201121670 六、發明說明： 【發明所屬之技術領域】 本發明是關於利用金屬介質的超聲波幹式清洗機，具 體地說，就是關於對基板進行幹式清洗時，通過破壞以一 定的速度移動的基板上所形成的、具有25 μηι厚度的邊界層 ’以消除其領域內基板上所附著的非黏著性異物質的，利 用金屬介質的超聲波幹式清洗機的。 【先前技術】 PDP，LCD，AMOLED等顯示幕（Display)用玻璃基 板或膠片（Film)或半導體幹膠片等的表面，應該通過清 洗，維持其表面沒有異物質的狀態。如果以表面存在異物 質的狀態，進行加工，那麼，最終產品上，就會發生缺陷 ’從而生產出不良品，最後導致生產收穫（得）率下降。 清洗方法，大體上可分爲濕式清洗（Wet Cleaning) 和幹式清洗（DryCeaning)等兩種方法。 上述的所謂濕式清洗（W e t C 1 e a n i n g )，是指依此經 過有機清洗、純水清洗、無機清洗、乾燥階段，將如同黏 著性物質油污、膠帶（Tape )痕跡、手油漬等以有機黏合 劑相連接的無機物等，用非接觸性方法，切斷有機黏合劑 ’從而變成無機物化的清洗方法。這樣的有機清洗方法的 種類，有EUV、AP Plasma (上壓Plasma)、低溫UV清洗 等。雖然’ EUV及UV清洗方法的技術成熟而穩定，但是， 在清洗最近的大型玻璃（Glass )、或清洗短的TAT方面， 201121670 卻表現爲技術有限。 尤其，高輸出（功率）EUV的情況下，由於其壽命只 有1 000小時（Hr)，因此，燈（Lamp)更換費用比較大。 真空等離子體（Plasma)主要用於半導體中，一部分使用 於幹式蝕刻（Dry Etch )前、後，但是，以清洗目的，使 用於FPD上等事情，幾乎沒有。AP等離子（AP Plasma) ，使用於不是以清洗爲目的，而是以有助於清洗爲目的而 使用。由於，清除所形成的臭氧（〇3)，需要大容量的排 氣管（Exhaust)，又因爲氮氣（N2)、氦氣（Helium) 、清潔乾燥空氣CD A ( Clean Dry Air )等的持續性消耗， 以及產品（Utility )的大型化、陰極管（cathode)壽命短 等原因，空間及維修保養（Maintenance)等，將會受制約 的。 另外，上述所謂的幹式清洗，是指經過有機清洗及無 機清洗而完成清洗的，是把如同非黏著性異物質的灰塵的 無機物，用非接觸性方法，進行浮游化後，清洗的方法。 這樣的無機清洗方法的種類，有滾刷（Roll brush)、噴 水式（Water jet)、噴泡沫式（Bubble jet)、氣刀（Air knife)、以及使用超聲波清洗機的方法等。 —方面，PDP、LCD、AMOLED等顯示幕用玻璃基板 或膠片（Film)或半導體體幹膠片（wafer:晶圓）等，結 束有機清洗後，在維持其清潔狀態的清潔房（Clean Room )內部的匣子（Cassette )裏，累積成多層，進行保管。 在這樣進行保管時，隨著在匣子（Cassette )內部保管時 -6 - 201121670 間的經過，就會發生清潔房內部所存在的浮游性異物質（ 例如，如同玻璃粉等因其重量而降落到基板上的非黏著性 物質或頭屑、灰塵等浮游物質），重新降落到基板上的問 題。如果發生這樣的問題，那麼，爲了製造上述PDP、 LCD、AMOLED等顯示幕（Display )用玻璃基板或半導體 膠片（Wafer )晶圓），而進行基板的露光、真空蒸鍍膜 、濺（Spattering)時，會出現缺陷（Defect)，從而導致 嚴重的質量問題，因此，一般使用幹式清洗機（Dry Cleaner)，進行幹式清洗。 根據這樣的目的使用的，從前的幹式清洗機，有如同 上述的有滾刷（Roll brush )、噴水式（Water jet )、噴 泡沫式（Bubble jet )、氣刀（Air knife )、以及超聲波 清洗機等。 其中，氣刀（Air knife )，只能消除在基板上所形成 的因流體而形成的油膜，即，在邊界層上的厚度25 μπι以上 的異物質。它不能消除厚度2 5 μηι以下的物質的原因是，氣 刀（Air knife )的壓縮空氣，不能消除25μιη以內的油膜（ 邊界層）。因此，邊界層內部所存在的3μηι程度的非黏著 性異物質，當基板以一定速度移動時，與基板相接觸的流 體，不能破壞隨著基板的阻抗而形成的油膜（邊界層）。 因此，不能清洗。 爲解決像這樣的從前的接觸式幹式清洗裝置所存在的 問題’而誕生的清洗機，就是通過破壞邊界層（油膜）， 來消除其內部所存在的異物質的，超聲波幹式清洗機。 201121670 這樣的超聲波幹式清洗機的構成’是由位於一般超聲 波清洗機的前、後端的電離裝置（I〇nizer)、具有被加振 的超聲波的壓縮空氣手段（Pressure Air)、以及真空吸 入（Vacuum Suction)手段等構成，來消除附著於基板上 的異物質。電離裝置在基板上面，中和靠靜電作用帶電成 (+)正離子或（-)負離子的異物質，使其失去黏合力， 具有被加振的超聲波的壓縮空氣（Pressure Air )手段， 通過破壞邊界層，使存在於其中的被中和狀態的異物質浮 游，那麼，真空吸入（Vacuum Suction)手段，就吸入浮 游的異物質。 上述超聲波清洗機的超聲波發生原理，有利用超聲波 感測器的方法和利用銳孔流速管和口袋（Orifice Tube& pocket )的方法。利用超聲波感測器[陶瓷壓電元件（ Piezoelectric element)]的專利有專利申請人，Huggle和 Apros等專利。利用銳孔流速管和口袋（Orifice Tube& pocket )，來產生超聲波的專利，有專利申請人Shinkko的 專利。 但是，從前的超聲波發生手段中，根據Shinkko的專 利，依靠物理性結構（皺紋管）所發生，並被加振的超聲 波，只能產生14〜20KHz的超聲波，因此，要消除上述的 邊界層，還遠遠不夠，其結構上存在這一些問題。 另外，Huggle和Apros等專利，是以壓縮空氣爲介質 ，依靠共振，把超聲波感測器的被加振的頻率傳輸到基板 上，並把浮游的異物質，進行真空吸入的結構所構成的。 -8- 201121670 即，如同Huggle和Apros的超聲波發生原理，是把空 氣使用爲超聲波發生介質，來傳達超聲波頻率，從而產生 超聲波振動子的加振力，只不過是14〜20KHz的超聲波而 已，因此，完全消除上述的邊界層，也是遠不夠的，其結 構上也存在這一些問題。 當然，也許會認爲，如果使用更大的超聲波的加振子 頻率，就能解決上述從前的超聲波清洗機的問題似的，但 是，實際上，即使超聲波加振子的頻率大，由於因空氣介 質的衰減效果，傳輸到基板上的超聲波的加振力，也並不 加大，因此，這也存在著不能破壞基板上所形成的邊界層 的結構性問題。 即，從前的超聲波幹式清洗機，都存在著不能消除 2 5 μιη以內的油膜邊界層的結構性問題，因此，不能完全消 除基板上蒸著的非黏著性異物質，所以，最終產品上’會 出現缺陷，從而導致收穫（得）率降低等存在著以上的問 題。 因此，迫切需要能夠破壞25μΓη的油膜（邊界層）’來 消除存在於其中的、具有1〜3μηι程度大小的異物質的超聲 波幹式清洗機的必要性。但是，至今還沒有人能夠提供完 全能夠消除這些的超聲波幹式清洗機’這也是實際情況。 【發明內容】 需解決的課題 爲了解決上述問題，本發明的目的在於提供，當對清 "9 - 201121670 洗物件物質（PDP，LCD，AMOLED等的顯示幕用（ display )玻璃基板，或膠片（Film )或半導體幹膠片）， 進行幹式清洗時，通過破壞以一定速度移動的基板上所形 成的具有25μιη厚度的邊界層（Boundary layer)，消除其 領域內基板上所附著的非黏著性異物質的，超聲波幹式清 洗機。 本發明的另外目的在於提供，利用金屬介質，產生20 〜4〇KHz的超聲波，當對清洗物件物質進行幹式清洗時， 能夠破壞以一定速度移動的基板上所形成的、具有25 μηι厚 度的邊界層（Boundary layer)，從而消除其領域內基板 上所附著的非黏著性異物質的超聲波幹式清洗機。 本發明的另外一個目的在於提供，爲了使從超聲波加 振子產生的超聲波，在維持其加振力的狀態下，集中於清 洗物件物質或者產品上，而利用金屬介質。但是，爲了使 通過金屬介質的超聲波的加振力集中及降低從超聲波加振 子所產生的超聲波噪音，而形成槽子（groove )的超聲波 幹式清洗機。 本發明的另一個目的在於提供，爲了使從超聲波加振 子所產生的超聲波，在不發生噪音的情況下，維持其加振 力，並一這種狀態，集中於清洗物件物質或者產品中，來 傳輸的金屬介質構成的，具有犄角結構的超聲波幹式清洗 機。 課題解決手段 -10- 201121670 爲了達到上述目的及解決從前的缺陷，而執行的課題 的本發明，是通過提供如下結構構成的利用金屬介質的超 聲波清洗機，來達到其目的的。g卩，在包含壓縮空氣排出 部、真空吸入部、超聲波加振子及中和帶電異物質的電離 裝置等構成的超聲波幹式清洗機中，發生超聲波的超聲波 加振子；與超聲波加振子與面相接觸，來加振超聲波後， 傳輸給清洗物件物質的金屬介質支架犄角；在金屬介質支 架犄角內部安裝的金屬介質支架；分別形成於金屬介質支 架（7)上，衰減超聲波傳輸的頻率傳輸切斷槽；形成於 金屬介質所構成的空間部，並位於下部的、通過壓縮空氣 排氣孔，排出壓縮空氣的壓縮空氣排出部；在上述金屬介 質支架犄角和金屬介質支架所形成的兩側空間部形成並位 於其下部的、通過真空吸入口吸入浮游的非黏著形異物質 的真空吸入部；安裝在上述金屬介質支架的兩側，並與金 屬介質支架的兩側相隔一定的距離，來中和清洗物件物質 中帶電的異物質的電離裝置等，結構所構成，來破壞在清 洗物件物質中所形成的邊界層，從而把清洗物件物質內部 所存在的異物質清洗掉爲特徵的利用金屬介質的超聲波幹 式清洗機。通過提供以上的清洗機，來達到上述的目的。 另外，上述金屬介質支架犄角是以上部寬，下部窄的 結構構成的，而且內部結構形成爲空的，因此，能夠使從 超聲波加振子發生的超聲波，在下部集中後，與壓縮空氣 一起排出爲特徵的。 另外，上述頻率傳輸切斷槽，分別形成於位於金屬介 -11 - 201121670 質支架犄角的側方向的金屬介質支架的上部面上，來衰減 通過超聲波加振子所發生的側面方向的超聲波傳輸，並降 低噪音爲特徵的。 另外，上述頻率傳輸切斷槽，使以2個以上的多層形 成爲特徵的。 另外，上述超聲波加振子，以能夠產生20〜40KHz的 超聲波爲特徵的。 另外，上述邊界層的厚度爲25 μηι爲特徵的。 另外，上述金屬介質是以鋁爲特徵的。 另外，把利用上述金屬介質的超聲波幹式清洗機作爲 單位清洗機，在一個方向連接多數個單位清洗機，並把它 們聯動起來，以清洗清洗物件物質爲特徵的。 另外，上述清洗物件物質是從PDP用玻璃基板、LCD 用玻璃基板、AMOLED用玻璃基板、膠片（Film )、半導 體幹膠片中，任意選擇一種爲特徵的。 本發明的另外實施形態爲如下；在包含，發生超聲波 的超聲波加振子；與超聲波加振子與面相接觸，來加振超 聲波後，傳輸給清洗物件物質的金屬介質犄角；在內部安 裝金屬介質犄角的金屬介質支架犄角；在內部安裝金屬介 質支架犄角的金屬介質支架；形成於金屬介質支架犄角所 構成的空間部’並位於下部的、通過壓縮空氣排氣孔，排 出壓縮空氣的壓縮空氣排出部；在上述金屬介質支架犄角 和金屬介質支架所形成的兩側空間部形成並位於其下部的 、通過真空吸入口吸入浮游的非黏著形異物質的真空吸入 -12- 201121670 部；安裝在上述金屬介質支架的兩側，並與金屬介質支架 的兩側相隔一定的距離，來中和清洗物件物質中帶電的異 物質的電離裝置等結構所構成，來破壞在清洗物件物質中 所形成的邊界層，從而把清洗物件物質內部所存在的異物 質清洗掉爲特徵的，利用金屬介質的超聲波幹式清洗機。 通過提供以上的清洗機，來達到上述的目的。 另外，上述金屬介質犄角是以上部寬，下部窄的結構 構成的金屬介質爲特徵的。 另外，上述的超聲波加振子是以產生2〇〜4〇khz的超 聲波爲特徵的。 另外，上述清洗物件物質是從PDP用玻璃基板、LCD 用玻璃基板、AMO LED用玻璃基板、膠片（Film )、半導 體幹膠片中，任意選擇一種爲特徵的。 刪除 效果 本發明具有對清洗物件物質[PDP ’ LCD，AM Ο LED等 的顯示幕用玻璃基板或者膠片（Film )或者半導體幹膠片 (W af er )]，進行幹式清洗時，破壞以一定的速度移動的 基板上所形成的、具有25μηι厚度的邊界層（Boundary layer )，來消除其領域內基板上所附著的非黏性異物質的 優點。 另外，具有對上述清洗物件物質，進行幹式清洗時， 破壞以一定的速度移動的基板上所形成的 '具有25 μΐΏ厚度 -13- 201121670 的邊界層（Boundary layer )，來消除其領域內基板上所 附著的非黏性異物質的優點。 另外，通過利用作爲傳輸超聲波的介質的金屬介質， 來產生20〜4〇KHz的超聲波，對清洗物件物質，進行幹式 清洗時，破壞以一定的速度移動的基板上所形成的、具有 25μιη厚度的邊界層（Boundary layer)，來消除其領域內 基板上所附著的非黏性異物質的優點。 另外’利用金屬介質，使從超聲波加振子產生的超聲 波，以維持加振力的狀態，集中於清洗物件物質或產品上 。因此’通過金屬介質的超聲波的加振力集中，通過形成 槽（groove )，來衰減從超聲波加振子產生的超聲波噪音 。具有以上的優點。 另外，通過配置由金屬介質構成的犄角結構來衰減， 從而達到了在不發生從超聲波加振子產生的超聲波噪音的 情況下，以維持其加振力的狀態，集中並傳輸於清洗物件 物質或產品中的目的。具有以上的優點。因此，該發明是 有名的發明，將能夠廣泛利用於產業界的發明。 【實施方式】 爲實施發明的具體內容 下面利用附加的圖紙，把本發明的實施例子的構成及 其作用，詳細說明如下。另外，在說明本發明的過程中， 如果判斷爲有關公知功能或構成的具體說明，不必要地模 糊本發明的綱要時，就會省略其詳細說明的。 -14- 201121670 匱I 1是顯示根據本發明的實施例子的利用金屬介 超聲波幹式清洗機的截面圖。如圖所示，根據本發明 位超聲波幹式清洗機（頭Head)，如同—般的超聲波 清洗機’是由把壓縮空氣排出到基板上面的排出結構 空吸入結構、發生超聲波的超聲波加振子極爲中和在 上帶電成（+)正離子和（-)負離子的異物質的電離 結構等構成的。 本發明是，利用了 20〜40KHz的超聲波，來加振 介質支架犄角（Horn )，其加振縱潑或橫波被載入到 介質中傳輸，超聲波以空氣爲介質，傳輸到最終目標 洗物件物質（例如，PDP，LCD，AMOLED等顯示幕 璃基板或者膠片（Film )或者半導體幹膠片，以下簡 “基板”）中，並消除基板上的異物質的方法。即，通 振來破壞’以20KHz以上的頻率移動的基板或膠片（ )上形成的厚度25 μηι程度的邊界層，利用電離裝置， 在其下面所存在的3 μ m程度的非黏著性異物質，然後 用壓縮空氣，把異物質進行浮游化，在另外一側，進 空吸入’從而消除異物質的結構。另外，爲了使因共 產生的噪音極小化，把金屬介質的外部側面部，加工 較厚的厚度，並在其上面加工槽（groove )，從而把 波波（Wave )傳輸力極小化。 具體地說明本發明的結構構成如下。即，位於上 加振子（振盪器）（1 )、在其下部與面接觸的金屬 支架犄角（8)、在其內部配置該金屬介質支架犄角 質的 的單 幹式 、真 基板 裝置 金屬 金屬 的清 用玻 稱爲 過加 Film 中和 ，利 行真 振而 成比 超聲 部的 介質 的金 -15- 201121670 屬介質支架（7)等所構成的。該金屬介質支架（7)和在 其內部配置的金屬介質支架犄角（8)，形成多數個空間 部’金屬介質支架犄角（8 )所形成的空間部中，形成位 於其下部，並儲藏排出到清洗物件基板上的壓縮空氣的壓 縮空氣排出部（6):金屬介質支架犄角（8)和金屬介質 支4 (7)所形成的兩側空間部中，形成爲了吸入浮游的 異物質而形成真空的、空間部的真空吸入部（5)。 上述金屬介質支架（7)和在其內部安裝的金屬介質 支架犄角（8 )，形成互相隔離的個別空間部。另外，金 屬介質支架（7)，可形成爲圓桶管或包括四角桶管在內 的多角形管。 在上述壓縮空氣排出部（6)的下端部，形成壓縮空 氣排氣狹縫（Ultra Sonic Air Slit)(超高音速空氣狹縫 )(3)，以便壓縮空氣通過氣嘴狹縫，被排出的結構構 成的。另外，雖然其圖紙符號並未圖示，但是，在壓縮空 氣排出部（6)的上端部，已形成流入壓縮空氣的流入口 〇 上述的真空部（5)的下端部中，形成真空吸入口（ Vacuum Suction Hole) ( 4 )，以吸入浮游的異物質。另 外，雖然，未圖示其圖紙符號，但是，在真空吸入部（5 )的上端部中，在每個真空吸入部上，都分別形成了提供 真空力的流入口。 與上述金屬介質支架（7 )的外側面相隔一定的距離 的地方，安裝了電離裝置（9)，以中和在基板上帶電成 -16- 201121670 (+)正離子和（-)負離子的異物質。雖然，在圖紙上未 圖示電離裝置（Ionizer ) (9)，但是，爲了中和基板上 帶電成（+)正離子和（-)負離子的異物質，理所當然’ 配置了固定手段，以便通過固定電離裝置（Ionizer ) (9 )，與超聲波清洗劑聯動起來移動。 上述金屬介質支架犄角（8)，其上部與超聲波加振 子（振盪器）（1 )的下部相接觸，把超聲波加振子（振 盪器）的加振力，毫無損失地傳輸到下部，這是該發明的 核心。像這樣的毫無損失地傳輸加振力，只有通過金屬介 質，才能實現。以往的超聲波幹式清洗機，作爲傳輸超聲 波的介質，使用了空氣，因此，不可避免地出現了超聲波 加振力損失。 本發明的金屬介質支架犄角（8 )，是與位於其上部 的超聲波加振子（振盪器）（1 )直接接觸的結構構成的 。因此，具有20〜40KHZ頻率的超聲波傳輸於下部基板上 ，以破壞隨著基板以一定的速度移動而形成的25 μηι厚度的 油膜（邊界層）。由於這樣的邊界層的破壞，在其內部所 存在的具有1〜3μιη程度大小的異物質，被壓縮空氣被浮游 而被真空吸入的。當然，在這裏，爲方便起見，把異物質 表示爲3 μπι，但是，理所當然，其大小可以比該數小或大 的。重要的是，以往的一半的超聲波幹式清洗機的超聲波 不能破壞的，存在於邊界層內部的異物質，才是重要的。 本發明是能夠消除存在於厚度25 μηι的油膜（邊界層）內部 的異物質的超聲波幹式清洗機。 -17- 201121670 在本發明中，使用20〜4OKHz頻率的理由，是爲了利 用低頻率短波方式（20〜40KHz程度的單一頻率成分）， 進行除塵’另外，爲了適用爲完善駐波現象[(市在振動 板內的波形，如同靜止的具有能源分佈的現象，在每個波 長中周期性地出現強與弱的氣穴（Cavitation)]的轉換（ Sweep )功能’是爲了進行利用多數頻率方式（選擇性地 產生2個以上的頻率）的除塵，如果超過40KHz時，由於削 弱衍射性（回折性），因此，在上限値上，給了限定値。 由於上述金屬介質支架犄角（8)，以上部款，下部 窄的結構構成’因此，從上部超聲波加振子（振盪器）產 生的超聲波’在下部集中後，於壓縮空氣一起，通過壓縮 空氣排出狹縫（Ultra Sonic Air Slit:超高音速狹縫）（3 )，被排出。此時，被加振爲20〜40KHz的頻率的超聲波 ’由於到達基板上的邊界層的距離短，所以，在傳輸過程 中’不發生因壓縮空氣引起的頻率的衰減現象。即，以往 的超聲波幹式清洗機，所發生的超聲波，從一開始起，就 以壓縮空氣爲介質，進行傳播的，因此，即使是通過共振 而被增幅，其加振力被消滅，而得不到被加振爲20〜 40KHZ頻率的超聲波。但是，本發明能夠把毫無損失地被 加振爲20〜40KHz頻率的超聲波，來破壞基板上的邊界層 ，從而把存在於其中的異物質，進行浮游化。 另外，爲了通過金屬介質支架犄角（8)，把超聲波 只往下部傳輸’形成了爲衰減向側面方向傳輸的超聲波而 構成的頻率傳輸切斷槽（groove) (2)。該頻率傳輸切 -18- 201121670 斷槽（groove ) ( 2 ) ’形成於金屬介質支架（7 )的上部 面上。而該金屬介質支架（7)，位於超聲波加振子（振 盪器）（1 )的下部，並與超聲波加振子（振盪器）（1 ) 直接接觸的金屬介質支架犄角（8)的側方向。 頻率傳輸切斷槽（groove) (2)，形成爲2個以上的 多層（段），通過多層（段）的槽，圈住或消耗超聲波， 以阻止往側方向傳輸的超聲波。因此，非常自然地，從超 聲波加振子（振盪器）產生的超聲波，隨著金屬介質支架 犄角（8 )的形象，往下部方向，以最小的頻率損失傳輸 ，並移動而聚集。 上述的金屬介質支架犄角（8)或者金屬介質支架（7 )的材質爲金屬就足夠，如果採用輕量的鋁，那麼，其超 聲波傳輸效果更好。 雖然，並沒有說明，但是，符號1 〇爲蓋子（罩子）， 配置於超聲波加振子（振盪器）的上部。 另外，在上述說明中，由於在基板上面安裝的構成超 聲波清洗機（Head:頭）的其他構成，屬於超聲波清洗劑 領域已周知的構成，所以，省略了其具體的說明。例如， 產生壓縮空氣並連接到頭（Head )爲止的結構；通過振動 超聲波加振字（陶瓷壓電元件），產生超聲波的結構；通 過產生真空吸入力來吸入的結構；帶動基板移動的滾筒（ Roller )的驅動及控制手段；移動超聲波清洗劑或調節高 低的驅動及控制手段；產生（+)正離子和（-)負離子的 電離裝置（Ionizer )等超聲波清洗劑領域內周知的結構。 19- 201121670 圖2是根據本發明的另外實施例子的，利用金屬介質 的超聲波幹式清洗機的截面例示圖。如圖所示，與根據在 圖1中所圖示的一個實施例子的結構，大部分都相同。只 是圖1的金屬介質支架犄角（8)，與超聲波加振子（振盪 器）相接觸的部位大部分，構成爲能夠接觸金屬介質犄角 (1 1 )的結構。該金屬介質犄角（1 1 )，是以其內部由金 屬介質灌滿的結構構成的。因此，通過金屬介質，把超聲 波加振力，直接傳輸於基板上。 上述金屬介質犄角（11)，形成於金屬介質支架犄角 (8)的內部空間部的壓縮空氣排出部（6)中。 上述金屬介質犄角（11)，其形象爲上部寬，下部窄 的結構，並且用金屬介質灌滿而構成。 上述金屬介質犄角（1 1 )的結構，能夠使從上部超聲 波加振子產生的超聲波，在其下部聚集後，與壓縮空氣一 起，通過壓縮空氣排出狹縫（Ultra Sonic Air Slit) (3) ，而被排出。此時，被加振成20〜40KHz頻率的超聲波， 由於到達基板上的邊界層爲止的距離短，所以，在傳輸過 程中，不發生因壓縮空氣而衰減頻率的現象。爲此，通過 被加振成20〜40KHz頻率的超聲波，破壞基板上的邊界層 ，並把存在於其中的異物質浮游化。被浮游的異物質，如 同前面所述，通過真空吸入口（Vacuum Suction Hole)( 4)，真空吸入部（5)，被真空吸入，從而進行幹式清洗 基板。 另外，圖2的結構中，由於金屬介質犄角（11)接觸 -20- 201121670 超聲波加振子（1 )的下部的大部分面積’所以’不需要 如圖1所示的頻率傳輸切斷槽（greeve ) ( 2 )。即使一部 分超聲波傳輸到側方向，通過由上部款而下部窄的結構構 成的、由灌滿的金屬介質構成的金屬介質支架犄角（8) ，大部分的超聲波被傳輸到下部’因此’從上部超聲波加 振子（振盪器）所產生的超聲波，聚集於下部後’與壓縮 空氣一起，通過壓縮空氣排出狹縫（Ultra Sonic Air Slit )(3 )，而被排出。此時，被加振成2〇〜4〇KHz頻率的超 聲波，由於到達基板上的邊界層爲止的距離短，所以’在 傳輸過程中，不發生因壓縮空氣而衰減頻率的現象。 圖3是顯示根據圖1和本發明的一個實施例子的、由多 數個超聲波幹式清洗機結合在一起配置的截面例示圖。如 圖所示，顯示連接多數個在圖1中所示的單位超聲波幹式 清洗機後，用一次的作業’就能夠把基板（例如，LCD或 者PDP或者AMOLED等的玻璃基板）的一側寬面全部清洗 的情況。像這樣，把多數個清洗機一起配置在一起時，相 鄰的單位超聲波幹式清洗機之間的間隔要滿足如下條件。 即，排列後，能夠滿足超聲波的頻率在傳輸過程中，不發 生頻率衰減現象，能夠破壞2 5 μπι以下的邊界層後，把存在 於其內部的1〜3 μ01程度的非黏著性異物質浮游化的程度的 加振力，即能夠傳輸20〜4〇ΚΗζ頻率的超聲波的程度即可 〇 圖4是顯示根據圖2和本發明的另外實施例子的、由多 數個超聲波幹式清洗機結合在一起安裝的截面例示圖。如 -21 - 201121670 圖所示，顯示連接多數個圖2所示的單位超聲波幹式清洗 機後，用一次性作業，就能把基板（例如，LCD或者PDP 或者AMOLED等的玻璃基板）的一側寬面全部清洗的情況 。像這樣，把多數個清洗機一起配置在一起時，相鄰的單 位超聲波幹式清洗機之間的間隔要滿足如下條件。即，排 列後，能夠滿足超聲波的頻率在傳輸過程中，不發生頻率 衰減現象，能夠破壞25 μηι以下的邊界層後，把存在於其內 部的1〜3 μιη程度的非黏著性異物質浮游化的程度的加振力 ，即能夠傳輸20〜40ΚΗζ頻率的超聲波的程度即可。 圖5是顯示根據圖1和本發明的一個實施例子的超聲波 幹式清洗機動作的例示圖。單位超聲波幹式清洗機，通過 金屬介質，把具有20〜40ΚΗζ頻率的超聲波，即，顯示了 從上端部的超聲波加振子，無衰減地被傳輸的20〜40ΚΗΖ 頻率的超聲波，通過中央部下端的狹縫，把壓縮空氣，進 行加振後移送到基板上，那麼，就能破壞具有厚度25 μιη以 下的邊界層後，把存在於其內部的異物質，進行浮游化， 然後，通過超聲波幹式清洗機的狹縫兩側的真空吸入口吸 入被浮游的異物質的現象。此時，所使用的壓縮空氣的壓 力強度爲12Kpa以上，以便增強浮游性。另外，真空吸入 壓力維持爲-0.5 Kpa，以便順利進行真空吸入。另外，壓 縮空氣，通過每一個超聲波幹式清洗機使用一個鼓風機（ Blower )來供應爲好。另外，單位超聲波幹式清洗機的大 小，使用能夠清洗整個基板（Glass )寬度，並且不干涉 投入部的超聲波幹式清洗機就可以。 -22- 201121670 本發明是不侷限於上述的特定的所希望的貫施例子’ 當然，在不超出申請專利範圍內所申請的be發明的綱要的 該發明所屬的技術領域裏，具有通常知識的人’任何人都 能夠進行多種多樣的變形實施的’但是’像那樣的變更都 應視爲屬於申請範圍記摘的範圍之內的° 【圖式簡單說明】 圖1是根據本發明的一個實施例子的利用金屬介質的 超聲波幹式清洗機的截面例示圖。 圖2是根據本發明的另外一個實施例子的利用金屬介 質的超聲波幹式清洗機的截面例示圖。 圖3是顯示根據圖1和本發明的一個實施例子的由多數 個超聲波幹式清洗機結合在一起配置的截面例示圖 圖4是顯示根據圖2和本發明的另外實施例子的 '由多 數個超聲波幹式清洗機結合在一起安裝的截面例示圖。 圖5是顯示根據圖1和本發明的一個實施例子的超聲波 幹式清洗機動作的例示圖。 【主要元件符號說明】 1 :超聲波加振子 2:頻率傳輸切斷槽（gro〇Ve) 3 :壓縮空氣排出狹縫 4 :真空吸入口 5 :真空吸入部 -23- 201121670 6 :壓縮空氣排出部 7 :金屬介質支架 8:金屬介質支架犄角 9 :電離裝置 10 :蓋子 1 1 :金屬介質犄角 -24BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic dry cleaning machine using a metal medium, and more particularly to a substrate that is moved at a constant speed by dry destruction when the substrate is dry-cleaned. An ultrasonic dry cleaning machine using a metal medium to form a boundary layer having a thickness of 25 μm to eliminate non-adhesive foreign matter adhering to the substrate in the field. [Prior Art] The surface of a glass substrate or film (Film) or semiconductor wafer used for display such as PDP, LCD, AMOLED, etc. should be cleaned to maintain a state of no foreign matter on its surface. If the processing is carried out in the state of foreign matter on the surface, defects will occur on the final product to produce defective products, which will eventually lead to a decrease in the yield of production. The cleaning method can be roughly divided into two methods: wet cleaning (Wet Cleaning) and dry cleaning (DryCeaning). The above-mentioned so-called wet cleaning (W et C 1 eaning) refers to the organic cleaning, pure water cleaning, inorganic cleaning, and drying stages, and the organic substances such as adhesive substances, tape marks, hand oil stains, etc. are organic. The inorganic substance or the like to which the binder is bonded is a non-contact method for cutting the organic binder to become a chemical cleaning method. The types of such organic cleaning methods include EUV, AP Plasma (upper pressure Plasma), and low temperature UV cleaning. Although the technology of 'EUV and UV cleaning methods is mature and stable, 201121670 shows limited technology in cleaning the recent large glass (Glass) or cleaning short TAT. In particular, in the case of high output (power) EUV, since the life is only 1 000 hours (Hr), the lamp replacement cost is relatively large. Vacuum plasma (Plasma) is mainly used in semiconductors, and some is used before and after dry etching (Dry Etch). However, for cleaning purposes, there is almost no such thing as FPD. AP Plasma is used not for cleaning purposes but for cleaning purposes. Since the ozone formed (清除3) is removed, a large-capacity exhaust pipe (Exhaust) is required, and the sustainability of nitrogen (N2), helium (Helium), and clean dry air CD A (Clean Dry Air) is required. Consumption, as well as the size of the product, the short life of the cathode, etc., space and maintenance, etc., will be constrained. Further, the above-mentioned "dry cleaning" refers to a method in which an organic material such as non-adhesive foreign matter is floated by a non-contact method after being cleaned by organic cleaning and inorganic cleaning, and is cleaned by a non-contact method. The types of such inorganic cleaning methods include a Roll Brush, a Water Jet, a Bubble Jet, an Air Knife, and a method using an ultrasonic cleaner. - In the case of a PDP, LCD, AMOLED, etc., a glass substrate, a film, or a semiconductor wafer (wafer), etc., after the organic cleaning is completed, the clean room (Clean Room) is maintained in a clean state. In the Cassette, it is accumulated in multiple layers for storage. When storing in this way, the floating foreign matter existing inside the clean room occurs as the -6 - 201121670 is stored inside the Cassette (for example, glass powder, etc., falls due to its weight The problem of non-adhesive substances on the substrate or floating matter such as dandruff and dust) falling onto the substrate again. When such a problem occurs, in order to manufacture a glass substrate or a wafer (wafer) wafer for a display such as a PDP, an LCD, or an AMOLED, the substrate is exposed, vacuum-deposited, or splashed. Defects can occur, resulting in serious quality problems. Therefore, dry cleaning is generally performed using a dry cleaner (Dry Cleaner). For the purpose of such a dry cleaning machine, there are a Roll Brush, a Water Jet, a Bubble Jet, an Air Knife, and an Ultrasound as described above. Washing machine, etc. Among them, the air knife can only eliminate the oil film formed on the substrate by the fluid, that is, the foreign matter having a thickness of 25 μm or more on the boundary layer. The reason why it cannot eliminate substances having a thickness of 2 5 μη or less is that the compressed air of the air knife cannot eliminate the oil film (boundary layer) within 25 μm. Therefore, the non-adhesive foreign matter of about 3 μm in the boundary layer does not break the oil film (boundary layer) formed by the impedance of the substrate when the substrate moves at a constant speed. Therefore, it cannot be cleaned. The cleaning machine which was born to solve the problem of the prior contact dry cleaning apparatus of this type is an ultrasonic dry cleaning machine which destroys the foreign matter existing inside by destroying the boundary layer (oil film). 201121670 The configuration of such an ultrasonic dry cleaning machine is made up of an ionization device (I〇nizer) located at the front and rear ends of a general ultrasonic cleaning machine, a compressed air means (Pressure Air) having an ultrasonic wave to be oscillated, and a vacuum suction ( Vacuum Suction means or the like to eliminate foreign matter adhering to the substrate. The ionization device is on the substrate, neutralizing the foreign matter charged by (+) positive ions or (-) negative ions by electrostatic action, so that the adhesive force is lost, and the compressed air (Pressure Air) means is activated by the vibration. The boundary layer floats the neutralized foreign matter present therein, and then, by means of vacuum suction, the floating foreign matter is sucked. The ultrasonic generation principle of the above ultrasonic cleaning machine includes a method using an ultrasonic sensor and a method using an orifice flow tube and an pocket (Orifice Tube & pocket). Patents utilizing ultrasonic sensors [Piezoelectric elements] are patented by the applicants, Huggle and Apros. A patent for the generation of ultrasonic waves using an orifice flow tube and pocket (Orifice Tube & pocket) is patented by the patent applicant Shinkko. However, in the former ultrasonic generating means, according to the Shinkko patent, ultrasonic waves which are generated by the physical structure (wrinkle tube) and which are excited can generate ultrasonic waves of 14 to 20 kHz, and therefore, the boundary layer is eliminated. It is still far from enough, and there are some problems in its structure. In addition, patents such as Huggle and Apros are composed of a structure in which compressed air is used as a medium and resonance is used to transmit the vibration frequency of the ultrasonic sensor to the substrate, and the floating foreign matter is vacuum-inhaled. -8- 201121670 That is, the principle of ultrasonic generation of Huggle and Apros is to use air as an ultrasonic generating medium to transmit the ultrasonic frequency, thereby generating the vibration force of the ultrasonic vibrator, which is only 14~20KHz ultrasonic wave. It is far from enough to completely eliminate the above boundary layer, and there are some problems in its structure. Of course, it may be considered that if the vibration frequency of the larger ultrasonic wave is used, the problem of the above-mentioned ultrasonic cleaning machine can be solved, but, in fact, even if the frequency of the ultrasonic vibrator is large, due to the air medium The attenuation effect does not increase the vibrational force of the ultrasonic waves transmitted onto the substrate. Therefore, there is also a structural problem that the boundary layer formed on the substrate cannot be destroyed. In other words, in the prior ultrasonic dry cleaning machine, there is a structural problem that the oil film boundary layer within 2 5 μm cannot be eliminated. Therefore, the non-adhesive foreign matter evaporated on the substrate cannot be completely eliminated, so that the final product is There are problems such as defects, resulting in a decrease in harvest rate, and the like. Therefore, there is an urgent need for an ultrasonic dry cleaning machine capable of destroying an oil film (boundary layer) of 25 μΓη to eliminate foreign matter having a size of 1 to 3 μm. However, no one has yet been able to provide an ultrasonic dry cleaning machine that can completely eliminate these. This is also the case. SUMMARY OF THE INVENTION Problems to be Solved In order to solve the above problems, an object of the present invention is to provide a display substrate (PDP, LCD, AMOLED, etc., a glass substrate, or a film for cleaning materials). (Film) or semiconductor wafer), in the dry cleaning, eliminates the non-adhesiveness attached to the substrate in the field by destroying the Boundary layer having a thickness of 25 μm formed on the substrate moving at a certain speed. Foreign matter, ultrasonic dry cleaning machine. Another object of the present invention is to provide an ultrasonic wave of 20 to 4 kHz KHz by using a metal medium, which can destroy a thickness of 25 μηι formed on a substrate moving at a certain speed when dry cleaning the cleaning object material. Boundary layer, which eliminates the ultrasonic dry cleaning machine attached to the non-adhesive foreign matter on the substrate in the field. Another object of the present invention is to provide a metal medium for concentrating on cleaning an object substance or a product while maintaining the vibration force of the ultrasonic wave generated from the ultrasonic vibrator. However, in order to concentrate the oscillating force of the ultrasonic waves passing through the metal medium and reduce the ultrasonic noise generated by the ultrasonic oscillator, an ultrasonic dry cleaning machine for forming a groove is formed. Another object of the present invention is to provide an ultrasonic wave generated from an ultrasonic vibrator that maintains its oscillating force without generating noise, and in such a state, concentrates on cleaning the object material or product. An ultrasonic dry cleaning machine having a corner structure formed by a transported metal medium. Solution to Problem -10-201121670 The present invention has been made in order to achieve the above object and to solve the problems of the prior art, and to achieve the object by providing an ultrasonic cleaning machine using a metal medium having the following configuration. In other words, in an ultrasonic dry cleaning machine including a compressed air discharge unit, a vacuum suction unit, an ultrasonic vibrator, and an ionization device that neutralizes a charged foreign substance, an ultrasonic ultrasonic vibrator is generated; and the ultrasonic vibrator is in contact with the surface. After the ultrasonic wave is applied, the metal medium support horn is transmitted to the cleaning object material; the metal medium support installed inside the corner of the metal medium support; respectively formed on the metal medium support (7), attenuating the frequency transmission cut-off groove of the ultrasonic transmission a compressed air discharge portion formed in a space portion formed by the metal medium and located at a lower portion through a compressed air vent hole to discharge compressed air; formed in a space portion formed by the metal medium support horn and the metal medium support And a vacuum suction portion at a lower portion thereof for sucking floating non-adhesive foreign matter through a vacuum suction port; installed on both sides of the metal medium support and separated from both sides of the metal medium support to neutralize the cleaning An ionization device, such as a charged foreign matter in an object material, constitutes a structure An ultrasonic dry cleaning machine utilizing a metal medium characterized by the destruction of the boundary layer formed in the material of the object to clean the foreign matter present in the material of the cleaning article. The above object is achieved by providing the above washing machine. Further, since the metal medium support has a wide angle and a narrow lower portion, and the internal structure is formed to be empty, the ultrasonic waves generated from the ultrasonic vibrator can be discharged together with the compressed air after being concentrated in the lower portion. charactermatic. Further, the frequency transmission cutting grooves are respectively formed on the upper surface of the metal medium holder located on the side of the corner of the metal interlayer - 201121670, to attenuate the ultrasonic transmission in the side direction by the ultrasonic vibrator, and Noise reduction is characteristic. Further, the above-described frequency transmission cutting groove is characterized by two or more multilayer shapes. Further, the ultrasonic vibrator is characterized by being capable of generating ultrasonic waves of 20 to 40 kHz. Further, the thickness of the above boundary layer is characterized by 25 μηι. Further, the above metal medium is characterized by aluminum. Further, an ultrasonic dry cleaning machine using the above metal medium is used as a unit cleaning machine, and a plurality of unit washing machines are connected in one direction, and they are linked to each other to characterize cleaning of the cleaning object. Further, the above-mentioned cleaning object material is characterized by arbitrarily selecting one of a glass substrate for a PDP, a glass substrate for LCD, a glass substrate for AMOLED, a film (Film), and a semiconductor wafer. According to still another embodiment of the present invention, the ultrasonic vibrator including the ultrasonic wave is generated, and the ultrasonic vibrator is brought into contact with the surface to transmit the ultrasonic wave, and the metal medium is transported to the object of the cleaning object; a metal medium support horn; a metal medium support having a metal medium support horn mounted therein; a compressed air discharge portion formed at a space portion formed by a corner of the metal medium support and located at a lower portion through a compressed air vent hole to discharge compressed air; a vacuum suction -12-201121670 portion of a non-adhesive foreign matter formed by a vacuum suction port and having a non-adhesive foreign matter formed at a lower portion of the space formed by the above-mentioned metal medium support horn and the metal medium support; The two sides of the bracket are separated from the two sides of the metal medium support to form a structure for neutralizing the charged foreign matter in the object material to destroy the boundary layer formed in the material of the cleaning object. Thereby cleaning the foreign matter present inside the material of the object Ultrasonic dry cleaning machine featuring metal media, characterized by cleaning. The above object is achieved by providing the above washing machine. Further, the above-mentioned metal medium corner is characterized by a metal medium having a wide upper portion and a narrow lower portion. Further, the above-described ultrasonic vibrator is characterized by generating an ultrasonic wave of 2 〇 to 4 〇 khz. Further, the cleaning object material is characterized by being arbitrarily selected from the group consisting of a PDP glass substrate, an LCD glass substrate, an AMO LED glass substrate, a film (Film), and a semiconductor wafer. Deletion effect The present invention has a certain degree of destruction when dry cleaning is performed on a glass substrate for a cleaning object such as a PDP 'LCD, an AM Ο LED, or a film (Film) or a semiconductor wafer (W af er ). A Boundary layer having a thickness of 25 μm formed on a substrate that is moving at a speed to eliminate the advantage of non-adhesive foreign matter adhering to the substrate in the field. In addition, when the cleaning object material is subjected to dry cleaning, the Boundary layer having a thickness of 25 μΐΏ-13-201121670 formed on the substrate moving at a constant speed is destroyed to eliminate the substrate in the field. The advantage of non-adhesive foreign matter attached to it. Further, by using a metal medium as a medium for transmitting ultrasonic waves, ultrasonic waves of 20 to 4 kHz are generated, and when the object material is subjected to dry cleaning, the substrate is moved at a constant speed and has a thickness of 25 μm. Boundary layer to eliminate the advantages of non-sticky foreign matter attached to the substrate in the field. Further, the use of a metal medium causes the ultrasonic wave generated from the ultrasonic vibrator to concentrate on the cleaning of the object material or product in a state of maintaining the vibration force. Therefore, the oscillating force of the ultrasonic waves passing through the metal medium is concentrated, and the ultrasonic noise generated from the ultrasonic vibrator is attenuated by forming a groove. Has the above advantages. In addition, by arranging the corner structure composed of the metal medium to attenuate, it is possible to concentrate and transmit the material or product to be cleaned in a state in which the vibration is generated without the ultrasonic noise generated from the ultrasonic vibrator. In the purpose. Has the above advantages. Therefore, this invention is a famous invention and can be widely used in industrial inventions. [Embodiment] In order to carry out the invention, the configuration of the embodiment of the present invention and its function will be described in detail below using additional drawings. Further, in the course of explaining the present invention, if it is judged that the specific description of the known function or the configuration is unnecessarily obscured, the detailed description thereof will be omitted. -14- 201121670 匮I 1 is a cross-sectional view showing the use of a metal-transparent ultrasonic dry cleaning machine according to an embodiment of the present invention. As shown in the figure, according to the present invention, an ultrasonic dry cleaning machine (head head) is a vacuum suction machine that discharges compressed air onto a substrate, and an ultrasonic vibration absorbing element that generates ultrasonic waves is extremely Neutralizing an ionization structure of a foreign substance that is charged with (+) positive ions and (-) negative ions. According to the present invention, ultrasonic waves of 20 to 40 kHz are used to oscillate the media support angle (Horn), and the vibration or the transverse wave is loaded into the medium for transmission, and the ultrasonic wave is transmitted to the final target material by air. (For example, PDP, LCD, AMOLED, etc., such as a display glass substrate or a film (Film) or a semiconductor wafer, the following "substrate"), and a method of eliminating foreign matter on the substrate. That is, vibrating to destroy the boundary layer of a thickness of 25 μm formed on a substrate or film ( ) moving at a frequency of 20 kHz or more, and using an ionization device, a non-adhesive foreign matter of 3 μm existing under the ionization device Then, using compressed air, the foreign matter is floated, and on the other side, the air is sucked in, thereby eliminating the structure of the foreign matter. Further, in order to minimize the noise generated in common, the outer side surface portion of the metal medium is processed to have a thick thickness, and a groove is formed thereon to minimize the wave transmission force. Specifically, the structure of the present invention is as follows. That is, the metal oscillator bracket (8) located in the upper vibrator (oscillator) (1) and the metal bracket in the lower portion thereof is placed in contact with the surface, and the single-layer, true-substrate metal metal in the metal medium holder is disposed inside. The glass is called the medium neutralization with the addition of the Film Neutralization, and it is composed of the gold -15-201121670 medium medium support (7) which is the medium of the ultrasonic part. The metal medium support (7) and the metal medium support horn (8) disposed inside thereof form a space portion formed by a plurality of space portions 'metal medium support horns (8), are formed at a lower portion thereof, and are stored and discharged to a compressed air discharge portion (6) for cleaning compressed air on the substrate of the object: a space formed in the space between the metal medium support horn (8) and the metal medium support 4 (7) to form a vacuum for inhaling the floating foreign matter The vacuum suction part (5) of the space part. The metal medium support (7) and the metal medium support horn (8) mounted therein are formed as separate space portions which are isolated from each other. Alternatively, the metallic medium support (7) may be formed as a drum tube or a polygonal tube including a four-corner barrel. At a lower end portion of the compressed air discharge portion (6), a compressed air exhaust slit (Ultra Sonic Air Slit) (3) is formed so that compressed air is discharged through the nozzle slit. Structured. Further, although the reference numerals are not shown, a vacuum inlet is formed in the lower end portion of the vacuum portion (5) where the inflow port of the compressed air is formed at the upper end portion of the compressed air discharge portion (6). ( Vacuum Suction Hole) ( 4 ) to inhale the floating foreign matter. Further, although the drawing symbols are not shown, in the upper end portion of the vacuum suction portion (5), an inflow port for supplying a vacuum force is formed in each of the vacuum suction portions. An ionization device (9) is installed at a certain distance from the outer side surface of the above-mentioned metal medium support (7) to neutralize the difference between the positive and negative ions (-) of the -16-201121670 (+) positive ions on the substrate. substance. Although the ionizer (Ionizer) (9) is not shown on the drawing, in order to neutralize the foreign matter charged to the (+) positive ion and (-) negative ion on the substrate, it is a matter of course that a fixing means is provided for fixing The ionizer (Ionizer) (9) moves in conjunction with the ultrasonic cleaner. The metal medium support horn (8) has an upper portion in contact with a lower portion of the ultrasonic vibrator (oscillator) (1), and transmits the oscillating force of the ultrasonic vibrator (oscillator) to the lower portion without loss. The core of the invention. The transmission of the oscillating force without any loss like this can only be achieved by the metal medium. In the conventional ultrasonic dry cleaning machine, air is used as a medium for transmitting ultrasonic waves, and therefore, ultrasonic vibration loss is inevitably caused. The metal medium holder corner (8) of the present invention is constructed by directly contacting an ultrasonic vibrator (oscillator) (1) located at an upper portion thereof. Therefore, ultrasonic waves having a frequency of 20 to 40 kHz are transmitted to the lower substrate to break the oil film (boundary layer) having a thickness of 25 μm formed as the substrate moves at a constant speed. Due to the destruction of such a boundary layer, the foreign matter having a size of 1 to 3 μm existing inside is compressed by the compressed air and vacuumed. Of course, here, for the sake of convenience, the foreign matter is expressed as 3 μπι, but, of course, its size may be smaller or larger than the number. It is important that the foreign matter that exists in the boundary layer is not damaged by the ultrasonic wave of the past half of the ultrasonic dry cleaning machine. The present invention is an ultrasonic dry cleaning machine capable of eliminating foreign matter existing in an oil film (boundary layer) having a thickness of 25 μm. -17- 201121670 In the present invention, the reason for using the frequency of 20 to 4 OKHz is to perform dust removal by using a low-frequency short-wave method (a single frequency component of a degree of 20 to 40 kHz). In addition, in order to improve the standing wave phenomenon [ The waveform in the vibrating plate, like the phenomenon of static energy distribution, the periodic occurrence of strong and weak cavitation conversion (Sweep) function in each wavelength is for the use of most frequency modes ( Dedusting that selectively generates two or more frequencies), if it exceeds 40 kHz, the diffraction property is reduced (folding property), so the upper limit is given to the upper limit 値. Because of the above-mentioned metal medium support angle (8), the above In the lower section, the narrow structure is formed. Therefore, the ultrasonic waves generated from the upper ultrasonic vibrator (oscillator) are concentrated in the lower part, and the compressed air is discharged together through the compressed air (Ultra Sonic Air Slit). (3), is discharged. At this time, the ultrasonic wave that is excited to a frequency of 20 to 40 KHz is short due to the distance to the boundary layer on the substrate. In the transmission process, the frequency attenuation due to the compressed air does not occur. That is, the ultrasonic ultrasonic wave generated by the conventional ultrasonic dry cleaning machine uses compressed air as a medium to propagate from the beginning. Even if it is amplified by resonance, its oscillating force is extinguished, and ultrasonic waves that are excited to a frequency of 20 to 40 kHz are not obtained. However, the present invention can be oscillated to a frequency of 20 to 40 kHz without loss. Ultrasonic waves are used to destroy the boundary layer on the substrate to float the foreign matter present in it. In addition, in order to pass the metal medium support angle (8), the ultrasonic wave is transmitted only to the lower part to form a transmission for attenuation to the side direction. The ultrasonic transmission is formed by a frequency transmission cutting groove (2). The frequency transmission is cut -18-201121670 Groove (2) 'formed on the upper surface of the metal medium support (7). The dielectric support (7) is located at the lower part of the ultrasonic vibrator (oscillator) (1) and is in direct contact with the ultrasonic vibrator (oscillator) (1). 8) Side direction. Frequency transmission cutting groove (2), formed into two or more layers (segments), through the multi-layer (segment) groove, encircling or consuming ultrasonic waves to prevent transmission in the lateral direction Ultrasonic. Therefore, very naturally, the ultrasonic waves generated from the ultrasonic vibrator (oscillator) are transmitted in the lower direction with the smallest frequency loss as the image of the metal medium support angle (8), and move and gather. The metal medium support angle (8) or the metal medium support (7) is made of metal. If lightweight aluminum is used, the ultrasonic transmission effect is better. Although not illustrated, the symbol 1 is a cover (cover) and is disposed on the upper portion of the ultrasonic vibrator (oscillator). Further, in the above description, the other configuration constituting the ultrasonic cleaning machine (Head: head) mounted on the upper surface of the substrate is a well-known configuration in the field of ultrasonic cleaning agents, and thus a detailed description thereof will be omitted. For example, a structure that generates compressed air and is connected to a head; a structure that generates ultrasonic waves by vibrating an ultrasonic vibration word (ceramic piezoelectric element); a structure that is sucked by generating a vacuum suction force; and a roller that drives the substrate to move ( Roller) drive and control means; mobile ultrasonic cleaner or high and low drive and control means; (+) positive ion and (-) negative ion ionizer (Ionizer) and other known structures in the field of ultrasonic cleaners. 19-201121670 Fig. 2 is a cross-sectional view showing an ultrasonic dry cleaning machine using a metal medium according to another embodiment of the present invention. As shown, most of the structures are the same as those according to an embodiment shown in Fig. 1. Only the metal medium support corner (8) of Fig. 1 is in contact with the ultrasonic vibrator (oscillator), and is configured to be in contact with the metal dielectric angle (1 1 ). The metal dielectric angle (1 1 ) is constituted by a structure in which the inside is filled with a metal medium. Therefore, the ultrasonic wave is excited by the metal medium and directly transmitted to the substrate. The metal medium corner (11) is formed in the compressed air discharge portion (6) of the inner space portion of the metal medium support corner (8). The above-mentioned metal medium corner (11) has a structure in which the upper portion is wide and the lower portion is narrow, and is formed by filling with a metal medium. The above-mentioned metal medium angle (11) is configured such that ultrasonic waves generated from the upper ultrasonic vibrator are collected in the lower portion thereof, and together with the compressed air, are discharged through the compressed air (Ultra Sonic Air Slit) (3). It is discharged. At this time, since the ultrasonic wave excited to a frequency of 20 to 40 kHz has a short distance to reach the boundary layer on the substrate, the phenomenon of attenuating the frequency due to the compressed air does not occur during the transmission. For this reason, the boundary layer on the substrate is destroyed by ultrasonic waves excited to a frequency of 20 to 40 kHz, and the foreign matter existing therein is floated. The foreign substance that has been floated, as described above, is vacuum-sucked through a vacuum suction port (4) and vacuum suction portion (5), thereby performing dry cleaning of the substrate. In addition, in the structure of Fig. 2, since the metal dielectric angle (11) contacts most of the area of the lower portion of the ultrasonic vibrator (1) of the -20-201121670, the frequency transmission cut-off groove as shown in Fig. 1 is not required. ) ( 2 ). Even if a part of the ultrasonic wave is transmitted to the side direction, most of the ultrasonic waves are transmitted to the lower part by the angle of the metal medium support (8) composed of the filled metal medium composed of the lower part and the lower part of the structure. The ultrasonic waves generated by the vibrator (oscillator) are collected in the lower portion and are discharged together with the compressed air through the compressed air discharge slit (Ultra Sonic Air Slit) (3). At this time, the ultrasonic wave excited to a frequency of 2 〇 to 4 〇 KHz has a short distance to the boundary layer on the substrate, so that the frequency is not attenuated by the compressed air during the transmission. Fig. 3 is a cross-sectional view showing a configuration in which a plurality of ultrasonic dry cleaning machines are combined in accordance with Fig. 1 and an embodiment of the present invention. As shown in the figure, after connecting a plurality of unit ultrasonic dry cleaning machines shown in FIG. 1, the operation of one time can be used to widen one side of a substrate (for example, a glass substrate such as an LCD or a PDP or an AMOLED). The condition of all cleaning. In this way, when a plurality of washing machines are arranged together, the interval between adjacent unit ultrasonic dry cleaning machines satisfies the following conditions. That is, after the arrangement, the frequency of the ultrasonic wave can be satisfied, and the frequency attenuation phenomenon does not occur during the transmission, and the boundary layer of 25 μm or less can be destroyed, and the non-adhesive foreign matter floating in the range of 1 to 3 μ01 existing inside is suspended. The degree of oscillating force, that is, the degree of ultrasonic waves capable of transmitting frequencies of 20 to 4 〇, FIG. 4 is a combination of a plurality of ultrasonic dry cleaning machines according to FIG. 2 and another embodiment of the present invention. A cross-sectional illustration of the installation together. As shown in the figure - 21 - 201121670, it is shown that after connecting a plurality of unit ultrasonic dry cleaning machines shown in Fig. 2, one of the substrates (for example, a glass substrate such as an LCD or a PDP or an AMOLED) can be used in a single operation. The case where the side wide side is completely cleaned. In this way, when a plurality of washing machines are arranged together, the interval between adjacent unit ultrasonic dry cleaning machines satisfies the following conditions. In other words, after the arrangement, the frequency of the ultrasonic wave can be prevented from being attenuated during the transmission, and the boundary layer of 25 μm or less can be destroyed, and the non-adhesive foreign matter existing in the range of 1 to 3 μm existing inside is floated. The degree of vibration, that is, the degree of ultrasonic waves capable of transmitting frequencies of 20 to 40 即可. Fig. 5 is a view showing an operation of the ultrasonic dry cleaning machine according to Fig. 1 and an embodiment of the present invention. The unit ultrasonic dry cleaning machine transmits ultrasonic waves having a frequency of 20 to 40 通过 through a metal medium, that is, ultrasonic waves of 20 to 40 显示 which are transmitted from the upper end portion and are transmitted without attenuation, and pass through the lower end of the center portion. After the compressed air is shaken and transferred to the substrate, the boundary layer having a thickness of 25 μm or less can be destroyed, and the foreign matter existing inside the container can be floated, and then dried by ultrasonic dry cleaning. The vacuum suction ports on both sides of the slit of the machine inhale the phenomenon of floating foreign matter. At this time, the compressed air used has a pressure strength of 12 KPa or more in order to enhance the floatation property. In addition, the vacuum suction pressure is maintained at -0.5 Kpa for smooth vacuum suction. In addition, the compressed air is supplied through each of the ultrasonic dry cleaning machines using a blower (blower). Further, the size of the unit ultrasonic dry cleaning machine can be an ultrasonic dry cleaning machine capable of cleaning the entire substrate (Glass) width without interfering with the input portion. -22- 201121670 The present invention is not limited to the specific desired embodiments described above. Of course, in the technical field to which the invention belongs without exceeding the outline of the invention of the application within the scope of the patent application, it is common knowledge. Any change that can be performed by a person with a variety of variants is considered to be within the scope of the application range. [Simplified Schematic] FIG. 1 is an implementation in accordance with the present invention. An example of a cross section of an ultrasonic dry cleaning machine using a metal medium as an example. Fig. 2 is a cross-sectional view showing an ultrasonic dry cleaning machine using a metal medium according to another embodiment of the present invention. 3 is a cross-sectional view showing a configuration in which a plurality of ultrasonic dry cleaning machines are combined in accordance with FIG. 1 and an embodiment of the present invention. FIG. 4 is a view showing a plurality of other embodiments according to FIG. 2 and the present invention. An example of a cross-section of an ultrasonic dry cleaner installed together. Fig. 5 is a view showing an operation of the ultrasonic dry cleaning machine according to Fig. 1 and an embodiment of the present invention. [Explanation of main component symbols] 1: Ultrasonic vibrator 2: Frequency transmission cut-off groove (gro〇Ve) 3: Compressed air discharge slit 4: Vacuum suction port 5: Vacuum suction section -23- 201121670 6 : Compressed air discharge section 7: Metal medium bracket 8: Metal medium bracket corner 9: Ionization device 10: Cover 1 1 : Metal medium angle-24