201117706 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子裝置，尤係一種用於性能穩定之電 子裝置。 【先前技術】 [0002] 一些常見之電子設備例如伺服器，通常都有二處理器， 每個處理器在運行之時均會產生大量熱，為此，需要給 每個處理器均配備一散熱裝置，並引導系統風流經散熱 裝置以提高散熱效率。惟，在一些場合，例如，由於處 理器周邊電子元件（例如，硬碟）之存在，會對系統風 進行阻擋和/或預加熱，導致分別進入到兩個處理器之散 熱裝置之氣流之量和/或溫度產生了差異，而使得兩個散 熱裝置之散熱效率不同，而無法很好地兼顧兩個處理器 之散熱需求。 【發明内容】 [0003] 有鐾於此，有必要提供一種平衡多個發熱電子元件散熱 之電子裝置。 [0004] 一種電子裝置，其内設置有一第一電子元件及與第一電 子元件間隔設置之一第二電子元件，一第一散熱器用於 對第一電子元件散熱，一第二散熱器用於對第二電子元 件散熱，該電子裝置具有一氣流通道，第一散熱器包括 一第一散熱部及一散熱能力較第一散熱部弱之第二散熱 部，第二散熱器包括一第一散熱部及一散熱能力較第一 散熱部弱之第二散熱部，該第一散熱器之第一、第二散 熱部與第二散熱器之第一、第二散熱部交錯設置，且第 098138472 表單編號A0101 201117706 二散熱器之第二散熱部與第一散熱器之第一散熱部前後 設置於該氣流通道之第一侧，該第二散熱器之第一散熱 部與該第一散熱器之第二散熱部前後設置於該氣流通道 之第二側。 [0005] 與習知技術相比，本發明電子裝置内第一、第二散熱器 散熱能力強弱不同之第一、第二散熱部交錯設置且分別 位於氣流通道之兩侧，均衡第一、第二電子元件散發之 熱量，保障電子裝置之穩定性。 Q 【實施方式】 [0006] 下面參照附圖結合實施例對本發明作進一步之說明。 [0007] 請參閱圖1至圖3，本發明一實施例中之電子裝置可為但 不限於一伺服器，其可包括一電路板11、設置於電路板 11上之二電子元件、位於電路板11左右兩侧且蔣二電子 元件夾設其間之一第一記憶體30及一第二記憶體40及位 於二電子元件前側之一第一硬碟50及一第二硬碟60。在 一些實施例中，二電子元件為一第一處理器10及位於第 〇 一處理器10右侧之一第二處理器20。第一、第二處理器 10、20及第一、第二記憶體30、40並排設置，從而使第 一、第二記憶體30、40之間形成一供氣流穿行之氣流通 道90。 [0008] 可以理解地，該氣流通道90也可以由位於第一、第二處 理器10、20左右相對兩侧之其他元件形成，如二凸板、 其他電子元件等。其中，第一處理器10所在一侧之氣流 通道90為第一通道91，第二處理器20所在一侧之氣流通 道90為第二通道92。第一、第二硬碟50、60並排設置。 098138472 表單編號A0101 第5頁/共17頁 201117706 第一硬碟50正對第一、第二處理器10、20相靠近一側之 前端。第二硬碟60正對第二記憶體40及第一處理器10相 靠近一側之前端。如此設置，第一通道91之流阻小，第 二通道92之流阻大。一散熱器組合用於對第一、第二處 理器10、20散熱，其包括一第一散熱器70及一第二散熱 器80。 [0009] 再如圖1及2所示，該第一散熱器70可包括一第一散熱部 71及自第一散熱部71垂直延伸之一第二散熱部73。該第 一散熱部71包括一縱長之基板713及自基板71 3上表面垂 直向上延伸且平行、間隔設置之複數散熱片715，相鄰散 熱片715之間之間隔之朝向與氣流通道9 0_之朝向一致，以 供氣流通過而散熱。該第二散熱部73同樣包括一縱長之 基板733及自基板733上表面垂直向上延伸且平行、間隔 設置之複數散熱片735，相鄰散熱片735之間之間隔之朝 向與氣流通道90之朝向一致，以供氣流通過而散熱。散 熱片715、735可相互平行。第二散熱部73之基板733可 與第一散熱部71之基板713 —體連接，第二散熱部73之基 板733自第一散熱部71之基板713之右端後側向後延伸形 成。基板733之長度較基板713之長度小，其寬度略大於 基板713之寬度。基板713貼設第一處理器10，基板733 位於第二處理器20之右侧端。可以理解地，在一些實施 例中第一散熱部71之基板713也可與第二散熱部73之基板 733呈分離設計，而通過熱管將兩者相連。 [0010] 該第二散熱器80與第一散熱器70類似，可包括一第一散 熱部81及自第一散熱部81垂直延伸之一第二散熱部83。 098138472 表單編號A0101 第6頁/共17頁 0982065978-0 201117706 Ο Q [0011] 該第一散熱部81包括一縱長之基板81 3及自基板813上表 面垂直向上延伸且平行、間隔設置之複數散熱片815。該 第二散熱部83同樣包括一縱長之基板833及自基板83 3'上 表面垂直向上延伸且平行、間隔設置之複數散熱片835。 散熱片815、835相互平行。第二散熱部83之基板833與 第一散熱部81之基板813—體連接’第二散熱部83之基板 833自第一散熱部81之基板813之左端前側向前延伸形成 。基板833之長度較基板813之長度小，其寬度大於某板 813之寬度。基板833之寬度大於基板713之寬度。基板 81 3貼設第二處理器20且位於第一散熱器7〇第二散熱部 73之前端並可完全阻擋第二散熱部73 β基板833位於第一 散熱器70之第一散熱部71之前端並可完全阻#第一 部71。第-散熱部81及第二散熱部73前後排布於第二通 道92中。第二散熱部83及第—散熱部71前後排布於第一 通道91中。第-散熱聰之散熱面積較第二散熱部^大 ，因而其散熱能力較第二散熱部83強。 在-些實施例中’第一、第二散熱器？〇、8〇均呈L形設置 ，且兩者之結構相同，以採用同一規格之散熱器給第一 υβιπο' 2Q散熱’從而可以降低散熱器之設計 及製造成本。 [0012] 如圖3所τ電子裝置工作時’第一散熱器7〇吸收第一處 理器1〇f發之熱量，第二散熱器8〇吸收第二處理器20散 發之熱量。系統風從電子裝置之前端吹向後端。因第一 通道91之流阻小，卢. 厅乂，系統風較多地吹向氣流通道9〇 中第一通道91所在之-側，從而使第—通道91中之氣流 098138472 表單編號腦1第7 —頁 __ 201117706 量較第二通道92中之氣流量大。同時，因第一、第二硬 碟50、60均更靠近第二處理器20之前端，且因第一、第 二硬碟50、60在運行時也會產生熱量，因此，系統風流 經第一、第二硬碟50、60後會被預熱，使得進入第二通 道92之氣流溫度較進入第一通道91之溫度高。 [0013] 請同時參閱圖4，習知之電子裝置組合與本發明之電子裝 置組合相似，同樣包括一氣流通道90a及分別位於氣流通 道90a相對兩側之一第一處理器10a及一第二處理器20a 。其中，第一處理器l〇a所在一側之氣流通道為第一通道 91a，第二處理器20a所在一侧之氣流通道為第二通道 92a。習知之電子裝置組合與本發明之電子裝置組合之區 別在於：二大致呈矩形之散熱器70a分別對第一、第二處 理器10a、20a散熱且分別位於第一、第二通道9la及92a 中。因第一、第二硬碟50a、60a之阻擋，第二通道92a 中氣流之流量較第一通道91 a小且氣流溫度較第一通道 91a中高。如此，必然造成第一、第二處理器10a、20a 之溫度差。 [0014] 本發明中，由於第二散熱器80之第二散熱部83伸入到第 一通道91中，並位於第一散熱器70之第一散熱部71之前 侧，而第一散熱器70之第二散熱部73伸入到第二通道92 中，並位於第二散熱器80之第一散熱部81之後側，使得 本發明中之第一、第二散熱器70、80相對於圖4中之二散 熱器70a而言，第一散熱器70之散熱能力整體有所下降， 而第二散熱器80之整體散熱能力有所上升。如此設置， 則當第一通道91中之氣流量和/或溫度較第二通道92中之 098138472 表單編號A0101 第8頁/共17頁 201117706 氣流量和/或溫度大時，第一散熱器7〇與第二散熱器8〇之 散熱能力整體上恰好相等或接近相等，從而能夠對第〆 處理器10、第二處理器2〇進行均衡地散熱目之。 [0015] [0016] [0017] Ο [0018] Q [0019] [0020] [0021] [0022] [0023] [0024] 可以理解地’第—散熱器70之散熱片715、735町通過〆 L形熱管連接在一起而不用設置基板713、733。 可以理解地’第一、第二散熱器7〇、可為結構不同之 散熱器，只要能實現本發明均溫之目之即可。 可以理解地，導致氣流通道9〇兩側氣流之風量和/或溫度 不等之因素可不局限於上述實施例中之硬碟5〇、6〇，而 可根據電子裝置之内部搭配為其他元件。 综上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明電子裝置中第-、第二散熱器之組合後之示 意圖。 圖2係圖1中第一、第二散熱器分開後之示意圖。 圖3係本發明電子裝置之示意圖。 圖4係習知之電子裝置之示意圖。 【主要元件符號說明】 第一處理器：10 電路板：11 098138472 表單編號Α0101 第9頁/共17頁 0982065978-0 201117706 [0025] 第二處理器：20 [0026] 第一記憶體：30 [0027] 第二記憶體：40 [0028] 第一硬碟：5 0 [0029] 第二硬碟：60 [0030] 第一散熱器：70 [0031] 第一散熱部：71 [0032] 第二散熱部：73 [0033] 第二散熱器：80 [0034] 氣流通道：90 [0035] 第一通道：91 [0036] 第二通道：92 [0037] 第一散熱部：81 [0038] 第二散熱部：83 [0039] 基板：713 [0040] 散熱片：71 5 [0041] 基板：733 [0042] 散熱片：735 [0043] 基板：813201117706 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to an electronic device, and more particularly to an electronic device for stable performance. [Prior Art] [0002] Some common electronic devices, such as servers, usually have two processors, each of which generates a large amount of heat during operation. To this end, each processor needs to be equipped with a heat sink. The device directs the system wind through the heat sink to improve heat dissipation efficiency. However, in some cases, for example, due to the presence of electronic components (eg, hard disks) around the processor, the system wind is blocked and/or preheated, resulting in the amount of airflow entering the heat sinks of the two processors, respectively. There is a difference between the temperature and/or the temperature, so that the heat dissipation efficiency of the two heat sinks is different, and the heat dissipation requirements of the two processors cannot be well balanced. SUMMARY OF THE INVENTION [0003] In view of this, it is necessary to provide an electronic device that balances heat dissipation of a plurality of heat-generating electronic components. [0004] An electronic device is provided with a first electronic component and a second electronic component spaced apart from the first electronic component, a first heat sink for dissipating heat from the first electronic component, and a second heat sink for pairing The second electronic component has a heat dissipation portion, and the first heat sink includes a first heat dissipation portion and a second heat dissipation portion that is weaker than the first heat dissipation portion, and the second heat sink includes a first heat dissipation portion. And a second heat dissipating portion having a lower heat dissipation capability than the first heat dissipating portion, the first and second heat dissipating portions of the first heat sink and the first and second heat dissipating portions of the second heat sink are staggered, and the number of the 098138472 form is A0101 201117706 The second heat dissipating portion of the second heat sink and the first heat dissipating portion of the first heat sink are disposed on the first side of the air flow channel, and the first heat dissipating portion of the second heat sink and the second heat dissipating portion The heat dissipating portion is disposed on the second side of the air flow passage. [0005] Compared with the prior art, the first and second heat dissipating portions of the first and second heat sinks having different heat dissipation capacities in the electronic device of the present invention are staggered and respectively located on both sides of the air flow channel, and the first and the second are equalized. The heat emitted by the two electronic components ensures the stability of the electronic device. [Embodiment] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings. Referring to FIG. 1 to FIG. 3, an electronic device in an embodiment of the present invention may be, but not limited to, a server, which may include a circuit board 11, two electronic components disposed on the circuit board 11, and a circuit. The first memory 30 and the second memory 40 are disposed on the left and right sides of the board 11 and the first hard disk 50 and the second hard disk 60 are located on the front side of the two electronic components. In some embodiments, the two electronic components are a first processor 10 and a second processor 20 located on the right side of the first processor 10. The first and second processors 10, 20 and the first and second memories 30, 40 are arranged side by side such that an air flow path 90 for airflow is formed between the first and second memories 30, 40. It can be understood that the air flow passage 90 can also be formed by other components located on opposite sides of the first and second processors 10, 20, such as two convex plates, other electronic components and the like. The air channel 90 on the side where the first processor 10 is located is the first channel 91, and the air channel 90 on the side where the second processor 20 is located is the second channel 92. The first and second hard disks 50, 60 are arranged side by side. 098138472 Form No. A0101 Page 5 of 17 201117706 The first hard disk 50 faces the front end of the first and second processors 10, 20 close to one side. The second hard disk 60 faces the front end of the second memory 40 and the first processor 10 adjacent to one side. With this arrangement, the flow resistance of the first passage 91 is small, and the flow resistance of the second passage 92 is large. A heat sink assembly for dissipating heat to the first and second processors 10, 20 includes a first heat sink 70 and a second heat sink 80. As shown in FIGS. 1 and 2, the first heat sink 70 may include a first heat dissipating portion 71 and a second heat dissipating portion 73 extending perpendicularly from the first heat dissipating portion 71. The first heat dissipating portion 71 includes an elongated substrate 713 and a plurality of fins 715 extending vertically upward from the upper surface of the substrate 71 and spaced apart from each other. The spacing between the adjacent fins 715 and the airflow path 90 _ is oriented in the same direction for airflow to pass through. The second heat dissipating portion 73 also includes an elongated substrate 733 and a plurality of fins 735 extending vertically upward from the upper surface of the substrate 733 and spaced apart from each other. The spacing between adjacent fins 735 and the airflow path 90 are The orientation is uniform for heat flow through the airflow. The heat sinks 715, 735 may be parallel to each other. The substrate 733 of the second heat radiating portion 73 is connected to the substrate 713 of the first heat radiating portion 71, and the substrate 733 of the second heat radiating portion 73 is formed to extend rearward from the rear end of the right end of the substrate 713 of the first heat radiating portion 71. The length of the substrate 733 is smaller than the length of the substrate 713, and its width is slightly larger than the width of the substrate 713. The substrate 713 is attached to the first processor 10, and the substrate 733 is located at the right end of the second processor 20. It can be understood that, in some embodiments, the substrate 713 of the first heat dissipating portion 71 can also be separated from the substrate 733 of the second heat dissipating portion 73, and the two are connected by a heat pipe. [0010] The second heat sink 80 is similar to the first heat sink 70 and may include a first heat radiating portion 81 and a second heat radiating portion 83 extending perpendicularly from the first heat radiating portion 81. 098138472 Form No. A0101 Page 6 of 17 0982065978-0 201117706 Ο Q [0011] The first heat dissipating portion 81 includes an elongated substrate 81 3 and a plurality of vertically extending parallel and spaced intervals from the upper surface of the substrate 813 Heat sink 815. The second heat dissipating portion 83 also includes an elongated substrate 833 and a plurality of fins 835 extending vertically upward from the upper surface of the substrate 83 3' and arranged in parallel and spaced apart. The fins 815, 835 are parallel to each other. The substrate 833 of the second heat radiating portion 83 is connected to the substrate 813 of the first heat radiating portion 81. The substrate 833 of the second heat radiating portion 83 is formed to extend forward from the front side of the left end of the substrate 813 of the first heat radiating portion 81. The length of the substrate 833 is smaller than the length of the substrate 813, and the width thereof is larger than the width of a certain plate 813. The width of the substrate 833 is greater than the width of the substrate 713. The substrate 81 3 is attached to the second processor 20 and located at the front end of the first heat sink 7 and the second heat sink 73 and can completely block the second heat sink 73. The base substrate 833 is located at the first heat sink 71 of the first heat sink 70. The front end can completely block the first portion 71. The first heat radiating portion 81 and the second heat radiating portion 73 are arranged in the second channel 92 in the front and rear. The second heat radiating portion 83 and the first heat radiating portion 71 are arranged side by side in the first passage 91. The heat dissipation area of the first heat sink is larger than that of the second heat sink portion, and thus the heat dissipation capability is stronger than that of the second heat sink portion 83. In some embodiments, the first and second heat sinks? Both 〇 and 8〇 are arranged in an L shape, and the structure of the two is the same. The heat dissipation of the first υβιπο' 2Q can be reduced by using the heat sink of the same specification to reduce the design and manufacturing cost of the heat sink. [0012] When the electronic device operates as shown in FIG. 3, the first heat sink 7 absorbs the heat generated by the first processor 1〇f, and the second heat sink 8〇 absorbs the heat radiated by the second processor 20. The system wind blows from the front end of the electronic device to the rear end. Because the flow resistance of the first passage 91 is small, Lu. Hall, the system wind blows more toward the side of the first passage 91 in the air passage 9〇, so that the airflow in the first passage 91 is 098138472. The 7th-page __ 201117706 quantity is larger than the air flow in the second channel 92. At the same time, since the first and second hard disks 50 and 60 are closer to the front end of the second processor 20, and the first and second hard disks 50 and 60 generate heat during operation, the system wind flows through the first 1. The second hard disk 50, 60 is preheated, so that the temperature of the airflow entering the second channel 92 is higher than the temperature entering the first channel 91. [0013] Please also refer to FIG. 4, the conventional electronic device combination is similar to the electronic device combination of the present invention, and also includes an air flow channel 90a and a first processor 10a and a second processing respectively located on opposite sides of the air flow channel 90a. 20a. The airflow channel on the side where the first processor 10a is located is the first channel 91a, and the airflow channel on the side where the second processor 20a is located is the second channel 92a. The difference between the conventional electronic device combination and the electronic device combination of the present invention is that the two substantially rectangular heat sinks 70a respectively dissipate heat to the first and second processors 10a, 20a and are respectively located in the first and second channels 9la and 92a. . Due to the blocking of the first and second hard disks 50a, 60a, the flow rate of the airflow in the second passage 92a is smaller than that of the first passage 91a and the airflow temperature is higher than that in the first passage 91a. Thus, the temperature difference between the first and second processors 10a, 20a is inevitably caused. In the present invention, the second heat sink 83 of the second heat sink 80 extends into the first channel 91 and is located on the front side of the first heat sink portion 71 of the first heat sink 70, and the first heat sink 70 The second heat dissipating portion 73 extends into the second passage 92 and is located at the rear side of the first heat dissipating portion 81 of the second heat sink 80, so that the first and second heat sinks 70, 80 of the present invention are relative to FIG. In the case of the second heat sink 70a, the heat dissipation capability of the first heat sink 70 is generally reduced, and the overall heat dissipation capability of the second heat sink 80 is increased. With this arrangement, when the air flow rate and/or temperature in the first passage 91 is larger than the 098138472 form number A0101 in the second passage 92, the eighth radiator/the temperature is large, the first radiator 7 The heat dissipation capability of the second heat sink 8 is substantially equal or nearly equal to the whole, so that the second processor 10 and the second processor 2 can be evenly cooled. [0017] [0018] [0020] [0020] [0024] [0024] [0024] It can be understood that the heat sink of the first radiator 70, 715, 735, passed through 〆 The L-shaped heat pipes are connected together without providing the substrates 713, 733. It can be understood that the first and second heat sinks 7 can be radiators having different structures as long as the temperature of the present invention can be achieved. It can be understood that the factors causing the airflow and/or temperature of the airflow on both sides of the airflow passage 9〇 are not limited to the hard disks 5〇 and 6〇 in the above embodiment, and may be other components according to the internal fitting of the electronic device. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the combination of a first and a second heat sink in an electronic device of the present invention. 2 is a schematic view showing the first and second heat sinks in FIG. Figure 3 is a schematic illustration of an electronic device of the present invention. 4 is a schematic diagram of a conventional electronic device. [Description of main component symbols] First processor: 10 Circuit board: 11 098138472 Form number Α 0101 Page 9 / Total 17 page 0992065978-0 201117706 [0025] Second processor: 20 [0026] First memory: 30 [ 0027] Second memory: 40 [0028] First hard disk: 5 0 [0029] Second hard disk: 60 [0030] First heat sink: 70 [0031] First heat sink: 71 [0032] Second Heat sink: 73 [0033] Second heat sink: 80 [0034] Air flow channel: 90 [0035] First channel: 91 [0036] Second channel: 92 [0037] First heat sink: 81 [0038] Second Heat sink: 83 [0039] Substrate: 713 [0040] Heat sink: 71 5 [0041] Substrate: 733 [0042] Heat sink: 735 [0043] Substrate: 813
098138472 表單編號A0101 第10頁/共17頁 0982065978-0 201117706 [0044] 散熱片：815 [0045] 基板：833 [0046] 散熱片：835 [0047] 第一處理器：10a [0048] 第二處理器：20a [0049] 第一硬碟：50a [0050] 第二硬碟：60a [0051] 散熱器：70a [0052] 氣流通道：90a [0053] 第一通道：91a [0054] 第二通道：92a 〇 098138472 表單編號Α0101 第11頁/共17頁 0982065978-0098138472 Form No. A0101 Page 10 of 17 0982065978-0 201117706 [0044] Heat sink: 815 [0045] Substrate: 833 [0046] Heat sink: 835 [0047] First processor: 10a [0048] Second processing Device: 20a [0049] First hard disk: 50a [0050] Second hard disk: 60a [0051] Heat sink: 70a [0052] Air flow channel: 90a [0053] First channel: 91a [0054] Second channel: 92a 〇098138472 Form No. 1010101 Page 11 of 17 0982065978-0