JP2009000698A - Laser beam machining device and laser beam machining method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining device and a laser beam machining method capable of preventing a workpiece from being damaged by the contact of a nozzle. <P>SOLUTION: The laser beam machining device for performing the laser beam machining by irradiating a workpiece with laser beams while jetting assist gas therefrom comprises a laser beam oscillator for emitting laser beams, a nozzle unit for condensing laser beams by a lens optical system and irradiating the machining position with the laser beams, and jetting the assist gas therefrom, a nozzle unit driving means for moving the nozzle unit to the predetermined position, a detection means for detecting the contact of the nozzle unit with the workpiece, and a notification means for notifying the result of detection obtained by the detection means. The nozzle unit has a vertical shock-absorbing means for shock-absorbing of the external force generated in the vertical direction by the contact, and a horizontal shock-absorbing means different from the vertical shock-absorbing means for shock-absorbing of the external force generated in the horizontal direction by the contact. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a laser processing apparatus and a laser processing method, and more particularly to a laser processing apparatus and laser processing for preventing damage caused by contact of a nozzle with an object to be processed and improving the restoration accuracy of the nozzle with a simple configuration. Regarding the method.

  Conventionally, at the time of laser processing by a laser processing apparatus, an assist gas such as an inert gas is used, and this inert gas is ejected to the irradiation position of the laser beam, so that the laser beam is applied to a workpiece such as a resin (processing object). Irradiated and laser-processed dross and processing dust are blown away, and high-precision processing is realized without causing dust or the like to adhere to the workpiece.

  Also, in a general laser processing apparatus, a nozzle is provided in order to efficiently eject the assist gas to the vicinity of the workpiece processing position, and the nozzle is brought close to the workpiece to eject gas from a position corresponding to the shape of the workpiece. Is going.

  Here, when the processing position of the workpiece changes, the position of the nozzle is moved, but the nozzle may be brought into contact with the workpiece or a jig for holding the workpiece during the movement. Therefore, there is a technique for avoiding damage to the workpiece or the like by the nozzle (see, for example, Patent Documents 1 and 2).

  In the technique disclosed in Patent Document 1, a laser processing apparatus includes a laser processing optical system that collects and irradiates laser light output from a laser oscillator and performs processing such as workpiece cutting and welding. A laser processing head equipped with this laser processing optical system includes a fixed unit for guiding laser light, a movable unit incorporating a condensing optical system, and an elastic holding means provided between the fixed unit and the movable unit. Have. The movable unit constitutes a contact-type workpiece copying mechanism that follows unevenness and inclination of the workpiece processing surface by means of elastic holding means. By this workpiece copying mechanism, the distance from the condensing optical system to the workpiece processing position is always kept substantially constant, and the workpiece is copied by laser light.

Further, in the technique disclosed in Patent Document 2, a laser torch having a nozzle attached to a nozzle holder is positioned by fitting the vertical concave line of the torch holder with the tapered surface of the nozzle holder so that the vertical axis coincides with the attachment. Can do. Then, an attractive force is applied between the magnet of the torch holder and the magnet of the nozzle holder to hold the laser torch attached to the torch holder. Further, the holding distance of the laser torch by the magnet's attractive force can be adjusted to the optimum holding force by adjusting the gap between the magnets with the adjusting screw.
JP 2000-61669 A JP 2001-711165 A

  By the way, generally, when the nozzle contacts the workpiece or the like during movement during laser processing, there is a possibility that the alignment position may be shifted, so the nozzle setting position or laser processing position may be shifted.

  At this time, in the case of a mechanism for releasing the nozzle by extending the spring as shown in Patent Document 1 described above, a mechanism for accurately restoring the original position is complicated. Further, in the case of a mechanism using a magnet as shown in Patent Document 2, it may be difficult to operate depending on the direction of impact, and readjustment or the like is necessary.

  Therefore, in order to solve the above-described problems, even when the nozzle contacts the workpiece, the nozzle and the workpiece are not damaged, and the restoration accuracy by the mechanism that easily returns the nozzle moved by the contact to the original position easily. High laser processing is required.

  The present invention has been made in view of the above-described problems. A laser processing apparatus for preventing damage caused by contact of a nozzle with a workpiece (workpiece) and improving restoration accuracy with a simple configuration, and An object is to provide a laser processing method.

  In order to achieve the above-described object, the present invention provides a laser processing apparatus that performs laser processing by irradiating a laser beam while injecting an assist gas from a position corresponding to the shape of an object to be processed to a predetermined processing position. A laser oscillator that emits light, a laser beam from the laser oscillator is condensed by a lens optical system, and is irradiated onto the processing position, and a nozzle unit that ejects the assist gas, and the nozzle unit is moved to a predetermined position Nozzle unit driving means for causing the nozzle unit to be in contact with the workpiece, and detecting means for detecting that the nozzle unit is in contact with the workpiece, and notification means for notifying the detection result obtained by the detecting means, Vertical buffer means for buffering an external force generated in the vertical direction by the contact; The said vertical buffer means for buffering the external force, characterized in that the different horizontal buffer means. Accordingly, it is possible to prevent damage due to the nozzle coming into contact with the object to be processed and to improve the restoration accuracy of the nozzle with a simple configuration.

  Further, it is preferable that the vertical buffering means of the nozzle unit is constituted by an elastic member. As a result, the movement in the vertical direction can be easily performed, and the original position can be quickly and accurately restored.

  Furthermore, it is preferable that the horizontal buffering means of the nozzle unit is made of a magnetic member. As a result, the movement in the horizontal direction can be easily performed, and the original position can be quickly and accurately restored.

  Further, when the detection unit detects contact between the nozzle unit and the object to be processed, control is performed to stop the emission of the laser light from the laser oscillator and the movement of the nozzle unit by the nozzle unit driving unit. It is preferable to have a means. Thereby, since laser processing can be stopped quickly when an error occurs, damage to the object to be processed and the like can be prevented, and high-precision processing can be realized.

  According to another aspect of the present invention, there is provided a laser processing method for performing laser processing by irradiating a laser beam while injecting an assist gas from a position corresponding to the shape of an object to be processed to a predetermined processing position. A light emitting step, a processing step of condensing the laser light from the laser oscillator by a lens optical system provided in a nozzle unit movable to a predetermined position, irradiating the processing position, and injecting the assist gas; A detection step for detecting that the nozzle unit has come into contact with the object to be processed; and a notification step for notifying a detection result obtained by the detection step. The vertical direction buffering means for buffering the external force generated with respect to the horizontal direction is generated by the contact. Characterized in that the different horizontal buffer means is provided between the vertical buffering means for buffering the force. Accordingly, it is possible to prevent damage due to the nozzle coming into contact with the object to be processed and to improve the restoration accuracy of the nozzle with a simple configuration.

  Further, it is preferable that the vertical buffering means of the nozzle unit is constituted by an elastic member. As a result, the movement in the vertical direction can be easily performed, and the original position can be quickly and accurately restored.

  Furthermore, it is preferable that the horizontal buffering means of the nozzle unit is made of a magnetic member. As a result, the movement in the horizontal direction can be easily performed, and the original position can be quickly and accurately restored.

  Furthermore, when the contact between the nozzle unit and the object to be processed is detected by the detection step, there is a control step for controlling to stop the emission of the laser beam and the movement of the nozzle unit in the laser oscillator. preferable. Thereby, since laser processing can be stopped quickly when an error occurs, damage to the object to be processed and the like can be prevented, and high-precision processing can be realized.

  ADVANTAGE OF THE INVENTION According to this invention, while the damage by the nozzle contacting the process target object can be prevented, the restoration | restoration precision of a nozzle can be improved with a simple structure.

  Hereinafter, embodiments in which a laser processing apparatus and a laser processing method according to the present invention having the above-described features are suitably implemented will be described in detail with reference to the drawings. In the following description, as an example of laser processing, a process for forming a pattern by irradiating a predetermined laser beam onto a resin layer or the like used for a plasma display panel or the like that is an object to be processed will be described. However, the present invention is not limited to this, and can be widely applied to various laser processing such as drilling, welding, cutting, and annealing.

<First Embodiment>
<Laser processing equipment: Equipment configuration>
FIG. 1 is a diagram illustrating a configuration example of a laser processing apparatus according to the present embodiment. A laser processing apparatus 10 shown in FIG. 1 includes a laser oscillator 11, a reflection mirror 12, a nozzle unit 13,
The gas supply unit 14, the nozzle unit driving unit 15, the contact detection unit 16, the notification unit 17, and the control unit 18 are configured.

Since the laser oscillator 11 shown in FIG. 1 forms a predetermined pattern on the workpiece 1 made of resin, metal, or the like, which is a processing target, the laser oscillator 11 has a predetermined strength at a predetermined timing based on a control signal obtained from the control means 18. The pulse laser beam is emitted. Here, for example, a YAG laser or the like can be used as the laser light in the present embodiment. In addition, for example, a CO ₂ laser, an excimer laser, or the like can be used, and the type of laser light in the present invention is not particularly limited. That is, it can be arbitrarily selected according to various processing conditions such as the material and thickness of the workpiece 1 and what processing (for example, drilling, welding, cutting, annealing, etc.) is performed.

  The reflection mirror 12 guides the laser light emitted from the laser oscillator 11 in the direction of entering the nozzle unit 13.

  The nozzle unit 13 is provided with a lens optical system for receiving the laser beam obtained from the laser oscillator 11, forming an image in a predetermined shape, and irradiating a predetermined portion of the workpiece 1. Laser processing of a predetermined portion of the workpiece 1 is realized by the laser light emitted from the workpiece.

  Further, the nozzle unit 13 injects assist gas obtained by the gas supply means 14 from the tip of the nozzle to the vicinity of the laser processing position of the workpiece 1.

  Further, the nozzle unit 13 can be moved in the XYZ directions shown in FIG. 1 by the nozzle unit driving means 15 and moved to an appropriate position (for example, near a predetermined processing position) according to the shape of the workpiece 1. Thus, laser processing can be performed by irradiating laser light at a predetermined position.

  Further, the nozzle unit 13 is provided with a buffer mechanism that presses against a load (external force) from the vertical direction (Z-axis direction, vertical direction) with an elastic member such as a spring when the tip contacts the workpiece 1. Further, the nozzle unit 13 is provided with a buffer mechanism using a magnetic member such as a magnet against an external force from the horizontal direction (XY direction, lateral direction). Thereby, it is possible to effectively avoid the external force in the vertical direction and the horizontal direction of the nozzle unit 13 due to contact with the workpiece 1 and the like, and it is possible to increase the restoration accuracy with a simple mechanism. A specific example of the nozzle unit 13 will be described later.

  In response to a control signal from the control means 18, the gas supply means 14 supplies a gas for ejecting an assist gas from the nozzle tip to the vicinity of the processing portion of the workpiece 1 via the nozzle unit 13. As the assist gas, for example, oxygen, nitrogen, air, argon or the like can be used. Thereby, a process part can be oxidized and a melting reaction can be accelerated | stimulated, or dross can be blown away.

  Further, the nozzle unit driving means 15 moves the nozzle unit to a predetermined position by a control signal from the control means 18. Thereby, laser processing can be performed while moving the nozzle unit 13 in accordance with the shape of the workpiece 1.

  Further, when the nozzle unit 13 comes into contact with the workpiece 1 or the like, the contact detection unit 16 detects contact and outputs a signal to the control unit 18. The contact detection means 16 separately detects when the buffering in the Z-axis direction is performed by an elastic member such as a spring and when the buffering is performed in the XY direction by a magnetic member such as a magnet.

  The notification unit 17 includes a screen display unit such as a monitor and a voice output unit such as a speaker. The error unit displays an error message on the screen or displays an alarm ( Alarm) etc. are output by voice output. For example, the notification means 17 is detected by the contact detection means 16 when an error is detected, and the contact detection means 16 is executed when the buffer is executed in the Z-axis direction by an elastic member such as a spring and in the XY directions by a magnetic member such as a magnet. Can be detected separately from each other, so it is not only an error detection message, but also a message corresponding to the detection content (for example, “A vertical contact was detected”, “ “Contact in the horizontal direction has been detected.”).

  Note that the notifying unit 17 may notify a message related to normal process execution, such as a normal execution start or end message, based on a control signal or the like obtained from the control unit 18.

  The control means 18 controls each function in the present embodiment. Specifically, the control unit 18 controls driving and the like in the laser oscillator 11, the gas supply unit 14, the nozzle unit driving unit 15, the contact detection unit 16, and the like. Specifically, the control means 18 controls the intensity and timing of laser light irradiation by the laser oscillator 11, controls the start and end timing of gas supply by the gas supply means 14, the gas supply amount, etc. Control of the start and end timing of the movement of the nozzle unit 13 by the nozzle unit driving means 15, the moving speed, the moving position, etc., and setting the detection signal from the contact detection means 16 and the notification contents based on normal execution, etc. Control for notifying by 17 is performed.

  Note that when the contact is detected, the control unit 18 not only outputs an error message, an alarm, or the like by the notification unit 17, but also the drive mechanism of the laser processing apparatus 10 (for example, the operation in the nozzle unit drive unit 15, The operation of the gas supply means 14 is stopped (temporarily stopped), and control such as closing the shutter of the laser hole for outputting the laser beam provided in the laser oscillator 11 is performed to stop laser processing (temporarily stop). ) Can also be controlled. In this case, in order to return, for safety, for example, a user, an administrator, or the like performs a process for restarting machining by pressing a reset switch or the like.

  With the configuration of the laser processing apparatus 10 described above, damage due to contact of the nozzle with the workpiece 1 can be prevented, and the restoration accuracy of the nozzle can be improved with a simple configuration. That is, an effective collision-response type laser processing apparatus can be realized by combining two types of mechanisms, a horizontal buffering mechanism using a magnet holding and a vertical buffering mechanism using a spring.

  In the laser processing apparatus 10 shown in FIG. 1, the workpiece 1 is fixed and the nozzle unit 13 is driven by the nozzle unit driving means 15 to perform processing. For example, the work 1 is set on a stage, and a work driving means for driving the stage on which the work 1 is set in the XYZ directions is provided, and the nozzle unit 13 is fixed and only the stage is moved. Alternatively, the nozzle unit 13 and the stage may both be movable.

<About the nozzle unit 13>
Next, a specific example of the nozzle unit 13 will be described with reference to the drawings. FIG. 2 is a diagram illustrating an example of a nozzle unit. The nozzle unit 13 shown in FIG. 2 is configured to include a vertical buffer 21, a horizontal buffer 22, a lens optical system 23, a gas supply unit 24, a nozzle end 25, and a sensor 26. Yes. The nozzle unit 13 is provided with a cavity 30, and the laser beam 2 passes through the nozzle unit 13 from the tip of the nozzle unit 13 to irradiate a predetermined processing position of the workpiece 1 with the laser beam. Processing.

  In the nozzle unit 13, the vertical buffer 21 is slid by an elastic member with respect to the Z-axis direction, so that the tip of the nozzle end 25 contacts the workpiece 1 and an external force is applied in the Z-axis direction. Damage to the nozzle unit 13 and the workpiece 1 can be prevented. A specific configuration of the vertical buffer member 21 will be described later.

  Moreover, the horizontal direction buffer means 22 is provided with magnet members 31-1, 31-2 such as two permanent magnets, for example, and both are integrally assembled and fixed by magnetic attraction. Thereby, for example, when an external force from the lateral direction is applied to the nozzle end portion 25, the magnet members 31-1 and 31-2 are detached, whereby damage to the workpiece 1 or the like can be prevented. An example of the operation in the horizontal buffering means 22 will be described later.

  The lens optical system 23 is an optical system for condensing the laser light 2 incident on the cavity 30 into a predetermined shape, and includes at least one concave lens.

  The gas supply unit 24 is a supply port for supplying assist gas. The supplied assist gas flows downward as shown in FIG. 2 and is injected from the tip of the nozzle end 25 to the vicinity of the machining position of the workpiece 1. Further, the nozzle end portion 25 shows the entire configuration from the magnet member 31-2 to the tip end portion where laser light and assist gas are output. Further, when the nozzle unit collides with and contacts the workpiece 1, the sensor unit 26 detects a change in the vertical direction buffer unit 21 or the horizontal direction buffer unit 22 and outputs a detection signal to the control unit 18.

<Vertical direction buffer 21>
Next, a specific configuration of the vertical buffer 21 will be described with reference to the drawings. FIG. 3 is a diagram showing a cross-section in the AA direction in FIG. 2. As shown in FIG. 3, the vertical cushioning means 21 is configured to include a contact switch 41, a flanged linear bush 42, and a plunger portion 43. In the example of FIG. 3, the plunger portion 43 is provided on the left and right sides of the linear bush 42 (43-1, 43-2), and one linear bush 42 and two plunger portions 43 are set as three sets (42 a to 42 a. c, 43-1a to 43-1c, 43-2a to 43-2c) are evenly arranged.

  4 is a diagram showing an example of a vertical cross section in the B, C, and D directions in FIG. 4A shows an example in the B direction, FIG. 4B shows an example in the C direction, and FIG. 4C shows an example in the D direction.

  As shown in FIG. 4, the upper and lower frame parts 51-1 and 51-2 constituting the vertical cushioning means 21 are provided with a gap by a cushioning member such as an O-ring.

  The contact switch 41 shown in FIG. 4A detects that an external force is applied in the Z-axis direction when the nozzle end portion 25 comes into contact with the workpiece 1. Specifically, the contact switch 41 is provided with a contact-type electrical contact, opens and closes an electric circuit simultaneously with pressure measurement, and is used as an alarm for abnormal pressure. Further, when the contact switch 41 detects an abnormality, the contact switch 41 outputs a detection signal to the control means 18.

  Further, the linear bush 42 shown in FIG. 4B is a sliding buffer mechanism for enabling vertical movement when an external force is applied in the Z-axis direction, and the nozzle unit 13 is biased and held at a normal position. It is an urging means to do. In addition, the linear bushing 42 can use a heat oil bushing etc., for example.

  4C, when an external force is applied in the Z-axis direction, the nozzle unit 13 is pressed to reciprocate the cylinder up to a certain load (for example, about 10 kgf) with a spring or the like to buffer the external force. Can be made.

  Thereby, the buffer of an up-down direction can be performed effectively. In addition, the elastic member in this invention is not limited to the spring mentioned above, For example, you may use the film etc. which were formed with the shape memory alloy.

<Horizontal cushioning means 22>
FIG. 5 is a diagram illustrating an example of the operation of the horizontal buffering means. For example, as shown in FIG. 5, when the nozzle end 25 comes into contact with the workpiece 1, the contacted nozzle end receives an external force in the lateral direction. At this time, the magnet members 31-1 and 31-2 are temporarily removed. The sensor unit 26 detects that the magnet member 31-1 and part of the magnet member 31-2 are detached, and outputs a detection signal to the control means 18.

  In addition, it is preferable that the vertical direction buffering means 21 or the horizontal direction buffering means 22 described above is provided immediately after a portion in which the configuration of each unit is fixed by screws or the like in the overall configuration of the nozzle unit 13. That is, the position of the vertical cushioning means 21 or the horizontal cushioning means 22 is set depending on the overall rigidity and ease of adjustment. Further, in the above-described embodiment, the horizontal cushioning means 22 is provided near the workpiece 1 and the vertical cushioning means 21 is provided at a position farther than the horizontal cushioning means 22, but the present invention is not limited to this. Alternatively, the vertical cushioning means 21 may be provided at a position closer to the workpiece 1, and the vertical cushioning means 21 and the horizontal cushioning means 22 may be provided at the same position.

  As described above, according to the present invention, it is possible to prevent damage caused by the nozzle coming into contact with the workpiece (workpiece) and improve the accuracy of restoring the nozzle with a simple configuration. That is, an effective collision-response type laser processing apparatus can be realized by combining two types of mechanisms, a horizontal buffering mechanism using a magnet holding and a vertical buffering mechanism using a spring.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be changed.

It is a figure which shows the example of 1 structure of the laser processing apparatus in this embodiment. It is a figure which shows an example of a nozzle unit. It is a figure which shows the cross section of the AA direction in FIG. It is a figure which shows an example of the orthogonal | vertical direction cross section in the B, C, D direction in FIG. It is an example for demonstrating operation | movement of a horizontal direction buffer means.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Laser processing apparatus 11 Laser oscillator 12 Reflection mirror 13 Nozzle unit 14 Gas supply means 15 Nozzle unit drive means 16 Contact detection means 17 Notification means 18 Control means 21 Vertical direction buffer means 22 Horizontal direction buffer means 23 Lens optical system 24 Gas supply part 25 Nozzle end portion 26 Sensor 30 Cavity portion 31 Magnet member 41 Contact switch 42 Linear bushing 43 Plunger portion 51 Frame portion

Claims (8)

In a laser processing apparatus that performs laser processing by irradiating a laser beam while injecting an assist gas from a position corresponding to the shape of a processing object to a predetermined processing position,
A laser oscillator that emits laser light;
Condensing laser light from the laser oscillator with a lens optical system, irradiating the processing position, and a nozzle unit for injecting the assist gas;
Nozzle unit driving means for moving the nozzle unit to a predetermined position;
Detecting means for detecting that the nozzle unit is in contact with the workpiece;
Notification means for notifying the detection result obtained by the detection means,
The nozzle unit includes a vertical buffer that buffers external force generated in the vertical direction by the contact, and a horizontal buffer that is different from the vertical buffer that buffers external force generated in the horizontal direction by the contact. And a laser processing apparatus.   The laser processing apparatus according to claim 1, wherein the vertical buffering means of the nozzle unit is constituted by an elastic member.   The laser processing apparatus according to claim 1, wherein the horizontal buffering means of the nozzle unit is made of a magnetic member.   Control means for controlling to stop the emission of laser light in the laser oscillator and the movement of the nozzle unit in the nozzle unit driving means when the detection means detects contact between the nozzle unit and the workpiece. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is provided. In a laser processing method for performing laser processing by irradiating a laser beam while injecting an assist gas from a position corresponding to the shape of a processing object to a predetermined processing position,
A laser beam emitting step of emitting laser beam by a laser oscillator;
A processing step of condensing laser light from the laser oscillator by a lens optical system provided in a nozzle unit movable to a predetermined position, irradiating the processing position, and injecting the assist gas;
A detection step of detecting that the nozzle unit is in contact with the workpiece;
A notification step of notifying the detection result obtained by the detection step,
The nozzle unit has a horizontal direction different from the vertical direction buffering means for buffering the external force generated in the vertical direction by the contact and the vertical direction buffering means for buffering the external force generated in the horizontal direction by the contact. A laser processing method, comprising: a buffer means.   The laser processing method according to claim 5, wherein the vertical buffering means of the nozzle unit is constituted by an elastic member.   7. The laser processing method according to claim 5, wherein the horizontal buffering means of the nozzle unit is made of a magnetic member.   When the contact between the nozzle unit and the object to be processed is detected by the detection step, the laser step includes a control step for controlling the emission of the laser light and the movement of the nozzle unit to be stopped. The laser processing method according to any one of claims 5 to 7.

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