1308790 九、發明說明： 【發明所屬之技術領域】 本發明關於一種電子元件，尤其涉及一種可防止立碑 現象發生之表面貼裝電子元件。 【先前技術】 Φ 立碑現象（Tombstone)，又稱之為吊橋或曼哈頓現象， 係表面貼裝（Surface Mounted Technology，SMT)生產過 程中常見之缺陷，係一種電子元件焊接後出現翹立而脫落 之現象。立碑現象發生之根本原因在於電子元件兩邊之張 力不平衡。立碑現象通常出現於重量很輕之片式電子阻容 兀件上，因為不均衡之張力可很容易地拉動元件。立碑現 象之產生主要包括以下情形： (1) 電子元件焊盤設計與佈局不合理，若元件有一侧 #焊盤面積過大，則會因熱熔量不均勻而引起電子元件兩端 張力不平衡。 (2) 焊接時焊接面受熱不均，各處溫度差過大以致元 件焊盤吸熱不均勻，導致電子元件兩端張力不平衡。 (3) 焊料活性不高，錫膏熔化後，表面張力不均勻， 引起電子元件兩端張力不平衡。 (4) 電子元件兩側焊盤錫膏印刷量不均勻，錫膏較多 --邊會因錫膏吸熱量增多，熔化時間滯後，導致 •兩端張力不平衡。 屯丁兀什 1308790 ⑺電子元件貼片時受力不 深淺不-，烊料溶化時會 導致次入到焊料中 力不平衡。 時間差而導致電子元件兩端張 隨者各種電子產品朝著輕、薄、短 電子元件越來越小，佈線亦越 之方向發展’ 日益明顯。於表面貼裝過現象之影響亦 焊接時極易引起電子元件二:兩==件1。， 現象。立碑現象出現會大大影響表面貼裝之 電子產品質量。 脫洛從而嚴重影響 有鑑於此，提供-種表面貼裝電子元件，以有 f面貼裝過程中立碑現象之發生，提高表面貼裝 屬必要。 卞貝 【發明内容】 以下以實施例說明一種表面貼裝電子元件。 • 料表面貼裝電子元件’其包括一焊接面、一 接面相對之頂面及-連續侧壁，該連續侧壁同時盘所述 1面及頂面相連，該焊接面包括一第一焊接區域與—第二 焊接區域，該第一焊接區域與該第二焊接區域對稱分佈於 焊接面，所述連續側壁開設有至少一與第一焊接區域相通 之第一凹槽，及至少一與第二焊接區域相通之第二凹槽。 相對於先前技術，所述表面貼裝電子元件之優點在 於.通過於表面貼裝電子元件之側壁設置凹槽，利用毛細 .官現象與煙®效應使得焊料於熔化時可順著電子元件側壁 1308790 接而#效平衡表面貼裝電子元件兩端由於焊 之張力不平衡’將電子元件牢固焊接於電路板 上，有效防止立碑現象發生。 【實施方式】 以下將實施例說明一種表面貼裝電子元件。 請參閱圖2與圖3，實施例一提供之表面貼裝電子元件 2〇,其為長方體結構’ #然，亦可為其他平行多面體結構。 鲁該表面貼裝電子元件2G包括—焊接面21，—與該焊接面相 對之頂面22 ’及-連續侧壁23。該焊接面21與頂面22分別 為長方體相對之兩底面，所述連讀侧壁23為長方體之側 面，該連續側壁23包括一第一侧壁段231及一與該第一側壁 段231相對之第二側壁段232，一第三側壁段233及一與該第 三側壁段233相對之第四侧壁段234。該第一侧壁段231、第 二侧壁段232、第三侧壁段233及第四側壁段234同時與焊接 面21及頂面22相連。 該焊接面21包括一第一焊接區域211與一第二焊接區 域212。本實施例中，該第一焊接區域211位於焊接面21靠 近第一侧壁段231—侧，該第二焊接區域212位於焊接面21 罪近第一側壁段232 —側，且，該第一焊接區域211與該第 二焊接區域212對稱分佈於焊接面21靠近邊緣位置。由於焊 接面21為矩形，而矩形係中心對稱圖形，故，該第一焊接 區域211與該第二焊接區域212亦呈中心對稱分佈於焊接面 21靠近邊緣位置。 該第一侧壁段231與第二側壁段232分別開設有一第一 8 1308790 «* 凹槽24與一第二凹槽25。該第一凹槽％與焊接面。之第一 焊接區域211相通，該第二凹槽25與焊接面21之第二焊接區 域=2相通。優選地，第一凹槽24與第一焊接區域2ιι垂直 相交；第一凹槽25與第一焊接區域212垂直相交。該第一凹 槽與該第二凹槽25之橫截面呈弧形。當然，亦可為其他 任意形狀，例如V形、；；形、多邊折線形等。此外，該第一 焊接區域211與該第二焊接區域212可分別設置一焊盤 213 ’以利表面貼裝電子元件2〇更好焊接。 所述表面貼裝電子元件2〇焊接到電路板時，位於電路 f烊區與表面貼裝電子元件2〇之第一焊接區域2ιι與第二 桿接區域212之間之焊料如焊錫膏被加熱熔化，由於表面貼 裝電子7G件20於第一側壁段231與第二侧壁段232分別開設 有第一凹槽24與第二凹槽25，熔化之焊料可由於毛細管作 用，、沿著第一凹槽24與第二凹槽25之内壁分別由第一焊接 區域211與第二焊接區域212向上爬升，擴散到第一凹槽24 與第二凹槽24中。這樣焊料與表面貼裝電子元件2〇之接觸 面積大大增加，從而使表面貼裝電子元件2〇緊密牢固焊接 於電路板。同時’於焊接加熱熔化焊料過程中，第一凹槽 2績第二凹槽25靠近焊接面21 一端溫度較高，㈣近頂^ 22-端溫度較低，溫差之存在得以發生煙自效應，溶化之 焊料同樣會沿著凹槽243内壁向上爬升，擴散到第一凹槽Μ 與第二凹槽25中，從而增加焊料與表面貼裝電子元件之 接觸面積’使表面貼裝電子元件2〇緊密牢固之焊接於電路 板。如此，擴散到第一凹槽24與第二凹槽25中之焊料與焊 9 * 1308790 接面21與電路板焊區之間之焊料連接形成為一體，能有效 平衡表面貼裝電子元件20兩端由於焊接而造成之張力不平 衡，將表面貼裝電子元件20牢固焊接與電路板。此外，該 第三側壁段233與第四侧壁段234亦可分別開設凹槽，來進 一步增加焊料與表面貼裝電子元件20之接觸面積，使表面 貼裝電子元件20緊密牢固焊接於電路板。 請參閱圖4與圖5，實施例二提供之表面貼裝電子元件 30，其結構與表面貼裝電子元件20大致相同。不同之處在 鲁於，第一凹槽34與焊接面31之第一焊接區域311相通，並同 時與頂面32相通；該第二凹槽35與焊接面31之第二焊接區 域312相通，並同時與頂面32相通。 請參閱圖6與圖7，實施例三提供之表面貼裝電子元件 40，其結構與表面貼裝電子元件20大致相同。不同之處在 於，有複數個第一凹槽44與複數個第二凹槽45分別開設於 第一侧壁段431與第二側壁段432。所述表面貼裝電子元件 鲁40焊接到電路板上時，由於表面貼裝電子元件40之第一側 壁段431與第二侧壁段432開設有複數個第一凹槽44與複數 個第二凹槽45，熔化焊料可由於毛細管作用與煙囪效應沿 複數個第一凹槽44與複數個第二凹槽45内壁向上爬升，擴 散到複數個第一凹槽44與複數個第二凹槽45中。如此，一 方面，焊料由第一焊接區域411與第二焊接區域412擴大至 第一侧壁段431與第二側壁段432之複數個第一凹槽44與複 '數個第二凹槽45中，增加了焊料與表面貼裝電子元件40之 '間接觸面積；另一方面，第一焊接區域411與第二焊接區域 • Ϊ308790 412呈中心對稱排佈，與表面貼裝電子元件4〇之間接觸面積 之增加’使得表面貼裝電子元件4〇於第一焊接區域411所受 張力與其於第一焊接區域412所受張力於同時增加之情況 下更趨向於相當，表面貼裝電子元件40於兩端受力均勻平 衡之障况下’會使表面貼裝電子元件緊密牢固焊接於電 路板。 另外，表面電子貼裝電子元件並不僅僅限於平行多面 籲體結構，還可為其他任何形狀。請參閱圖8與圖9，實施例 四提供之表面貼裝電子元件5〇，其為圓柱體結構。該表面 貼襄電子το件50包括-焊接面51，—與該焊接面相對之頂 面52 連續侧壁53同時與焊接面51與頂面52相連。該焊 -接面51與頂面52分別為圓柱體相對之兩底面，所述連續側 壁5 3為圓柱體之側面。 該焊接面51包括一第一焊接區域511與一第二焊接區 域512。該第一焊接區域511與該第二焊接區域512分別呈對 鲁稱設置。由於焊接面51為圓形，而圓形係中心對稱圖形， 該第一焊接區域511與該第二焊接區域512亦呈中心對稱分 佈於焊接面51靠近邊緣位置。該側壁53開設有一第一凹槽 54與一第二凹槽55。該第一凹槽54與焊接面51之第一焊接 區域511相通，該第二凹槽55與焊接面51之第二焊接區域 512相通。當然，該第一凹槽54亦可同時與第一焊接區域5ιι 與頂面52相通；該第二凹槽55亦可同時與第二焊接區域512 與頂面52相通。該第一凹槽54與該第二凹槽％之橫截面呈 弧形。當然，亦可為其他任意形狀，例如v形、。形、多邊 11 • 1308790 折線形等。 此卜該第帛接區域511與該第二焊接區域5 別設置—焊盤513,以利表面㈣電子元件50更好焊接。 上述表面貼裝電子元件2G、L 50之優點在於： 通過於表面貼裝電子元件之侧壁設置凹槽，制毛細管現 象與煙_效應使得焊料於炫化時可順著電子元件側壁之凹 槽向上;^ ft*冑效平衡表面貼裝電子元件兩端由於焊接而 造成之張力不平衡，將電子元件牢n焊接於電路板上，有 效防止立碑現象發生。 綜上所述’本發明符合發明專利要件，爰依法提出專 利申請。m所述者僅為本發明之較佳實施方式 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技蔽 之人士，在援依本案發明精神所作之等效修飾或變化，: 應包含於以下之申請專利範圍内。 白 【圖式簡單說明】 圖1係習知表面貼裝電子元件結構示意圖。 圖2係實施例一表面貼裝電子元件結構示意圖。 圖3係實施例一表面貼裝電子元件結構仰視圖。 圖4係實施例二表面貼裝電子元件結構示意圖。 圖5係實施例二表面貼裝電子元件結構仰視圖。 圖6係實施例三表面貼裝電子元件結構示意圖。 圖7係實施例三表面貼裝電子元件結構仰視圖。 圖8係實施例四表面貼裝電子元件結構示意圖。 圖9係實施例四表面貼裝電子元件結構仰視圖。 12 1308790 主要元件符號說明】 表面貼裝電子元件 20 、 30 、 40 焊接面 21 、 31 、 41 頂面 22、32、42 連續側壁 23 第一側壁段 231、 第二侧壁段 232 ' 第三侧壁段 第四侧壁段 第一焊接區域 211 、 311 、 411 、 第二焊接區域 212、312、412、 第一凹槽 24 、 34 ' 44 第二凹槽 25 、 35 、 45 焊盤 213、 、50 > 51 、52 '53 431 432 233 234 511 512 '54 '55 5131308790 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic component, and more particularly to a surface mount electronic component capable of preventing a tombstoning phenomenon from occurring. [Prior Art] Φ Tombstone, also known as the suspension bridge or Manhattan phenomenon, is a common defect in the surface mounted technology (SMT) production process, which is an electronic component that rises and falls off after soldering. The phenomenon. The root cause of the phenomenon of the tombstone is the unbalanced tension between the two sides of the electronic component. The tombstone phenomenon usually occurs on a very light weight chip electronic resistance device, because the unbalanced tension can easily pull the component. The phenomenon of the tombstone phenomenon mainly includes the following situations: (1) The design and layout of the electronic component pad are unreasonable. If the component has one side #pad area is too large, the tension between the two ends of the electronic component will be unbalanced due to the uneven heat flux. . (2) When the welding surface is heated unevenly during welding, the temperature difference between the parts is too large, so that the element pads absorb heat unevenly, resulting in unbalanced tension at both ends of the electronic component. (3) The solder activity is not high, and the surface tension is not uniform after the solder paste is melted, causing the tension at both ends of the electronic component to be unbalanced. (4) The solder paste on both sides of the electronic component is printed unevenly, and the solder paste is more than one. The heat is absorbed by the solder paste, and the melting time is delayed, resulting in unbalanced tension at both ends. Kenting Osh 1308790 (7) When the electronic components are patched, the force is not shallow. If the material melts, it will cause a force imbalance in the solder. The time difference causes the electronic components at both ends of the electronic components to become lighter, thinner, and shorter. The electronic components are getting smaller and smaller, and the wiring is becoming more and more oriented. The effect of surface mount phenomenon is also easy to cause electronic components when soldering: two == piece 1. , phenomenon. The appearance of the tombstone phenomenon will greatly affect the quality of electronic products for surface mount. The effect of detachment is serious. In view of this, it is necessary to provide surface-mounting electronic components to enhance the surface mount in the event of a stray phenomenon in the f-face mounting process.卞贝 [Summary of the Invention] A surface mount electronic component will be described below by way of examples. • a material surface mount electronic component that includes a soldering surface, a top surface opposite the top surface, and a continuous sidewall that is simultaneously connected to the one surface and the top surface of the disk, the soldering surface including a first solder And a second welding area, the first welding area and the second welding area are symmetrically distributed on the welding surface, the continuous side wall is provided with at least one first groove communicating with the first welding area, and at least one a second groove in which the second welding zone communicates. Compared with the prior art, the surface mount electronic component has the advantages of providing a groove on the sidewall of the surface mount electronic component, and utilizing the capillary phenomenon and the smoke effect to make the solder follow the side wall of the electronic component when melting. In addition, the effect balance is unbalanced at both ends of the surface-mount electronic component. The electronic components are firmly soldered to the circuit board to effectively prevent the phenomenon of tombstoning. [Embodiment] Hereinafter, an embodiment will be described with respect to a surface mount electronic component. Referring to FIG. 2 and FIG. 3, the surface mount electronic component 2A provided in the first embodiment has a rectangular parallelepiped structure, and may be other parallel polyhedral structures. The surface mount electronic component 2G includes a soldering surface 21, a top surface 22' opposite the soldering surface, and a continuous sidewall 23. The welding surface 21 and the top surface 22 are respectively opposite bottom surfaces of the rectangular parallelepiped, and the continuous reading sidewall 23 is a side surface of the rectangular parallelepiped. The continuous sidewall 23 includes a first sidewall segment 231 and a first sidewall segment 231 opposite to the first sidewall segment 231. The second sidewall segment 232, a third sidewall segment 233 and a fourth sidewall segment 234 opposite the third sidewall segment 233. The first sidewall segment 231, the second sidewall segment 232, the third sidewall segment 233 and the fourth sidewall segment 234 are simultaneously connected to the soldering surface 21 and the top surface 22. The welding face 21 includes a first weld zone 211 and a second weld zone 212. In this embodiment, the first soldering region 211 is located on the side of the soldering surface 21 adjacent to the first sidewall segment 231, and the second soldering region 212 is located on the side of the soldering surface 21 adjacent to the first sidewall segment 232, and the first The welding zone 211 is symmetrically distributed with the second welding zone 212 at the edge of the welding surface 21 near the edge. Since the soldering surface 21 is rectangular and the rectangle is centrally symmetrical, the first soldering region 211 and the second soldering region 212 are also symmetrically distributed in the center of the soldering surface 21 near the edge. The first side wall segment 231 and the second side wall segment 232 respectively define a first 8 1308790 «* recess 24 and a second recess 25 . The first groove % is associated with the weld face. The first welding zone 211 is in communication, and the second groove 25 is in communication with the second welding zone of the welding face 21 = 2. Preferably, the first recess 24 intersects the first weld zone 2 ι vertically; the first recess 25 intersects the first weld zone 212 perpendicularly. The first recess and the second recess 25 have an arc shape in cross section. Of course, it can be any other shape, such as a V shape, a shape, a polygonal line shape, or the like. In addition, the first soldering region 211 and the second soldering region 212 may respectively be provided with a pad 213' for better soldering of the surface mount electronic component 2 . When the surface mount electronic component 2 is soldered to the circuit board, solder such as solder paste between the first soldering region 2 ι and the second soldering region 212 of the surface mount electronic component 2 is heated. The first surface 24 and the second side wall 232 of the surface mount electronic component 7 are respectively provided with a first recess 24 and a second recess 25, and the molten solder may be caused by capillary action. The inner walls of a recess 24 and the second recess 25 are respectively climbed upward by the first weld region 211 and the second weld region 212, and diffused into the first recess 24 and the second recess 24. Thus, the contact area of the solder with the surface mount electronic component 2 is greatly increased, so that the surface mount electronic component 2 is tightly and firmly soldered to the circuit board. At the same time, in the process of soldering and melting the solder, the first groove 2 has a higher temperature at the end of the second groove 25 near the welding surface 21, and (4) the temperature near the top 22 22 is lower, and the existence of the temperature difference can cause a smoke self-effect. The molten solder also climbs up along the inner wall of the recess 243 and diffuses into the first recess Μ and the second recess 25, thereby increasing the contact area of the solder with the surface mount electronic component. Tightly and firmly soldered to the board. In this way, the solder and the solder joints between the first recess 24 and the second recess 25 are formed integrally with the solder joint between the solder pads 9*1308790 and the solder pads of the circuit board, which can effectively balance the surface mount electronic components 20 The surface is unbalanced due to soldering, and the surface mount electronic component 20 is firmly soldered to the circuit board. In addition, the third sidewall segment 233 and the fourth sidewall segment 234 may also respectively form a recess to further increase the contact area between the solder and the surface mount electronic component 20, so that the surface mount electronic component 20 is tightly and firmly soldered to the circuit board. . Referring to FIG. 4 and FIG. 5, the surface mount electronic component 30 provided in the second embodiment has substantially the same structure as the surface mount electronic component 20. The difference is that the first groove 34 communicates with the first welding zone 311 of the welding surface 31 and simultaneously communicates with the top surface 32; the second groove 35 communicates with the second welding zone 312 of the welding surface 31, At the same time, it communicates with the top surface 32. Referring to FIG. 6 and FIG. 7, the surface mount electronic component 40 provided in the third embodiment has substantially the same structure as the surface mount electronic component 20. The difference is that a plurality of first recesses 44 and a plurality of second recesses 45 are respectively defined in the first sidewall segment 431 and the second sidewall segment 432. When the surface mount electronic component 430 is soldered to the circuit board, the first sidewall portion 431 and the second sidewall portion 432 of the surface mount electronic component 40 are provided with a plurality of first recesses 44 and a plurality of second portions. The groove 45, the molten solder may climb upward along the inner walls of the plurality of first grooves 44 and the plurality of second grooves 45 due to capillary action and chimney effect, and diffuse to the plurality of first grooves 44 and the plurality of second grooves 45 in. As such, on the one hand, the solder is expanded from the first soldering region 411 and the second soldering region 412 to the plurality of first recesses 44 and the plurality of second recesses 45 of the first sidewall segment 431 and the second sidewall segment 432. The contact area between the solder and the surface mount electronic component 40 is increased; on the other hand, the first soldering region 411 and the second soldering region • Ϊ 308790 412 are arranged symmetrically in the center, and the surface mount electronic component 4 The increase in the contact area is such that the tension applied to the surface mount electronic component 4 in the first soldering region 411 tends to be more uniform than the tension applied to the first soldering region 412, and the surface mount electronic component 40 is mounted. Under the condition that the force is evenly balanced at both ends, the surface mount electronic components are tightly and firmly soldered to the circuit board. In addition, surface electronically mounted electronic components are not limited to parallel multi-faceted structures, but may be of any other shape. Referring to FIG. 8 and FIG. 9, the surface mount electronic component 5A provided in Embodiment 4 is a cylindrical structure. The surface mount electronic component 50 includes a soldering surface 51, and a top surface 52 of the top surface 52 opposite the soldering surface is simultaneously connected to the soldering surface 51 and the top surface 52. The weld-joining surface 51 and the top surface 52 are respectively opposite bottom surfaces of the cylindrical body, and the continuous side wall 53 is a side surface of the cylindrical body. The weld face 51 includes a first weld zone 511 and a second weld zone 512. The first welding zone 511 and the second welding zone 512 are respectively disposed in a pair. Since the welding surface 51 is circular and the circular center is symmetrical, the first welding region 511 and the second welding region 512 are also symmetrically distributed centrally to the welding surface 51 near the edge position. The sidewall 53 defines a first recess 54 and a second recess 55. The first recess 54 communicates with a first soldering region 511 of the soldering surface 51, and the second recess 55 communicates with a second soldering region 512 of the soldering surface 51. Of course, the first recess 54 can also communicate with the first soldering region 5 ι and the top surface 52 at the same time; the second recess 55 can also communicate with the second soldering region 512 and the top surface 52 at the same time. The cross section of the first groove 54 and the second groove % is curved. Of course, it can be any other shape, such as a v shape. Shape, Multilateral 11 • 1308790 Line shape, etc. The first splicing region 511 and the second soldering region 5 are provided with a pad 513 for better soldering of the surface (four) electronic component 50. The above surface mount electronic components 2G, L 50 have the advantages that: by providing a groove on the sidewall of the surface mount electronic component, the capillary phenomenon and the smoke effect can make the solder follow the groove of the side wall of the electronic component when the solder is dazzled. Up; ^ ft* effect balance The tension between the two ends of the surface mount electronic components due to soldering, the electronic components are firmly soldered to the circuit board, effectively preventing the phenomenon of tombstoning. In summary, the invention conforms to the patent requirements of the invention, and the patent application is filed according to law. The scope of the invention is not limited to the above-described embodiments, and those skilled in the art will be able to include equivalent modifications or variations in the spirit of the invention. It is within the scope of the following patent application. White [Simple description of the drawing] Fig. 1 is a schematic view showing the structure of a conventional surface mount electronic component. 2 is a schematic structural view of a surface mount electronic component of Embodiment 1. Figure 3 is a bottom plan view showing the structure of the surface mount electronic component of the first embodiment. 4 is a schematic structural view of a surface mount electronic component of Embodiment 2. Figure 5 is a bottom plan view showing the structure of the surface mount electronic component of the second embodiment. 6 is a schematic structural view of a surface mount electronic component of Embodiment 3. Figure 7 is a bottom plan view showing the structure of the surface mount electronic component of the third embodiment. FIG. 8 is a schematic structural view of a surface mount electronic component of Embodiment 4. FIG. Figure 9 is a bottom plan view showing the structure of the surface mount electronic component of the fourth embodiment. 12 1308790 Description of main component symbols] Surface mount electronic components 20, 30, 40 Welding faces 21, 31, 41 Top faces 22, 32, 42 Continuous side walls 23 First side wall section 231, Second side wall section 232 'Third side Wall section fourth side wall section first welding area 211, 311, 411, second welding area 212, 312, 412, first groove 24, 34' 44 second groove 25, 35, 45 pad 213, 50 > 51 , 52 '53 431 432 233 234 511 512 '54 '55 513
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