TW201124022A - Method of manufacturing multi-layer circuit board and its structure thereof. - Google Patents
Method of manufacturing multi-layer circuit board and its structure thereof. Download PDFInfo
- Publication number
- TW201124022A TW201124022A TW98144866A TW98144866A TW201124022A TW 201124022 A TW201124022 A TW 201124022A TW 98144866 A TW98144866 A TW 98144866A TW 98144866 A TW98144866 A TW 98144866A TW 201124022 A TW201124022 A TW 201124022A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- signal
- hole
- ground
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 238000012360 testing method Methods 0.000 claims abstract description 50
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 120
- 239000004020 conductor Substances 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98144866A TW201124022A (en) | 2009-12-24 | 2009-12-24 | Method of manufacturing multi-layer circuit board and its structure thereof. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98144866A TW201124022A (en) | 2009-12-24 | 2009-12-24 | Method of manufacturing multi-layer circuit board and its structure thereof. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201124022A true TW201124022A (en) | 2011-07-01 |
| TWI382801B TWI382801B (enExample) | 2013-01-11 |
Family
ID=45046938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98144866A TW201124022A (en) | 2009-12-24 | 2009-12-24 | Method of manufacturing multi-layer circuit board and its structure thereof. |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201124022A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI461698B (zh) * | 2010-09-30 | 2014-11-21 | Mpi Corp | Probe unit and its making method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200908850A (en) * | 2007-08-10 | 2009-02-16 | Microelectonics Technology Inc | Multilayer circuit board |
-
2009
- 2009-12-24 TW TW98144866A patent/TW201124022A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI461698B (zh) * | 2010-09-30 | 2014-11-21 | Mpi Corp | Probe unit and its making method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI382801B (enExample) | 2013-01-11 |
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