201102202 t 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用以保持雷射加工裝置之加工頭的 加工頭保持機構。 【先前技術】 加工頭保持機構係具備加工頭而構成，藉由從加工頭 照射雷射光而進行工件之雷射加工。加工頭係接合在朝z 軸方向（雷射光照射方向）移動的加工頭保持裝置，且與加 工頭保持裝置一同移動。在該雷射加工裝置中，加工頭與 工件等碰撞時，在加工頭或加工頭保持機構等會產生損 傷。因此，雷射加工裝置係具備損傷減輕機構而構成。例 如，有一種藉由樹脂螺栓固定加工頭與加工頭保持裝置的 損傷減輕機構。該損傷減輕機構係在加工頭與工件等碰撞 時，藉由使樹脂螺栓破損而減輕對加工頭或加工頭保持裝 置等之撞擊。該種損傷減輕機構因對於加工頭之修復要花 費長時間，故期望在不使加工頭與加工頭保持裝置的固定 部分破損之情況下以減輕加工頭或加工頭保持裝置等之損 傷。 例如，在專利文獻1記載之雷射加工裝置係在雷射加 工機之加工頭的保持裝置具有用以在加工頭之碰撞聘解除 保持裝置的碰撞保護裝置。而且，在碰撞保護構件設置有 作為觸發器之碰撞力的調節裝置。 (專利文獻1):日本特開2006-123163號公報 【發明内容】 4 322014 201102202 « . (發明所欲解決之課題） 然而，在上述習知技術中，會有無法精密地進行碰撞 .力之調整且無法進行正確之碰撞力調整的問題。此外，會 v有在加工頭碰撞後之碰撞保護裝置的修復耗費時間精力之 問題。 本發明係鑑於上述課題而研創者，其目的係在於提供 一種能以適當之力量保持加工頭且容易地安裝加工頭的加 工頭保持機構。 ' (解決課題之手段） 為了要解決上述課題並達成目的，本發明之加工頭保 持機構係具備照射雷射光之加工頭、及以可裝卸之方式安 裝,刖述加工頭之加工頭保持部，且安裝在前述加工頭保持 部之加工頭係相對移動在工件上者，其中，前述加工頭保 持部係具備磁吸著於前述加工頭之電磁鐵，前述加工頭係 具備磁吸著於前述電磁鐵之磁吸著部，前述加工頭保持部 係藉由對施加於前述電磁鐵之電流進行控制，而調整前述 電磁鐵之磁力，藉此調整前述電磁鐵與前述磁吸著部之間 的磁吸著力。 (發明之效果） 依據本發明，藉由施加於電磁鐵之電流來調整電磁鐵 之磁力，並調整電磁鐵與磁吸著部之間的磁吸著力，因此 可獲致能以適當之力量保持加工頭且容易地安裝加工頭的 效果。 【實施方式】 [s 322014 l 201102202 以下，依據圖式詳細說明本發明之實施形態的加工頭 保持機構。本發明並非限定於該實施形態者。 (實施形態） 第1圖係顯示從正面右側觀看本發明實施形態之加工 頭保持機構時之構造的斜視圖。第2圖係顯示從背面左側 觀看本發明實施形態之加工頭保持機構時之構造的斜視 圖。第3圖係顯示加工頭保持機構之構造的左側面圖。第 4圖係顯示加工頭保持機構之構造的右側面圖。第5圖係 顯示加工頭保持機構之構造的正面圖，且顯示加工頭安裝 在加工頭保持部的狀態。 ' 加工頭保持機構係具有加工頭1及加工頭保持部2， ,加工頭保持部2係以可裝卸加工頭1,之方式構成。加工頭 保持部2係安裝在雷射加工裝置，且朝雷射光之照射方向 之Z軸方向（鉛直方向）移動。本實施形態之加工頭保持部 2係構成為：措由磁力而磁吸著（安裝）加工頭1 ’ _並且在施 加有預定値以上之力量時加工頭1會脫落。加工頭1係具 有將雷射光照射在工件（未圖示）的功能，並藉由磁力而安 裝在加工頭保持部2〇 加工頭保持部2與加工頭1係以將加工頭保持部2之 正面側及加工頭1之背面側磁吸著之方式安裝。加工頭保 持部2係包含朝Z軸方向延伸之平板而構成，且以使該平 板之一方主面朝加工頭保持機構的正面，使另一方主面朝 向加工頭保持機構之背面的方式安裝在雷射加工裝置。加 工頭1係具有朝z軸方向延伸之大致長方體的框體，該框f — I ύ 6 322014 201102202 體之背面侧係安裴在加工頭保持部2 ό 在加工頭保持部2之正面側配置有：永久電磁鐵 磁鐵22Α、22Β、安裝加工頭]時之進行左右方向的定位之 左右導引部24、安裝加工頭}時之進行上下方向定位 下導引槽23。 幻上 在加工頭保持部2之背面侧配置有可磁吸著於永 磁鐵21、電磁鐵22Α、22Β之麵著板12。該磁吸著板12 係由磁吸者於水久電磁鐵21、電磁鐵22α、22β之強 體構件（鐵等）所構成。此外，在加工頭！之背面側配置有 安裝於加工頭保持部2時之進行上下方向之定位的上下導 引部13。此外’加丄頭丨係在底面侧具有作為雷射光之射 出口的雷射光射出部11。 永久電磁鐵21係為藉由在與磁吸著板12接觸後將電 流施加在永久電磁鐵21而與磁吸著板12磁吸著，且在磁 吸著後即使切斷電流亦可維持與磁吸著板12之磁吸著狀 態的磁鐵。 . 、 電磁鐵22Α、22Β係為在與磁吸著板12接觸之後使電 流流通至電磁鐵22Α ' 22Β而與磁吸著板12磁吸著，僅在 電磁鐵22Α、22Β流通有電流之期間與磁吸著板12磁吸著 之磁鐵。 左右導引部2 4係配設成從加工頭保持部2之左側面延 伸至加工頭保持部2之正面側，且由例如板狀構件所構 成。左右導引部24係接合在加工頭保持部2之左側面，以 在加工頭1與加工頭保持部2磁吸著時使左右導引部24之 322014 7 201102202 板狀構件的主面（内侧之主面）與加工頭1之左側面接觸。 上下導引部13係從加工頭1之表面侧朝背面側的方向 延設。上下導引部13係形成例如圓柱狀，且構成為該圓柱 之柱轴朝向與加工頭1之背面垂直的方向。 上下導引槽23係載置上下導引部13並且沿著上下導 引槽23之槽壁面導引上下導引部13。上下導引槽23係具 有形成在從加工頭保持部2之正面側朝背面側之方向的谷 狀之槽，沿著該谷狀之槽送入上下導引部13。 在將加工頭1安裝在加工頭保持部2時，使加工頭1 之背面側接近加工頭保持部2之正面側。接著，一面使左 右導引部24之内側的主面接觸加工頭1之左侧的側面，一 面使加工頭1接近加工頭保持部2。此時，一面使上下導 引部13接觸上下導引槽23，一面使加工頭1接近加工頭 保持部2。加工頭1之背面侧與加工頭保持部2之正面側 係藉由使磁吸著板12與永久電磁鐵21接觸且磁吸著板12 與電磁鐵22A、22B接觸而接觸。 在使磁吸著板12與電磁鐵22A、22B接觸之狀態下， 電流會流至電磁鐵22A、22B。藉此，電磁鐵22A、22B與 磁吸著板12係藉由電磁鐵22A、22B之磕力而磁吸著。此 外，在使永久電磁鐵21與磁吸著板12接觸之狀態下，電 流會流動於永久電磁鐵21與磁吸著板12之間。藉此，永 久電磁鐵21與磁吸著板12藉由永久電磁鐵21之磁力而磁 吸著。在永久電磁鐵21與磁吸者板12精由永久電磁鐵21 之磁力而磁吸考後’切斷往永久電磁鐵21之電流。錯此\ 8 322014 201102202 加工頭1與加工頭保持部2係藉由電磁鐵22A、22B之磁力 及永久電磁鐵21之磁力而磁吸著。 電磁鐵22A、22B與磁吸著板12之磁吸著力係依流通 至電磁鐵22A、22B之電流的大小而變化。換言之，從電磁 鐵22A、22B發生之磁力會依流通至電磁鐵22A、22B之電 流的大小而變化’因此電磁鐵22A、22B與磁吸著板12間 之磁吸著力亦變化。因此，在本實施形態中，係調整流通 至電磁鐵22A、22B之電流，而以所希望之磁吸著力使加工 頭1與加工頭保持部2磁吸著。藉此，在預定値以上之撞 擊施加於加工頭保持機構時，加工頭1會從加工頭保持部 2分離。例如，加工頭1以比預定速度大的速度與工件碰 揸時，加工頭1會從加工頭保持部2脫離。. 流動至電磁鐵22A、22B之電流的大小係由磁々控制骏 置（控制部）3所控制。此外’流動至電磁鐵22A、22B之電 在的大小亦可依加工頭1之移動速度（Z軸方向的速度）而 變化。在此’說明磁力控制裝置的構成。第.6圖係顯示磁 力控制裝置3之構成的圖。磁力控制裝置3係雷射加工裝 置所具備之裝置，與加工頭保持部2之電磁鐵22A、22B連 接。 磁力控制裝置3係控制流動至電磁鐵22A、22B之電流 的大小之裝置。磁力控制裝置3考慮永久電磁鐵21與磁吸 箸板12之間的磁吸著力而控制流通至電磁鐵22A、22B之 電流的大小。磁力控制裝置3係具有速度檢測部31、磁力 算出部32、磁力控制部33。此外，磁力控制裝置3亦可以 [s 9 322014 201102202 使磁力控制裝置3成為加工頭保持機構的一部分的方式構 成加工頭保持機構。201102202 t VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a processing head holding mechanism for holding a processing head of a laser processing apparatus. [Prior Art] The processing head holding mechanism is constituted by a processing head, and laser processing of the workpiece is performed by irradiating the laser beam from the processing head. The processing head is joined to the processing head holding device that moves in the z-axis direction (the direction in which the laser light is irradiated), and moves together with the processing head holding device. In the laser processing apparatus, when the machining head collides with a workpiece or the like, damage occurs in the machining head or the machining head holding mechanism. Therefore, the laser processing apparatus is configured to include a damage reduction mechanism. For example, there is a damage mitigation mechanism for fixing a processing head and a processing head holding device by a resin bolt. This damage mitigating mechanism reduces the impact on the processing head or the processing head holding device or the like by breaking the resin bolt when the processing head collides with the workpiece or the like. Since such a damage mitigating mechanism takes a long time to repair the processing head, it is desirable to reduce the damage of the processing head or the processing head holding device without damaging the fixed portion of the processing head and the processing head holding device. For example, the laser processing apparatus described in Patent Document 1 is a holding device for a processing head of a laser processing machine, and has a collision protection device for colliding the holding device at the processing head. Further, the collision protection member is provided with an adjustment means as a collision force of the trigger. (Patent Document 1): JP-A-2006-123163 [Summary of the Invention] 4 322014 201102202 « . (Problems to be Solved by the Invention) However, in the above-mentioned prior art, there is a possibility that collision cannot be performed in a precise manner. Adjusted and unable to make correct collision force adjustment problems. In addition, there is a problem that it takes time and effort to repair the collision protection device after the collision of the machining head. The present invention has been made in view of the above problems, and an object thereof is to provide a machining head holding mechanism capable of holding a machining head with an appropriate force and easily mounting a machining head. (Means for Solving the Problem) In order to solve the above problems and achieve the object, the processing head holding mechanism of the present invention includes a processing head that irradiates laser light, and a processing head holding unit that is detachably attached to the processing head. And the processing head mounted on the processing head holding portion is relatively moved on the workpiece, wherein the processing head holding portion includes an electromagnet that is magnetically attracted to the processing head, and the processing head has magnetic attraction to the electromagnetic In the magnetic attraction portion of the iron, the processing head holding portion adjusts the magnetic force applied to the electromagnet to adjust the magnetic force of the electromagnet, thereby adjusting the magnetic force between the electromagnet and the magnetic attraction portion Soaking force. (Effect of the Invention) According to the present invention, the magnetic force of the electromagnet is adjusted by the current applied to the electromagnet, and the magnetic attraction force between the electromagnet and the magnetic attraction portion is adjusted, so that the machining can be maintained with an appropriate force. It is easy to install the processing head. [Embodiment] [s 322014 l 201102202 Hereinafter, a processing head holding mechanism according to an embodiment of the present invention will be described in detail based on the drawings. The present invention is not limited to the embodiment. (Embodiment) FIG. 1 is a perspective view showing a structure when a machining head holding mechanism according to an embodiment of the present invention is viewed from the front right side. Fig. 2 is a perspective view showing the structure when the processing head holding mechanism of the embodiment of the present invention is viewed from the left side of the back side. Fig. 3 is a left side view showing the configuration of the processing head holding mechanism. Fig. 4 is a right side view showing the configuration of the processing head holding mechanism. Fig. 5 is a front view showing the structure of the processing head holding mechanism, and shows a state in which the machining head is attached to the processing head holding portion. The machining head holding mechanism has a machining head 1 and a machining head holding portion 2, and the machining head holding portion 2 is configured to be detachable from the machining head 1. The processing head holding portion 2 is attached to the laser processing apparatus and moves in the Z-axis direction (vertical direction) in the irradiation direction of the laser light. The machining head holding portion 2 of the present embodiment is configured such that the machining head 1'_ is magnetically attracted (mounted) by the magnetic force, and the machining head 1 is detached when a predetermined force or more is applied. The processing head 1 has a function of irradiating laser light to a workpiece (not shown), and is attached to the processing head holding portion 2 by a magnetic force. The processing head holding portion 2 and the processing head 1 are used to machine the head holding portion 2 The front side and the back side of the processing head 1 are magnetically mounted. The processing head holding portion 2 includes a flat plate extending in the Z-axis direction, and is configured such that one of the main faces of the flat plate faces the front surface of the processing head holding mechanism, and the other main surface faces the back surface of the processing head holding mechanism. Laser processing equipment. The processing head 1 has a substantially rectangular parallelepiped frame extending in the z-axis direction, and the frame f_I ύ 6 322014 201102202 is disposed on the back side of the body in the processing head holding portion 2 ό on the front side of the processing head holding portion 2 The left and right guide portions 24 for positioning in the left-right direction when the permanent electromagnet magnets 22, 22, and the machining heads are mounted, and the lower guide grooves 23 are positioned in the vertical direction. On the back side of the processing head holding portion 2, a face plate 12 that can be magnetized to the permanent magnet 21 and the electromagnets 22A and 22A is disposed. The magnetic absorbing plate 12 is composed of a strong member (iron or the like) of a magnetizer, a long electromagnet 21, and electromagnets 22α and 22β. Also, in the processing head! The upper and lower guide portions 13 that are positioned in the vertical direction when attached to the processing head holding portion 2 are disposed on the back side. Further, the 'header' has a laser light emitting portion 11 as an exit port of laser light on the bottom side. The permanent electromagnet 21 is magnetically attracted to the magnetic attraction plate 12 by applying a current to the permanent electromagnet 21 after coming into contact with the magnetic attraction plate 12, and can maintain the current even after the magnetic current is cut off. A magnetically attracted magnet of the magnetic plate 12 is magnetically attracted. The electromagnets 22Α, 22Β are made to flow current to the electromagnet 22Α ' 22Β after being in contact with the magnetic attraction plate 12, and are magnetically attracted to the magnetic attraction plate 12, and only during the current flow of the electromagnets 22Α, 22Β A magnet that is magnetically attracted to the magnetic attraction plate 12. The left and right guide portions 24 are disposed to extend from the left side surface of the processing head holding portion 2 to the front side of the processing head holding portion 2, and are constituted by, for example, a plate member. The left and right guide portions 24 are joined to the left side surface of the processing head holding portion 2 to make the main surface of the left and right guiding portions 24 of the left and right guiding portions 24 when the processing head 1 and the processing head holding portion 2 are magnetically attracted (inside The main surface is in contact with the left side surface of the processing head 1. The upper and lower guide portions 13 are extended from the surface side of the processing head 1 toward the back side. The upper and lower guide portions 13 are formed, for example, in a columnar shape, and the column axis of the cylinder is oriented in a direction perpendicular to the back surface of the processing head 1. The upper and lower guide grooves 23 mount the upper and lower guide portions 13 and guide the upper and lower guide portions 13 along the groove wall surfaces of the upper and lower guide grooves 23. The upper and lower guide grooves 23 are formed in a valley-like groove formed in the direction from the front side to the back side of the processing head holding portion 2, and the upper and lower guide portions 13 are fed along the groove of the valley. When the machining head 1 is attached to the machining head holding portion 2, the back side of the machining head 1 is brought close to the front side of the machining head holding portion 2. Next, the main surface on the inner side of the left and right guide portions 24 is brought into contact with the side surface on the left side of the processing head 1, and the processing head 1 is brought closer to the processing head holding portion 2 on one side. At this time, the processing head 1 is brought close to the processing head holding portion 2 while the upper and lower guide portions 13 are brought into contact with the upper and lower guide grooves 23. The back side of the processing head 1 and the front side of the processing head holding portion 2 are brought into contact by bringing the magnetic attraction plate 12 into contact with the permanent electromagnet 21 and the magnetic attraction plate 12 is in contact with the electromagnets 22A, 22B. In a state where the magnetic attraction plate 12 is brought into contact with the electromagnets 22A and 22B, a current flows to the electromagnets 22A and 22B. Thereby, the electromagnets 22A and 22B and the magnetic attraction plate 12 are magnetically attracted by the force of the electromagnets 22A and 22B. Further, in a state where the permanent electromagnet 21 is brought into contact with the magnetic attraction plate 12, current flows between the permanent electromagnet 21 and the magnetic attraction plate 12. Thereby, the permanent electromagnet 21 and the magnetic attraction plate 12 are magnetically attracted by the magnetic force of the permanent electromagnet 21. When the permanent electromagnet 21 and the magnetizer plate 12 are magnetized by the magnetic force of the permanent electromagnet 21, the current to the permanent electromagnet 21 is cut. Wrong 8 82014201102202 The machining head 1 and the machining head holding portion 2 are magnetically attracted by the magnetic forces of the electromagnets 22A and 22B and the magnetic force of the permanent electromagnet 21. The magnetic attraction forces of the electromagnets 22A, 22B and the magnetic attraction plate 12 vary depending on the magnitude of the current flowing to the electromagnets 22A, 22B. In other words, the magnetic force generated from the electromagnetic irons 22A, 22B changes depending on the magnitude of the current flowing to the electromagnets 22A, 22B. Therefore, the magnetic attraction between the electromagnets 22A, 22B and the magnetic attraction plate 12 also changes. Therefore, in the present embodiment, the current flowing to the electromagnets 22A and 22B is adjusted, and the machining head 1 and the machining head holding portion 2 are magnetically attracted by the desired magnetic attraction force. Thereby, the machining head 1 is separated from the machining head holding portion 2 when a collision of more than a predetermined radius is applied to the machining head holding mechanism. For example, when the machining head 1 hits the workpiece at a speed greater than a predetermined speed, the machining head 1 is detached from the machining head holding portion 2. The magnitude of the current flowing to the electromagnets 22A, 22B is controlled by the magnetic cyber control (control unit) 3. Further, the magnitude of the electric current flowing to the electromagnets 22A and 22B may vary depending on the moving speed of the processing head 1 (the speed in the Z-axis direction). Here, the configuration of the magnetic control device will be described. Fig. 6 is a view showing the configuration of the magnetic force control device 3. The magnetic control device 3 is a device provided in the laser processing apparatus, and is connected to the electromagnets 22A and 22B of the processing head holding unit 2. The magnetic control device 3 controls the magnitude of the current flowing to the electromagnets 22A, 22B. The magnetic force control device 3 controls the magnitude of the current flowing to the electromagnets 22A, 22B in consideration of the magnetic attraction force between the permanent electromagnet 21 and the magnetic absorbing plate 12. The magnetic force control device 3 includes a speed detecting unit 31, a magnetic force calculating unit 32, and a magnetic force control unit 33. Further, the magnetic force control device 3 may constitute a machining head holding mechanism such that the magnetic force control device 3 becomes a part of the machining head holding mechanism [s 9 322014 201102202].
速度檢測部31係具備用以檢測加工頭1之z軸方向之 ，移動速度的速度感測器等而構成，並將所檢測之移動速度 运至磁力算出部32。在此之移動速度係加工頭1相對於工 件之相對速度（相對移動速度）。磁力算出部32係算出對應 速度檢測部31所檢出之移動速度的磁力。磁力算出部32 所算出之磁力係產生於電磁鐵22A、22B之磁力，依據例如 第7圖所示之移動速度_磁力資訊ι〇1所算出。移動速度_ 磁力貧訊101係顯示加工頭1之移動速度與對電磁鐵22A、 22B造成之磁力的對應關係之資訊。移動速度_磁力資訊 101亦可為顯示加工頭i之移動速度與對電磁鐵22A、22B 造成之磁力的對應關係之式，亦可為顯示對應關係之資訊 表。 如第7圖所示，移動速度為〇時，設定為於電磁鐵22八、 22B造成預定之磁力。此外，設定為磁力會隨著移動速度 .變大而變大。 磁力控制裝置33係控制電磁鐵“A、22B，以使產生 磁力异出部32所算出之磉力。具體而言，磁力控制部33 係使用以產生磁力算出部32所算出之磁力的電流流通至 電磁鐵22A、22B〇 S3 藉此’於加工頭1之移動速度變大而使加工頭1容易 從加工頭保持部2脫落時，可強力地固定加工頭丨與加工 頭保持部2。再者，加工頭丨之移動速度變.小而使加工頭iThe speed detecting unit 31 is provided with a speed sensor or the like for detecting the moving speed in the z-axis direction of the machining head 1, and transports the detected moving speed to the magnetic force calculating unit 32. The moving speed here is the relative speed (relative moving speed) of the machining head 1 with respect to the workpiece. The magnetic force calculation unit 32 calculates the magnetic force corresponding to the moving speed detected by the speed detecting unit 31. The magnetic force calculated by the magnetic force calculating unit 32 is generated by the magnetic forces of the electromagnets 22A and 22B, and is calculated based on, for example, the moving speed_magnetic information ι〇1 shown in Fig. 7. The moving speed _ magnetic lean 101 is information indicating the correspondence relationship between the moving speed of the processing head 1 and the magnetic force generated by the electromagnets 22A and 22B. The moving speed_magnetic information 101 may be an expression for indicating the correspondence between the moving speed of the processing head i and the magnetic force generated by the electromagnets 22A and 22B, or may be an information table for displaying the correspondence relationship. As shown in Fig. 7, when the moving speed is 〇, it is set to cause a predetermined magnetic force at the electromagnets 22, 22B. In addition, it is set that the magnetic force becomes larger as the moving speed becomes larger. The magnetic force control device 33 controls the electromagnets "A, 22B" so as to generate the force calculated by the magnetic force generating portion 32. Specifically, the magnetic force control portion 33 uses a current that generates a magnetic force calculated by the magnetic force calculating portion 32. When the moving speed of the machining head 1 is increased and the machining head 1 is easily detached from the machining head holding portion 2, the machining head 丨 and the machining head holding portion 2 can be strongly fixed to the electromagnets 22A and 22B 〇 S3. The processing speed of the processing head is changed. The processing head i is made small.
I 10 322014 201102202 不容易從加工頭保持部2脫落時，可較弱地^加工頭] 與加工頭㈣部2°料進行上賴制，叫應加工頭！ 與加工頭保持部2之容易脫落性的力量可對加工頭！與加 工頭保持部2進行磁吸著。如此，以對應移動速度的磁力 對加工頭丨與加X頭_部2進行錢著，因此可使加工 頭1與加工頭保持部2不容易脫落而磁吸著，而且即使加 工頭1與讀碰撞時，亦可減低對雷射加卫裝置（加工頭ι 或加工頭保持部2等）與卫件的損傷。此外，可藉由電磁鐵 22A、22B之磁力調整加工頭！之容易脫落性、因加工頭1 與工件之碰撞而產生的雷射加卫裝置之損傷的大小等。 此外，在本實施形態中，雖說明依加卫頭丨之移動速 度而造成使電磁鐵22A、22B之磁力產生變化的情形加以說 明，但亦可依加工頭1之移動加速度（z軸方向的加速度） 使造成電磁鐵22A、22B之磁力產生變化。此情形時，速度 檢測部31係利用所檢測之速度算出加工頭1之加速度。在 此之加工頭1的加速度係加工頭〗相對於工件之栢對加速 度（相對移動加速度）。此外，磁力算出部32係算出對應速 度檢測部31所檢出之移動加速度的磁力，磁力控制部33 係令用以產生磁力算出部32所算出之磁力的電流流通至 電磁鐵22A、22B。 磁力算出部32係依據例如第8圖所示之移動加速声一 磁力#訊102算出磁力。移動加速度_磁力資訊1〇2 加工頭1之移動加速度與對電磁鐵22Α、22β造成成，、、不 對應關係的資訊。移動加速度-磁力資訊102亦可為：力之 322〇i4 11 201102202 工頭1之移動加速度與對電磁鐵22A、22B造成之磁力的對 應關係之式，亦可為顯示對應關係之資訊表。 如第8圖所示’即使移動加速度為〇 B夺’亦設定為對 • 電磁鐵22A、. 22B造成預定之磁力。此外，設定為磁力會隨 著移動加速度的絕對值變大而變大。 磁力控制裝置3亦可依工件之材質（硬度）等加工條件 使於電磁鐵22A、22B造成之磁力產生變化。此外，亦可在 加工頭保持部2配置永久磁鐵，以取代永夂電磁鐵21。此 時，磁力控制裝置3係考慮永久磁鐵與磁吸著板12之磁吸 著力來控制流通至電磁鐵22A、22B之電流的大小。再者， 亦可在加工頭保持部2將永久磁鐵與電磁鐵22Α、22β、永 久電磁鐵21 —同配置。此情形時，磁力控制裝置3係考慮 永久電磁鐵21與磁吸著板12之磁吸著力、永久磁鐵與磁 =著板12之磁吸著力來控制流通至電磁鐵2以、22B之電 流的大小。此外，亦能以電磁鐵22A、22B及磁吸著板i2 t加工頭1與加頭鋪部2進行魏著，並且以樹脂螺 栓進行接著加工頭1與加工頭保持部2。. 在本貫施形態中，雖依據加工頭！之z抽方向的移動 速度使電磁鐵22A、22B之磁力變化㈣形進行·，惟磁 力控制裝置3亦可依據加工頭！之χγ平面内的移動速度， 使電磁鐵22Α、22Β之磁力變化。此情形時，在χγ平面内 =移動速度係為加卫頭i相對於卫件之相對速度。因此， 二加工頭1並未移動於π平面内，且載置工件之台移 Υ平面内時’該ΧΥ台之移動速度係為加工頭i之ΧΥ 322014 12 201102202 平面内的移動速度。 此外’磁力控制裝置3亦可依據加工頭1之Z軸方向 的移動速度及在XY平面内的移動速度兩者，使電磁鐵 22A、22B之磁力變化。再者，磁力控制裝置3亦可對Z軸 % 方向的速度及在XY平面内的速度進行加權，再依據z軸方 向的速度及在XY平面内的速度使電磁鐵22A、22B之磁力 變化。 再者，磁力控制裝置3亦可依據加工頭1之在χγ平面 内的移動加速度，使電磁鐵22A、22B之磁力變化。此情形 時，在XY平面内之移動加速度係為加工頭1相對於工件之 相對加速度。又，磁力控制裝置3亦可根據加工頭1的z 軸方向移動加速度及χγ平面内的移動加速度兩者使電磁 鐵22A、22B之磁力變化。此外，磁力控制裝置3亦可對z 軸方向的加速度及在XY平面内的加速度進行加權，再依據 Z軸方向的加速度及在χγ平面内的加速度使電磁鐵22A、 22B之磁力變化。 在本實施形態中，雖依據加工頭1之移動速度或移動 加速度使電磁鐵22A、22B之磁力變化的情形進行說明，但 磁力控制裝置3亦可依據加工頭1之Z轴方向的移動速度 及移動加速度兩者使電磁鐵22A、22B之磁力變化。I 10 322014 201102202 When it is not easy to fall off from the processing head holding portion 2, the head can be processed relatively weakly with the processing head (four) part 2°, which is called the processing head! The force that is easy to fall off with the processing head holding portion 2 can be applied to the processing head! Magnetic attraction is performed with the processing head holding portion 2. In this way, the processing head 丨 and the X head portion 2 are made to be magnetic by the magnetic force corresponding to the moving speed, so that the processing head 1 and the processing head holding portion 2 can be prevented from falling off and magnetically attracted, and even the processing head 1 and the reading are performed. In the event of a collision, damage to the laser guard (processing head 1 or the processing head holding portion 2, etc.) and the guard can also be reduced. In addition, the machining head can be adjusted by the magnetic force of the electromagnets 22A, 22B! The ease of detachment, the size of damage caused by the collision of the processing head 1 and the workpiece, and the like. Further, in the present embodiment, a description will be given of a case where the magnetic force of the electromagnets 22A and 22B is changed by the moving speed of the gazeback head, but the movement acceleration of the machining head 1 (z-axis direction) may be used. Acceleration) causes a change in the magnetic force of the electromagnets 22A, 22B. In this case, the speed detecting unit 31 calculates the acceleration of the machining head 1 using the detected speed. In this case, the acceleration of the machining head 1 is relative to the workpiece (relative movement acceleration). Further, the magnetic force calculating unit 32 calculates the magnetic force of the moving acceleration detected by the corresponding speed detecting unit 31, and the magnetic force control unit 33 causes the current for generating the magnetic force calculated by the magnetic force calculating unit 32 to flow to the electromagnets 22A and 22B. The magnetic force calculation unit 32 calculates the magnetic force based on, for example, the motion acceleration sound-magnetic force #102 shown in Fig. 8. Movement Acceleration_Magnetic Information 1〇2 Information on the movement acceleration of the machining head 1 and the correspondence between the electromagnets 22Α and 22β. The movement acceleration-magnetic information 102 can also be: 322 〇 i4 11 201102202 The movement acceleration of the foreman 1 and the corresponding relationship with the magnetic force generated by the electromagnets 22A, 22B can also be an information table showing the correspondence relationship. As shown in Fig. 8, 'even if the moving acceleration is 〇 B', the predetermined magnetic force is applied to the electromagnets 22A, 22B. In addition, it is set that the magnetic force becomes larger as the absolute value of the moving acceleration becomes larger. The magnetic force control device 3 can also change the magnetic force caused by the electromagnets 22A and 22B depending on the processing conditions such as the material (hardness) of the workpiece. Further, a permanent magnet may be disposed in the processing head holding portion 2 instead of the permanent magnet 21. At this time, the magnetic force control device 3 controls the magnitude of the current flowing to the electromagnets 22A, 22B in consideration of the magnetic attraction force of the permanent magnet and the magnetic attraction plate 12. Further, the permanent magnets may be disposed in the processing head holding portion 2 together with the electromagnets 22A, 22β, and the permanent electromagnets 21. In this case, the magnetic control device 3 controls the current flowing to the electromagnet 2 and 22B in consideration of the magnetic attraction force of the permanent electromagnet 21 and the magnetic attraction plate 12, and the magnetic attraction force of the permanent magnet and the magnetic plate 12. size. Further, the processing head 1 and the head portion 2 can be lifted by the electromagnets 22A and 22B and the magnetic attraction plate i2 t, and the processing head 1 and the processing head holding portion 2 can be carried out by resin stoppers. In the basic form, it is based on the processing head! The movement speed of the z-pulling direction causes the magnetic force of the electromagnets 22A, 22B to change (four), but the magnetic force control device 3 can also be based on the processing head! Then, the moving speed in the γ plane changes the magnetic force of the electromagnets 22Α and 22Β. In this case, the moving speed in the χγ plane is the relative speed of the defending head i relative to the guard. Therefore, when the two processing heads 1 are not moved in the π plane and the stage in which the workpiece is placed is moved in the plane, the moving speed of the stage is the moving speed in the plane of the processing head i 322014 12 201102202. Further, the magnetic force control device 3 can change the magnetic force of the electromagnets 22A and 22B in accordance with both the moving speed of the processing head 1 in the Z-axis direction and the moving speed in the XY plane. Further, the magnetic force control device 3 can also weight the speed in the Z-axis % direction and the speed in the XY plane, and change the magnetic force of the electromagnets 22A, 22B in accordance with the speed in the z-axis direction and the speed in the XY plane. Further, the magnetic force control device 3 can change the magnetic force of the electromagnets 22A, 22B in accordance with the movement acceleration of the machining head 1 in the χ γ plane. In this case, the moving acceleration in the XY plane is the relative acceleration of the machining head 1 relative to the workpiece. Further, the magnetic force control device 3 can change the magnetic force of the electromagnetic irons 22A and 22B in accordance with both the acceleration in the z-axis direction of the machining head 1 and the movement acceleration in the χγ plane. Further, the magnetic force control device 3 can also weight the acceleration in the z-axis direction and the acceleration in the XY plane, and then change the magnetic force of the electromagnets 22A and 22B in accordance with the acceleration in the Z-axis direction and the acceleration in the χγ plane. In the present embodiment, the magnetic force of the electromagnets 22A and 22B is changed depending on the moving speed or the moving acceleration of the processing head 1. However, the magnetic force control device 3 may be moved in accordance with the moving speed of the processing head 1 in the Z-axis direction. Both of the moving accelerations change the magnetic force of the electromagnets 22A, 22B.
此外，在本實施形態中，由於永久電磁鐵21與磁吸著 板12磁吸著’因此當移動速度為〇時，亦可將電磁鐵22A、 22B之磁力設為〇。此外，亦可將流通至電磁鐵22A、22B 之電流設為可變，在加工開始後設定為一定値。此情形時， [s ] 13 322014 201102202 磁力控制裝置3亦可不具有速度檢測部31或磁力算出部 32。不論加工頭1之移動速度為何，磁力控制裝置3係使 預設之預定電流値流至電磁鐵22A、22B與磁吸著板丨2之 間。此外’磁力控制裝置3亦可令用以產生因應外部輸入 之來自使用者之指示的磁力之電流値流至電磁鐵22A、 22B。此情形時’磁力控制裝置3亦可不具有速度檢測部 31或磁力算出部32。 此外’在本實施形態中，雖說明加工頭保持部2具有 1個永久電磁鐵21及2個電磁鐵22A、22B之情形，但加 工頭保持部2所具有之永久電磁鐵21及電磁鐵22A、22B 的個數亦可為複數個。 如此’加工頭保持機構係利用電磁鐵22A、22B使加工 頭1與加工頭保持部2磁吸著，因此在加工頭1與工件碰 撞之際，因加工頭1與加工頭保持部2會分離，因此可減 輕對雷射加工裝置或工件之撞擊。此外，容易地將因碰撞 而分離之加工頭1與加工頭保持部2予以定位，且能以電 磁鐵22A、22B等之磁力進行迅速之固定。藉此，能以磁力 磁吸著進行加工頭保持機構之迅速復原。 右電磁鐵22A、22B之磁力為一定，則加工頭1高速移 動時，即使加工頭1未與工件碰撞，加工頭1.亦容易從加 工頭保持部2脫落。此外，若電磁鐵22A、22B之磁力為一 定，則加工頭1低速移動時，即使加工頭1與工件碰撞， 加工頭1亦不容易從加工頭保持部2脫落。在本實施形態 中’由於依加工頭1之移動速度來控制電磁鐵22A、22B之 322014 14 201102202 磁力的大小，因此可防止在磁力之大小為—定時發生之高 速移動時的力σ工頭ί之脫落或低速移動時之加工頭〗的非 脫落。換言之，在高速移動時可防止加工碩1在未與工件 碰才里之障$下脫落，在低速移動時可使加工頭1在盘工件 碰撞時脫落。 ~ 此外，加工頭保持機構亦可藉由利用空壓或油壓之真 空抽吸（吸著力）使加工頭1與加工頭保持部2吸著以取代 磁力。此情形時’加工頭i與加工頭保持部2之間的吸著 力係構成為可變。此外，亦可依加工頭1之移動速度或移 動加速度’使加工頭i與加工頭保持部2之間的吸著力變 W再可將力感測器安敦在加卫頭14加工·_ 控制電磁鐵22A、22B之磁力，以在 加 頭保持部W施加航力量為止〇使加王頭」脫力落 工頭=雷射加工裝置(例如加工頭保持機構)亦可在力, 工頭1從加卫縣持部2脫落時輸出警報。此情 機構配置近接感測器。而且，該近接感測到 在^則到加卫頭丨從加工頭保持部2脫落時輸出煞報。 如上.所述依據本實_態，能以適當之磁力保持加二 頭1，同時可容易地將加工頭1安穿 ’、 外，可利㈣易之構成的加工頭m持部2。^ 加工頭保持機搆。 與销持部2則 此外，由於依加玉頭1之移動逮度或移動力 至電磁鐵22A、22B之電流的大小變化， k又使/刀 j文化，因此能以對應加3 322014 15 201102202 Μ與加工頭保持部2之容易脫落性的力量對加工頭^ 加工頭保持部2進行磁吸著。此外，由於利用永磁鐵 21或永久磁鐵對加卫頭]與加工頭保持部2進行磁 因此能以低電力將加安裝在加工頭保持部2。 (產業上之可利用性） 如上所述，本發明之加工頭保持機構係適合於加工頭 之安裝及保持、加工頭之脫落。 【圖式簡單說明】 第1圖係顯示從正面方向齡實施形態之加工頭保 機構時之構造的斜視圖。 ' 第2圖係顯示從背面方向觀看實施形態之加工頭保持 機構時之構造的斜視圖。 、 第3圖係顯示加工頭保持機構之構造的左側面圖。 第4圖係顯示加工頭保持機構之構造的右側面圖。 第5圖係顯示加工頭保持機構之構造的正面圖。 第6圖係顯示磁力控制裝置之構成的圖。 第7圖係顯示移動速度-磁力資訊之一例的圖。 第8圖係顯示移動加速度-磁力資訊之一例的圖。 【主要元件符號說明】 1 加工頭 2 加工頭保持部 3 磁力控制裝置 11 雷射光射出部 12 磁吸著板 13 上下導引部 21 永久電磁鐵 22Α、 22Β電磁鐵 23 上下導引槽 24 左右導引部 16 322014 201102202 31 速度檢測部 32 磁力算出部 33 磁力控制部 101 移動速度-磁力資訊 102 移動加速度-磁力資訊 17 322014Further, in the present embodiment, since the permanent electromagnet 21 and the magnetic attraction plate 12 are magnetically attracted, the magnetic force of the electromagnets 22A and 22B can be set to 〇 when the moving speed is 〇. Further, the current flowing through the electromagnets 22A and 22B may be made variable, and may be set to a constant value after the start of processing. In this case, [s] 13 322014 201102202 The magnetic force control device 3 may not have the speed detecting unit 31 or the magnetic force calculating unit 32. Regardless of the moving speed of the processing head 1, the magnetic control device 3 causes the predetermined predetermined current to flow between the electromagnets 22A, 22B and the magnetic plate 丨2. Further, the magnetic control device 3 can also cause a current for generating a magnetic force in response to an external input from the user to flow to the electromagnets 22A, 22B. In this case, the magnetic force control device 3 does not have to include the speed detecting unit 31 or the magnetic force calculating unit 32. In the present embodiment, the processing head holding unit 2 has one permanent electromagnet 21 and two electromagnets 22A and 22B. However, the permanent electromagnet 21 and the electromagnet 22A of the processing head holding unit 2 are described. The number of 22Bs can also be plural. Since the machining head holding mechanism magnetically attracts the machining head 1 and the machining head holding portion 2 by the electromagnets 22A and 22B, the machining head 1 and the machining head holding portion 2 are separated when the machining head 1 collides with the workpiece. Therefore, the impact on the laser processing device or the workpiece can be reduced. Further, the machining head 1 and the machining head holding portion 2 which are separated by the collision are easily positioned, and can be quickly fixed by the magnetic force of the electromagnets 22A, 22B or the like. Thereby, the rapid recovery of the processing head holding mechanism can be performed by magnetic attraction. When the magnetic forces of the right electromagnets 22A and 22B are constant, when the machining head 1 moves at a high speed, even if the machining head 1 does not collide with the workpiece, the machining head 1 easily falls off from the machining head holding portion 2. Further, when the magnetic forces of the electromagnets 22A and 22B are constant, when the machining head 1 moves at a low speed, even if the machining head 1 collides with the workpiece, the machining head 1 does not easily fall off from the machining head holding portion 2. In the present embodiment, since the magnitude of the magnetic force of the 322014 14 201102202 of the electromagnets 22A and 22B is controlled in accordance with the moving speed of the processing head 1, it is possible to prevent the force σ forehead when the magnitude of the magnetic force is high-speed movement. The non-shedding of the processing head when falling off or moving at a low speed. In other words, at the time of high-speed movement, the processing master 1 can be prevented from falling off without being obstructed by the workpiece, and the machining head 1 can be detached when the disk workpiece collides at a low speed. Further, the processing head holding mechanism can also suck the processing head 1 and the processing head holding portion 2 by the vacuum suction (suction force) using the air pressure or the oil pressure instead of the magnetic force. In this case, the suction force between the processing head i and the processing head holding portion 2 is configured to be variable. In addition, the suction force between the processing head i and the processing head holding portion 2 can be changed according to the moving speed or the moving acceleration of the processing head 1 and the force sensor can be processed in the Guard head 14 _ Control electromagnetic The magnetic force of the irons 22A, 22B is such that the king's head is released from the forehead when the head force is applied to the head holding portion W. The laser processing device (for example, the processing head holding mechanism) can also be in force, and the foreman 1 is lifted. An alarm is output when the county holding unit 2 falls off. This mechanism is equipped with a proximity sensor. Further, the proximity sensing senses that the output is reported when the guard head is detached from the processing head holding portion 2. As described above, according to the actual state, the processing head 1 can be easily held by the appropriate magnetic force, and the processing head 1 can be easily worn and the processing head m holding portion 2 can be easily formed. ^ Processing head retention mechanism. In addition to the pinning portion 2, in addition, since the magnitude of the current of the movement head or the moving force of the eagle head 1 to the electromagnets 22A, 22B is changed, k is again a culture of the knife, so that it can be added 3 322014 15 201102202 The processing head holding portion 2 is magnetically attracted to the processing head holding portion 2 by the force of easy peeling off of the processing head holding portion 2. Further, since the urging head and the machining head holding portion 2 are magnetically magnetized by the permanent magnet 21 or the permanent magnet, the machining head holding portion 2 can be attached with low electric power. (Industrial Applicability) As described above, the processing head holding mechanism of the present invention is suitable for attachment and holding of a processing head and dropping of a processing head. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the structure of a processing head holding mechanism of an embodiment of the front side. Fig. 2 is a perspective view showing the structure when the processing head holding mechanism of the embodiment is viewed from the back side. Fig. 3 is a left side view showing the structure of the processing head holding mechanism. Fig. 4 is a right side view showing the configuration of the processing head holding mechanism. Fig. 5 is a front view showing the configuration of the processing head holding mechanism. Fig. 6 is a view showing the configuration of a magnetic control device. Fig. 7 is a view showing an example of the moving speed-magnetic information. Fig. 8 is a view showing an example of the moving acceleration-magnetic information. [Description of main component symbols] 1 Processing head 2 Processing head holding portion 3 Magnetic control device 11 Laser light emitting portion 12 Magnetic attraction plate 13 Upper and lower guide portions 21 Permanent electromagnets 22Α, 22Β Electromagnets 23 Upper and lower guide grooves 24 Left and right guides Leading unit 16 322014 201102202 31 Speed detecting unit 32 Magnetic force calculating unit 33 Magnetic force control unit 101 Moving speed - Magnetic information 102 Moving acceleration - Magnetic information 17 322014