WO2010125928A1 - Processing head holding mechanism - Google Patents

Processing head holding mechanism Download PDF

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Publication number
WO2010125928A1
WO2010125928A1 PCT/JP2010/056768 JP2010056768W WO2010125928A1 WO 2010125928 A1 WO2010125928 A1 WO 2010125928A1 JP 2010056768 W JP2010056768 W JP 2010056768W WO 2010125928 A1 WO2010125928 A1 WO 2010125928A1
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WO
WIPO (PCT)
Prior art keywords
processing head
machining head
head holding
magnetic force
electromagnet
Prior art date
Application number
PCT/JP2010/056768
Other languages
French (fr)
Japanese (ja)
Inventor
裕司 木野
弘晃 山奥
圭二 高橋
浩嘉 大村
Original Assignee
三菱電機株式会社
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Publication of WO2010125928A1 publication Critical patent/WO2010125928A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/02Carriages for supporting the welding or cutting element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Definitions

  • the present invention relates to a machining head holding mechanism that holds a machining head of a laser machining apparatus.
  • the laser processing apparatus is configured to include a processing head, and performs laser processing of the workpiece by irradiating laser light from the processing head.
  • the processing head is joined to a processing head holding device that moves in the Z-axis direction (laser beam irradiation direction), and moves together with the processing head holding device.
  • the laser processing apparatus includes a damage reduction mechanism.
  • the processing head holding device in the laser processing machine has a collision protection device for releasing the holding device when the processing head collides.
  • the collision protection member is provided with a collision force adjusting device serving as a trigger.
  • the above-described conventional technique has a problem that the collision force cannot be finely adjusted, and the accurate collision force cannot be adjusted.
  • the present invention has been made in view of the above, and an object of the present invention is to obtain a machining head holding mechanism capable of easily mounting a machining head while holding the machining head with an appropriate force.
  • the present invention includes a processing head for irradiating a laser beam, and a processing head holding portion to which the processing head is detachably attached.
  • the processing head holding portion includes an electromagnet that is magnetically attached to the processing head, and the processing head is a magnetically attached portion that is magnetically attached to the electromagnet.
  • the machining head holding part adjusts the magnetic force of the electromagnet by controlling the current applied to the electromagnet, and thereby adjusts the magnetizing force between the electromagnet and the magnetized part. It is characterized by.
  • the magnetic force of the electromagnet is adjusted by the current applied to the electromagnet, and the magnetic adhesion force between the electromagnet and the magnetized portion is adjusted, so that the machining head can be easily held while holding the machining head with an appropriate force. There is an effect that it can be attached to.
  • FIG. 1 is a perspective view showing a structure when the processing head holding mechanism according to the embodiment is viewed from the front.
  • FIG. 2 is a perspective view showing a structure when the processing head holding mechanism according to the embodiment is viewed from the back side.
  • FIG. 3 is a left side view showing the structure of the machining head holding mechanism.
  • FIG. 4 is a right side view showing the structure of the machining head holding mechanism.
  • FIG. 5 is a front view showing the structure of the machining head holding mechanism.
  • FIG. 6 is a diagram illustrating a configuration of the magnetic force control device.
  • FIG. 7 is a diagram illustrating an example of moving speed-magnetic force information.
  • FIG. 8 is a diagram illustrating an example of movement acceleration-magnetic force information.
  • FIG. 1 is a perspective view showing a structure when a machining head holding mechanism according to an embodiment of the present invention is viewed from the front right side
  • FIG. 2 is a machining head holding according to an embodiment of the invention. It is a perspective view which shows the structure at the time of seeing a mechanism from the back left side.
  • FIG. 3 is a left side view showing the structure of the machining head holding mechanism
  • FIG. 4 is a right side view showing the structure of the machining head holding mechanism.
  • FIG. 5 is a front view showing the structure of the machining head holding mechanism, and shows a state in which the machining head is attached to the machining head holding part.
  • the machining head holding mechanism has a machining head 1 and a machining head holding unit 2, and the machining head holding unit 2 is configured so that the machining head 1 can be attached and detached.
  • the processing head holding unit 2 is attached to a laser processing apparatus, and moves in the Z-axis direction (vertical direction) that is the irradiation direction of laser light.
  • the machining head holding unit 2 of the present embodiment is configured to magnetically attach (attach) the machining head 1 with a magnetic force, and to remove the machining head 1 when a force greater than a predetermined value is applied.
  • the processing head 1 has a function of irradiating a workpiece (not shown) with laser light, and is attached to the processing head holding unit 2 by a magnetic force.
  • the processing head holding unit 2 and the processing head 1 are attached so that the front side of the processing head holding unit 2 and the back side of the processing head 1 are magnetically attached.
  • the processing head holding unit 2 includes a flat plate extending in the Z-axis direction. One main surface of the flat plate faces the front of the processing head holding mechanism, and the other main surface faces the back of the processing head holding mechanism. It is attached to the laser processing device so that it faces.
  • the processing head 1 has a substantially rectangular parallelepiped casing extending in the Z-axis direction, and the back side of the casing is attached to the processing head holding unit 2.
  • the permanent electromagnet 21 On the front side of the processing head holding unit 2, the permanent electromagnet 21, the electromagnets 22 ⁇ / b> A and 22 ⁇ / b> B, the left / right guide unit 24 for positioning in the left / right direction when attaching the processing head 1, and the up / down direction when attaching the processing head 1
  • the upper and lower guide grooves 23 for positioning are arranged.
  • a magnetized plate 12 that can be magnetized to the permanent electromagnet 21 and the electromagnets 22A and 22B is disposed on the back side of the machining head 1.
  • the magnetized plate 12 is composed of a ferromagnetic member (such as iron) that is magnetically attached to the permanent electromagnet 21 and the electromagnets 22A and 22B.
  • an upper and lower guide portion 13 that performs positioning in the vertical direction when attached to the processing head holding portion 2 is disposed.
  • the machining head 1 has a laser beam emitting portion 11 that becomes a laser beam emitting port on the bottom surface side.
  • the permanent electromagnet 21 is magnetically attached to the magnetized plate 12 by applying a current to the permanent electromagnet 21 after coming into contact with the magnetized plate 12, and is magnetized to the magnetized plate 12 even if the current is interrupted after magnetizing. It is a magnet that can maintain the state.
  • the electromagnets 22A and 22B are magnetically attached to the magnetized plate 12 when current is passed through the electromagnets 22A and 22B after contacting the magnetized plate 12, and the magnetized plate is only while current is passed through the electromagnets 22A and 22B.
  • 12 is a magnet that is magnetically attached to 12.
  • the left and right guide portion 24 is disposed so as to extend from the left side surface of the processing head holding portion 2 to the front side of the processing head holding portion 2, and is configured by a plate-like member, for example.
  • the left and right guide portions 24 have a main surface (inner main surface) of the plate-like member of the left and right guide portions 24, a left side surface of the processing head 1, and Are joined to the left side surface of the machining head holding portion 2 so as to be in contact with each other.
  • the upper and lower guide portions 13 are extended in the direction from the front surface side to the back surface side of the processing head 1.
  • the upper and lower guide portions 13 have, for example, a cylindrical shape, and are configured such that the column axis of the column faces a direction perpendicular to the back surface of the machining head 1.
  • the upper and lower guide grooves 23 place the upper and lower guide portions 13 and guide the upper and lower guide portions 13 along the groove wall surfaces of the upper and lower guide grooves 23.
  • the vertical guide groove 23 has a valley-like groove formed in a direction from the front side to the back side of the machining head holding part 2, and the vertical guide part 13 is fed along the valley-like groove. come.
  • the back side of the machining head 1 is brought closer to the front side of the machining head holding part 2.
  • the processing head 1 is brought close to the processing head holding unit 2 while the inner main surface of the left and right guide unit 24 is brought into contact with the left side surface of the processing head 1.
  • the machining head 1 is brought close to the machining head holding unit 2 while bringing the vertical guide portion 13 into contact with the vertical guide groove 23.
  • the back surface side of the processing head 1 and the front side of the processing head holding part 2 come into contact with each other when the magnetized plate 12 and the permanent electromagnet 21 are in contact with each other and the magnetized plate 12 and the electromagnets 22A and 22B are in contact with each other.
  • a current is passed through the electromagnets 22A and 22B.
  • the electromagnets 22A and 22B and the magnetized plate 12 are magnetized by the magnetic force of the electromagnets 22A and 22B.
  • a current is passed between the permanent electromagnet 21 and the magnetized plate 12 in a state where the permanent electromagnet 21 and the magnetized plate 12 are in contact with each other. Thereby, the permanent electromagnet 21 and the magnetized plate 12 are magnetized by the magnetic force of the permanent electromagnet 21.
  • the processing head 1 and the processing head holding part 2 are magnetically attached by the magnetic force of the electromagnets 22A and 22B and the magnetic force of the permanent electromagnet 21.
  • the magnetizing force of the electromagnets 22A and 22B and the magnetized plate 12 varies depending on the magnitude of the current flowing through the electromagnets 22A and 22B.
  • the magnetizing force between the electromagnets 22A and 22B and the magnetized plate 12 also changes. Therefore, in the present embodiment, the current flowing through the electromagnets 22A and 22B is adjusted so that the machining head 1 and the machining head holding unit 2 are magnetized with a desired magnetizing force.
  • the machining head 1 is separated from the machining head holding unit 2 when an impact of a predetermined value or more is applied to the machining head holding mechanism. For example, when the machining head 1 collides with the workpiece at a speed larger than a predetermined speed, the machining head 1 is detached from the machining head holding unit 2.
  • FIG. 6 is a diagram illustrating a configuration of the magnetic force control device 3.
  • the magnetic force control device 3 is a device included in the laser processing device, and is connected to the electromagnets 22 ⁇ / b> A and 22 ⁇ / b> B of the processing head holding unit 2.
  • the magnetic force control device 3 is a device that controls the magnitude of the current flowing through the electromagnets 22A and 22B.
  • the magnetic force control device 3 controls the magnitude of the current flowing through the electromagnets 22 ⁇ / b> A and 22 ⁇ / b> B in consideration of the magnetizing force between the permanent electromagnet 21 and the magnetized plate 12.
  • the magnetic force control device 3 includes a speed detector 31, a magnetic force calculator 32, and a magnetic force controller 33.
  • the machining head holding mechanism may be configured such that the magnetic force control device 3 becomes a part of the machining head holding mechanism.
  • the speed detection unit 31 includes a speed sensor that detects the movement speed of the machining head 1 in the Z-axis direction, and sends the detected movement speed to the magnetic force calculation unit 32.
  • the moving speed here is a relative speed (relative moving speed) of the machining head 1 to the workpiece.
  • the magnetic force calculator 32 calculates a magnetic force according to the moving speed detected by the speed detector 31.
  • the magnetic force calculated by the magnetic force calculator 32 is a magnetic force generated in the electromagnets 22A and 22B, and is calculated based on, for example, the moving speed-magnetic force information 101 shown in FIG.
  • the moving speed / magnetic force information 101 is information indicating the correspondence between the moving speed of the machining head 1 and the magnetic force applied to the electromagnets 22A and 22B.
  • the moving speed-magnetic force information 101 may be an expression indicating the correspondence between the moving speed of the machining head 1 and the magnetic force applied to the electromagnets 22A and 22B, or may be an information table indicating the correspondence
  • the electromagnets 22A and 22B are set to be given a predetermined magnetic force.
  • the magnetic force is set to increase as the moving speed increases.
  • the magnetic force control unit 33 controls the electromagnets 22A and 22B so as to generate the magnetic force calculated by the magnetic force calculation unit 32. Specifically, the magnetic force control unit 33 supplies a current for generating the magnetic force calculated by the magnetic force calculation unit 32 to the electromagnets 22A and 22B.
  • the machining head 1 and the machining head holding part 2 can be strongly fixed.
  • the moving speed of the machining head 1 is reduced and the machining head 1 is difficult to disengage from the machining head holding unit 2
  • the machining head 1 and the machining head holding unit 2 can be fixed weakly.
  • the machining head 1 and the machining head holding part 2 are magnetically attached with a magnetic force corresponding to the moving speed, the machining head 1 and the machining head holding part 2 are hard to be separated from each other while being magnetically attached. Even when 1 collides with a workpiece, damage to the laser machining apparatus (such as the machining head 1 or the machining head holding unit 2) or the workpiece can be reduced. In addition, it is possible to adjust the ease with which the machining head 1 is detached, the magnitude of damage to the laser machining apparatus caused by the collision of the machining head 1 with the workpiece, and the like by the magnetic force of the electromagnets 22A and 22B.
  • the case where the magnetic force applied to the electromagnets 22A and 22B is changed according to the moving speed of the machining head 1 has been described.
  • the electromagnet according to the movement acceleration (acceleration in the Z-axis direction) of the machining head 1 You may change the magnetic force given to 22A, 22B.
  • the speed detection unit 31 calculates the acceleration of the machining head 1 using the detected speed.
  • the acceleration of the machining head 1 here is a relative acceleration (relative movement acceleration) of the machining head 1 with respect to the workpiece.
  • the magnetic force calculation unit 32 calculates a magnetic force according to the movement acceleration detected by the speed detection unit 31, and the magnetic force control unit 33 generates a current for generating the magnetic force calculated by the magnetic force calculation unit 32 as electromagnets 22A and 22B. Shed.
  • the magnetic force calculator 32 calculates the magnetic force based on, for example, the moving acceleration-magnetic force information 102 shown in FIG.
  • the moving acceleration / magnetic force information 102 is information indicating the correspondence between the moving acceleration of the machining head 1 and the magnetic force applied to the electromagnets 22A and 22B.
  • the movement acceleration-magnetic force information 102 may be an expression indicating the correspondence between the movement acceleration of the machining head 1 and the magnetic force applied to the electromagnets 22A and 22B, or may be an information table indicating the correspondence.
  • the electromagnets 22A and 22B are set to be given a predetermined magnetic force.
  • the magnetic force is set to increase as the absolute value of the movement acceleration increases.
  • the magnetic force control device 3 may change the magnetic force applied to the electromagnets 22A and 22B according to processing conditions such as the material (hardness) of the workpiece.
  • a permanent magnet may be arranged in the machining head holding part 2 instead of the permanent electromagnet 21.
  • the magnetic force control device 3 controls the magnitude of the current flowing through the electromagnets 22 ⁇ / b> A and 22 ⁇ / b> B in consideration of the magnetizing force between the permanent magnet and the magnetized plate 12.
  • permanent magnets may be arranged in the machining head holding portion 2 together with the electromagnets 22 ⁇ / b> A and 22 ⁇ / b> B and the permanent electromagnet 21.
  • the magnetic force control device 3 controls the magnitude of the current passed through the electromagnets 22 ⁇ / b> A and 22 ⁇ / b> B in consideration of the magnetizing force between the permanent electromagnet 21 and the magnetized plate 12 and the magnetizing force between the permanent magnet and the magnetized plate 12. . Further, the processing head holding unit 2 and the processing head 1 may be bonded with resin bolts while being magnetized by the electromagnets 22A and 22B and the magnetized plate 12.
  • the magnetic force of the electromagnets 22A and 22B is changed based on the moving speed of the machining head 1 in the Z-axis direction.
  • the magnetic force control device 3 operates in the XY plane of the machining head 1.
  • the magnetic force of the electromagnets 22A and 22B may be changed based on the moving speed at.
  • the moving speed in the XY plane is a relative speed of the machining head 1 with respect to the workpiece. Therefore, when the machining head 1 does not move in the XY plane and the XY table on which the workpiece is placed moves in the XY plane, the movement speed of the XY table is the movement speed of the machining head 1 in the XY plane. It becomes.
  • the magnetic force control device 3 may change the magnetic force of the electromagnets 22A and 22B based on both the moving speed of the machining head 1 in the Z-axis direction and the moving speed in the XY plane. Further, the magnetic force control device 3 weights the speed in the Z-axis direction and the speed in the XY plane, and then determines the magnetic force of the electromagnets 22A and 22B based on the speed in the Z-axis direction and the speed in the XY plane. It may be changed.
  • the magnetic force control device 3 may change the magnetic force of the electromagnets 22A and 22B based on the movement acceleration of the machining head 1 in the XY plane. Also in this case, the movement acceleration in the XY plane is a relative acceleration of the machining head 1 with respect to the workpiece. Further, the magnetic force control device 3 may change the magnetic force of the electromagnets 22A and 22B based on both the movement acceleration in the Z-axis direction of the machining head 1 and the movement acceleration in the XY plane.
  • the magnetic force control device 3 weights the acceleration in the Z-axis direction and the acceleration in the XY plane, and then determines the magnetic force of the electromagnets 22A and 22B based on the acceleration in the Z-axis direction and the acceleration in the XY plane. It may be changed.
  • the magnetic force of the electromagnets 22A and 22B is changed based on the moving speed and the moving acceleration of the processing head 1 has been described.
  • the magnetic force control device 3 operates in the Z-axis direction of the processing head 1.
  • the magnetic force of the electromagnets 22A and 22B may be changed based on both the moving speed and the moving acceleration.
  • the magnetic force of the electromagnets 22A and 22B may be set to 0 when the moving speed is 0. Further, the current flowing through the electromagnets 22A and 22B may be variable, and may be a constant value after the start of processing. In this case, the magnetic force control device 3 may not include the speed detection unit 31 and the magnetic force calculation unit 32. Regardless of the moving speed of the machining head 1, the magnetic force control device 3 allows a predetermined current value set in advance to flow between the electromagnets 22 ⁇ / b> A and 22 ⁇ / b> B and the magnetized plate 12.
  • the magnetic force control device 3 may cause the electromagnets 22 ⁇ / b> A and 22 ⁇ / b> B to pass a current value for generating a magnetic force according to an instruction from a user input from the outside. Also in this case, the magnetic force control device 3 may not include the speed detection unit 31 and the magnetic force calculation unit 32.
  • the machining head holding unit 2 has one permanent electromagnet 21 and two electromagnets 22A and 22B has been described.
  • the permanent electromagnet 21 and the electromagnet 22A that the machining head holding unit 2 has. , 22B may be any number.
  • the machining head holding mechanism magnetizes the machining head 1 and the machining head holding part 2 using the electromagnets 22A and 22B, when the machining head 1 collides with the workpiece, the machining head 1 and The separation of the processing head holding unit 2 can reduce the impact on the laser processing apparatus and the workpiece. Further, the machining head 1 and the machining head holding portion 2 separated by the collision can be easily positioned and can be quickly fixed by the magnetic force of the electromagnets 22A and 22B. As a result, it is possible to quickly restore the processing head holding mechanism by magnetic magnetic adhesion.
  • the machining head 1 can easily fall off the machining head holding portion 2 even if the machining head 1 does not collide with the workpiece when the machining head 1 is moving at high speed. Become. Further, if the magnetic forces of the electromagnets 22A and 22B are constant, the machining head 1 is unlikely to fall off the machining head holding portion 2 even when the machining head 1 collides with the workpiece when the machining head 1 moves at a low speed. Become.
  • the magnitude of the magnetic force of the electromagnets 22A and 22B is controlled in accordance with the moving speed of the machining head 1, so that the machining head 1 is dropped during high-speed movement that occurs when the magnitude of the magnetic force is constant. It is possible to prevent the machining head 1 from falling off during low-speed movement. In other words, the machining head 1 can be prevented from dropping without colliding with the workpiece during high-speed movement, and the machining head 1 can be dropped when colliding with the workpiece during low-speed movement.
  • the processing head holding mechanism may attract the processing head 1 and the processing head holding unit 2 by vacuum suction (adsorption force) using air pressure or hydraulic pressure instead of magnetic force.
  • vacuum suction adssorption force
  • the suction force between the processing head 1 and the processing head holding unit 2 is configured to be variable.
  • the suction force between the processing head 1 and the processing head holding unit 2 may be changed according to the moving speed or moving acceleration of the processing head 1.
  • a force sensor is attached to the machining head 1 or the machining head holding unit 2 so that the electromagnet 22A, the machining head 1 does not fall off until a predetermined force is applied between the machining head 1 and the machining head holding unit 2.
  • the magnetic force of 22B may be controlled.
  • the laser processing apparatus may output an alarm when the processing head 1 is detached from the processing head holding unit 2.
  • a proximity sensor is arranged in the processing head holding mechanism. When the proximity sensor detects the removal of the processing head 1 from the processing head holding unit 2, an alarm is output.
  • the machining head holding mechanism can be configured using the machining head 1 and the machining head holding unit 2 having a simple configuration.
  • the machining head 1 and the machining head holding portion 2 can be magnetically attached. Further, since the machining head 1 and the machining head holding unit 2 are magnetically attached using the permanent electromagnet 21 or the permanent magnet, the machining head 1 can be mounted on the machining head holding unit 2 with low power.
  • the machining head holding mechanism according to the present invention is suitable for mounting and holding the machining head and dropping the machining head.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)

Abstract

A processing head holding mechanism provided with a processing head (1) which emits a laser beam and also with a processing head holding section (2) to which the processing head (1) is removably attached, the processing head holding mechanism being configured in such a manner that the processing head (1) attached to the processing head holding section (2) moves on a workpiece relative thereto. The processing head holding section (2) is provided with electromagnets (22A, 22B) which magnetically adhere to the processing head (1), and the processing head (1) is provided with a magnetically adhering plate (12) which magnetically adheres to the electromagnets (22A, 22B). The processing head holding section (2) is configured in such a manner that the magnetic force of the electromagnets (22A, 22B) is adjusted by controlling an electric current applied to the electromagnets (22A, 22B), and by this, the magnetic adhesion force between the electromagnets (22A, 22B) and the magnetically adhering plate (12) is adjusted.

Description

加工ヘッド保持機構Processing head holding mechanism
 本発明は、レーザ加工装置の加工ヘッドを保持する加工ヘッド保持機構に関する。 The present invention relates to a machining head holding mechanism that holds a machining head of a laser machining apparatus.
 レーザ加工装置は、加工ヘッドを備えて構成されており、加工ヘッドからレーザ光を照射することによってワークのレーザ加工を行う。加工ヘッドは、Z軸方向(レーザ光照射方向)に移動する加工ヘッド保持装置に接合されており、加工ヘッド保持装置とともに移動する。このようなレーザ加工装置では、加工ヘッドがワークなどに衝突した場合に、加工ヘッドや加工ヘッド保持装置などにダメージが発生する。このため、レーザ加工装置は、ダメージ軽減機構を備えて構成されている。例えば、加工ヘッドと加工ヘッド保持装置とを樹脂ボルトによって締結させたダメージ軽減機構がある。このダメージ軽減機構は、加工ヘッドがワークなどに衝突した場合に、樹脂ボルトを破損させることによって加工ヘッドや加工ヘッド保持装置などへの衝撃を軽減させている。このようなダメージ軽減機構は、加工ヘッドの復旧に長時間を有するので、加工ヘッドと加工ヘッド保持装置との締結部分を破損させずに加工ヘッドや加工ヘッド保持装置などのダメージを軽減させることが望まれる。 The laser processing apparatus is configured to include a processing head, and performs laser processing of the workpiece by irradiating laser light from the processing head. The processing head is joined to a processing head holding device that moves in the Z-axis direction (laser beam irradiation direction), and moves together with the processing head holding device. In such a laser processing apparatus, when the processing head collides with a workpiece or the like, the processing head, the processing head holding device, or the like is damaged. For this reason, the laser processing apparatus includes a damage reduction mechanism. For example, there is a damage reduction mechanism in which a machining head and a machining head holding device are fastened by a resin bolt. This damage mitigation mechanism reduces the impact on the machining head, machining head holding device, etc. by damaging the resin bolt when the machining head collides with a workpiece or the like. Since such a damage reduction mechanism has a long time to recover the machining head, damage to the machining head and the machining head holding device can be reduced without damaging the fastening portion between the machining head and the machining head holding device. desired.
 例えば、特許文献1に記載のレーザ加工装置は、レーザ加工機における加工ヘッドの保持装置が、加工ヘッドの衝突時に保持装置を解除するための衝突保護装置を有している。そして、衝突保護部材に、トリガとなる衝突力の調節装置が設けられている。 For example, in the laser processing apparatus described in Patent Document 1, the processing head holding device in the laser processing machine has a collision protection device for releasing the holding device when the processing head collides. The collision protection member is provided with a collision force adjusting device serving as a trigger.
特開2006-123163号公報JP 2006-123163 A
 しかしながら、上記従来の技術では、衝突力の調整を細かく行うことができず正確な衝突力調整を行えないという問題があった。また、加工ヘッドが衝突した後の衝突保護装置の復旧に手間がかかるという問題があった。 However, the above-described conventional technique has a problem that the collision force cannot be finely adjusted, and the accurate collision force cannot be adjusted. In addition, there is a problem that it takes time to restore the collision protection device after the machining head collides.
 本発明は、上記に鑑みてなされたものであって、適切な力で加工ヘッドを保持しつつ加工ヘッドを容易に装着することができる加工ヘッド保持機構を得ることを目的とする。 The present invention has been made in view of the above, and an object of the present invention is to obtain a machining head holding mechanism capable of easily mounting a machining head while holding the machining head with an appropriate force.
 上述した課題を解決し、目的を達成するために、本発明は、レーザ光を照射する加工ヘッドと、前記加工ヘッドを着脱可能に取り付ける加工ヘッド保持部とを有し、前記加工ヘッド保持部に取り付けられた加工ヘッドがワーク上を相対移動する加工ヘッド保持機構において、前記加工ヘッド保持部は、前記加工ヘッドに磁着する電磁石を備え、前記加工ヘッドは、前記電磁石に磁着する磁着部を備え、前記加工ヘッド保持部は、前記電磁石に印加する電流が制御されることによって前記電磁石の磁力が調整され、これにより前記電磁石と前記磁着部との間の磁着力が調整されることを特徴とする。 In order to solve the above-described problems and achieve the object, the present invention includes a processing head for irradiating a laser beam, and a processing head holding portion to which the processing head is detachably attached. In the processing head holding mechanism in which the mounted processing head moves relative to the workpiece, the processing head holding portion includes an electromagnet that is magnetically attached to the processing head, and the processing head is a magnetically attached portion that is magnetically attached to the electromagnet. And the machining head holding part adjusts the magnetic force of the electromagnet by controlling the current applied to the electromagnet, and thereby adjusts the magnetizing force between the electromagnet and the magnetized part. It is characterized by.
 本発明によれば、電磁石に印加する電流によって電磁石の磁力が調整されて電磁石と磁着部との間の磁着力が調整されるので、適切な力で加工ヘッドを保持しつつ加工ヘッドを容易に装着することができるという効果を奏する。 According to the present invention, the magnetic force of the electromagnet is adjusted by the current applied to the electromagnet, and the magnetic adhesion force between the electromagnet and the magnetized portion is adjusted, so that the machining head can be easily held while holding the machining head with an appropriate force. There is an effect that it can be attached to.
図1は、実施の形態に係る加工ヘッド保持機構を正面方向から見た場合の構造を示す斜視図である。FIG. 1 is a perspective view showing a structure when the processing head holding mechanism according to the embodiment is viewed from the front. 図2は、実施の形態に係る加工ヘッド保持機構を背面方向から見た場合の構造を示す斜視図である。FIG. 2 is a perspective view showing a structure when the processing head holding mechanism according to the embodiment is viewed from the back side. 図3は、加工ヘッド保持機構の構造を示す左側面図である。FIG. 3 is a left side view showing the structure of the machining head holding mechanism. 図4は、加工ヘッド保持機構の構造を示す右側面図である。FIG. 4 is a right side view showing the structure of the machining head holding mechanism. 図5は、加工ヘッド保持機構の構造を示す正面図である。FIG. 5 is a front view showing the structure of the machining head holding mechanism. 図6は、磁力制御装置の構成を示す図である。FIG. 6 is a diagram illustrating a configuration of the magnetic force control device. 図7は、移動速度-磁力情報の一例を示す図である。FIG. 7 is a diagram illustrating an example of moving speed-magnetic force information. 図8は、移動加速度-磁力情報の一例を示す図である。FIG. 8 is a diagram illustrating an example of movement acceleration-magnetic force information.
 以下に、本発明の実施の形態に係る加工ヘッド保持機構を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。 Hereinafter, a machining head holding mechanism according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.
実施の形態
 図1は、本発明の実施の形態に係る加工ヘッド保持機構を正面右側から見た場合の構造を示す斜視図であり、図2は、本発明の実施の形態に係る加工ヘッド保持機構を背面左側から見た場合の構造を示す斜視図である。図3は、加工ヘッド保持機構の構造を示す左側面図であり、図4は、加工ヘッド保持機構の構造を示す右側面図である。図5は、加工ヘッド保持機構の構造を示す正面図であり、加工ヘッドが加工ヘッド保持部に取り付けられた状態を示している。
Embodiment FIG. 1 is a perspective view showing a structure when a machining head holding mechanism according to an embodiment of the present invention is viewed from the front right side, and FIG. 2 is a machining head holding according to an embodiment of the invention. It is a perspective view which shows the structure at the time of seeing a mechanism from the back left side. FIG. 3 is a left side view showing the structure of the machining head holding mechanism, and FIG. 4 is a right side view showing the structure of the machining head holding mechanism. FIG. 5 is a front view showing the structure of the machining head holding mechanism, and shows a state in which the machining head is attached to the machining head holding part.
 加工ヘッド保持機構は、加工ヘッド1と加工ヘッド保持部2を有しており、加工ヘッド保持部2は加工ヘッド1を着脱可能なよう構成されている。加工ヘッド保持部2は、レーザ加工装置に取り付けられており、レーザ光の照射方向であるZ軸方向(鉛直方向)に移動する。本実施の形態の加工ヘッド保持部2は、磁力によって加工ヘッド1を磁着(装着)するとともに、所定値以上の力が加わった場合に加工ヘッド1が外れるよう構成されている。加工ヘッド1は、レーザ光をワーク(図示せず)に照射する機能を有しており、磁力によって加工ヘッド保持部2に取り付けられる。 The machining head holding mechanism has a machining head 1 and a machining head holding unit 2, and the machining head holding unit 2 is configured so that the machining head 1 can be attached and detached. The processing head holding unit 2 is attached to a laser processing apparatus, and moves in the Z-axis direction (vertical direction) that is the irradiation direction of laser light. The machining head holding unit 2 of the present embodiment is configured to magnetically attach (attach) the machining head 1 with a magnetic force, and to remove the machining head 1 when a force greater than a predetermined value is applied. The processing head 1 has a function of irradiating a workpiece (not shown) with laser light, and is attached to the processing head holding unit 2 by a magnetic force.
 加工ヘッド保持部2と加工ヘッド1とは、加工ヘッド保持部2の正面側と加工ヘッド1の裏面側とが磁着するよう取り付けられる。加工ヘッド保持部2は、Z軸方向に延びる平板を含んで構成されており、この平板の一方の主面が加工ヘッド保持機構の正面を向き、他方の主面が加工ヘッド保持機構の裏面を向くようレーザ加工装置に取り付けられている。加工ヘッド1は、Z軸方向に延びる概略直方体の筐体を有しており、この筐体の裏面側が加工ヘッド保持部2に取り付けられる。 The processing head holding unit 2 and the processing head 1 are attached so that the front side of the processing head holding unit 2 and the back side of the processing head 1 are magnetically attached. The processing head holding unit 2 includes a flat plate extending in the Z-axis direction. One main surface of the flat plate faces the front of the processing head holding mechanism, and the other main surface faces the back of the processing head holding mechanism. It is attached to the laser processing device so that it faces. The processing head 1 has a substantially rectangular parallelepiped casing extending in the Z-axis direction, and the back side of the casing is attached to the processing head holding unit 2.
 加工ヘッド保持部2の正面側には、永電磁石21と、電磁石22A,22Bと、加工ヘッド1を取り付ける際の左右方向の位置決めを行う左右ガイド部24と、加工ヘッド1を取り付ける際の上下方向の位置決めを行う上下ガイド溝23と、が配置されている。 On the front side of the processing head holding unit 2, the permanent electromagnet 21, the electromagnets 22 </ b> A and 22 </ b> B, the left / right guide unit 24 for positioning in the left / right direction when attaching the processing head 1, and the up / down direction when attaching the processing head 1 The upper and lower guide grooves 23 for positioning are arranged.
 加工ヘッド1の裏面側には、永電磁石21、電磁石22A,22Bに磁着可能な磁着板12が配置されている。この磁着板12は、永電磁石21や電磁石22A,22Bに磁着する強磁性体部材(鉄など)によって構成されている。また、加工ヘッド1の裏面側には、加工ヘッド保持部2に取り付けられる際の上下方向の位置決めを行う上下ガイド部13が配置されている。また、加工ヘッド1は、底面側に、レーザ光の出射口となるレーザ光出射部11を有している。 A magnetized plate 12 that can be magnetized to the permanent electromagnet 21 and the electromagnets 22A and 22B is disposed on the back side of the machining head 1. The magnetized plate 12 is composed of a ferromagnetic member (such as iron) that is magnetically attached to the permanent electromagnet 21 and the electromagnets 22A and 22B. Further, on the back side of the processing head 1, an upper and lower guide portion 13 that performs positioning in the vertical direction when attached to the processing head holding portion 2 is disposed. Further, the machining head 1 has a laser beam emitting portion 11 that becomes a laser beam emitting port on the bottom surface side.
 永電磁石21は、磁着板12と接触した後に永電磁石21に電流が印加されることによって磁着板12と磁着し、磁着後に電流を遮断しても磁着板12との磁着状態を維持できる磁石である。 The permanent electromagnet 21 is magnetically attached to the magnetized plate 12 by applying a current to the permanent electromagnet 21 after coming into contact with the magnetized plate 12, and is magnetized to the magnetized plate 12 even if the current is interrupted after magnetizing. It is a magnet that can maintain the state.
 電磁石22A,22Bは、磁着板12と接触した後に電磁石22A,22Bに電流が流されることによって磁着板12と磁着し、電磁石22A,22Bに電流が流されている間のみ磁着板12と磁着する磁石である。 The electromagnets 22A and 22B are magnetically attached to the magnetized plate 12 when current is passed through the electromagnets 22A and 22B after contacting the magnetized plate 12, and the magnetized plate is only while current is passed through the electromagnets 22A and 22B. 12 is a magnet that is magnetically attached to 12.
 左右ガイド部24は、加工ヘッド保持部2の左側面から加工ヘッド保持部2の正面側に延びるよう配設されており、例えば板状部材によって構成されている。左右ガイド部24は、加工ヘッド1と加工ヘッド保持部2とが磁着する際に、左右ガイド部24の板状部材の主面(内側の主面)と、加工ヘッド1の左側面と、が接触するよう、加工ヘッド保持部2の左側面に接合されている。 The left and right guide portion 24 is disposed so as to extend from the left side surface of the processing head holding portion 2 to the front side of the processing head holding portion 2, and is configured by a plate-like member, for example. When the processing head 1 and the processing head holding unit 2 are magnetically attached, the left and right guide portions 24 have a main surface (inner main surface) of the plate-like member of the left and right guide portions 24, a left side surface of the processing head 1, and Are joined to the left side surface of the machining head holding portion 2 so as to be in contact with each other.
 上下ガイド部13は、加工ヘッド1の表面側から裏面側に向かう方向に延設されている。上下ガイド部13は、例えば円柱状をなしており、この円柱の柱軸が加工ヘッド1の裏面に垂直な方向を向くよう構成されている。 The upper and lower guide portions 13 are extended in the direction from the front surface side to the back surface side of the processing head 1. The upper and lower guide portions 13 have, for example, a cylindrical shape, and are configured such that the column axis of the column faces a direction perpendicular to the back surface of the machining head 1.
 上下ガイド溝23は、上下ガイド部13を載せるとともに上下ガイド溝23の溝壁面に沿って上下ガイド部13を導く。上下ガイド溝23は、加工ヘッド保持部2の正面側から裏面側に向かう方向に形成された谷状の溝を有しており、この谷状の溝に沿って上下ガイド部13が送り込まれてくる。 The upper and lower guide grooves 23 place the upper and lower guide portions 13 and guide the upper and lower guide portions 13 along the groove wall surfaces of the upper and lower guide grooves 23. The vertical guide groove 23 has a valley-like groove formed in a direction from the front side to the back side of the machining head holding part 2, and the vertical guide part 13 is fed along the valley-like groove. come.
 加工ヘッド1を加工ヘッド保持部2に取り付ける際には、加工ヘッド1の裏面側を加工ヘッド保持部2の正面側に近づける。そして、左右ガイド部24の内側の主面を加工ヘッド1の左側の側面に接触させながら、加工ヘッド1を加工ヘッド保持部2に近づける。このとき、上下ガイド部13を上下ガイド溝23に接触させながら加工ヘッド1を加工ヘッド保持部2に近づける。加工ヘッド1の裏面側と加工ヘッド保持部2の正面側とは、磁着板12と永電磁石21が接触するとともに、磁着板12と電磁石22A,22Bとが接触することによって接触する。 When attaching the machining head 1 to the machining head holding part 2, the back side of the machining head 1 is brought closer to the front side of the machining head holding part 2. Then, the processing head 1 is brought close to the processing head holding unit 2 while the inner main surface of the left and right guide unit 24 is brought into contact with the left side surface of the processing head 1. At this time, the machining head 1 is brought close to the machining head holding unit 2 while bringing the vertical guide portion 13 into contact with the vertical guide groove 23. The back surface side of the processing head 1 and the front side of the processing head holding part 2 come into contact with each other when the magnetized plate 12 and the permanent electromagnet 21 are in contact with each other and the magnetized plate 12 and the electromagnets 22A and 22B are in contact with each other.
 磁着板12と電磁石22A,22Bとを接触させた状態で、電磁石22A,22Bに電流が流される。これにより、電磁石22A,22Bと磁着板12とが電磁石22A,22Bの磁力によって磁着する。また、永電磁石21と磁着板12とを接触させた状態で、永電磁石21と磁着板12との間に電流が流される。これにより、永電磁石21と磁着板12とが永電磁石21の磁力によって磁着する。永電磁石21と磁着板12とが永電磁石21の磁力によって磁着した後、永電磁石21への電流が遮断される。これにより、加工ヘッド1と加工ヘッド保持部2とが、電磁石22A,22Bの磁力および永電磁石21の磁力によって磁着する。 In the state where the magnetized plate 12 and the electromagnets 22A and 22B are in contact with each other, a current is passed through the electromagnets 22A and 22B. Thereby, the electromagnets 22A and 22B and the magnetized plate 12 are magnetized by the magnetic force of the electromagnets 22A and 22B. In addition, a current is passed between the permanent electromagnet 21 and the magnetized plate 12 in a state where the permanent electromagnet 21 and the magnetized plate 12 are in contact with each other. Thereby, the permanent electromagnet 21 and the magnetized plate 12 are magnetized by the magnetic force of the permanent electromagnet 21. After the permanent electromagnet 21 and the magnetized plate 12 are magnetized by the magnetic force of the permanent electromagnet 21, the current to the permanent electromagnet 21 is interrupted. Thereby, the processing head 1 and the processing head holding part 2 are magnetically attached by the magnetic force of the electromagnets 22A and 22B and the magnetic force of the permanent electromagnet 21.
 電磁石22A,22Bと磁着板12とは、電磁石22A,22Bに流す電流の大きさに応じて磁着力が変化する。換言すると、電磁石22A,22Bに流す電流の大きさに応じて電磁石22A,22Bから発生する磁力が変化するので、電磁石22A,22Bと磁着板12との間の磁着力も変化する。したがって、本実施の形態では、所望の磁着力で加工ヘッド1と加工ヘッド保持部2とが磁着するよう、電磁石22A,22Bに流す電流を調整する。これにより、所定値以上の衝撃が加工ヘッド保持機構に加わった場合に加工ヘッド1が加工ヘッド保持部2から分離する。例えば、加工ヘッド1が所定の速度よりも大きな速度でワークに衝突した場合に、加工ヘッド1が加工ヘッド保持部2からはずれる。 The magnetizing force of the electromagnets 22A and 22B and the magnetized plate 12 varies depending on the magnitude of the current flowing through the electromagnets 22A and 22B. In other words, since the magnetic force generated from the electromagnets 22A and 22B changes according to the magnitude of the current flowing through the electromagnets 22A and 22B, the magnetizing force between the electromagnets 22A and 22B and the magnetized plate 12 also changes. Therefore, in the present embodiment, the current flowing through the electromagnets 22A and 22B is adjusted so that the machining head 1 and the machining head holding unit 2 are magnetized with a desired magnetizing force. As a result, the machining head 1 is separated from the machining head holding unit 2 when an impact of a predetermined value or more is applied to the machining head holding mechanism. For example, when the machining head 1 collides with the workpiece at a speed larger than a predetermined speed, the machining head 1 is detached from the machining head holding unit 2.
 電磁石22A,22Bに流す電流の大きさは、磁力制御装置(制御部)3によって制御される。また、電磁石22A,22Bに流す電流の大きさは、加工ヘッド1の移動速度(Z軸方向の速度)に応じて変化させてもよい。ここで磁力制御装置の構成について説明する。図6は、磁力制御装置3の構成を示す図である。磁力制御装置3は、レーザ加工装置が備える装置であり、加工ヘッド保持部2の電磁石22A,22Bに接続されている。 The magnitude of the current flowing through the electromagnets 22A and 22B is controlled by the magnetic force control device (control unit) 3. Further, the magnitude of the current passed through the electromagnets 22A and 22B may be changed according to the moving speed of the machining head 1 (speed in the Z-axis direction). Here, the configuration of the magnetic force control device will be described. FIG. 6 is a diagram illustrating a configuration of the magnetic force control device 3. The magnetic force control device 3 is a device included in the laser processing device, and is connected to the electromagnets 22 </ b> A and 22 </ b> B of the processing head holding unit 2.
 磁力制御装置3は、電磁石22A,22Bに流す電流の大きさを制御する装置である。磁力制御装置3は、永電磁石21と磁着板12との間の磁着力を考慮して電磁石22A,22Bに流す電流の大きさを制御する。磁力制御装置3は、速度検出部31、磁力算出部32、磁力制御部33を有している。なお、磁力制御装置3が加工ヘッド保持機構の一部となるよう加工ヘッド保持機構を構成してもよい。 The magnetic force control device 3 is a device that controls the magnitude of the current flowing through the electromagnets 22A and 22B. The magnetic force control device 3 controls the magnitude of the current flowing through the electromagnets 22 </ b> A and 22 </ b> B in consideration of the magnetizing force between the permanent electromagnet 21 and the magnetized plate 12. The magnetic force control device 3 includes a speed detector 31, a magnetic force calculator 32, and a magnetic force controller 33. Note that the machining head holding mechanism may be configured such that the magnetic force control device 3 becomes a part of the machining head holding mechanism.
 速度検出部31は、加工ヘッド1のZ軸方向の移動速度を検出する速度センサなどを備えて構成されており、検出した移動速度を磁力算出部32に送る。ここでの移動速度は、加工ヘッド1のワークに対する相対速度(相対移動速度)である。磁力算出部32は、速度検出部31が検出した移動速度に応じた磁力を算出する。磁力算出部32が算出する磁力は電磁石22A,22Bに発生させる磁力であり、例えば図7に示す移動速度-磁力情報101に基づいて算出される。移動速度-磁力情報101は、加工ヘッド1の移動速度と電磁石22A,22Bに与える磁力との対応関係を示す情報である。移動速度-磁力情報101は、加工ヘッド1の移動速度と電磁石22A,22Bに与える磁力との対応関係を示す式であってもよいし、対応関係を示す情報テーブルであってもよい。 The speed detection unit 31 includes a speed sensor that detects the movement speed of the machining head 1 in the Z-axis direction, and sends the detected movement speed to the magnetic force calculation unit 32. The moving speed here is a relative speed (relative moving speed) of the machining head 1 to the workpiece. The magnetic force calculator 32 calculates a magnetic force according to the moving speed detected by the speed detector 31. The magnetic force calculated by the magnetic force calculator 32 is a magnetic force generated in the electromagnets 22A and 22B, and is calculated based on, for example, the moving speed-magnetic force information 101 shown in FIG. The moving speed / magnetic force information 101 is information indicating the correspondence between the moving speed of the machining head 1 and the magnetic force applied to the electromagnets 22A and 22B. The moving speed-magnetic force information 101 may be an expression indicating the correspondence between the moving speed of the machining head 1 and the magnetic force applied to the electromagnets 22A and 22B, or may be an information table indicating the correspondence.
 図7に示すように、移動速度が0の場合であっても、電磁石22A,22Bには所定の磁力が与えられるよう設定されている。そして、移動速度が大きくなるにしたがって、磁力が大きくなるよう設定されている。 As shown in FIG. 7, even when the moving speed is 0, the electromagnets 22A and 22B are set to be given a predetermined magnetic force. The magnetic force is set to increase as the moving speed increases.
 磁力制御部33は、磁力算出部32が算出した磁力を発生させるよう電磁石22A,22Bを制御する。具体的には、磁力制御部33は、磁力算出部32が算出した磁力を発生させための電流を電磁石22A,22Bに流す。 The magnetic force control unit 33 controls the electromagnets 22A and 22B so as to generate the magnetic force calculated by the magnetic force calculation unit 32. Specifically, the magnetic force control unit 33 supplies a current for generating the magnetic force calculated by the magnetic force calculation unit 32 to the electromagnets 22A and 22B.
 これにより、加工ヘッド1の移動速度が大きくなって加工ヘッド1が加工ヘッド保持部2からはずれやすい場合には、加工ヘッド1と加工ヘッド保持部2とを強く固定することができる。また、加工ヘッド1の移動速度が小さくなって加工ヘッド1が加工ヘッド保持部2からはずれにくい場合には、加工ヘッド1と加工ヘッド保持部2とを弱く固定することができる。このような制御を行うことにより、加工ヘッド1と加工ヘッド保持部2とのはずれ易さに応じた力で加工ヘッド1と加工ヘッド保持部2とを磁着することが可能となる。このように、加工ヘッド1と加工ヘッド保持部2とを移動速度に応じた磁力で磁着しているので、加工ヘッド1と加工ヘッド保持部2とをはずれににくく磁着しつつ、加工ヘッド1がワークに衝突した場合であってもレーザ加工装置(加工ヘッド1や加工ヘッド保持部2など)やワークに与えるダメージを低減できる。また、加工ヘッド1のはずれ易さや、加工ヘッド1のワークへの衝突によって生じるレーザ加工装置の損傷の大きさなどを電磁石22A,22Bの磁力によって調整することが可能となる。 Thereby, when the moving speed of the machining head 1 is increased and the machining head 1 is easily detached from the machining head holding part 2, the machining head 1 and the machining head holding part 2 can be strongly fixed. In addition, when the moving speed of the machining head 1 is reduced and the machining head 1 is difficult to disengage from the machining head holding unit 2, the machining head 1 and the machining head holding unit 2 can be fixed weakly. By performing such control, it is possible to magnetize the machining head 1 and the machining head holding unit 2 with a force corresponding to the ease of disengagement between the machining head 1 and the machining head holding unit 2. Thus, since the machining head 1 and the machining head holding part 2 are magnetically attached with a magnetic force corresponding to the moving speed, the machining head 1 and the machining head holding part 2 are hard to be separated from each other while being magnetically attached. Even when 1 collides with a workpiece, damage to the laser machining apparatus (such as the machining head 1 or the machining head holding unit 2) or the workpiece can be reduced. In addition, it is possible to adjust the ease with which the machining head 1 is detached, the magnitude of damage to the laser machining apparatus caused by the collision of the machining head 1 with the workpiece, and the like by the magnetic force of the electromagnets 22A and 22B.
 なお、本実施の形態では、加工ヘッド1の移動速度に応じて電磁石22A,22Bに与える磁力を変化させる場合について説明したが、加工ヘッド1の移動加速度(Z軸方向の加速度)に応じて電磁石22A,22Bに与える磁力を変化させてもよい。この場合、速度検出部31は、検出した速度を用いて加工ヘッド1の加速度を算出する。ここでの加工ヘッド1の加速度は、加工ヘッド1のワークに対する相対加速度(相対移動加速度)である。そして、磁力算出部32は、速度検出部31が検出した移動加速度に応じた磁力を算出し、磁力制御部33は、磁力算出部32が算出した磁力を発生させための電流を電磁石22A,22Bに流す。 In the present embodiment, the case where the magnetic force applied to the electromagnets 22A and 22B is changed according to the moving speed of the machining head 1 has been described. However, the electromagnet according to the movement acceleration (acceleration in the Z-axis direction) of the machining head 1 You may change the magnetic force given to 22A, 22B. In this case, the speed detection unit 31 calculates the acceleration of the machining head 1 using the detected speed. The acceleration of the machining head 1 here is a relative acceleration (relative movement acceleration) of the machining head 1 with respect to the workpiece. The magnetic force calculation unit 32 calculates a magnetic force according to the movement acceleration detected by the speed detection unit 31, and the magnetic force control unit 33 generates a current for generating the magnetic force calculated by the magnetic force calculation unit 32 as electromagnets 22A and 22B. Shed.
 磁力算出部32は、例えば図8に示す移動加速度-磁力情報102に基づいて磁力を算出する。移動加速度-磁力情報102は、加工ヘッド1の移動加速度と電磁石22A,22Bに与える磁力との対応関係を示す情報である。移動加速度-磁力情報102は、加工ヘッド1の移動加速度と電磁石22A,22Bに与える磁力との対応関係を示す式であってもよいし、対応関係を示す情報テーブルであってもよい。 The magnetic force calculator 32 calculates the magnetic force based on, for example, the moving acceleration-magnetic force information 102 shown in FIG. The moving acceleration / magnetic force information 102 is information indicating the correspondence between the moving acceleration of the machining head 1 and the magnetic force applied to the electromagnets 22A and 22B. The movement acceleration-magnetic force information 102 may be an expression indicating the correspondence between the movement acceleration of the machining head 1 and the magnetic force applied to the electromagnets 22A and 22B, or may be an information table indicating the correspondence.
 図8に示すように、移動加速度が0の場合であっても、電磁石22A,22Bには所定の磁力が与えられるよう設定されている。そして、移動加速度の絶対値が大きくなるにしたがって、磁力が大きくなるよう設定されている。 As shown in FIG. 8, even when the movement acceleration is zero, the electromagnets 22A and 22B are set to be given a predetermined magnetic force. The magnetic force is set to increase as the absolute value of the movement acceleration increases.
 なお、磁力制御装置3は、ワークの材質(硬度)などの加工条件に応じて電磁石22A,22Bに与える磁力を変化させてもよい。また、加工ヘッド保持部2には、永電磁石21の代わりに永久磁石を配置してもよい。この場合、磁力制御装置3は、永久磁石と磁着板12との磁着力を考慮して電磁石22A,22Bに流す電流の大きさを制御する。また、加工ヘッド保持部2には、電磁石22A,22B、永電磁石21とともに永久磁石を配置しておいてもよい。この場合、磁力制御装置3は、永電磁石21と磁着板12との磁着力、永久磁石と磁着板12との磁着力を考慮して電磁石22A,22Bに流す電流の大きさを制御する。また、加工ヘッド保持部2と加工ヘッド1とを、電磁石22A,22Bと磁着板12とで磁着しつつ、さらに樹脂ボルトで接着してもよい。 The magnetic force control device 3 may change the magnetic force applied to the electromagnets 22A and 22B according to processing conditions such as the material (hardness) of the workpiece. Further, a permanent magnet may be arranged in the machining head holding part 2 instead of the permanent electromagnet 21. In this case, the magnetic force control device 3 controls the magnitude of the current flowing through the electromagnets 22 </ b> A and 22 </ b> B in consideration of the magnetizing force between the permanent magnet and the magnetized plate 12. Further, permanent magnets may be arranged in the machining head holding portion 2 together with the electromagnets 22 </ b> A and 22 </ b> B and the permanent electromagnet 21. In this case, the magnetic force control device 3 controls the magnitude of the current passed through the electromagnets 22 </ b> A and 22 </ b> B in consideration of the magnetizing force between the permanent electromagnet 21 and the magnetized plate 12 and the magnetizing force between the permanent magnet and the magnetized plate 12. . Further, the processing head holding unit 2 and the processing head 1 may be bonded with resin bolts while being magnetized by the electromagnets 22A and 22B and the magnetized plate 12.
 また、本実施の形態では、加工ヘッド1のZ軸方向の移動速度に基づいて、電磁石22A,22Bの磁力を変化させる場合について説明したが、磁力制御装置3は、加工ヘッド1のXY平面内での移動速度に基づいて、電磁石22A,22Bの磁力を変化させてもよい。この場合も、XY平面内での移動速度は、加工ヘッド1のワークに対する相対速度である。したがって、加工ヘッド1がXY平面内を移動せず、ワークを載置するXYテーブルがXY平面内を移動する場合には、このXYテーブルの移動速度が加工ヘッド1のXY平面内での移動速度となる。 In the present embodiment, the case where the magnetic force of the electromagnets 22A and 22B is changed based on the moving speed of the machining head 1 in the Z-axis direction has been described. However, the magnetic force control device 3 operates in the XY plane of the machining head 1. The magnetic force of the electromagnets 22A and 22B may be changed based on the moving speed at. Also in this case, the moving speed in the XY plane is a relative speed of the machining head 1 with respect to the workpiece. Therefore, when the machining head 1 does not move in the XY plane and the XY table on which the workpiece is placed moves in the XY plane, the movement speed of the XY table is the movement speed of the machining head 1 in the XY plane. It becomes.
 また、磁力制御装置3は、加工ヘッド1のZ軸方向の移動速度およびXY平面内での移動速度の両方に基づいて、電磁石22A,22Bの磁力を変化させてもよい。さらに、磁力制御装置3は、Z軸方向の速度とXY平面内での速度に重み付けをしたうえで、Z軸方向の速度およびXY平面内での速度に基づいて、電磁石22A,22Bの磁力を変化させてもよい。 Further, the magnetic force control device 3 may change the magnetic force of the electromagnets 22A and 22B based on both the moving speed of the machining head 1 in the Z-axis direction and the moving speed in the XY plane. Further, the magnetic force control device 3 weights the speed in the Z-axis direction and the speed in the XY plane, and then determines the magnetic force of the electromagnets 22A and 22B based on the speed in the Z-axis direction and the speed in the XY plane. It may be changed.
 また、磁力制御装置3は、加工ヘッド1のXY平面内での移動加速度に基づいて、電磁石22A,22Bの磁力を変化させてもよい。この場合も、XY平面内での移動加速度は、加工ヘッド1のワークに対する相対加速度である。また、磁力制御装置3は、加工ヘッド1のZ軸方向の移動加速度およびXY平面内での移動加速度の両方に基づいて、電磁石22A,22Bの磁力を変化させてもよい。さらに、磁力制御装置3は、Z軸方向の加速度とXY平面内での加速度に重み付けをしたうえで、Z軸方向の加速度およびXY平面内での加速度に基づいて、電磁石22A,22Bの磁力を変化させてもよい。 Moreover, the magnetic force control device 3 may change the magnetic force of the electromagnets 22A and 22B based on the movement acceleration of the machining head 1 in the XY plane. Also in this case, the movement acceleration in the XY plane is a relative acceleration of the machining head 1 with respect to the workpiece. Further, the magnetic force control device 3 may change the magnetic force of the electromagnets 22A and 22B based on both the movement acceleration in the Z-axis direction of the machining head 1 and the movement acceleration in the XY plane. Further, the magnetic force control device 3 weights the acceleration in the Z-axis direction and the acceleration in the XY plane, and then determines the magnetic force of the electromagnets 22A and 22B based on the acceleration in the Z-axis direction and the acceleration in the XY plane. It may be changed.
 また、本実施の形態では、加工ヘッド1の移動速度や移動加速度に基づいて、電磁石22A,22Bの磁力を変化させる場合について説明したが、磁力制御装置3は、加工ヘッド1のZ軸方向の移動速度および移動加速度の両方に基づいて、電磁石22A,22Bの磁力を変化させてもよい。 Further, in the present embodiment, the case where the magnetic force of the electromagnets 22A and 22B is changed based on the moving speed and the moving acceleration of the processing head 1 has been described. However, the magnetic force control device 3 operates in the Z-axis direction of the processing head 1. The magnetic force of the electromagnets 22A and 22B may be changed based on both the moving speed and the moving acceleration.
 なお、本実施の形態では、永電磁石21と磁着板12とが磁着しているので、移動速度が0の場合に電磁石22A,22Bの磁力を0としてもよい。また、電磁石22A,22Bに流す電流は可変としつつ、加工開始後は一定値としてもよい。この場合、磁力制御装置3は、速度検出部31や磁力算出部32を有していなくてもよい。磁力制御装置3は、加工ヘッド1の移動速度に関わらず、予め設定しておいた所定の電流値を電磁石22A,22Bと磁着板12との間に流す。また、磁力制御装置3は、外部入力される使用者からの指示に応じた磁力を発生させるための電流値を電磁石22A,22Bに流してもよい。この場合も、磁力制御装置3は、速度検出部31や磁力算出部32を有していなくてもよい。 In the present embodiment, since the permanent electromagnet 21 and the magnetized plate 12 are magnetized, the magnetic force of the electromagnets 22A and 22B may be set to 0 when the moving speed is 0. Further, the current flowing through the electromagnets 22A and 22B may be variable, and may be a constant value after the start of processing. In this case, the magnetic force control device 3 may not include the speed detection unit 31 and the magnetic force calculation unit 32. Regardless of the moving speed of the machining head 1, the magnetic force control device 3 allows a predetermined current value set in advance to flow between the electromagnets 22 </ b> A and 22 </ b> B and the magnetized plate 12. Further, the magnetic force control device 3 may cause the electromagnets 22 </ b> A and 22 </ b> B to pass a current value for generating a magnetic force according to an instruction from a user input from the outside. Also in this case, the magnetic force control device 3 may not include the speed detection unit 31 and the magnetic force calculation unit 32.
 また、本実施の形態では、加工ヘッド保持部2が1つの永電磁石21と2つの電磁石22A,22Bを有している場合について説明したが、加工ヘッド保持部2が有する永電磁石21や電磁石22A,22Bの数はいくつであってもよい。 In the present embodiment, the case where the machining head holding unit 2 has one permanent electromagnet 21 and two electromagnets 22A and 22B has been described. However, the permanent electromagnet 21 and the electromagnet 22A that the machining head holding unit 2 has. , 22B may be any number.
 このように、加工ヘッド保持機構は、電磁石22A,22Bを用いて加工ヘッド1と加工ヘッド保持部2とを磁着させているので、加工ヘッド1がワークに衝突した際に、加工ヘッド1と加工ヘッド保持部2とが分離することによってレーザ加工装置やワークへの衝撃を軽減できる。また、衝突によって分離された加工ヘッド1と加工ヘッド保持部2を、容易に位置決めして、電磁石22A,22Bなどの磁力による迅速な固定が可能となる。これにより、磁力磁着による加工ヘッド保持機構の迅速な復旧が可能となる。 Thus, since the machining head holding mechanism magnetizes the machining head 1 and the machining head holding part 2 using the electromagnets 22A and 22B, when the machining head 1 collides with the workpiece, the machining head 1 and The separation of the processing head holding unit 2 can reduce the impact on the laser processing apparatus and the workpiece. Further, the machining head 1 and the machining head holding portion 2 separated by the collision can be easily positioned and can be quickly fixed by the magnetic force of the electromagnets 22A and 22B. As a result, it is possible to quickly restore the processing head holding mechanism by magnetic magnetic adhesion.
 電磁石22A,22Bの磁力が一定であれば、加工ヘッド1が高速移動している場合には、加工ヘッド1がワークに衝突していなくても加工ヘッド1は加工ヘッド保持部2から脱落しやすくなる。また、電磁石22A,22Bの磁力が一定であれば、加工ヘッド1が低速移動している場合には、加工ヘッド1がワークに衝突しても加工ヘッド1は加工ヘッド保持部2から脱落しにくくなる。本実施の形態では、加工ヘッド1の移動速度に応じて電磁石22A,22Bの磁力の大きさを制御するので、磁力の大きさが一定の場合に発生する高速移動時の加工ヘッド1の脱落や低速移動時の加工ヘッド1の非脱落を防止できる。換言すると、高速移動時には、ワークへ衝突することなく加工ヘッド1が脱落することを防止でき、低速移動時には、ワークへ衝突した際に加工ヘッド1を脱落させることが可能となる。 If the magnetic forces of the electromagnets 22A and 22B are constant, the machining head 1 can easily fall off the machining head holding portion 2 even if the machining head 1 does not collide with the workpiece when the machining head 1 is moving at high speed. Become. Further, if the magnetic forces of the electromagnets 22A and 22B are constant, the machining head 1 is unlikely to fall off the machining head holding portion 2 even when the machining head 1 collides with the workpiece when the machining head 1 moves at a low speed. Become. In the present embodiment, the magnitude of the magnetic force of the electromagnets 22A and 22B is controlled in accordance with the moving speed of the machining head 1, so that the machining head 1 is dropped during high-speed movement that occurs when the magnitude of the magnetic force is constant. It is possible to prevent the machining head 1 from falling off during low-speed movement. In other words, the machining head 1 can be prevented from dropping without colliding with the workpiece during high-speed movement, and the machining head 1 can be dropped when colliding with the workpiece during low-speed movement.
 また、加工ヘッド保持機構は、磁力の代わりに空圧や油圧を用いた真空吸引(吸着力)によって加工ヘッド1と加工ヘッド保持部2とを吸着させてもよい。この場合も、加工ヘッド1と加工ヘッド保持部2との間の吸着力は可変なよう構成しておく。さらに、加工ヘッド1の移動速度や移動加速度に応じて、加工ヘッド1と加工ヘッド保持部2との間の吸着力を変化させてもよい。 Further, the processing head holding mechanism may attract the processing head 1 and the processing head holding unit 2 by vacuum suction (adsorption force) using air pressure or hydraulic pressure instead of magnetic force. Also in this case, the suction force between the processing head 1 and the processing head holding unit 2 is configured to be variable. Furthermore, the suction force between the processing head 1 and the processing head holding unit 2 may be changed according to the moving speed or moving acceleration of the processing head 1.
 また、加工ヘッド1や加工ヘッド保持部2に力覚センサを取り付けておき、加工ヘッド1と加工ヘッド保持部2との間に所定の力が加わるまでは加工ヘッド1が脱落しないよう電磁石22A,22Bの磁力を制御してもよい。 Further, a force sensor is attached to the machining head 1 or the machining head holding unit 2 so that the electromagnet 22A, the machining head 1 does not fall off until a predetermined force is applied between the machining head 1 and the machining head holding unit 2. The magnetic force of 22B may be controlled.
 また、レーザ加工装置(例えば加工ヘッド保持機構)は、加工ヘッド1が加工ヘッド保持部2から脱落した際にアラームを出力してもよい。この場合、加工ヘッド保持機構には、近接センサを配置しておく。そして、この近接センサが、加工ヘッド1の加工ヘッド保持部2からの脱落を検知した場合にアラームを出力させる。 Further, the laser processing apparatus (for example, the processing head holding mechanism) may output an alarm when the processing head 1 is detached from the processing head holding unit 2. In this case, a proximity sensor is arranged in the processing head holding mechanism. When the proximity sensor detects the removal of the processing head 1 from the processing head holding unit 2, an alarm is output.
 このように実施の形態によれば、適切な磁力で加工ヘッド1を保持しつつ加工ヘッド1を加工ヘッド保持部2に容易に装着することが可能となる。また、加工ヘッド保持機構を簡易な構成の加工ヘッド1と加工ヘッド保持部2とを用いて構成することが可能となる。 As described above, according to the embodiment, it is possible to easily attach the machining head 1 to the machining head holding portion 2 while holding the machining head 1 with an appropriate magnetic force. Further, the machining head holding mechanism can be configured using the machining head 1 and the machining head holding unit 2 having a simple configuration.
 また、電磁石22A,22Bに流す電流の大きさを、加工ヘッド1の移動速度や移動加速度に応じて変化させているので、加工ヘッド1と加工ヘッド保持部2とのはずれ易さに応じた力で加工ヘッド1と加工ヘッド保持部2とを磁着することが可能となる。また、加工ヘッド1と加工ヘッド保持部2とを永電磁石21や永久磁石を用いて磁着しているので低い電力で加工ヘッド1を加工ヘッド保持部2に装着することが可能となる。 Further, since the magnitude of the current flowing through the electromagnets 22A and 22B is changed according to the moving speed and moving acceleration of the processing head 1, a force corresponding to the ease with which the processing head 1 and the processing head holding portion 2 are disengaged. Thus, the machining head 1 and the machining head holding portion 2 can be magnetically attached. Further, since the machining head 1 and the machining head holding unit 2 are magnetically attached using the permanent electromagnet 21 or the permanent magnet, the machining head 1 can be mounted on the machining head holding unit 2 with low power.
 以上のように、本発明にかかる加工ヘッド保持機構は、加工ヘッドの装着および保持、加工ヘッドの脱落に適している。 As described above, the machining head holding mechanism according to the present invention is suitable for mounting and holding the machining head and dropping the machining head.
 1 加工ヘッド
 2 加工ヘッド保持部
 3 磁力制御装置
 11 レーザ光出射部
 12 磁着板
 13 上下ガイド部
 21 永電磁石
 22A,22B 電磁石
 23 上下ガイド溝
 24 左右ガイド部
 31 速度検出部
 32 磁力算出部
 33 磁力制御部
 101 移動速度-磁力情報
 102 移動加速度-磁力情報
DESCRIPTION OF SYMBOLS 1 Processing head 2 Processing head holding | maintenance part 3 Magnetic force control apparatus 11 Laser beam emitting part 12 Magnetic attachment board 13 Upper and lower guide part 21 Permanent electromagnet 22A, 22B Electromagnet 23 Upper and lower guide groove 24 Left and right guide part 31 Speed detection part 32 Magnetic force calculation part 33 Magnetic force Control unit 101 Movement speed-magnetic information 102 Movement acceleration-magnetic information

Claims (5)

  1.  レーザ光を照射する加工ヘッドと、前記加工ヘッドを着脱可能に取り付ける加工ヘッド保持部とを有し、前記加工ヘッド保持部に取り付けられた加工ヘッドがワーク上を相対移動する加工ヘッド保持機構において、
     前記加工ヘッド保持部は、
     前記加工ヘッドに磁着する電磁石を備え、
     前記加工ヘッドは、
     前記電磁石に磁着する磁着部を備え、
     前記加工ヘッド保持部は、前記電磁石に印加する電流が制御されることによって前記電磁石の磁力が調整され、これにより前記電磁石と前記磁着部との間の磁着力が調整されることを特徴とする加工ヘッド保持機構。
    In a processing head holding mechanism that has a processing head that irradiates a laser beam and a processing head holding portion that detachably attaches the processing head, and the processing head attached to the processing head holding portion relatively moves on a workpiece.
    The processing head holding part is
    An electromagnet magnetically attached to the processing head;
    The processing head is
    A magnetized portion magnetized to the electromagnet;
    The machining head holding unit is configured to adjust a magnetic force of the electromagnet by controlling an electric current applied to the electromagnet, and thereby adjust a magnetizing force between the electromagnet and the magnetized unit. A processing head holding mechanism.
  2.  前記電磁石に印加する電流を制御する制御部をさらに備え、
     前記制御部は、前記加工ヘッドの前記ワークに対する相対移動速度に応じた電流を前記電磁石に印加することを特徴とする請求項1に記載の加工ヘッド保持機構。
    A control unit for controlling a current applied to the electromagnet;
    The processing head holding mechanism according to claim 1, wherein the control unit applies a current corresponding to a relative moving speed of the processing head to the workpiece to the electromagnet.
  3.  前記電磁石に印加する電流を制御する制御部をさらに備え、
     前記制御部は、前記加工ヘッドの前記ワークに対する相対移動加速度に応じた電流を前記電磁石に印加することを特徴とする請求項1に記載の加工ヘッド保持機構。
    A control unit for controlling a current applied to the electromagnet;
    The processing head holding mechanism according to claim 1, wherein the control unit applies a current corresponding to a relative movement acceleration of the processing head with respect to the workpiece to the electromagnet.
  4.  前記加工ヘッド保持部は、前記加工ヘッドに磁着する永電磁石をさらに備え、
     前記加工ヘッドの磁着部は、前記電磁石および前記永電磁石に磁着することを特徴とする請求項1~3のいずれか1つに記載の加工ヘッド保持機構。
    The processing head holding portion further includes a permanent electromagnet that is magnetically attached to the processing head,
    The machining head holding mechanism according to any one of claims 1 to 3, wherein the magnetized portion of the machining head is magnetized to the electromagnet and the permanent electromagnet.
  5.  前記加工ヘッド保持部は、前記加工ヘッドに磁着する永久磁石をさらに備え、
     前記加工ヘッドの磁着部は、前記電磁石および前記永久磁石に磁着することを特徴とする請求項1~3のいずれか1つに記載の加工ヘッド保持機構。
     
     
     
     
    The processing head holding unit further includes a permanent magnet that is magnetically attached to the processing head,
    The machining head holding mechanism according to any one of claims 1 to 3, wherein the magnetized portion of the machining head is magnetized to the electromagnet and the permanent magnet.



PCT/JP2010/056768 2009-04-28 2010-04-15 Processing head holding mechanism WO2010125928A1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012110907A (en) * 2010-11-22 2012-06-14 Mitsubishi Electric Corp Machining apparatus
CN105773000A (en) * 2016-03-30 2016-07-20 山东诺博泰智能科技有限公司 Moment adjustable mechanism for automatic anti-collision device
JP2018072431A (en) * 2016-10-25 2018-05-10 住友ナコ フォ−クリフト株式会社 Mounted bracket for camera
CN112809217A (en) * 2021-02-23 2021-05-18 广东宏石激光技术股份有限公司 Method for preventing laser head from being damaged due to collision and anti-collision damage device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6131158B2 (en) * 2013-09-19 2017-05-17 株式会社アマダホールディングス Laser processing head
JP1639042S (en) 2018-10-22 2019-08-13
CN113508003B (en) 2019-03-06 2022-12-27 三菱电机株式会社 Disassembling and assembling device, machining machine and machining head
JP7118286B2 (en) * 2019-10-16 2022-08-15 三菱電機株式会社 Processing head and laser processing equipment
CN111192437B (en) * 2019-12-31 2021-10-15 天长缸盖有限公司 Mistake proofing early warning formula is from locking cylinder cap processingequipment
CN113290903B (en) * 2021-04-20 2021-12-31 太田机械江苏有限公司 High-precision single-column hydraulic machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04104271U (en) * 1991-02-07 1992-09-08 株式会社小松製作所 Torch damage prevention device for thermal cutting machines
JPH0569125A (en) * 1991-09-06 1993-03-23 Komatsu Ltd Supporter of torch for thermal cutter
JP2000317753A (en) * 1999-05-06 2000-11-21 Ntn Corp Movable table

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04104271U (en) * 1991-02-07 1992-09-08 株式会社小松製作所 Torch damage prevention device for thermal cutting machines
JPH0569125A (en) * 1991-09-06 1993-03-23 Komatsu Ltd Supporter of torch for thermal cutter
JP2000317753A (en) * 1999-05-06 2000-11-21 Ntn Corp Movable table

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012110907A (en) * 2010-11-22 2012-06-14 Mitsubishi Electric Corp Machining apparatus
CN105773000A (en) * 2016-03-30 2016-07-20 山东诺博泰智能科技有限公司 Moment adjustable mechanism for automatic anti-collision device
JP2018072431A (en) * 2016-10-25 2018-05-10 住友ナコ フォ−クリフト株式会社 Mounted bracket for camera
CN112809217A (en) * 2021-02-23 2021-05-18 广东宏石激光技术股份有限公司 Method for preventing laser head from being damaged due to collision and anti-collision damage device

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