TW201107877A - Half tone mask and manufacturing method of the same - Google Patents

Half tone mask and manufacturing method of the same Download PDF

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TW201107877A
TW201107877A TW099116829A TW99116829A TW201107877A TW 201107877 A TW201107877 A TW 201107877A TW 099116829 A TW099116829 A TW 099116829A TW 99116829 A TW99116829 A TW 99116829A TW 201107877 A TW201107877 A TW 201107877A
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Taiwan
Prior art keywords
semi
barrier layer
penetrating
substrate
photoresist
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TW099116829A
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Chinese (zh)
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TWI434134B (en
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Moo-Sung Kim
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Lg Innotek Co Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • G03F1/58Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0332Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Liquid Crystal (AREA)

Abstract

The present invention relates to a half tone mask and a manufacturing method of the same configured to have multiple half permeation units by using a single half permeation material, wherein the half tone mask comprises: a substrate; a transmissive area formed on the substrate for transmitting irradiated light of a predetermined wavelength range; and a half permeation area formed on the substrate with multiple half permeation units having a plurality of mutually different transmittances using the predetermined wavelength range according to thickness of the half permeation material or the number of stacked layers.

Description

201107877 六、發明說明:【發明所屬之技術區域】 本發明係主張關於2009年05月26日申請之韓國專利 案號10-2009-0045847之優先權。藉以引用的方式併入本 文用作參考。 本發明係關於一種半調式光罩及藉由使用單一半穿透材料以 架構出具有多個半穿透單元之半調式光罩製造方法。 ^ 【先前技術】 〇 〇 -般來說,液晶顯示n⑽)制電場來控制具有介電異向 性(dielectric anisotropy)液晶之透光率從而顯示晝面。為達 成此-目的,該LCD包括:-液晶顯示器面板,利用二液晶胞矩 陣和-驅動該液晶顯示面板的驅動電路來呈現晝面。關於液曰顯 示器面板的技術包括:-彩色濾、光片基板和一薄膜電晶體基:彼 此結合並且有液晶灌注於其間。 彩色濾、光片基板包括··-黑矩陣、—彩色觀片及— 極接續設置於上玻璃基板上。 /、电 薄膜電晶體基板包括:-_電晶體和—位於下玻璃基板上 =極.=叉;資料線所定義*針對個別晶細胞所供設之書 =! 資料線的資料信號到畫素電極以響: ^極線路_極信號。從—翻導電層所形成的晝素電奸 /專膜電晶體提供資料信號以驅動液晶。 ’、文 =膜電晶體基㈣錢許錢 由運用單-半調式光罩形成源極和_ ==中經 減光罩製程的數量。 +導體圖案的製程以縮 4 201107877 在此時’半調式光罩包括:—wt紫外線的阻隔區,— 部分 紫外線穿透的半穿親以及—允許料線穿透其間的透光區— 半穿罩的半穿親可以形成_具林同透光率的多個 =了形成多個半穿透單元,使用了許多各自具有不同透光率 如’三種各有不同透光率的半穿透材料是必要 、^ 一固以上相互不同透光率的多個半穿透單元。 Ο Ο ’為了形成具有超過三個或以上多辨穿透單元的 牛调式先罩,將必需增加半穿透材料的數量。 【發明内容】 "為避免上述本發鴨提供—半赋鮮及藉由使用單 :半穿透材料以架構出具有多個半穿透單元之半調式料製造方 在本發明的一實施例中,提供有一半調式光罩,复包括一 基板;一透光區形成於基板上用以透射一特定波長範圍之照射光 線,以及-半穿透區形成於基板上且具有依據半穿透材料厚 疊層數量於特定波長範圍下有相互不同透光率的多個半^單 元。 在些實施例中,半調式光罩更可包括一阻隔區,阻隔區且 有形成介於至少兩辨穿透材料之層。 八 在些實施例中’半調式光罩更可包括一阻隔區,阻隔區且 有形成在至少兩個半穿透材料之一上表面或一底表面的一阻隔 層。 5 201107877 在-些實施例中’半穿透材料可包括有以鉻 錫、鋅、銦、鎂、給、銳、鈦、鍺、氧化二 為早—主要元素之材料或混合至少有兩贼以上元素之 ,或包括添加CGX、〇χ、他、&、&及&中至少二種 至I早-主要讀材料或結合材料之材料,其中字尾x 數並定義了個別化學元素的原子數。 〜自然 穿透穿辆可包姉成於基板上具有讓光線 ◎ i齡U 穿透材料的—第―半穿透單元,形成了較 厚的半穿透材料讓光線穿透多達Y%的—第二半穿透單_,、 及與兩層半穿透材料相堆疊 / 疋以 透單元。 隹且福先線穿透多達Z%的-第三半穿 括乙實麵中’一種半調式光罩製造方法,係包 土上:t叠有一第一半穿透材料、一阻隔層及一光 光和顯影光阻以露出該阻隔層 ’士 ο該阻隔層的基板上之後,曝光和顯4 +穿透材料及 ,先H该光阻並且移除露出的阻隔 i吏二隔f的需要區域得以露出;在移除露出的阻隔層以形 接-堆:了 :和第二半穿透材料之間阻隔層的阻隔區之後’ -半貝穿^穿透材料和光阻;曝光和顯影該光阻以露出第 -+穿透侧的需魏域助__㈣ 阻隔層;並且形成-半穿透區,其中包括—第一半穿透==及 半穿細、一第二半穿透單元在基板上:成反 、有,亥弟二半穿透材料、以及一第三半穿透單元與第一半穿透材 6 201107877 料和第二半穿透材料相堆疊。 ,在-些實施例中’第—和第二半穿透材料以相同之半穿透材 料形成,且第-和第二半穿透材料個別有不同之厚度。 、在-些實施例巾’半穿透材料係細鉻n目、组或铭作 為其單-主要元素的一種材料,或者是一結合材料混合至少有兩 T或以上元素,或者是材料中添加Cgx、0x、Nx t之至少一種到 單主要元素材料或結合材料。 ◎ *本伽的優點在於’根據本發㈣半調式光罩採用-單-半 本②料^具有二個以上相互㈣透縣之翅半穿透單元的 __「區,並且介於至少兩辨穿透㈣之間形成具有阻隔層的 =區,因此,單—半穿透材料而具有三個以上相互不同透 =的多辨穿透單元以省卻—具有多個透光率辭穿透材料, 具衫辦料元料調式鮮科需增加半穿透材料 的數置。 【實施方式】201107877 VI. Description of the Invention: [Technical Area to which the Invention Is Applicable] The present invention claims priority to Korean Patent No. 10-2009-0045847 filed on May 26, 2009. This is incorporated herein by reference. SUMMARY OF THE INVENTION The present invention is directed to a halftone reticle and a method of fabricating a halftone reticle having a plurality of semi-transparent cells by using a single-half penetrating material. ^ [Prior Art] 〇 〇 In general, the liquid crystal display n(10)) produces an electric field to control the transmittance of dielectric anisotropy liquid crystal to display the surface. To achieve this, the LCD includes: - a liquid crystal display panel that utilizes two liquid crystal cell arrays and - drives the liquid crystal display panel to drive the surface. Techniques for liquid helium display panels include: - color filter, light substrate, and a thin film transistor base: bonded to each other and with liquid crystal in between. The color filter and the light substrate include a black matrix, a color viewing film, and a pole connection on the upper glass substrate. /, the electric thin film transistor substrate includes: - _ transistor and - on the lower glass substrate = pole. = fork; data line definition * for the individual crystal cells to provide books =! data line data signal to the pixel The electrode is ringing: ^ pole line _ pole signal. A data signal is supplied from the alizarin ethics/special film transistor formed by the turned-on conductive layer to drive the liquid crystal. ', text = film transistor base (four) money Xu from the use of single-half-tone mask to form the source and _ = = the number of medium-reducing mask process. The process of the +conductor pattern is reduced to 4 201107877. At this time, the 'half-tone mask includes: - the barrier zone of -wt ultraviolet light, the part of the ultraviolet penetrating half-piercing and the light-transmitting area that allows the material line to pass through - half worn The half-piercing of the cover can form a plurality of semi-transparent units with multiple transmittances, and a plurality of semi-transparent materials each having different transmittances such as 'three different transmittances' are used. It is necessary to have a plurality of semi-transparent units having different transmittances from each other. Ο Ο ′ In order to form a cow-shaped hood with more than three or more multi-resolution penetration units, it will be necessary to increase the amount of semi-penetrating material. SUMMARY OF THE INVENTION [In order to avoid the above-mentioned present duck-semi-freshing and by using a single: semi-transparent material to construct a half-tone material having a plurality of semi-transparent units, an embodiment of the present invention Providing a half-tone mask comprising a substrate; a light transmissive region formed on the substrate for transmitting a specific wavelength range of illumination light, and a semi-transmissive region formed on the substrate and having a semi-transmissive material The number of thick laminates is a plurality of half-units having mutually different light transmittances in a specific wavelength range. In some embodiments, the half-tone mask may further comprise a barrier region, the barrier region and a layer formed between at least two of the interfering material. In some embodiments, the semi-tone mask may further include a barrier region, and a barrier layer formed on one of the upper surface or the bottom surface of the at least two semi-permeable materials. 5 201107877 In some embodiments, 'semi-penetrating material may include materials containing chromium tin, zinc, indium, magnesium, donor, sharp, titanium, tantalum, oxidized two early—the main element or a mixture of at least two thieves or more An element, or a material that adds at least two of the CGX, 〇χ, 、, &, & and & to I early-primary reading material or bonding material, wherein the suffix x number defines the individual chemical elements The number of atoms. ~ Naturally penetrating through the car can be wrapped into a semi-transparent unit on the substrate that allows the light to pass through the material, forming a thick semi-penetrating material that allows light to penetrate up to Y%. - The second half penetrates the single _, and is stacked with the two layers of semi-permeable material / 疋 to penetrate the unit.福 福 先 线 穿透 穿透 穿透 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福 福After a light and a developing photoresist are exposed on the substrate of the barrier layer, the light is exposed and exposed, and the photoresist is removed and the exposed barrier is removed. The desired area is exposed; after removing the exposed barrier layer to form a stack--stack: and after the barrier region of the barrier layer between the second semi-penetrating material '-a half-penetration material and photoresist; exposure and development The photoresist is exposed to expose the gamma-assisted __(four) barrier layer on the first-permeation side; and forms a semi-transparent region, including - first half penetration == and semi-through, and second half penetration The unit is on the substrate: a reverse, a, a two-part penetrating material, and a third semi-penetrating unit stacked with the first semi-permeable material 6 201107877 material and the second semi-penetrating material. In some embodiments, the first and second semi-permeable materials are formed from the same semi-permeable material, and the first and second semi-permeable materials are individually of different thicknesses. In some embodiments, the 'semi-penetrating material is a material of fine chrome n-group, group or inscription as its single-main element, or a combination of at least two T or more elements, or added to the material. At least one of Cgx, 0x, Nx t to a single main element material or a bonding material. ◎ * The advantage of this gamma is that 'according to this (four) half-tone mask adopts - single-half the second material ^ has more than two mutual (four) through the county's winged semi-transparent unit __ "zone, and at least two Forming a region with a barrier layer between (4), therefore, a single-semi-penetrating material having more than three different penetration units that are different from each other to eliminate - having multiple transmittances In order to increase the number of semi-penetrating materials, it is necessary to increase the number of semi-penetrating materials.

上, S2。 本發明實施例之詳細描述請參照圖丨至12。 圖1雜示出根據本發明一實施例之半調式光罩剖視圖。 多閱圖卜一半調式光罩100包括-阻隔區S1於-基板1〇2 具有多個半穿透單元之半穿透巴U a 心千芽迓(an S3、S4、S5以及一透光區On, S2. For a detailed description of embodiments of the present invention, please refer to FIGS. 1 is a cross-sectional view of a halftone reticle in accordance with an embodiment of the present invention. The multi-view mask half-modular reticle 100 includes a barrier region S1 on the substrate 1 〇 2 having a plurality of semi-transparent units of semi-transparent cells U a heart buds (an S3, S4, S5 and a light transmissive region)

一料二_可以疋—透明基板’例如,石英,能夠完全地透射 特疋波長範圍内之昭射朵綠 AK 可m 而,祕板麟於石英而 了以疋任何能夠透射光線之材料。 7 201107877 半穿透區S3、S4、S5可以包括多個半穿透部分在一特定波長 範圍以相互不同透光率透射光線到基板。在經過光阻製程的曝光 製程中部分透射紫外線之顯影製程後,半穿透區S3、弘、%,可 藉由個別不同厚度的光阻圖案所形成。 更具體言之,該半穿透區S3、S4、S5可以包括藉由使用至少 三個或以上個別具有不同透光率之半穿透材料的多個半穿透部 分。也就是說,半穿透區S3、S4、S5可以包括形成於基板上由讓 〇絲穿透多達X %之第—半穿透材料112所形成的—第一半 穿透單元S3,讓光線穿透多達γ %之第二半穿透材料ιΐ4所 形成的-第二半穿透單元S2,以及讓光線穿透多達z %的一第 二半穿透單元S4其與第-及第二半穿透材料112、114堆疊。 此時’第-和第二半穿透· 112、114個別是使用同一半穿 透材料所形成的,形成於第—半穿透單元S3上的第—穿透材料 112的厚度比軸於第二半穿透單元S2上㈣二半穿透材料114 更厚,其中個別的娜、抓和现定義為在範圍為1〇至當 ^ 中照射光線能夠透射的透光率。 、…如_述及,半調式光罩可以形成具有三個以上相互不同透 光率的多個半穿透單几係根據半穿透材料厚度或使用單一半穿透 材料的堆疊層數量。 此時,第一和第二半穿透材料112、114可以是以鉻、石夕、 斗、、1太1呂之纟作為主要元素的材料或-混合有至少兩個 $以上之化合物’或使用至少Cqx、qx、他之—者添加到該主要 讀材料之化合物’射χ是—自絲,爾元素誠之變化。 8 201107877 第一和第二半穿透材料n2、114之組成可以任意變化只要在 一特定波長範園的部分照射光線能夠透射。在本發明中,該第一 矛弟半穿透材料112、114之組成,例如,堆疊的半穿透材料 U2、114 可以是從—群組的 CrxOy、CrxCOy、Crx〇yNz、Six〇y、 Six〇yNz > SixCOy,SixCOyNz > MoxSiy > MoxOy > Mox〇yNz ^ MoxCOy ^The second substrate can be a transparent substrate, for example, quartz, which can completely transmit the illuminating green AK in the wavelength range of the 疋. 7 201107877 The semi-transmissive regions S3, S4, S5 may include a plurality of semi-transmissive portions that transmit light to the substrate at mutually different transmittances in a specific wavelength range. After partial development of the ultraviolet light transmission process in the exposure process of the photoresist process, the semi-transmissive regions S3, HI, and % can be formed by individual photoresist patterns of different thicknesses. More specifically, the semi-transmissive regions S3, S4, S5 may include a plurality of semi-transmissive portions by using at least three or more semi-penetrating materials having different light transmittances. That is, the semi-transparent regions S3, S4, S5 may include a first semi-transparent unit S3 formed on the substrate formed by letting the filaments penetrate up to X% of the first-semi-penetrating material 112, The second half penetrating unit S2 formed by the light penetrating up to γ% of the second half penetrating material ιΐ4, and a second semi-transparent unit S4 allowing the light to penetrate up to z% The second semi-penetrating material 112, 114 is stacked. At this time, the first- and second-half penetrations 112 and 114 are formed by using the same semi-penetrating material, and the thickness of the first-penetrating material 112 formed on the first-half penetrating unit S3 is greater than The two-half penetrating unit S2 has a thicker thickness of the (four) two-half penetrating material 114, wherein the individual Na, grab and now are defined as the light transmittance that can be transmitted by the irradiated light in the range of 1 〇 to ^. As described, the half-tone mask can form a plurality of semi-transparent single-systems having three or more mutually different transmittances depending on the thickness of the semi-transparent material or the number of stacked layers using a single-half penetration material. At this time, the first and second semi-penetrating materials 112, 114 may be a material mainly composed of chromium, shi, hopper, or 1 11 纟 或 or mixed with at least two compounds of more than $ or Use at least Cqx, qx, and others - the compound added to the main reading material 'shooting is - from the silk, the element changes. 8 201107877 The composition of the first and second semi-transmissive materials n2, 114 can be arbitrarily changed as long as a portion of the illumination light at a particular wavelength range can be transmitted. In the present invention, the composition of the first spear-through material 112, 114, for example, the stacked semi-transparent materials U2, 114 may be from a group of CrxOy, CrxCOy, Crx〇yNz, Six〇y, Six〇yNz > SixCOy, SixCOyNz > MoxSiy > MoxOy > Mox〇yNz ^ MoxCOy ^

MoxOyNz^ MoxSiy〇z, MoxSiyOzN ' MoxSiyC02N ^ MoxSiyCOz > Tax〇y > Tax〇yNz,TaxCOy , Tax〇yNz , ΑΙχ〇γ , AlxC〇y ^ ^ 〇 AlxCGyNz、Tix〇y、Tix〇yNz、孔叫任何—個或其組合。 同%’如圖1中所缘示,半穿透區可以包括具有不同穿 透率的第-、第二和第三半穿透單元,且第一個到第η半穿透單 元可以使用單一半穿透材料來形成。 “在顯之後第-阻隔區S1的絲随係於曝光製程中 藉由阻擋1外線所留有。為翻這樣的目的,阻隔區Si接續使用 第—穿透材料m、-阻隔層•及第二個半穿透材_堆疊 於基板上102從而阻止紫外線。也就是說,阻隔區S1的阻隔層110 係形成介於第一及第二半穿透材料之間。 _ ’一個形成半調式光軍的製程包括,透光區S5,今 阻隔區S1及半穿透區S2H將參_到1〇敘述之' 靜青參_2’第-半穿透材料m,阻隔層⑽和光阻则 由鱗、化學氣相沉積及類似方式依序堆疊在基板1〇2上。 更具敝,第,透材料112最好機♦翻、钮、 之者為主要兀素的材料或一混合有至少兩個或以上之化 9 201107877 合物’或使用至少c〇x、〇x、Nx之一者添加到該主要元素材料之 化口物’其中子尾X是一自然數,依據所被結合的主要元素而變 化。 第一半穿透材料112之組成可以任意變化只要在一特定波長 範圍的部分照射光線能夠透射。在本發明中,該第一半穿透材料 112之組成可以是從—辦_ ⑺^、MoxOyNz^ MoxSiy〇z, MoxSiyOzN ' MoxSiyC02N ^ MoxSiyCOz > Tax〇y > Tax〇yNz, TaxCOy , Tax〇yNz , ΑΙχ〇γ , AlxC〇y ^ ^ 〇AlxCGyNz, Tix〇y, Tix〇yNz, Hole Call Any one or a combination thereof. As shown in FIG. 1, the semi-transmissive region may include first, second, and third semi-transparent units having different transmittances, and the first to n-th trans-penetrating units may use a single Half penetrates the material to form. "After the display, the filament of the first-barrier region S1 is left in the exposure process by the barrier 1 outer line. For the purpose of turning over the barrier region Si, the first-penetrating material m, the barrier layer, and the The two semi-permeable materials are stacked on the substrate 102 to block ultraviolet rays. That is, the barrier layer 110 of the barrier region S1 is formed between the first and second semi-transmissive materials. _ 'One half-tone light is formed The military's process includes the light-transmissive zone S5, and the current barrier zone S1 and the semi-penetration zone S2H will be referred to as the 'static blue ginseng 2' first-half penetrating material m, and the barrier layer (10) and the photoresist are Scales, chemical vapor deposition and the like are sequentially stacked on the substrate 1 〇 2. More 敝, the first, the permeable material 112 is preferably a machine, a button, a material of a main element or a mixture of at least two One or more of the 9 201107877 compounds 'or add at least one of c〇x, 〇x, Nx to the chemistry of the main element material' where the sub-tail X is a natural number, depending on the primary The composition of the first half of the penetrating material 112 can be arbitrarily changed as long as it is in a specific wavelength range The sub-illuminated light can be transmitted. In the present invention, the composition of the first semi-transparent material 112 can be from - (7) ^,

SixOyNz、SixCOy、SixCQyNz、MoxSiy、MoxQy、Μ()ΑΝζ、M〇xC〇y、 〇 MoxQyNz、MoxSiyQz、MoxSiy〇zN、MoxSiyCQzN、MoxSiyCOz、Tax〇y、SixOyNz, SixCOy, SixCQyNz, MoxSiy, MoxQy, Μ()ΑΝζ, M〇xC〇y, 〇 MoxQyNz, MoxSiyQz, MoxSiy〇zN, MoxSiyCQzN, MoxSiyCOz, Tax〇y,

TaxOyNz ^ TaxCOy ^ Tax〇yNz ^ Alx〇y. AlxCOy. AlxOyNz > AlxCOyNz ^ TixOy、Tix〇yNz、TixCOy^一個或其組合,其中字尾x、y和z 為自然數並疋義每個元素的原子數目。 因此’阻隔層110的可使用能夠阻止料線的材料所形成, 以及例如,阻隔層可以使用鉻及%〇7所形成的薄膜。 現在請參閱圖3,形成於阻隔層11G上的光阻12G是以雷射 〇光束照射及繪製(Drawn),並且纷製的光阻12〇麵影以使露出的 阻隔層no位在透光區S5及第二半穿透單元S2應該形成的一個 位置。 5月參閱圖4 ’使用留存在阻隔層110上的光阻120作為光罩, 心由侧製程去除露出的阻隔層11()以露出第一半穿透材料⑴。 睛參閱圖5 ’藉由使用留在阻隔層110上的光阻120作為光 罩,經由爛製程去除露出的第-半穿透材料112。接著,藉由剝 離(去光阻)製程移除留在阻隔層11〇的光阻12〇。因此,阻隔區 201107877 si及第-和第三半穿透單元S3、S4應該形成的—個位置是與第 :半穿j材料112及阻隔層11Q所堆疊形成,及透光區s5及第二 半穿透單元S2應該形成的一個位置是基板1〇2露出的地方。 參閱圖6,形成的光阻120與第一半穿透材料ιΐ2和阻隔層 H0堆疊在基板1〇2上,並且雷射光束照射在光阻⑽上及給製 (Drawn)。此後,緣製的光阻12〇被顯影以使得阻隔層ιι〇祕露 在第二半穿透單元S4應該形成的一個位置。 〇 請參_7’制在基板⑽上形翁第—穿透材料112及阻 隔層110上所留有的光阻12G作為光罩,藉域刻製程去除露出 的阻隔層H0。接著,留在基板102上的光阻12〇被去光阻製程所 請簽閲圖8,第 …丁桃戰il4及光阻120依續藉由賤鍛 化學氣相沉積及類似方式被沉積在基板102上。 〇 在此時,形成第二半穿透材料114可叹使用相同於第 穿透材料的材質,但厚H半穿透制112料,使得個另 的第-及第二半穿透材料可以有不同的透光率。 更具體言之,第二半穿透材料114之最好由以鉻、石夕、翻、 钽、鈦、紅-者為主要元素的材料或—混合有至少兩個或以』 之化合物’或使用至少CQX、0x、Nx之—者添加到該 料之化合物’其中字尾X是-自然:數,依據所被結合的主要㈣ 而變化。 ” 第二彻材料m之紐成可以任意變化只要在一特定波長 11 201107877 範圍的部分照射光線能夠透射。在本發明中,第—半穿透材料ιΐ4 之組成可岐從-個群_ CrA、CrxC〇y、CrANz、si為、TaxOyNz ^ TaxCOy ^ Tax〇yNz ^ Alx〇y. AlxOyNz > AlxCOyNz ^ TixOy, Tix〇yNz, TixCOy^ or a combination thereof, where the suffixes x, y and z are natural numbers and derogate each element The number of atoms. Therefore, the barrier layer 110 can be formed using a material capable of preventing the wire, and for example, the barrier layer can be formed using a film formed of chromium and %〇7. Referring now to FIG. 3, the photoresist 12G formed on the barrier layer 11G is irradiated and drawn by a laser beam, and the photoresist is patterned to make the exposed barrier layer no. A position where the region S5 and the second half penetrating unit S2 should be formed. Referring to Figure 4, in May, the photoresist 120 left on the barrier layer 110 is used as a mask, and the exposed barrier layer 11 () is removed by a side process to expose the first semi-permeable material (1). Referring to Figure 5, the exposed first-half penetrating material 112 is removed via a ruin process by using the photoresist 120 remaining on the barrier layer 110 as a reticle. Next, the photoresist 12 留 remaining in the barrier layer 11 is removed by a stripping (deblocking) process. Therefore, the position where the barrier zone 201107877 si and the first and third half penetrating units S3, S4 should be formed is formed by stacking with the: semi-piercing j material 112 and the barrier layer 11Q, and the light transmitting region s5 and the second One position where the semi-transparent unit S2 should be formed is where the substrate 1〇2 is exposed. Referring to Fig. 6, the formed photoresist 120 is stacked on the substrate 1 2 with the first semi-transmissive material ι 2 and the barrier layer H0, and the laser beam is irradiated on the photoresist (10) and drawn (Drawn). Thereafter, the edge photoresist 12 is developed so that the barrier layer is exposed to a position where the second half penetrating unit S4 should be formed. 〇 Please refer to _7' to form the photoresist 12G on the substrate (10) on the shape-penetrating material 112 and the barrier layer 110 as a mask, and remove the exposed barrier layer H0 by a process. Next, the photoresist 12 留 remaining on the substrate 102 is removed by the photoresist process. Please refer to Figure 8. The Ding Tao il4 and the photoresist 120 are successively deposited by upsetting chemical vapor deposition and the like. On the substrate 102. At this time, the second semi-penetrating material 114 is formed to be sighed using the same material as the first penetrating material, but the thick H is half-transparent to make the material so that the other first and second semi-permeable materials may have Different light transmittance. More specifically, the second semi-penetrating material 114 is preferably made of a material mainly composed of chromium, stellite, turn, bismuth, titanium, red or a compound having at least two or Use at least CQX, 0x, Nx - the compound added to the material 'where the suffix X is - natural: number, depending on the primary (four) being combined. The second material m can be arbitrarily changed as long as a part of the illuminating light in a range of a specific wavelength 11 201107877 can be transmitted. In the present invention, the composition of the first semi-penetrating material ι ΐ 4 can be obtained from a group _ CrA, CrxC〇y, CrANz, si are,

SixOyNz ^ SixCOy ^ SixCOyNz > MoxSiy > MoxOy ^ MoxOyNz > MoxCOy >SixOyNz ^ SixCOy ^ SixCOyNz > MoxSiy > MoxOy ^ MoxOyNz > MoxCOy >

MoxOyNz、MoxSiyOz、MoxSiy〇zN MDxSiyCOzN、MoxSiyCOz、TaxOy、MoxOyNz, MoxSiyOz, MoxSiy〇zN MDxSiyCOzN, MoxSiyCOz, TaxOy,

TaxOyNz、Taxroy、TaxQyNz、AlxQy、AlxCQy、AlxQyNz、AlxC〇yNz、TaxOyNz, Taxroy, TaxQyNz, AlxQy, AlxCQy, AlxQyNz, AlxC〇yNz,

TixOy、TixOyNz、TixCOy任何一個或其組合,其中字尾x、y和z 為自然數並定義每個元素的原子數目。 〇 §青參閱目9 ’光阻120形成於透光區S5與第-半穿透單元S3 所應該形成的-位置被_及顯影’因此第二半穿透材料ιΐ4被 露出。 Ο 更具體言之’形成於透光區S5及第—半穿透單元幻所岸該 形成位光阻12〇為雷射光束騎和撕製,其情製的光阻 區域被顯影和被移除。因此,光阻⑽被留在第二半穿透材料 114 ’形成於阻隔區S1,第二半穿透單元S2及第三半穿透單元S4 應該成形的-個位置,及第二光阻⑽在透光區%和第一半穿透 S域S3應該成形的^ —個位置露出。 請參閱圖10,與留在第二半穿透材料114上作為光罩的光阻 -祕出的第二半穿透材料114被移除,因此該透光區叫皮 形成而露出基板1〇2,而且阻隔層11(^露在一處第—半穿透單元 S3應該被成形的位置。 請參閱圖11,移除暴露在基板上⑽的阻隔層110以形成具 有第一半穿透材料112的第一半穿透單元S3。 12 201107877 請參閱圖12,在基板102上所留下的光阻12〇被去光阻製程 所移除,因此與阻隔層110、第一半穿透材料112及第二半穿透材 料114堆疊的阻隔區si形成於基板1〇2上,與第一半穿透材料112 所形成的第一半穿透單元S3形成於基板1〇2上,與第二半穿透材 料114所形成的第一半穿透單元S4形成在基板丨〇2上,與第一半 牙透材料112和第二半穿透材料114堆疊的第三半穿透單元兑形 成在基板102上,以及形成曝露出基板的透光區%。Any one or combination of TixOy, TixOyNz, TixCOy, where the suffixes x, y, and z are natural numbers and define the atomic number of each element.参阅 参阅 参阅 目 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Ο More specifically, 'formed in the light-transmissive area S5 and the first-half-penetrating unit, the formation of the photoresist 12 is the laser beam riding and tearing, and the photosensitive resist area is developed and moved. except. Therefore, the photoresist (10) is left at the position where the second semi-transparent material 114' is formed in the barrier region S1, the second semi-transparent unit S2 and the third semi-transparent unit S4 should be formed, and the second photoresist (10) The position where the light transmission area % and the first semi-transmissive S domain S3 should be formed is exposed. Referring to FIG. 10, the second semi-transparent material 114, which is left as a photoresist of the photomask, is removed from the second semi-transmissive material 114, so that the light-transmissive region is called skin to expose the substrate. 2, and the barrier layer 11 is exposed at a position where the first-half penetrating unit S3 should be formed. Referring to FIG. 11, the barrier layer 110 exposed on the substrate (10) is removed to form a first semi-transmissive material. The first half of the 112 penetrates the unit S3. 12 201107877 Referring to FIG. 12, the photoresist 12 left on the substrate 102 is removed by the photoresist removal process, thus interacting with the barrier layer 110 and the first semi-transmissive material. The blocking region si of the 112 and the second semi-transmissive material 114 is formed on the substrate 1〇2, and the first semi-transparent unit S3 formed by the first semi-transmissive material 112 is formed on the substrate 1〇2, and The first semi-transparent unit S4 formed by the two-pass material 114 is formed on the substrate 丨〇2, and the third semi-transparent unit stacked with the first semi-transmissive material 112 and the second semi-transmissive material 114 is formed. On the substrate 102, and forming a light transmissive area % of the exposed substrate.

雖然本發明的較佳實補已被揭露作她明之用,該總體的 發明構思非用以限定上述實關。對於習知本技齡將可瞭解, 進行各種修改和形式與其細部之變化皆為可能,耐偏離申請專 利申請範圍中所揭露本發明之範疇及精神。 科㈣用於產業在於,根據本發明之半赋光罩採用一單 一半穿透材料以構成—有三個以上相互不同透光率之具有多個半 f透单病半穿透區,及—介於至少兩個半穿透材料之間一阻隔 層所形成之阻隔區,藉由多個半穿透部分使用—單—的 刊瓣❹辨辑如免除具有多 罩而不增加半穿透材料的數量。 干Μ光 13 201107877 【圖式簡單說明】 圖1係為根據本發明的一實施例所繪示之半調式光罩剖視圖。 圖2至12係為根據圖1之實施例繪示出半調式光罩製造方法 之剖視圖。 【主要元件符號說明】Although the invention has been disclosed for its purposes, the general inventive concept is not intended to limit the above. It will be apparent to those skilled in the art that various modifications and changes in the form and the details thereof are possible, and the scope and spirit of the invention disclosed in the scope of the application of the patent application. Section (4) is used in the industry, according to the present invention, the semi-foaming cover is constructed by using a single-half penetrating material - having more than three mutually different light transmittances and having a plurality of semi-f translucent single-transmission semi-transparent zones, and a barrier region formed by a barrier layer between at least two semi-penetrating materials, by using a plurality of semi-transparent portions to identify a single-sheet, such as eliminating the need for multiple covers without increasing the semi-penetrating material Quantity. Dry light 13 201107877 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a half-tone mask according to an embodiment of the invention. 2 through 12 are cross-sectional views showing a method of fabricating a halftone mask in accordance with the embodiment of Fig. 1. [Main component symbol description]

100 : 半調式光罩 102 : 基板 110 : 阻隔層 112 : 第一半穿透材料 114 : 第二半穿透材料 120 : 光阻 S1 : 阻隔區 S2 : 半穿透單元 S3 : 半穿透單元 S4 : 半穿透單元 S5 : 透光區 14100 : Halftone mask 102 : Substrate 110 : Barrier layer 112 : First half penetrating material 114 : Second semi penetrating material 120 : Photoresist S1 : Barrier zone S2 : Semi-transparent unit S3 : Semi-transparent unit S4 : Semi-transparent unit S5 : Transmissive area 14

Claims (1)

201107877 七、申請專利範圍: 1. 一種半調式光罩,係包括: 一基板; -透光區域形成於該基板上用以透射—蚊波長範圍之照射 光線;以及 ' 一半穿透區依據半穿透材料厚度·層數量,仙特定波長 Ο 〇 範圍形成於具有複數個相互不同透光率的多個 該基板上。 ^ 2. 如申請專利範圍第1項所述之半調式群,進-步包括—阻隔 區,具有形成介於至少_半穿透材料之間的—阻隔層。 3·如申請專利顏第丨項所述之半調式縣,進—步姑— =形成㈣_彻敝—咖或—底表面的 4.如申請專利細第丨項所述之糊 包括有以鉻、石夕、鈿、趣、鈇、紹,^中斜穿透材料 鈒、鈥、錯、氧化鎮-氧化銘或氮化 祕給、 混合至少峨似軸物,输mr:或 Nx、Cx、Fx及Bx中之至少一種到該單一主要 合材料之-材料,其中字尾義個5該結 元素的原子數。 巧自…、、數亚疋義了個別化學 5.如申請專利範圍第β 千周式先罩’其中’該半穿透區 201107877 包括形成於板上具有讓光線穿透多達χ 材料的一第一车空诗&涿+穿透 透多達γ %的—第二二厚的半穿透_讓光線穿 疊且讓光線穿透多達 早凡’以及與該兩半穿透材料堆 顿夕達z%的—第三半穿透單元。 6. -種製造半調式光罩之方法,係包括·· Ο Ο -基,上堆#有—第—半穿娜、—嶋及—光阻 口,4影該光阻以露出該阻隔層的需要區域,依續 的 阻隔層及該第-半穿透材料;在該光阻堆叠於具有該第—出= 透=料及該阻隔層的該基板上後’曝光和顯影該光阻並且移除 名路出的阻隔層以使得該阻隔層的該需要區域得以露出^ 除該露出的阻隔層以形成具有介於該第一半穿透材料和該第二 半穿透材料之間一阻隔層的一阻隔區之後,依續堆疊一第二半 穿透材料和-光阻;曝光和顯影該光阻以露出該第二半穿秘 科的需要區域並相繼移除該露出的第二半穿透材料及該阻隔層; 亚且形成-半穿透區,其中該半穿透區包括形成在該基板上且 有該第-半穿透材料的-第-半穿透單元、形成在該基板上具 有该第二半穿透材料的一第二半穿透單元、以及與該第一穿透 材料和該第一半穿透材料堆疊的一第三半穿透單元。 •如申請專利細第6斯述之糊式光罩製造方法,其中該第 :半穿透材料和該第二半穿透材料之形成使用相同之半穿透材 料’且該第-半穿透材料和該第二半穿透材料侧有不同之厚 度。 16 201107877 其中讀半 鋅、细、 者為舉— 8.如ί請專利範圍第6項所述之半調式光罩製造方法 穿透材料係為以鉻、矽、鉬、鈕、鈦、鋁、 、 、Ό 踢、 鎂、铪、釩、鈥、鍺、氧化鎂-氧化鋁或氮化矽中之一 主要凡素材料或是混合至少兩種或以上元素之結合材 、:、、力Cox、〇χ、Νχ、cx、fx及Βχ中之至少一種到該單一主 疋素材料或該結合材料之一材料。201107877 VII. Patent application scope: 1. A half-tone mask comprising: a substrate; - a light-transmissive region formed on the substrate for transmitting light in the wavelength range of the mosquito; and a semi-transparent region according to the half-through The thickness of the material and the number of layers are formed on a plurality of substrates having a plurality of mutually different light transmittances. ^ 2. The semi-tone group of claim 1, wherein the step comprises a barrier zone having a barrier layer formed between at least the semi-permeable material. 3. If you apply for a semi-tone county as described in the application of the Philippine 丨 , , 进 进 进 = = = = = = = = forming (4) _ 敝 敝 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖Chromium, Shixi, 钿, 趣, 鈇, 绍, ^ 斜 oblique through the material 鈒, 鈥, wrong, oxidized town - oxidation or nitriding secret, mixing at least 峨 like axis, lose mr: or Nx, Cx, At least one of Fx and Bx to the material of the single primary material, wherein the suffix is 5 the number of atoms of the junction element. Coincidence from ...,, and several sub-defects of individual chemistry 5. As claimed in the patent scope, the beta-thousand-thousand-first hood 'where' the semi-transparent zone 201107877 includes a first formed on the plate that allows light to penetrate as much as χ material Car empty poems & 涿 + penetration through as much as γ% - the second two thick semi-penetration _ let the light pile up and let the light penetrate as much as possible 'and penetrate the material with the two halves Up to z% - the third half of the penetrating unit. 6. A method for manufacturing a half-tone mask, comprising: · Ο Ο - base, upper pile #有—第半半娜, -嶋 and - photoresist port, 4 shadows of the photoresist to expose the barrier layer a desired area, a continuous barrier layer and the first-semi-penetrating material; after the photoresist is stacked on the substrate having the first-out-pass and the barrier layer, the photoresist is exposed and developed and moved Deleting the barrier layer to expose the desired region of the barrier layer to remove the exposed barrier layer to form a barrier layer between the first semi-through material and the second semi-permeable material After a barrier region, a second semi-transmissive material and a photoresist are successively stacked; the photoresist is exposed and developed to expose a desired area of the second semi-perforated secret and the exposed second half is successively removed. a transmissive material and the barrier layer; and a semi-transmissive region, wherein the semi-transmissive region includes a first-peri-permeation unit formed on the substrate and having the first semi-penetrating material, formed on the substrate a second semi-transparent unit having the second semi-permeable material, and the first penetrating material and the first Transflective Transflective a third cell material are stacked. The method of manufacturing a paste mask of the sixth aspect of the invention, wherein the first semi-transparent material and the second semi-penetrating material are formed using the same semi-penetrating material 'and the first-half penetrating The material and the second semi-permeable material have different thicknesses on the side. 16 201107877 Where to read the semi-zinc, fine, and for the lift - 8. The method for manufacturing the half-tone mask according to item 6 of the patent scope is chrome, tantalum, molybdenum, button, titanium, aluminum, , , , , , , , , , , , , , , , , , , , , , , , , At least one of 〇χ, Νχ, cx, fx, and Βχ to the single host halogen material or one of the bonding materials. 1717
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