plurality of electronic components from the second transfer unit 4 to the first transfer unit 3, the first comparison with the present invention In the embodiment, the number of electronic components that are transferred to the pickup position PP within a predetermined time can be increased. The second moving device 43 can convey the second conveying member 41 so that any one of the second conveying grooves 4ΐ can be connected to the conveying groove 221. When any one of the second transfer grooves 4 ι is connected to the transfer groove 221, at least any one of the second transfer grooves 4 ι can be connected to at least any one of the first transfer grooves 311. Further, the second transfer groove 411 connected to the conveying groove 221 can be combined with any one of the first transfer grooves 311. Therefore, the 'electron τ member can be supplied to the second transfer groove 411 connected to the transfer groove 221, and the electronic τ member can be taken out from the second transfer groove connected to the first transfer groove 311. Therefore, the feed tree of the second embodiment of the present invention can transfer the component 2 to the second transfer unit 4, and simultaneously transfer the electronic component-delivery 4 to the first transfer unit. 3, so that a larger number of electronic components can be transferred to the pickup position in a short time. The number of the second transfer grooves 4ΐ in the second transfer member 41 may be smaller than the number of the first transfer grooves 311 included in the first transfer unit 31. Therefore, the size of the second can be reduced from the lowering of the electronic component of the present invention! The second transfer slot 411 can be inserted into a plurality of electronic components in the electronic component. : extending in the direction of movement such that the feed element 201129267 of the second embodiment of the present invention is further configured to continuously transfer a plurality of electronic components from the supply unit 2 to the second ===: :=传: A shirt is fed by the electronic component of the first embodiment of the present invention. = the waiting time of the electronic component in the second transfer unit 4 is shortened, so that a plurality of 70 pieces are transferred from the second transfer unit 4 Transfer to the first transfer unit 3. Therefore, the device 1 for feeding an electronic component of the second embodiment of the present invention can transfer a larger number of electronic components to the pickup position PP in a short time.

Please refer to "Fig. 8". The second embodiment of the present invention, the device 1 for feeding electronic components, includes the test unit 5 according to the first transfer unit 3. The test unit 5 can test the electronic components located at the test position τρ. The test position ΤΡ can be located between the supply position sp and the pickup position ρρ. The test unit $ can test the electrical properties of the electronic components. If the electronic components have been tested in the test unit 5, the test unit 5 can obtain information on the lying of the electronic components. For example, if the electronic component is a light-emitting diode (LED) having two wire terminals, the compensation unit $ provides a forward-reverse voltage through the two wires, and the resulting voltage value is obtained. Therefore, the test unit 5 The information of the orientation of the light-emitting diode (Led) can be obtained according to the resulting voltage value. The unit 5 can provide the obtained test information to the surface mount device 1G (as shown in "Fig. 1"). The surface mount device 10 (as shown in the "i") can be tested by the test unit 5: #输继装置^ (as shown in "Figure 1"). The test unit 5 is mounted in the first conveying member 31 in such a manner as to be above or below the first conveying member. The test unit 5 can include contact pins (not shown) that will be in contact with the electronic components. The fine feet can be moved up or down to be connected to the electronic components. The number of the wuw or the feet can be (not shown). At this time, the contact weight in the job list is equal to the number of the first transfer grooves 311. The electronic component 70 3 may include a "first" broadcast block 32. The first - Wei 32 can resist the electronic components in the test position 砰. According to the test unit, the 5-bit transmission member m ((4)-----32-to-first==τ-touch 32 can be up or to the genus, so that the first broadcast block first communication slot 311 or with the first transmission slot 311 When the first block 32 is inserted into the first transfer slot 31 i, the electronic component is in the position of ^, and the material -=3 = when the first transfer slot 3U is separated, the electronic component is not subjected to the first load. The block (4) is moved to the pickup position punch. The first transfer unit 3 may include a moving module (not shown) for moving the first stop 32 upward or downward. At this time, the first transfer unit 3 The number of the first-loaded blocks 32 may be substantially the same as the number of the first transfer grooves 3 ι. The first transfer unit 3 may include a second load block %. The second load block % may block electronic components, thereby enabling The electronic component is located at the buffer position Bp. The buffer position Bp may be located between the supply position SP and the test position TP. In the improved second embodiment of the present invention, the device for feeding the electronic component, when the position _ trial τρ other In the case of an electronic component, the electronic component waits at the buffer position. Therefore, the improved second of the present invention _ Example Shu human apparatus for electronic components can be shaped test after the electronic element Zhan position taken by the test of τρ ') transfer of the electronic ΐ secret test site surface for red τρ time required. Therefore, the present invention improves the bite of the electronic component fed into the second embodiment. The electronic component that can be recorded in the office (10) is transferred to the pickup position PP. The second stopper 33 is mounted in the first conveying member 31 in such a manner as to be located above or below the first conveying member 31. The second stopper 33 is movable upward or downward to be connected to or separated from the first transfer groove. When the second stopper 33 is inserted into the special = slot 311 day temple, the first broadcast block 33 slaps the electronic component so that the electronic component blocks the position BP. At the same time, when the second stopper 33 is separated from the first transfer groove Mi, the electronic component moves to the test position _ TP without being affected by the second stopper 33. The first transfer unit 3 may include a moving module (not shown) that moves the second stop 33 upward or downward. At this time, the number of the second stops 33 included in the first transfer unit 3 may be substantially the same as the number of the first transfer grooves 311. The first transfer unit 3 may include an ejection unit for ejecting a fluid to transport the electronic components. The ejection unit can eject the fluid onto the electronic component inserted into the first. The spray unit can include a first spray device 34 and two second spray devices 35. The 帛-Russ device 34 can eject the fluid that transports the electronic components located at the 峨 position to the pickup position ρρ. When the first ejecting device does not eject fluid onto the tested electronic component, the tested electronic component is transferred from the test position to the picking position ΡΡ. In this case, the fluid can be air. The first injection device 34 may include a plurality of first injection holes (not shown), wherein the number of the first injection holes is approximately the same as the number of the first transfer grooves 311. The electronic component inserted into the first transfer groove 311 t can be moved by using a fluid ejecting apparatus. At this time, the number of fluid ejecting devices included in the first ejecting means 34 and the first transfer unit 3 is approximately the same as the number of the first transfer grooves 311. 201129267 The second injection device 35 can eject a fluid that moves the electronic component located at the buffer position βρ to the test position τρ. When the 苐 翁 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In this case, the fluid can be air. The second ejecting device % may include a plurality of second perforating holes (counter shown). The number of the second Confucian holes is approximately the same as the number of the first transfer grooves 311. The electronic component is movably inserted into the first transfer groove 311 by using a fluid ejecting apparatus. At this time, the number of the fluid nozzles provided in the second ejection device 35 and the first-transfer unit 3 may be the same as the number of the first transfer grooves 3ι. Referring to FIG. 9 and FIG. 1 , in a device for feeding an electronic tree according to another modified second embodiment of the present invention, each of the first transfer grooves 3 ι may include a first connecting groove 3111 . And - the second connecting trough. The first connection groove 3111 can connect the supply position sp and the correction position CP, and the second connection groove 3ι2 can connect the correction position 〇&gt; with the pickup_PP tree. Correct the direction of the cp correction component. As shown in Fig. 9, the correction position CP may be located between the supply position SP and the pickup position PP, or may be located between the test position τρ and the pickup position. The first-conveying unit 3 may include a plurality of correcting members 36 and a plurality of rotating devices standing at the correcting position cp' and being threaded in the first transporting member 31. The correcting member 36 is rotatably mounted in the first conveying member 31. Each of the correcting members % causes the first coupling groove 3111 and the coupling groove 3112 to be connected to each other. The correcting member 36 can be formed in a disk shape; and the correction member 361 becomes a rectangular-shaped groove on both sides of the male right member 36. 22 201129267 The turning device 37 can rotate the correcting member %. The rotating shaft can be rotated independently by the rotating device. As shown in the "figure", the rotating device 37 (not shown in Fig. 9) can rotate the correcting member %, so that one of the correcting grooves 361 is made according to the orientation of the electronic 7L member inserted into the correcting groove 361. The other side of the side application or correction groove is connected to the second connection groove 3112. Test unit 5 can provide test information regarding the orientation of the electronic components inserted into k positive slots 361. That is, the rotating device 37 can individually rotate the correcting member % so that all the electronic components face the direction of _ at the picking position. For example, if the electronic component faces the first direction at the pickup position PP, the operation of the device 1 for feeding the electronic component according to the second embodiment of the present month is as τ ° . gossip first, such as " As shown in Fig. 10, for the correcting member %, if the electronic component inserted into the k positive groove 361 faces the first direction, the rotating device π rotates the correcting member 36' so that the other side of the correcting groove 361 It is connected to the second connecting groove. In this case, the electronic component is supplied to the side of the positive groove %, and then taken away by the other side of the correction groove 361. Therefore, in the case where the electronic component faces the first direction without changing the I direction, the electronic component can be transferred from the correction position π to the pickup position PP. As shown in the "FIG. π", for the correcting member 36, if the electronic component inserted into the correcting groove 361 faces the second direction opposite to the first direction, the rotating device 37 rotates the correcting member 36, thereby causing the correcting groove One side 361 & 361 of the 361 is connected to the second connection groove 3112. In this case, the electronic component is supplied by the other side of the correction groove 361, and then the electronic component is taken out by the 361a of the correction groove 361. 23 201129267 Therefore, the direction of the electronic components is changed. In the case of the first direction, the electronic component can be transferred from the correction position CP to the pickup position pp. Since the apparatus for feeding an electronic component of the second embodiment of the present invention can make the electronic components at the pickup position PP face in the same direction, the orientation of the electronic component at the pickup position PP is There is no need for an additional process for the placement unit u (as shown in Figure 1). Therefore, the device i for feeding the electronic component according to the second modified embodiment of the present invention can shorten the mounting of the electronic component on the substrate s by using the surface mount device 1 (as shown in FIG. 1). "The time above. The rotating device 37 may include a motor (not shown). The motor may be directly coupled to the rotating shaft of the correcting member 36 to thereby rotate the correcting member 36. If the motor is configured to be the pitch of the spot correcting member 36 At a predetermined distance, the rotating device π may include a connecting device for connecting the rotating shafts of the motor and the correcting member 36. The connecting shock may be a driving wheel, a driven wheel or a conveyor belt. By using vibration, using a conveyor belt or spraying a fluid The electronic component inserted into the correction slot 361 can be moved. Referring to FIG. 9, the first transmission member 31 can include a plurality of removal holes 312 for removing defective electronic components. Located at the side of the 31U or the second connecting groove, the removing hole is formed in such a manner that the removing hole 3 can be connected to the correcting groove 361 according to the rotational direction of the correcting member 36: although the figure is not shown -Transport 3 1 Zhong Anshang is used for accommodating a defective product receiving unit with a defective sub-touch. The defective electrons can be moved to the defective product holding sheet through the removing hole 312. The defective receiving unit is mounted on the surface of the first conveying member a The removal hole 312 is in communication with the defective receiving unit and passes through the first transfer (4). 24 201129267 The rotating device 37 can rotate the correcting member 36, thereby making the correcting groove 36 and the second according to the result of the interpolation------- The material or the removal of the fine phase connection. The test unit 5 can provide information about the insertion into the calibration slot. Also _, _ 37 separate: = thus transferring defective electronic components to the removal (four), and the quality of the electronics Several pieces are conveyed to the second connecting groove, for example, as indicated by the first call, for the defective electric power inserted in the correcting groove 36, the correcting member 36 is rotated by using the rotating device 37. The other side 361b of the correction groove 361 is connected to the removal hole 312. Meanwhile, as shown in the "the ω", the correction member 36 in which the high-quality 2 sub-read is inserted in the correction groove 361 is transmitted through the rotating device 37. _correction %, the other side 361b of the correction slot 361 is connected to the second In the device for feeding electronic components of the second embodiment of the present invention, only the high-quality electronic components are placed in the pickup position, so that it is not necessary to check the electronic components located at the position PP. Whether it is a defective product, and a process of removing a defective electronic component when the electronic 7G piece located at the pickup position pp is a defective product. As shown in "Fig. 11", a high quality is inserted into the correction groove 361 and facing In the second direction of the correcting member 36 of the corresponding electronic component, the rotating device 37 rotates the correcting member 36' such that one side 361&amp; of the correcting groove 361 is connected to the second connecting groove 3ii2. In this case, 'by the correcting groove The other side 361b of the 361 supplies the electronic component and then removes the electronic component by the side of the positive slot 361. Therefore, in the case where the direction of the electronic component is changed by 18 〇 to face the wide direction, the electronic horn can be transmitted from the correction position CP to the pickup position i pp . According to another embodiment of the present invention, the device 1 for feeding electronic components of the first embodiment of the present invention places only the high-quality electronic components at the pickup position PP and causes the electronic components at the pickup position pp to face the same direction. Place. [Third Embodiment] Fig. 13 is a view schematically showing an apparatus for feeding an electronic component according to a third embodiment of the present invention. "帛Η图" is a plan view of a device for feeding electronic components of the third embodiment of the invention. Fig. 15 is a perspective view schematically showing the pickup unit of the present invention. The "$16 figure" is a schematic view showing the structure of the pickup unit in the apparatus for feeding the electronic component of the third embodiment of the present invention. It is an enlarged view of the portion of the "B" portion of the "Mth picture". "Embodiment 18" is a third embodiment showing the improvement of the present bet_a human electronic component surface view: (4) is a schematic diagram showing the operation of the pickup unit in the improved 2 tillage apparatus of the present invention. - The improved third real system is a light map. (9) The plane of the device feeding the electronic component The device of the electronic component can include a feed 4 of the third embodiment. The first transmission slip of the third embodiment of the present invention. The third transmission unit and the first transmission unit of the second embodiment are constructed in accordance with the first aspect of the present invention. It is similar, so the following description only describes that the first transfer unit 3 can include - 38 to move the first transfer member 31 along the second axis. The first-moving device is moved in the direction of the electronic component (Y-axis), and the second-axis is perpendicular to the first-axis direction (X-axis direction). First 26 201129267 The mobile device 38 can move the first transport member 3 to place any one of the first transport slots 3 ι in the supply position SP. The first moving device 38 may include a motor, and - a connecting device (not shown) that linearly moves the first conveying member by a rotational force provided by the motor. The connecting device may be formed as a belt type including a driving wheel, a belt conveyor, a rack including a smashing and a caster transmission, a pinion type, or a ball type including a ball screw. Referring to "Fig. 13" and "Fig. 14", the second transfer unit 4 may include a call-pick unit 44. The pickup unit 44 picks up the electronic component from the supply unit 2, and then transfers the electronic component to the first transfer slot 3ι located at the supply position sp. Referring to "Fig. 13" to "Fig. 15," the pickup unit 44 may include a pickup device 44, a first mounting member 442, a second mounting member, and a member 444. The flat pickup device 441 can adsorb electronic components. At this time, the electronic component that is in contact with the pickup device 441 can be sucked up by the device in the pickup device 441. The first mounting member 442 is movably coupled to the second mounting member 443. When the two mounting members 443 are connected, the first mounting member 442 is moved through the working unit 444 or downward. The pickup device 441 is mounted in the first mount 442. When the first ampere M42 moves upward, the pickup device 441 also moves upward. At the same time = when the dressing piece 442 moves downward, the pick-up device 441 also moves downward. The mounting member 443 can be left-to-left with the main body 445 in the first axial direction (X-axis direction). In "Fig. 14", the second mounting member 443 can be moved on the subject's «. Since the second mounting member 443 is coupled to the first mounting member 442 in the first axial direction (X-axis direction) 27 201129267, the first mounting member 442 can be moved on the first axis. Therefore, the pickup mounted in the first mounting _ moves in the first axial direction (x-axis direction), so that the movement of the electronic door moves an i piece 443 which can be moved between the first position and the second position by the working unit 444. Silk (10) to do - exhaust, please ask early &quot;2. When the first:mount 443 is in the first position, the pickup device 441 can be located at the first transfer unit 3.

A work early element 444 can move the first mount 442 up or down and can move the second mount 443 in the first direction (x fiscal). Through the conveyor belt type including the driving wheel, and the transmission (4); the rack and pinion type including the rack transmission and the pinion transmission f; the ball screw type including the ball screw; or the cam cam type operation The unit 444 can move the first mount member up or down and can move the second mount member in the first-axis direction (the x-axis direction). The month of the present invention, the apparatus 1 for feeding the electronic component of the third embodiment of the present invention may include a test unit 5 for testing the electronic component.

. "The beta type single turn 5 can be located between the supply unit 2 and the first transfer unit 3. The test can measure the electrical properties of the electronic component. The test unit 5 can include a contact pin that will be in electrical contact with the electron (Fig. Not shown. The contact foot can be connected to the electronic component or moved to separate from the electronic component. If the test unit $+ has tested the electronic component 'test cell 5, test information about the orientation of the electronic component can be obtained. If the electronic component is a light-emitting diode having two wire terminals, the test unit 5 sequentially supplies forward and reverse voltages through the two terminals, and the resulting voltage value is obtained. Therefore, the test unit 5 can According to the results, Lai Jiande has test information about the orientation of 28 201129267 5 illuminating-polar body (LED). Since the test unit 5 tests 70 pieces of electricity, it can be used to test the information of the cake. 5 The obtained test information can be supplied to the first transfer unit 3. Therefore, the 'first transfer unit 3 can correct the orientation of the electronic component, thereby making the pick-up by using the correcting member 36 (as shown in "Fig. 9")*. All the electronic components at the position pp face the same direction; in addition, the first transfer unit 3 can also remove the defective $electronic component' to place only the high-quality electronic components to the pickup position pp. The obtained test information is provided to the surface mount device (1) (as shown in "Figure:"). The surface mount device 10 (as shown in "i") can be controlled according to the test information provided by the test sheet W. The unit u (as shown in the "figure i"). The month 14 to the "figure 16", the picking unit 44 picks up the sub-component to be tested (four) from the supply unit 2, and the sub-component of the weft To the test unit 5. And the 'pickup unit 44 picks up the tested electronic components from the test unit 5 and then transfers the tested electronic components to the first transfer unit 3. In order to reduce the time required for the above process, the pick-up device 441 may comprise There is a first picker 441 and a second picker 4412. The first picker 4411 picks up the electronic component to be tested from the supply unit 2, and transmits the electronic component to the test unit 5 after the autumn. The second picker 4412 picks up from the test unit $ The electronic component to be tested is then transferred to the first transfer unit 3. Thus, the first picker 4411 and the second picker 4412 can be shortened to transfer the electronic read from the supply unit 2 to the first transfer unit 3. The distance moved, therefore, = a certain number of electronic components are transferred from the supply unit 2 to the first transmission beam element 3 in a short time. 29 201129267 »Monthly refer to the S 16 figure", in the first installation of the Μ2 order The distance between the picker and the second picker 4412 may be reduced from the distance D2 between the unit 2 and the test unit 5, or may be rotated from the distance between the test unit 5 and the first transfer unit 3. When the first pick-up 1 picks up the electronic component of the test from the supply unit 2, the second pick-up 4412 can pick up the measured component from the test unit 5 and pick up the electronic component to be tested. In the case of H, the second pickup 4412 can place the tested electronic component on the first transfer unit 3. Although not shown, the picking device state may include a plurality of first pickers, and may also include a plurality of second pickers. Therefore, the pickup unit 44 can transfer a plurality of electronic components from the supply unit 2 to the first transfer unit by the test unit 5; say that the 'the second picker 44U picks up a plurality of electronic components from the supply unit 2, and the: To the test unit 5; and the second pick 11 4412 from the test unit 5, the electronic &quot; ° piece, and the electronic components are transferred to the first transfer unit 3. In this case, the test unit 5 can test these electronic components. The rotation of the ^^3 Μ0' test unit 5 may include a correction device 52 and a gas-and-positive device 52 having a receiving groove 52 for accommodating electronic components. When testing the electronic components housed in the receiving groove 521, Get the battle dragon about electric work. ·, the test element 5 job electronic components, from the second: whether the electronic components are defective test information. The first pick-up 4411 is white, and the electronic component to be tested is transferred. 'A ^ 44 4412 is picked up from the valley 521 and the tested electronic component is transmitted to the first transfer unit 3. The rotating unit 53 can rotate the correcting device 52 in accordance with the orientation of the electronic components housed in the accommodating groove 521. Therefore, the second transfer unit 4 can correct the orientation of the electronic components such that all the electronic components face the same direction at the pickup position pp, and then transfer the electronic components to the first transfer unit 3. Therefore, the test unit 5 in the feed-in electronic component of the third embodiment of the present invention can test the electronic component and simultaneously correct the orientation of the electronic component. Thus, the short-time surface-mounting device 10 can be mounted. (As shown in Figure 1) Supply a larger number of electronic components. Compared with the above-described embodiment having a separate test electronic component structure and a structure for correcting the orientation of the electronic component, the device i for feeding the electronic component according to the third embodiment of the present invention can reduce the production cost and simplify the structure. Rotating the single it 53 can include - (not shown). The reliant can be directly connected to the rotating shaft of the correcting device 52 to lie the correcting device %. If the vacancy is at a predetermined distance from the rotating shaft of the correcting device 52, the rotating unit 53A includes a connecting device ′ to connect the motor to the rotating shaft of the correcting device 52. The connecting device can be a driving wheel, a driven wheel or a conveyor belt. The first transport member 31 may include a plurality of adsorption holes 313. The adsorption hole 313 may be disposed at the pickup position pp and may be in communication with the first transfer groove 。. The adsorption hole 313 can be connected to the adsorption device, and the adsorption device provides suction for the adsorption and the sub-clamp. The adsorption device draws the fluid passing through the adsorption hole 313, so that the electronic component is stopped at the lower surface of the transfer member-transfer member 31 at a pickup speed of pp. In the first transfer member 31, there are adsorption holes 313 arranged in "mxn, matrix (m, n is greater than the integer of 31 201129267). Therefore, electronic components arranged in the "mxn" matrix can be placed on the pickup. Position PP. At this time, when the adsorption is formed in the first conveying member 31

In the case of the hole 313, the number of the adsorption holes 313 included in the first conveying member 31 is approximately equal to the number of electronic components allowed by the mounting unit 11 (as shown in "Fig. 1"), wherein the mounting unit 11 (such as " The number of allowed electronic components refers to the predetermined number of electronic components that can be picked up at one time by the mounting unit 11 (shown in FIG. 1). That is, the device for feeding an electronic component of the present invention can place a licensed number of electronic components at the pickup position PP at a time. For example, as shown in Fig. 17, the adsorption holes 313 arranged in a (8χ2) matrix may be located at the pickup position 1ρρ, so that the electronic components may be arranged in a (10) matrix. In this case, the mounting unit u (as shown in the "Figure!") can pick up sixteen electronic components at a time. As shown in Fig. 18, in the apparatus 1 for feeding an electric device according to the third modified embodiment of the present invention, the second transfer unit 4 can be packaged with a second transfer member 41 and - The second mobile device 43. Inserted into the first transmission 411, and a plurality of second transfer grooves 4, the electronic component is shaken. As described above, the second conveying member 41 can convey the insertion electron carrying member to the first conveying unit 3 by using a transfer belt or a jetting fluid. The second moving means 43 of the $1 domain 4n may be perpendicular to the second axis: the second axis direction is perpendicular to the electronic component. The second moving device 43 can be located at any one of the X-axis transfer grooves 411 at the appropriate first member 41, thereby causing the second electronic component. The second moving device 43 can be displaced to the pick-up unit 44. Loading (4) the first communication member 4 to thereby make it to 32 201129267 &gt; any second transmission_ and at least any one of the first transfer slot states: the first transfer member 3] can be fixedly disposed at a predetermined position, And the 伽^ gamma transport member 41 moves in the second axis direction (the x-axis direction), then the pass = send (four) 1 can be connected with at least any - the first transfer (four) shown) from the first: value ~ fixed The position can be opposite to the appropriate position of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In this way, the second transporting member 41 is along the second axial direction (γ-axis direction)= such that the plurality of first transporting slots can simultaneously include a plurality of second, table (four) devices 43 including a motor and a connecting device (not shown) ), the connecting device is used for the fine rhyme provided. The second transmitting member 4 can be formed as follows: a conveyor belt type comprising a wire wheel, a driven wheel and a conveyor belt;

It includes rack-and-pinion and small-passage tilting wheel type; or ball-screw type with ball screw. Referring to Fig. 18 and Fig. 19, the pickup unit 44 transfers the electronic components from the supply unit 2 to the second transfer member 41. If the pickup: reading includes a first picker 4411 and a second picker 4412, the first picker 4411 picks up the electronic component from the supply unit 2, and then transfers the electronic component to the [5] unit and the second picker 4412 picks up the electronic component from the test unit 5 and then transfers the electronic component to the second transport member 4. In this case, the distance between the first picker 4411 and the second picker 4412 in the first mount: 442 is di ^ With the supply unit 2 and the unit 5 close _ D2 scale, or can be with the test sheet = 33 201129267 5 and the distance between the second transport member w m phase test unit 5 pick up the test fourth benefit from self-test When the electronic component is housed in the test unit 5, the first &lt; picker 4411 assigns the test electronic component to the second transport member 1 above the second picker 4412 to test the feed: As shown in the figure, in the direction of the third modified embodiment according to the present invention, the first transporting member 3 is moved to the second transportable transporting member 31 in the second axial direction. So that at least any - pass 3 Π and at least any one of the second transfer slots 4 ι Connected. Therefore, at least any one of the inventions is called:: change: two:: meaning: a second transfer slot 411 is connected. Therefore, a transmitting member 31 2 - the device 1 for feeding the electronic component can shorten the transmission of the electronic component from the second transfer slot 411 by the distance of the first movement, so that a larger number of The electronic component is transmitted from the first pass to the first transfer unit 3 early. In the mounting unit U (as shown in "Fig. 1"), the self-pickup position is =, = before the member - the first transport member 31 must be stopped. Even in the above-described process period, the electronic components from the first supply unit 2 can be supplied to the axis of the machine unit 43. Therefore, the apparatus i of the third embodiment of the present invention, which feeds the electronic components, can transfer a plurality of electronic components to the pickup position pp in a short time. 34 201129267, FIG. 21 is a perspective view of a device for feeding an electronic component according to a fourth embodiment of the present invention, which is a schematic view showing a feedthrough of the fourth embodiment of the present invention. Plan view "Fig. 23" is a plan view schematically showing the test unit of the present invention. Fig. 24 is a view showing the operation of the pickup unit of the electronic feeding member according to the fourth embodiment of the present invention. "Day" is a fourth embodiment of the improved fourth embodiment of the present invention, which is a simplified embodiment of the fourth embodiment of the electronic device. A plan view of the device that feeds the electronic components. Referring to Fig. 21 and Fig. 22, the feed electronic device of the fourth embodiment of the present invention may include a - transfer unit 3, a second transfer unit 4, and a test unit 5. The first transfer unit 3 of the fourth embodiment of the present invention is identical in structure to the first transfer unit 3 of the first to third embodiments of the present invention, and therefore only the different components will be described below. The second transfer unit 4 of the device 1 for feeding electronic components according to the fourth embodiment of the present invention may include a second transfer member 41, a second mobile device, and a pickup unit 44. The second transfer member 41 may have a plurality of second transfer grooves 4, and the electronic components are inserted into the second transfer grooves 411. As described above, the second conveying member 41 can convey the electronic component inserted into the second conveying groove 4 to the first conveying unit 3 by using vibration, using a conveyor belt or a jetting fluid. The second moving means 43 is movable in the second axial direction (the x-axis direction) so that the second transmission member 4 is perpendicular to the first axial direction of the electronic component. The second moving device 43 can move the second conveying member 41 so that the second 35 201129267 is in the proper position of the power-carrying component, to be mounted by the pick-up unit 44, and the Ren-yi (four) wire-moving device 43 can be used. Moving the second transfer 14 so that the transfer device 411 is connected to at least any one of the first transfer grooves 311 1 =:, the first transfer member 31 can be moved freely (Υ_), Then, the first conveying member 31 reaches the slot 411 and can be connected to at least one of the first conveying members 31 at a position different from the position where the electronic component is picked up by the mounting unit 11 (such as the "Fig. 1" cake 31. Corresponding to each other. The interval between the intermediate it transfers _ can be compared with the respective first-passing fine sugar &quot; Γ ° due to the second transport member 41 in the second axial direction (γ-axis direction) The first transmission slot 311 and the plurality of second remote transmission devices 43 may include a motor and a connecting device (not shown), and the device provides a linear force to move the second transport member 41. The second connection becomes a conveyor belt type including a driving wheel, a driven wheel and a conveyor belt; The record of the device is a bribe-wheel type; or a ball-screw type including a rolling screw. = Refer to Figure 15, Figure 21 and Figure 22, and the pickup unit 44 can supply electronic components. 2 Transferring to the second transport member by the job unit 5 The pickup unit 44 can include a pick-up device 44, a first mount member, a second mount member 443, and a work unit 444. The pick-up device 441 can be adsorbed The electronic component is housed. At this time, the electronic component that is in contact with the 36 201129267 pick-up device 441 can be sucked up by the suction device provided by the suction device in the pick-up device 441 (not shown). The first mounting member 4 is movably connected to the second mounting member 443. When the mobile device is moved in the private state, the first mounting member 442 is mounted to the first mounting member 4 through the health unit 444 or the mounting member 4 is called the first mounting member 4. The yarn member gamma picking device 441 is also moved upward. Meanwhile, when the first dressing piece moves downward, the picking device 441 also moves downward. In the _ direction) and the main body 445 can be Φ 22, The second installation (10) can be moved on the main miscellaneous), so with ^ at t At 443, the - mobile (X-axis direction in the stem is connected to the first old Zheng have to take a first mounting member 44 opposing ^ F 442 can be in the axial direction) on. Therefore, the mounting on the first mounting member 442 =: the setting 41 can be moved in the first direction, thereby transmitting the -axis, and can be in the cylinder of the first steam &gt; 1 cylinder, the L43. The second mounting member 442 can be moved up or down by moving the belt-type bead screw bead. Screw type or the gamma cam member 1 using the belt transmission belt. Mounting member 443. In the direction of the first axis (X axis, please refer to "21" to "23" between element 2 and the second transfer member 41. The test unit $ can test the electronic element. If it is tested in the test unit 5 With the first feature of the electronic component, the test unit 5 37 201129267 can obtain a light-emitting diode (LED) with two terminals for the orientation of the electronic component, and the electric component is the end of the device: According to the results, the voltage value obtained the first touch of the electronic scale of the luminescent diode _), and the test information of the Chichi. For example, if the electronic component has two voltage values = t-pole (LED), the test private 5 can utilize the current value or test information as to whether the light-emitting diode (LED) has a defect. The contact pin = may include a contact pin (not shown) that will be in contact with the electronic component. Connected, electronic 7G pieces are connected, or the moving scale elements are separated. The test unit 5 can provide the obtained test information to the first transfer unit 3. Since the 1% first-transport unit 3 can correct the orientation of the electrons, all the electronic components at the pickup position pp = face the same direction by using the correction (as shown in "Fig. 9"); The unit 3 can also remove the defective sub-turns to place only the high quality electronic components in the pick-up position pp. Test unit 5 can provide the obtained test information to the surface mount device ι (such as "i-th map" = shown). Surface Mount Equipment 〇 (as shown in the “Figure ”)) The Mounting Unit 11 can be controlled according to the test information provided by Test Unit 5 (as shown in Figure 1). Referring to "21st to 23rd", the test unit 5 may include a support member 54, a turntable 55, and a first drive unit %. The support 54 can support electronic components. The electronic component supported by the support member 54 is attracted to the support member (four) 54 through an adsorption device (not shown). Although not shown, the 38 201129267 branch member 54 can include a receiving slot in which the electronic components are received. A plurality of support members 54 are connectable to the turntable 55. A plurality of support members 54 may be sequentially placed in the loading electronic component pack LP, the first test position £TP1 of the service electronic component, and the unloading position ULP of the unloading electronic component. The loading position Lp is a position in the electronic component 54 suitable for the surface pickup unit 44. The first test position is a position suitable for testing the characteristics of the electronic component, wherein the first test position τρι can be located between the loading position Lp and the unloading position (10). The unloading position (4) is adapted to pick up the position of the tested electronic component from the picking member 54 by means of the picking unit 44. A plurality of support members 54 are coupled to the turntable % in such a manner that the Wei branch members 54 are respectively located at the loading position Lp, the first test position τρι, and the unloading position ULP. Therefore, the electronic component to be tested is placed on the support member 54 at the loading position π; the electronic component placed on the slap member is tested at the first test position m; and the support member 54 is removed from the unloading position. Pick up the tested electronic components. A plurality of stocks 54 can be coupled to the turntable 55. The turntable &amp; can be rotated about the rotating shaft 55a by the first driving device 56 (as shown in Fig. 21). Through the rotation of the turntable, a plurality of stocks S4 can be sequentially placed at the loading position Lp, the first test position TP1, and the unloading position ULP. When a plurality of support members 54 are connected to the turntable 55, the plurality of support members 54' are placed at regular intervals while maintaining the angles of the plurality of support members S4 and the rotary shaft. Therefore, when the turntable 55 is rotated about the rotation axis by a predetermined angle, the plurality of support members 54 can be simultaneously placed at the loading position £ρ, the first test position, and the 39 201129267 unloading position ULP. For example, when the support members 54 are coupled to the turntable 55, the support members 54 are disposed at fixed intervals while maintaining 9 turns with the rotating shaft 55a. angle. In this case, if the turntable turns 90. After the stop, the branch members 54 can be simultaneously located at the loading position LP, the first test position TP1, and the unloading position ULP, respectively. In addition to the support members 54 that are simultaneously located at the loading position LP, the first test position TP1, and the unloading position ULP, more support members 54 may be additionally coupled to the turntable 55. In order to move the support member 54 to the next position by the first driving means 56, the angle of rotation of the turntable 55 can be reduced. Therefore, the apparatus 1 for feeding an electronic component according to the fourth embodiment of the present invention can shorten the time required to move the branch member 54 to the lower position by the first driving means 56. "Fig. 23" shows that four branch members 54 are connected to the turntable %. However, the present invention is limited thereto, that is, three, four or more support members 54 may be coupled to the turntable 55. The first drive unit 56 (shown as "Fig. 21") can rotate the turntable %, thereby sequentially placing the support members 于 in the loading position Lp, the first test position, and the unloading position ULP. If the first rifle is set to 5% (four)%, the support 54 of the turntable 55 can be sequentially placed at the loading position Lp, the top side of the first test position. The first device 56 is referred to as a turntable 55. The first driving device 56 can include a package for the transfer, and the thief can be turned. The swell of the 5 singer is the driving wheel, the driven wheel or the conveyor belt. 201129267 In the apparatus 1 for feeding electronic components according to the fourth embodiment of the present invention, if the measuring unit 5 has the above structure, the second conveying unit 4 may include a pickup unit 44 described below. Referring to "21st to 24th", the pickup unit 44 can transfer the electronic component to be tested from the supply unit 2 to the support member 54 at the loading position Lp. The pickup unit 44 can transfer the tested electronic components from the support 54 located at the unloading position ULP to the second transfer member 41. The pickup unit 44 can place the tested electronic component #2 in the second transfer slot 411 of the second transport member 41. In order to shorten the time required for the above process, the pickup unit it 44 may include a first picker 4411 and a second picker 4412. The first pickup 4411 picks up the electronic component to be tested from the supply unit 2, and then transfers the electronic component to the branch member 54 at the loading position Lp. That is, the 'th picker 4411 can load the electronic component to be tested to the tag 54 at the loading position. The second picker 4412 picks up the tested (four) sub-component from the branch member μ located at the unloading position, and the thief transmits the tested electronic component to the second transport member 4, that is, the second picker is completely unloaded. The tested electronic components are unloaded in the support 54 of the location chat. Therefore, it is possible to shorten the distance that the first picker and the first picker move the electronic component from the supply unit 2 to the second transport member ', thereby being able to transmit to the short supply unit 2 First Transfer Unit ^ Referring to (10) "24th", the first picker in the first mount 442 can be used to pick up the H 4412 between the supply unit 2 and the support 54 The distance is equal to the fine. The first mounting distance ^ 201129267 The distance D1 between the pickup 4411 and the second picker 4412 may be equal to the distance between the second transport member 41 and the branch member 54 at the loading position LP. Therefore, when the first picker 4411 picks up the electronic component to be tested from the supply unit 2, the second-pickup 4412 can pick up the tested electronic component from the branch member M located at the unloading position. Also, when the first pick-up 4411 places the electronic component to be tested on the support member 54 at the loading position LP, the second picker 4412 can place the tested electronic component on the second transfer member 41. Although not shown, the picking device 441 may include a plurality of first pickers 44, and may also include a plurality of second pickers. Therefore, the pickup unit 44 can transfer the plural # electronic components from the supply unit 2 to the second transfer member by the test unit 5. That is, the first picker 4411 picks up a plurality of electronic components from the supply unit 2 and transfers the electronic components to the test unit 5; and the second picker 4412 picks up the electronic components from the test unit 5 and transmits the electronic components to The second transfer member ^. In this case, the seam 54 can record the position Lp; the plurality of branch members can be located at the unloading position ULP. A plurality of support members 54 can be located at the first test position m. As shown in FIG. 21 to FIG. 24, in the device i for feeding electronic components according to the fourth embodiment of the present invention, the test unit 5 may further include a second driving device 57 (such as "24th" Figure"). A plurality of second driving devices 57 can be mounted on the turntable, and the second driving device 57 can rotate the support members 54, respectively. The second drive unit 57 causes the support member to rotate about the axis of rotation. At this time, the number of the second driving means π included in the test unit 5 may be approximately the same as the number of the field members 54 connected to the turntable 55. The second drive unit 57 can rotate the branch member 54 to test according to the first characteristic 42 201129267 = correct the orientation of the tested electronic components. Therefore, the second transfer unit 4 corrects the lying, from the direction in which all the electronic components are facing the $ at the pick-up wheel, the weaving will be transmitted toward the corrected electronic component to the first-transfer unit 3, for example, if At the pickup position pp, the electronic component faces the first direction, and the second driving means 57 is operated as follows. Firstly, based on the test result of the first characteristic, if the sub-element faces the second direction opposite to the first direction at the first test position τρι, the second driving device 57 causes the corresponding electronic component to be placed thereon. The support member is rotated by %. The drive unit 57 is rotatable at the first test position τρι and the support member 54 of the corresponding electronic component is placed thereon. The second drive unit 57 can rotate the support member 54 while the support member 54 on which the corresponding electronic component is placed is transferred from the first test position τρι to the unloading position ULP. The second drive unit 57 is rotatable at the unloading position αρ and the support member 54 of the corresponding electronic component is placed thereon. Based on the test result of the first characteristic, if the electronic component located at the first test position TP1 faces the first direction, the second driving device 57 does not rotate the support member 54 on which the corresponding electronic component is placed. Therefore, the device for feeding an electronic component according to the fourth embodiment of the present invention can test the electronic component in the test unit 5 and simultaneously correct the orientation of the electronic component in the test unit 5, thereby making a larger number in a short time. The electronic components are supplied to the surface mount device 10 (as shown in Fig. 1). Each of the second driving devices 57 can include a motor (not shown). The motor can be directly coupled to the rotating shaft of the support member 54 to thereby rotate the support member 54. If the electro-mechanical configuration is set at a predetermined distance from the axis of rotation of the support member 54, each of the second drive assemblies 43 201129267 57 may include a connection for this connection. The device 57 of the mu handleable ball age can be mounted on the lower surface of the turntable 55 on the moving wheel or the conveyor belt. The second drive - test ===% picture 23", can be installed in the unit 5 to install the (four) _ first-pole (LED) illuminating device. The first-test device 100 can be moved from a hairline such as ^ (LED)

产色卢和Γ / 'For example, the light emitted by the self-illuminating diode (LED) is two '^^第—the device (10) may include a photodetector and a spectrometer, ... the first test device of the temple can be installed on Among the test units 5, and positioned at the first test position Tn. The J-type device 100 can test the electronic component placed on the first test position τρι. The /4 unit 5 can include contact pins (10) not in contact with the electronic components at the first test position τρι. In the process of detecting the first characteristic of the electronic component, the test unit 5 is turned over and ploughed, thereby making

The electronic component emits light, and then the first test device 1 can pass the light emitted from the electronic component driven from the test unit 5 to test the optical characteristics. Although not shown, the first test device 100 may include an additional contact leg that additionally drives the electronic component placed at the first test position TP1 to cause the electronic component to emit light. 4 Referring to "FIG. 23", a second test device 2 can be installed in the test unit 5, wherein the second test device 2 detects the appearance characteristics of the electronic components. The second test device 200 can test the appearance characteristics of the electronic component, and more specifically, can test whether the appearance of the electronic component is damaged. The second test device 2 can include a charge coupled device (charge 44 201129267

Coupled Device, CCD) camera. Therefore, the second test apparatus 200 can test the appearance characteristics of the electronic component by comparing the images taken by the standard still image and the charge coupled device (CCD) camera. At this time, the standard still image can be a still image of an electronic component having a normal appearance. The second test device 2 can test the electronic components located at the first test position ΤΡ1. The second test device 2 can be mounted in the test unit 5 and positioned in the first test position. The first test device 1 or the second test device 200 can be mounted to the first test position τρι. The second test device 200 can test the luminescence characteristics of the electronic components. The electronic component can be a light emitting device such as a light emitting diode (LED). In this case, the second test apparatus 200 can test the light-emitting characteristics of the light-emitting diode (LED), that is, whether the light-emitting diode (LED) emits light normally. As described above, the test unit 5 can include a contact pin (not shown) in contact with the electronic component located at the first test position TP1. In the process of detecting the first characteristic of the electronic component, the test unit 5 drives the electronic component in contact with the contact foot, thereby causing the electronic component to emit light, and then the second test device 2 can be emitted through the electronic component driven from the test unit 5. Light to test the luminescent properties. The second test device 2A may include an additional contact leg that drives the electronic component at the first test position τρι such that the electronic component emits light. The first test device 100 or the second test device 2 can provide the obtained test information to the table-mounted device 1Q (such as the surface mount device 10 shown in FIG. 1) (as shown in FIG. 1) The mounting unit u can be controlled according to the test information provided by the __test device or the second test device 200 (as shown in the "Fig. 2", for example, according to the test information, if the corresponding electronic component f is too bad * no Can be mounted on the substrate s (as shown in the "i"), then the surface mount device 1 (as shown in the "picture" above) controls the placement unit u (such as "i" The corresponding electronic components are not mounted on the substrate s (as shown in the "figure i"). If the electronic components are determined on the substrate s according to the performance of the corresponding electronic components (such as "the map"上上上=Placement position, then the surface mount (4) (as shown in Figure 1) controls the placement of the early 11 (as shown in Figure 1), so that the corresponding electronic components are mounted on The predetermined position of the substrate, /, °, device 100 or second test device 2 can be provided to the second transfer unit 4 The test information is obtained. The second transfer unit 4 can control the pick list &amp; 44 according to the test information provided by the first test device or the first test device 200. For example, if the corresponding electronic component is of poor quality, it cannot be mounted on The substrate S (e.g., "on the map") controls the pick-up unit 44 so that the corresponding electronic component is placed on the second transport member 41 by using the pick-up early 44. The transfer unit 4 can control the pick-up list (10) to supply the corresponding electric power to the pick-up unit 44 while transmitting the corresponding electric:-type unit 5 to the second transport unit 41. The transport member 41 may include a container (not shown) outside the 偻If. For an electronic component having a damaged appearance, the second 4 may control the pick-up unit 44 to accommodate the electronic component having a damaged appearance in another container.提#^=The test device just or the second test device can send the information to the first transfer unit 3 or the first test unit. The first transfer unit 3 can be provided according to the first test set), ° "provided by the device 2〇0 Test information control corrections 妒 (eg "Figure 9" As shown in the factory, Fig. 9 and Fig. 12, the first transfer unit 3 can control the positive element 36 of the 2011 201129267 to transmit the defective electronic component to the removal hole 312, and the high quality electronic device The device is transferred to the second connecting slot 3112. Referring to the "Fig. 25", according to the modified embodiment of the present invention, the testing device 100 or the second testing device can be installed in the testing unit 5: set to 1 〇. The second characteristic of the electronic component, the second test device 2 = the third characteristic of the electronic component. The second characteristic and the third characteristic can be different special cases, the second is slightly hidden, and the third impurity appearance characteristic: The second characteristic can be related to the brightness fins of various optical impurities, and the second characteristic can also be related to the chromaticity of various optical characteristics. The first test apparatus 100 can test the electronic component t' located at the first 峨 position τ'. The second test apparatus 200 can test the electronic components located at the second test position TP2. = The test position TP2 is located beside the first position m, or may be located between the first test position m and the unloading position. In this case, the first drive button 56 (as shown in FIG. 21) can rotate the turntable 55' to place a plurality of supports=sequentially in the loading position LP, the first test position TP1, the second test position, And spares: 3⁄4 ULP. The first - (10) can be threaded on the test unit ' and located at the first - test position τρι. The second test is in ^5 and is located in the second test position (four). If the electronic component is placed, the first-measurement TP2' can test its first and second characteristics. The Verde element 31 is movable in the first axial direction (the x-axis direction) by the first moving means 38. The first moving device 3 8 can move the first transport member 3 i such that at least any one of the 201129267 slots 411 are connected. Therefore, at least any one of 411 is connected. Therefore, the device 1 for the electronic component can shorten the first transfer first transfer slot 311 and the at least any second transfer slot to move the first transport member 31 and the third transport member 41, respectively, the first transfer slot 311 and At least any one of the second transfer grooves 41, the feed device 31 and the second transfer member 41 of the improved fourth embodiment transmit the electronic component from the second transfer slot 4 to the distance moved by the first pass 3111, thereby A greater number of electronic components are transmitted from the second transfer unit 4 to the first transfer unit 3. It will be appreciated by those skilled in the art that the present invention may be practiced without departing from the spirit and scope of the invention as claimed in the appended claims. Please refer to the attached patent application for the scope of protection defined by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a surface mount apparatus of a simplified surface technology; FIG. 2 is a plan view schematically showing an apparatus for feeding an electronic component according to a first embodiment of the present invention; 3 is a plan view schematically showing an operation relationship in a spring device for feeding an electronic component according to a first embodiment of the present invention; - FIG. 4 is a schematic diagram of a modified first embodiment of the present invention for feeding an electronic component. FIG. 5 and FIG. 6 are plan views of the system for feeding the f-sub-element according to the modified first embodiment of the present invention; FIG. 7 is a schematic view of the second embodiment of the present invention. A plan view of an apparatus for implementing a device for feeding electronic components; 48 201129267 FIG. 8 is a plan view schematically showing an apparatus of the second embodiment of the present invention; FIG. 9 is a view schematically showing another modification of the present invention. 2 is a plan view of a portion of the apparatus for feeding electronic components; FIGS. 10 to 12 are partial enlarged plan views of a portion "A" of FIG. 9, which is illustrated in the second embodiment of the present invention. Example _ human electronic device equipment FIG. 13 is a perspective view schematically showing a device of a third embodiment of the present invention, which is a device for feeding an electronic component, and a device for feeding the electronic component of the third embodiment of the present invention. FIG. 15 is a perspective view showing a pick-up unit of the invention of the invention; FIG. 16 is a schematic view showing the operation of the pick-up unit for feeding the electronic component according to the third embodiment of the present invention; a partial enlarged view of the "Β" portion of Fig. 14; Fig. 18 is a plan view showing the device for feeding electronic components of the modified third embodiment of the present invention; ^9 _ for the wire Good material three implementation _ private electronic components 3 also in the preparation of the pick-up unit operation; the first = _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 21 is a perspective view of a device for feeding an electronic component according to a fourth embodiment of the present invention. 201129267 FIG. 22 is a plan view schematically showing a device for feeding an electronic component according to a fourth embodiment of the present invention; Briefly represents the invention A plan view of a test unit; Fig. 24 is a view showing the operation of the pick-up unit of the device for feeding an electronic component according to a fourth embodiment of the present invention; and Fig. 25 is a view schematically showing the feed of the modified fourth embodiment of the present invention A plan view of a test unit in an apparatus of an electronic component; and a 26th drawing is a plan view schematically showing an apparatus for feeding an electronic component of a modified fourth embodiment of the present invention. [Main component symbol description] 1 Device for feeding electronic components 2 Supply unit 3 First transfer unit 4 Second transfer unit 5 Test unit 10 Surface mount device 11 Mount unit 12 Transfer unit 20 Tape feeder 21 Storage device 22 conveying device 31 first conveying member 201129267

32 first stop 33 second stop 34 first spraying device 35 second spraying device 36 correcting member 37 rotating device 38 first moving device 41 second conveying member 41a rotating shaft 42 rotating member 43 second rotating device 44 picking unit 51 Test slot 52 Correction device 53 Rotating unit 54 Support 55 Turntable 55a Rotary shaft 56 First drive device 57 Second drive device 100 First test device 51 201129267 200 Second test device 211 Storage slot 221 Transport slot 311 First transfer slot 3111 First connection groove 312 removal hole 3112 second connection groove 313 adsorption hole 361 correction groove 361a side 361b other side 411 second transfer groove 411a side 411b other side 441 pickup device 442 first mount 443 second installation 444 working unit 445 main body 521 accommodating groove 4411 first picker

52 201129267

4412

S

BP

CP

SP

PP

WP

TP D Bu D2, D3,

LP TP1

ULP Second Pickup Substrate Buffer Position Correction Position Supply Position Picking Position Waiting Position Test Position, D5, D6 Distance Loading Position First Test Position Unloading Position

53

Claims (1)

201129267 VII. Patent Application Range: 1. A device for feeding electronic components, comprising: a supply unit, the supply unit comprising a storage slot for storing the electronic component therein; a first transfer unit The first transfer unit is configured to transmit the electronic component to a picking position, wherein the picking position is a position where the mounting unit disposed in a surface mount device can pick up the electronic component; and a first transfer unit, The second transfer unit is configured to transfer the 3H electronic component from the supply unit to the first transfer unit, wherein the second transfer unit is installed between the supply unit and the first transfer unit . 2. The device for feeding an electronic component according to claim 1, wherein the first transmitting unit comprises: a first conveying member, comprising a plurality of first conveying grooves for connecting a feeding position and the picking a position, wherein the supply location is a location at which the electronic component is supplied. 3. The device for feeding an electronic component according to claim 2, wherein the second transmitting unit comprises: a second transmitting member, comprising a second transmitting slot, the electronic component being inserted into the second And a rotating member, the rotating member rotates the second conveying member about a rotating shaft, so that the second conveying groove is connected with any of the 帛-transmission grooves. 54 201129267 4. The device for feeding electronic components according to claim 3, further comprising: a test unit for testing the electronic component, the test unit being mounted on the supply unit and the second transfer unit Between the rotating member rotating the second conveying member, so that one side or the other side of the second conveying groove is connected to any one of the first conveying grooves according to the test information provided by the testing unit. 5. The device for feeding an electronic component according to Item 2 of the claim, wherein each of the first transfer slots comprises a first connection slot for connecting the supply position and the waiting position, and i. The second connection groove of the material position and the secret position, and the __ of each of the _first connection grooves gradually decrease as the position from the special position approaches the supply position. 6. The apparatus for feeding an electronic component according to Item 2, wherein the second transfer unit package 3 has a pick-up unit, the pick-up unit picks up the electronic component from the supply unit and transmits the electronic component To the first transfer slot at the supply position, wherein the first transfer unit includes a first moving device that moves the first transport member H in a second axial direction perpendicular to the first axis direction The axis direction is the direction in which the electronic component is transported, and wherein the first moving device moves the first transport member such that any one of the first transfer grooves is located at the supply position. 55 201129267 7. The device for feeding electronic components according to Item 2 of the present invention, wherein the second transfer unit comprises: the delivery member % includes a plurality of second transfer slots, and the electronic components are inserted into the second And a second moving device that pivots the second transporting member such that at least any one of the second transfer slots is coupled to at least any of the first transfer slots. The apparatus for feeding an electronic component according to Item 7, wherein the supply unit has a storage device having the f-slot, and the "transport with a transfer slot" is transferred from the storage device. The electronic component is inserted into the transport slot, wherein the first mobile device moves the second transport member such that any one of the second transport slots is coupled to the transport slot. a device for feeding an electronic component, wherein the number of the second transfer grooves included in the first transfer member is less than the number of the first transfer grooves, and _ each of the second transfer grooves The interval between each other is equal to the interval between each of the first transfer grooves. 1. A device for feeding electronic components, comprising: a supply unit, comprising a storage slot for storing the electronic component therein A first transfer unit includes a first 56 201129267 transporting a plurality of first transfer slots, and the transfer position of the electronic component is used to pick up the pick-up position of the money carrier And the transfer unit is configured to transfer the electronic component inserted into the first transmission to the pickup position; and a second transfer order is to transmit the electronic component from the supply unit to the first A transfer unit. 11. The device of claim 10, comprising: the device for feeding electronic components, wherein the second transmitting first transmitting member comprises a plurality of second transmitting slots, the electronic components being inserted into the a second transfer device; the second mobile device moves the second transfer member such that at least any one of the # second passes is connected to at least any one of the first transfer slots; And the #取取取 unit is used to transfer the electronic component from the supply unit to the first transfer unit. 12. The device for feeding electronic components according to Item 11 of the present invention further includes: , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Wherein the miscellaneous unit comprises a first picking S, the _ test Weizi component is self-supplied, and the second picker is used to test the tested electronic component from the 57 201129267 The unit is transferred to the second picker of the second transport. 13. The device for feeding an electronic component according to claim 12, wherein the test unit comprises: a calibration device comprising a receiving slot for receiving the electronic component; and a 'rotating unit for housing according to The test result of the electronic component in the receiving slot rotates the correcting device. M. The device for feeding an electronic component according to Item 12, wherein the pick-up unit comprises a --mounting member, wherein the first mounting member is mounted with the first pick-up device and the first Two pickers, . . Wherein the distance between the supply unit and the test unit is the same as the first picker. The distance between the second pickers is the same; and, the distance between the k-cell and the second transport member is the same as the distance between the first pick-up and the second pick-up. The device for feeding an electronic component according to Item 11 of the present invention, wherein the first passer g 3 has a first-heterogeneous device, and the first-transfer is placed between the first and the second of the transfer of the electrical component. Moving the first transport and the fish in a direction perpendicular to the second axis, wherein the first mobile device moves the first transport member such that at least any of the six transmissions, such as requesting the first slot and at least any one of the second transmissions The slots are connected. The device for feeding the electronic component described in the second item ω, and the test unit mounted in the first transfer member, 58 201129267 wherein the test unit tests the electronic component at the test position, the test position Between the supply position and the pick-up position, and wherein the first transfer unit includes a first stop for blocking the electronic component to the test position such that the electronic component is located Test location. 17. Equipment for feeding electronic components as described in item 16 of the claim. The first transfer unit includes a second stop for holding the electronic component in a buffer position between the supply position and the test position. 18. The apparatus for feeding an electronic component according to Item 2 or Item 1, wherein the apparatus further comprises a jetting unit for jetting the fluid to move the electronic component. 19, for example, a device for feeding an electronic component of a stomach, wherein the spray unit comprises: a spray device for spraying a fluid to move a sub-element located at the test position to the pick-up Position, the test position is between the supply position and the pick-up position; and the first-nozzle device is for ejecting a fluid to decorate the /Electronic 7L piece located at the buffer position to a reward position Between the supply position and the S-hai test position. 20. The apparatus for feeding an electronic component according to Item 2 or Item 1G, wherein the parent first transfer groove comprises a first connection slot connecting the supply position and the correction position; The correction position and the second connection slot to which the pickup position is connected. 21. The apparatus for feeding a sub-component according to claim 2G, wherein the first transfer element comprises a tilting positive element and a plurality of conversion parts, and the correcting parts are mounted on the first conveying piece And in the correction position, and the rotating device is configured to rotate each of the correcting members, wherein each of the positive members comprises a correction slot, the correction slot is such that the first connecting slot and the second connecting slot Connected to each other, and each of the rotating devices rotates the correcting members such that one side or the other side of the correcting groove is aligned with the second connecting groove according to the orientation of the electronic component inserted into the correcting lens connection. 22. The device for feeding an electronic component according to claim 2, wherein the first permeable member comprises a plurality of removal holes for removing defective electronic components, The first delivery unit includes a plurality of correction members and a plurality of rotations, and the X positive members are mounted on the first delivery member and are located at the correction position, and the rotations are set to rotate the health correction members. The female contact positive thorn includes a correction groove, the misalignment groove is such that the connection groove and the second connection groove are connected to each other, and wherein each of the rotation devices rotates the correction members, thereby according to the insertion &quot; The test result of the electronic component in the positive slot causes the correction slot to be connected to the second connection slot of the 201129267 or the removal holes. 23. The device for feeding an electronic component according to the above item 2, wherein the first transporting member comprises a plurality of adsorption holes, wherein the adsorption holes are in communication with each of the first transfer grooves, And wherein the adsorption holes are formed in the pick-up position, and the adsorption holes are connected to an adsorption device that provides suction to adsorb the electronic component. 24. The device for feeding an electronic component according to claim 23, wherein the adsorption holes are formed in the first transfer member to place the electronic components of the mXn matrix in a 5 hoisting position, wherein m and η are integers greater than one. 25. The device for feeding an electronic component according to claim 11, further comprising a test unit for testing the electronic component, the test unit being mounted between the supply unit and the second transport member, wherein the The test sheet S includes: a support member for the electronic component of the branch building, a turntable to which the support members are connected, and a first driving device for the touch-up of the first drive unit Positioning the mounting touch (Lp) for loading the electronic 7G piece, testing the first test position (TP1) of the first characteristic of the electronic component, and unloading the unloading position (ULP) of the electronic component, and wherein the picking The unit includes: a first picker that transfers the f sub-element to be tested from the miscellaneous feeding unit to the support member at the (four) position; and a second picker, the second picker The 70 pieces of the tested 201129267 sub-piece are transferred from the support located at the unloading position to the second transfer member. 26. The device for feeding electronic components of claim 25, wherein the test unit dc is mounted in the turntable and the § hai test unit comprises a plurality of second drive loads respectively rotating the support members And each of the second drive loads rotates the support member to correct the orientation of the tested electronic component based on the test result of the first characteristic. 27. The device for feeding an electronic component according to claim 25, wherein the test unit comprises a first testing device, the first testing device is configured to test optical characteristics of the electronic component, and wherein the first A test device tests the electronic component at the first test location. 28. The device for feeding an electronic component according to claim 25, wherein the test unit comprises a second testing device for testing an appearance characteristic of the electronic component, and wherein the second test The device is located in the electronic component of the first test device. $ 29. The device for feeding an electronic component according to claim 25, wherein the test unit comprises: a first test device for testing a second characteristic of the electronic component, and a second test device Used to test a third characteristic of the electronic component, wherein the first test device tests the electronic component at the first test location; the second test device tests the electronic component at the second test location, and 62 201129267 Wherein the first drive means rotates the turntable so that the support members are sequentially placed in the remaining position, the first position, the second position, and the unloading position. 30. According to claim 25, the pick-up sheet 7G includes a -first mounting member, the first mounting member is mounted with the first picker and the second picking The distance between the supply unit and the salient located at the unloading position is the same as the distance between the first picker and the second picker, and wherein the second transport member and the remaining portion are located The distance between the materials is the same as the distance between the first picking and the second picking. 31. The apparatus for feeding an electronic component according to Item 1 or Item 1G, wherein the supply unit comprises a storage device having the storage tank, the storage device being a bowl feeder, and wherein The electronic component stored in the storage tank is a light emitting diode (LED). 63