201119091 六、發明說明： 【發明所屬之技術領域】 本發明是有關一種發光二極體模組及其製造方法，特別是一種改 善出光效率之發光二極體模組及其製造方法。 【先前技術】 發光二極體(light-emitting diode，LED)具有體積小、使用壽命長以 及省電等優點，因此發光二極體廣泛應用於背光模組、照明燈具、交 通號誌以及裝飾等用途。 習知之發光二極體模組是以發光二極體之背面設置於基板或散熱 件上’再將發光二極體之主動面與基板之電路層電性連接。電子以及 電洞在NP接面結合所發出之光線是分別朝向發光二極體之主動面以 及背面放射出去。然而’依據上述結構，朝向發光二極體之背面所放 射的光線受到基板或散熱件的阻擋而無法有效利用，使得習知之發光 二極體模組之出光效率較差。 综上所述，如何改善習知之發光二極體模組之出光效率便是目前 極需努力的目標。 【發明内容】 ，針對上述問題，本發明目的之一是提供一種發光二極體模組及其 製造方法，其是以透光封裝件承絲光二滅，因此，本發明之發光 -極體模組可由發光二極體之背面出光，以改善發光二極體模組的出 光效率。 本發明-實施例之發光二極體模組包含一基板、一發光二極體、 一第-封裝件以及-第二透光封裝件。基板具有H面、一第二 201119091 表面、-電路層以及-開孔，其中開孔貫穿第一表面以及第二表面， 且電路層包含至少-設置於第-表面之第„導電接i發光二極體設 置於開孔’並與第-導電接點電性連接。第一封裝件設置於基板之第 -表面’靖紐光二極體以及第—魏接點^第二透絲裝件則設 置於基板之第二表面，以封裝發光二極體。 本發明另-實施例之發光二極體模組之製造方法包含：提供一載 板以及-紐，基板具有-第-表面、—第二表面、—電路層以及一 開孔，且基板是以第二表面設置於載板，其中開孔貫穿第—表面以及 第,表面以顯露出載板之表面，且電路層包含至少—設置於第一表面 • 力第一導電接點；設置一發光二極體於載板對應於開孔之表面；電性 連接發光二減以及第-導電接點；設置—第—封裝躲基板之第一 表面側，以封裝發光二極體以及第一導電接點；移除載板；以及設置 -第二透光封裝件於基板之第二表面側，以封裝發光二極體。 以下藉由具體實補配合_賴式詳加_ 發明之目的、技_容、特點及其所達叙姐。 易瞭解本 【實施方式】 ❿ 請參照圖1，本發明之-實施例之發光二極體模組丨包含—基 U、-發光二極體12、-第-封裝件13以及一第二透光封裝件二； 基板11具有-第-表面11卜-第二表面112以及一開孔113 開孔113貫穿第-表面ιη以及第二表面112。此外，基板^具^ 少一電路層，舉例而言，電路層包含至少一設置於第一表面ui 二導電接點114。於-實施例中，基板u可為—銅㈣基板、—絕緣木 質基板一玻璃纖雜板、-喊基板…複合材料基板、一軟性; 板、-玻賴_浸錢-綠子㈣基板，且不 人』 亦可為多健板疊合而I 續數’ 發光二極體12設置於基板U的開孔113中，並與電路層的第_ 201119091 導電接點114電性連接。與 其此” L 運接舉例而言，發光二極體12是以-弓|線121盥 ^需注意者，每—基板^ r。單-基板”：:=== 置於單i孔113中。第—封裝件13設置於基板 _封裝發光—極體12以及第—導電接點n =則設置於基板η的第二表面U2，用以封裝發光二二封 :貫㈣中，第-封料13可為—高分子材料，較佳者，第 件13亦可為一透光材料。 (BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode module and a method of fabricating the same, and more particularly to a light emitting diode module that improves light extraction efficiency and a method of fabricating the same. [Prior Art] Light-emitting diodes (LEDs) have the advantages of small size, long service life, and power saving. Therefore, LEDs are widely used in backlight modules, lighting fixtures, traffic signs, and decoration. use. The conventional light-emitting diode module is disposed on the substrate or the heat sink with the back surface of the light-emitting diode, and electrically connects the active surface of the light-emitting diode with the circuit layer of the substrate. The light emitted by the electrons and the holes in the NP junction is radiated toward the active surface of the light-emitting diode and the back surface, respectively. However, according to the above configuration, the light emitted toward the back surface of the light-emitting diode is blocked by the substrate or the heat sink and cannot be effectively utilized, so that the light-emitting efficiency of the conventional light-emitting diode module is inferior. In summary, how to improve the light-emitting efficiency of the conventional LED module is the goal that is currently in great demand. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a light emitting diode module and a manufacturing method thereof, which are characterized in that the light-transmitting package is cut off by a light-transmitting package, and therefore, the light-emitting body model of the present invention The group can emit light from the back surface of the light-emitting diode to improve the light-emitting efficiency of the light-emitting diode module. The LED module of the present invention includes a substrate, a light emitting diode, a first package, and a second light transmitting package. The substrate has a H-face, a second 201119091 surface, a circuit layer, and an opening, wherein the opening penetrates the first surface and the second surface, and the circuit layer includes at least a first electrode disposed on the first surface The pole body is disposed at the opening and electrically connected to the first conductive contact. The first package is disposed on the first surface of the substrate, the Jing New Light Dipole and the first Wei contact ^ the second transparent wire assembly The second surface of the substrate is used to encapsulate the light emitting diode. The manufacturing method of the light emitting diode module according to another embodiment of the present invention comprises: providing a carrier and a button, the substrate having a - surface, and a second a surface, a circuit layer, and an opening, and the substrate is disposed on the carrier with the second surface, wherein the opening penetrates the first surface and the surface to expose the surface of the carrier, and the circuit layer includes at least a surface • a first conductive contact; a light-emitting diode is disposed on the surface of the carrier corresponding to the opening; the electrical connection is dimmed and the first conductive contact; and the first surface of the first substrate is hidden Side to encapsulate the light emitting diode and a conductive contact; a carrier plate is removed; and a second light-transmissive package is disposed on the second surface side of the substrate to encapsulate the light-emitting diode. The following is a specific implementation of the _ _ _ _ _ _ _ _ _ _ _ [Embodiment] Please refer to FIG. 1, the light-emitting diode module of the embodiment of the present invention includes a base U, a light-emitting diode 12, and The first package 11 and the second transparent package 2; the substrate 11 has a - surface 11 - a second surface 112 and an opening 113 opening 113 extending through the first surface and the second surface 112. The substrate layer has a circuit layer. For example, the circuit layer includes at least one conductive surface 114 disposed on the first surface ui. In the embodiment, the substrate u can be a copper (four) substrate, and the insulating wood substrate is Glass fiber board, - shouting substrate... composite substrate, a soft; board, - Bray _ immersion - green (four) substrate, and no one can also be a multi-plate superimposed and I continued 'lighting two poles The body 12 is disposed in the opening 113 of the substrate U and electrically connected to the _201119091 conductive contact 114 of the circuit layer. This and its "L then transported example, light-emitting diode 12 is - bow | ^ should be noted that the gray wire 121 are each - substrate ^ r. The single-substrate"::=== is placed in the single-hole 113. The first package 13 is disposed on the substrate_package light-emitting body 12 and the first conductive contact n= is disposed on the second surface U2 of the substrate η For encapsulating the light-emitting two-two seal: in the fourth (four), the first-sealing material 13 may be a polymer material, preferably, the first member 13 may also be a light-transmitting material.
於-實施例中，第二透光封裝件14可為—高分子材料。此外，請 /照圖2 ’於另-實施例中，本發明之發光二極體模、组^之第二透光 ^裝件14’可包含-間隔件⑷以及—透光基板142，其中間隔件⑷ 设置於基板11的第二表面112，而透光基板142則設置於間隔件⑷ 上，使透光基板142與發光二極體12間具有一間隙。 於-實施例中，發光二極體模組更包含一螢光材料，其可設置於 發光-極體12的表面’例如以—螢光膜設置於發光二極體12之上； 或者螢光材料混合於第二透光封裝件及/或第_封裝件的高分子材料 中。此外’螢光材料亦能夠以塗佈或黏合等方式設置於透光基板⑷ 之表面，例如内表面或外表面，或是混合於透絲板⑷巾。藉由透 光基板142與發光二極體12間之間隙的區隔，營光材料即較不會因發 光二極體12所產生的熱能而劣化。 圖1所示之實施例，其發光二極體12之底s 122是與基板u的 第二表面112共平面，但不限於此。發光二極體12之底自122亦可高 於基板11的第二表面112(如圖3a所示），或是低於基板u的第二表 面m(如圖3b所示）。換言之，發光二極體12設置於基板u之開孔 113的投影區域内皆未脫離本發明之精神。 請參照圖4，本發明之發光二極體模組比相較於圖 1所示之實施 201119091 峨組1吻犧㈣、—第二導電 接點115 ’其设置於基板u之第- Ν極以及Ρ極即可分難第一112。如此，發光二極體12之 一矣而⑴,# Ί表面111上之第一導電接點114以及第 一表面112上之紅導電魅m電性連接。 -)H蝴中’本發明之發光二極體模組更包含—反射件(未圖 13 _，以_第—表面⑴ 5a以及® 透光封裝件M的方向放射。請參照圖 明之發光二極體模組更包含一散熱件15，其設置In the embodiment, the second light transmissive package 14 may be a polymer material. In addition, please refer to FIG. 2 'in another embodiment, the light-emitting diode mold of the present invention, the second light-transmitting device 14' of the group may include a spacer (4) and a transparent substrate 142, wherein The spacer (4) is disposed on the second surface 112 of the substrate 11, and the transparent substrate 142 is disposed on the spacer (4) to have a gap between the transparent substrate 142 and the LED 12. In an embodiment, the light emitting diode module further includes a fluorescent material, which may be disposed on the surface of the light emitting body 12, for example, a fluorescent film disposed on the light emitting diode 12; or fluorescent The material is mixed in the second light transmissive package and/or the polymer material of the first package. Further, the fluorescent material can be applied to the surface of the light-transmitting substrate (4), such as the inner surface or the outer surface, or to the surface of the light-transmitting sheet (4) by coating or bonding. By the gap between the light-transmitting substrate 142 and the light-emitting diode 12, the light-emitting material is less deteriorated by the heat energy generated by the light-emitting diode 12. In the embodiment shown in Fig. 1, the bottom s 122 of the light-emitting diode 12 is coplanar with the second surface 112 of the substrate u, but is not limited thereto. The bottom of the LED 12 may also be higher than the second surface 112 of the substrate 11 (as shown in Figure 3a) or the second surface m of the substrate u (as shown in Figure 3b). In other words, the light-emitting diode 12 is disposed in the projection area of the opening 113 of the substrate u without departing from the spirit of the present invention. Referring to FIG. 4, the LED module of the present invention is disposed on the first-bungee of the substrate u compared to the implementation of the 201119091 group 1 kiss (4) and the second conductive contact 115'. And the bungee can be divided into the first 112. Thus, one of the light-emitting diodes 12 is electrically connected to the first conductive contact 114 on the surface 111 of the #1 and the red conductive charm on the first surface 112. -) H Butterfly 'The light-emitting diode module of the present invention further includes a reflection member (not shown in Figure 13 _, in the direction of _ first surface (1) 5a and the light-transmitting package M. Please refer to the light-emitting two of the figure The polar body module further includes a heat sink 15 and its setting
= —表面1U側’以改善發光二極體模組的散熱問題D。散 t封裝件13接觸，如圖％所示，亦可直接與發光1 叶，例如K料所不。需注意者，散熱件之外型可依需求加以設 散熱效^ 、件15之表面設置散減片151以增進散熱件15的 作;，本發明之發光二極體模組是以第二奴封裝件14 ΖίίΓ於—實施例中，發光二極體可以p極朝向第二透 ΐϊΐϋΓ向設置。由於？極之透光率較佳，因此，以發光二極 於、:主要出光面可改善發光二極體模組之出光效率。但不限 ;以么光—極體之叫作為主要出光面亦可實現本發明。 制、、、圖6a至圖6e以及圖丨，以說明本發明之發光二極體模組之 請參照圖6a，首先，提供一載板10以及一基板Π，其中 :11是一表面1U、一第二表面112以及一開孔113，且基 以e m -主—表面112設置於載板10。開孔113則貫穿第一表面 一命—表面112以顯露出载板10的表面。此外，基板U具有至少 114电。路層’電路層包含至少一設置於第-表面ill的第-導電接點 ⑴^參二極體12設置於對應至開孔113峨板 间孔113相對於載板10的投影區域内。請參照圖6c， 201119091 電性連接發光二極體12以及基板11上之電路層，例如第一導電接點 114。請參照圖6d，設置一第一封裝件13於基板u之第一表面 側，以封裝發光二極體12以及第一導電接點1M。如圖&所示，移 除載板ίο;最後，設置一第二透光封裝件14於基板u之第二表面112 側’以封裝發光二極體12，即完成如圖丨所示之發光二極體模組j。 需注意者’載板10對應於開孔113之表面可高於或低於基板u 之第二表面112，者是與基板u之第二表面112共平面，如此即可 依需求改變發光二極體12相對於基板U之位置。 於一貫把例中，基板11上之電路層更包含至少一設置於基板11 之第二表面112的第二導電接點出(如圖4所示）。於此實施例中，可 先電性連接發光二極體12以及第二表面112上之第二導電接點出， 再設置第二透光封裝件14，以絲如圖4所示之發光二極體模組。另 外，本發明所屬技術領域中具有通常知識者可將前述之榮光材料、反 射件以及散熱件等兀件整合至本發明之發光二極體模組之製造流程 中，故在此不再贅述。 知合上述，本發明之發光二極體模組及其製造方法是以透光封裝 件承載發光二極體’因此，本發明之發光二極體模組無需設置導電凸 # f即可由毛光—極體之背面出光，以改善發光二極體模組的出光效 率。較佳者’以發光二極體之p極朝向該透光封裝件的方式設置，可 進一步改善發光二極體模組的出光效率。 以上所述之實施例僅是為說明本發明之技術思想及特點，其目的 在使熟1此項技藝之人士能夠瞭解本發明之内容並據以實施，當不能 ==本發明之專利範圍，即大凡依本發明所揭示之精神所作之均 等邊化或修飾’減涵蓋在本發明之專_圍内。 201119091 【圖式簡單說明】 圖1為一剖面圖，顯示本發明第一實施例之發光二極體模組。 圖2為一剖面圖，顯示本發明第二實施例之發光二極體模組。 圖3a以及圖3b為一剖面圖，顯示本發明第三以及第四實施例之 發光二極體模組。 圖4為一剖面圖，顯示本發明第五實施例之發光二極體模組。 圖5a以及圖5b為一剖面圖，顯示本發明第五以及第六實施例之 發光二極體模組。 圖6a至圖5e為一剖面圖，顯示本發明之實施例之發光二極體模 組之製造方法。 【主要元件符號說明】 1 ' la' lb 發光二極體模組 10 載板 11 基板 111 第一表面 112 第二表面 113 開孔 114 第一導電接點 115 第二導電接點 12 發光二極體 121 引線 122 底面 201119091 13 第一封裝件 14、14， 第二透光封裝件 141 間隔件 142 透光基板 15 散熱件 151 散熱鰭片= - Surface 1U side to improve the heat dissipation problem D of the LED module. The t-package 13 is in contact, as shown in Fig. %, and can also directly illuminate 1 leaf, such as K material. It should be noted that the heat sink may be provided with a heat dissipation effect according to the requirements. The surface of the member 15 is provided with a strip 151 to enhance the heat sink 15; the light emitting diode module of the present invention is a second slave. The package 14 is 实施ίίΓ—in the embodiment, the light emitting diode can be disposed with the p pole facing the second through direction. due to? The light transmittance of the pole is better. Therefore, the light-emitting diode can improve the light-emitting efficiency of the light-emitting diode module. However, it is not limited to; the invention can also be realized by using the light-polar body as the main light-emitting surface. FIG. 6a to FIG. 6e and FIG. 6B illustrate the light-emitting diode module of the present invention. Referring to FIG. 6a, first, a carrier 10 and a substrate are provided, wherein: 11 is a surface 1U, A second surface 112 and an opening 113 are disposed on the carrier 10 with an em-main surface 112. The opening 113 extends through the first surface to the surface 112 to reveal the surface of the carrier 10. Further, the substrate U has at least 114 electricity. The circuit layer 'circuit layer includes at least one first conductive contact (1) disposed on the first surface ill. The reference electrode 12 is disposed in a projection area corresponding to the opening 113 of the opening 113 relative to the carrier 10. Referring to FIG. 6c, 201119091 electrically connects the LED 12 and the circuit layer on the substrate 11, such as the first conductive contact 114. Referring to FIG. 6d, a first package member 13 is disposed on the first surface side of the substrate u to encapsulate the light emitting diode 12 and the first conductive contact 1M. As shown in the figure &, the carrier plate is removed; finally, a second light-transmissive package member 14 is disposed on the second surface 112 side of the substrate u to encapsulate the light-emitting diode 12, that is, as shown in FIG. Light-emitting diode module j. It should be noted that the surface of the carrier 10 corresponding to the opening 113 may be higher or lower than the second surface 112 of the substrate u, which is coplanar with the second surface 112 of the substrate u, so that the light emitting diode can be changed according to requirements. The position of the body 12 relative to the substrate U. In a conventional example, the circuit layer on the substrate 11 further includes at least one second conductive contact disposed on the second surface 112 of the substrate 11 (as shown in FIG. 4). In this embodiment, the second conductive contact on the light-emitting diode 12 and the second surface 112 can be electrically connected first, and then the second light-transmitting package 14 is disposed, and the light is as shown in FIG. Polar body module. In addition, those skilled in the art to which the present invention pertains can integrate the aforementioned components such as the glare material, the reflector, and the heat dissipating component into the manufacturing process of the illuminating diode module of the present invention, and therefore will not be described herein. In view of the above, the LED module of the present invention and the manufacturing method thereof are provided with the light-emitting diodes in the light-transmitting package. Therefore, the LED module of the present invention can be used without the need to provide the conductive bumps #f. - The back side of the polar body emits light to improve the light extraction efficiency of the LED module. Preferably, the p-pole of the light-emitting diode is disposed toward the light-transmissive package, and the light-emitting efficiency of the light-emitting diode module can be further improved. The embodiments described above are only for explaining the technical idea and the features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the patent scope of the present invention. That is, the equalization or modification of the spirit of the present invention is covered by the scope of the present invention. 201119091 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a light emitting diode module according to a first embodiment of the present invention. 2 is a cross-sectional view showing a light emitting diode module according to a second embodiment of the present invention. 3a and 3b are cross-sectional views showing the light-emitting diode modules of the third and fourth embodiments of the present invention. 4 is a cross-sectional view showing a light emitting diode module according to a fifth embodiment of the present invention. Fig. 5a and Fig. 5b are cross-sectional views showing the light-emitting diode modules of the fifth and sixth embodiments of the present invention. Fig. 6a to Fig. 5e are cross-sectional views showing a method of manufacturing a light emitting diode module according to an embodiment of the present invention. [Main component symbol description] 1 'la' lb LED module 10 carrier 11 substrate 111 first surface 112 second surface 113 opening 114 first conductive contact 115 second conductive contact 12 light emitting diode 121 lead 122 bottom surface 201119091 13 first package 14 , 14 , second light transmissive package 141 spacer 142 transparent substrate 15 heat sink 151 heat sink fin