201109604 •六、發明說明： ' 【發明所屬之技術領域】201109604 • Six, invention description: 'Technical field to which the invention belongs
本發明涉及一種熱管及採用該熱管的散熱I 置，尤其涉及一種具有較高強度的熱管及採用該熱 管的散熱裝置。 ' 【先前技術】 目如，由於熱管具有較快的傳熱速度，而廣泛 • 應用於具較大發熱量的電子元件的散熱。習知的熱 管通常包括一中空的殼體、設於該殼體内表面的毛 細結構及填充於該殼體内的適量的工作流體。所述 熱管的一端為蒸發端，另一端為冷凝端，在具體應 用時，將熱官的洛發端與一發熱電子元件相接觸， 以吸收該發熱電子元件所產生的熱量並傳導至其冷 凝端，該冷凝端與一散熱器連接，以進一步將熱量 向外散發。 •然而，習知的熱管的殼體均為中空的管狀，其 強度較低，從而限制其應用領域。如 /器 撕常需要通過過盈配合的方式相連接，二散熱 器上設有供熱管穿設的一穿孔’該穿扎的孔徑略小 於熱管的外徑’將該熱管穿設於該穿孔内以使二者 間緊配結合。而由於習知的熱管強度不夠，與散埶 器緊配結合時容易產生變形，從而會破化熱管内的 毛細結構’影響熱管的導熱性能。 201109604 【發明内容】 有繁於此’有必要提供一種強度較高的熱管及 ' 使用該熱管的散熱裝置。 一種熱管’包括一管體及設於該管體内表面的 毛細結構，該管體内沿管體的軸向還設有一支架， 该支架與管體内的毛細結構相抵觸而支撐設於該管 體内部並將該管體的内部空間分割成複數通道，該 Φ 支架的外表面上設有毛細結構。 一種散熱裝置，該散熱裝置包括一散熱器及穿 设於該散熱器上的一熱管，該散熱器包括一中心部 及由該中心部向外延伸的複數散熱片，該中心部内 «L有一供熱管穿設的穿孔，該熱管通過過盈配合與 該穿孔相結合，該熱管包括一管體及設於該管體内 表面的毛細結構，該管體内沿管體的軸向還設有一 _ 支架，該支架與管體内的毛細結構相抵觸而支撐設 於該官體内部並將該管體的内部空間分割成複數通 道’該支架的外表面上設有毛細結構。 與習知技術相比，上述散熱裝置中的熱管内部 設^支架，該支架支撐於該熱管的管體内，提高了 熱官的強度，防止熱管與散熱器通過過盈配合相結 合時而產生變形，同時該支架的外表面上設有毛細 π構了以增強熱管内工作流體的回流速度，從而提 高熱管的導熱性能。 201109604 【實施方式】 以下參照附圖’對本發明熱管及應用該熱管的 散熱裝置予以進一步說明。 如圖1所示，該散熱裝置包括一散熱器10及穿 設於該散熱器10内的一熱管20。The present invention relates to a heat pipe and a heat sink I using the same, and more particularly to a heat pipe having a higher strength and a heat sink using the heat pipe. [Prior Art] For example, because heat pipes have a fast heat transfer rate, they are widely used for heat dissipation of electronic components with large heat generation. Conventional heat pipes typically include a hollow housing, a capillary structure disposed on the inner surface of the housing, and an appropriate amount of working fluid filled within the housing. One end of the heat pipe is an evaporation end, and the other end is a condensation end. In a specific application, the heat-emitting end of the heat-generating contact is contacted with a heat-generating electronic component to absorb the heat generated by the heat-generating electronic component and conduct to the condensation end thereof. The condensation end is connected to a heat sink to further dissipate heat outward. • However, conventional heat pipe housings are hollow tubular and have low strength, which limits their field of application. For example, the tearing of the device is often connected by means of an interference fit, and the second heat sink is provided with a through hole for the heat pipe to pass through. The pierced aperture is slightly smaller than the outer diameter of the heat pipe. In order to make the two tightly combined. However, since the conventional heat pipe is insufficient in strength, it is easily deformed when it is tightly coupled with the diffuser, and the capillary structure in the heat pipe is broken to affect the heat conductivity of the heat pipe. 201109604 [Summary of the Invention] It is necessary to provide a heat pipe having a higher strength and a heat sink using the heat pipe. A heat pipe 'includes a pipe body and a capillary structure disposed on the inner surface of the pipe body. The pipe body further has a bracket along the axial direction of the pipe body, and the bracket is supported by the capillary structure in the pipe body. The inside of the pipe body divides the inner space of the pipe body into a plurality of passages, and the outer surface of the Φ bracket is provided with a capillary structure. A heat dissipating device includes a heat sink and a heat pipe disposed on the heat sink, the heat sink including a center portion and a plurality of heat sinks extending outward from the center portion, wherein the center portion has a supply The heat pipe is provided with a perforation, and the heat pipe is combined with the perforation by an interference fit, the heat pipe comprises a pipe body and a capillary structure disposed on the inner surface of the pipe body, and the pipe body is further provided with a body along the axial direction of the pipe body The bracket is in contact with the capillary structure in the tube body to support and is disposed inside the body and divides the internal space of the tube body into a plurality of channels. The outer surface of the bracket is provided with a capillary structure. Compared with the prior art, the heat pipe in the heat dissipating device is internally provided with a bracket, and the bracket is supported in the tube body of the heat pipe, thereby improving the strength of the heat officer and preventing the heat pipe and the heat sink from being combined by the interference fit. Deformation, at the same time, the outer surface of the bracket is provided with capillary π structure to enhance the reflow speed of the working fluid in the heat pipe, thereby improving the thermal conductivity of the heat pipe. [Embodiment] Hereinafter, a heat pipe of the present invention and a heat sink using the heat pipe will be further described with reference to the accompanying drawings. As shown in FIG. 1, the heat sink includes a heat sink 10 and a heat pipe 20 disposed in the heat sink 10.
'•亥政熱器10整體大致為方矩狀，其包括一中心 部12及自該中心部12外圍向外呈放射狀延伸而出 的複數散熱片14。該中心部12包括一柱體12〇及 由該柱體120外圍延伸而出的四個導熱分支部 122。該柱體12〇為四棱柱體，該柱體12〇的中心設 有一供熱官20穿設的圓形的穿孔124，該穿孔124 由該柱體120的頂面貫穿至其底面。所述導熱分支 部122分別由該四棱柱體的四棱角向外輻射延伸。 該等散熱片14分別由四棱柱體的四個側面及導熱 分支部122的外表面向外沿徑向延伸，且被導熱分 支邛122間隔成四部分，每一部分散熱片Μ與其對 應的四棱柱體的側面相垂直。 ^同時參閱圖2’該熱管2〇大致為圓柱形，售 熱官2〇包括一底板22、與該底板22相對的一頂才 24、連接於該底板22與頂板24之間的一管體26 設於該管體26内的一支年 文永28、及填充於該管體2 内的適量的工作流體（圖未示）。 該底板22為圓形板狀’該底板22的上表面」 201109604 設有毛細結構220,該毛細結構細為粉末燒結毛 二、、、σ構》。該管體26為一頂端和底端均為開口的圓 吕，該官體26的底部開口端262通過焊接與該底板 22的上表面相連接，該管體26的外徑與該底板22 的外徑相同，可使該底板22恰好封設在該開口端 262上。該官體26的長度與該散熱器10的穿孔124 的長度相同，該管體26的外徑略大於該穿孔124的 内徑:以與該穿孔124緊配合結合。該管體26的内 表面叹有毛細結構260，該毛細結構26〇亦為粉末 燒結毛細結構，當該底板22封設於管體26的底端 後，毛細結構260與底板22的上表面的毛細結構 220相接。 該頂板24通過焊接封設在該管體26的頂部開 & 264上。該頂板24的形狀及大小與該頂部開口 端264的形狀及大小相同。該頂板％的中心位置設 有一通孔（圖未示），該頂板24於該通孔的周緣向 上延伸形成一管徑較小的圓管242，該圓管242的 末，形成一密封部244，該熱管20通過該圓管242 向官體26内注入工作流體及抽真空再經過夾扁加 工等步驟形成該密封部244。 凊同時參閱圖3,該支架28收容於該管體26 内。該支架28的橫截面呈“十，，字形，其包括一沿 管體26軸向延伸的縱長的第一支撐板282、與該第 201109604 一支撐板282垂直並且相交的第二支撐板284、及 设於所述第一支撐板282及第二支撐板284的外表 * 面的毛細結構280。該第二支撐板284與第一支撐 板282均呈矩形板狀’該第二支撐板284沿管體26 的徑向延伸的寬度與該第一支撐板282的寬度相 等’且均等於管體26的内徑的大小。該支架28整 體的外圍尺寸的大小與該管體26的内徑的大小相 鲁 同’可剛好支撐於該管體26内並通過焊接或燒結與 δ亥管體26的内表面固定連接’該支架28將管體26 内部的空間均勻地分隔成沿管體26軸向延伸的四 個氣流通道266。該支架28的長度小於該管體26 的長度。該支架28收容於該管體26内後，其底端 與管體26的底端相平齊’且抵靠在該底板22的毛 細結構220上’該第一支撐板282與第二支撐板284 相交的位置恰好位於管體26中心的轴線處，所述第 • 一及第二支撐板282、284的侧邊與管體26内的毛 細結構260相抵觸，而該支架28的頂端與該管體 26的頂端保持一定的距離，即該支架28的頂端與 該頂板24夂間形成一空間268。因此，當該支架28 收容於該管體26内後，該支架28上的毛細結構28〇 與該底板22的毛細結構22〇以及管體26的毛細結 構260相連接，形成一整體連通的毛細結構。在本 實施例中，該支架28上的毛細結構28〇與該底板 22上的毛細結構22〇以及管體％内的毛細結構26〇 201109604 均為相同的燒結式毛細結構。具體實施時，所述毛 細結構280、220、260亦可均為溝槽或絲網毛細結 構，或者為燒結、溝槽或絲網毛細結構中的任意組 合0 組裝時，該熱管20穿設於散熱器10的穿孔124 内，並與散熱器10通過過盈配合相結合。該熱管 20的底板22的外表面與該散熱器10的中心部12 的底面在同一平面上。由於該支架28支撐在該管體 26内，可以增強熱管20的強度，防止該管體26與 散熱器10的穿孔124緊配合時而變形。使用時，該 熱管20的底板22直接與一發熱電子元件相貼設， 因此，該發熱電子元件產生的熱量迅速傳導至熱管 20的底板22使得熱管20内的工作流體於底板22 處氣化並沿熱管20内的四個氣流通道266向上流動 並迅速充填於管體26内，氣化後的工作流體碰到管 體26的内壁及頂板24後釋放熱量並凝結成液態的 工作流體，釋放的熱量通過散熱器10向外散發，而 液態的工作流體在熱管20内的毛細結構280、220、 260的作用力下迅速回流至熱管20的底端，通過該 工作流體的循環運動，將電子元件產生的熱量迅速 傳遞至熱管20外圍的散熱器10而散發出去。由於 管體26内於支架28頂端的空間268的設置，各氣 流通道266内的高溫氣體在上升至支架28頂端的空 間268後混合在一起，從而增強各氣流通道266内 201109604 氣體的互動，防止單一氣流通道266内氣體過多或 溫度過高而影響熱管20的導熱性能。該支架28支 撐在該管體26内，可以增強熱管2〇的強度，同時 該支架28上毛細結構28〇的設置，增強了熱管 内毛細結構220、260的整體毛細作用力及流體輪送 能力，增加了熱管20内工作流體的回流路徑，從而 提高熱管20的導熱性能。 圖4為本發明熱管20的内部的支架28a的第二 實施例。本實施例與前一實施例的區別在於：該支 架28a由金屬粉末燒結形成’其還包括與該第—支 撐板282垂直相交的第三及第四支撐板286、288， 該第二及第四支撐板286、288分別位於該第二支撑 板284的前、後兩側且與該第二支撐板284平行等 間隔設置。該第三及第四支撐板286 ' 288沿管體 26的徑向延伸的寬度相等，且小於該第一支撐板 282及第二支撐板284的寬度。該支架28a將管體 26内部的空間分隔成沿管體26軸向延伸的多個氣 流通道266a ’該等氣流通道266a形成在支撐板 282(284、286、’288)與管體％之間。該第三及.第四 支撐板286、288的設置可以進一步提高熱管2〇的 内部強度，同時增大支架28a的表面積。所述支架 28a直接形成為内部具有大量孔隙的毛細結構28〇， 從而產生較大的毛細作用力而進一步補足該熱管2〇 内毛細結構220、260的整體毛細作用力及流體輸送 201109604 能力提高熱管20内的工作流體回流的速度。 圖5為本發明熱管20的内部的支架28b的第三 ' 實施例。該支架28b整體大致呈圓柱形，其包括一 中空圓管狀的本體281、由該本體281的外圍呈放 射狀延伸形成的複數矩形的支撐板282b、設於該本 體281及支撐板282b外表面的毛細結構280及收容 於該本體281内的一毛細結構柱體285。該支架28b I 將管體26内部的空間分隔成沿管體26軸向延伸的 多個氣流通道266b，該等氣流通道266b形成在支 撐板282b、本體281與管體26之間。該本體281 的中央為一貫穿的通孔283，該毛細結構柱體285 穿設於通孔283内，且該毛細結構柱體285的外表 面與該通孔283的内表面相接觸。該毛細結構柱體 285可以為粉末燒結毛細結構或者絲網毛細結構。 該毛細結構柱體285於熱管20的中心形成液體回流 • 路徑，該熱管20的工作流體除可通過管體26的毛 細結構260、支架28b外表面的毛細結構280及該 底板22上的毛細結構220回流外，還可通過該支架 28b的本體281内的毛細結構柱體285回流，從·而 提高工作流體的回流速度。 圖6所示分別為本發明熱管20的内部的支架 28c的第四實施例。本實施例與第三實施例的區別在 於：該支架28c的本體281c為中空的錐形管狀，即 201109604 該本體281c的管徑沿該本體281c的韩向從頂端向 其底端逐漸增大。該本體281c的底面的外徑與該熱 ' 管2〇的底板22的直徑大致相等，即該本體281c的 最大外徑與該熱管20的管體26的内徑大致相等。 所述複數支撐板282c由該本體281c的外圍呈放射 狀延伸形成且大致呈直角三角形，每一支撐板282c 沿管體26徑向的寬度從本體281c的軸向的頂端向 鲁 底端逐漸減小。所述支撐板282c的側邊與管體26 的毛細結構260相抵觸。該支架28c將管體26内部 的空間分隔成沿管體26軸向延伸的多個液流通道 266c，該等液流通道266c形成在支稽板282c、本體 281c與管體26之間。該本體281c的通孔283c内未 設置毛細結構柱體285’該通孔283c作為在熱管20 的底端氣化後的工作流體的通路。使用時，氣化後 的工作流體通過本體281c内的通孔283c向上流 鲁 動，而液化後的工作流體通過毛細結構260、280、 220的毛細吸力作用，經由該等液流通道266。回流 至底板22處，因此，該熱管20内部氣化及液化後 的工作流體具有分..離的、互不干擾的運動通道，從 而可增強熱管20内氣液循環的速度，進而增強該熱 管20的熱傳導性能。 圖7所示為本發明熱管2〇的内部的支架283的 第五實施例。本實施例與第四實施例的區別在於： 該支架28d的本體28ld包括上、下兩邹分287d、 11 ί S j 201109604 289d’該上部分287d為中空的圓管狀，該下部分 觀為中空的錐形管狀。該通孔283d位於該上部 ， 分287d内的孔徑不變，位於該下部分289d内的孔 徑由上向下逐漸增大。 紅上所述，本發明符合發明專利之要件，爰依 法提出專射請。惟以上所述者㈣本發明之較佳 實鈿例’舉凡熟悉本案技藝之人士’在爰依本發明 • 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 圖1為本發明一較佳實施例散熱裝置的立體組 裝圖。 圖2為圖1中散熱裝置的熱管的第一實施例的 立體分解圖。 圖3為圖2中熱管去除底板及頂板後的組裝圖。 • 圖4為圖2中熱管的支架第二實施例的立體分 解圖。 圖5為圖2中熱管的支架第三實施例的立體分 解圖。 圖6為圖2中熱管的支架第四實施例的立體分 解圖。 圖7為ffi 2 +熱管的支架第五實施例的立體分 解圖。 【主要元件符號說明】 12 I S 3 201109604 散熱器 10 中心部 12 散熱片 14 熱管 20 底板 22 頂板 24 管體 26 支架 28、28a、28b、28c、28d 柱體 120 導熱分支部 122 穿孔 124 毛細結構 220、260、280 圓管 242 密封部 244 開口端 262、264氣流通道 266、266a、266b 液流通道 266c 空間 268 本體 281'281c ' 281d 支撐板 282、282b、282c、284 、286 、 288 通孔 283'283c > 283d 毛細結構柱體 285 上部分 287d 下部分 289d 13The holographic heat exchanger 10 is generally rectangular in shape and includes a central portion 12 and a plurality of fins 14 extending radially outward from the periphery of the central portion 12. The central portion 12 includes a post 12 and four thermally conductive branches 122 extending from the periphery of the post 120. The cylinder 12 is a quadrangular cylinder. The center of the cylinder 12 is provided with a circular through hole 124 for the heat 20 to pass through. The through hole 124 extends from the top surface of the cylinder 120 to the bottom surface thereof. The thermally conductive branch portions 122 are radiated outwardly from the quadrangular corners of the quadrangular prism. The heat sinks 14 extend radially outward from the four sides of the quadrangular prism and the outer surface of the heat conducting branch portion 122, respectively, and are separated into four parts by the heat conducting branch 邛 122, and each part of the heat sink Μ is corresponding to the quadrangular prism. The sides are vertical. ^ Referring to FIG. 2', the heat pipe 2 is substantially cylindrical, and the heat sales unit 2 includes a bottom plate 22, a top portion opposite to the bottom plate 22, and a tube body connected between the bottom plate 22 and the top plate 24. 26 An annual body 28 disposed in the tubular body 26 and an appropriate amount of working fluid (not shown) filled in the tubular body 2. The bottom plate 22 has a circular plate shape 'the upper surface of the bottom plate 22'. 201109604 is provided with a capillary structure 220 which is finely powdered and sintered. The tubular body 26 is a circular opening having a top end and a bottom end. The bottom open end 262 of the body 26 is connected to the upper surface of the bottom plate 22 by welding. The outer diameter of the tubular body 26 and the bottom plate 22 are The outer diameter is the same so that the bottom plate 22 can be just sealed on the open end 262. The length of the body 26 is the same as the length of the perforation 124 of the heat sink 10. The outer diameter of the body 26 is slightly larger than the inner diameter of the perforation 124: for tight engagement with the perforation 124. The inner surface of the tubular body 26 has a capillary structure 260. The capillary structure 26 is also a powder sintered capillary structure. When the bottom plate 22 is sealed at the bottom end of the tubular body 26, the capillary structure 260 and the upper surface of the bottom plate 22 are The capillary structure 220 is connected. The top plate 24 is sealed to the top opening & 264 of the tubular body 26 by welding. The shape and size of the top plate 24 are the same as the shape and size of the top open end 264. A center of the top plate is provided with a through hole (not shown). The top plate 24 extends upwardly from the periphery of the through hole to form a circular tube 242 having a smaller diameter. The end of the tube 242 forms a sealing portion 244. The heat pipe 20 is formed by injecting a working fluid into the body 26 through the round pipe 242, vacuuming, and then forming the sealing portion 244 by a process such as flattening. Referring to FIG. 3 at the same time, the bracket 28 is received in the tubular body 26. The bracket 28 has a cross section of "ten," which includes an elongated first support plate 282 extending axially along the tubular body 26, and a second support plate 284 perpendicular to and intersecting the support plate 282 of the 201109604. And a capillary structure 280 disposed on the outer surface of the first support plate 282 and the second support plate 284. The second support plate 284 and the first support plate 282 each have a rectangular plate shape. The second support plate 284 The width extending in the radial direction of the tubular body 26 is equal to the width of the first support plate 282 and is equal to the inner diameter of the tubular body 26. The size of the outer peripheral dimension of the stent 28 and the inner diameter of the tubular body 26 The size of the same phase can be just supported in the tubular body 26 and fixedly connected to the inner surface of the δ-Hui tubular body 26 by welding or sintering. The bracket 28 uniformly divides the space inside the tubular body 26 along the tubular body 26 The axially extending four airflow passages 266. The length of the bracket 28 is smaller than the length of the tubular body 26. After the bracket 28 is received in the tubular body 26, the bottom end thereof is flush with the bottom end of the tubular body 26' Abutting against the capillary structure 220 of the bottom plate 22, the first support plate 282 and the second support The intersection of the plates 284 is located just at the axis of the center of the tubular body 26, the sides of the first and second support plates 282, 284 are in contact with the capillary structure 260 in the tubular body 26, and the top end of the stent 28 Maintaining a certain distance from the top end of the tubular body 26, that is, a space 268 is formed between the top end of the bracket 28 and the top plate 24. Therefore, when the bracket 28 is received in the tubular body 26, the capillary on the bracket 28 The structure 28 is coupled to the capillary structure 22 of the bottom plate 22 and the capillary structure 260 of the tubular body 26 to form an integrally connected capillary structure. In the present embodiment, the capillary structure 28 on the bracket 28 and the bottom plate 22 The upper capillary structure 22〇 and the capillary structure 26〇201109604 in the tube body % are all the same sintered capillary structure. In specific implementation, the capillary structures 280, 220, 260 may also be groove or mesh capillary structure. When assembled for any combination of sintered, grooved or mesh capillary structures, the heat pipe 20 is threaded into the perforations 124 of the heat sink 10 and combined with the heat sink 10 by an interference fit. The outer surface of the bottom plate 22 and the dispersion The bottom surface of the central portion 12 of the device 10 is on the same plane. Since the bracket 28 is supported in the tubular body 26, the strength of the heat pipe 20 can be enhanced to prevent the tubular body 26 from being deformed when it is tightly fitted with the through hole 124 of the heat sink 10. In use, the bottom plate 22 of the heat pipe 20 is directly attached to a heat-generating electronic component. Therefore, the heat generated by the heat-generating electronic component is quickly transmitted to the bottom plate 22 of the heat pipe 20, so that the working fluid in the heat pipe 20 is vaporized at the bottom plate 22 and The four air flow passages 266 in the heat pipe 20 flow upward and are quickly filled in the pipe body 26. The vaporized working fluid hits the inner wall of the pipe body 26 and the top plate 24, releases heat and condenses into a liquid working fluid, and is released. The heat is radiated outward through the heat sink 10, and the liquid working fluid is rapidly returned to the bottom end of the heat pipe 20 under the force of the capillary structures 280, 220, 260 in the heat pipe 20, and the electronic components are circulated by the working fluid. The generated heat is quickly transmitted to the heat sink 10 at the periphery of the heat pipe 20 to be dissipated. Due to the arrangement of the space 268 in the tube body 26 at the top end of the bracket 28, the high temperature gas in each air flow passage 266 is mixed together after rising to the space 268 at the top end of the bracket 28, thereby enhancing the interaction of the 201109604 gas in each air flow passage 266, preventing Excessive gas or excessive temperature in the single gas flow passage 266 affects the thermal conductivity of the heat pipe 20. The bracket 28 is supported in the tubular body 26 to enhance the strength of the heat pipe 2, and the capillary structure 28〇 on the bracket 28 enhances the overall capillary force and fluid transfer capability of the capillary structures 220 and 260 in the heat pipe. The return path of the working fluid in the heat pipe 20 is increased, thereby improving the thermal conductivity of the heat pipe 20. Figure 4 is a second embodiment of the bracket 28a of the interior of the heat pipe 20 of the present invention. The difference between this embodiment and the previous embodiment is that the bracket 28a is formed by sintering of metal powder, which further includes third and fourth support plates 286, 288 perpendicularly intersecting the first support plate 282, the second and the second The four support plates 286 and 288 are respectively located on the front and rear sides of the second support plate 284 and are disposed at equal intervals in parallel with the second support plate 284. The third and fourth support plates 286' 288 have an equal width along the radial direction of the tubular body 26 and are smaller than the widths of the first support plate 282 and the second support plate 284. The bracket 28a divides the space inside the tubular body 26 into a plurality of airflow passages 266a that extend axially along the tubular body 26. The airflow passages 266a are formed between the support plates 282 (284, 286, '288) and the tubular body %. . The arrangement of the third and fourth support plates 286, 288 can further increase the internal strength of the heat pipe 2 while increasing the surface area of the bracket 28a. The bracket 28a is directly formed into a capillary structure 28〇 having a large number of pores therein, thereby generating a large capillary force to further complement the overall capillary force of the capillary structure 220, 260 in the heat pipe 2 and the fluid transporting 201109604 capacity improving heat pipe The rate at which the working fluid flows back within 20. Figure 5 is a third 'embodiment of the bracket 28b inside the heat pipe 20 of the present invention. The bracket 28b is substantially cylindrical in shape, and includes a hollow tubular body 281, a plurality of rectangular support plates 282b extending radially from the periphery of the body 281, and the outer surface of the body 281 and the support plate 282b. The capillary structure 280 and a capillary structure cylinder 285 received in the body 281. The bracket 28b I divides the space inside the tubular body 26 into a plurality of airflow passages 266b extending axially along the tubular body 26, and the airflow passages 266b are formed between the support plates 282b, the body 281, and the tubular body 26. The center of the body 281 is a through hole 283. The capillary structure 285 is disposed in the through hole 283, and the outer surface of the capillary structure 285 is in contact with the inner surface of the through hole 283. The capillary structure cylinder 285 can be a powder sintered capillary structure or a wire mesh capillary structure. The capillary structure cylinder 285 forms a liquid reflux path at the center of the heat pipe 20. The working fluid of the heat pipe 20 passes through the capillary structure 260 of the pipe body 26, the capillary structure 280 on the outer surface of the bracket 28b, and the capillary structure on the bottom plate 22. In addition to the reflow of 220, the capillary structure column 285 in the body 281 of the holder 28b can be recirculated to increase the return velocity of the working fluid. Fig. 6 shows a fourth embodiment of the bracket 28c inside the heat pipe 20 of the present invention, respectively. The difference between this embodiment and the third embodiment is that the body 281c of the bracket 28c has a hollow tapered shape, that is, 201109604. The diameter of the body 281c gradually increases from the top end to the bottom end along the Han direction of the body 281c. The outer diameter of the bottom surface of the body 281c is substantially equal to the diameter of the bottom plate 22 of the heat 'tube 2', that is, the maximum outer diameter of the body 281c is substantially equal to the inner diameter of the tubular body 26 of the heat pipe 20. The plurality of support plates 282c are radially extended from the periphery of the body 281c and are substantially right-angled triangles. The width of each support plate 282c along the radial direction of the pipe body 26 is gradually reduced from the axial top end of the body 281c toward the bottom end. small. The sides of the support plate 282c are in contact with the capillary structure 260 of the tubular body 26. The bracket 28c divides the space inside the tubular body 26 into a plurality of liquid flow passages 266c extending axially along the tubular body 26, and the fluid flow passages 266c are formed between the branching plate 282c, the body 281c and the tubular body 26. The capillary 285' is not provided in the through hole 283c of the body 281c. The through hole 283c serves as a passage for the working fluid vaporized at the bottom end of the heat pipe 20. In use, the vaporized working fluid flows upward through the through holes 283c in the body 281c, and the liquefied working fluid passes through the capillary passages of the capillary structures 260, 280, 220 through the liquid flow passages 266. Returning to the bottom plate 22, the working fluid after gasification and liquefaction inside the heat pipe 20 has separate moving passages that do not interfere with each other, thereby enhancing the speed of gas-liquid circulation in the heat pipe 20, thereby enhancing the heat pipe. 20 heat transfer performance. Fig. 7 shows a fifth embodiment of the bracket 283 inside the heat pipe 2 of the present invention. The difference between this embodiment and the fourth embodiment is that: the body 28ld of the bracket 28d includes upper and lower two points 287d, 11 S S j 201109604 289d'. The upper portion 287d is a hollow circular tube, and the lower portion is hollow. Tapered tubular. The through hole 283d is located at the upper portion, the hole diameter in the portion 287d is constant, and the hole diameter in the lower portion 289d is gradually increased from the top to the bottom. According to the above description, the invention complies with the requirements of the invention patent, and the special law is requested by the law. However, the above-mentioned (4) preferred embodiments of the present invention are intended to cover the equivalents of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a heat dissipating device in accordance with a preferred embodiment of the present invention. Fig. 2 is an exploded perspective view showing the first embodiment of the heat pipe of the heat sink of Fig. 1. 3 is an assembled view of the heat pipe of FIG. 2 after removing the bottom plate and the top plate. Figure 4 is a perspective exploded view of a second embodiment of the holder for the heat pipe of Figure 2; Figure 5 is a perspective exploded view of a third embodiment of the holder of the heat pipe of Figure 2; Figure 6 is a perspective exploded view of a fourth embodiment of the holder of the heat pipe of Figure 2; Fig. 7 is a perspective exploded view of a fifth embodiment of the bracket of the ffi 2 + heat pipe. [Main component symbol description] 12 IS 3 201109604 Heatsink 10 Center 12 Heat sink 14 Heat pipe 20 Base plate 22 Top plate 24 Tube body 26 Brackets 28, 28a, 28b, 28c, 28d Column 120 Heat transfer branch 122 Perforation 124 Capillary structure 220 260, 280 round tube 242 sealing portion 244 open end 262, 264 air flow passage 266, 266a, 266b liquid flow passage 266c space 268 body 281 '281c ' 281d support plate 282, 282b, 282c, 284, 286, 288 through hole 283 '283c > 283d capillary structure cylinder 285 upper part 287d lower part 289d 13