201109257 六、發明說明： 【發明所屬之技術領域】 本發明是關於利用白努利夾頭（Bernoulli chuck)以 非接觸狀態保持基板而進行移載之基板移載裝置及基板移 載方法。 【先前技術】 利用白努利夾頭來吸引保持太陽電池用的基板而進行 移載的技術，是在專利文獻1所公知的。該技術，是在四 角形的手部之下面中央配置一個白努利夾頭，在手部的對 角角落部配置吸附墊。在吸附墊的附近設置刷狀的滑接體 。在移載時，利用吸附墊來吸附基板的對角角落部，同時 利用白努利夾頭來吸引保持基板的中央部。在滑接體接觸 基板的角落部的狀態下使手部上昇，藉此能將移載對象之 基板的下面所密合的基板予以強制分離，而僅取出最上面 的基板進行移載。 在本發明，是將白努利夾頭所吸引保持之基板，在利 用導件體定位成既定姿勢的狀態下進行移載，這種具備導 件體之移載裝置是揭示於專利文獻2。該移載裝置，是在 四角形的支承板的下面配置七個白努利夾頭，在支承板之 相鄰接的邊部，分別配置兩個定位用的導件體。在該移載 裝置，是讓吸引保持著基板（玻璃基板）的狀態之白努利 夾頭，相對於水平面及垂直面呈傾斜，而使基板沿著吸附 面利用本身重量產生滑移，利用兩組的導件體來擋止基板 -5- 201109257 之相鄰接的邊部以進行縱橫方向的定位。 在本發明，移載裝置之主要部是由平行連桿機構所構 成，平行連桿機構的基本構造，是在本申請人所申請之專 利文獻3所公知的。該平行連桿機構係具備：配置於基座 之三個驅動馬達、藉由各驅動馬達進行驅動操作之三組的 臂單元、藉由臂單元支承的手部、以及將旋轉動力傳遞至 設置於手部的迴旋軸之迴旋驅動軸等。 [專利文獻1]日本特開2003 - 1 1 88 59號公報（段落〇〇33 ，第4圖） [專利文獻2]日本特開2000- 1 9 1 3 3 4號公報（段落0022 ，第4圖、第5圖） [專利文獻3]國際公開第2008/059659號文件（段落 0018，第 1 圖） 【發明內容】 專利文獻1的移載裝置，由於是利用白努利夾頭和吸 附墊來吸引保持基板，在移載時，可利用吸附墊來確實地 防止基板沿著白努利夾頭的吸附面發生移位。然而，由於 是利用吸附墊來吸附固定基板的表面角落部，並不適用於 不喜歡接觸其他物體之基板的移載。 關於這點，依據專利文獻2的移載裝置，由於是利用 兩組的導件體來對被白努利夾頭吸引保持的基板之周緣施 以定位，能以非接觸狀態來移載基板是理所當然的，還能 將基板以高位置精度移載至移載目的地。此外，由於是利 -6- 201109257 用白努利夾頭來吸引保持基板之後獨立地進行定位動作， 在吸引開始位置吸引保持基板時，可減緩白努利夾頭的位 置精度。然而，必須使白努利夾頭朝不同方向傾斜兩次來 進行定位，定位勢必要花費更多的時間，而無法高效率地 進行基板的移載。 本發明的目的是爲了提供一種基板之移載裝置及其方 法，可將保持基板時之手部的位置精度減緩，且能以高速 度高效率地進行基板之移載。 以下，作爲解決課題的手段是說明複數個態樣。該等 態樣可按照需要來進行任意的組合。 本發明的一觀點之移載裝置，是用來移載四角形基板 的裝置，係具備手部、移動機構、白努利夾頭以及複數個 導件體。移動機構讓手部移動。白努利夾頭，係設置於手 部，具有吸附面，該吸附面包含以非接觸狀態保持基板之 夾頭凹部。複數個導件體，是設置於手部，用來將被白努 利夾頭保持的基板施以定位。在白努利夾頭設置：可將壓 縮空氣朝夾頭凹部的內部吹出以產生負壓之複數個噴嘴孔 。導件體，是分散配置成包圍吸附面之周圍的狀態。在白 努利夾頭開始進行基板的保持之前，藉由手部使導件體移 動至基板的輪廓線外。而且，藉由從噴嘴孔吹出之壓縮空 氣，使被白努利夾頭保持的基板朝單方向旋轉，利用導件 體來擋止基板的邊部以進行定位。 如上述般，若在導件體位於基板之輪廓線外的狀態下 利用白努利夾頭來保持基板，可在基板和各導件體間確保 201109257 充分的餘裕間隙的狀態下來保持基板。亦即，在 降中，可避免基板接觸導件體而發生摩擦，或和 而發生破損。再者，利用從噴嘴孔吹出之空氣流 的基板朝單方向旋轉並利用導件體進行定位，整 不須嚴密地進行保持基板時之手部的定位。因此 移載裝置，可減緩保持基板時之手部的位置精度 此可更迅速地進行手部的定位，可讓移動機構更 作而提昇基板的移載效率。 亦可進一步具備：設置於手部，讓白努利夾 體繞垂直軸旋轉之旋轉軸。藉由旋轉軸使導件體 導件體位於基板的輪廓線外》 在此情況，藉由旋轉軸使保持開始位置之導 ，而讓導件體位於基板的輪廓線外，即使是在保 置之基板的姿勢並非一定的狀況下，仍能確實地 而進行定位。例如，即使是以隨機的姿勢搬運至 位置之基板，仍能確賓地保持而進行適當地定位 在利用白努利夾頭保持基板之前，將基板配 板的輪廓線避開導件體之預定配置位置的狀態。 在此情況’由於將基板配置成使基板的輪廓 件體之預定配置位置的狀態，在將基板的姿勢統 利用輪送機來搬運的情況等，可在導件體的姿勢 的狀態下保持基板，因此能使移載動作簡單化。 部只要在保持開始位置和移載目的地之間單純地 ，對應於移載動作的簡單化，可高效率地移載基 導件體下 前端接觸 讓保持後 體而言， ，依據本 ，對應於 高速度動 頭及導件 旋轉，使 件體旋轉 持開始位 保持基板 保持開始 〇 置成使基 線避開導 ——致後 形成一定 亦即，手 往復即可 板。還能 201109257 省去用來調整導件體姿勢的構造，而具有讓移載構造簡單 化的優點。 白努利夾頭可具有：固定於手部的下面側之夾頭座、 以及固定於夾頭座的下面之複數個夾頭單元。在各個夾頭 單元’以能在夾頭凹部朝相同方向讓空氣移動的方式形成 噴嘴孔。 在此情況，由於是使用以複數個夾頭單元作爲吸附要 素之白努利夾頭，藉由對應於移載對象之基板的形狀或大 小等來改變夾頭單元之配置個數或配置形態，可構成緊緻 的白努利夾頭。此外，藉由在各個夾頭單元的夾頭凹部產 生相同方向的空氣移動，能使所保持的基板朝單方向強制 旋轉而利用導件體進行定位。 白努利夾頭可進一步具備：固定於夾頭座的上面，覆 蓋白努利夾頭所保持的基板的上面之至少一部分之遮蔽板 〇 在此情況，由於在夾頭座的上面固定遮蔽板，且利用 遮蔽板覆蓋白努利夾頭所保持的基板的上面之至少一部分 ，藉由遮蔽板可遮擋手部往上方移動時之空氣流，而能大 幅減少作用於基板之向下的空氣阻力。因此可防止：起因 於作用於基板之空氣阻力使基板的保持狀態變得不穩定而 搖動或從白努利夾頭落下，而能夠在使基板穩定的狀態下 進行高速地移載。 各導件體，可爲圓軸狀，且具備：設置於下端之往下 漸細之錐狀的導入軸部、以及用來擋止基板的邊部之限制 -9 - 201109257 軸部。 在此情況，由於使用具有導入軸部和限制軸部之導件 體，利用限制軸部的周面擋止基板邊部時的狀態可形成點 接觸。因此，可防止基板接觸其他物體而產生損傷’且能 以穩定的狀態正確地進行定位。此外，可儘量減少利用導 件體來矯正基板姿勢時的接觸阻力’因此可更順利地進行 基板的定位。由於在下端設置往下漸細之錐狀的導入軸部 ，關於導件體相對於基板進行定位時之位置座標，以相當 於導入軸部的水平成分的尺寸作爲餘裕量是可期待的。結 果，例如即使是擾動所造成之裝置振動等之超乎想像的位 置精度等的惡化要因，也能予以因應。 導件體，可配置成在偏離基板之各邊部的中點的位置 擋止基板。 在此情況，由於將導件體配置成在偏離基板之各邊部 的中點的位置擋止基板，是利用偏離基板的中心（中央） 的位置進行各邊部的定位。因此，能以更高的精度將基板 定位。此外，在讓各導件體位於基板的輪廓線外的位置時 ，能使各導件體位於儘量遠離基板邊部的位置而在兩者間 確保大的餘裕間隙，如此可進一步減緩手部的位置精度。 可將從基板之各邊部的中點起至導件體所擋止之各邊 部的抵接位置爲止的距離設定成等距離，將用來擋止基板 的對置邊部之各導件體配置成，以基板的中心爲對稱中心 而成爲點對稱的狀態。 如上述般，若在偏離中心的位置利用導件體來擋止邊 -10- 201109257 部，且將各邊部之至抵接位置的距離設定成等距離’最先 進行抵接的邊部不管是遇到哪個導件體’基板的移位量都 大致一定，而能迅速地讓基板的姿勢最佳化。附帶一提的 ，該距離在各導件體爲大小不同的情況’最先進行抵接的 邊部，會根據遇到哪個導件體而產生不同的基板移位量’ 會有定位費時的情況發生。 移動機構可包含平行連桿機構。 在此情況，由於移動機構包含平行連桿機構’例如相 較於多關節型的機器人’不須在可動部設置馬達或減速機 ，可實現移動機構的輕量化’因此能使其動作速度高速化 。如此，可高效率地進行基板的移載作業。 可進一步具備攝影裝置和控制部。.該攝影裝置，是在 將基板朝向藉由白努利夾頭保持的位置搬運的期間，取得 基板的影像，根據該影像來界定基板藉由白努利夾頭保持 之前的基板位置及姿勢。該控制部，是取得基板的位置及 姿勢資訊而控制移動機構的動作。在此情況，根據控制部 所輸出的指令訊號，藉由移動機構使手部移動並讓旋轉軸 旋轉，而在白努利夾頭保持基板之前，讓導件體位於基板 的輪廓線外。 在此情況，藉由攝影裝置取得朝向保持開始位置搬運 之基板的影像，根據該影像來界定基板的位置及姿勢，利 用控制部來控制保持開始位置之導件體的姿勢，因此能夠 確實地進行以隨機姿勢搬運之基板的保持。此外，由於不 須嚴密地規定搬運時基板的姿勢，在將基板搬運至保持開 -11 - 201109257 始位置之前使基板方向一致的裝置變得不需要。 本發明的其他觀點之基板移載方法，是在手部設置白 努利夾頭和複數個導件體之移載裝置中，利用白努利夾頭 以非接觸狀態保持四角形的基板，進一步在利用複數個導 件體將基板定位的狀態下進行移載。本方法具備以下的步 驟。 ◎在導件體位於基板的輪廓線外的狀態下，爲了使白 努利夾頭能保持基板而讓白努利夾頭及導件體移動的步驟 ◎藉由從白努利夾頭吹出的空氣流使被白努利夾頭保 持的基板朝單方向旋轉，利用導件體來擋止基板的邊部以 進行定位的步驟。 如上述般，由於在導件體位於基板之輪廓線外的狀態 下利用白努利夾頭來保持基板，可在保持前的基板和各導 件體間確保充分的餘裕間隙的狀態下來保持基板，可避免 在此期間基板接觸導件體而發生摩擦。再者，利用從噴嘴 孔吹出之空氣流讓保持後的基板朝單方向旋轉並利用導件 體進行定位，整體而言，不須嚴密地進行保持基板時之手 部的定位。因此，依據本發明的移載方法，可減緩保持基 板時之手部的位置精度，對應於此可更迅速地進行手部的 定位，可讓移動機構更高速度動作而提昇基板的移載效率 0 可進一步具備：在白努利夾頭保持基板之前，藉由使 白努利夾頭及導件體旋轉，而讓導件體位於基板之輪廓線 -12- 201109257 外的步驟。 在此情況，藉由使在保持開始位置之導件體旋轉而讓 導件體位於基板之輪廓線外，即使是在保持開始位置之基 板的姿勢並非一定的狀況下，仍能確實地保持基板而進行 定位。例如，即使是以隨機的姿勢被搬運至保持開始位置 之基板，仍能確實地保持而進行適當地定位。 可進一步具備··在白努利夾頭保持基板之前，將基板 配置成使基板的輪廓線避開導件體之預定配置位置的狀態 之步驟。 在此情況，若將保持開始位置之基板配置成基板的輪 廓線避開導件體之預定配置位置的狀態，由於能以導件體 的姿勢形成一定的狀態來保持基板，能夠使移載動作單純 化。詳而言之，手部只要在保持開始位置和移載目的地之 間單純地往復即可，對應於移載動作的簡單化，可高效率 地移載基板。 可進一步具備：在藉由白努利夾頭保持基板的狀態下 使手部移動的期間，藉由讓導件體旋轉而將基板的姿勢變 更成移載姿勢之步驟。 在此情況，在藉由移動機構使手部移動的期間，將導 件體旋轉而使基板的姿勢變更成移載姿勢，因此可縮短移 載基板所需之週期時間，能更有效率地進行基板的移載。 【實施方式】 (1 )移載裝置[Technical Field] The present invention relates to a substrate transfer device and a substrate transfer method for transferring a substrate in a non-contact state by a Bernoulli chuck. [Prior Art] A technique for transferring a substrate for holding a solar cell by a white nucleus chuck and transferring it is known in Patent Document 1. In this technique, a white Nuoli chuck is placed in the center of the lower side of the rectangular hand, and an adsorption pad is disposed in the diagonal corner of the hand. A brush-like sliding body is provided in the vicinity of the adsorption pad. At the time of transfer, the suction pad is used to adsorb the diagonal corner portions of the substrate, and the center portion of the holding substrate is attracted by the white Nucleus chuck. When the slider is brought into contact with the corner portion of the substrate, the hand is raised, whereby the substrate to be adhered to the lower surface of the substrate to be transferred can be forcibly separated, and only the uppermost substrate can be taken out for transfer. In the present invention, the substrate to be held by the white Nucleus chuck is transferred in a state in which the guide body is positioned in a predetermined posture. Such a transfer device including the guide body is disclosed in Patent Document 2. In the transfer device, seven white Nurem chucks are disposed under the quadrangular support plate, and two positioning guide members are disposed on the adjacent side portions of the support plate. In the transfer device, the white Nuori chuck in a state in which the substrate (glass substrate) is sucked and held is inclined with respect to the horizontal plane and the vertical surface, and the substrate is caused to slip by its own weight along the adsorption surface. The set of guide bodies blocks the adjacent sides of the substrate -5, 201109257 for vertical and horizontal positioning. In the present invention, the main portion of the transfer device is constituted by a parallel link mechanism, and the basic configuration of the parallel link mechanism is known from the patent document 3 filed by the present applicant. The parallel link mechanism includes three drive motors disposed on the base, three sets of arm units that are driven by the drive motors, a hand supported by the arm unit, and the rotary power is transmitted to the set. The rotary shaft of the revolving shaft of the hand, etc. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003 - 1 1 88 59 (paragraph , 33, Fig. 4) [Patent Document 2] Japanese Patent Laid-Open Publication No. 2000- 1 9 1 3 3 No. 4 (paragraph 0022, 4th) (Patent Document 3) International Patent Publication No. 2008/059659 (paragraph 0018, FIG. 1) [Disclosure] The transfer device of Patent Document 1 utilizes a Bainuoli chuck and an adsorption pad. To attract the holding substrate, the adsorption pad can be used to reliably prevent the substrate from being displaced along the adsorption surface of the white Nucleus chuck during transfer. However, since the adsorption pad is used to adsorb the corner portion of the surface of the fixed substrate, it is not suitable for the transfer of the substrate which does not like to contact other objects. In this regard, according to the transfer device of Patent Document 2, since the guide members of the two groups are used to position the periphery of the substrate sucked and held by the Bernoulli chuck, the substrate can be transferred in a non-contact state. Of course, the substrate can also be transferred to the transfer destination with high positional accuracy. Further, since it is a -6-201109257, the positioning operation is independently performed after the substrate is sucked and held by the white nucleus chuck, and the positional accuracy of the nucleus chuck can be alleviated when the holding substrate is sucked at the suction start position. However, it is necessary to tilt the Bernoulli chuck twice in different directions for positioning, and it takes more time to position the substrate, and the substrate cannot be efficiently transferred. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate transfer device and a method thereof, which can reduce the positional accuracy of a hand when a substrate is held, and can efficiently transfer a substrate at a high speed. Hereinafter, as a means for solving the problem, a plurality of aspects will be described. This aspect can be arbitrarily combined as needed. A transfer device according to an aspect of the present invention is a device for transferring a quadrangular substrate, and includes a hand, a moving mechanism, a whiteur chuck, and a plurality of guide bodies. The moving mechanism moves the hand. The white Nuori chuck is attached to the hand and has an adsorption surface containing a chuck recess that holds the substrate in a non-contact state. A plurality of guide bodies are provided on the hand for positioning the substrate held by the white Nucleus chuck. In the Bainuuli chuck setting: a plurality of nozzle holes can be blown out of the inside of the chuck recess to generate a negative pressure. The guide body is in a state of being dispersedly arranged to surround the periphery of the adsorption surface. The guide body is moved by the hand to the outside of the outline of the substrate before the whiteur chuck begins to hold the substrate. Further, the compressed air blown from the nozzle holes is rotated in a single direction by the substrate held by the white Nurem chuck, and the guide member is used to block the side portions of the substrate for positioning. As described above, when the guide body is positioned outside the outline of the substrate, the substrate is held by the white Nucleus chuck, and the substrate can be held while ensuring a sufficient margin of the gap between the substrate and each of the guide members. That is, during the lowering, it is possible to prevent the substrate from contacting the guide body to cause friction or breakage. Further, the substrate which is blown by the air flow from the nozzle holes is rotated in one direction and positioned by the guide body, so that the positioning of the hand when holding the substrate is not strictly performed. Therefore, the transfer device can reduce the positional accuracy of the hand when the substrate is held. This allows the hand to be positioned more quickly, allowing the moving mechanism to improve the transfer efficiency of the substrate. Further, it is further provided with a rotating shaft which is disposed on the hand and rotates the white Nuori body about the vertical axis. The guide body of the guide body is located outside the outline of the substrate by the rotating shaft. In this case, the guide body is placed outside the outline of the substrate by the rotation axis to maintain the guide position of the substrate, even if it is placed When the posture of the substrate is not constant, the positioning can be performed reliably. For example, even if the substrate is transported to the position in a random posture, it can be accurately held and properly positioned to avoid the outline of the substrate of the substrate before the substrate is held by the white Nucleus chuck. Configure the status of the location. In this case, the substrate can be held in the state of the posture of the guide body by the state in which the substrate is placed in a predetermined position of the outline of the substrate, and the posture of the substrate is conveyed by the wheel conveyor. Therefore, the transfer operation can be simplified. As long as the simplification of the transfer operation is simple between the hold start position and the transfer destination, the front end contact of the base guide body can be efficiently transferred to hold the rear body, and according to the present, The high-speed moving head and the guide rotate, so that the rotation of the body holds the starting position, and the substrate is kept set to prevent the baseline from being guided away. It is also possible to eliminate the structure for adjusting the posture of the guide body and to simplify the transfer structure. The white Nuoli chuck may have a collet holder fixed to the lower side of the hand, and a plurality of collet units fixed to the lower side of the collet holder. A nozzle hole is formed in each of the chuck units ' in such a manner as to allow air to move in the same direction in the chuck recess. In this case, since the white Nuoli chuck using a plurality of chuck units as the adsorption elements is used, the number or arrangement of the chuck units is changed by the shape or size of the substrate corresponding to the transfer target, and the like. Can form a compact white Nuori chuck. Further, by moving the air in the same direction in the chuck recess of each of the chuck units, the held substrate can be forcibly rotated in one direction and positioned by the guide body. The white Nuoli chuck may further comprise: a shielding plate fixed to the upper surface of the chuck seat and covering at least a part of the upper surface of the substrate held by the white Nuo collet, in which case the shielding plate is fixed on the upper surface of the collet holder And covering at least a part of the upper surface of the substrate held by the white Nuo chuck by using a shielding plate, the shielding air block can block the air flow when the hand moves upward, and the downward air resistance acting on the substrate can be greatly reduced . Therefore, it is possible to prevent the substrate from being held in a stable state due to the air resistance acting on the substrate, and to be shaken or dropped from the nucleus chuck, and the substrate can be transferred at a high speed while the substrate is stabilized. Each of the guide members may have a circular shaft shape, and includes a tapered tapered introduction shaft portion provided at the lower end and a tapered portion for blocking the substrate. -9 - 201109257 Shaft portion. In this case, since the guide body having the introduction shaft portion and the restriction shaft portion is used, the point contact can be formed by restricting the state in which the peripheral surface of the shaft portion blocks the edge portion of the substrate. Therefore, it is possible to prevent the substrate from coming into contact with other objects to cause damage' and to perform positioning in a stable state. Further, the contact resistance at the time of correcting the posture of the substrate by the guide body can be minimized, so that the positioning of the substrate can be performed more smoothly. It is expected that the positional coordinates when the guide body is positioned with respect to the substrate at the lower end are provided with a size corresponding to the horizontal component of the introduction shaft portion as a margin. As a result, for example, it is possible to cope with the deterioration of the positional accuracy such as the vibration of the device caused by the disturbance. The guide body can be configured to block the substrate at a position offset from a midpoint of each side of the substrate. In this case, since the guide body is disposed so as to stop the substrate at a position offset from the midpoint of each side portion of the substrate, the positioning of each side portion is performed by the position deviated from the center (center) of the substrate. Therefore, the substrate can be positioned with higher precision. In addition, when the guide members are positioned outside the outline of the substrate, the guide members can be positioned as far as possible from the edge of the substrate to ensure a large margin between the two, so that the hand can be further slowed down. Positional accuracy. The distance from the midpoint of each side of the substrate to the contact position of each side portion where the guide body is stopped can be set to be equidistant, and the guides for blocking the opposite sides of the substrate can be used. The body is arranged in a state of point symmetry with the center of the substrate being the center of symmetry. As described above, when the off-center position is used, the guide body is used to stop the side -10- 201109257, and the distance from each side to the abutment position is set to equidistance. It is the guide body that is encountered, and the displacement amount of the substrate is substantially constant, and the posture of the substrate can be quickly optimized. Incidentally, in the case where the distance between the guide members is different, the first portion to be abutted will have a different amount of substrate displacement depending on which guide body is encountered. occur. The moving mechanism can include a parallel linkage mechanism. In this case, since the moving mechanism includes the parallel link mechanism 'for example, compared with the multi-joint type robot, it is not necessary to provide a motor or a speed reducer in the movable portion, so that the weight of the moving mechanism can be reduced', so that the operating speed can be increased. . In this way, the substrate transfer operation can be performed efficiently. Further, an imaging device and a control unit can be provided. In the photographing apparatus, the image of the substrate is taken while the substrate is being transported toward the position held by the nucleus chuck, and the position and posture of the substrate before the substrate is held by the nucleus chuck are defined based on the image. The control unit controls the movement of the moving mechanism by acquiring the position and posture information of the substrate. In this case, according to the command signal outputted by the control unit, the moving mechanism moves the hand and rotates the rotating shaft, and the guide body is positioned outside the outline of the substrate before the white Nucleus chuck holds the substrate. In this case, the image of the substrate conveyed toward the holding start position is obtained by the photographing device, the position and posture of the substrate are defined based on the image, and the posture of the guide body at the start position is controlled by the control unit, so that the posture can be surely performed. The holding of the substrate conveyed in a random posture. Further, since it is not necessary to strictly specify the posture of the substrate during transportation, it is not necessary to transport the substrate to the position where the substrate direction is kept until the start position of -11 - 201109257 is maintained. A substrate transfer method according to another aspect of the present invention is a substrate in which a white Nuuli chuck and a plurality of guide bodies are disposed in a hand, and a quadrangular substrate is held in a non-contact state by a white Nucleus chuck, and further The substrate is transferred in a state in which the substrate is positioned by a plurality of guide bodies. This method has the following steps. ◎ In the state where the guide body is located outside the outline of the substrate, the step of moving the Bernoulli chuck and the guide body in order to allow the white Nuori chuck to hold the substrate ◎ is blown out from the Bainuuli chuck The air flow rotates the substrate held by the Bernoulli chuck in a single direction, and the guide body is used to block the edge portion of the substrate for positioning. As described above, since the substrate is held by the use of a white Nucleus chuck in a state where the guide body is located outside the outline of the substrate, the substrate can be held while maintaining a sufficient margin between the substrate before holding and each of the guide members. It can avoid the friction between the substrate and the guide body during this period. Further, by the air flow blown from the nozzle holes, the held substrate is rotated in one direction and positioned by the guide body, and the positioning of the hand when the substrate is held is not required to be performed as a whole. Therefore, according to the transfer method of the present invention, the positional accuracy of the hand when the substrate is held can be slowed down, and accordingly, the positioning of the hand can be performed more quickly, and the moving mechanism can be moved at a higher speed to improve the transfer efficiency of the substrate. 0 Further, there is a step of allowing the guide body to be located outside the outline of the substrate -12-201109257 by rotating the white Nucleus chuck and the guide body before the white Nucleus chuck holds the substrate. In this case, by rotating the guide body at the holding start position and leaving the guide body outside the outline of the substrate, the substrate can be surely held even in a state where the posture of the substrate holding the start position is not constant. And to locate. For example, even if the substrate is transported to the holding start position in a random posture, it can be reliably held and appropriately positioned. Further, there is provided a step of arranging the substrate so that the outline of the substrate avoids a predetermined arrangement position of the guide body before the substrate is held by the Bernoulli chuck. In this case, when the substrate holding the start position is disposed such that the outline of the substrate avoids the predetermined arrangement position of the guide body, the substrate can be held in a predetermined state in the posture of the guide body, and the transfer operation can be performed. Simplified. More specifically, the hand can simply reciprocate between the hold start position and the transfer destination, and the substrate can be efficiently transferred in accordance with the simplification of the transfer operation. Further, the step of changing the posture of the substrate to the transfer posture by rotating the guide body while the hand is being moved while holding the substrate by the white Nucleus chuck may be provided. In this case, while the hand is moved by the moving mechanism, the guide body is rotated to change the posture of the substrate to the transfer posture. Therefore, the cycle time required for transferring the substrate can be shortened, and the operation can be performed more efficiently. Transfer of the substrate. [Embodiment] (1) Transfer device
C -13- 201109257 第1圖〜第12圖係顯示本發明的基板移載裝置之實施例 。第2圖之移載裝置’是將以高剛性的架台1 (橫跨輸送機 )爲基體而構成之平行連桿機構做成移載構造。移載對象 之基板W，是構成太陽電池之四角形的矽晶圓’其縱橫尺 寸爲125mm X 125mm或156mm X 156mm，厚度尺寸爲 0.1〜0.2mm。如第2圖所示，平行連桿機構係具備：固定於 架台1之基座2、配置於基座2的下面之三個驅動馬達3、藉 由各馬達3進行驅動之三組的臂單元4、藉由各臂單元4支 承之手部5等。在手部5設置：透過迴旋驅動軸6進行迴旋 驅動之廻旋軸7。此外，在手部5的下面側設有：接頭體8 、白努利夾頭9以及複數個導件體10。 驅動馬達3是透過馬達托架組裝於基座2 ’臂單元4的 上端連結於其輸出軸。驅動馬達3，係一體地具備伺服馬 達和減速機，將被減速機減速後的往復迴旋動力輸出至臂 單元4。 臂單元4係具備：驅動臂13、將驅動臂13的迴旋動作 傳遞至手部5之一對的平行連桿14。連桿14的上端及下端 分別透過球形接頭15連結於驅動臂13及手部5。藉由彈簧 1 6將兩連桿1 4朝互相接近的方向彈壓。利用驅動馬達3來 驅動各臂單元4，可將手部5在既定的三維空間內自由地移 位操作。 爲了追隨手部5之三維移位並傳遞迴旋動力’是由可 伸縮自如的滾珠栓槽軸1 8和連結於其上下端之萬向接頭19 來構成迴旋驅動軸6。上側的萬向接頭1 9連結於馬達20的 -14 - 201109257 輸出軸，下側的萬向接頭19連結於迴旋軸7。用來驅動迴 旋驅動軸6之馬達20，與前述驅動馬達3同樣地是由伺服馬 達和減速機所構成，且被配置於基座2的上面。 第3圖所示之手部5，是由三叉狀的板狀塊所構成，在 其中央部，前述迴旋軸7是藉由交叉滾子軸承21軸支承成 可旋轉自如（參照第4圖）。在迴旋軸7的下面固定接頭體 8，進一步在接頭體8的下面固定白努利夾頭9。如第5圖所 示，接頭體8是形成向下開口之淺的有底筒狀，在其筒壁 的下端周面之四個部位，突出形成用來緊固白努利夾頭9 之緊固座23。爲謀求輕量化，接頭體8整體，例如是由鋁 合金或聚醚醚酮（PEEK )等的工程塑膠材料、或是纖維 強化塑膠（FRP )等的高強度材料所形成。再者，爲了謀 求輕量化，在接頭體8的上端壁以貫穿上下的方式形成多 數個減厚孔。 (2 )白努利夾頭 白努利夾頭9係具備：固定於接頭體8的下面之平板狀 的夾頭座26、固定於夾頭座26的下面之四個夾頭單元27、 以及固定於夾頭座26的上面之遮蔽板28等。夾頭座26的基 本形狀，是形成比基板W大一圏之正方形。如第5圖所示 ，在夾頭座26之板面之四個部位，設置用來緊固夾頭單元 27之環狀的夾頭緊固座31。在該等夾頭緊固座31之間，形 成用來緊固接頭體8之部分圓弧狀的接頭緊固座32。此外 ，在夾頭座26的各邊部，呈直線狀地形成有用來緊固導件 -15- 201109257 體10之導件緊固座33。 夾頭座26，爲了輕量化且能和與基板W對置之夾頭單 元27的下面成爲大致同一平面，是由彎曲和變形少且具有 高彎曲強度之材料所形成。作爲這種材料，例如可採用： 在聚對苯二甲酸乙二醇酯（PET)塡充複合玻璃纖維或無 機塡料後的板材經由加熱積層而構成之市售材料（商品名 UNILATE )。此外，在前述夾頭緊固座31、接頭緊固座32 以及導件緊固座3 3的周圍形成減厚空間以謀求輕量化。如 此般藉由將各緊固座31、32、33以外的部分除去來形成減 厚空間，可減輕夾頭座26的重量而減少運動慣性力。 第1圖之夾頭單元27，是由向下開口之有底圓筒狀的 上夾頭體40、向上開口之有底圓筒狀的下夾頭體41所構成 。上夾頭體40及下夾頭體41當中至少下夾頭體41，考慮到 與太陽電池用矽晶圓接觸的可能性，是由以下材料所形成 :超高分子量聚乙烯（UHPE) 、PEEK、聚縮醛（POM) 、聚四氟乙烯（PTFE)、聚醯亞胺（PI) 、ABS之任一者 ，或其中幾個所組合成的聚合物合金。上夾頭體4〇是緊固 固定在夾頭座2 6的下面，下夾頭體4 1，是以密閉狀態緊固 固定在上夾頭體40的下面開口側。藉此，在上下的夾頭體 40、41間形成大致圓柱狀的空氣室42。如第4圖所示，空 氣室42，是透過連結於上夾頭體40的周面之空氣通路（橡 膠軟管）43來連接於未圖示的壓縮空氣供應源。 在下夾頭體41的下面，形成向下開口之淺的夾頭凹部 45，且在夾頭凹部45的開口周緣形成連續的平坦面46。空 -16- 201109257 氣室42和夾頭凹部45，是透過八個噴嘴孔47來連通。如第 1圖及第8圖所示，噴嘴孔47，是形成從空氣室42側朝夾頭 凹部45的周緣角落部側往下傾斜的狀態，且噴嘴孔47的中 心軸線和夾頭凹部45的開口緣以既定的角度交叉。藉此， 從噴嘴孔47吹出的空氣流之中心軸，會指向夾頭凹部45之 開口緣的下方。如第8圖所示，該等噴出空氣整體的流動 ，在從底面觀察夾頭單元27的狀態下，成爲朝逆時針旋轉 方向迴旋之迴旋氣流，俯視之噴出空氣整體的流動成爲順 時針旋轉方向之迴旋氣流（參照第1 1圖）。 如上述般，若壓縮空氣以指向夾頭凹部45之開口緣的 下方之狀態從噴嘴孔47吹出，能使夾頭凹部45之中央部側 的壓力成爲負壓。利用該負壓作用來吸引保持移載對象之 基板W。此外，在將包含平坦面46之夾頭凹部45的開口面 當作白努利夾頭9的吸附面時，被吸引保持的基板W和吸 附面如第1圖所示般隔著些微的間隙E而上下對置。從噴嘴 孔47吹出之空氣流透過該間隙E而往大氣中排出。 如上述般，在利用白努利夾頭9吸引保持基板W而進 行搬運時，空氣阻力會作用於基板W的表面，而可能使白 努利夾頭所進行之基板W的吸引保持狀態變得不穩定。特 別是在運動速度快之平行連桿機構的情況’大的空氣阻力 會作用於基板W的表面，而可能使基板W從白努利夾頭9落 下。如此般，爲了防止空氣阻力造成基板W之搖動或落下 ，在夾頭座26的上面緊固固定著可覆蓋基板W的上面全體 之遮蔽板2 8。 -17- 201109257 第5圖所示之遮蔽板28，與夾頭座26同樣地是由以正 方形爲基本形狀之塑膠板材所構成。在遮蔽板28之板面的 中央，沿著接頭體8和夾頭單元27的輪廓線形成穿通孔49 以謀求輕量化。遮蔽板28是配置成覆蓋夾頭座26之減厚開 口 35及減厚缺口 37。在穿通孔49的周圍壁當中面對夾頭座 26的減厚空間之四個部位，爲了讓空氣通路43通過而形成 有圓孔狀的通氣孔50。 如此般，若利用遮蔽板28覆蓋基板W的上方空間，手 部5往上方移動時的空氣流會被遮蔽板28遮擋，藉此可避 免向下的空氣阻力作用於基板W，因此可防止基板W從白 努利夾頭9落下。又在夾頭部之垂直投影面上，在接頭體8 的上壁雖穿設有八個孔，但由於在其正上方近接配置手部 5，因此氣流不會通過該孔而直接衝擊基板W。 (3 )導件體 藉由白努利夾頭9吸引保持的狀態之基板W，容易沿 著白努利夾頭9的吸附面滑動。爲了限制這樣的滑動而將 基板W定位，在夾頭座2 6的各邊部，以向下突出的狀態固 定四個導件體10。詳而言之，第7圖中，在夾頭座26之上 邊部的靠右角落及下邊部的靠左角落、左邊部的靠上角落 及右邊部的靠下角落，合計四個部位配置導件體1〇。各導 件體10，是利用螺栓54來緊固固定於夾頭座26之導件緊固 座3 3的下面。 如上述般，藉由將導件體1〇設置在靠夾頭座26之各角 -18- 201109257 落部側的位置，從基板W之各邊部的中點往角落部側偏置 的位置可藉由導件體10來擋止。從基板w之各邊部的中點 起至導件體10所擋止之各邊部的抵接位置爲止之偏置距離 ，在對置的邊部是設定成等距離。因此，連結上下邊部的 導件體1 0、1 〇之直線和連結左右邊部的導件體1 0、1 0之直 線，是在白努利夾頭9的中心交叉。此外，擋止基板W的 對置邊部之各導件體1 0、1 0，以基板W的重心爲對稱中心 而具有點對稱的關係。 如第1圖所示，導件體10係具備：圓軸狀的軸部51、 形成於軸部5 1下端之往下漸細之錐狀的導入軸部5 2、以及 連續於導入軸部52的上側之限制軸部53，其整體是形成子 彈狀。限制軸部5 3是由直徑比軸部5 1小之圓軸所構成，利 用其周面來擋止基板W的邊部以限制滑移，而將被吸引保 持的狀態之基板W施以定位。爲此，將導件體1〇的上下位 置設定成，使白努利夾頭9的吸附面位在與限制軸部5 3的 上下方向中途部交叉之水平面上。爲了輕量化，軸部51和 限制軸部53是透過往下漸細錐狀的軸部分來連接。 導件體10，是使用耐久性優異的塑膠材料來形成。具 體而言，在基板W爲太陽電池用矽晶圓的情況，作爲塑膠 材料較佳爲使用：超高分子量聚乙烯（UHPE) 、聚醚酸 酮（PEEK)、聚縮醛（POM) '聚四氟乙烯（PTFE)、 聚醯亞胺（PI )、ABS等的塑膠材料。然而，由於超高分 子量聚乙烯和聚醯亞胺很難進行射出成形，若將棒狀材料 實施車削加工來形成的話’能以低成本簡單地形成尺寸精 -19- 201109257 度優異的導件體1 〇。 (4 )移載裝置之使用例 上述構造之移載裝置，例如第9圖所示是使用於：將 藉由第1輸送機60移送過來的各個基板W移載到第2輸送機 61 (與第1輸送機60鄰接）上的承盤62時。在此，驅動各 輸送機60、61之馬達Μ的驅動狀態，是分別透過編碼器63 反饋至控制部64。此外，第1輸送機60所搬運之基板W的 位置訊號和姿勢資訊，是根據攝影裝置65 (由攝影機部和 影像處理部構成）所取得的攝影影像來求出，並朝控制部 64輸出。再者，第1輸送機60所搬運之承盤62的位置資訊 ，是透過光學感測器66朝控制部64輸出。 基板W之移載動作是依以下的順序來進行。首先，在 基板W到達既定的吸引開始位置之前，藉由攝影裝置65取 得基板W的影像，根據影像資訊來界定基板w的重心位置 和搬運姿勢。具體而言，是根據攝影裝置65的攝影機部所 拍攝之影像資訊，來檢測出攝影裝置65的座標系（XI · Υ 1 · Ζ 1 )中基板W的位置和傾斜。攝影裝置6 5的座標系例 如可定義成，以攝影機部的攝影面作爲XI-Υ1平面，以光 軸作爲Ζ1方向。將該座標系之基板W的重心位置和基板W 的傾斜（第9圖的0 1)藉由攝影裝置內的CPU進行座標轉 換，藉此算出平行連桿機構之座標系（X2 · Y2 · Z2 )中 基板W的重心位置和傾斜。將該等資訊從攝影裝置6 5輸出 至控制部64。在控制部64，由於是即時檢測第丨輸送機6 〇 -20- 201109257 的編碼訊號，可算出從拍攝基板W的時點起算之進給量， 而界定出基板W現在的重心位置。藉此，可追隨第丨輸送 機60的搬運動作而逐次更新手部5的目標位置，控制手部5 的位置直到吸引基板W爲止。又基板W的傾斜角度β 1是依 各個基板W而不同，也會有負値的情形。 配合基板W到達既定的吸引開始位置之時點，將手部 5及白努利夾頭9往基板W的正上方進行移位操作，在此期 間將迴旋軸7迴旋驅動角度0，而使白努利夾頭9的姿勢配 合基板W的姿勢。如第10圖所示，迴旋軸7之迴旋角度Θ ，是將白努利夾頭9之水平中心軸71與位置基準69 —致的 狀態設定爲零，而成爲前述基板W的傾斜角度0 1加上正 方向的餘裕角度02後的値。亦即以（0=0 1+ 02)的關 係，將迴旋軸7從位置基準69以迴旋角度0進行迴旋操作 〇 如上述般，藉由將迴旋軸7以迴旋角度0進行迴旋操 作，如第1 〇圖所示，在吸引開始位置之各導件體1 〇會位在 基板W的輪廓線之外。在此狀態下操作手部5及白努利夾 頭9，以不讓導件體1〇的下端接觸第1輸送機60的上面的方 式，下降至可吸附基板W之既定高度。這時，基板W是受 到：白努利夾頭9的迴旋流所產生之旋轉力矩 '以及發生 的負壓所產生之吸引力’由於吸引力非常大’會從第1輸 送機60的表面離開。結果’原先位於輸送機上的基板W藉 由白努利夾頭9進行吸引保持。被吸引保持的基板W，藉 由各夾頭單元27而受到第11圖的箭頭所示之順時針旋轉方 -21 - 201109257 向的迴旋氣流。因此，在被吸引保持的起初位於第11圖的 想像線所示位置之基板W，整體會朝順時針旋轉方向滑移 ，其邊部如實線所示般會被導件體1 〇之限制軸部53擋止。 亦即，基板W本身會迴旋移動而抵接於導件體10，而自我 完成地進行定位。在此，第1輸送機60的皮帶是使用一條 平皮帶，亦可爲寬度更細之複數條的平皮帶，或是由複數 條的圓皮帶所構成亦可。藉由使各個皮帶變細並將間隙加 大，可避免在萬一的情況下導件體10將皮帶戳破。或者是 ，亦可控制白努利夾頭9的位置，以對準間隙而使導件體 10下降至更下方。另一方面，承盤62，在第2搬送機61上 搬運的途中，是藉由光學感測器66來檢測其前端位置。光 學感測器66和第2輸送機61之編碼訊號是即時送往控制部 64，因此在控制部64可算出任意時間的承盤位置。亦即， 手部5移載基板W時之目標位置被逐次更新，控制手部5的 位置直到將基板W移載於承盤62上爲止。 在被吸引保持的基板W往承盤62側移送的期間，如第 12圖所示將迴旋軸7朝向與前述迴旋方向相反的方向（負 方向）以角度0進行迴旋驅動。藉由該迴旋驅動，使白努 利夾頭9之水平中心軸7 1與前述基準位置6 9 —致，而回到 適合承盤62之移載姿勢。在第12圖，白努利夾頭9迴旋操 作前之狀態以想像線表示，白努利夾頭9迴旋操作後的狀 態以實線表示。讓回到移載姿勢的狀態之手部5及白努利 夾頭9下降至承盤62的移載位置，停止對空氣室42供應壓 縮空氣，藉此使基板W落到承盤62上而完成移載。 -22- 201109257 移載後之手部5及白努利夾頭9，由於依然朝向前述g 準位置69，之後藉由反覆進行上述動作，可將第1輸送機 60上的基板W正確地移載至第2輸送機61上的承盤62。對 於承盤62，基板W以縱橫構成直線列的狀態整齊地進行移 載。又對於承盤62之移載姿勢，在與前述基準位置69不同 的情況，只要以適合移載姿勢的狀態將迴旋軸7以既定角 度進行迴旋操作即可。 (5)效果 上述構·造之移載裝置，由於在讓各導件體1〇位於基板 W之輪廓線外的狀態下進行基板w的吸引保持，如第10圖 所示，在吸附前的基板w和各導件體10之間可確保充分的 餘裕間隙。因此，關於手部5及白努利夾頭9相對於基板W 進行定位時之目標値（X . Y · Z座標），可預估以前述餘 裕間隙爲界限之偏差，對應於此可減緩手部5的位置精度 。即使是起因於輸送機的蛇行和延伸而發生之基板W的位 置偏移，也能夠因應。此外，由於相對於基板w之位置精 度減緩，可更迅速地進行手部5及白努利夾頭9的定位’而 讓平行連桿機構更高速地動作以提昇基板w的移載效率。 再者，在基板W被白努利夾頭9吸引保持的狀態下’ 基板W之定位是由基板W本身自動地進行’而能使基板W 的中心與白努利夾頭9的中心高精度地一致’因此能以高 的位置精度將基板W移載至移載目的地。 又在上述實施形態’基板W是藉由輸送機搬運至吸引 -23- 201109257 開始位置，基板W的移動量是根據設置於第1輸送機60之 編碼器63的輸出訊號來求出。這時，即使起因於輸送皮帶 之蛇行和延伸，而在基板W的實際位置和根據前述輸出訊 號進行計算所獲得的位置之間發生誤差，基板W仍能以不 接觸導件體10的方式被吸引保持。 此外，將從基板W之各邊部的中央往角落部側偏置的 位置藉由導件體1 0擋止而進行基板W的定位，比起將基板 W之各邊部的中央附近藉由導件體10擋止而進行基板W的 定位的情況，可提昇基板W之定位精度》再者，讓各導件 體1 〇位於基板W的輪廓線之外時，可在吸附前的基板W和 各導件體1 〇之間確保大的餘裕間隙，而能進一步減緩手部 5的位置精度。 從基板W之各邊部的中央起至導件體10所擋止之各邊 部的抵接位置爲止之偏置距離，若在對置的邊部設定成等 距離，最先進行抵接的邊部不管是遇到哪個導件體1 〇，基 板W的移位量都大致一定，而能迅速地讓基板W的姿勢最 佳化。附帶一提的，前述偏置距離在各導件體10爲大小不 同的情況，最先進行抵接的邊部，會根據遇到哪個導件體 1 〇而產生不同的基板W移位量，會有定位費時的情況發生 〇 根據以上的說明可明白，在本發明的一實施形態之基 板移載方法，是藉由設置於移載機構的手部5之白努利夾 頭9，將載置於吸引開始位置之四角形的基板W以非接觸 狀態進行吸引保持，在利用複數個導件體1 〇將基板W定位 -24- 201109257 的狀態下往移載位置進行移載。藉由手部5保持白努利夾 頭9的位置，使吸引開始位置之白努利夾頭9能夠以導件體 10位於基板W之輪廓線外的狀態將基板W予以吸引保持。 藉由從白努利夾頭的噴嘴孔47吹出之空氣流讓被吸引保持 的基板W朝單方向迴旋，利用導件體10來擋止迴旋移位之 基板W的邊部，藉此進行定位。 具體而言，藉由設置於手部5之迴旋軸7將位於吸引開 始位置之白努利夾頭9及導件體10進行迴旋操作，藉此使 導件體1 〇位於基板W的輪廓線之外。 較佳爲，在藉由移載機構將手部5從吸引開始位置往 移載位置進行移位操作的期間，利用迴旋軸7將導件體1 0 進行迴旋操作，而將基板W的姿勢變更爲移載姿勢。 (6 )其他實施形態 以上是說明本發明之一實施形態，但本發明並不限定 於上述實施形態，在不脫離發明要旨的範圍內可進行各種 的變更。特別是本說明書所記載之複數個實施形態及變形 例，可按照需要進行任意的組合。 (A )第1 3圖係顯示導件體〗〇的其他實施例。在此， 是在軸部5 1的下端設置往下漸細之錐狀的導入軸部52，導 入軸部52是兼作爲限制軸部53。爲此，將導件體10的上下 位置設定成，使白努利夾頭9的吸附面位在與導入軸部52 的上下方向中途部交叉之水平面上。且導入軸部52的錐角 爲90度。 -25- 201109257 若如此般利用往下漸細之錐狀的導入軸部5 2來將基板 W施以定位，與上述實施例同樣的，藉由白努利夾頭9吸 引保持的基板W可確實地定位。此外，受到空氣阻力、對 裝置的擾動等的外力之基板W，在被推向白努利夾頭9的 吸附面側的情況，可利用導入軸部52來擋止基板W的周緣 ，以限制基板W越過界限位置而移動。結果，可防止基板 W接觸白努利夾頭9的平坦面46而發生損傷。此外，比起 前述實施例的導件體10，由於第1輸送機60和承盤62的表 面可更靠近白努利夾頭9，因此可縮短從開始吸引至進行 保持的時間》再者，可降低藉由吸引力而使基板W碰撞白 努利夾頭9的平坦面之可能性。由於其他是與前述實施例 相同，對於相同的構件是賦予相同的符號而省略其說明。 (B)在上述實施例，是說明將隨機姿勢的基板W藉 由白努利夾頭9吸引保持的情況，但在基板W統一成既定 姿勢的情況，不須藉由迴旋軸7將白努利夾頭9實施迴旋操 作，因此可省略迴旋軸7。在此情況，將吸引開始位置的 基板W載置成其輪廓線避開導件體1 0的占有位置的狀態， 而使導件體1 〇位於基板W的輪廓線外。 詳而言之，以基板W的水平中心軸70相對於位置基準 69朝負方向偏移餘裕迴旋角度02的狀態，將基板W載置 於吸引開始位置。將此狀態的基板W藉由白努利夾頭9吸 引保持，使基板W沿著白努利夾頭9的吸附面迴旋移動而 利用導件體1 〇進行定位，以使其水平中心軸7〇與位置基準 69—致。之後是與前述實施例同樣地，將基板W移載至承 -26- 201109257 盤62。 (C)在上述實施例，是由四個夾頭單元27來構成白 努利夾頭9 ’也能不必這樣做，而使用更大徑的一個夾頭 單元27作爲基板W的吸附要素而構成白努利夾頭9。在此 情況’可將夾頭單元27直接固定於接頭體8，再者可利用 夾頭單元27來固定導件體1〇。接頭體8和夾頭座26是一體 地形成亦可。 (D )導件體1 0之配置個數及配置形態，可按照基板 W的大小、形狀或基板W之移載方向而改變，至少三個抵 接於基板W的邊部即可。例如，只要在夾頭座26之鄰接的 三邊部各設置一個導件體10，將基板W之鄰接的三邊部藉 由各導件體10來擋止，即可無歧異地決定其位置。在剩下 的一邊’只要往該方向作用的慣性力沒有使基板W飛出之 虞，導件體10是不需要的。或是，爲了避免在萬一的情況 基板W發生飛出，以在基板W和導件體1 〇之間隔著既定間 隙的方式在剩下的一邊也配置導件體10亦可。從基板W之 各邊部的中點起至導件體10所擋止之各邊部的抵接位置爲 止之偏置距離可爲大小不同，只要在各邊部的中點和任一 方的角落部之間存在前述抵接位置即可。 (E)作爲移載構造，雖然平行連桿機構是適當的， 但亦可爲多關節型的機器人。 【圖式簡單說明】 第1圖係本發明的移載裝置之白努利夾頭以及導件體 -27- 201109257 圖 面 截 縱 之 第第第第第第第第第第第 5 6 7 8 圖圖 視視 前俯 之之 構構 機機 桿桿 違 這 行行 平平 係係 圖圖 圖 立 解 分 之 澧 。 蔽 圖遮 面及 截以 縱座 之頭 頭夾 夾、 利體 努頭 白接 係係 圖圖 圖画 圖圖 圖 澧 。 flH 立圖。 解視圖 分仰視 之之仰 頭頭之 夾夾元 利利單 努努頭 白白夾 係係係 圖 圖 視 俯 之 例 用 使 的 置 裝 載 移 示 顯II 係卩 圖 明 說 之 係 關 置 位 的 體 件 導 之 時 附 吸 示 顯 明 。 說 圖之 明作 說動 之旋 作迴 動之 旋時 迴勢 之姿 板載 基移 的到 後回 附板 吸基 示示 顯顯 係係 圖圖 圖 圖 面 截 之 例 施 實 他 其 的 澧 a°-· 件 導 示 顯 係 圖 3 第 【主要元件符號說明】 5 :移載構造的手部 7 :迴旋軸 9 :白努利夾頭 1 0 :導件體 26 :夾頭座 4 5 :夾頭凹部 47 :噴嘴孔 -28-C-13-201109257 Figs. 1 to 12 show an embodiment of the substrate transfer device of the present invention. The transfer device of Fig. 2 is a transfer link mechanism in which a parallel link mechanism having a highly rigid gantry 1 (cross-conveyor) as a base is used as a transfer structure. The substrate W of the transfer target is a square-shaped germanium wafer constituting a solar cell having an aspect ratio of 125 mm X 125 mm or 156 mm X 156 mm and a thickness of 0.1 to 0.2 mm. As shown in Fig. 2, the parallel link mechanism includes a base 2 fixed to the gantry 1, two drive motors 3 disposed on the lower surface of the susceptor 2, and three sets of arm units driven by the motors 3. 4. The hand 5 and the like supported by the arm units 4. In the hand 5, a revolving shaft 7 that is driven by the revolving drive shaft 6 is provided. Further, on the lower surface side of the hand 5, a joint body 8, a whitenuuli chuck 9, and a plurality of guide bodies 10 are provided. The drive motor 3 is coupled to the output shaft by an upper end of the arm unit 4 assembled to the base 2' via a motor bracket. The drive motor 3 is integrally provided with a servo motor and a speed reducer, and outputs the reciprocating power that has been decelerated by the speed reducer to the arm unit 4. The arm unit 4 includes a drive arm 13 and a parallel link 14 that transmits a whirling motion of the drive arm 13 to one of the hands 5. The upper end and the lower end of the link 14 are coupled to the drive arm 13 and the hand 5 via a ball joint 15, respectively. The two links 14 are biased toward each other by the spring 16. By driving the arm units 4 by the drive motor 3, the hand 5 can be freely displaced in a predetermined three-dimensional space. In order to follow the three-dimensional displacement of the hand 5 and transmit the swirling power ', the revolving drive shaft 6 is constituted by a retractable ball bolt shaft 18 and a universal joint 19 coupled to the upper and lower ends thereof. The upper universal joint 19 is coupled to the -14 - 201109257 output shaft of the motor 20, and the lower universal joint 19 is coupled to the swing shaft 7. The motor 20 for driving the revolving drive shaft 6 is constituted by a servo motor and a speed reducer similarly to the above-described drive motor 3, and is disposed on the upper surface of the base 2. The hand 5 shown in Fig. 3 is composed of a three-pronged plate-like block, and the turning shaft 7 is rotatably supported by a cross roller bearing 21 at a central portion thereof (see Fig. 4). . The joint body 8 is fixed under the turning shaft 7, and the white Null chuck 9 is further fixed under the joint body 8. As shown in Fig. 5, the joint body 8 is formed in a shallow bottomed cylindrical shape which is formed in a downwardly open manner, and is formed at four places on the circumferential surface of the lower end of the cylindrical wall to be fastened to fasten the white Nucleus chuck 9. Solid seat 23. In order to reduce the weight, the entire joint body 8 is formed of, for example, an engineering plastic material such as an aluminum alloy or polyetheretherketone (PEEK) or a high-strength material such as fiber reinforced plastic (FRP). Further, in order to reduce the weight, a plurality of thickened holes are formed in the upper end wall of the joint body 8 so as to penetrate vertically. (2) The Bainuuli chuck Whiteurly chuck 9 includes: a flat chuck holder 26 fixed to the lower surface of the joint body 8, and four chuck units 27 fixed to the lower surface of the chuck holder 26, and A shielding plate 28 or the like fixed to the upper surface of the collet holder 26. The basic shape of the collet holder 26 is a square which is formed larger than the substrate W. As shown in Fig. 5, an annular collet fastening seat 31 for fastening the collet unit 27 is provided at four portions of the plate surface of the collet holder 26. Between the chuck fastening seats 31, a portion of the arc-shaped joint fastening seat 32 for fastening the joint body 8 is formed. Further, on each side portion of the chuck holder 26, a guide fastening seat 33 for fastening the guide member -15-201109257 body 10 is formed linearly. The chuck holder 26 is formed of a material having a small bending and deformation and high bending strength in order to reduce the weight and to be substantially flush with the lower surface of the chuck unit 27 opposed to the substrate W. As such a material, for example, a commercially available material (trade name: UNILATE) composed of a polyethylene terephthalate (PET)-filled composite glass fiber or an inorganic slab after heating and lamination can be used. Further, a thickened space is formed around the chuck fastening seat 31, the joint fastening base 32, and the guide fastening seat 33 to reduce the weight. Thus, by reducing the portions other than the fastening seats 31, 32, and 33 to form a reduced space, the weight of the collet holder 26 can be reduced to reduce the motion inertia force. The chuck unit 27 of Fig. 1 is composed of a bottomed cylindrical upper chuck body 40 that is opened downward and a bottomed cylindrical lower chuck body 41 that is open upward. At least the lower collet body 41 of the upper collet body 40 and the lower collet body 41 is formed of the following materials in consideration of the possibility of contact with the solar cell wafer: ultra high molecular weight polyethylene (UHPE), PEEK Polyacetal (POM), polytetrafluoroethylene (PTFE), polyimine (PI), ABS, or a combination of several of them. The upper chuck body 4 is fastened and fixed to the lower surface of the chuck holder 26, and the lower chuck body 41 is fastened and fixed to the lower opening side of the upper chuck body 40 in a sealed state. Thereby, a substantially cylindrical air chamber 42 is formed between the upper and lower chuck bodies 40, 41. As shown in Fig. 4, the air chamber 42 is connected to a compressed air supply source (not shown) through an air passage (rubber hose) 43 connected to the circumferential surface of the upper chuck body 40. On the lower surface of the lower chuck body 41, a shallow chuck recess 45 which is open downward is formed, and a continuous flat surface 46 is formed at the periphery of the opening of the chuck recess 45. Empty -16- 201109257 The air chamber 42 and the collet recess 45 are communicated through the eight nozzle holes 47. As shown in FIGS. 1 and 8, the nozzle hole 47 is formed to be inclined downward from the air chamber 42 side toward the peripheral corner portion side of the chuck recess 45, and the center axis of the nozzle hole 47 and the collet recess 45 are formed. The opening edges intersect at a predetermined angle. Thereby, the central axis of the air flow blown from the nozzle hole 47 is directed downward of the opening edge of the chuck recess 45. As shown in Fig. 8, the flow of the entire discharge air is a swirling airflow that swirls in the counterclockwise direction when the chuck unit 27 is viewed from the bottom surface, and the flow of the entire discharge air in a plan view becomes a clockwise rotation direction. The swirling airflow (refer to Figure 11). As described above, when the compressed air is blown out from the nozzle hole 47 in a state directed downward from the opening edge of the chuck recess 45, the pressure on the central portion side of the chuck recess 45 can be made a negative pressure. This negative pressure action is utilized to attract the substrate W that holds the transfer target. Further, when the opening surface of the chuck recess 45 including the flat surface 46 is used as the adsorption surface of the nucleus chuck 9, the substrate W and the suction surface which are sucked and held are separated by a slight gap as shown in Fig. 1. E is up and down. The air flow blown from the nozzle hole 47 passes through the gap E and is discharged to the atmosphere. When the holding substrate W is sucked and sucked by the white nipple 9 as described above, the air resistance acts on the surface of the substrate W, and the suction holding state of the substrate W by the nucleus chuck may become Unstable. In particular, in the case of a parallel linkage mechanism which is fast in motion, a large air resistance acts on the surface of the substrate W, and it is possible to cause the substrate W to fall from the nucleus chuck 9. In this manner, in order to prevent the substrate W from being shaken or dropped by the air resistance, the shield plate 28 covering the entire upper surface of the substrate W is fastened and fixed to the upper surface of the chuck holder 26. -17- 201109257 The shield plate 28 shown in Fig. 5 is composed of a plastic sheet having a square shape as a basic shape, similarly to the chuck base 26. A through hole 49 is formed in the center of the plate surface of the shield plate 28 along the outline of the joint body 8 and the chuck unit 27 to reduce the weight. The shield plate 28 is a thickened opening 35 and a reduced thickness notch 37 that are disposed to cover the collet holder 26. Four portions of the surrounding space of the through-hole 49 face the thickened space of the chuck holder 26, and a circular hole-shaped vent hole 50 is formed in order to allow the air passage 43 to pass therethrough. In this manner, when the upper space of the substrate W is covered by the shielding plate 28, the air flow when the hand 5 moves upward is blocked by the shielding plate 28, thereby preventing the downward air resistance from acting on the substrate W, thereby preventing the substrate from being prevented. W fell from the Bainuuli chuck 9. Further, on the vertical projection surface of the clip head, although eight holes are formed in the upper wall of the joint body 8, since the hand 5 is disposed adjacent to the upper side thereof, the airflow does not directly penetrate the substrate W through the hole. . (3) Guide body The substrate W which is attracted by the white Nucleus chuck 9 is easily slid along the adsorption surface of the nucleus chuck 9. In order to restrict such sliding, the substrate W is positioned, and the four guide bodies 10 are fixed in a state of being protruded downward at each side portion of the chuck holder 26. In detail, in the seventh figure, the left corner of the upper side of the chuck seat 26 and the left corner of the lower side, the upper corner of the left side, and the lower corner of the right side are collectively arranged in four places. The body is 1〇. Each of the guide members 10 is fastened to the lower surface of the guide fastening seat 33 of the collet holder 26 by bolts 54. As described above, the guide body 1 is disposed at a position on the side of each of the corners -18 to 201109257 of the chuck holder 26, and is offset from the midpoint of each side portion of the substrate W toward the corner portion side. It can be stopped by the guide body 10. The offset distance from the midpoint of each side portion of the substrate w to the contact position of each side portion where the guide body 10 is stopped is set to be equidistant at the opposite side portions. Therefore, the straight line connecting the guide body 10 and 1 〇 of the upper and lower sides and the straight line connecting the left and right side guide members 10 and 10 are intersected at the center of the nucleus chuck 9. Further, each of the guide bodies 10 and 10 of the opposite side portions of the stopper substrate W has a point symmetry relationship with the center of gravity of the substrate W as a center of symmetry. As shown in Fig. 1, the guide body 10 includes a shaft portion 51 having a circular shaft shape, a tapered introduction shaft portion 5 formed at the lower end of the shaft portion 5 1 and tapered downward, and continuous to the introduction shaft portion. The upper limiting shaft portion 53 of the upper portion 52 is formed in a bullet shape as a whole. The restricting shaft portion 53 is composed of a circular shaft having a diameter smaller than that of the shaft portion 51, and the peripheral portion thereof is used to block the side portion of the substrate W to restrict the slip, and the substrate W in the state of being sucked and held is positioned. . For this purpose, the upper and lower positions of the guide body 1A are set such that the suction surface of the white Nucleus chuck 9 is horizontally intersected with the intermediate portion of the vertical direction of the restriction shaft portion 53. In order to reduce the weight, the shaft portion 51 and the regulating shaft portion 53 are connected by a shaft portion that tapers downward. The guide body 10 is formed using a plastic material excellent in durability. Specifically, in the case where the substrate W is a silicon wafer for a solar cell, it is preferably used as a plastic material: ultra high molecular weight polyethylene (UHPE), polyether ketone (PEEK), polyacetal (POM) 'poly Plastic materials such as tetrafluoroethylene (PTFE), polyimide (PI), and ABS. However, since ultra-high molecular weight polyethylene and polyimine are difficult to perform injection molding, if a rod-shaped material is formed by turning, it is possible to form a guide body excellent in size -19-201109257 at a low cost. 1 〇. (4) Use Example of Transfer Device The transfer device of the above configuration is, for example, shown in FIG. 9 for transferring the respective substrates W transferred by the first conveyor 60 to the second conveyor 61 (and When the first conveyor 60 abuts the upper tray 62. Here, the driving states of the motor turns that drive the respective conveyors 60, 61 are fed back to the control unit 64 via the encoder 63, respectively. Further, the position signal and the posture information of the substrate W conveyed by the first conveyor 60 are obtained based on the captured image obtained by the imaging device 65 (which is constituted by the camera unit and the image processing unit), and are output to the control unit 64. Further, the position information of the retainer 62 conveyed by the first conveyor 60 is output to the control unit 64 via the optical sensor 66. The transfer operation of the substrate W is performed in the following order. First, before the substrate W reaches a predetermined suction start position, the image of the substrate W is taken by the photographing device 65, and the center of gravity position and the conveyance posture of the substrate w are defined based on the image information. Specifically, the position and inclination of the substrate W in the coordinate system (XI · Υ 1 · Ζ 1 ) of the imaging device 65 are detected based on the image information captured by the camera unit of the imaging device 65. The coordinates of the photographing device 650 can be defined, for example, such that the photographing surface of the camera unit is the XI-Υ1 plane and the optical axis is the Ζ1 direction. The position of the center of gravity of the substrate W of the coordinate system and the inclination of the substrate W (0 1 of FIG. 9) are coordinate-converted by the CPU in the imaging device, thereby calculating the coordinate system of the parallel link mechanism (X2 · Y2 · Z2) The center of gravity of the center substrate W is tilted. This information is output from the photographing device 65 to the control unit 64. In the control unit 64, since the coded signal of the second conveyor 6 2011 -20- 201109257 is detected immediately, the feed amount from the time when the substrate W is photographed can be calculated, and the current center of gravity of the substrate W can be defined. Thereby, the target position of the hand 5 can be sequentially updated following the conveyance operation of the second conveyor 60, and the position of the hand 5 can be controlled until the substrate W is attracted. Further, the inclination angle β 1 of the substrate W is different depending on the respective substrates W, and there is a case where there is a negative enthalpy. When the substrate W reaches the predetermined suction start position, the hand 5 and the white Nucleus chuck 9 are displaced directly above the substrate W, and during this period, the rotary shaft 7 is rotated to drive the angle 0, and the whitenu The posture of the chuck 9 matches the posture of the substrate W. As shown in Fig. 10, the swing angle Θ of the turning shaft 7 is set to zero in the state in which the horizontal center axis 71 of the whiteur chuck 9 and the position reference 69 are set to zero, and becomes the tilt angle 0 1 of the substrate W. Plus the 余 in the positive direction of the angle 02. That is, in a relationship of (0=0 1+ 02), the turning shaft 7 is rotated from the position reference 69 at a swing angle of 0. As described above, the turning shaft 7 is rotated at a swing angle of 0, as described above. 1 As shown in the figure, each of the guide bodies 1 在 at the suction start position is positioned outside the outline of the substrate W. In this state, the hand 5 and the white nucleus chuck 9 are operated so as not to bring the lower end of the guide body 1 接触 into contact with the upper surface of the first conveyor 60, and descend to a predetermined height at which the substrate W can be adsorbed. At this time, the substrate W is subjected to a rotation torque ' generated by the swirling flow of the white Nucleus chuck 9 and an attractive force generated by the generated negative pressure. The attraction force is extremely large, and is separated from the surface of the first conveyor 60. As a result, the substrate W originally placed on the conveyor was suction-held by the white Nucleus chuck 9. The substrate W that is sucked and held is subjected to the swirling airflow in the clockwise rotation direction -21 - 201109257 indicated by the arrow in Fig. 11 by each chuck unit 27. Therefore, the substrate W which is initially attracted and held at the position indicated by the imaginary line of Fig. 11 is slid as a whole in the clockwise direction, and its side portion is restricted by the guide body 1 as indicated by the solid line. Part 53 stops. That is, the substrate W itself is rotatably moved to abut against the guide body 10, and is self-finished. Here, the belt of the first conveyor 60 may be a flat belt, a flat belt of a plurality of narrower widths, or a plurality of round belts. By thinning the individual belts and increasing the gap, it is possible to prevent the guide body 10 from punctuating the belt in the event of a break. Alternatively, the position of the white Nucleus chuck 9 can be controlled to align the gap to lower the guide body 10 to the lower side. On the other hand, the retainer 62 detects the distal end position of the retainer 62 by the optical sensor 66 while it is being transported by the second transporter 61. The coded signals of the optical sensor 66 and the second conveyor 61 are immediately sent to the control unit 64. Therefore, the control unit 64 can calculate the position of the disk at any time. That is, the target position when the hand 5 is transferred to the substrate W is successively updated, and the position of the hand 5 is controlled until the substrate W is transferred onto the retainer 62. While the substrate W being sucked and held is transferred to the retainer 62 side, as shown in Fig. 12, the turning shaft 7 is rotationally driven at an angle of 0 in a direction opposite to the swirling direction (negative direction). By this rotary drive, the horizontal central axis 7 1 of the Bernoulli chuck 9 is brought into alignment with the aforementioned reference position 6 9 and returned to the transfer position suitable for the retainer 62. In Fig. 12, the state before the rotation of the Bainuuli chuck 9 is indicated by an imaginary line, and the state after the rotation of the Bainuuli chuck 9 is indicated by a solid line. The hand 5 and the white Nucleus chuck 9 in the state of returning to the transfer position are lowered to the transfer position of the retainer 62, and the supply of compressed air to the air chamber 42 is stopped, whereby the substrate W is dropped onto the retainer 62. Complete the transfer. -22- 201109257 After the transfer, the hand 5 and the white nucleus chuck 9 are still facing the g-alignment position 69, and then the above operation is repeated, the substrate W on the first conveyor 60 can be correctly moved. The retainer 62 is carried to the second conveyor 61. With respect to the retainer 62, the substrate W is neatly transferred in a state in which the vertical and horizontal lines constitute a straight line. Further, in the case where the transfer posture of the retainer 62 is different from the reference position 69, the swing shaft 7 may be rotated at a predetermined angle in a state suitable for the transfer posture. (5) Effects of the above-described transfer device, the substrate w is sucked and held in a state where the guide members 1 are positioned outside the outline of the substrate W, as shown in Fig. 10, before the adsorption A sufficient margin is ensured between the substrate w and each of the guide bodies 10. Therefore, with respect to the target 値 (X. Y · Z coordinate) when the hand 5 and the white Nucleus chuck 9 are positioned with respect to the substrate W, it is possible to estimate the deviation from the margin of the margin, which corresponds to this. The positional accuracy of the part 5. Even if it is caused by the positional shift of the substrate W which occurs due to the meandering and extension of the conveyor, it can be adapted. Further, since the positional accuracy with respect to the substrate w is slowed down, the positioning of the hand 5 and the white Null chuck 9 can be performed more quickly, and the parallel link mechanism can be operated at a higher speed to increase the transfer efficiency of the substrate w. Further, in the state where the substrate W is sucked and held by the Bernoulli chuck 9, the positioning of the substrate W is automatically performed by the substrate W itself, and the center of the substrate W and the center of the nucleus chuck 9 can be made highly precise. The ground is consistent 'so that the substrate W can be transferred to the transfer destination with high positional accuracy. Further, in the above embodiment, the substrate W is conveyed by the conveyor to the start position of the suction -23-201109257, and the amount of movement of the substrate W is obtained based on the output signal of the encoder 63 provided in the first conveyor 60. At this time, even if an error occurs between the actual position of the substrate W and the position obtained by calculation based on the aforementioned output signal due to the meandering and extension of the conveyance belt, the substrate W can be attracted without contacting the guide body 10. maintain. Further, the position of the substrate W is offset from the center of each side portion of the substrate W by the guide body 10 to position the substrate W, and the vicinity of the center of each side portion of the substrate W is used. When the guide body 10 is stopped and the substrate W is positioned, the positioning accuracy of the substrate W can be improved. Further, when each of the guide members 1 is positioned outside the outline of the substrate W, the substrate W before the adsorption can be performed. A large margin is ensured between each of the guide bodies 1 ,, and the positional accuracy of the hand 5 can be further reduced. The offset distance from the center of each side portion of the substrate W to the contact position of each side portion where the guide body 10 is stopped is set to be equidistant at the opposite side portions, and the first contact is made. Regardless of which guide body 1 遇到 is encountered in the side portion, the amount of displacement of the substrate W is substantially constant, and the posture of the substrate W can be quickly optimized. Incidentally, the offset distance is different when the respective guide bodies 10 are different in size, and the first abutting side portion generates a different amount of displacement of the substrate W depending on which guide body 1 is encountered. According to the above description, the substrate transfer method according to the embodiment of the present invention is provided by the white Nuoli chuck 9 provided in the hand 5 of the transfer mechanism. The rectangular substrate W placed at the suction start position is suction-held in a non-contact state, and is transferred to the transfer position in a state in which the substrate W is positioned -24 to 201109257 by a plurality of guide bodies 1 . By holding the position of the white nucleus chuck 9 by the hand 5, the white nucleus chuck 9 at the suction start position can suck and hold the substrate W in a state where the guide body 10 is located outside the outline of the substrate W. The substrate W that is sucked and held is swirled in one direction by the air flow blown from the nozzle hole 47 of the white Nucleus chuck, and the guide body 10 blocks the edge portion of the substrate W that is rotated and displaced, thereby performing positioning. . Specifically, the white nucleus chuck 9 and the guide body 10 at the suction start position are rotated by the turning shaft 7 provided on the hand 5, whereby the guide body 1 is placed on the contour of the substrate W. Outside. Preferably, during the shifting operation of the hand 5 from the suction start position to the transfer position by the transfer mechanism, the guide body 10 is rotated by the swing shaft 7 to change the posture of the substrate W. For the transfer posture. (6) Other Embodiments The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention. In particular, the plurality of embodiments and modifications described in the present specification can be arbitrarily combined as needed. (A) Fig. 13 shows another embodiment of the guide body. Here, the lower end of the shaft portion 51 is provided with a tapered tapered introduction shaft portion 52, and the introduction shaft portion 52 also serves as the restriction shaft portion 53. Therefore, the upper and lower positions of the guide body 10 are set such that the suction surface of the white Nucleus chuck 9 is horizontally intersected with the intermediate portion of the introduction shaft portion 52 in the vertical direction. Further, the taper angle of the introduction shaft portion 52 is 90 degrees. -25- 201109257 The substrate W is positioned by the tapered tapered introduction shaft portion 5 2 as described above, and the substrate W that is held by the white Null chuck 9 can be held in the same manner as in the above embodiment. Position it exactly. Further, when the substrate W that is subjected to an external force such as air resistance or disturbance to the device is pushed toward the adsorption surface side of the white Null chuck 9, the introduction shaft portion 52 can be used to block the peripheral edge of the substrate W to restrict The substrate W moves beyond the limit position. As a result, it is possible to prevent the substrate W from coming into contact with the flat surface 46 of the nucleus chuck 9 and causing damage. Further, since the surface of the first conveyor 60 and the retainer 62 can be closer to the Bainuuli chuck 9 than the guide body 10 of the foregoing embodiment, the time from the start of attraction to the holding can be shortened. It is possible to reduce the possibility that the substrate W collides with the flat surface of the white Null chuck 9 by the attraction force. Since the other components are the same as those of the foregoing embodiments, the same reference numerals are given to the same members, and the description thereof will be omitted. (B) In the above embodiment, the case where the substrate W in a random posture is sucked and held by the white Nucleus chuck 9 is described. However, when the substrate W is unified in a predetermined posture, it is not necessary to use the revolving shaft 7 to whiten The chuck 9 performs a swing operation, so the swing shaft 7 can be omitted. In this case, the substrate W at the suction start position is placed such that its outline avoids the occupied position of the guide body 10, and the guide body 1 is placed outside the outline of the substrate W. More specifically, the substrate W is placed at the suction start position with the horizontal center axis 70 of the substrate W being shifted in the negative direction by the marginal rotation angle 02 with respect to the position reference 69. The substrate W in this state is sucked and held by the Bernoulli chuck 9, and the substrate W is rotated along the adsorption surface of the nucleus chuck 9 to be positioned by the guide body 1 , so that the horizontal central axis 7 is 〇 and location benchmark 69. Thereafter, in the same manner as in the foregoing embodiment, the substrate W is transferred to the tray 62 of the -26-201109257. (C) In the above embodiment, the white nipple 9' is constituted by the four chuck units 27, and it is not necessary to do so, and a chuck unit 27 having a larger diameter is used as the adsorption element of the substrate W. White Nuori Chuck 9. In this case, the chuck unit 27 can be directly fixed to the joint body 8, and the chuck unit 27 can be used to fix the guide body 1〇. The joint body 8 and the collet holder 26 may be integrally formed. (D) The number and arrangement of the guide bodies 10 may be changed according to the size and shape of the substrate W or the transfer direction of the substrate W, and at least three may be abutted on the side of the substrate W. For example, if one guide body 10 is provided in each of the adjacent three sides of the chuck holder 26, the adjacent three sides of the substrate W are stopped by the respective guide bodies 10, and the position can be determined without any difference. . On the remaining side, the guide body 10 is not required as long as the inertial force acting in this direction does not cause the substrate W to fly out. Alternatively, in order to prevent the substrate W from flying out in a case where the substrate W is flying out, the guide body 10 may be disposed on the remaining side so that the substrate W and the guide body 1 are spaced apart from each other by a predetermined gap. The offset distance from the midpoint of each side of the substrate W to the contact position of each side portion where the guide body 10 is stopped may be different in size, as long as the midpoint and either corner of each side portion The aforementioned abutment position may exist between the parts. (E) As the transfer structure, the parallel link mechanism is suitable, but it may be a multi-joint type robot. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a white Nuoli chuck and a guide body of the transfer device of the present invention. -27- 201109257 No. 1st, first and fifth of the figure interception 5 6 7 8 The figure shows that the structure of the machine pole is in violation of this line of the line system diagram. The cover of the cover and the head of the vertical block are clipped, and the head of the body is connected with the white head. The picture is shown in the figure. flH an image. The view of the top view of the head of the head of the clip, the head of the Lili single Nunu head white and white system is shown in the diagram of the example of the use of the loading and shifting display II system diagram At the time, the attached display is obvious. Speaking of the picture, the rotation of the picture is the reversal of the rotation, the posture of the returning plate, the base shift, the back of the attached plate, the display of the base, the display of the system, the picture, the illustration, and the example of the section. A°-· Parts guide system diagram 3 [Main component symbol description] 5: Hand transfer structure of hand 7: Cyclotron axis 9: Bainuuli chuck 1 0 : Guide body 26: Chuck seat 4 5 : Chuck recess 47: Nozzle hole -28-