201124733 六、發明說明： 【發明所屬之技術領域】 本發明，係有關於在半導體裝置之試驗中所使用的探 針導引構件、及具備有此之探針卡、以及使用有其之半導 體裝置之試驗方法。 【先前技術】 在具備有被稱作突塊之突起狀的連接電極之例如 BGA (球柵矩陣）等的半導體裝置之電性特性的試驗中， 從先前技術起’係以使用與突起狀之連接電極垂直地作接 觸之垂直型的探針爲主流，但是，當連接電極之節距爲小 的情況、或者是當爲了進行凱文連接而必須要在1個的連 接電極處而使2根的探針作接觸的情況等時，由於垂直型 之探針係無法作對應，因此’最近，係進行有使用懸臂型 之探針。 但是’旋臂型之探針’由於係僅爲單端支持地而將探 針作安裝’因此’其之前端部係容易移動，特別是，當與 突起狀之連接電極作了接觸的情況時，雖然亦依存於其之 . 接觸部位’但是’係會有著探針之前端從突起狀之連接電 - 極而滑落並成爲無法取得安定之電性連接的問題。 爲了解決此問題’例如，在專利文獻1中，係提案有 :在身爲檢查對象之半導體裝置與具備有探針之探針卡之 間，而配置具備有成爲突起狀之連接電極的平面尺寸以下 並且較探針之前端部尺寸而更大之直徑的貫通孔之探針導 -5- 201124733 引構件。 然而，在專利文獻1中所提案之導引構件的貫通孔， 由於係爲對於突起狀之連接電極的略全面而作開口之圓形 的貫通孔，因此，探針之前端部，係並非一定會成爲經由 此貫通孔而被朝向過驅動時之刮擦方向作導引，而會有在 貫通孔所容許之範圍內而朝向側方向滑動的情形，故係有 著難以取得安定之電性連接的缺點。 又，在專利文獻1中所提案之貫通孔，由於係如同上 述一般，相對於突起狀之連接電極的包含有突起頂點之略 全面而作開口，因此，若是將探針前端處插入至此貫通孔 內並與連接電極作接觸，則有時候會發生探針之前端部與 連接電極之突起頂點相接觸並在突起頂點上造成刮擦痕跡 的情形。突起狀連接電極之突起頂點，係爲該電極與作安 裝之安裝品之間的結合場所之部分的中心，若是在該處存 在有刮擦痕跡，則該部分會在之後的熔著時而成爲空洞並 殘留，其結果，會成爲造成接合強度不足或者是導電量不 足等的原因。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2004-3 3 56 1 3號公報 【發明內容】 [發明所欲解決之課題] -6 - 201124733 本發明’係爲爲了解決上述之先前技術的缺點所進行 者’並以提供一種能夠在懸臂型之探針與突起狀連接電極 之間而進行安定之電性連接並且不會對於突起狀連接電極 之突起頂點而賦予刮擦痕跡的探針導引構件、具備有該種 導引構件之懸臂型探針卡、以及使用有該種導引構件之半 導體裝置之試驗方法一事，作爲課題。 [用以解決課題之手段] 本發明，係經由提供下述一般之探針導引構件、和具 備有該種探針導引構件的懸臂型之探針卡、以及使用有該 種探針導引構件之半導體裝置之試驗方法，而解決了上述 課題，該探針導體構件，係爲當對於具備有突起狀連接電 極之半導體裝置而使用懸臂型之探針卡來進行試驗時所使 用的探針導引構件，其特徵爲：係具備有導引孔，其係具 備著將在試驗時而與突起狀連接電極作接觸之探針前端部 的移動朝向沿著其之滑動方向的直線方向而作導引之直線 狀的側部，該導引孔，係爲當上述探針導引構件相對於突 起狀連接電極而被定位在使用位置處時，在與從沿著通過 突起狀連接電極之突起頂點的滑動方向之中心線而偏移了 的頂點週邊部相對向的位置處作開口之導引孔。 若依據本發明之探針導體構件，則探針之前端部，由 於係經由導引孔之直線狀的側部而使得其之移動被朝向刮 擦方向作導引，因此，係不會有滑落至突起狀連接電極之 側方的情況，而能夠在探針與連接電極之間恆常地實現安 201124733 定之電性連接。又，若依據本發明之探針導引構件，則當 相對於突起狀連接電極而對於使用位置作定位時，導引孔 ，由於係在與從沿著通過突起狀連接電極之突起頂點的刮 擦方向之中心線而偏離了的頂點週邊部相對向之位置處而 作開口，因此，探針前端部與連接電極之突起頂點作接觸 一事係被防止，而不會有在突起頂點處造成刮擦痕跡的情 形。 本發明之探針導引構件，在其中一種理想實施形態中 ，導引孔，係在沿著通過突起狀連接電極之突起頂點的滑 動方向之中心線的兩側處，而被分別作設置。如此這般， 當在突起狀連接電極之中心線的兩側處而分別設置有導引 孔的情況時，能夠將本發明之探針導引構件合適地使用在 使2根的探針與1個的連接電極作接觸之試驗、例如藉由 凯文接觸所進行之試驗中。 進而，本發明之探針導引構件，在其中一種理想實施 形態中，被分別設置在上述中心線之兩側處的導引孔，係 以使其之上述直線狀的側部之彼此間的間隔隨著試驗時之 探針前端部的朝向滑動方向之先端的移動而逐漸變窄的方 式，而被設置爲八字狀。藉由此，相較於將導引孔的上述 直線狀之側部相互平行地作設置的情況，能夠使2根的探 針與突起狀連接電極之間的電性連接成爲更加安定者。 另外，本發明之作爲對象的半導體裝置，係並不被限 定於上述之BGA，而亦可爲例如CSP (晶片尺寸封裝）、 WLCSP (晶圓尺度CSP )、覆晶晶片等，只要是具備有突 -8 - 201124733 起狀之連接電極的半導體裝置，則不論是何種半導體裝置 均可。 [發明之效果] 若依據本發明，則係能夠在懸臂型之探針與突起狀連 接電極之間而貫現女定的電性連接。又，若依據本發明， 則由於係並不會在身爲檢查對象之半導體裝置的突起狀連 接電極之突起頂點處造成刮擦痕跡，因此，係不會有對於 身爲檢查對象之半導體裝置，而造成像是在其之與安裝品 之間的接合中而會成爲問題的接合強度不足或者是導電量 不足等等的問題之情況。 【實施方式】 以下’使用圖面來對於本發明作詳細說明，但是，當 然的，本發明係不被該些圖示者所限定。 圖1，係爲對於本發明之懸臂型探針卡的其中一例作 展示之剖面圖。於圖中’ 1係爲探針卡，2係爲配線基板 ’ 3係爲補強構件’ 4係爲殼體’ 5係爲頂蓋，6係爲導引 區塊，7係爲探針推壓構件’ 8係爲探針，9係爲試驗品 插入部，1 〇係爲定位用之導引銷。1 1係爲本發明之探針 導引構件，1 2係爲探針導引構件1 1之配向調整螺絲。經 由定位用之導引銷1 〇，殼體4、探針導引構件1 1以及導 引區塊6，係相互被定位在特定之位置處。 圖2’係爲將圖1之重要部分作一部份擴大展示，並 -9- 201124733 且將身爲試驗對象之半導體裝置的一部份一倂作展示之圖 。如圖2中所示一般’在探針導引構件11處，係被設置 有導引孔13。14係爲身爲試驗對象之半導體裝置，15係 爲其之突起狀連接電極。16，係爲探針導引構件11與突 起狀連接電極15之間的對位構件。如圖中所示—般，在 本例之探針卡1中，對於各突起狀連接電極15，係各對 應有2個的探針8以及導引孔13。如此這般，對於1個 的突起狀連接電極15而使2個的導引孔13作了對應之探 針導引構件11’例如’係適合於使用在凯文連接式之探 針卡中，但是，當然的，係並不僅被限定於凱文連接中， 在使2根的探針與1個的突起狀連接電極作接觸並進行通 常之試驗的情況中，係亦可作使用。又，圖中，與最接近 於導引區塊6之突起狀連接電極15相對應的探針8、和 與位置在其之左側處的突起狀連接電極1 5相對應的探針 8，由於兩者間之朝向係偏差有90度，因此，與最接近於 導引區塊6之突起狀連接電極1 5相對應的導引孔1 3、和 與位置在其之左側處的突起狀連接電極1 5相對應的導引 孔13，其朝向亦係偏差有90度，在圖中，係僅對於2個 的導引孔13中之其中1個作展示。 在半導體裝置14之上方，係存在有未圖示之推壓構 件與可動平台，在試驗時，經由此推壓構件與可動平台， 半導體裝置14，係在將其之突起狀連接電極15之位置對 於探針8以及探針導引構件1 1之導引孔1 3而作了定位的 狀態下，被朝向探針卡1而作推壓。當然，亦可讓探針卡 -10- 201124733 1朝向半導體裝置14而移動。 不論如何，在試驗時，探針導引構件11，係爲相對 於半導體裝置14之突起狀連接電極15以及探針8而被作 了定位的狀態，在該被作了定位的狀態下，探針導引構件 1 1之導引孔1 3，係在與從通過各對應之突起狀連接電極 1 5的突起頂點之刮擦方向的中心線而作了偏離的頂點週 邊部相對向的位置處作開口。又，探針8之前端部，係分 別位在將相對應之貫通孔1 3作貫通的位置處。 在圖2中，探針8之前端部，雖然係成爲已將各相對 應之導引孔1 3作了貫通的狀態，但是，探針8，係可在 此狀態下而被對於半導體裝置14之突起狀連接電極相對 性地作推壓並與突起狀連接電極1 5作接觸，亦可於起初 而位置在導引孔13之外，並當半導體裝置14被對於探針 卡〗相對性地作推壓時，而貫通各相對應之導引孔13, 並與突起狀連接電極15作接觸。 探針導引構件1 1，例如，係可藉由聚醯亞胺等之絕 緣性的樹脂薄膜來作成，其之厚度，雖然亦依存於突起狀 連接電極15之大小，但是，通常，係可爲30〜50#m左 右。 圖3，係爲對於探針導引構件1 1之其中一例作展示 之平面圖。如圖中所示一般，在探針導引構件11處，係 於與半導體裝置之突起狀連接電極相對應的位置處，而被 設置有各2個的導引孔13。 圖4，係爲對於突起狀連接電極1 5和與其相對應之 -11 - 201124733 導引孔1 3、1 3以及探針8、8之間的位置關係作展示之圖 。於圖中，箭頭，係代表當探針8、8被施加有過驅動時 而一面與突起狀連接電極15作接觸一面滑動的方向，亦 即是’係代表刮擦方向。如圖中所示一般，導引孔13、 1 3 ’係具備有於刮擦方向上而較長的長孔形狀，導引孔 13、13之刮擦方向的長度，係較探針8、8之前端部的想 定滑動量更長，與刮擦方向相正交之橫方向的寬幅，係以 能夠使探針8之前端部貫通導引孔1 3、1 3的方式，而被 形成爲較探針8、8之前端部附近的直徑更長。 1 7 ’係爲突起狀連接電極1 5之突起頂點，C，係爲沿 著通過突起頂點1 7之刮擦方向的中心線。如圖4中所示 —般’導引孔1 3、1 3 ’係並未在此中心線C上作開口， 而是在挾持中心線C的兩側處，在與從中心線C而偏離 了的突起頂點7之週邊部相對向的位置處作開口。故而， 被插通於導引孔13、13內之探針8、8的前端部，係並不 會有與突起頂點1 7相接觸的情況，而不會在突起頂點1 7 處造成刮擦痕跡。 1 8 ’係爲導引孔1 3之直線狀的側部。側部1 8，由於 係與刮擦方向相平行，因此，探針8之前端部，係經由此 側部1 8而使其之移動被導引至沿著刮擦方向之直線方向 上。藉由此，探針8之前端部，係不會有從突起狀連接電 極15而滑落的情況，而兩者間之安定的電性連接係被實 現。另外，在圖4中，雖係於導引孔1 3之左右兩側處而 被設置有直線狀之側部1 8，但是，探針8之前端部，由 -12- 201124733 於通常係沿著突起狀連接電極1 5之表面的傾斜，而朝向 從中心線C而遠離之外側方向作滑動，因此，直線狀之側 部1 8 ’係亦可僅設置在從導引孔】3之中心線C而遠離之 單側處。 圖5 ’係爲對於探針導引構件1 1之另外一例作展示 之圖。在此圖之探針導引構件1 1中，係與圖4之例相同 的’與1個的突起狀連接電極1 5相對應地而分別在中心 線之兩側處被設置有2個的導引孔1 3、1 3，但是，該些 之2個的導引孔1 3、1 3，係以使其之直線狀之側部1 8 ' 1 8彼此間的間隔隨著朝向以箭頭所示之刮擦方向的前端 前進而逐漸地變窄的方式，而被設置爲八字型。當使探針 8之前端部的移動經由此種導引孔1 3的直線狀之側部1 8 而被作導引的情況時，當探針8之前端部與突起狀連接電 極15之表面作接觸並滑動時，由於係被朝向爬上突起狀 連接電極1 5之傾斜表面的方向而被作導引，因此，探針 8之前端部與突起狀連接電極1 5之間的接觸壓係變高， 而能夠實現更加安定之電性連接。 圖6，係爲對於探針導引構件U之又一其他例作展 示之圖，並爲當對於1個的突起狀連接電極而使1根的探 針作接觸而進行試驗時所使用的探針導引構件。如圖中所 示一般，導引孔13，係與1個的突起狀連接電極15相對 應地，而在與從其之中心線C而偏移了的頂點週邊部相對 向之位置處僅被設置有1個。另外，在本例之探針導引構 件1 1中，當然的，導引孔13，係同樣的具備有將探針8 -13- 201124733 之前端部的移動朝向沿著其之刮擦方向的直線方向而作導 引之直線狀的側部18。 當使用上述一般之探針導引構件11而進行半導體裝 置之電性特性的試驗時，係使探針導引構件1 1中介存在 於探針8與身爲試驗對象之半導體裝置之間，並使探針8 之前端部貫通探針導引構件11之導引孔13而與突起狀連 接電極15作接觸，除此之外，只要與通常之試驗方法同 樣地來進行即可。若依據本發明之試驗方法，則係一面將 懸臂型探針之前端部使其之移動朝向刮擦方向來直線性地 作導引，一面使該探針與突起狀連接電極之從沿著通過突 起頂點之刮擦方向的中心線而偏離了的頂點週邊部作接觸 ，而進行具備有突起狀連接電極之半導體裝置之電性試驗 。另外，探針導引構件1 1，係可被組入至探針卡1中， 亦可與探針卡1分開地而被安裝在試驗裝置上。 [產業上之利用可能性] 若依據本發明之探針導引構件及具備有其之探針卡以 及本發明之試驗方法，則由於係能夠將具備有突起狀連接 電極之半導體裝置的電性特性試驗更加安定且確實地來進 行，因此，對於半導體裝置之信賴性的提升，係有著極大 的幫助，不僅是在製造半導體裝置之產業中，就算是在對 於半導體裝置作利用之其他的產業領域中，亦具備有極大 的可利用性。 -14 - 201124733 【圖式簡單說明】 [圖1 ]對於本發明之懸臂型探針卡的其中一例作展示 之剖面圖。 [圖2]將圖1之重要部分作一部份擴大展示之圖。 [匱I 3 ]對於探針導引構件之其中一例作展示之平面圖 〇 [圖4]對於突起狀連接電極、導引孔以及探針之間的 位置關係作展示之圖。 [圖5]對於探針導引構件之另外一例作展示之圖。 [圖6]對於探針導引構件之又另外一例作展示之平面 圖。 【主要元件符號說明】 1 :探針卡 2 :配線基板 3 :補強構件 4 :殼體 5 :頂蓋 6 :導引區塊 7 :探針推壓構件 8 :探針 9 :試驗品插入部 10 :定位用導引銷 1 1 :探針導引構件 -15- 201124733 1 2 :配向調整螺絲 13 :導引構件 1 4 :半導體裝置 1 5 :突起狀連接電極 1 6 :對位構件 1 7 :突起頂點 1 8 :直線狀之側部 C ·中屯、線BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe guiding member used in testing of a semiconductor device, a probe card provided therewith, and a semiconductor device using the same Test method. [Prior Art] In the test of the electrical characteristics of a semiconductor device such as a BGA (ball grid matrix) having a bump-like connection electrode called a bump, it is used in the prior art from the prior art. A vertical type probe in which the connection electrodes are vertically contacted is the mainstream, but when the pitch of the connection electrodes is small, or when it is necessary to perform a Kevin connection, it is necessary to make two at the connection electrodes. When the probe is in contact with the probe or the like, since the vertical probe system cannot be used for correspondence, it has recently been carried out using a cantilever type probe. However, the 'spiral-arm type probe' mounts the probe because it is only a single-ended support. Therefore, the front end portion is easy to move, especially when it is in contact with the protruding connection electrode. Although it also depends on it. The contact part 'but' has the problem that the front end of the probe slides off from the protruding connection pole and becomes a stable electrical connection. In order to solve this problem, for example, in Patent Document 1, it is proposed to arrange a planar size including a connection electrode having a protrusion shape between a semiconductor device to be inspected and a probe card having a probe. The probe of the through hole of the diameter below and larger than the size of the front end of the probe is -5, 2011, 24,733. However, since the through hole of the guide member proposed in Patent Document 1 is a circular through hole that is slightly open to the protruding connection electrode, the front end portion of the probe is not necessarily fixed. There is a case where the direction of the wiping direction when the through hole is driven through the through hole is controlled, and the side hole is slid in the range permitted by the through hole, so that it is difficult to obtain a stable electrical connection. Disadvantages. Further, since the through hole proposed in Patent Document 1 is generally opened as described above with respect to the protruding connection electrode including the apex of the protrusion, the tip end of the probe is inserted into the through hole. Inside and in contact with the connecting electrode, there are cases where the front end of the probe comes into contact with the apex of the connecting electrode and causes a scratch on the apex of the protrusion. The apex of the protrusion of the protruding connection electrode is the center of the portion of the joint between the electrode and the mounting member to be mounted, and if there is a scratch mark there, the portion becomes the fusion at the time of the subsequent fusion. The voids remain and remain, which may cause insufficient bonding strength or insufficient conductivity. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] JP-A-2004-3 3 56 1 3 [Invention] [Problems to be Solved by the Invention] -6 - 201124733 The present invention is to solve the above The disadvantages of the prior art have been made to provide a stable electrical connection between the cantilever type probe and the protruding connecting electrode and do not impart scratch marks to the protruding apex of the protruding connecting electrode. A probe guiding member, a cantilever type probe card having such a guiding member, and a test method using a semiconductor device having such a guiding member are a problem. [Means for Solving the Problems] The present invention provides a general probe guiding member, a cantilever type probe card provided with the probe guiding member, and a probe guide The above-described problem is solved by a test method for a semiconductor device of a lead member which is used for testing a cantilever type probe card for a semiconductor device including a bump-shaped connection electrode. The needle guiding member is characterized in that it has a guiding hole provided with a movement of a distal end portion of the probe which is in contact with the protruding connecting electrode during the test, and a linear direction along a sliding direction thereof a linear side portion for guiding the guide hole when the probe guiding member is positioned at the use position with respect to the protruding connecting electrode A guide hole for opening is formed at a position where the peripheral portion of the apex of the protrusion is offset from the center line of the sliding direction of the apex of the protrusion. According to the probe conductor member of the present invention, since the front end portion of the probe is guided by the linear side portion of the guide hole so as to be guided toward the wiping direction, there is no slippage. In the case of the side of the protruding connection electrode, it is possible to constantly realize the electrical connection of the security of 201124733 between the probe and the connection electrode. Further, according to the probe guiding member of the present invention, when the position is used for positioning with respect to the protruding connecting electrode, the guiding hole is scraped due to the apex of the projection from the projection electrode. The center line of the rubbing direction is offset from the position of the peripheral portion of the vertex which is deviated from the center of the apex, so that the front end portion of the probe is prevented from coming into contact with the apex of the connecting electrode, and the scraping is not caused at the apex of the protrusion. The situation of rubbing the traces. In the probe guiding member of the present invention, in one preferred embodiment, the guide holes are provided at both sides of the center line along the sliding direction of the projection apex passing through the projecting connecting electrodes. In this way, when the guide holes are respectively provided at both sides of the center line of the projecting connecting electrodes, the probe guiding member of the present invention can be suitably used in making the probes of 2 and 1 The connecting electrodes are tested for contact, for example, by Kevin contact. Further, in the probe guiding member of the present invention, in one preferred embodiment, the guide holes respectively provided at both sides of the center line are such that the linear side portions thereof are located between each other The interval is gradually increased as the tip end portion of the probe is gradually narrowed toward the sliding direction of the sliding direction, and is provided in a figure-eight shape. Thereby, the electrical connection between the two probes and the protruding connection electrodes can be made more stable than when the linear side portions of the guide holes are arranged in parallel with each other. Further, the semiconductor device to which the present invention is applied is not limited to the above-described BGA, and may be, for example, a CSP (Chip Size Package), a WLCSP (Wafer Scale CSP), a flip chip, or the like, as long as it is provided.突-8 - 201124733 The semiconductor device that connects the electrodes can be used regardless of the semiconductor device. [Effects of the Invention] According to the present invention, it is possible to realize a female electrical connection between a cantilever type probe and a protruding connection electrode. Moreover, according to the present invention, since the scratches are not caused at the apex of the protrusion of the protruding connection electrode of the semiconductor device to be inspected, there is no possibility for the semiconductor device to be inspected. This causes a problem that the joint strength is insufficient or the amount of electric conductivity is insufficient, such as in the joint between the mount and the mount. [Embodiment] The present invention will be described in detail below using the drawings, but it is to be understood that the invention is not limited by the figures. Fig. 1 is a cross-sectional view showing an example of a cantilever type probe card of the present invention. In the figure, '1 is a probe card, 2 is a wiring board' 3 is a reinforcing member '4 is a housing' 5 is a top cover, 6 is a guiding block, and 7 is a probe pushing The member '8 is a probe, the 9 is a test piece insertion part, and the 1 part is a guide pin for positioning. 1 1 is the probe guiding member of the present invention, and 12 is the alignment adjusting screw of the probe guiding member 1 1 . The housing 4, the probe guiding member 1 1 and the guiding block 6 are positioned at specific positions with each other by the guiding pin 1 for positioning. Fig. 2' is an enlarged view showing an important part of Fig. 1, and -9-201124733, and a part of a semiconductor device as a test object is shown. As shown in Fig. 2, generally, at the probe guiding member 11, guide holes 13 are provided. 14 is a semiconductor device which is a test object, and 15 is a projecting connection electrode thereof. 16 is an alignment member between the probe guiding member 11 and the protruding connecting electrode 15. As shown in the figure, in the probe card 1 of the present embodiment, two probes 8 and guide holes 13 are provided for each of the projecting connecting electrodes 15. In this manner, the probe guiding members 11' are, for example, suitable for use in the Kevin-connected probe card, for the one protruding connection electrode 15 and the two guiding holes 13 corresponding to each other. However, of course, it is not limited to the Kevin connection, and it is also possible to use two probes in contact with one of the protruding connection electrodes and perform a normal test. Further, in the figure, the probe 8 corresponding to the projecting connection electrode 15 closest to the guide block 6 and the probe 8 corresponding to the projecting connection electrode 15 positioned at the left side thereof are The orientation deviation between the two is 90 degrees, and therefore, the guide hole 13 corresponding to the protruding connection electrode 15 closest to the guide block 6 and the protrusion-like connection at the left side of the position The guiding holes 13 corresponding to the electrodes 15 are also oriented with a deviation of 90 degrees. In the figure, only one of the two guiding holes 13 is shown. Above the semiconductor device 14, there are a pressing member and a movable stage (not shown). At the time of the test, the pressing member and the movable stage are connected to the semiconductor device 14 by the position of the protruding connecting electrode 15 In the state in which the probe 8 and the guide hole 13 of the probe guiding member 1 are positioned, they are pressed toward the probe card 1. Of course, the probe card -10- 201124733 1 can also be moved toward the semiconductor device 14. In any case, during the test, the probe guiding member 11 is in a state of being positioned with respect to the protruding connecting electrode 15 of the semiconductor device 14 and the probe 8, and in the state in which the positioning is performed, The guide hole 13 of the needle guiding member 1 is at a position opposed to the peripheral portion of the apex which is deviated from the center line of the wiping direction of the projection apex passing through the corresponding protruding connecting electrode 15 Make an opening. Further, the front end portions of the probes 8 are located at positions where the corresponding through holes 13 are passed through. In FIG. 2, the front end portion of the probe 8 is in a state in which the corresponding guide holes 13 have been penetrated, but the probe 8 can be used in this state for the semiconductor device 14. The protruding connecting electrode is relatively pressed and brought into contact with the protruding connecting electrode 15 or may be positioned outside the guiding hole 13 at the beginning, and when the semiconductor device 14 is relatively opposite to the probe card When the pressing is performed, the corresponding guiding holes 13 are passed through and brought into contact with the protruding connecting electrodes 15. The probe guiding member 1 1 can be formed, for example, by an insulating resin film such as polyimide or the like, and the thickness thereof depends on the size of the protruding connecting electrode 15, but usually, It is around 30~50#m. Fig. 3 is a plan view showing an example of the probe guiding member 1 1. Generally, as shown in the figure, at the probe guiding member 11, at a position corresponding to the projecting connecting electrode of the semiconductor device, two guiding holes 13 are provided. Fig. 4 is a view showing the positional relationship between the projecting connecting electrode 15 and its corresponding -11 - 201124733 guiding holes 13 and 13 and the probes 8, 8. In the figure, the arrow indicates the direction in which the probes 8, 8 are slid while being in contact with the projecting connecting electrode 15 when the overdrive is applied, that is, the 'system' represents the wiping direction. As shown in the figure, the guide holes 13, 13' are generally provided with a long hole shape which is long in the wiping direction, and the length of the guide holes 13 and 13 in the wiping direction is compared with the probe 8. The desired amount of sliding of the end portion of the front end portion of 8 is longer, and the width in the lateral direction orthogonal to the wiping direction is formed so that the front end portion of the probe 8 can pass through the guide holes 13 and 13 It is longer than the diameter near the front end of the probes 8, 8. 1 7 ' is the protrusion apex of the protruding connection electrode 15 , and C is the center line along the wiping direction passing through the apex of the protrusion 17 . As shown in FIG. 4, the 'guide holes 1 3, 1 3 ' are not open on the center line C, but are offset from the center line C at both sides of the center line C. An opening is formed at a position where the peripheral portion of the protrusion apex 7 is opposed to each other. Therefore, the front end portions of the probes 8, 8 inserted into the guide holes 13, 13 are not in contact with the apex 17 of the protrusion, and do not cause scratching at the apex 17 of the protrusion. trace. 1 8 ' is a linear side portion of the guide hole 13 . Since the side portion 18 is parallel to the wiping direction, the front end portion of the probe 8 is guided by the side portion 18 to be guided in a straight line direction along the wiping direction. Thereby, the front end portion of the probe 8 does not slip from the protruding connection electrode 15, and the stable electrical connection between the two is realized. In addition, in FIG. 4, the linear side portion 1 is provided at the left and right sides of the guide hole 13, but the front end of the probe 8 is -12-201124733 for the usual edge. The inclination of the surface of the protruding connection electrode 15 is slid away from the center line C and away from the outer side. Therefore, the linear side portion 18' can also be disposed only at the center of the guide hole 3 Line C is far from the one side. Fig. 5' is a view showing another example of the probe guiding member 1 1. In the probe guiding member 1 1 of this drawing, the same as the example of FIG. 4 is provided with two of the two sides of the center line corresponding to one of the protruding connecting electrodes 15 . The guide holes 13 3, 1 3, but the two guide holes 13 3, 1 3 are arranged such that the linear portions thereof are spaced apart from each other by an arrow 18 8 The front end of the wiping direction shown is gradually narrowed, and is set to a figure-eight shape. When the movement of the front end portion of the probe 8 is guided via the linear side portion 18 of the guide hole 13, the front end portion of the probe 8 and the surface of the protruding connection electrode 15 are used. When contacting and sliding, since it is guided toward the direction in which the inclined surface of the protruding connecting electrode 15 is climbed, the contact pressure between the front end portion of the probe 8 and the protruding connecting electrode 15 It becomes higher and can achieve a more stable electrical connection. Fig. 6 is a view showing still another example of the probe guiding member U, and is used for testing when one probe is brought into contact with one protruding connecting electrode. Needle guiding member. As shown in the drawing, the guide hole 13 is corresponding to one of the projecting connecting electrodes 15 and is located only at a position opposite to the peripheral portion of the apex which is offset from the center line C thereof. There is one setting. Further, in the probe guiding member 1 1 of the present embodiment, of course, the guiding hole 13 is similarly provided with the movement of the front end portion of the probe 8-13-201124733 toward the wiping direction thereof. A linear side portion 18 that guides in a straight line direction. When the electrical characteristics of the semiconductor device are tested using the above-described general probe guiding member 11, the probe guiding member 1 is interposed between the probe 8 and the semiconductor device under test, and The front end of the probe 8 may be passed through the guide hole 13 of the probe guiding member 11 to make contact with the protruding connecting electrode 15, and the same may be carried out in the same manner as in the usual test method. According to the test method of the present invention, the front end of the cantilever type probe is linearly guided while moving toward the wiping direction, and the probe and the protruding connecting electrode are passed along. The center line of the rubbing direction of the apex of the protrusion was brought into contact with the peripheral portion of the apex which deviated from the apex of the protrusion, and an electrical test of the semiconductor device having the protruding connection electrode was performed. Further, the probe guiding member 1 1 can be incorporated into the probe card 1 or can be mounted on the test device separately from the probe card 1. [Industrial Applicability] According to the probe guiding member of the present invention, the probe card provided therewith, and the test method of the present invention, it is possible to electrically connect the semiconductor device having the protruding connection electrode Since the characteristic test is performed more stably and surely, it is extremely helpful for the reliability of the semiconductor device to be improved, not only in the industry for manufacturing semiconductor devices, but also in other industrial fields that are utilized for semiconductor devices. It also has great availability. -14 - 201124733 BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] A cross-sectional view showing an example of a cantilever type probe card of the present invention. [Fig. 2] A diagram showing an enlarged part of the important part of Fig. 1. [匮I 3 ] A plan view showing one example of the probe guiding member 〇 [Fig. 4] A view showing a positional relationship between the protruding connecting electrode, the guiding hole, and the probe. Fig. 5 is a view showing another example of the probe guiding member. Fig. 6 is a plan view showing another example of the probe guiding member. [Description of main component symbols] 1 : Probe card 2 : Wiring board 3 : Reinforcing member 4 : Case 5 : Top cover 6 : Guide block 7 : Probe pressing member 8 : Probe 9 : Test piece insertion portion 10 : positioning guide pin 1 1 : probe guiding member -15- 201124733 1 2 : alignment adjusting screw 13 : guiding member 1 4 : semiconductor device 1 5 : protruding connecting electrode 1 6 : aligning member 1 7 : Protrusion apex 1 8 : Straight side C · Middle 屯, line